Package, electronic component, and manufacturing method

Abstract

To provide a package in which an inspector can easily see a bonding point, an electronic component, and a manufacturing method.SOLUTION: The package includes a housing portion having a peripheral wall with a mounting surface surrounding an opening of a housing space capable of housing an electronic element, a cap having a slit surrounding the opening and placed on the mounting surface, and a sealing portion that is bonded to the mounting surface to fill a slit and hermetically sealing the cap in the housing portion.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present disclosure relates to packages, electronic components, and manufacturing methods. [Background technology]

[0002] 2. Description of the Related Art Some electronic components and other parts are known in which elements are hermetically housed in a package. For example, Patent Document 1 discloses a hermetically sealed housing that hermetically houses a semiconductor chip. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-258435 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the hermetically sealed housing disclosed in Patent Document 1, a metal cover for hermetically sealing is joined to the upper surface of the opening edge of the housing body. However, in the hermetic sealing disclosed in Patent Document 1, the joints are hidden by the metal cover for hermetic sealing, making it difficult for an inspector to visually check the joints after sealing.

[0005] In view of any of the above problems, an object of the present disclosure is to provide a package, an electronic component, and a manufacturing method that allow an inspector to easily visually check joints. [Means for solving the problem]

[0006] A package according to one embodiment of the present disclosure comprises a storage section having a peripheral wall with a bonding surface surrounding an opening of a storage space capable of accommodating an electronic element, a cap having a slit surrounding the opening and placed on the mounting surface, and a sealing section bonded to the mounting surface so as to fill the slit and hermetically seal the cap in the storage section.

[0007] A manufacturing method according to one aspect of the present disclosure includes placing an electronic element in a storage section having a peripheral wall with a mounting surface surrounding an opening of a storage space capable of housing an electronic element, placing a pre-processing cap having a plurality of pre-processing slits on the mounting surface so that the plurality of pre-processing slits surround the opening, hermetically sealing the pre-processing cap in the storage section, and during the hermetic sealing, forming slits along the plurality of pre-processing slits, and joining a sealing portion to the mounting surface so as to fill the slits. Effect of the Invention

[0008] According to the above aspect, an inspector can easily visually check the joint portion. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view of the package according to the first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] 2 is a flowchart of a manufacturing method according to the first embodiment. [Figure 4] 10 is a plan view of a housing section in which an electronic element is housed in a step of housing the electronic element according to the first embodiment; FIG. [Diagram 5] 5 is a cross-sectional view taken along line VV in FIG. 4. [Figure 6] 11 is a plan view of a storage section on which a pre-machining cap is placed in a step of placing the pre-machining cap in the first embodiment. FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] 10 is a plan view of the storage portion in which the pre-processed cap is sealed in the step of hermetically sealing in the first embodiment; FIG. [Figure 9] FIG. 13 is a plan view of a package according to a comparative example. [Figure 10] 10 is a cross-sectional view taken along line XX in FIG. 9. [Figure 11] FIG. 11 is a plan view of a package according to a second embodiment. [Figure 12]10 is a flowchart of a manufacturing method according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Various embodiments according to the present disclosure will be described below with reference to the drawings.

[0011] First Embodiment A first embodiment according to the present disclosure will be described below with reference to FIGS.

[0012] (Electronic components and package configuration) As shown in FIGS. 1 and 2, an electronic component 9 includes a package 8. The package 8 includes a container portion 1 , a cap 2 , and a sealing portion 3 . For example, the electronic component 9 may further include an electronic element 4 within the package 8 . For example, the electronic component 9 may include, as the electronic element 4, a hybrid IC for microwave communication equipment.

[0013] (Storage section) The storage section 1 has a peripheral wall 11 having a mounting surface SA. The placement surface SA surrounds an opening OP of a housing space VV capable of housing an electronic element 4 therein.

[0014] For example, the housing 1 may be made of metal. For example, the storage section 1 may have an opening OP on the +Z direction side. For example, the placement surface SA may be the surface of the peripheral wall 11 on the +Z direction side. For example, the storage unit 1 may have a placement surface SA on the +Z direction side and a bottom surface S2 on the -Z direction side. The +Z direction may be the upward direction, and the -Z direction may be the downward direction.

[0015] For example, the accommodation space VV may be a space defined by the bottom surface S2 and the inner peripheral surface S1 of the peripheral wall 11. For example, the bottom surface S2 may be connected to the inner peripheral surface S1. For example, the accommodation space VV may have a rectangular parallelepiped shape.

[0016] For example, when viewed from the cap 2 side, the placement surface SA may surround the opening OP. For example, the opening OP may have a rectangular shape.

[0017] For example, the placement surface SA may be a surface facing the cap 2. For example, the placement surface SA may be a surface facing the +Z direction.

[0018] (cap) The cap 2 has a slit SLM surrounding an opening OP. The cap 2 is placed on a placement surface SA.

[0019] For example, the cap 2 may be metallic. For example, the cap 2 may have a plate shape having a thickness in the ±Z direction and a rectangular plate surface.

[0020] For example, the slits SLM may be formed by processing a plurality of pre-machining slits SL that are included in a pre-machining cap, which is a base material before the cap 2 is processed. For example, the slit SLM may be a trace of the pre-machining slit SL formed by irradiating a laser to the pre-machining slit SL in the pre-machining cap and melting the pre-machining cap. For example, the slit SLM may extend so as to connect a plurality of pre-machining slits SL in the pre-machining cap. For example, the slit SLM may have a ring shape surrounding the opening OP when the cap 2 is viewed from the +Z direction side. For example, the slit SLM may be located slightly outside the inner circumferential surface S1 of the peripheral wall 11.

[0021] (Sealing part) The sealing portion 3 is bonded to the mounting surface SA so as to fill the slit SLM. The sealing portion 3 hermetically seals the cap 2 to the housing portion 1 .

[0022] For example, the inner circumferential surface S3 of the sealing portion 3 may be substantially flush with the inner circumferential surface S1 of the peripheral wall 11. For example, the sealing portion 3 may include an alloy of the cap 2 and the housing portion 1 . For example, the sealing portion 3 may be formed by irradiating a laser onto a plurality of pre-processing slits SL of the pre-processing cap to melt the pre-processing cap and fill the pre-processing slits SL. For example, the sealing portion 3 may be exposed on the surface of the package 8 in the +Z direction so that it is visible from the +Z direction side.

[0023] (Manufacturing method) A method for manufacturing the electronic component 9 in this embodiment will be described. The method for manufacturing the electronic component 9 in this embodiment is carried out according to the flow shown in FIG.

[0024] First, as shown in Figures 4 and 5, the worker places the electronic element 4 in the storage section 1, which has a peripheral wall 11 with a mounting surface SA that surrounds an opening OP of the storage space VV capable of accommodating the electronic element 4 (ST01: step of placing the electronic element).

[0025] Next, as shown in Figures 6 and 7, the worker places a pre-processing cap 2a having multiple pre-processing slits SL on the placement surface SA so that the multiple pre-processing slits SL surround the opening OP (ST02: step of placing pre-processing cap).

[0026] For example, when the pre-processing cap 2a is viewed from the +Z direction side, a plurality of pre-processing slits SL may be arranged so as to surround the opening OP. For example, the multiple pre-machining slits SL may be disposed at a position slightly outside the inner circumferential surface S1 of the peripheral wall 11.

[0027] For example, the pre-machining cap 2a may have thin portions 21 having a small plate thickness between the plurality of pre-machining slits SL. For example, in the pre-machining cap 2a, the plate thickness of the thin portion 21 may be thinner than the plate thickness of the regions outside and inside the region where the multiple pre-machining slits SL are aligned.

[0028] For example, each pre-processing slit SL may have a shape extending toward another adjacent pre-processing slit SL. For example, a plurality of pre-machining slits SL may be arranged on each side of a rectangular shape with the thin portions 21 interposed therebetween.

[0029] Next, as shown in FIG. 8, the worker hermetically seals the pre-processing cap 2a in the housing portion 1 (ST03: hermetically sealing step). In ST03, the worker forms slits SLM along the multiple pre-processing slits SL, and bonds the sealing portion 3 to the mounting surface SA so as to fill the slits SLM (ST03A: step of bonding the sealing portion to the mounting surface). Here, the pre-processed cap 2a is hermetically sealed to form the cap 2.

[0030] For example, in ST03, the worker may irradiate a laser across multiple pre-processing slits SL, melt the pre-processing cap 2a to form slits SLM, and then join the sealing portion 3 to the mounting surface SA so as to fill the formed slits SLM. For example, in ST03, the slit SLM may be formed by melting the thin portion 21 with a laser and connecting adjacent pre-machining slits SL to each other. At this time, the slit width of the pre-machining slits SL in the pre-machining cap 2a, the number of the pre-machining slits SL, the thin portions 21, and the like may be optimized in advance according to the irradiation energy of the laser.

[0031] For example, as a result of performing ST03, an electronic component 9 having a package 8 may be manufactured.

[0032] (Action and Effects) According to the package 8 of this embodiment, an inspector can visually check the state of the sealing portion 3 filling the slit SLM from the cap 2 side of the package 8. Therefore, the inspector can easily visually confirm the joint.

[0033] As a comparative example, a laser LB is applied to the boundary between the housing section and the pre-processed cap at a 45-degree angle to melt the pre-processed cap and create an alloy with the housing section, thereby achieving an airtight seal as shown in Figure 9. In this case, after the airtight sealing, an inspector must visually check the appearance of the boundary surface from an oblique angle, which makes visual inspection difficult. As a result, the product may be sent to a later process without being sealed properly, and defects may be discovered during a subsequent airtightness test.

[0034] In contrast to this comparative example, according to this embodiment, as described above, the inspector can easily visually recognize the joint portion. Furthermore, according to this embodiment, the yield is improved by improving visibility. As in the present embodiment, for example, if the degree of filling inside the slit SLM can be visually confirmed from directly above, an inspector can easily identify areas that are not airtight and can reseal those areas, thereby improving the yield.

[0035] According to one example of this embodiment, the inner circumferential surface S3 of the sealing portion 3 is substantially flush with the inner circumferential surface S1 of the peripheral wall 11. For this reason, the cutoff frequency of the package 8 can be related to the size of the opening OP of the accommodation space VV.

[0036] In the case of the comparative example described above, as shown in FIG. 10, the boundary between the storage part and the cap where the laser LB hits is bonded, but immediately inside the boundary, gaps are likely to occur between the storage part and the cap due to thermal stress caused by the laser LB and the flatness of the storage part and the cap, etc. Normally, the cutoff frequency is determined by the width W1, but if a gap occurs between the housing portion and the cap as in the comparative example, the cutoff frequency is determined by the width W2 due to the influence of the gap between the housing portion and the cap, causing the cutoff frequency to decrease. Due to such a decrease in the cutoff frequency, the frequency propagating through space also decreases in the comparative example. Generally, the lower the frequency, the higher the gain of the amplifier. Therefore, if the frequency propagating through space is lowered as in the comparative example, for example, when the amplifier is placed inside a package, this can cause oscillation or resonance due to the low-frequency propagation through space.

[0037] In contrast to this comparative example, according to one example of the present embodiment, as described above, the cutoff frequency in the package 8 can be approximately related to the size of the opening OP of the accommodation space VV. Therefore, the package 8 can suppress a decrease in the cutoff frequency when hermetically sealed.

[0038] Furthermore, according to one example of this embodiment, since the sealing portion 3 contains an alloy of the storage portion 1 and the cap 2, the storage portion 1 and the cap 2 can be integrated via the sealing portion 3. Therefore, the package 8 can hermetically seal the gap between the container 1 and the cap 2.

[0039] Furthermore, according to one example of this embodiment, the pre-processing cap 2a has a thin portion 21 having a small plate thickness between multiple pre-processing slits SL, so that in the manufactured package 8, it is easy to provide a sealing portion 3 around the entire circumference of the slits SLM.

[0040] Furthermore, according to one example of this embodiment, the thin portion 21 is melted by a laser, so that the package 8 can be hermetically sealed at a surface substantially flush with the inner circumferential surface S1 of the peripheral wall 11. Therefore, in the manufactured package 8, a gap is unlikely to occur between the housing portion 1 and the cap 2, and the inner wall of the package 8 is unlikely to expand, so that a decrease in the cutoff frequency can be suppressed.

[0041] Furthermore, according to one example of this embodiment, the electronic component 9 includes a hybrid IC for microwave communication equipment as the electronic element 4 inside the package 8 that can suppress the decrease in the cutoff frequency, and therefore, oscillation and resonance in the hybrid IC for microwave communication equipment can be suppressed.

[0042] <Modification> In one example of the above-described embodiment, the electronic component 9 includes a hybrid IC for microwave communication equipment as the electronic element 4, but the electronic component 9 may include any electronic element, and may be applied to general packaging products used for other purposes.

[0043] In the example of the embodiment described above, the accommodation space VV has a rectangular parallelepiped shape, but may have any shape as long as it can accommodate the electronic element 4. Alternatively, the receiving space VV may have a cubic shape.

[0044] In the above-described embodiment, the cap 2 has a rectangular plate surface, but may have any shape. Alternatively, the cap 2 may have a square shaped plate surface.

[0045] In the example embodiment described above, the slit SLM is filled with a seal 3, but in the slit SLM filled with a seal 3 the package 8 may have any appearance. As a variant, in the slit SLM filled with the sealing part 3, the package 8 may have a groove or a step. As another variant, in the slit SLM filled with the seal 3, the package 8 may have areas of discontinuity in color, material or surface roughness.

[0046] Second Embodiment Hereinafter, as a second embodiment, an embodiment of a minimum configuration of a package according to the present disclosure will be described with reference to FIG.

[0047] The package 108 includes a container portion 101 , a cap 102 , and a sealing portion 103 . The housing portion 101 includes a peripheral wall 111 having a placement surface SA surrounding an opening OP of a housing space VV capable of housing an electronic element. The cap 102 has a slit SLM1 surrounding the opening OP1, and is placed on the placement surface SA1. The sealing portion 103 is joined to the placement surface SA1 so as to fill the slit SLM1, and hermetically seals the cap 102 in the accommodation portion 101.

[0048] According to the package 108 of this embodiment, the state of the sealing portion 103 filling the slit SLM1 can be visually confirmed from the cap 102 side. Therefore, the inspector can easily visually confirm the joint.

[0049] <Third embodiment> Hereinafter, as a third embodiment, an embodiment of a minimum configuration of the manufacturing method according to the present disclosure will be described. The manufacturing method in this embodiment is carried out according to the flow shown in FIG.

[0050] First, an operator places an electronic element in a housing portion that has a peripheral wall having a placement surface surrounding an opening of a housing space capable of housing the electronic element (ST101). Next, the worker places the pre-machined cap having a plurality of pre-machined slits on the placement surface so that the plurality of pre-machined slits surround the opening (ST102). Next, the worker hermetically seals the pre-processing cap in the receiving portion (ST103). In the hermetic sealing, the worker forms slits along the multiple pre-processing slits and bonds the sealing portion to the mounting surface so as to fill the slits (ST103A).

[0051] According to the manufacturing method of this embodiment, the state of the sealing portion filling the slit can be visually confirmed from the cap side of the manufactured product. Therefore, the inspector can easily visually confirm the joint.

[0052] Although the embodiment of the present disclosure has been described above, this embodiment is shown as an example and is not intended to limit the scope of the present disclosure. This embodiment can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the present disclosure. [Explanation of symbols]

[0053] 1 Storage unit 2 Cap 2a Cap before processing 3 Sealing part 4. Electronic elements 8 Packages 9. Electronic Components 11 Peripheral wall 21 Thin section 101 Storage unit 102 Cap 103 Sealing part 108 Packages 111 Peripheral wall LB Laser OP Opening OP1 opening S1 Inner surface S2 bottom S3 Inner surface SA Placement surface SA1 Placement surface SL Pre-processing slit SLM Slit SLM1 Slit VV Storage Space VV1 Storage space

Claims

1. A housing section including a peripheral wall having a mounting surface surrounding an opening of a housing space capable of housing an electronic element; a cap having a slit surrounding the opening and placed on the placement surface; a sealing portion that is joined to the placement surface so as to fill the slit and airtightly seals the cap in the storage portion, The inner periphery of the sealing portion is substantially flush with the inner periphery of the peripheral wall. package.

2. The package of claim 1 , wherein the sealing portion comprises an alloy of the receiving portion and the cap.

3. The package according to claim 1 or 2, wherein the sealing portion surrounds the entire periphery of the opening.

4. 4. The package according to claim 1, wherein the electronic device is a hybrid IC for microwave communication equipment.

5. A package according to any one of claims 1 to 4; The electronic element is provided in the package. Electronic components.

6. The electronic element is accommodated in an accommodating section having a peripheral wall with a mounting surface surrounding an opening of an accommodating space capable of accommodating the electronic element; placing a pre-processing cap having a plurality of pre-processing slits on the placement surface such that the plurality of pre-processing slits surround the opening; Hermetically sealing the pre-processing cap in the housing portion; In the hermetic sealing, a sealing portion is bonded to the mounting surface so as to fill in the slits while forming slits along the plurality of pre-processing slits; The pre-machining cap has a thin portion between the plurality of pre-machining slits. Manufacturing method.

7. The electronic element is accommodated in an accommodating section having a peripheral wall with a mounting surface surrounding an opening of an accommodating space capable of accommodating the electronic element; placing a pre-processing cap having a plurality of pre-processing slits on the placement surface such that the plurality of pre-processing slits surround the opening; Hermetically sealing the pre-processing cap in the housing portion; In the hermetic sealing, a sealing portion is bonded to the mounting surface so as to fill in the slits while forming slits along the plurality of pre-processing slits; The inner periphery of the sealing portion is substantially flush with the inner periphery of the peripheral wall. Manufacturing method.

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