Display modules and electronic devices

Abstract

This display module has: a resin molded circuit board that includes a first terminal formed on one main-surface side thereof and a second terminal formed on another main-surface side thereof, and that also includes a wiring that connects the first terminal and the second terminal formed on a surface of the board; a display panel that has a connection terminal and is disposed on the one main surface of the resin molded circuit board; and a bonding wire that connects the first terminal and the connection terminal.

Description

[Technical field]

[0001] The present disclosure relates to a display module, and more particularly to a display module including a substrate having terminals and a display panel, the terminals of the substrate being connected to the terminals of the display panel by bonding wires. [Background technology]

[0002] Various electronic components, such as flexible printed circuits (FPCs), are connected to terminals through which electrical signals that control the display of display panels flow. In display modules equipped with display panels, improvements have been made to accommodate the increased area of ​​the terminal connection area required to accommodate the increased data volume that accompanies higher resolution displays.

[0003] For example, the technology of Patent Document 1 proposes an image display device having a display module that includes a multilayer substrate, a display panel, and bonding wires, with the display panel disposed on the front side of the multilayer substrate and a connector provided on the back side. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2014-178616 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the technology of Patent Document 1, a terminal connection area is formed on the back side of the multilayer substrate by vias and wiring provided in the multilayer substrate. The technology of Patent Document 1 leaves room for improvement in the display module in terms of simplifying the manufacturing process and suppressing parasitic capacitance.

[0006] The present disclosure has been made in consideration of the above-mentioned points, and one of its objectives is to provide a display module and electronic device that can achieve improvements in terms of increasing the area of ​​the terminal connection region, simplifying the manufacturing process, and suppressing parasitic capacitance. [Means for solving the problem]

[0007] The present disclosure relates to, for example, (1) a first terminal is formed on one main surface side and a second terminal is formed on the other main surface side, No. Terminal 1 and No. A resin molded circuit board having wiring formed on its surface for connecting the terminals of 2; A connection terminal and tree Plastic molded circuit board one a display panel disposed on one of the main surfaces; No. Terminal 1 and contact Bonding wires connecting terminals and, a flexible printed circuit board electrically connected to the second terminal; Have death, the resin molded circuit board is placed on one of the main surfaces of the flexible printed circuit board such that the other main surface of the resin molded circuit board faces one of the main surfaces of the flexible printed circuit board; A display module.

[0008] The present disclosure relates to for example, (2) Equipped with two device modules, The two device modules are A first terminal is formed on one main surface side and a second terminal is formed on the other main surface side, and No. Terminal 1 and No. A resin molded circuit board having wiring formed on its surface for connecting the terminals of ... tree Plastic molded circuit board one a display panel disposed on one of the main surfaces; No. Terminal 1 and contact and a bonding wire for connecting the connection terminal. and, No. Electrically connected to terminal 2 Flexible printed circuit boards and having the resin molded circuit board is placed on one of the main surfaces of the flexible printed circuit board such that the other main surface of the resin molded circuit board faces one of the main surfaces of the flexible printed circuit board; The two device modules are bonded together so that the other main surfaces of the flexible printed circuit boards face each other. A display module.

[0009] The present disclosure relates to for example, (3) forming a first terminal on one main surface side and a second terminal on the other main surface side; and No. Terminal 1 and No. a first resin molded circuit board having a first wiring formed on a surface thereof for connecting a first terminal to a second terminal; No. 1. Resin molded circuit board one a display panel disposed on one of the main surfaces; No. Terminal 1 and No. A first bonding wire connecting the first connection terminal a first flexible printed circuit board electrically connected to the second terminal; a first device module having A third terminal is formed on one main surface side and a fourth terminal is formed on the other main surface side, and No. Terminal 3 and No. a second resin molded circuit board having a second wiring formed on its surface for connecting the terminals of the first and second terminals; D It has a function different from the display panel and has a second connection terminal and No. 2. Resin molded circuit board one a functional module disposed on one of the main surfaces; No. Terminal 3 and No. A second bonding wire connecting the second connection terminal a second flexible printed circuit board electrically connected to the fourth terminal; A second device module having having the first resin molded circuit board is placed on one of the main surfaces of the first flexible printed circuit board such that the other main surface of the first resin molded circuit board faces the one of the main surfaces of the first flexible printed circuit board; the second resin molded circuit board is placed on one of the main surfaces of the second flexible printed circuit board such that the other main surface of the second resin molded circuit board faces one of the main surfaces of the second flexible printed circuit board; The first device module and the second device module are bonded together such that the other main surface of the first flexible printed circuit board faces the other main surface of the second flexible printed circuit board. A display module.

[0010] The present disclosure also relates to, for example, the above (1) , (2) or (3) The present invention may also be an electronic device equipped with the display module described above. [Brief description of the drawings]

[0011] [Figure 1]FIG. 1 is a cross-sectional view showing a schematic configuration of an example of a display module according to a first embodiment. [Diagram 2] Fig. 2A is a plan view showing a schematic configuration of an example of a display module according to the first embodiment, and Fig. 2B is a bottom view showing a schematic configuration of an example of a display module according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing a schematic configuration of an example of a display module according to the first embodiment. [Figure 4] Fig. 4A is a partial perspective view showing an embodiment of a first terminal, a connection terminal, and a wiring, and Fig. 4B is a partial perspective view showing an embodiment of a second terminal and a wiring. [Diagram 5] Fig. 5A is a partial perspective view showing an embodiment of a first terminal, a connection terminal, and a wiring, and Fig. 5B is a partial perspective view showing an embodiment of a second terminal and a wiring. [Figure 6] FIG. 6 is a cross-sectional view showing a schematic configuration of an example of a display module according to the second embodiment. [Figure 7] FIG. 7 is a cross-sectional view showing a schematic configuration of an example of a display module according to the third embodiment. [Figure 8] 8A and 8B are cross-sectional views each showing a schematic configuration of an example of a display module according to the fourth embodiment. [Figure 9] FIG. 9 is a cross-sectional view showing a schematic configuration of an example of a display module according to the fifth embodiment. [Figure 10] FIG. 10 is a cross-sectional view showing a schematic configuration of an example of a display module according to the sixth embodiment. [Figure 11] FIG. 11 is a diagram for explaining an embodiment of an electronic device incorporating a display module. [Figure 12] FIG. 12 is a diagram for explaining an embodiment of an electronic device incorporating a display module. [Figure 13] FIG. 13 is a diagram for explaining an embodiment of an electronic device incorporating a display module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. The description will be made in the following order. In this specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and duplicated description will be omitted.

[0013] The explanation will be given in the following order. 1. Display module according to the first embodiment 2. Display module according to the second embodiment 3. Display module according to the third embodiment 4. Display module according to the fourth embodiment 5. Display module according to the fifth embodiment 6. Display module according to the fifth embodiment 7.Electronic equipment

[0014] The following description is of preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments.

[0015] [1. First embodiment] (Display module 1a) As shown in Fig. 1, Fig. 2A, Fig. 2B, Fig. 3, etc., the display module 1a has a resin molded circuit board 2, a display panel 3, and a bonding wire 4. Fig. 1, Fig. 2A, Fig. 2B, and Fig. 3 are diagrams showing an example of the configuration of the display module 1a according to the first embodiment. Note that in Fig. 2A and Fig. 2B, for convenience of explanation, the sealing portion 17, the bonding wire 4, and the reinforcing portion 21 are omitted. This also applies to Fig. 4A, Fig. 4B, Fig. 5A, and Fig. 5B.

[0016] (Display Panel 3) The display panel 3 has a connection terminal 5 and an image display area R.

[0017] The display panel 3 has an element mounting substrate 6, on whose surface an image display region R is formed. The element mounting substrate 6 is equipped with a substrate, and a plurality of organic EL elements, each having a laminated structure of a transparent display electrode, an organic EL layer, and a back electrode, are arranged on the substrate surface. The connection terminals 5 are electrically connected to each organic EL element. Electricity is applied to the organic EL elements via a three-dimensional wiring section 12, bonding wires 4, and the connection terminals 5, which will be described later. In the image display region R, an image is displayed according to the electric current state of the organic EL elements.

[0018] An example of the substrate constituting the element mounting substrate 6 is a silicon substrate. A protective substrate 7 is laminated so as to cover the image display region R of the element mounting substrate 6. As the protective substrate 7, a glass substrate is preferably used.

[0019] In the first embodiment, a case where the display panel 3 is an OLED (Organic Light Emitting Diode) display (organic EL display) is described as an example. However, this does not limit the display panel 3. Specific examples of the display panel 3 include an LCOS (Liquid Crystal on Silicon) display and an LED (Light Emitting Diode) display in addition to an OLED display. This also applies to the second to sixth embodiments.

[0020] The display panel 3 has a plurality of connection terminals 5 arranged along at least a part of the outer periphery thereof.

[0021] 1, 2A, etc., the display panel 3 is formed in a rectangular shape in a plan view of the display panel 3, and a plurality of connection terminals 5 are arranged along each of two opposing sides of the rectangle. Note that this does not prohibit the connection terminals 5 from being formed along any one, three, or four sides of the display panel 3, and it is sufficient that the connection terminals 5 are arranged along the outer periphery along at least one side of the display panel 3. Note that the plan view of the display panel 3 refers to the case where the line of sight is in a direction parallel to the thickness direction of the display panel 3 (the direction of the arrow Z in FIG. 1).

[0022] 2A, the display panel 3 has a frame portion 8 that serves as a non-image display area outside the image display area R along its outer periphery, and a plurality of connection terminals 5 are arranged in the frame portion 8. The connection terminal 5 shown in FIG. 2A has a pad 5a at its tip that is connected to a bonding wire 4.

[0023] 2A and 4A, the connection terminals 5 are arranged such that the tip pads 5a are aligned in a row, but this does not limit the arrangement of the connection terminals 5. For example, as shown in Fig. 5A, the connection terminals 5 may be arranged such that the tip pads 5a are aligned in a staggered manner. When the pads 5a are aligned in a staggered manner, the pads 5a can be aligned in multiple rows (two rows in the example of Fig. 5A).

[0024] (Resin molded circuit board 2) As shown in FIG. 1, FIG. 2A, FIG. 2B, FIG. 4A, FIG. 4B, FIG. 5A, FIG. 5B, etc., the resin molded circuit board 2 has a first terminal 9 on one main surface 2a side and a second terminal 10 on the other main surface 2b side, and also has wiring 11 formed on the surface to connect the first terminal 9 and the second terminal 10. A three-dimensional wiring section 12 is formed by combining the first terminal 9 and the second terminal 10 with the wiring 11 connecting them. One connection terminal 5 corresponds to one three-dimensional wiring section 12. In the examples of FIG. 1, FIG. 2A, FIG. 2B, etc., a plurality of three-dimensional wiring sections 12 are formed, and each three-dimensional wiring section 12 is disposed at a position corresponding to each of the connection terminals 5.

[0025] The materials of the first terminal 9, the second terminal 10, and the wiring 11 are not particularly limited, and may be, for example, copper, silver, gold, or the like.

[0026] (First terminal 9) The first terminal 9 is formed outside the installation area of ​​the display panel 3. In the example of Fig. 1 etc., the first terminal 9 is formed on the resin molded circuit board 2 outside a recess 13 described below. There are no particular limitations on the shape and size of the first terminal 9 as long as the bonding wire 4 can be connected by a wire bonding method.

[0027] A plurality of first terminals 9 are formed in accordance with the connection terminals 5 of the display panel 3. The arrangement of the first terminals 9 corresponds to the arrangement of the connection terminals 5 of the display panel 3. In the examples of FIGS. 1, 2A, 4A, and 5A, the first terminals 9 are arranged so as to face the connection terminals 5 of the display panel 3.

[0028] 2A, the first terminals 9 are disposed on one main surface 2a of the resin molded circuit board 2 at positions facing each of two opposing sides of the display panel 3. However, this does not prohibit the first terminals 9 from being formed at a position facing one side of the display panel 3. Similarly, it does not prohibit the first terminals 9 from being formed at positions facing each of three or four sides of the display panel 3.

[0029] 2A and 4A, the first terminals 9 are arranged in a row, but this does not limit the arrangement of the first terminals 9. For example, as shown in Fig. 5A, the arrangement of the first terminals 9 may be a staggered arrangement. When the arrangement of the first terminals 9 is a staggered arrangement, it is possible to form a state in which the arrangement of the first terminals 9 is formed in multiple rows (two rows in the example of Fig. 5A).

[0030] (Second terminal 10) A plurality of second terminals 10 are formed in accordance with the first terminals 9. In the examples of Figs. 2B and 4B, the second terminals 10 are aligned in a line in a plan view of the display panel 3, but this does not limit the arrangement of the second terminals 10. For example, as shown in Fig. 5B, the arrangement of the second terminals 10 may be a staggered arrangement. When the arrangement of the second terminals 10 is a staggered arrangement, a state in which the arrangement of the second terminals 10 is formed in a plurality of rows (two rows in the example of Fig. 5B) can be formed. The shape and size of the second terminals 10 are not particularly limited as long as a predetermined electronic component such as an FPC can be connected to the second terminals 10.

[0031] (Wiring 11) 1, 3, 4A, 5A, etc., the wiring 11 is formed on the end surface 2c of the resin molded circuit board 2 and crosses the end surface 2c of the resin molded circuit board 2 in its thickness direction (the direction of the arrow Z in FIG. 1). In FIG. 4A, an end of the wiring 11 on one main surface 2a extends from the end surface 2c of the resin molded circuit board 2 onto the main surface 2a toward the first terminal 9 and is connected to the first terminal 9, and an end of the wiring 11 on the other main surface 2b is connected to the second terminal 10.

[0032] In addition, the wiring 11 is not limited to the above example as long as it is formed on the surface of the resin molded circuit board 2, one end is connected to the first terminal 9, and the other end is connected to the second terminal 10. For example, depending on the positions of the first terminal 9 and the second terminal 10, the wiring 11 may have a structure as shown in the example of wiring 11a in FIG. 5A and FIG. 5B. In the example of FIG. 5B, the wiring 11a is formed on the end surface 2c of the resin molded circuit board 2. Furthermore, the end of the wiring 11a on one main surface 2a side extends from the end surface 2c of the resin molded circuit board 2 toward the first terminal 9 on the one main surface 2a and connects to the first terminal 9. Then, the end of the wiring 11a on the other main surface 2b side extends from the end surface 2c of the resin molded circuit board 2 toward the second terminal 10 on the other main surface 2b and connects to the second terminal 10.

[0033] As described above, the first terminal 9, the second terminal 10, and the wiring 11 forming the three-dimensional wiring portion 12 are formed along the surface of the resin molded circuit board 2. As the resin molded circuit board 2 on which such a three-dimensional wiring portion 12 is formed, a MID (Molded Interconnect Device; molded circuit component) can be suitably used. Examples of a method for manufacturing an MID include a one-shot molding method (one-shot method) and a two-shot molding method (two-shot method). By using such a method, a board can be manufactured on which a circuit structure corresponding to the three-dimensional wiring portion 12 is formed along the surface of an injection-molded resin molded board. Then, the board becomes the resin molded circuit board 2.

[0034] By forming the three-dimensional wiring section 12 on the surface of the resin molded circuit board 2, it becomes possible to arrange the wiring 11 that connects the two terminals (the first terminal 9 and the second terminal 10) formed on the different main surfaces 2a and 2b to each other, avoiding the interior of the board on which the display panel 3 is attached. This makes it possible to simultaneously suppress the formation of vias and the occurrence of parasitic capacitance, and to provide the second terminal 10, which serves as a connection part with an FPC or the like, on the other main surface side (the side on which the display panel 3 is not installed).

[0035] The element mounting board 6 of the display panel 3 is fixed onto the resin molded circuit board 2. The fixing position of the element mounting board 6 is determined on one main surface 2a of the resin molded circuit board 2 so that the first terminals 9 and the connection terminals 5 have a predetermined positional relationship with each other.

[0036] 1, the element mounting substrate 6 and the resin molded circuit board 2 are fixed to each other via an adhesive layer 16 made of a die bond. The die bond is not particularly limited as long as it is an adhesive that can bond the element mounting substrate 6 of the display panel 3 to the resin molded circuit board 2.

[0037] (Recess 13) The resin molded circuit board 2 shown in the examples of Figures 1 and 3 has a recess 13 having a bottom surface 14 and a wall portion 15 formed on the first terminal forming surface side (one of the main surfaces 2a side). The resin molded circuit board 2 is formed in a stepped shape by the recess 13 and an outer portion of the recess 13. The recess 13 may be formed in a sunken shape with the wall portion 15 formed so as to surround the entire periphery of the bottom surface 14, or may be formed in a groove shape.

[0038] In the display module 1a according to the first embodiment, the display panel 3 is placed on the resin molded circuit board 2 with the bottom surface of the element mounting board 6 facing the recess 13 of the resin molded circuit board 2.

[0039] 1 and 3, with the display panel 3 fixed to the resin molded circuit board 2, a gap is formed between the wall portion 15 of the resin molded circuit board 2 and the end face of the display panel 3, and the gap is filled with a sealing resin described below, forming a part of the sealing portion 17 in the gap. The display module 1a is not limited to this example, and may be one in which no gap is formed.

[0040] In the display module 1a, with the display panel 3 fixed to the resin molded circuit board 2, it is preferable that the position of the front surface of the first terminal 9 (position P2 in Figs. 1 and 3) is higher than the position of the rear surface of the element mounting substrate 6 of the display panel 3 (position P1 in Figs. 1 and 3) in the height direction based on the bottom surface (the other main surface 2b) of the resin molded circuit board 2. In this case, as shown in Fig. 1, the distance from the connection terminal 5 of the display panel 3 to the first terminal 9 can be made shorter, and the length of the bonding wire 4 can be made shorter. In addition, the bonding wire 4 is sealed with a sealing portion 17 described later, and according to such a display module 1a, the amount of sealing resin used to form the sealing portion 17 can be reduced. Note that the height is defined as the height when the thickness direction of the resin molded circuit board 2 (the direction of the arrow Z in Figs. 1 and 3) is taken as the up-down direction.

[0041] (Bonding wire 4) The first terminal 9 and the connection terminal 5 are connected (wire-bonded connection) by a bonding wire 4 using a wire bonding method. The material of the bonding wire 4 is not particularly limited, and gold, silver, aluminum, etc. can be used. The wire bonding method is not particularly limited, and for example, a wedge bonding method or a ball bonding method can be used. In the example of FIG. 1, a ball portion 4a is formed at the connection end of the bonding wire 4 on the connection terminal 5 side, and a wedge portion 4b is formed at the connection end of the bonding wire 4 on the first terminal 9 side, using the wire bonding method.

[0042] In the display module 1a, the bonding wires 4 are sealed with a sealing resin such as an epoxy resin while the first terminals 9 and the connection terminals 5 are joined together. At this time, the portion sealed with the sealing resin forms a sealing portion 17. The sealing portion 17 can prevent the bonding wires 4 from being exposed to the outside, thereby protecting the bonding wires 4.

[0043] In the example of FIG. 1, the display module 1a is not connected to a flexible printed circuit (FPC) 18, which will be described later. In this type of display module 1a, the second terminal 10 can be used as a terminal of a land grid array (LGA). In this case, the display module 1a can be used specifically by mounting it on an electronic component having a socket corresponding to the LGA. In addition, such a display module 1a is less likely to have shape variations according to the shape of the FPC, making it easier to standardize the component shapes.

[0044] The display module 1a may be provided with an FPC 18 as shown in the example of Fig. 3. Note that in the display modules of the second and fourth embodiments described below, the FPC 18 may or may not be connected.

[0045] (FPC18) In the display module 1a shown in FIG. 3, a flexible printed circuit board (Flexible Printed Circuits; FPC) 18 is electrically connected to the second terminal 10. The method of connecting the FPC 18 and the second terminal 10 is not particularly limited. A connection terminal electrically connected to the circuit of the FPC 18 is formed on the surface of the FPC 18. In the example of FIG. 3, a conductive protrusion (bump 19) is formed as the connection terminal. The bump 19 is electrically connected to the second terminal 10, so that the FPC 18 and the second terminal 10 are electrically connected. For example, a method of connecting the bump 19 and the second terminal 10 includes a method of using an anisotropic conductive film (ACF) 20 made of a resin film containing conductive particles. This method can be carried out, for example, as follows. The other main surface 2b and the surface of the FPC 18 on which the bumps 19 are formed are placed opposite each other so that the FPC 18 faces the second terminals 10 of the resin molded circuit board 2, and the ACF 20 is interposed between the other main surface 2b and the surface of the FPC 18 on which the bumps 19 are formed. At this time, the resin molded circuit board 2 and the FPC 18 are aligned so that the second terminals 10 face the bumps 19 via the ACF 20. Then, the resin molded circuit board 2, the ACF 20, and the FPC 18 are pressure-bonded to each other, so that the second terminals 10 and the bumps 19 are electrically connected via the conductive particles contained in the ACF 20. Among the bumps 19 of the FPC 18, the bumps 19a formed at predetermined positions other than the connection area with the resin molded circuit board 2 are electrically connected to a drive board (not shown) which is a main board for controlling the drive of the display module 1a and the like.

[0046] (Reinforcement part 21) In the display module 1a, it is preferable that at least the end surface 2c of the resin molded circuit board 2 is covered with resin to form a reinforcing portion 21. When the reinforcing portion 21 is formed, it is possible to prevent the wiring 11 from being exposed to the outside, and it is possible to protect the wiring 11.

[0047] In the display module 1a according to the first embodiment, the second terminal 10 is provided on the other main surface 2b of the resin molded circuit board 2, so that the area for connecting the FPC 18 is formed on the non-installation surface side (the other main surface 2b side) of the display panel 3, and even if the terminal connection area for connecting the second terminal 10 and the FPC 18 is increased in area, it is possible to ensure the area of ​​the terminal connection area while ensuring the image display area R. Therefore, according to the display module 1a, it is possible to suppress restrictions on the image display area R caused by an increase in the area of ​​the terminal connection area.

[0048] Moreover, according to the display module 1a, the second terminal 10 of the main surfaces 2a, 2b of the resin molded circuit board 2 is formed on the non-mounting surface side of the display panel 3, so that the display module 1a can be made smaller. Furthermore, since the display module 1a has the three-dimensional wiring section 12 formed along the surface of the resin molded circuit board 2, the process of forming a via for connecting the first terminal 9 and the second terminal 10 can be omitted, and the parasitic capacitance can be suppressed.

[0049] [2. Second embodiment] In the display module 1a according to the first embodiment, the resin molded circuit board 2 is formed in a stepped shape, but as shown in the display module 1b of the example of FIG. 6, the resin molded circuit board 2 may have a flat plate shape (second embodiment). This can be achieved by avoiding the formation of a recess 13 in the resin molded circuit board 2. FIG. 6 is a cross-sectional view for explaining the display module 1b according to the second embodiment.

[0050] In the display module 1b according to the second embodiment, the resin molded circuit board 2 has a flat plate shape, and with the display panel 3 arranged on the resin molded circuit board 2, the position of the front surface of the first terminal 9 (position P2 in FIG. 6) is located at substantially the same height as the position of the rear surface of the element mounting board 6 of the display panel 3 (position P1 in FIG. 6) in the height direction based on the other main surface 2b of the resin molded circuit board 2. Note that "substantially the same" as used here includes the cases where they are completely the same and the cases where they are roughly the same. According to such a display module 1b, it is possible to simplify the three-dimensional structure of the resin molded circuit board 2, and it becomes possible to further reduce manufacturing costs.

[0051] [3. Third embodiment] In the display module 1a according to the first embodiment, the FPC 18 is electrically connected to the second terminal 10 of the resin molded circuit board 2 at a predetermined position, and the drive board is connected by bumps 19a formed at other predetermined positions except the connection area with the resin molded circuit board 2, but this is not limited thereto. That is, as shown in the example of the display module 1c in FIG. 7, other electronic components and integrated circuits of the display module may be further connected to the FPC 18 (third embodiment). In the explanation of the third embodiment, these "other electronic components and integrated circuits of the display module" are referred to as FPC-mounted components 22.

[0052] Examples of the FPC-mounted component 22 include a microcomputer, a display driver integrated circuit (DDIC), a chip capacitor (CR), and a timing controller (TCON). The FPC-mounted component 22 is preferably an electronic component or an integrated circuit mounted on a drive board. In this case, the degree of freedom in the wiring design of the drive board and the degree of freedom in the layout design of the FPC-mounted component 22 are improved, making it easier to miniaturize the drive board and the electronic device in which the drive board is mounted.

[0053] In the display module 1c according to the third embodiment, the surface of the FPC 18 to which the FPC mounted component 22 is connected and the surface to which the resin molded circuit board 2 is connected (sometimes referred to as the connection surface or the front surface) may be the same or different, but as in the example of Fig. 7, it is preferable that the FPC mounted component 22 is connected to the surface (sometimes referred to as the non-connection surface or the back surface) opposite to the surface to which the resin molded circuit board 2 is connected. By mounting the FPC mounted component 22 on the back surface of the FPC 18, the display module 1c can be efficiently downsized, and it becomes easier to further efficiently downsize electronic devices and the like incorporating the display module 1c.

[0054] [4. Fourth embodiment] As shown in the example of a display module 1d in Figures 8A and 8B, a resin molded circuit board 2 having a recess 13 that forms a stepped shape is used, and a dustproof panel 23 may be provided on one main surface 2a of the resin molded circuit board 2 so as to cover the image display area R of the display panel 3 (fourth embodiment).

[0055] As the dustproof panel 23, for example, a light-transmitting substrate such as a glass substrate having a size sufficient to cover the recess 13 of the resin molded circuit board 2 can be used.

[0056] The dustproof panel 23 is provided on the resin molded circuit board 2 via a fixed seal part 24 formed of, for example, a fixed seal material. As the fixed seal material, a resin having adhesiveness to both the resin molded circuit board 2 and the dustproof panel 23 can be preferably used.

[0057] The depth of recess 13 in resin molded circuit board 2 (the difference in height between the outer periphery of recess 13 and bottom surface 14 of recess 13) is not particularly limited, but from the viewpoint of being able to more reliably provide dustproof panel 23 on resin molded circuit board 2, it is preferable that it is equal to or greater than the thickness of display panel 3. From the viewpoint of being able to seal the space within recess 13 without gaps with fixed seal part 24, dustproof panel 23, and resin molded circuit board 2, it is preferable that recess 13 be formed in a sunken shape with wall part 15 formed so as to surround the entire periphery of bottom surface 14.

[0058] In the display module 1d according to the fourth embodiment, it is preferable that the sealing resin protecting the bonding wires 4 also serves as a fixed sealant from the viewpoint of simplifying the structure of the display module 1d. Specifically, for example, a sealing resin is provided so as to seal the bonding wires 4 and surround the entire periphery of the recess 13, and a dustproof panel 23 is disposed and fixed on the sealing resin. At this time, as shown in Figs. 8A and 8B, the sealing portion 17 also serves as a fixed seal portion 24.

[0059] According to the display module 1d of the fourth embodiment, the dustproof panel 23 is provided, and therefore the combined structure of the dustproof panel 23 and the resin molded circuit board 2 can function as a member for casing the display panel 3.

[0060] 8A, the display panel 3 is provided with a protective substrate 7, but in the display module 1d according to the fourth embodiment, the protective substrate 7 does not have to be provided on the element mounting substrate 6 of the display panel 3 as shown in FIG. 8B. In this case, the dustproof panel 23 of the resin molded circuit board 2 also functions as the protective substrate 7 of the display panel 3.

[0061] [5. Fifth embodiment] As shown in the example of a display module 1e in FIG. 9, the display module may have two device modules (a first device module 25a and a second device module 25b) and further have two FPCs 18, 18 (fifth embodiment).

[0062] The device modules (first device module 25a, second device module 25b) to which the FPC 18 is connected each have a structure similar to that of the display module 1a according to the first embodiment to which the FPC 18 is connected.

[0063] That is, the first device module 25a and the second device module 25b each have a first terminal 9 on one main surface 2a and a second terminal 10 on the other main surface 2b, and each have a resin molded circuit board 2 having wiring 11 formed on its surface connecting the first terminal 9 and the second terminal 10, a display panel 3 having a connection terminal 5, and a bonding wire 4 connecting the first terminal 9 and the connection terminal 5.

[0064] Furthermore, in each of the first device module 25a and the second device module 25b, an FPC 18 is electrically connected to the second terminal 10. The method of connecting the second terminal 10 to the FPC 18 is the same as in the first embodiment.

[0065] In the display module 1e, a three-dimensional wiring section 12 is formed by a first terminal 9, a second terminal 10, and wiring 11, and this three-dimensional wiring section 12 is formed along the surface of a resin molded circuit board 2. As the resin molded circuit board 2 on which the three-dimensional wiring section 12 is formed, an MID can be suitably used, as in the first embodiment.

[0066] The FPCs 18, 18 connected to the first device module 25a and the second device module 25b are bonded to each other at predetermined positions on the non-connection surfaces (rear surfaces) of the device modules 25. There is no particular limitation on the method of bonding the FPCs 18, 18. In the example of Fig. 9, the FPCs are connected via an adhesive layer 39 formed from an adhesive.

[0067] According to the display module 1e of the fifth embodiment, it is possible to realize a double-sided integrated module structure in which the display panels 3 are arranged on both sides of the FPC 18. Moreover, in the display module 1e, the second terminals 10 are located on the other main surface 2b of the resin molded circuit board 2, so that the double-sided integrated module structure as a whole can be made compact. Moreover, a VR (Virtual Reality) lens can be formed using this display module 1e.

[0068] [6. Sixth embodiment] In the above-mentioned fifth embodiment, two device modules (a first device module 25a and a second device module 25b) each having a display panel 3 are provided. However, as shown in the example of a display module 1f in FIG. 10, a functional module 26 described below may be provided instead of the display panel 3 of the second device module 25b in the fifth embodiment (sixth embodiment).

[0069] The display module 1f has, as device modules, a first device module 25c and a second device module 25d.

[0070] (First device module 25c) The first device module 25c has a first resin molded circuit board 27, a first bonding wire 28, and a display panel 35. The first resin molded circuit board 27, the first bonding wire 28, and the display panel 35 are similar to the resin molded circuit board 2, the bonding wire 4, and the display panel 3 of the first device module 25a according to the fifth embodiment.

[0071] That is, in the first device module 25c, the first resin molded circuit board 27 has a first terminal 31 formed on one main surface 27a and a second terminal 32 formed on the other main surface 27b, and has a first wiring 33 formed on the surface, connecting the first terminal 31 and the second terminal 32. The first terminal 31, the second terminal 32, and the first wiring 33 form a three-dimensional wiring section 34. As in the fifth embodiment, an MID can be suitably used as the first resin molded circuit board 27 on which the three-dimensional wiring section 34 is formed.

[0072] 10, similarly to the fifth embodiment, the display panel 35 has a first connection terminal 36, is disposed on one main surface 27a of the first resin molded circuit board 27, and is fixed to the first resin molded circuit board 27 via an adhesive layer 40. In addition, in FIG. 10, reference numerals 52 and 53 denote a device mounting board and a protection board.

[0073] Similar to the fifth embodiment, the first bonding wire 28 connects the first terminal 31 and the first connection terminal 36 by wire bonding, and is sealed with a sealing portion 47 made of a sealing resin.

[0074] A first FPC 37 is electrically connected to the second terminal 32 of the first device module 25c on the other main surface 27b side of the first resin molded circuit board 27. The first FPC 37 is the same as the FPC 18 described above. The method of connecting the second terminal 32 to the first FPC 37 may be the same as in the fifth embodiment. In the example of FIG. 10, the second terminal 32 is connected to the bump 55 of the first FPC 37 via the ACF 54.

[0075] (Second device module 25d) The second device module 25d has a second resin molded circuit board 29, second bonding wires 30, and a functional module 26. The second resin molded circuit board 29 and the second bonding wires 30 are similar to the resin molded circuit board 2 and the bonding wires 4 of the second device module 25b according to the fifth embodiment.

[0076] In the second device module 25d, the second resin molded circuit board 29 has a third terminal 41 formed on one main surface 29a and a fourth terminal 42 formed on the other main surface 29b, and also has a second wiring 43 formed on the surface, connecting the third terminal 41 and the fourth terminal 42. The third terminal 41, the fourth terminal 42, and the second wiring 43 form a three-dimensional wiring portion 44. As in the resin molded circuit board 2 of the fifth embodiment, an MID can be suitably used as the second resin molded circuit board 29 on which the three-dimensional wiring portion 44 is formed.

[0077] The functional module 26 is a module equipped with electronic circuits that perform functions other than those of the display panel 3. An example of the functional module 26 is an image sensor. An example of the image sensor is a complementary metal-oxide-semiconductor (CMOS) image sensor. For example, a CMOS image sensor has a configuration in which a large number of imaging elements are arranged in a sensor region defined on a substrate, and the imaging elements are electrically connected to a second connection terminal 38 described later.

[0078] The functional module 26 has a second connection terminal 38, is disposed on one main surface 29a of the second resin molded circuit board 29, and is fixed to the second resin molded circuit board 29 via an adhesive layer 45. It is preferable that the second connection terminal 38 of the functional module 26 has a structure and an arrangement pattern similar to that of the connection terminal 5 of the display panel 3 described above, so that the second resin molded circuit board 29 and the first resin molded circuit board 27 can be made common.

[0079] Similar to the fifth embodiment, the second bonding wire 30 connects the third terminal 41 and the second connection terminal 38 by wire bonding, and is sealed with a sealing portion 48 made of a sealing resin.

[0080] A second FPC 46 is electrically connected to the fourth terminal 42 of the second device module 25d on the other main surface 29b side of the second resin molded circuit board 29. The second FPC 46 is the same as the FPC 18 described above. The method of connecting the fourth terminal 42 to the second FPC 46 may be the same as the method of connecting the second terminal 10 to the FPC 18 in the fifth embodiment. In the example of FIG. 10, the fourth terminal 42 is connected to the bump 56 of the second FPC 46 via the ACF 54.

[0081] In the display module 1f, the surface (rear surface) of the first FPC 37 that is not connected to the first device module 25c and the surface (rear surface) of the second FPC that is not connected to the second device module 25d are bonded to each other. There is no particular limitation on the method of bonding the first FPC 37 and the second FPC 46. In the example of Fig. 10, they are connected via an adhesive layer 51 formed of an adhesive.

[0082] In addition, in the display module 1f, as in the first to fifth embodiments, it is preferable from the viewpoint of protecting the first wiring 33 and the second wiring 43 that at least the end faces of the first resin molded circuit board 27 and the second resin molded circuit board 29 are coated with resin to form reinforcing portions 49, 50.

[0083] According to the display module 1f of the sixth embodiment, as in the fifth embodiment, a double-sided integrated module structure in which display panels are arranged on both sides of the FPC can be realized, and the double-sided integrated module structure as a whole can be easily miniaturized. In addition, an AR (Augmented Reality) lens can be formed using this display module 1f.

[0084] [7.Electronic equipment] The display module according to any one of the above-described embodiments is incorporated into various electronic devices as, for example, a microdisplay module, and is particularly suitable for small displays that require high resolution and are used in a magnified state near the eyes, such as electronic viewfinders for video cameras and single-lens reflex cameras, or head-mounted displays.

[0085] (Example 1) 11A and 11B show an example of the external appearance of a digital still camera 310. This digital still camera 310 is a lens-interchangeable single-lens reflex type, and has an interchangeable photographing lens unit (interchangeable lens) 312 approximately in the center of the front of a camera main body (camera body) 311, and a grip part 313 for the photographer to hold on the left side of the front.

[0086] A monitor 314 is provided at a position shifted leftward from the center on the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition. A display module according to any of the above-mentioned embodiments can be incorporated into the electronic viewfinder 315. This allows the digital still camera 310 to be made even more compact.

[0087] (Example 2) FIG. 12 shows an example of the appearance of the head mounted display 320. The head mounted display 320 has, for example, ear hooks 322 on both sides of a glasses-shaped display unit 321 for wearing on the user's head. The display unit 321 can incorporate a display module according to any of the above-mentioned embodiments. When the display module 1e of the fifth embodiment is incorporated in the display unit 321 as described above, the head mounted display 320 can be a VR glass, and when the display module 1f of the sixth embodiment is incorporated in the display unit 321, the head mounted display 320 can be an AR glass. By incorporating a display module according to any of the above-mentioned embodiments in the head mounted display 320, the head mounted display 320 can be made smaller.

[0088] For example, when the head mounted display 320 is a VR (Virtual Reality) glass, as shown in VR glass 320a in FIG. 13, the display module 1e is arranged in the center, mirrors 400 are provided on the left and right, and the head mounted display 320 is configured so that the image projected on the display panel 3 travels in the direction of arrow L1, is reflected by the mirror 400 in the direction of arrow L2, and enters the eyes of the user U. FIG. 13 is a schematic diagram for explaining an example of the VR glass. In the example of the VR glass 320a in FIG. 13, the mirror 400 is used so that the image is sent to the eyes of the user U, but a half-mirror type prism may be provided instead of or together with the mirror 400.

[0089] The above provides a specific description of embodiments of the present disclosure and examples of electronic devices using the same. However, the present disclosure is not limited to the above-described embodiments and examples of electronic devices using the same, and various modifications based on the technical ideas of the present disclosure are possible.

[0090] For example, the configurations, methods, processes, shapes, materials, and numerical values, etc., given in the above-described embodiments and examples of electronic devices using the same are merely examples, and different configurations, methods, processes, shapes, materials, and numerical values, etc., may be used as necessary.

[0091] Furthermore, the configurations, methods, processes, shapes, materials, numerical values, etc. given in the above-described embodiments and examples of electronic devices using the same can be combined with each other without departing from the spirit of this disclosure.

[0092] Unless otherwise specified, the materials exemplified in the above-mentioned embodiments may be used alone or in combination of two or more.

[0093] It should be noted that the contents of the present disclosure should not be construed as being limited to the effects exemplified in the present disclosure.

[0094] The present disclosure may also have the following configurations. (1) A resin molded circuit board having a first terminal on one main surface side and a second terminal on the other main surface side, and wiring formed on a surface thereof to connect the first terminal and the second terminal; a display panel having connection terminals and disposed on the one main surface of the resin molded circuit board; A display module having a bonding wire connecting the first terminal and the connection terminal. (2) The display module according to (1) above, wherein an FPC is disposed on the other main surface side of the resin molded circuit board, and the FPC is electrically connected to the second terminal. (3) The display module according to (1) above, wherein the second terminal is a terminal of an LGA (land grid array). (4) Two device modules each including a resin molded circuit board having a first terminal on one main surface side and a second terminal on the other main surface side, and wiring formed on a surface thereof connecting the first terminal and the second terminal, a display panel having a connection terminal and disposed on the one main surface of the resin molded circuit board, and bonding wires connecting the first terminal and the connection terminal, an FPC is disposed on the other main surface side of the resin molded circuit board in each of the device modules, and each of the FPCs is electrically connected to the second terminal; A display module in which each of the FPCs is bonded to a device module at a non-connecting surface thereof. (5) a first device module including: a first resin molded circuit board having a first terminal on one main surface side and a second terminal on the other main surface side, and having a first wiring formed on a surface thereof connecting the first terminal and the second terminal; a display panel having a first connection terminal and being placed on the one main surface of the first resin molded circuit board; and a first bonding wire connecting the first terminal and the first connection terminal; a second resin molded circuit board having a third terminal on one main surface side and a fourth terminal on the other main surface side, and a second wiring formed on a surface thereof for connecting the third terminal and the fourth terminal; a functional module having a function different from that of the display panel, having a second connection terminal, and being disposed on the one main surface of the second resin molded circuit board; and a second device module having a second bonding wire connecting the third terminal and the second connection terminal; in the first device module, a first FPC is disposed on the other main surface side of the first resin molded circuit board and is electrically connected to the second terminal; in the second device module, a second FPC is disposed on the other main surface side of the second resin molded circuit board and is electrically connected to the fourth terminal; A display module in which a surface of the first FPC that does not connect to the first device module and a surface of the second FPC that does not contact the second device module are bonded to each other. (6) The resin molded circuit board has a stepped shape, The first terminal is formed at a position higher than a mounting surface of the display panel. A display module according to any one of (1) to (5) above. (7) The resin molded circuit board has a flat plate shape, The first terminal is formed at the same height as a mounting surface of the display panel. A display module according to any one of (1) to (5) above. (8) The first resin molded circuit board has a stepped shape, The first terminal is formed at a position higher than a mounting surface of the display panel. A display module as described in (6) above. (9) The first resin molded circuit board has a flat plate shape, The first terminal is formed at the same height as a mounting surface of the display panel. A display module according to any one of (6) above. (10) The display module according to any one of (1) to (9) above, wherein the display panel is an OLED display, an LCOS display, or an LED display. (11) A plurality of connection terminals are arranged along at least one side of the outer periphery of the display panel, A display module described in any one of (1) to (5) above, wherein the resin molded circuit board has a plurality of three-dimensional wiring sections formed from the first terminals, the second terminals, and wiring, and each three-dimensional wiring section is arranged at a position corresponding to each of the connection terminals. (12) A plurality of first connection terminals are arranged along at least one side of the outer periphery of the display panel, The display module described in (6) above, wherein the first resin molded circuit board has a plurality of three-dimensional wiring sections formed from the first terminal, the second terminal, and the first wiring, and each three-dimensional wiring section is arranged at a position corresponding to each of the first connection terminals. (13) The first terminal is formed in plurality and is arranged in a row or a staggered pattern. A display module according to any one of (1) to (5) above. (14) The second terminals are arranged in a row or a staggered pattern. A display module according to any one of (1) to (5) above. (15) An electronic device comprising a display module according to any one of (1) to (17) above. [Explanation of symbols]

[0095] 1a, 1b, 1c, 1d, 1e, 1f Display Module 2. Resin molded circuit board 2a, 2b main surface 3 Display Panel 4 Bonding Wire 5 Connection terminal 5a Pad 6 Element mounting board 7 Protection Board 8 Frame 9 First Terminal 10 Second Terminal 11 Wiring 12 Three-dimensional wiring section 13 Recess 14 Bottom 15 Wall 16 Adhesive layer 17 Sealing part 18 FPC 19, 19a Bump 20 ACF 21 Reinforcement 22 FPC mounting parts 23 Dustproof Panel 24 Fixed seal part 25a, 25c First device module 25b, 25d Second device module 26 Functional Modules 27 First resin molded circuit board 27a, 27b main surface 28 First Bonding Wire 29 Second resin molded circuit board 29a, 29b main surface 30 Second Bonding Wire 31 First Terminal 32 Second Terminal 33 First Wire 34 Three-dimensional wiring section 35 Display Panel 36 First connection terminal 37 First FPC 38 Second connection terminal 39 Adhesive layer 40 Adhesive layer 41 Third Terminal 42 Fourth Terminal 43 Second Wiring 44 Three-dimensional wiring section 45 Adhesive layer 46 Second FPC 47, 48 Sealing part 49, 50 Reinforcement 51 Adhesive layer 52 Element mounting board 53 Glass Substrate 54 ACF 55, 56 Bump

Claims

1. a resin molded circuit board having a first terminal formed on one main surface side and a second terminal formed on the other main surface side, and wiring formed on a surface thereof for connecting the first terminal and the second terminal; a display panel having connection terminals and disposed on the one main surface of the resin molded circuit board; a bonding wire connecting the first terminal and the connection terminal; a flexible printed circuit board electrically connected to the second terminal; having the resin molded circuit board is placed on one of the main surfaces of the flexible printed circuit board such that the other main surface of the resin molded circuit board faces one of the main surfaces of the flexible printed circuit board; Display module.

2. The resin molded circuit board is a MID (Molded Interconnect Device). The display module of claim 1 .

3. The second terminal is a terminal of an LGA (land grid array). The display module of claim 1 .

4. A device comprising: Each of the two device modules includes: a device module including: a resin molded circuit board having a first terminal on one main surface side and a second terminal on the other main surface side, and wiring formed on a surface thereof for connecting the first terminal and the second terminal; a display panel having a connection terminal and disposed on the one main surface of the resin molded circuit board; and bonding wires for connecting the first terminal and the connection terminal; a flexible printed circuit board electrically connected to the second terminal; having the resin molded circuit board is placed on one of the main surfaces of the flexible printed circuit board such that the other main surface of the resin molded circuit board faces one of the main surfaces of the flexible printed circuit board; The two device modules are bonded together such that the other principal surfaces of the flexible printed circuit boards face each other. Display module.

5. a first device module including: a first resin molded circuit board having a first terminal on one main surface side and a second terminal on the other main surface side, and having a first wiring formed on a surface thereof for connecting the first terminal and the second terminal; a display panel having a first connection terminal and disposed on the one main surface of the first resin molded circuit board; a first bonding wire connecting the first terminal and the first connection terminal; and a first flexible printed circuit board electrically connected to the second terminal; a second device module including: a second resin molded circuit board having a third terminal on one main surface side and a fourth terminal on the other main surface side, and having a second wiring formed on a surface thereof for connecting the third terminal and the fourth terminal; a functional module having a function different from that of the display panel, having a second connection terminal, and being disposed on the one main surface of the second resin molded circuit board; a second bonding wire connecting the third terminal and the second connection terminal, and a second flexible printed circuit board electrically connected to the fourth terminal; having the first resin molded circuit board is placed on one of the main surfaces of the first flexible printed circuit board such that the other main surface of the first resin molded circuit board faces one of the main surfaces of the first flexible printed circuit board; the second resin molded circuit board is placed on one main surface of the second flexible printed circuit board such that the other main surface of the second resin molded circuit board faces one main surface of the second flexible printed circuit board; the first device module and the second device module are bonded together such that the other main surface of the first flexible printed circuit board faces the other main surface of the second flexible printed circuit board; Display module.

6. The resin molded circuit board has a stepped shape, The first terminal is formed at a position higher than a mounting surface of the display panel.

5. A display module according to claim 1 or 4.

7. The resin molded circuit board has a flat plate shape, The first terminal is formed at the same height as a mounting surface of the display panel.

5. A display module according to claim 1 or 4.

8. The display panel is an OLED display, an LCOS display, or an LED display.

6. A display module according to claim 1, 4 or 5.

9. a plurality of the connection terminals are arranged along at least one side of an outer periphery of the display panel; a plurality of three-dimensional wiring sections each including the first terminal, the second terminal, and the wiring are formed on the resin molded circuit board, and each of the three-dimensional wiring sections is disposed at a position corresponding to each of the connection terminals; 5. A display module according to claim 1 or 4.

10. The first terminals are formed in plurality and arranged in a row or a staggered pattern.

6. A display module according to claim 1, 4 or 5.

11. The second terminals are formed in plurality and arranged in a row or a staggered pattern.

6. A display module according to claim 1, 4 or 5.

12. 6. An electronic device comprising the display module according to claim 1, 4 or 5.

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