Electronic equipment

Abstract

To solve the problem in which: there is demanded an electronic apparatus of an external connection type that is attached to an imaging apparatus and reduces an increase in internal temperature of the imaging apparatus.SOLUTION: An electronic apparatus has an interface unit including a connection unit, a heat transfer unit, a heat radiation unit, and a fixing member. The connection unit can be attached to an interface terminal included in an external device. The fixing member can be joined to a fixing unit included in the external device. When the electronic apparatus is attached to the external device, the heat radiation unit, the heat transfer unit, and the interface unit are laminated and arranged in this order and are thermally joined to each other, and the fixing member is thermally joined to the heat radiation unit and the fixing unit.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to electronic devices, and more particularly to electronic devices such as imaging devices having an interface that allows connection to other electronic devices. [Background technology]

[0002] In recent years, the spread of video viewing applications and video distribution services has led to an increasing demand for imaging devices capable of capturing high-quality video for long periods of time. To address this issue, imaging devices are being equipped with high-performance video engines on their internal control boards to reduce imaging noise and improve image resolution.

[0003] In order to reduce the temperature rise in electronic components due to heat generation accompanying long periods of video shooting, for example, an imaging device has been proposed that can forcibly cool heat-generating elements inside the housing by configuring an air-cooling duct inside the housing and installing a heat dissipation device (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-071516 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technique described in Patent Document 1, a ventilation duct is disposed inside the imaging device, which requires a large installation space for the ventilation duct, and this may hinder miniaturization of the imaging device.

[0006] The present invention has been made in consideration of the above-mentioned problems, and has an object to provide an externally connected electronic device that is attached to an imaging device and reduces an internal temperature rise of the imaging device. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention provides a thermal communication device having an interface section including a connection section, a heat transfer section, a heat dissipation section, and a fixing member, the connection section being attachable to an interface terminal of an external device, the fixing member being connectable to a fixing section of the external device, and the fixing member being attached to the external device. In the state , The heat dissipation section, the heat transfer section, and the interface section are laminated in this order and thermally coupled to each other, and the fixing member is thermally coupled to the heat dissipation section and the fixing section. And, The fixing member and the fixing portion are fixed to each other by an attachment member that penetrates the heat dissipation portion. . Effect of the Invention

[0008] According to the present invention, it is possible to provide an externally connected electronic device that prevents a cooling device attached to an imaging device from coming off and reduces an increase in the internal temperature of the imaging device. [Brief description of the drawings]

[0009] [Figure 1] 1A and 1B are external and schematic diagrams of an imaging device 1 according to a first embodiment of the present invention. [Diagram 2] FIG. 1 is a diagram illustrating a state in which a heat dissipation device 10 is attached to an imaging device 1 according to a first embodiment of the present invention. [Diagram 3] FIG. 1 is an exploded perspective view of an electronic device (heat dissipation device) 10 according to a first embodiment of the present invention. [Figure 4] FIG. 2A is a perspective view of an attached state of the electronic device 10 and the imaging device 1 in the first embodiment of the present invention, and FIG. 2B is a cross-sectional view of the attached state of the electronic device 10 and the imaging device 1 in the first embodiment of the present invention. [Diagram 5] 1 is a cross-sectional view of an attached state of an electronic device 10 and an imaging device 1 according to a first embodiment of the present invention. [Figure 6] FIG. 11 is an exploded perspective view of an electronic device (heat dissipation device) 200 according to a second embodiment of the present invention. [Figure 7]FIG. 13A is a side view of an electronic device 200 according to a second embodiment of the present invention, and FIG. 13B is a cross-sectional view taken along line AA of the electronic device 200 according to the second embodiment of the present invention. [Figure 8] FIG. 13A is an exploded perspective view of an electronic device (heat dissipation device) 300 according to a third embodiment of the present invention, and FIG. 13B is a perspective view of the electronic device (heat dissipation device) 300 according to the third embodiment of the present invention. [Figure 9] FIG. 13 is a diagram showing an imaging device 1 according to a third embodiment of the present invention to which a fixed metal plate 301 is attached. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Note that the embodiment described below is one example of a means for realizing the present invention, and may be appropriately modified or changed depending on the configuration of the device to which the present invention is applied and various conditions. Also, each embodiment may be appropriately combined.

[0011] (First embodiment) Hereinafter, an electronic device 10 according to a first embodiment of the present invention will be described with reference to FIGS.

[0012] Fig. 1 is an external view and a schematic diagram of an imaging device 1 (external device) in this embodiment. Fig. 1(a) is a view of the imaging device 1 in this embodiment as seen from the front. Fig. 1(b) is a view of the imaging device 1 as seen from the side. Fig. 1(c) is a schematic diagram showing the inside of the imaging device 1 in this embodiment.

[0013] In the imaging device 1 of this embodiment, a lens unit is attached to the imaging device body. A detailed description of the structure of the imaging device 1 is omitted, and only the parts required for the description of the present invention are taken up. A receptacle connector 2 is disposed on the side of the body of the imaging device 1. The receptacle connector 2 (interface terminal) is a connector that enables mechanical and electrical connection with an external interface. The receptacle connector 2 is compatible with general-purpose interfaces, such as the USB (Universal Serial Bus) standard and the HDMI (registered trademark) (High-Definition Multimedia Interface) standard. The receptacle connector 2 is mounted on a control board 3. In addition to the receptacle connector 2, the control board 3 also mounts various electronic components such as a control IC (heat-generating electronic component) 4, and controls the main operation of the imaging device 1. When the imaging device 1 is used to capture moving images or still images in high-speed continuous shooting, the amount of electrical signal processing increases due to the effects of image processing, etc. Then, the element package of the control IC 4 generates heat. When moving image capture or still image capture at high speed is performed for a long time, the control IC 4 becomes hot, and the heat generated by the control IC 4 propagates to the conductor layer, insulating layer, etc. of the control board 3, causing the temperature of the control board 3 to rise. FIG. 1(c) shows a schematic diagram of the heat generated by the control IC 4 propagating to the control board 3 using shades of hatching, and the heat generated by the control IC 4 also propagates to the receptacle connector 2 mounted on the control board 3, causing the temperature of the receptacle connector 2 to rise. If moving image capture or still image capture at high speed is continued for a certain period of time or longer, and the heat-generating electronic components such as the control IC 4 mounted on the control board 3 reach a temperature high enough to exceed their respective guaranteed operating temperatures, this may lead to damage to the electronic components and the control board 3. For this reason, certain limitations may be set on the continuous recording time of the operation or the number of still images captured at high speed in succession to prevent damage caused by heat. However, placing such operational restrictions on the imaging device 1 reduces user convenience, so it is desirable to suppress the temperature rise of heat-generating electronic components such as the control IC 4 as much as possible and not to place operational restrictions.

[0014] Next, a method of attaching the electronic device (heat dissipation device) 10 to the imaging device 1 will be described with reference to FIG. 2. The electronic device 10 can be connected to the imaging device 1. FIG. 2 is a front view showing a state in which the electronic device 10 is attached to the imaging device 1 in this embodiment. FIG. 2(a) shows a state before attachment, and FIG. 2(b) shows a state after attachment. The electronic device 10 is configured to be attachable to the imaging device 1. Details of the internal configuration of the electronic device 10 will be described later. The electronic device 10 has a plug 11 (interface section). The plug 11 is configured to be mechanically connectable to a receptacle connector of a general-purpose interface, and has a plug side shape (or a header shape and a mail shape) of the same interface standard as the receptacle connector 2 of the imaging device 1. The plug 11 is mechanically connectable to the receptacle connector 2 and is mainly made of a metal material. The electronic device 10 is also configured to be attachable to a power cable 60. The electronic device 10 receives power by attaching the power cable 60 and connecting the other end of the power cable 60 to a power supply unit (not shown). The operation and function of the electronic device 10 will also be described in detail later.

[0015] Next, the internal configuration of the electronic device 10 will be described in detail with reference to FIG. 3. FIG. 3 is an exploded perspective view of the electronic device 10 in this embodiment. The electronic device 10 is configured to accommodate various parts including the plug 11 inside the housing case 12, and then to combine the cover 13. First, the electronic device 10 has a heat dissipation fin 14 (heat dissipation section). The heat dissipation fin 14 has a fixing section 14b formed on a main surface 14a. The fixing section 14b mainly consists of four screw fixing holes. A plurality of fins 14c are erected from the main surface 14a toward the opposite direction to the arrangement surface of the fixing section 14b. The heat dissipation fin 14 is integrally formed of the main surface 14a, the fixing section 14b, and the fins 14c by die casting using an alloy material such as aluminum, magnesium, or zinc. A Peltier element 17 (heat transfer section) is arranged in the inner area surrounded by the four screw fixing holes of the fixing section 14b. The Peltier element 17 is a semiconductor element that utilizes the Peltier effect, and is composed of a main body 17a processed into a rectangular shape and two terminals 17b extending from the main body 17a. A heat transfer rubber 18 (elastic member) is arranged so as to abut against the main body 17a. The heat transfer rubber 18 is a rubber sheet having elasticity and excellent thermal conductivity, and is formed by adding various mixed materials to a base such as silicone rubber. The outer shape of the heat transfer rubber 18 is processed into approximately the same shape as the main body 17a of the Peltier element 17 and is attached to the Peltier element 17. Furthermore, the plug 11 is arranged so as to abut against the heat transfer rubber 18. The plug 11 is composed of a connection portion 11a and a fixing portion 11b, and the connection portion 11a is exposed from an opening 13a formed in the cover 13 during assembly. The fixing portion 11b is shaped like a flat plate, and has four through holes surrounding the connection portion 11a. The arrangement of the through holes is formed to correspond to the arrangement of the screw fixing holes of the fixing portion 14b. With the Peltier element 17, heat transfer rubber 18, and plug 11 stacked in order of proximity to the main surface 14a of the heat dissipation fin 14, four screws 20 are fastened from the through-hole side of the fixing portion 11b toward the screw fixing holes of the fixing portion 14b to fix and hold the Peltier element 17, 18, and plug 11 to the main surface 14a of the heat dissipation fin 14. At this time, four resin washers 19 are inserted between the fixing portion 11b of the plug 11 and the fixing portion 14b of the heat dissipation fin 14.

[0016] Next, the heat dissipation fin 14 forms a fixing portion 14e on a side surface 14d perpendicular to the main surface 14a. The fixing portion 14e mainly consists of two screw fixing holes. A printed circuit board 16 is arranged on the side surface 14d and fixed and held by two screws 21. Furthermore, the heat dissipation fin 14 forms a fixing portion 14g on an upper surface 14f perpendicular to the main surface 14a and the side surface 14d. The fixing portion 14g consists of four screw fixing holes. A fan 15 is arranged on the upper surface 14f. The fan 15 is configured as a so-called axial fan motor, and a stator arranged in the center of a rectangular frame is equipped with a copper wire coil and a board (not shown) electrically connected to various electronic components, and a blade 15a equipped with a magnet is formed on the rotor portion. The frame has four through holes 15b at the corners. Four screws 22 are fastened from the through holes 15b side of the fan 15 toward the fixing portion 14g to fix and hold the fan 15. A power jack connector 16a is mounted on the printed circuit board 16. The power jack connector 16a is configured to be connectable to a power cable 60, which supplies power from the outside to the printed circuit board 16. Furthermore, a tactile switch 16b is mounted on the printed circuit board 16. When the electronic device 10 is fully assembled, the tactile switch 16b is pressed when an operation button 12c formed on the housing case 12 is operated. The operation button 12c is disposed so as to face the photographer when the electronic device 10 is attached to the imaging device 1, and is configured to allow a smooth transition from operation of the imaging device 1 to operation of the electronic device 10.

[0017] A connector 16c is mounted on the printed circuit board 16. The connector 16c is a connector that electrically connects to the fan 15. The fan 15 has lead wires 15c extending from a board arranged in the stator section, and a header-side connector 15d that fits the connector 16c is joined to the tip of the lead wire 15c. The fan 15 is operated by a drive and control circuit for the fan 15, which is composed of various electronic components mounted on the printed circuit board 16. The housing case 12 has an exhaust port 12a formed of multiple slits on the surface facing the fan 15. The housing case 12 has an intake port 12b formed on the surface facing the exhaust port 12a. The intake port 12b also has multiple slits like the exhaust port 12a. When the heat dissipation fin 14 is accommodated inside the housing case 12, a duct 12d that connects the exhaust port 12a and the intake port 12b is formed. When the fan 15 is driven, a flow path is formed in which the outside air is taken in through the intake port 12b, passes through the duct 12d and the fins 14c, and is discharged to the exhaust port 12a. The printed circuit board 16 is further formed with a conductor land 16d having a through hole through which the tip of the terminal portion 17b of the Peltier element 17 can be inserted. The Peltier element 17 is first fixed to the heat dissipation fin 14, and then the terminal portion 17b is inserted into the conductor land 16d to fix the printed circuit board 16 to the heat dissipation fin 14. Then, the terminal portion 17b and the conductor land 16d are electrically connected by soldering or the like. The Peltier element 17 is operated by a drive and control circuit for the Peltier element 17, which is composed of various electronic components mounted on the printed circuit board 16. When the Peltier element 17 is operated, the flat side facing the heat transfer rubber 18 becomes a heat absorbing surface, and the flat side facing the heat dissipation fin 14 becomes a heat generating surface. The plug 11 is then cooled via the heat transfer rubber 18, and conversely, the heat of the Peltier element 17 is dissipated to the heat dissipation fins 14. Once the attachment of the various components described above to the heat dissipation fins 14 has been completed, the heat dissipation fins 14 are fixed to the housing case 12, and then the cover 13 is fitted and fastened with screws 23. The fixing sheet metal 24 is fixed to fixing parts 14h provided on the heat dissipation fins 14 with screws 25. An opening 13b is provided in the cover 13, so that the heat dissipation fins 14 and the fixing sheet metal 24 are in direct contact with each other.The mounting screws 26 have a length sufficient to penetrate the cooling fins 14, and protrude from the holes 24a of the fixing sheet metal 24. The mounting screws 26 and the heat dissipation fins 14 are thermally connected via a heat transfer member 29.

[0018] The electronic device 10 can be assembled using the method described above.

[0019] A method of mounting the electronic device 10 to the imaging device 1 will be described. FIG. 4(a) is an exploded perspective view of the mounted state. However, in FIG. 4(a), the exterior of the imaging device 1 and the like are omitted. FIG. 4(b) is a cross-sectional view of the mounted state. The control board 3 on which the control IC 4 serving as a heat source is mounted is fixed to a chassis 27 made of metal with screws 28. The chassis 27 has screw holes 27a and is arranged on both sides of the receptacle connector 2. The mounting screws 26 are arranged at positions corresponding to the screw holes 27a of the chassis, and the electronic device 10 is fixed to the imaging device 1 by connecting the plug 11 of the electronic device 10 to the receptacle connector 2 and tightening the mounting screws 26. By fixing with the mounting screws 26, it is possible to prevent the electronic device 10 from falling off even if an external force is applied to the electronic device 10. In addition, by arranging the mounting screws on both sides of the receptacle connector 2, it is possible to make the electronic device 10 more resistant to coming off even if it is gouged or a load is applied from various directions. Furthermore, by fastening the fixing sheet metal 24 together with the mounting screws 26, even if an excessive external force is applied to the electronic device 10, the fixing sheet metal 24 is configured to withstand the external force, and damage to the plug can be prevented. In this embodiment, the plug 11 and the receptacle connector 2 are not electrically connected, but an electrically connectable plug may be used. In that case, a circuit board on which the plug 11 is mounted is disposed inside the electronic device 10, and the electronic device 10 can be controlled from the imaging device 1 side. In this case, the fixing sheet metal 24 can alleviate stress on the mounting terminal of the plug 11 and the elements on the circuit board.

[0020] The electronic device 10 can be attached to the imaging device 1 by the method described above.

[0021] Next, the cooling operation of the electronic device 10 will be described with reference to FIG. 5. FIG. 5 is a cross-sectional view of the electronic device 10 and the imaging device 1 in this embodiment. It shows a state in which the electronic device 10 is attached to the imaging device 1. As described above, when the imaging device 1 performs, for example, video shooting or high-speed continuous shooting of still images for a long period of time, the control IC 4 becomes hot, and the heat generated by the control IC 4 is propagated to the conductor layer and insulating layer of the control board 3, and the temperature of the control board 3 rises. Then, the heat generated by the control IC 4 is propagated to the receptacle connector 2 mounted on the control board 3, and the temperature of the receptacle connector 2 rises. When the operation button 12c is operated to start the cooling operation of the electronic device 10 with the electronic device 10 attached, the temperature of the plane in contact with the heat transfer rubber 18 is reduced by the action of the Peltier element 17. Then, the plug 11 is cooled via the heat transfer rubber 18, and the receptacle connector 2 physically connected to the plug 11 is also cooled. Then, the temperature rise of the control board 3 and the control IC 4 is reduced, and it is possible to suppress the activation of operation restrictions on, for example, video shooting and high-speed continuous shooting of still images of the imaging device 1. At this time, the temperature of the plane of the Peltier element 17 facing the heat dissipation fin 14 rises. If the temperature continues to rise, the operation of the Peltier element 17 may become unstable due to the heat generated, or the semiconductor constituting the Peltier element 17 may be damaged. Therefore, the heat generating surface of the Peltier element 17 is brought into surface contact with the heat dissipation fin 14, and the heat generated on the heat generating surface side of the Peltier element 17 is transferred to the heat dissipation fin 14. The transferred heat is propagated to the multiple fins 14c. Furthermore, the fan 15 is driven to draw in outside air, and an air flow is generated in a flow path formed inside the electronic device 10, and the warm air remaining near the fins 14c of the heat dissipation fin 14 is discharged to the outside. By performing such an operation, it is possible to suppress the temperature rise on the heat generating surface side of the Peltier element 17, stabilize the operation of the Peltier element 17, and prevent damage to the semiconductor. If the heat transferred from the heat generating surface of the Peltier element 17 to the heat dissipation fin 14 is transferred to the heat absorbing surface side of the Peltier element 17 via the fixing part 11b, the effect of reducing the temperature rise of the control board 3 and the control IC 4 due to the operation of the Peltier element 17 may be reduced.Therefore, by inserting the resin washer 19 between the fixed portion 11b of the plug 11 and the fixed portion 14b of the heat dissipation fin 14 as described above, the heat transferred from the heat generating surface of the Peltier element 17 to the heat dissipation fin 14 is less likely to be transmitted to the heat absorbing surface of the Peltier element 17 via the fixed portion 11b. Therefore, inserting the resin washer 19 contributes to making the cooling effect of the Peltier element 17 work more efficiently. Here, for example, if a resin washer for the purpose of thermal insulation is further added between the fixed portion 11b and the head seat surface of the screw 20, the intrusion of heat into the heat absorbing surface of the Peltier element 17 can be further reduced.

[0022] The control board 3 is fixed to the chassis 27, and the heat of the control IC 4 is transferred from the control board 3 to the chassis 27. The heat transferred to the chassis 27 is transferred to the mounting screw 26 by tightening the mounting screw 26 into the screw hole 27a provided in the chassis. The heat is easily transferred because the screw threads are tightly attached. The heat transferred to the mounting screw 26 is transferred to the heat dissipation fin 14 via the heat transfer member 29. The heat transfer member 29 is made of elastic heat conductive rubber, and is configured so that the heat conductive rubber is placed in close contact between the mounting screw 26 and the heat dissipation fin 14. As other heat transfer means for thermally connecting the mounting screw 26 and the heat dissipation fin 14, heat conductive grease may be filled or a metal spring may be used to bias the mounting screw 26 against the heat dissipation fin 14. The temperature of the mounting screw 26 rises due to the heat transferred from the control board. In that case, the screw head 26a of the mounting screw 26 may be made of resin. In this way, heat is transferred from the mounting screws 26 to the heat dissipation fins 14, but since resin is less resistant to heat transfer than metal, the temperature of the screw heads 26a is less likely to rise. This makes it possible to prevent the photographer from touching hot parts when performing the installation operation.

[0023] The structure is such that heat is also transferred to the fixed metal plate 24, which is fastened together with the heat dissipation fin 14 by tightening the mounting screws 26. The fixed metal plate 24 is fixed to the fixing portion 14h of the heat dissipation fin 14 by screws 25, and heat is also transferred to the heat dissipation fin 14 via the fixed metal plate 24. The heat transferred from each of the routes via the mounting screws 26 and the fixed metal plate 24 is discharged to the outside by driving the fan 15. In addition to cooling by the plug 11, the cooling capacity can be increased by transferring heat using screw fixing. Furthermore, fixing stabilizes the contact of each heat route, and the variation in cooling capacity can be suppressed.

[0024] In addition, the receptacle connector 2 is formed with electronic contacts that enable signal communication with other electronic devices. The connection portion 11a of the plug 11 is mainly made of a metal material, but an insulating resin piece is inserted into the connection portion 11a of the receptacle connector 2 in the vicinity of the electronic contact portion. Alternatively, an insulating paint is applied, or a sufficient gap is secured between the electronic contact portion. Therefore, when the electronic device 10 is attached to the imaging device 1, the electronic contacts of the receptacle connector 2 are not electrically shorted through the plug 11. As described above, the heat transfer rubber 18 is disposed between the Peltier element 17 and the plug 11, and is fixed and held in a state where it is pressed to a certain degree. If the heat transfer rubber 18 is not provided and the plug 11 is directly contacted with the Peltier element 17 to cool the plug 11, high surface accuracy is required for the flat surfaces of the Peltier element 17 and the plug 11 so that the contact surfaces do not contact one side, line contact, or point contact. Such high-precision flat surface processing may cause a decrease in yield rate of parts production and an increase in parts costs. In addition, when electronic device 10 is attached to imaging device 1 and used, if an external force is applied to electronic device 10, a load is also applied to plug 11. However, since plug 11 and Peltier element 17 are connected via elastic heat conductive rubber 18, the load can be absorbed and the load on the Peltier element can be reduced.

[0025] In addition, when assembling the electronic device 10, an electric screwdriver may be used to fix and hold the Peltier element 17 and the plug 11 to the heat dissipation fin 14 using the screws 20. These tools use the power of a motor to tighten the screws, and shocks occur when tightening the screws and when the screws are tightened. If the heat transfer rubber 18 is not provided and the plug 11 is directly in contact with the Peltier element 17, there is a concern that the Peltier element 17 may be damaged due to the shock propagating directly from the plug 11, which is a rigid body, to the Peltier element 17. As a configuration for reducing the damage to the Peltier element 17 during the assembly work without providing the heat transfer rubber 18, for example, a configuration in which coil springs are additionally provided at four locations between the fixing portion 11b of the plug 11 and the screws 20 to tighten the screws is considered. In this case, it is possible to make it difficult for the shock during the screw tightening work to be transmitted to the Peltier element 17, but the work of tightening the screws becomes complicated. Therefore, the configuration in which the heat transfer rubber 18 is disposed between the Peltier element 17 and the plug 11 is more useful than other configurations in terms of preventing damage to the Peltier element 17 during assembly, ease of assembly, and stable heat transfer between the Peltier element 17 and the plug 11. For the purpose of stable heat transfer, a certain amount of gap may be provided between the heat generating surface of the Peltier element 17 and the heat dissipation fins 14, and a member equivalent to the heat transfer rubber 18 may be added to the gap. Alternatively, a configuration in which grease with high thermal conductivity is applied between the heat generating surface of the Peltier element 17 and the heat dissipation fins 14 may be adopted.

[0026] When the electronic device 10 is attached to the imaging device 1 and imaging is performed while the electronic device 10 is in operation, warm air continues to be exhausted from the exhaust port 12a during imaging. If the exhaust port 12a faces the subject, the subject or objects captured within the angle of view may move during close-up imaging, and it may be impossible to perform the intended imaging. If the exhaust port 12a faces the photographer, there is a concern that the warm air may continue to hit the photographer's face or hands during imaging, which is annoying. Therefore, it is desirable that the direction in which the exhaust port 12a exhausts the warm air is parallel to a plane perpendicular to the optical axis direction of the imaging device 1. In addition, the heated air expands and the unit weight becomes lighter. Therefore, when the electronic device 10 is placed in a so-called normal position with the tripod seat facing downward with respect to the imaging device 1, it is desirable that the exhaust direction in which the electronic device 10 is attached exhausts the warm air is opposite to the vertical direction. By configuring the exhaust direction in the opposite direction to the vertical direction, efficient exhaust operation can be performed without resisting the movement of the warm air. 1 and 2, when the connection part of the external interface in the imaging device 1 is arranged on the side of the case, it is preferable that the fins 14c of the heat dissipation fins 14 are arranged in a direction parallel to the mounting direction in which the electronic device 10 is connected. It is also preferable that the multiple metal flat plates constituting the fins 14c are arranged in parallel to the vertical direction. Furthermore, configuring the exhaust direction of the duct 12d to be linear in the direction opposite to the vertical direction works favorably for cooling operation.

[0027] The electronic device 10 is configured to be detachable from the imaging device 1, and is cooled by cooling the external interface. The electronic device is fixed using mounting screws 26 and fixing members 24.

[0028] This embodiment allows heat from the imaging device 1 to be dissipated, suppressing the activation of operational restrictions in scenes such as long-term video shooting or high-speed continuous still image shooting, and also prevents the electronic device 10 from falling off or the plug 11 from being damaged.

[0029] Second Embodiment Next, an electronic device 200 according to a second embodiment of the present invention will be described with reference to Figs. 6 and 7. In the electronic device 200, a heat transfer metal plate 201 is added to the electronic device 10 described in the first embodiment. The other basic configurations and the operation method of the electronic device 30 are configured the same as those of the electronic device 10. The same reference numerals are used for the same parts as those of the electronic device 10, and detailed descriptions thereof will be omitted. Fig. 6 is an exploded perspective view of the electronic device 200 in this embodiment. Fig. 7(a) shows a side view of the electronic device 200 in this embodiment, and Fig. 7(b) shows the plug 11 portion in an AA cross-sectional view.

[0030] The fixed metal plate 24 is fixed to the heat transfer metal plate 201 with screws 25, sandwiching the cover 13. An opening 13b is provided in the cover 13, and the fixed metal plate 24 and the heat transfer metal plate 201 are in direct contact with each other. The heat transfer metal plate 201 has an extension 201a, which is disposed between the plug 11 and the Peltier element 17. The heat transfer metal plate 201 is in close contact with the plug 11 via heat conductive rubber 18. The Peltier element 17 is thermally connected with the heat conductive grease (not shown). The heat transfer metal plate 201 and the heat dissipation fins 14 are not in direct contact with each other, that is, the heat transfer metal plate 201 and the heat dissipation fins 14 are thermally separated from each other.

[0031] The electronic device 200 is fixed by connecting the plug 11 to the receptacle connector 2 of the imaging device 1 and tightening the mounting screw 26. When the cooling operation of the electronic device 10 is started, the temperature of the plane in contact with the heat transfer sheet metal 201 is reduced by the action of the Peltier element 17. The plug 11 is cooled via the heat transfer rubber 18 in contact with the heat transfer sheet metal 201, and the receptacle connector 2 connected to the plug 11 is also cooled. The material of the heat transfer sheet metal 201 is aluminum or copper, which has high thermal conductivity. The fixing sheet metal 24 fixed with a screw to the heat transfer sheet metal 201 cooled by the Peltier element 17 is also cooled. When the electronic device 200 is fixed to the imaging device 1 by the mounting screw 26, the chassis 27 is cooled by the fixing sheet metal 24, and the temperatures of the control board 3 and the control IC 4 fixed to the chassis 27 can be reduced. The temperature of the heat dissipation fin 14 in contact with the heat generating surface of the Peltier element 17 is high due to the heat generated by the Peltier element 17. However, because the heat transfer sheet metal 201 and heat dissipation fins 14 are not in direct contact with each other, it is possible to prevent the heat from the heat generating surface of the Peltier element 17 from being transferred to the heat absorbing surface of the Peltier element 17 via the heat dissipation fins 14 and the heat transfer sheet metal 201. The mounting screws 26 are also made of resin except for the screw tips, which makes it possible to prevent the heat from the heat dissipation fins 14 from being transferred to the imaging device 1 via the screws.

[0032] According to the second embodiment, by bringing the heat transfer metal plate 201 thermally connected to the fixed metal plate 24 into contact with the heat absorption surface of the Peltier element 17, it is possible to enhance the cooling effect while preventing the imaging device 1 and the electronic device 200 from falling off.

[0033] (Third embodiment) Next, an electronic device 300 according to a third embodiment of the present invention will be described with reference to Figs. 8 and 9. The electronic device 300 has a different shape of the fixing plate 301 from the electronic device 10 described in the first embodiment, and the method of mounting the electronic device to the imaging device 1 has been changed. The other basic configuration is the same as that of the electronic device 10. The same reference numerals are used for the same parts as those of the electronic device 10, and detailed description thereof will be omitted. Fig. 8(a) is an exploded perspective view of the electronic device 300 in this embodiment, and Fig. 8(b) shows the electronic device 300 in a state where it is fixed to the imaging device 1 in this embodiment, and shows the mounting position of the fixing plate 301 on the electronic device 300. Fig. 9 shows the state where the fixing plate 301 is mounted on the imaging device 1 in this embodiment. The fixing plate 301 has a hole portion 301a that is fixed to the imaging device 1, and is fixed to the chassis 27 inside the imaging device 1 by a mounting screw 302. The fixing plate 301 has a screw hole in an extension portion 301b that extends substantially perpendicularly to the mounting surface of the imaging device 1, that is, parallel to the insertion direction of the plug 11. The extension 301 b is inserted through a hole 13 c of the cover 13 and fixed to a fixing portion 14 i of the heat dissipation fin 14 by using a fixing screw 303 .

[0034] A method of mounting electronic device 300 to imaging device 1 will be described. As shown in Fig. 9, fixing sheet metal 301 is fixed to imaging device 1 in advance with mounting screws 302. Plug 11 of electronic device 300 is connected to receptacle connector 2. At the same time, fixing sheet metal 301 is inserted into hole 13c of cover 13. At this time, the screw hole of extension 301b of fixing sheet metal is positioned at the same position as fixing portion 14i of heat dissipation fin 14, and fixing screw 303 is screwed in from the side to complete the fixing of electronic device 300 and imaging device 1.

[0035] When the cooling operation of the electronic device 300 is started, the temperature of the plane in contact with the heat transfer sheet metal 201 is reduced by the action of the Peltier element 17. The plug 11 is cooled via the heat transfer rubber 18 in contact with the heat transfer sheet metal 201, and the receptacle connector 2 physically connected to the plug 11 is also cooled. The control board 3 on which the control IC 4 serving as a heat source is mounted is fixed to the chassis 27. The heat of the control IC 4 is transferred to the fixed sheet metal 301 fixed to the chassis 27. The fixed sheet metal 301 is fixed to the heat dissipation fin 14, and is cooled by driving the fan. In this way, the Peltier element 17 is used for cooling, and the heat of the imaging element 1 can be dissipated via the fixed sheet metal 301. The fixed sheet metal 301 can be attached to the imaging device 1 in advance. Therefore, even if the position of the screw fixing on the imaging device side is different from that of this embodiment, it is possible to attach it by preparing another fixed sheet metal 301 that matches the position.

[0036] According to this embodiment, the electronic device 300 can be attached to various devices without changing the internal components of the electronic device 300 other than the fixing plate 301, and versatility can be improved.

[0037] (Other embodiments) Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0038] 1 Imaging device (external device) 2 Receptacle connector (interface terminal) 3 Control Board 4 Control IC (heat-generating electronic components) 10 Electronic equipment 11 Plug (interface section) 11a Connection 12d Duct 14 Heat dissipation fin (heat dissipation part) 14c fins 15 Fan 17 Peltier element 17 (heat transfer part) 18 Heat transfer rubber (elastic heat transfer material) 24 Fixed Sheet Metal 26 Mounting screws 27 Chassis 28 Board fixing screw 29 Heat transfer materials 201 Heat Transfer Sheet Metal 301 Fixed Sheet Metal 302 Mounting screw 303 Fixing screw

Claims

1. The heat transfer unit includes an interface unit including a connection unit, a heat dissipation unit, and a fixing member. the connection portion is attachable to an interface terminal of an external device, The fixing member is connectable to a fixing portion of the external device, When the external device is attached to the device, the heat dissipation section, the heat transfer section, and the interface section are laminated in this order and thermally coupled to each other, and the fixing member is thermally coupled to the heat dissipation section and the fixing section, The electronic device according to claim 1, wherein the fixing member and the fixing portion are fixed to each other by an attachment member that penetrates the heat dissipation portion.

2. The electronic device according to claim 1 , wherein the fixing portion is provided on both sides of the interface portion.

3. 3. The electronic device according to claim 1, further comprising an elastic member disposed between the interface section and the heat transfer section.

4. 4. The electronic device according to claim 1, further comprising a heat transfer member thermally coupled to the fixing member between the interface portion and the heat transfer portion, the heat transfer member being thermally isolated from the heat dissipation portion.

5. The electronic device according to any one of claims 1 to 4, characterized in that the fixing member has an extension portion extending from a mounting surface inserted into a hole provided in a cover covering the interface portion, and is fixed to the heat dissipation portion.

Images