Light source module and display device

Abstract

Disclosed is a light source module and a display device including a substrate having a plurality of light-emitting regions arranged in an array, each of which is provided with two light-emitting groups each including a plurality of light-emitting branches arranged in parallel, and two driver chips arranged in parallel between the two light-emitting groups, and single-layer layout wiring disposed on the substrate, which couples the driver chips in the plurality of light-emitting regions to each other and electrically connects the driver chip to the plurality of light-emitting branches in a single light-emitting group.

Description

[Technical field]

[0001] The present invention relates to the field of display technology, and in particular to a light source module and a display device. [Background technology]

[0002] Submillimeter Light Emitting Diode (Mini LED) refers to a light emitting diode with a die (chip) size of 50 to 200 microns. Its application includes Mini LED direct display and display devices using Mini LED backlight. Display devices using Mini LED technology have the advantages of a long life and less burn-in.

[0003] Display devices with Mini LED backlights need to integrate more Mini LEDs, which makes it difficult to make the light source module thinner and generates more heat. Conventionally, there are light source modules based on two or more layers of metal wiring, but this wiring method has problems such as easy short circuits between different metal layers and high costs, and still needs to be improved. Summary of the Invention

[0004] According to the present invention, a light source module and a display device are provided to improve the problems caused by the conventional light source module having two or more layers of metal wiring.

[0005] In order to solve the above problems, according to a first aspect of the present invention, a light emitting device has a plurality of light emitting regions arranged in an array, and each light emitting region is provided with two light emitting groups each including a plurality of light emitting branches arranged in parallel, and a center symmetrical light emitting element is provided between the two light emitting groups. (This means point symmetry. The same applies below.) a substrate configured so that two driver chips are provided in parallel; A light source module is provided, the light source module including: a single-layer layout wiring disposed on the substrate, coupling driving chips in a plurality of the light-emitting regions to each other and electrically connecting the driving chip to a plurality of the light-emitting branches in a single light-emitting group, each of the light-emitting branches including one sub-millimeter light-emitting diode or at least two sub-millimeter light-emitting diodes connected in parallel or in series.

[0006] According to one embodiment of the present invention, each driving chip includes a ground pin, at least one power pin, a plurality of function pins and a plurality of output pins, and the ground pins of the two driving chips located in each of the light-emitting areas are adjacent to each other, and the plurality of output pins are adjacent to the plurality of light-emitting branches in a single light-emitting group.

[0007] According to one embodiment of the present invention, the single-layer layout wiring is configured such that each output pin in each light-emitting area is coupled to one end of one of the light-emitting branches in the same light-emitting area, the other ends of the light-emitting branches in a plurality of the light-emitting areas are coupled to each other, the ground pins in a plurality of the light-emitting areas are coupled to each other, the power supply pins in a plurality of the light-emitting areas are coupled to each other, and the same or corresponding functional pins in a plurality of the light-emitting areas are respectively coupled to each other.

[0008] According to one embodiment of the present invention, the plurality of light-emitting branches are arranged in parallel along a first direction, and the single-layer layout wiring is further configured to form a ground line portion extending along the first direction between the two driving chips, so that the ground pins in the plurality of light-emitting areas are coupled.

[0009] According to one embodiment of the present invention, the single-layer layout wiring is further configured to form two light source line portions each extending along the first direction on one side of the light-emitting group away from the driving chip, so that the light-emitting branches in the multiple light-emitting areas are coupled.

[0010] According to one embodiment of the present invention, the single-layer layout wiring is further configured to form two power supply line portions extending along the first direction between the ground line portion and the light source line portion, respectively, so that the power supply pins in the multiple light-emitting regions are coupled.

[0011] According to one embodiment of the present invention, the single-layer layout wiring is further configured to form a plurality of functional line portions extending along the first direction between the two light-emitting groups, so that identical or corresponding functional pins in a plurality of the light-emitting areas are coupled.

[0012] In order to solve the above problem, according to a second aspect of the present invention, there is provided a substrate having a plurality of light-emitting regions arranged in an array, each of the light-emitting regions being provided with two light-emitting groups each including a plurality of light-emitting branches arranged in parallel, and two driving chips being provided in parallel between the two light-emitting groups; A light source module is provided, the light source module including: a single-layer layout wiring disposed on the substrate, coupling driving chips in the plurality of light-emitting regions to each other and electrically connecting the driving chip to the plurality of light-emitting branches in the single light-emitting group.

[0013] According to one embodiment of the present invention, each driving chip includes a ground pin, at least one power pin, a plurality of function pins and a plurality of output pins, and the ground pins of the two driving chips located in each of the light-emitting areas are adjacent to each other, and the plurality of output pins are adjacent to the plurality of light-emitting branches in a single light-emitting group.

[0014] According to one embodiment of the present invention, the single-layer layout wiring is configured such that each output pin in each light-emitting area is coupled to one end of one of the light-emitting branches in the same light-emitting area, the other ends of the light-emitting branches in a plurality of the light-emitting areas are coupled to each other, the ground pins in a plurality of the light-emitting areas are coupled to each other, the power supply pins in a plurality of the light-emitting areas are coupled to each other, and the same or corresponding functional pins in a plurality of the light-emitting areas are respectively coupled to each other.

[0015] According to one embodiment of the present invention, the plurality of light-emitting branches are arranged in parallel along a first direction, and the single-layer layout wiring is further configured to form a ground line portion extending along the first direction between the two driving chips, so that the ground pins in the plurality of light-emitting areas are coupled.

[0016] According to one embodiment of the present invention, the single-layer layout wiring is further configured to form two light source line portions each extending along the first direction on one side of the light-emitting group away from the driving chip, so that the light-emitting branches in the multiple light-emitting areas are coupled.

[0017] According to one embodiment of the present invention, the single-layer layout wiring is further configured to form two power supply line portions extending along the first direction between the ground line portion and the light source line portion, respectively, so that the power supply pins in the multiple light-emitting regions are coupled.

[0018] According to one embodiment of the present invention, the single-layer layout wiring is further configured to form a plurality of functional line portions extending along the first direction between the two light-emitting groups, so that identical or corresponding functional pins in a plurality of the light-emitting areas are coupled.

[0019] According to one embodiment of the present invention, the two driver chips are arranged symmetrically about the center.

[0020] According to one embodiment of the present invention, each of the light emitting branches includes one sub-millimeter light emitting diode or at least two sub-millimeter light emitting diodes connected in parallel or in series.

[0021] In order to solve the above problem, according to a third aspect of the present invention, there is provided a display device including a display screen and the above light source module connected to the display screen. Effect of the Invention

[0022] According to the light source module and display device of the present invention, the substrate has a plurality of light-emitting regions arranged in an array, and each light-emitting region is provided with two light-emitting groups each including a plurality of light-emitting branches arranged in parallel, and two driving chips are arranged in parallel between the two light-emitting groups, and a single-layer layout wiring is arranged on the substrate, coupling the driving chips in the plurality of light-emitting regions to each other and electrically connecting the driving chip to the plurality of light-emitting branches in the single light-emitting group. This makes it possible to design a chip-driven sub-millimeter light-emitting diode backlight product based on the single-layer metal wiring, for example, the two driving chips are arranged centrally symmetrically, the ground pins of the two driving chips are adjacent to each other, and the plurality of output pins are adjacent to the plurality of light-emitting branches in the single light-emitting group. Compared with the light source module based on two or more layers of metal wiring in the prior art, the present invention can avoid problems such as easy short circuit between different metal layers and high cost, not only realizing product competitiveness, but also reducing costs and improving product yield. [Brief description of the drawings]

[0023] In order to more clearly describe the technical means in the embodiments of the present invention, the following briefly describes the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative efforts.

[0024] [Figure 1] 1 is a schematic diagram showing a circuit of a light source module according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic diagram showing a pin of a driver chip according to a first embodiment of the present invention. [Diagram 3] FIG. 11 is a schematic diagram showing a circuit of a light source module according to a second embodiment of the present invention. [Figure 4] FIG. 11 is a schematic diagram showing a pin of a driver chip according to a second embodiment of the present invention. [Diagram 5]2 is a schematic diagram showing wiring of multiple light source modules for a display device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, the technical means in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments that a person skilled in the art can obtain without paying creative labor are all within the protection scope of the present invention.

[0026] In addition, in the description of this specification, the orientations or positional relationships indicated by terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," etc. are based on the orientations or positional relationships shown in the drawings, and are for the convenience and simplification of the description of the present invention, and do not indicate or imply that the devices or elements shown have a specific orientation or are configured and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0027] It should be noted that in the description of this specification, the terms "first" and "second" are for descriptive purposes only and cannot be understood as indicating or implying a relative importance or the number of technical features being described. Thus, features qualified as "first" and "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more than two unless otherwise limited.

[0028] In this specification, many different embodiments or examples are provided to realize different structures of the present invention. In order to simplify the disclosure of the present invention, components and settings of specific examples are described below. Of course, they are merely examples and do not limit the present invention. In addition, in the present specification, symbols and / or reference characters may be repeated in different examples, but such repetition does not itself indicate a relationship between the various embodiments and / or settings discussed for the purpose of simplicity and clarity. In addition, the examples of various specific processes and materials provided in this specification may allow those skilled in the art to recognize the application of other processes and / or the use of other materials.

[0029] In the display device, the light source module can be designed based on single-layer layout wiring technology, for example, realizing two-row loading of a single data channel, and the light source driving design does not require other peripheral auxiliary devices other than the light emitting unit and the driving chip, as exemplified but not limited to the following:

[0030] According to an embodiment of the present invention, a light source module applicable to various light emitting diode display devices is provided, for example, the light source module can be used in a display device using sub-millimeter light emitting diodes (Mini LEDs) as a backlight source, such as a liquid crystal display device, but is not limited thereto, and the light source module can also be used in a display device using sub-millimeter light emitting diodes as a direct display light source, such as a Mini LED display screen. The light source module can be applied not only to display devices, but also to other products such as lighting fixtures. The light emitting diodes can generate a specific color spectrum, such as red, green, and blue spectrums.

[0031] 1, in the first embodiment of the light source module, the light source module includes a substrate 1, which can be provided with a plurality of light-emitting branches 2, a plurality of driving chips 3, and a single-layer layout wiring 4. In this embodiment, for the sake of simplicity, the light source module can be configured as a surface light source, such as a backlight source or a direct display light source, according to the light-emitting needs of a display device.

[0032] In the following, an embodiment in which the light source module is applied as a backlight module will be described as an example, but the present invention is not limited thereto.

[0033] For example, in one embodiment, as shown in FIG. 1, the substrate 1 may be a glass substrate, a printed circuit board (PCB) substrate, a BT resin substrate, or the like, but is not limited thereto. For example, the substrate 1 may be configured to have a plurality of light-emitting regions M arranged in an array, and each light-emitting region M is provided with two light-emitting groups G, and each light-emitting group G includes a plurality of light-emitting branches 2 arranged in parallel. For example, the plurality of light-emitting branches 2 are arranged in parallel along a first direction (shown as a vertical direction from top to bottom in FIG. 1 as an example). Here, only four light-emitting branches 2 are taken as an example, but are not limited thereto. The light-emitting branches 2 may be at least Each of the light-emitting groups G includes one submillimeter light-emitting diode 21, and the submillimeter light-emitting diodes 21 may be connected in series, parallel, or series-parallel so that the light-emitting branch 2 has one of the following light-emitting forms: 1 light, 2 lights, 4 lights, 6 lights, 8 lights, 10 lights, 12 lights, 14 lights, or 16 lights. Here, only the light-emitting form with two lights is taken as an example, but is not limited to this. Two driving chips 3 may be arranged side by side between the two light-emitting groups G. For example, the two driving chips 3 are arranged side by side vertically between the two light-emitting groups G, and the size of the driving chip 3 is preferably less than 1500*1500 microns (μm), but is not limited to this.

[0034] In one example, as shown in FIG. 2, for example, each driver chip 3 includes 10 pins, pin 30 is a serial output (e.g., SO) pin, pin 31 is a ground (e.g., GND) pin, pin 32 is a spare (e.g., NC) pin, pin 33 is a power supply (e.g., VDD) pin, pin 34 is a serial input (e.g., SI) pin, pins 35, 36, 37, and 38 are four output (e.g., 01, 02, 03, 04) pins, and pin 39 is a data input (e.g., DI) pin, and for example, pins 30 to 34 and pins 35 to 39 are arranged on opposite sides of the driver chip 3, but are not limited thereto.

[0035] In this example, as shown in Figures 1 and 2, each driver chip 3 includes a ground (e.g., GND) pin 31, a power (e.g., VDD) pin 33, multiple function (e.g., SO, SI, DI) pins 30, 34, 39 and multiple output (e.g., 01, 02, 03, 04) pins 35, 36, 37, 38, and the ground (e.g., GND) pins 31 of the two driver chips 3 are adjacent to each other, and the multiple output (e.g., 01, 02, 03, 04) pins 35-38 of a single driver chip 3 are adjacent to the multiple light-emitting branches 2 of a single light-emitting group G.

[0036] In this example, as shown in Figures 1 and 2, the single-layer layout wiring 4 can be configured so that each output (e.g., 01, 02, 03, 04) pin 35, 36, 37, 38 in each light-emitting area M is coupled to one end of one of the light-emitting branches 2 in the same light-emitting area M, the other ends of the light-emitting branches 2 in the multiple light-emitting areas M are coupled to each other, the ground (e.g., GND) pins 31 in the multiple light-emitting areas M are coupled to each other, the power supply (e.g., VDD) pins 33 in the multiple light-emitting areas M are coupled to each other, and the same or corresponding function (e.g., SO, SI or DI) pins 30, 34 or 39 in the multiple light-emitting areas M are coupled to each other, respectively.

[0037] Exemplarily, as shown in FIG. 1, the single-layer layout wiring 4 may be further configured to form a ground line section GND' extending along the first direction (e.g., vertical direction from top to bottom as shown in FIG. 1) between two of the driving chips 3 so that the ground (e.g., GND) pins 31 of the driving chips 3 in a plurality of the light-emitting areas M are coupled, for example, the ground line section GND' includes a first ground segment (a vertical segment shown in the figure) and a plurality of second ground segments (horizontal segments shown in the figure), the first ground segment extending in the first direction between the two of the driving chips 3, and the second ground segment being coupled to the ground (e.g., GND) pin 31 along a second direction (e.g., horizontal direction from left to right as shown in FIG. 1) between the two of the driving chips 3.

[0038] Exemplarily, as shown in FIG. 1, the single-layer layout wiring 4 may be further configured to form two light source line portions VLED extending along the first direction on one side of the light-emitting group G away from the driving chip 3, so as to couple the light-emitting branches 2 in the multiple light-emitting regions M.

[0039] Exemplarily, as shown in FIG. 1, the single-layer layout wiring 4 may be further configured to form two power supply line sections VDD' extending along the first direction between the ground line section GND' and the light source line section VLED, respectively, so as to couple the power supply (e.g., VDD) pins 33 of the driving chips 3 in the multiple light-emitting areas M.

[0040] 1, the single-layer layout wiring 4 may be further configured to form a plurality of function line sections extending along the first direction between the two light-emitting groups, such that the same or corresponding function pins in the plurality of light-emitting regions M are coupled, for example, a data input function line section DI' is coupled to the data input (e.g., DI) pins 39 of all the driver chips 3, the data input function line section DI' may extend and pass through the projection range of the two driver chips 3 on the substrate 1, so that the overall wiring range is reduced, and a serial function line section SR is coupled to the serial output (e.g., SO) pins 30 and the serial input (e.g., SI) pins 34 of all the driver chips 3, such that the serial output (e.g., SO) pins 30 and the serial input (e.g., SI) pins 34 are connected in series with each other. This allows driving two rows of driver chips by one data set.

[0041] As shown in FIG. 1, the two driver chips 3 in the first embodiment are arranged vertically in parallel between the two light-emitting groups G, and the two driver chips 3 are arranged symmetrically about the center. For example, one driver chip 3 is rotated 180 degrees relative to the other driver chip 3 so that the same features of the two driver chips 3 are arranged facing each other or back-to-back in parallel. For example, the two marks (the solid triangular mark and the hollow triangular mark shown in FIG. 1) on the two driver chips 3 are in opposite positions, so that the multiple output (e.g., 01, 02, 03, 04) pins 35-38 of a single driver chip 3 are adjacent to the multiple light-emitting branches 2 of a single light-emitting group G, and the ground (e.g., GND) pins 31 of the two driver chips 3 are adjacent to each other, and the wiring (i.e., the ground line portion GND') coupled to the ground pin can be concentrated between the two driver chips 3, thereby reducing the area occupied by the wiring.

[0042] Also, as shown in FIG. 3, in the second embodiment of the light source module, the light source module includes a substrate 1', and the substrate 1' can be provided with a plurality of light-emitting branches 2', a plurality of driving chips 3' and a single-layer layout wiring 4'. In order to simplify the description, only an example is given in which the light source module can be configured as a surface light source, such as a backlight source or a direct display light source, according to the light-emitting needs of the display device. The substrate 1' and the light-emitting branch 2' in the second embodiment are substantially similar to the embodiment of the substrate 1 and the light-emitting branch 2 in the first embodiment, and the substrate 1' can be configured to have a plurality of light-emitting regions M' arranged in an array, and each light-emitting region M' can be provided with two light-emitting groups G', and each light-emitting group G' includes a plurality of light-emitting branches 2' arranged in parallel, and the implementation content thereof is referred to the above description and will not be described here.

[0043] The difference between the second embodiment and the first embodiment is that, as shown in FIG. 3, in the second embodiment, the two driving chips 3' are arranged side by side horizontally between the two light-emitting groups G', and the two driving chips 3' are arranged symmetrically about the center.

[0044] In one example, as shown in FIG. 4, each driver chip 3' includes 12 pins, pins 30' and 31' are two output (e.g., 01, 02) pins, pins 32' and 37' are power (e.g., VDD) pins, pins 33' and 38' are data input (e.g., DI) pins, pin 34' is a serial output (e.g., SO) pin, pins 35' and 36' are two output (e.g., 03, 04) pins, pin 39' is a serial input (e.g., SI) pin, pin 3a' is a spare (e.g., NC) pin, and pin 3b' is a ground (e.g., GND) pin. For example, pins 30' to 34' and pins 35' to 39' are arranged on both sides (e.g., both top and bottom) of the driver chip 3', and pins 3a' and 3b' are located at both ends (e.g., both left and right ends) of the driver chip 3', but are not limited thereto.

[0045] In this example, as shown in Figures 3 and 4, each driver chip 3' includes a ground (e.g., GND) pin 3b', two power (e.g., VDD) pins 32', 37', multiple function (e.g., DI, SO, SI) pins 33', 34', 38', 39' and multiple output (e.g., 01, 02, 03, 04) pins 30', 31', 35', 36', and the ground (e.g., GND, etc.) pins 3b' of the two driver chips 3' are adjacent to each other, and the multiple output (e.g., 01, 02, 03, 04) pins 30', 31', 35', 36' of a single driver chip 3 are adjacent to the multiple light-emitting branches 2' of a single light-emitting group G'.

[0046] Therefore, as shown in FIG. 3, the single-layer layout wiring 4′ of the second embodiment is slightly different from the single-layer layout wiring 4 of the first embodiment. For example, the single-layer layout wiring 4′ can be further configured to form a plurality of function lines, such as one ground line portion GND″, two light source line portions VLED′, two power supply line portions VDD″, and a data input function line portion DI″ and a serial function line portion SR′, and the wiring method changes the wiring layout form according to the pin positions of the driver chip 3′.

[0047] For example, in this example, as shown in Figures 3 and 4, the single-layer layout wiring 4' can be configured such that each output (e.g., 01, 02, 03, 04) pin 30', 31', 35', 36' in each light-emitting area M' is coupled to one end of one of the light-emitting branches 2' in the same light-emitting area M', the other ends of the light-emitting branches 2' in the multiple light-emitting areas M' are coupled to each other, the ground (e.g., GND) pin 3b' in the multiple light-emitting areas M' are coupled to each other, the power supply (e.g., VDD) pins 32' and 37' in the multiple light-emitting areas M' are coupled to each other, and the same or corresponding function (e.g., DI, SO, SI) pins 33', 34', 38', 39' in the multiple light-emitting areas M' are coupled to each other. This can realize the driving of two rows of driving chips by one data set.

[0048] Several non-limiting examples of the light source module are given below.

[0049] According to one aspect of the present invention, a light source module is provided, comprising: a substrate having a plurality of light-emitting regions arranged in an array, each of which is provided with two light-emitting groups, each of which includes a plurality of light-emitting branches arranged in parallel, and two driver chips arranged in parallel between the two light-emitting groups; and a single-layer layout wiring arranged on the substrate, which couples the driver chips in the plurality of light-emitting regions to each other and electrically connects the driver chip to the plurality of light-emitting branches in the single light-emitting group. Thus, the substrate is provided with a single-layer layout wiring, and the two driver chips are arranged in parallel between the two light-emitting groups, so that each driver chip drives the plurality of light-emitting branches in the single light-emitting group, thereby realizing two-row loading of a single data channel; and the backlight driving design does not require any other peripheral auxiliary devices other than the light-emitting units and the driver chips, which can reduce the number of components used and the layout area, simplify the processing process, and is favorable for reducing costs and improving product yield.

[0050] Optionally, in one embodiment, each driving chip includes a ground pin, at least one power pin, a plurality of function pins and a plurality of output pins, and the ground pins of the two driving chips located in each of the light-emitting areas are adjacent to each other, and the plurality of output pins are adjacent to the plurality of light-emitting branches in the single light-emitting group, so that the ground wiring can be centrally arranged between the two driving chips, which is favorable for reducing the wiring occupation area, reducing costs and improving product yield.

[0051] Optionally, in one embodiment, the single-layer layout wiring is configured such that each output pin in each light-emitting region is coupled to one end of one of the light-emitting branches in the same light-emitting region, the other ends of the light-emitting branches in multiple light-emitting regions are coupled to each other, the ground pins in multiple light-emitting regions are coupled to each other, the power pins in multiple light-emitting regions are coupled to each other, and the same or corresponding function pins in multiple light-emitting regions are coupled to each other, thereby greatly simplifying the layout area occupied by the single-layer wiring and avoiding the easy and high cost of short-circuiting between different metal layers.

[0052] Optionally, in one embodiment, the plurality of light-emitting branches are arranged in parallel along a first direction, and the single-layer layout wiring is further configured to form a ground line portion extending along the first direction between the two driving chips, so that the ground pins in the plurality of light-emitting regions are coupled together, thereby being advantageous in reducing costs and improving product yields through a centralized layout of the ground line.

[0053] Optionally, in one embodiment, the single-layer layout wiring is further configured to form two light source line parts extending along the first direction on one side of the light-emitting group away from the driving chip, so that the light-emitting branches in the plurality of light-emitting regions are coupled together, whereby the two light source line parts are disposed outside the light-emitting branches, thereby avoiding mutual interference between wirings and favoring improvement of product yield.

[0054] Optionally, in one embodiment, the single-layer layout wiring is further configured to form two power supply line parts extending along the first direction between the ground line part and the light source line part, so that the power supply pins in the plurality of light-emitting regions are coupled to each other, whereby the two power supply line parts are disposed on both sides of the ground line part, thereby avoiding mutual interference of wiring power supply, which is advantageous for improving product yield.

[0055] Optionally, in one embodiment, the single-layer layout wiring is further configured to form a plurality of function line parts extending along the first direction between the two light-emitting groups, such that the same or corresponding function pins in the plurality of light-emitting regions are coupled together, whereby the plurality of function line parts are disposed between the two light-emitting groups, and thus the wiring layout can be effectively utilized to provide a redundant space for providing a driving chip, which is advantageous for reducing costs and improving product yields.

[0056] Optionally, in one embodiment, the two driving chips are arranged symmetrically with respect to the center, so that the ground wiring can be centrally laid out through different layout methods of the two driving chips, which is advantageous for reducing costs and improving product yields.

[0057] Optionally, in one embodiment, each of the light emitting branches includes a sub-millimeter light emitting diode or at least two sub-millimeter light emitting diodes connected in parallel or in series, so that the sub-millimeter light emitting diodes can be used as a backlight source for the display device, and the display device has advantages such as a long life and less burn-in.

[0058] According to another aspect of the present invention, a display device is provided, such as a display device using a sub-millimeter light emitting diode as a backlight source or a direct display light source, for example, the display device includes a display screen and the above-mentioned light source module connected to the display screen. The implementation and beneficial effects of the light source module are as described above and will not be described here. For example, the display device may be a liquid crystal display device using the light source module as a backlight source, or alternatively, a Mini LED display screen using the light source module as a direct display light source, but is not limited thereto.

[0059] For example, in one application example, as shown in FIG. 5, the display device includes a plurality of light source modules C and a controller (Bcon) B. In order to simplify the description, only two light source modules (embodiments of the light source modules shown in FIG. 1 and FIG. 2) are described as examples here, but this is not limited thereto, and the above description is also applicable to the light source modules shown in FIG. 3 and FIG. 4.

[0060] Optionally, as shown in FIG. 1, FIG. 2 and FIG. 5, each light source module C has a plurality of light-emitting regions arranged in an array, and each light-emitting region M is provided with two light-emitting groups G including a plurality of light-emitting branches 2 arranged in parallel, and a substrate 1 configured such that two driving chips 3 are provided in parallel between the two light-emitting groups G; and a single-layer layout wiring 4 arranged on the substrate 1 such that a plurality of driving chips 3 in the plurality of light-emitting regions M are coupled to each other to drive a plurality of the light-emitting branches 2 in each single light-emitting group G, and one driving chip 3 among the plurality of driving chips 3 on the substrate 1 of each light source module C is coupled to the controller B.

[0061] 1, 2 and 5, one driver chip 3 on the substrate 1 adjacent to the controller B may be configured to be coupled to the controller B as a specific driver chip 3, for example, two function (e.g., SO, DI) pins 30, 39 of the specific driver chip 3 are coupled to two corresponding pins of the controller B via a part of the single-layer layout wiring 4. Thus, the controller B can control a plurality of driver chips 3 coupled to each other of a plurality of the light source modules C, and the controller B transmits data (e.g., transmits control commands, etc.) to the plurality of driver chips 3 to perform various light source control operations and meet the display needs of the display device.

[0062] According to the light source module and display device of the above embodiments of the present invention, the substrate has a plurality of light-emitting regions arranged in an array, and each light-emitting region is provided with two light-emitting groups, each of which includes a plurality of light-emitting branches arranged in parallel, and two driving chips are provided in parallel between the two light-emitting groups. Single-layer layout wiring is disposed on the substrate to couple the driving chips in the plurality of light-emitting regions to each other and electrically connect the driving chip to the plurality of light-emitting branches in the single light-emitting group.

[0063] Therefore, according to the above embodiment of the present invention, a chip-driven sub-millimeter light emitting diode backlight product can be designed based on a single-layer metal wiring, for example, two driving chips are arranged symmetrically around the center, the ground pins of the two driving chips are adjacent to each other, and a plurality of output pins are adjacent to a plurality of light emitting branches in a single light emitting group. Compared with the light source module based on two or more layers of metal wiring in the prior art, the above embodiment of the present invention can avoid problems such as easy short circuit between different metal layers and high cost, not only to realize product competitiveness, but also to reduce costs and improve product yield.

[0064] The above describes the embodiments of the present invention in detail, and the present specification describes the principles and embodiments of the present invention by applying specific examples. The above description of the embodiments is only to facilitate understanding of the technical means of the present invention and its core idea, and those skilled in the art can still modify the technical means described in each of the above embodiments or replace some of the technical features with equivalents, and it should be understood that these modifications or replacements do not deviate from the essence of the corresponding technical means from the scope of the technical means of each of the embodiments of the present invention.

Claims

1. A substrate having a plurality of light-emitting regions arranged in an array, each of the light-emitting regions being provided with two light-emitting groups each including a plurality of light-emitting branches arranged in parallel, and two driving chips being provided in parallel between the two light-emitting groups; a single-layer layout wiring disposed on the substrate, coupling the driving chips in the plurality of light-emitting regions to each other and electrically connecting the driving chip to the plurality of light-emitting branches in the single light-emitting group; Each driving chip includes a ground pin, at least one power pin, a plurality of function pins and a plurality of output pins, and the ground pins of the two driving chips located in each of the light-emitting areas are adjacent to each other, and the plurality of output pins are adjacent to the plurality of light-emitting branches in a single light-emitting group; Light source module.

2. the single-layer layout wiring is configured such that each output pin in each light-emitting region is coupled to one end of one of the light-emitting branches in the same light-emitting region, the other ends of the light-emitting branches in the plurality of light-emitting regions are coupled to each other, the ground pins in the plurality of light-emitting regions are coupled to each other, the power supply pins in the plurality of light-emitting regions are coupled to each other, and the same or corresponding function pins in the plurality of light-emitting regions are coupled to each other, The light source module according to claim 1 .

3. The plurality of light-emitting branches are arranged in parallel along a first direction, and the single-layer layout wiring is further configured to form a ground line portion extending along the first direction between the two driving chips so that the ground pins in the plurality of light-emitting regions are coupled to each other. The light source module according to claim 1 .

4. The single-layer layout wiring is further configured to form two light source line portions extending along the first direction on one side of the light-emitting group away from the driving chip, so that the light-emitting branches in the plurality of light-emitting regions are coupled together. The light source module according to claim 3 .

5. The single-layer layout wiring is further configured to form two power supply line portions extending along the first direction between the ground line portion and the light source line portion, so that the power supply pins in the plurality of light-emitting regions are coupled to each other. The light source module according to claim 4 .

6. The single-layer layout wiring is further configured to form a plurality of function line portions extending along the first direction between the two light-emitting groups so that the same or corresponding function pins in the plurality of light-emitting areas are coupled to each other. The light source module according to claim 3 .

7. The two driving chips are provided point-symmetrically. The light source module according to claim 1 .

8. each of said light emitting branches includes one sub-millimeter light emitting diode or at least two sub-millimeter light emitting diodes connected in parallel or in series; The light source module according to claim 1 .

9. A display screen and a light source module according to any one of claims 1 to 8 connected to the display screen. Display device.

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