Photoelectric conversion devices and equipment

Abstract

To provide a photoelectric conversion device that has a first substrate including pixels and a second substrate including a signal processing circuit laminated thereon, and to reduce an influence of heat and noise generated from the signal processing circuit on the pixels, while suppressing, increase in a chip size.SOLUTION: A photoelectric conversion device comprises a second substrate 200 that includes a signal processing circuit 203 that performs signal processing using machine learning on signals output from a first substrate 100, and is laminated on the first substrate 100. The signal processing circuit 203 has an arrangement in which the same overlaps a pixel array 101 and does not overlap a light shielding pixel area 103 in plan view.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] This relates to photoelectric conversion devices and equipment. [Background technology]

[0002] 2. Description of the Related Art Photoelectric conversion devices that convert incident light into electric charges are known to have a stacked structure in which a plurality of substrates are stacked.

[0003] Patent Document 1 describes a stacked type light receiving sensor in which a first substrate having pixels and a second substrate having a signal processing circuit (DSP) are stacked. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-25263 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the light receiving sensor described in Patent Document 1, in order to reduce the effect of noise generated from the signal processing circuit provided on the second substrate on the pixels, it is considered to arrange the signal processing circuit and the pixel array so that they do not overlap at all; however, this may result in an increase in the chip size of the photoelectric conversion device.

[0006] In addition, in order to reduce the impact of heat and noise generated by the signal processing circuit on the pixels, it is possible to arrange the signal processing circuit and the pixel array so that they do not overlap at all, but this could result in an increase in the chip size of the photoelectric conversion device.

[0007] The technology disclosed herein provides a technology that reduces the effects of heat and noise generated from a signal processing circuit on pixels while suppressing an increase in the chip size of a photoelectric conversion device. [Means for solving the problem]

[0008] One of the means for solving the problem is a first substrate including a pixel array having an effective pixel area having a plurality of effective pixels to which light is incident and a light-shielding pixel area having a plurality of light-shielding pixels that are shielded from light; A second substrate is laminated on the first substrate, and the second substrate has a signal processing circuit that performs signal processing using machine learning on a signal output from the first substrate. and a second substrate, wherein the signal processing circuit overlaps with the pixel array in a plan view but does not overlap with the light-shielded pixel region. Effect of the Invention

[0009] The technology disclosed herein can reduce the effects of heat and noise generated from a signal processing circuit on pixels while suppressing an increase in the chip size of a photoelectric conversion device. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 shows the configuration of a first substrate [Diagram 2] A diagram showing the configuration of a pixel [Diagram 3] FIG. 2 shows the configuration of a second substrate [Figure 4] A diagram showing the configuration of the first and second substrates. [Diagram 5] FIG. 2 shows the configuration of a second substrate [Figure 6] FIG. 2 shows the configuration of a second substrate [Figure 7] FIG. 2 shows the configuration of a second substrate [Figure 8] FIG. 2 shows the configuration of a second substrate [Figure 9] FIG. 1 shows the configuration of a first substrate [Figure 10] Photoelectric conversion system functional block diagram [Figure 11] Distance sensor functional block diagram [Figure 12] Functional block diagram of endoscopic surgery [Figure 13] Photoelectric conversion system and moving object [Figure 14] Schematic diagram of smart glasses [Figure 15] Functional block diagram of diagnostic system DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In the following embodiments, an image pickup device will be mainly described as an example of a photoelectric conversion device. However, each embodiment is not limited to an image pickup device, and can be applied to other examples of photoelectric conversion devices. For example, a distance measuring device (a device for measuring distance using focus detection or TOF (Time Of Flight)) or a photometric device (a device for measuring the amount of incident light) may be used.

[0012] The conductivity types of the transistors described in the following embodiments are merely examples and are not limited to those described in the examples. The conductivity types described in the embodiments can be changed as appropriate, and the potentials of the gate, source, and drain of the transistors are changed as appropriate.

[0013] For example, in the case of a transistor operated as a switch, the low and high levels of the potential supplied to the gate may be reversed in accordance with the change in the conductivity type, as compared to the description in the embodiment. The conductivity type of the semiconductor region described in the embodiment described below is also merely an example, and is not limited to the conductivity type described in the embodiment. The conductivity type may be changed as appropriate from the conductivity type described in the embodiment, and the potential of the semiconductor region may be changed as appropriate in accordance with this change.

[0014] (First embodiment) FIG. 1 is a diagram showing the configuration of a first substrate (pixel substrate) included in a photoelectric conversion device according to this embodiment.

[0015] The first substrate 100 has an effective pixel region 101 in which effective pixels 102 are arranged across multiple rows and multiple columns. The number of effective pixels 102 arranged in the pixel array 101 is tens of millions of pixels in the case of a general digital camera. A light-shielding pixel region 103 in which light-shielding pixels 104 are arranged is provided in the periphery of the effective pixel region 101. The light-shielding pixel region 103 includes a region A in which the light-shielding pixels 104 are arranged in one row and one column in FIG. 1, and a region B in which the light-shielding pixels 104 are arranged in multiple rows and one column. However, this is not limited to this example, and the light-shielding pixels 104 may be arranged in multiple rows and multiple columns in the region A, or the light-shielding pixels 104 may be arranged in multiple rows and multiple columns in the region B. The pixel array provided in the first substrate 100 includes the effective pixel region 101 and the light-shielding pixel region 103.

[0016] The light-shielded pixels 104 include optical black pixels that output a black level signal. The optical black pixels include a light-shielded photoelectric conversion unit.

[0017] The first substrate 100 has bonding portions 120-1 and 120-2 that output signals to a second substrate, which will be described later. The bonding portions 120-1 and 120-2 typically have a TSV (Through Silicon Via) structure.

[0018] 2(a) is a circuit diagram showing the circuit of the effective pixels 102 arranged in two rows and two columns, among the effective pixels 102 shown in FIG. 1. In the following description, it is assumed that the charges accumulated in the photodiodes, which are photoelectric conversion units, are electrons. It is assumed that all the transistors included in the effective pixels 102 are N-type transistors. On the other hand, the charges accumulated in the photodiodes may be holes, in which case the transistors of the effective pixels 102 may be P-type transistors. In other words, the definition of the conductivity type used in the following description can be changed depending on the polarity of the charges to be treated as signals.

[0019] The effective pixel 102 has a photodiode D1 as a photoelectric conversion unit, a transfer transistor M1, a charge conversion unit C1, a reset transistor M3, an amplification transistor M4, and a selection transistor M5. The transfer transistor M1 is provided in an electrical path between the photodiode D1 and a node to which the charge conversion unit C1, the reset transistor M3, and the amplification transistor M4 are connected. The charge conversion unit C1 is also called a floating diffusion unit (FD unit). A power supply voltage VDD is applied to the reset transistor M3 and the amplification transistor M4. The selection transistor M5 is provided in an electrical path between the amplification transistor M4 and a column signal line 10. It can be said that the amplification transistor M4 is electrically connected to the vertical output line 10 via the selection transistor M5. The charge conversion unit C1 includes a floating diffusion capacitance provided in a semiconductor substrate and a parasitic capacitance of an electrical path from the transfer transistor M1 to the amplification transistor M5 via the floating diffusion capacitance.

[0020] Each of the signals RES, Tx_A, and SEL is supplied from a vertical scanning circuit (not shown) shown in Fig. 1 via a control line 30. In Fig. 2, each signal is indicated by adding the pixel row to which the signal is supplied at the end of the signal. For example, the signal RES(m) means that the signal RES is supplied to the pixel in the mth row.

[0021] A current source (not shown) is connected to each of the vertical output lines 10-1 and 10-2. When the signal SEL(m) becomes active level, the selection transistor M5 of the effective pixel 102 in the mth row is turned on. As a result, a current is supplied from the current source to the amplification transistor M4 of the effective pixel 102 in the mth row. In the effective pixel 102 in the mth row, a source follower circuit is formed by a power supply voltage VDD, the amplification transistor M4, and a current source (not shown) connected to the vertical output line 10-1. By forming this source follower circuit, the amplification transistor M4 outputs a signal based on the potential of the charge conversion unit C1 to the vertical output line 10-1 via the transistor M5.

[0022] Furthermore, when the signal SEL(m+1) becomes active level, the selection transistor M5 of the effective pixel 102 in the (m+1)th row is turned on. As a result, a current is supplied from the current source to the amplification transistor M4 in the (m+1)th row. In the effective pixel 102 in the (m+1)th row, a source follower circuit is formed by the power supply voltage VDD, the amplification transistor M4, and a current source (not shown) connected to the vertical output line 10-2. By forming this source follower circuit, the amplification transistor M4 outputs a signal based on the potential of the charge conversion unit C1 to the vertical output line 10-2 via the transistor M5.

[0023] In this manner, the effective pixel 102 in the mth row and the effective pixel 102 in the (m+1)th row are connected to different vertical output lines 10, respectively.

[0024] 2(b) shows the configuration of an optical black pixel 104-1, which is a part of the light-shielded pixels 104, and a reference pixel 104-2, which is another part of the light-shielded pixels 104. The optical black pixel 104-1 has the same configuration as the effective pixel 102, except that the photodiode D1 is shielded from light. The optical black pixel 104-1 is a pixel that outputs a black level signal.

[0025] Moreover, the reference pixel 104-2 does not have a photodiode D1, which is a photoelectric conversion unit. The reference pixel 104-2 has a capacitive element C2 instead of the photodiode D1. The configuration of the reference pixel 104-2 is not limited to this form, and may be configured without the capacitive element C2, or may be configured without the transfer transistor M1. As viewed from the center of the pixel array, the effective pixel 102, the reference pixel 104-2, and the optical black pixel 104-1 are arranged in this order. From another perspective, the reference pixel 104-2 is arranged between the effective pixel 102 and the optical black pixel 104-1. The reference pixel 104-2 outputs a signal corresponding to the reset level of the capacitive element C1, which is an FD unit, to the corresponding vertical output line 10-n (n is a natural number). The signal output by this reference pixel 104-2 can be used as a signal for referring to the noise component of the amplification transistor M4.

[0026] A part of the vertical output line 10-n is connected to a junction 120-1, and another part of the vertical output line 10-n is connected to a junction 120-2.

[0027] FIG. 3 shows the configuration of the second substrate 200 laminated on the first substrate 100. The effective pixel region 101, the light-shielded pixel region 103, and the bypass capacitor 110 provided on the first substrate 100 are indicated by dashed lines. The bypass capacitor 110 has a configuration in which one electrode and the other electrode receive a plurality of power supply voltages supplied to the pixel array. That is, one electrode of the bypass capacitor 110 is connected to a power supply line that supplies a first power supply voltage, and the other electrode is connected to another power supply line that supplies a second power supply voltage. This stabilizes the plurality of power supply voltages supplied to the pixel array. The plurality of power supply voltages are typically the power supply voltage VDD shown in FIG. 2 and the ground voltage supplied to the photodiode D1. The second substrate 200 is provided with AD conversion units 201-1 and 201-2, a preprocessing unit 202, and a DSP (Digital Signal Processor) 203.

[0028] The AD conversion unit 201-1 receives a pixel signal from the junction 120-1, and the AD conversion unit 201-2 receives a pixel signal from the junction 120-2.

[0029] The AD conversion units 201-1 and 201-2 convert the input pixel signals into digital signals. In addition, the AD conversion units 201-1 and 201-2 may perform a process of reducing noise contained in the pixel signals (typically, CDS (Correlated Double Sampling)) and an amplification process prior to the AD conversion. The digital signals generated by the AD conversion units 201-1 and 201-2 are input to the pre-processing unit 202.

[0030] The pre-processing unit 202 performs signal processing on the digital signals output from the AD conversion units 201-1 and 201-2. This signal processing may include, in addition to CDS (Correlated Double Sampling), offset removal, amplification processing, and other processing equivalent to a part of image processing. For example, when the image data to be processed is a color image, the pre-processing unit 202 converts the format of this image data into YUV image data, RGB image data, or the like. Furthermore, the pre-processing unit 202 performs processing such as noise removal and white balance adjustment on the image data to be processed as necessary. In addition, the pre-processing unit 202 performs various signal processing (also referred to as pre-processing) on ​​the image data to be processed that is necessary for the DSP 203 to process the image data.

[0031] The DSP203 is a signal processing circuit that functions as a machine learning unit that uses a deep neural network (DNN). The DSP203 executes a machine learning processing program to perform a process of multiplying the dictionary coefficients and image data. The results obtained by such machine learning processing (machine learning results) are output to the outside of the photoelectric conversion device. The machine learning results may include image data obtained by machine learning the image data, various information (metadata) obtained from the image data, and the like.

[0032] When the DSP 203 does not execute any processing on the image data output from the pre-processing unit 202 , the image data output from the pre-processing unit 202 may be output as is without going through the DSP 203 .

[0033] The DSP 203 overlaps with the pixel array. Specifically, the DSP 203 overlaps with the effective pixel region 101. On the other hand, the DSP 203 does not overlap with the light-shielded pixel region 103. The DSP 203 generates a lot of heat because it executes a machine learning processing program and generates a machine learning result. This heat exceeds the heat generation amount of each of the AD conversion units 201-1 and 201-2 depending on the concentration of the processing load. When this heat is propagated to the light-shielded pixel region 103 included in the pixel array, noise included in the signal output by the pixel of the light-shielded pixel region 103 increases. When the heat is propagated to the optical black pixel 104-1, the black level of the image shifts. In addition, depending on the arrangement of the DSP 203, heat distribution occurs in the first substrate 100, and shading occurs in the output of the multiple optical black pixels 104-1. As a result, shading also occurs in the image generated by the signal output by the photoelectric conversion device. Furthermore, when heat is propagated to the reference pixel 104-2, the noise contained in the signal output by the reference pixel 104-2 increases. Therefore, when noise reduction processing is performed on the signal output by the reference pixel 104-2 from the signal output by the effective pixel 102, a signal component greater than the original noise is subtracted. This results in a decrease in the signal accuracy of the effective pixel 102.

[0034] In this embodiment, the DSP 203 is disposed at a position where it does not overlap the light-shielded pixel region 103 in a plan view seen from the top surface of the first substrate 100 and the second substrate 200 (unless otherwise specified, when a plan view is described, it is assumed that it is viewed from the top surface). This suppresses the propagation of heat from the DSP 203 to the light-shielded pixel region 103. In addition, the DSP 203 is disposed at a position where it does not overlap the optical black pixel 104-1 in a plan view. This suppresses the influence on the black level of the image. In addition, the DSP 203 is disposed at a position where it does not overlap the reference pixel 104-2. This suppresses an increase in noise in the reference pixel 104-2 and a decrease in the signal accuracy of the effective pixel 102.

[0035] Moreover, the DSP 203 overlaps with the effective pixel region 101 in a plan view. This suppresses an increase in the area of ​​the second substrate 200 compared to when the DSP 203 is disposed outside the effective pixel region 101. This also suppresses an increase in the chip size of the photoelectric conversion device.

[0036] In this way, the present embodiment can suppress an increase in the chip size of the photoelectric conversion device while providing a structure in which heat from the DSP 203 is less likely to propagate to the light-shielded pixel region 103. This makes it possible to suppress an increase in noise in the signal output from the light-shielded pixel region 103.

[0037] (Variation 1) In the first embodiment, the first substrate 100 and the second substrate 200 are connected by the bonding portions 120-1 and 120-2 having a TSV structure arranged outside the pixel array. FIG. 4(a) shows an example in which the bonding portions 120-3 and 120-4 are provided in the first substrate 100 at positions overlapping the pixel array in a plan view. FIG. 4(b) shows the bonding portions 120-5 and 120-6 provided in the second substrate 200 so as to bond with the bonding portions 120-3 and 120-4. The bonding portions 120-3, 120-4, 120-5, and 120-6 each have an island-shaped bonding electrode (metal), and are structured such that the bonding electrode on the first substrate side is bonded to the bonding electrode on the second substrate side. An insulating layer is provided on the layer on which the bonding electrodes are provided, and the insulating layer on the first substrate side is also bonded to the insulating layer on the second substrate side. Such a structure in which metal layers are joined together or insulating layers are joined together is also called a hybrid joint.

[0038] In Fig. 4(b), AD conversion units 201-1 and 201-2 perform AD conversion on pixel signals input from junctions 120-5 and 120-6, respectively. The functions of preprocessing units 202-1 and 202-2 and DSPs 203-1 and 203-2 are the same as those in the first embodiment. Even in this embodiment, the same effects as those in the first embodiment can be obtained.

[0039] (Variation 2) 5 shows a form in which a DSP is further provided in addition to the first modification. DSP 203-2 and DSP 203-3 are provided on the second substrate 200. DSP 203-2 may be configured to receive an output from the AD conversion section 201-2, or may be configured to receive an output from the pre-processing section 202. DSP 203-3 may be configured to receive an output from the AD conversion section 201-3, or may be configured to receive an output from the pre-processing section 202.

[0040] Both the DSPs 203-2 and 203-3 are provided at positions that do not overlap the light-shielded pixel region 103 in a planar view. This suppresses the propagation of heat to the optical black pixel 104-1 and the reference pixel 104-2 provided in the light-shielded pixel region 103. In addition, the first substrate 100 is provided with bypass capacitors 110-2 and 110-3 at positions that overlap the DSPs 203-2 and 203-3 in a planar view. The bypass capacitors 110-2 and 110-3 function as heat dissipation, so that heat generated from the DSPs 203-2 and 203-3 is efficiently released to the outside of the photoelectric conversion device. This further suppresses the propagation of heat to the light-shielded pixel region 103.

[0041] Further, as shown in FIG. 6, a DSP203-4 may be provided. A bypass capacitor 110-4 is provided on the first substrate 100 at a position overlapping the DSP203-4 in a plan view. In the configuration of FIG. 6, the DSP203 is not arranged in a region adjacent to the region B in the light-shielded pixel region 103 shown in FIG. 1. In other words, the DSP203 is not provided between one end of the second substrate 200 and an end of the light-shielded pixel region 103 of the first substrate 100. This makes it possible to suppress the influence of heat generated by the DSP203 on the light-shielded pixel region 103. In addition, a DSP203-3 is provided between another end of the second substrate 200 and another end of the light-shielded pixel region 103 of the first substrate 100. Therefore, the light-shielded pixel region of the region A is more susceptible to the influence of heat generated by the DSP203 than the light-shielded pixel region of the region B. By comparing the output of the light-shielded pixel region in region A with the output of the light-shielded pixel region in region B, it is possible to analyze the influence of heat on the light-shielded pixel region in region A. By feeding back this influence of heat to the output of the light-shielded pixel region in region A and the output of the effective pixels 102, it is possible to more accurately reduce the noise components of the effective pixels 102. In this way, by providing light-shielded pixel regions that are susceptible to the influence of heat generated by the DSP 203 and light-shielded pixel regions that are not, it is possible to analyze the influence of heat generated by the DSP 203 on noise.

[0042] (Variation 3) FIG. 7 shows a modified arrangement of the AD conversion unit, pre-processing unit, and DSP from the first modification. The joint unit 120 can be the same as the first modification. Each of blocks 1 to 4 is provided with an AD conversion unit, a pre-processing unit, and a DSP. The functions of the AD conversion unit, the pre-processing unit, and the DSP are the same as those of the first embodiment. In blocks 1 and 3, the DSP overlaps with the light-shielded pixel region 103, but in blocks 2 and 4, the DSP is arranged in an area that does not overlap with the light-shielded pixel region 103. Even in this form, the effect of heat generation from the DSP on the light-shielded pixel region 103 can be reduced compared to the case where all the DSPs overlap with the light-shielded pixel region 103.

[0043] (Variation 4) 8 shows a configuration in which the DSPs of blocks 1 and 3 overlap with the light-shielded pixel region of area B shown in FIG. 1, in contrast to Modification 3. However, the DSP of block 4 does not overlap with the light-shielded pixel region. Even with this configuration, the effect of heat generation from the DSPs on the light-shielded pixel region 103 can be reduced compared to the case in which all DSPs overlap with the light-shielded pixel region 103.

[0044] (Variation 5) In the first embodiment, the DSP is provided only on the second substrate 200, but it may be further provided on the first substrate 100. In that case, as shown in FIG. 9, DSPs 203-5 and 203-6 are arranged to sandwich the pixel array. In this case, the DSP arranged on the first substrate 100 performs part of the processing of the DSP arranged on the second substrate 200, so that heat generation of the DSP arranged on the second substrate 200 can be suppressed. In addition, by distributing the DSP 203 between the first substrate 100 and the second substrate 200, it is possible to suppress bias in heat distribution of the photoelectric conversion device.

[0045] Second embodiment FIG. 10 is a block diagram showing a configuration of a photoelectric conversion system 11200 according to this embodiment. The photoelectric conversion system 11200 according to this embodiment includes a photoelectric conversion device 11204. Here, the photoelectric conversion device 11204 can be any of the photoelectric conversion devices described in the above embodiments. The photoelectric conversion system 11200 can be used as, for example, an imaging system. Specific examples of the imaging system include a digital still camera, a digital camcorder, a security camera, and a network camera. FIG. 10 shows an example of a digital still camera as the photoelectric conversion system 11200.

[0046] 10 includes a photoelectric conversion device 11204 and a lens 11202 that forms an optical image of a subject on the photoelectric conversion device 11204. The photoelectric conversion system 11200 also includes an aperture 11203 that varies the amount of light passing through the lens 11202, and a barrier 11201 that protects the lens 11202. The lens 11202 and the aperture 11203 form an optical system that focuses light on the photoelectric conversion device 11204.

[0047] The photoelectric conversion system 11200 has a signal processing unit 11205 that processes an output signal output from the photoelectric conversion device 11204. The signal processing unit 11205 performs signal processing operations such as performing various corrections and compression on an input signal as necessary and outputting the signal. The photoelectric conversion system 11200 further has a buffer memory unit 11206 for temporarily storing image data, and an external interface unit (external I / F unit) 11209 for communicating with an external computer or the like. The photoelectric conversion system 11200 further has a recording medium 11211 such as a semiconductor memory for recording or reading out imaging data, and a recording medium control interface unit (recording medium control I / F unit) 11210 for recording or reading out data on the recording medium 11211. The recording medium 11211 may be built in the photoelectric conversion system 11200 or may be removable. In addition, communication between the recording medium control I / F unit 11210 and the recording medium 11211 and communication from the external I / F unit 11209 may be performed wirelessly.

[0048] Furthermore, the photoelectric conversion system 11200 has an overall control / calculation unit 11208 that performs various calculations and controls the entire digital still camera, and a timing generation unit 11207 that outputs various timing signals to the photoelectric conversion device 11204 and the signal processing unit 11205. Here, timing signals and the like may be input from the outside, and the photoelectric conversion system 11200 only needs to have at least the photoelectric conversion device 11204 and the signal processing unit 11205 that processes the output signal output from the photoelectric conversion device 11204. The overall control / calculation unit 11208 and the timing generation unit 11207 may be configured to implement some or all of the control functions of the photoelectric conversion device 11204.

[0049] The photoelectric conversion device 11204 outputs the image signal to the signal processing unit 11205. The signal processing unit 11205 performs a predetermined signal processing on the image signal output from the photoelectric conversion device 11204 and outputs image data. The signal processing unit 11205 generates an image using the image signal. The signal processing unit 11205 may perform distance measurement calculation on the signal output from the photoelectric conversion device 11204. The signal processing unit 11205 and the timing generating unit 11207 may be mounted on the photoelectric conversion device. That is, the signal processing unit 11205 and the timing generating unit 11207 may be provided on a substrate on which pixels are arranged, or may be provided on a different substrate. By configuring an imaging system using the photoelectric conversion device of each of the above-mentioned embodiments, an imaging system capable of acquiring a better quality image can be realized.

[0050] Third embodiment FIG. 11 is a block diagram showing an example of the configuration of a range image sensor, which is an electronic device that uses the photoelectric conversion device described in the above embodiment.

[0051] 11, the distance image sensor 12401 is configured to include an optical system 12407, a photoelectric conversion device 12408, an image processing circuit 12404, a monitor 12405, and a memory 12406. The distance image sensor 12401 can obtain a distance image according to the distance to the subject by receiving light (modulated light or pulsed light) that is projected from a light source device 12409 toward the subject and reflected by the surface of the subject.

[0052] The optical system 12407 is configured to have one or more lenses, and guides image light (incident light) from a subject to a photoelectric conversion device 12408 , forming an image on the light receiving surface (sensor portion) of the photoelectric conversion device 12408 .

[0053] As the photoelectric conversion device 12408 , the photoelectric conversion device of each of the above-mentioned embodiments is applied, and a distance signal indicating a distance determined from a light receiving signal output from the photoelectric conversion device 12408 is supplied to the image processing circuit 12404 .

[0054] The image processing circuit 12404 performs image processing to construct a distance image based on the distance signal supplied from the photoelectric conversion device 12408. The distance image (image data) obtained by this image processing is then supplied to a monitor 12405 for display, or supplied to a memory 406 for storage (recording).

[0055] In the range image sensor 12401 configured in this way, by applying the above-mentioned photoelectric conversion device, it is possible to obtain, for example, a more accurate range image as the pixel characteristics improve.

[0056] (Fourth embodiment) The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0057] FIG. 12 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0058] 12 shows a state in which an operator (doctor) 13131 is performing surgery on a patient 13132 on a patient bed 13133 using an endoscopic surgery system 13003. As shown in the figure, the endoscopic surgery system 13003 is composed of an endoscope 13100, a surgical tool 13110, and a cart 13134 on which various devices for endoscopic surgery are mounted.

[0059] The endoscope 13100 is composed of a lens barrel 13101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 13132, and a camera head 13102 connected to the base end of the lens barrel 13101. In the illustrated example, the endoscope 13100 is configured as a so-called rigid scope having a rigid lens barrel 13101, but the endoscope 13100 may be configured as a so-called flexible scope having a flexible lens barrel.

[0060] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 13101. A light source device 13203 is connected to the endoscope 13100, and light generated by the light source device 13203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 13101. This light is irradiated via the objective lens toward an observation target in the body cavity of the patient 13132. The endoscope 13100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0061] An optical system and a photoelectric conversion device are provided inside the camera head 13102, and reflected light (observation light) from an observation target is collected by the optical system onto the photoelectric conversion device. The observation light is photoelectrically converted by the photoelectric conversion device to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to an observation image. The photoelectric conversion device described in each of the above-mentioned embodiments can be used as the photoelectric conversion device. The image signal is transmitted to a camera control unit (CCU) 13135 as RAW data.

[0062] The CCU 13135 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and performs overall control of the operations of the endoscope 13100 and the display device 13136. Furthermore, the CCU 13135 receives an image signal from the camera head 13102, and performs various types of image processing on the image signal, such as development processing (demosaic processing), for displaying an image based on the image signal.

[0063] Under the control of the CCU 13135, the display device 13136 displays an image based on an image signal that has been subjected to image processing by the CCU 13135.

[0064] The light source device 13203 is composed of a light source such as an LED (Light Emitting Diode), and supplies the endoscope 13100 with irradiation light when photographing an operation site or the like.

[0065] The input device 13137 is an input interface for the endoscopic surgery system 13003. A user can input various information and instructions to the endoscopic surgery system 13003 via the input device 13137.

[0066] The treatment tool control device 13138 controls the driving of the energy treatment tool 13112 for cauterizing tissue, incising, sealing blood vessels, or the like.

[0067] The light source device 13203 that supplies irradiation light to the endoscope 13100 when photographing the surgical site can be composed of a white light source composed of, for example, an LED, a laser light source, or a combination of these. When the white light source is composed of a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so that the white balance of the captured image can be adjusted in the light source device 13203. In this case, it is also possible to capture images corresponding to each of the RGB colors in a time-division manner by irradiating the observation target with laser light from each of the RGB laser light sources in a time-division manner and controlling the driving of the image sensor of the camera head 13102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter to the image sensor.

[0068] The light source device 13203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 13102 in synchronization with the timing of the change in the light intensity to acquire images in a time-division manner and synthesizing the images, it is possible to generate an image with a high dynamic range that is free of so-called blackout and whiteout.

[0069] The light source device 13203 may be configured to supply light in a predetermined wavelength band corresponding to the special light observation. In the special light observation, for example, the wavelength dependency of light absorption in body tissue is utilized. Specifically, a predetermined tissue such as blood vessels on the mucous membrane surface is photographed with high contrast by irradiating light in a narrower band than the irradiation light (i.e., white light) in normal observation. Alternatively, the special light observation may be a fluorescent observation in which an image is obtained by fluorescence generated by irradiating excitation light. In the fluorescent observation, it is possible to irradiate excitation light to the body tissue and observe the fluorescence from the body tissue, or to locally inject a reagent such as indocyanine green (ICG) into the body tissue and irradiate the body tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 13203 may be configured to supply narrow band light and / or excitation light corresponding to such special light observation.

[0070] Fifth embodiment The photoelectric conversion system and the moving body of this embodiment will be described with reference to Fig. 13. Fig. 13 is a schematic diagram showing a configuration example of the photoelectric conversion system and the moving body according to this embodiment. In this embodiment, an example of an in-vehicle camera is shown as the photoelectric conversion system.

[0071] FIG. 13 shows an example of a vehicle system and a photoelectric conversion system mounted thereon for capturing images. The photoelectric conversion system 14301 includes a photoelectric conversion device 14302, an image preprocessing unit 14315, an integrated circuit 14303, and an optical system 14314. The optical system 14314 forms an optical image of a subject on the photoelectric conversion device 14302. The photoelectric conversion device 14302 converts the optical image of the subject formed by the optical system 14314 into an electrical signal. The photoelectric conversion device 14302 is any of the photoelectric conversion devices according to the above-mentioned embodiments. The image preprocessing unit 14315 performs a predetermined signal processing on the signal output from the photoelectric conversion device 14302. The function of the image preprocessing unit 14315 may be incorporated in the photoelectric conversion device 14302. The photoelectric conversion system 14301 is provided with at least two sets of an optical system 14314 , a photoelectric conversion device 14302 , and an image pre-processing unit 14315 , and the output from each set of the image pre-processing unit 14315 is input to the integrated circuit 14303 .

[0072] The integrated circuit 14303 is an integrated circuit for use in an imaging system, and includes an image processing unit 14304 including a memory 14305, an optical distance measuring unit 14306, a distance measuring calculation unit 14307, an object recognition unit 14308, and an abnormality detection unit 14309. The image processing unit 14304 performs image processing such as development processing and defect correction on the output signal of the image pre-processing unit 14315. The memory 14305 stores the primary storage of the captured image and the defective positions of the captured pixels. The optical distance measuring unit 14306 performs focusing and distance measurement of the subject. The distance measuring calculation unit 14307 calculates distance measurement information from multiple image data acquired by multiple photoelectric conversion devices 14302. The object recognition unit 14308 recognizes subjects such as cars, roads, signs, and people. When the abnormality detection unit 14309 detects an abnormality in the photoelectric conversion device 14302, it issues an abnormality report to the main control unit 14313.

[0073] The integrated circuit 14303 may be realized by dedicated hardware, a software module, or a combination of these. It may also be realized by a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or the like, or a combination of these.

[0074] The main control unit 14313 supervises and controls the operations of the photoelectric conversion system 14301, the vehicle sensor 14310, the control unit 14320, etc. It is also possible to adopt a method in which the main control unit 14313 is not provided, and the photoelectric conversion system 14301, the vehicle sensor 14310, and the control unit 14320 each have a communication interface and each transmits and receives a control signal via a communication network (for example, CAN standard).

[0075] The integrated circuit 14303 has a function of receiving a control signal from the main control unit 14313 or transmitting a control signal or a set value to the photoelectric conversion device 14302 by its own control unit.

[0076] The photoelectric conversion system 14301 is connected to the vehicle sensor 14310, and can detect the vehicle's driving state such as vehicle speed, yaw rate, and steering angle, as well as the state of the environment outside the vehicle and other vehicles and obstacles. The vehicle sensor 14310 is also a distance information acquisition means for acquiring distance information to an object. The photoelectric conversion system 14301 is also connected to the driving assistance control unit 1311 that performs various driving assistance such as automatic steering, automatic cruising, and collision prevention functions. In particular, regarding the collision determination function, it determines whether or not a collision with another vehicle or obstacle has occurred based on the detection results of the photoelectric conversion system 14301 and the vehicle sensor 14310. As a result, avoidance control is performed when a collision is estimated, and a safety device is activated in the event of a collision.

[0077] The photoelectric conversion system 14301 is also connected to an alarm device 14312 that issues an alarm to the driver based on the result of the determination by the collision determination unit. For example, if the collision determination unit determines that there is a high possibility of a collision, the main control unit 14313 performs vehicle control to avoid a collision and reduce damage by applying the brakes, releasing the accelerator, suppressing engine output, etc. The alarm device 14312 warns the user by sounding an alarm, displaying alarm information on a display screen of a car navigation system or a meter panel, vibrating a seat belt or steering wheel, etc.

[0078] In this embodiment, the surroundings of the vehicle, for example, the front or rear, are photographed by a photoelectric conversion system 14301. Fig. 13(b) shows an example of the arrangement of the photoelectric conversion system 14301 when the photoelectric conversion system 14301 photographs the area in front of the vehicle.

[0079] The two photoelectric conversion devices 14302 are disposed in front of the vehicle 14300. Specifically, the center line of the vehicle 14300 with respect to its forward / backward direction or outer shape (for example, vehicle width) is regarded as an axis of symmetry, and the two photoelectric conversion devices 1302 are disposed in line symmetry with respect to the axis of symmetry. This form is preferable for obtaining distance information between the vehicle 14300 and a subject to be photographed and for judging the possibility of a collision. In addition, the photoelectric conversion device 14302 is preferably disposed so as not to obstruct the driver's field of vision when the driver visually checks the situation outside the vehicle 14300 from the driver's seat. The alarm device 14312 is preferably disposed so as to be easily within the driver's field of vision.

[0080] In addition, in this embodiment, the control to prevent collision with other vehicles has been described, but the control can also be applied to automatic driving control to follow other vehicles and automatic driving control to prevent the vehicle from going out of the lane. Furthermore, the photoelectric conversion system 14301 can be applied not only to vehicles such as the vehicle itself, but also to moving bodies (moving devices) such as ships, aircraft, and industrial robots. In addition, the photoelectric conversion system 14301 can be applied not only to moving bodies but also to devices that widely use object recognition, such as intelligent transport systems (ITS).

[0081] The photoelectric conversion device of the present invention may further be configured to be capable of acquiring various types of information such as distance information.

[0082] Sixth embodiment FIG. 14 illustrates glasses 16600 (smart glasses) according to one application example. The glasses 16600 have a photoelectric conversion device 16602. The photoelectric conversion device 16602 is the photoelectric conversion device described in each of the above embodiments. A display device including a light-emitting device such as an OLED or LED may be provided on the back side of the lens 16601. The photoelectric conversion device 16602 may be one or more. A combination of multiple types of photoelectric conversion devices may also be used. The arrangement position of the photoelectric conversion device 16602 is not limited to that shown in FIG. 14(a).

[0083] The glasses 16600 further include a control device 16603. The control device 16603 functions as a power source that supplies power to the photoelectric conversion device 16602 and the display device. The control device 16603 also controls the operations of the photoelectric conversion device 16602 and the display device. The lens 16601 is formed with an optical system for collecting light on the photoelectric conversion device 16602.

[0084] FIG. 14(b) illustrates glasses 16610 (smart glasses) according to one application example. The glasses 16610 have a control device 16612, and the control device 16612 is equipped with a photoelectric conversion device corresponding to the photoelectric conversion device 16602 and a display device. The lens 16611 is formed with an optical system for projecting light emitted from the photoelectric conversion device in the control device 16612 and the display device, and an image is projected onto the lens 16611. The control device 16612 functions as a power source for supplying power to the photoelectric conversion device and the display device, and controls the operation of the photoelectric conversion device and the display device. The control device may have a line of sight detection unit that detects the line of sight of the wearer. Infrared light may be used to detect the line of sight. The infrared light emission unit emits infrared light toward the eyeball of a user gazing at a display image. An image of the eyeball is obtained by detecting the reflected light of the emitted infrared light from the eyeball with an imaging unit having a light receiving element. By providing a reduction unit that reduces the amount of light from the infrared light emitting unit to the display unit in a plan view, degradation of image quality is reduced.

[0085] The gaze of the user with respect to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be applied to gaze detection using the image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used.

[0086] More specifically, a gaze detection process based on the pupil-corneal reflex method is performed. Using the pupil-corneal reflex method, a gaze vector that indicates the direction (rotation angle) of the eyeball is calculated based on the pupil image and the Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0087] The display device of this embodiment may have a photoelectric conversion device having a light receiving element, and may control the display image of the display device based on information on the user's line of sight from the photoelectric conversion device.

[0088] Specifically, the display device determines a first field of view area to which the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be received from an external control device. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0089] The display area may have a first display area and a second display area different from the first display area, and a high priority area may be determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be received from an external control device. The resolution of the high priority area may be controlled to be higher than the resolution of areas other than the high priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0090] In addition, AI may be used to determine the first field of view area and the area with high priority. The AI ​​may be a model configured to estimate the angle of the line of sight and the distance to an object at the end of the line of sight from the image of the eyeball, using the image of the eyeball and the direction in which the eyeball in the image was actually looking as teacher data. The AI ​​program may be included in the display device, the photoelectric conversion device, or an external device. If included in the external device, it is transmitted to the display device via communication.

[0091] When display control is performed based on visual recognition detection, the present invention can be preferably applied to smart glasses further including a photoelectric conversion device for capturing an image of the outside world. The smart glasses can display captured outside information in real time.

[0092] Seventh embodiment The system of this embodiment will be described with reference to Fig. 15. This embodiment can be applied to a pathological diagnosis system in which a doctor or the like observes cells or tissues collected from a patient to diagnose a lesion, or a diagnosis support system that supports the diagnosis. The system of this embodiment may diagnose a lesion or support the diagnosis based on an acquired image.

[0093] 15, the system of this embodiment includes one or more pathology systems 15510. It may further include an analysis unit 15530 and a medical information system 15540.

[0094] Each of the one or more pathology systems 15510 is a system used mainly by pathologists, and is installed in, for example, a laboratory or a hospital. Each pathology system 15510 may be installed in a different hospital, and is connected to the analysis unit 15530 and the medical information system 15540 via various networks such as a wide area network or a local area network.

[0095] Each pathology system 15510 includes a microscope 15511, a server 15512, and a display device 15513.

[0096] The microscope 15511 has the function of an optical microscope, captures an object to be observed placed on a glass slide, and obtains a pathological image, which is a digital image. The object to be observed is, for example, tissue or cells collected from a patient, and may be a piece of flesh from an organ, saliva, blood, etc.

[0097] The server 15512 stores and saves the pathological images acquired by the microscope 15511 in a storage unit (not shown). When the server 15512 receives a viewing request, it can search for the pathological images stored in a memory or the like and display the searched pathological images on the display device 15513. The server 15512 and the display device 15513 may be connected via a device that controls the display.

[0098] Here, when the observation object is a solid object such as a piece of flesh of an organ, the observation object may be, for example, a stained thin section. The thin section may be prepared, for example, by slicing a block piece cut out from a specimen such as an organ. In addition, when slicing, the block piece may be fixed with paraffin or the like.

[0099] The microscope 15511 may include a low-resolution imaging unit for capturing images at low resolution and a high-resolution imaging unit for capturing images at high resolution. The low-resolution imaging unit and the high-resolution imaging unit may be different optical systems or may be the same optical system. If they are the same optical system, the microscope 15511 may change the resolution depending on the object to be captured.

[0100] The observation object is accommodated in a glass slide or the like and placed on a stage located within the angle of view of the microscope 15511. The microscope 15511 first acquires an entire image within the angle of view using a low-resolution imaging unit, and identifies the area of ​​the observation object from the acquired entire image. Next, the microscope 15511 divides the area in which the observation object exists into a plurality of divided areas of a predetermined size, and acquires high-resolution images of each divided area by sequentially imaging each divided area using a high-resolution imaging unit. When switching between the target divided areas, the stage may be moved, the imaging optical system may be moved, or both may be moved. In addition, each divided area may overlap with an adjacent divided area in order to prevent the occurrence of an unimaging area due to unintended slippage of the glass slide. Furthermore, the entire image may include identification information for associating the entire image with the patient. This identification information may be, for example, a character string or a QR code (registered trademark), etc.

[0101] The high-resolution image acquired by the microscope 15511 is input to the server 15512. The server 15512 can divide each high-resolution image into partial images of smaller size. When the partial images are generated in this way, the server 15512 executes a synthesis process for all the partial images, in which a predetermined number of adjacent partial images are synthesized to generate one image. This synthesis process can be repeated until one partial image is finally generated. By this process, a group of partial images in a pyramid structure is generated, each layer being composed of one or more partial images. In this pyramid structure, the number of pixels of a partial image in a certain layer is the same as that of a partial image in a layer other than this layer, but the resolutions are different. For example, when a total of four partial images (2×2) are synthesized to generate one partial image in the upper layer, the resolution of the partial image in the upper layer is 1 / 2 times the resolution of the partial image in the lower layer used in the synthesis.

[0102] By constructing such a pyramid-structured group of partial images, it becomes possible to switch the level of detail of the observed object displayed on the display device depending on the layer to which the tile image to be displayed belongs. For example, when a partial image in the lowest layer is used, a narrow area of ​​the observed object is displayed in detail, and as a partial image in a higher layer is used, a wide area of ​​the observed object is displayed coarser.

[0103] The generated pyramid-structured partial image group can be stored in, for example, a memory etc. Then, when the server 15512 receives a request for acquiring a partial image including identification information from another device (for example, the analysis unit 15530), it transmits the partial image corresponding to the identification information to the other device.

[0104] In addition, the partial image, which is a pathology image, may be generated for each imaging condition such as focal length and staining condition. When a partial image is generated for each imaging condition, other pathology images corresponding to imaging conditions different from the specific imaging condition and of the same region as the specific pathology image may be displayed side by side together with the specific pathology image. The specific imaging condition may be specified by the viewer. Furthermore, when a plurality of imaging conditions are specified by the viewer, pathology images of the same region corresponding to each imaging condition may be displayed side by side.

[0105] Furthermore, the server 15512 may store the pyramid-structured partial image group in a storage device other than the server 15512, for example, a cloud server. Furthermore, a part or all of the above-described partial image generation process may be executed by a cloud server or the like. By using partial images in this way, the user can get the feeling that he or she is observing the observation object while changing the observation magnification. In other words, by controlling the display, it can function like a virtual microscope. The virtual observation magnification here actually corresponds to the resolution.

[0106] The medical information system 15540 is a so-called electronic medical record system, and stores information related to diagnosis, such as information for identifying a patient, information about the patient's disease, test information and image information used in the diagnosis, diagnosis results, and prescription drugs. For example, a pathological image obtained by imaging an observation object of a certain patient may be temporarily stored via the server 15512 and then displayed on the display device 15514. A pathologist using the pathological system 15510 makes a pathological diagnosis based on the pathological image displayed on the display device 15513. The results of the pathological diagnosis made by the pathologist are stored in the medical information system 15540.

[0107] The analysis unit 15530 may perform an analysis on the pathology image. A learning model created by machine learning may be used for this analysis. The analysis unit 15530 may derive a classification result of a specific region, a tissue identification result, or the like, as the analysis result. Furthermore, the analysis unit 15530 may derive an identification result such as cell information, number, position, brightness information, or the like, and scoring information therefor. The information obtained by the analysis unit 15530 may be displayed on the display device 15513 of the pathology system 15510 as diagnosis support information.

[0108] The analysis unit 15530 may be a server system including one or more servers (including a cloud server). The analysis unit 15530 may be incorporated in, for example, the server 15512 in the pathology system 15510. That is, various analyses of the pathology image may be performed in the pathology system 15510.

[0109] The photoelectric conversion device described in the above embodiment can be suitably applied to, for example, the microscope 15511 among the above-described configurations. Specifically, it can be applied to the low-resolution imaging section and / or the high-resolution imaging section in the microscope 15511. This allows the low-resolution imaging section and / or the high-resolution imaging section to be miniaturized, and thus the microscope 15511 to be miniaturized. This makes it easier to transport the microscope 15511, which makes it easier to introduce the system, reconfigure the system, and the like. Furthermore, by applying the photoelectric conversion device described in the above embodiment, part or all of the processing from acquisition of the pathological image to analysis of the pathological image can be performed on the fly within the microscope 15511, which allows for more rapid and accurate output of diagnostic support information.

[0110] The configuration described above can be applied not only to the diagnosis support system but also to biological microscopes in general, such as confocal microscopes, fluorescence microscopes, and video microscopes. Here, the observation object may be a biological sample such as cultured cells, fertilized eggs, and sperm, a biological material such as a cell sheet and three-dimensional cell tissue, or a living organism such as a zebrafish or mouse. In addition, the observation object is not limited to a glass slide, and may be observed in a state stored in a well plate, a petri dish, or the like.

[0111] Furthermore, a moving image may be generated from still images of an observation object acquired using a microscope. For example, a moving image may be generated from still images captured continuously for a predetermined period of time, or an image sequence may be generated from still images captured at a predetermined interval. In this way, by generating a moving image from still images, it becomes possible to analyze the dynamic characteristics of an observation object, such as the pulsation, elongation, migration, etc. of cancer cells, nerve cells, cardiac muscle tissue, sperm, etc., and the division process of cultured cells and fertilized eggs, using machine learning.

[0112] <Other embodiments> Although each embodiment has been described above, the present invention is not limited to these embodiments, and various changes and modifications are possible. In addition, each embodiment is mutually applicable. That is, a part of one embodiment can be replaced with a part of the other embodiment, and a part of one embodiment can be added to a part of the other embodiment. Also, a part of an embodiment can be deleted.

[0113] The disclosure of this specification includes not only what is described in this specification, but also all matters that can be understood from this specification and the drawings attached hereto. The disclosure of this specification also includes the complement of the concepts described in this specification. In other words, if this specification contains a statement that "A is greater than B," for example, even if the statement that "A is not greater than B" is omitted, this specification can be said to disclose that "A is not greater than B." This is because when it contains a statement that "A is greater than B," it is assumed that the case in which "A is not greater than B" is taken into consideration. [Explanation of symbols]

[0114] 100 First substrate 102 effective pixels 103 Light-shielding pixel area 104-1 Optical Black Pixel 104-2 Reference pixel 200 Second board 203 DSP (signal processing circuit)

Claims

1. a first substrate including a pixel array including an effective pixel area including a plurality of effective pixels to which light is incident, and a light-shielding pixel area including a plurality of light-shielding pixels that are shielded from light; A photoelectric conversion device including a second substrate laminated on the first substrate, the second substrate having a signal processing circuit that performs signal processing using machine learning on a signal output from the first substrate, The signal processing circuit overlaps with the pixel array in a plan view, but does not overlap with the light-shielded pixel region. A photoelectric conversion device comprising:

2. some of the light-shielded pixels are optical black pixels including a light-shielded photoelectric conversion unit, 2. The photoelectric conversion device according to claim 1, wherein the signal processing circuit does not overlap the optical black pixel in a plan view.

3. some of the light-shielded pixels are reference pixels that do not have a photoelectric conversion unit, 3. The photoelectric conversion device according to claim 1, wherein the signal processing circuit does not overlap with the reference pixel in a plan view.

4. a bypass capacitor connected to a first power supply line and a second power supply line is disposed on the first substrate; 4. The photoelectric conversion device according to claim 1, wherein the signal processing circuit overlaps with the bypass capacitor in a plan view.

5. the second substrate includes a plurality of the signal processing circuits; 5. The photoelectric conversion device according to claim 1, wherein some of the plurality of signal processing circuits do not overlap the light-shielded pixel region in a plan view.

6. The photoelectric conversion device according to any one of claims 1 to 5, a signal processing unit that generates an image using a signal output from the photoelectric conversion device.

7. A moving object including the photoelectric conversion device according to any one of claims 1 to 5, A moving body comprising: a control unit that controls the movement of the moving body using a signal output from the photoelectric conversion device.

Images