Cooling device for semiconductor switch elements, power inverter device, and arrangement comprising a power inverter device and an electric machine

Abstract

A cooling device (15) for cooling a semiconductor switch element (10, 11), the cooling device (15) comprising: a first wall (17) having a first side (18) for supporting the semiconductor switch element (10, 11) and a second side (19) opposite the first side (18); a second wall (20) having a first side (21) forming a main cooling channel (22) together with the second side (19) of the first wall (17), the second wall (20) having a second side (25) opposite the first side (21) of the second wall (20); and a third wall (23) forming an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), the second wall (20) comprising connecting means (26) for fluidly connecting the auxiliary cooling channel (24) to the main cooling channel (22).

Description

[Technical field]

[0001] The present invention relates to a cooling device for cooling a semiconductor switch element, comprising: a first wall having a first side for supporting the semiconductor switch element and having a second side opposite the first side; and a second wall having a first side forming a main cooling channel together with the second side of the first wall, the second wall having a second side opposite the first side of the second wall.

[0002] Furthermore, the invention relates to a power inverter arrangement and to an arrangement comprising a power inverter arrangement and an electric machine. [Background technology]

[0003] During operation of semiconductor switching elements, for example in a power inverter device supplying an electric machine of an electric drive vehicle, large power losses occur which may cause failure due to overheating of the semiconductor switching elements. It is known to use cooling devices for cooling the semiconductor switching elements. The cooling devices have cooling channels along which a coolant may flow so as to cool the semiconductor switching elements. Here, additional heat sink structures such as pin fins extending into the cooling channels may be used in order to generate turbulence in the coolant and thus a larger heat exchange surface.

[0004] Document US 2004 / 0150956 A1 discloses a heat sink assembly for use in power electronics applications for transferring heat from a heat source comprising a semiconductor die to a cooling medium, the heat sink assembly comprising a base plate, a plurality of heat transfer pins arranged inside the base plate for transferring heat from the heat source to the cooling medium, and a heat exchange assembly having a top mounting part and a cooling channel formed therebetween, the cooling medium being arranged in the cooling channel for absorbing heat.

[0005] However, due to the effect of thermal deposition, the temperature of the coolant at the outlet region of the single cooling channel may be higher than at the inlet region, reducing heat transfer from the outlet semiconductor switch element and causing heat accumulation in the outlet portion of the cooling device. Summary of the Invention

[0006] It is therefore an object of the present invention to provide improved possibilities for cooling semiconductor switching elements in power inverter devices, in particular for driving vehicles.

[0007] According to the present invention, the above mentioned object is achieved by a cooling device as described at the beginning, further comprising a third wall forming an auxiliary cooling channel together with the second side of the second wall, the second wall comprising a connecting means for connecting the auxiliary cooling channel to the main cooling channel in a fluid conducting manner.

[0008] The cooling device according to the invention provides an auxiliary cooling channel, which is thermally decoupled from the semiconductor switch element via a second wall and thus carries a cooler coolant than the main cooling channel. A connecting means allows the coolant to be discharged from the auxiliary cooling channel into the main cooling channel. This causes turbulence in the main cooling channel and / or reduces the temperature of the coolant flow along the main cooling channel, as the coolant flow mixes with the cooler coolant flow from the auxiliary cooling channel. Both the turbulence and the reduced temperature of the coolant allow more heat to be transferred from the semiconductor switch element to the coolant flowing along the main cooling channel. Advantageously, the cooling device according to the invention allows for improved heat dissipation from the semiconductor switch element and / or allows for the elimination of expensive conventional heat sink structures such as pin fins.

[0009] Preferably, the semiconductor switch elements form semiconductor switch element configurations each comprising a half-bridge circuit. The half-bridge circuit may comprise a series connection of two transistor structures, each provided with an anti-parallel diode structure. Typically, three semiconductor switch element configurations may be cooled by a cooling device. Typically, the first wall extends parallel to the second wall and / or the third wall. Preferably, the distance between the second side of the first wall and the first side of the second wall is greater than the distance between the second side of the second wall and the third wall.

[0010] Preferably, said connection means of the cooling device according to the invention are a plurality of through holes. Thereby, the coolant flow flowing along the auxiliary cooling channel can be discharged into the main cooling channel. Preferably, the through holes are arranged in a matrix along the second wall. Each row extends along the flow direction of the coolant flow in the main cooling channel. Preferably, each column comprises at least 5, more preferably at least 10, more preferably at least 15 through holes. Typically, the through holes are arranged in a rectangular or elliptical pattern and / or in a diagonal pattern. The ratio of the diameter of the through holes to the width of the cooling channel is preferably between 1.5% and 10%. Furthermore, the diameters of the through holes may be substantially equal or may be equal. Alternatively, the diameters of the through holes may be different. Preferably, the diameter of the through holes increases or decreases with respect to the flow direction. Thereby, the desired requirements of heat transfer and pressure loss can be met.

[0011] It is further preferred that the through-hole is inclined with respect to a plane parallel to the second wall, preferably with an angle of inclination of at least 10°, more preferably at least 30° and / or at most 80°, more preferably at most 60°.

[0012] The cooling device according to the present invention may further comprise an inlet channel assembly for supplying coolant to said main cooling channel and said auxiliary cooling channel, and an outlet channel for discharging said coolant from said main cooling channel.

[0013] Here, it is preferred that the density of connections between the main and auxiliary cooling channels on the outlet channel side of the connection means is higher than on the inlet channel side of the connection means, since the temperature of the coolant flowing along the main cooling channel typically increases from the inlet channel side to the outlet channel side, by increasing the density of connections, e.g. the density of through holes, on the outlet channel side, the temperature distribution of the coolant flowing along the main cooling channel can be more balanced.

[0014] Further, it is preferred that the connection means is disposed within a section of the second wall extending between the outlet channel end of the second wall and a position between the outlet channel and the inlet channel assembly, and that the second wall may be impermeable to the coolant outside of the section.

[0015] Here, the distance between the outlet channel end of the second wall and the position is at most 60 percent, preferably at most 50 percent, more preferably at most 40 percent of the length of the second wall. In this case, the coolant from the auxiliary cooling channel can be discharged only into the area of ​​the main cooling channel where the coolant flow along the main cooling channel is already heated. This allows for a more balanced heat distribution in the main cooling channel.

[0016] Alternatively, the distance between the outlet channel end of the second wall and the location is at least 60 percent, preferably at least 75 percent, more preferably at least 90 percent of the length of the second wall. If the distance is significantly higher, e.g., greater than 60 percent of the length, the coolant from the auxiliary cooling channel can be discharged into the main cooling channel over a wide area of ​​the main cooling channel. This allows a cooling effect comparable to pin fins or ribbon joints distributed on the second side of the first wall to be achieved without the use of such expensive structures.

[0017] According to a first preferred alternative, the inlet channel assembly comprises a common inlet channel from which the main inlet channel and the auxiliary cooling channels branch off, which may facilitate the integration of the cooling device into the cooling cycle.

[0018] According to a second preferred alternative, the inlet channel assembly comprises a main inlet channel and an auxiliary inlet channel spaced apart from each other, which allows for a higher cooling performance, for example for the integration of the cooling device in a sports vehicle. In particular, the main inlet channel and the auxiliary inlet channel can be or are supplied by separate cooling cycles.

[0019] Typically, the cooling device has a single outlet channel for the main and auxiliary cooling channels.

[0020] Said third wall of the cooling device according to the invention is advantageously formed by the bottom of a cavity formed in a housing element. Typically, the cavity is realized by milling into a metal block or by casting the housing element so as to have a cavity. The housing element may be made of aluminium. Typically, the cavity is well shaped and has at least one bore realising the inlet channel assembly and / or a bore realising the outlet channel. Each bore may be inclined.

[0021] Advantageously, the second wall is formed by a plate-like separation element arranged in a recess of the cavity, which facilitates assembly of the cooling device, since the separation element can be a separate part relative to the housing element. Typically, in order to achieve the weight of the cooling device, the separation element is made of plastic.

[0022] Generally, for a cooling device according to the invention, the first wall may be formed by a base plate, and the semiconductor switch element may be attached to the base plate by soldering.

[0023] According to a first alternative for manufacture, the cooling device comprises a fixing element arranged between the base plate and the separation element, the fixing element being elastically deformed by the base plate when the base plate closes the cavity. According to a second alternative, the cooling device comprises a frame element arranged between the base plate and the separation element, the frame element having a flange connected or connectable to a flange of the housing element by fastening means.

[0024] According to the present invention, the above mentioned object is further achieved by a power inverter device comprising a plurality of semiconductor switch elements and a cooling device for said semiconductor switch elements according to the present invention.

[0025] According to the present invention, the above mentioned object is further solved by an arrangement comprising a power inverter arrangement according to the present invention and an electric machine arranged to drive a vehicle, said power inverter arrangement being arranged to supply said electric machine with power.

[0026] Further details and advantages of the invention are explained in the following embodiments. In the description, reference is made to the attached drawings, which show, in schematic form: [Brief description of the drawings]

[0027] [Figure 1] 1 is a block diagram of an embodiment of an arrangement according to the invention with a first embodiment of a power inverter device according to the invention with a first embodiment of a cooling device according to the invention; [Diagram 2] FIG. 2 is a top view of the first embodiment of the power inverter device. [Diagram 3] FIG. 3 is a longitudinal cross-sectional view of the first embodiment of the power inverter device taken along the plane III-III in FIG. 2; [Figure 4] FIG. 4 is a principle diagram of a second wall of the first embodiment of the cooling device. [Diagram 5]FIG. 2 is a simplified cross-sectional view of a first embodiment of a power inverter device showing main and auxiliary cooling channels. [Figure 6] FIG. 2 is a simplified cross-sectional view of a first embodiment of a power inverter device showing an outlet channel. [Figure 7] FIG. 7 is a cross-sectional view of the first embodiment of the power inverter device taken along a plane VII-VII in FIG. [Figure 8] FIG. 2 is a top view of a fixing element of the first embodiment of the cooling device. [Figure 9] 3 shows a longitudinal section through a second embodiment of a power inverter device according to the invention having a second embodiment of a cooling device according to the invention; [Figure 10] 3 shows a longitudinal section through a third embodiment of a power inverter device according to the invention having a third embodiment of a cooling device according to the invention; FIG. [Figure 11] FIG. 11 is a principle diagram of a second wall of a third embodiment of the cooling device. [Figure 12] 8 is a cross-sectional view corresponding to FIG. 7 of a fourth embodiment of a power inverter device according to the present invention having a fourth embodiment of a cooling device according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Figure 1 shows a block diagram of an embodiment of an arrangement 1 having a power inverter arrangement 2 and an electric machine 3. The power inverter arrangement 2 is arranged to power the electric machine 3. The electric machine 3 is suitable for driving a vehicle such as a battery electric vehicle or a hybrid electric vehicle. Furthermore, Figure 1 shows a high voltage battery 4 connected to the DC link of the power inverter arrangement 2 or arrangement 1, respectively.

[0029] The power inverter device 2 comprises a DC link capacitor 5 and a semiconductor switch element module 6. The semiconductor switch element module 6 comprises a first semiconductor switch element arrangement 7, a second semiconductor switch element arrangement 8 and a third semiconductor switch element arrangement 9. Each semiconductor switch element arrangement 7, 8, 9 is configured to supply an output phase current of the power inverter device 2. For this purpose, each semiconductor switch element arrangement 7, 8, 9 comprises a half bridge formed by two semiconductor switch elements 10, 11. Each semiconductor switch element comprises a transistor structure 12 and an anti-parallel diode structure 13. The transistor structure 12 and the diode structure 13 can be formed by one or more power MOSFETs or by one or more connections of IGBTs and diodes.

[0030] The power inverter device 2 further includes a control unit 14. The control unit 14 is configured to control the semiconductor switch element module 6, i.e., the semiconductor switch element configurations 7, 8, and 9, respectively, to provide a three-phase output voltage. The power inverter device 2 further includes a first embodiment of a cooling device 15 for cooling the semiconductor switch elements 10 and 11.

[0031] 2 is a top view of the first embodiment of the power inverter device 2. As shown in the figure, the semiconductor switch element assemblies 7, 8, 9 are mounted in a row on a base plate 16 of a cooling device 15.

[0032] FIG. 3 is a longitudinal cross-sectional view of a first embodiment of the power inverter device 2 along the plane III-III in FIG.

[0033] The cooling device 15 includes a first wall 17 formed by a base plate 16. The first wall 17 has a first side 18 for supporting the semiconductor switch elements 10, 11, i.e., the semiconductor switch element structures 7, 8, 9, respectively, and a second side 19 opposite the first side 18. The cooling device 15 further includes a second wall 20 having a first side 21 that forms a main cooling channel 22 together with the second side 19 of the first wall 17. A third wall 23 of the cooling device 15 forms an auxiliary cooling channel 24 together with a second side 25 of the second wall 20. The main cooling channel 22 and the auxiliary cooling channel 24 run parallel to each other below the base plate 16 in direct thermal contact with the coolant flow along the main cooling channel 22.

[0034] The second wall 20 is provided with connection means 26 for connecting the auxiliary cooling channel 24 to the main cooling channel 22 in a fluid-conducting manner. To this end, the connection means 26 is provided with a number of through holes 26a inclined with respect to a plane parallel to the second wall 20. Thus, the coolant flow along the auxiliary cooling channel 24, which is thermally separated from the semiconductor switch elements 10, 11 by the second wall 20, is discharged into the main cooling channel 22 via the connection realized by the through holes 26a.

[0035] The cooling device 15 further comprises an inlet channel assembly 27 for supplying coolant to the main cooling channel 22 and the auxiliary inlet channel 24. An outlet channel 28 for discharging the coolant from the main cooling channel 22 is provided on the opposite side of the cooling device 15 relative to the inlet channel assembly 27. In this embodiment, the inlet channel assembly 27 comprises a common inlet channel 31 from which branches a main inlet channel 29 for supplying coolant to the main cooling channel 20 and the auxiliary coolant channel 24.

[0036] The inlet channel assembly 27 and the outlet channel 28 are formed by angled bores in a housing element 32 constructed, for example, from aluminum. In addition, Figure 3 shows an optional ribbon junction 33 located on the second side 19 of the first wall 17.

[0037] FIG. 4 is a principle diagram of the second wall 20 of the cooling device 15 of the first embodiment.

[0038] The connecting means 26 is disposed within a section 34 of the second wall 20. The section 34 extends between an outlet channel end 35 of the second wall 20 and a location between the outlet channel 28 and the inlet channel assembly 27. Outside the section 34, the second wall 20 is impermeable to the coolant. The distance between the outlet channel end 35 of the second wall 20 and said location is approximately 50 percent of the length of the second wall 20.

[0039] Section 34 has a first subsection 36 on the inlet channel side of connection means 26 and a second subsection 37 on the outlet channel side of connection means 26. In second subsection 37, the density of connections and thus the density of through holes 26a, respectively, is higher than in first subsection 36. In first subsection 36, through holes 26a are arranged in a square pattern, whereas in second subsection 37, through holes 26a are in a diagonal pattern to provide a higher density of connections.

[0040] This causes the cooler coolant flowing along the auxiliary cooling channel 24 to be discharged in the region of the main cooling channel 22, i.e. the region below the second and third switch element components 8 and 9. In this region, the coolant flow along the main cooling channel 22 is already heated by heat dissipation from the first switch element component 7. Since the coolant flow along the auxiliary cooling channel 24 is cooler than the coolant flow along the main cooling channel 22, the temperature below the second and third switch element components 8 and 9 is reduced compared to a cooling device without an auxiliary cooling channel. Since the density of the through holes 26a in the second subsection 37 below the third semiconductor switch element component 9 is higher than in the first subsection 36, more coolant is discharged into the main cooling channel 22. This causes the temperature of the coolant flow along the main cooling channel 22 to be reduced compared to a cooling device without an auxiliary cooling channel. Due to the turbulence caused by the coolant discharged through the through holes 26a, a further improvement in heat dissipation is achieved.

[0041] 5 and 6 are each a simplified cross-sectional view of a first embodiment of the power inverter device 2. FIG. 5 shows the main cooling channel 22 and the auxiliary cooling channel 24, and FIG. 6 shows the outlet channel 28. As shown, the distance between the second side 19 of the first wall 17 and the first side 21 of the second wall 20 is greater than the distance between the second side 25 of the second wall 20 and the third wall 23. As a result, the height of the main cooling channel 22 is greater than the height of the auxiliary cooling channel 24.

[0042] FIG. 7 is a cross-sectional view of the first embodiment of the power inverter device 2 along the plane VII-VII in FIG.

[0043] The third wall 23 is formed by a bottom 38 of a cavity 39 formed in the housing element 32. The second wall 20 is formed by a plate-like separating element 40 arranged in a recess 41 of the cavity 39. A fixing element 42, shown in top view in Figure 8, is provided between the base plate 16 and the separating element 42 and is elastically deformed by the base plate 16 when the base plate 16 closes the cavity 39.

[0044] 9 to 12 show further embodiments of the power inverter device 2 each having a further embodiment of the cooling device 15. In the following, only the differences between the respective embodiments of the power inverter device 2 and the cooling device 15 and the first embodiment of the power inverter device 2 and the cooling device 15 described above will be described. The same reference symbols are used for the same or equivalent components. Alternatively, all of the further embodiments of the power inverter device 2 may be applied to the component 1.

[0045] 9 shows a longitudinal section of an embodiment of a power inverter device 2 with a second embodiment of a cooling device 15. According to this embodiment, the main inlet channel 29 is separate from the auxiliary inlet channel 30. For this purpose, two separate bores for each of the inlet channels 29, 30 are provided in the housing element 32. The main inlet channel 29 and the auxiliary inlet channel 30 are fed by different cooling cycles so as to provide a higher cooling performance than the first embodiment.

[0046] FIG. 10 shows a longitudinal section of a third embodiment of a power inverter 2 with a third embodiment of a cooling device 15. In these embodiments, the through holes 26a are distributed over substantially the entire area of ​​the second wall 20. FIG. 11 shows a principle diagram of the second wall 20 of the third embodiment of a cooling device 15. As shown, the section 34 extends to a position where the distance to the outlet channel end 35 is more than 90 percent of the length of the second wall 20. Here, no ribbon joints are provided in the base plate 16, because the inclined jets of coolant flowing from the auxiliary cooling channels 24 into the main cooling channels 22 generate turbulences in the main cooling channels 22 that are comparable to those generated by the corresponding distribution of the ribbon joints in the first wall 17.

[0047] Figure 12 is a cross-sectional view corresponding to figure 7 according to a fourth embodiment of the power inverter device 2 with a fourth embodiment of the cooling device 15. In this embodiment the cooling device comprises a frame element 43 arranged between the base plate 16 and the separation element 40, the frame element 43 having a flange 44 connected by fastening means 46 to a flange 45 of the housing element 32.

Claims

1. A cooling device (15) for cooling a semiconductor switch element (10, 11), comprising: a first wall (17) having a first side (18) for supporting said semiconductor switch element (10, 11) and having a second side (19) opposite said first side (18); a second wall (20) having a first side (21) forming a main cooling channel (22) together with said second side (19) of said first wall (17), said second wall (20) having a second side (25) opposite said first side (21) of said second wall (20); Equipped with a third wall (23) forming an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), the third wall (23) comprising a connecting means (26) connecting the auxiliary cooling channel (24) in a fluid-conducting manner to the main cooling channel (22), The connection means (26) is a plurality of through holes (26a), The through hole (26a) is inclined with respect to a plane parallel to the second wall (20). Cooling device (15).

2. A cooling device (15) for cooling a semiconductor switch element (10, 11), comprising: a first wall (17) having a first side (18) for supporting said semiconductor switch element (10, 11) and having a second side (19) opposite said first side (18); a second wall (20) having a first side (21) forming a main cooling channel (22) together with said second side (19) of said first wall (17), said second wall (20) having a second side (25) opposite said first side (21) of said second wall (20); Equipped with a third wall (23) forming an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), the third wall (23) comprising a connecting means (26) connecting the auxiliary cooling channel (24) in a fluid-conducting manner to the main cooling channel (22), said third wall (23) being formed by a bottom (38) of a cavity (39) formed in a housing element (32); the second wall (20) being formed by a plate-like separation element (40) arranged in a recess (41) of the cavity (39); The first wall (17) is formed by a base plate (16), the cooling device (15) comprises a fixing element (42) arranged between the base plate (16) and the separation element (40), the fixing element (42) being elastically deformed by the base plate (16) when the base plate (16) closes the cavity (39); Cooling device (15).

3. A cooling device (15) for cooling a semiconductor switch element (10, 11), comprising: a first wall (17) having a first side (18) for supporting said semiconductor switch element (10, 11) and having a second side (19) opposite said first side (18); a second wall (20) having a first side (21) forming a main cooling channel (22) together with said second side (19) of said first wall (17), said second wall (20) having a second side (25) opposite said first side (21) of said second wall (20); Equipped with a third wall (23) forming an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), the third wall (23) comprising a connecting means (26) connecting the auxiliary cooling channel (24) in a fluid-conducting manner to the main cooling channel (22), said third wall (23) being formed by a bottom (38) of a cavity (39) formed in a housing element (32); the second wall (20) being formed by a plate-like separation element (40) arranged in a recess (41) of the cavity (39); The first wall (17) is formed by a base plate (16), the cooling device (15) comprises a frame element (43) arranged between the base plate (16) and the separation element (40), the frame element (43) having a flange (44) connected or connectable to a flange (45) of the housing element (32) by fastening means (46); Cooling device (15).

4. an inlet channel assembly (27) for supplying coolant to said main cooling channel (22) and to said auxiliary cooling channel (24); an outlet channel (28) for discharging said coolant from said main cooling channel (22); Further comprising: The cooling device according to any one of claims 1 to 3.

5. a density of connections between the main cooling channel (22) and the auxiliary cooling channel (24) at the outlet channel side of the connection means (26) is higher than at the inlet channel side of the connection means (26); The cooling device according to claim 4.

6. the connecting means (26) is disposed within a section (34) of the second wall (20) extending between an outlet channel end (35) of the second wall (20) and a location between the outlet channel (28) and the inlet channel assembly (27); the second wall (20) is impermeable to the coolant outside the section (34); 6. The cooling device according to claim 4 or 5.

7. The distance between the outlet channel end (35) of the second wall (20) and the position is 1 / 2 of the length of the second wall (20). at most 60 percent, preferably at most 50 percent, more preferably at most 40 percent, or at least 60 percent, preferably at least 75 percent, more preferably at least 90 percent That is, The cooling device according to claim 6.

8. The inlet channel assembly (27) comprises a common inlet (31) channel; From said inlet (31) channel branch off a main inlet channel (29) and said auxiliary cooling channel (24); The cooling device according to any one of claims 5 to 7.

9. The inlet channel assembly (27) comprises a main inlet channel (29) and an auxiliary inlet channel (30) spaced apart from each other; The cooling device according to any one of claims 5 to 7.

10. A power inverter device (2) comprising a plurality of semiconductor switch elements (10, 11) and a cooling device (15) for the semiconductor switch elements (10, 11) according to any one of claims 1 to 9.

11. 11. An arrangement (1) comprising a power inverter device (2) according to claim 10 and an electric machine (3) configured to drive a vehicle, the power inverter device (2) being configured to supply power to the electric machine (3).

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