Method for manufacturing package substrate and package substrate

Abstract

To provide a manufacture method of a package substrate, capable of improving a wiring density, and provide the package substrate.SOLUTION: A method contains: a step of providing a bottom plate where a first wire layer is installed, installing a demand point to the first wire layer, and installing a first region to be saved on one side of the demand point; a step of processing a first intermediate insulation layer containing a first intermediate insulation dielectric body coating the first region to be saved onto the bottom plate; a step of partially being installed onto the first intermediate insulation dielectric layer on the first intermediate insulation layer, and processing the first intermediate wiring layer containing the first intermediate wire connected to the demand point; a step of being laminated onto the bottom plate onto the first intermediate wiring layer, and processing the first insulation layer that coats the first intermediate wiring layer; and a step of processing a wiring build-up layer onto the first insulation layer.EFFECT: The first interval wiring layer is processed between adjacent two wiring layers to realize a local step wiring, and allow a realization of a thinner build-up layer structure.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to the technical field of semiconductor packages, and in particular to a method for manufacturing a package substrate and a package substrate. [Background technology]

[0002] In the related technology of semiconductor packaging, metal lines are generally arranged on different circuit layers, and adjacent circuit layers are isolated by insulating dielectric layers, and metal lines on the same circuit layer are located in the same wiring plane. When there is a fault area between two demand points located on the same circuit layer, the related technology generally extends the connection line to avoid the fault area, or arranges the connection line on an adjacent circuit layer to avoid the fault area, and connects it by an interlayer via hole. The former causes an increase in the wiring area and an increase in wiring difficulty, while the latter requires wiring after build-up, making the package substrate thicker, and processing an interlayer via hole, which increases the design difficulty. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and therefore provides a method for manufacturing a package substrate and the package substrate, which can improve wiring density. [Means for solving the problem]

[0004] In one aspect, an embodiment of the present invention provides a method of making a packaging substrate, the method comprising: providing a bottom plate on which a first line layer is installed, wherein at least one demand point is installed on the first line layer, and a first area to be evacuated is installed on one side of the demand point; Processing a first intermediate insulating layer on the bottom plate, the first intermediate insulating layer including a first intermediate insulating dielectric covering the first region to be removed; fabricating a first intermediate wiring layer on the first intermediate dielectric layer, the first intermediate wiring layer including a first intermediate line partially disposed on the first intermediate dielectric and connected to the demand point; A step of processing a first insulating layer on the first intermediate wiring layer, the first insulating layer being laminated on the bottom plate and covering the first intermediate wiring layer; and processing a line build-up layer on the first insulating layer.

[0005] According to some embodiments of the present invention, prior to the step of providing a base plate, the method further comprises: providing a core plate having opposing faces, the core plate having a package cavity disposed therein and extending through the opposing faces of the core plate; machining a temporary support surface on the bottom of the package cavity on the core plate; mounting an electronic component in the package cavity, the electronic component having an active surface connected to the temporary support surface; packaging the package cavity with a package material; removing the temporary support surface to expose connection terminals on an active surface of the electronic component; The method further includes a step of processing the first circuit layer on the core plate to form the bottom plate, at least one of the demand points being connected to a connection terminal on the active surface of the electronic component.

[0006] According to some embodiments of the present invention, prior to the step of providing a base plate, the method further comprises: providing a core plate having opposing faces, the core plate having a package cavity disposed therein and extending through the opposing faces of the core plate; machining a temporary support surface on the bottom of the package cavity on the core plate; mounting an electronic component in the package cavity having opposing active surfaces and a passive surface connected to the temporary support surface; performing a packaging process on the package cavity with a package material to form a first package body; A step of processing a conductive hole on the first package body to be connected to a connection terminal of an active surface of the electronic component; The method further includes a step of processing the first circuit layer on the core plate so as to form the bottom plate, at least one of the demand points being connected to the conductive hole.

[0007] According to some embodiments of the present invention, a package cavity in which an electronic component is packaged is provided on the bottom plate and is located in the first region to be removed, and the step of processing a first intermediate insulating layer on the bottom plate includes: processing a first intermediate insulating dielectric covering the package cavity on the bottom plate at a position corresponding to the first region to be removed; and opening a window in the first interlevel insulating dielectric to expose the electronic component.

[0008] According to some embodiments of the present invention, the step of fabricating a first intermediate insulating layer on the bottom plate comprises: fabricating a photosensitive insulating dielectric material on the bottom plate; performing a pattern transfer onto the photosensitive insulating dielectric material so as to hold the photosensitive insulating dielectric material located in the first region to be removed; and curing the photosensitive insulating dielectric material after pattern transfer to form the first interlayer insulating layer, thereby obtaining the first interlayer insulating dielectric.

[0009] According to some embodiments of the present invention, the photosensitive insulating dielectric material is a dry film type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate includes a step of pressing the dry film type photosensitive insulating dielectric material covering the first line layer onto the bottom plate; or Alternatively, the photosensitive insulating dielectric material is a liquid type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate includes a step of applying the liquid type photosensitive insulating dielectric material onto the bottom plate, covering the first line layer.

[0010] In another aspect, an embodiment of the present invention provides a package substrate manufactured by the above method for making a package substrate.

[0011] In yet another aspect, embodiments of the present invention provide a package substrate, comprising: The present invention includes a bottom plate on which a first line layer is installed, wherein at least one demand point is installed on the first line layer and a first area to be evacuated is installed on one side of the demand point; a first intermediate insulation layer including a first intermediate insulation dielectric that is installed on the bottom plate and covers the first area to be evacuated; a first intermediate wiring layer that is partially installed on the first intermediate insulation dielectric and includes a first intermediate line connected to the demand point; a first insulation layer that is stacked on the bottom plate and covers the first intermediate wiring layer; and a line build-up layer that is installed on the first insulation layer.

[0012] According to some embodiments of the present invention, an electronic component is packaged within the base plate, and at least one of the demand points is connected to a connection terminal of an active surface of the electronic component.

[0013] According to some embodiments of the present invention, at least one of a line, a pad, and an electronic component is placed in the first area to be evacuated.

[0014] The embodiments of the present invention have at least the following beneficial effects:

[0015] According to an embodiment of the present invention, a first intermediate wiring layer can be processed between two adjacent circuit layers to realize localized step wiring, and a thinner build-up layer structure can be realized, which is advantageous for improving wiring density.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The above and / or additional aspects and advantages of the present invention will become apparent and will be more easily understood from the following detailed description of the embodiments taken in conjunction with the drawings. [Brief description of the drawings]

[0017] [Figure 1] 2 is a step flowchart of a method for fabricating a package substrate according to an embodiment of the present invention. [Diagram 2] 2 is a schematic diagram of the structure of a package substrate in an intermediate process of the method for producing the package substrate shown in FIG. 1. [Diagram 3] 2 is a schematic diagram of the structure of a package substrate in an intermediate process of the method for producing the package substrate shown in FIG. 1. [Figure 4] 2 is a schematic diagram of the structure of a package substrate in an intermediate process of the method for producing the package substrate shown in FIG. 1. [Diagram 5] 2 is a schematic diagram of the structure of a package substrate in an intermediate process of the method for producing the package substrate shown in FIG. 1. [Figure 6] 2 is a schematic diagram of the structure of a package substrate in an intermediate process of the method for producing the package substrate shown in FIG. 1. [Figure 7] 1 is a schematic plan view of a package substrate according to an embodiment of the present invention; [Figure 8] FIG. 2 is a second schematic diagram of a planar structure of a package substrate according to an embodiment of the present invention. [Figure 9] 1 is a schematic cross-sectional view of a package substrate according to an embodiment of the present invention; [Figure 10] FIG. 2 is a second schematic diagram of a cross-sectional structure of a package substrate according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] In the following, the embodiments of the present invention will be described in detail, and examples of the embodiments are shown in the drawings, in which the same or similar reference numerals throughout indicate the same or similar elements, or elements having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and are only used to interpret the present invention, and should not be understood as limiting the present invention.

[0019] In the description of the present invention, "several" means one or more, "plurality" means two or more, terms such as "greater than", "less than", "exceeding", etc. are understood as exclusive of a number, and terms such as "greater than", "less than", "within", etc. are understood as inclusive of a number. Where "first", "second", etc. are described, they are merely intended to distinguish technical features and should not be understood as indicating or implying a relative importance, or implying the number of the indicated technical features, or implying the context of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly limited, the terms "installation", "connection" and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above terms in the present invention in combination with the specific content of the technical solutions.

[0021] In the description of this embodiment, the steps of the method are numbered consecutively for ease of review and understanding, and the implementation order between the steps may be adjusted in accordance with the overall technical solution of this embodiment and the logical relationship between each step, without affecting the technical effect achieved by the technical solution of the present invention.

[0022] 1, the present embodiment discloses a method for manufacturing a package substrate. The method includes steps S100 to S500. Here, the details of each step are as follows:

[0023] S100: Referring to FIG. 2, a base plate 100 is provided on which a first line layer 120 is installed, and at least one demand point 121 is installed on the first line layer 120, and a first evacuation area 122 is installed on one side of the demand point 121.

[0024] S200: Referring to FIG. 3 and FIG. 4, a first intermediate insulating layer 200 is fabricated on the bottom plate 100, the first intermediate insulating layer 200 including a first intermediate insulating dielectric 210 covering the first region 122 to be evacuated.

[0025] S300: Referring to FIG. 5 , on the first intermediate insulation layer 200, a first intermediate wiring layer 300 is processed, the first intermediate wiring layer 300 including a first intermediate line 310 partially disposed on the first intermediate insulation dielectric 210 and connected to the demand point 121.

[0026] S400: Referring to FIG. 6, on the first intermediate wiring layer 300, a first insulating layer 400 that is laminated on the bottom plate 100 and covers the first intermediate wiring layer 300 is processed.

[0027] S500: Still referring to FIG. 6, process a line build-up layer 500 on the first insulating layer 400.

[0028] 2 to 6, the bottom plate 100 of this embodiment may be a single-sided plate, a double-sided plate, or a multi-layer plate. In the case of a single-sided plate, the first circuit layer 120 is a single-sided wiring structure, that is, the bottom plate 100 includes a core plate 110 and a first circuit layer 120 installed on one side of the core plate 110. In the case of a double-sided plate, the first circuit layer 120 is a double-sided wiring structure, and the bottom plate 100 includes a core plate 110 and a first circuit layer 120 installed on both opposing sides of the core plate 110, and the first circuit layers 120 located on different sides of the core plate 110 are connected by an interlayer conductive structure, where the interlayer conductive structure may be a structure such as a copper post or a conductive hole. In the case of a multi-layer board, the bottom plate 100 includes a core plate 110, an inner wiring layer, and a first wiring layer 120, which are stacked in sequence, and similar to single-sided and double-sided boards, the inner wiring layer and the first wiring layer 120 may be a single-sided wiring structure or a double-sided wiring structure.

[0029] In wiring, shortening the wiring interval is one of the means to improve the wiring density and realize a compact design. However, in an actual wiring process, it has been discovered that a certain demand point 121, such as an end of a line, a pad, or a connection terminal of an electronic device embedded in the bottom plate 100, has a limited wiring area, and when wiring structures such as lines, pads, or heat dissipation blocks are arranged around the demand point 121, the demand point 121 cannot perform line extension or line connection with other demand points 121. In this case, in order to facilitate wiring evacuation, it is necessary to regard the area where the structures such as lines, pads, or heat dissipation blocks are located outside the demand point 121 as the first evacuation area 122.

[0030] In the case of limited planar wiring space, it is very difficult to optimize the wiring, so in this embodiment, the wiring space is changed from a planar wiring space to a three-dimensional wiring space, and the first intermediate insulating dielectric 210 covers the first area 122 to be evacuated, so that a new wiring area is processed on the first area 122 to be evacuated, thereby realizing local step wiring. In addition, the height of the first intermediate insulating layer 200 relative to the surface of the bottom plate 100 is higher than the first circuit layer 120 and lower than the first insulating layer 400 that follows it. Compared with the method of arranging the connection lines on adjacent circuit layers in the related art, this embodiment makes full use of the wiring space in the thickness direction, wires between adjacent circuit layers, realizes a thinner build-up layer structure, meets the requirement for high-density wiring, and reduces the thickness of the package substrate. Furthermore, according to the needs of actual applications, the shape and area of ​​the first intermediate insulating dielectric 210 can be adaptively adjusted, for example, the planar projection shape of the first intermediate insulating dielectric 210 onto the bottom plate 100 may be rectangular, circular, annular, or irregular, etc.

[0031] In this embodiment, the first intermediate wiring layer 300 is processed on the first intermediate insulating layer 200, and the first intermediate line 310 and the first line layer 120 can be isolated by the first intermediate insulating dielectric 210, so as to meet the wiring requirements. In addition, the wiring manner of the first intermediate line 310 can be flexibly adjusted according to the actual application. For example, referring to FIG. 7 and FIG. 8, the number of demand points 121 can be one, two, or three or more, and the first intermediate line 310 has a loop structure, a straight structure, a T-shaped structure, or a branch structure with multiple ends, etc., and the first intermediate line 310 is disposed on the first intermediate insulating dielectric 210, and the ends of the first intermediate line 310 are connected to the demand points 121. In addition, the first intermediate wiring layer 300 can be processed by a process such as a Tenting masking method, a SAP semi-additive method, or an MSAP modified semi-additive method. Compared with the method of arranging the connecting line in an adjacent line layer, the first intermediate line 310 of this embodiment is directly connected to the demand point 121, and can omit the interlayer conductive structure such as a conductive hole or a copper post, thereby eliminating the manufacturing process of the interlayer conductive structure, which is advantageous for improving manufacturing efficiency and saving manufacturing costs.

[0032] After completing the fabrication of the first intermediate wiring layer 300, the first insulating layer 400 is processed on the first intermediate wiring layer 300 by lamination and compression bonding, and the line build-up layer 500 is processed on the first insulating layer 400, thereby achieving the fabrication of a multi-layer line.

[0033] 9, in some applications, it is necessary to embed an electronic component 010 in the bottom plate 100 to improve the functional diversity of the package substrate. The electronic component 010 may be an active device such as a chip, or a passive device such as a resistor. Therefore, before the step of providing the bottom plate 100, the method for making the package substrate further includes the following steps:

[0034] S011: A core plate 110 having opposing surfaces is provided, and a package cavity penetrating the opposing surfaces of the core plate 110 is provided in the core plate 110.

[0035] S012: A temporary support surface (not shown) is processed on the bottom of the package cavity on the core plate 110. For example, an adhesive sheet or tape is attached on the core plate 110 so that a temporary support surface is formed on the bottom of the package cavity.

[0036] S013: An electronic component 010, whose active surface is connected to the temporary support surface, is mounted in the package cavity.

[0037] S014: Perform packaging process on the package cavity with the package material, where the package material adopts a photosensitive medium material, for example a dry film type photosensitive medium material or a liquid type photosensitive medium material, and packages the electronic component 010 in the package cavity with the package material, thereby realizing the embedding process of the electronic component 010, and reducing the space occupied by the planar wiring of the electronic component 010, which is favorable for improving the integration density.

[0038] S015: The temporary support surface is removed so that the connection terminals on the active surface of the electronic component 010 are exposed.

[0039] S016: Process the first circuit layer 120 on the core plate 110 to form the bottom plate 100, and at least one demand point 121 of the first circuit layer 120 is connected to the connection terminal on the active surface of the electronic component 010. Before processing the first circuit layer 120, a through hole can be processed by drilling such as a laser drill or a mechanical drill on the core plate 110, and the through hole can be plated to form a conductive hole. Of course, a copper post can be precast on the core plate 110 to realize interlayer conduction.

[0040] In this application example, the connection terminal on the active surface of the electronic component 010 is connected to the demand point 121, and by processing the first intermediate wiring layer 300 on the first intermediate insulating layer 200, the wiring structure around the electronic component 010 can be retracted, thereby realizing flexible wiring of the electronic component 010.

[0041] In some other applications (not shown), it is also necessary to embed the electronic component 010 in the bottom plate 100, but the mounting orientation of the electronic component 010 is different from the above application in that the passive surface and the temporary support surface are connected. Therefore, before the step of providing the bottom plate 100, the method for manufacturing the package substrate further includes the following steps:

[0042] S021: A core plate 110 having opposing surfaces is provided, and a package cavity penetrating the opposing surfaces of the core plate 110 is provided in the core plate 110.

[0043] S022: On the core plate 110, a temporary support surface is processed on the bottom of the package cavity. For example, an adhesive sheet or an adhesive tape is attached on the core plate 110 so that a temporary support surface is formed on the bottom of the package cavity.

[0044] S023: An electronic component 010 having opposing active and passive surfaces, with the passive surface connected to a temporary support surface, is mounted in the package cavity.

[0045] S024: A packaging process is performed on the package cavity using a package material to form a first package body.

[0046] S025: A conductive hole is machined on the first package body, and the conductive hole is connected to a connection terminal of the active surface of the electronic component 010, where the processing of the conductive hole can be performed by obtaining a through hole by a mechanical drill or a laser drill, and can be performed by plating the through hole.

[0047] S026: A first circuit layer 120 is processed on the core plate 110 to form the bottom plate 100, and at least one demand point 121 therein is connected to the through hole.

[0048] In some other application examples, a package cavity is provided on the bottom plate 100 in which an electronic component 010 located in the first area to be evacuated 122 is packaged, and the step of processing the first intermediate insulating layer 200 on the bottom plate 100 includes the following steps:

[0049] S031: On the bottom plate 100, a first intermediate insulating dielectric 210 for covering the package cavity is processed at a position corresponding to the first region 122 to be removed.

[0050] S032: A window is opened in the first intermediate insulating dielectric 210 so that the electronic component 010 is exposed.

[0051] Referring to FIG. 10 , a window opening process can be performed on the first intermediate insulating dielectric 210 to form a cavity 211 on the first intermediate insulating dielectric 210, and according to the actual wiring needs, the cavity 211 can adjust the wiring to the first intermediate line 310, which is advantageous for realizing flexible wiring.

[0052] In the above discussion, the steps of processing the first intermediate insulating layer 200 on the bottom plate 100 include the following steps.

[0053] S210: Process a photosensitive insulating dielectric material on the bottom plate 100.

[0054] S220: A pattern transfer process including exposure and development is performed on the photosensitive insulating dielectric material so as to hold the photosensitive insulating dielectric material located in the first retreat area 122.

[0055] S230: Curing the photosensitive insulating dielectric material after the pattern transfer to form the first interlayer insulating layer 200, and obtaining the first interlayer insulating dielectric 210.

[0056] Specifically, the photosensitive insulating dielectric material is a dry film type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate 100 includes the steps of pressing the dry film type photosensitive insulating dielectric material covering the first circuit layer 120 onto the bottom plate 100; Alternatively, the photosensitive insulating dielectric material is a liquid-type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the base plate 100 includes the step of applying a liquid-type photosensitive insulating dielectric material onto the base plate 100 to cover the first circuit layer 120.

[0057] This embodiment further provides a package substrate manufactured by the above-mentioned method for manufacturing a package substrate. This embodiment processes a first intermediate wiring layer 300 between two adjacent wiring layers, thereby realizing local step wiring, and realizing a thinner build-up layer structure, which is advantageous for improving wiring density.

[0058] The present embodiment further provides a package substrate including: a bottom plate 100 on which a first circuit layer 120 is installed, the first circuit layer 120 having at least one demand point 121 installed thereon and a first area to be evacuated 122 installed on one side of the demand point 121; a first intermediate insulating layer 200 installed on the bottom plate 100 and including a first intermediate insulating dielectric 210 covering the first area to be evacuated 122; a first intermediate wiring layer 300 partially installed on the first intermediate insulating dielectric 210 and including a first intermediate circuit 310 connected to the demand point 121; a first insulating layer 400 stacked on the bottom plate 100 and covering the first intermediate wiring layer 300; and a circuit build-up layer 500 installed on the first insulating layer 400.

[0059] In this embodiment, a first intermediate wiring layer 300 is processed between two adjacent circuit layers, making it possible to realize localized step wiring and a thinner build-up layer structure, which is advantageous for improving wiring density.

[0060] An electronic component 010 is packaged in the bottom plate 100, and at least one demand point 121 is connected to a connection terminal of the active surface of the electronic component 010; in this way, by arranging the first intermediate circuit 310 on the first intermediate insulating layer 200, the outer wiring structure of the electronic component 010 can be evacuated, thereby realizing flexible wiring of the electronic component 010.

[0061] At least one of the lines, pads, and electronic components 010 is placed in the first area to be evacuated 122. The first insulating dielectric can cover the first area to be evacuated 122 and isolate the first intermediate lines 310 from the lines, pads, or electronic components 010 in the first area to be evacuated 122, thereby realizing flexible wiring and improving wiring density.

[0062] Although the embodiment of the present invention has been described in detail above with reference to the drawings, the present invention is not limited to the above embodiment, and various modifications are possible within the scope of knowledge of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A method of manufacturing a semiconductor device, comprising the steps of: providing a core plate having opposing sides, the core plate having a package cavity disposed therein, the package cavity penetrating the opposing sides of the core plate; machining a temporary support surface on the bottom of the package cavity on the core plate; mounting an electronic component in the package cavity, the electronic component having an active surface connected to the temporary support surface; performing a packaging process on the package cavity with a package material; removing the temporary support surface to expose connection terminals on an active surface of the electronic component; A step of processing a first circuit layer on the core plate to form a bottom plate, in which at least a first demand point and a second demand point are provided on the first circuit layer, a first region to be evacuated is provided between the first demand point and the second demand point, and at least the first demand point and the second demand point are connected to a connection terminal on an active surface of the electronic component; Processing a first intermediate insulating layer on the bottom plate, the first intermediate insulating layer including a first intermediate insulating dielectric covering the first region to be removed; fabricating a first intermediate wiring layer on the first intermediate dielectric layer, the first intermediate wiring layer including a first intermediate line partially disposed on the first intermediate dielectric and directly connected to the first demand point and the second demand point; a step of processing a first insulating layer on the first intermediate wiring layer, the first insulating layer being laminated on the bottom plate and covering the first intermediate wiring layer; and processing a line build-up layer on the first insulating layer.

2. A package cavity in which an electronic component is packaged is provided on the bottom plate and is located within the first region to be evacuated, and the step of processing a first intermediate insulating layer on the bottom plate includes: processing a first intermediate insulating dielectric covering the package cavity on the bottom plate at a position corresponding to the first region to be removed; 2. The method of claim 1, further comprising the step of: opening a window in the first interlayer insulating dielectric to expose the electronic component.

3. The step of processing a first intermediate insulating layer on the bottom plate includes: fabricating a photosensitive insulating dielectric material on the bottom plate; performing a pattern transfer onto the photosensitive insulating dielectric material so as to hold the photosensitive insulating dielectric material located in the first region to be removed; 2. The method for manufacturing a package substrate according to claim 1, further comprising: curing the photosensitive insulating dielectric material after pattern transfer to form the first intermediate insulating layer, thereby obtaining the first intermediate insulating dielectric.

4. The photosensitive insulating dielectric material is a dry film type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate includes a step of pressing the dry film type photosensitive insulating dielectric material covering the first circuit layer onto the bottom plate, or Alternatively, the photosensitive insulating dielectric material is a liquid type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate includes a step of applying the liquid type photosensitive insulating dielectric material covering the first line layer onto the bottom plate.

5. A method of manufacturing a packaging cavity comprising the steps of: providing a core plate having opposing sides, the core plate having a packaging cavity extending through the opposing sides of the core plate; machining a temporary support surface on the bottom of the package cavity on the core plate; mounting an electronic component in the package cavity having opposing active surfaces and a passive surface connected to the temporary support surface; performing a packaging process on the package cavity with a package material to form a first package body; processing a conductive hole on the first package body to be connected to a connection terminal on an active surface of the electronic component; A step of processing a first circuit layer on the core plate to form a bottom plate, in which at least a first demand point and a second demand point are provided on the first circuit layer, a first region to be evacuated is provided between the first demand point and the second demand point, and at least the first demand point and the second demand point are connected to the conductive hole; Processing a first intermediate insulating layer on the bottom plate, the first intermediate insulating layer including a first intermediate insulating dielectric covering the first region to be removed; fabricating a first intermediate wiring layer on the first intermediate dielectric layer, the first intermediate wiring layer including a first intermediate line partially disposed on the first intermediate dielectric and directly connected to the first demand point and the second demand point; a step of processing a first insulating layer on the first intermediate wiring layer, the first insulating layer being laminated on the bottom plate and covering the first intermediate wiring layer; and processing a line build-up layer on the first insulating layer.

6. A package cavity is provided on the bottom plate, the package cavity being located in the first region to be removed and in which an electronic component is packaged. The step of processing a first intermediate insulating layer on the bottom plate includes: processing a first intermediate insulating dielectric covering the package cavity on the bottom plate at a position corresponding to the first region to be removed; 6. The method of claim 5, further comprising the step of: opening a window in the first interlayer insulating dielectric to expose the electronic component.

7. The step of fabricating a first intermediate insulating layer on the bottom plate includes: fabricating a photosensitive insulating dielectric material on the bottom plate; performing a pattern transfer onto the photosensitive insulating dielectric material so as to hold the photosensitive insulating dielectric material located in the first region to be removed; 6. The method for manufacturing a package substrate according to claim 5, further comprising: curing the photosensitive insulating dielectric material after pattern transfer to form the first intermediate insulating layer, thereby obtaining the first intermediate insulating dielectric.

8. The photosensitive insulating dielectric material is a dry film type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate includes a step of pressing the dry film type photosensitive insulating dielectric material covering the first line layer onto the bottom plate; Alternatively, the photosensitive insulating dielectric material is a liquid type photosensitive insulating dielectric material, and the step of processing the photosensitive insulating dielectric material on the bottom plate includes a step of applying the liquid type photosensitive insulating dielectric material covering the first line layer onto the bottom plate.

Images