Temperature control device, processing device, and article manufacturing method

Abstract

To provide a technique advantageous for improving an efficiency of cooling by a temperature adjustment device.SOLUTION: A temperature adjustment device includes: a first heat exchanger having a first inlet port and a first outlet port; a second heat exchanger having a second inlet port and a second outlet port; a first flow channel connecting the first outlet port and a branched part; a second flow channel connecting the branched part and a confluent part, and arranged so as to cool a first heat generation source; a third flow channel connecting the branched part and the second inlet port; a fourth flow channel connecting the second outlet port and the confluent part, and arranged so as to cool a second heat generation source; a fifth flow channel connecting the confluent part and the first inlet port; a first heater arranged between the first heat generation source and the branched part in the second flow channel; a second heater arranged between the second heat generation source and the second outlet port in the fourth flow channel; and a temperature control part configured to control the first heater and the second heater so as to adjust a temperature of the first heat generation source and a temperature of the second heat generation source.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a temperature adjustment device, a processing device, and an article manufacturing method. [Background technology]

[0002] Cooling the heat source in the device and keeping the inside of the device at a constant temperature is an essential technique for maintaining the performance of the device. In the process of manufacturing articles such as semiconductor devices, higher performance is required for the device due to the recent high integration of semiconductor devices. For example, in an exposure device, it is necessary to improve the alignment accuracy between the substrate and the original and the transfer accuracy of the pattern of the original to the substrate. In order to guarantee the performance of the device, it is necessary to prevent the performance from decreasing due to the influence of thermal expansion, etc., and for this purpose, the main part of the device is surrounded by a chamber and the temperature in the chamber can be maintained constant. However, since various components constituting the main part generate heat, temperature fluctuations also occur in the chamber. In a conventional temperature adjustment device that suppresses the decrease in accuracy due to temperature fluctuations, for example, a refrigerant cooled by a heat exchanger is heated to a predetermined temperature by a reheat heater, and each heat source is cooled by the refrigerant. Patent Document 1 describes a configuration in which a chamber is divided into multiple spaces, and each space is connected to a separate air conditioning means provided outside the chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 4-22118 Summary of the Invention [Problem to be solved by the invention]

[0004] A configuration in which the refrigerant cooled by a heat exchanger is distributed to multiple systems and the temperature of the refrigerant is heated to a desired temperature by a reheat heater in each system is advantageous for simplifying the configuration of the temperature adjustment device and for precise temperature adjustment. However, in such a configuration, since it is necessary to operate the heat exchanger so as to match the cooling capacity to the system that generates the greatest amount of heat, there is a problem that the cooling capacity becomes excessive in systems other than the system that generates the greatest amount of heat, and the energy consumed for temperature control increases.

[0005] An object of the present invention is to provide an advantageous technique for improving the efficiency of cooling by a temperature adjustment device. [Means for solving the problem]

[0006] One aspect of the present invention relates to a temperature adjustment device, the temperature adjustment device including: a first heat exchanger having a first inlet port and a first outlet port; a second heat exchanger having a second inlet port and a second outlet port; a first flow path connecting the first outlet port and a branching portion; a second flow path connecting the branching portion and a junction portion and arranged to cool a first heat source; a third flow path connecting the branching portion and the second inlet port; a fourth flow path connecting the second outlet port and the junction portion and arranged to cool a second heat source; a fifth flow path connecting the junction portion and the first inlet port; a first heater arranged in the second flow path between the branching portion and the first heat source; a second heater arranged in the fourth flow path between the second outlet port and the second heat source; and a temperature control unit that controls the first heater and the second heater such that a temperature of the first heat source and a temperature of the second heat source are adjusted. Effect of the Invention

[0007] According to the present invention, an advantageous technique is provided for improving the efficiency of cooling by a temperature adjustment device. [Brief description of the drawings]

[0008] [Figure 1]FIG. 1 is a diagram illustrating a configuration of a temperature adjustment device according to a first embodiment. [Diagram 2] FIG. 6 is a diagram illustrating a configuration of a temperature adjustment device according to a second embodiment. [Diagram 3] FIG. 13 is a diagram illustrating a configuration of a temperature adjustment device according to a third embodiment. [Figure 4] FIG. 13 is a diagram illustrating a configuration of a temperature adjustment device according to a fourth embodiment. [Diagram 5] FIG. 2 is a block diagram of a temperature control system according to the first embodiment. [Figure 6] FIG. 11 is a block diagram of a configuration example of a temperature control system according to a second embodiment. [Figure 7] FIG. 11 is a block diagram of another configuration example of the temperature control system according to the second embodiment. [Figure 8] FIG. 13 is a block diagram of yet another configuration example of the temperature control system according to the second embodiment. [Figure 9] FIG. 11 is a block diagram of a temperature control system according to a third embodiment. [Figure 10] FIG. 2 is a diagram showing the configuration of a processing apparatus incorporating a temperature adjustment device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] In this specification, reference numbers with subscripts are used to distinguish multiple components that are given reference numbers with the same part other than the subscript from each other by the subscript. When a component with a reference number with a subscript is described by the part other than the subscript, the function, operation, or feature of each component to which the reference number is given is comprehensively described.

[0011] A temperature adjustment device 101 of the first embodiment will be described with reference to Fig. 1. The temperature adjustment device 101 may include a first heat exchanger E1 and a second heat exchanger E2. The first heat exchanger E1 may have a first inlet port HPI1 and a first outlet port HPO1 on the high temperature side, and a first inlet port LPI1 and a first outlet port LPO1 on the low temperature side. The second heat exchanger E2 may have a second inlet port HPI2 and a second outlet port HPO2 on the high temperature side, and a second inlet port LPI2 and a second outlet port LPO2 on the low temperature side.

[0012] The temperature adjustment device 101 may also include a first flow path FP1, a second flow path FP2, a third flow path FP3, a fourth flow path FP4, a fifth flow path FP5, a branching portion 121, and a merging portion 122. The first flow path FP1 may connect the first outlet port HPO1 on the high temperature side of the first heat exchanger E1 to the branching portion 121. The second flow path FP2 may connect the branching portion 121 to the merging portion 122 and be disposed so as to cool the first heat source 103a. The third flow path FP3 may connect the branching portion 121 to the second inlet port HPI2 on the high temperature side of the second heat exchanger E2. The fourth flow path FP4 may connect the second outlet port HPO2 on the high temperature side of the second heat exchanger E2 to the merging portion 122 and be disposed so as to cool the second heat source 103f. The fifth flow path FP5 can connect the junction 122 and the first inlet port HPI1 on the high temperature side of the first heat exchanger E1.

[0013] The first flow path FP1, the second flow path FP2, the third flow path FP3, the fourth flow path FP4, and the fifth flow path FP5 constitute a first circulation path C1 for circulating the first refrigerant R1. The first circulation path C1 may include a first sub-circulation path and a second sub-circulation path. The first sub-circulation path is from the first outlet port HPO1 on the high temperature side of the first heat exchanger E1 through the first flow path FP1, the branching portion 121, the second flow path FP2, the merging portion 122, and the fifth flow path FP5 to the first inlet port HPI1 on the high temperature side of the first heat exchanger E1. The second sub-path is from the first outlet port HPO1 of the first heat exchanger E1 through the first flow path FP1, the branching portion 121, the third flow path FP3, the second heat exchanger E2, the fourth flow path FP4, the merging portion 122, and the fifth flow path FP5 to the first inlet port HPI1 of the first heat exchanger E1.

[0014] The temperature adjustment device 101 may further include a first heater 104a and a second heater 104f. The first heater 104a may be disposed between the branching portion 121 of the second flow path FP2 and the first heat source 103a. The second heater 104f may be disposed between the second outlet port HP02 on the high temperature side of the second heat exchanger E2 and the second heat source 103f of the fourth flow path FP4. The temperature adjustment device 101 may further include a temperature control unit 110 that controls the first heater 104a and the second heater 104f so that the temperatures of the first heat source 103a and the second heat source 103f are adjusted.

[0015] The temperature adjustment device 101 may include a first temperature measuring device that measures the temperature of the first refrigerant R1 flowing through the second flow path FP2 and a second temperature measuring device that measures the temperature of the first refrigerant R1 flowing through the fourth flow path FP4. The temperature control unit 110 may control the first heater 104a based on the measurement result by the first temperature measuring device so that the first refrigerant R1 flowing through the second flow path FP2 is heated to a target temperature. The temperature control unit 110 may control the second heater 104f based on the measurement result by the second temperature measuring device so that the first refrigerant R1 flowing through the fourth flow path FP4 is heated to a target temperature. The first temperature measuring device may include a temperature sensor 105a that measures the temperature of the first refrigerant R1 between the first heat source 103a and the junction 122. The second temperature measuring device may include a temperature sensor that measures the temperature of the first refrigerant R1 between the second heat source 103f and the junction 122.

[0016] The temperature adjustment device 101 may include a storage tank 106 and a pump 107 for pumping the first refrigerant R1 from the storage tank 106 between the first outlet port HP01 on the high temperature side of the first heat exchanger E1 and the branching portion 121.

[0017] The temperature adjustment device 101 may further include a second circulation path C2 that circulates the second refrigerant R2 on the low-temperature side of the first heat exchanger E1 and the second heat exchanger E2. A compressor 108 that compresses the second refrigerant R2 and a condenser 109 that condenses the second refrigerant R2 compressed by the compressor 108 may be disposed in the second circulation path C2. The second refrigerant R2 condensed by the condenser 109 may be sent to the first inlet port LPI1 on the low-temperature side of the first heat exchanger E1 and the second inlet port LPI2 on the low-temperature side of the second heat exchanger E2. The second refrigerant R2 flowing out from the first outlet port LPO1 on the low-temperature side of the first heat exchanger E1 and the second refrigerant R2 flowing out from the second outlet port LPO2 on the low-temperature side of the second heat exchanger E2 may be sent to the compressor 108. The first heat exchanger E1, the second heat exchanger E2, the compressor 108, the condenser 109, and the second circulation path C2 may constitute the refrigerator 102. Such a refrigerator 102 is advantageous in terms of space saving compared to a configuration in which the compressor 108 and the condenser 109 are provided separately for the first heat exchanger E1 and the second heat exchanger E2, respectively.

[0018] The first refrigerant R1 that flows into the first inlet port HPI1 on the high temperature side of the first heat exchanger E1 and flows out from the first outlet port HPO1 on the high temperature side of the first heat exchanger E1 is cooled by heat exchange with the second refrigerant R2 in the first heat exchanger E1. The first refrigerant R1 that flows out from the first outlet port HPO1 on the high temperature side of the first heat exchanger E1 passes through the first flow path FP1 and is branched into the third flow path FP3 at the branching section 121. The first refrigerant R1 that has passed through the third flow path FP3 flows into the second inlet port HPI2 on the high temperature side of the second heat exchanger E2, is cooled by heat exchange with the second refrigerant R2 in the second heat exchanger E2, and flows out from the second outlet port HPO2 on the high temperature side of the second heat exchanger E2. That is, the first refrigerant R1 that passes through the first heat exchanger E1, through the first flow path FP1, the branching portion 121, and the third flow path FP3, and reaches the second heat exchanger E2 is cooled in two stages by heat exchange with the second refrigerant R2 twice. Therefore, the temperature of the first refrigerant R1 flowing out from the second outlet port HP02 on the high temperature side of the second heat exchanger E2 is lower than the temperature of the first refrigerant R1 flowing out from the first outlet port HP01 on the high temperature side of the first heat exchanger E1.

[0019] In one example, the maximum heat generation amount of the second heat generation source 103f arranged in the fourth flow path FP4 is greater than the maximum heat generation amount of the first heat generation source 103a arranged in the second flow path FP2. Alternatively, the average heat generation amount of the second heat generation source 103f arranged in the fourth flow path FP4 is greater than the average heat generation amount of the first heat generation source 103a arranged in the second flow path FP2. In one example, the temperature control unit 110 can control the first heater 104a to heat the first refrigerant R1 to a first target temperature, and control the second heater 104f to heat the first refrigerant R1 to a second target temperature lower than the first target temperature.

[0020] The heat source whose temperature is adjusted by the first refrigerant R1 flowing out from the second outlet port HP02 on the high temperature side of the second heat exchanger E2 may include not only the second heat source 103f but also other heat sources. In this case, the second flow path FP2 may be branched into sub-flow paths equal in number to the heat sources whose temperatures are to be adjusted, and a heater and a heat source may be disposed in each sub-flow path.

[0021] The heat source whose temperature is adjusted by the first refrigerant R1 discharged from the first outlet port HP01 on the high temperature side of the first heat exchanger E1 may include not only the first heat source 103a but also other heat sources. In this case, the first flow path FP1 may be branched into sub-flow paths as many as the heat sources whose temperatures are to be adjusted, and a heater and a heat source may be disposed in each sub-flow path. More specifically, the temperature adjustment device 101 may include a sixth flow path FP6 as a sub-flow path that connects the branching portion 121 and the merging portion 122 and is disposed so as to cool the third heat source 103b. The temperature adjustment device 101 may also include a third heater 104b that is disposed between the branching portion 121 and the third heat source 103b of the sixth flow path FP6. Alternatively, the temperature adjustment device 101 may include a plurality of sixth flow paths FP6 as a plurality of sub-flow paths that connect the branching portion 121 and the merging portion 122 and is disposed so as to cool the plurality of third heat sources 103b to 103e, respectively. In this case, the temperature adjustment device 101 may include a plurality of third heaters 104b to 104e disposed between the branching portion 121 of each of the sixth flow paths FP6 and each of the third heat sources 103b to 103e.

[0022] The flow rate of the first refrigerant R1 flowing through the third flow path FP3 may be less than 50%, less than 40%, less than 30%, less than 20%, or less than 10% of the flow rate of the first refrigerant R1 flowing through the first flow path FP1. At least one heat source having the largest maximum heat generation amount or the largest average heat generation amount among the plurality of heat generation sources 103a-103f may be disposed in the fourth flow path FP4, and the remaining heat generation sources may be disposed in the second flow path FP2 or the third flow path FP3. With this configuration, the amount of heating of the first refrigerant R1 by the heater disposed in the second flow path FP2 or the third flow path FP3 can be reduced, and therefore the efficiency of cooling by the temperature adjustment device 101 can be improved.

[0023] On the other hand, in a configuration without the second heat exchanger E2, the temperature of the first refrigerant needs to be excessively lowered by the first heat exchanger E1 to a temperature corresponding to the heat source with the highest maximum or average heat generation. Therefore, the amount of heating of the first refrigerant R1 by the heater provided in the flow path that cools the heat source other than the heat source with the highest maximum or average heat generation needs to be excessively large. This results in a large amount of energy consumption.

[0024] The temperature measuring device (temperature sensor 105), the heater 104 corresponding thereto, and the temperature control unit 110 may constitute a feedback control system that controls the temperature of the first refrigerant R1 or the heat generation source 103. FIG. 5 shows a block diagram of such a feedback control system. The temperature control unit 110 may include a subtractor 141 and a compensation calculator 142. The subtractor 141 may calculate the deviation e between a target temperature r1 provided from a main control unit (not shown) and a temperature y1 (in the example of FIG. 1, the temperature of the first refrigerant R1 after cooling the heat generation source 103) measured by the temperature measuring device (temperature sensor 105). The compensation calculator 142 may perform a compensation calculation on the deviation e to generate an operation amount u and provide it to the heater 104. The heater 104 may heat the first refrigerant R1 according to the operation amount u. The first refrigerant R1 that has passed through the heater 104 has a temperature y2 and may be provided to the heat generation source 103. The feedback control system can feedback control the temperature of the first refrigerant R1 after cooling the heat source 103, in other words, the temperature of the first refrigerant R1 at the outlet of the heat source 103, so that it becomes a target temperature r1. A feedback control system can be provided for each heat source 103.

[0025] As described above, the above configuration can reduce the amount of heating of the first refrigerant R1 by the first heater 104a arranged in the first flow path FP1 in which the first heat source 103a is arranged, compared to a configuration that does not include the second heat exchanger E2. Therefore, the range of the operation amount given to the first heater 104a can be reduced, which is advantageous for precise control of the temperature of the first refrigerant R1 by the first heater 104a.

[0026] The temperature adjustment device 101 of the second embodiment will be described with reference to FIG. 2. Matters not mentioned as the second embodiment may follow the first embodiment. In the second embodiment, the first temperature measuring device may include a temperature sensor 201a that measures the temperature of the first refrigerant R1 between the first heat source 103a and the first heater 104a, or the temperature of the first refrigerant R at the inlet of the first heat source 103a. Similarly, the second temperature measuring device may include a temperature sensor 201f that measures the temperature of the first refrigerant R1 between the second heat source 103f and the second heater 104f, or the temperature of the first refrigerant R1 at the inlet of the second heat source 103f. Similarly, each third temperature measuring device may include a temperature sensor 201 that measures the temperature of the first refrigerant R1 between the third heat source 103 and the third heater 104, or the temperature of the first refrigerant R1 at the inlet of the third heat source 103. In FIG. 2, the four sixth temperature sensors 201 provided in the four sixth flow paths FP6, respectively, are indicated as 201b to 201d.

[0027] The temperature measuring device (temperature sensor 201), the heater 104 corresponding thereto, and the temperature control unit 110 may constitute a feedback control system that controls the temperature of the first refrigerant R1 or the heat generation source 103. FIG. 6 shows a block diagram of such a feedback control system. The temperature control unit 110 may include a subtractor 141 and a compensation calculator 142. The subtractor 141 may calculate the deviation e between a target temperature r1 provided from a main control unit (not shown) and a temperature y2 (in the example of FIG. 2, the temperature of the first refrigerant R1 after being heated by the heater 104 and before cooling the heat generation source 103) measured by the temperature measuring device (temperature sensor 201). The compensation calculator 142 may perform a compensation calculation on the deviation e to generate an operation amount u and provide it to the heater 104. The heater 104 may heat the first refrigerant R1 according to the operation amount u. The first refrigerant R1 that has passed through the heater 104 may be provided to the heat generation source 103. The feedback control system can feedback control the temperature of the first refrigerant R1 so that the temperature of the first refrigerant R1 after being heated by the heater 104 and before cooling the heat source 103, in other words, the temperature of the first refrigerant R1 at the inlet of the heat source 103, becomes a target temperature r1. A feedback control system can be provided for each heat source 103.

[0028] The first temperature measuring device may include a first temperature sensor 105a that measures the temperature of the first refrigerant R1 between the first heat source 103a and the junction 122, and a second temperature sensor 201a that measures the temperature of the first refrigerant R1 between the first heat source 103a and the first heater 104a. The second temperature measuring device may include a third temperature sensor 105f that measures the temperature of the first refrigerant R1 between the second heat source 103f and the junction 122, and a fourth temperature sensor 201f that measures the temperature of the first refrigerant R1 between the second heat source 103f and the second heater 104f. Similarly, each third temperature measuring device may include a fifth temperature sensor 105 that measures the temperature of the first refrigerant R1 between the third heat source 103 and the junction 122, and a sixth temperature sensor 201 that measures the temperature of the first refrigerant R1 between the third heat source 103 and the third heater 104. In addition, in FIG. 2, the four fifth temperature sensors 105 provided in the four sixth flow paths FP6, respectively, are shown as temperature sensors 105b to 105d, and the four sixth temperature sensors 201 provided in the four sixth flow paths FP6, respectively, are shown as 201b to 201d.

[0029] The temperature control unit 110 may control the first heater 104a based on the measurement results by the first temperature sensor 105a and the second temperature sensor 201a, and may control the second heater 104f based on the measurement results by the third temperature sensor 105f and the fourth temperature sensor 201f. The temperature control unit 110 may feedback-control the third heater 104 based on the measurement results by the fifth temperature sensor 105 and the sixth temperature sensor 201. FIG. 7 shows a block diagram of such a feedback control system. The temperature control unit 110 may include a subtractor 141 and a compensation calculator 142. The subtractor 141 may calculate the deviation e between the target temperature r1 provided from the main control unit (not shown) and the evaluation temperature of the first refrigerant R1 obtained from the temperatures y1 and y2 measured by the temperature measuring devices (temperature sensors 105 and 201). The compensation calculator 142 may perform a compensation calculation on the deviation e to generate an operation amount u and provide it to the heater 104. The heater 104 may heat the first refrigerant R1 in accordance with the manipulated variable u. The first refrigerant R1 that has passed through the heater 104 may be provided to the heat source 103. The feedback control system may feedback-control the temperature of the first refrigerant R1 so that the evaluated temperature of the first refrigerant R1 becomes a target temperature r1. The feedback control system may be provided for each heat source 103.

[0030] Here, an average temperature obtained by averaging the temperature y1 measured by the first temperature sensor 105 and the temperature y2 measured by the second temperature sensor 201 may be fed back (that is, the difference between the target temperature r1 and the average temperature may be set as the deviation e). For example, if the temperature distribution in the path from the inlet to the outlet of the heat source 103 is linear, the temperature of the heat source 103 can be more accurately controlled to the target temperature r1.

[0031] Alternatively, feedback may be performed by weighting each of the temperature y1 measured by the first temperature sensor 105 and the temperature y2 measured by the second temperature sensor 201. This is advantageous when the temperature distribution in the path from the inlet to the outlet of the heat source 103 is nonlinear.

[0032] In the configuration example shown in Fig. 7, a value obtained by multiplying the temperature y1 measured by the first temperature sensor 105 by a gain (weight) K1 using a multiplier 151 is fed back. Also, a value obtained by multiplying the temperature y2 measured by the second temperature sensor 201 by a gain (weight) K2 using a multiplier 152 is fed back. Specifically, the deviation e is calculated by subtracting from the target temperature r1 a value obtained by multiplying the temperature y1 measured by the first temperature sensor 105 by the weight K1 plus a value obtained by multiplying the temperature y measured by the second temperature sensor 201 by the weight K2. Here, if both K1 and K2 are set to 0.5, the average temperature obtained by averaging the temperatures y1 and y2 is fed back.

[0033] An operation control unit 202 that controls the operation of an apparatus (e.g., a processing apparatus such as a semiconductor manufacturing apparatus) including heat sources 103 such as first heat source 103a and second heat source 103f can provide information correlated with the amount of heat generated from heat source 103 to temperature control unit 110. Operation control unit 202 may be the main control unit described above. The information correlated with the amount of heat generated is, for example, information correlated with the power consumption in heat source 103. To give a more specific example, when the heat source is a motor such as a linear motor, the information correlated with the amount of heat generated can be, for example, time series data of the current supplied to the motor, or time series data of the acceleration of an object driven by the motor.

[0034] The temperature control unit 110 may perform feedforward control of heaters such as the first heater 104a and the second heater 104b based on information provided from the operation control unit 202. FIG. 8 shows a block diagram of a feedback control system incorporating such a feedforward control system. The temperature control unit 110 may provide the heater 104 with an operation amount u obtained by adding an operation amount determined based on the deviation e and an operation amount determined based on information s provided from the operation control unit 202. Here, the information s is information that has a correlation with the amount of heat generated from the heat source 103, and the temperature control unit 110 can recognize the timing at which the amount of heat generated by the heat source 103 increases based on the information s before that timing. Therefore, based on the information s, the temperature of the first refrigerant R1 is reduced before the amount of heat generated by the heat source 103 increases, that is, the amount of heat generated by the heater 104 is reduced, thereby suppressing a delay in the control of the temperature of the heat source 103.

[0035] Although various features have been described as the second embodiment, even when only one of these features is implemented, the effect of that feature is obtained.

[0036] A temperature adjustment device 101 of the third embodiment will be described with reference to Fig. 3. Matters not mentioned as the third embodiment may follow the first or second embodiment. Note that the configuration shown in Fig. 3 has a configuration in which temperature sensors 302a, 302b, a temperature control unit 303, an expansion valve control unit 304, and expansion valves 301a, 301b are added to the configuration shown in Fig. 2, but these may also be added to the configuration shown in Fig. 1.

[0037] The temperature sensor 302a may be arranged to measure the temperature of the first refrigerant R1 flowing out from the first outlet port HP01 on the high temperature side of the first heat exchanger E1. The temperature sensor 302b may be arranged to measure the temperature of the first refrigerant R1 flowing out from the second outlet port HP02 on the high temperature side of the second heat exchanger E2. The expansion valve 301a is arranged between the condenser 109 and the first inlet port LPI1 on the low temperature side of the first heat exchanger E1, and the flow rate of the second refrigerant R2 flowing into the first inlet port LPI1 on the low temperature side of the first heat exchanger E1 is adjusted according to the opening degree of the expansion valve 301a. The expansion valve 301b is arranged between the condenser 109 and the second inlet port LPI2 on the low temperature side of the second heat exchanger E2, and the flow rate of the second refrigerant R2 flowing into the second inlet port LPI2 on the low temperature side of the second heat exchanger E2 is adjusted according to the opening degree of the expansion valve 301b. Therefore, the cooling capacity of the heat exchangers E1 and E2 can be adjusted by adjusting the opening degree of the expansion valves 301a and 301b, thereby adjusting the temperature of the first refrigerant R1 flowing out from the first outlet port HP01 on the high temperature side of the first heat exchanger E1 and the second outlet port HP02 on the high temperature side of the second heat exchanger E2, that is, the temperature of the first refrigerant R1 detected by the temperature sensors 302a and 302b.

[0038] The temperature control unit 303 may be incorporated in the temperature control unit 110. The temperature control unit 303 may determine a target temperature of the first refrigerant R1 flowing out from the first outlet port HPO1 of the first heat exchanger E1 and the second outlet port HPO2 of the second heat exchanger E2, for example, based on the manipulated variable provided to the heater 104. More specifically, the temperature control unit 303 may determine a target temperature of the first refrigerant R1 flowing out from the first outlet port HPO1 of the first heat exchanger E1, based on the manipulated variable provided to the heaters 104a, 104b to 104e. The temperature control unit 303 may also determine a target temperature of the first refrigerant R1 flowing out from the second outlet port HPO2 of the second heat exchanger E2, based on the manipulated variable provided to the heater 104f. Here, the target temperature of the first refrigerant R1 flowing out from the second outlet port HP02 of the second heat exchanger E2 can be set to a temperature lower than the target temperature of the first refrigerant R1 flowing out from the first outlet port HP01 of the first heat exchanger E1.

[0039] The expansion valve control unit 304 may perform feedback control to provide the expansion valve 301a with a manipulated variable determined based on the deviation between a target temperature of the first refrigerant R1 flowing out from the first outlet port HPO1 of the first heat exchanger E1 and a temperature measured by the temperature sensor 302a. The expansion valve control unit 304 may perform feedback control to provide the expansion valve 301b with a manipulated variable determined based on the deviation between a target temperature of the first refrigerant R1 flowing out from the second outlet port HPO2 of the second heat exchanger E2 and a temperature measured by the temperature sensor 302b.

[0040] A block diagram of such a feedback control system is shown in FIG. 9. The temperature control unit 303 can determine a target temperature r4 of the first refrigerant R1 flowing out from the first outlet port HPO1 of the first heat exchanger E1 based on the manipulated variable u provided to the heaters 104a, 104b to 104e. The temperature control unit 303 can also determine a target temperature r4 of the first refrigerant R1 flowing out from the second outlet port HPO2 of the second heat exchanger E2 based on the manipulated variable u provided to the heater 104f. The expansion valve control unit 304 can provide the expansion valve 301a with a manipulated variable v determined based on the deviation e2 between the target temperature r4 of the first refrigerant R1 flowing out from the first outlet port HPO1 of the first heat exchanger E1 and the temperature measured by the temperature sensor 302a. The expansion valve control unit 304 can provide the expansion valve 301b with an operating variable v determined based on the deviation e2 between the target temperature r4 of the first refrigerant R1 flowing out of the second outlet port HP02 of the second heat exchanger E2 and the temperature measured by the temperature sensor 302b.

[0041] According to the above configuration, the first refrigerant R1 supplied to the first heater 104a is prevented from being excessively cooled, and the amount of heating of the first refrigerant R1 by the first heater 104a can be reduced. In addition, the first refrigerant R1 supplied to the second heater 104f is prevented from being excessively cooled, and the amount of heating of the first refrigerant R1 by the second heater 104f can be reduced. Similarly, the first refrigerant R1 supplied to the third heaters 104b to 104e arranged in parallel to the first heater 104a is prevented from being excessively cooled, and the amount of heating of the first refrigerant R1 by the third heaters 104b to 104e can be reduced. This makes it possible to reduce the range of the operation amount given to the heaters 104a to 104f. This is advantageous for precise control of the temperature of the first refrigerant R1 by the heaters 104a to 104f.

[0042] In the above example, the first heat exchanger E1 and the second heat exchanger E2 are each provided with an expansion valve for feedback control, but such an expansion valve may be provided in either the first heat exchanger E1 or the second heat exchanger E2. On the other hand, by providing the first heat exchanger E1 and the second heat exchanger E2 with expansion valves 301a and 301b for feedback control, respectively, the output balance of the first heat exchanger E1 and the second heat exchanger E2 can be adjusted. This is advantageous for improving the degree of freedom in selecting the number of systems (heat sources) that perform the second cooling by the second heat exchanger E2.

[0043] A temperature adjustment device 101 of the fourth embodiment will be described with reference to Fig. 4. Matters not mentioned as the fourth embodiment may follow any one of the first to third embodiments, or a combination thereof. Note that the configuration shown in Fig. 4 has a configuration in which a third heat exchanger E3 and associated components are added to the configuration shown in Fig. 3, but these may also be added to the configuration shown in Fig. 1 or Fig. 2.

[0044] The temperature control device 101 of the third embodiment includes a third heat exchanger E3 in addition to the first heat exchanger E1 and the second heat exchanger E2 described above. The third heat exchanger E3 may have a third inlet port HPI3 and a third outlet port HPO3 on the high temperature side, and a third inlet port LPI3 and a third outlet port LPO3 on the low temperature side. The temperature control device 101 of the third embodiment may also include a seventh flow path, FP7, and an eighth flow path FP8. The seventh flow path FP7 may be a flow path that branches from the fourth flow path FP4 at the second branching portion 123 and reaches the third inlet port HPI3. The eighth flow path and FP8 may be flow paths that connect the third outlet port HPO3 to the fifth flow path FP5 and are arranged to cool the fourth heat source 103g. The eighth flow path FP8 may be connected to the fifth flow path FP5 via a portion of the fourth flow path FP4 between the second heat source 103f and the junction portion 122. Alternatively, the eighth flow path FP8 may be connected to the fifth flow path FP5 through a portion of the second flow path FP2 between the first heat source 103a and the junction 122. Alternatively, the eighth flow path FP8 may be connected to the fifth flow path FP5 through a portion of the third flow path FP3 between the third heat source 103 (in the example of FIG. 4, any one of 103b to 103e) and the junction 122. Furthermore, the temperature adjustment device 101 of the third embodiment may include a fourth heater 104g arranged between the third outlet port HP03 of the eighth flow path FP8 and the fourth heat source 103g.

[0045] As described above, the first refrigerant R1 that passes through the first heat exchanger E1, the first flow path FP1, the branching portion 121, and the third flow path FP3 to the second heat exchanger E2 is cooled in two stages by two heat exchanges with the second refrigerant R2. Therefore, the temperature of the first refrigerant R1 flowing out of the second outlet port HP02 on the high temperature side of the second heat exchanger E2 is lower than the temperature of the first refrigerant R1 flowing out of the first outlet port HP01 on the high temperature side of the first heat exchanger E1. The first refrigerant R1 flowing out of the second outlet port HP02 on the high temperature side of the second heat exchanger E2 passes through the fourth flow path FP4 and is branched into the seventh flow path FP7 at the second branching portion 123. The first refrigerant R1 that has passed through the seventh flow path FP7 flows into the third inlet port HPI3 on ​​the high temperature side of the third heat exchanger E3, where it is cooled by heat exchange with the second refrigerant R2, and flows out from the third outlet port HPO3 on the high temperature side of the third heat exchanger E3. Therefore, the temperature of the first refrigerant R1 flowing out from the third outlet port HPO3 on the high temperature side of the third heat exchanger E3 is lower than the temperature of the first refrigerant R1 flowing out from the second outlet port HPO2 on the high temperature side of the second heat exchanger E2.

[0046] In one example, the maximum heat generation amount of the fourth heat generation source 103g arranged in the eighth flow path FP8 is greater than the maximum heat generation amount of the second heat generation source 103f arranged in the fourth flow path FP4. Alternatively, the average heat generation amount of the fourth heat generation source 103g arranged in the eighth flow path FP8 is greater than the average heat generation amount of the second heat generation source 103f arranged in the fourth flow path FP4. In one example, the temperature control unit 110 may control the second heater 104f to heat the first refrigerant R1 to a second target temperature, and control the fourth heater 104g to heat the first refrigerant R1 to a third target temperature lower than the second target temperature.

[0047] The flow path that flows out from the second outlet port HP02 on the high temperature side of the second heat exchanger E2 and then reaches the junction 122 without passing through the third heat exchanger E3 may be branched into multiple sub-flow paths, and a heater and a heat source may be provided in each sub-flow path. Also, the heat source whose temperature is adjusted by the first refrigerant R1 that flows out from the third outlet port HP03 on the high temperature side of the third heat exchanger E3 may include not only the fourth heat source 103g but also other heat sources. In this case, the eighth flow path FP8 may be branched into sub-flow paths equal in number to the number of heat sources whose temperatures are to be adjusted, and a heater and a heat source may be provided in each sub-flow path.

[0048] The temperature adjustment device 101 of the third embodiment may further include one or more additional heat exchangers, for example, a fourth heat exchanger. A flow path branched from the eighth flow path FP8 is connected to an inlet port on the high temperature side of the fourth heat exchanger, and a heat source and a flow path passing through a heat source arranged downstream of the heat source and leading to the fifth flow path FP5 may be connected to an inlet port on the high temperature side of the fourth heat exchanger.

[0049] The second circulation path C2 may be configured to circulate the second refrigerant R2, for example, in the low-temperature sides of the first heat exchanger E1, the second heat exchanger E2, and the third heat exchanger E3. The second circulation path C2 may include a compressor 108 that compresses the second refrigerant R2, and a condenser 109 that condenses the second refrigerant R2 compressed by the compressor 108. The second refrigerant R2 condensed by the condenser 109 may be sent to a first inlet port LPI1 on the low-temperature side of the first heat exchanger E1, a second inlet port LPI2 on the low-temperature side of the second heat exchanger E2, and a third inlet port LPI3 on ​​the low-temperature side of the third heat exchanger E3. The second refrigerant R2 flowing out from the first outlet port LPO1 on the low temperature side of the first heat exchanger E1, the second outlet port LPO2 on the low temperature side of the second heat exchanger E2, and the third outlet port LPO3 on the low temperature side of the third heat exchanger E3 can be sent to the compressor 108. The first heat exchanger E1, the second heat exchanger E2, the third heat exchanger E3, the compressor 108, the condenser 109, and the second circulation path C2 can constitute the refrigerator 102. Such a refrigerator 102 is advantageous in terms of space saving compared to a configuration in which the compressor 108 and the condenser 109 are provided individually for each of the first heat exchanger E1, the second heat exchanger E2, and the third heat exchanger E3.

[0050] The temperature adjustment device 101 may include a temperature sensor 302c that measures the temperature of the first refrigerant R1 flowing out from the third outlet port HP03 on the high temperature side of the third heat exchanger E3. The temperature adjustment device 101 may also include an expansion valve 301c arranged between the condenser 109 and the third inlet port LPI3 on ​​the low temperature side of the third heat exchanger E3. The flow rate of the second refrigerant R2 flowing into the third inlet port LPI3 on ​​the low temperature side of the third heat exchanger E3 is adjusted according to the opening degree of the expansion valve 301c.

[0051] The temperature control unit 303 may determine a target temperature of the first refrigerant R1 flowing out from the third outlet port HP03 of the third heat exchanger E3 based on a manipulated variable provided to the heater 104g. The expansion valve control unit 304 may perform feedback control to provide the expansion valve 301c with a manipulated variable determined based on the deviation between the target temperature of the first refrigerant R1 flowing out from the third outlet port HP03 of the third heat exchanger E3 and the temperature measured by the temperature sensor 302c.

[0052] FIG. 10 shows the configuration of a processing apparatus 300 incorporating a temperature adjustment device 101 for adjusting the temperature. The processing apparatus 300 can be used when implementing an article manufacturing method for manufacturing an article. The processing apparatus 300 can be, for example, a processing apparatus for processing a substrate as a material for manufacturing an article. The processing apparatus 300 can be, for example, a pattern forming apparatus or a lithography apparatus for forming a pattern on a substrate. The pattern forming apparatus or the lithography apparatus can include a substrate positioning mechanism for holding and positioning the substrate, and an original positioning mechanism for holding and positioning an original having a pattern to be transferred to the substrate. The pattern forming apparatus or the lithography apparatus can include a projection optical system for projecting the pattern of the original onto the substrate, and an illumination optical system for illuminating the original. Each of these components includes a heat source and can be subject to cooling or temperature adjustment. The processing apparatus 300 can include, for example, a first component including a first heat source 103a and a second component including a second heat source 103f. The first heat source 103a may be disposed in the second flow path FP2 described above, and the second heat source 103f may be disposed in the fourth flow path FP4 described above.

[0053] The method for manufacturing an article may include a first process step of processing a substrate, and a second process step of further processing the substrate processed in the second process step to obtain an article from the substrate. The first process step may include, for example, forming a pattern on the substrate using a processing device 300 configured as a pattern forming device or a lithography device. The second process step may include, for example, processing, for example etching, the substrate using the pattern formed in the first process step.

[0054] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0055] 101: temperature adjustment device, 102: refrigerator, 103a, 103b, 103c, 103d, 103e, 103f: heat source, 104a, 104b, 104c, 104d, 104e, 104f: heater, 105a, 105b, 105c, 105d, 105e, 105f: first temperature sensor, E1: first heat exchanger, E2: second heat exchanger, R1: first refrigerant, R2: second refrigerant, C1: first circulation path, C2: second circulation path, 110: temperature control section, 121: branching section, 122: junction section, FP1, FP2, FP3, FP4, FP5, FP6: flow path, HPI1: first inlet port, HPO1: first outlet port, HPI2: second inlet port, HPO2: second outlet port

Claims

1. a first heat exchanger having a first inlet port and a first outlet port; a second heat exchanger having a second inlet port and a second outlet port; a first flow passage connecting the first outlet port and a branch portion; a second flow path that connects the branching portion and the junction portion and is arranged to cool the first heat source; a third flow passage connecting the branch portion and the second inlet port; a fourth flow passage that connects the second outlet port and the junction and is arranged to cool a second heat source; a fifth flow passage connecting the junction and the first inlet port; a first heater disposed between the branch portion of the second flow path and the first heat source; a second heater disposed in the fourth flow path between the second outlet port and the second heat source; a temperature control unit that controls the first heater and the second heater so that a temperature of the first heat source and a temperature of the second heat source are adjusted; A temperature adjustment device comprising:

2. The maximum heat generation amount of the second heat source is greater than the maximum heat generation amount of the first heat source. The temperature adjustment device according to claim 1 .

3. The average heat generation amount of the second heat source is greater than the average heat generation amount of the first heat source. The temperature adjustment device according to claim 1 .

4. a sixth flow path that connects the branch portion and the junction portion and is arranged to cool a third heat source; a third heater disposed between the branch portion of the sixth flow path and the third heat source; The temperature adjustment device according to any one of claims 1 to 3, further comprising:

5. a plurality of sixth flow paths that connect the branching portion and the junction portion and are arranged to cool a plurality of third heat sources, respectively; a plurality of third heaters each disposed between the branching portion and each of the third heat sources in each of the sixth flow paths; The temperature adjustment device according to any one of claims 1 to 3, further comprising:

6. The flow rate of the coolant flowing through the third flow path is less than 50% of the flow rate of the coolant flowing through the first flow path. The temperature adjustment device according to any one of claims 1 to 5.

7. a third heat exchanger having a third inlet port and a third outlet port; a seventh flow passage branching from the fourth flow passage and leading to the third inlet port; an eighth flow passage connecting the third outlet port to the fifth flow passage and arranged to cool a fourth heat source; a fourth heater disposed in the eighth flow path between the third outlet port and the fourth heat source; The temperature adjustment device according to any one of claims 1 to 6, further comprising:

8. The eighth flow path is connected to the fifth flow path via a portion of the fourth flow path between the second heat source and the junction. The temperature adjustment device according to claim 7 .

9. a first temperature measuring device that measures a temperature of the refrigerant flowing through the second flow path; a second temperature measuring device that measures a temperature of the refrigerant flowing through the fourth flow path, the temperature control unit controls the first heater to control the temperature of the coolant flowing through the second flow path based on a measurement result by the first temperature measuring device, and controls the second heater to control the temperature of the coolant flowing through the fourth flow path based on a measurement result by the second temperature measuring device. The temperature adjustment device according to any one of claims 1 to 8.

10. the first temperature measuring device includes a temperature sensor that measures a temperature of the refrigerant between the first heat source and the junction; The second temperature measuring device includes a temperature sensor that measures a temperature of the refrigerant between the second heat source and the junction. The temperature adjustment device according to claim 9 .

11. the first temperature measuring device includes a temperature sensor that measures a temperature of a refrigerant between the first heat source and the first heater; The second temperature measuring device includes a temperature sensor that measures a temperature of a refrigerant between the second heat source and the second heater. The temperature adjustment device according to claim 9 .

12. the first temperature measuring device includes a first temperature sensor that measures a temperature of the refrigerant between the first heat generation source and the junction, and a second temperature sensor that measures a temperature of the refrigerant between the first heat generation source and the first heater, the second temperature measuring device includes a third temperature sensor that measures a temperature of the refrigerant between the second heat generation source and the junction, and a fourth temperature sensor that measures a temperature of the refrigerant between the second heat generation source and the second heater, the temperature control unit controls the first heater based on measurement results by the first temperature sensor and the second temperature sensor, and controls the second heater based on measurement results by the third temperature sensor and the fourth temperature sensor. The temperature adjustment device according to claim 9 .

13. the temperature control unit performs feedforward control of the first heater and the second heater based on information provided from an operation control unit that controls an operation of an apparatus including the first heat source and the second heat source; The temperature adjustment device according to claim 12 .

14. The temperature control device according to any one of claims 1 to 13, further comprising a circulation path for circulating a second refrigerant so as to exchange heat with a refrigerant flowing from the first inlet port to the first outlet port in the first heat exchanger and a refrigerant flowing from the second inlet port to the second outlet port in the second heat exchanger.

15. the circulation path includes a compressor that compresses the second refrigerant, a condenser that condenses the second refrigerant compressed by the compressor, a first expansion valve that expands the second refrigerant condensed by the condenser and supplies it to the first heat exchanger, and a second expansion valve that expands the second refrigerant condensed by the condenser and supplies it to the second heat exchanger. The temperature adjustment device according to claim 14.

16. a third temperature measuring device that measures the temperature of the refrigerant flowing out from the first outlet port; a fourth temperature measuring device that measures the temperature of the refrigerant flowing out from the second outlet port; The temperature control unit controls the first expansion valve based on a measurement result by the third temperature measuring device, and controls the second expansion valve based on a measurement result by the fourth temperature measuring device. The temperature adjustment device according to claim 15 .

17. A processing apparatus for processing a substrate, comprising: A first component and a second component; The temperature adjustment device according to any one of claims 1 to 16, The first component includes the first heat source, and the second component includes the second heat source. A processing device comprising:

18. A first processing step of processing a substrate by the processing apparatus according to claim 17; A second processing step of further processing the substrate processed in the first processing step to obtain an article; A method for manufacturing an article, comprising:

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