Metal powder for additive manufacturing and additively manufactured object produced using said metal powder

Abstract

To provide a metal powder for lamination molding suitable for forming a lamination molding having both of high conductivity and high mechanical strength, and a lamination molding made using the metal powder.SOLUTION: A metal powder for lamination molding is used that is a mixed powder obtained by mixing of two or more selected from Cu powder, Al powder, X1 (X1=Co, Fe, Sc, Ti, Zr or Hf) powder, Cu-Al alloy powder, Cu-X1 (X1=Co, Fe, Sc, Ti, Zr or Hf) alloy powder, and Cu-Al-X1 (X1=Co, Fe, Sc, Ti, Zr or Hf) alloy powder. As a composition of the mixed powder, a total of Al and X1 is 0.01 at% or more and less than 0.3 at%, with the balance being Cu.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a metal powder for additive manufacturing and an additive manufacturing object produced using the metal powder. [Background technology]

[0002] In recent years, attempts have been made to use metal 3D printer technology to create complex, three-dimensional metal parts that are considered difficult to model. 3D printers are also known as additive manufacturing (AM), and are a method of creating additively modeled objects with complex shapes by spreading a thin layer of metal powder on a plate to form a metal powder layer, scanning this metal powder layer with an electron beam or laser light to melt and solidify it, spreading a thin layer of new powder on top of that, and similarly melting and solidifying the specified parts with laser light, and repeating this process.

[0003] As one of the metals for additive manufacturing, a copper-based material with high mechanical strength and high electrical conductivity is used. For example, Patent Document 1 discloses a copper alloy powder containing 1.1 to 20 mass% Cr, 0 to 0.2 mass% Zr, and the balance Cu and unavoidable impurities, and discloses that the copper alloy molded product has an electrical conductivity of 65% IACS or more, a 0.2% proof stress of 150 MPa or more, and a tensile strength of 300 MPa or more. Patent Document 2 discloses a copper alloy powder containing more than 1.00 mass% to 2.80 mass% chromium, and the balance copper. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-70169 A [Patent Document 2] JP 2018-197389 A DISCLOSURE OF THEINVENTION [Problem to be solved by the invention]

[0005] Although it has become possible to manufacture objects using copper alloy powders in recent years, no additively manufactured objects have been obtained that have electrical conductivity comparable to that of additively manufactured objects made of pure copper and mechanical strength superior to that of additively manufactured objects made of pure copper. In view of the above, an object of the present invention is to provide a metal powder for additive manufacturing that is suitable for forming additively manufactured objects having both high electrical conductivity and high mechanical strength, and an additively manufactured object manufactured using the metal powder. [Means for solving the problem]

[0006] Please amend this section by referring to the claims. > Amended. In order to solve the above problems, the inventors conducted intensive research and discovered that by appropriately selecting elements to be added to copper as metal powder for additive manufacturing, the resulting additive manufacturing product can have mechanical strength that significantly exceeds that of copper without significantly impairing the electrical conductivity that is characteristic of copper. Based on this finding, the following embodiments are provided. 1) A metal powder for additive manufacturing, which is composed of a mixture of Cu powder, Al powder, and X1 powder (X1 = Co, Fe, Sc, Ti, Zr, or Hf), in which the total of Al and X1 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. 2) A metal powder for additive manufacturing, which is composed of a mixture of Cu-Al alloy powder and Cu-X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, in which the total of Al and X1 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 3) A metal powder for additive manufacturing consisting of a Cu-Al-X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, in which the composition of the alloy powder is such that the sum of Al and X1 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 4) A metal powder for additive manufacturing, which is a mixed powder obtained by selecting and mixing two or more of Cu powder, Al powder, X1 (X1=Co, Fe, Sc, Ti, Zr, or Hf) powder, Cu-Al alloy powder, Cu-X1 (X1=Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, and Cu-Al-X1 (X1=Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, wherein the total of Al and X1 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. 5) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Bi powder, and X2 (X2 = Sc or Zr) powder, wherein the mixed powder has a composition in which the sum of Bi and X2 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 6) A metal powder for additive manufacturing consisting of a mixed powder of Cu-Bi alloy powder and Cu-X2 (X2 = Sc or Zr) alloy powder, in which the total of Bi and X2 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 7) A metal powder for additive manufacturing consisting of a Cu-Bi-X2 (X2 = Sc or Zr) alloy powder, in which the composition of the alloy powder is such that the sum of Bi and X2 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 8) A metal powder for additive manufacturing, which is a mixed powder obtained by selecting and mixing two or more of Cu powder, Bi powder, X2 (X2=S or Zr) powder, Cu-Bi alloy powder, Cu-X2 (X2=S or Zr) alloy powder, and Cu-Bi-X2 (X2=S or Zr) alloy powder, wherein the total of Bi and X2 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 9) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Co powder, and X3 (X3 = P, Si, or Hf) powder, in which the mixed powder has a composition in which the sum of Co and X3 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 10) A metal powder for additive manufacturing comprising a mixed powder of Cu-Co alloy powder and Cu-X3 (X3 = P, Si, or Hf) alloy powder, in which the total of Co and X3 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 11) A metal powder for additive manufacturing comprising a Cu-Co-X3 (X3 = P, Si, or Hf) alloy powder, in which the composition of the alloy powder is such that the sum of Co and X3 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 12) A mixed powder obtained by selecting and mixing two or more of Cu powder, Co powder, X3 (X3=P, Si or Hf) powder, Cu-Co alloy powder, Cu-X3 (X3=P, Si or Hf) alloy powder, and Cu-Co-X3 (X3=P, Si or Hf) alloy powder, wherein the total of Co and X3 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 13) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Cr powder, and X4 (X4 = P or Si) powder, wherein the mixed powder has a composition in which the sum of Cr and X4 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 14) A metal powder for additive manufacturing comprising a mixed powder of Cu-Cr alloy powder and Cu-X4 (X4 = P or Si) alloy powder, the mixed powder having a composition in which the sum of Cr and X4 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 15) A metal powder for additive manufacturing comprising a Cu-Cr-X4 (X4 = P or Si) alloy powder, the composition of the alloy powder being such that the sum of Cr and X4 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 16) A mixed powder obtained by selecting and mixing two or more of Cu powder, Cr powder, X4 (X4=P or Si) powder, Cu-Cr alloy powder, Cu-X4 (X4=P or Si) alloy powder, and Cu-Cr-X4 (X4=P or Si) alloy powder, wherein the total of Cr and X4 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 17) A metal powder for additive manufacturing, comprising a mixed powder of Cu powder, Fe powder, and X5 (X5 = P, Si, Ti or Hf) powder, in which the total of Fe and X5 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. 18) A metal powder for additive manufacturing, comprising a mixed powder of Cu-Fe alloy powder and Cu-X5 (X5 = P, Si, Ti, or Hf) alloy powder, in which the total of Fe and X5 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 19) A metal powder for additive manufacturing comprising a Cu-Fe-X5 (X5 = P, Si, Ti, or Hf) alloy powder, in which the composition of the alloy powder is such that the sum of Fe and X5 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 20) A mixed powder obtained by selecting and mixing two or more of Cu powder, Fe powder, X5 (X5 = P, Si, Ti or Hf) powder, Cu-Fe alloy powder, Cu-X5 (X5 = P, Si, Ti or Hf) alloy powder, and Cu-Fe-X5 (X5 = P, Si, Ti or Hf) alloy powder, wherein the total of Fe and X5 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing. 21) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Ga powder, and X6 (X6 = Sc, Ti, Zr or Hf) powder, the mixed powder having a composition in which the sum of Ga and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 22) A metal powder for additive manufacturing comprising a mixed powder of Cu-Ga alloy powder and Cu-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, in which the total of Ga and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 23) A metal powder for additive manufacturing comprising a Cu-Ga-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, in which the composition of the alloy powder is such that the sum of Ga and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 24) A metal powder for additive manufacturing, comprising a mixed powder of two or more selected from the group consisting of Cu powder, Ga powder, X6 (X6 = Sc, Ti, Zr, or Hf) powder, Cu-Ga alloy powder, Cu-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, and Cu-Ga-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, wherein the total of Ga and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 25) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, In powder, and Sc powder, wherein the mixed powder has a composition in which the total of In and Sc is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 26) A metal powder for additive manufacturing comprising a mixed powder of Cu-In alloy powder and Cu-Sc alloy powder, the mixed powder having a composition in which the sum of In and Sc is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 27) A metal powder for additive manufacturing comprising a Cu-In-Sc alloy powder, the composition of the alloy powder being such that the sum of In and Sc is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 28) A metal powder for additive manufacturing, comprising a mixed powder of two or more selected from the group consisting of Cu powder, In powder, Sc powder, Cu-In alloy powder, Cu-Sc alloy powder, and Cu-In-Sc alloy powder, wherein the total of In and Sc is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 29) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Ni powder, and X6 (X6 = Sc, Ti, Zr, or Hf) powder, in which the total of Ni and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 30) A metal powder for additive manufacturing comprising a mixed powder of Cu-Ni alloy powder and Cu-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder, the mixed powder having a composition in which the total of Ni and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 31) A metal powder for additive manufacturing comprising a Cu-Ni-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, the composition of the alloy powder being such that the sum of Ni and X6 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 32) A metal powder for additive manufacturing, which is a mixed powder obtained by selecting and mixing two or more of Cu powder, Ni powder, X6 (X6 = Sc, Ti, Zr, or Hf) powder, Cu-Ni alloy powder, Cu-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, and Cu-Ni-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, wherein the total of Ni and X6 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 33) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, P powder, and X7 (X7 = Sc, Ti, V or Zr) powder, the mixed powder having a composition in which the sum of P and X7 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 34) A metal powder for additive manufacturing comprising a mixed powder of Cu-P alloy powder and Cu-X7 (X7 = Sc, Ti, V, or Zr) alloy powder, the mixed powder having a composition in which the sum of P and X7 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 35) A metal powder for additive manufacturing comprising a Cu-P-X7 (X7 = Sc, Ti, V, or Zr) alloy powder, in which the composition of the alloy powder is such that the sum of P and X7 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 36) A metal powder for additive manufacturing, comprising a mixed powder of two or more selected from the group consisting of Cu powder, P powder, X7 (X7 = Sc, Ti, V, or Zr) powder, Cu-P alloy powder, Cu-X7 (X7 = Sc, Ti, V, or Zr) alloy powder, and Cu-P-X7 (X7 = Sc, Ti, V, or Zr) alloy powder, wherein the total of P and X7 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 37) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Sc powder, and X8 (X8 = Si, Sn, or Ti) powder, in which the mixed powder has a composition in which the sum of Sc and X8 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 38) A metal powder for additive manufacturing comprising a mixed powder of Cu-Sc alloy powder and Cu-X8 (X8 = Si, Sn or Ti) alloy powder, in which the total of Sc and X8 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 39) A metal powder for additive manufacturing comprising a Cu-Sc-X8 (X8 = Si, Sn or Ti) alloy powder, in which the composition of the alloy powder is such that the sum of Sc and X7 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 40) A metal powder for additive manufacturing, comprising a mixed powder of two or more selected from the group consisting of Cu powder, Sc powder, X8 (X8=Si, Sn or Ti) powder, Cu-Sc alloy powder, Cu-X8 (X8=Si, Sn or Ti) alloy powder, and Cu-Sc-X8 (X8=Si, Sn or Ti) alloy powder, wherein the total of Sc and X8 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 41) A metal powder for additive manufacturing, comprising a mixed powder of Cu powder, Si powder, and X9 (X9 = Ti, V, or Zr) powder, in which the total of Si and X9 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 42) A metal powder for additive manufacturing comprising a mixed powder of Cu-Si alloy powder and Cu-X9 (X9 = Ti, V, or Zr) alloy powder, the mixed powder having a composition in which the sum of Si and X9 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 43) A metal powder for additive manufacturing comprising a Cu-Si-X9 (X9 = Ti, V, or Zr) alloy powder, the composition of the alloy powder being such that the sum of Si and X9 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 44) A metal powder for additive manufacturing, which is a mixed powder obtained by selecting and mixing two or more of Cu powder, Si powder, X9 (X9 = Ti, V or Zr) powder, Cu-Si alloy powder, Cu-X9 (X9 = Ti, V or Zr) alloy powder, and Cu-Si-X9 (X9 = Ti, V or Zr) alloy powder, wherein the total of Si and X9 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 45) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Sn powder, and X10 (X10 = Ti or Zr) powder, in which the total of Sn and X10 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. 46) A metal powder for additive manufacturing consisting of a mixed powder of Cu-Sn alloy powder and Cu-X10 (X10 = Ti or Zr) alloy powder, in which the total of Sn and X10 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 47) A metal powder for additive manufacturing consisting of a Cu-Sn-X10 (X10 = Ti or Zr) alloy powder, in which the composition of the alloy powder is such that the sum of Sn and X10 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 48) Cu powder, Sn powder, X10 (X10 = Ti or Zr) powder, Cu-Sn alloy powder, Cu-X10 (X10 = Ti or Zr) alloy powder, Cu-Sn-X10 (X10 = Ti or Zr) alloy powder, any two or more of which are selected and mixed, and the mixed powder has a composition in which the sum of Sn and X10 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing. 49) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Hf powder, and X11 (X11 = Ni, P, Si, or Sn) powder, the mixed powder having a composition in which the sum of Hf and X11 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 50) A metal powder for additive manufacturing, comprising a mixed powder of Cu-Hf alloy powder and Cu-X11 (X11 = Ni, P, Si or Sn) alloy powder, in which the total of Hf and X11 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 51) A metal powder for additive manufacturing consisting of a Cu-Hf-X11 (X11 = Ni, P, Si, or Sn) alloy powder, in which the composition of the alloy powder is such that the sum of Hf and X11 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 52) A mixed powder obtained by selecting and mixing two or more of Cu powder, Hf powder, X11 (X11 = Ni, P, Si or Sn) powder, Cu-Hf alloy powder, Cu-X11 (X11 = Ni, P, Si or Sn) alloy powder, and Cu-Hf-X11 (X11 = Ni, P, Si or Sn) alloy powder, in which the total of Hf and X11 (X11 = Ni, P, Si or Sn) is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing. 53) A metal powder for additive manufacturing comprising a mixture of Cu powder, Nd powder, and Si powder, the composition of the mixture being such that the sum of Nd and Si is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 54) A metal powder for additive manufacturing comprising a mixed powder of Cu-Nd alloy powder and Si alloy powder, the mixed powder having a composition in which the sum of Nd and Si is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 55) A metal powder for additive manufacturing comprising a Cu-Nd-Si alloy powder, the composition of the alloy powder being such that the sum of Nd and Nd is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu. 56) A metal powder for additive manufacturing, which is a mixed powder obtained by selecting and mixing two or more of Cu powder, Nd powder, Si powder, Cu-Nd alloy powder, Cu-Si alloy powder, and Cu-Nd-Si alloy powder, wherein the total of Nd and Si is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu. 57) The metal powder for additive manufacturing according to any one of 1) to 56) above, characterized in that the metal powder has an average particle size D50 (median size) of 10 to 150 μm. 58) A method for producing an additive manufacturing method for producing an additive manufacturing object by an additive manufacturing method using the metal powder according to any one of 1) to 57) above. 59) A copper alloy additive manufacturing product produced by the manufacturing method described in 58) above. Effect of the Invention

[0007] According to the present invention, there is provided a metal powder for additive manufacturing in which the elements added to copper are appropriately selected, and an additive manufacturing object produced using the metal powder has the excellent effect of combining high electrical conductivity and high mechanical strength. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] When pure copper powder is used as the metal powder for additive manufacturing, the laser absorption rate is lower than that of other elements, so by using copper alloy powder or mixed powder, the laser absorption rate is higher than that of pure copper powder, depending on the added elements, and additive manufacturing properties can be improved. On the other hand, additive manufacturing objects are required to have high strength and high conductivity, and although copper alloys can be expected to improve mechanical strength by precipitation strengthening by precipitating added elements, the conductivity of pure copper is higher than that of other elements, so the conductivity of copper alloys is impaired by solid solution of added elements.

[0009] For this reason, the present invention aims to obtain an additively manufactured product having high strength by forming stable compounds between additive elements, suppressing solid solution of the additive elements, and precipitating these compounds in copper (parent phase) while taking advantage of the high electrical conductivity characteristic of pure copper in the additively manufactured product. More specifically, the present invention uses formation energy as a criterion for generating stable compounds between additive elements in the additively manufactured product, and is based on the finding that when formation energy is -0.3 eV or less, compounds of the additive elements precipitate from the copper parent phase, and precipitation strengthening can be expected.

[0010] (Selection of additive elements) The amount of solid solution in copper is an inherent property of the additive element, and can be extracted from a diagram showing the phase relationship of two elements with respect to temperature, generally called a "phase diagram." For example, it can be determined by referring to Phase Diagrams for Binary Alloys (ISBN: 0-87170-682-2) published by ASM International. From this phase diagram, various additive elements were selected by referring to the amount of solid solution in Cu and taking into consideration high electrical conductivity. Eleven elements that dissolve in copper at a concentration of 1.0 wt% or more (Zn, Si, Pt, Pd, Ni, Mn, Ge, Ga, Au, As, Al) were extracted. 25 elements that dissolve in copper at 0.1wt% or more but less than 1.0wt% (Zr, V, Ti, Tl, Sn, Sc, Sb, Rh, Pb, P, Mg, Li, Ir, In, Hg, Hf, H, Fe, Cr, Co, Cd, Bi, Be, B, Ag) were extracted. Furthermore, 32 elements (Ba, Bi, Ca, Gd, Eu, Ho, La, Lu, Mo, Nd, Nb, Os, Pb, Pm, Pu, Re, Ru, S, Se, Sr, Sm, Tb, Tc, Te, Th, Tm, U, V, W, Y, Yb, Zr) were selected as elements that form a solid solution in copper at 0.2 at% or less, and from the perspective of achieving both mechanical strength and electrical conductivity, eight elements - W, Zr, Nb, Nd, Y, Mo, Os, and Ru - were extracted from a new perspective.

[0011] Next, from the elements extracted above, elements were excluded based on the following criteria, and 20 elements (Zr, Nd, Si, Ni, Mn, V, Ti, Sc, Fe, Cr, Co, P, Zn, Ga, Al, Sn, In, Mg, Bi, Hf) were extracted. ·Nonmetal element (H) ·Precious metal elements (Os, Ru, Pt, Pd, Au, Rh, Ag) Harmful elements (Pb, Hg, Cd, Be, Ge, As, Tl, Sb) Hazardous elements (Y, Li) -Elements that are difficult to atomize because their single metal melting point is over 1800℃ (W, Nb, Mo, Ir, B)

[0012] For the 20 elements mentioned above, the Materials Project database was used to extract combinations of additive elements that would produce compounds with a formation energy of -0.3 eV or less, and the composition of the compounds. Furthermore, from the extracted binary additive elements, those in which each additive element is soluble in copper at 0.1 at% or more were extracted. The results are shown below.

[0013] (Cu-Al-X1 system: X1 is Co, Fe, Sc, Ti, Zr or Hf) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Al and X1. The total content of Al and X1 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Al-X1 alloy, it is also possible to use a mixture of Cu powder, Al powder, and X1 powder, or a Cu-Ni alloy and a Cu-X1 alloy in appropriate combination as the metal powder, considering that the alloy is formed by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0014] [Table 1]

[0015] (Cu-Bi-X2 system: X2 is Sc or Zr) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Bi and X2. The total content of Bi and X2 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Bi-X2 alloy, it is also possible to use a mixture of Cu powder, Bi powder, and X2 powder, or a Cu-Bi alloy and a Cu-X2 alloy in appropriate combination as the metal powder, in consideration of alloying by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0016] [Table 2]

[0017] (Cu-Co-X3 system: X3 is P, Si or Hf) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Co and X3. The total content of Co and X3 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Co-X3 alloy, it is also possible to use a mixture of Cu powder, Co powder, and X3 powder, or a Cu-Co alloy and a Cu-X3 alloy in appropriate combination as the metal powder, considering that the alloy is formed by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0018] [Table 3]

[0019] (Cu-Cr-X4 system: X4 is P or Si) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Cr and X3. The total content of Cr and X4 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Cr-X4 alloy, it is also possible to use a mixture of Cu powder, Cr powder, and X4 powder, or a Cu-Cr alloy and a Cu-X4 alloy in appropriate combination as the metal powder, in consideration of alloying by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0020] [Table 4]

[0021] (Cu-Fe-X5 system: X5 is P, Si, Ti or Hf) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Fe and X5. The total content of Fe and X5 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Fe-X5 alloy, it is also possible to use a mixture of Cu powder, Fe powder, and X5 powder, or a Cu-Fe alloy and a Cu-X5 alloy in appropriate combination as the metal powder, considering that the alloy is formed by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the calculation results of the formation energy when the concentration of the additive element is changed are shown.

[0022] [Table 5]

[0023] (Cu-Ga-X6 system: X6 is Sc, Ti, Zr or Hf) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Ga and X6. The total content of Ga and X6 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Ga-X6 alloy, it is also possible to use a mixture of Cu powder, Ga powder, and X6 powder, or a Cu-Ga alloy and a Cu-X6 alloy in appropriate combination as the metal powder, considering that the alloy is formed by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0024] [Table 6]

[0025] (Cu-In-Sc system) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is In and Sc. The total content of In and Sc is 0.01 at% or more and less than 0.3 at%. Here, it is sufficient that the additively manufactured product is a Cu-In-Sc alloy. In consideration of alloying by an electron beam or laser beam during manufacturing, a mixed powder of Cu powder, In powder, and Sc powder, or a Cu-In alloy and a Cu-Sc alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0026] [Table 7]

[0027] (Cu-Ni-X6 system: X6 is Sc, Ti, Zr or Hf) Ni and X6 are examples of combinations of additive elements that generate a compound with a formation energy of -0.3 eV or less. The total content of Ni and X5 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured object is a Cu-Ni-X6 alloy, if alloying is performed by an electron beam or laser beam during manufacturing, a mixed powder of Cu powder, Ni powder, and X6 powder, or a Cu-Ni alloy and a Cu-X6 alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0028] [Table 8]

[0029] (Cu-P-X7 system: X7 is Nb, Sc, Ti, V or Zr) P and X7 are examples of combinations of additive elements that generate a compound with a formation energy of -0.3 eV or less. The total content of P and X7 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-P-X7 alloy, it is also possible to use a mixture of Cu powder, P powder, and X7 powder, or a Cu-P alloy and a Cu-X7 alloy in appropriate combination as the metal powder, considering that the alloy is formed by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0030] [Table 9]

[0031] (Cu-Sc-X8 system: X8 is Si, Sn or Zn) Sc and X8 are examples of combinations of additive elements that generate compounds with a formation energy of -0.3 eV or less. The total content of Sc and X8 is 0.01 at% or more and less than 0.3 at%. Here, it is sufficient that the additively manufactured object is a Cu-Sc-X8 alloy, so considering that the additively manufactured object is alloyed by an electron beam or laser beam during manufacturing, a mixed powder of Cu powder, Sc powder, and X8 powder, or a Cu-Sc alloy and a Cu-X8 alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0032] [Table 10]

[0033] (Cu-Si-X9 system: X9 is Ti, V or Zr) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Si and X9. The total content of Si and X9 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Si-X9 alloy, it is also possible to use a mixture of Cu powder, Si powder, and X9 powder, or a Cu-Si alloy and a Cu-X9 alloy in appropriate combination as the metal powder, considering that the alloy is formed by an electron beam or a laser beam during manufacturing. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0034] [Table 11]

[0035] (Cu-Sn-X10 system: X10 is Ti or Zr) A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Sn and X10. The total content of Sn and X10 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured product is a Cu-Sn-X10 alloy, if alloying is performed by an electron beam or laser beam during manufacturing, a mixed powder of Cu powder, Sn powder, and X10 powder, or a Cu-Sn alloy and a Cu-X10 alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0036] [Table 12]

[0037] (Cu-Hf-X11 system: X11 is Ni, P, Si or Sn) Hf and X11 are examples of combinations of additive elements that generate a compound with a formation energy of -0.3 eV or less. The total content of Hf and X11 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the additively manufactured object is a Cu-Hf-X11 alloy, if alloying is performed by an electron beam or laser beam during manufacturing, a mixed powder of Cu powder, Hf powder, and X11 powder, or a Cu-Hf alloy and a Cu-X11 alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0038] [Table 13]

[0039] (Cu-Nd-Si system) Nd and Si are examples of combinations of additive elements that generate compounds with a formation energy of -0.3 eV or less. The total content of Nd and Si is 0.01 at% or more and less than 0.3 at%. Here, it is sufficient that the additively manufactured product is a Cu-Nd-Si alloy. In consideration of alloying by an electron beam or laser beam during manufacturing, a mixed powder of Cu powder, Nd powder, and Si powder, or a Cu-Nd alloy and a Cu-Si alloy can be used as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.

[0040] [Table 14]

[0041] Here, the content of the added element can be measured, for example, by ICP-OES (inductively coupled plasma optical emission spectrometry) of SPS3500DD manufactured by SII Corporation.

[0042] The metal powder preferably has an average particle size D50 of 10 to 150 μm. By setting the average particle size D50 to 20 μm or more, the powder is less likely to fly around during modeling, making it easier to handle. By setting the average particle size D50 to 150 μm or less, the powder melts smoothly, making it possible to produce a highly precise layered object. The average particle diameter D50 refers to the diameter of a circle corresponding to the area calculated from an image of a particle obtained by microscopic image analysis, and is the particle diameter at an integrated value of 50% in the particle size distribution. For example, it can be measured using a dry particle image analyzer, Morphologi G3, manufactured by Spectris Co., Ltd. (Malvern Division).

[0043] (Metal Powder Manufacturing Method) The metal powder may be a copper alloy powder produced by a known method. If the particle size is several μm or more, it is common to use a metal powder produced by a dry method, such as the atomization method, which is industrially superior in manufacturing cost, but it is also possible to use a metal powder produced by a wet method, such as a reduction method. Specifically, the alloy components in a molten state are dropped from the bottom of a tundish and contacted with high-pressure gas or high-pressure water to rapidly cool and solidify the alloy components, thereby powdering the alloy components. In addition, the metal powder may be produced by, for example, a plasma atomization method or a centrifugal atomization method. By using the metal powder obtained by these manufacturing methods, a dense layered object tends to be obtained.

[0044] (Method of manufacturing laminated objects) As long as the method uses the metal powder according to the present embodiment, the specific means is not particularly limited. For example, it can be manufactured by the following method. First, a thin layer of metal powder is formed on a modeling stage, and this thin layer is irradiated with an electron beam or a laser beam according to a program inputted into the device to melt it, and then cooled and solidified. Next, the modeling stage is slid, and a thin layer of metal powder is formed again, and then irradiated with an electron beam or a laser beam to melt it, and then cooled and solidified. By repeating this series of steps, a layered object of a programmed shape can be manufactured. [Industrial Applicability]

[0045] The metal powder according to the present invention has an increased absorption rate of laser light and can be efficiently melted by a laser, and is particularly useful for additive manufacturing applications to produce metal parts that have complex shapes and require high electrical conductivity and high strength (heat sinks and heat exchangers for heat dissipation, connector materials for electronic components, mechanical components for aerospace use, etc.).

Claims

1. A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Al powder, and X1 (X1 = Co, Sc or Ti) powder, the mixed powder having a composition in which the sum of Al and X1 is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.

2. A metal powder for additive manufacturing, comprising a mixed powder of Cu-Al alloy powder and Cu-X1 (X1=Co, Sc or Ti) alloy powder, the mixed powder having a composition in which the sum of Al and X1 is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.

3. A metal powder for additive manufacturing, which is made of a Cu-Al-X1 (X1 = Co, Sc or Ti) alloy powder, and the composition of the alloy powder is such that the sum of Al and X1 is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.

4. A mixed powder obtained by selecting and mixing two or more of Cu powder, Al powder, X1 (X1=Co, Sc or Ti) powder, Cu-Al alloy powder, Cu-X1 (X1=Co, Sc or Ti) alloy powder, and Cu-Al-X1 (X1=Co, Sc or Ti) alloy powder, wherein the total of Al and X1 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.

5. A metal powder for additive manufacturing according to any one of claims 1 to 4, characterized in that the average particle diameter D50 (median diameter) of the metal powder is 10 to 150 μm.

6. A method for manufacturing an additively molded object, comprising the steps of: manufacturing an additively molded object by an additive manufacturing method using the metal powder described in any one of claims 1 to 4.

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