Package structure having adhesive layer and packaging method thereof

Abstract

To provide a package structure having an adhesion layer.SOLUTION: A package structure includes a first rewiring layer 110, an adhesion layer 120, and a first electronic element 130. The first rewiring layer 110 includes a first upper surface 111 and a first lower surface 112. The first upper surface 111 has upper bumps 111a and the first lower surface 112 has conductive pads 112a. The adhesion layer 120 is located on the first upper surface 111 of the first rewiring layer 110 and surrounds the upper bumps 111a. The first electronic element 130 is mounted on the adhesion layer 120. The first electronic element 130 includes a first active surface and multiple conductors. The conductors are exposed on the first active surface. The first active surface faces toward the first upper surface 111. Each conductor is connected to each upper bump 111a. Two adhesion surfaces of the adhesion layer 120 are adhered to the first upper surface 111 and the first active surface respectively.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a package structure and a packaging method thereof, and more particularly to a package structure with an adhesive layer and a packaging method thereof. [Background technology]

[0002] Currently, semiconductor packaging is developing towards higher density structures to increase the signal transmission speed and power density of semiconductor chips. A common package structure is stacking different dies vertically with through silicon vias (TSVs), transmitting signals through the metal of the through silicon vias, and allowing different dies to be placed in the same package structure with redistribution layers (RDLs). Summary of the Invention [Problem to be solved by the invention]

[0003] However, in the conventional packaging technology described above, when the die and the redistribution layer are bonded by thermocompression, the die itself is easily warped due to stress, which affects the bonding strength. In addition, the position deviation is easily generated between the solder bumps of the die and the bonding bumps of the redistribution layer, which reduces the contact area between the bumps and affects the bonding strength.

[0004] Therefore, the present inventors believed that the above-mentioned drawbacks could be improved, and as a result of extensive research, they came to propose the present invention, which effectively improves the above-mentioned problems through rational design.

[0005] The present invention has been made in consideration of the above, and its object is to provide a more complex package structure by bonding a redistribution layer and an electronic element with an adhesive layer, thereby significantly increasing the bonding strength between the two elements. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention employs the following means. A package structure having an adhesive layer (120) according to one embodiment of the present invention includes a first redistribution layer (110), an adhesive layer (120), and a first electronic element (130). The first redistribution layer includes a first upper surface (111) and a first lower surface (112), the first upper surface having a plurality of upper bumps (111a), the first lower surface having a plurality of conductive pads, the adhesive layer is located on the first upper surface of the first redistribution layer, the adhesive layer surrounds the upper bumps, and the first electronic element is mounted on the adhesive layer. The first electronic element has a first active surface and a plurality of conductors, the conductors are exposed to the first active surface, the first active surface faces the first upper surface, and each of the conductors is connected to each of the upper bumps. Two adhesive surfaces of the adhesive layer are respectively attached to the first upper surface and the first active surface. The first electronic component includes a first encapsulant (131), a first die (132), a plurality of first solder bumps (133), and a second redistribution layer (134). The first solder bumps are located on the first die, the first encapsulant surrounds the first die and the first solder bumps, a first exposed surface (131a) of the first encapsulant exposes a first connecting surface (133a) of each of the first solder bumps, the first exposed surface is a first active surface of the first electronic component, and the first solder bumps are conductors of the first electronic component. The second redistribution layer has a second lower surface (134a) and a second upper surface (134b), a plurality of lower redistribution pads (134c) on the second lower surface are connected to the upper bumps, a plurality of upper redistribution pads (134d) on the second upper surface are connected to the first solder bumps, the second lower surface is a first active surface of the first electronic element, and the lower redistribution pads are conductors of the first electronic element.

[0007] In order to achieve the above object, the present invention further provides a packaging method for a packaging structure having an adhesive layer. The packaging method of the package structure with an adhesive layer according to the present invention includes the steps of: providing a first redistribution layer having a first upper surface having a plurality of upper bumps and a first lower surface having a plurality of conductive pads; forming an adhesive layer on the first redistribution layer, the adhesive layer being located on the first upper surface of the first redistribution layer and surrounding the upper bumps; planarizing the adhesive layer to expose the upper bumps to the adhesive layer; placing a first electronic element on the adhesive layer, the first electronic element having a first active surface and a plurality of conductors, the conductors being exposed to the first active surface and facing the first upper surface; and thermocompressing the first electronic element and the first redistribution layer to connect each of the conductors to each of the upper bumps, and the two adhesive surfaces of the adhesive layer being respectively attached to the first upper surface and the first active surface during thermocompression. Effect of the Invention

[0008] The present invention is configured as described above and therefore provides the effects described below. The present invention uses an adhesive layer to bond the first redistribution layer and the first electronic element, thereby significantly increasing the bonding strength between the first redistribution layer and the first electronic element, making the package structure more complex and simple in design, and improving the signal transmission speed and power density.

[0009] Other objects, configurations and effects of the present invention will become apparent from the following detailed description of the preferred embodiments of the present invention. [Brief description of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view showing a package structure according to a first embodiment of the present invention. [Diagram 2] FIG. 11 is a cross-sectional view showing a package structure according to a second embodiment of the present invention. [Diagram 3] FIG. 11 is a cross-sectional view showing a package structure according to a third embodiment of the present invention. [Figure 4] FIG. 11 is a cross-sectional view showing a package structure according to a fourth embodiment of the present invention. [Figure 5a] 4 is a flowchart showing a packaging method for the packaging structure according to the first embodiment of the present invention. [Figure 5b] 4 is a flowchart showing a packaging method for the packaging structure according to the first embodiment of the present invention. [Figure 5c] 4 is a flowchart showing a packaging method for the packaging structure according to the first embodiment of the present invention. [Figure 6a] 10 is a flowchart showing a packaging method of the packaging structure according to the third embodiment of the present invention. [Figure 6b] 10 is a flowchart showing a packaging method of the packaging structure according to the third embodiment of the present invention. [Figure 6c] 10 is a flowchart showing a packaging method of the packaging structure according to the third embodiment of the present invention. [Figure 7a] 10 is a flowchart showing a packaging method for the packaging structure according to the fourth embodiment of the present invention. [Figure 7b]10 is a flowchart showing a packaging method for the packaging structure according to the fourth embodiment of the present invention. [Figure 7c] 10 is a flowchart showing a packaging method for the packaging structure according to the fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following examples, and can be modified as desired without departing from the gist of the present invention. <First Example>

[0012] FIG. 1 is a cross-sectional view of a package structure 100 with an adhesive layer according to a first embodiment of the present invention. The package structure 100 includes a first redistribution layer 110, an adhesive layer 120, and a first electronic component 130. The first redistribution layer 110 includes a first upper surface 111 and a first lower surface 112, the first upper surface 111 having a plurality of upper bumps 111a, and the first lower surface 112 having a plurality of conductive pads 112a. The first redistribution layer 110 further includes at least one circuit layer and an insulating layer, the circuit layer being used to electrically connect between each of the upper bumps 111a and each of the conductive pads 112a, and the insulating layer being used to mount and insulate the metal layer. The implementation manner of the circuit layer in the first redistribution layer 110 is diverse and is not a main technical feature of the present invention, so it is only illustrated by a few blocks in the figure.

[0013] The adhesive layer 120 is located on the first upper surface 111 of the first redistribution layer 110 and surrounds the upper bumps 111a. In this embodiment, the adhesive layer 120 is formed by curing an organic adhesive material, and preferably, the thermal expansion coefficient of the adhesive layer 120 is similar to that of the insulating layer of the first redistribution layer 110, so as to prevent the occurrence of a problem of warping due to non-uniform thermal expansion in a subsequent high-temperature process. The first electronic element 130 is disposed on the adhesive layer 120, and the first electronic element 130 has a first active surface and a plurality of conductors, the conductors being exposed on the first active surface. The first active surface faces the first upper surface 111, and each of the conductors is connected to each of the upper bumps 111a. The two adhesive surfaces of the adhesive layer 120 are respectively attached to the first upper surface 111 and the first active surface.

[0014] 1, in this embodiment, the first electronic element 130 has a first encapsulant 131, a first die 132, and a plurality of first solder bumps 133, the first solder bumps 133 are located on the first die 132, the first encapsulant 131 surrounds the first die 132 and the first solder bumps 133, and the first connecting surfaces 133a of the first solder bumps 133 are exposed on a first exposed surface 131a of the first encapsulant 131. The first exposed surface 131a of the first encapsulant 131 is a first active surface of the first electronic element 130, and the first solder bumps 133 are conductors of the first electronic element 130. In this embodiment, the first encapsulant 131 is a package epoxy molding compound (EMC), and the first solder bumps 133 are a metal alloy or a single metal.

[0015] In this embodiment, the first solder bumps 133 of the first electronic element 130 are eutectic-bonded to the upper bumps 111a of the first redistribution layer 110 by thermocompression, the adhesive layer 120 is melted again by the heating temperature of the thermocompression and the first exposed surface 131a of the first electronic element 130 and the first upper surface 111 of the first redistribution layer 110 are bonded, the adhesive layer 120 is cooled and hardened after the thermocompression is completed, and the solvent in the adhesive layer 120 is volatilized by the heating of the thermocompression, thereby increasing the hardness. In this embodiment, the adhesive layer 120 is bonded to the first electronic element 130 and the first redistribution layer 110, and the eutectic bonding of the metal bumps not only greatly increases the bonding strength between the two elements, but also prevents the first electronic element 130 from warping during the thermocompression process, making the package structure 100 with the adhesive layer a more complex design.

[0016] 1, the adhesive package structure 100 further includes a plurality of conductive elements 140, which are located on the first lower surface 112 of the first redistribution layer 110 and connected to the conductive pads 112a, respectively. The conductive elements 140 connect the adhesive package structure 100 to other electronic elements such as a circuit board or a flexible circuit board, and transmit signals. In this embodiment, the conductive elements 140 are solder balls, and in other embodiments, the conductive elements 140 may be solder bumps, anisotropic conductive films (ACF), or wire bonding.

[0017] As shown in FIG. 1, in this embodiment, the first encapsulant 131 has two first dies 132, and in other embodiments, the first encapsulant 131 has only one or more first dies 132, but the present invention does not limit the number of first dies 132. <Second Example>

[0018] 2 is a cross-sectional view showing a package structure according to a second embodiment of the present invention. The difference between the first embodiment and the first embodiment is that the first redistribution layer 110 has two first electronic components 130, which are a CPU chip and a memory chip, respectively, and the two electronic components 130 are electrically connected to each other by the first redistribution layer 110 or conductively connected to a conductive element 140 located on the first lower surface 112 of the first redistribution layer 110, thereby achieving a SiP (System in Package) structure. <Third Example>

[0019] 3 is a cross-sectional view showing a package structure according to a third embodiment of the present invention. The difference between the first embodiment and the second embodiment is that the first electronic component 130 further includes a second redistribution layer 134, the second redistribution layer 134 includes a second lower surface 134a and a second upper surface 134b, the plurality of lower redistribution pads 134c on the second lower surface 134a are connected to the upper bumps 111a, and the plurality of upper redistribution pads 134d on the second upper surface 134b are connected to the first solder bumps 133. In this embodiment, the second lower surface 134a is the first active surface of the first electronic component 130, and the lower redistribution pads 134c are conductors of the first electronic component 130. The second redistribution layer 134 is provided to increase the contact area between each of the lower redistribution pads 134c and each of the upper bumps 111a, and the first electronic component 130 and the first redistribution layer 110 have a more flexible circuit layout. In addition, preferably, the second redistribution layer 134 has an insulator for support and insulation, and the insulator is made of an organic adhesive material or an organic polymer having a thermal expansion coefficient similar to that of the adhesive layer 120, which similarly prevents the second redistribution layer 134 and the adhesive layer 120 from peeling off due to differences in thermal expansion coefficients when they are thermocompression bonded. <Fourth Example>

[0020] 4 is a cross-sectional view showing a package structure according to a fourth embodiment of the present invention. The difference between the third embodiment of the present invention is that the fourth embodiment further includes a second electronic component 150 and a third redistribution layer 160, and the second electronic component 150 includes a second encapsulant 151, a second die 152, and a plurality of second solder bumps 153. The second die 152 includes a lower conductive surface 152a and an upper conductive surface 152b, and both ends of the second solder bump 153 are respectively connected to the lower conductive surface 152a and a plurality of upper conductive pads 161 of the third redistribution layer 160, and the second encapsulant 151 surrounds the second die 152 and the second solder bumps 153. The upper conductive surface 152b of the second die 152 and the second connection surface 153a of the second solder bump 153 are exposed to the outside of the second encapsulant 151, and the upper conductive surface 152b of the second die 152 is connected to the conductive pads 112a of the first redistribution layer 110. In this embodiment, the conductive element 140 is connected to a plurality of lower conductive pads 162 of the third redistribution layer 160, and the first electronic element 130 and the second electronic element 150 transmit signals to the outside via the conductive element 140.

[0021] By bonding the first redistribution layer 110 and the first electronic component 130 with the adhesive layer 120, the present invention significantly increases the bonding strength between the first redistribution layer 110 and the first electronic component 130, making the design of the package structure 100 with the adhesive layer more complex and simple, and improving the signal transmission speed and power density.

[0022] 5a, 5b and 5c are flow charts showing a packaging method of the package structure 100 with adhesive layer according to the first embodiment of the present invention. First, in the example of FIG. 5a, a first redistribution layer 110 is provided. The first redistribution layer 110 is mounted on a first carrier s1 by a first adhesive t1, and the first redistribution layer 110 includes a first upper surface 111 and a first lower surface 112, the first upper surface 111 having a plurality of upper bumps 111a, and the first lower surface 112 having a plurality of conductive pads 112a. Next, an adhesive layer 120 is formed on the first redistribution layer 110, and the adhesive layer 120 is positioned on the first upper surface 111 of the first redistribution layer 110 and surrounds the upper bumps 111a. In this embodiment, the step of forming the adhesive layer 120 includes the steps of applying an organic adhesive material to the first redistribution layer 110, and curing the organic adhesive material into the adhesive layer 120 by heating and cooling. Finally, the adhesive layer 120 is planarized to expose the upper bumps 111a on the adhesive layer 120. Preferably, in this embodiment, the hardened adhesive layer 120 is cut by a fly-cut process.

[0023] Next, in the example of FIG. 5b, the manufacturing method of the first electronic component 130 according to the first embodiment includes first mounting a plurality of first dies 132 on a second carrier s2 by a second adhesive t2, and forming a plurality of first solder bumps 133 on the first dies 132. Next, forming a first encapsulant 131 covering the first dies 132 and the first solder bumps 133. Finally, the first encapsulant 131 is planarized to form a first exposed surface 131a, and the first connecting surfaces 133a of the first solder bumps 133 are exposed on the first exposed surface 131a. The first exposed surface 131a is the first active surface of the first electronic component 130, and the first solder bumps 133 are conductors of the first electronic component 130.

[0024] 5a and 5b, referring to FIG. 5c, the first electronic element 130 is placed upside down on the adhesive layer 120, and the first exposed surface 131a of the first encapsulant 131 and the first connecting surface 133a of each of the first solder bumps 133 are directed toward the first upper surface 111. The first electronic element 130 and the first redistribution layer 110 are then thermocompressed to eutectic-bond each of the first solder bumps 133 and each of the upper bumps 111a. The adhesive layer 120 is melted again by the high temperature of thermocompression, and the two adhesive surfaces of the adhesive layer 120 are respectively bonded to the first upper surface 111 and the first exposed surface 131a during thermocompression, and the adhesive layer 120 is cooled again after thermocompression to be hardened and molded.

[0025] In addition, if the temperature of the thermocompression bonding is insufficient to completely volatilize the solvent in the organic adhesive material due to the characteristics of the organic adhesive material forming the adhesive layer 120, the method further includes a step of heating the adhesive layer 120 again to volatilize the excess solvent and then cooling it again to complete final curing after thermocompression bonding the first electronic component 130 and the first redistribution layer 110. Finally, the first adhesive t1 and the first carrier s1 are removed, and the plurality of conductive elements 140 are placed on the first lower surface 112 of the first redistribution layer 110, and each of the conductive elements 140 is connected to each of the conductive pads 112a, and then the second adhesive t2 and the second carrier s2 are removed to complete the manufacture of the package structure 100 having the adhesive layer.

[0026] 6a, 6b and 6c are flow charts showing a packaging method of the package structure 100 with adhesive layer according to the third embodiment of the present invention. The manufacturing flow chart of FIG. 6a is the same as FIG. 5a of the first embodiment, so the description thereof will not be repeated here. FIG. 6b shows a manufacturing method of the first electronic component 130 according to the third embodiment, which firstly mounts a plurality of first dies 132 on a second carrier s2 by a second adhesive t2, and forms a first solder bump 133 on each of the first dies 132. Next, a first encapsulant 131 is formed to cover the first dies 132 and the first solder bumps 133. Next, the first encapsulant 131 is planarized to form a first exposed surface 131a, and the first connecting surface 133a of each of the first solder bumps 133 is exposed on the first exposed surface 131a. Finally, a second redistribution layer 134 having a second lower surface 134a and a second upper surface 134b is formed on the first exposed surface 131a, and the multiple upper redistribution pads 134d on the second upper surface 134b are connected to the first solder bumps 133. The second lower surface 134a is the first active surface of the first electronic element 130, and the multiple lower redistribution pads 134c on the second lower surface 134a are conductors of the first electronic element 130.

[0027] 6c, after the flow charts of FIG. 6a and FIG. 6b are completed, the first electronic component 130 is placed upside down on the adhesive layer 120, and the second lower surface 134a of the second redistribution layer 134 faces the first upper surface 111, and the first electronic component 130 and the first redistribution layer 110 are thermocompression-bonded to eutectic-bond the lower redistribution pads 134c of the second lower surface 134a to the upper bumps 111a, respectively. The adhesive layer 120 is melted again by the high temperature of thermocompression, and the two adhesive surfaces of the adhesive layer 120 are respectively bonded to the first upper surface 111 and the second lower surface 134a during thermocompression, and the adhesive layer 120 is hardened again to form after the thermocompression is completed.

[0028] Finally, the first adhesive t1 and the first carrier s1 are removed, and a plurality of conductive elements 140 are placed on the first lower surface 112 of the first redistribution layer 110, and each of the conductive elements 140 is connected to each of the conductive pads 112a, and then the second adhesive t2 and the second carrier s2 are removed to complete the fabrication of the package structure 100 having an adhesive layer.

[0029] 7a, 7b and 7c are flow charts showing a packaging method of the package structure 100 with adhesive layer according to the fourth embodiment of the present invention. The manufacturing flow chart of FIG. 7b is the same as FIG. 6b of the third embodiment, so the description thereof will not be repeated here. In the example of FIG. 7a, a first redistribution layer 110 is provided. In this embodiment, the first redistribution layer 110 is disposed on a second electronic component 150 and a third redistribution layer 160, and the second electronic component 150 has a second encapsulant 151, a second die 152 and a plurality of second solder bumps 153. The second die 152 includes a lower conductive surface 152a and an upper conductive surface 152b, and both ends of the second solder bump 153 are respectively connected to the lower conductive surface 152a and a plurality of upper conductive pads 161 of the third redistribution layer 160. The second encapsulation 151 surrounds the second die 152 and the second solder bumps 153, and the upper conductive surface 152b of the second die 152 and the second connecting surface 153a of the second solder bumps 153 are exposed outside the second encapsulation 151. The upper conductive surface 152b of the second die 152 is connected to the conductive pads 112a of the first redistribution layer 110. The first redistribution layer 110, the second electronic element 150, and the third redistribution layer 160 are mounted on the first carrier s1 by a first adhesive t1. Next, an adhesive layer 120 is formed on the first redistribution layer 110, and the adhesive layer 120 is located on the first upper surface 111 of the first redistribution layer 110 and surrounds the upper bumps 111a. In this embodiment, the step of forming the adhesive layer 120 includes the steps of applying an organic adhesive material to the first redistribution layer 110, and heating and cooling the organic adhesive material to harden it into the adhesive layer 120. Finally, the adhesive layer 120 is planarized to expose the upper bump 111a in the adhesive layer 120. Preferably, in this embodiment, the adhesive layer 120 is cut by a fly-cut process.

[0030] 7a and 7b are completed, referring to FIG. 7c, the first electronic component 130 is placed upside down on the adhesive layer 120, and the second lower surface 134a of the second redistribution layer 134 faces the first upper surface 111, and the first electronic component 130 and the first redistribution layer 110 are thermocompression-bonded to eutectic-bond the lower redistribution pads 134c of the second lower surface 134a to the upper bumps 111a, respectively. The adhesive layer 120 is melted again by the high temperature of the thermocompression, and the two adhesive surfaces of the adhesive layer 120 are respectively bonded to the first upper surface 111 and the second lower surface 134a during the thermocompression, and the adhesive layer 120 is hardened again and shaped after the thermocompression is completed.

[0031] Finally, the first adhesive t1 and the first carrier s1 are removed, and the multiple conductive elements 140 are placed on the multiple lower conductive pads 162 of the third redistribution layer 160, and each of the conductive elements 140 is connected to each of the lower conductive pads 162. After that, the second adhesive t2 and the second carrier s2 are removed to complete the fabrication of the package structure 100 having an adhesive layer.

[0032] In the present invention, an adhesive layer 120 is formed on the first redistribution layer 110, and when the first electronic element 130 is thermocompression bonded to the first redistribution layer 110, the adhesive layer 12 is melted at high temperature, thereby bonding the first electronic element 130 and the first redistribution layer 110. By significantly increasing the bonding strength, the package structure 100 having the adhesive layer is designed to have a higher density and a more complex structure.

[0033] As described above, the present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0034] 100 Package structure having adhesive layer 110 1st redistribution layer 111 1st top surface 111a Upper Bump 112 1st bottom surface 112a Conductive pad 120 Adhesive layer 130 First Electronic Element 131 First sealed body 131a 1st exposed surface 132 First Die 133 1st solder bump 133a First connecting surface 134 2nd redistribution layer 134a 2nd bottom surface 134b 2nd top surface 134c Bottom Rerouting Pad 134d Top rewiring pad 140 Conductive elements 150 Second electronic element 151 Second sealing body 152 2nd Die 152a Lower conductive surface 152b Upper conductive surface 153 2nd solder bump 153a Second connection surface 160 3rd redistribution layer 161 Upper Conductive Pad 162 Lower Conductive Pad t1 First adhesive s1 1st carrier t2 2nd adhesive s2 Second carrier

Claims

1. a first redistribution layer (110) including a first upper surface (111) having a plurality of upper bumps (111a) and a first lower surface (112) having a plurality of conductive pads (112a); an adhesive layer (120) located on the first top surface of the first redistribution layer, the adhesive layer surrounding the upper bump; a first electronic element (130) mounted on the adhesive layer, the first electronic element having a first active surface and a plurality of conductors, the conductors being exposed on the first active surface, the first active surface facing the first top surface, each of the conductors being connected to each of the upper bumps, and two adhesive surfaces of the adhesive layer being respectively attached to the first top surface and the first active surface; The first electronic component has a first encapsulant (131), a first die (132), a plurality of first solder bumps (133), and a second redistribution layer (134), the first solder bumps being located on the first die, the first encapsulant surrounding the first die and the first solder bumps, a first exposed surface (131a) of the first encapsulant exposing a first connection surface (133a) of each of the first solder bumps, the first exposed surface being the first active surface of the first electronic component, and the first solder bumps being connected to the first encapsulant. a first solder bump is the conductor of the first electronic element, the second redistribution layer has a second lower surface (134a) and a second upper surface (134b), a plurality of lower redistribution pads (134c) on the second lower surface are connected to the upper bumps, and a plurality of upper redistribution pads (134d) on the second upper surface are connected to the first solder bumps, the second lower surface is the first active surface of the first electronic element, and the lower redistribution pads are the conductor of the first electronic element.

2. 2. The package structure having an adhesive layer according to claim 1, wherein the adhesive layer is formed by curing an organic adhesive material.

3. 2. A package structure having an adhesive layer as described in claim 1, further comprising a plurality of conductive elements located on the first lower surface of the first redistribution layer and connected to each of the conductive pads.

4. 2. The package structure with an adhesive layer according to claim 1, comprising: a second electronic component (150) and a third redistribution layer (160), the second electronic component having a second encapsulation (151), a second die (152), and a plurality of second solder bumps (153), the second die having a lower conductive surface (152a) and an upper conductive surface (152b), both ends of the second solder bumps being connected to the lower conductive surface and a plurality of upper conductive pads (161) of the third redistribution layer, respectively, the second encapsulation surrounding the second die and the second solder bumps, the upper conductive surface of the second die and a second connection surface (153a) of the second solder bumps being exposed outside the second encapsulation, and the upper conductive surface of the second die being connected to the conductive pads of the first redistribution layer.

5. 5. The package structure having an adhesive layer according to claim 4, further comprising a plurality of conductive elements (140) connected to a plurality of lower conductive pads (162) of the third redistribution layer.

6. providing a first redistribution layer including a first upper surface having a plurality of upper bumps and a first lower surface having a plurality of conductive pads; forming an adhesive layer on the first redistribution layer, the adhesive layer being located on the first upper surface of the first redistribution layer and surrounding the upper bump; planarizing the adhesive layer to expose the top bump to the adhesive layer; placing a first electronic component on the adhesive layer, the first electronic component having a first active surface and a plurality of conductors, the conductors being exposed on the first active surface, the first active surface facing the first top surface; a step of thermocompression bonding the first electronic element and the first redistribution layer to connect each of the conductors to each of the upper bumps, and two adhesive surfaces of the adhesive layer are respectively adhered to the first upper surface and the first active surface during thermocompression bonding.

7. 7. The packaging method for a package structure having an adhesive layer as described in claim 6, characterized in that the step of forming the adhesive layer on the first redistribution layer includes the steps of applying an organic adhesive material to the first redistribution layer and heating and cooling the organic adhesive material to harden it into the adhesive layer.

8. 7. The packaging method for a package structure having an adhesive layer as claimed in claim 6, wherein the step of planarizing the adhesive layer comprises cutting the adhesive layer by a fly-cut process.

9. 7. The packaging method for a package structure having an adhesive layer according to claim 6, further comprising the step of heating and cooling the adhesive layer again after the first electronic element and the first redistribution layer are thermocompressed to complete a final hardening.

10. 7. The packaging method for a package structure having an adhesive layer as claimed in claim 6, further comprising the steps of: placing a plurality of conductive elements on the first lower surface of the first redistribution layer; and connecting each of the conductive elements to each of the conductive pads.

11. 7. The packaging method for a package structure having an adhesive layer according to claim 6, wherein the manufacturing method for the first electronic element includes forming a plurality of first solder bumps on a first die, forming a first encapsulation body covering the first die and the first solder bumps, and planarizing the first encapsulation body to form a first exposed surface, exposing first connection surfaces of each of the first solder bumps from the first exposed surface, the first exposed surface being the first active surface of the first electronic element, and the first solder bumps being the conductors of the first electronic element.

12. 7. The packaging method of claim 6, wherein the method for manufacturing the first electronic component includes forming a plurality of first solder bumps on a first die, forming a first encapsulant covering the first die and the first solder bumps, planarizing the first encapsulant to form a first exposed surface, exposing first connection surfaces of each of the first solder bumps from the first exposed surface, forming a second redistribution layer on the first exposed surface, the second redistribution layer having a second lower surface and a second upper surface, connecting a plurality of upper redistribution pads on the second upper surface to the first solder bumps, the second lower surface being the first active surface of the first electronic component, and a plurality of lower redistribution pads on the second lower surface being the conductors of the first electronic component, and wherein when the first electronic component and the first redistribution layer are thermocompression bonded, the plurality of lower redistribution pads on the second lower surface are connected to the upper bumps.

13. 13. The packaging method of claim 12, wherein the first redistribution layer is disposed on a second electronic component and a third redistribution layer, the second electronic component has a second encapsulant, a second die, and a plurality of second solder bumps, the second die being formed of a lower conductive surface and an upper conductive surface, both ends of the second solder bump being connected to the lower conductive surface and a plurality of upper conductive pads of the third redistribution layer, respectively, the second encapsulant surrounding the second die and the second solder bumps, the upper conductive surface of the second die and a second connection surface of the second solder bump being exposed outside the second encapsulant, and the upper conductive surface of the second die being connected to the conductive pads of the first redistribution layer.

14. 14. The packaging method for a package structure having an adhesive layer according to claim 13, further comprising the steps of: placing a plurality of conductive elements on a plurality of lower conductive pads of the third redistribution layer; and connecting each of the conductive elements to each of the lower conductive pads.

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