Resin composition, cured product, resin sheet, printed wiring board, and semiconductor device

Abstract

To provide: a resin composition which can bring about a cured product capable of suppressing occurrence of warpage and having excellent dielectric characteristics; as well as the cured product, a resin sheet, a printed circuit board and a semiconductor device.SOLUTION: A resin composition of the invention contains (A) an epoxy resin, (B) an inorganic filler, and (C) a cage silsesquioxane compound.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition. The present invention further relates to a cured product, a resin sheet, a printed wiring board, and a semiconductor device obtained by using the resin composition. [Background technology]

[0002] Patent Document 1 discloses an epoxy resin obtained by a crosslinking reaction using, as a curing agent, a silsesquioxane compound having an alicyclic acid anhydride group, which is the raw material for a polymer having a double-decker skeleton in the main chain, and it is said that such a polymer is useful for optoelectronic materials such as insulating films, liquid crystal alignment films, encapsulants for light-emitting diodes, and optical waveguides (claim 1, 9, paragraphs

[0009] and

[0010] ). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4946169 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in recent years, insulating layers used in wiring boards having buried wiring layers, for example, are required to be less susceptible to warping and to have excellent dielectric properties.

[0005] An object of the present invention is to provide a resin composition capable of producing a cured product that is suppressed in occurrence of warping and has excellent dielectric properties; and a cured product, a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition. [Means for solving the problem]

[0006] Means for Solving the Problems The present inventors have conducted intensive research to solve the above problems, and as a result have found that the above problems can be solved by a resin composition containing (A) an epoxy resin and (B) an inorganic filler, further containing (C) a cage silsesquioxane, thereby completing the present invention.

[0007] That is, the present invention includes the following. [1] A resin composition comprising (A) an epoxy resin, (B) an inorganic filler, and (C) a cage-type silsesquioxane compound. [2] The resin composition according to [1], wherein the component (C) is a double-decker silsesquioxane compound. [3] The resin composition according to [2], wherein the double-decker silsesquioxane compound contains a cage structure represented by the following formula (C1): [ka] (C1) [In the above formula (C1), X's are each independently a group selected from an alkyl group having 1 to 40 carbon atoms, whose hydrogen atom may be replaced by a halogen atom, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, and an arylalkyl group in which an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, is bonded to an alkylene group having 1 to 8 carbon atoms; Y's each independently represent an alkyl group having 1 to 40 carbon atoms, whose hydrogen atom may be replaced by a halogen atom, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, or an arylalkyl group in which an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, is bonded to an alkylene group having 1 to 8 carbon atoms; Z's each independently represent a trivalent group bonded to a Si atom and containing two bonds; When X or Y is an alkyl group having 1 to 40 carbon atoms, -CH2- contained in the alkyl group may be replaced by -O- or -CH=CH-; When X or Y is an aryl group, and a hydrogen atom of the aryl group is replaced by an alkyl group having 1 to 20 carbon atoms, a hydrogen atom of the alkyl group having 1 to 20 carbon atoms may be replaced by a halogen atom, and -CH2- contained in the alkyl group having 1 to 20 carbon atoms may be replaced by -O- or -CH=CH-; When X or Y is an arylalkyl group, -CH2- contained in the arylalkyl group may be replaced by -O-.] [4] The resin composition according to [3], wherein each of X's is a phenyl group. [5] The resin composition according to any one of [1] to [4], wherein the component (C) contains a cage silsesquioxane compound having at least one reactive functional group in the molecule (C-1). [6] The resin composition according to [5], wherein the reactive functional group is an acid anhydride group. [7] The resin composition according to [6], wherein the acid anhydride group has any one of the structures shown below. [ka] [8] Further comprising (D) a hardener, The resin composition according to any one of [5] to [7], wherein the mass ratio of the content of the component (D) to the total content of the component (C-1) and the content of the component (D) is 10 mass% or more. [9] The resin composition according to any one of [1] to [8], wherein the content of the component (C) is 60 mass % or less, relative to 100 mass % of the non-volatile components in the resin composition.

[10] The resin composition according to any one of [1] to [9], further comprising an active ester curing agent.

[11] The resin composition according to any one of [1] to

[10] , further comprising (E) a radically polymerizable compound.

[12] The resin composition according to any one of [1] to

[11] , wherein the content of the component (B) is 10 mass % or more, relative to 100 mass % of the non-volatile components in the resin composition.

[13] The resin composition according to any one of [1] to

[12] , wherein the cured product of the resin composition has a dielectric constant (Dk) value of less than 3.2.

[14] The resin composition according to any one of [1] to

[13] , wherein a dielectric loss tangent (Df) value of a cured product of the resin composition is 0.0045 or less.

[15] The resin composition according to any one of [1] to

[14] , which is for use in an insulating layer of a printed wiring board.

[16] A cured product of the resin composition according to any one of [1] to

[15] .

[17] A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition according to any one of [1] to

[15] .

[18] A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of [1] to

[15] .

[19] A semiconductor device comprising the printed wiring board according to

[18] . Effect of the Invention

[0008] According to the present invention, it is possible to provide a resin composition that can provide a cured product that is suppressed in occurrence of warping and has excellent dielectric properties; and a cured product, a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The present invention will be described in detail below with reference to preferred embodiments. However, the present invention is not limited to the following embodiments and examples, and can be modified and implemented as desired without departing from the scope of the claims of the present invention and their equivalents.

[0010] [Resin composition] The resin composition of the present invention contains (A) an epoxy resin, (B) an inorganic filler, and (C) a cage silsesquioxane, and as a result, the resin composition of the present invention is able to suppress the occurrence of warping and provide a cured product with excellent dielectric properties.

[0011] The resin composition of the present invention may further contain optional components in addition to the components (A), (B) and (C). Examples of the optional components include a curing agent (D) (excluding the components (A) to (C)), a radical polymerizable compound (E), a polymerization initiator (F), a thermoplastic resin (G), a curing accelerator (H), other additives (I), and an organic solvent (J). Each component contained in the resin composition of the present invention will be described in detail below.

[0012] <(A) Epoxy resin> The resin composition of the present invention contains an epoxy resin (A). The epoxy resin (A) means a curable resin having an epoxy group. The component (A) excludes the component (C) described below. The epoxy resin (A) may be used alone or in combination of two or more kinds.

[0013] Examples of the epoxy resin (A) include bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, hydrogenated bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ether ... Examples of epoxy resins include ester type epoxy resins, cresol novolac type epoxy resins, phenol aralkyl type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, tetraphenylethane type epoxy resins, isocyanurate type epoxy resins, phenolphthalimidine type epoxy resins, and phenolphthalein type epoxy resins.

[0014] The resin composition preferably contains, as the (A) epoxy resin, an epoxy resin having two or more epoxy groups in one molecule. The proportion of the epoxy resin having two or more epoxy groups in one molecule relative to 100% by mass of the non-volatile components of the (A) epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0015] Epoxy resins include epoxy resins that are solid at a temperature of 25° C. (hereinafter sometimes referred to as "solid epoxy resins") and epoxy resins that are liquid at a temperature of 25° C. (hereinafter sometimes referred to as "liquid epoxy resins"). The resin composition of the present invention may contain, as the epoxy resin (A), only a solid epoxy resin, or only a liquid epoxy resin, or may contain a combination of a solid epoxy resin and a liquid epoxy resin.

[0016] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

[0017] Preferred solid epoxy resins include bixylenol type epoxy resins, naphthalene type epoxy resins, naphthalene type tetrafunctional epoxy resins, naphthol novolac type epoxy resins, cresol novolac type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol type epoxy resins, biphenyl type epoxy resins, naphthylene ether type epoxy resins, anthracene type epoxy resins, bisphenol A type epoxy resins, bisphenol AF type epoxy resins, phenol aralkyl type epoxy resins, tetraphenylethane type epoxy resins, phenolphthalimidine type epoxy resins, and phenolphthalein type epoxy resins.

[0018] Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene type epoxy resins) manufactured by DIC Corporation; and "EXA-73" manufactured by DIC Corporation. 11", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN475V" manufactured by Nippon Steel Chemical & Material Co., Ltd. (Naphthalene type epoxy resin); "ESN485" (Naphthol type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (Dihydroxynaphthalene type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", "YL7890" (Bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YL6121" (Biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX8800" (Anthracene type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX77" manufactured by Mitsubishi Chemical Co., Ltd. Examples of epoxy resins include "PG-100" (phenol aralkyl type epoxy resin), "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals, "YX7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical, "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical, "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical, "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical, and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd. These may be used alone or in combination of two or more types.

[0019] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0020] Preferred liquid epoxy resins are bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, hydrogenated bisphenol A type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins having an ester skeleton, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, and epoxy resins having a butadiene structure.

[0021] Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", and "825" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycilol type epoxy resin) manufactured by ADEKA Corporation; "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resins) manufactured by ADEKA Corporation; and "EP-4088S" (glycidylamine type epoxy resins) manufactured by ADEKA Corporation. Examples of such epoxy resins include: "ZX1059" manufactured by Nippon Steel Chemical & Material Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" manufactured by Nagase Chemtex Corporation (glycidyl ester type epoxy resin); "Celloxide 2021P" manufactured by Daicel Corporation (alicyclic epoxy resin having an ester skeleton); "PB-3600" manufactured by Daicel Corporation, "JP-100" and "JP-200" manufactured by Nippon Soda Co., Ltd. (epoxy resin having a butadiene structure); "ZX1658" and "ZX1658GS" manufactured by Nippon Steel Chemical & Material Co., Ltd. (1,4-glycidylcyclohexane type epoxy resin), "YX8000" manufactured by Mitsubishi Chemical Corporation (hydrogenated bisphenol A type epoxy resin), and "KF-101" manufactured by Shin-Etsu Chemical Co., Ltd. (epoxy modified silicone resin). These may be used alone or in combination of two or more types.

[0022] The (A) epoxy resin may be any one of a solid epoxy resin, a liquid epoxy resin, or a combination thereof, but it is preferable that it contains a solid epoxy resin, and it is particularly preferable that it is a combination of a solid epoxy resin and a liquid epoxy resin.

[0023] When a solid epoxy resin and a liquid epoxy resin are used in combination as the (A) epoxy resin, the mass ratio thereof (solid epoxy resin:liquid epoxy resin) is preferably 20:1 to 1:20, more preferably 10:1 to 1:10, and particularly preferably 3:1 to 1:3.

[0024] The epoxy equivalent of the (A) epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 1,000 g / eq., even more preferably 80 g / eq. to 500 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The epoxy equivalent is the mass of the resin per equivalent of epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0025] The weight average molecular weight (Mw) of the epoxy resin (A) is preferably from 100 to 5,000, more preferably from 250 to 3,000, and further preferably from 400 to 1500. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0026] The content of the epoxy resin (A) is more than 0% by mass, and from the viewpoint of obtaining the effects of the present invention significantly, when the non-volatile components in the resin composition are taken as 100% by mass, the content is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.3% by mass or more, particularly preferably 0.5% by mass or more, and is preferably 50% by mass or less, more preferably 40% by mass or less, even more preferably 35% by mass or less, particularly preferably 30% by mass or less. Therefore, in a preferred embodiment, the content of the epoxy resin (A) is 0.1 to 50% by mass, when the non-volatile components in the resin composition are taken as 100% by mass.

[0027] <(B) Inorganic filler> The resin composition contains an inorganic filler as component (B). By including the inorganic filler (B) in the resin composition, a cured product (insulating layer) having excellent mechanical properties can be obtained. Furthermore, by including the inorganic filler (B) in the resin composition, a cured product having a low linear thermal expansion coefficient can be obtained.

[0028] As the inorganic filler, an inorganic compound is used. Examples of the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Moreover, as the silica, spherical silica is preferable. (B) The inorganic filler may be used alone or in combination of two or more types.

[0029] (B) Commercially available inorganic fillers include, for example, "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30" manufactured by Denka Company, Ltd.; "Silfill NSS-3N", "Silfill NSS-4N", and "Silfill NSS-5N" manufactured by Tokuyama Corporation; and "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", and "SC-C2" manufactured by Admatechs Co., Ltd.

[0030] From the viewpoint of significantly obtaining the desired effects of the present invention, the average particle size of the (B) inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, and is preferably 5 μm or less, more preferably 2 μm or less, and even more preferably 1 μm or less.

[0031] (B) The average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is created on a volume basis using a laser diffraction / scattering particle size distribution measuring device, and the median diameter is used as the average particle size. The measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture by ultrasonic waves for 10 minutes. The measurement sample is measured using a laser diffraction particle size distribution measuring device with blue and red light wavelengths as the light source, and the volume-based particle size distribution of the inorganic filler is measured using a flow cell method, and the average particle size is calculated from the obtained particle size distribution as the median diameter. An example of a laser diffraction particle size distribution measuring device is the "LA-960" manufactured by Horiba, Ltd.

[0032] The specific surface area of ​​the (B) inorganic filler is preferably 1 m or less from the viewpoint of significantly obtaining the desired effects of the present invention. 2 / g or more, more preferably 2m 2 / g or more, particularly preferably 3m 2 / g or more. There is no particular upper limit, but it is preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 The specific surface area is measured by using a BET fully automatic specific surface area measuring device (Mountec's "Macsorb HM-1210") to adsorb nitrogen gas onto the surface of the sample, and then calculating the specific surface area using the BET multipoint method to measure the specific surface area of ​​the inorganic filler.

[0033] (B) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, titanate coupling agents, etc. The surface treatment agent may be used alone or in any combination of two or more.

[0034] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane), and Shin-Etsu Chemical Co., Ltd.'s N-phenyl-8-aminooctyl-trimethoxysilane.

[0035] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2 parts by mass to 5 parts by mass of the surface treatment agent, more preferably 0.2 parts by mass to 3 parts by mass, and even more preferably 0.3 parts by mass to 2 parts by mass.

[0036] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable.2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the melt viscosity in the form of a sheet, it is more preferable that the content is 1 mg / m 2 Less than 0.8 mg / m is preferred. 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0037] (B) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, the "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used.

[0038] The content of the (B) inorganic filler is more than 0 mass%, and from the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile components in the resin composition are taken as 100 mass%, the content is preferably 10 mass% or more, more preferably 15 mass% or more, and even more preferably 20 mass% or more. The upper limit is not particularly limited, but is, for example, 90 mass% or less. From the viewpoint of suppressing the occurrence of warping and obtaining a cured product with excellent dielectric properties, the content is 80 mass% or less, preferably 78 mass% or less, and more preferably 75 mass% or less. From the viewpoint of obtaining a cured product with a low dielectric tangent (Df), the content may be 50 mass% or less, 45 mass% or less, or 40 mass% or less.

[0039] <(C) Cage-type silsesquioxane compound> The resin composition contains a cage-type silsesquioxane compound (hereinafter also referred to as "cage-type PSQ") as component (C). The cage-type PSQ (C) may be used alone or in combination of two or more. The resin composition of the present invention can achieve the desired effects by containing component (C) in combination with components (A) and (B).

[0040] Silsesquioxane compounds (PSQ: polysilsesquioxane) usually have a skeleton containing a siloxane bond, (RSiO 3 / 2 ) n The above R represents an organic group such as a hydrocarbon group, and n represents an integer. Silsesquioxane compounds are known to have an amorphous structure, a ladder structure, an incompletely condensed structure, and a completely condensed structure. The cage PSQ contained in the resin composition of the present invention has a cage structure. The cage structure refers to a structure that contains multiple cyclic structures (in the case of a silsesquioxane compound, a cyclic structure composed of a silicon-containing skeleton) and forms a closed space by the multiple cyclic structures or can form a closed space after reaction. Cage PSQs include, for example, T8-type silsesquioxane compounds, double-decker-type silsesquioxane compounds (hereinafter also referred to as "DDSQ"), and T12-type silsesquioxane compounds, and may also include T7-type silsesquioxane compounds that can form a closed space by reaction. On the other hand, cage PSQs exclude PSQs that do not have a cage structure, such as PSQs having a ladder structure and PSQs having an amorphous structure.

[0041] From the viewpoint of enhancing the intended effects of the present invention, the cage PSQ is preferably DDSQ.

[0042] DDSQ preferably contains a cage structure represented by the following formula (C1): [ka] (C1) [In the above formula (C1), X's are each independently a group selected from an alkyl group having 1 to 40 carbon atoms, whose hydrogen atom may be replaced by a halogen atom, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, and an arylalkyl group in which an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, is bonded to an alkylene group having 1 to 8 carbon atoms; Y's each independently represent an alkyl group having 1 to 40 carbon atoms, whose hydrogen atom may be replaced by a halogen atom, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, or an arylalkyl group in which an aryl group, whose hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, is bonded to an alkylene group having 1 to 8 carbon atoms; Z's each independently represent a trivalent group bonded to a Si atom and containing two bonds; When X or Y is an alkyl group having 1 to 40 carbon atoms, -CH2- contained in the alkyl group may be replaced by -O- or -CH=CH-; When X or Y is an aryl group, and a hydrogen atom of the aryl group is replaced by an alkyl group having 1 to 20 carbon atoms, a hydrogen atom of the alkyl group having 1 to 20 carbon atoms may be replaced by a halogen atom, and -CH2- contained in the alkyl group having 1 to 20 carbon atoms may be replaced by -O- or -CH=CH-; When X or Y is an arylalkyl group, -CH2- contained in the arylalkyl group may be replaced by -O-.]

[0043] In X and Y, examples of the alkyl group include a methyl group, an ethyl group, a t-butyl group, an octyl group, and a decyl group. Examples of the alkyl group in which a hydrogen atom is replaced with a halogen atom include a 3,3,3-trifluoropropyl group and a tridecafluoro-1,1,2,2-tetrahydrooctyl group. Examples of the group in which -CH2- in the alkyl group is replaced with -O- include a 3-methoxypropyl group and a 3-heptafluoroisopropoxypropyl group. Examples of the group in which -CH2- in the alkyl group is replaced with -CH=CH- include an ethenyl group, a 3-butenyl group, and an allyloxyundecyl group.

[0044] In X and Y, examples of the cycloalkyl group include a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and a decalyl group.

[0045] In X and Y, examples of the aryl group include a phenyl group, a naphthyl group, an anthryl group, and a fluorenyl group. Examples of the aryl group in which a hydrogen atom is replaced by a halogen atom include a 4-fluorophenyl group, a 4-chlorophenyl group, and a 4-bromophenyl group. Examples of the aryl group in which a hydrogen atom is replaced by an alkyl group include a 4-methylphenyl group, a 4-ethylphenyl group, a 4-butylphenyl group, a 4-octylphenyl group, a 4-decylphenyl group, a 2,4-dimethylphenyl group, a 4-(1,1-dimethylethyl)phenyl group, and a 4-(2-ethylhexyl)phenyl group. Examples of the group in which a hydrogen atom of an aryl group is replaced by an alkyl group and -CH2- contained in the alkyl group is replaced by -O- include a 4-methoxyphenyl group, a 4-ethoxyphenyl group, a 4-butoxyphenyl group, a 4-heptyloxyphenyl group, and a methoxyethylphenyl group.

[0046] From the viewpoint of obtaining a cured product with a low dielectric tangent, preferably, in the cage structure shown in the formula (C1), at least one of X and Y, more preferably both, contain a hydrophobic group. Examples of the hydrophobic group include a hydrocarbon group having 1 to 40 carbon atoms, preferably a hydrocarbon group having 1 to 20 carbon atoms. Such a hydrocarbon group may be linear, may contain a side chain, may contain an aliphatic ring, or may contain an aromatic ring. X preferably contains an aromatic ring, more preferably contains a substituted or unsubstituted aryl group, further preferably a substituted or unsubstituted aryl group, and particularly preferably an unsubstituted aryl group. Y is preferably a substituted or unsubstituted aliphatic hydrocarbon group, and more preferably a substituted or unsubstituted alkyl group. In a preferred embodiment, in the cage structure shown in the formula (C1), all of the multiple Xs are phenyl groups. In a more preferred embodiment, in the cage structure shown in the formula (C1), all of the multiple Xs are phenyl groups, and all of the multiple Ys are alkyl groups, such as methyl groups.

[0047] Z is preferably a trivalent hydrocarbon group. The number of carbon atoms in the trivalent hydrocarbon group is preferably 2 or more, more preferably 4 or more, and preferably 20 or less, more preferably 10 or less. Preferred trivalent hydrocarbon groups include trivalent alicyclic groups and trivalent saturated aliphatic groups. The trivalent alicyclic group may be a crosslinked ring, and one -CH2- may be replaced by -O-. Preferred examples of Z include groups represented by the following formulas (1) to (7).

[0048] [ka]

[0049] The cage PSQ is not limited as long as it has the cage structure exemplified above, and may be (C-1) reactive cage PSQ or (C-2) non-reactive cage PSQ. The reactive cage PSQ refers to a cage PSQ having at least one reactive functional group in the molecule. The non-reactive cage PSQ refers to a cage PSQ that does not contain a reactive functional group.

[0050] From the viewpoint of suppressing the occurrence of warping and obtaining a cured product having excellent dielectric properties, it is preferable that the cage PSQ contains a (C-1) reactive cage PSQ, and more preferably the cage PSQ is a (C-1) reactive cage PSQ.

[0051] In view of the purpose of the present invention, the reactive functional group of the reactive cage PSQ generally refers to a functional group that exhibits reactivity when the resin composition is cured. The reactive functional group may be one that exhibits its reactivity by heating or light irradiation. Since the epoxy resin of the component (A) is thermosetting, it is preferable that the reactive functional group of the reactive cage PSQ (C-1) also exhibits reactivity by heating. The reactive cage PSQ (C-1) has a reactive functional group, which makes it possible to incorporate the component (C) into the crosslinked structure formed by the component (A). The number of reactive functional groups is one or more, preferably two or more, per molecule, and there is no upper limit as long as they can be introduced into the molecule. In one embodiment, the reactive cage PSQ (C-1) is a DDSQ having two reactive functional groups.

[0052] Examples of reactive functional groups include acid anhydride groups, epoxy groups, oxetanyl groups, hydroxy groups, carboxy groups, amino groups, and vinyl groups, as well as groups containing one or more of these groups (e.g., allyl groups, acryloyl groups, and methacryloyl groups).Unless otherwise specified, the term "acid anhydride group" refers to a group containing -CO-O-CO-.

[0053] The reactive functional group may be a part of the cage structure, may be directly bonded to the cage structure, or may be bonded via any linking group. From the viewpoint of obtaining a cured product excellent in rigidity and heat resistance, it is preferable that the reactive functional group is a part of the cage structure, and more preferably, it is preferable that it is configured by including Z in the cage structure of the above-mentioned formula (C1). In a preferred embodiment, the reactive functional group of the reactive cage PSQ (C-1) is an acid anhydride group. In a more preferred embodiment, the acid anhydride group of the reactive cage PSQ (C-1) contains -CO-O-CO- and contains any of the structures shown in the above-mentioned formulas (1) to (7).

[0054] The structures shown in the above formulae (1) to (7) all have three bonds. Preferably, the acid anhydride group is formed by linking two of the three bonds contained in any of the structures shown in the above formulae (1) to (7), more preferably two bonds of two adjacent carbon atoms, to -CO-O-CO-. In a further preferred embodiment, the acid anhydride group of the (C-1) reactive cage PSQ is formed by including Z in the cage structure of the above formula (C1), and includes any of the structures shown in the above formulae (1) to (7). In this case, the acid anhydride group is preferably formed by linking two of the three bonds contained in any of the structures shown in the above formulae (1) to (7), preferably two bonds held by two adjacent carbon atoms, to -CO-O-CO-, and is preferably bonded to a Si atom contained in the cage structure of the above formula (C1) via the remaining bond (i.e., Z in the cage structure of the formula (C1) forms a part of the acid anhydride group).

[0055] As the (C-1) reactive cage PSQ, a commercially available product can be used. Examples of such commercially available products include bifunctional double-decker silsesquioxane "alicyclic double-decker silsesquioxane-DDSQ-01" or "silsesquioxane alicyclic acid dianhydride DDSQ" (CAS number: 948849-07-8) manufactured by Japan Material Technology Co., Ltd. The (C-1) reactive cage PSQ may be produced, for example, according to the method described in Patent Document 1.

[0056] The (C-2) non-reactive cage-type PSQ can be produced, for example, by substituting the reactive functional group of the above-mentioned (C-1) reactive cage-type PSQ with a non-reactive group. To obtain the non-reactive cage-type PSQ, any monomer composition containing the (C-1) reactive cage-type PSQ may be prepared and the monomers may be polymerized together.

[0057] The content of the reactive cage PSQ (C-1) is preferably higher than the content of the non-reactive cage PSQ (C-2). In one embodiment, the non-reactive cage PSQ (C-2) is not contained. In this case, the component (C-1) may be read as the component (C).

[0058] The content of component (C) is more than 0 mass%, and from the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile components in the resin composition are taken as 100 mass%, the content is preferably 5 mass% or more, more preferably 7 mass% or more, even more preferably 10 mass% or more, and is preferably 60 mass% or less, more preferably 55 mass% or less, even more preferably 50 mass% or less.

[0059] The content (parts by mass) of the (C) component can be, for example, 10 times or less, 9 times or less, or 8 times or less relative to the content (parts by mass) of the (A) component. When the (C) component contains the (C-1) component, the content of the (C-1) component is preferably determined so that the total number of reactive functional groups of the (C-1) component is 20 times or less, 3 times or less, or 1.5 times or less, and 0.01 times or more, 0.05 times or more, or 0.1 times or more relative to the total number of epoxy groups of the (A) epoxy resin. The total number of epoxy groups of the (A) epoxy resin is the total value of the non-volatile mass of each of the (A) epoxy resins divided by the epoxy equivalent for all the epoxy resins. The total number of reactive functional groups of the (C-1) reactive cage PSQ is the total value of the non-volatile mass of each of the (C-1) reactive cage PSQs divided by the reactive functional group equivalent for all the reactive cage PSQs.

[0060] From the viewpoint of obtaining the effects of the present invention significantly, the total content of the (C) component and the (B) component is preferably 15% by mass or more, more preferably 20% by mass or more, and even more preferably 25% by mass or more, when the non-volatile components in the resin composition are 100% by mass, and the upper limit is not particularly limited, but is, for example, 95% by mass or less, and from the viewpoint of obtaining a cured product in which the occurrence of warping is suppressed and which has excellent dielectric properties, it is preferably 85% by mass or less, more preferably 83% by mass or less, and even more preferably 80% by mass or less. The mass ratio (mass%) of the content (parts by mass) of the (C) component to the content (parts by mass) of the (B) component is more than 0% by mass, and is preferably determined so that the total content of the (C) component and the (B) component satisfies the above-mentioned range, but from the viewpoint of obtaining the effects of the present invention significantly, it may be 5% by mass or more, 10% by mass or more, or 15% by mass or more, 300% by mass or less, 250% by mass or less, or 200% by mass or less.

[0061] From the viewpoint of obtaining the effects of the present invention remarkably, the content of the (C) component is preferably 10% by mass or more, more preferably 12% by mass or more, and even more preferably 15% by mass or more, and is preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 80% by mass or less, when the resin component in the resin composition is taken as 100% by mass. The resin component refers to the non-volatile components in the resin composition excluding the (B) component.

[0062] <(D) Hardener> The resin composition may contain a (D) curing agent. As the (D) component, one having a function of curing the (A) component can be used. However, the (D) component does not include those corresponding to the (A), (B) and (C) components. The (D) component can be contained in the resin composition whether the (C) component contains the (C-1) component or not, but when the (C) component does not contain the (C-1) component, it is preferable that the resin composition contains the (D) component. By containing the (D) curing agent together with the (A) epoxy resin, a cured product having excellent heat resistance can be obtained. From the viewpoint of obtaining a cured product having excellent plating adhesion, it is preferable that the resin composition contains the (D) curing agent.

[0063] (D) The curing agent may be one or more selected from active ester curing agents, phenolic curing agents, naphthol curing agents, carbodiimide curing agents, benzoxazine curing agents, acid anhydride curing agents, amine curing agents, and cyanate ester curing agents. From the viewpoint of obtaining a cured product with excellent plating adhesion, it is preferable to use an active ester curing agent. The curing agent may be used alone or in combination of two or more.

[0064] The active ester curing agent is not particularly limited, but generally, compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferably used. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, etc. Here, the term "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0065] Specifically, active ester compounds containing a dicyclopentadiene-type diphenol structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated product of phenol novolac, and active ester compounds containing a benzoylated product of phenol novolac are preferred, and among these, active ester compounds containing a naphthalene structure and active ester compounds containing a dicyclopentadiene-type diphenol structure are more preferred. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0066] Commercially available active ester curing agents include active ester compounds containing a dicyclopentadiene-type diphenol structure, such as "EXB-9451", "EXB-9460", "EXB-9460S", "HPC-8000-65T", "HPC-8000H-65TM", and "HPC-8000L-65TM" (manufactured by DIC Corporation); active ester compounds containing a naphthalene structure, such as "EXB-9416-70BK", "EXB-8100L-65T", "EXB-8150-65T", "EXB-8150L-65T", "HPC-8150-60T", "HPC-8150-62T", and "HP-B-8151-62T" (manufactured by DIC Corporation); and phenol novolac. Examples of the active ester compound containing an acetylated product of phenol novolac include "DC808" (manufactured by Mitsubishi Chemical Corporation), an active ester compound containing a benzoylated product of phenol novolac includes "YLH1026" (manufactured by Mitsubishi Chemical Corporation), an active ester curing agent which is an acetylated product of phenol novolac includes "DC808" (manufactured by Mitsubishi Chemical Corporation), an active ester curing agent which is a benzoylated product of phenol novolac includes "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation), and an active ester compound containing a styryl group includes "PC1300-02-65MA" (manufactured by Air Water Corporation).

[0067] As the phenol-based curing agent (excluding active ester compounds) and naphthol-based curing agent (excluding active ester compounds), from the viewpoint of heat resistance and water resistance, a phenol-based curing agent having a novolac structure or a cresol novolac structure, or a naphthol-based curing agent having a novolac structure is preferred. Also, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferred, and a triazine skeleton-containing phenol-based curing agent is more preferred.

[0068] Specific examples of phenol-based curing agents and naphthol-based curing agents include, for example, "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd., "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375", and "SN395" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", "EXB-9500", and "KA-1160" manufactured by DIC Corporation.

[0069] Specific examples of carbodiimide-based curing agents include "V-03", "V-05", "V-07", "V-09", and "Elastostab H01" manufactured by Nisshinbo Chemical Inc.

[0070] Specific examples of benzoxazine-based curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation, "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd. The benzoxazine-based curing agent is a compound having a benzoxazine structure. The benzoxazine structure refers to a substituted or unsubstituted benzoxazine ring (e.g., 1,2-benzoxazine ring, 1,3-benzoxazine ring), or a benzoxazine ring in which a part of the double bond is hydrogenated (e.g., 3,4-dihydro-2H-1,3-benzoxazine ring).

[0071] Examples of the acid anhydride curing agent include a curing agent having one or more acid anhydride groups in one molecule, and a curing agent having two or more acid anhydride groups in one molecule is preferable. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride (e.g., 3,4,3',4'-biphenyl tetracarboxylic dianhydride ("BPDA"), naphthalene tetracarboxylic dianhydride, oxydiphthalic dianhydride , 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resins in which styrene and maleic acid are copolymerized. Commercially available acid anhydride-based hardeners include the Rikacid series "BT-100", "HNA-100", "MH-700", "MTA-15", "DDSA", and "OSA" manufactured by New Japan Chemical Co., Ltd., "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Co., Ltd., and "HN-2200" and "HN-5500" manufactured by Hitachi Chemical Co., Ltd.

[0072] The amine-based curing agent may be a curing agent having one or more, preferably two or more, amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc., and among them, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenylether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propanediamine, and the like. bis(4-aminophenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. The amine-based curing agent may be a commercially available product, for example, "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD AA", "KAYAHARD AB", "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

[0073] Examples of the cyanate ester curing agent include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate phenyl-1-(methylethylidene))benzene, bis(4-cyanate phenyl)thioether, and bis(4-cyanate phenyl)ether; polyfunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), "BA230", and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been converted to triazine to form a trimer), all of which are manufactured by Lonza Japan.

[0074] The ratio of the amount of the (A) epoxy resin to the (D) curing agent is preferably 1:0.01 to 1:20, more preferably 1:0.05 to 1:3, and even more preferably 1:0.1 to 1:1.5, in terms of the ratio of [total number of epoxy groups in the epoxy resin] to [total number of reactive groups in the curing agent]. Here, the reactive groups in the (D) curing agent are active ester groups, active hydroxyl groups, etc., and vary depending on the type of the (D) curing agent. The total number of reactive groups in the (D) curing agent is the total value of the non-volatile mass of each of the (D) curing agents divided by the reactive group equivalent for all the curing agents. By setting the ratio of the amount of the (A) epoxy resin to the (D) curing agent in this range, the desired effect of the present invention can be enhanced.

[0075] When the component (C) contains the component (C-1), the ratio of the amount of the epoxy resin (A) to the curing agent (D) and the reactive cage-type PSQ (C-1) is preferably in the range of 1:0.01 to 1:20, more preferably 1:0.05 to 1:3, and even more preferably 1:0.1 to 1:1.5, in terms of the ratio of [total number of epoxy groups in the epoxy resin]:[total number of reactive groups in the curing agent and reactive functional groups in the reactive cage-type PSQ]. By setting the ratio of the amount of the epoxy resin (A) to the curing agent (D) and the reactive cage-type PSQ (C-1) within such range, the desired effect of the present invention can be enhanced.

[0076] The content of the (D) component is preferably determined so as to satisfy the above-mentioned range of the ratio of the epoxy resin (A) to the curing agent (D) or the above-mentioned range of the ratio of the epoxy resin (A) to the curing agent (D) and the reactive cage-type PSQ (C-1). The content of the (D) component is 0% by mass or more, and from the viewpoint of obtaining a cured product having excellent plating adhesion, the content of the (D) component may be 0.5% by mass or more, 1% by mass or more, 2% by mass or more, or 3% by mass or more, 50% by mass or less, 40% by mass or less, 30% by mass or less, 25% by mass or less, 20% by mass or less, or 15% by mass or less, when the non-volatile content in the resin composition is 100% by mass.

[0077] In the case where the resin composition further contains a (D) component, and the (C) component contains a (C-1) component, the mass ratio of the content of the (D) component to the total content of the (C-1) component and the (D) component may be 10 mass% or more, 15 mass% or more, or 20 mass% or more from the viewpoint of obtaining a cured product having excellent plating adhesion. Also, the mass ratio may be 90 mass% or less, 80 mass% or less, or 70 mass% or less from the viewpoint of obtaining a cured product in which warping is suppressed and which has excellent dielectric properties.

[0078] <(E) Radical Polymerizable Compound> The resin composition may contain a radical polymerizable compound as component (E). However, the component (E) excludes those corresponding to components (A) to (D). The component (E) may be used alone or in combination of two or more. When the resin composition contains component (E), it is preferable that the resin composition contains component (F) described below.

[0079] The component (E) has a radical polymerizable unsaturated group in the molecule. The component (E) is not particularly limited as long as it has a radical polymerizable unsaturated group in the molecule, but from the viewpoint of providing a cured product with a low dielectric tangent in combination with the components (A) and (B), the component (E) preferably contains a compound having at least one radical polymerizable unsaturated group selected from vinyl group, allyl group, styryl group, vinylphenyl group, acryloyl group, methacryloyl group, maleimide group, fumaroyl group, and maleoyl group, and more preferably contains a compound containing at least one selected from allyl group, styryl group, vinylphenyl group, acryloyl group, and methacryloyl group. An example of a resin containing a radical polymerizable unsaturated group is "SA9000-111" manufactured by SABIC.

[0080] The component (E) is preferably at least one selected from a maleimide resin, a styryl resin, a (meth)acrylic resin, an allyl resin, and a butadiene resin, more preferably at least one selected from a maleimide resin, a (meth)acrylic resin, and a styryl resin, and more preferably either a maleimide resin or a styryl resin.

[0081] The component (E) more preferably contains a compound having two or more radically polymerizable unsaturated groups in the molecule. There is no particular upper limit, but it may be 10 or less.

[0082] The maleimide resin contains a maleimide group represented by the following formula (E-1) in the molecule. [ka] (E-1)

[0083] From the viewpoint of significantly obtaining the intended effects of the present invention, the number of maleimide groups per molecule of the maleimide resin is preferably 2 or more, more preferably 3 or more, and is preferably 10 or less, more preferably 6 or less, and even more preferably 3 or less.

[0084] From the viewpoint of significantly achieving the intended effects of the present invention, the maleimide resin preferably has either an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and more preferably has an aliphatic hydrocarbon group and an aromatic hydrocarbon group.

[0085] The aliphatic hydrocarbon group is preferably a divalent aliphatic hydrocarbon group, more preferably a divalent saturated aliphatic hydrocarbon group, and further preferably an alkylene group. The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, further preferably an alkylene group having 1 to 3 carbon atoms, and particularly preferably a methylene group.

[0086] As the aromatic hydrocarbon group, monovalent and divalent aromatic hydrocarbon groups are preferred, and aryl and arylene groups are more preferred. As the arylene group, an arylene group having 6 to 30 carbon atoms is preferred, an arylene group having 6 to 20 carbon atoms is more preferred, and an arylene group having 6 to 10 carbon atoms is even more preferred. Examples of such an arylene group include a phenylene group, a naphthylene group, an anthracenylene group, an aralkyl group, a biphenylene group, and a biphenylaralkyl group, and among these, a phenylene group, an aralkyl group, a biphenylene group, and a biphenylaralkyl group are preferred, and a phenylene group, an aralkyl group, and a biphenylene group are even more preferred. As the aryl group, an aryl group having 6 to 30 carbon atoms is preferred, an aryl group having 6 to 20 carbon atoms is more preferred, an aryl group having 6 to 10 carbon atoms is even more preferred, and a phenyl group is particularly preferred.

[0087] In the maleimide resin, from the viewpoint of significantly achieving the intended effect of the present invention, the nitrogen atom of the maleimide group is preferably directly bonded to a monovalent or divalent aromatic hydrocarbon group, where "directly" means that there is no other group between the nitrogen atom of the maleimide group and the aromatic hydrocarbon group.

[0088] The maleimide resin preferably contains, for example, a compound represented by the following formula (E-2).

[0089] [ka] (E-2) In formula (E-2), R 31 and R 36 represents a maleimide group, and R 32 , R 33 , R 34 and R 35 each independently represents a hydrogen atom, an alkyl group, or an aryl group, and each D independently represents a divalent aromatic group. m1 and m2 each independently represent an integer of 1 to 10, and a represents an integer of 1 to 100.

[0090] R in formula (E-2) 32 , R 33 , R 34 and R 35 each independently represents a hydrogen atom, an alkyl group, or an aryl group, and is preferably a hydrogen atom.

[0091] The alkyl group is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and even more preferably an alkyl group having 1 to 3 carbon atoms. The alkyl group may be linear, branched, or cyclic. Examples of such alkyl groups include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, and an isopropyl group.

[0092] The aryl group is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and even more preferably an aryl group having 6 to 10 carbon atoms. The aryl group may be a single ring or a condensed ring. Examples of such aryl groups include a phenyl group, a naphthyl group, and an anthracenyl group.

[0093] The alkyl group and the aryl group may have a substituent. The substituent is not particularly limited and may be the same as described above, but for example, a halogen atom, -OH, -OC 1-6 Alkyl group, -N(C 1-10 Alkyl group) 2, C1-10 an alkyl group, C 6-10 an aryl group, -NH2, -CN, -C(O)O-C 1-10 an alkyl group, -COOH, -C(O)H, -NO2, etc. are exemplified. Here, the term "C p-q "(p and q are positive integers, and p < q is satisfied.) represents that the number of carbon atoms of the organic group described immediately after this term is p to q. For example, the expression "C 1-10 an alkyl group" indicates an alkyl group having 1 to 10 carbon atoms. These substituents may be bonded to each other to form a ring, and the ring structure includes a spiro ring and a fused ring.

[0094] D in formula (E-2) represents a divalent aromatic group. Examples of the divalent aromatic group include a phenylene group, a naphthylene group, an anthracenylene group, an aralkyl group, a biphenylene group, a biphenylaralkyl group, etc. Among them, a biphenylene group and a biphenylaralkyl group are preferable, and a biphenylene group is more preferable. The divalent aromatic group may have a substituent. The substituents are the same as those that the alkyl group represented by R 32 in formula (E-2) may have.

[0095] m1 and m2 each independently represent an integer of 1 to 10, preferably 1 to 6, more preferably 1 to 3, still more preferably 1 to 2, and 1 is even more preferable.

[0096] a represents an integer of 1 to 100, preferably 1 to 50, more preferably 1 to 20, still more preferably 1 to 5.

[0097] The maleimide resin preferably contains a compound represented by formula (E-3).

Chemical formula

[0098] a1 is the same as a in formula (E-2), and the preferred range is also the same.

[0099] The maleimide resin may be a commercially available product, such as "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.

[0100] The maleimide resin preferably contains a compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.

[0101] The number of carbon atoms of the alkyl group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. The alkyl group may be linear, branched, or cyclic, and linear is preferred. Examples of such alkyl groups include pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. The alkyl group having 5 or more carbon atoms may be a substituent of an alkylene group having 5 or more carbon atoms.

[0102] The number of carbon atoms of the alkylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. The alkylene group may be linear, branched, or cyclic, and linear is preferred. Here, the cyclic alkylene group is a concept that includes the case where it is composed of only a cyclic alkylene group and the case where it contains both a linear alkylene group and a cyclic alkylene group. Examples of such alkylene groups include pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecylene, hexatriacontylene, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0103] From the viewpoint of significantly obtaining the intended effects of the present invention, it is also preferable that the maleimide resin contains a compound containing both an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.

[0104] The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms may be bonded to each other to form a ring, and the ring structure also includes a spiro ring and a condensed ring. Examples of the ring formed by bonding to each other include a cyclohexane ring.

[0105] The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms preferably have no substituent, but may have a substituent. As the substituent, as described above, suitable examples include an unsaturated hydrocarbon group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, etc. The substituent may be contained alone or in combination of two or more kinds.

[0106] The maleimide resin preferably contains a compound in which the above-mentioned alkyl group having 5 or more carbon atoms and alkylene group having 5 or more carbon atoms are directly bonded to the nitrogen atom of the maleimide group.

[0107] In one embodiment, the maleimide resin includes a compound represented by the following general formula (E-4): [ka] (E-4) In formula (E-4), M represents an alkylene group having 5 or more carbon atoms which may have a substituent, and L represents a single bond or a divalent linking group.

[0108] M represents an alkylene group having 5 or more carbon atoms which may have a substituent. The alkylene group of M is the same as the alkylene group having 5 or more carbon atoms described above. The substituent of M is the same as the substituent that may be possessed by the alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms described above, and the substituent is preferably an alkyl group having 5 or more carbon atoms.

[0109] L represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -C(=O)-, -C(=O)-O-, -NR 0 -(R 0 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, an oxygen atom, a sulfur atom, or C(=O)NR 0 -, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, and a group consisting of a combination of two or more of these divalent groups. The alkylene group, alkenylene group, alkynylene group, arylene group, divalent group derived from phthalimide, divalent group derived from pyromellitic diimide, and a group consisting of a combination of two or more of these divalent groups may have an alkyl group having 5 or more carbon atoms as a substituent. The divalent group derived from phthalimide represents a divalent group derived from phthalimide, specifically a group represented by general formula (E-5). The divalent group derived from pyromellitic diimide represents a divalent group derived from pyromellitic diimide, specifically a group represented by general formula (E-6). In the formula, "*" represents a bond.

[0110] [ka] (E-5)

[0111] [ka] (E-6)

[0112] The alkylene group as the divalent linking group in L is preferably an alkylene group having 1 to 50 carbon atoms, more preferably an alkylene group having 1 to 45 carbon atoms, and particularly preferably an alkylene group having 1 to 40 carbon atoms. This alkylene group may be linear, branched, or cyclic. Examples of such alkylene groups include a methylethylene group, a cyclohexylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, an undecylene group, a dodecylene group, a tridecylene group, a heptadecylene group, a hexatriacontylene group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0113] The alkenylene group as the divalent linking group in L is preferably an alkenylene group having 2 to 20 carbon atoms, more preferably an alkenylene group having 2 to 15 carbon atoms, and particularly preferably an alkenylene group having 2 to 10 carbon atoms. This alkenylene group may be linear, branched, or cyclic. Examples of such alkenylene groups include a methylethylenylene group, a cyclohexenylene group, a pentenylene group, a hexenylene group, a heptenylene group, and an octenylene group.

[0114] The alkynylene group as the divalent linking group in L is preferably an alkynylene group having 2 to 20 carbon atoms, more preferably an alkynylene group having 2 to 15 carbon atoms, and particularly preferably an alkynylene group having 2 to 10 carbon atoms. This alkynylene group may be linear, branched, or cyclic. Examples of such alkynylene groups include a methylethynylene group, a cyclohexynylene group, a pentynylene group, a hexynylene group, a heptynylene group, and an octynylene group.

[0115] The arylene group as the divalent linking group in L is preferably an arylene group having 6 to 24 carbon atoms, more preferably an arylene group having 6 to 18 carbon atoms, still more preferably an arylene group having 6 to 14 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. Examples of the arylene group include a phenylene group, a naphthylene group, and an anthracenylene group.

[0116] The alkylene group, alkenylene group, alkynylene group, and arylene group, which are the divalent linking groups in L, may have a substituent. The substituent is the same as the substituent that may be possessed by the above-mentioned alkyl group having 5 or more carbon atoms and alkylene group having 5 or more carbon atoms, and is preferably an alkyl group having 5 or more carbon atoms.

[0117] Examples of the group consisting of a combination of two or more divalent groups in L include a divalent group consisting of a combination of an alkylene group, a divalent group derived from phthalimide, and an oxygen atom; a divalent group consisting of a combination of a divalent group derived from phthalimide, an oxygen atom, an arylene group, and an alkylene group; a divalent group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; and the like. The group consisting of a combination of two or more divalent groups may form a ring such as a condensed ring by the combination of the respective groups. In addition, the group consisting of a combination of two or more divalent groups may be a repeating unit having a repeating unit number of 1 to 10.

[0118] Among them, L in the general formula (E-4) is preferably an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, an alkylene group having 1 to 50 carbon atoms which may have a substituent, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a divalent group consisting of a combination of two or more of these groups. Among them, L is more preferably an alkylene group; a divalent group having a structure of an alkylene group-a divalent group derived from phthalimide-oxygen atom-a divalent group derived from phthalimide; a divalent group having a structure of an alkylene group-a divalent group derived from phthalimide-oxygen atom-arylene group-alkylene group-arylene group-oxygen atom-a divalent group derived from phthalimide; or a divalent group having a structure of an alkylene-a divalent group derived from pyromellitic diimide.

[0119] The compound represented by general formula (E-4) preferably includes a compound represented by general formula (E-7). [ka] (E-7) In general formula (E-7), M 1 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, each Z independently represents an alkylene group having 5 or more carbon atoms which may have a substituent or a divalent group having an aromatic ring which may have a substituent, and t represents an integer of 1 to 10.

[0120] M 1 Each of M independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. 1 is the same as M in general formula (E-4).

[0121] Each Z independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, or a divalent group having an aromatic ring which may have a substituent. The alkylene group in Z may be any of linear, branched, and cyclic, and among them, a cyclic alkylene group having 5 or more carbon atoms which may have a substituent is preferred. The number of carbon atoms of the alkylene group is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. Examples of such alkylene groups include a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0122] The aromatic ring in the divalent group having an aromatic ring represented by Z may be as described above, but examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, a phthalimide ring, a pyromellitic diimide ring, and an aromatic heterocycle, and the like. A benzene ring, a phthalimide ring, and a pyromellitic diimide ring are preferred. That is, examples of the divalent group having an aromatic ring include a divalent group having a benzene ring which may have a substituent, a divalent group having a phthalimide ring which may have a substituent, and a divalent group having a pyromellitic diimide ring which may have a substituent. Examples of the divalent group having an aromatic ring include a group consisting of a combination of a divalent group derived from phthalimide and an oxygen atom; a group consisting of a combination of a divalent group derived from phthalimide, an oxygen atom, an arylene group, and an alkylene group; a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; a divalent group derived from pyromellitic diimide; a group consisting of a combination of a divalent group derived from phthalimide and an alkylene group; and the like. The arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (E-4).

[0123] The alkylene group and the divalent group having an aromatic ring represented by Z may have a substituent. The substituent is the same as the substituent that may be possessed by the above-mentioned alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms.

[0124] Specific examples of the group represented by Z include the following groups: In the formula, "*" represents a bond.

[0125] [ka]

[0126] [ka]

[0127] The compound represented by general formula (E-4) is preferably any one of a compound represented by general formula (E-8) and a compound represented by general formula (E-9).

[0128] [ka] (E-8) In general formula (E-8), M 2 and M 3 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent; R 40 each independently represents an oxygen atom, an arylene group, an alkylene group, or a divalent group consisting of a combination of two or more of these groups. t1 represents an integer of 1 to 10.

[0129] [ka] (E-9) In general formula (E-9), M 4 , M 6 and M 7 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent; M 5each independently represents a divalent group having an aromatic ring which may have a substituent; R 41 and R 42 each independently represents an alkyl group having 5 or more carbon atoms. t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.

[0130] M 2 and M 3 Each of M independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. 2 and M 3 is the same as the alkylene group having 5 or more carbon atoms represented by M in general formula (E-4), and a hexatriacontylene group is preferred.

[0131] R 40 R each independently represents an oxygen atom, an arylene group, an alkylene group, or a group consisting of a combination of two or more of these divalent groups. The arylene group and the alkylene group are the same as the arylene group and the alkylene group in the divalent linking group represented by L in the general formula (E-4). 40 is preferably an oxygen atom or a group formed from a combination of two or more divalent groups.

[0132] R 40 In the formula, examples of the group consisting of a combination of two or more divalent groups include a combination of an oxygen atom, an arylene group, and an alkylene group. Specific examples of the group consisting of a combination of two or more divalent groups include the following groups. In the formula, "*" represents a bond. [ka]

[0133] M 4 , M 6 and M 7 Each of M independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. 4 , M 6 and M 7is the same as the alkylene group having 5 or more carbon atoms which may have a substituent represented by M in general formula (E-4), and is preferably a hexylene group, a heptylene group, an octylene group, a nonylene group, or a decylene group, and more preferably an octylene group.

[0134] M 5 Each of M independently represents a divalent group having an aromatic ring which may have a substituent. 5 is the same as the divalent group having an aromatic ring which may have a substituent represented by Z in general formula (E-7), and is preferably a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; a group consisting of a combination of a divalent group derived from phthalimide and an alkylene group, and more preferably a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide. The arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (E-4).

[0135] M 5 Specific examples of the group represented by the formula include the following groups: In the formula, "*" represents a bond. [ka]

[0136] R 41 and R 42 R each independently represents an alkyl group having 5 or more carbon atoms. 41 and R 42 is the same as the above-mentioned alkyl group having 5 or more carbon atoms, and is preferably a hexyl group, a heptyl group, an octyl group, a nonyl group, or a decyl group, and more preferably a hexyl group or an octyl group.

[0137] Each of u1 and u2 independently represents an integer of 1 to 15, and an integer of 1 to 10 is preferable.

[0138] Specific examples of the maleimide resin include the following compounds (E1) to (E3). However, the maleimide resin is not limited to these specific examples. In the formula, n represents an integer of 1 to 10.

[0139] [ka] (E1)

[0140] [ka] (E2)

[0141] [ka] (E3)

[0142] Specific examples of maleimide resins include "BMI1500" (compound of formula (E1)), "BMI1700" (compound of formula (E2)), and "BMI689" (compound of formula (E3)), all manufactured by Designer Molecules.

[0143] From the viewpoint of significantly obtaining the intended effects of the present invention, the maleimide group equivalent of the maleimide resin is preferably 50 g / eq. to 2000 g / eq., more preferably 100 g / eq. to 1000 g / eq., and further preferably 150 g / eq. to 500 g / eq. The maleimide group equivalent is the mass of a compound containing one equivalent of a maleimide group.

[0144] The styryl resin has one or more groups selected from a styryl group and a vinylphenyl group in the molecule, and preferably has a vinylphenyl group. The vinylphenyl group is a group having the structure shown below. [ka] (* represents a bond.)

[0145] From the viewpoint of obtaining a cured product with a low dielectric tangent, the styryl resin more preferably has two or more vinylphenyl groups.

[0146] The styryl resin preferably has a cyclic structure from the viewpoint of obtaining a cured product with a low dielectric tangent. The cyclic structure is preferably a divalent cyclic group. The divalent cyclic group may be any of a cyclic group containing a non-aromatic ring, such as an alicyclic structure, and a cyclic group containing an aromatic ring structure. In addition, the styryl resin may have a plurality of divalent cyclic groups.

[0147] From the viewpoint of significantly obtaining the intended effect of the present invention, the divalent cyclic group is preferably a 3-membered or more ring, more preferably a 4-membered or more ring, and even more preferably a 5-membered or more ring, and is preferably a 20-membered or less ring, more preferably a 15-membered or less ring, and even more preferably a 10-membered or less ring. In addition, the divalent cyclic group may be a monocyclic structure or a polycyclic structure.

[0148] The ring in the divalent cyclic group may have a ring skeleton constituted by a heteroatom other than carbon atoms. Examples of the heteroatom include an oxygen atom, a sulfur atom, and a nitrogen atom, and an oxygen atom is preferred. The ring may have one or more heteroatoms.

[0149] Specific examples of the divalent cyclic group include the following divalent groups (xii) and (xiii). [ka] (In the divalent groups (xii) and (xiii), R 51 , R 52 , R 55 , R 56 , R 57 , R 61 , and R 62 each independently represents a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group; R 53 , R 54 , R 58 , R 59 , and R 60each independently represents a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group.

[0150] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine atoms. Examples of alkyl groups having 6 or less carbon atoms include methyl, ethyl, propyl, butyl, pentyl, and hexyl groups, with methyl being preferred. 51 , R 52 , R 55 , R 56 , R 57 , R 61 , and R 62 R preferably represents a methyl group. 53 , R 54 , R 58 , R 59 , and R 60 is preferably a hydrogen atom or a methyl group.

[0151] In addition, the divalent cyclic group may be a combination of a plurality of divalent cyclic groups. Specific examples of the combination of divalent cyclic groups include the divalent cyclic group represented by the following formula (E4) (divalent group (a)). [ka] (E4) (In formula (E4), R 71 , R 72 , R 75 , R 76 , R 77 , R 81 , R 82 , R 85 and R 86 each independently represents a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group; R 73 , R 74 , R 78 , R 79 , R 80 , R 83 and R 84each independently represents a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group. d1 and d2 each represent an integer of 0 to 300, except for the case where one of d1 and d2 is 0.

[0152] R 71 , R 72 , R 85 and R 86 R in formula (xii) 51 is the same as R 73 , R 74 , R 83 and R 84 R in formula (xii) 53 is the same as R 75 , R 76 , R 77 , R 81 , and R 82 R in formula (xiii) 55 is the same as R 78 , R 79 , and R 80 R in formula (xiii) 58 is the same as:

[0153] d1 and d2 represent an integer of 0 to 300, except when one of d1 and d2 is 0. d1 and d2 preferably represent an integer of 1 to 100, more preferably an integer of 1 to 50, and even more preferably an integer of 1 to 10. d1 and d2 may be the same or different.

[0154] The divalent cyclic group may have a substituent, such as a halogen atom, an alkyl group, an alkoxy group, an aryl group, an arylalkyl group, a silyl group, an acyl group, an acyloxy group, a carboxy group, a sulfo group, a cyano group, a nitro group, a hydroxy group, a mercapto group, or an oxo group, and an alkyl group is preferred.

[0155] The vinylphenyl group may be directly bonded to the divalent cyclic group, or may be bonded via a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an arylene group, a heteroarylene group, -C(=O)O-, -O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, -S-, -SO-, -NH-, and the like, and may be a group in which a plurality of these are combined. The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and even more preferably an alkylene group having 1 to 5 carbon atoms or an alkylene group having 1 to 4 carbon atoms. The alkylene group may be linear, branched, or cyclic. Examples of such alkylene groups include methylene, ethylene, propylene, butylene, pentylene, hexylene, and 1,1-dimethylethylene groups, and are preferably methylene, ethylene, or 1,1-dimethylethylene. As the alkenylene group, an alkenylene group having 2 to 10 carbon atoms is preferred, an alkenylene group having 2 to 6 carbon atoms is more preferred, and an alkenylene group having 2 to 5 carbon atoms is even more preferred. As the arylene group or heteroarylene group, an arylene group or heteroarylene group having 6 to 20 carbon atoms is preferred, and an arylene group or heteroarylene group having 6 to 10 carbon atoms is more preferred. As the divalent linking group, an alkylene group is preferred, and among them, a methylene group is preferred.

[0156] The styryl resin preferably contains a compound represented by the following formula (E-10). [ka] (E-10) (In formula (E-10), R 91 and R 92 each independently represents a divalent linking group. Ring B1 represents a divalent cyclic group.

[0157] R 91 and R 92 each independently represents a divalent linking group. The divalent linking group is the same as the divalent linking group described above.

[0158] Ring B1 represents a divalent cyclic group. Ring B is the same as the above divalent cyclic group.

[0159] Ring B1 may have a substituent. The substituent is the same as the substituent that the above divalent cyclic group may have.

[0160] Specific examples of the styryl resin are shown below, but the present invention is not limited thereto. [ka] (q1 is the same as d1 in formula (E4), and q2 is the same as d2 in formula (E4).)

[0161] The styryl resin may be a commercially available product, such as "OPE-2St", "OPE-2St 1200", or "OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Co., Inc. One type of styryl resin may be used alone, or two or more types may be used in combination.

[0162] From the viewpoint of significantly obtaining the intended effects of the present invention, the number average molecular weight of the styryl resin is preferably 3000 or less, more preferably 2500 or less, even more preferably 2000 or less, or 1500 or less. The lower limit is preferably 100 or more, more preferably 300 or more, even more preferably 500 or more, or 1000 or more. The number average molecular weight is the number average molecular weight in terms of polystyrene measured using gel permeation chromatography (GPC).

[0163] The (meth)acrylic resin includes a compound having an acryloyl group or a methacryloyl group in the molecule. From the viewpoint of significantly obtaining the intended effect of the present invention, the (meth)acrylic resin preferably includes a compound having two or more (meth)acryloyl groups per molecule. The term "(meth)acryloyl group" is a general term for an acryloyl group and a methacryloyl group.

[0164] The (meth)acrylic resin preferably has a cyclic structure from the viewpoint of significantly achieving the desired effects of the present invention. The cyclic structure is preferably a divalent cyclic group. The divalent cyclic group may be any of a cyclic group containing a non-aromatic ring, for example, an alicyclic structure, and a cyclic group containing an aromatic ring structure. Among them, from the viewpoint of significantly achieving the desired effects of the present invention, a cyclic group containing an alicyclic structure is preferable.

[0165] From the viewpoint of significantly obtaining the intended effect of the present invention, the divalent cyclic group is preferably a 3-membered or more ring, more preferably a 4-membered or more ring, and even more preferably a 5-membered or more ring, and is preferably a 20-membered or less ring, more preferably a 15-membered or less ring, and even more preferably a 10-membered or less ring. In addition, the divalent cyclic group may be a monocyclic structure or a polycyclic structure.

[0166] The ring in the divalent cyclic group may have a ring skeleton constituted by a heteroatom other than carbon atoms. Examples of the heteroatom include an oxygen atom, a sulfur atom, and a nitrogen atom, and an oxygen atom is preferred. The ring may have one or more heteroatoms.

[0167] Specific examples of the divalent cyclic group include the following divalent groups (i) to (xi). Among them, the divalent cyclic group is preferably (x) or (xi). [ka]

[0168] The divalent cyclic group may have a substituent, such as a halogen atom, an alkyl group, an alkoxy group, an aryl group, an arylalkyl group, a silyl group, an acyl group, an acyloxy group, a carboxy group, a sulfo group, a cyano group, a nitro group, a hydroxy group, a mercapto group, or an oxo group, and an alkyl group is preferred.

[0169] The (meth)acryloyl group may be directly bonded to the divalent cyclic group, or may be bonded via a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an arylene group, a heteroarylene group, -C(=O)O-, -O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, -S-, -SO-, -NH-, and the like, and may be a group in which a plurality of these are combined. The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and even more preferably an alkylene group having 1 to 5 carbon atoms or an alkylene group having 1 to 4 carbon atoms. The alkylene group may be linear, branched, or cyclic. Examples of such alkylene groups include methylene, ethylene, propylene, butylene, pentylene, hexylene, and 1,1-dimethylethylene groups, and are preferably methylene, ethylene, or 1,1-dimethylethylene. As the alkenylene group, an alkenylene group having 2 to 10 carbon atoms is preferred, an alkenylene group having 2 to 6 carbon atoms is more preferred, and an alkenylene group having 2 to 5 carbon atoms is even more preferred. As the arylene group or heteroarylene group, an arylene group or heteroarylene group having 6 to 20 carbon atoms is preferred, and an arylene group or heteroarylene group having 6 to 10 carbon atoms is more preferred. As the divalent linking group, an alkylene group is preferred, and among them, a methylene group or a 1,1-dimethylethylene group is preferred.

[0170] The (meth)acrylic resin preferably contains a compound represented by the following formula (E-11). [ka] (E-11) (In formula (E-11), R 101 and R 104 each independently represents an acryloyl group or a methacryloyl group, R 102 and R 103 each independently represents a divalent linking group. Ring B2 represents a divalent cyclic group.

[0171] R101 and R 104 each independently represents an acryloyl group or a methacryloyl group, and an acryloyl group is preferred.

[0172] R 102 and R 103 each independently represents a divalent linking group. The divalent linking group is the same as the divalent linking group which may have a (meth)acryloyl group bonded thereto.

[0173] Ring B2 represents a divalent cyclic group. Ring B2 is the same as the divalent cyclic group. Ring B2 may have a substituent. The substituent is the same as the substituent that the divalent cyclic group may have.

[0174] Specific examples of the (meth)acrylic resin include the following, but the present invention is not limited thereto. [ka]

[0175] As the (meth)acrylic resin, commercially available products may be used, and examples thereof include "A-DOG" manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" manufactured by Kyoeisha Chemical Co., Ltd., "NPDGA", "FM-400", "R-687", "THE-330", "PET-30", and "DPHA" manufactured by Nippon Kayaku Co., Ltd., and "NK Ester DCP" manufactured by Shin-Nakamura Chemical Co., Ltd.

[0176] From the viewpoint of significantly obtaining the intended effects of the present invention, the (meth)acryloyl group equivalent of the (meth)acrylic resin is preferably 30 g / eq. to 400 g / eq., more preferably 50 g / eq. to 300 g / eq., and further preferably 75 g / eq. to 200 g / eq. The (meth)acryloyl group equivalent is the mass of a compound containing one equivalent of a (meth)acryloyl group.

[0177] The allyl resin has at least one allyl group in the molecule. The allyl resin more preferably has two or more allyl groups in one molecule. The upper limit is not particularly limited, but is preferably 10 or less, more preferably 5 or less.

[0178] In order to remarkably obtain the intended effects of the present invention, the allyl resin preferably has, in addition to the allyl group, any one of a benzoxazine ring, a phenol ring, an isocyanuric ring, and a carboxylic acid derivative having a cyclic structure.

[0179] The allyl resin having a benzoxazine ring is preferably bonded to either the nitrogen atom of the benzoxazine ring or the benzene ring, and more preferably bonded to the nitrogen atom.

[0180] Examples of allyl resins having a phenol ring include cresol resins containing an allyl group, novolac-type phenol resins containing an allyl group, and cresol novolac resins containing an allyl group.

[0181] In the allyl resin having an isocyanuric structure, a nitrogen atom of the isocyanuric structure and an allyl group are preferably directly bonded to each other. Examples of the allyl resin having an isocyanuric structure include allyl isocyanurate, diallyl isocyanurate, and triallyl isocyanurate.

[0182] As the allyl resin having a carboxylic acid derivative having a cyclic structure, an allyl carboxylate having a cyclic structure is preferred. The cyclic structure may be any of a non-aromatic ring, for example, a cyclic group containing an alicyclic structure and a cyclic group containing an aromatic ring structure. In addition, the cyclic group may have a ring skeleton formed by heteroatoms other than carbon atoms. Examples of heteroatoms include oxygen atoms, sulfur atoms, and nitrogen atoms, and nitrogen atoms are preferred. The ring may have one heteroatom or two or more heteroatoms.

[0183] Examples of carboxylic acids having a cyclic structure include isocyanuric acid, diphenic acid, phthalic acid, cyclohexanedicarboxylic acid, etc. Examples of allyl resins having a carboxylic acid derivative having a cyclic structure include allyl isocyanurate, diallyl isocyanurate, triallyl isocyanurate, diallyl diphenate, allyl diphenate, ortho-diallyl phthalate, meth-diallyl phthalate, para-diallyl phthalate, allyl cyclohexanedicarboxylate, diallyl cyclohexanedicarboxylate, etc.

[0184] The allyl resin may be a commercially available product. Examples of commercially available products include "MEH-8000H" and "MEH-8005" (allyl resin having a phenol ring) manufactured by Meiwa Kasei Co., Ltd.; "ALP-d" (allyl resin having a benzoxazine ring) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "L-DAIC" (allyl resin having an isocyanuric ring) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "TAIC" (allyl resin having an isocyanuric ring (triallyl isocyanurate) manufactured by Nippon Kasei Co., Ltd.; "MDAC" (allyl resin having a cyclohexanedicarboxylic acid derivative) manufactured by Osaka Soda Co., Ltd.; "DAD" (diallyl diphenate) manufactured by Nissho Techno Fine Chemical Co., Ltd.; and "Daiso DAP Monomer" (ortho-diallyl phthalate) manufactured by Osaka Soda Co., Ltd.

[0185] From the viewpoint of significantly obtaining the intended effects of the present invention, the allyl group equivalent of the allyl resin is preferably 20 g / eq. to 1000 g / eq., more preferably 50 g / eq. to 500 g / eq., and further preferably 100 g / eq. to 300 g / eq. The allyl group equivalent is the mass of a compound containing one equivalent of an allyl group.

[0186] The butadiene resin has a butadiene skeleton. The polybutadiene structure may be included in the main chain or in the side chain. The polybutadiene structure may be partially or entirely hydrogenated. The butadiene resin is preferably one or more resins selected from the group consisting of hydrogenated polybutadiene skeleton-containing resin, hydroxyl group-containing butadiene resin, phenolic hydroxyl group-containing butadiene resin, carboxyl group-containing butadiene resin, acid anhydride group-containing butadiene resin, isocyanate group-containing butadiene resin, and urethane group-containing butadiene resin.

[0187] Specific examples of butadiene resins include "JP-100" manufactured by Nippon Soda Co., Ltd., and "Ricon100", "Ricon150", "Ricon130MA8", "Ricon130MA13", "Ricon130MA20", "Ricon131MA5", "Ricon131MA10", "Ricon131MA17", "Ricon131MA20", and "Ricon 184MA6" manufactured by CRAY VALLEY Corporation.

[0188] The content of the (E) component is 0 mass% or more, and from the viewpoint of enhancing the intended effects of the present invention, in particular from the viewpoint of obtaining a cured product with a low dielectric tangent, when the non-volatile components in the resin composition are taken as 100 mass%, the content is preferably 0.5 mass% or more, more preferably 1 mass% or more, even more preferably 1.5 mass% or more, and is preferably 60 mass% or less, more preferably 50 mass% or less, even more preferably 40 mass% or less.

[0189] From the viewpoint of enhancing the intended effects of the present invention, particularly from the viewpoint of obtaining a cured product with a low dielectric tangent, the content of the (E) component, relative to 100 mass% of the resin component in the resin composition, is preferably 1 mass% or more, more preferably 2 mass% or more, and even more preferably 3 mass% or more, and is preferably 80 mass% or less, more preferably 70 mass% or less, and even more preferably 60 mass% or less.

[0190] <(F) Polymerization initiator> In the present invention, the resin composition may further contain a polymerization initiator as component (F). However, the polymerization initiator (F) excludes those corresponding to components (A) to (E). The polymerization initiator (F) may be used alone or in combination of two or more kinds. A typical example of the polymerization initiator as component (F) is a peroxide-based polymerization initiator.

[0191] Examples of component (F) include peroxides such as t-butylcumyl peroxide, t-butyl peroxyacetate, α,α'-di(t-butylperoxy)diisopropylbenzene, t-butyl peroxylaurate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneodecanoate, and t-butyl peroxybenzoate.

[0192] Commercially available products of component (F) include, for example, NOF Corporation's “Perbutyl (registered trademark) C”, “Perbutyl (registered trademark) A”, “Perbutyl (registered trademark) P”, “Perbutyl (registered trademark) L”, “Perbutyl (registered trademark) O”, “Perbutyl (registered trademark) ND”, “Perbutyl (registered trademark) Z”, “Perhexyl (registered trademark) D”, “Percumyl (registered trademark) P”, and “Percumyl (registered trademark) D”.

[0193] When the resin composition contains the (F) component, the content of the (F) component, relative to 100 mass% of the non-volatile components in the resin composition, is preferably 0.01 mass% or more, more preferably 0.03 mass% or more, even more preferably 0.05 mass% or more, and is preferably 5 mass% or less, more preferably 3 mass% or less, even more preferably 2 mass% or less.

[0194] <(G)Thermoplastic resin> The resin composition of the present invention may contain a (G) thermoplastic resin as an optional component. However, the (G) thermoplastic resin excludes those corresponding to the components (A) to (F). The (G) thermoplastic resin may be used alone or in combination of two or more kinds.

[0195] Examples of the (G) thermoplastic resin include phenoxy resin, polyvinyl acetal resin, acrylic resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polyetherimide resin, polycarbonate resin, polyetheretherketone resin, and polyester resin. Of these, resins selected from phenoxy resin, acrylic resin, and polyphenylene ether resin are preferred.

[0196] Examples of the phenoxy resin include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group. The phenoxy resin may be used alone or in combination of two or more. Specific examples of phenoxy resins include "1256" and "4250" (both of which are phenoxy resins containing a bisphenol A skeleton), "YX8100" (phenoxy resin containing a bisphenol S skeleton), and "YX6954" (phenoxy resin containing a bisphenol acetophenone skeleton) manufactured by Mitsubishi Chemical Corporation, "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "YX7200B35", "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", and "YL7482" manufactured by Mitsubishi Chemical Corporation.

[0197] Examples of polyvinyl acetal resin include polyvinyl formal resin and polyvinyl butyral resin, and polyvinyl butyral resin is preferred.Specific examples of polyvinyl acetal resin include "Denka Butyral 4000-2", "Denka Butyral 5000-A", "Denka Butyral 6000-C", and "Denka Butyral 6000-EP" manufactured by Denki Kagaku Kogyo Co., Ltd., and S-LEC BH series, BX series (e.g. BX-5Z), KS series (e.g. KS-1), BL series, and BM series manufactured by Sekisui Chemical Co., Ltd.

[0198] The acrylic resin refers to a polymer obtained by polymerizing a monomer component including a (meth)acrylic acid ester monomer. The monomer components constituting the acrylic resin may contain, in addition to the (meth)acrylic acid ester monomer, a (meth)acrylamide monomer, a styrene monomer, a functional group-containing monomer, or the like as copolymerization components. Specific examples of acrylic resins include "ARUFON UP-1000", "ARUFON UP-1010", "ARUFON UP-1020", "ARUFON UP-1021", "ARUFON UP-1061", "ARUFON UP-1080", "ARUFON UP-1110", "ARUFON UP-1170", "ARUFON UP-1190", "ARUFON UP-1500", "ARUFON UH-2000", "ARUFON UH-2041", "ARUFON UH-2190", "ARUFON UHE-2012", "ARUFON UC-3510", "ARUFON US-6100", and "ARUFON US-6170" manufactured by Toa Gosei Co., Ltd. These may be used alone or in combination of two or more types.

[0199] Examples of polyolefin resins include ethylene-based copolymer resins such as low-density polyethylene, very low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin-based elastomers such as polypropylene and ethylene-propylene block copolymer.

[0200] Examples of polybutadiene resins include hydrogenated polybutadiene skeleton-containing resins, hydroxy group-containing polybutadiene resins, phenolic hydroxy group-containing polybutadiene resins, carboxy group-containing polybutadiene resins, acid anhydride group-containing polybutadiene resins, isocyanate group-containing polybutadiene resins, urethane group-containing polybutadiene resins, polyphenylene ether-polybutadiene resins, and the like.

[0201] Specific examples of polyimide resins include "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd. Specific examples of polyimide resins also include modified polyimides such as linear polyimides obtained by reacting bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride (polyimides described in JP-A-2006-37083), and polysiloxane skeleton-containing polyimides (polyimides described in JP-A-2002-12667 and JP-A-2000-319386, etc.).

[0202] Specific examples of polyamide-imide resins include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of polyamide-imide resins also include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical Co., Ltd.

[0203] A specific example of the polyethersulfone resin is "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0204] Specific examples of polysulfone resins include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0205] A specific example of the polyphenylene ether resin is Noryl (registered trademark) SA90 manufactured by SABIC, etc. A specific example of the polyetherimide resin is Ultem manufactured by GE, etc.

[0206] Examples of polycarbonate resins include hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, and urethane group-containing carbonate resins. Specific examples of polycarbonate resins include "FPC0220" manufactured by Mitsubishi Gas Chemical Co., Ltd., "T6002" and "T6001" (polycarbonate diol) manufactured by Asahi Kasei Chemicals Corporation, and "C-1090", "C-2090", and "C-3090" (polycarbonate diol) manufactured by Kuraray Co., Ltd. Specific examples of polyether ether ketone resins include "Sumiploy K" manufactured by Sumitomo Chemical Co., Ltd. Examples of polyester resins include polyethylene terephthalate resins.

[0207] The weight average molecular weight of the (G) thermoplastic resin is preferably 8,000 or more, more preferably 10,000 or more, and even more preferably 20,000 or more, and is preferably 100,000 or less, more preferably 70,000 or less, and even more preferably 60,000 or less. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0208] The content of the (G) thermoplastic resin is 0% by mass or more. From the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile components in the resin composition are taken as 100% by mass, the content is preferably 0.1% by mass or more, more preferably 1% by mass or more, even more preferably 2% by mass or more, and particularly preferably 3% by mass or more. As long as the effects of the present invention are not impaired, the upper limit is not limited, and the content can be, for example, 50% by mass or less, 40% by mass or less, 30% by mass or less, or 25% by mass or less.

[0209] <(H) Curing accelerator> The resin composition of the present invention may contain (H) a curing accelerator as an optional component. The (H) curing accelerator has a function of accelerating the curing reaction of the (A) epoxy resin. However, the (H) curing accelerator excludes those corresponding to the (A) components to (G) components. The (H) curing accelerator may be used alone or in combination of two or more types.

[0210] Examples of the (H) curing accelerator include phosphorus-based curing accelerators, imidazole-based curing accelerators, amine-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, etc. Among these, as the (H) curing accelerator, from the viewpoint of achieving a higher light reflectance, phosphorus-based curing accelerators and imidazole-based curing accelerators are preferred, and phosphorus-based curing accelerators are more preferred.

[0211] From the viewpoint of achieving a higher light reflectance, the phosphorus-based curing accelerator preferably contains one or more members selected from the group consisting of phosphonium salts and phosphines.

[0212] Examples of the phosphonium salt include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butylmethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, and the like. Examples of aromatic phosphonium salts include aromatic phosphonium salts such as phenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate.

[0213] Examples of phosphines include aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, and tris(2,5-dimethylphenyl)phosphine. tris(2,6-dimethylphenyl)phosphine, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2- Examples of aromatic phosphines include bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; and aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct.

[0214] As the phosphorus-based curing accelerator, commercially available products may be used, for example, "TBP-DA" manufactured by Hokko Chemical Industry Co., Ltd.

[0215] Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2, 4-Diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-furan Examples of the imidazole compounds include imidazole compounds such as 2-ethyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds and epoxy resins. Of these, 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are preferred.

[0216] As the imidazole-based curing accelerator, commercially available products may be used, for example, "P200-H50" manufactured by Mitsubishi Chemical Corporation, "1B2PZ" and "1B2PZ-10M" manufactured by Shikoku Kasei Co., Ltd.

[0217] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred.

[0218] Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, and 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene. Examples of such biguanide include o-[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide. Of these, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene are preferred.

[0219] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0220] The content of the (H) curing accelerator is 0% by mass or more, and from the viewpoint of significantly obtaining the effects of the present invention or from the viewpoint of controlling the curing time, when the non-volatile components in the resin composition are taken as 100% by mass, the content is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less, for example, preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and even more preferably 0.05% by mass or more.

[0221] <(I) Other additives> The resin composition of the present invention may further contain any additive as a non-volatile component. Examples of such additives include organic fillers such as rubber particles; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; defoamers such as silicone-based defoamers, acrylic defoamers, fluorine-based defoamers, and vinyl resin-based defoamers; ultraviolet absorbers such as benzophenone-based ultraviolet absorbers, benzotriazole-based ultraviolet absorbers, and salicylic acid-based ultraviolet absorbers; adhesion improvers such as urea silane; adhesion imparters such as triazole-based adhesion imparters, tetrazole-based adhesion imparters, and triazine-based adhesion imparters; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; Examples of the additives include surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (I) Other additives may be used alone or in combination of two or more at any ratio. The content of (I) other additives can be appropriately set by those skilled in the art. For example, the photocurable component and its auxiliary are usually contained in an amount that does not impair the thermosetting property of the resin composition of the present invention.

[0222] <(J) Organic solvent> The resin composition of the present invention may further contain an arbitrary organic solvent as a volatile component in addition to the non-volatile components described above. As the (J) organic solvent, a known one may be appropriately used, and the type is not particularly limited. As the (J) organic solvent, for example, ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, γ-butyrolactone, etc.; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, etc.; alcohol-based solvents such as methanol, ethanol, propanol, butanol, ethylene glycol, etc.; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate, etc. Examples of the organic solvent include ether ester solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (J) The organic solvent may be used alone or in combination of two or more in any ratio.

[0223] The content of the (J) organic solvent is not particularly limited, but when all components in the resin composition are taken as 100 mass%, it can be, for example, 60 mass% or less, 40 mass% or less, 30 mass% or less, 20 mass% or less, 15 mass% or less, 10 mass% or less, 5 mass% or less, etc.

[0224] In the present invention, the resin composition can be produced, for example, by adding and mixing the components (A), (B), and (C), and also the components (D), (E), (F), (G), (H), and (J) in any order and / or all at once in any preparation vessel. In addition, the temperature can be appropriately set during the process of adding and mixing each component, and heating and / or cooling can be performed temporarily or throughout. In addition, during or after the process of adding and mixing, the resin composition can be stirred or shaken using a stirring device or shaking device such as a mixer to disperse the resin composition uniformly. In addition, degassing can be performed under low pressure conditions such as under vacuum at the same time as stirring or shaking.

[0225] <Physical properties and applications of resin compositions> As described above, even when the resin composition of the present invention contains (A) an epoxy resin and (B) an inorganic filler, the resin composition of the present invention contains (C) a cage silsesquioxane compound, so that the occurrence of warping is suppressed and a cured product having excellent dielectric properties can be obtained. The suppression of the occurrence of warping (low warping property) can be evaluated by the method described in the <Evaluation of low warping property> section below. For example, the resin composition of the present invention is heat-cured at 190°C for 90 minutes, and the cured product has a warping amount of 1.0 cm or less, preferably less than 1.0 cm, and more preferably 0.9 cm or less. The dielectric properties can be evaluated by the method described in the <Evaluation of dielectric properties (dielectric constant, dielectric loss tangent)> section below. For example, the resin composition of the present invention is heat-cured at 200°C for 90 minutes, and the cured product has a dielectric constant (Dk) of preferably less than 3.2, more preferably 3.10 or less, and even more preferably 3.00 or less. The dielectric loss tangent (Df) of the cured product is preferably 0.0045 or less, more preferably 0.0043 or less, and even more preferably 0.0041 or less. In a preferred embodiment, the dielectric constant (Dk) of the cured product obtained by thermal curing at 200°C for 90 minutes is preferably less than 3.2, and the dielectric loss tangent (Df) is preferably 0.0045 or less.

[0226] In addition, one embodiment of the resin composition of the present invention shows a tendency that a cured product having excellent plating adhesion can be obtained. The plating adhesion can be evaluated by the method described in the <Evaluation of plating adhesion> section below. For example, the resin composition of the present invention has a peel strength of preferably 0.34 kgf / cm or more, more preferably more than 0.34 kgf / cm, even more preferably 0.345 kgf / cm or more, and particularly preferably 0.370 kgf / cm or more, when the cured product is thermally cured at 130°C for 30 minutes and then at 170°C for 30 minutes.

[0227] The resin composition of the present invention can obtain a cured product that is suppressed from warping and has excellent dielectric properties. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulating layers of printed wiring boards, particularly for interlayer insulation. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an interlayer insulation layer. In addition, the resin composition of the present invention can be suitably used as a resin composition for insulating the solder resist layer of a printed wiring board (resin composition for forming a solder resist layer).

[0228] The resin composition can obtain a cured product in which the occurrence of warping is suppressed and which has excellent dielectric properties. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulation purposes. Specifically, the resin composition can be suitably used as a resin composition for forming an insulating layer (resin composition for forming an insulating layer) for forming a conductor layer (including a rewiring layer) formed on an insulating layer.

[0229] Furthermore, in the multilayer printed wiring board described below, the resin composition can be suitably used as a resin composition for forming an insulating layer of a multilayer printed wiring board (resin composition for forming an insulating layer of a multilayer printed wiring board) and a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board).

[0230] In addition, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a rewiring formation layer (resin composition for forming a rewiring formation layer) as an insulating layer for forming a rewiring layer, and as a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). When a semiconductor chip package is manufactured, a rewiring layer may be further formed on the sealing layer. (1) A step of laminating a temporary fixing film onto a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A process of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0231] [Resin sheet] The resin sheet of the present invention includes a support and a resin composition layer formed from the resin composition of the present invention provided on the support.

[0232] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less, from the viewpoint of making the printed wiring board thinner and being able to provide a cured product with excellent insulation even if the cured product of the resin composition is a thin film. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more.

[0233] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0234] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0235] When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, etc., and copper foil is preferred. As the copper foil, a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0236] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0237] In addition, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. The release agent used in the release layer of the support with a release layer may be, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. The support with a release layer may be a commercially available product, for example, "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Unipeel" manufactured by Unitika Limited, which are PET films having a release layer mainly composed of an alkyd resin-based release agent.

[0238] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the total thickness of the support with a release layer is in the above range.

[0239] In one embodiment, the resin sheet may further include other layers as necessary. Examples of such other layers include a protective film equivalent to the support provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dirt and the like to the surface of the resin composition layer and scratches can be suppressed.

[0240] The resin sheet can be produced, for example, by preparing a resin varnish by dissolving a resin composition in an organic solvent, applying this resin varnish onto a support using a die coater or the like, and then drying the same to form a resin composition layer.

[0241] Drying may be performed by a known method such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is performed so that the content of organic solvent in the resin composition layer becomes 10 mass % or less, preferably 5 mass % or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30 mass % to 60 mass % of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0242] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0243] [Printed wiring board] The printed wiring board of the present invention includes an insulating layer formed from a cured product of the resin composition of the present invention.

[0244] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that a resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of thermally curing the resin composition layer to form an insulating layer

[0245] The "inner layer substrate" used in step (I) is a member that becomes the substrate of a printed wiring board, and examples thereof include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. The substrate may have a conductor layer on one or both sides, and the conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be called an "inner layer circuit substrate". In addition, an intermediate product on which an insulating layer and / or a conductor layer is to be further formed during the manufacture of a printed wiring board is also included in the "inner layer substrate" of the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0246] The lamination of the inner layer substrate and the resin sheet can be carried out, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of the member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as the "thermocompression bonding member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the inner layer substrate.

[0247] The lamination of the inner layer substrate and the resin sheet may be performed by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably in the range of 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably performed under reduced pressure conditions of 26.7hPa or less.

[0248] The lamination can be performed by a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch type vacuum pressure laminator.

[0249] After lamination, the laminated resin sheet may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. The smoothing treatment may be performed using a commercially available laminator. The lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0250] The support may be removed between step (I) and step (II) or after step (II).

[0251] In step (II), the resin composition layer is thermally cured to form an insulating layer. The conditions for thermally curing the resin composition layer are not particularly limited, and conditions that are usually employed when forming an insulating layer for a printed wiring board may be used.

[0252] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, etc., but the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0253] Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50° C. or more and less than 120° C. (preferably 60° C. or more and 115° C. or less, more preferably 70° C. or more and 110° C. or less) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes).

[0254] In manufacturing a printed wiring board, the steps of (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art for use in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be carried out between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (V). In addition, the formation of the insulating layer and the conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board, as necessary.

[0255] Step (III) is a step of drilling holes in the insulating layer, which allows holes such as via holes and through holes to be formed in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined depending on the design of the printed wiring board.

[0256] Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smears are also removed. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions that are usually used when forming an insulating layer of a printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order. The swelling liquid used in the roughening treatment is not particularly limited, but includes an alkaline solution, a surfactant solution, and the like, and is preferably an alkaline solution, and as the alkaline solution, a sodium hydroxide solution and a potassium hydroxide solution are more preferable. Examples of commercially available swelling liquids include "Swelling Dip Securigans P", "Swelling Dip Securigans SBU", and "Swelling Dip Securigant P" manufactured by Atotech Japan. The swelling treatment using a swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes. The oxidizing agent used in the roughening treatment is not particularly limited, but examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. In addition, the concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securiganth P" manufactured by Atotech Japan. The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product is, for example, "Reduction Solution Securiganth P" manufactured by Atotech Japan. Treatment with a neutralizing solution can be performed by immersing the surface that has been roughened with an oxidizing agent in the neutralizing solution at 30°C to 80°C for 1 to 30 minutes.From the viewpoint of workability etc., a method in which the object that has been subjected to roughening treatment with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 minutes to 20 minutes is preferred.

[0257] In one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after the roughening treatment is preferably 300 nm or less, more preferably 250 nm or less, and even more preferably 200 nm or less. There is no particular limit to the lower limit, but it is preferably 30 nm or more, more preferably 40 nm or more, and even more preferably 50 nm or more. The arithmetic mean roughness (Ra) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0258] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The conductor layer may be a single metal layer or an alloy layer, and examples of the alloy layer include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy and copper-titanium alloy). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, and the like, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0259] The conductor layer may be a single-layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

[0260] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, and preferably 5 μm to 30 μm.

[0261] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer by a conventionally known technique such as a semi-additive method or a full-additive method, and from the viewpoint of ease of production, it is preferable to form the conductor layer by the semi-additive method. An example of forming the conductor layer by the semi-additive method will be described below.

[0262] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to a desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[0263] [Semiconductor Devices] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention. The semiconductor device of the present invention may include an insulating layer containing a cured product of the resin composition layer of the present invention. Examples of such semiconductor devices include a printed wiring board itself, a semiconductor chip package, a multi-chip package, a package-on-package, a wafer-level package, a panel-level package, and a system-in-package.

[0264] Semiconductor devices are used in electrical appliances (eg, computers, mobile phones, digital cameras, and televisions) and vehicles (eg, motorcycles, automobiles, trains, ships, and aircraft).

[0265] The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. The "conductive portion" refers to a portion of a printed wiring board that transmits an electric signal, and the portion may be either on the surface or embedded. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of semiconductor material.

[0266] The method of mounting a semiconductor chip when manufacturing a semiconductor device is not particularly limited as long as the semiconductor chip functions effectively, but specific examples include a wire bonding mounting method, a flip chip mounting method, a bumpless buildup layer (BBUL) mounting method, an anisotropic conductive film (ACF) mounting method, a non-conductive film (NCF) mounting method, etc. Here, the "bumpless buildup layer (BBUL) mounting method" refers to "a mounting method in which a semiconductor chip is directly embedded in a recess in a printed wiring board and the semiconductor chip is connected to the wiring on the printed wiring board." EXAMPLES

[0267] The present invention will be specifically described below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Unless otherwise specified, the temperature and pressure conditions are room temperature (25°C) and atmospheric pressure (1 atm).

[0268] --Examples 1 to 8 and Comparative Example 1-- Examples and comparative examples of the resin composition containing a component selected from the group consisting of the components (A), (B) and (C) are shown below.

[0269] [Example 1] (1) Preparation of Resin Varnish A 5 parts of epoxy resin a1 as component (A) (biphenyl aralkyl type epoxy resin "YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 194 g / eq.), 2 parts of epoxy resin a2 as component (A) (naphthalene type epoxy resin "HP-4032SS" manufactured by DIC Corporation, epoxy equivalent: 144 g / eq.), and 2 parts of epoxy resin a3 as component (alicyclic epoxy having an ester skeleton manufactured by Daicel Corporation). Two parts of resin "Celloxide 2021P", epoxy equivalent: 137g / eq.) and 33.3 parts of thermoplastic resin g (phenoxy resin "YX7553BH30" manufactured by Mitsubishi Chemical Corporation, 1:1 solution of cyclohexanone: methyl ethyl ketone (MEK) with 30% non-volatile content by mass, Mw = 35000) as component (G) were dissolved in a mixed solvent (20 parts of solvent naphtha and 10 parts of cyclohexanone) with stirring. This resulted in an epoxy resin-containing solution.

[0270] In the epoxy resin-containing solution, an inorganic filler b as component (B) (spherical silica "SC-C2" manufactured by Admatechs Co., Ltd., surface-treated with N-phenyl-8-aminooctyl-trimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd., specific surface area: 5.9 m 2 / g, average particle size: 0.77μm) 175 parts, a cage-type silsesquioxane having a binding functional group as a component (C-1) (a bifunctional double-decker silsesquioxane compound "alicyclic double-decker silsesquioxane-DDSQ-01" or "silsesquioxane alicyclic acid dianhydride DDSQ" (hereinafter also referred to as "reactive cage-type PSQ-c1") manufactured by Japan Material Technology Co., Ltd., CAS number: 948849-07-8, acid anhydride group equivalent: 909g / eq., cyclohexanone solution of 50% by mass of non-volatile components), and 2 parts of a curing accelerator h as a component (H) (a MEK solution of 10% by mass of imidazole-based curing accelerator "1B2PZ" (1-benzyl-2-phenylimidazole) manufactured by Shikoku Kasei Co., Ltd.) were added, mixed, and further uniformly dispersed with a high-speed rotating mixer. As a result, a dispersion liquid was obtained.

[0271] The reactive cage-type PSQ-c1 is a compound represented by the following structural formula.

[0272] [ka]

[0273] As described above, a resin varnish of a resin composition containing at least the components (A) to (C) was prepared. Hereinafter, the resin varnish thus prepared is also referred to as "resin varnish A."

[0274] (2) Preparation of resin sheet B As a support, a PET film ("Lumirror R80" manufactured by Toray Industries, Inc., thickness 38 μm, softening point 130°C, hereinafter sometimes referred to as "release PET") that had been release-treated with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Corporation) was prepared.

[0275] Resin varnish A was uniformly applied onto the release PET with a die coater so that the thickness of the resin composition layer after drying was 25 μm, and dried at 80 ° C for 1 minute to obtain a resin composition layer on the release PET. Next, a rough surface of a polypropylene film (Oji F-Tex Co., Ltd. "Alphan MA-411", thickness 15 μm) was laminated as a protective film on the surface of the resin composition layer that was not bonded to the support, so as to be bonded to the resin composition layer. This resulted in a resin sheet consisting of the release PET (support), the resin composition layer, and the protective film in this order. Hereinafter, the resin sheet produced in this manner is also referred to as "resin sheet B".

[0276] [Example 2] In Example 1, the amount of inorganic filler b as component (B) was changed from 175 parts to 40 parts, the amount of thermoplastic resin g (non-volatile component 30% by mass) as component (G) was changed from 33.3 parts to 13.2 parts, and the amount of curing accelerator h (non-volatile component 10% by mass) as component (H) was changed from 2 parts to 1 part. Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 1.

[0277] [Example 3] In Example 1, the amount of inorganic filler b as component (B) was changed from 175 parts to 105 parts, the amount of reactive cage-type PSQ-c1 as component (C-1) was changed from 48 parts to 18 parts, the amount of thermoplastic resin g (non-volatile component 30 mass%) as component (G) was changed from 33.3 parts to 19.8 parts, and 12.1 parts of curing agent d1 as component (D) (active ester curing agent "HPC-8150-62T" manufactured by DIC Corporation, active group equivalent: 229 g / eq., toluene solution with non-volatile component 62 mass%) was further added to the epoxy resin-containing solution. Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 1.

[0278] [Example 4] In Example 3, 12.1 parts of curing agent d1 (62% by mass of non-volatile components) as component (D) was changed to 19.8 parts of curing agent d2 (DIC Corporation's active ester curing agent "HPC-8000-65T", active group equivalent: 223 g / eq., toluene solution of 65% by mass of non-volatile components). Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 3.

[0279] [Example 5] In Example 1, the amount of inorganic filler b as component (B) was changed from 175 parts to 205 parts, the amount of thermoplastic resin g (non-volatile component 30% by mass) as component (G) was changed from 33.3 parts to 36.3 parts, and the amount of hardening accelerator h (non-volatile component 10% by mass) as component (H) was changed from 2 parts to 4 parts. In addition, 14.3 parts of radical polymerizable compound e1 as component (E) (biphenylaralkyl type maleimide compound "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with non-volatile component 70% by mass) and 0.2 parts of hardening accelerator f as component (F) ("Perhexyl (registered trademark) D" manufactured by NOF Corporation) were further added to the epoxy resin-containing solution. Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 1.

[0280] [Example 6] In Example 6, 14.3 parts of the radical polymerizable compound e1 (70% by mass of non-volatile components) as the component (E) in Example 5 was changed to 10 parts of a radical polymerizable compound e2 (maleimide compound "BMI689" manufactured by Designer Molecules (N-alkylbismaleimide having a skeleton derived from dimer diamine, solvent-free). Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 5.

[0281] [Example 7] In Example 7, 14.3 parts of the radical polymerizable compound e1 (70% by mass of non-volatile components) as the component (E) in Example 5 was changed to 10 parts of the radical polymerizable compound e3 (SABIC Corporation, "SA9000-111", number average molecular weight (Mn): 1850 to 1950, solvent not included). Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 5.

[0282] [Example 8] In Example 5, 14.3 parts of radical polymerizable compound e1 (70% by mass of non-volatile component) as component (E) was used, whereas in Example 8, 15.4 parts of radical polymerizable compound e4 (vinylbenzyl-modified polyphenylene ether "OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Company, Inc., a toluene solution of 65% non-volatile component) was used, and the amount of curing accelerator f as component (F) was changed from 0.2 parts to 0.01 parts. Except for the above, resin varnish A was prepared and resin sheet B was produced in the same manner as in Example 5.

[0283] [Comparative Example 1] In Example 1, the amount of reactive cage-type PSQ-c1 as component (C-1) was changed from 48 parts to 0 parts (i.e., not included), and 48 parts of curing agent d3 (acid anhydride curing agent "Rikacid BT-100" (1,2,3,4-butanetetracarboxylic dianhydride) manufactured by New Japan Chemical Co., Ltd.) as component (D) was further added to the epoxy resin-containing solution. That is, an acid anhydride curing agent was used instead of reactive cage-type PSQ-c1 as component (C-1). Except for the above, a resin varnish A not containing the component (C) was prepared and a resin sheet B was produced in the same manner as in Example 1.

[0284] Next, various measurement and evaluation methods will be explained.

[0285] <Evaluation of low warpage> (1) Lamination of resin sheet Each resin sheet B produced in the examples and comparative examples was cut into a size of 9.5 cm square, and laminated onto the roughened surface of copper foil "3EC-III (thickness 35 μm)" produced by Mitsui Mining & Smelting Co., Ltd., cut into a size of 10 cm square, using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., 2-stage build-up laminator "CVP700"). The lamination was carried out by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing at 120°C for 30 seconds at a pressure of 0.74 MPa to produce a metal foil with a resin composition layer, and then peeling off the PET film support.

[0286] (2) Curing of the resin composition layer The four sides of the metal foil with the resin composition layer obtained in (1) above were attached to a 1 mm thick SUS plate with polyimide tape so that the resin composition layer was on the upper side, and the resin composition layer was cured under curing conditions of 190°C and 90 minutes.

[0287] (3) Measurement of warpage The polyimide tape was peeled off from three of the four sides of the metal foil with the resin composition layer obtained in (2) above, and the height of the highest point from the SUS plate was measured to determine the amount of warping, which was then evaluated according to the following criteria. ○: The amount of warping is less than 1 cm. ×: The amount of warping is 1 cm or more.

[0288] <Evaluation of plating adhesion> 1. Preparation of measurement samples (1) Surface preparation for inner layer circuit boards Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed were etched 1 μm using MEC's ​​"CZ8101" to roughen the copper surface.

[0289] (2) Lamination of a resin sheet with a support The protective film was peeled off from each resin sheet, and the sheets were laminated on both sides of the inner layer circuit board using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., 2-stage build-up laminator "CVP700"). Lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing at 130°C and a pressure of 0.74 MPa for 45 seconds. Next, a heat press was performed at 120°C and a pressure of 0.5 MPa for 75 seconds.

[0290] (3) Curing of the resin composition The laminated resin sheet was cured at 130° C. for 30 minutes, and then at 170° C. for 30 minutes to cure the resin composition, thereby forming an insulating layer.

[0291] (4) Roughening treatment The inner layer circuit board with the insulating layer formed was immersed in swelling dip Securigant P (glycol ether, sodium hydroxide aqueous solution) containing diethylene glycol monobutyl ether manufactured by Atotech Japan as a swelling liquid at 60°C for 10 minutes, then immersed in Concentrate Compact P (KMnO4: 60g / L, NaOH: 40g / L aqueous solution) manufactured by Atotech Japan as a roughening liquid at 80°C for 20 minutes, and finally immersed in Reduction Shoreucin Securigant P (sulfuric acid aqueous solution) manufactured by Atotech Japan as a neutralizing liquid at 40°C for 5 minutes, and then dried at 80°C for 30 minutes. This board was named "Evaluation Board C".

[0292] (5) Semi-additive plating Evaluation substrate C was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. After heating at 150°C for 30 minutes to perform an annealing treatment, an etching resist was formed, and after forming a pattern by etching, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 20 μm. Next, an annealing treatment was performed at 200°C for 60 minutes. This substrate was designated "evaluation substrate D."

[0293] 2. Measurement and evaluation of peel strength A 10 mm wide and 100 mm long cut was made in the conductor layer of evaluation board D, and one end of this was peeled off and held with a gripping tool (TSE Corporation, Autocom type testing machine "AC-50C-SL"), and the load (kgf / cm) was measured when 35 mm was peeled off vertically at a speed of 50 mm / min at room temperature.

[0294] The measured peel strength was evaluated according to the following criteria. ○: 0.34kgf / cm or more ×: Less than 0.34kgf / cm

[0295] <Evaluation of dielectric properties (dielectric constant, dielectric tangent)> The protective film was peeled off from each resin sheet B produced in the examples and comparative examples, and the resin composition layer was thermally cured by heating at 200°C for 90 minutes, and then the support was peeled off. The obtained cured product was cut into a test piece having a width of 2 mm and a length of 80 mm. The dielectric constant (Dk) and dielectric loss tangent (Df) of the test piece were measured at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C by a cavity resonance perturbation method using an "HP8362B" manufactured by Agilent Technologies. Measurements were performed on three test pieces, and the average value was calculated.

[0296] The dielectric properties were evaluated according to the following criteria. ○: Dielectric constant is less than 3.2 and dielectric tangent is 0.0045 or less ×: At least one of the following is satisfied: dielectric constant is 3.2 or more, and dielectric tangent is more than 0.0045.

[0297] The results of Examples 1 to 8 and Comparative Example 1 are shown in Table 1.

[0298] [Table 1]

[0299] In Examples 1 to 8, it has been confirmed that even when the (G) component is not contained, or when a non-reactive cage-type PSQ is contained, the results are similar to those of the above examples, although to different degrees.

Claims

1. A resin composition comprising (A) an epoxy resin, (B) an inorganic filler, and (C) a cage silsesquioxane compound, The component (B) contains silica, The component (C) is a double-decker silsesquioxane compound, The component (C) contains (C-1) a cage silsesquioxane compound having at least two reactive functional groups in the molecule, A resin composition, wherein the reactive functional group is a group selected from the group consisting of an acid anhydride group, a carboxy group, an amino group, and a group containing at least one of these groups.

2. A resin composition comprising (A) an epoxy resin, (B) an inorganic filler, and (C) a cage-type silsesquioxane compound, The component (B) contains silica, The component (C) contains (C-1) a cage silsesquioxane compound having at least two reactive functional groups in the molecule, A resin composition, wherein the reactive functional group is an acid anhydride group.

3. A resin composition described in claim 1 or 2, wherein the mass ratio (mass %) of the content (parts by mass) of the (C) component to the content (parts by mass) of the (B) component is 5 mass% or more and 300 mass% or less.

4. The resin composition according to claim 1 , wherein the double-decker silsesquioxane compound comprises a cage structure represented by the following formula (C1): 【Chemistry 1】 ... (C1) [In the above formula (C1), X's are each independently a group selected from an alkyl group having 1 to 40 carbon atoms in which a hydrogen atom may be replaced by a halogen atom, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group in which a hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, and an arylalkyl group in which an aryl group in which a hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms is bonded to an alkylene group having 1 to 8 carbon atoms; Each Y is independently a group selected from an alkyl group having 1 to 40 carbon atoms in which a hydrogen atom may be replaced by a halogen atom, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group in which a hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms, and an arylalkyl group in which an aryl group in which a hydrogen atom may be replaced by a halogen atom or an alkyl group having 1 to 20 carbon atoms is bonded to an alkylene group having 1 to 8 carbon atoms; Z's are each independently a trivalent group bonded to a Si atom and containing two bonds, and the reactive functional group is constituted by including Z; When X or Y is an alkyl group having 1 to 40 carbon atoms, the —CH ２ - may be replaced by -O- or -CH=CH-; When X or Y is an aryl group, and a hydrogen atom of the aryl group is replaced by an alkyl group having 1 to 20 carbon atoms, a hydrogen atom of the alkyl group having 1 to 20 carbon atoms may be replaced by a halogen atom, and —CH ２ - may be replaced by -O- or -CH=CH-; When X or Y is an arylalkyl group, the arylalkyl group contains —CH ２ - may be replaced by -O-.

5. The resin composition according to claim 4 , wherein each X is a phenyl group.

6. The resin composition according to any one of claims 1 and 3 to 5, wherein the reactive functional group is an acid anhydride group.

7. The resin composition according to claim 2 or 6, wherein the acid anhydride group is formed by linking two of three bonds contained in any one of the structures represented by the following formulas (1) to (7) to -CO-O-CO-. 【Chemistry 2】

8. The resin composition according to any one of claims 1 to 7, further comprising (D) a curing agent.

9. Further, (D) a curing agent is contained, The resin composition according to any one of claims 1 to 8, wherein the mass ratio of the content of the (D) component to the total content of the (C-1) component and the (D) component is 10 mass% or more.

10. The resin composition according to any one of claims 1 to 9, wherein the content of the component (C) is 60 mass% or less, when the non-volatile components in the resin composition are 100 mass%.

11. The resin composition according to claim 8 or 9, wherein the component (D) comprises an active ester-based curing agent.

12. The resin composition according to any one of claims 1 to 11, further comprising (E) a radically polymerizable compound.

13. The resin composition according to any one of claims 1 to 12, wherein the content of the component (B) is 10 mass% or more, based on 100 mass% of non-volatile components in the resin composition.

14. The resin composition according to any one of claims 1 to 13, wherein the dielectric constant (Dk) of the cured product of the resin composition is less than 3.

2.

15. The resin composition according to any one of claims 1 to 14, wherein the dielectric loss tangent (Df) of the cured product of the resin composition is 0.0045 or less.

16. The resin composition according to any one of claims 1 to 15, which is for use in an insulating layer of a printed wiring board.

17. A cured product of the resin composition according to any one of claims 1 to 16.

18. A resin sheet comprising a support and a resin composition layer comprising the resin composition according to any one of claims 1 to 16 provided on the support.

19. A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 16.

20. A semiconductor device comprising the printed wiring board according to claim 19.

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