Base material assembly for mechanical and electrical connections and riveting method thereof

Abstract

The present invention discloses a base material assembly and a rivet fastening method comprising: a first base material made of a conductive material; a second base material made of a conductive material, positioned facing the first base material but spaced apart from each other, and connected to the first base material by riveting; and a plurality of embossed members protruding from the inner surface of the first base material so as to be in point contact with the flat surface of the inner surface of the second base material, wherein the first base material and the second base material are mechanically and electrically connected via the plurality of embossed members, and the base material assembly and rivet fastening method are characterized in that they can reduce quality variations in the mechanical and electrical connections between a plurality of base materials.

Description

[Technical field]

[0001] The present invention relates to a base material assembly for mechanical and electrical connection and a riveting method thereof, and more particularly to a base material assembly and a riveting method thereof that can reduce quality variations when mechanically and electrically connecting multiple base materials. [Background technology]

[0002] The recent technological development and increase in demand for mobile devices has been remarkable, and as a result, the demand for rechargeable secondary batteries as an energy source is rapidly increasing. Accordingly, a lot of research and development on secondary batteries that can meet a wide variety of requirements is being actively carried out. Secondary batteries are also attracting attention as a power source for medium- to large-sized devices such as electric vehicles, hybrid electric vehicles, and plug-in hybrid electric vehicles.

[0003] When such secondary batteries are used in medium to large devices that require large capacity, they are used in the form of a battery pack having a structure in which multiple battery cells are arranged in an array so as to meet the output and capacity required for the medium to large device.

[0004] On the other hand, riveting is one of the connection methods used for the mechanical and electrical connections between medium to large devices and the battery packs mounted thereon, the mechanical and electrical connections between battery packs mounted in medium to large devices, and the mechanical and electrical connections between battery cells within a battery pack.

[0005] At this time, the contact area of ​​the parts connected by the riveting method tends to vary depending on the working environment such as the position of the riveting gun, the riveting direction, and the skill level of the worker.The contact area of ​​the connected parts is related to resistance, and therefore the deviation in resistance of the connected parts caused by the difference in the contact area of ​​the connected parts can reach about 10%.

[0006] Therefore, after mechanical and electrical connections are made using the riveting method, it is necessary to inspect the contact area in order to reduce variation in the quality of the connected parts. However, since the parts connected using the riveting method are in surface contact with each other, it is difficult to inspect them visually, which is an inconvenience.

[0007] The background art of the present invention is described in the following patent documents: [Prior art documents] [Patent documents]

[0008] [Patent Document 1] KR10-2013-0080023 A [Patent Document 2] KR10-1329250 B1 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention provides a base material assembly and a riveting method thereof that can reduce variations in the quality of contact areas and the associated deviations in resistance when mechanically and electrically connecting the base material and the associated deviations in resistance. [Means for solving the problem]

[0010] A base material assembly for mechanical and electrical connection according to an embodiment of the present invention comprises a first base material made of a conductive material, a second base material made of a conductive material, arranged facing the first base material but separated from the first base material, and connected to the first base material by rivet fastening, and a plurality of embossing members protruding from the inner surface of the second base material so as to be in point contact with a plane of the inner surface of the first base material, and is characterized in that the first base material and the second base material are mechanically and electrically connected via the plurality of embossing members.

[0011] The plurality of embossing members may be arranged along the inner surface of the second base material and may be spaced apart from each other in the row and vertical directions.

[0012] The plurality of embossing members may be arranged symmetrically and spaced apart about a rivet member attached to join the first base material and the second base material.

[0013] The plurality of embossing members may be provided so as to have the same protruding height within an error range.

[0014] Each of the plurality of embossing members may have a hemispherical surface that is in close contact with the first base material.

[0015] The plurality of embossing members may be made of the same material as the second base material.

[0016] The plurality of embossing members may be made of a material different from the second base material and may include a material made of a conductive substance.

[0017] A riveting method for a base material assembly for mechanical and electrical connection according to an embodiment of the present invention includes the steps of preparing a first base material made of a conductive material, preparing a second base material made of a conductive material, forming a plurality of embossed members on the second base material, arranging one side of the first base material and the other side of the second base material on which the plurality of embossed members are formed so as to face each other and be spaced apart from each other, bringing the first base material and the second base material close to each other so that the plurality of embossed members and the plane of one side of the first base material are in point contact with each other, and joining the first base material and the second base material by riveting, wherein the joining step is characterized in that the first base material and the second base material are mechanically and electrically connected via the plurality of embossed members.

[0018] The process of preparing a first base material made of a conductive material may include a process of forming a first through hole in the first base material so that a rivet member can be passed therethrough, the process of preparing a second base material made of a conductive material may include a process of forming a second through hole in the second base material so that the second through hole corresponds to the first through hole and allows the rivet member to be passed therethrough, and the process of forming the multiple embossing members may include forming multiple embossing members on the other surface of the second base material so that the embossing members are spaced apart from the second through hole in the row and vertical directions and protrude from the second base material at the same height as each other.

[0019] The riveting method of the base material assembly for mechanical and electrical connection may include, after the joining process, a process of checking the contact condition between the multiple embossed members and the first base material through a separation space between the first base material and the second base material, and a process of determining whether the riveting between the first base material and the second base material is good or bad based on the result of the checking. Effect of the Invention

[0020] According to an embodiment of the present invention, an embossed member is formed on the inner surface of one of a pair of base materials to be mechanically and electrically connected, and the inner surface of the remaining other is made flat, and these are joined by a riveting method, so that the embossed member and the flat surface can be brought into contact at points, unlike the conventional method. Therefore, compared to the conventional method in which the flat surfaces are brought into contact with each other in a face-to-face manner, it is possible to reduce the variation in the quality of the contact area between the pair of base materials caused by differences in working environment and the associated deviation in resistance. In addition, since a space can be secured between the pair of base materials after joining using the embossed member, the contact state between the pair of base materials can be easily determined visually. [Brief description of the drawings]

[0021] [Figure 1] 1 is a schematic diagram of a base material assembly according to an embodiment of the present invention. [Diagram 2]1 is a schematic diagram of a first base material according to an embodiment of the present invention. [Diagram 3] 4 is a schematic diagram of a second base material and an embossing member according to an embodiment of the present invention. FIG. [Figure 4] FIG. 2 is a schematic diagram showing a state before a first base material and a second base material according to an embodiment of the present invention are fastened together by riveting. [Diagram 5] FIG. 2 is a schematic diagram showing how a first base material and a second base material are riveted together according to an embodiment of the present invention. [Figure 6] FIG. 2 is a schematic diagram showing a state in which a first base material and a second base material have been riveted together according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments of the present invention are merely provided to complete the disclosure of the present invention and to fully inform those skilled in the art of the scope of the invention. In order to explain the embodiments of the present invention, the drawings may be exaggerated, and parts that are not relevant to the description may be omitted, and the same reference numerals in the drawings indicate the same components.

[0023] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0024] 1. Base material assembly for mechanical and electrical connections according to an embodiment of the present invention

[0025] 1 is a schematic diagram of a base material assembly according to an embodiment of the present invention. With reference to FIG. 1, a base material assembly for mechanical and electrical connection according to an embodiment of the present invention will be described in detail.

[0026] The base material assembly according to an embodiment of the present invention is a base material assembly for mechanical and electrical connection between a first object 1 and a second object (not shown) and comprises the following components:

[0027] 1.1. First base material 100

[0028] The first base material 100 may be made of a conductive material, that is, the first base material 100 may be made of a metal material having high electrical conductivity.

[0029] The first base material 100 may be provided in the first object 1 and may be connected to the first object 1. The first object 1 may be a battery cell or a battery pack. For example, the first base material 100 may be integrally formed with an electrode terminal of the battery cell or a bus bar of the battery pack, and may be connected to the electrode terminal of the battery cell or the bus bar of the battery pack. Needless to say, the type of the first object 1 can be changed in various ways.

[0030] FIG. 2 is a schematic diagram of a first base material according to an embodiment of the present invention.

[0031] Referring to FIG. 2, the first base material 100 may be formed in a rectangular plate shape having a length in the row direction h longer than the length in the vertical direction v and a predetermined thickness in the up-down direction. In addition, one surface 101 of the first base material 100, which is the surface facing the second base material 200, may be flat. The one surface 101 of the first base material 100 may be referred to as an inner surface or an upper surface. Meanwhile, the shape of the other surface 102 of the first base material 100 may be changed in various ways. For example, the shape of the other surface 102 of the first base material 100 may be flat. The other surface 102 of the first base material 100 may be referred to as an outer surface or a lower surface.

[0032] 1.2. First through hole H1

[0033] The first through hole H1 may be formed to penetrate the first base material 100 in the up-down direction. Here, the up-down direction may be a direction intersecting with the vertical direction v and the row direction h. A rivet member 300 may be disposed in the first through hole H1.

[0034] 1.3. Second base material 200

[0035] The second base material 200 may be made of a conductive material. That is, the first base material 100 may be made of a metal material having high electrical conductivity. In this case, the second base material 200 may be made of the same material as the first base material 100. Needless to say, the second base material 200 may be made of a material that is different from the first base material 100 but has electrical conductivity.

[0036] The second base material 200 may be provided on a second object (not shown) and may be connected to the second object. Here, the second object may be a peripheral battery cell or a peripheral battery pack to be mechanically and electrically connected to the first object 1. And, the second object may be a circuit board of a power supply part of a small, medium or large device to be mechanically and electrically connected to the first object 1. The second base material 200 may be formed integrally with an electrode terminal of a peripheral battery cell, a bus bar of a peripheral battery pack, or a circuit board of a power supply part, and may be connected to the electrode terminal of a peripheral battery cell, a bus bar of a peripheral battery pack, or a circuit board of a power supply part. Needless to say, the type of the second object can be changed in various ways.

[0037] FIG. 3 is a schematic diagram of a second base material and an embossing member according to an embodiment of the present invention.

[0038] Referring to FIG. 3, the second base material 200 may be formed in a rectangular plate shape in which the length in the row direction h is longer than the length in the vertical direction v and the second base material 200 has a predetermined thickness in the vertical direction. The other surface 202 of the second base material 200 facing the first base material 100 in the vertical direction may be flat. The other surface 202 of the second base material 200 may be referred to as an inner surface or a lower surface. Meanwhile, the shape of one surface 201 of the second base material 200 may be changed in various ways. For example, the shape of one surface 201 of the second base material 200 may be flat. The one surface 201 of the second base material 200 may be referred to as an outer surface or an upper surface.

[0039] The second base material 200 is disposed opposite the first base material 100 at a distance from each other, and is joined to the first base material 100 by riveting. In other words, the other surface 202 of the second base material 200 and one surface 101 of the first base material 100 may be spaced apart from each other by a distance corresponding to a predetermined height in the vertical direction by the multiple embossing members 400.

[0040] 1.4. Second through hole H2

[0041] The second through hole H2 may be formed to penetrate the second base material 200 in the vertical direction. A rivet member 300 may be disposed in the second through hole H2. In this case, the second through hole H2 may correspond to the first through hole H1. "Corresponding" means facing each other in the vertical direction and aligned with each other. The second through hole H2 may be located at the center of the multiple embossing members 400 in the row direction h and the vertical direction v.

[0042] According to the positional relationship between the second through hole H2 and the multiple embossing members 400, when the first base material 100 and the second base material 200 are riveted together with the rivet member 300, the force with which the rivet member 300 presses the first base material 100 and the second base material 200 in the vertical direction can be uniformly distributed to the multiple embossing members 400.

[0043] Therefore, the first base material 100 and the second base material 200 can be separated horizontally without tilting each other, and the multiple embossing members 400 can be brought into stable and uniform contact with one surface 101 of the first base material 100.

[0044] 1.5. Rivet member 300

[0045] The rivet member 300 may be disposed to pass through the first through hole H1 and the second through hole H2, and may be in contact with the other surface 102 of the first base material 100 and one surface 201 of the second base material 200. The rivet member 300 can join the first base material 100 and the second base material 200 to each other by a lower end thereof pressing upward against the other surface 102 of the first base material 100 near the first through hole H1 and an upper end thereof pressing downward against the one surface 201 of the second base material 200 near the second through hole H2.

[0046] 1.6. Plurality of Embossed Members 400

[0047] The multiple embossing members 400 may be provided to protrude from the inner surface 202 of the second base material 200 so as to be in point contact with the flat surface of the inner surface 101 of the first base material 100. Through the multiple embossing members 400, the first base material 100 and the second base material 200 can be mechanically and electrically connected to each other.

[0048] 3, the multiple embossing members 400 may be arranged along the inner surface of the second base material 200 and spaced apart from each other in the row direction h and the vertical direction v. In this case, the multiple embossing members 400 may be arranged symmetrically apart from each other in the row direction h and the vertical direction v with the rivet member 300 attached to join the first base material 100 and the second base material 200 as the center.

[0049] In addition, the multiple embossing members 400 may each be protruding in the vertical direction from the inner surface 202 of the second base material 200, and in this case, the protruding heights in the vertical direction may be the same as each other within the error range.

[0050] The error range refers to the degree of change in the protruding height in the row direction h and the vertical direction v when it is determined that the degree of change in the protruding height does not affect the change in the contact area or number of contacts between the multiple embossed members 400 and the first base material 100, and since this can be obtained during repetitive riveting operations, numerical examples of this will be omitted.

[0051] Each of the multiple embossing members 400 may have a curved shape such that the surface that comes into close contact with the first base material 100 faces the first base material, for example, a curved shape that is convex downward. Specifically, each of the multiple embossing members 400 may have a lower surface that comes into close contact with the first base material 100 that is, for example, semispherical.

[0052] According to such a shape of the plurality of embossing members 400, when the first base material 100 and the second base material 200 are riveted together, the plurality of embossing members 400 can be brought into uniform contact with the first base material 100, and the first base material 100 and the second base material 200 can move away from each other in parallel. Therefore, the plurality of embossing members 400 can be brought into uniform contact with one surface 101 of the first base material 100.

[0053] The plurality of embossing members 400 may contain the same material as the second base material 200. Needless to say, the plurality of embossing members 400 may contain a material that is different from the material of the second base material 200 and is made of a conductive material.

[0054] That is, if the material of the plurality of embossing members 400 is the same as the material of the second base material 200, the second base material 200 and the plurality of embossing members 400 can be easily manufactured.

[0055] In addition, by making the multiple embossing members 400 and the second base material 200 from different materials, for example, by making the material of the multiple embossing members 400 from a metal material having a lower or higher resistance than the material of the second base material 200, the overall resistance of the base material assembly can be easily adjusted to the desired resistance.

[0056] Meanwhile, the material of the plurality of embossing members 400 may be different from the material of the first base material 100. For example, by making the material of the plurality of embossing members 400 brittle or hard than the material of the first base material 100 and riveting the first base material 100 and the second base material 200, the size of the contact surface between the plurality of embossing members 400 and the first base material 100 can be adjusted by adjusting the riveting strength to widely deform the lower surface of each of the plurality of embossing members 400 in the row direction h and the vertical direction v, or by inserting the lower surface of each of the plurality of embossing members 400 into the inner surface 101 of the first base material 100 by a predetermined depth.

[0057] 2. Method of riveting a base material assembly for mechanical and electrical connection according to an embodiment of the present invention

[0058] FIG. 4 is a schematic diagram showing a state before the first base material and the second base material according to the embodiment of the present invention are riveted together. FIG. 5 is a schematic diagram showing a state in which the first base material and the second base material according to the embodiment of the present invention are riveted together. FIG. 6 is a schematic diagram showing a state in which the first base material and the second base material according to the embodiment of the present invention have been riveted together. A riveting method for a base material assembly according to the embodiment of the present invention will be described in detail with reference to FIGS. 2 to 6. In describing the riveting method for a base material assembly, details that overlap with the description of the base material assembly described above will be omitted or described in a simplified manner.

[0059] A method of riveting a base material assembly according to an embodiment of the present invention may include the following steps.

[0060] 2.1. A process for preparing a first base material made of a conductive material

[0061] Referring to Figure 2, the process of preparing a first base material 100 made of a conductive material is a process of preparing a plate-shaped first base material 100 having one surface 101 that is to come into contact with a plurality of embossing members 400 and is formed so as to have a flat shape, and forming a first through hole H1 in the first base material 100 to allow the rivet member 300 to pass through.

[0062] At this time, a first through hole H1 may be formed in the first base material 100 connected to the first object 1, or the first through hole H1 may be formed in the first base material 100 and then the first base material 100 may be connected to the second object 1.

[0063] 2.2. Providing a second substrate made of a conductive material

[0064] Referring to Figure 3, the process of preparing a second base material 200 made of a conductive material is a process of preparing a plate-shaped second base material 200 having the other surface 202 on which a plurality of embossed members 400 are to be formed so as to have a flat shape, and forming a second through hole H2 in the second base material 200 that corresponds to the first through hole H1 and enables the rivet member 300 to pass through.

[0065] At this time, a second through hole H2 may be formed in the second base material 200 connected to the second object (not shown), or the second through hole H2 may be formed in the second base material 200 and then the second base material 200 may be connected to the second object.

[0066] 2.3. Forming a plurality of embossed members in a second base material

[0067] Referring to FIG. 3, the process of forming the plurality of embossing members 400 on the second base material 200 is a process of forming the plurality of embossing members 400 on the other surface 202 of the second base material 200.

[0068] In this case, multiple embossing members 400 may be formed on the other surface 202 of the second base material 200 so that the multiple embossing members 400 are spaced apart from the second through hole H2 in the row direction h and vertical direction v and protrude from the second base material 200 at the same height as each other.

[0069] Methods for forming the plurality of embossed members 400 include a wide variety of methods such as cutting, bonding, casting, welding, etc. For example, a plate member having a first thickness may be prepared, and the other surface of the plate member may be cut to provide a second base material 200 having a thickness smaller than the first thickness, and a plurality of embossed members 400 provided integrally with the second base material 200.

[0070] 2.4. The process of placing one surface of a first base material and the other surface of a second base material facing each other and spaced apart from each other

[0071] The process of arranging one surface 101 of the first base material 100 and the other surface 202 of the second base material 200 facing each other and spaced apart from each other is the process of positioning the second base material 200 above the one surface 101 of the first base material 100.

[0072] Here, the first through hole H1 and the second through hole H2 may be aligned in the up-down direction.

[0073] 2.5. A process of bringing a first base material and a second base material close to each other so that a plurality of embossing members and a flat surface on one side of the first base material are in point contact with each other.

[0074] The process of bringing the first base material and the second base material close to each other so that the multiple embossing members and the plane of one side of the first base material are in point contact with each other is the process of placing multiple embossing members 400 on one side 101 of the first base material 100.

[0075] At this time, referring to Fig. 4, the rivet member 300 may be positioned above the second through hole H2. For example, the rivet member 300 may be the rivet member 300 before being riveted, and may include a hollow rivet body 310 and a mandrel 320. Here, the mandrel 320 may include a mandrel upper part 321 arranged at the upper part of the rivet body 310 and protruding above the rivet body 310, a mandrel lower part 322 arranged at the lower part of the rivet body 310, and a mandrel head 323 protruding below the rivet body 310. Needless to say, the configuration of the rivet member 300 can be modified in various ways.

[0076] Meanwhile, in the process of bringing the first base material 100 and the second base material 200 closer to each other, the multiple embossing members 400 come into contact with one surface 101 of the first base material 100, thereby enabling the first base material 100 and the second base material 200 to move away from each other in the vertical direction by the multiple embossing members 400, thereby forming a space between them.

[0077] Here, the space between the first base material 100 and the second base material 200 can be maintained even during the riveting process, and can also be used in a subsequent process of checking the degree of contact between the multiple embossed members 400 and the first base material 100.

[0078] 2.6. The process of joining a first base material to a second base material by riveting

[0079] Referring to Figures 5 and 6, the process of joining the first base material 100 and the second base material 200 by riveting may include a process of placing the rivet member 300 inside the first and second through holes H1, H2, and pulling the mandrel of the rivet member 300 upward to deform the rivet body of the rivet member 300, thereby pressurizing the first base material 100 upward and pressurizing the second base material 200 downward to join the first base material 100 and the second base material 200.

[0080] At this time, referring to FIG. 6, the first base material 100 and the second base material 200 can be mechanically and electrically connected via a plurality of embossing members 400. As shown in FIG.

[0081] 2.7. A process of checking the contact state between the plurality of embossed members and the first base material through the space between the first base material and the second base material, and a process of determining whether the riveted connection between the first base material and the second base material is good or bad based on the result of the checking.

[0082] The process of checking the contact state between the multiple embossing members 400 and the first base material 100 may be performed after the process of joining the first base material and the second base material by riveting. The process of checking the contact state may be performed by an operator himself / herself by visually measuring the separation space between the first base material and the second base material, or may be performed by taking an image of the multiple embossing members 400 and one surface 101 of the first base material 100 in the separation space between the first base material and the second base material using an optical device (not shown) and analyzing the taken image by a computer.

[0083] In the process of determining whether the rivet is fastened properly, the contact area between the multiple embossed members 400 and one surface 101 of the first base material 100 or the number of multiple embossed members 400 in contact with one surface 101 of the first base material 100 may be confirmed, and the rivet may be determined to be good if the contact area falls within a reference area or the number of contacts falls within a reference number. Alternatively, the rivet may be determined to be poor if the contact area does not meet the reference area or the number of contacts does not meet the reference number.

[0084] In this way, in the base material assembly and riveting method according to an embodiment of the present invention, by bringing the embossing member and the base material into face-to-face point contact, it is possible to reduce quality variation at the time of contact, and by the embossing member separating the two base materials from each other, it is possible to easily inspect the condition of contact between the embossing member and the base material.

[0085] The above-mentioned embodiments of the present invention are for the purpose of explaining the present invention, and are not intended to limit the present invention. It should be noted that the configurations and methods disclosed in the above-mentioned embodiments of the present invention may be combined or crossed to be modified in various forms, and such modifications are also considered to be within the scope of the present invention. That is, the present invention may be embodied in various different forms within the scope of the claims and the technical ideas equivalent thereto, and those skilled in the art to which the present invention pertains may understand that various embodiments are possible within the scope of the technical ideas of the present invention. [Explanation of symbols]

[0086] 100: First base material 200: Second base material 300: Rivet material 400: Multiple embossed parts

Claims

1. A first base material made of a conductive material; a second base material made of a conductive material, arranged to face the first base material but apart from it, connected to the first base material by riveting, and having a length in a row direction (h) longer than a length in a vertical direction (v); A plurality of embossing members protruding from the inner surface of the second base material so as to be in point contact with a flat surface of the inner surface of the first base material; It is equipped with the first base material and the second base material are arranged parallel to each other and spaced apart from each other, and are mechanically and electrically connected to each other via the plurality of embossing members; The plurality of embossing members include The rivet members are spaced apart symmetrically with respect to the row direction (h) and the longitudinal direction (v) about a rivet member attached to join the first base material and the second base material; The first base material and the second base material are electrically connected to each other, and the first base material and the second base material are electrically connected to each other. A base material assembly characterized in that a predetermined space is formed between the first base material and the second base material so that the presence or absence of poor contact between the first base material and the second base material can be confirmed from the number of embossing members in contact with one side of the first base material.

2. 2. The base material assembly according to claim 1, wherein each of the plurality of embossing members has a hemispherical surface that is brought into close contact with the first base material.

3. 2. The base material assembly of claim 1, wherein the plurality of embossing members are made of the same material as the second base material.

4. 2. The base material assembly according to claim 1, wherein the plurality of embossing members are made of a material different from the second base material and comprise a material made of a conductive material.

5. providing a first base material made of a conductive material; preparing a second base material made of a conductive material and having a length in a row direction (h) longer than a length in a vertical direction (v); forming a plurality of embossing features in the second base material; a step of disposing one surface of the first base material and another surface of the second base material on which the plurality of embossed members are formed so as to face each other and spaced apart from each other; a step of bringing the first base material and the second base material close to each other so that the plurality of embossing members and a flat surface of one side of the first base material are in point contact with each other; a step of joining the first base material and the second base material by riveting using a rivet member; a step of checking the number of embossing members that are in contact with the first base material through a space formed by the plurality of embossing members separating the first base material from the second base material, and checking whether or not there is poor contact between the first base material and the second base material; comprising The bonding step comprises: the first base material and the second base material are mechanically and electrically connected via the plurality of embossing members; The plurality of embossing members include The rivet members are arranged symmetrically in the row direction (h) and the vertical direction (v) at intervals around the rivet member, are made of a material composed of a conductive substance, and are protruded so that their protruding heights are the same within an error range, electrically connecting the first base material and the second base material; A riveting method for a base material assembly, characterized in that a predetermined separation space is formed between the first base material and the second base material so that the presence or absence of poor contact between the first base material and the second base material can be confirmed from the number of embossed members contacting one side of the first base material.

6. The step of preparing a first base material made of a conductive material includes: forming a first through hole in the first base material to allow the rivet member to pass therethrough; The step of preparing a second base material made of a conductive material includes: forming a second through hole corresponding to the first through hole in the second base material to allow the rivet member to pass through; The step of forming the plurality of embossing members includes: The riveting method for a base material assembly as described in claim 5, characterized in that the multiple embossed members are formed on the other surface of the second base material so as to be spaced away from the second through hole in the row direction and the vertical direction and to protrude from the second base material at the same height as each other.

7. After the step of confirming, determining whether the riveting between the first base material and the second base material is good or bad based on the result of the confirmation; 7. The method of riveting a base material assembly according to claim 5 or 6, comprising the steps of:

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