Processing System

Abstract

Provided is a processing system that processes an object by using an energy beam. The processing system is provided with: an irradiation optical system which has a condensing optical system, and condenses the energy beam incident on a pupil surface of the condensing optical system to irradiate the object with the energy beam; and a detection device which detects object light including light from the object through the condensing optical system. At least a part of a path of the object light in the condensing optical system is different from at least a part of a path of the energy beam in the condensing optical system.

Description

[Technical field]

[0001] The present invention relates to the technical field of, for example, a processing system for processing an object. [Background technology]

[0002] An example of a processing system for processing an object is described in Patent Document 1. Specifically, Patent Document 1 describes a processing system that performs additional processing on a workpiece, which is an example of an object, by supplying a material powder to the workpiece and irradiating it with a laser beam. One of the technical challenges that such a processing system has is to appropriately process the object to be processed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2019 / 270246 Summary of the Invention

[0004] According to a first aspect, there is provided a processing system for processing an object using an energy beam, the processing system having a focusing optical system, an illumination optical system that focuses an energy beam incident on a pupil plane of the focusing optical system and illuminates the object, and a detection device that detects object light including light from the object via the focusing optical system, wherein at least a portion of a path of the object light within the focusing optical system is different from at least a portion of a path of the energy beam within the focusing optical system.

[0005] According to a second aspect, there is provided a processing system for processing an object using an energy beam, the processing system including: an irradiation optical system that irradiates the object with a plurality of energy beams as the energy beam; and a beam characteristic changing device that individually changes the characteristics of at least one of the plurality of energy beams.

[0006] According to a third aspect, there is provided a processing system for processing an object using an energy beam, the processing system comprising: an irradiation optical system that irradiates a plurality of energy beams onto the object as the energy beams; and a beam property changing device that changes the properties of at least one of the plurality of energy beams, wherein the properties of a first energy beam of the plurality of energy beams are different from the properties of a second energy beam of the plurality of energy beams.

[0007] According to a fourth aspect, there is provided a processing system for processing an object using an energy beam, comprising: an irradiation optical system that irradiates a plurality of energy beams onto the object as the energy beams; and a beam property changing device that changes the characteristics of at least one of the plurality of energy beams, wherein the beam property changing device is capable of setting the characteristics of a first energy beam of the plurality of energy beams to be different from the characteristics of a second energy beam.

[0008] According to a fifth aspect, there is provided a processing system for processing an object using an energy beam, the processing system comprising: an irradiation optical system that irradiates a plurality of energy beams onto the object as the energy beams; and a beam property setting device that is capable of setting the characteristics of a first energy beam among the plurality of energy beams to be different from the characteristics of a second energy beam among the plurality of energy beams.

[0009] According to a sixth aspect, there is provided a processing system for processing an object using an energy beam, comprising: an irradiation optical system that irradiates the object with multiple energy beams as the energy beam; and a distance changing device that changes the distance between a surface on which the multiple energy beams are superimposed and a surface of the object to change the distribution of the energy beams on the surface of the object.

[0010] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a cross-sectional view showing a structure of a processing system according to a first embodiment. [Diagram 2] FIG. 2 is a system configuration diagram showing the system configuration of the machining system according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing the structure of the processing head (that is, the irradiation optical system and the material nozzle). [Figure 4] FIG. 4 is a cross-sectional view showing the structure of the processing head (that is, the irradiation optical system and the material nozzle). [Diagram 5] FIG. 5 is a cross-sectional view showing an optical path of processing light within a virtual optical plane in the focusing optical system that intersects with the optical axis of the focusing optical system. [Figure 6] FIG. 6 is a cross-sectional view showing another example of the optical path of the processing light that is irradiated onto the workpiece via the focusing optical system. [Figure 7] FIG. 7 is a cross-sectional view showing another example of the region through which the processing lights EL#1 to EL#4 pass within the optical surface OP. [Figure 8] FIG. 8(a) is a plan view showing the processing light irradiated onto the workpiece, and FIG. 8(b) is a cross-sectional view showing the processing light irradiated onto the workpiece. [Figure 9] FIG. 9(a) is a plan view showing the processing light irradiated onto the workpiece, and FIG. 9(b) is a cross-sectional view showing the processing light irradiated onto the workpiece. [Figure 10] Each of Fig. 10(a) to Fig. 10(e) is a cross-sectional view showing a state in which a certain area on a workpiece is irradiated with processing light and a modeling material is supplied. [Figure 11] Each of Figures 11(a) to 11(c) is a cross-sectional view showing a process for forming a three-dimensional structure. [Figure 12] FIG. 12 is a plan view showing a target irradiation area (that is, an irradiation position of the processing light) moving toward the +Y side along the Y-axis direction on the modeling surface. [Figure 13]13(a) and 13(b) are graphs showing the intensity of processing light irradiated to a relatively rear position in the movement direction and processing light irradiated to a relatively forward position in the movement direction, respectively. [Figure 14] FIG. 14 is a graph showing the intensity of the processing light irradiated to a position relatively on the rear side in the movement direction and the intensity of the processing light irradiated to a position relatively on the front side in the movement direction. [Figure 15] Each of FIG. 15(a) and FIG. 15(b) is a cross-sectional view showing a state in which processing light EL is emitted toward a target irradiation area set on the modeling surface. [Figure 16] FIG. 16 is a cross-sectional view showing an optical path of processing light within an imaginary optical plane in the focusing optical system that intersects with the optical axis of the focusing optical system. [Figure 17] FIG. 17 is a plan view showing an example of beam spots of desired shapes formed by a plurality of processing beams on a modeling surface. [Figure 18] FIG. 18 is a cross-sectional view showing the structure of the processing system according to the second embodiment. [Figure 19] FIG. 19 is a system configuration diagram showing the system configuration of the machining system according to the second embodiment. [Figure 20] FIG. 20 is a cross-sectional view showing the optical paths of the measurement light and the object light in the irradiation optical system (particularly, in the focusing optical system) of the second embodiment. [Figure 21] FIG. 21 is a cross-sectional view taken along the line XX-XX' of FIG. [Figure 22] FIG. 22 is a system configuration diagram showing the system configuration of the machining system according to the third embodiment. [Figure 23] FIG. 23 is a cross-sectional view showing the structure of the irradiation optical system according to the third embodiment. [Figure 24] Each of FIG. 24(a) to FIG. 24(c) is a cross-sectional view showing an example of the optical path of the measurement light irradiated onto the modeling surface. [Diagram 25] FIG. 25 is a system configuration diagram showing the system configuration of the machining system according to the fourth embodiment. [Figure 26]FIG. 26 is a cross-sectional view showing the optical paths of the measurement light and the return light in the irradiation optical system (particularly, in the light collecting optical system) of the fourth embodiment. [Figure 27] FIG. 27 is a cross-sectional view taken along line XXVI-XXVI' of FIG. [Figure 28] FIG. 28 is a system configuration diagram showing the system configuration of the machining system according to the fifth embodiment. [Figure 29] FIG. 29 is a plan view that illustrates the operation of the recovery device and the gas supply device of the fifth embodiment. [Diagram 30] FIG. 30 is a system configuration diagram showing the system configuration of the machining system according to the sixth embodiment. [Diagram 31] FIG. 31 is a cross-sectional view showing the structure of the surrounding member of the sixth embodiment. [Diagram 32] FIG. 32 is a system configuration diagram showing the system configuration of the machining system according to the seventh embodiment. [Diagram 33] FIG. 33 is a cross-sectional view showing the structure of the processing system according to the seventh embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, a processing system SYS, which is an embodiment of the processing system of the present invention, will be described with reference to the drawings. In the following description, the positional relationship of various components constituting the processing system SYS will be described using an XYZ orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In the following description, for convenience of explanation, each of the X-axis direction and the Y-axis direction is a horizontal direction (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is a vertical direction (i.e., a direction perpendicular to the horizontal plane, and essentially a vertical direction or a direction of gravity). In addition, the rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. In addition, the XY plane may be the horizontal direction.

[0013] (1) Machining system SYS of the first embodiment First, a processing system SYS of a first embodiment (hereinafter, the processing system SYS of the first embodiment will be referred to as the "processing system SYSa") will be described. The processing system SYSa of the first embodiment is a processing system capable of forming a three-dimensional structure ST by performing additional processing. The processing system SYSa can form a three-dimensional structure ST by performing additional processing based on, for example, a laser metal deposition (LMD) method. In addition, the laser metal deposition welding method (LMD) may be called direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas through wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, and laser rapid forming. However, the processing system SYSa may form a three-dimensional structure ST by performing additive processing based on other additive processing methods.

[0014] The structure and operation of the machining system SYSa that performs such additional machining will be described below.

[0015] (1-1) Structure of the processing system SYSa First, the structure of the machining system SYSa of the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view showing the structure of the machining system SYSa of the first embodiment. Fig. 2 is a system configuration diagram showing the system configuration of the machining system SYSa of the first embodiment.

[0016] The processing system SYSa can form a three-dimensional structure ST (i.e., a three-dimensional object having a size in any of the three-dimensional directions, a solid object, in other words, an object having a size in the X-axis direction, the Y-axis direction, and the Z-axis direction). The processing system SYSa can form the three-dimensional structure ST on a workpiece W that is a base (i.e., a base material) for forming the three-dimensional structure ST. The processing system SYSa can form the three-dimensional structure ST by performing additional processing on the workpiece W. When the workpiece W is a stage 41 described later, the processing system SYSa can form the three-dimensional structure ST on the stage 41. When the workpiece W is a placed object that is an object placed on the stage 41, the processing system SYSa can form the three-dimensional structure ST on the placed object. In this case, the processing system SYSa may form a three-dimensional structure ST integrated with the placed object. The operation of forming the three-dimensional structure ST integrated with the placed object is equivalent to the operation of adding a new structure to the placed object. The existing structure may be, for example, a product requiring repair that has a missing part. The processing system SYSa may form a three-dimensional structure ST on the product requiring repair so as to fill in the missing part of the product requiring repair. Alternatively, the processing system SYSa may form a three-dimensional structure ST that can be separated from the placed object. The placed object placed on the stage 41 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYSa. In the following, the description will be given using an example in which the workpiece W is a placed object placed on the stage 41. In the following description, unless otherwise specified, the workpiece W refers to both a workpiece W on which a three-dimensional structure ST has not been formed and a workpiece W on which at least a part of a three-dimensional structure ST has been formed (i.e., a workpiece W including at least a part of a formed three-dimensional structure ST).

[0017] As described above, the processing system SYSa can form a molded object by the laser build-up welding method. In other words, the processing system SYSa can be said to be a 3D printer that forms an object using additive manufacturing technology. The additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0018] The processing system SYSa processes the modeling material M with the processing light EL to form a modeled object. The modeling material M is a material that can be melted by irradiation with the processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, other materials different from the metallic material and the resinous material may be used as the modeling material M. The modeling material M is a powder or granular material. In other words, the modeling material M is a powdered granular material. However, the modeling material M does not have to be a powdered granular material. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0019] 1 and 2, in order to form a three-dimensional structure ST, the processing system SYSa includes a material supply source 1, a plurality of processing light sources 2, a processing device 3, a stage device 4, a gas supply source 5, and a control device 6. The processing device 3 and the stage device 4 may be accommodated in a chamber space 73IN inside a housing 7.

[0020] The material supply source 1 supplies the modeling material M to the processing device 3. The material supply source 1 supplies a desired amount of modeling material M according to a required amount so that the amount of modeling material M required per unit time to form a three-dimensional structure ST is supplied to the processing device 3.

[0021] Each of the multiple processing light sources 2 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include pulsed light (i.e., a pulse beam). The processing light EL may be laser light. In this case, each of the multiple processing light sources 2 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD: Laser Diode)). The laser light source may include at least one of a fiber laser, a CO2 laser, a YAG laser, and an excimer laser. However, the processing light EL may not be a laser light. In this case, the processing light source 2 that emits the processing light EL that is not a laser light may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp). In the first embodiment, an example will be described in which the processing system SYSa includes four processing light sources 2 (specifically, a processing light source 2#1 that emits processing light EL#1, a processing light source 2#2 that emits processing light EL#2, a processing light source 2#3 that emits processing light EL#3, and a processing light source 2#4 that emits processing light EL#4). However, the number of processing light sources 2 may be three or less, or five or more.

[0022] The processing device 3 processes the modeling material M supplied from the material supply source 1 using the processing light EL#1 to EL#4 propagating from the processing light sources 2#1 to 2#4, respectively, to form a three-dimensional structure ST. In order to form the three-dimensional structure ST, the processing device 3 includes a processing head 31 and a head drive system 32. However, the processing device 3 does not necessarily have to include the head drive system 32. Furthermore, the processing head 31 includes an irradiation optical system 311 and a material nozzle (i.e., a material supply device that supplies the modeling material M) 312. The processing head 31 and the head drive system 32 are housed in the chamber space 73IN. However, at least a part of the processing head 31 and / or the head drive system 32 may be disposed in the external space 74OUT, which is a space outside the housing 7. The external space 74OUT may be a space that an operator of the processing system SYSa can enter.

[0023] Here, the processing head 31 (i.e., the irradiation optical system 311 and the material nozzle 312) will be further described with reference to Figures 3 and 4 in addition to Figures 1 and 2. Figures 3 and 4 are cross-sectional views showing the structure of the processing head 31 (i.e., the irradiation optical system 311 and the material nozzle 312).

[0024] As shown in FIG. 1 to FIG. 4, the irradiation optical system 311 is an optical system into which the processing light EL#1 to EL#4 propagating from the processing light sources 2#1 to 2#4, respectively, are incident. The irradiation optical system 311 is an optical system for emitting the processing light EL#1 to EL#4 incident on the irradiation optical system 311. Specifically, the irradiation optical system 311 is optically connected to the processing light sources 2#1 to 2#4 via a plurality of optical transmission members 21 including at least one of an optical fiber and a light pipe. More specifically, the irradiation optical system 311 is optically connected to the processing light source 2#1 via the optical transmission member 21#1, optically connected to the processing light source 2#2 via the optical transmission member 21#2, optically connected to the processing light source 2#3 via the optical transmission member 21#3, and optically connected to the processing light source 2#4 via the optical transmission member 21#4. The irradiation optical system 311 emits processing light EL#1 to EL#4 propagating from the processing light sources 2#1 to 2#4 via the optical transmission members 21#1 to 21#4. The irradiation optical system 311 emits processing light EL#1 to EL#4 downward (i.e., toward the -Z side) from the irradiation optical system 311. A stage 41 is disposed below the irradiation optical system 311. When a workpiece W is placed on the stage 41, the irradiation optical system 311 emits processing light EL#1 to EL#4 toward the workpiece W.

[0025] The irradiation optical system 311 may focus the processing light EL#1 to EL#4 emitted toward the workpiece W on the workpiece W. In order to focus the processing light EL#1 to EL#4, the irradiation optical system 311 may be provided with a focusing optical system 3111. The focusing optical system 3111 is an optical system including a plurality of optical members 3112 (e.g., lenses), but may be an optical system including a single optical member 3112. The processing light EL#1 to EL#4 are emitted toward the workpiece W from the terminal optical member 3114, which is located closest to the workpiece W side along the optical path of the processing light EL#1 to EL#4 (located closest to the -Z side in the example shown in FIG. 3 and FIG. 4), among the plurality of optical members 3112 (particularly, the plurality of optical members 3112 having power) provided in the focusing optical system 3111. The terminal optical member 3114 may be referred to as a final optical member.

[0026] The processing light EL#1 to EL#4 emitted from the focusing optical system 3111 is focused on a focusing surface FP, which is a virtual optical surface intersecting the optical axis AX of the focusing optical system 3111 (i.e., the optical axis of the irradiation optical system 311). For this reason, the focusing optical system 3111 may be considered as an optical system for focusing the processing light EL#1 to EL#4 incident on the pupil surface (entrance pupil surface) of the focusing optical system 3111 on the focusing surface FP of the focusing optical system 3111. Here, the state in which "the processing light EL#1 to EL#4 are focused on the focusing surface FP" in the first embodiment may mean the state in which "the processing light EL#1 to EL#4 are superimposed on the focusing surface FP". In other words, the state in which "the processing light EL#1 to EL#4 are focused on the focusing surface FP" in the first embodiment may mean the state in which "the processing light EL#1 to EL#4 are irradiated at the same position on the focusing surface FP". Such a focusing plane FP is typically set at the rear focal position of the focusing optical system 3111. 3 and 4 show an example in which the focusing plane FP coincides with the surface WS of the workpiece W. In the first embodiment, since the optical axis AX is an axis along the Z axis, the focusing plane FP becomes a plane intersecting the Z axis (for example, a plane along the XY plane). In this example, the entrance pupil plane of the focusing optical system 3111 is located outside (on the entrance side) of the focusing optical system 3111, but the entrance pupil plane of the focusing optical system 3111 may be located inside the focusing optical system 3111.

[0027] In the focusing optical system 3111, the optical paths of the processing light EL#1 to EL#4 (i.e., the paths along which the processing light EL#1 to EL#4 travel) may be optically separated. That is, in the focusing optical system 3111, the optical paths of the processing light EL#1 to EL#4 may be different from each other. In the focusing optical system 3111, the optical paths of the processing light EL#1 to EL#4 do not have to overlap with each other.

[0028] In order to optically separate the optical paths of the processing light EL#1 to EL#4, for example, as shown in FIG. 5, which is a cross-sectional view showing the optical paths of the processing light EL#1 to EL#4 in a virtual optical plane OP (typically a plane along the XY plane, for example, an entrance pupil plane of the focusing optical system 3111) in the focusing optical system 3111 intersecting the optical axis AX of the focusing optical system 3111, in the optical plane OP, the processing light EL#1 to EL#4 may pass through separate regions that are separated in different directions from the optical axis AX. In this case, in the optical plane OP, the distance between the optical axis AX and the optical path of the processing light EL#1, the distance between the optical axis AX and the optical path of the processing light EL#2, the distance between the optical axis AX and the optical path of the processing light EL#3, and the distance between the optical axis AX and the optical path of the processing light EL#4 may be the same as each other. Alternatively, the distances between the optical axis AX and at least two optical paths of the processing light EL#1 to EL#4 may be different from each other. In the examples shown in Fig. 3 to Fig. 5, the distances between the optical axis AX and the optical paths of the processing light EL#1 to EL#4 are the same in the optical surface OP. In this case, the processing light EL#1 to EL#4 may pass through an area symmetrical with respect to the optical axis AX in the optical surface OP (an area having n-fold rotational symmetry with respect to the optical axis AX in the optical surface OP (where n is an integer of 2 or more)). For example, as shown in Fig. 5, the processing light EL#1 to EL#4 may pass through four areas (areas having four-fold rotational symmetry with respect to the optical axis AX in the optical surface OP) whose clockwise rotation angles around the origin are 270 degrees, 90 degrees, 0 degrees, and 180 degrees (or θ (θ is an arbitrary angle) + 270 degrees, θ + 90 degrees, θ degrees, and θ + 180 degrees) in a coordinate plane along the XY plane with the optical axis AX as the origin.

[0029] When the processing light EL#1 to EL#4 pass through separate regions in the optical surface OP that are spaced apart in different directions from the optical axis AX, the focusing optical system 3111 may irradiate the processing light EL#1 to EL#4 onto the workpiece W from different directions. Specifically, as shown in Figures 3 to 5, the focusing optical system 3111 may irradiate the processing light EL#1 to EL#4 onto the workpiece W from different positions in the rotational direction about the optical axis AX.

[0030] Alternatively, in order to optically separate the optical paths of the processing light EL#1 to EL#4, in the optical surface OP, the processing light EL#1 to EL#4 may pass through separate regions that are different distances from the optical axis AX in the same direction. For example, as shown in FIG. 6, which is a cross-sectional view showing another example of the optical paths of the processing light EL#1 to EL#4 irradiated to the workpiece W via the focusing optical system 3111, and FIG. 7, which is a cross-sectional view showing another example of the region through which the processing light EL#1 to EL#4 pass in the optical surface OP, the processing light EL#1 to EL#4 may pass through separate regions that are different distances from the optical axis AX toward the +Y side. In other words, the processing light EL#1 to EL#4 may pass through separate regions that are different in the same direction from the optical axis AX such that the distance between the optical axis AX and the optical path of the processing light EL#1, the distance between the optical axis AX and the optical path of the processing light EL#2, the distance between the optical axis AX and the optical path of the processing light EL#3, and the distance between the optical axis AX and the optical path of the processing light EL#4 are different from each other.

[0031] When the processing light EL#1 to EL#4 pass through different regions in the optical surface OP at different distances from the optical axis AX in the same direction, the focusing optical system 3111 may irradiate the processing light EL#1 to EL#4 to the workpiece W such that the angles between the optical axis AX and the traveling direction of the processing light EL#1 to EL#4 traveling from the focusing optical system 3111 toward the workpiece W are different from each other. Specifically, as shown in Fig. 6, the focusing optical system 3111 may irradiate the processing light EL#1 to EL#4 to the workpiece W such that the angle between the traveling direction of the processing light EL#1 and the optical axis AX, the angle between the traveling direction of the processing light EL#2 and the optical axis AX, the angle between the traveling direction of the processing light EL#3 and the optical axis AX, and the angle between the traveling direction of the processing light EL#4 and the optical axis AX are different from each other.

[0032] In order to change the traveling direction of the multiple processing beams EL#1 to EL#4 traveling from the focusing optical system 3111 toward the workpiece W, the positions of the emission ends of the light transmission members 21#1 to 21#4 along the XY plane (a plane parallel to the optical surface OP) may be changeable. The positions of the emission ends of the light transmission members 21#1 to 21#4 along the Z direction may also be changeable. The traveling direction of the processing beams EL#1 to EL#4 emitted from the light transmission members 21#1 to 21#4 (the traveling direction of the processing beams EL#1 to EL#4 between the light transmission members 21#1 to 21#4 and the focusing optical system) may also be changeable.

[0033] In each optical member 3112 constituting the focusing optical system 3111, an opening 3113 is formed penetrating each optical member 3112 in a direction along the optical axis AX. The opening 3113 may be formed at a position where each optical member 3112 and the optical axis AX overlap. In other words, the opening 3113 may be formed on the optical axis AX. At least a part of the material nozzle 312 is disposed in the multiple openings 3113 formed in each of the multiple optical members 3112. At least a part of the material nozzle 312 is inserted into the multiple openings 3113. In this case, the material nozzle 312 may be inserted into the opening 3113 such that the supply outlet 314 at the tip of the material nozzle 312 is disposed outside the opening 3113. Therefore, the material nozzle 312 is disposed such that at least a part of the material nozzle 312 is surrounded by the multiple optical members 3112. When the openings 3113 are formed on the optical axis AX, at least a portion of the material nozzles 312 may be arranged along the optical axis AX in the multiple openings 3113. In this case, at least a portion of the material nozzles 312 may be arranged on the optical axis AX.

[0034] When an opening 3113 is formed in each optical member 3112, the processing light EL#1 to EL#4 pass through a portion of each optical member 3112 where the opening 3113 is not formed. When the opening 3113 is formed on the optical axis AX as described above, the processing light EL#1 to EL#4 pass through a portion of each optical member 3112 away from the optical axis AX. In this case, typically, the processing light EL#1 to EL#4 may travel from the focusing optical system 3111 toward the workpiece W along a direction inclined with respect to the optical axis AX. In other words, the focusing optical system 3111 may emit the processing light EL#1 to EL#4 along a direction inclined with respect to the optical axis AX.

[0035] When an opening 3113 is formed in each optical member 3112, the purge gas supplied from the gas supply source 5 to the chamber space 73IN may be supplied to a space on the emission surface side of the terminal optical member 3114 (i.e., a space on the workpiece W side) via the opening 3113. Specifically, the purge gas supplied from the gas supply source 5 to the chamber space 73IN may be supplied between the optical members 3112 constituting the focusing optical system 3111. The purge gas supplied between the optical members 3112 constituting the focusing optical system 3111 may be supplied to a space on the emission surface side of the terminal optical member 3114 via the opening 3113 (particularly, the opening 3113 of the terminal optical member 3114).

[0036] The material nozzle 312 is formed with a supply outlet 314. The material nozzle 312 supplies (e.g., ejects, jets, spouts, or sprays) the modeling material M from the supply outlet 314. The material nozzle 312 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 312 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 312 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and the conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 312 via the supply pipe 11. As a result, the material nozzle 312 supplies the modeling material M together with the conveying gas. As the gas for conveyance, for example, a purge gas supplied from the gas supply source 5 is used. However, as the gas for conveyance, a gas supplied from a gas supply source other than the gas supply source 5 may be used. Although the material nozzle 312 is depicted as a tube in FIGS. 3 and 4, the shape of the material nozzle 312 is not limited to this shape. The material nozzle 312 supplies the modeling material M downward (i.e., toward the -Z side) from the material nozzle 312. At this time, since the material nozzle 312 is disposed in the opening 3113 of the optical member 3112, the material nozzle 312 may be considered to supply the modeling material M through the opening 3113 of the optical member 3112 (particularly, the opening 3113 of the terminal optical member 3114). The material nozzle 312 may be considered to supply the modeling material M through a space inside the optical path of the processing light EL#1 to EL#4 emitted through a portion of the optical member 3112 where the opening 3113 is not formed. The stage 41 is disposed below the material nozzle 312. When the workpiece W is mounted on the stage 41, the material nozzle 312 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W.

[0037] The material nozzle 312 supplies the shaping material M to the workpiece W from a direction intersecting with the surface WS of the workpiece W. In the example shown in FIG. 3 to FIG. 4, the material nozzle 312 supplies the shaping material M to the workpiece W from the Z-axis direction intersecting with the surface WS of the workpiece W. That is, the material nozzle 312 supplies the shaping material M so that the supply path of the shaping material M from the material nozzle 312 to the workpiece W is a path along the Z-axis direction. In this case, the direction in which the material nozzle 312 supplies the shaping material M to the workpiece W (i.e., the direction along the Z-axis, the optical axis direction of the focusing optical system 3111) may be different from the direction in which the focusing optical system 3111 emits the processing light EL#1 to EL#4 toward the workpiece W (i.e., the direction inclined with respect to the Z-axis or the optical axis AX). That is, the supply direction of the shaping material M by the material nozzle 312 (which may be referred to as the material supply direction) may be different from the irradiation direction of the processing light EL#1 to EL#4 by the focusing optical system 3111.

[0038] In this embodiment, the material nozzle 312 is aligned with the irradiation optical system 311 so as to supply the shaping material M toward a target irradiation area EA (i.e., a position where the irradiation optical system 311 irradiates the processing light EL#1 to EL#4) where the irradiation optical system 311 irradiates the processing light EL#1 to EL#4. In other words, the material nozzle 312 and the irradiation optical system 311 are aligned so that a target supply area MA, which is set on or near the workpiece W as an area where the material nozzle 312 supplies the shaping material M, and the target irradiation area EA coincide (or at least partially overlap). As will be described later, a molten pool MP is formed on the workpiece W by the processing light EL#1 to EL#4 emitted from the irradiation optical system 311. The material nozzle 312 may be aligned with the irradiation optical system 311 so as to supply the shaping material M to the molten pool MP. However, the material nozzle 312 does not have to supply the shaping material M to the molten pool MP. For example, the processing system SYSa may melt the forming material M from the material nozzle 312 using processing light EL#1 to EL#4 from the irradiation optical system 311 before the forming material M reaches the workpiece W, and adhere the molten forming material M to the workpiece W.

[0039] As described above, the opening 3113 in which the material nozzle 312 is disposed is used as a supply path for the purge gas to be supplied to the space on the emission surface side of the terminal optical member 3114. In this case, the purge gas supplied through the opening 3113 forms, for example, a gas flow toward the supply outlet 314 at the tip of the material nozzle 312. As a result, due to such a gas flow, the modeling material M from the supply outlet 314 is more likely to be supplied along a supply path that is directed downward from the material nozzle 312. In other words, the modeling material M from the supply outlet 314 is less likely to be scattered in all directions from the material nozzle 312. As a result, the material nozzle 312 can appropriately supply the modeling material M. In other words, the processing system SYSa can improve the directivity of the supply direction of the modeling material M.

[0040] 1 and 2 again, the head drive system 32 moves the processing head 31. For example, the head drive system 32 moves the processing head 31 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the head drive system 32 moves the processing head 31, the relative positions of the processing head 31 and the stage 41 and the workpiece W placed on the stage 41 change. That is, the relative positions of the irradiation optical system 311 and the material nozzle 312 and the stage 41 and the workpiece W change. Furthermore, when the relative positions of the processing head 31 and the stage 41 and the workpiece W change, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W. For this reason, the head drive system 32 may function as a moving device that moves the target irradiation area EA and the target supply area MA (and further, the molten pool MP) relative to the workpiece W.

[0041] When the head drive system 32 moves the processing head 31 along the Z-axis direction (i.e., the direction along the optical axis AX of the focusing optical system 3111), a distance DS changes between the focusing surface FP of the focusing optical system 3111 on which the processing light EL#1 to EL#4 are focused and the surface WS of the workpiece W. For this reason, the head drive system 32 may function as a distance change device for changing the distance DS between the focusing surface FP of the focusing optical system 3111 and the surface WS of the workpiece W in the Z-axis direction.

[0042] The head drive system 32 may change the distance DS between the focusing surface FP of the focusing optical system 3111 and the surface WS of the workpiece W in the Z-axis direction so that the focusing surface FP of the focusing optical system 3111 coincides with the surface WS of the workpiece W (or the printing surface MS described later, the same below). In other words, the head drive system 32 may change the distance DS so that the distance DS becomes zero. In this case, as shown in FIG. 8(a) which is a plan view showing the processing light EL#1 to EL#4 irradiated to the workpiece W and FIG. 8(b) which is a cross-sectional view showing the processing light EL#1 to EL#4 irradiated to the workpiece W, the processing light EL#1 to EL#4 are condensed on the surface WS of the workpiece W. In other words, the processing light EL#1 to EL#4 are superimposed on the surface WS of the workpiece W. In this case, a single beam spot irradiated with the processing light EL#1 to EL#4 is formed on the surface WS of the workpiece W.

[0043] The head drive system 32 may change the distance DS between the focusing surface FP and the surface WS of the workpiece W in the Z-axis direction so that the focusing surface WS of the focusing optical system 3111 is out of the surface WS of the workpiece W in the Z-axis direction. That is, the head drive system 32 may change the distance DS so that the distance DS becomes a value other than zero. In this case, as shown in FIG. 9(a) which is a plan view showing the processing light EL#1 to EL#4 irradiated to the workpiece W and FIG. 9(b) which is a cross-sectional view showing the processing light EL#1 to EL#4 irradiated to the workpiece W, the processing light EL#1 to EL#4 are not condensed on the surface WS of the workpiece W. That is, the processing light EL#1 to EL#4 are not superimposed on the surface WS of the workpiece W. In this case, four beam spots are formed on the surface WS of the workpiece W, on which the processing light EL#1 to EL#4 are irradiated, respectively. The positional relationship of the four beam spots and the size of the four beam spots change depending on the distance between the focusing surface of the focusing optical system 3111 and the surface of the workpiece W in the Z-axis direction. In the example shown in Fig. 9(a), the four beam spots do not overlap each other, but at least two of the four beam spots may partially overlap each other. Also, in the examples shown in Fig. 9(a) and Fig. 9(b), the processing lights EL#1 to EL#4 do not intersect each other, but the processing lights EL#1 to EL#4 may be irradiated onto the surface WS of the workpiece W in a state in which the processing lights EL#1 to EL#4 are separated from each other after intersecting each other.

[0044] When the distance DS between the focusing surface FP of the focusing optical system 3111 and the surface WS of the workpiece W in the Z-axis direction is changed in this manner, the irradiation state of the processing light EL#1 to EL#4 on the surface WS of the workpiece W changes. As a result, the distribution (e.g., intensity distribution) of the processing light EL#1 to EL#4 on the surface WS of the workpiece W changes. For this reason, the head drive system 32 may function as a device for changing the distribution (e.g., intensity distribution) of the processing light EL#1 to EL#4 on the surface WS of the workpiece W.

[0045] 1 and 2 again, the stage device 4 includes a stage 41 and a stage drive system 42. However, the stage device 4 does not necessarily have to include the stage drive system 42. The stage 41 may also be called a table.

[0046] The stage 41 can support the workpiece W. The state where "the stage 41 supports the workpiece W" may mean a state where the workpiece W is directly or indirectly supported by the stage 41. The stage 41 may be capable of holding the workpiece W placed on the stage 41. That is, the stage 41 may support the workpiece W by holding the workpiece W. In this case, the stage 41 may be equipped with a mechanical chuck, a vacuum suction chuck, or the like, to hold the workpiece W. Alternatively, the stage 41 may not be capable of holding the workpiece W. In this case, the workpiece W may be placed on the stage 41 in a clampless manner. Furthermore, the stage 41 may be capable of releasing the held workpiece W when the workpiece W is held. The above-mentioned irradiation optical system 311 irradiates the workpiece W with the processing light EL#1 to EL#4 during at least a part of the period during which the stage 41 supports the workpiece W. Furthermore, the above-mentioned material nozzle 312 supplies the modeling material M during at least a part of the period during which the stage 41 supports the workpiece W.

[0047] The stage drive system 42 moves the stage 41. For this reason, the stage drive system 42 may be referred to as a moving device. The stage drive system 42 moves the stage 41, for example, along at least one of the X-axis, Y-axis, Z-axis, θX-direction, θY-direction, and θZ-direction. When the stage drive system 42 moves the stage 41, the relative positions of the processing head 31, the stage 41, and the workpiece W placed on the stage 41 change. For this reason, the stage drive system 42 may function as a moving device that moves the target irradiation area EA and the target supply area MA (and further, the molten pool MP) relative to the workpiece W, similar to the head drive system 32. In addition, when the stage drive system 42 moves the stage 41 along the Z-axis direction (i.e., the direction along the optical axis AX of the focusing optical system 3111), the distance DS between the focusing surface FP of the focusing optical system 3111 on which the processing beams EL#1 to EL#4 are focused and the surface WS of the workpiece W changes. Therefore, like the head driving system 32, the stage driving system 42 may function as a distance changing device for changing the distance DS in the Z-axis direction between the focusing surface FP of the focusing optical system 3111 and the surface WS of the workpiece W. Like the head driving system 32, the stage driving system 42 may function as a device for changing the distribution (e.g., intensity distribution) of the processing light EL#1 to EL#4 on the surface WS of the workpiece W.

[0048] The gas supply source 5 is a supply source of a purge gas for purging the chamber space 73IN. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas or argon gas. The gas supply source 5 is connected to the chamber space 73IN via a supply port 72 formed in the partition member 71 of the housing 7 and a supply pipe 51 connecting the gas supply source 5 and the supply port 72. The gas supply source 5 supplies a purge gas to the chamber space 73IN via the supply pipe 51 and the supply port 72. As a result, the chamber space 73IN becomes a space purged by the purge gas. The gas supply source 5 may be a cylinder storing an inert gas such as nitrogen gas or argon gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using the air as a raw material.

[0049] As described above, when the material nozzle 312 supplies the modeling material M together with the purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M from the material supply source 1 is supplied. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 that connects the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pumped) through the supply pipe 11 toward the material nozzle 312 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 312 via the supply pipe 52, the mixer 12, and the supply pipe 11. In that case, the material nozzle 312 supplies the modeling material M from the supply outlet 314 together with the purge gas for pumping the modeling material M.

[0050] The control device 6 controls the operation of the machining system SYSa. The control device 6 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and an FPGA (Field Programmable Gate Array). The storage device may include, for example, a memory. The control device 6 functions as a device that controls the operation of the machining system SYSa by the arithmetic device executing a computer program. This computer program is a computer program for making the arithmetic device perform (i.e., execute) the operation to be performed by the control device 6, which will be described later. In other words, this computer program is a computer program for making the control device 6 function so as to make the machining system SYSa perform the operation to be described later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 6, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control device 6 or externally attachable to the control device 6. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 6 via a network interface.

[0051] For example, the control device 6 may control the emission mode of the processing light EL#1 to EL#4 by the irradiation optical system 311. The emission mode may include, for example, at least one of the intensity of the processing light EL#1 to EL#4 and the emission timing of the processing light EL#1 to EL#4. When the processing light EL#1 to EL#4 includes a plurality of pulsed lights, the emission mode may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio of the length of the emission time of the pulsed light to the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 6 may control the movement mode of the processing head 31 by the head driving system 32. The control device 6 may control the movement mode of the stage 41 by the stage driving system 42. The movement mode may include, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing (movement time). Furthermore, the control device 6 may control the supply mode of the modeling material M by the material nozzle 312. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply period).

[0052] The control device 6 may not be provided inside the processing system SYSa. For example, the control device 6 may be provided as a server or the like outside the processing system SYSa. In this case, the control device 6 and the processing system SYSa may be connected by a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, a network using a serial bus type interface, for example, at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB, may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface conforming to Ethernet (registered trademark), for example, at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 6 and the processing system SYSa may be configured to be able to transmit and receive various information via the network. The control device 6 may also be able to transmit information such as commands and control parameters to the processing system SYSa via the network. The processing system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 6 via the network. The processing system SYSa may include a transmitting device (i.e., an output device that outputs information to the control device 6) that transmits information such as commands and control parameters to the control device 6 via the network. Alternatively, a first control device that performs a part of the processing performed by the control device 6 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control device 6 may be provided outside the processing system SYSa.

[0053] As a recording medium for recording the computer program executed by the control device 6, at least one of CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), and other optical disks, magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program may be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 6 by the control device 6 (i.e., a computer) executing the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 6, or may be realized in a form in which a logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0054] The housing 7 is a housing device that houses at least a part of each of the processing device 3 and the stage device 4 in a chamber space 73IN, which is an internal space of the housing 7. The housing 7 includes a partition member 71 that defines the chamber space 73IN. The partition member 71 is a member that separates the chamber space 73IN from an external space 74OUT of the housing 7. The partition member 71 faces the chamber space 73IN via its inner wall 711, and faces the external space 74OUT via its outer wall 712. In this case, the space surrounded by the partition member 71 (more specifically, the space surrounded by the inner wall 711 of the partition member 71) becomes the chamber space 73IN. The partition member 71 may be provided with a door that can be opened and closed. This door may be opened when the workpiece W is placed on the stage 41. The door may be opened when the workpiece W and / or the shaped object is removed from the stage 41. The door may be closed during processing (i.e., during additional processing or joining processing). The partition member 71 may be provided with an observation window (not shown) for visually checking the chamber space 73IN from the external space 74OUT of the housing .

[0055] (1-2) Operation of the machining system SYSa Next, the operation of the processing system SYSa will be described. In the first embodiment, the processing system SYSa performs an additional processing operation for forming a three-dimensional structure ST on the workpiece W. Furthermore, the processing system SYSa performs a light characteristic control operation for controlling at least one characteristic of the processing light EL#1 to the processing light EL#4 during at least a portion of the period during which the additional processing operation is performed. For this reason, the additional processing operation and the light characteristic control operation will be described in order below. (1-2-1) Additional processing operations First, the additional processing operation will be described. As described above, the processing system SYSa forms a three-dimensional structure ST by the laser build-up welding method. For this reason, the processing system SYSa may form the three-dimensional structure ST by performing an existing additional processing operation (in this case, a molding operation) that complies with the laser build-up welding method. Hereinafter, an example of the additional processing operation for forming the three-dimensional structure ST using the laser build-up welding method will be briefly described.

[0056] The processing system SYSa forms a three-dimensional structure ST on the workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. Measurement data of a solid object measured by at least one of a measuring device (not shown) provided in the processing system SYSa and a three-dimensional shape measuring device provided separately from the processing system SYSa may be used as the three-dimensional model data. In order to form the three-dimensional structure ST, the processing system SYSa sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYSa sequentially forms a plurality of structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis direction, one by one. As a result, a three-dimensional structure ST, which is a laminated structure in which a plurality of structural layers SL are stacked, is formed. Hereinafter, a flow of operations for forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.

[0057] First, the operation of forming each structure layer SL will be described with reference to Fig. 10(a) to Fig. 10(e). Under the control of the control device 6, the processing system SYSa moves at least one of the processing head 31 and the stage 41 so that the target irradiation area EA is set in a desired area on the printing surface MS corresponding to the surface WS of the workpiece W or the surface of the formed structure layer SL. After that, the processing system SYSa irradiates the target irradiation area EA with processing light EL#1 to EL#4 from the irradiation optical system 311. At this time, in the Z-axis direction, the light collection plane FP on which the processing light EL#1 to EL#4 are collected may coincide with the printing surface MS (see Fig. 8(a) and Fig. 8(b)). Alternatively, in the Z-axis direction, the light collection plane FP on which the processing light EL#1 to EL#4 are collected may be deviated from the printing surface MS (see Fig. 9(a) and Fig. 9(b)). When the processing light EL#1 to EL#4 are irradiated onto the printing surface MS, as shown in FIG. 10(a), a molten pool (i.e., a pool of metal melted by the processing light EL#1 to EL#4) MP is formed on the printing surface MS irradiated with the processing light EL#1 to EL#4. Furthermore, under the control of the control device 6, the processing system SYSa supplies the printing material M from the material nozzle 312. Here, since the target supply area MA to which the printing material M is supplied coincides with the target irradiation area EA as described above, the target supply area MA includes at least a part of the area in which the molten pool MP is formed. For this reason, as shown in FIG. 10(b), the processing system SYSa supplies the printing material M to the molten pool MP from the material nozzle 312. As a result, the printing material M supplied to the molten pool MP melts. Thereafter, when the processing light EL is no longer irradiated onto the molten pool MP as at least one of the processing head 31 and the stage 41 moves, the printing material M melted in the molten pool MP is cooled and solidified (i.e., solidified). As a result, the solidified modeling material M is deposited on the modeling surface MS, as shown in Fig. 10(c). That is, a model is formed by the deposition of the solidified modeling material M.

[0058] The processing system SYSa repeats a series of printing processes, including forming a molten pool MP by irradiating the processing light EL#1 to EL#4, supplying the printing material M to the molten pool MP, melting the supplied printing material M, and solidifying the molten printing material M, while moving the processing head 31 along the XY plane relative to the printing surface MS, as shown in Fig. 10(d). At this time, the processing system SYS irradiates the processing light EL#1 to EL#4 to the area on the printing surface MS where a model is to be formed, while not irradiating the processing light EL#1 to EL#4 to the area on the printing surface MS where a model is not to be formed. In other words, the processing system SYSa irradiates the processing light EL#1 to EL#4 to the printing surface MS at a timing according to the distribution of the area where a model is to be formed, while moving the target irradiation area EA along a predetermined movement trajectory on the printing surface MS. As a result, the molten pool MP also moves on the printing surface MS along a movement trajectory according to the movement trajectory of the target irradiation area EA. Specifically, the molten pool MP is formed on the printing surface MS in the area along the movement trajectory of the target irradiation area EA, in the area irradiated with the processing light EL#1 to EL#4. As a result, as shown in FIG. 10(e), a structure layer SL corresponding to an assembly of objects made of the melted and then solidified molding material M is formed on the printing surface MS. That is, a structure layer SL corresponding to an assembly of objects formed on the printing surface MS in a pattern according to the movement trajectory of the molten pool MP (that is, a structure layer SL having a shape according to the movement trajectory of the molten pool MP in a plan view) is formed. Note that, when the target irradiation area EA is set in an area where a molded object is not desired to be formed, the processing system SYSa may irradiate the target irradiation area EA with the processing light EL#1 to EL#4 and stop the supply of the molding material M. Also, when the target irradiation area EA is set in an area where a molded object is not desired to be formed, the processing system SYSa may supply the molding material M to the target irradiation area EA and irradiate the target irradiation area EA with the processing light EL#1 to EL#4 having an intensity that does not allow the molded pool MP to be formed.

[0059] The processing system SYSa repeatedly performs an operation for forming such a structure layer SL based on the three-dimensional model data under the control of the control device 6. Specifically, the control device 6 first slices the three-dimensional model data at the layer pitch to create slice data. Note that data obtained by partially modifying this slice data according to the characteristics of the processing system SYSa may be used. The processing system SYSa performs an operation for forming the first structure layer SL#1 on the printing surface MS corresponding to the surface WS of the workpiece W based on the three-dimensional model data corresponding to the structure layer SL#1 (i.e., slice data corresponding to the structure layer SL#1). As a result, the structure layer SL#1 is formed on the printing surface MS as shown in FIG. 11(a). After that, the processing system SYS sets the surface (i.e., the upper surface) of the structure layer SL#1 as a new printing surface MS, and then forms the second structure layer SL#2 on the new printing surface MS. To form the structure layer SL#2, the control device 6 first controls the head drive system 32 so that the processing head 31 moves along the Z axis. Specifically, the control device 6 controls the head drive system 32 to move the processing head 31 toward the +Z side so that the target irradiation area EA and the target supply area MA are set on the surface of the structure layer SL#1 (i.e., the new printing surface MS). Thereafter, under the control of the control device 6, the processing system SYSa forms the structure layer SL#2 on the structure layer SL#1 based on the slice data corresponding to the structure layer SL#2 in the same operation as the operation of forming the structure layer SL#1. As a result, as shown in FIG. 11(b), the structure layer SL#2 is formed. Thereafter, the same operation is repeated until all the structure layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in FIG. 11(c), the three-dimensional structure ST is formed by a stacked structure in which a plurality of structure layers SL are stacked.

[0060] (1-2-2) Optical characteristic control operation Next, the light characteristic control operation will be described. The light characteristic control operation is mainly performed under the control of the control device 6. That is, the control device 6 may perform the light characteristic control operation to control (in other words, change or adjust) at least one characteristic of the processing light EL#1 to EL#4 during at least a part of the period during which the additional processing operation is performed.

[0061] The control device 6 may individually control at least one characteristic of the processing light EL#1 to EL#4. That is, the control device 6 may control the characteristic of one of the processing light EL#1 to EL#4, regardless of whether or not the control device 6 controls the characteristic of the other processing light EL#1 to EL#4. In this case, the control device may control the characteristic of each of the processing light EL#1 to EL#4. That is, the control device may control the characteristic of the processing light EL#1, control the characteristic of the processing light EL#2, control the characteristic of the processing light EL#3, and control the characteristic of the processing light EL#4. Alternatively, the control device may control at least one characteristic of the processing light EL#1 to EL#4, while not controlling at least one other characteristic of the processing light EL#1 to EL#4. That is, the control device 6 may control at least one characteristic of the processing light EL#1 to EL#4, while fixing at least one other characteristic of the processing light EL#1 to EL#4. For example, the control device 6 may control the characteristics of each of the processing lights EL#1 and EL#2, but may not control (may fix) the characteristics of each of the processing lights EL#3 and EL#4.

[0062] The control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 so that at least one characteristic of the processing light EL#1 to EL#4 is different from at least one other characteristic of the processing light EL#1 to EL#4. In other words, the control device 6 may be able to set (in other words, determine) at least one characteristic of the processing light EL#1 to EL#4 so that at least one characteristic of the processing light EL#1 to EL#4 is different from at least one other characteristic of the processing light EL#1 to EL#4. In this case, the control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 so that at least one characteristic of the processing light EL#1 to EL#4 becomes the set characteristic. For example, the control device 6 may set the characteristic of the processing light EL#1 so that the characteristic of the processing light EL#1 becomes different from each of the characteristics of the processing light EL#2 to EL#4, and control the characteristic of the processing light EL#1 so that the characteristic of the processing light EL#1 becomes the set characteristic.

[0063] The characteristics of the processing light EL may include the intensity of the processing light EL. In this case, the control device 6 may control the intensity of at least one of the processing lights EL#1 to EL#4. Note that the "intensity of the processing light EL" referred to here may mean the intensity of the processing light EL on a surface intersecting the traveling direction of the processing light EL. Typically, the "intensity of the processing light EL" may mean the intensity of the processing light EL on the forming surface MS (e.g., the surface WS of the workpiece W or the surface of the structural layer SL) on which the additional processing is actually performed.

[0064] The characteristics of the processing light EL may include the intensity distribution of the processing light EL. In this case, the control device 6 may control the intensity distribution of at least one of the processing lights EL#1 to EL#4. Note that the "intensity distribution of the processing light EL" referred to here may mean the intensity of the processing light EL in a plane intersecting the traveling direction of the processing light EL. Typically, the "intensity distribution of the processing light EL" may mean the intensity distribution of the processing light EL in the forming surface MS (e.g., the surface WS of the workpiece W or the surface of the structural layer SL) where additional processing is actually performed.

[0065] The characteristics of the processing light EL may include the polarization distribution of the processing light EL. That is, the characteristics of the processing light EL may include the distribution of the polarization components contained in the processing light EL (for example, the distribution of the polarization components in a plane (typically, the printing surface MS) that intersects with the traveling direction of the processing light EL). The characteristics of the processing light EL may include the wavelength distribution of the processing light EL. That is, the characteristics of the processing light EL may include the distribution of the light components of each wavelength or each wavelength band contained in the processing light EL (for example, the distribution of the light components in a plane (typically, the printing surface MS) that intersects with the traveling direction of the processing light EL).

[0066] When the characteristics of the processing light EL (e.g., at least one of the intensity and the intensity distribution) change, the state (formation state) of the molten pool MP formed by the processing light EL changes. For this reason, the control device 6 may control the formation state of the molten pool MP by controlling the characteristics of the processing light EL (e.g., at least one of the intensity and the intensity distribution). The control device 6 may control the formation state of the molten pool MP by controlling the characteristics of the processing light EL (e.g., at least one of the intensity and the intensity distribution) so that the formation state of the molten pool MP becomes the desired formation state (i.e., the ideal formation state).

[0067] When controlling the state of formation of the molten pool MP, the control device 6 may control the state of formation of the molten pool MP based on the measurement results of a measuring device capable of measuring the state of formation of the molten pool MP. An example of such a measuring device is a measuring device 82b provided in the machining system SYSb of the second embodiment described below. However, the control device 6 may also control the state of formation of the molten pool MP based on the measurement results of the state of formation of the molten pool MP by a measuring device other than the measuring device 82b.

[0068] The formation state of the molten pool MP may include the temperature distribution of the molten pool MP. In this case, the control device 6 may control the characteristics of the processing light EL (for example, at least one of the intensity and the intensity distribution) so that the temperature distribution of the molten pool MP becomes a desired temperature distribution (i.e., an ideal temperature distribution).

[0069] When the temperature distribution of the molten pool MP changes, the size of the molten pool MP may change. For example, when the temperature distribution of the molten pool MP changes, the size (i.e., width, length) of the molten pool MP in the direction along the printing surface MS may change. For example, when the temperature distribution of the molten pool MP changes, the size (i.e., depth) of the molten pool MP in the direction intersecting the printing surface MS may change. For this reason, the formation state of the molten pool MP may include the size of the molten pool MP. In this case, the control device 6 may control the characteristics of the processing light EL (e.g., at least one of the intensity and intensity distribution) so that the size of the molten pool MP becomes the desired size (i.e., ideal size).

[0070] In order to control the characteristics of at least one of the processing light EL#1 to EL#4, the control device 6 may control at least one of the processing light sources 2#1 to 2#4 that generate the processing light EL#1 to EL#4, respectively. Specifically, the control device 6 may control the characteristics of the processing light EL#1 by controlling the processing light source 2#1. The control device 6 may control the characteristics of the processing light EL#2 by controlling the processing light source 2#2. The control device 6 may control the characteristics of the processing light EL#3 by controlling the processing light source 2#3. The control device 6 may control the characteristics of the processing light EL#4 by controlling the processing light source 2#4.

[0071] In order to control at least one characteristic of the processing light EL#1 to EL#4, the control device 6 may control the distance DS in the Z-axis direction between the focusing surface FP on which the focusing optical system 3111 focuses the processing light EL#1 to EL#4 and the surface WS of the workpiece W. This is because, as described above, when the distance DS changes, the distribution (e.g., intensity distribution) of the processing light EL#1 to EL#4 on the surface WS (or the printing surface MS) of the workpiece W changes. For this reason, the control device 6 may control at least one of the head driving system 32 and the stage driving system 42, which can change the distance DS, so that at least one characteristic of the processing light EL#1 to EL#4 becomes a desired characteristic by controlling the distance DS.

[0072] In order to control at least one characteristic of the processing light EL#1 to EL#4, the control device 6 may control an optical component provided in the irradiation optical system 311 and capable of controlling at least one characteristic of the processing light EL#1 to EL#4.

[0073] The control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 based on movement information related to the movement of the target irradiation area EA on the printing surface MS. Here, as described above, the target irradiation area EA moves with the movement of the processing head 31 by the head drive system 32 and the movement of the stage 41 by the stage drive system 42. For this reason, the operation of controlling at least one characteristic of the processing light EL#1 to EL#4 based on the movement information related to the movement of the target irradiation area EA may be considered to be substantially equivalent to the operation of controlling at least one characteristic of the processing light EL#1 to EL#4 based on information related to the movement of at least one of the processing head 31 and the stage 41.

[0074] The movement information regarding the movement of the target irradiation area EA may include information regarding the movement direction of the target irradiation area EA on the printing surface MS (i.e., the movement direction of the irradiation positions of the processing light EL#1 to EL#4). In this case, the control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 based on the movement direction of the target irradiation area EA on the printing surface MS. The control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 based on the movement direction of at least one of the processing head 31 and the stage 41.

[0075] When controlling at least one characteristic of the processing light EL#1 to EL#4 based on the moving direction of the target irradiation area EA, the control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 so that the characteristic of at least one processing light EL irradiated to a relatively forward position in the moving direction is different from the characteristic of at least one processing light EL irradiated to a relatively rearward position in the moving direction. For example, FIG. 12 is a plan view showing the target irradiation area EA (i.e., the irradiation positions of the processing light EL#1 to EL#4) moving toward the +Y side along the Y-axis direction on the printing surface MS. In the example shown in FIG. 12, the irradiation position of the processing light EL#2 is located relatively forward (i.e., +Y side) in the moving direction of the target irradiation area EA, and the irradiation position of the processing light EL#1 is located relatively rearward (i.e., -Y side) in the moving direction of the target irradiation area EA. In this case, the control device 6 may control at least one characteristic of the processing light EL#1 and EL#2 so that the characteristic of the processing light EL#1 is different from the characteristic of the processing light EL#2.

[0076] As an example, as shown in FIG. 13(a) and FIG. 13(b), which are graphs showing the intensities of the processing light EL#1 irradiated to a relatively rear position in the moving direction and the processing light EL#2 irradiated to a relatively forward position in the moving direction, the control device 6 may control the characteristics (e.g., intensity or intensity distribution) of at least one of the processing light EL#1 and EL#2 so that the intensity of the processing light EL#1 is smaller than the intensity of the processing light EL#2. Note that FIG. 13(a) shows an example in which the intensity of the processing light EL#1 is greater than zero, and FIG. 13(b) shows an example in which the intensity of the processing light EL#2 is zero. When the intensity of the processing light EL#1 irradiated to a relatively rear position in the moving direction becomes smaller than the intensity of the processing light EL#2 irradiated to a relatively forward position in the moving direction in this way, the formation state of the molten pool MP is more likely to be maintained in a desired formation state. For example, the formation state of the molten pool MP is more likely to be maintained in a liquid phase state, which is an example of a desired formation state. Therefore, the processing system SYSa can properly process the workpiece W.

[0077] As another example, as shown in FIG. 14, which is a graph showing the intensities of the processing light EL#1 irradiated to a relatively rear position in the moving direction and the processing light EL#2 irradiated to a relatively forward position in the moving direction, the control device 6 may control the characteristics (e.g., intensity or intensity distribution) of the processing light EL#1 so that the processing light EL#1 becomes pulsed light. On the other hand, the control device 6 may control the characteristics (intensity) of the processing light EL#2 so that the processing light EL#2 becomes continuous light (CW: Continuous Wave). When the processing light EL#1 irradiated to a relatively rear position in the moving direction becomes pulsed light, while the processing light EL#2 irradiated to a relatively forward position in the moving direction becomes continuous light, the processing traces on the printing surface MS by the processing light EL#2 are smoothed by the processing light EL#2, which is a pulsed light. Therefore, the processing system SYSa can appropriately process the workpiece W. For example, the processing system SYSa can form a three-dimensional structure ST with a relatively smooth surface. Furthermore, the control device 6 may control at least one of the processing light EL#1 and the processing light EL#2 so that the integrated light amount of the processing light EL#1 and the integrated light amount of the processing light EL#2 are different from each other.

[0078] In addition to or instead of the above-mentioned movement information, the control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 based on work information related to the workpiece W to be processed. The workpiece information related to the workpiece W may include information related to the shape of the workpiece W. In this case, the control device 6 may control at least one characteristic of the processing light EL#1 to EL#4 based on the shape of the workpiece W. Note that, when a portion of a three-dimensional structure ST has already been formed on the workpiece W, the information related to the shape of the workpiece W may include information related to the shape of the workpiece W including the portion of the already formed three-dimensional structure ST.

[0079] The control device 6 may control at least one characteristic (e.g., intensity or intensity distribution) of the processing light EL#1 to EL#4 based on the shape of the workpiece W so that the intensity of the processing light EL irradiated to the part of the workpiece W to be processed is equal to or higher than the processable intensity that is large enough to process the workpiece W. The control device 6 may control at least one characteristic (e.g., intensity or intensity distribution) of the processing light EL#1 to EL#4 based on the shape of the workpiece W so that the intensity of the processing light EL irradiated to the part of the workpiece W that is not to be processed is equal to or lower than the unprocessable intensity that is small enough not to process the workpiece W. For example, FIG. 15(a) is a cross-sectional view showing a state in which the processing light EL#1 and EL#2 are emitted toward the target irradiation area EA under a situation in which the target irradiation area EA is set in the first portion P1 to process the first portion P1 of the printing surface MS. In the situation shown in FIG. 15(a), each of the processing light EL#1 and EL#2 is irradiated to the first portion P1 to be processed of the workpiece W. Therefore, in this case, the control device 6 may control the characteristics (e.g., intensity or intensity distribution) of the processing light EL#1 and EL#2 so that the intensity of each of the processing light EL#1 and EL#2 is equal to or greater than the processable intensity. On the other hand, for example, FIG. 15(b) is a cross-sectional view showing a state in which the processing light EL#1 and EL#2 are emitted toward the target irradiation area EA under a situation in which the target irradiation area EA is set in the second portion P2 of the printing surface MS in order to process the second portion P2. In the situation shown in FIG. 15(b), the processing light EL#2 is irradiated to the second portion P2 of the workpiece W to be processed. Therefore, in this case, the control device 6 may control the characteristics (e.g., intensity or intensity distribution) of the processing light EL#2 so that the intensity of the processing light EL#2 is equal to or greater than the processable intensity. On the other hand, the processing light EL#1 is not irradiated to the second portion P2 of the workpiece W to be processed. This is because the third portion P3 of the workpiece W that should not be processed is present on the optical path of the processing light EL#1 from the irradiation optical system 211 to the target irradiation position EA. In this case, there is a possibility that the third portion P3 will be unintentionally processed by irradiating the third portion P3 with the processing light EL#1.Therefore, the control device 6 may control the characteristics (e.g., intensity or intensity distribution) of the processing light EL#1 so that the intensity of the processing light EL#1 is equal to or lower than the intensity at which processing is impossible. At this time, the control device 6 may control the intensity of the processing light EL#1 to be zero. As a result, the processing system SYSa can properly process the workpiece W.

[0080] (1-3) Technical effects of processing system SYSa As described above, the processing system SYSa of the first embodiment can individually control at least one of the multiple processing light beams EL irradiated to the workpiece W. Therefore, the processing system SYSa can appropriately process the workpiece W using the multiple processing light beams EL, compared to the processing system of the comparative example that cannot individually control at least one of the multiple processing light beams EL.

[0081] (1-4) Modified examples of processed light EL In the example shown in FIG. 5, the processing light EL#1 to EL#4 pass through separate regions that are separated from the optical axis AX in different directions and are symmetrical with respect to the optical axis AX in a virtual optical surface OP (e.g., the entrance pupil surface of the focusing optical system 3111) in the focusing optical system 3111 that intersects with the optical axis AX of the focusing optical system 3111. However, as shown in FIG. 16, which is a cross-sectional view showing the optical paths of the processing light EL#1 to EL#4 in the optical surface OP, the processing light EL#1 to EL#4 may pass through separate regions that are separated from the optical axis AX in different directions and are asymmetrical with respect to the optical axis AX in the optical surface OP. In other words, the region in the optical surface OP through which the processing light EL#1 to EL#4 pass may be one-time rotationally symmetric with respect to the optical axis AX. For example, the processing light EL#1 to EL#4 may pass through separate regions that are not linearly symmetric in the optical surface OP under a situation in which a straight line (e.g., a straight line along the X-axis or Y-axis) that intersects with the optical axis AX is the axis of symmetry. In this case, there is a small possibility that the return light from the workpiece W of one processing light EL irradiated to the workpiece W is incident on the processing light source 2 that generates the other processing light EL via the same optical path as the optical path of the other processing light EL irradiated to the workpiece W. Therefore, there is a small possibility that the processing light source 2 will break down due to the return light being incident on the processing light source 2.

[0082] In the examples shown in the above-mentioned Figures 8 and 9, the shape of the beam spot formed by the processing light EL on the printing surface MS (for example, the surface WS of the workpiece W or the surface of the structure layer SL) is circular. However, the shape of the beam spot formed by the processing light EL may be a shape other than circular. For example, the shape of the beam spot formed by the processing light EL may be elliptical, rectangular, or slit-shaped. Furthermore, multiple processing lights EL may form beam spots of a desired shape on the printing surface MS. For example, as shown in Figure 17, which is a plan view showing an example of beam spots of a desired shape formed by multiple processing lights EL on the printing surface MS, multiple processing lights EL may form annular beam spots on the printing surface MS. In this case, each processing light EL may form a beam spot of an arc shape (partial annular shape) that constitutes a part of the annular zone on the printing surface MS.

[0083] (2) Machining system SYS of the second embodiment Next, a machining system SYS of a second embodiment (hereinafter, the machining system SYS of the second embodiment will be referred to as "machining system SYSb") will be described with reference to Figs. 18 and 19. Fig. 18 is a cross-sectional view showing a schematic structure of the machining system SYSb of the second embodiment. Fig. 19 is a system configuration diagram showing the system configuration of the machining system SYSb of the second embodiment. In the following description, the same components as those already described will be denoted by the same reference symbols, and detailed description thereof will be omitted.

[0084] 18 and 19, the processing system SYSb of the second embodiment is different from the processing system SYSa of the first embodiment in that the processing system SYSb includes a measurement light source 81b and a measurement device 82b. Other features of the processing system SYSb may be similar to other features of the processing system SYSa.

[0085] The measurement light source 81b emits, for example, at least one of infrared light, visible light, and ultraviolet light as the measurement light ML. However, other types of radiation (for example, at least one of terahertz waves, microwaves, and X-rays) may be used as the measurement light ML. The wavelength of the measurement light ML may be different from the wavelength of the processing light EL. The wavelength range of the measurement light ML may be different from the wavelength range of the processing light EL. However, the wavelength of the measurement light ML may be the same as the wavelength of the processing light EL. At least a part of the wavelength range of the measurement light ML may overlap (i.e., may overlap) with at least a part of the wavelength range of the processing light EL. The measurement light ML emitted by the measurement light source 81b is incident on the irradiation optical system 311 via an optical transmission member 811b including at least one of an optical fiber, a light pipe, and the like. For this reason, the irradiation optical system 311 and the measurement light source 81b are optically connected via the optical transmission member 811b. The measurement light ML incident on the irradiation optical system 311 is irradiated onto the workpiece W (more specifically, the printing surface MS) via the irradiation optical system 311 (i.e., via the focusing optical system 3111). At this time, the measurement light ML may be used as illumination light for illuminating the workpiece W. In this case, the measurement light source 81b may be referred to as an illumination device.

[0086] The irradiation optical system 311 may irradiate the measurement light ML to an area on the workpiece W where at least one of the processing lights EL#1 to EL#4 is irradiated. The irradiation optical system 311 may irradiate the measurement light ML to an area including at least a part of the target irradiation area EA set on the workpiece W. The irradiation optical system 311 may irradiate the measurement light ML to an area including at least a part of the molten pool MP formed on the workpiece W. However, the irradiation optical system 311 may irradiate the measurement light ML to an area other than the area on the workpiece W where at least one of the processing lights EL#1 to EL#4 is irradiated. The irradiation optical system 311 may irradiate the measurement light ML to an area other than the target irradiation area EA set on the workpiece W. The irradiation optical system 311 may irradiate the measurement light ML to an area other than the molten pool MP formed on the workpiece W.

[0087] When the measurement light ML is irradiated onto the workpiece W, return light generated by the measurement light ML being irradiated onto the workpiece W is emitted from the workpiece W. The return light may include at least one of the reflected light, scattered light, and transmitted light of the measurement light ML by the workpiece W. The return light may also be referred to as light directly generated by the measurement light ML being irradiated onto the workpiece W. Also, as described above, a molten pool MP made of molten metal is formed on the workpiece W. In this case, light from the molten pool MP (light indirectly generated by irradiation with the processing light EL) is emitted from the workpiece W. Hereinafter, both the return light generated by the measurement light ML being irradiated onto the workpiece W and the light generated by irradiation with the processing light EL are referred to as the object light RL. The wavelength of the object light RL (particularly, the wavelength of the return light included in the object light RL) may be different from the wavelength of the processing light EL. The wavelength range of the object light RL may be different from the wavelength range of the processing light EL. The wavelength of the object light RL may be the same as the wavelength of the processing light EL. At least a part of the wavelength range of the object light RL may overlap with at least a part of the wavelength range of the processing light EL. The object light RL emitted from the workpiece W is incident on the measuring device 82b via the irradiation optical system 311 (i.e., via the focusing optical system 3111).

[0088] Here, the optical paths of the measurement light ML and object light RL in the irradiation optical system 311 (particularly in the collecting optical system 3111) will be described with reference to Figs. 20 and 21. Fig. 20 is a cross-sectional view showing the optical paths of the measurement light ML and object light RL in the irradiation optical system 311 (particularly in the collecting optical system 3111). Fig. 21 is a cross-sectional view taken along line XX-XX' in Fig. 20. Note that Fig. 20 is a cross-sectional view taken along line XX-XX' in Fig. 21.

[0089] 20 and 21, in the focusing optical system 3111, at least a part of the optical path of the measurement light ML, at least a part of the optical path of the object light RL, and at least a part of the optical paths of the processing light EL#1 to EL#4 may be optically separated. That is, in the focusing optical system 3111, at least a part of the optical path of the measurement light ML, at least a part of the optical path of the object light RL, and at least a part of the optical paths of the processing light EL#1 to EL#4 may be different from each other. In the focusing optical system 3111, at least a part of the optical path of the measurement light ML, at least a part of the optical path of the object light RL, and at least a part of the optical paths of the processing light EL#1 to EL#4 do not have to overlap with each other.

[0090] In order to optically separate at least a part of the optical path of the measurement light ML, at least a part of the optical path of the object light RL, and at least a part of the optical paths of the processing lights EL#1 to EL#4, as shown in Fig. 21, within a virtual optical surface OP (typically a surface along the XY plane, for example, a pupil surface (entrance pupil surface) of the focusing optical system 3111) in the focusing optical system 3111 intersecting the optical axis AX of the focusing optical system 3111, the measurement light ML, the object light RL, and the processing lights EL#1 to EL#4 may each pass through separate regions spaced apart in different directions from each other from the optical axis AX. Within the optical surface OP, the region through which the measurement light ML passes, the region through which the object light RL passes, and the region through which the processing lights EL#1 to EL#4 pass may not overlap. In this case, in the optical surface OP, the distance between the optical axis AX and the optical path of the measurement light ML, the distance between the optical axis AX and the optical path of the object light RL, the distance between the optical axis AX and the optical path of the processing light EL#1, the distance between the optical axis AX and the optical path of the processing light EL#2, the distance between the optical axis AX and the optical path of the processing light EL#3, and the distance between the optical axis AX and the optical path of the processing light EL#4 may be the same. Alternatively, the distance between the optical axis AX and at least two of the optical paths of the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may be different from each other. In the example shown in FIG. 21, in the optical surface OP, the distance between the optical axis AX and the optical paths of the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 is the same. In this case, the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may pass through an area that is linearly symmetrical with respect to the J axis that intersects with the optical axis AX in the optical surface OP. For example, as shown in Figure 21, the measurement light ML, object light RL and processing light EL#1 to EL#4 may each pass through six regions in a coordinate plane along the XY plane with the optical axis AX as the origin, where the clockwise rotation angles around the origin are 315 degrees, 135 degrees, 270 degrees, 90 degrees, 0 degrees and 180 degrees (or θ+α (α is any angle other than 90 degrees, 180 degrees and 270 degrees), θ+α-180 degrees, θ+270 degrees, θ+90 degrees, θ degrees and θ+180 degrees). In other words, the measurement light ML, object light RL and processing light EL#1 to EL#4 may pass through regions in the optical surface OP that are two-fold rotationally symmetric with respect to the optical axis AX.

[0091] When the measurement light ML, object light RL, and processing light EL#1 to EL#4 pass through separate regions in the optical surface OP that are spaced apart in different directions from the optical axis AX, the focusing optical system 3111 may irradiate the measurement light ML and processing light EL#1 to EL#4 onto the workpiece W from different directions. Specifically, the focusing optical system 3111 may irradiate the measurement light ML and processing light EL#1 to EL#4 onto the workpiece W from different positions in the rotation direction about the optical axis AX. In addition, the object light RL may enter the focusing optical system 3111 after traveling an optical path different from the optical path through which the processing light EL#1 to EL#4 pass between the focusing optical system 3111 and the workpiece W.

[0092] Alternatively, in order to optically separate at least a part of the optical path of the measurement light ML, at least a part of the optical path of the object light RL, and at least a part of the optical paths of the processing lights EL#1 to EL#4, the measurement light ML, the object light RL, and the processing lights EL#1 to EL#4 may pass through different regions in the optical surface OP that are different distances from the optical axis AX in the same direction. In this case, the focusing optical system 3111 may irradiate the measurement light ML and the processing lights EL#1 to EL#4 to the workpiece W such that, between the focusing optical system 3111 and the workpiece W, the angle between the traveling direction of the measurement light ML and the optical axis AX and the angle between the traveling direction of the processing lights EL#1 to EL#4 and the optical axis AX are different from each other. In addition, the object light RL may enter the focusing optical system 3111 after traveling an optical path between the focusing optical system 3111 and the workpiece W, in which the angle between the traveling direction of the return light RL and the optical axis AX is different from the angle between the traveling direction of the processing light EL#1 to EL#4 and the optical axis AX.

[0093] The object light RL incident on the light collecting optical system 3111 is detected (in other words, received) by the measuring device 82b via the light collecting optical system 3111 (i.e., via at least a part of the irradiation optical system 311). For this reason, the measuring device 82b may be referred to as a detection device or a light receiving device. The measuring device 82b may also be referred to as an information acquisition device that acquires information regarding the object light RL. The measuring device 82b is capable of measuring (in other words, observable or monitorable) the workpiece W by detecting the object light RL. As an example, the measuring device 82b may include an imaging device (camera) that images the workpiece W by detecting the object light RL. In this case, the measuring device 82b may measure the workpiece W by imaging at least a part of the workpiece W illuminated by the measurement light ML that can be used as illumination light.

[0094] The detection result of the object light RL by the measuring device 82b (i.e., the measurement result of the workpiece W) may be output to the control device 6. The control device 6 may control the machining system SYSb to machine the workpiece W based on the detection result of the object light RL by the measuring device 82b (i.e., the measurement result of the workpiece W).

[0095] The machining system SYSb of the second embodiment described above can enjoy the same effects as those that can be enjoyed by the machining system SYSa of the first embodiment described above. Furthermore, the machining system SYSb can machine the workpiece W based on the measurement result of the workpiece W by the measuring device 82b. Therefore, the machining system SYSb can properly machine the workpiece W compared to the machining system of the comparative example not equipped with the measuring device 82b. For example, when the measurement light ML is irradiated onto the workpiece W before the additional machining operation is started, the machining system SYSb can identify the state of the workpiece W before being machined based on the measurement result of the workpiece W by the measuring device 82b. As a result, the machining system SYSb can properly set the machining conditions so that an appropriate additional machining operation is performed based on the state of the workpiece W before being machined. For example, when the measurement light ML is irradiated onto the workpiece W during the period in which the additional machining operation is performed, the machining system SYSb can identify the machining state of the workpiece W in real time based on the measurement result of the workpiece W by the measuring device 82b. As a result, the machining system SYSb can properly set the machining conditions so that an appropriate additional machining operation is performed based on the machining state of the workpiece W identified in real time. For example, when the measurement light ML is irradiated onto the workpiece W after the additional machining operation is completed, the machining system SYSb can identify the state of the machined workpiece W based on the measurement results of the workpiece W by the measuring device 82b. As a result, the machining system SYSb can determine whether or not an appropriate additional machining operation has been performed based on the state of the machined workpiece W. Furthermore, when it is determined that an appropriate additional machining operation has not been performed, the machining system SYSb can machine the workpiece W again.

[0096] (3) Machining system SYS of the third embodiment Next, a machining system SYS of a third embodiment (hereinafter, the machining system SYS of the third embodiment will be referred to as a "machining system SYSc") will be described with reference to Fig. 22. Fig. 22 is a system configuration diagram showing the system configuration of the machining system SYSc of the third embodiment.

[0097] As shown in FIG. 22, the processing system SYSb of the third embodiment is different from the processing system SYSb of the second embodiment described above in that it includes a processing device 3c instead of the processing device 3. Other features of the processing system SYSc may be similar to other features of the processing system SYSb. The processing device 3c is different from the processing device 3 in that it includes a processing head 31c instead of the processing head 31. Other features of the processing device 3c may be similar to other features of the processing device 3. The processing head 31c is different from the processing head 31 in that it includes an irradiation optical system 311c instead of the irradiation optical system 311. Other features of the processing head 31c may be similar to other features of the processing head 31. For this reason, hereinafter, the irradiation optical system 311c will be described with reference to FIG. 23. FIG. 23 is a cross-sectional view showing the structure of the irradiation optical system 311c of the third embodiment.

[0098] 23, the irradiation optical system 311c is different from the irradiation optical system 311 in that the irradiation optical system 311c includes movable mirrors 3115c and 3116c and movable mirror drivers 3117c and 3118c. Other features of the irradiation optical system 311c may be similar to other features of the irradiation optical system 311.

[0099] The movable mirror 3115c is disposed on the optical path of the measurement light ML emitted from the measurement light source 81b. In the example shown in FIG. 23, the movable mirror 3115c is disposed on the optical path of the measurement light ML between the measurement light source 81b and the condensing optical system 3111. In this case, the movable mirror 3115c reflects the measurement light ML incident on the reflecting surface of the movable mirror 3115c to guide the measurement light ML to the condensing optical system 3111. The movable mirror 3116c is disposed on the optical path of the object light RL emitted from the workpiece W. In the example shown in FIG. 23, the movable mirror 3116c is disposed on the optical path of the object light RL between the condensing optical system 3111 and the measuring device 82b. In this case, the movable mirror 3116c reflects the object light RL incident on the reflecting surface of the movable mirror 3116c to guide it to the measuring device 82b.

[0100] The movable mirror 3115c can be driven by a movable mirror drive device 3117c so as to change the angle of the reflecting surface of the movable mirror 3115c relative to the traveling direction of the measurement light ML incident on the movable mirror 3115c. The movable mirror 3116c can be driven by a movable mirror drive device 3118c so as to change the angle of the reflecting surface of the movable mirror 3116c relative to the traveling direction of the object light RL incident on the movable mirror 3116c. The movable mirror drive devices 3117c and 3118c change the angles of the reflecting surfaces of the movable mirrors 3115c and 3116c under the control of the control device 6.

[0101] In the third embodiment, for example, the movable mirror 3115c may change the irradiation position of the measurement light ML on the printing surface MS by changing the angle of the reflecting surface of the movable mirror 3115c with respect to the traveling direction of the measurement light ML. Therefore, the movable mirror 3115c and the movable mirror driving device 3117c may function as a position changing device for changing the irradiation position of the measurement light ML on the printing surface MS. In addition, the movable mirror 3116c may guide the object light RL including the return light of the measurement light ML irradiated on the printing surface MS to the measurement device 82b by changing the angle of the reflecting surface of the movable mirror 3116c with respect to the traveling direction of the object light RL in synchronization with the driving of the movable mirror 3115c. In other words, the movable mirror 3116c and the movable mirror driving device 3118c may change the angle of the reflecting surface of the movable mirror 3116c with respect to the traveling direction of the object light RL so that the object light RL including the return light of the measurement light ML is detected by the measurement device 82b even if the irradiation position of the measurement light ML on the printing surface MS is changed.

[0102] For example, as shown in FIG. 24(a), which is a cross-sectional view showing a first example of the optical path of the measurement light ML irradiated to the printing surface MS, the movable mirror 3115c may change the angle of the reflecting surface of the movable mirror 3115c with respect to the traveling direction of the measurement light ML so that the measurement light ML is irradiated to the position on the printing surface MS where the processing light EL is currently irradiated. In this case, the movable mirror 3116c may change the angle of the reflecting surface of the movable mirror 3116c with respect to the traveling direction of the object light RL so that the object light RL including the light from the position on the printing surface MS where the processing light EL is currently irradiated is incident on the measuring device 82b. As a result, the machining system SYSc can specify the machining state of the workpiece W in real time based on the measurement result of the workpiece W by the measuring device 82b. Therefore, the machining system SYSc can appropriately set the machining conditions so that an appropriate additional machining operation is performed based on the machining state of the workpiece W specified in real time.

[0103] For example, as shown in FIG. 24(b), which is a cross-sectional view showing a second example of the optical path of the measurement light ML irradiated to the printing surface MS, the movable mirror 3115c may change the angle of the reflecting surface of the movable mirror 3115c with respect to the traveling direction of the measurement light ML so that the measurement light ML is irradiated to a position on the printing surface MS where the processing light EL has already been irradiated. The position where the processing light EL has already been irradiated is located behind the position where the processing light EL is currently irradiated in the moving direction of the processing light EL in the direction along the printing surface MS (i.e., the moving direction of the target irradiation area EA). In this case, the movable mirror 3116c may change the angle of the reflecting surface of the movable mirror 3116c with respect to the traveling direction of the object light RL so that the object light RL including the light from the position on the printing surface MS where the processing light EL has already been irradiated enters the measuring device 82b. As a result, the machining system SYSc can identify the state of the machined workpiece W based on the measurement result of the workpiece W by the measuring device 82b. Therefore, the machining system SYSc can determine whether or not an appropriate additional machining operation has been performed based on the state of the machined workpiece W.

[0104] For example, as shown in FIG. 24(c), which is a cross-sectional view showing a third example of the optical path of the measurement light ML irradiated to the printing surface MS, the movable mirror 3115c may change the angle of the reflecting surface of the movable mirror 3115c with respect to the traveling direction of the measurement light ML so that the measurement light ML is irradiated to a position on the printing surface MS that has not yet been irradiated with the processing light EL (specifically, a position where the processing light EL is to be irradiated in the future). The position where the processing light EL is to be irradiated in the future is located forward in the moving direction of the processing light EL in the direction along the printing surface MS (i.e., the moving direction of the target irradiation area EA) from the position where the processing light EL is currently irradiated. In this case, the movable mirror 3116c may change the angle of the reflecting surface of the movable mirror 3116c with respect to the traveling direction of the object light RL so that the object light RL including the light from the position where the processing light EL is to be irradiated in the future on the printing surface MS is incident on the measuring device 82b. As a result, the processing system SYSc can identify the state of the workpiece W before processing based on the measurement result of the workpiece W by the measuring device 82b. Therefore, the machining system SYSc can appropriately set machining conditions so that an appropriate additional machining operation is performed based on the state of the workpiece W before it is machined.

[0105] In this way, the machining system SYSc of the third embodiment can achieve the same effects as those achieved by the machining system SYSb of the second embodiment described above.

[0106] As described in the first embodiment, the same effect as that of the processing system SYSc of the third embodiment can be obtained by changing the angle of the emission end of the optical transmission members 21#1 to 21#4 in the first embodiment and thereby changing the traveling direction of the processing light EL#1 to EL#4 emitted from the optical transmission members 21#1 to 21#4.

[0107] (4) Machining system SYS of the fourth embodiment Next, a machining system SYS of a fourth embodiment (hereinafter, the machining system SYS of the fourth embodiment will be referred to as a "machining system SYSd") will be described with reference to Fig. 25. Fig. 25 is a system configuration diagram showing the system configuration of the machining system SYSd of the fourth embodiment.

[0108] 25, the machining system SYSd of the fourth embodiment is different from the machining system SYSb of the second embodiment in that the machining system SYSd includes a measuring device 83d. Other features of the machining system SYSd may be similar to other features of the machining system SYSb.

[0109] The measuring device 83d is a device capable of measuring the workpiece W, similar to the measuring device 82b. However, the measuring device 83d may be a device capable of measuring the workpiece W by a measurement method based on a different principle from that of the measuring device 82b. For example, in the case where the measuring device 82b measures the workpiece W by capturing an image of the workpiece W as described above, the measuring device 83d may be a device capable of measuring the workpiece W without capturing an image of the workpiece W.

[0110] The measuring device 83d is a device capable of optically measuring the workpiece W via the light collecting optical system 3111 (i.e., via the irradiation optical system 311). In this case, the measuring device 83d may include a light transmitting unit 831d and a light receiving unit 832d.

[0111] The light sending unit 831d can send, for example, the measurement light ML' from a light source (not shown) to the workpiece W via the light collecting optical system 3111. That is, the light sending unit 831d can irradiate the measurement light ML' from a light source (not shown) to the workpiece W via the light collecting optical system 3111. For this reason, the light sending unit 831d may be referred to as an irradiation device. The light sending unit 831d may include a light source of the measurement light ML'. The measurement light ML' includes, for example, at least one of infrared light, visible light, and ultraviolet light. However, the measurement light ML' may include other types of radiation (for example, at least one of terahertz waves, microwaves, and X-rays). The wavelength of the measurement light ML' may be different from the wavelength of at least one of the processing light EL and the measurement light ML. The wavelength range of the measurement light ML' may be different from the wavelength range of at least one of the processing light EL and the measurement light ML. However, the wavelength of the measurement light ML' may be the same as the wavelength of at least one of the processing light EL and the measurement light ML. At least a part of the wavelength range of the measurement light ML' may overlap (i.e., may overlap) with at least a part of the wavelength range of at least one of the processing light EL and the measurement light ML.

[0112] The irradiation optical system 311 may irradiate the measurement light ML' to an area on the workpiece W where at least one of the measurement light ML and the processing light EL#1 to EL#4 is irradiated. The irradiation optical system 311 may irradiate the measurement light ML' to an area including at least a part of the target irradiation area EA set on the workpiece W. The irradiation optical system 311 may irradiate the measurement light ML' to an area including at least a part of the molten pool MP formed on the workpiece W. However, the irradiation optical system 311 may irradiate the measurement light ML' to an area different from the area on the workpiece W where at least one of the measurement light ML and the processing light EL#1 to EL#4 is irradiated. The irradiation optical system 311 may irradiate the measurement light ML' to an area different from the target irradiation area EA set on the workpiece W. The irradiation optical system 311 may irradiate the measurement light ML' to an area different from the molten pool MP formed on the workpiece W.

[0113] When the measurement light ML' is irradiated onto the workpiece W, return light RL' generated by the irradiation of the measurement light ML' onto the workpiece W is emitted from the workpiece W. The return light RL' may include at least one of reflected light, scattered light, and transmitted light of the measurement light ML' by the workpiece W. The return light RL' emitted from the workpiece W (i.e., object light equivalent to the measurement light ML' passing through the workpiece W) enters the light receiving unit 832d via the irradiation optical system 311 (i.e., via the focusing optical system 3111).

[0114] Here, the optical paths of the measurement light ML' and the return light RL' in the irradiation optical system 311 (particularly in the collecting optical system 3111) will be described with reference to Fig. 26 and Fig. 27. Fig. 26 is a cross-sectional view showing the optical paths of the measurement light ML' and the return light RL' in the irradiation optical system 311 (particularly in the collecting optical system 3111). Fig. 27 is a cross-sectional view taken along line XXVI-XXVI' in Fig. 26.

[0115] 26 and 27, in the focusing optical system 3111, at least a part of the optical path of the measurement light ML' and at least a part of the optical paths of the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may be optically separated (i.e., may be different from each other). For this reason, as shown in Fig. 27, in a virtual optical surface OP (typically a surface along the XY plane, for example, an entrance pupil surface of the focusing optical system 3111) in the focusing optical system 3111 intersecting with the optical axis AX of the focusing optical system 3111, the measurement light ML', the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may each pass through separate regions separated from the optical axis AX in different directions. Alternatively, in the optical surface OP, the measurement light ML', the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may each pass through separate regions separated from the optical axis AX in the same direction by different distances (see Figs. 6 to 7).

[0116] In addition, in the focusing optical system 3111, at least a part of the optical path of the return light RL' may be optically separated from at least a part of the optical paths of the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 (i.e., may be different from each other). Therefore, as shown in Fig. 27, in the optical surface OP, the return light RL', the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may pass through separate areas that are separated from each other in different directions from the optical axis AX. Alternatively, in the optical surface OP, the return light RL', the measurement light ML, the object light RL, and the processing light EL#1 to EL#4 may pass through separate areas that are separated from each other by different distances in the same direction from the optical axis AX (see Figs. 6 to 7).

[0117] On the other hand, in the light collecting optical system 3111, the optical path of the measurement light ML' and the optical path of the return light RL' do not have to be optically separated. In other words, in the light collecting optical system 3111, the optical path of the measurement light ML' traveling from the light sending unit 831d toward the workpiece W and the optical path of the return light RL' traveling from the workpiece W toward the light receiving unit 832d may overlap. Therefore, as shown in FIG. 27, in the optical surface OP, the measurement light ML' and the return light RL' may pass through the same region. However, in the light collecting optical system 3111, at least a part of the optical path of the measurement light ML' and at least a part of the optical path of the return light RL' may be optically separated.

[0118] The return light RL' incident on the light collecting optical system 3111 is received (in other words, detected) by the light receiving unit 832d via the light collecting optical system 3111 (i.e., via the irradiation optical system 311). For this reason, the light receiving unit 832d may be referred to as a detection device or a light receiving device. The light receiving device 832d can measure (in other words, can observe or monitor) the workpiece W by receiving the return light RL'.

[0119] An example of the measuring device 83d having such a light transmitting unit 831d and a light receiving unit 832d is a laser distance meter. As an example of the laser distance meter, a time-of-flight type measuring device can be used. In this case, the control device 6 can calculate the distance from the measuring device 83d to the workpiece W (particularly, the distance from the measuring device 83d to the position on the workpiece W where the measuring light ML' is irradiated) based on the detection result of the return light RL' by the measuring device 83d. If the measuring device 83d irradiates the measuring light ML' to multiple points on the workpiece W, the control device 6 can calculate the distance from the measuring device 83d to multiple points on the workpiece W based on the detection result of the return light RL' by the measuring device 83d. As a result, the control device 6 can calculate at least one of the position and the shape of the workpiece W based on the distance from the measuring device 83d to the multiple points on the workpiece W. In this case, the control device 6 may control the processing system SYSd so as to process the workpiece W based on at least one of the position and the shape of the workpiece W. Note that an interference measurement type measuring device may be used as the laser distance meter.

[0120] The machining system SYSd of the fourth embodiment described above can achieve the same effects as those achieved by the machining system SYSb of the second embodiment described above. Furthermore, the machining system SYSd can machine the workpiece W based on the measurement result of the workpiece W by the measuring device 83d, in addition to the measurement result of the workpiece W by the measuring device 83d. Therefore, the machining system SYSd can properly machine the workpiece W.

[0121] At least one of the machining system SYSa of the first embodiment and the machining system SYSc of the third embodiment may include a component specific to the fourth embodiment. The component specific to the fourth embodiment is a component related to the measuring device 83d.

[0122] (5) Machining system SYS of the fifth embodiment Next, a machining system SYS of a fifth embodiment (hereinafter, the machining system SYS of the fifth embodiment will be referred to as a "machining system SYSe") will be described with reference to Fig. 28. Fig. 28 is a system configuration diagram showing the system configuration of the machining system SYSe of the fifth embodiment.

[0123] As shown in Fig. 28, the processing system SYSe of the fifth embodiment is different from the processing system SYSa of the first embodiment in that it includes a collection device 91e and a gas supply device 92e. Other features of the processing system SYSe may be similar to other features of the processing system SYSa. Hereinafter, the operation of the collection device 91e and the gas supply device 92e will be described with reference to Fig. 29. Fig. 29 is a plan view that illustrates the operation of the collection device 91e and the gas supply device 92e.

[0124] The recovery device 91e recovers unnecessary material generated by irradiation of the processing light EL from the chamber space 73IN. Specifically, the recovery device 91e recovers the unnecessary material via a recovery port 911e arranged in the chamber space 73IN. The recovery port 911e is directed toward the printing surface MS onto which the processing light EL is irradiated. In particular, the unnecessary material is highly likely to be generated from the position onto which the processing light EL is irradiated (i.e., the position onto which the molten pool MP is formed). For this reason, the recovery port 911e may be directed toward the position onto which the molten pool MP is formed.

[0125] If the processing light EL is blocked by the recovery port 911e, this may affect the processing of the workpiece W using the processing light EL. For this reason, the recovery port 911e may be disposed at a position away from the optical path of the processing light EL in a direction intersecting the traveling direction of the processing light EL (that is, a direction intersecting the optical axis AX of the focusing optical system 3111, typically a direction along the XY plane). In other words, the recovery port 911e may be disposed at a position away from the molten pool MP to which the processing light EL is irradiated, in a direction intersecting the traveling direction of the processing light EL.

[0126] The recovery device 91e sucks the gas in the chamber space 73IN through the recovery port 911e (i.e., exhausts the chamber space 73IN) to recover the unnecessary material together with the gas in the chamber space 73IN. For this reason, typically, a gas flow is formed from the molten pool MP toward the recovery port 911e. The unnecessary material moves from the molten pool MP, which is the main source of the unnecessary material, to the recovery port 911e along with this gas flow. As a result, the unnecessary material is recovered through the recovery port 911e. Here, if the gas flow from the molten pool MP toward the recovery port 911e (i.e., the recovery path of the unnecessary material) exists on the optical path of the processing light EL, the unnecessary material may hinder the irradiation of the processing light EL to the workpiece W. For this reason, the recovery port 911e may recover the unnecessary material so that the gas flow from the molten pool MP toward the recovery port 911e (i.e., the recovery path of the unnecessary material) does not exist on the optical path of the processing light EL. For example, the recovery port 911e may be disposed at a position that satisfies the condition that the processing light EL is irradiated to a position away from a straight line including a line LN1 connecting the molten pool MP and the recovery port 911e (i.e., a straight line along the flow of gas formed by the recovery port 911e and extending along the recovery path of the unnecessary material) along a direction that intersects both the straight line and the optical path of the processing light EL (i.e., the optical axis AX of the focusing optical system 3111), as shown in FIG. 29. In other words, the focusing optical system 3111 may irradiate the processing light EL to the printing surface MS so that the flow of gas from the molten pool MP toward the recovery port 911e does not exist on the optical path of the processing light EL. For example, the focusing optical system 3111 may irradiate the processing light EL to a position away from a straight line including a line LN1 connecting the molten pool MP and the recovery port 911e along a direction that intersects both the straight line and the optical path of the processing light EL, as shown in FIG. 29.

[0127] The gas supply device 92e supplies gas to the chamber space 73IN to form a gas flow for removing unnecessary materials generated by irradiation with the processing light EL from the printing surface MS or a space facing the printing surface MS. Specifically, the gas supply device 92e supplies gas to the chamber space 73IN via a gas supply port 921e disposed in the chamber space 73IN. The gas supply port 921e is directed toward the printing surface MS to which the processing light EL is irradiated. In particular, the gas supply port 921e may be directed toward a position where a molten pool MP, which is a main source of unnecessary materials, is formed.

[0128] If the gas supply port 921e blocks the processing light EL, this may affect the processing of the workpiece W using the processing light EL. For this reason, the gas supply port 921e may be disposed at a position away from the optical path of the processing light EL in a direction intersecting the traveling direction of the processing light EL (i.e., a direction intersecting the optical axis AX of the focusing optical system 3111, typically a direction along the XY plane). In other words, the gas supply port 921e may be disposed at a position away from the molten pool MP to which the processing light EL is irradiated, in a direction intersecting the traveling direction of the processing light EL.

[0129] The gas supply device 92e supplies gas to the chamber space 73IN via the gas supply port 921e, thereby forming a gas flow from the gas supply port 921e. Unnecessary materials are removed from the printing surface MS or the space facing the printing surface MS by this gas flow. Here, if the gas flow from the gas supply port 921e (i.e., the removal path of the unnecessary materials) exists on the optical path of the processing light EL, the unnecessary materials may hinder the irradiation of the processing light EL to the workpiece W. For this reason, the gas supply port 921e may supply gas such that the gas flow from the gas supply port 921e (i.e., the removal path of the unnecessary materials) does not exist on the optical path of the processing light EL. For example, the gas supply port 921e may be disposed at a position that satisfies the condition that the processing light EL is irradiated to a position away from a straight line including the line LN2 connecting the molten pool MP and the gas supply port 921e (i.e., a straight line along the gas flow formed by the gas supply port 921e and a straight line along the removal path of unnecessary materials) along a direction intersecting both the straight line and the optical path of the processing light EL (i.e., the optical axis AX of the focusing optical system 3111), as shown in FIG. 29. In other words, the focusing optical system 3111 may irradiate the processing light EL to the printing surface MS so that the gas flow from the gas supply port 921e (i.e., the removal path of unnecessary materials) does not exist on the optical path of the processing light EL. For example, the focusing optical system 3111 may irradiate the processing light EL to a position away from a straight line including the line LN2 connecting the molten pool MP and the gas supply port 921e along a direction intersecting both the straight line and the optical path of the processing light EL, as shown in FIG. 29.

[0130] The unnecessary materials removed by the gas supplied by the gas supply device 92e may be recovered by the recovery device 91e. In this case, in order to improve the efficiency of removing the unnecessary materials by the gas supply device 92e and the efficiency of recovering the unnecessary materials by the recovery device 91e, the gas supply port 921e and the recovery port 911e may be arranged such that the molten pool MP, which is the main source of the unnecessary materials, is located between the gas supply port 921e and the recovery port 911e. In this case, a gas flow is formed from the gas supply port 921 toward the recovery port 911e via the source of the unnecessary materials, so that the unnecessary materials are efficiently removed and recovered.

[0131] The processing system SYSe of the fifth embodiment described above can achieve the same effects as those that can be achieved by the processing system SYSa of the first embodiment described above. Furthermore, the processing system SYSe can properly remove and / or recover unnecessary materials generated by irradiation of the processing light EL. Therefore, the processing system SYSe can reduce the effects caused by unnecessary materials interfering with the irradiation of the processing light EL to the workpiece W. Therefore, the processing system SYSe can properly process the workpiece W.

[0132] In the above description, the processing system SYSe includes both the recovery device 91e and the gas supply device 92e. However, the processing system SYSe may include the recovery device 91e but not the gas supply device 92e. The processing system SYSe may include the gas device 92e but not the recovery device 91e.

[0133] In the above description, the processing system SYSe removes unnecessary substances using the gas supplied from the gas supply device 92e. However, the processing system SYSe may remove unnecessary substances using the gas (i.e., purge gas) supplied from the gas supply source 5. That is, the processing system SYSe may remove unnecessary substances by supplying a purge gas to the chamber space 73IN through the gas supply port 921e. In this case, the processing system SYSe may not be provided with the gas supply device 92e.

[0134] At least one of the processing system SYSb of the second embodiment to the processing system SYSd of the fourth embodiment may have a configuration characteristic of the fifth embodiment. The configuration characteristic of the fifth embodiment is a configuration characteristic of at least one of the recovery device 91e and the gas supply device 92e.

[0135] (6) Machining system SYS of the sixth embodiment Next, a machining system SYS of a sixth embodiment (hereinafter, the machining system SYS of the sixth embodiment will be referred to as a "machining system SYSf") will be described with reference to Fig. 30. Fig. 30 is a system configuration diagram showing the system configuration of the machining system SYSf of the sixth embodiment.

[0136] As shown in FIG. 30, the processing system SYSf of the sixth embodiment is different from the processing system SYSa of the first embodiment in that it includes a processing device 3f instead of the processing device 3. Furthermore, the processing system SYSf is different from the processing system SYSa in that it includes a gas supply device 93f. Other features of the processing system SYSf may be similar to other features of the processing system SYSa. The processing device 3f is different from the processing device 3 in that it includes a processing head 31f instead of the processing head 31. Other features of the processing device 3f may be similar to other features of the processing device 3. The processing head 31f is different from the processing head 31 in that it includes a surrounding member 313f. Other features of the processing head 31f may be similar to other features of the processing head 31. For this reason, the surrounding member 313f will be further described below with reference to FIG. 31. FIG. 31 is a cross-sectional view showing the structure of the surrounding member 313f of the sixth embodiment.

[0137] 31, the surrounding member 313f is attached to the tip of the irradiation optical system 311 (specifically, the tip on the -Z side facing the workpiece W). In other words, the surrounding member 313f is attached to the tip of the focusing optical system 3111.

[0138] The surrounding member 313f surrounds at least a portion of the material nozzle 312. In other words, the surrounding member 313f surrounds at least a portion of the supply path of the modeling material M of the material nozzle 312. Specifically, the surrounding member 313f surrounds at least a portion of the material nozzle 312 that protrudes downward from the irradiation optical system 311. For this reason, the surrounding member 313f has a through hole 3131f through which a portion of the material nozzle 312 is inserted. The surrounding member 313f further has a through hole 3132f that defines a space through which the processing light EL emitted from the focusing optical system 3111 can pass. For this reason, the surrounding member 313f may include an inner wall member 3133f that surrounds the material nozzle 312 so as to define the through hole 3131f, and an outer wall member 3134f that defines the through hole 3132f together with the inner wall member 3133f (i.e., surrounds the inner wall member 3133f so as to define the through hole 3132f). That is, the surrounding member 313f may have a structure like a double pipe in which a pipe in which the material nozzle 312 is arranged and a pipe through which the processing light EL can pass are formed. In this case, the focusing optical system 3111f irradiates the processing light EL to the workpiece W through the space between the outer wall member 3134f and the inner wall member 3133f (i.e., the space between the outer wall member 3134f and the material nozzle 312). Each of the inner wall member 3133f and the outer wall member 3134f may be referred to as a partition member.

[0139] The through hole 3132f is connected to the opening 3113 (particularly, the opening 3113 of the terminal optical member 3114 of the focusing optical system 3111). Here, as described above, the purge gas supplied from the gas supply source 5 to the chamber space 73IN is supplied to the space on the emission surface side of the terminal optical member 3114 (typically, the workpiece W) via the opening 3113. Therefore, when the through hole 3132f is connected to the opening 3113, the purge gas supplied from the gas supply source 5 to the chamber space 73IN is supplied to the space below the surrounding member 313f (that is, the space between the surrounding member 313f and the workpiece W) via the opening 3113 and the through hole 3132f. Specifically, the purge gas is supplied to a through hole 3132f corresponding to the space between the surrounding member 313f and the material nozzle 312 (specifically, the space between the outer wall member 3134f and the material nozzle 312) through the opening 3113 of the terminal optical member 3114. The purge gas supplied to the through hole 3132f is supplied to the space below the surrounding member 313f from an exhaust port 3135df corresponding to the lower end of the through hole 3132f. That is, the purge gas supplied to the through hole 3132f is supplied to the workpiece W located below the surrounding member 313f from the exhaust port 3135f. In this case, the surrounding member 3131f may function as a gas guide member that guides the purge gas from the opening 3113 of the terminal optical member 3114 to the workpiece W.

[0140] Even in this case, as described in the first embodiment, the flow of gas supplied through the through-holes 3132f increases the likelihood that the modeling material M from the supply outlet 314 will be supplied along a supply path that extends downward from the material nozzle 312. In other words, the modeling material M from the supply outlet 314 is less likely to scatter in all directions from the material nozzle 312. As a result, the material nozzle 312 can appropriately supply the modeling material M. This effect becomes more pronounced when the exhaust port 3135f is formed in the vicinity of the supply outlet 314.

[0141] Furthermore, a flow of purge gas is formed in the through hole 3132f through which the processing light EL passes, from inside the through hole 3132f to outside the through hole 3132f. This reduces the possibility that unwanted substances generated by the irradiation of the processing light EL onto the workpiece W will invade the inside of the through hole 3132f. This reduces the effect of unwanted substances interfering with the irradiation of the processing light EL onto the workpiece W.

[0142] The processing system SYSf of the sixth embodiment described above can achieve the same effects as those achieved by the processing system SYSa of the first embodiment described above. Furthermore, as described above, the processing system SYSf can appropriately supply the modeling material M along a supply path extending downward from the material nozzle 312 by using the purge gas supplied through the surrounding member 313f. In other words, the processing system SYSf can improve the directivity of the supply direction of the modeling material M. Furthermore, as described above, the processing system SYSf can reduce the effect of unnecessary materials interfering with the irradiation of the processing light EL to the workpiece W by using the purge gas supplied through the surrounding member 313f.

[0143] At least one of the machining system SYSb of the second embodiment to the machining system SYSe of the fifth embodiment may have a configuration element specific to the sixth embodiment. The configuration element specific to the sixth embodiment is a configuration element related to the surrounding member 313f.

[0144] (7) Machining system SYS of the seventh embodiment Next, a processing system SYS of the seventh embodiment (hereinafter, the processing system SYS of the seventh embodiment will be referred to as "processing system SYSg") will be described. The processing system SYSg of the seventh embodiment differs from the processing system SYSa of the first embodiment described above in that it may perform a removal process to remove a part of the workpiece W by irradiating the workpiece W with processing light EL. For example, the processing system SYSg may perform the removal process so that the shape of the workpiece W becomes a desired shape. For example, the processing system SYSg may perform the removal process so that a desired structure is formed on the workpiece W. For example, the processing system SYSg may perform the removal process so that a desired structure is formed on the surface of the workpiece W. For example, the processing system SYSg may perform the removal process so that the surface of the workpiece W is smoothed.

[0145] When performing removal processing, the processing system SYSg may form a riblet structure on the workpiece W. The riblet structure may be a structure capable of reducing the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). The riblet structure may include a structure capable of reducing noise generated when the fluid and the surface of the workpiece W move relatively to each other. The riblet structure may include, for example, a structure in which grooves extending in a first direction (e.g., the Y-axis direction) along the surface of the workpiece W are arranged in a plurality of rows along a second direction (e.g., the X-axis direction) along the surface of the workpiece W and intersecting the first direction.

[0146] When performing removal processing, the processing system SYSg may form an arbitrary structure having an arbitrary shape on the surface of the workpiece W. An example of the arbitrary structure is a structure that generates vortices in the flow of a fluid on the surface of the workpiece W. Another example of the arbitrary structure is a structure for imparting hydrophobicity to the surface of the workpiece W. Another example of the arbitrary structure is a micro- or nanometer-order fine texture structure (typically an uneven structure) formed regularly or irregularly. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure that have a function of reducing resistance by a fluid (gas and / or liquid). The fine texture structure may include a lotus leaf surface structure that has at least one of a liquid repellent function and a self-cleaning function (for example, having a lotus effect). The fine texture structure may include at least one of a micro-protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function utilizing van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, and a honeycomb structure having a droplet collecting function.

[0147] Such a processing system SYSb is shown in FIG. 32 and FIG. 33. FIG. 32 is a block diagram showing the system configuration of the processing system SYSg. FIG. 33 is a cross-sectional view showing the structure of the processing system SYSg. As shown in FIG. 32 and FIG. 33, the processing system SYSg is different from the processing system SYSa in that it may not include a material supply source 1 and a mixer 12. Furthermore, the processing system SYSg is different from the processing system SYSa in that it may not include a material nozzle 312. Specifically, the processing system SYSg is different from the processing system SYSa in that it includes a processing device 3g including a processing head 31g not including a material nozzle 312, instead of a processing device 3 including a processing head 31 including a material nozzle 312. In other words, the processing system SYSg is different from the processing system SYSa in that it may not include a configuration requirement for supplying the modeling material M. Other features of the processing system SYSg may be similar to other features of the processing system SYSa.

[0148] The above-described processing system SYSg may also perform the light characteristic control operation during at least a part of the period during which the removal processing operation is performed, similar to the processing system SYSa. As a result, the processing system SYSg can obtain the same effects as those that the processing system SYSa can obtain.

[0149] When performing removal processing, the processing system SYSg may irradiate the workpiece W with processing light EL including a plurality of pulsed lights. For example, the processing system SYSg may irradiate the workpiece W with processing light EL including a plurality of pulsed lights having an emission time of nanoseconds or less.

[0150] (8) Other modifications In the above description, the processing system SYS irradiates the workpiece W with a plurality of processing lights EL emitted from a plurality of processing light sources 2. That is, the processing system SYS is provided with a plurality of processing light sources 2. However, the processing system SYS may branch a single light emitted from a single processing light source 2 into a plurality of processing lights EL, and irradiate the workpiece W with the branched plurality of processing lights EL. That is, the processing system SYS may be provided with a single processing light source 2. Here, the intensity of the branched plurality of processing lights EL may be independently changeable. Changing the intensity may include setting the intensity to zero. In this case, a shutter may be provided in each of the optical paths of the branched plurality of processing lights EL. In addition to or instead of providing a shutter, a light amount adjustment member that actively changes the amount of light passing through each of the optical paths of the plurality of processing lights EL may be provided.

[0151] In the above description, the processing system SYS processes the workpiece W by irradiating the processing light EL onto the workpiece W. However, the processing system SYS may process the workpiece W by irradiating an arbitrary energy beam onto the workpiece W. In this case, the processing system SYS may include, in addition to or instead of the processing light source 2 and the irradiation optical system 311, a beam source capable of generating an arbitrary energy beam and a beam irradiation device capable of irradiating the arbitrary energy beam onto the workpiece W. Examples of the arbitrary energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0152] When the workpiece W is processed using an arbitrary energy beam, the control device 6 may control the characteristics of the energy beam by performing the light characteristic control operation described above. The characteristics of the energy beam may include, for example, the energy amount of the energy beam. When a charged particle beam is used as the energy beam, the characteristics of the energy beam (i.e., the characteristics of the charged particle beam) may include, for example, the current density distribution of the charged particle beam (for example, the current density distribution in a plane (typically, the printing surface MS) that intersects with the traveling direction of the processing light EL).

[0153] (9) Additional Notes The following supplementary notes are further disclosed regarding the above-described embodiment. [Appendix 1] A processing system for processing an object, comprising: an illumination optical system for illuminating the object with a plurality of energy beams; a beam characteristic changing device that changes the characteristics of the plurality of energy beams individually in accordance with the shape of the object; A processing system comprising: [Appendix 2] A processing system for processing an object, comprising: an irradiation optical system for irradiating the object with a plurality of energy beams to form a molten pool on the object; a beam characteristic changing device for changing the characteristics of the plurality of energy beams individually to change the temperature distribution of the molten pool; A processing system comprising: [Appendix 3] a detection device for detecting light from the molten pool; The beam characteristic changing device changes the distribution of the energy beam based on the detection result of the detection device. 3. The processing system of claim 2. [Appendix 4] A processing system for processing an object, comprising: an illumination optical system for illuminating the object with a plurality of energy beams; a moving device that moves at least one of the object and the irradiation position of the energy beam; a beam characteristic changing device that changes the characteristics of the plurality of energy beams individually in accordance with a moving direction of the moving device; A processing system comprising: [Appendix 5] The characteristics of the energy beam include an intensity of the energy beam. 5. The processing system according to claim 1 . [Appendix 6] A processing system for processing an object, comprising: an irradiation optical system that irradiates the object with a plurality of energy beams from different directions to form a molten pool on the object; a material supply device for supplying material to the molten pool; A processing system comprising: [Appendix 7] The direction in which the material is supplied from the material supply device to the molten pool is different from the irradiation direction of the multiple energy beams. 7. The processing system of claim 6. [Appendix 8] The material supply device supplies the material from a material supply direction that intersects with a surface of the object. 8. The processing system according to claim 6 or 7. [Appendix 9] 1. A processing system for processing an object using an energy beam, comprising: an irradiation optical system that focuses the energy beam and irradiates the object; a material supplying device that supplies a material toward an irradiation position of the energy beam on the object; an enclosing member that encloses at least a portion of the material supply path of the material supply device; a gas supply device that supplies gas to spaces between a plurality of optical members that configure the irradiation optical system; Equipped with the irradiation optical system irradiates the energy beam through a space between the surrounding member and at least a part of the material supply device; The gas from the gas supply device is supplied to the space between the enclosing member and at least a portion of the material supply device. Processing system. [Appendix 10] The gas from the gas supply device is supplied through an opening formed in at least a part of the optical members constituting the irradiation optical system. 10. The processing system of claim 9. [Appendix 11] The at least a portion of the material supply device is disposed along an optical axis of the irradiation optical system. 11. The processing system according to claim 9 or 10. [Appendix 12] 1. A processing system for processing an object using an energy beam, comprising: an illumination optical system for illuminating the object with the energy beam; a detection device that detects object light including light from the object via the irradiation optical system; Equipped with At least a portion of a path of the object beam through the illumination optical system is different from at least a portion of a path of the energy beam through the illumination optical system. Processing system. [Appendix 13] the object beam is a first object beam, the detection device is a first detection device, a second detection device that detects a second object light that includes light from the object via the illumination optical system and is different from the first object light; 13. The processing system of claim 12. [Appendix 14] At least a portion of a path of the second object beam in the illumination optical system is different from at least a portion of a path of the energy beam in the illumination optical system and from at least a portion of a path of the first object beam in the illumination optical system. 14. The processing system of claim 13. [Appendix 15] The object is further provided with an illumination device that illuminates the object with measurement light via the illumination optical system. 15. The processing system of any one of claims 12 to 14. [Appendix 16] At least a portion of a path of the measurement light in the irradiation optical system is different from at least a portion of a path of the energy beam in the irradiation optical system. 16. The processing system of claim 15. [Appendix 17] The object light includes light from the object irradiated with the measurement light. 17. The processing system according to claim 15 or 16. [Appendix 18] The object light includes at least one of reflected light, scattered light, and transmitted light of the measurement light from the object. 18. The processing system of any one of claims 15 to 17. [Appendix 19] The measuring device further includes a position changing device for changing the irradiation position of the measuring light on the object. 19. The processing system of any one of claims 15 to 18. [Appendix 20] The position changing device changes the irradiation position of the measurement light so that the measurement light is irradiated to at least one of a first position on the object where the energy beam has already been irradiated, a second position on the object where the energy beam is currently irradiated, and a third position on the object where the energy beam is to be irradiated in the future. 20. The processing system of claim 19. [Appendix 21] a light guiding optical system that guides the object light from the first position to the detection device during at least a portion of a period during which the measurement light is irradiated to the first position, guides the object light from the second position to the detection device during at least a portion of a period during which the measurement light is irradiated to the second position, and guides the object light from the third position to the detection device during at least a portion of a period during which the measurement light is irradiated to the third position. 21. The processing system of claim 20. [Appendix 22] the measurement light is a first measurement light, the irradiation device is a first irradiation device, a second illumination device that illuminates the object with a second measurement light different from the first measurement light via the illumination optical system. 22. The processing system of any one of claims 15 to 21. [Appendix 23] At least a portion of a path of the second measurement light in the irradiation optical system is different from at least a portion of a path of the energy beam in the irradiation optical system and at least a portion of a path of the first measurement light in the irradiation optical system. 23. The processing system of claim 22. [Appendix 24] the object beam is a first object beam, the detection device is a first detection device, a second detection device that detects a second object light that includes light from the object via the illumination optical system and is different from the first object light; the first object light includes light from the object irradiated with the first measurement light, The second object light includes light from the object irradiated with the second measurement light. 24. The processing system according to claim 22 or 23. [Appendix 25] the first object light includes at least one of reflected light, scattered light, and transmitted light of the first measurement light from the object, The second object light includes at least one of reflected light, scattered light, and transmitted light of the second measurement light from the object. 25. The processing system of claim 24. [Appendix 26] 1. A processing system for processing an object using a plurality of energy beams, comprising: a plurality of beam sources each emitting the plurality of energy beams; an illumination optical system that illuminates the object with the plurality of energy beams from the plurality of beam sources; a controller for controlling each of the plurality of beam sources to individually modify characteristics of the plurality of energy beams; A processing system comprising: [Appendix 27] The control device controls each of the plurality of beam sources such that a characteristic of a first energy beam among the plurality of energy beams is different from a characteristic of a second energy beam among the plurality of energy beams, the second energy beam being different from the first energy beam. 27. The processing system of claim 26. [Appendix 28] a moving device that moves the irradiation positions of the plurality of energy beams relative to the object; The control device controls each of the plurality of beam sources based on movement information regarding movement of irradiation positions of the plurality of energy beams. 28. The processing system according to claim 26 or 27. [Appendix 29] The movement information includes information regarding the movement directions of the irradiation positions of the plurality of energy beams. 29. The processing system of claim 28. [Appendix 30] the characteristics of the energy beam include an intensity of the energy beam; the control device controls each of the plurality of beam sources such that an intensity of a first energy beam of the plurality of energy beams is smaller than an intensity of a second energy beam of the plurality of energy beams that is different from the first energy beam; The irradiation position of the first energy beam on the object is located behind the irradiation position of the second energy beam on the object in the moving direction. 29. The processing system of claim 29. [Appendix 31] The control device controls each of the plurality of beam sources so that the intensity of the second energy beam is zero. 31. The processing system of claim 30. [Appendix 32] the control device controls each of the plurality of beam sources so that a first energy beam of the plurality of energy beams is a pulsed beam and a second energy beam of the plurality of energy beams, different from the first energy beam, is a continuous beam; The irradiation position of the first energy beam on the object is located behind the irradiation position of the second energy beam on the object in the moving direction. 32. The processing system of any one of claims 29 to 31. [Appendix 33] The control device controls each of the plurality of beam sources based on object information regarding the object. 33. The processing system of any one of claims 26 to 32. [Appendix 34] The object information includes information regarding a shape of the object. 34. The processing system of claim 33. [Appendix 35] the illumination optics illuminates a third energy beam of the plurality of energy beams onto a first portion of the object; The control device controls each of the plurality of beam sources so that an intensity of a fourth energy beam, which is on a path from the irradiation optical system to the first portion and through which the second portion of the object is present, is equal to or lower than a predetermined intensity. 35. The processing system of claim 34. [Appendix 36] The predetermined intensity is an intensity of the energy beam that is incapable of processing the object or is zero. 36. The processing system of claim 35. [Appendix 37] Within a predetermined plane intersecting an optical axis of the irradiation optical system, at least two of the plurality of energy beams pass through regions symmetrical with respect to the optical axis. 37. The processing system of any one of claims 26 to 36. [Appendix 38] Within a predetermined plane intersecting an optical axis of the irradiation optical system, at least two of the plurality of energy beams pass through an area asymmetric with respect to the optical axis. 38. The processing system of any one of claims 26 to 37. [Appendix 39] the plurality of energy beams include a first energy beam, a second energy beam, a third energy beam, and a fourth energy beam; within a predetermined plane intersecting an optical axis of the irradiation optical system, the first energy beam and the second energy beam pass through positions on either side of the optical axis in a first direction along the predetermined plane, Within the predetermined plane, the third energy beam and the fourth energy beam pass through positions that are along the predetermined plane and sandwich the optical axis in a second direction that intersects with the first direction. 39. The processing system of any one of claims 26 to 38. [Appendix 40] The plurality of energy beams form an annular beam shape within a predetermined plane intersecting the optical axis of the irradiation optical system. 40. The processing system of any one of claims 26 to 39. [Appendix 41] the processing system irradiates the object with the plurality of energy beams to form a molten pool on the object; a gas supply device that supplies gas toward the molten pool through a supply port that is disposed at a position away from the molten pool; The plurality of energy beams are irradiated at a position spaced apart from a straight line including a line connecting the molten pool and the supply port along a direction intersecting the straight line. 41. The processing system of any one of claims 26 to 40. [Appendix 42] the processing system irradiates the object with the plurality of energy beams to form a molten pool on the object; a recovery device that recovers materials generated by the irradiation of the plurality of energy beams through a recovery port that is disposed at a position away from the molten pool; The plurality of energy beams are irradiated at a position separated from a straight line including a line connecting the molten pool and the recovery port along a direction intersecting the straight line. 42. The processing system of any one of claims 26 to 41. [Appendix 43] a partition member that defines a space through which the energy beam from the irradiation optical system can propagate. 43. The processing system of any one of claims 12 to 42. [Appendix 44] The apparatus further includes a gas supply device for supplying gas to the space. 44. The processing system of claim 43. [Appendix 45] Further, a material supply device that supplies a material from a supply port is provided, The gas supplied to the space is discharged from the space through a discharge port formed in the partition member near the supply port. 45. The processing system of claim 44.

[0154] At least a part of the components of each of the above-mentioned embodiments can be appropriately combined with at least a part of other components of each of the above-mentioned embodiments. Some of the components of each of the above-mentioned embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-mentioned embodiments are incorporated by reference into the present description.

[0155] The present invention is not limited to the above-described embodiments, but may be modified as appropriate within the scope of the claims and the gist or concept of the invention as can be read from the entire specification, and processing systems involving such modifications are also included in the technical scope of the present invention. [Explanation of symbols]

[0156] SYS Machining System 1 Material source 2 Processing light source 3 Processing equipment 31 Processing head 311 Irradiation optical system 3111 Condensing optical system 32 Head drive system 4. Stage Equipment 41 Stage 42 Stage drive system 6. Control device W work M Build material SL structure layer MS printing surface EL processing light

Claims

1. 1. A processing system for processing an object using an energy beam, comprising: an illumination optical system having a focusing optical system and configured to focus an energy beam incident on a pupil plane of the focusing optical system and illuminate the object; a detection device that detects object light including light from the object via the light collecting optical system; Equipped with At least a portion of a path of the object light, which is at least a portion of the object light having a width in a traveling direction within the focusing optical system, is different from at least a portion of a path of the energy beam, which is at least a portion of the energy beam having a width in a traveling direction within the focusing optical system. Processing system.

2. The path of the object beam in the collection optical system and the path of the energy beam in the collection optical system do not overlap. The processing system of claim 1 .

3. A region on the pupil plane through which the energy beam passes is different from a region on the pupil plane through which the object beam passes. The processing system according to claim 1 or 2.

4. On the pupil plane, the region through which the energy beam passes does not overlap with the region through which the object beam passes. The processing system of claim 3 .

5. The focusing optics irradiates a plurality of energy beams from different directions onto the object. The processing system according to any one of claims 1 to 4.

6. The plurality of energy beams are irradiated onto the object from different positions in a rotational direction around the optical axis of the focusing optical system. The processing system of claim 5 .

7. A first angle between a first energy beam among the plurality of energy beams and an optical axis of the focusing optical system and a second angle between a second energy beam among the plurality of energy beams and the optical axis are different from each other. The processing system according to claim 5 or 6.

8. The detection device receives the object light traveling along an optical path different from an optical path along which the plurality of energy beams pass between the object and the focusing optical system. The processing system according to any one of claims 1 to 7.

9. The detection device further includes an illumination device that irradiates the object with illumination light via the light collecting optical system. The processing system according to any one of claims 1 to 8.

10. The area on the object irradiated with the illumination light includes an area on the object irradiated with the energy beam. The processing system of claim 9.

11. The object light includes the illumination light passing through the object. The processing system according to claim 9 or 10.

12. The object beam includes light generated by irradiating the object with the energy beam. The processing system according to any one of claims 1 to 11.

13. a molten pool is formed on the object by the energy beam from the focusing optics; The object beam includes light from the molten pool. The processing system of claim 12.

14. The detection device includes an imaging device. The processing system according to any one of claims 1 to 13.

15. The wavelength of the energy beam is different from the wavelength of the object beam. The processing system according to any one of claims 1 to 14.

16. At least a portion of the wavelength range of the energy beam and at least a portion of the wavelength range of the object light overlap.

16. The processing system according to any one of claims 1 to 15.

17. The detection device includes a light sending unit that sends measurement light to the object via the light collecting optical system, and a light receiving unit that receives the measurement light that has passed through the object via the light collecting optical system as at least a part of the object light.

17. The processing system according to any one of claims 1 to 16.

18. The area on the object onto which the measurement light is irradiated includes an area on the object onto which the energy beam is irradiated.

20. The processing system of claim 17.

19. The measurement light passing through the object includes scattered light from the object.

19. A processing system according to claim 17 or 18.

20. a material supplying device that supplies a material toward a position on the object where the energy beam is irradiated through an opening formed in a final optical member that constitutes the focusing optical system; 20. The processing system of any one of claims 1 to 19.

21. At least a portion of the material supply device is disposed along the optical axis of the focusing optical system.

21. The processing system of claim 20.

22. a gas supply device that supplies a gas to a space between the optical members of the focusing optical system, the focusing optical system includes a plurality of optical members including the final optical member, At least a portion of the gas is supplied to the space on the exit surface side of the final optical element through the opening.

22. A processing system according to claim 20 or 21.

23. A gas guide member is provided to guide the gas from the opening to the object.

23. The processing system of claim 22.

24. The gas guide member surrounds at least a portion of the material supply device.

24. The processing system of claim 23.

25. Addition processing is performed on the object.

25. The processing system of any one of claims 1 to 24.

26. The object is subjected to removal processing.

26. The processing system of any one of claims 1 to 25.

27. A method for processing an object using an energy beam, comprising the steps of: directing the energy beam into a focusing optical system; Concentrating an energy beam incident on a pupil plane of the focusing optical system and irradiating the object with the energy beam; detecting object light including light from the object via the light collecting optical system; Including, At least a portion of a path of the object light, which is at least a portion of the object light having a width in a traveling direction within the focusing optical system, is different from at least a portion of a path of the energy beam, which is at least a portion of the energy beam having a width in a traveling direction within the focusing optical system. Processing method.

28. The path of the object beam in the collection optical system and the path of the energy beam in the collection optical system do not overlap. The processing method according to claim 27.

29. A region on the pupil plane through which the energy beam passes is different from a region on the pupil plane through which the object beam passes.

29. The processing method according to claim 27 or 28.

30. On the pupil plane, the region through which the energy beam passes does not overlap with the region through which the object beam passes.

30. The processing method according to claim 29.

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