HEAT DISSIPATION DEVICE FOR OPTICAL MODULES AND COMMUNICATION DEVICES

Abstract

The present application provides a heat dissipation device for an optical module and a communication device to solve the problem of insufficient heat dissipation performance of the optical module, and relates to the field of communication device technology. The heat dissipation device for an optical module provided in the present application includes a heat dissipation substrate including a plurality of first heat dissipation sections, a plurality of adapter sections, and a second heat dissipation section. The plurality of first heat dissipation sections correspond one-to-one to the plurality of adapter sections. Each adapter section is configured to connect the corresponding first heat dissipation section and the second heat dissipation section, and the plurality of first heat dissipation sections, the plurality of adapter sections, and the second heat dissipation section are integrally formed.

Description

[Technical field]

[0001] This application claims priority to Chinese Patent Application No. 202110321865.8, entitled “Heat Dissipation Apparatus for Optical Module, and Communication Device,” filed with the State Intellectual Property Office of the People's Republic of China on March 25, 2021, the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the field of communication device technology, and in particular to a heat dissipation device for an optical module and a communication device. [Background technology]

[0003] The optical module is an important component in the communication network, and the main function of the optical module is to carry out the mutual conversion between optical signals and electrical signals. With the upgrade and development of the communication network, the amount and transmission rate of communication data in the communication network have been greatly improved. Therefore, it is necessary that all components in the communication network have good performance. After the performance of the optical module has been improved, the power consumption of the optical module has also increased, which causes serious heat generation. The head of the optical module accounts for a high proportion of heat. Therefore, how to improve the heat dissipation performance of the optical module has become an urgent technical problem to be solved. Summary of the Invention [Means for solving the problem]

[0004] The embodiments of the present application provide a heat dissipation apparatus for an optical module and a communication device to solve the problem of insufficient heat dissipation effect in the prior art.

[0005] According to a first aspect, the present application provides a heat dissipation device for an optical module, including a heat dissipation substrate and a plurality of bosses. The heat dissipation substrate includes a plurality of first heat dissipation sections, a plurality of adapter sections, and a second heat dissipation section. The plurality of first heat dissipation sections correspond one-to-one with the plurality of adapter sections. The adapter section is configured to connect the corresponding first heat dissipation section and the second heat dissipation section. The plurality of first heat dissipation sections, the plurality of adapter sections, and the second heat dissipation section are integrally formed. The plurality of bosses correspond one-to-one with the plurality of first heat dissipation sections, and are configured to conduct heat of the optical module to the heat dissipation substrate. One end of the boss contacts the optical module, and the other end of the boss contacts the corresponding first heat dissipation section.

[0006] It should be noted that the first heat dissipation section is generally located above each optical module and configured to dissipate heat of a single optical module. Therefore, the first heat dissipation section may also be called an optical module heat sink. The second heat dissipation section is located behind the multiple first heat dissipation sections and configured to dissipate heat of multiple optical modules. Therefore, the second heat dissipation section may also be called a common heat sink.

[0007] Based on the heat dissipation device provided in the embodiment of the present application, the optical module heat sink can be communicated with a common heat sink through multiple adapter parts to prevent overload of a single optical module heat sink, so that the heat of the optical module is transferred to the common heat sink. Through the above-mentioned heat dissipation device, the temperature difference between multiple optical modules can be reduced, and the temperature cascade of the optical module can be realized, thereby implementing the sharing of heat dissipation resources in the whole heat dissipation device and improving the heat dissipation ability of the optical module.

[0008] The heat dissipation device for optical modules provided in the embodiment is particularly applicable to the scenario where multiple optical modules work simultaneously. A larger number of current optical modules will show a larger temperature difference between optical modules at different upstream and downstream positions. As a result, it is difficult to dissipate the heat of downstream modules. According to the heat dissipation device provided in the embodiment of the present application, heat dissipation resources can be shared among multiple optical modules to improve the heat dissipation efficiency of multiple optical modules.

[0009] In a possible embodiment, the first heat dissipation section, the adapter section, and the second heat dissipation section each include a substrate housing and a capillary structure layer. The capillary structure layer is sintered on the inner surface of the substrate housing and configured to perform cyclic heat dissipation. The integral formation of the plurality of first heat dissipation sections, the plurality of adapter sections, and the second heat dissipation section includes the substrate housing and the capillary structure layer being integrally formed.

[0010] According to the above embodiment, an integrated heat dissipation device is used in the optical module to implement the sharing of heat dissipation resources with another optical module, and the heat generated by the optical module can be transferred from the first heat dissipation part to the second heat dissipation part through the adapter part. In addition, by the arrangement of the capillary structure layer, the heat dissipation process can be periodically performed to improve the heat dissipation effect.

[0011] In a possible embodiment, the heat dissipation substrate further includes a vacuum cavity, which is obtained by drawing a vacuum in the inner cavity of the heat dissipation substrate, and the vacuum cavity is filled with a phase-change working material, which is configured to transfer heat of the optical module by vaporization.

[0012] In the above-mentioned embodiment, the inside of the heat dissipation substrate is evacuated to implement a vacuum cavity, which can enable the phase-change working material to reach a state in which the phase-change working material evaporates very easily, thereby implementing rapid heat dissipation of the optical module and ensuring that the inner wall of the heat dissipation substrate is not corroded or contaminated.

[0013] In another possible embodiment, each adapter part is configured to connect the corresponding first heat dissipation part and the second heat dissipation part, the first heat dissipation part, the adapter part, and the second heat dissipation part communicate with each other through a vacuum cavity. In this way, the heat generated by the optical module can be quickly transferred from the first heat dissipation part to the second heat dissipation part through the adapter part, so as to implement the sharing of heat dissipation resources and ensure the temperature uniformity throughout the inside of the heat dissipation device.

[0014] In a possible embodiment, the first heat dissipation part and the second heat dissipation part each further include a support and a capillary powder layer. The support is located between the upper layer and the lower layer of the substrate housing and configured to hold the substrate housing. The capillary powder layer is sintered in a circumferential direction on the outer layer of the support. After the heat generated by the optical module is cooled and liquefied in the upper layer of the heat dissipation substrate, the capillary powder layer or the capillary structure layer is configured to guide the cooled and liquefied liquid to the lower layer of the heat dissipation substrate. The support or the capillary powder layer is not disposed in the vacuum cavity of the adapter part. In this way, the flexibility of the adapter part can be guaranteed to absorb the tolerance brought by the insertion and removal of the optical module and ensure the normal insertion and removal of the optical module.

[0015] In a possible embodiment, the multiple first heat dissipation units are arranged in parallel to each other in a first direction and perpendicular to the second heat dissipation unit. The first direction is the insertion and removal direction of the optical module. In this way, the multiple first heat dissipation units are arranged in parallel in the horizontal direction and are all perpendicular to the second heat dissipation unit, and are generally in the shape of a piano keyboard. This can effectively reduce the volume of the heat dissipation device, reduce the space occupied by the heat dissipation device, and improve the heat dissipation efficiency of the communication device.

[0016] In a possible embodiment, the material of the capillary structure layer and / or the material of the capillary powder layer is copper powder.In this way, when the phase-change working material is cooled and liquefied above the heat dissipation substrate, the absorption effect inside the heat dissipation substrate can be enhanced, and the liquid is led back under the heat dissipation substrate by capillary force and participates in the thermal cycle again, so as to realize the rapid heat dissipation of the optical module.

[0017] In a possible embodiment, the phase-change working material is water. It should be noted that the selection of the phase-change working material 3303 is mainly related to the operating temperature of the heat dissipation device, and the properties of the liquid, such as specific heat capacity and boiling point, are also factors to be considered. The general operating temperature of existing heat dissipation devices is about 60 degrees Celsius. Therefore, water is generally selected as the phase-change working material. In liquids, water has a high specific heat capacity and a low freezing point, is easy to boil, and has low cost, so water is generally the first choice of the heat dissipation device. Of course, when the heat dissipation device has a low temperature, substances such as acetone and liquid ammonia may also be used, since acetone and liquid ammonia have low freezing points, which can prevent the heat dissipation device from being unable to dissipate heat normally due to the solidification of the phase-change working material during operation. In addition, chemicals such as anhydrous alcohol may also be used as the phase-change working material. Specifically, this is not limited in this application.

[0018] In a possible embodiment, the heat dissipation device further includes a heat dissipation fin. The heat dissipation fin is disposed on the outer surface of the heat dissipation substrate and configured to dissipate heat to the outside of the heat dissipation device. The presence of the heat dissipation fin can increase the heat dissipation area of ​​the heat dissipation substrate. In addition, when the heat of the optical module is transferred to the first heat dissipation part, the temperature of the heat dissipation fin is lower than the temperature of the main body of the first heat dissipation part, the phase-change working material evaporates and absorbs heat, and the vapor reaches the heat dissipation fin and is liquefied when cooled. The heat is dissipated into the air by heat exchange with the air flow.

[0019] In a possible embodiment, the heat dissipation substrate further includes a first substrate configured to be welded to a surface of the first heat dissipation portion, hold the first heat dissipation portion, and assist the first heat dissipation portion in dissipating heat, and / or a second substrate configured to be welded to a surface of the second heat dissipation portion, hold the second heat dissipation portion, and assist the second heat dissipation portion in dissipating heat.

[0020] In the above-mentioned heat dissipation device for optical module, the heat dissipation substrate is essentially a phase change substrate, and the main function of the heat dissipation substrate is to quickly transfer the heat of the optical module. In addition, a support needs to be arranged inside the heat dissipation substrate to hold the inner cavity of the substrate. In this embodiment, the first substrate and the second substrate are added to the first heat dissipation section and the second heat dissipation section respectively, and replace the support to hold the first heat dissipation section and the second heat dissipation section of the heat dissipation substrate, which not only simplifies the manufacturing process of the heat dissipation substrate and reduces the heat dissipation cost, but also assists the first heat dissipation section and the second heat dissipation section in dissipating heat, and can quickly transfer the heat of the optical module to the outside of the device, improving the heat dissipation efficiency.

[0021] In a possible embodiment, the first substrate or the second substrate is a metal plate. Because of having a certain degree of rigidity, the metal plate can not only hold the heat dissipation substrate, but also has good thermal conductivity, which can improve the heat dissipation efficiency of the heat dissipation device.

[0022] In a possible embodiment, the substrate housing is made of a hard metal material, thus making the substrate housing robust enough to protect the internal heat dissipation device from damage.

[0023] In a possible embodiment, the other end of the boss contacts the first heat sink, meaning that the upper surface of the boss is welded to the corresponding lower surface of the first heat sink.

[0024] In another possible embodiment, the boss is made of a thermally conductive graphene material. Optionally, the boss may further include a thermal pad to achieve a better heat conduction effect. The thermal pad may be joined to the first heat dissipation part by a joining structure, or may be connected to the first heat dissipation part by a connector. Of course, another connecting structure may be used instead to connect the thermal pad to the first heat dissipation part.

[0025] It should be understood that regardless of how the boss is connected to the first heat dissipation part, the boss should preferably be in surface contact with the first heat dissipation part to improve heat transfer efficiency. In this way, compared with discrete point contact, the surface contact can effectively improve the heat transfer efficiency.

[0026] In order to further improve the heat conduction efficiency, it should be noted that the flatness and roughness of the contact surface between the boss and the first heat dissipation part need to be as small as possible so as to reduce the thermal resistance between the contact surfaces and improve the heat conduction efficiency.

[0027] It should be noted that flatness, also called uniformity, is one of the important indexes for evaluating the quality of the formed surface, which is the deviation of the measured surface height from the ideal plane, which directly affects the joining effect and fastening performance between components. Roughness refers to the unevenness of the measured surface, which has small gaps and microscopic irregularities. The smaller the roughness of the surface, the smoother the surface.

[0028] According to a second aspect, an embodiment of the present application provides a communication device, the communication device includes a heat dissipation device for an optical module according to the first aspect and any possible implementation of the first aspect, and further includes a PCB substrate and an optical module. The PCB substrate has a jack, and the jack is configured for insertion of the optical module.

[0029] In the heat dissipation device for optical modules provided in the present application, a first heat dissipation part, a second heat dissipation part and an adapter part are disposed on a heat dissipation substrate, and the optical module heat sink communicates with a common heat sink through the adapter part to transfer the heat of the optical module to the common heat sink. The optical modules communicate with each other through an internal cavity to dissipate heat together to prevent overloading of a single optical module heat sink. By the aforementioned heat dissipation device, the temperature difference between the optical modules can be reduced, and the temperature cascade of the optical modules can be implemented, thereby implementing the sharing of heat dissipation resources in the entire heat dissipation device and improving the heat dissipation ability of the optical modules. [Brief description of the drawings]

[0030] [Figure 1] 1 is a schematic diagram of the structure of a communication device. [Diagram 2] 1 is a schematic diagram of a heat pipe structure. [Diagram 3] FIG. 2 is a top view of a heat dissipation device for an optical module according to an embodiment of the present application. [Figure 4] FIG. 4 is a side view of a heat dissipation device for the optical module shown in FIG. 3 according to an embodiment of the present application. [Diagram 5] 1 is a schematic diagram of the internal structure of a heat pipe according to an embodiment of the present application; [Figure 6A] FIG. 2 is a top view of a heat dissipation device for an optical module according to an embodiment of the present application. [Figure 6B] FIG. 6B is a side view of a heat dissipation device for the optical module shown in FIG. 6A according to an embodiment of the present application. [Figure 7A] 1 is a side cross-sectional view of a heat dissipation substrate according to an embodiment of the present application; [Figure 7B] 7B is a top cross-sectional view of the heat dissipation substrate shown in FIG. 7A according to an embodiment of the present application. [Figure 8] 1 is a side view of another heat dissipation device for an optical module according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] In order to make the objectives, technical solutions and advantages of the present application clearer, the following further describes in detail the heat dissipation apparatus for optical modules and communication devices with reference to the accompanying drawings.

[0032] In order to facilitate understanding of the optical module assembly provided in the embodiments of the present application, the following first describes the optical module in detail.

[0033] In the data transmission stage of an optoelectronic communication system, data information is transmitted in the form of optical signals in media such as fibers and cables to achieve low-cost and low-loss information transmission. In the data processing stage, communication devices (such as computers) use electrical signals. Therefore, in order to facilitate the processing of data information, the data information in the form of optical signals needs to be converted into the form of electrical signals.

[0034] The main function of the optical module is to perform mutual conversion between the aforementioned optical signal and the aforementioned electrical signal. Therefore, in the optical electronic communication system, the optical module plays a particularly important role. Functionally, the optical module mainly includes a transmitting part and a receiving part. The optical module relies on the transmitting part to convert the electrical signal into an optical signal, and relies on the receiving part to convert the optical signal into an electrical signal. For example, the transmitting part is configured to input an electrical signal having a specific bit rate, and drive a semiconductor laser device or a light emitting diode to emit an optical signal having a corresponding rate after the electrical signal is processed by an internal driving chip. The transmitting part may have an automatic optical output control circuit therein to keep the output of the output optical signal stable. The receiving part is configured to convert the optical signal having a specific bit rate into an electrical signal through a photodetector diode after the optical signal is input into the optical module, and then output the electrical signal having the corresponding bit rate after the electrical signal passes through a preamplifier.

[0035] Unless otherwise specified, it should be noted that the optical module in this application is a broad optical module, and refers to a device that has an optical signal transmission function or an optical signal reception function, or can perform mutual conversion between an optical signal and an electrical signal. In addition, other functions and forms of the optical module are not limited in this application.

[0036] Fig. 1 is a schematic diagram of the structure of a communication device. As shown in Fig. 1, in the practical application of the optical module 10, the optical module 10 is generally plugged into the communication device 20 to implement the connection between the optical module 10 and the communication device 20. Specifically, a jack 211 that helps to connect to the optical module 10 is disposed in the housing 21 of the communication device 20. A part of the optical module 10 may extend into the housing 21 through the jack 211, and another part is exposed to the outside of the housing 21.

[0037] With the continuous development of the optical electronic communication system, the capacity of data information carried in the communication system is becoming larger and larger, and the transmission rate of the data information is also becoming higher and higher. When the optical module 10 and the communication device 20 process a large amount of data information, the power consumption of the optical module 10 and the communication device 20 is greatly increased, resulting in an obvious increase in the heat generated.

[0038] In order to improve the heat dissipation performance of the optical module 10 , a heat pipe 330 may be disposed on the surface of the optical module 10 .

[0039] FIG. 2 is a schematic diagram of the structure of a heat pipe. Please refer to FIG. 2. The heat pipe 330 has a high-temperature end 301 and a low-temperature end 302 opposite to each other. The heat pipe is evacuated inside. The high-temperature end 301 of the heat pipe 330 is configured to contact the heat generating surface of the optical module 10, absorb the heat generated by the optical module 10, and transfer the heat to the low-temperature end 302 of the heat pipe 330. The low-temperature end 302 of the heat pipe is configured to dissipate heat to the outside of the optical module 10, thereby implementing the heat dissipation of the optical module 10. In addition, the heat pipe 330 further has a port 3021 for injecting a phase-change working substance into the heat pipe 330 after the inside of the heat pipe 330 is evacuated, and then the port 3021 is sealed. The phase-change working substance may be a liquid with a high specific heat capacity, and is configured to absorb heat through a vaporization process when heated. To ensure air tightness inside the heat pipe, the inside diameter of the port 3021 is narrow.

[0040] However, when high-power-consuming optical modules are densely arranged in existing communication devices, due to the heat dissipation of the optical modules alone, the temperature difference between the optical modules is large and temperature uniformity cannot be achieved, which reduces the processing performance of the optical modules and the communication devices and shortens the life span of the optical modules and the communication devices.

[0041] Therefore, an embodiment of the present application provides a heat dissipation device for an optical module, which can improve the heat dissipation performance of the optical module 10.

[0042] In order to make the objectives, technical solutions and advantages of the present application clearer, the following further describes the present application in detail with reference to the accompanying drawings and specific embodiments.

[0043] The terms used in the following embodiments are only intended to describe certain embodiments and are not intended to limit the present application. As used in this specification and the appended claims of this application, the singular terms "a," "an," "the," "the," and "one of" are intended to include the plural forms such as "one or more," unless the context clearly indicates otherwise. It is further understood that in the following embodiments of this application, "at least one" and "one or more" refer to one, two, or more.

[0044] References to "one embodiment" or the like as described herein mean that one or more embodiments of the application include the particular feature, structure, or characteristic described with reference to the embodiment. Thus, statements such as "in one embodiment," "in some other embodiments," and "in yet other embodiments" appearing in different places in this specification do not necessarily refer to the same embodiment, unless otherwise specified, but rather mean "one or more, but not all, embodiments." The terms "including," "comprising," "having," and variations thereof all mean "including, but not limited to," unless specifically emphasized otherwise.

[0045] 3 is a top view of a heat dissipation device for an optical module according to an embodiment of the present application. As shown in FIG. 3, the heat dissipation device 300 includes a plurality of optical module heat sinks 310, a common heat sink 320, and a plurality of heat pipes 330. In addition, for ease of description, this embodiment further includes an optical module 370 and a PCB board 360. After being plugged into a communication device, the optical module 370 forms a circuit connection with the PCB board 360. As shown in FIG. 3, each optical module 370 is provided with a corresponding optical module heat sink 310. In addition, at the rear end of each optical module heat sink 310, a common heat sink 320 is further provided in the heat dissipation device.

[0046] Specifically, as shown in FIG. 3, the heat pipe 330 is embedded horizontally between the optical module heat sink 310 and the common heat sink 320. The heat pipe 330 can communicate the optical module heat sink 310 with the common heat sink 320 to transfer the heat of the optical module to the common heat sink 320 to prevent the overload of a single optical module heat sink. In addition, the heat pipe 330 is embedded vertically inside the common heat sink 320 to equalize the temperature difference in the common heat sink. By the above-mentioned heat dissipation device, the temperature difference between multiple optical modules can be reduced, and the temperature cascade of the optical modules can be implemented, thereby implementing the sharing of heat dissipation resources in the entire heat dissipation device and improving the heat dissipation ability of the optical modules.

[0047] It should be understood that the number of heat pipes 330 may be determined based on the amount of heat emitted by the optical module. For example, when the optical module emits a large amount of heat, multiple heat pipes arranged side by side may be used.

[0048] FIG. 4 is a side view of a heat dissipation device for the optical module shown in FIG. 3 according to an embodiment of the present application. As shown in FIG. 4, in a possible implementation, the heat dissipation device for the optical module further includes a boss 340. The boss 340 is configured to conduct heat of the optical module to the optical module heat sink 310. One end of the boss 340 is configured to contact the optical module, absorb heat from the surface of the optical module, and transfer the heat to the other end of the boss through the boss itself. The other end of the boss 340 contacts the optical module heat sink 310. Using FIG. 4 as an example, the top surface of the boss 340 contacts the bottom surface of the optical module heat sink 310, and the bottom surface of the boss 340 contacts the optical module. For example, the boss 340 can be made of a metal material so that the heat generated by the optical module is conducted to the top surface, and the heat is absorbed by the optical module heat sink. For example, the heat dissipation device further includes a heat sink fin 350. The heat sink fins 350 may be welded to the top surface of the optical module heat sink 310 and the top and bottom surfaces of the common heat sink, and are configured to dissipate heat. Specifically, the heat sink fins 350 are made of a metal material.

[0049] It should be noted that the manner of connection between the boss 340 and the optical module heat sink 310 is not limited in this embodiment of the present application. There are multiple manners of connection between the boss 340 and the optical module heat sink 310, for example, there is a permanent connection, i.e., the boss 340 and the optical module heat sink 310 are fixed relative to each other in the second direction, for example, they are welded to each other, and in another example, there is a movable connection, i.e., the boss 340 and the optical module heat sink 310 can be moved relative to each other in the second direction. For example, the boss 340 and the optical module heat sink 310 are an integral structure. Instead, the boss 340 and the optical module heat sink 310 may be connected in another manner. It should also be noted that the heat dissipation device of the present application may include multiple bosses, and each boss corresponds to one optical module and one optical module heat sink.

[0050] FIG. 5 is a schematic diagram of the internal structure of a heat pipe according to an embodiment of the present application. As shown in FIG. 5, the heat pipe 330 includes a heat pipe housing 3301, a capillary layer 3302, and a phase-change working material 3303. The housing 3301 is usually made of a metal material such as copper. The capillary layer 3302 is generally made of copper powder or copper mesh, and is sintered on the inner surface of the housing 3301. The phase-change working material 3303 is usually water. The inner cavity of the heat pipe 330 is depressurized to a vacuum or negative pressure state. The working principle of the heat pipe 330 is as follows: when the high-temperature end 301 of the heat pipe is heated, the phase-change working material quickly evaporates into vapor, and the vapor quickly diffuses to the low-temperature end 302 under a small pressure difference, releases heat at the low-temperature end 302, and re-condenses into a liquid. The condensed liquid is then transported back to the hot end 301 by the capillary force of the capillary layer 3302, and the process is repeated. In addition, the heat released at the cold end 302 is then transferred to the common heat sink 320 and dissipated to the outside airflow through the fins of the common heat sink 320, which quickly transfers the heat and equilibrates the temperature of the entire heat dissipation device.

[0051] For example, multiple heat pipes 330 arranged side-by-side in the interior cavity of a common heat sink 320 may be used for internal thermal uniformity.

[0052] For example, a plurality of optical module heat sinks are parallel to each other in the horizontal direction and are all perpendicular to a common heat sink. A plurality of first heat dissipation sections are arranged in parallel in the horizontal direction and are all perpendicular to a second heat dissipation section, forming a piano key shape as a whole. This can effectively reduce the volume of the heat dissipation device and improve the heat dissipation efficiency of the communication device.

[0053] In conclusion, with the heat dissipation device for optical modules provided in this embodiment, the heat pipe can connect the optical module heat sink with a common heat sink to prevent the overload of a single optical module heat sink, so that the heat of the optical module is transferred to the common heat sink. With the above-mentioned heat dissipation device, the temperature difference between multiple optical modules can be reduced, and the temperature cascade of the optical modules can be realized, thereby implementing the sharing of heat dissipation resources in the whole heat dissipation device and improving the heat dissipation ability of the optical module.

[0054] 6A and 6B show another heat dissipation device for an optical module according to an embodiment of the present application.

[0055] FIG. 6A is a top view of a heat dissipation device for an optical module according to an embodiment of the present application. FIG. 6B is a side view of a heat dissipation device for an optical module shown in FIG. 6A according to an embodiment of the present application. As shown in FIG. 6A and FIG. 6B, the heat dissipation device 600 provided in this embodiment includes a heat dissipation substrate 610 and a boss 620. In addition, for ease of description, this embodiment further includes an optical module 640 and a PCB substrate 630. After being plugged into a communication device, the optical module 640 forms a circuit connection with the PCB substrate 630. The heat dissipation substrate 610 specifically includes a plurality of first heat dissipation parts 611, a plurality of adapter parts 612, and a second heat dissipation part 613. The plurality of first heat dissipation parts correspond one-to-one with the plurality of adapter parts. The first heat dissipation part 611 is located above the optical module 640 and configured to absorb heat of a single optical module and transfer the heat to the second heat dissipation part 613 through the adapter part 612. The second heat dissipation part 613 is located behind all the optical modules and is a common heat sink for the optical modules. The adapter part 612 is configured to connect an end of the first heat dissipation part 611 and an end of the second heat dissipation part 613 to make the first heat dissipation part 611 communicate with the second heat dissipation part 613 internally, thereby implementing the sharing of heat dissipation resources in the entire heat dissipation device. The first heat dissipation part 611, the adapter part 612, and the second heat dissipation part 613 are integral parts. For example, the first heat dissipation part 611, the adapter part 612, and the second heat dissipation part 613 can be integrated by processes such as welding and injection molding. The boss 620 is configured to conduct heat of the optical module to the heat dissipation substrate. One end of the boss 620 is configured to contact the optical module and absorb heat from the surface of the optical module. The other end of the boss 620 contacts the first heat dissipation part and conducts heat of the optical module to the heat dissipation substrate through the boss 620 itself. For example, one end of the boss 620 is the upper surface and the other end is the lower surface. The upper surface of the boss 620 is welded to the lower surface of the first heat dissipation part 611, the lower surface of the boss 620 contacts the optical module, and the boss 620 may be made of a metal material. In this way, the heat generated by the optical module is conducted to the upper surface and absorbed by the optical module heat sink. The direction of the arrow in FIG. 6A indicates the heat flow direction.

[0056] Optionally, fins 650 may be further arranged on the upper surface of the first heat dissipation section 611 and the upper and lower surfaces of the second heat dissipation section 613 to increase the heat dissipation area of ​​the heat dissipation substrate 610 and further improve the heat dissipation effect of the optical module 640. Specifically, the fins 650 may be welded to the upper surface of the first heat dissipation section 611 and the upper and lower surfaces of the second heat dissipation section 613. Preferably, the fins 650 are made of a metal material. Alternatively, the fins 650 may be arranged at another position on the surface of the heat dissipation substrate. This is not limited in the present application. Alternatively, in some embodiments, the fins 650 may be omitted.

[0057] Based on the heat dissipation device provided in this embodiment, when the heat dissipation device is working, the heat of the optical module is first transferred to the first heat dissipation part 611 through the boss, and the first heat dissipation part 611 can dissipate part of the heat. For example, the first heat dissipation part 611 dissipates part of the heat through the fins 650 located on the upper surface of the first heat dissipation part 611. In addition, since the first heat dissipation part 611 communicates with the second heat dissipation part 613 through the adapter part 612, the remaining heat of the optical module can be transferred to the second heat dissipation part 613 respectively, and carried away by the air flow through the second heat dissipation part 613, so that the heat dissipation resources are shared by the optical modules, the temperature difference between the modules is reduced, and the temperature stability of the communication device is achieved.

[0058] FIG. 7A is a side cross-sectional view of a heat dissipation substrate according to an embodiment of the present application, and FIG. 7B is a top cross-sectional view of the heat dissipation substrate shown in FIG. 7A according to an embodiment of the present application. As shown in FIG. 7A, in a possible embodiment, the heat dissipation substrate 610 includes a substrate housing 6101, a capillary structure layer 6102, a vacuum cavity 6103, a phase change working material 6104, a support 6105, and a capillary powder layer 6106. In one embodiment, the substrate housing 6101 can be made of a metal material, for example, a metal plate such as an aluminum plate, a copper plate, or an iron plate, or another hard metal material. The capillary structure layer 6102 is sintered with the upper and lower layers of the inner surface of the substrate housing 6101. It should be noted that the first heat dissipation portion 611, the adapter portion 612, and the second heat dissipation portion 613 of the heat dissipation substrate are integrally formed. In the present embodiment, it can be understood that the substrate housing 6101 and the capillary structure layer 6102 of the heat dissipation substrate 610 are integrally formed. The capillary structure layer 6102 may be, but is not limited to, a metal powder or a metal mesh. The vacuum cavity 6103 is located between the two upper and lower capillary structure layers 6102 and obtained by drawing a vacuum. A phase-change working material 6104, for example, water, is disposed in the vacuum cavity 6103 and configured to convert the heat of the optical module. The support pillars 6105 are located between the upper and lower layers of the substrate housing 6101 and are configured to stretch the substrate housing 6101. It should be noted that since the substrate housing 6101 and the capillary structure layer 6102 are integrally formed, the support pillars 6105 can also be said to be located between the upper and lower layers of the capillary structure layer 6102 and configured to stretch the capillary structure layer 6102. The capillary powder layer 6106 is sintered in the circumferential direction with the outer layer of the support 6105. The capillary powder layer 6106 may be a metal powder. The metal powder and the metal powder forming the capillary structure layer 6102 may be made of the same material. After the heat generated by the optical module is cooled and liquefied in the upper layer of the heat dissipation substrate, the capillary powder layer 6106 or the capillary structure layer 6102 is configured to guide the cooled and liquefied liquid to the lower layer of the heat dissipation substrate by the driving force of capillary force to carry out the thermal cycle of the phase-change working material.

[0059] It should be noted that the vacuum cavity can enable the phase-change working material 6104 to reach a state in which it evaporates very easily, thereby implementing rapid heat dissipation of the optical module and ensuring that the inner walls of the heat dissipation substrate are not corroded or contaminated.

[0060] It should also be noted that in Fig. 7A and Fig. 7B of this embodiment, the shape of the phase-change working material 6104 is designed to be block-like, and the phase-change working material 6104 is arranged in several positions in the internal cavity of the heat dissipation substrate, but this is only for ease of description. However, this does not mean that the phase-change working material is solid, or that the distribution of the phase-change working material is limited to the positions in the figures. In fact, in a possible embodiment, the phase-change working material can be liquid, and the liquid is distributed over the entire lower surface of the internal cavity of the heat dissipation substrate.

[0061] The working principle of the heat dissipation device is as follows: when the optical module 640 works, heat is conducted to the bottom of the first heat dissipation part 611 through the boss 620, the phase-change working material 6104 in the vacuum cavity 6103 absorbs heat and vaporizes, and the vaporized gas quickly diffuses everywhere in the vacuum cavity of the heat dissipation substrate. Due to the presence of the heat dissipation fins 650 on the upper surface of the first heat dissipation part and the upper and lower surfaces of the second heat dissipation part of the heat dissipation substrate, the temperature of the heat dissipation substrate is lower than the temperature of the vaporized gas. The gas is cooled and liquefied on the upper surface of the first heat dissipation part and the upper and lower surfaces of the second heat dissipation part of the heat dissipation substrate to release heat, and the heat is dissipated through the heat dissipation fins 650. The liquefied liquid is returned to the lower surface of the first heat dissipation part 611 of the heat dissipation substrate by capillary force along the capillary structure layer 6102 and the capillary powder layer 6106. This process is circulated continuously. The heat of each optical module is spread throughout the internal cavity of the heat dissipation substrate and finally removed by the airflow through the heat dissipation fins, thereby implementing the sharing of heat dissipation resources among the optical modules and reducing the temperature difference between the modules.

[0062] For example, the multiple first heat dissipation parts are parallel to each other in the horizontal direction and are all perpendicular to the second heat dissipation part. The multiple first heat dissipation parts are arranged in parallel in the horizontal direction, and are all perpendicular to the second heat dissipation part, and are generally in the shape of a piano keyboard. This can effectively reduce the volume of the heat dissipation device and improve the heat dissipation efficiency of the communication device.

[0063] For example, the materials of the capillary structure layer and the fine capillary powder layer are both copper powder, and the phase change working material of the capillary structure layer and the fine capillary powder layer is water.

[0064] It should be noted that the selection of the phase-change working material 6104 is mainly related to the working temperature of the heat dissipation device, and the properties of the liquid, such as the specific heat capacity and boiling point, are also factors to be considered. The general working temperature of existing heat dissipation devices is about 60 degrees Celsius. Therefore, water is commonly used as the phase-change working material. In liquids, water is generally the first choice of the heat dissipation device, because water has a high specific heat capacity and a low freezing point, is easy to boil, and has a low cost. Of course, when the heat dissipation device has a low temperature, substances such as acetone and liquid ammonia may also be used, since acetone and liquid ammonia have low freezing points, which can prevent the heat dissipation device from being unable to dissipate heat normally due to the solidification of the phase-change working material during operation. In addition, chemical substances such as anhydrous alcohol may also be used as the phase-change working material. Specifically, this is not limited in this application.

[0065] Preferably, the support pillar 6105 or the capillary powder layer 6106 is not disposed in the internal cavity of the adapter part 612. In this way, the adapter part can be designed to be flexible to absorb the tolerance brought by the insertion and removal of the optical module to ensure the normal insertion and removal of the optical module. It should be noted that different optical modules may have different shapes and sizes, and the position and height of the second heat dissipation part of the heat dissipation substrate are permanent in the communication device. When the optical modules having different shapes and heights are inserted into the communication device, because the adapter part is designed to be flexible, sufficient space can be provided under the first heat dissipation part to ensure the normal insertion and removal of the optical module.

[0066] There are various connection manners between the boss 620 and the first heat dissipation part 611, for example, there is a permanent connection, i.e., the boss 620 and the first heat dissipation part 611 are fixed relative to each other in the second direction, for example, welded to each other, and in another example, there is a movable connection, i.e., the boss 620 and the first heat dissipation part 611 are movable relative to each other in the second direction. Alternatively, an elastic structure or elastic material is used for the boss 620, which has a certain expansion and contraction space in the second direction. In this way, when optical modules with different heights are inserted into the communication device, the height of the boss can be changed correspondingly, so that the optical modules can be smoothly inserted. For example, the boss 620 and the first heat dissipation part 611 are an integral structure part. Alternatively, the boss 620 and the first heat dissipation part 611 may be connected in another manner.

[0067] Please note that all first directions in this application are directions H shown in Figure 6A, i.e., directions parallel to the insertion direction of the optical module 640. All second directions in this application are directions V shown in Figure 6B, i.e., directions perpendicular to the insertion direction of the optical module.

[0068] Optionally, to achieve a better heat conduction effect, the boss 620 may include a thermal pad. The thermal pad may be joined to the first heat dissipation part by a joint structure, or may be connected to the first heat dissipation part by a connector. Of course, another connection structure may be used instead to connect the thermal pad to the first heat dissipation part. Specifically, a thermally conductive member such as thermally conductive graphene may be used as the boss.

[0069] It should be understood that regardless of how the boss 620 is connected to the first heat dissipation portion 611, the boss should preferably be in surface contact with the first heat dissipation portion to improve heat transfer efficiency. In this way, compared with discrete point contact, the surface contact can effectively improve the heat transfer efficiency.

[0070] It should be noted that the flatness and roughness of the contact surface between the boss 620 and the first heat dissipation part 611 should be as small as possible to reduce the thermal resistance between the contact surfaces and improve the heat conduction efficiency. It should be noted that the flatness, also called uniformity, is one of the important indexes for evaluating the quality of the formed surface, which is the deviation of the measured surface height from the ideal plane, which directly affects the joining effect and fastening performance between the components. Roughness refers to the unevenness of the measured surface, which has small gaps and microscopic irregularities. The smaller the roughness of the surface, the smoother the surface.

[0071] In conclusion, the heat dissipation device for optical modules provided in this embodiment allows the adapter part to connect the optical module heat sink (first heat dissipation part) with a common heat sink (second heat dissipation part) to prevent overloading of a single optical module heat sink, so that the heat of the optical module is transferred to the common heat sink. By the above-mentioned heat dissipation device, the temperature difference between multiple optical modules can be reduced, and the temperature cascade of the optical module can be implemented, thereby implementing the sharing of heat dissipation resources in the whole heat dissipation device and improving the heat dissipation ability of the optical module.

[0072] FIG. 8 is a side view of another heat dissipation device for an optical module according to an embodiment of the present application. As shown in FIG. 8, the heat dissipation device 800 includes a heat dissipation substrate 810 and a boss 820. In addition, for ease of description, this embodiment further includes an optical module 840 and a PCB substrate 830. After being plugged into a communication device, the optical module 840 forms a circuit connection with the PCB substrate 830. Similar to the heat dissipation device shown in FIG. 6A and FIG. 6B, the heat dissipation substrate 810 of this embodiment also includes a plurality of first heat dissipation parts 811, a plurality of adapter parts 812 corresponding to the first heat dissipation parts 811, and a second heat dissipation part 813.

[0073] Different from the heat dissipation device for an optical module shown in FIGS. 6A and 6B, the heat dissipation device for an optical module provided in this embodiment further includes a first substrate 814 and a second substrate 815 .

[0074] Specifically, the first substrate 814 is located above the first heat dissipation section 811, configured to hold the first heat dissipation section, and assist the first heat dissipation section 811 in performing heat dissipation. The second substrate 815 is located above the second heat dissipation section 813, configured to hold the second heat dissipation section, and assist the second heat dissipation section 813 in performing heat dissipation. It should be noted that in the heat dissipation device for the optical module shown in Figures 6A and 6B, the heat dissipation substrate 610 is essentially a phase change substrate, and the main function of the heat dissipation substrate 610 is to quickly transfer the heat of the optical module, and the heat dissipation effect is limited. In addition, a support needs to be disposed inside the heat dissipation substrate to hold the internal cavity of the heat dissipation substrate. In this embodiment, the first substrate and the second substrate are added to the first heat dissipation section and the second heat dissipation section respectively, and replace the support pillars to hold the first heat dissipation section and the second heat dissipation section of the heat dissipation substrate, which not only simplifies the manufacturing process of the heat dissipation substrate and reduces the heat dissipation cost, but also assists the first heat dissipation section and the second heat dissipation section in dissipating heat, and can quickly transfer the heat of the optical module to the outside of the device, thereby improving the heat dissipation efficiency.

[0075] For example, the first substrate 814 is welded to the upper surface of the first heat dissipation section 811. The second substrate is welded to the upper surface of the second heat dissipation section 813. The adapter section 812 remains flexible to absorb the tolerance caused by the insertion and removal of the optical module and ensure the normal insertion and removal of the optical module. Alternatively, the first substrate 814 is welded to the lower surface of the first heat dissipation section 811, and the second substrate is welded to the lower surface of the second heat dissipation section 813. Alternatively, in another aspect, the first substrate 814 may be connected to the first heat dissipation section. In this embodiment, the manner of connection between the first substrate and the first heat dissipation section and the manner of connection between the second substrate and the second heat dissipation section are not limited.

[0076] For example, the first substrate or the second substrate may be a metal plate. Because of its certain rigidity, the metal plate can not only hold the heat dissipation substrate, but also has good thermal conductivity, which can improve the heat dissipation efficiency of the heat dissipation device.

[0077] Optionally, fins 850 may be further disposed on the upper surface of the first heat dissipation portion 811 and the upper and lower surfaces of the second heat dissipation portion 813, so as to increase the heat dissipation area of ​​the heat dissipation substrate 810 and further improve the heat dissipation effect of the optical module 840. Specifically, the fins 850 may be welded to the upper surface of the first heat dissipation portion 811 and the upper and lower surfaces of the second heat dissipation portion 813. Preferably, the fins 850 are made of a metal material.

[0078] Of course, the fins 850 may instead be disposed at other locations on the surface of the heat dissipation substrate, and this is not a limitation of this application. Alternatively, in some embodiments, the fins 850 may be omitted.

[0079] When the heat dissipation device is operated, the heat of the optical module is first transferred to the first heat dissipation part through the boss. The first heat dissipation part can dissipate a part of the heat, for example, through the first substrate on its upper surface. In addition, the first heat dissipation part 611 internally communicates with the second heat dissipation part 613 through the adapter part 612, so that the remaining heat of the optical module can be transferred to the second heat dissipation part 613 respectively and dissipated to the outside of the communication device through the second substrate located on the upper surface of the second heat dissipation part 613. In this way, the heat dissipation resources are shared by the optical modules, the temperature difference between the modules is reduced, and the temperature stability of the communication device is achieved.

[0080] In this embodiment, the internal structure of the heat dissipation substrate 810, the connection between the boss 820 and the heat dissipation substrate 810, and the positions and specific functions of each component can be referred to the above embodiment, and the details will not be described again here.

[0081] In addition, the embodiment of the present application further provides a communication device. For details, please refer to the communication device 20 shown in FIG. 1. The communication device includes a heat dissipation device for an optical module, a PCB board, and an optical module according to the above-mentioned embodiment. The PCB board has a jack, and the optical module is inserted into the communication device through the jack, and the heat generated by the optical module is dissipated to the outside of the communication device through the heat dissipation device for the optical module. In a specific implementation, the communication device may be a device such as a switch, a router, or a gateway. In the present application, the type of the communication device is not limited.

[0082] It should be understood that in specific implementation, the number of heat dissipation devices for the optical modules used in the communication device 20 can be appropriately set based on the actual situation, which is not limited in this application.

[0083] The above description is merely a specific embodiment of the present application, and is not intended to limit the scope of protection of the present application. Any variations or replacements that are easily conceived by those skilled in the art within the technical scope disclosed in the present application shall be within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims. [Explanation of symbols]

[0084] 10 Optical Modules 20. Communication Devices 21 Housing 211 Jack 300 Heat dissipation device 301 Hot End 302 Low temperature end 310 Optical module heat sink 320 Common Heat Sink 330 Heat Pipe 340 Boss 350 Heatsink Fins 360 PCB Board 370 Optical Module 600 Heat dissipation device 610 Heat dissipation board 611 First heat dissipation part 612 Adapter part 613 Second heat dissipation section 620 Boss 630 PCB Board 640 Optics Module 650 Fins 800 Heat dissipation device 810 Heat dissipation board 811 First heat dissipation part 812 Adapter part 813 Second heat dissipation section 814 First Substrate 815 Second Board 820 Boss 830 PCB Board 840 Optics Module 850 Fins Port 3021 3301 Heat Pipe Housing 3302 Capillary layer 3303 Phase change working materials 6101 PCB Housing 6102 Capillary structure layer 6103 Vacuum Cavity 6104 Phase change working material 6105 Post 6106 Capillary Powder Bed

Claims

1. A heat dissipation device for an optical module, comprising: a heat dissipation substrate including a plurality of first heat dissipation sections, a plurality of adapter sections, and a second heat dissipation section, wherein the plurality of first heat dissipation sections correspond one-to-one to the plurality of adapter sections, each of the adapter sections is configured to connect the corresponding first heat dissipation section and the second heat dissipation section, and the plurality of first heat dissipation sections, the plurality of adapter sections, and the second heat dissipation section are integrally formed; a plurality of bosses each corresponding to the plurality of first heat dissipation portions and configured to conduct heat of the optical module to the heat dissipation substrate, one end of each boss being in contact with the optical module and the other end of each boss being in contact with the corresponding first heat dissipation portion; Equipped with A heat dissipation device for an optical module, wherein the plurality of first heat dissipation sections, the plurality of adapter sections, and the second heat dissipation section each include a substrate housing and a capillary structure layer, the capillary structure layer being sintered on an inner surface of the substrate housing to perform periodic heat dissipation, and the plurality of first heat dissipation sections, the plurality of adapter sections, and the second heat dissipation section being integrally formed includes the substrate housing and the capillary structure layer being integrally formed.

2. The heat dissipation substrate further comprises a vacuum cavity; The heat dissipation device as claimed in claim 1 , wherein the vacuum cavity is obtained by evacuating an inner cavity of the heat dissipation substrate, and the vacuum cavity is filled with a phase-change working material to transfer the heat of the optical module by vaporization.

3. 3. The heat dissipation device of claim 2, wherein each of the adapter parts is configured to connect its corresponding first heat dissipation part and second heat dissipation part, including each of the first heat dissipation parts, each of the adapter parts, and the second heat dissipation part communicating with each other via the vacuum cavity.

4. 3. The heat dissipation device according to claim 2, wherein the phase-change working material is water.

5. 5. The heat dissipation device according to claim 1, wherein each of the first heat dissipation section and the second heat dissipation section further comprises a support and a capillary powder layer, the support being located between an upper layer and a lower layer of the substrate housing and configured to hold the substrate housing, the capillary powder layer being sintered in a circumferential direction on an outer layer of the support, and after the heat generated by the optical module is cooled and liquefied in the upper layer of the heat dissipation substrate, the capillary powder layer or the capillary structure layer is configured to guide the cooled and liquefied liquid to the lower layer of the heat dissipation substrate.

6. The heat dissipation device according to claim 1 or 5, wherein the material of the capillary structure layer and / or the material of the capillary powder layer is copper powder.

7. The heat dissipation device includes: a first substrate welded to a surface of the first heat sink, the first substrate configured to hold the first heat sink and assist in dissipating heat of the first heat sink; and / or a second substrate configured to be welded to a surface of the second heat sink to hold the second heat sink and to assist in dissipating heat from the second heat sink; The heat dissipation device according to claim 1 , further comprising:

8. The heat dissipation device according to claim 7 , wherein the first substrate or the second substrate is a metal plate.

9. The heat dissipation device according to claim 1 , wherein the first heat dissipation sections are arranged in a row parallel to each other in a first direction and perpendicular to the second heat dissipation section, and the first direction is a direction in which the optical module is inserted and removed.

10. The heat dissipation device according to claim 1 , further comprising heat dissipation fins, the heat dissipation fins being disposed on an outer surface of the heat dissipation substrate and configured to dissipate heat to the outside of the heat dissipation device.

11. The heat dissipation device according to claim 1 or 2, wherein the substrate housing is made of a hard metal material.

12. The heat dissipation device according to claim 1 , wherein the contact of the other end of the boss with the corresponding first heat dissipation portion specifically includes welding an upper surface of the boss to a lower surface of the corresponding first heat dissipation portion.

13. The heat dissipation device of claim 1 , wherein the boss is made of a thermally conductive graphene material.

14. A communication device comprising a heat dissipation device for an optical module according to any one of claims 1 to 13, a PCB board, and the optical module, the PCB board having a jack configured for insertion of the optical module.

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