Electrostatic discharge protection structure and electronic equipment

Abstract

This application describes an electrostatic discharge protection structure and an electronic device. One end of a metal partition wall (3) is connected to a metal housing (1), and the other end of the metal partition wall (3) extends in a direction away from the metal housing (1) to form an end face (31) at the end away from the metal housing (1), and a screen module (4) is disposed on the side of the metal partition wall (3). A continuous conductive layer is disposed between the insulating frame (2) and the screen module (4), and the insulating frame (2) has a joint surface (211) facing the end face of the metal partition wall (3), and an insulating layer is disposed between the conductive layer and the end face (31), and the insulating layer is an insulating layer that can be destroyed by static electricity. The electrostatic discharge protection structure prevents the problem of RSE caused by a ground fault, which may further affect the antenna performance, and also prevents secondary discharge.

Description

[Technical field]

[0001] This application relates to the field of electrostatic discharge protection technology, and in particular to electrostatic discharge protection structures and electronic devices. [Background technology]

[0002] In electronic devices such as mobile phones, static electricity may occur on the side edges of the screen module. When static electricity discharge occurs, the mobile phone may freeze frequently, automatically turn off, reduce image quality and volume, and have unstable signal quality. Therefore, electrostatic discharge (ESD) has become an important content for the quality control of electronic products. Compared with traditional screens, flexible screens are characterized by flexibility and foldability, and provide users with new interaction modes based on foldability to meet more demands of users for electronic devices. Since flexible screens deform when folded, the design of electrostatic discharge protection structures located on the side edges of the screen module of flexible screens faces more challenges.

[0003] Existing electrostatic discharge protection structures are used on the side edges of screen modules of foldable flexible screens in two ways: In the first method, the electrostatic discharge protection structure is fixed to the metal housing of the electronic device with conductive adhesive to discharge static electricity through grounding; in the second method, the electrostatic discharge protection structure discharges static electricity to the metal housing in the form of gap discharge.

[0004] However, the above two methods have the following problems. In the first method, adhesive is applied to ensure the stability of the electrostatic discharge protection structure, which results in a wider black border on the screen. In addition, this grounding method may cause a risk of radiated spurious emission (RSE) to the antenna due to poor grounding, which may affect antenna performance. In the second method, the gap between the electrostatic discharge protection structure and the metal housing is charged when the flexible screen is deformed during the folding process, and the charging of the gap creates a risk of secondary discharge. Summary of the Invention

[0005] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present embodiments provide electrostatic discharge protection structures and electronic devices to prevent the risks of RSE and secondary discharge caused by ground faults.

[0006] According to a first aspect, the present application provides an electrostatic discharge protection structure. One end of a metal partition is connected to a metal housing, and the other end of the metal partition extends in a direction away from the metal housing. An end face is formed at the end away from the metal housing. A screen module is disposed on the side of the metal partition. The insulating frame includes a first side edge, a connection portion, and a second side edge. The first side edge is disposed on a side of the metal partition opposite to the screen module. The connection portion is disposed on the end of the first side edge away from the metal housing. The connection portion includes a joint surface attached to the end face and a first surface facing the screen module. An insulating layer is disposed between the joint surface and the end face. The second side edge is disposed on a side of the connection portion facing the screen module. The second side edge includes a second surface facing the screen module. A continuous conductive layer is disposed on the joint surface, the first surface, and the second surface.

[0007] According to the electrostatic discharge protection structure provided in the present application, since the insulating layer is disposed between the joint surface and the end surface without electrostatic charges, DC insulation is implemented between the joint surface and the end surface. This prevents the RSE caused by the conventional ground fault. When entering from the side edge of the screen module, the electrostatic charges will be transmitted to the joint surface through the continuous conductive layer disposed on the second surface, the first surface and the joint surface. Since the electrostatic charges have a high voltage, it may cause insulation breakdown. Therefore, the electrostatic charges will be transmitted to the metal housing through the metal partition and discharged by grounding.

[0008] In practice, the metal housing and the metal partition wall are integrally formed. In this way, in the process of manufacturing electronic devices, the metal housing and the metal partition wall can be integrally poured, so as to simplify the manufacturing process. Furthermore, since the metal housing and the metal partition wall are integrally poured and firmly connected, when static electricity is conducted, the static electricity can be directly conducted to the metal housing through the metal partition wall and discharged by grounding, so that the grounding effect is good.

[0009] In practice, the insulating frame includes a plastic boundary frame, so that the signal failure caused by the metal boundary frame during the manufacturing process of the electronic device can be avoided, and the plastic as a stable insulating material can reduce the impact on the antenna performance.

[0010] In the implementation, the screen module includes a display surface and a rear surface disposed on the opposite side of the display surface. The insulating frame is disposed on the outer periphery of the screen module. The metal housing is disposed on the rear side. According to this implementation, the positions of the screen module, the insulating frame, and the metal housing are specifically limited to ensure that the technical solution presented in this application is suitable for electronic devices arranged in this arrangement manner.

[0011] In practice, the insulating layer is a metal anodized oxide layer disposed on the surface of the metal partition. After the surface anodizing process is performed on the metal material, the corrosion resistance, hardness, wear resistance, insulation and heat resistance of the metal anodized oxide layer are greatly improved. When the insulating layer of the metal partition is made of a metal anodized oxide layer, direct current insulation can be ensured.

[0012] In practice, the metal anodized oxide layer comprises an aluminum anodized oxide layer. When anodized, the performance of aluminum is excellent. The aluminum anodized oxide layer can be further improved in corrosion resistance and wear resistance by subjecting the aluminum anodized oxide layer to aluminum anodizing and sealing treatment with hot water, high temperature steam, or nickel salt.

[0013] In implementation, the conductive layer includes at least one of the following materials: conductive silver paste, conductive copper sheet, conductive graphite, and conductive cloth. Thus, multiple materials may be selected as the material of the conductive layer based on the specific configuration of the electrostatic discharge protection structure.

[0014] In an implementation, the first side edge further includes a third surface. The third surface is disposed on a side of the first side edge facing the metal housing. A gap exists between the third surface and the metal housing. In an implementation, an insulating layer is disposed between the first side edge and the metal partition wall, and the metal partition wall plays a clamping role. Therefore, the third surface does not need to be closely attached to the metal housing, the insulating frame and the metal housing do not need to be fixed with adhesive, and the DC isolation is implemented when the metal partition wall is clamped. This prevents the increase in the width of the black border of the screen caused by fixing the insulating frame to the metal housing with conductive adhesive, and also prevents the impact on antenna performance caused by the RSE risk of the antenna due to poor grounding of the conductive adhesive.

[0015] In practice, an antenna area is disposed on the side of the insulating frame opposite to the screen module. Due to the requirements for signal strength, the antenna is usually disposed near the boundary frame. The antenna area is disposed on the side of the insulating frame, so that it has less impact on signal transmission.

[0016] In the present embodiment, the electrostatic discharge protection structure is used for a foldable electronic device. Since the foldable electronic device is deformed during the folding process, the risk of RSE and secondary discharge caused by ground faults cannot be prevented by the current technical solutions. The electrostatic discharge protection structure provided in this embodiment is suitable for the foldable electronic device, so that the risk of RSE and secondary discharge caused by ground faults can be prevented.

[0017] According to a second aspect, the present application further provides an electronic device, the electronic device including an electrostatic discharge protection structure according to any one of the first aspect and the implementations of the first aspect.

[0018] According to the electronic device provided in the present application, an insulating layer is disposed on the end surface of the metal partition, so that DC insulation is implemented between the joint surface and the end surface. This prevents RSE caused by conventional ground faults. When entering from the side edge of the screen module, static electricity is transmitted to the joint surface through the continuous conductive layer disposed on the second surface, the first surface and the joint surface. Since static electricity has a high voltage, it may cause insulation breakdown. Therefore, the static electricity is transmitted to the metal housing through the metal partition and discharged by grounding. [Brief description of the drawings]

[0019] [Figure 1] 1A-1D are diagrams of assembly scenarios of a screen module according to the present application. [Diagram 2] 1 is a schematic cross-sectional view of an assembly of a screen module according to the present application; [Diagram 3] FIG. 2 is a schematic diagram of a specific arrangement of the assembly of the screen module according to the present application. [Figure 4]1A-1D are diagrams of folding scenarios of the screen module according to the present application. [Diagram 5] 1 is a schematic diagram of an electrostatic discharge protection structure according to the present application. [Figure 6] 2 is a schematic diagram of another electrostatic discharge protection structure in accordance with the present application; [Figure 7] 1 is a schematic diagram of an electrostatic discharge protection structure according to an embodiment of the present application. [Figure 8] FIG. 2 is a schematic diagram of an arrangement of a screen module according to an embodiment of the present application. [Figure 9] FIG. 2 is a schematic diagram of a metal middle frame according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Compared with traditional screens, flexible screens feature strong flexibility and foldability, and provide users with new interaction modes based on foldability to meet more demands of users on electronic devices. Active-matrix organic light-emitting diode (AMOLED) is a display technology. AMOLED flexible screens have the characteristics of a wide display color range, low power consumption, and good flexibility. Existing foldable electronic devices (e.g., foldable mobile phones) usually use AMOLED flexible screens as displays.

[0021] 1 is a diagram of an assembly scenario of a screen module according to the present application. As shown in FIG. 1, a flip phone is used as an example. First, a screen module 4 is assembled in a metal housing 1 and clamped to a metal bulkhead 3 connected to the metal housing 1 via a boundary frame 2, so that the screen module 4 is buckled to the metal housing 1 via the boundary frame 2. Furthermore, the boundary frame 2 can also cover the gap formed between the screen module 4 and the metal housing 1.

[0022] At present, the antenna of electronic equipment is usually designed on the side edge of the screen module. In order to ensure that the signal radiation strength is the same in all directions of 360° in the cross section of the antenna and achieve the best communication effect, a sufficiently large space (such as a clearance area) should be provided around the antenna of electronic equipment without shielding and interference. Since metal will cause serious interference to the antenna, in the assembly scenario of the screen module shown in Figure 1, the boundary frame is usually an insulating frame.

[0023] FIG. 2 is a schematic cross-sectional view of an assembly of a screen module according to the present application. FIG. 3 is a schematic diagram of a specific arrangement of an assembly of a screen module according to the present application. As shown in FIG. 2 and FIG. 3, when divided along the dotted line in FIG. 2, one end of the metal partition wall 3 is connected to the metal housing 1, and the other end of the metal partition wall 3 extends in a direction away from the metal housing 1. An end surface 31 is formed at the end away from the metal housing 1. The screen module 4 is disposed on the side of the metal partition wall 3. The edge of the insulating frame 2 is used as an example. The insulating frame 2 includes a first side edge 21, a connecting portion 22, and a second side edge 23. The first side edge 21 is disposed on the side of the metal partition wall 3 opposite to the screen module 4. The connecting portion 22 is disposed at the end of the first side edge 21 away from the metal housing 1. The connecting portion 22 includes a joint surface 221 facing the metal housing 1 and a first surface 222 facing the screen module 4. The second side edge 23 is disposed on the side of the connection part 22 facing the screen module 4. The second side edge 23 includes a second surface 231 facing the screen module 4. A continuous conductive layer is disposed on the joint surface 221, the first surface 222, and the second surface 231. The first side edge 21 is configured to be clamped in a groove formed by the metal bulkhead 3 and the metal housing 1. The connection part 22 includes a joint surface 221. The joint surface 221 is connected to the end surface 31 in a manner that conducts static electricity. The second side edge 23 is configured to fix the screen module 4. It should be noted that the static electricity sensing area is disposed on the side of the side edge of the screen module, as shown in the dashed box in FIG. 3, so that static electricity is easy to enter along the side edge of the screen module.

[0024] FIG. 4 is a diagram of a folding scenario of a screen module according to the present application. An AMOLED flexible screen is used as an example. Since the AMOLED flexible screen is formed by packaging a polymer substrate and a series of organic films, the AMOLED flexible screen is inherently a multi-layer structure. When the screen module is folded, the screen module will be deformed as shown in FIG. 4 for a certain thickness of the screen module. Since the polymer substrate layer of the screen module is folded at the outermost layer, this layer will be slightly deformed. With increasing thickness, the organic film layers farther from the folding position will be gradually deformed more.

[0025] Static electricity exists at the side edge of the screen module. In the AMOLED flexible screen, the AMOLED flexible screen is formed by packaging a polymer substrate and a series of organic films. As shown in the dashed box in Figure 4, the static electricity sensing area is located at the side edge of the screen module of the AMOLED flexible screen, so static electricity is easy to generate and enter along the side edge of the screen module, and then transmitted to other areas through the conductive layer. Static electricity has the characteristics of long-term accumulation, high voltage, low battery level, small current, and short action event. When static electricity discharge occurs, mobile phones may freeze frequently, automatically turn off, reduce image quality and volume, and have unstable signal quality. Therefore, ESD has become an important content for the quality control of electronic products. ESD certification is to be carried out in the process of putting electronic devices into the market. Therefore, electrostatic discharge protection is important for electronic devices. The existing strategies to solve static electricity are insulation or grounding.

[0026] In foldable electronic devices, the screen module is deformed when folded. Therefore, relative slippage occurs between the insulating frame used to cover the gap formed between the screen module and the metal housing and the screen module, and the insulation may not be achieved by conventional hot melt adhesive or back adhesive, etc., and the screen module is easily damaged. Therefore, in foldable electronic devices, electrostatic discharge protection is usually implemented by grounding.

[0027] FIG. 5 is a schematic diagram of an electrostatic discharge protection structure according to the present application. As shown in FIG. 5, the first side edge 21 includes a third surface 211 facing the side of the metal housing 1 and a fourth surface 212 facing the side of the screen module. A continuous conductive layer is disposed on the second surface 231, the first surface 222, the joint surface 221, and the fourth surface 212. A conductive adhesive is disposed between the third surface 211 and the metal housing 1, and the conductive layer is connected to the metal housing 1 by the conductive adhesive. When entering from the side edge of the screen module, the static charge is conducted to the conductive adhesive along the conductive layer, and then conducted to the metal housing 1 by the conductive adhesive, and finally discharged by grounding. Therefore, in the process of manufacturing the electrostatic discharge protection structure, the conductive adhesive is applied to the bottom of the groove formed by the metal partition 3 and the metal housing 1. The existing manufacturing process does not guarantee the uniformity and tightness of the application. In order to ensure the performance and adhesion degree of the conductive adhesive, when the adhesive is applied to a groove with a certain depth, the amount of conductive adhesive may increase the width of the black border of the screen, which affects the competitiveness of the product's appearance. Furthermore, since the antenna area is located on the opposite side of the insulating frame 2 to the screen module 4, the antenna is located as far away from the interference-causing components as possible to prevent harmonic interference caused by the components to the antenna. According to the electrostatic discharge protection structure shown in Figure 5, the antenna area is close to the ground position of the conductive layer and the conductive adhesive, so that the RSE risk is easily caused by poor grounding.

[0028] The gap discharge includes two electrodes. One electrode is fixed to the insulator, and the other electrode is connected to the grounding device through an auxiliary gap, and a certain gap distance is maintained between the two electrodes. When an instantaneous overvoltage occurs, the gap is broken and a part of the overvoltage charge flows to the ground. This prevents the voltage of the protected device from rising. Figure 6 is a schematic diagram of another electrostatic discharge protection structure. Static electricity is discharged in the gap. As shown in Figure 6, a continuous conductive layer is disposed on the second surface 231, the first surface 222, the joint surface 221, and the fourth surface 212. The conductive layer disposed on the fourth surface 212 extends from one end of the first side edge 21 away from the metal housing 1 to the middle position of the first side edge 21, and corresponds to an electrode fixed to the insulator. A specified gap distance is maintained between the conductive layer on the fourth surface 212 and the metal partition 3 for the gap discharge. The metal partition 3 and the metal housing 1 are connected and grounded to discharge static electricity. The metal partition 3 corresponds to an electrode connected to a grounding device through an auxiliary gap. When static electricity enters the side edge of the screen module 4, the static charge is conducted along the conductive layer, breaks the gap, and is conducted through the metal partition 3 to the metal housing 1, where it is discharged by grounding.

[0029] Secondary discharge means abnormal discharge on the processed surface due to the presence of pitting products, etc. Arc sparks occur during this abnormal discharge. Such secondary discharge in electronic devices may cause problems such as freezing of mobile phones and deterioration of call quality. When providing a conductive layer, the existing conductive layer mounting technology is not advanced. Taking a conductive copper sheet as an example, in the electrostatic discharge protection structure shown in FIG. 6, the conductive layer on the fourth surface 212 extends from one end of the first side edge 21, which is far from the metal housing 1, to the middle position of the fourth surface 212. A certain gap should be arranged between the conductive layer and the metal partition wall 3. When the conductive layer is made from a conductive copper sheet, due to the limitations of the mounting technology, the conductive copper sheet is not fixed at the middle position and is prone to curling. When the electrostatic discharge protection structure is placed in a folding electronic device, the screen module 4 is deformed during the folding process of the electronic device. Therefore, the gap distance between the conductive layer and the metal partition wall 3 changes due to folding, and the curled conductive copper sheet is easily contacted with the metal partition wall 3, resulting in secondary discharge.

[0030] In order to solve the problems in the prior art, this embodiment of the present application describes an electrostatic discharge protection structure, according to which the electrostatic discharge protection structure can effectively discharge the electrostatic charge at the side edges of the screen module 4, and the electrostatic discharge protection can be effectively provided for each side edge of the screen module 4, ensuring the antenna performance, and preventing the risk of RSE and secondary discharge caused by grounding fault in the prior art.

[0031] FIG. 7 is a schematic diagram of an electrostatic discharge protection structure according to an embodiment of the present application. As shown in FIG. 7, the electrostatic discharge protection structure provided in this embodiment of the present application includes a metal housing 1, an insulating frame 2, and a metal partition wall 3. One end of the metal partition wall 3 is connected to the metal housing 1, and the other end of the metal partition wall 3 extends in a direction away from the metal housing 1. An end surface 31 is formed at the end away from the metal housing 1. The screen module 4 is disposed on the side of the metal partition wall 3. The insulating frame 2 includes a first side edge 21, a connecting portion 22, and a second side edge 23. The first side edge 21 is disposed on the side of the metal partition wall 3 opposite to the screen module 4. An insulating layer is disposed between the first side edge 21 and the metal partition wall 3. The connecting portion 22 is disposed at the end of the first side edge 21 away from the metal housing 1. The connecting portion 22 includes a joint surface 221 attached to the end surface 31 and a first surface 222 facing the screen module 4. An insulating layer is disposed between the joint surface 221 and the end surface 31, and an insulating layer is disposed between the metal partition 3 and the screen module 4. The second side edge 23 is disposed on the side of the connection portion 22 facing the screen module 4. The second side edge 23 includes a second surface 231 facing the screen module. A continuous conductive layer is disposed on the joint surface 221, the first surface 222 and the second surface 231. Since an insulating layer is disposed on the end surface 31 of the metal partition 3, DC insulation is implemented between the joint surface 221 and the end surface 31. This prevents the RSE risk caused by the conventional ground fault. When entering from the side edge of the screen module 4, the static electricity is guided to the joint surface 221 through the continuous conductive layer disposed on the second surface 231, the first surface 222 and the joint surface 221, and the joint surface 221 is closely attached to the end surface 31. Since the static electricity has a high voltage, it may cause insulation breakdown, and the insulating layer of the end surface 31 is destroyed. Therefore, the static electricity is conducted to the metal housing 1 through the metal partition 3 and is discharged by grounding.

[0032] In the implementation, the metal partition 3 is perpendicular to the metal housing 1. The metal partition 3 includes, but is not limited to, a solid cube or a hollow cube. When the metal partition 3 is a solid cube, the manufacturing process is simple, the metal partition is easily poured, and is entirely conductive. When the metal partition 3 is a hollow cube, a part of the material is scraped off during the manufacturing process, which facilitates the heat dissipation of the screen module 4. The first side edge 21 and the second side edge 23 are vertically arranged in an L-shape, and the connection portion 22 is arranged at the corner of the L-shape. The first surface 222 and the side edge of the metal partition 3 facing the screen module 4 are located on the same plane. The metal housing 1, the metal partition 3, the first surface 222, and the second surface 231 form a space for accommodating the screen module 4. The side edge of the metal partition 3 opposite to the screen module 4 and the metal housing 1 form a rectangular groove, and the rectangular groove is clamped to the first side edge 21.

[0033] In practice, the metal housing and the metal partition wall are integrally formed. In this way, in the process of manufacturing electronic devices, the metal housing and the metal partition wall can be integrally poured, so as to simplify the manufacturing process. Furthermore, since the metal housing and the metal partition wall are integrally poured and firmly connected, when static electricity is conducted, the static electricity can be directly conducted to the metal housing through the metal partition wall and discharged by grounding, so that the grounding effect is good.

[0034] 8 is a schematic diagram of the layout of a screen module according to an embodiment of the present application. As shown in FIG. 8, in the implementation, the screen module 4 includes a display surface 41 and a rear surface 42 disposed on the opposite side of the display surface 41. The insulating frame 2 is disposed on the periphery of the screen module 4. The metal housing 1 is disposed on the side of the rear surface 42. According to this implementation, the positions of the screen module 4, the insulating frame 2, and the metal housing 1 are specifically limited to ensure that the technical solution presented in the present application is suitable for the electronic device arranged in this layout. Since the AMOLED flexible screen is formed by packaging a polymer substrate and a series of organic films, the AMOLED flexible screen is essentially a multi-layer structure.

[0035] In implementation, the metal housing 1 is a metal middle frame. FIG. 9 is a schematic diagram of a metal middle frame according to an embodiment of the present application. As shown in FIG. 9, the metal middle frame generally includes a middle plate 11 and a metal border frame 12 surrounding the edge of the middle plate 11. The metal middle frame may be regarded as a supporting structure of the electronic device. Components in the electronic device, such as a main board, a camera, a speaker, a battery, and a receiver, may be fixed to the metal middle frame. The metal bulkhead 3 on the metal middle frame may be configured to fix the screen module. The groove formed by the metal middle frame and the metal bulkhead 3 is configured to be clamped to the insulating frame 2. This allows the screen module 4 to be buckled to the metal middle frame via the insulating frame 2, covering the gap between the screen module 4 and the metal middle frame.

[0036] In practice, the metal housing 1 is configured to implement grounding. When the metal housing 1 is a metal middle frame, the metal middle frame can be grounded to achieve the purpose of discharging static electricity.

[0037] In practice, the insulating frame 2 includes a plastic boundary frame. During the manufacturing process of electronic devices, signal failure caused by a metal boundary frame can be prevented. Plastic, as a stable insulating material, can reduce the impact on antenna performance. The insulating material of the insulating frame 2 shown in this application includes but is not limited to plastic, and may also be other insulating materials such as plastic.

[0038] In practice, the insulating layer is a metal anodic oxide layer disposed on the surface of the metal partition 3. After the surface anodizing treatment is performed on the metal material, the corrosion resistance, hardness, wear resistance, insulation, and heat resistance of the metal anodic oxide layer are greatly improved. If the insulating layer of the metal partition is made from a metal anodic oxide layer, the DC insulation can be improved. Under the condition of no static electricity, the insulating performance is good because the metal anodic oxide layer is disposed on the outside of the metal partition 3. Therefore, under normal circumstances, the metal partition is in a DC insulation state, no charge is conducted, and the impact on the antenna area is small. If static electricity enters along the side edge of the screen, the static electricity has a high voltage, so that insulation breakdown may be caused, and the conductive layer conducts the static electricity to the metal partition through the joint surface, and then through the metal housing to ground.

[0039] In practice, the metal anodized oxide layer comprises an aluminum anodized oxide layer. When anodized, the performance of aluminum is excellent. The aluminum anodized oxide layer can be further improved in corrosion resistance and wear resistance by subjecting the aluminum anodized oxide layer to aluminum anodizing and sealing treatment with hot water, high temperature steam, or nickel salt.

[0040] In implementation, the conductive layer includes at least one of the following materials: conductive silver paste, conductive copper sheet, conductive graphite, and conductive cloth. In this way, multiple materials may be selected as the material of the conductive layer based on the specific arrangement of the electrostatic discharge protection structure. Since the conductive layer shown in the embodiment of the present application is only arranged on the joint surface 221, the first surface 222, and the second surface 231, the conductive layer shown in the present application is more easily arranged, and the tolerance of the gap between the insulating frame 2 and the metal partition wall 3 can be small. That is, the error of the mounting of the conductive layer is not considered. Taking the copper sheet as an example, when the conductive layer of the present application is made of a conductive copper sheet, compared with the electrostatic discharge protection structure shown in FIG. 7, the difficulty of mounting the conductive copper sheet is reduced, and the risk of the screen module being damaged due to the screen module being scratched by the curled conductive copper sheet when the screen module is folded can be prevented.

[0041] In the implementation, the first side edge 21 further includes a third surface 211. The third surface 211 is disposed on the side of the first side edge 21 facing the metal housing 1. There is a gap between the third surface 211 and the metal housing 1. An insulating layer is disposed between the first side edge 21 and the metal partition wall 3, and the metal partition wall 3 plays a clamping role. Therefore, the third surface 211 does not need to be closely attached to the metal housing 1 and fixed with adhesive, and the DC insulation is implemented when the metal partition wall 3 is clamped. This prevents the increase in the width of the black edge of the screen caused by fixing the metal housing with conductive adhesive, and also prevents the RSE risk of the antenna due to grounding failure. It should be noted that the gap between the third surface 211 and the metal housing 1 may be used to control the closeness of the attachment of the joint surface 221 to the end surface 31, and then control the effect of destroying the insulating layer by static electricity. The insulating frame 2 is generally made by a deformable material. Therefore, when the first side edge 21 is clamped to the metal partition 3 and the gap is small, the bonding surface 221 is closely attached to the end surface 31. When the first side edge 21 is clamped to the metal partition 3 and the gap is large, a small gap exists between the bonding surface 221 and the end surface 31, and static electricity is transmitted across the small gap.

[0042] In practice, an antenna area is placed on the side of the insulating frame 2 opposite the screen module. Due to the requirements for signal strength, the antenna is usually placed near the boundary frame. The antenna area is placed on the side of the insulating frame, so that it has less impact on signal transmission.

[0043] In practice, the electrostatic discharge protective structure is used in foldable electronic devices, which are deformed during the folding process, so the risks of RSE and secondary discharge caused by grounding defects cannot be prevented by current technical solutions.

[0044] The embodiment of the present application further provides an electronic device, which includes the electrostatic discharge protection structure provided in the above embodiment. The electronic device may include, for example, a mobile phone, a tablet computer, a personal computer, a workstation device, a large screen device (e.g., smart screen and intelligent television), a portable game console, a home game console, a virtual reality device, an augmented reality device, a mixed reality device, an intelligent vehicle terminal, an autonomous vehicle, a customer-premises equipment (CPE), and the like.

[0045] According to the electronic device provided in the present application, an insulating layer is disposed on the end surface of the metal partition, so that DC insulation is implemented between the joint surface and the end surface. This prevents RSE caused by conventional ground faults. When entering from the side edge of the screen module, static electricity is transmitted to the joint surface through the continuous conductive layer disposed on the second surface, the first surface and the joint surface. Since static electricity has a high voltage, it may cause insulation breakdown. Therefore, the static electricity is transmitted to the metal housing through the metal partition and discharged by grounding.

[0046] This application claims priority to Chinese Patent Application No. 202110993811.6, entitled "ELECTRO-STATIC DISCHARGE PROTECTION STRUCTURE AND ELECTRONIC DEVICE," filed with the State Intellectual Property Office of the People's Republic of China on August 27, 2021, and the prior Chinese patent application is incorporated herein by reference in its entirety.

Claims

1. The device has a metal housing, an insulating frame, and a metal partition wall, one end of the metal partition wall is connected to the metal housing, and the other end of the metal partition wall extends in a direction away from the metal housing to form an end face at one end away from the metal housing, and a screen module is disposed on a side of the metal partition wall; the insulating frame has a first portion located on the screen module and a second portion located on the metal partition wall, a continuous conductive layer is disposed between the first portion of the insulating frame and the screen module, the continuous conductive layer extending from above the screen module to a position between the metal partition wall and the second portion of the insulating frame; the second portion of the insulating frame has a joint surface, the joint surface faces the end surface of the metal partition wall, an insulating layer is disposed between the joint surface and the end surface, the insulating layer is disposed between the conductive layer and the end surface, and the insulating layer is an insulating layer that can be destroyed by static electricity. Electrostatic discharge protection construction.

2. The joining surface and the end surface are arranged opposite each other.

2. The electrostatic discharge protection structure of claim 1.

3. The metal housing and the metal partition wall are integrally formed.

2. The electrostatic discharge protection structure of claim 1.

4. The insulating frame comprises a plastic frame.

2. The electrostatic discharge protection structure of claim 1.

5. the screen module has a display surface and a back surface disposed opposite the display surface; The insulating frame is disposed around the outer periphery of the screen module, The metal housing is disposed on the rear side.

2. The electrostatic discharge protection structure of claim 1.

6. the insulating layer is a metal anodic oxide layer disposed on a surface of the metal partition wall; 2. The electrostatic discharge protection structure of claim 1.

7. The metal anodized oxide layer comprises an aluminum anodized oxide layer.

7. The electrostatic discharge protection structure of claim 6.

8. The conductive layer comprises at least one of the following materials: conductive silver paste, conductive copper sheet, conductive graphite, and conductive cloth.

2. The electrostatic discharge protection structure of claim 1.

9. The insulating frame further has a third portion, the third portion being disposed on a side of the metal partition wall away from the screen module, and a gap being present between the third portion and the metal housing.

2. The electrostatic discharge protection structure of claim 1.

10. The insulating frame further has a third portion, the third portion being disposed on a side of the metal partition away from the screen module, the third portion having a third surface; the third surface is a surface of the insulating frame facing the metal housing, a gap exists between the third surface and the metal housing; 2. The electrostatic discharge protection structure of claim 1.

11. An antenna area is arranged on the insulating frame on the side opposite to the screen module.

2. The electrostatic discharge protection structure of claim 1.

12. The electrostatic discharge protection structure is used in foldable electronic devices.

2. The electrostatic discharge protection structure of claim 1.

13. An electronic device comprising the electrostatic discharge protection structure according to claim 1 .

14. The electrostatic discharge protection structure is disposed on an edge of a screen of the electronic device.

14. The electronic device according to claim 13.

15. A plurality of electrostatic discharge protection structures are arranged, and the plurality of electrostatic discharge protection structures are arranged at frame positions of the electronic device.

15. The electronic device according to claim 14.

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