Control board, electronic device and image forming apparatus

Abstract

To provide a control board that efficiently generates electric energy with a power generation device from heat generated from an electronic device.SOLUTION: A control board comprises: a substrate that includes a first heat dissipation pad; an electronic device that includes a second heat dissipation pad for dissipating heat; a power generation device that is provided sandwiched between the first heat dissipation pad and the second head dissipation pad and includes a Peltier element for converting thermal energy generated from the electronic device into electric energy; and a power supply circuit that reuses the electric energy.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a control board, an electronic device, and an image forming apparatus. [Background technology]

[0002] 2. Description of the Related Art Devices that generate electrical energy by utilizing exhaust heat from electronic devices are known. Techniques are also known for reusing the energy by storing the electrical energy generated by the devices in a battery such as a secondary battery.

[0003] Thermoelectric power generation elements that generate electricity using the temperature difference between both ends are known. Patent Document 1 discloses a shield structure that can generate electricity with a thermoelectric power generation element by utilizing heat generated by an electronic component and can easily electrically connect the thermoelectric power generation element to a circuit board. Summary of the Invention [Problem to be solved by the invention]

[0004] In the shield structure disclosed in Patent Document 1, the thermoelectric generating element is attached to the opposite side of the printed circuit board of the electronic component. Therefore, since the thermoelectric generating element is fixed at a position separated from the printed circuit board, a conductive elastic body is required for the electric energy generated by the thermoelectric generating element. The need for a conductive elastic body increases costs, and furthermore, unnecessary loss occurs due to the resistance of the conductive elastic body.

[0005] An object of the present disclosure is to provide a control board that efficiently generates electrical energy using a power generation device from heat generated by an electronic device. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided a power generation device including: a substrate having a first heat dissipation pad; an electronic device having a second heat dissipation pad for dissipating heat; a power generation device sandwiched between the first heat dissipation pad and the second heat dissipation pad and including a Peltier element for converting thermal energy generated by the electronic device into electrical energy; and a power supply circuit for reusing the electrical energy. The power generation device includes a wiring that connects a first terminal of the electronic device and a second terminal of the substrate, the power generation device has a first surface that is joined to the second heat dissipation pad of the electronic device and a second surface that is joined to the first heat dissipation pad of the substrate, the wiring passes between the first surface and the second surface, and the first terminal, the second terminal, and the wiring are located at the same position in a top view. A control board is provided. Effect of the Invention

[0007] According to the control board of the present disclosure, electrical energy can be efficiently generated by the power generation device from the heat generated by the electronic device. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a control board according to the present embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the control board according to the present embodiment. [Diagram 3] FIG. 3 is a bottom view of the electronic device on the control board according to the present embodiment. [Figure 4] FIG. 4 is a top view of the power generation device of the control board according to the present embodiment. [Diagram 5] FIG. 5 is a bottom view of the power generation device of the control board according to the present embodiment. [Figure 6] FIG. 6 is a cross-sectional view of the power generation device of the control board according to this embodiment. [Figure 7] FIG. 7 is a block diagram of the control board according to the present embodiment. [Figure 8] FIG. 8 is a top view of a modification of the control board according to the present embodiment. [Figure 9] FIG. 9 is a side view of a modified example of the control board according to the present embodiment. [Figure 10] FIG. 10 is a diagram showing an example of the configuration of an image forming apparatus, which is an example of the electronic device according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted. In addition, in order to facilitate understanding, the scale of each part in the drawings may differ from the actual scale. In directions such as parallel, right angle, orthogonal, horizontal, vertical, up / down, left / right, deviations are permitted to the extent that do not impair the effects of the embodiment. The shape of the corners is not limited to right angles, and may be rounded in an arch shape. Parallel, right angle, orthogonal, horizontal, and vertical may include approximately parallel, approximately right angle, approximately orthogonal, approximately horizontal, and approximately vertical.

[0010] The control board 1 according to this embodiment will be described in detail below with reference to the accompanying drawings. Note that the present invention is not limited to this embodiment.

[0011] <Control board 1> The control board 1 is used in electronic devices such as a printer or a multifunction peripheral.

[0012] Fig. 1 is a perspective view of a control board 1 according to the present embodiment. Fig. 2 is an exploded perspective view of the control board 1 according to the present embodiment.

[0013] For convenience of explanation, a virtual three-dimensional coordinate system (XYZ Cartesian coordinate system) consisting of mutually orthogonal X-axis, Y-axis, and Z-axis (XYZ axes) may be set in the drawings. However, this coordinate system is defined for the purpose of explanation and does not limit the attitude of the control board 1, etc.

[0014] In this disclosure, unless otherwise specified, the X-axis direction and the Y-axis direction are parallel to the main surface of the substrate 30 of the control substrate 1. The Z-axis is perpendicular to the X-axis and the Y-axis. Furthermore, the side of the substrate 30 of the control substrate 1 on which the electronic device 10 and the power generation device 20 are mounted, i.e., the +Z side, may be referred to as the upper side.

[0015] The control board 1 includes an electronic device 10, a power generation device 20, and a board 30. The electronic device 10 is an integrated circuit (IC (Integrated Circuit)) that performs a predetermined operation when an electronic device on which the control board 1 is mounted operates. The power generation device 20 has a first surface 20A and a second surface 20B, and is a device that generates power due to the temperature difference between the first surface 20A and the second surface 20B. The power generation device 20 includes, for example, a Peltier element.

[0016] The substrate 30 is a substrate on which the electronic device 10 and the power generation device 20 are mounted. The substrate 30 also includes a power supply circuit 50 that reuses the electric energy generated by the power generation device 20.

[0017] The control board 1 of this embodiment is provided so as to sandwich the power generation device 20 between the electronic device 10 and the board 30. More specifically, the control board 1 is provided so as to sandwich the power generation device 20 between a heat dissipation pad 11 (to be described later) of the electronic device 10 and a heat dissipation pad 31 (to be described later) of the board 30. The power generation device 20 generates power due to the temperature difference between the heat dissipation pad 11 of the electronic device 10 and the heat dissipation pad 31 of the board 30.

[0018] [Electronic Devices 10] 3 is a bottom view of the electronic device 10 of the control board 1 according to this embodiment. The electronic device 10 is a device that generates a lot of heat during operation. The electronic device 10 is, for example, a power supply IC. Note that hereinafter, the electronic device 10 will be described using a power supply IC as an example.

[0019] The electronic device 10 includes a heat dissipation pad 11 and terminal pads 12a, 12b, 12c, 12d, 12e and 12f.

[0020] (Heat dissipation pad 11) The heat dissipation pad 11 is a pad for dissipating heat generated inside the electronic device 10. If the electronic device 10 is, for example, a power supply IC, the electronic device 10, which is a power supply IC, has a resistor inside the power supply IC to step down the power supplied from the device to a desired power supply. The resistor inside the power supply IC converts electrical energy into thermal energy, allowing the power supply IC to obtain a desired output voltage. This generated thermal energy is dissipated to the outside of the power supply IC by coming into contact with the air around the power supply IC.

[0021] However, because air has a low thermal conductivity, the internal temperature of the power supply IC rises and rises, and may even exceed the temperature standard of the power supply IC. If the internal temperature of the power supply IC exceeds the temperature standard of the power supply IC, the power supply IC may be damaged.

[0022] Therefore, in order to prevent damage due to heat, the electronic device 10 has a heat dissipation pad 11. The heat dissipation pad 11 of the electronic device 10 generates heat as heat is transferred from a heat-generating element inside the electronic device 10. The temperature of the electronic device 10 is reduced by dissipating heat from the heat-generating pad 11.

[0023] For example, the heat dissipation pad 11 is connected to a ground electrode of a printed circuit board on which the electronic device 10 is mounted. The heat dissipation pad 11 is connected to the ground electrode of the printed circuit board and dissipates thermal energy to the ground electrode, thereby reducing the temperature of the electronic device 10. Note that the ground electrode on the printed circuit board has a large layout area, so it is possible to maintain a low temperature.

[0024] In the control board 1 of this embodiment, the heat dissipation pad 11 is not directly connected to the heat dissipation pad 31 of the board 30, which is a printed circuit board, but is thermally connected to the heat dissipation pad 31 via the power generation device 20, which will be described later.

[0025] There is a temperature difference between the heat dissipation pad 11 of the electronic device 10 and the heat dissipation pad 31 of the substrate 30. Therefore, the temperature difference between the heat dissipation pad 11 of the electronic device 10 and the heat dissipation pad 31 of the substrate 30 is used to convert thermal energy into electrical energy by the power generation device 20.

[0026] (Terminal pads 12a, 12b, 12c, 12d, 12e and 12f) The terminal pads 12a, 12b, 12c, 12d, 12e, and 12f will be described below. Note that the functions described below are merely examples and are not intended to be limiting.

[0027] The terminal pad 12a is, for example, a terminal for inputting a positive voltage from a power supply. The terminal pad 12b is, for example, a terminal for inputting a device enable signal from a controller that controls the on / off of the electronic device 10. The terminal pad 12c is, for example, a terminal for inputting a ground potential.

[0028] The terminal pad 12d is, for example, a terminal for supplying positive power to an external load. The terminal pad 12e is, for example, a terminal for outputting a power good signal indicating whether the output voltage of the electronic device 10 is at a set voltage value. The terminal pad 12f is a terminal for inputting a ground potential.

[0029] [Power generation device 20] Next, the power generation device 20 will be described. Fig. 4 is a top view of the power generation device 20 of the control board 1 according to this embodiment. Fig. 5 is a bottom view of the power generation device 20 of the control board 1 according to this embodiment. Fig. 6 is a cross-sectional view of the power generation device 20 of the control board 1 according to this embodiment. Specifically, Fig. 6 is a cross-sectional view taken along line II in Fig. 4. Note that in Fig. 6, the detailed structure of the Peltier element 21 is omitted and is shown by crossed diagonal lines.

[0030] The power generation device 20 has a housing 23 which is an insulator. The power generation device 20 also has a Peltier element 21 inside the housing 23. The Peltier element 21 is located between the heat dissipation pad 11 of the electronic device 10 and the heat dissipation pad 31 of the substrate 30 when the control board 1 is assembled. The power generation device 20 also has metal wiring 22a, 22b, 22c, 22d, 22e, and 22f penetrating the first surface 20A and the second surface 20B. The power generation device 20 also has terminal pads 24a and 24b for outputting the power generated by the Peltier element 21.

[0031] The power generation device 20 has a first surface 20A bonded to the heat dissipation pad 11 of the electronic device 10. Also, a second surface 20B bonded to the heat dissipation pad 31 of the substrate 30. That is, the power generation device 20 is located between the electronic device 10 and the substrate 30. When the control substrate 1 is assembled, the Peltier element 21 is located between the heat dissipation pad 11 of the electronic device 10 and the heat dissipation pad 31 of the substrate 30, and thereby generates power.

[0032] The Peltier element 21 outputs the generated power from the terminal pad 24a and the terminal pad 24b. The terminal pad 24a is a positive terminal, and the terminal pad 24b is a negative terminal.

[0033] Moreover, the metal wirings 22a, 22b, 22c, 22d, 22e, and 22f are located corresponding to the terminal pads 12a, 12b, 12c, 12d, 12e, and 12f, respectively, of the electronic device 10. That is, the metal wirings 22a, 22b, 22c, 22d, 22e, and 22f are located at the same positions as the terminal pads 12a, 12b, 12c, 12d, 12e, and 12f, respectively, of the electronic device 10, when viewed from above.

[0034] In the control board 1 of this embodiment, the power generation device 20 is sandwiched between the electronic device 10 and the board 30, so the terminal pads 12a, 12b, 12c, 12d, 12e and 12f of the electronic device 10 cannot be directly connected to the terminal pads 32a, 32b, 32c, 32d, 32e and 32f of the board 30, respectively.

[0035] Therefore, the power generation device 20 of the control board 1 of this embodiment includes metal wirings 22a, 22b, 22c, 22d, 22e, and 22f. The metal wirings 22a, 22b, 22c, 22d, 22e, and 22f can electrically connect the terminal pads 12a, 12b, 12c, 12d, 12e, and 12f of the electronic device 10 to the terminal pads 32a, 32b, 32c, 32d, 32e, and 32f of the board 30, respectively. Therefore, the electronic device 10 operates normally.

[0036] The shapes of the metal wirings 22a, 22b, 22c, 22d, 22e, and 22f may be appropriately changed depending on the electrical characteristics of the signals, voltages, currents, and the like that propagate through the metal wirings.

[0037] [Substrate 30] Next, the substrate 30 will be described. As shown in Fig. 2, the substrate 30 has an upper surface 30A and a lower surface 30B. The substrate 30 has a heat dissipation pad 31, terminal pads 32a, 32b, 32c, 32d, 32e, and 32f, terminal pad 34a, and terminal pad 34b on the upper surface 30A.

[0038] The heat dissipation pad 31 serves as the ground potential (common potential) of the substrate 30. The heat dissipation pad 31 has a large area on the substrate 30. The heat dissipation pad 31 comes into contact with other components to dissipate heat from the other components.

[0039] The terminal pads 32a, 32b, 32c, 32d, 32e, and 32f are connected to the terminal pads 12a, 12b, 12c, 12d, 12e, and 12f of the electronic device 10, respectively. For example, the terminal pad 32a is connected to the terminal pad 12a via the metal wiring 22a. Similarly, the terminal pad 32b is connected to the terminal pad 12b via the metal wiring 22b. The terminal pad 32c is connected to the terminal pad 12c via the metal wiring 22c. The terminal pad 32d is connected to the terminal pad 12d via the metal wiring 22d. The terminal pad 32e is connected to the terminal pad 12e via the metal wiring 22e. The terminal pad 32f is connected to the terminal pad 12f via the metal wiring 22f.

[0040] The terminal pads 34a and 34b receive the power generated by the Peltier element 21. The terminal pads 34a and 34b are connected to the terminal pads 24a and 24b, respectively.

[0041] The substrate 30 has a power supply circuit 50 that reuses the electrical energy generated by a Peltier element 21, which will be described later.

[0042] <Circuit configuration of control board 1> Next, a circuit configuration of the control board 1 according to this embodiment will be described below. Fig. 7 is a block diagram of the control board 1 according to this embodiment.

[0043] The control board 1 includes a rechargeable secondary battery 51, a diode 60, a diode 61, and a capacitor 70 and a capacitor 71. The control board 1 also includes a terminal 40 for supplying a positive voltage from an external power supply unit, a terminal 41 for detecting an input voltage of the electronic device 10, a terminal 42 for supplying a positive voltage from the electronic device 10 to an external load, a terminal 43 for inputting a device enable signal of the electronic device 10, and a terminal 44 for outputting a power good signal of the electronic device 10.

[0044] The control board 1 is provided by stacking the electronic device 10 on the power generation device 20. In Fig. 7, the electronic device 10 is illustrated shifted from the power generation device 20 in order to show the electrical connection. Also, the connection between the terminals of the electronic device 10 and the metal wiring of the power generation device 20 is indicated by dotted lines.

[0045] An external power supply unit supplies power from terminal 40 to terminal pad 12a via diode 60 and metal wiring 22a. Terminal 41 is electrically connected to metal wiring 22a and terminal pad 12a. Terminal pad 12b is connected to terminal 43. Terminal pad 12c is connected to a ground pattern. Terminal pad 12a and terminal pad 12c are connected via capacitor 70 to remove high-frequency noise. High-frequency noise flows into the ground pattern via capacitor 70.

[0046] The terminal 41 is also used as an input voltage for electronic devices other than the electronic device 10 (not shown).

[0047] Terminal pad 12d is connected to terminal 42. Terminal pad 12e is connected to terminal 44. Terminal pad 12f is connected to a ground pattern. Terminal pad 12d and terminal pad 12f are connected via a capacitor 71 in order to remove high-frequency noise. High-frequency noise flows through capacitor 71 to the ground pattern.

[0048] The power generation device 20 outputs the electric energy generated from the Peltier element 21 from the terminal pads 24a and 24b of the power generation device 20. The terminal pad 24a is connected to the positive terminal of the secondary battery 51. The terminal pad 24a is also connected to the terminal pad 12a via the diode 61 and the metal wiring 22a. The terminal pad 24b is also connected to the negative terminal of the secondary battery 51. The terminal pad 24a is also connected to a ground pattern.

[0049] The power generation device 20 utilizes a voltage difference generated between the positive terminal pad 24a and the negative terminal pad 24b to charge the rechargeable secondary battery 51. The power generation device 20 also supplies power to the electronic device 10 by utilizing a voltage difference generated between the positive terminal pad 24a and the negative terminal pad 24b.

[0050] The control board 1 of this embodiment supplies the power stored in the secondary battery 51, the power generated by the Peltier element 21, and the power from an external power supply unit to the electronic device 10 via the diode 60 or diode 61.

[0051] In the control board 1, the electrical energy generated by the Peltier element 21 becomes the input power source for the electronic device 10, and the surplus electrical energy is stored in the secondary battery 51. By storing electricity in the secondary battery 51, when more power is required in the electronic device 10, the power can be supplied from the secondary battery 51. Furthermore, when the power from the secondary battery 51 is insufficient, power is further supplied from an external power supply unit.

[0052] The heat dissipation pad 31 is an example of a first heat dissipation pad, and the heat dissipation pad 11 is an example of a second heat dissipation pad. The circuit connected from the terminal pad 24a to the terminal pad 24b via the secondary battery 51 is an example of a power supply circuit 50 that reuses the electric energy converted from the thermal energy by the Peltier element 21.

[0053] <Modification> In the above description, a power supply IC has been described as an example of the electronic device 10. The electronic device 10 is not limited to a power supply IC. For example, the electronic device 10 may be a processor such as a CPU (Central Processing Unit).

[0054] Processors such as CPUs are devices that handle high-speed signals with frequencies of several hundred MHz or more. When transmitting high-speed signals, it is desirable to match the characteristic impedance of the transmission paths, such as the device, wiring on the circuit board, and connectors, in order to prevent deterioration of the signal waveform quality due to distortion such as signal reflection.

[0055] Fig. 8 is a top view of the control board 2 which is a modified example of the control board 1 according to the present embodiment. Fig. 9 is a side view of the control board 2 which is a modified example of the control board 1 according to the present embodiment.

[0056] The control board 2 includes an electronic device 110, a power generation device 120, an electronic device 180, and a board .

[0057] The electronic device 110 is, for example, a processor such as a CPU. The electronic device 110 is a device that generates heat when it operates. The electronic device 110 includes a plurality of terminal pads and a heat dissipation pad, similar to the electronic device 10. Among the plurality of terminal pads, a terminal pad 112e is connected to a high-speed signal line 135. Therefore, a high-speed signal propagates through the terminal pad 112e.

[0058] The power generation device 120 is located between the electronic device 110 and the substrate 130. The power generation device 120 generates power by using the temperature difference between the electronic device 110 and the substrate 130. The power generation device 120 includes a Peltier element 121 and a plurality of metal wires similar to the power generation device 120. A metal wire 122e among the plurality of metal wires is connected to a high-speed signal line 135 via a terminal pad 132e provided on the surface of the substrate 130. Therefore, a high-speed signal propagates through the metal wire 122e.

[0059] The electronic device 180 is a driver IC that processes high-speed signals. The electronic device 180 is, for example, an IC that processes signals of a Universal Serial Bus (USB). The electronic device 180 includes a plurality of terminal pads and a heat dissipation pad, similar to the electronic device 10. The terminal pad 182b among the plurality of terminal pads is connected to the high-speed signal line 135 via the terminal pad 138 provided on the surface of the substrate 130. Therefore, a high-speed signal propagates to the terminal pad 182b. The heat dissipation pad of the electronic device 180 is connected to the heat dissipation pad provided on the substrate 130.

[0060] The substrate 130 is a circuit board on which the electronic device 110, the power generation device 120, and the electronic device 180 are mounted. Like the substrate 30, the substrate 130 includes a power supply circuit that reuses the electric energy generated by the power generation device 120. The substrate 130 includes a high-speed signal line 135 that transmits high-speed signals on the substrate surface.

[0061] In order to maintain the signal waveform quality of the high-speed signal propagating through the high-speed signal line 135, it is desirable that the characteristic impedances of the high-speed signal line 135, the terminal pad 132e through which the high-speed signal propagating through the high-speed signal line 135 passes, the metal wiring 122e, and the terminal pad 112e are consistent with each other. In other words, it is desirable that the impedance of the metal wiring 122e is matched between the electronic device 110 and the substrate 130.

[0062] Furthermore, it is desirable for the characteristic impedances of the high speed signal line 135 and the terminal pad 182b of the electronic device 180 to be matched.

[0063] In this modification, the power generating device 120 is provided between the heat generating electronic device 110 and the substrate 130. Furthermore, by making the metal wiring of the power generating device 120 have the same characteristic impedance as the electronic device 110 and the substrate 130, distortion such as reflection can be prevented and high-speed signals can be handled.

[0064] The power generating device of this embodiment may be provided between the electronic device 180 and the substrate 130.

[0065] <Actions and Effects> In the control board 1 of this embodiment, the power generation device 20 is provided between the electronic device 10, which is a heat generating device, and the board 30. By providing the power generation device 20 between the electronic device 10 and the board 30, heat from the electronic device 10 can be efficiently converted into electrical energy. Furthermore, by providing the power generation device 20 between the electronic device 10 and the board 30, wiring between the power generation device 20 and the power supply circuit 50 that reuses the electrical energy generated by the power generation device 20 can be easily performed.

[0066] Furthermore, since the power generation device 20 includes metal wiring, wiring between the electronic device 10 and the substrate 30 can be easily performed.

[0067] <Application Examples> 10 is a diagram showing an example of the configuration of an image forming apparatus 500, which is an example of the electronic device according to this embodiment. For example, the control board of this embodiment is suitable for use as a power supply control board for the image forming apparatus.

[0068] The image forming device 500 is a multifunction device called an MFP (Multi Functional Peripheral / Printer). The image forming device 500 has a combination of functions such as a copy function, a fax function, a print function, a scanner function, and a function for storing and distributing input images (originals read by the scanner function, and images input by the printer function or fax function).

[0069] Image forming apparatus 500 can also communicate with external devices such as a PC (Personal Computer) and can perform operations according to instructions received from the external devices. In the embodiment, the "image" processed by image forming apparatus 500 includes not only image data but also data that does not include image data, that is, data that includes only text information.

[0070] The image forming apparatus 500 is a so-called electrophotographic image forming apparatus that adheres toner to an electrostatic latent image written by selectively exposing a charged photoreceptor surface, and transfers the adhered toner to a recording medium such as paper.

[0071] Image forming apparatus 500 includes an operation panel 510, a start switch 520, a controller 530, a reading unit 540, an engine control unit 550, a printer unit 560, paper feed cassettes 570A and 570B, and a transport unit 580.

[0072] The operation panel 510, which is an operation unit, accepts various inputs according to user operations and displays various information (e.g., information indicating the accepted operation, information indicating the operating status of the image forming apparatus 500, information indicating the setting state of the image forming apparatus 500, etc.). The operation panel 510 is configured, for example, by a liquid crystal display device (LCD (Liquid Crystal Display)) equipped with a touch panel function, but is not limited to this. For example, the operation panel 510 may be configured by an organic EL (Electro-Luminescence) display device equipped with a touch panel function. Furthermore, in addition to or instead of this, an operation unit such as hardware keys and a display unit such as a lamp can also be provided.

[0073] When start-up switch 520 is pressed by a user while image forming apparatus 500 is powered off, it starts up image forming apparatus 500. When start-up switch 520 is pressed by a user while image forming apparatus 500 is powered on and started up, it turns off the image forming apparatus. In this way, start-up switch 520 may turn image forming apparatus 500 on / off when pressed by a user, but is not limited to this, and image forming apparatus 500 may be turned on / off based on an instruction received from an external device.

[0074] Controller 530 comprehensively controls image forming apparatus 500 based on operation inputs from operation panel 510, etc. As one example, controller 530 causes image forming apparatus 500 to execute an operation corresponding to an operation or information received by operation panel 510. As another example, controller 530 causes image forming apparatus 500 to execute an instruction received by image forming apparatus 500 from an external device such as a PC. As yet another example, controller 530 causes image forming apparatus 500 to execute a predetermined operation when a specific condition is detected, for example, when controller 530 detects pressing of start switch 520, or when controller 530 detects an abnormality occurring in image forming apparatus 500, etc.

[0075] A specific example of the controller 530 is a controller board equipped with a circuit that performs overall control of the image forming apparatus 500. The circuit that performs overall control of the image forming apparatus 500 is equipped with, for example, a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). The controller 530 controls the image forming apparatus 500 by the CPU using the RAM as a working area to execute programs stored in the ROM and a hard disk drive (HDD).

[0076] The reading unit 540 reads an original. The reading unit 540 includes an ADF (Auto Document Feeder) 541 and a scanner unit 542. The ADF 541 sequentially transports the originals placed on the ADF 541, optically reads the originals, and generates image data. The scanner unit 542 fixes the originals on a transparent platen, optically reads the fixed originals, and generates image data.

[0077] The engine control unit 550 generates control signals for controlling the printer unit 560 and the transport unit 580 based on the image data generated by the reading unit 540. A specific example of the engine control unit 550 is a circuit board for generating control signals based on image data.

[0078] The printer unit 560 is an image forming section that forms an image on a recording medium such as paper. The printer unit 560 forms a toner image on the recording medium. The printer unit 560 includes a photoconductor drum 561 as a photoconductor, a charging member 562, a writing unit 563, a developing member 564, a conveyor belt 565, and a fixing section 566. The charging member 562 charges the outer surface of the photoconductor drum 561. The writing unit 563 exposes the charged photoconductor drum 561 based on the image data read by the reading section 540, and writes an electrostatic latent image on the photoconductor. The developing member 564 develops the written latent image with toner. The conveyor belt 565 conveys the recording medium on which the toner image is formed. The fixing section 566 fixes the toner on the recording medium to the recording medium.

[0079] The paper feed cassettes 570A and 570B store recording media before image formation. In Fig. 10, as an example, two paper feed cassettes are provided, each storing recording media of a different size, but the number of paper feed cassettes may be one or three or more.

[0080] The transport unit 580 transports the recording medium as a paper feed transport section. The transport unit 580 includes various rollers. The transport unit 580 transports the recording medium stored in the paper feed cassette 570A or 570B to the printer unit 560 along the arrow 500C.

[0081] Here, the flow of image formation in image forming apparatus 500 will be described using copy mode as an example. First, a user operates a function switching key or the like on operation panel 510 to sequentially switch and select copy function, printer function, and facsimile function of image forming apparatus 500, and it becomes possible to operate each function. When the copy function is selected, the mode becomes copy mode, when the printer function is selected, the mode becomes printer mode, and when the facsimile function is selected, the mode becomes facsimile mode.

[0082] In the copy mode, the reading unit 540 reads image information of each document to be copied, and generates image data.

[0083] The outer peripheral surface of the photoconductor drum 561 is uniformly charged by a charging member 562 in the dark, and then exposed to light (indicated by a dotted arrow 500A in FIG. 10) from a writing unit 563, resulting in an electrostatic latent image being formed on the outer peripheral surface of the photoconductor drum 561. A developing member 564 visualizes the electrostatic latent image with toner. This forms a toner image on the photoconductor drum 561. The photoconductor drum 561 rotates in the direction of an arrow 500B. The toner image formed on the photoconductor drum 561 is then transferred to a recording medium on a conveyor belt 565. Then, a fixing unit 566 heats and melts the toner of the toner image on the recording medium, for example, with a heater, to fix the toner image to the recording medium, and the recording medium is discharged from the image forming apparatus 500.

[0084] Although the printer unit 560 forms images by a monochrome electrophotographic method in the above description, the image forming method is not limited to these and may be a color electrophotographic method or an inkjet method.

[0085] Furthermore, the above-mentioned operation panel 510 may be controlled by controller 530, or may have a control circuit for controlling operation panel 510 separate from controller 530 and be controlled by the control circuit. In this case, the control circuit of controller 530 and the control circuit of operation panel 510 are connected to each other so as to be able to communicate with each other, and controller 530 controls the entire image forming apparatus 500 including operation panel 510.

[0086] Although controller 530, engine control unit 550, printer unit 560, paper feed cassettes 570A and 570B, and transport unit 580 are provided inside the exterior of image forming apparatus 500, FIG. 10 shows the inside in a see-through manner.

[0087] By using the control board of this embodiment in the image forming apparatus 500, it is possible to utilize waste heat, such as exhaust heat, inside the image forming apparatus 500 to generate power using a Peltier element, and store the generated electrical energy in a secondary battery. By storing the generated electrical energy in a secondary battery, the power in energy saving mode of the image forming apparatus 500 can be supplied from the secondary battery, and the power in energy saving mode can be set to 0 W.

[0088] Also, the heat exhausted from inside the image forming apparatus 500 may be generated by the fixing unit 566 for melting the toner in the image forming apparatus 500. However, the fixing unit 566 can only generate heat when the image forming apparatus 500 is printing. Therefore, it is not possible to generate electrical energy sufficient to cover the power consumption of the image forming apparatus 500 during energy saving. On the other hand, the control board of the present embodiment generates electrical energy using the exhaust heat from a part that constantly emits heat, such as a power supply IC, and therefore can be used as power consumption during energy saving.

[0089] Although the image forming apparatus 500 has been described as an example of an electronic device, the control board of this embodiment is not limited to the image forming apparatus 500 and can be applied to electronic devices equipped with heat-generating electronic devices, such as a power supply control IC and a processor such as a CPU.

[0090] The present invention is not limited to the configurations shown here, such as combinations of the configurations and other elements in the above-mentioned embodiments, etc. These points can be changed without departing from the spirit of the present invention, and can be appropriately determined according to the application form. [Explanation of symbols]

[0091] 1, 2 Control board 10, 110 Electronic Devices 11 Heat dissipation pad 12a, 12b, 12c, 12d, 12e, 12f, 112e terminal pads 20, 120 Power generation devices 20A Page 1 20B 2nd side 21, 121 Peltier element 22a, 22b, 22c, 22d, 22e, 22f, 122e metal wiring 23 Case 24a, 24b terminal pads 30, 130 board 30A top 30B Bottom 31 Heat dissipation pad 32a, 32b, 32c, 32d, 32e, 32f, 132e, 138 Terminal Pads 34a, 34b terminal pads 40, 41, 42, 43, 44 terminals 50 Power circuit 51 Secondary battery 60, 61 Diode 70, 71 Capacitor 135 High Speed ​​Signal Line 180 Electronic Devices 182b Terminal Pad 500 Image forming device 500A, 500B, 500C Arrows 510 Operation Panel 520 Start switch 530 Controller 540 Reading unit 541 ADF 542 Scanner section 550 Engine control unit 560 Printer Unit 561 Photoconductor drum 562 Electrostatic materials 563 Write Unit 564 Developing materials 565 Conveyor Belt 566 Fixing part 570A, 570B Paper Cassette 580 Transport Unit [Prior art documents] [Patent documents]

[0092] [Patent Document 1] JP 2014-027186 A

Claims

1. a substrate having a first heat dissipation pad; an electronic device having a second thermal pad for dissipating heat; a power generation device including a Peltier element sandwiched between the first heat dissipation pad and the second heat dissipation pad, the Peltier element converting thermal energy generated by the electronic device into electrical energy; a power supply circuit that reuses the electrical energy; the power generation device includes a wiring that connects a first terminal of the electronic device and a second terminal of the substrate; the power generation device has a first surface bonded to the second heat dissipation pad of the electronic device and a second surface bonded to the first heat dissipation pad of the substrate; the wiring passes through between the first surface and the second surface, The first terminal, the second terminal, and the wiring are located at the same position in a top view. Control board.

2. The wiring is impedance-matched between the electronic device and the substrate. The control board according to claim 1 .

3. A control board according to claim 1 or 2, electronic equipment.

4. A control board according to claim 1 or 2, Image forming device.

Images