Impurity treatment device and impurity treatment method

Abstract

An impurity treatment device for treating metal impurities included in a solid-liquid mixture for forming an electrode of a power storage device, wherein said impurity treatment device comprises: a first electrode and a second electrode for applying an electric field to a solid-liquid mixture; and a power supply unit that causes electrical current of 0.1 mA or more to flow between the first electrode and the second electrode.

Description

[Technical field]

[0001] The present disclosure relates to an impurity treatment device and an impurity treatment method. [Background technology]

[0002] When preparing a solid-liquid mixture having electronic conductivity, metal particles may be mixed in as impurities. When this solid-liquid mixture is used in an electronic device, the impurities may cause defects in the electronic device. For example, examples of electronic devices include electric storage devices such as lithium ion batteries, lithium ion secondary batteries, alkaline dry batteries, electric double layer capacitors, and electrochemical capacitors. Examples of solid-liquid mixtures include electrode slurries used in these electric storage devices. When metal impurities are mixed into the electrode slurry, the metal impurities may cause a short circuit between the positive and negative electrodes. In response to this, for example, Patent Document 1 discloses a method of magnetically removing metal foreign matter contained in an aqueous slurry containing an electrode active material and a particulate binder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2014 / 142045 Summary of the Invention

[0004] Conventional methods that use magnetism to remove metallic impurities are unable to remove impurities made of non-magnetic metals, and therefore have an insufficient rate of impurity treatment.

[0005] One aspect of the present disclosure is an impurity treatment device for treating metal impurities contained in a solid-liquid mixture for forming an electrode for a power storage device, the device including a first electrode and a second electrode for applying an electric field to the solid-liquid mixture, and a power supply unit for passing a current of 0.1 mA or more between the first electrode and the second electrode.

[0006] Another aspect of the present disclosure is an impurity treatment method for treating metal impurities contained in a solid-liquid mixture for forming an electrode for a power storage device, the method including passing a current of 0.1 mA or more between a first electrode and a second electrode that apply an electric field to the solid-liquid mixture.

[0007] Any combination of the above components and any conversion of the expression of the present disclosure between a method, an apparatus, a system, etc. are also valid as aspects of the present disclosure.

[0008] According to the present disclosure, it is possible to reduce the size of metal impurities contained in a solid-liquid mixture for forming an electrode for an electricity storage device. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a coating device provided with an impurity treatment device according to the first embodiment. [Figure 2A] FIG. 2A is a perspective view illustrating a schematic view of an electrode portion. [Figure 2B] FIG. 2B is a perspective view illustrating a schematic view of an electrode portion. [Figure 2C] FIG. 2C is a perspective view illustrating a schematic view of an electrode portion. [Figure 3A] FIG. 3A is a schematic diagram of an electrode unit included in the impurity treatment apparatus according to the second embodiment. [Figure 3B] FIG. 3B is a schematic diagram of an electrode unit included in the impurity treatment apparatus according to the second embodiment. [Figure 3C] FIG. 3C is a schematic diagram of an electrode unit included in the impurity treatment apparatus according to the second embodiment. [Figure 3D] FIG. 3D is a schematic diagram of an electrode unit included in the impurity treatment apparatus according to the second embodiment. [Figure 3E] FIG. 3E is a schematic diagram of an electrode unit included in the impurity treatment apparatus according to the second embodiment. [Figure 3F] FIG. 3F is a schematic diagram of an electrode unit included in the impurity treatment apparatus according to the second embodiment. [Figure 4A]FIG. 4A is a diagram showing a specific example of a current flowing from a power supply unit between a first electrode and a second electrode. [Figure 4B] FIG. 4B is a diagram showing a specific example of a current flowing from a power supply unit between the first electrode and the second electrode. [Figure 4C] FIG. 4C is a diagram showing a specific example of a current flowing from a power supply unit between the first electrode and the second electrode. [Figure 4D] FIG. 4D is a diagram showing a specific example of a current flowing from a power supply unit between the first electrode and the second electrode. [Diagram 5] FIG. 5 is a diagram illustrating a first example of the configuration of the power supply unit. [Figure 6] FIG. 6 is a diagram illustrating a second configuration example of the power supply unit. [Figure 7] FIG. 7 is a diagram illustrating a third example of the configuration of the power supply unit. [Figure 8] FIG. 8 shows experimental data when various types of electric current were passed through a solid-liquid mixture for one hour. [Figure 9] FIG. 9 is a plot of the relationship between the amount of electricity applied to the solid-liquid mixture and the amount of copper dissolved. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present disclosure will be described below with reference to the drawings based on preferred embodiments. The embodiments are illustrative and do not limit the present disclosure, and all features and combinations thereof described in the embodiments are not necessarily essential to the present disclosure. The same or equivalent components, members, and processes shown in each drawing are given the same reference numerals, and duplicated descriptions are omitted as appropriate. In addition, the scale and shape of each part shown in each drawing are set for convenience to facilitate explanation, and are not to be interpreted as being limiting unless otherwise specified. In addition, when terms such as "first" and "second" are used in this specification or claims, unless otherwise specified, these terms do not represent any order or importance, but are intended to distinguish one configuration from another. In addition, some of the members that are not important in explaining the embodiment in each drawing are omitted.

[0011] (Embodiment 1) 1 is a schematic diagram of a coating apparatus provided with an impurity treatment device according to embodiment 1. The coating apparatus 1 includes a coating die 2, a valve 4, a tank 6, a pump 8, a feed pipe 10, a return pipe 12, and a die supply pipe 14.

[0012] The coating die 2 is a tool for applying the coating material 18 to the workpiece 16. The coating device 1 of this embodiment is used, as an example, to manufacture an electrode plate for a secondary battery. The electrode plate for a secondary battery is a sheet-shaped electrode material obtained by applying an electrode slurry to a current collector and drying it. Therefore, in this embodiment, the workpiece 16 is a current collector for a secondary battery, and the coating material 18 is an electrode slurry for a secondary battery. The current collector is, for example, a metal foil. The electrode slurry is an electronically conductive solid-liquid mixture containing an electrode active material and a solvent. In the case of a typical lithium-ion secondary battery, the positive electrode plate is prepared by applying an electrode slurry containing a positive electrode active material such as lithium cobalt oxide or lithium iron phosphate to an aluminum foil. The negative electrode plate is prepared by applying an electrode slurry containing a negative electrode active material such as graphite to a copper foil.

[0013] The coating die 2 is disposed so that the discharge port 22 faces the peripheral surface of the backup roll 20 at a predetermined distance. The workpiece 16 is continuously transported by the rotation of the backup roll 20 to a position where the backup roll 20 and the discharge port 22 face each other.

[0014] A valve 4 is connected to the coating die 2 via a die supply pipe 14. The valve 4 can switch between supplying and not supplying paint 18 to the coating die 2. The coating device 1 can discharge paint 18 from the coating die 2 to a workpiece 16 while the paint 18 is being supplied to the coating die 2. A tank 6 is connected to the valve 4 via a feed pipe 10 and a return pipe 12.

[0015] The tank 6 stores the paint 18. A pump 8 is provided in the feed pipe 10, and the paint 18 is fed from the tank 6 to the valve 4 by driving the pump 8. The valve 4 supplies the paint 18 supplied from the tank 6 to the coating die 2 via a die supply pipe 14. Alternatively, the valve 4 returns the paint 18 supplied from the tank 6 to the tank 6 via a return pipe 12.

[0016] The valve 4 supplies the paint 18 to the coating die 2, so that the paint 18 can be discharged from the coating die 2 to form a coated portion 18a of the paint 18 on the workpiece 16. The valve 4 also returns the paint 18 to the tank 6, so that application of the paint 18 from the coating die 2 can be stopped and an uncoated portion 16a of the paint 18 can be formed on the workpiece 16. In other words, the valve 4 allows the paint 18 to be intermittently coated on the workpiece 16. The uncoated portion 16a is used for attaching a center lead of an electrode, etc. The configuration of each part of the coating device 1 is not limited to that described above.

[0017] The coating device 1 is provided with an impurity treatment device 100 according to this embodiment. The impurity treatment device 100 includes a pipe 102, an electrode unit 104, and a power supply unit 106. The pipe 102 is a flow path through which the liquid to be treated containing metal impurities flows. In this embodiment, the region of the feed pipe 10 between the tank 6 and the pump 8 constitutes the pipe 102. That is, the impurity treatment device 100 is provided in the feed pipe 10. Moreover, the paint 18, in other words, the electrode slurry containing the solvent and the electrode active material, corresponds to the liquid to be treated.

[0018] The impurity treatment device 100 may be provided in a region between the pump 8 and the valve 4 in the feed pipe 10. The impurity treatment device 100 may also be provided in the return pipe 12, the die supply pipe 14, or the like. The coating device 1 is not limited to use for manufacturing electrode plates for secondary batteries, and the body 16 to be coated and the coating material 18 do not have to be an electrode plate and an electrode slurry. The impurity treatment device 100 may also be provided in a device other than the coating device 1, for example, a device for manufacturing the liquid to be treated.

[0019] The electrode unit 104 includes a first electrode 108 and a second electrode 110. FIGS. 2A to 2C are perspective views that show the electrode unit 104 in a schematic manner. FIG. 2A is a first example of the electrode unit 104, FIG. 2B is a second example of the electrode unit 104, and FIG. 2C is a third example of the electrode unit 104. The first electrode 108 and the second electrode 110 are disposed in the pipe 102. The electrode unit 104 of the present embodiment has a rod-shaped body 112 that is inserted into the pipe 102. The first electrode 108 is provided in the pipe 102, and the second electrode 110 is provided in the rod-shaped body 112. The first electrode 108 and the second electrode 110 are insulated from each other.

[0020] The first electrode 108 and the second electrode 110 are made of a material having electrical conductivity. The material has, for example, a volume resistivity of 0.1 Ω·cm or less. Specific examples of materials that make up the first electrode 108 and the second electrode 110 include insoluble metals such as stainless steel, titanium, platinum, gold, niobium, and ruthenium, and carbon. These materials can also be combined as appropriate.

[0021] The first electrode 108 is provided at least on the inner wall (inner circumferential surface) of the pipe 102. The first electrode 108 may be provided on the entire inner wall of the pipe 102, or may be provided on a part of it. When the first electrode 108 is provided on a part of the inner wall, it may be a part of the area in the flow direction of the liquid to be treated, or may be a part of the area in the circumferential direction of the pipe 102. Furthermore, the entire pipe 102 may be made of an insoluble metal or the like, and the entire pipe 102 may constitute the first electrode 108. In other words, the first electrode 108 may be provided only on the surface of the inner wall of the pipe 102, or may be provided up to the inside of the inner wall.

[0022] The second electrode 110 is provided at least on the outer wall (peripheral surface) of the rod-shaped body 112. The second electrode 110 may be provided on the entire outer wall of the rod-shaped body 112, or on a part of it. When the second electrode 110 is provided on a part of the outer wall, it may be a part of the area in the flow direction of the liquid to be treated, or a part of the area in the circumferential direction of the rod-shaped body 112. Furthermore, the entire rod-shaped body 112 may be made of an insoluble metal or the like, and the entire rod-shaped body 112 may constitute the second electrode 110. In other words, the second electrode 110 may be provided only on the surface of the outer wall of the rod-shaped body 112, or may be provided up to the inside of the outer wall.

[0023] In a first example shown in FIG. 2A, the rod-shaped body 112 is hollow. The inside of the rod-shaped body 112 is sealed, and the liquid to be treated does not flow. In a second example shown in FIG. 2B, the rod-shaped body 112 is solid. By using a hollow or solid rod-shaped body 112 as the second electrode 110, it is possible to suppress an increase in pressure loss caused by the second electrode 110 when the liquid to be treated passes through the pipe 102. On the other hand, in a third example shown in FIG. 2C, the rod-shaped body 112 is a cylindrical mesh. The liquid to be treated can move between the inside and outside of the rod-shaped body 112 through the openings of the mesh while flowing through the pipe 102. By using a cylindrical mesh rod-shaped body 112 as the second electrode 110, it is possible to increase the contact area between the second electrode 110 and the liquid to be treated, thereby increasing the treatment rate of impurities by the impurity treatment device 100.

[0024] The power supply unit 106 passes a current between the first electrode 108 and the second electrode 110. The power supply unit 106 can be configured with a known DC / DC converter, a DC / AC inverter, or the like. For example, the first electrode 108 is connected to a positive output terminal of the power supply unit 106, and the second electrode 110 is connected to a negative output terminal of the power supply unit 106. Therefore, the first electrode 108 is a positive electrode, and the second electrode 110 is a negative electrode. The first electrode 108 may be a negative electrode, and the second electrode 110 may be a positive electrode. The current passed by the power supply unit 106 may be a direct current or an alternating current. The amount of current passed by the power supply unit 106 is, for example, 0.1 mA or more and 12 mA or less.

[0025] By applying a voltage from the power supply unit 106 to the first electrode 108 and the second electrode 110 and passing a current through the liquid to be treated to generate an electric field in the pipe 102, the metal impurities in the liquid to be treated can be ionized and miniaturized. Some of the metal impurities contained in the electrode slurry are as large as several hundred μm, but they can be miniaturized to a size of 10 μm or less by passing a current through the liquid to be treated. The inventors have confirmed that when a current is passed through the liquid to be treated that contains a copper wire as a metal impurity model, the mass of the copper wire decreases linearly with an increase in the amount of electricity, that is, the metal impurities are miniaturized. They have also confirmed that metal impurities can be miniaturized by passing either a direct current or an alternating current.

[0026] Moreover, by generating an electric field in the pipe 102 by the power supply unit 106, the metal impurities can be ionized and electrodeposited onto the surface of the first electrode 108 or the second electrode 110. This makes it possible to remove the metal impurities from the liquid to be treated. Note that a direct current is more suitable for micronizing the metal impurities, while an alternating current is more suitable for electrodeposition of the metal impurities. Those skilled in the art can appropriately set the conditions for electrodepositing the metal impurities onto the electrode surfaces.

[0027] By miniaturizing or removing the metal impurities, it is possible to prevent the metal impurities themselves from causing a short circuit between the positive and negative electrodes. In addition, in an electricity storage device in which an electrolyte is interposed between the positive and negative electrodes, if the positive electrode slurry contains metal impurities, the metal impurities may dissolve into the electrolyte during charging of the electricity storage device, and may be reduced and precipitated on the surface of the negative electrode. If this precipitation is repeated, the metal impurities grow into dendrites, penetrate the separator, reach the positive electrode, and cause a short circuit. The larger the size of the metal impurities, the more likely they are to cause a short circuit due to dendrites. Therefore, by miniaturizing or removing the metal impurities, it is possible to prevent a short circuit due to dendrites. Therefore, by passing a current through the liquid to be treated by the impurity treatment device 100, it is possible to remove the metal impurities in the liquid to be treated, and even if they remain in the liquid to be treated, they can be converted into a form that is less likely to adversely affect the performance of the electricity storage device.

[0028] The application of voltage from the power supply unit 106 is controlled by the control device 107, for example. The control device 107 is realized as a hardware configuration by elements and circuits including a computer CPU and memory, and as a software configuration by a computer program or the like. Those skilled in the art will understand that these functional blocks can be realized in various forms by combining hardware and software. The control device 107 controls the power supply unit 106, for example, based on the value of the current flowing from the power supply unit 106 and the time for which the current flows. In this case, the control device 107 constitutes a part of the impurity treatment device 100. Note that the on / off of the power supply unit 106 may be controlled independently of the control device 107. The control device 107 may control the valve 4 and the pump 8.

[0029] As described above, the impurity treatment device 100 according to this embodiment includes a pipe 102 through which the liquid to be treated containing metal impurities flows, a first electrode 108 and a second electrode 110 disposed in the pipe 102, and a power supply unit 106 for passing a current between the first electrode 108 and the second electrode 110. The impurity treatment device 100 according to this embodiment micronizes or removes metal impurities by passing a current through the liquid to be treated, so that even if the impurities are non-magnetic metals, they can be treated. Therefore, the treatment rate of impurities can be increased. In addition, since a current is passed through the liquid to be treated flowing in the pipe 102, it is possible to treat the metal impurities while transporting the liquid to be treated. In addition, the micronized metal impurities can be carried along with the flow of the liquid to be treated and widely dispersed.

[0030] As an example, the liquid to be treated is an electrode slurry containing a solvent and an electrode active material. The piping 102 is provided in a coating device 1 including a coating die 2 for applying the liquid to the object to be coated 16 and a tank 6 for storing the liquid to be treated. This allows impurity treatment to be performed in the process of transporting the liquid to be treated from the tank 6 to the coating die 2. In addition, by disposing the impurity treatment device 100 in the feed piping 10 or the die supply piping 14 of the coating device 1, the liquid to be treated can be subjected to impurity treatment until just before it is applied to the object to be coated 16. Therefore, the impurity treatment device 100 of this embodiment can improve the performance of the electronic device.

[0031] Moreover, the impurity treatment device 100 can be installed in an existing device by simply using part of the piping in the device as the piping 102, or by simply replacing part of the piping with the piping 102 of the impurity treatment device 100. Therefore, the impurity treatment device 100 can be easily installed, replaced, and maintained.

[0032] In the impurity treatment device 100 of this embodiment, the first electrode 108 is provided on the pipe 102, and the second electrode 110 is provided on a rod-shaped body 112 inserted into the pipe 102. This allows the structures of the first electrode 108 and the second electrode 110 to be simplified. The rod-shaped body 112 is a hollow body, a solid body, or a cylindrical mesh. When the rod-shaped body 112 is a hollow body or a solid body, it is possible to suppress an increase in pressure loss when the liquid to be treated passes through the pipe 102. When the rod-shaped body 112 is a cylindrical mesh, it is possible to increase the contact area between the second electrode 110 and the liquid to be treated, thereby increasing the impurity treatment rate.

[0033] (Embodiment 2) The second embodiment has a common configuration with the first embodiment, except for the arrangement of the first electrode 108 and the second electrode 110. Below, the present embodiment will be described focusing on the configuration different from the first embodiment, and the common configuration will be described briefly or omitted.

[0034] Figures 3A to 3F are schematic diagrams of electrode unit 104 included in impurity treatment apparatus 100 according to embodiment 2. Figure 3A is a fourth example of electrode unit 104, Figure 3B is a fifth example of electrode unit 104, Figure 3C is a sixth example of electrode unit 104, Figure 3D is a seventh example of electrode unit 104, Figure 3E is an eighth example of electrode unit 104, and Figure 3F is a ninth example of electrode unit 104. Also, Figures 3A to 3F show a state in which the inner wall of pipe 102 is unfolded.

[0035] In the electrode section 104 of the present embodiment, the first electrode 108 and the second electrode 110 are provided in the pipe 102. The first electrode 108 and the second electrode 110 are provided at least on the inner wall of the pipe 102. The first electrode 108 and the second electrode 110 may be provided only on the surface of the inner wall of the pipe 102, or may be provided up to the inside of the inner wall. An insulating section 114 is provided between the first electrode 108 and the second electrode 110. The insulating section 114 electrically insulates the first electrode 108 and the second electrode 110.

[0036] In the fourth example shown in FIG. 3A, the first electrode 108 is laid in approximately 1 / 2 of the area in the circumferential direction on the inner wall of the pipe 102, and the second electrode 110 is laid in the remaining approximately 1 / 2 of the area. The first electrode 108 and the second electrode 110 extend in the direction in which the liquid to be treated flows. In the fifth example shown in FIG. 3B, a plurality of first electrodes 108 and a plurality of second electrodes 110 extending in the direction in which the liquid to be treated flows are alternately arranged in the circumferential direction of the inner wall of the pipe 102. The fourth and fifth examples have a structure in which the first electrodes 108 and the second electrodes 110 are arranged in a stripe pattern. In the fifth example, the area of ​​each electrode is smaller than that of the fourth example, and the layout pattern of each electrode is denser. Therefore, the fifth example can be suitably adopted for a pipe 102 having a larger inner diameter than the fourth example.

[0037] In a sixth example shown in Fig. 3C, the first electrode 108 and the second electrode 110 are each comb-shaped and are laid so as to interdigitate with each other. In a seventh example shown in Fig. 3D, the first electrode 108 and the second electrode 110 are laid in a spiral shape.

[0038] In the eighth example shown in FIG. 3E, the first electrode 108 is laid in approximately half of the area of ​​the inner wall of the pipe 102 in the direction in which the liquid to be treated flows, and the second electrode 110 is laid in approximately the remaining half of the area. The first electrode 108 and the second electrode 110 extend in the circumferential direction of the pipe 102. In the ninth example shown in FIG. 3F, a plurality of first electrodes 108 and a plurality of second electrodes 110 extending in the circumferential direction of the pipe 102 are alternately arranged in the direction in which the liquid to be treated flows. In the eighth and ninth examples, the first electrode 108 and the second electrode 110 are ring-shaped. In the ninth example, the area of ​​each electrode is smaller than that of the eighth example, and the layout pattern of each electrode is denser. Therefore, the ninth example can be suitably adopted for the electrode part 104 that is long in the direction in which the liquid to be treated flows, compared to the eighth example.

[0039] The current flowing from the power supply unit 106 between the first electrode 108 and the second electrode 110 will be described in detail below. Figures 4A to 4D are diagrams showing specific examples of current flowing from the power supply unit 106 between the first electrode 108 and the second electrode 110. Figure 4A is an example in which a constant DC current (continuous current) is flowing, Figure 4B is an example in which an intermittent DC current is flowing, Figure 4C is an example in which a square wave current is flowing, and Figure 4D is an example in which a sine wave current is flowing.

[0040] The intermittent current shown in Figure 4B is a current that periodically switches between periods when the current is flowing and periods when it is cut off. Below, we will assume an intermittent current with a duty ratio of 50% (ratio of on-period to off-period is 1:1). An intermittent current with a duty ratio of 50% corresponds to a DC square wave current with a lower current value of 0A.

[0041] The square wave current shown in FIG. 4C may be an AC current that changes symmetrically between positive and negative around 0V, or may be an AC current or DC current whose central voltage becomes other than 0V by applying a bias voltage. When the entire waveform of the square wave current falls within the positive or negative region, the direction of the current does not change, and it becomes a DC square wave current. Similarly, the sine wave current shown in FIG. 4D may be an AC current that changes symmetrically between positive and negative around 0V, or may be an AC current or DC current whose central voltage becomes other than 0V by applying a bias voltage.

[0042] The power supply unit 106 applies an electric field to a solid-liquid mixture (e.g., electrode slurry) for forming electrodes of the electricity storage device by passing a current of 0.1 mA or more between the first electrode 108 and the second electrode 110. The upper limit of the current passed between the first electrode 108 and the second electrode 110 is set to 100 mA in the case of a facility where the risk of electric shock does not need to be considered (e.g., an unmanned factory). In the case of a facility where the risk of electric shock needs to be considered, the upper limit is set to 10 to 12 mA.

[0043] The values ​​of intermittent current, square wave current, and sine wave current are specified as effective values. The effective value Irms of a current can be calculated by taking the square root of the periodic average of the instantaneous value I(t) squared, as shown in the following (Equation 1).

[0044] Irms = √(1 / T ∫I(t) 2 dt)...(Equation 1) The effective value Irms of the sinusoidal current can also be calculated as 1 / √2 of the maximum value Im of the sinusoidal current, as shown in the following (Equation 2).

[0045] Irms=Im / √2 (Equation 2) 5 is a diagram showing a first configuration example of the power supply unit 106. The power supply unit 106 includes an AC / DC converter 106a, a DC / DC converter 106b, a control circuit 106c, a current sensor 106d, a voltage sensor 106e, a switch SWp, and a switch SWm. The AC / DC converter 106a converts AC power supplied from the commercial power system 200 into DC power. The DC / DC converter 106b can convert the voltage or current of the DC power supplied from the AC / DC converter 106a into another value and output it. The switches SWp and SWm are switches for establishing or interrupting conduction between the DC / DC converter 106b and the solid-liquid mixture between the first electrode 108 and the second electrode 110. A relay or a semiconductor switch can be used for the switches SWp and SWm.

[0046] The current sensor 106d measures the current flowing between the first electrode 108 and the second electrode 110, and outputs the result to the control circuit 106c. The voltage sensor 106e measures the voltage between the first electrode 108 and the second electrode 110, and outputs the result to the control circuit 106c.

[0047] The control circuit 106c can be configured with, for example, a microcomputer. The control circuit 106c controls a switching element included in the DC / DC converter 106b so that the current value measured by the current sensor 106d maintains a target value. By lengthening the on-time of the switching element, the current value output from the DC / DC converter 106b can be increased, and by shortening the on-time, the current value output from the DC / DC converter 106b can be decreased. The target value of the current is set by the control device 107. In this manner, in the present disclosure, current control is executed to maintain the current value output from the DC / DC converter 106b at the target value.

[0048] The control circuit 106c can output a constant current (continuous current) shown in Fig. 4A by fixing the switches SWp and SWm to the on state. The control circuit 106c can output an intermittent current shown in Fig. 4B by turning on / off at least one of the switches SWp and SWm at a set cycle (which may be considered as a frequency). The cycle (frequency) is also set by the control device 107.

[0049] 6 is a diagram showing a second configuration example of the power supply unit 106. The power supply unit 106 includes an AC / DC converter 106a, an inverter 106f, a filter 106g, a control circuit 106c, a current sensor 106d, a voltage sensor 106e, a switch SWp, and a switch SWm. Hereinafter, descriptions that overlap with the first configuration example will be omitted as appropriate.

[0050] The inverter 106f includes a plurality of bridge-connected switching elements, and converts the DC power supplied from the AC / DC converter 106a into AC square wave power centered at 0 V. The filter 106g is formed, for example, by an LC filter, and can shape the waveform of the square wave output from the inverter 106f.

[0051] The control circuit 106c controls the on / off of a plurality of switching elements included in the inverter 106f at a set frequency, and controls the duty ratio of the plurality of switching elements so that the current value measured by the current sensor 106d maintains a target value. The control circuit 106c can output the square wave current shown in Fig. 4C by disabling the filter 106g. The control circuit 106c can also output the sine wave current shown in Fig. 4D by shaping the square wave output from the inverter 106f into a sine wave by enabling the filter 106g.

[0052] 7 is a diagram showing a third configuration example of the power supply unit 106. In the configuration of the power supply unit 106 shown in FIG. 7, the switches SWp and SWm in the configuration of the power supply unit 106 shown in FIG. 5 are replaced with C-contact switches SWpc and SWmc, respectively. The positive-side C-contact switch SWpc is a switch for selectively switching the connection destination of the positive-side output terminal of the DC / DC converter 106b between the first electrode 108 and the second electrode 110. The negative-side C-contact switch SWmc is a switch for selectively switching the connection destination of the negative-side output terminal of the DC / DC converter 106b between the first electrode 108 and the second electrode 110.

[0053] In a first state in which the positive-side C-contact switch SWpc selects the first electrode 108 and the negative-side C-contact switch SWmc selects the second electrode 110, a positive current flows from the DC / DC converter 106b to the solid-liquid mixture. Conversely, in a second state in which the positive-side C-contact switch SWpc selects the second electrode 110 and the negative-side C-contact switch SWmc selects the first electrode 108, a negative current flows from the DC / DC converter 106b to the solid-liquid mixture. The control circuit 106c can output the square wave current shown in FIG. 4C by alternately switching the positive-side C-contact switch SWpc and the negative-side C-contact switch SWmc between the first state and the second state at a set frequency.

[0054] The control circuit 106c may transmit the current value acquired from the current sensor 106d and the voltage value acquired from the voltage sensor 106e to the control device 107. The control device 107 may display the waveforms of the current value and the voltage value acquired from the control circuit 106c on an oscilloscope. In this case, the operator of the coating device 1 can monitor the current and voltage applied to the solid-liquid mixture in real time.

[0055] When an abnormality occurs in at least one of the waveform of the current value and the waveform of the voltage value, the application of current to the solid-liquid mixture may be stopped by an operation of an operator or by an operation program in the control device 107. Also, when the waveform of the voltage value becomes a waveform indicating that the impurities contained in the solid-liquid mixture have been miniaturized to be smaller than a reference value, the application of current to the solid-liquid mixture may be stopped by an operation of an operator or by an operation program in the control device 107.

[0056] FIG. 8 shows experimental data when various types of electric current were passed through the solid-liquid mixture for one hour. In this experiment, a solid-liquid mixture containing a copper wire as a foreign metal was placed between the first electrode 108 and the second electrode 110. The change in mass of the copper wire was measured before and after passing an electric current through the solid-liquid mixture. In the graph of FIG. 8, the presence or absence of copper elution is indicated as "Yes" if there was a mass reduction of 0.1 mg or more, and "No" if there was no copper elution. The presence or absence of alteration of the solid-liquid mixture is indicated by visually checking the presence or absence of a change in the state of the solid-liquid mixture after passing an electric current through the solid-liquid mixture for one hour. Specifically, if an altered substance is present on the mesh after the mesh pass, it is indicated as "Yes", and if not, it is indicated as "No". For example, if the viscosity changes due to gelation of the solid-liquid mixture, or a change in the volume or solid content ratio, altered substances may remain on the mesh.

[0057] The voltage value depends on the conductivity of the solid-liquid mixture (which may be considered as resistance) and the distance between the first electrode 108 and the second electrode 110 (hereinafter referred to as the inter-electrode distance). Even when the same current is passed, the greater the resistance of the solid-liquid mixture, the higher the voltage value. Also, even when the same current is passed, the longer the inter-electrode distance, the higher the voltage value.

[0058] The amount of electricity (charge) applied to a solid-liquid mixture is defined as the product of current and time. In the SI system of units, the amount of electricity is defined in coulombs C, which are constructed by the product of amperes A and seconds s [A·s]. The amount of copper dissolved is proportional to the amount of electricity applied. Therefore, the higher the current value, the more copper dissolved. Also, the longer the time the current is passed, the more copper dissolved. However, if an excessive amount of electricity is applied to the solid-liquid mixture, there is a higher risk of the solid-liquid mixture changing.

[0059] In the example shown in Figure 8, deterioration of the solid-liquid mixture was confirmed when a current of 3 mA was passed continuously for one hour. Furthermore, no deterioration of the solid-liquid mixture was confirmed when a current of 3 mA was passed for one hour, or when the current was an intermittent current. Furthermore, deterioration of the solid-liquid mixture was confirmed when a square wave current of 1 mA was passed for one hour at a frequency of 0.01 Hz. Furthermore, deterioration of the solid-liquid mixture was confirmed when a sinusoidal current of 1 mA was passed for one hour at a frequency of 0.01 Hz.

[0060] No deterioration of the solid-liquid mixture was observed when a square wave current of 1 mA was passed for 1 hour at a frequency of 0.1 Hz, and no deterioration of the solid-liquid mixture was observed when a sinusoidal current of 1 mA was passed for 1 hour at a frequency of 0.1 Hz.

[0061] Figure 9 is a plot of the relationship between the amount of electricity [C] applied to the solid-liquid mixture and the amount of copper dissolved [mg]. Multiple sample data were collected for each of the four cases: when a constant direct current (DC) was applied, when a sine wave current was applied at a frequency of 10 mHz, when a sine wave current was applied at a frequency of 100 mHz, when a sine wave current was applied at a frequency of 1 Hz, and when a sine wave current was applied at a frequency of 60 Hz, and linear regression was performed for each case. The steeper the slope of the regression line, the faster the copper dissolution rate.

[0062] From Figure 9, we can see that the higher the frequency, the less likely the solid-liquid mixture is to change quality. When applying a constant direct current (DC), it is necessary to reduce the quantity of electricity [C]. For example, it is preferable to apply a constant current continuously for 100 seconds or less. When applying a sine wave current, it is preferable to apply it at a frequency higher than 10 mHz.

[0063] According to another experiment by the present inventor, it was confirmed that copper as a foreign matter can be rendered harmless without causing deterioration of the solid-liquid mixture by passing a current of 0.1 mA or more between the first electrode 108 and the second electrode 110 and applying an electric charge of 1 C or more to the solid-liquid mixture. To render copper harmless, it is necessary to reduce the copper to a size of 30 μm or less. When the efficiency of electrical dissolution is 33%, 1 C corresponds to the amount of electricity required to reduce copper spheres (×22) with a diameter of 100 μm to copper spheres with a diameter of 30 μm.

[0064] The electrical dissolution efficiency indicates the percentage of the applied electricity that is used to dissolve foreign matter, and if all of the applied electricity is used to dissolve foreign matter, the electrical dissolution efficiency will be 100%. Normally, not all of the applied electricity is used to dissolve foreign matter, and most of it is used to convert into heat, etc.

[0065] The Faraday constant F is a universal constant that represents the amount of electricity possessed by 1 mol of a group of charged particles with elementary charge e, and is expressed as F ≒ 96485 C / mol. The Faraday constant F is equal to the amount of electricity required to precipitate 1 mol of monovalent ions by electrolysis. Using the Faraday constant F, the number of moles can be calculated from the amount of electricity [C], and the dissolved mass of copper as a foreign substance can be calculated as the amount of substance.

[0066] In another experiment by the inventor, the relationship between the electrode distance t [mm] and the voltage [V] applied to the solid-liquid mixture was linearly regressed to the form of V = αt + β. When a non-aqueous solvent was used, the regression was possible to the formula V = 1.2t + 3. When an aqueous solvent was used, the regression was possible to the formula V = 1.15t + 1.5. The decomposition voltage of the non-aqueous solvent was concentrated in the vicinity of 3V, and the decomposition voltage of the aqueous solvent was 1.5V. Therefore, regardless of which solvent was used, the voltage between the electrodes when a current was applied was equal to or higher than the decomposition voltage of the solvent. That is, in the case of a non-aqueous solvent, the voltage was equal to or higher than 3V, and in the case of an aqueous solvent, the voltage was equal to or higher than 1.5V. In the experimental data shown in FIG. 8, the voltage value between the electrodes was equal to or higher than the decomposition voltage of the solvent regardless of which current was applied. Even when a current of 0.1 mA was continuously applied for 1 hour, the voltage value between the electrodes was 14V, which was equal to or higher than the decomposition voltage of the solvent.

[0067] A solid-liquid mixture containing metal impurities can be regarded as a pseudo-bipolar electrolysis having an electric field between countless electronically conductive particles present in the solid-liquid mixture. Therefore, the voltage applied to the solid-liquid mixture is the sum of the voltages between each particle present in the solid-liquid mixture. The electrolysis voltage between each particle never reaches the decomposition voltage of the solvent, and even if the apparent voltage between the electrodes exceeds the decomposition voltage of the solvent, the solvent is not actually decomposed. Therefore, the metal impurities contained in the solid-liquid mixture can be miniaturized without reducing the solvent.

[0068] In the above embodiment, an example in which a current is applied to the solid-liquid mixture flowing in the pipe 102 in the coating device 1 has been described. In this regard, the timing of applying a current to the solid-liquid mixture may be in a process before the solid-liquid mixture is put into the tank 6 of the coating device 1. For example, a current may be applied in a mixing, stirring, and kneading process. In that case, electrodes are provided in a container having a blade for mixing, stirring, and kneading, and a current is applied between the electrodes during the preparation of the solid-liquid mixture in the container. The current may be applied during the period when the blade in the container is rotating, or during the period when the blade is not rotating. In addition, a current may be applied during the period when the solid-liquid mixture is stored in another container after preparation and before being put into the tank 6 of the coating device 1. In this way, a current may be applied when the solid-liquid mixture is in a stationary state.

[0069] The above describes the embodiments of the present disclosure in detail. The above-mentioned embodiments merely show specific examples of implementing the present disclosure. The contents of the embodiments do not limit the technical scope of the present disclosure, and many design changes such as changes, additions, and deletions of components are possible within the scope of the idea of ​​the present disclosure defined in the claims. A new embodiment with design changes has the effects of the combined embodiments and modifications. In the above-mentioned embodiments, the contents for which such design changes are possible are emphasized by adding notations such as "in this embodiment" and "in this embodiment", but design changes are permitted even in contents without such notations. Any combination of the above components is also valid as an aspect of the present disclosure. The hatching on the cross section of the drawing does not limit the material of the object to which the hatching is added.

[0070] The invention according to the above-described embodiment may be specified by the items described below.

[0071] [Item 1] A pipe (102) through which a liquid to be treated containing metal impurities flows; a first electrode (108) and a second electrode (110) disposed within the pipe (102); and a power supply unit (106) that applies a current of 1 mA or more between the first electrode (108) and the second electrode (110). An impurity treatment device (100). [Explanation of symbols]

[0072] 1 Coating device 2 Coating die 6. Tank 16 Object to be coated 100 Impurity treatment device 102 Piping 106 Power supply section 108 1st electrode 110 2nd electrode 112 Rod-shaped body

Claims

1. An impurity treatment apparatus for treating metal impurities contained in a solid-liquid mixture for forming an electrode for a power storage device, comprising: a first electrode and a second electrode for applying an electric field to the solid-liquid mixture; a power supply unit that applies a current of 0.1 mA or more between the first electrode and the second electrode through the solid-liquid mixture to apply an electric quantity of 1 C or more to the solid-liquid mixture; the solid-liquid mixture is an electrode slurry containing a solvent and an electrode active material, When a current of 0.1 mA or more is flowing between the first electrode and the second electrode, a voltage V [V] between the first electrode and the second electrode and a distance t "mm" between the first electrode and the second electrode satisfy a relationship of V = 1.2t + 3 when the solvent is a non-aqueous solvent, and satisfy a relationship of V = 1.15t + 1.5 when the solvent is an aqueous solvent. Impurity treatment equipment.

2. The power supply unit applies a sine wave current between the first electrode and the second electrode. The impurity treatment device according to claim 1 .

3. The power supply unit applies a sine wave AC current having a frequency higher than 10 mHz between the first electrode and the second electrode. The impurity treatment device according to claim 1 .

4. The power supply unit applies a rectangular wave current between the first electrode and the second electrode. The impurity treatment device according to claim 1 .

5. The power supply unit applies an intermittent current between the first electrode and the second electrode. The impurity treatment device according to claim 1 .

6. a voltage between the first electrode and the second electrode when a current of 0.1 mA or more is flowing between the first electrode and the second electrode is 3 V or more when the solvent is a non-aqueous solvent, and is 1.5 V or more when the solvent is an aqueous solvent; The impurity treatment device according to claim 1 .

7. Further comprising a pipe through which the solid-liquid mixture flows; The piping is provided in a coating device including a coating die for applying the solid-liquid mixture to a substrate and a tank for storing the solid-liquid mixture; The first electrode and the second electrode are installed in the pipe. The impurity treatment device according to any one of claims 1 to 6.

8. An impurity treatment method for treating metal impurities contained in a solid-liquid mixture for forming an electrode for an electricity storage device, comprising the steps of: A current of 0.1 mA or more is passed through the solid-liquid mixture between a first electrode and a second electrode that apply an electric field to the solid-liquid mixture, thereby applying an electric quantity of 1 C or more to the solid-liquid mixture; the solid-liquid mixture is an electrode slurry containing a solvent and an electrode active material, When a current of 0.1 mA or more is flowing between the first electrode and the second electrode, a voltage V [V] between the first electrode and the second electrode and a distance t "mm" between the first electrode and the second electrode satisfy a relationship of V = 1.2t + 3 when the solvent is a non-aqueous solvent, and satisfy a relationship of V = 1.15t + 1.5 when the solvent is an aqueous solvent. Impurity treatment method.

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