Holding device

Abstract

To prevent a reduction in controllability in the distribution of the surface temperature of a ceramic member.SOLUTION: A method for manufacturing a retainer includes the steps of: preparing a first structure including a first ceramic portion to be a portion on a first surface side of a ceramic member; preparing a second structure including a second ceramic portion to be a portion on a second surface side of the ceramic member, and a heater electrode arranged to be exposed on a fourth surface of the second ceramic portion; joining the second ceramic portion and a base member to each other with a joining part; measuring the distribution of a surface temperature of the fourth surface of the second ceramic portion, while supplying coolant to a coolant passage and supplying power to the heater electrode; adjusting the quantity of heat generated by the heater electrode by grinding a part of the heater electrode based on a result of measurement of the temperature distribution; and joining the first ceramic portion to the fourth surface side of the second ceramic portion.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a manufacturing method of a holding device for holding an object. [Background technology]

[0002] For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing semiconductor devices. The electrostatic chuck includes a ceramic member, a base member made of, for example, a metal, a joint that joins the ceramic member and the base member, and a chuck electrode disposed inside the ceramic member, and uses electrostatic attraction generated by applying a voltage to the chuck electrode to attract and hold the wafer onto the surface of the ceramic member (hereinafter referred to as the "attraction surface").

[0003] If the temperature of the wafer held on the adsorption surface of the electrostatic chuck does not reach the desired temperature, the accuracy of each process (film formation, etching, etc.) on the wafer may decrease, and therefore the electrostatic chuck is required to have the ability to control the temperature distribution of the wafer. For this reason, the temperature distribution of the adsorption surface of the ceramic member (and thus the temperature distribution of the wafer held on the adsorption surface) is controlled by heating using a heater electrode disposed inside the ceramic member, or cooling using a coolant supply to a coolant flow path formed in the base member (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-120909 A Summary of the Invention [Problem to be solved by the invention]

[0005] The heater electrode disposed inside the ceramic member is formed, for example, by printing a metallization paste (metallization ink) containing a conductive material on a ceramic green sheet and firing the metallization paste together with the ceramic green sheet. Therefore, there is a risk of variation in the shape (thickness and width) of the heater electrode that is formed. If variation in the shape of the heater electrode occurs, variation in the resistance of the heater electrode, i.e., variation in the amount of heat generated, may occur, and the controllability of the temperature distribution of the adsorption surface of the ceramic member (and thus the controllability of the temperature distribution of the wafer held on the adsorption surface) may decrease. Note that the decrease in the controllability of the temperature distribution of the adsorption surface of the ceramic member may occur not only due to variation in the shape of the heater electrode, but also due to the configuration of the ceramic member, the base member, and the joint.

[0006] Furthermore, this problem is not limited to electrostatic chucks, but is a common problem with any holding device that includes a ceramic member, a base member, and a joint and holds an object on the surface of the ceramic member.

[0007] This specification discloses a technique that can solve the above-mentioned problems. [Means for solving the problem]

[0008] The technology disclosed in this specification can be realized, for example, in the following forms.

[0009] (1) A method for manufacturing a holding device disclosed in the present specification includes a ceramic member having a first surface substantially perpendicular to a first direction and a second surface opposite to the first surface, a chuck electrode disposed inside the ceramic member, a heater electrode formed by a resistance heating element and disposed inside the ceramic member at a position spaced apart from the first surface relative to the chuck electrode, a base member having a third surface, disposed such that the third surface is located on the second surface side of the ceramic member, and having a coolant flow path formed therein, and a joining portion disposed between the second surface of the ceramic member and the third surface of the base member to join the ceramic member and the base member, and the holding device holds an object on the first surface of the ceramic member, the method comprising the steps of: a first preparation step of preparing a first structure including a first ceramic portion that is a part of the ceramic member on the first surface side, and the chuck electrode disposed inside the first ceramic portion; a second preparation step of preparing a second structure including a second ceramic part that is a part of the second surface side of a material and the heater electrode arranged so as to be exposed on a fourth surface located on the opposite side to the second surface of the second ceramic part; a first joining step of joining the second ceramic part constituting the second structure to the base member by the joining part; a measurement step of measuring a temperature distribution on the fourth surface of the second ceramic part while supplying a refrigerant to the refrigerant flow path and supplying power to the heater electrode; an adjustment step of adjusting the heat generation amount of the heater electrode by grinding the part of the heater electrode exposed on the fourth surface of the second ceramic part based on a measurement result of the temperature distribution; and a second joining step of manufacturing the ceramic member including the second ceramic part and the first ceramic part by joining the first ceramic part constituting the first structure to the fourth surface side of the second ceramic part constituting the second structure.

[0010] In the method for manufacturing the holding device, a second structure including a second ceramic part that is a part of the second surface side of the ceramic member and a heater electrode arranged so as to be exposed on a fourth surface of the second ceramic part that is located opposite to the second surface is bonded to a base member, and a temperature distribution of the fourth surface of the second ceramic part is measured while supplying a coolant to the coolant flow path and supplying power to the heater electrode. In addition, in the method for manufacturing the holding device, a heat generation amount of the heater electrode is adjusted by grinding a part of the heater electrode exposed on the fourth surface of the second ceramic part based on the measurement result of the temperature distribution of the fourth surface, and then a first structure including a first ceramic part that is a part of the first surface side of the ceramic member and a chuck electrode arranged inside the first ceramic part is bonded to the fourth surface side of the second ceramic part. That is, in the manufacturing method of the holding device, after manufacturing the part of the holding device closer to the base member than the heater electrode, the temperature distribution of the fourth surface of the second ceramic part is measured under the same conditions as in actual use, and the heat generation amount of the heater electrode can be adjusted based on the measurement result of the temperature distribution. Therefore, in the manufacturing method of the holding device, it is possible to correct the variation in the heat generation amount of the heater electrode caused by the variation in the shape of the heater electrode, for example, and as a result, it is possible to suppress the deterioration of the controllability of the temperature distribution of the first surface of the ceramic member (and thus the controllability of the temperature distribution of the object held on the first surface).

[0011] (2) The above-mentioned manufacturing method for the holding device may further include a thermal spraying step of forming a ceramic layer covering the heater electrode on the fourth surface of the second ceramic part by thermal spraying after the adjustment step and before the second joining step, and the second joining step may be a step of manufacturing the ceramic member including the second ceramic part, the ceramic layer, and the first ceramic part by joining the first ceramic part constituting the first structure to the ceramic layer formed on the fourth surface of the second ceramic part constituting the second structure. In this manufacturing method for the holding device, the variation in thermal conductivity of the ceramic member can be suppressed compared to a mode in which a ceramic layer is not formed on the fourth surface of the second ceramic part and the first ceramic part constituting the first structure is directly joined to the fourth surface of the second ceramic part. Therefore, according to this manufacturing method for the holding device, the deterioration of the controllability of the temperature distribution of the first surface of the ceramic member can be effectively suppressed.

[0012] (3) The above-mentioned method for manufacturing a holding device may further include a polishing step of polishing the surface of the ceramic layer opposite to the surface located on the fourth surface side after the thermal spraying step and before the second joining step. This method for manufacturing a holding device can suppress the variation in thickness of the ceramic layer, and as a result, the variation in thickness of the ceramic member can be effectively suppressed, and the variation in thermal conductivity of the ceramic member can be effectively suppressed. Therefore, according to this method for manufacturing a holding device, it is possible to extremely effectively suppress the deterioration of the controllability of the temperature distribution of the first surface of the ceramic member.

[0013] (4) In the above-mentioned method for manufacturing a holding device, the ceramic member may be substantially circular when viewed in the first direction, the holding device may include a plurality of the heater electrodes, and each of the heater electrodes may be disposed within each of the segments when the ceramic member is virtually divided into a plurality of segments by at least one virtual circular dividing line concentric with the outer circumferential line of the ceramic member when viewed in the first direction. That is, in the method for manufacturing a holding device, each segment is not further divided into a plurality of segments along the circumferential direction of the outer circumferential line of the ceramic member. In the embodiment in which the ceramic member is virtually divided into a plurality of segments by at least one virtual circular dividing line concentric with the outer circumferential line of the ceramic member when viewed in the first direction as in the method for manufacturing a holding device, it is difficult to correct the variation in the amount of heat generated in the heater electrodes disposed in each segment by controlling the amount of heat generated by the other heater electrodes, and the controllability of the temperature distribution on the first surface of the ceramic member is likely to be reduced, compared with the embodiment in which each segment is further divided into a plurality of segments along the circumferential direction of the outer circumferential line of the ceramic member. In the manufacturing method of the present holding device, even when a segment configuration is adopted in which the controllability of the temperature distribution on the first surface of the ceramic member is easily reduced, it is possible to correct the variation in the heat generation amount of each heater electrode caused, for example, by the variation in the shape of each heater electrode, and to suppress the reduction in the controllability of the temperature distribution on the first surface of the ceramic member.

[0014] (5) A holding device disclosed in the present specification includes: a ceramic member having a first surface substantially perpendicular to a first direction and a second surface opposite to the first surface; a chuck electrode disposed inside the ceramic member; a heater electrode formed by a resistance heating element and disposed inside the ceramic member at a position spaced apart from the first surface relative to the chuck electrode; a base member having a third surface, disposed so that the third surface is located on the second surface side of the ceramic member, and having a coolant flow path formed therein; and a joining portion disposed between the second surface of the ceramic member and the third surface of the base member to join the ceramic member and the base member; In a holding device for holding an object on a surface, the ceramic member includes a first ceramic part that is a part of the first surface side, the first ceramic part having the chuck electrode disposed therein, a second ceramic part that is a part of the second surface side, the second ceramic part having the heater electrode disposed on a fourth surface of the second ceramic part opposite to the second surface, and a second joint that joins the first ceramic part and the second ceramic part, wherein power is supplied to the heater electrode and a coolant is supplied to the coolant flow path, and when the difference between the temperature of the heater electrode and the temperature of the coolant is 50° C. or more, the difference between the maximum and minimum temperatures on the first surface is 3.5° C. or less. According to this holding device, the temperature difference at each position on the first surface of the ceramic member is extremely small, so that deterioration of the controllability of the temperature distribution on the first surface of the ceramic member can be effectively suppressed.

[0015] (6) The holding device may further include at least one power supply terminal for supplying power to the chuck electrode, the at least one power supply terminal satisfying at least one of the following conditions: (1) the first condition is that the at least one power supply terminal is located within 5% of the diameter of the first surface from the center of the first surface as viewed in the first direction; and (2) the second condition is that the at least one power supply terminal has a first terminal portion located closer to the first surface than the surface of the first ceramic part opposite to the first surface, and a second terminal portion located farther from the first surface than the first terminal portion and detachably attached to the first terminal portion. Since no power supply terminal for supplying power to the chuck electrode is present at a position other than the center vicinity of the first surface as viewed in the first direction in this holding device, or even if a power supply terminal is present, the remaining portion can be removed while leaving a portion located closer to the first surface than the surface of the first ceramic part opposite to the first surface, the portion of the second joint other than the center vicinity can be easily cut, and the first ceramic part can be easily removed and replaced.

[0016] The techniques disclosed in this specification can be realized in various forms, for example, in the form of a holding device, an electrostatic chuck, a manufacturing method thereof, and the like. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view illustrating a schematic external configuration of an electrostatic chuck 100 according to a first embodiment. [Diagram 2] 1 is an explanatory diagram illustrating a schematic XZ cross-sectional configuration of an electrostatic chuck 100 according to a first embodiment. [Diagram 3] 1 is an explanatory diagram illustrating a schematic XY cross-sectional configuration of an electrostatic chuck 100 according to a first embodiment. [Figure 4] 1 is an explanatory diagram illustrating a schematic XY cross-sectional configuration of an electrostatic chuck 100 according to a first embodiment. [Diagram 5]4 is a flowchart showing a method for manufacturing the electrostatic chuck 100 in the first embodiment. [Figure 6] 1A to 1C are explanatory diagrams illustrating an overview of a manufacturing method for the electrostatic chuck 100 according to the first embodiment. [Figure 7] 1A to 1C are explanatory diagrams illustrating an overview of a manufacturing method for the electrostatic chuck 100 according to the first embodiment. [Figure 8] 10 is an explanatory diagram illustrating a schematic XZ cross-sectional configuration of an electrostatic chuck 100 according to a second embodiment. FIG. [Figure 9] 10 is a flowchart showing a method for manufacturing the electrostatic chuck 100 according to the second embodiment. [Figure 10] 11 is an explanatory diagram illustrating a schematic XZ cross-sectional configuration of an electrostatic chuck 100 according to a third embodiment. FIG. [Figure 11] 10 is a flowchart showing the flow of a method for remanufacturing the electrostatic chuck 100 according to the third embodiment. [Figure 12] 11A to 11C are explanatory diagrams illustrating an overview of a method for remanufacturing the electrostatic chuck 100 according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] A. First embodiment: A-1. Configuration of electrostatic chuck 100: FIG. 1 is a perspective view that shows an external configuration of the electrostatic chuck 100 in the first embodiment, FIG. 2 is an explanatory diagram that shows an XZ cross-sectional configuration of the electrostatic chuck 100 in the first embodiment, and FIG. 3 and FIG. 4 are explanatory diagrams that show an XY cross-sectional configuration of the electrostatic chuck 100 in the first embodiment. FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 100 at a position III-III in FIG. 2, and FIG. 4 shows the XY cross-sectional configuration of the electrostatic chuck 100 at a position IV-IV in FIG. 2. Each figure shows mutually orthogonal XYZ axes for specifying the direction. In this specification, for convenience, the positive direction of the Z axis is referred to as the upward direction, and the negative direction of the Z axis is referred to as the downward direction, but the electrostatic chuck 100 may actually be installed in a direction different from such directions. In addition, in this specification, a direction perpendicular to the Z axis direction is referred to as a surface direction.

[0019] The electrostatic chuck 100 is a device that attracts and holds an object (e.g., a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W in a vacuum chamber of a semiconductor manufacturing device. The electrostatic chuck 100 includes a ceramic member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (in this embodiment, the vertical direction (Z-axis direction)). The ceramic member 10 and the base member 20 are arranged such that a lower surface S2 (see FIG. 2) of the ceramic member 10 and an upper surface S3 of the base member 20 face each other in the arrangement direction with a bonding portion 30 described later interposed therebetween. That is, the base member 20 is arranged such that the upper surface S3 of the base member 20 is located on the lower surface S2 side of the ceramic member 10. The upper surface S3 of the base member 20 corresponds to a third surface in the claims.

[0020] The ceramic member 10 is a substantially disk-shaped member having a substantially circular planar upper surface (hereinafter referred to as the "attachment surface") S1 that is substantially perpendicular to the above-mentioned arrangement direction (Z-axis direction) and a lower surface S2 opposite to the adsorption surface S1. In this embodiment, the ceramic member 10 has a flange portion 109 that protrudes in the planar direction over the entire circumference of the outer periphery. Hereinafter, a portion of the ceramic member 10 excluding the flange portion 109 is referred to as a main body portion 108. The diameter of the main body portion 108 of the ceramic member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic member 10 is, for example, about 1 mm to 10 mm. The adsorption surface S1 of the ceramic member 10 corresponds to the first surface in the claims, the lower surface S2 of the ceramic member 10 corresponds to the second surface in the claims, and the Z-axis direction corresponds to the first direction in the claims.

[0021] As shown in FIG. 2, in this embodiment, the ceramic member 10 is composed of an upper ceramic portion 101, a lower ceramic portion 102, and a middle portion 103. The upper ceramic portion 101 is a portion of the ceramic member 10 on the adsorption surface S1 side, more specifically, a portion including the adsorption surface S1. The flange portion 109 is formed on the upper ceramic portion 101. The lower ceramic portion 102 is a portion of the ceramic member 10 on the lower surface S2 side, more specifically, a portion including the lower surface S2. The upper ceramic portion 101 and the lower ceramic portion 102 are made of ceramics (e.g., alumina, aluminum nitride, etc.). As described later, the upper ceramic portion 101 and the lower ceramic portion 102 are fired bodies formed by firing. The upper ceramic portion 101 corresponds to a first ceramic portion in the claims, and the lower ceramic portion 102 corresponds to a second ceramic portion in the claims.

[0022] The intermediate portion 103 of the ceramic member 10 is a portion disposed between the upper ceramic portion 101 and the lower ceramic portion 102. The intermediate portion 103 is composed of an intermediate joint portion 104 located on the upper ceramic portion 101 side (upper side) and an intermediate ceramic portion 105 located on the lower ceramic portion 102 side (lower side). The intermediate ceramic portion 105 is formed of ceramics (e.g., alumina, aluminum nitride, etc.). As described later, the intermediate ceramic portion 105 is a sprayed layer formed by performing ceramic spraying. The intermediate ceramic portion 105 corresponds to the ceramic layer in the claims. The intermediate joint portion 104 is composed of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The intermediate joint portion 104 may contain a filler such as ceramic powder. The intermediate joint 104 joins the upper ceramic portion 101 and the lower ceramic portion 102 on which the intermediate ceramic portion 105 is formed. The intermediate joint 104 corresponds to a second joint in the claims. Although the ceramic member 10 includes the intermediate joint 104 that includes a resin adhesive, the majority of the ceramic member 10 is formed of ceramics, and therefore, for convenience, the ceramic member 10 will be referred to as the "ceramic" member 10 in this specification.

[0023] 2, a chuck electrode 40 made of a conductive material (e.g., tungsten, molybdenum, platinum, etc.) is disposed inside the ceramic member 10. The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction force is generated, and the wafer W is attracted and fixed to the attracting surface S1 of the ceramic member 10 by this electrostatic attraction force. In this embodiment, the chuck electrode 40 is disposed inside an upper ceramic portion 101 constituting the ceramic member 10.

[0024] Additionally, a plurality of heater electrodes 50 for controlling the temperature distribution on the chucking surface S1 of the ceramic member 10 (i.e., controlling the temperature distribution of the wafer W held on the chucking surface S1) and configurations (driver electrode 60, etc.) for supplying power to each heater electrode 50 are arranged inside the ceramic member 10. These configurations will be described in detail later.

[0025] The base member 20 is, for example, a circular flat plate-like member having the same diameter as the main body 108 of the ceramic member 10 or a larger diameter than the main body 108 of the ceramic member 10, and is made of, for example, a metal (aluminum, aluminum alloy, etc.). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm.

[0026] The base member 20 is joined to the ceramic member 10 by a joint 30 disposed between the lower surface S2 of the ceramic member 10 and the upper surface S3 of the base member 20. The joint 30 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The joint 30 may contain a filler such as ceramic powder. At least a part of the material constituting the joint 30 is preferably the same as at least a part of the material constituting the intermediate joint 104. The thickness of the joint 30 is, for example, about 0.1 mm to 1 mm.

[0027] A coolant flow path 21 is formed inside the base member 20. When a coolant (e.g., a fluorine-based inert liquid or water) flows through the coolant flow path 21, the base member 20 is cooled, and the ceramic member 10 is cooled by heat transfer (heat withdrawal) between the base member 20 and the ceramic member 10 via the joint 30, and the wafer W held on the adsorption surface S1 of the ceramic member 10 is cooled. This allows the temperature distribution of the wafer W to be controlled.

[0028] The electrostatic chuck 100 also includes a substantially annular O-ring 90 formed to surround the outer periphery of the laminate of the intermediate portion 103, the lower ceramic portion 102, and the bonding portion 30. The O-ring 90 is formed of an insulating material such as rubber. The O-ring 90 is in close contact with the lower surface of the flange portion 109 formed on the upper ceramic portion 101 and the upper surface S3 of the base member 20, and prevents the bonding portion 30 and the intermediate bonding portion 104 from being exposed to plasma or the like and deteriorating.

[0029] A-2. Configuration of heater electrode 50 etc.: Next, the heater electrode 50 and a configuration for supplying power to the heater electrode 50 will be described in detail. As described above, the electrostatic chuck 100 includes a plurality of heater electrodes 50 (more specifically, three heater electrodes 50A, 50B, and 50C) (see FIG. 3). In this embodiment, the plurality of heater electrodes 50 are disposed on an upper surface S4 (a surface opposite to the lower surface S2 of the ceramic member 10) of the lower ceramic portion 102 constituting the ceramic member 10. That is, the plurality of heater electrodes 50 are disposed at a position spaced apart from the chucking surface S1 by the chuck electrode 40. Note that, in reality, the intermediate ceramic portion 105 is disposed on the upper surface S4 of the lower ceramic portion 102, and the plurality of heater electrodes 50 are covered by the intermediate ceramic portion 105. The upper surface S4 of the lower ceramic portion 102 corresponds to a fourth surface in the claims.

[0030] 3, in the electrostatic chuck 100 of the present embodiment, the main body 108 of the ceramic member 10 is virtually divided into three segments Z (Za, Zb, Zc) arranged in a planar direction. More specifically, the main body 108 of the ceramic member 10 is virtually divided into the three segments Z by two circular virtual parting lines VL (VL1, VL2) concentric with the outer circumferential line of the main body 108 as viewed in the Z axis direction. The shape of each segment Z as viewed in the Z axis direction is substantially circular or substantially annular.

[0031] Each of the multiple heater electrodes 50 is disposed in one of multiple segments Z set in the main body 108 of the ceramic member 10. Specifically, of the three heater electrodes 50, one heater electrode 50A is disposed in segment Za located on the outermost side of the three segments Z, the other heater electrode 50C is disposed in segment Zc located closest to the center of the three segments Z, and the remaining heater electrode 50B is disposed in segment Zb sandwiched between segments Za and Zc.

[0032] Each heater electrode 50 has a heater line portion 51 which is a linear resistance heating element as viewed in the Z-axis direction, and heater pad portions 52 connected to both ends of the heater line portion 51. The heater line portion 51 and the heater pad portions 52 which constitute the heater electrode 50 are formed of a conductive material (e.g., tungsten, molybdenum, platinum, etc.). In this embodiment, the shape of the heater line portion 51 as viewed in the Z-axis direction is substantially circular or substantially spiral.

[0033] The electrostatic chuck 100 also includes a configuration for supplying power to each heater electrode 50. Specifically, the electrostatic chuck 100 includes a plurality of driver electrodes 60 (more specifically, six driver electrodes 60) (see FIG. 4). Each driver electrode 60 is a conductor pattern having a predetermined shape parallel to the surface direction, and is formed of a conductive material (e.g., tungsten, molybdenum, platinum, etc.). In this embodiment, the plurality of driver electrodes 60 are disposed inside the lower ceramic portion 102 constituting the ceramic member 10. The plurality of driver electrodes 60 are also disposed at the same positions as each other in the Z-axis direction. The driver electrode 60 differs from the heater electrode 50 in that it satisfies at least one of the following (1) and (2). (1) The cross-sectional area of ​​driver electrode 60 perpendicular to the direction of current flow is at least five times the similar cross-sectional area of ​​heater electrode 50. (2) The resistance between one via connected to the driver electrode 60 and the other via in the heater electrode 50 is five times or more than the resistance between the via connected to the heater electrode 50 and the via connected to the power supply terminal 74 in the driver electrode 60.

[0034] As shown in FIG. 4, in this embodiment, six driver electrodes 60 included in the electrostatic chuck 100 constitute three driver electrode pairs 600 (600A, 600B, 600C) each consisting of a pair of driver electrodes 60. The three driver electrode pairs 600 correspond to three heater electrodes 50 (50A, 50B, 50C). As shown in FIGS. 2 to 4, one of the pair of driver electrodes 60 constituting one driver electrode pair 600 (for example, driver electrode pair 600A) is electrically connected to one heater pad portion 52 of the corresponding heater electrode 50 (for example, heater electrode 50A) through a heater-side via 71 formed of a conductive material. In addition, the other of the pair of driver electrodes 60 constituting the driver electrode pair 600 (for example, driver electrode pair 600A) is electrically connected to the other heater pad portion 52 of the corresponding heater electrode 50 (for example, heater electrode 50A) through the heater-side via 71.

[0035] 2, the electrostatic chuck 100 is formed with a plurality of terminal holes 110 extending from the lower surface S7 of the base member 20 to the inside of the ceramic member 10. Each terminal hole 110 is an integrated hole formed by connecting a through hole 22 passing through the base member 20 in the vertical direction, a through hole 32 passing through the joint portion 30 in the vertical direction, and a recess 13 formed on the lower surface S2 side of the ceramic member 10 to each other.

[0036] A power supply terminal 74, which is a substantially columnar member made of a conductive material, is accommodated in each terminal hole 110. A power supply electrode (electrode pad) 73 made of a conductive material is disposed on the bottom surface of the recess 13 of the ceramic member 10 that constitutes each terminal hole 110. The upper end portion of the power supply terminal 74 is joined to the power supply electrode 73 by, for example, brazing.

[0037] Also, as shown in Figures 2 and 4, one of a pair of driver electrodes 60 constituting each driver electrode pair 600 is electrically connected to one power supply electrode 73 via a power supply side via 72 extending from the driver electrode 60 toward the lower surface S2 of the ceramic member 10, and the other of the pair of driver electrodes 60 is electrically connected to the other power supply electrode 73 via another power supply side via 72.

[0038] Each power supply terminal 74 is connected to a power supply (not shown). A voltage from the power supply is applied to each heater electrode 50 through the power supply terminal 74, the power supply electrode 73, the power supply side via 72, the driver electrode 60, and the heater side via 71. When a voltage is applied to each heater electrode 50, the heater electrode 50 generates heat and heats the ceramic member 10, thereby achieving control of the temperature distribution of the adsorption surface S1 of the ceramic member 10 (i.e., control of the temperature distribution of the wafer W held on the adsorption surface S1).

[0039] In the electrostatic chuck 100 of the present embodiment, when power is supplied to each heater electrode 50 and a coolant is supplied to the coolant flow passage 21, and the difference between the maximum and minimum temperatures on the attracting surface S1 of the ceramic member 10 is 3.5°C or less when the difference between the temperature of the heater electrode 50 and the temperature of the coolant is 50°C or more. That is, the temperature difference at each position on the attracting surface S1 of the ceramic member 10 is extremely small. Such a configuration can be realized, for example, by manufacturing the electrostatic chuck 100 according to the manufacturing method of the electrostatic chuck 100 of the present embodiment described below. The temperatures at each position on the heater electrodes and the attracting surface S1 can be measured using a temperature measuring device such as an IR camera.

[0040] A-3. Method for manufacturing electrostatic chuck 100: Next, a method for manufacturing the electrostatic chuck 100 in the first embodiment will be described. Fig. 5 is a flowchart showing the method for manufacturing the electrostatic chuck 100 in the first embodiment. Fig. 6 and Fig. 7 are explanatory diagrams showing an overview of the method for manufacturing the electrostatic chuck 100 in the first embodiment.

[0041] First, an upper ceramic structure 11 including an upper ceramic portion 101a and a chuck electrode 40 disposed inside the upper ceramic portion 101a is fabricated (S110, see column A in FIG. 6). Here, the upper ceramic portion 101a is a structure that will become the upper ceramic portion 101 in the electrostatic chuck 100 after the manufacturing process is completed. The upper ceramic portion 101a may be completely the same as the upper ceramic portion 101, or may become the upper ceramic portion 101 as a result of various processing steps being performed on the upper ceramic portion 101a. The step of S110 corresponds to a first preparation step in the claims, and the upper ceramic structure 11 corresponds to a first structure.

[0042] The method for producing the upper ceramic structure 11 is, for example, as follows. First, a plurality of ceramic green sheets are produced, and predetermined processing is performed on the predetermined ceramic green sheets. Examples of the predetermined processing include printing a metallization paste for forming the chuck electrode 40, etc., drilling holes for forming various vias, and filling the metallization paste. These ceramic green sheets are stacked and thermocompressed, and processed, such as cutting, to produce a ceramic green sheet laminate. The produced ceramic green sheet laminate is fired to obtain the upper ceramic structure 11. If necessary, warping of the upper ceramic structure 11 may be corrected, the surface may be polished, etc.

[0043] Further, a lower ceramic structure 12 including the lower ceramic portion 102a and the heater electrode 50 arranged so as to be exposed on the upper surface S4 of the lower ceramic portion 102a is fabricated (S120, see column B in FIG. 6). Here, the lower ceramic portion 102a is a structure that becomes the lower ceramic portion 102 in the electrostatic chuck 100 after the manufacturing is completed. The lower ceramic portion 102a may be completely the same as the lower ceramic portion 102, or may become the lower ceramic portion 102 as a result of various processing performed on the lower ceramic portion 102a. In this embodiment, the lower ceramic structure 12 further includes a driver electrode 60, a power supply electrode 73, and various vias 71 and 72. The step of S120 corresponds to a second preparation step in the claims, and the lower ceramic structure 12 corresponds to a second structure.

[0044] The method for producing the lower ceramic structure 12 is, for example, as follows. First, a plurality of ceramic green sheets are produced, and predetermined processing is performed on the predetermined ceramic green sheets. Examples of the predetermined processing include printing of metallization paste for forming the heater electrode 50, the driver electrode 60, the power supply electrode 73, etc., drilling holes for forming various vias, and filling with metallization paste. These ceramic green sheets are laminated, thermocompressed, and cut to produce a ceramic green sheet laminate. The produced ceramic green sheet laminate is fired to obtain the lower ceramic structure 12. If necessary, warping of the lower ceramic structure 12 may be corrected, and the surface (except for the upper surface S4 where the heater electrode 50 is exposed) may be polished.

[0045] Next, the power supply terminal 74 is joined to the power supply electrode 73 formed on the lower ceramic structure 12 by, for example, brazing (S130, see column C in FIG. 6). Note that, before joining the power supply terminal 74 to the power supply electrode 73, the surface of the power supply electrode 73 may be plated (for example, nickel plated).

[0046] Next, the lower ceramic portion 102a constituting the lower ceramic structure 12 and the base member 20 are joined by the joint 30 (S140, see column C in FIG. 6). More specifically, for example, an adhesive (paste-like adhesive or sheet-like adhesive) containing a silicone resin is placed on the upper surface S3 of the base member 20, the lower ceramic structure 12 containing the lower ceramic portion 102a is placed on the adhesive, and a hardening process is performed to harden the adhesive, thereby forming the joint 30 that joins the lower ceramic portion 102a constituting the lower ceramic structure 12 and the base member 20. The step of S140 corresponds to the first joining step in the claims.

[0047] Next, the temperature distribution on the upper surface S4 of the lower ceramic portion 102a is measured (S150) while supplying the coolant to the coolant flow passage 21 of the base member 20 and supplying power to the heater electrodes 50 arranged so as to be exposed on the upper surface S4 of the lower ceramic portion 102a. The temperature distribution is measured, for example, by measuring the temperatures at a plurality of measurement points on the upper surface S4 of the lower ceramic portion 102a. The step of S150 corresponds to the measuring step in the claims.

[0048] Next, based on the temperature distribution measurement result of S150, a portion of the heater electrode 50 arranged so as to be exposed on the upper surface S4 of the lower ceramic portion 102a is ground to adjust the heat generation amount of the heater electrode 50 (S160, see column A of FIG. 7). When a portion of the heater electrode 50 is ground, the cross-sectional area of ​​that portion of the heater electrode 50 becomes smaller, thereby increasing the electrical resistance and increasing the heat generation amount of that portion of the heater electrode 50. Therefore, for example, by grinding a portion of the heater electrode 50 that was relatively low temperature in the temperature distribution measurement result of S150, the temperature of that portion can be corrected to the high temperature side. The step of S160 corresponds to the adjustment step in the claims.

[0049] The grinding of the heater electrode 50 is performed, for example, by placing a mask MA on the portion other than the portion to be ground, and projecting a blasting material BM toward the upper surface S4 of the lower ceramic portion 102a by a shot blasting device BD. The amount of grinding of each portion of the heater electrode 50 can be made different by varying the number of shot blasts performed on each portion of the heater electrode 50. The grinding of the heater electrode 50 can also be achieved, for example, by polishing with a machining device. After adjusting the amount of heat generated by the heater electrode 50 by grinding the heater electrode 50, the temperature distribution of the upper surface S4 of the lower ceramic portion 102a may be measured again in the same manner as in the step S150, and the result of the adjustment of the amount of heat generated by the heater electrode 50 may be confirmed, and a determination may be made as to whether or not the heater electrode 50 needs to be ground again. The adjustment of the amount of heat generated by the heater electrode 50 may be confirmed, for example, by checking whether or not there is a change in the resistance value of the heater electrode 50 or the image by an IR camera.

[0050] Next, an intermediate ceramic portion 105 covering the heater electrode 50 is formed on the upper surface S4 of the lower ceramic portion 102a by thermal spraying (S170, see column B in FIG. 7). During the step S170, a coolant may be supplied to the coolant flow passage 21 of the base member 20. The step S170 corresponds to the thermal spraying step in the claims.

[0051] Next, the upper surface S5 of the intermediate ceramic portion 105 (the surface of the intermediate ceramic portion 105 opposite to the surface located on the upper surface S4 side of the lower ceramic portion 102a) is polished (S180). The step of S180 corresponds to the polishing step in the claims.

[0052] Next, the upper ceramic portion 101a constituting the upper ceramic structure 11 produced in S110 is joined to the upper surface S4 side of the lower ceramic portion 102a (more specifically, onto the intermediate ceramic portion 105 formed on the upper surface S4 of the lower ceramic portion 102a) by the intermediate joint portion 104 (S190, see column C of FIG. 7). More specifically, for example, an adhesive (paste-like adhesive or sheet-like adhesive) containing a silicone-based resin is placed on the upper surface S5 of the intermediate ceramic portion 105, the upper ceramic portion 101a is placed on the adhesive, and a hardening process is performed to harden the adhesive, thereby forming the intermediate joint portion 104 that joins the intermediate ceramic portion 105 and the upper ceramic portion 101a. Through the process of S190, the ceramic member 10 including the lower ceramic portion 102a, the intermediate portion 103 (the intermediate ceramic portion 105 and the intermediate joint portion 104), and the upper ceramic portion 101a is produced. After step S190, processing such as polishing may be performed on the adsorption surface S1 of the ceramic member 10. The step S190 corresponds to a second joining step in the claims.

[0053] Next, an O-ring 90 is attached so as to surround the outer periphery of the stack of the intermediate portion 103 (the intermediate ceramic portion 105 and the intermediate bonding portion 104), the lower ceramic portion 102a, and the bonding portion 30 (S200, see column C in FIG. 7). The electrostatic chuck 100 having the above-described configuration is manufactured mainly through the above steps.

[0054] A-4. Advantages of this embodiment: As described above, the electrostatic chuck 100 of the present embodiment includes the ceramic member 10, the base member 20, and the bonding portion 30. The ceramic member 10 has an adsorption surface S1 that is substantially perpendicular to the Z-axis direction, and a lower surface S2 opposite to the adsorption surface S1. The base member 20 has an upper surface S3, and is disposed so that the upper surface S3 is located on the lower surface S2 side of the ceramic member 10. A coolant flow path 21 is formed inside the base member 20. The bonding portion 30 is disposed between the lower surface S2 of the ceramic member 10 and the upper surface S3 of the base member 20, and bonds the ceramic member 10 and the base member 20. A chuck electrode 40 is disposed inside the ceramic member 10. In addition, a heater electrode 50 formed of a resistance heating element is disposed inside the ceramic member 10 at a position spaced apart from the adsorption surface S1 by the chuck electrode 40.

[0055] The manufacturing method of the electrostatic chuck 100 of this embodiment includes a step of preparing an upper ceramic structure 11 including an upper ceramic portion 101a that is a part of the attracting surface S1 side of the ceramic member 10 and a chuck electrode 40 arranged inside the upper ceramic portion 101a (first preparation step, S110); a step of preparing a lower ceramic structure 12 including a lower ceramic portion 102a that is a part of the lower surface S2 side of the ceramic member 10 and a heater electrode 50 that is arranged so as to be exposed on an upper surface S4 of the lower ceramic portion 102a that is located opposite to the lower surface S2; and a step of joining the lower ceramic portion 102a and the base member 20 that constitute the lower ceramic structure 12 by a joining portion 30 (second preparation step, S120). The method includes a step of measuring a temperature distribution on upper surface S4 of lower ceramic portion 102a while supplying refrigerant to refrigerant flow path 21 and powering heater electrode 50 (measurement step, S150), a step of adjusting the amount of heat generated by heater electrode 50 by grinding a portion of heater electrode 50 exposed on upper surface S4 of lower ceramic portion 102a based on the temperature distribution measurement result of S150 (adjustment step, S160), and a step of fabricating ceramic member 10 including lower ceramic portion 102a and upper ceramic portion 101a by bonding upper ceramic portion 101a constituting upper ceramic structure 11 to upper surface S4 of lower ceramic portion 102a constituting lower ceramic structure 12 (second bonding step, S190).

[0056] As described above, in the manufacturing method of the electrostatic chuck 100 of the present embodiment, the base member 20 is joined to the lower ceramic structure 12, which includes the lower ceramic portion 102a that is a part of the lower surface S2 side of the ceramic member 10, and the heater electrode 50 that is arranged so as to be exposed on the upper surface S4 of the lower ceramic portion 102a that is located opposite the lower surface S2. In this state, the temperature distribution of the upper surface S4 of the lower ceramic portion 102a is measured while supplying the refrigerant to the refrigerant flow path 21 and supplying power to the heater electrode 50. In the manufacturing method of the electrostatic chuck 100 of this embodiment, the amount of heat generated by the heater electrode 50 is adjusted by grinding a part of the heater electrode 50 exposed on the upper surface S4 of the lower ceramic portion 102a based on the measurement result of the temperature distribution in S150, and then the upper ceramic structure 11 including the upper ceramic portion 101a, which is a part of the chucking surface S1 side of the ceramic member 10, and the chuck electrode 40 disposed inside the upper ceramic portion 101a is joined to the upper surface S4 side of the lower ceramic portion 102a. That is, in the manufacturing method of the electrostatic chuck 100 of this embodiment, after a part of the electrostatic chuck 100 closer to the base member 20 (lower side) than the heater electrode 50 is manufactured, the temperature distribution of the upper surface S4 of the lower ceramic portion 102a is measured under the same conditions as those during actual use, and the amount of heat generated by the heater electrode 50 can be adjusted based on the measurement result of the temperature distribution. Therefore, in the manufacturing method of the electrostatic chuck 100 of the present embodiment, it is possible to correct the variation in the amount of heat generated by the heater electrode 50 due to, for example, the variation in the shape of the heater electrode 50, and as a result, it is possible to suppress a decrease in the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10 (and thus the controllability of the temperature distribution of the wafer W held on the attracting surface S1). Note that in this specification, "high controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10" includes at least one of the following meanings: the temperature distribution of the attracting surface S1 as a whole is nearly uniform, and the temperature distribution of the attracting surface S1 for each segment Z is nearly uniform.

[0057] Furthermore, the manufacturing method of the electrostatic chuck 100 of this embodiment further includes a step of forming an intermediate ceramic portion 105 covering the heater electrode 50 on the upper surface S4 of the lower ceramic portion 102a by thermal spraying (thermal spraying step, S170) after the adjustment step S160 and before the second bonding step S190. The second bonding step S190 is a step of producing a ceramic member 10 including the lower ceramic portion 102a, the intermediate ceramic portion 105, and the upper ceramic portion 101a by bonding the upper ceramic portion 101a constituting the upper ceramic structure 11 to the intermediate ceramic portion 105 formed on the upper surface S4 of the lower ceramic portion 102a constituting the lower ceramic structure 12. Therefore, in the manufacturing method of the electrostatic chuck 100 of the present embodiment, the intermediate ceramic portion 105 is not formed on the upper surface S4 of the lower ceramic portion 102a, and the upper ceramic portion 101a constituting the upper ceramic structure 11 is directly bonded to the upper surface S4 of the lower ceramic portion 102a, so that the variation in the thermal conductivity of the ceramic member 10 can be suppressed compared to a mode in which the intermediate ceramic portion 105 is not formed on the upper surface S4 of the lower ceramic portion 102a, and the upper ceramic portion 101a constituting the upper ceramic structure 11 is directly bonded to the upper surface S4 of the lower ceramic portion 102a. More specifically, when a portion of the heater electrode 50 is ground in the adjusting step of S160, the upper surface S4 of the lower ceramic portion 102a itself may be ground, which may result in variation in the thickness of the lower ceramic portion 102a (i.e., variation in the thickness of the ceramic member 10) and thus variation in the thermal conductivity of the ceramic member 10. However, by performing the thermal spraying step of S170, it is possible to suppress the variation in thickness of the lower ceramic portion 102a (i.e., the variation in thickness of the ceramic member 10), and as a result, it is possible to suppress the variation in the thermal conductivity of the ceramic member 10. Therefore, according to the manufacturing method for the electrostatic chuck 100 of the present embodiment, it is possible to effectively suppress the deterioration of the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10.

[0058] Moreover, the manufacturing method of the electrostatic chuck 100 of this embodiment further includes a step (polishing step, S180) of polishing the upper surface S5 of the intermediate ceramic portion 105 (the surface opposite to the surface located on the upper surface S4 side of the lower ceramic portion 102a) after the thermal spraying step of S170 and before the second bonding step of S190. Therefore, in the manufacturing method of the electrostatic chuck 100 of this embodiment, it is possible to suppress the variation in the thickness of the intermediate ceramic portion 105, and as a result, it is possible to effectively suppress the variation in the thickness of the ceramic member 10 and the variation in the thermal conductivity of the ceramic member 10. Therefore, according to the manufacturing method of the electrostatic chuck 100 of this embodiment, it is possible to extremely effectively suppress the deterioration of the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10.

[0059] Furthermore, in the manufacturing method of the electrostatic chuck 100 of the present embodiment, the main body portion 108 of the ceramic member 10 is substantially circular when viewed in the Z-axis direction, the electrostatic chuck 100 includes a plurality of heater electrodes 50, and each of the plurality of heater electrodes 50 is disposed in each of the segments Z when the main body portion 108 of the ceramic member 10 is virtually divided into a plurality of segments Z by at least one circular imaginary dividing line VL concentric with the outer periphery line of the main body portion 108 of the ceramic member 10 when viewed in the Z-axis direction. That is, in the present embodiment, each of the segments Z is not further divided into a plurality of segments along the circumferential direction of the outer periphery line of the main body portion 108 of the ceramic member 10. In the embodiment in which the main body 108 of the ceramic member 10 is virtually divided into a plurality of segments Z by at least one circular virtual dividing line VL concentric with the outer periphery of the main body 108 of the ceramic member 10 as viewed in the Z-axis direction, it is difficult to correct the variation in the heat generation amount of the heater electrodes 50 arranged in each segment Z by controlling the heat generation amount of the other heater electrodes 50, and the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10 is likely to decrease, compared to a configuration in which each segment Z is further divided into a plurality of segments along the circumferential direction of the outer periphery of the main body 108 of the ceramic member 10. In the manufacturing method of the electrostatic chuck 100 of the embodiment, even when such a configuration of the segments Z in which the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10 is likely to decrease is adopted, it is possible to correct the variation in the heat generation amount of each heater electrode 50 caused by, for example, the variation in the shape of each heater electrode 50, and it is possible to suppress the decrease in the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10.

[0060] In the electrostatic chuck 100 of the present embodiment, the ceramic member 10 includes an upper ceramic portion 101 which is a part of the chucking surface S1 side and has a chuck electrode 40 arranged therein, a lower ceramic portion 102 which is a part of the lower surface S2 side and has a heater electrode 50 arranged on an upper surface S4 of the lower ceramic portion 102 opposite to the lower surface S2, and an intermediate joint portion 104 which joins the upper ceramic portion 101 and the lower ceramic portion 102, and when power is supplied to the heater electrode 50 and a coolant is supplied to the coolant flow path 21, and the difference between the maximum and minimum temperatures on the chucking surface S1 is 3.5° C. or less when the difference between the temperature of the heater electrode 50 and the temperature of the coolant is 50° C. or more. In the electrostatic chuck 100 of this embodiment, the temperature difference between various positions on the attracting surface S1 of the ceramic member 10 is extremely small, so that deterioration in controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 can be effectively suppressed.

[0061] B. Second embodiment: 8 is an explanatory diagram illustrating a schematic XZ cross-sectional configuration of the electrostatic chuck 100 according to the second embodiment. In the following, among the configuration of the electrostatic chuck 100 according to the second embodiment, the configuration that is the same as the configuration of the electrostatic chuck 100 according to the first embodiment described above is denoted by the same reference numerals, and the description thereof will be appropriately omitted.

[0062] 8, the electrostatic chuck 100 of the second embodiment differs from the electrostatic chuck 100 of the first embodiment in the configuration of an intermediate portion 103 of a ceramic member 10. More specifically, in the electrostatic chuck 100 of the second embodiment, the intermediate portion 103 of the ceramic member 10 is formed of an intermediate bonding portion 104, and does not include the intermediate ceramic portion 105 in the electrostatic chuck 100 of the first embodiment. That is, in the electrostatic chuck 100 of the second embodiment, the lower ceramic portion 102 is bonded directly to the upper ceramic portion 101 by the intermediate bonding portion 104 without the intermediate ceramic portion 105 being interposed therebetween.

[0063] 9 is a flowchart showing a method for manufacturing the electrostatic chuck 100 according to the second embodiment. Steps S110 to S160 in the method for manufacturing the electrostatic chuck 100 according to the second embodiment are the same as steps S110 to S160 in the method for manufacturing the electrostatic chuck 100 according to the first embodiment. In the method for manufacturing the electrostatic chuck 100 according to the second embodiment, after the adjustment step of S160, the upper ceramic portion 101a constituting the upper ceramic structure 11 is joined to the upper surface S4 side of the lower ceramic portion 102a constituting the lower ceramic structure 12 by an intermediate joining portion 104 (S192). More specifically, for example, an adhesive (paste adhesive or sheet adhesive) containing a silicone resin is placed on the upper surface S4 of the lower ceramic part 102a so as to cover the heater electrode 50, and the upper ceramic part 101a constituting the upper ceramic structure 11 is placed on the adhesive, and a curing process is performed to harden the adhesive, thereby forming an intermediate joint 104 that joins the lower ceramic part 102a and the upper ceramic part 101a. The step of S192 produces a ceramic member 10 including the lower ceramic part 102a and the upper ceramic part 101a. The step of S192 corresponds to a second joining step in the claims. Thereafter, the step of S2000 is performed in the same manner as in the manufacturing method of the electrostatic chuck 100 of the first embodiment.

[0064] As described above, in the manufacturing method of the electrostatic chuck 100 of the second embodiment, similarly to the manufacturing method of the electrostatic chuck 100 of the first embodiment, in a state in which the base member 20 is joined to the lower ceramic structure 12 including the lower ceramic portion 102a which is a part of the lower surface S2 side of the ceramic member 10, and the heater electrode 50 which is arranged so as to be exposed on the upper surface S4 of the lower ceramic portion 102a which is located opposite the lower surface S2, the temperature distribution of the upper surface S4 of the lower ceramic portion 102a is measured while supplying a refrigerant to the refrigerant flow path 21 and supplying power to the heater electrode 50. Furthermore, based on the measurement results of the temperature distribution in S150, the portion of the heater electrode 50 exposed on the upper surface S4 of the lower ceramic portion 102a is ground to adjust the amount of heat generated by the heater electrode 50, and then the upper ceramic structure 11 including the upper ceramic portion 101a, which is a portion of the ceramic member 10 on the chucking surface S1 side, and the chuck electrode 40 disposed inside the upper ceramic portion 101a, is joined to the upper surface S4 side of the lower ceramic portion 102a. That is, after the portion of the electrostatic chuck 100 closer to the base member 20 (lower side) than the heater electrode 50 is fabricated, the temperature distribution of the upper surface S4 of the lower ceramic portion 102a is measured under the same conditions as those during actual use, and the amount of heat generated by the heater electrode 50 can be adjusted based on the measurement results of the temperature distribution. Therefore, in the manufacturing method of the electrostatic chuck 100 of the second embodiment, similar to the manufacturing method of the electrostatic chuck 100 of the first embodiment, it is possible to correct the variation in the heat generation amount of the heater electrode 50 caused, for example, by the variation in the shape of the heater electrode 50, and as a result, it is possible to suppress a decrease in the controllability of the temperature distribution of the adsorption surface S1 of the ceramic member 10 (and, ultimately, the controllability of the temperature distribution of the wafer W held on the adsorption surface S1).

[0065] C. Third embodiment: 10 is an explanatory diagram illustrating a schematic XZ cross-sectional configuration of an electrostatic chuck 100 according to the third embodiment. In the following, among the configuration of the electrostatic chuck 100 according to the third embodiment, the configuration that is the same as the configuration of the electrostatic chuck 100 according to the first embodiment described above is denoted by the same reference numerals, and the description thereof will be appropriately omitted.

[0066] 10, the electrostatic chuck 100 of the third embodiment includes a plurality of chuck electrodes 40 arranged in a planar direction. The electrostatic chuck 100 of the third embodiment also includes power supply terminals (a first power supply terminal 44 and a second power supply terminal 45) for supplying power to each of the chuck electrodes 40. Although not shown in the drawings, the electrostatic chuck 100 of the other embodiments described above also includes power supply terminals for supplying power to the chuck electrodes 40.

[0067] Each of the power supply terminals 44, 45 is housed in a terminal hole 120. The terminal hole 120 is a hole that extends approximately parallel to the Z-axis direction from the lower surface S7 of the base member 20 to the inside of the upper ceramic portion 101 that constitutes the ceramic member 10. A power supply electrode (electrode pad) 43 electrically connected to the chuck electrode 40 through a via 42 is disposed on the bottom surface (upper surface) of each of the terminal holes 120. An upper end portion of each of the power supply terminals 44, 45 is joined to the power supply electrode 43 by, for example, brazing.

[0068] Here, the first power supply terminal 44 is disposed near the center of the adsorption surface S1 as viewed in the Z-axis direction. More specifically, the first power supply terminal 44 is disposed at a position within 5% of the diameter of the adsorption surface S1 from the center of the adsorption surface S1 as viewed in the Z-axis direction (for example, the inner area of ​​a circle having a diameter having a length within 5% of the diameter of the adsorption surface S1 and centered at the center of the adsorption surface S1 as viewed in the Z-axis direction). The first power supply terminal 44 is composed of, for example, three parts (upper part 44a, middle part 44b, lower part 44c in order from the top) made of metal or the like. The upper part 44a and the lower part 44c are columnar parts. The upper end of the upper part 44a is joined to the power supply electrode 43. The middle part 44b is composed of, for example, a twisted wire, and connects the upper part 44a and the lower part 44c. The middle portion 44b is joined to the upper portion 44a and the lower portion 44c by, for example, crimping.

[0069] The second power supply terminal 45 is disposed outside the vicinity of the center of the suction surface S1 (at the periphery) as viewed in the Z-axis direction. More specifically, the second power supply terminal 45 is disposed at a position where the distance from the center of the suction surface S1 exceeds 5% of the diameter of the suction surface S1 as viewed in the Z-axis direction. The second power supply terminal 45 is composed of three parts (upper part 45a, middle part 45b, and lower part 45c, in that order from the top) made of metal or the like. The upper end of the upper part 45a is joined to the power supply electrode 43. The upper part 45a is entirely located closer to the suction surface S1 (i.e., on the upper side) than the surface of the upper ceramic part 101 opposite to the suction surface S1 (hereinafter referred to as the "lower surface S8"). The lower surface of the upper part 45a is formed with a recess in which a female screw is formed. The lower part 45c is a columnar part, and a recess is formed at the upper end of the lower part 45c. The intermediate portion 45b is a portion that connects the upper portion 45a and the lower portion 45c. An upper end portion of the intermediate portion 45b is formed with a male screw, and is screwed into the recessed portion of the upper portion 45a where the female screw is formed. The lower end portion of the intermediate portion 45b is, for example, in the shape of a leaf spring, and is fitted into the recessed portion of the lower portion 45c.

[0070] As described above, in the electrostatic chuck 100 according to the third embodiment, the power supply terminals 44 and 45 are (1) A first condition is met that the first power supply terminal 44 is disposed at a position within 5% of the diameter of the attraction surface S1 from the center of the attraction surface S1 as viewed in the Z-axis direction (the first power supply terminal 44 satisfies this condition); (2) A second condition is met (the second power supply terminal 45 satisfies this condition) that the upper ceramic portion 101 has a first terminal portion (e.g., upper portion 45a of the second power supply terminal 45) located on a side closer to the adsorption surface S1 (upper side) than a surface (lower surface S8) of the upper ceramic portion 101 opposite the adsorption surface S1, and a second terminal portion (e.g., middle portion 45b of the second power supply terminal 45) located on a side farther from the adsorption surface S1 (lower side) than the first terminal portion and detachably attached to the first terminal portion; At least one of the following is satisfied.

[0071] Next, a method for regenerating and manufacturing the electrostatic chuck 100 according to the third embodiment will be described. When the electrostatic chuck 100 is used repeatedly, for example, contaminants such as residual cleaning liquid from the wafer W may adhere to the attracting surface S1, or fine irregularities may be formed, which may reduce the chucking force for attracting the wafer W, or may reduce the adhesion between the attracting surface S1 and the wafer W, resulting in leakage of inert gas. In such a case, for example, it is possible to recover the performance by grinding the attracting surface S1, but if this is repeated, the thickness between the attracting surface S1 and the chuck electrode 40 may not reach the specified thickness. For example, in such a case, a process for regenerating and manufacturing the electrostatic chuck 100 is performed by replacing a portion of the ceramic member 10 including the attracting surface S1, i.e., the upper ceramic portion 101.

[0072] Fig. 11 is a flowchart showing a flow of a method for remanufacturing the electrostatic chuck 100 according to the third embodiment. Also, Fig. 12 is an explanatory diagram showing an overview of the method for remanufacturing the electrostatic chuck 100 according to the third embodiment.

[0073] First, among the power supply terminals 44, 45 for supplying power to the chuck electrode 40, a portion of the second power supply terminal 45 arranged on the periphery, specifically, the middle portion 45b and the lower portion 45c, are removed (S310). As described above, the upper portion 45a and the middle portion 45b of the second power supply terminal 45 are joined by a screw thread, so that only the middle portion 45b and the lower portion 45c can be easily removed by loosening and removing the screw thread. The O-ring 90 is also removed.

[0074] 12, section A shows a state in which the O-ring 90 and the middle portion 45b and the lower portion 45c of the second power supply terminal 45 have been removed from the electrostatic chuck 100. As described above, the upper portion 45a of the second power supply terminal 45 is located entirely above the lower surface S8 of the upper ceramic portion 101. Therefore, in a state in which the middle portion 45b and the lower portion 45c of the second power supply terminal 45 have been removed, no member is disposed in the portion of the terminal hole 120 for the second power supply terminal 45 below the lower surface S8 of the upper ceramic portion 101, leaving a space.

[0075] Next, the intermediate bonded portion 104 is cut (S320). More specifically, while the electrostatic chuck 100 is placed on a rotating table (not shown) and rotated, the intermediate bonded portion 104 is cut using a predetermined tool such as a jigsaw T. Column B of FIG. 12 shows how the intermediate bonded portion 104 is cut using the jigsaw T. At this time, of the power supply terminals 44, 45 for supplying power to the chuck electrode 40, the second power supply terminal 45 arranged on the periphery has the middle portion 45b and the lower portion 45c removed, so that the second power supply terminal 45 does not interfere with the cutting of the intermediate bonded portion 104. On the other hand, the first power supply terminal 44 arranged near the center interferes with the cutting of the intermediate bonded portion 104. Therefore, the intermediate bonded portion 104 is easily cut, leaving the vicinity of the center.

[0076] Next, the upper ceramic portion 101 is removed (S330). In the above-mentioned S320, the intermediate bonding portion 104 is cut except for the vicinity of the center, so that the upper ceramic portion 101 can be easily removed by cutting the first power supply terminal 44 located near the center and the intermediate bonding portion 104 remaining near the center using a predetermined tool.

[0077] Next, a newly produced upper ceramic portion 101 is joined by a newly formed intermediate joint portion 104 (S340). Next, the first power supply terminal 44 and the second power supply terminal 45 are attached to the upper ceramic portion 101 (S350). Regarding the second power supply terminal 45, if the upper portion 45a has already been joined to the newly produced upper ceramic portion 101, the remaining portions of the second power supply terminal 45, i.e., the middle portion 45b and the lower portion 45c, are attached. If the upper portion 45a has not already been joined to the newly produced upper ceramic portion 101, the second power supply terminal 45 is joined (e.g., brazed) to the power supply electrode 43.

[0078] Finally, the O-ring 90 is attached (S360). Through the above steps, the electrostatic chuck 100 is remanufactured and manufactured.

[0079] As described above, the electrostatic chuck 100 of the third embodiment includes the power supply terminals 44, 45 for supplying power to the chuck electrode 40. (1) A first condition is that the contact surface S1 is located within 5% of the diameter of the contact surface S1 from the center of the contact surface S1 when viewed in the Z-axis direction; and (2) A second condition that the upper ceramic portion 101 has a first terminal portion (e.g., upper portion 45a of the second power supply terminal 45) located on a side closer to the adsorption surface S1 (upper side) than a surface (lower surface S8) opposite the adsorption surface S1, and a second terminal portion (e.g., middle portion 45b of the second power supply terminal 45) located on a side farther from the adsorption surface S1 (lower side) than the first terminal portion and detachably attached to the first terminal portion; Therefore, in the electrostatic chuck 100 of the third embodiment, since there is no power supply terminal for supplying power to the chuck electrode 40 at a position other than the vicinity of the center of the attracting surface S1 as viewed in the Z-axis direction, or even if there is a power supply terminal, the remaining portion can be removed while leaving a portion located above the lower surface S8 of the upper ceramic portion 101, the portion of the intermediate joint portion 104 other than the vicinity of the center can be easily cut, and thus the upper ceramic portion 101 can be easily removed and replaced.

[0080] D. Variations: The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0081] The configuration of the electrostatic chuck 100 in the above embodiment is merely an example and can be modified in various ways. For example, the number of heater electrodes 50, the shape of each heater electrode 50, and the arrangement of each heater electrode 50 in the ceramic member 10 in the above embodiment are merely an example and can be modified in various ways. For example, the electrostatic chuck 100 in the above embodiment includes three heater electrodes 50, but the number of heater electrodes 50 included in the electrostatic chuck 100 may be two or less, or four or more. Similarly, the number of segments Z, the shape of each segment Z, and the arrangement of each segment Z in the ceramic member 10 in the above embodiment are merely an example and can be modified in various ways. Note that the manufacturing method of the electrostatic chuck 100 in the above embodiment is suitable for a form in which the number of segments Z is relatively small (for example, the number of segments Z is about 10 or less). In addition, the segments Z may not be set in the ceramic member 10.

[0082] Moreover, the number of the driver electrodes 60, the shape of each driver electrode 60, and the arrangement of each driver electrode 60 in the ceramic member 10 in the above embodiment are merely examples, and various modifications are possible. Moreover, in the above embodiment, the electrostatic chuck 100 may not include the driver electrode 60. Moreover, in the above embodiment, each via may be composed of a single via, or may be composed of a group of multiple vias. Moreover, in the above embodiment, each via may have a single-layer configuration consisting of only a via portion, or may have a multiple-layer configuration (for example, a configuration in which a via portion, a pad portion, and a via portion are laminated). Moreover, in the above embodiment, the electrostatic chuck 100 may not include the O-ring 90. Moreover, in the above embodiment, the ceramic member 10 may not have a flange portion 109.

[0083] In addition, in the above embodiment, a monopolar system in which one chuck electrode 40 is provided inside the ceramic member 10 is adopted, but a bipolar system in which a pair of chuck electrodes 40 are provided inside the ceramic member 10 may be adopted. In addition, the materials forming each member of the electrostatic chuck 100 in the above embodiment are merely examples, and each member may be formed of other materials. In addition, in the above embodiment, the upper ceramic portion 101 and the lower ceramic portion 102 may be formed of the same type of ceramic material, or may be formed of different types of ceramic materials.

[0084] Furthermore, the manufacturing method of the electrostatic chuck 100 in the above embodiment is merely an example and can be modified in various ways. For example, in the manufacturing method of the electrostatic chuck 100 in the first embodiment, the polishing step (S180) of the intermediate ceramic portion 105 is performed, but this step may be omitted. Furthermore, in the above embodiment, the upper ceramic portion 101a and the lower ceramic portion 102a are manufactured by firing a laminate of ceramic green, but at least one of the upper ceramic portion 101a and the lower ceramic portion 102a may be manufactured by another method (for example, hot press firing).

[0085] The configuration of the electrostatic chuck 100 in the third embodiment is merely an example and can be modified in various ways. For example, the electrostatic chuck 100 in the third embodiment includes, as power supply terminals for supplying power to the chuck electrode 40, one first power supply terminal 44 located near the center and one second power supply terminal 45 located at the periphery, but the electrostatic chuck 100 may not include one of these terminals, or the electrostatic chuck 100 may include power supply terminals for supplying power to the chuck electrode 40 other than these terminals. The configurations of the first power supply terminal 44 and the second power supply terminal 45 in the third embodiment are merely an example and can be modified in various ways. For example, in the third embodiment, the second power supply terminal 45 is composed of three parts (upper part 45a, middle part 45b, lower part 45c), but the second power supply terminal 45 may be composed of two parts or four or more parts, so long as it has a first terminal part located closer to the adsorption surface S1 than the surface (lower surface S8) of the upper ceramic part 101 opposite to the adsorption surface S1, and a second terminal part located farther from the adsorption surface S1 than the first terminal part and detachably attached to the first terminal part. Also, for example, in the third embodiment, the first power supply terminal 44 is composed of three parts (upper part 44a, middle part 44b, lower part 44c), but the first power supply terminal 44 may be composed of two or less parts or four or more parts. In addition, in the third embodiment, the connection between the upper portion 45a and the middle portion 45b of the second power supply terminal 45 is by a screw connection, but other connection forms (for example, fitting) may be used as long as they are detachable.

[0086] Furthermore, the present invention is not limited to electrostatic chuck 100 which includes a ceramic member 10 and a base member 20 and holds a wafer W by utilizing electrostatic attraction, but is similarly applicable to other holding devices which include a ceramic member, a base member, a joint which joins the ceramic member and the base member, and a heater electrode and a chuck electrode disposed inside the ceramic member and which hold an object on the surface of the ceramic member. [Explanation of symbols]

[0087] 10: Ceramic member 11: Upper ceramic structure 12: Lower ceramic structure 13: Recess 20: Base member 21: Coolant flow path 22: Through hole 30: Joint 32: Through hole 40: Chuck electrode 42: Via 43: Power supply electrode 44: First power supply terminal 44a: Upper portion 44b: Middle portion 44c: Lower portion 45: Second power supply terminal 45a: Upper portion 45b: Middle portion 45c: Lower portion 50: Heater electrode 51: Heater line portion 52: Heater pad portion 60: Driver electrode 71: Heater side via 72: Power supply side via 73: Power supply electrode 74: Power supply terminal 90: O-ring 100: Electrostatic chuck 101, 101a: Upper ceramic portion 102, 102a: Lower ceramic part 103: Middle part 104: Middle joint part 105: Middle ceramic part 108: Main body part 109: Flange part 110: Terminal hole 600: Driver electrode pair BD: Shot blasting device BM: Blasting material MA: Mask S1: Adsorption surface S2: Lower surface S3: Upper surface S4: Upper surface S5: Upper surface S7: Lower surface S8: Lower surface VL: Virtual parting line W: Wafer Z: Segment

Claims

1. A ceramic member having a first surface substantially perpendicular to a first direction and a second surface opposite to the first surface; a chuck electrode disposed inside the ceramic member; a heater electrode formed of a resistance heating element and disposed inside the ceramic member at a position spaced apart from the first surface relative to the chuck electrode; a driver electrode that is a conductor pattern of a predetermined shape that is arranged inside the ceramic member and is electrically connected to the heater electrode and is parallel to a surface direction; a base member having a third surface, the third surface being disposed on the second surface side of the ceramic member, the base member having a coolant flow path formed therein; a joining portion disposed between the second surface of the ceramic member and the third surface of the base member to join the ceramic member and the base member; A holding device for holding an object on the first surface of the ceramic member, The ceramic member is a first ceramic portion that is a portion of the first surface side, the first ceramic portion having the chuck electrode disposed therein; a second ceramic part which is a part of the second surface side, the second ceramic part being a sintered body having the heater electrode disposed on a fourth surface of the second ceramic part opposite to the second surface and the driver electrode disposed therein; a second joining portion joining the first ceramic portion and the second ceramic portion; an O-ring surrounding an outer periphery of the joint portion, the second ceramic portion, and the second joint portion and sealing the joint portion, the second ceramic portion, and the second joint portion; Including, when power is supplied to the heater electrode and a coolant is supplied to the coolant flow path, and when a difference between a temperature of the heater electrode and a temperature of the coolant is 50° C. or more, a difference between a maximum value and a minimum value of the temperature on the first surface is 3.5° C. or less. A holding device characterized in that

2. 2. The holding device according to claim 1, The first ceramic portion is formed with a flange portion that protrudes in a direction perpendicular to the first direction, A retaining device, wherein the O-ring is disposed between a surface of the flange portion that is located on the third surface side of the base member and the third surface of the base member.

3. The holding device according to claim 1 or 2, A holding device, wherein the joint is made of a silicone-based resin, an acrylic-based resin, or an epoxy-based resin.

4. A holding device according to any one of claims 1 to 3, a holding device, wherein a portion of the heater electrode is ground so that when power is supplied to the heater electrode and a coolant is supplied to the coolant flow path and the difference between the temperature of the heater electrode and the temperature of the coolant is 50°C or more, a difference between the maximum and minimum temperatures on the first surface is 3.5°C or less.

5. The holding device according to any one of claims 1 to 4, further comprising: at least one power supply terminal for supplying power to the chuck electrode; The at least one power supply terminal is (1) A first condition that the first surface is located at a position within 5% of a diameter of the first surface from a center of the first surface when viewed in the first direction; (2) the first ceramic portion has a first terminal portion located closer to the first surface than a surface opposite to the first surface, and a second terminal portion located farther from the first surface than the first terminal portion and detachably attached to the first terminal portion; and A holding device characterized in that

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