Ceramic heater and method for forming using liquid phase diffusion bonding

Abstract

The heating layer is formed of molybdenum and bonded to the AlN substrate via liquid phase diffusion bonding. The heater may also include a wiring layer and a plurality of first conductive vias connecting the heating layer to the wiring layer. The wiring layer and the plurality of first conductive vias may be formed of molybdenum, and at least one of the wiring layer and the plurality of first conductive vias may be bonded to the AlN substrate via liquid phase diffusion bonding. The heater may include a plurality of second conductive vias connecting the wiring layer to the surface of the AlN substrate, and the plurality of second conductive vias may be formed of molybdenum and bonded to the AlN substrate via liquid phase diffusion bonding.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Provisional Application No. 62 / 899,189, filed September 12, 2019, the disclosure of which is incorporated herein by reference. [Technical field]

[0002] The present disclosure relates to resistive heaters, and more particularly to ceramic heaters having a resistive heating element with a ceramic substrate. [Background technology]

[0003] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

[0004] A typical ceramic heater generally includes a ceramic substrate and a resistive heating element embedded in or disposed on the ceramic substrate. Heat generated in the resistive heating element is rapidly transferred to a heated object placed in close proximity to the ceramic substrate due to the excellent thermal conductivity of ceramic materials. However, it is known that ceramic materials are difficult to bond to metallic materials due to their poor wettability. Also, if the coefficient of thermal expansion (CTE) of the resistive heating element is incompatible with the CTE of the ceramic substrate, the bond between the ceramic substrate and the resistive heating element may be poorer. That is, cracks or gaps may occur at the interface between the ceramic substrate and the resistive heating element, thereby adversely affecting the heat transfer from the resistive heating element through the ceramic material to the heated object.

[0005] Among other problems associated with the manufacture of ceramic heaters, these problems associated with using ceramic substrates to form resistive heating elements are addressed by the present disclosure. Summary of the Invention

[0006] This section provides a general overview of the disclosure and is not an exhaustive disclosure of its entire scope or any of its features.

[0007] In one aspect of the present disclosure, a heater is provided, the heater comprising an aluminum nitride (AlN) substrate and a heating layer, the heating layer being formed of a molybdenum (Mo) material and bonded to the AlN substrate via liquid phase diffusion bonding.

[0008] In another aspect of the present disclosure, the heater further comprises a wiring layer and a plurality of first conductive vias connecting the heating layer to the wiring layer. In some aspects of the present disclosure, the wiring layer and the plurality of first conductive vias are formed of a molybdenum material. In such aspects, the wiring layer and at least one of the plurality of first conductive vias are bonded to the AlN substrate by liquid phase diffusion bonding.

[0009] In at least one embodiment of the present disclosure, the heater further includes a plurality of second conductive vias connecting the wiring layer to a surface of the AlN substrate. In some variations, the plurality of second conductive vias may be formed of a molybdenum material and bonded to the AlN substrate via liquid phase diffusion bonding.

[0010] In one embodiment of the present disclosure, the AlN substrate includes a plurality of plate members bonded together with a heating layer and a wiring layer via liquid phase diffusion bonding. In some embodiments, the plurality of plate members includes a first plate member and a second plate member through which a plurality of first conductive vias formed of a molybdenum material penetrate. In such variations, the heating layer is embedded within the first plate member and / or the second plate member. Also, the average surface roughness between the first plate member and the second plate member may be less than 5 μm. In one embodiment of the present disclosure, a third plate member is included, and a wiring layer formed of a molybdenum material is embedded within the second plate member and / or the third plate member and is in electrical contact with the plurality of first conductive vias.

[0011] In at least one embodiment of the present disclosure, the plurality of plate members includes a first plate member, a second plate member having a plurality of first conductive vias formed of a molybdenum material therethrough, and a third plate member having a plurality of second conductive vias formed of a molybdenum material therethrough, and a heating layer is embedded within the first plate member and / or the second plate member.

[0012] Many embodiments of the present disclosure further include at least one termination layer made from a molybdenum material.

[0013] In another aspect of the present disclosure, a heater includes an AlN substrate with a plurality of plate members and a heating layer made of a molybdenum material disposed within the AlN substrate. The plurality of plate members are bonded together via one or more liquid phase diffusion bonds between the plurality of plate members. In some aspects, the molybdenum material includes molybdenum and silicon. In such aspects, the liquid phase diffusion bonds can include a molybdenum-silicon (Mo-Si) alloy and / or a Mo-Si intermetallic compound.

[0014] In at least one embodiment of the present disclosure, the heater includes a wiring layer and a plurality of first conductive vias connecting the heating layer to the wiring layer. The wiring layer and the plurality of first conductive vias are formed of a molybdenum material, and at least one of the wiring layer and the plurality of first conductive vias is bonded to the AlN substrate via liquid phase diffusion bonding. The plurality of plate members may include a first plate member, a second plate member through which the plurality of first conductive vias formed of a molybdenum material penetrate, and a third plate member through which the plurality of second conductive vias formed of a molybdenum material penetrate. The heating layer is embedded in the first plate member and / or the second plate member and bonded to the first plate member via liquid phase diffusion bonding. The wiring layer is embedded in the second plate member and / or the third plate member and bonded to the third plate member via liquid phase diffusion bonding.

[0015] In yet another aspect of the present disclosure, a method of forming a heater is provided. The method includes liquid phase diffusion bonding of a heating layer formed of a molybdenum material to an AlN substrate. The liquid phase diffusion bonding includes heating the AlN substrate and the heating layer to a temperature greater than 1400° C. For example, in some aspects, the molybdenum material includes molybdenum and silicon, and the heating layer and the AlN substrate are heated to greater than 1400° C. such that the silicon melts and diffuses into the heating layer and the AlN substrate to form a liquid phase diffusion bond therebetween. In such aspects, when the silicon diffuses into the heating layer, it can form a molybdenum intermetallic compound. For example, when the silicon diffuses into the heating layer, it can form a Mo-Si alloy and / or a Mo-Si intermetallic compound.

[0016] In another aspect of the present disclosure, the method includes liquid phase diffusion bonding an interconnect layer formed of a molybdenum material to an AlN substrate. In such an aspect, a plurality of first conductive vias can be disposed in the AlN substrate and connect a heating layer to the interconnect layer. The method can also include disposing a plurality of second conductive vias in the AlN substrate, the plurality of vias can connect the interconnect layer to an outer surface of the AlN substrate.

[0017] Further areas of applicability will become apparent from the description provided herein.It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0018] In order that the present disclosure may be fully understood, various forms thereof will now be described, given by way of example only, with reference to the accompanying drawings, in which: [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a cross-sectional view of a ceramic heater constructed in accordance with the teachings of the present disclosure. [Figure 2A] FIG. 4 is a cross-sectional view of a second plate member. [Figure 2B] 2B is the second plate member of FIG. 2A having a trench and a via. [Figure 2C] 2C is the second plate member of FIG. 2B with a molybdenum layer deposited on an outer surface of the second plate member and within the trench. [Figure 2D] 2D is the second plate member of FIG. 2C with the molybdenum layer removed from the outer surface of the second plate member. [Figure 2E] 2D with a silicon layer deposited on the outer surface and the molybdenum layer within the trench of the second plate member. [Figure 2F] 2E is the second plate member of FIG. 2C with the silicon layer removed from the outer surface of the second plate member. [Figure 2G] 2F is the second plate member of FIG. 2F with fasteners deposited in the vias of the second plate member. [Figure 2H] FIG. 2C is a cross-sectional view of the first plate member, the second plate member, and the third plate member of FIG. 2G. [Figure 2I] 2H is an assembly of the first plate member, the second plate member, and the third plate member of FIG. 2H prior to transient liquid phase bonding of the plate members to one another. [Diagram 3] FIG. 2 is a cross-sectional view of another ceramic heater constructed in accordance with the teachings of the present disclosure. [Figure 4] 4 is a top view of the ceramic heater of FIG. 3 having a first configuration of heating zones. [Diagram 5] 4 is a top view of the ceramic heater of FIG. 3 having a second configuration of heating zones. [Figure 6] FIG. 6 is a perspective view of the ceramic heater in FIG. 5. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way.

[0021] The following description is merely exemplary in nature and is not intended to limit the disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate similar or corresponding parts and features. Examples are provided to fully convey the scope of the disclosure to those skilled in the art. Numerous specific details are described, such as types of specific components, devices, and methods, to provide a thorough understanding of the variations of the disclosure. It will be apparent to those skilled in the art that specific details need not be employed, and the examples provided herein may include alternative embodiments and are not intended to limit the scope of the disclosure. In some examples, well-known processes, well-known device structures, and well-known technologies have not been described in detail.

[0022] Referring to FIG. 1, a ceramic heater 10 constructed in accordance with the teachings of the present disclosure is shown. In one form, the ceramic heater 10 includes a substrate 110 made of a ceramic material such as aluminum nitride (AlN), a heating layer 130 for generating heat, a termination layer 132, a via 134, and a conductive via 140. The via 134 is disposed between the heating layer 130 and the termination layer 132 and connects the heating layer 130 and the termination layer 132. As shown, the ceramic heater 10 is used as part of a support platform in a semiconductor process. However, it should be understood that the ceramic heater may be used in other applications such as, by way of example, an extruder apparatus, an injection molding apparatus, a chemical reactor, among others, while remaining within the scope of the present disclosure.

[0023] The substrate 110 defines a first surface 112 for heating a target thereon and a second surface 114 from which terminal wires (FIG. 3) extend. A tubular shaft (FIG. 3) can be bonded to the second surface 114 of the ceramic heater 10 and surround the terminal wires to form a support.

[0024] The substrate 110 may include a plurality of plate members 122, 124, 126. The plurality of plate members 122, 124, 126 have a generally planar configuration, and while three plate members 122, 124, 126 are shown in the illustrated example, the substrate 110 may include any number of plate members. In this exemplary embodiment, the plate members are planar, but it should be understood that the teachings of the present disclosure may be applicable to a variety of shapes, including curved or non-linear shapes, while remaining within the scope of the present disclosure. The average surface roughness of the adjacent surfaces between the first plate member 122 and the second plate member 124 or the second plate member 124 and the third plate member 126 in one embodiment is less than 5 μm, for example, between 100 nm and 5 μm. In some embodiments, the average surface roughness of any one surface is between 100 nm and 1.5 μm, for example, between 100 nm and 750 nm or between 100 nm and 500 nm.

[0025] The heating layer 130 is embedded within or between the first plate member 122 and the second plate member 124. In some embodiments of the present disclosure, the heating layer 130 is embedded within the first plate member 122 and / or the second plate member 124. That is, the heating layer 130 may be disposed within the first plate member 122, the second plate member 124, or both the first plate member 122 and the second plate member 124 within the scope of the present disclosure.

[0026] The termination layer 132 is embedded within the second plate member 124 and / or the third plate member 126. In some forms, the termination layer 132 may be disposed within the second plate member 124 and / or the third plate member 126. That is, the termination layer 132 may be disposed within the second plate member 124, the third plate member 126, or both the second plate member 124 and the third plate member 126 within the scope of the present disclosure. In one form of the present disclosure, at least one of the heating layer 130, the termination layer 132, and the vias 134 is molybdenum or a molybdenum alloy.

[0027] As further shown, in one form, the conductive via 140 includes a head 142, a shaft 144, and a cap 146. In one form, the cap 146 has a nut configuration, where the shaft 144 is threaded inside the via 134, and the cap 146 is threaded onto the shaft 144. In at least one form, the head 142, shaft 144, and cap 146 are molybdenum or a molybdenum alloy. Further, the head 142, shaft 144, and cap 146 include the same or different molybdenum materials. In one form, a recess 150 (or cavity) is between the conductive via 140 and the first plate member 122 and / or a space 152 is between the conductive via 140 and the second plate member 124. It should be understood that such recess or cavity 150, 152 accommodates thermal expansion between the conductive via 140 and the AlN substrate 110. In another configuration, there is no recess or cavity between the conductive via 140 and the first plate member 122 and / or between the conductive via 140 and the second plate member 124. In such a configuration, at least a portion of the head 142 is bonded (e.g., brazed or liquid phase diffusion bonded) to the third plate member 126 and / or at least a portion of the cap 146 is bonded to the first plate member 122.

[0028] In accordance with the teachings of the present disclosure, at least one of the heating layer 130 and the termination layer 132 are transient liquid phase (TLP) bonded to at least one of the plate members 122, 124, and 126, as described in more detail below. Additionally, the conductive vias 140 may or may not be transient liquid phase bonded to the heating layer 130, the termination layer 132, and at least one of the plate members 122, 124, and 126. In at least one form of the present disclosure, the heating layer 130 is transient liquid phase bonded into the substrate 110 such that the heating layer 130, the termination layer 132, and the conductive vias 140 are hermetically sealed within the substrate 110, thereby eliminating the need for hermetic isolation that may be required in certain applications.

[0029] In one embodiment, the heating layer 130 has a thickness of 5 to 200 μm, e.g., 20 μm to 50 μm, 50 μm to 100 μm, 100 μm to 150 μm, or 150 μm to 200 μm. The termination layer 132 is generally thicker than the heating layer 130, resulting in a lower power density, leading to a higher power density in the heating layer 130 and a lower power density in the termination layer 132.

[0030] 2A-2I, a method of manufacturing a ceramic heater 10 according to the teachings of the present disclosure is provided.

[0031] 2A, the method includes, in Step 202, providing a second plate member 124. Among other features, the second plate member 124 has a first surface 123 disposed opposite a second surface 125.

[0032] As shown in FIG. 2B, in step 204, at least one first trench 124a, a via 124b, and a second trench 124c are formed in the second plate member 124. The first trench 124a is formed in the first surface 123, and the second trench 124c is formed in the second surface 125. That is, the first trench 124a extends from the first surface 123 toward the second surface 125 (in the +z direction), and the second trench 124c extends from the second surface 125 toward the first surface 123 (in the -z direction). The via 124b extends between the first trench 124a and the second trench 124c. It should be understood that the first trench 124a, the second trench 124c, and the via 124b, as well as other trenches and vias disclosed herein, can be formed using any known or yet to be developed material removal technique, non-limiting examples of which include grinding, laser cutting, etching, machining, photolithography, and sand or grit blasting, among others.

[0033] As shown in FIG. 2C, in step 206, at least one molybdenum (Mo) layer 50 is deposited on or within the first surface 123, the first trench 124a, the second trench 124c, and the second surface 125. Although not shown in FIG. 2C, the molybdenum layer 50 may be at least partially deposited within the via 124b. It should be understood that the molybdenum layer 50, as well as other layers disclosed herein, may be deposited using any known or yet to be developed material layer deposition technique. Non-limiting examples of material layer deposition techniques include cathodic arc discharge, cold spray, chemical vapor deposition (CVD) techniques, physical vapor deposition (PVD) techniques, sol-gel techniques, sputtering, and vacuum plasma spraying, among others.

[0034] As shown in FIG. 2D, at least a portion or thickness (z-direction) of the molybdenum layer 50 extends or is deposited on the first side 123 and the second side 125 and is removed in Step 208. In some forms, the molybdenum layer 50 is substantially removed from the first side 123 and the second side 125. However, as shown in the figure, the molybdenum layer 50 remains in the first trench 124a and the second trench 124c. In one form of the present disclosure, the average surface roughness of the second plate member 124 after the molybdenum layer 50 is removed from the first side 123 and the second side 125 is less than 5 μm, for example, between 100 nm and 5 μm. It should be understood that the molybdenum layer 50, as well as other layers disclosed herein, can be removed using any known or yet to be developed layer removal technique. Non-limiting examples of layer removal techniques include lapping, polishing, and chemical mechanical polishing (CMP), among others.

[0035] 2E, in Step 210, at least one silicon (Si) layer 52 is deposited on the molybdenum layer 50 disposed in the first and second trenches 124a, 124c, as well as on the first and second faces 123, 125. Although not shown, the silicon layer 52 may be at least partially deposited in the via 124b.

[0036] As shown in FIG. 2F, at least a portion or thickness (z-direction) of the silicon layer 52 extending or deposited on the first side 123 and the second side 125 is removed in step 212. In some embodiments, the silicon layer 52 is substantially removed from the first side 123 and the second side 125. However, as shown, the silicon layer 52 remains on the molybdenum layer 50 disposed in the first trench 124a and the second trench 124c. This provides the molybdenum layer 50 with the silicon thin film layer 52 disposed in the first trench 124a and the second trench 124c. Non-limiting examples of the thickness of the molybdenum layer 50 are in the range of 5 μm to 200 μm, for example, 10 μm to 40 μm. Non-limiting examples of the thickness of the silicon layer 52 are in the range of 100 nm to 10 μm, for example, 0.5 μm to 3 μm. In some embodiments of the present disclosure, the average surface roughness of the second plate member 124 after the silicon layer 52 is removed from the first side 123 and the second side 125 is less than 5 μm, for example between 100 nm and 5 μm.

[0037] In a variation of the present disclosure, step 208 is combined with step 212. That is, in step 206, a molybdenum layer 50 is deposited, step 208 is omitted, in step 210, a silicon layer 52 is deposited on the molybdenum layer 50, and in step 212, the molybdenum layer 50 and the silicon layer 52 extending or deposited on the first side 123 and the second side 125 are removed.

[0038] 2G, the shaft 144 of the conductive via 140 is positioned in the via 124b in step 214. The head 142 is positioned in contact with the silicon layer 52 deposited on the molybdenum layer 50 in the second trench 124c, and the cap 146 is positioned in contact with the silicon layer 52 deposited on the molybdenum layer 50 in the first trench 124a.

[0039] 2H, in step 216, a first plate member 122 and a third plate member 126 are provided. In some aspects of the present disclosure, the first plate member 122 includes an inner surface 121 and a trench 122a formed in the inner surface 121, and the third plate member 126 includes an inner surface 127 and a trench 126a formed in the inner surface 127. Additionally, the first plate member 122, the second plate member 124, and the third plate member 126 are assembled such that the trench 122a is aligned above the head 142 of the conductive via 140 (in the +z direction) and the trench 126a is aligned below the cap 146 of the conductive via 140 (in the -z direction).

[0040] 2I, the first plate member 122, the second plate member 124, and the third plate member 126 are placed in contact with one another in Step 218 and heated to an elevated temperature such that the silicon layer 52 melts and a liquid phase diffusion bond is formed between the plate members 122, 124, and 126 to create the ceramic heater 10 of FIG. 1. For example, the assembly of the first plate member 122, the second plate member 124, the third plate member 126, and the conductive vias 140 shown in FIG. 2I can be placed in a furnace "F" and heated to a temperature above the melting temperature of silicon (1414° C.). The silicon in the silicon layer 52 melts and diffuses into the adjacent molybdenum layer 50 and the adjacent plate members 122 and 126 to form a liquid phase diffusion bond therebetween. In particular, the silicon layer 52 disposed on the molybdenum layer 50 in the first trench 124a melts and diffuses into the molybdenum layer 50 and the overlapping inner surface 127 of the third plate member 126, forming a liquid phase diffusion bond between the molybdenum layer 50 and the third plate member 126. Also, the silicon layer 52 disposed on the molybdenum layer 50 in the second trench 124c melts and diffuses into the molybdenum layer 50 and the overlapping inner surface 121 of the first plate member 226, forming a liquid phase diffusion bond between the molybdenum layer 50 and the third plate member 126. In some embodiments of the present disclosure, the silicon layer 52 disposed on the molybdenum layer 50 in the first trench 124a melts and diffuses into the cap 146 of the conductive via 140, and the silicon layer 52 disposed on the molybdenum layer 50 in the second trench 124c melts and diffuses into the head 142 of the conductive via 140, forming a liquid phase diffusion bond therebetween.

[0041] Without being bound by theory, it is understood that the diffusion of silicon into the molybdenum layer 50 results in the formation of a Mo-Si diffusion layer that may or may not include a Mo-Si alloy or a Mo-Si intermetallic compound. For example, the diffusion of silicon into the molybdenum layer 50 can result in the formation of a liquid phase diffusion bond with a molybdenum disilicide (MoSi2) layer or a Mo-Si diffusion layer that includes MoSi2 precipitates. Also, the diffusion of silicon into the inner surfaces 121, 127 of the first plate member 122 and the third plate member 126, respectively, results in the formation of an AlN-Si diffusion layer that may or may not include an Al-Si alloy, an Al-Si intermetallic compound, and / or an AlN-Si intermetallic compound. It should also be appreciated that diffusion of silicon into the molybdenum layer 50 and adjacent inner surfaces 121, 127 results in isothermal solidification of the silicon as, for example, MoSi2 precipitates form and a bonded interface (i.e., a liquid phase diffusion bond) is formed between the molybdenum layer 50 and the adjacent inner surfaces 121, 127. In this manner, the plate members 122, 124, 126 are bonded together to form the substrate 110 having the molybdenum heating layer 130 and the molybdenum termination layer 132.

[0042] 2A-2I show liquid phase diffusion bonding of the plate members 122, 124, 126, it should be understood that brazing of portions of the ceramic heater 10 may be included. For example, the outer diameter surfaces of the plate members 122, 124 and / or 126 may be brazed together to seal the outer diameter of the substrate 110, thereby preventing leakage or outgassing of vapors from the heating layer 130, the termination layer 132 and the conductive vias 140 into the semiconductor wafer processing chamber during use of the ceramic heater 10. In one form, trenches may be formed in one or more of the plate members 122, 124, 126 to confine the flow of braze alloy outside of the desired braze area, thereby reducing the desired braze area.

[0043] 3, in another embodiment of the present disclosure, a ceramic heater 30 constructed according to the teachings of the present disclosure is shown. The ceramic heater 30 includes a substrate 310 made of a ceramic material such as aluminum nitride (AlN), a heating layer 330 for generating heat, a wiring layer 340, one or more first conductive vias 350, one or more second conductive vias 370, and a substrate shaft 380. The first conductive via 350 is disposed between the heating layer 330 and the wiring layer 340 to connect the heating layer 330 to the wiring layer 340, and the second conductive via 370 is disposed between the wiring layer 340 and at least one terminal wiring 390. The ceramic heater 30 may be used as a part of a support in semiconductor processing.

[0044] The substrate 310 defines a first surface 312 for heating a target thereon and a second surface 314 from which at least one terminal wire 390 extends. To form a support, a substrate shaft 380 is bonded to the second surface 314 of the substrate 310 via a bonding layer 382 (e.g., a liquid phase diffusion bonding layer) and surrounds the at least one terminal wire 390. The substrate 310 may include a plurality of plate members 322, 324, 326. Each of the plurality of plate members 322, 324, 326 has a planar configuration, and although three plate members 322, 324, 326 are shown in the illustrated example, the substrate 310 may include any number of plate members. The average surface roughness of the adjacent surfaces between the first plate member 322 and the second plate member 324 and between the second plate member 324 and the third plate member 326 is less than 5 μm, for example, between 100 nm and 5 μm.

[0045] The heating layer 330 is embedded within the first plate member 322 and / or the second plate member 324. In some embodiments of the present disclosure, the heating layer 330 is disposed in the first plate member 322 and / or the second plate member 324. That is, the heating layer 330 may be disposed in the first plate member 322, the second plate member 324, or the first plate member 322 and the second plate member 324 within the scope of the present disclosure. The wiring layer 340 is embedded within the second plate member 324 and / or the third plate member 326. In some embodiments, the wiring layer 340 may be disposed on or partially on the second plate member 324 and / or the third plate member 326. That is, the wiring layer 340 may be disposed in the second plate member 324, the third plate member 326, or the second plate member 324 and the third plate member 326 within the scope of the present disclosure. At least one of the first conductive vias 350 in the second plate member 324 between the heating layer 330 and the wiring layer 340, and / or at least one of the second conductive vias 360 in the third plate member 326, may be a trench (not shown) along a side of the second plate member 324 or the third plate member 326, respectively. In some forms of the present disclosure, at least one of the heating layer 330, the wiring layer 340, the first conductive via 350, and the second conductive via 370 is molybdenum or a molybdenum alloy.

[0046] In one aspect of the present disclosure, the heating layer 330 includes at least one heating element 332 and the wiring layer 340 includes a plurality of wiring layer elements 342. For example, the heating layer 330 can include, among others, a plurality of circularly arranged heating elements 332 and / or a plurality of serpentine arranged heating elements 332. The heating layer 330 can also define a plurality of separate, independently controlled heating zones, as described in more detail below.

[0047] In some forms of the present disclosure, the first conductive via 350 includes a fastener 360 including a head 362, a shaft 364, and a cap 366. In such forms, the fastener 360 extends through the second plate member 324, and in at least one embodiment, the head 362, shaft 364, and cap 366 are molybdenum or a molybdenum alloy. The second conductive via 370 can include a fastener (not shown). Alternatively, or in addition, the first conductive via 350 and / or the second conductive via 370 may be formed from rods, pins, shafts, among others, disposed in the second plate member 324 and the third plate member 326, respectively.

[0048] It should be understood that the substrate 310 is fabricated using liquid phase diffusion bonding, as described above with respect to the substrate 110. For example, in one aspect of the present disclosure, trenches and vias (not numbered) are formed in the second plate member 324, a molybdenum layer is deposited in the trenches and removed from the outer surface of the second plate member 324. A silicon layer is deposited on the molybdenum layer in the trenches and the silicon layer is removed from the outer surface of the second plate member 324, and a conductive via 360 is inserted through the via in the second plate member 322. A trench and vias (not numbered) are formed in the third plate member 326, and the plate members 322, 324, 326 are assembled and liquid phase diffusion bonded to one another. Additionally, a trench (not numbered) is formed in the substrate shaft 380 and a Mo-Si bonding layer is deposited in the trench and the substrate shaft 380 is assembled and transient liquid phase bonded to a third plate member before, during or after transient liquid phase bonding of the plate members 322, 324, and 326.

[0049] 4, a top view (-z direction) of a ceramic heater 30 according to one aspect of the present disclosure is shown. The first plate member 322 is not shown in FIG. 4 to show the heating layer 330 in more detail. The ceramic heater 30 shown in FIG. 4 includes a plurality of molybdenum heating elements 332, a plurality of wiring layers 340, and a plurality of conductive vias 350 extending between and electrically connecting the plurality of molybdenum heating elements to the plurality of wiring layers 340. The ceramic heater 30 shown in FIG. 4 also includes six separate independently controlled heat zones 334.

[0050] 5, there is shown a top view (-z direction) of a ceramic heater 30 (without the first plate member 322) according to another aspect of the present disclosure. Similar to the ceramic heater 30 shown in FIG. 4, the ceramic heater 30 shown in FIG. 5 includes a plurality of molybdenum heating elements 332, a plurality of wiring layers 340, and a plurality of conductive vias 350 extending between and electrically connecting the plurality of molybdenum heating elements to the plurality of wiring layers 340. The ceramic heater 30 shown in FIG. 5 also includes six separate independently controlled heat zones 336.

[0051] 6, a perspective view of the ceramic heater of FIG. 5 is shown with six thermal zones 336, a substrate shaft 380, and terminal wires 390.

[0052] Although the figures are generally described with Mo-Si layers or compositions used to transiently bond plate members, it should be understood that the teachings of the present disclosure include other compositions for transiently bonding plate members. Non-limiting examples of compositions that can be used to transiently bond plate members to one another as described herein include titanium-aluminum layers, palladium-aluminum layers, manganese-aluminum layers, niobium-silicon layers, and tungsten-silicon layers, among others.

[0053] When an element or layer is referred to as being "on," "engaged to," or "coupled to" another element or layer, it may be directly on, engaged, connected, or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may not be intervening elements or layers. Other words used to describe relationships between elements should be interpreted similarly (e.g., "between" vs. "directly between," "adjacent" vs. "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0054] Terms such as first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, but these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, and / or portion from another element, component, region, layer, and / or portion. Terms such as "first", "second", and other numerical terms, as used herein, do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer, or portion can be referred to as a second element, component, region, layer, or portion without departing from the teachings of the exemplary embodiments. Furthermore, an element, component, region, layer, or portion may be referred to as a "second" element, component, region, layer, or section without the need for the element, component, region, layer, or section to be referred to as a "first" element, component, region, layer, or portion.

[0055] Spatially relative terms such as "inner," "outer," "beneath," "below," "lower," "above," "upper," and the like may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as shown in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. For example, if the device in the figures is turned over, elements described as being "below" or "beneath" other elements or features would be positioned "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above or below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein would be interpreted accordingly.

[0056] As used herein, the phrase at least one of A, B, and C should be construed to mean the logical (A OR B OR C) using a non-exclusive logical OR, and not to mean "at least one of A, at least one of B, and at least one of C."

[0057] Unless expressly indicated otherwise, all numerical values ​​expressing mechanical / thermal properties, composition percentages, dimensions and / or tolerances, or other properties, in describing the scope of this disclosure, should be understood to be modified by the words "about" or "approximately." This variation may be desirable for a variety of reasons, including industrial practices, manufacturing techniques, and testing capabilities.

[0058] The terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to be limiting. The singular forms "a", "an" and "the" may be intended to include the plural unless the context clearly indicates otherwise. The terms "including" and "having" are inclusive and thus specify the presence of a stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein should not be construed as necessarily requiring their execution in the particular order described or illustrated, unless specifically identified as an order of execution. It should also be understood that additional or alternative steps may be used.

[0059] The description of the present disclosure is merely exemplary in nature, and therefore examples that do not depart from the contents of the present disclosure are intended to be within the scope of the present disclosure. Such examples should not be considered as departures from the spirit and scope of the present disclosure. The broad teachings of the present disclosure can be implemented in various forms. Thus, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, since other modifications will become apparent upon review of the drawings, specification, and appended claims. The invention as described in the claims of the present application as originally filed is set forth below. [1] A ceramic substrate; a heating layer, the heating layer being bonded to the ceramic substrate via liquid phase diffusion bonding; A heater comprising: [2] The heater of claim 1 , further comprising: a wiring layer; and a plurality of first conductive vias connecting the heating layer to the wiring layer. [3] 3. The heater of claim 2, wherein the ceramic substrate is an AlN substrate, the wiring layer and the plurality of first conductive vias are formed of molybdenum material, and at least one of the wiring layer and the plurality of first conductive vias is bonded to the AlN substrate via the liquid phase diffusion bonding. [4] The heater of claim 3 , further comprising a plurality of second conductive vias connecting the wiring layer to a surface of the AlN substrate. [5] 4. The heater of claim 3, wherein the AlN substrate comprises a plurality of plate members bonded together with the molybdenum material via liquid phase diffusion bonding. [6] The heater of claim 5 , wherein the plurality of plate members includes a first plate member and a second plate member through which the plurality of first conductive vias formed from the molybdenum material extend. [7] The heater of claim 6 , wherein the heating layer is embedded within at least one of the first plate member and the second plate member. [8] 7. The heater of claim 6, wherein an average surface roughness between the first plate member and the second plate member is less than 5 μm. [9] 7. The heater of claim 6, further comprising a wiring layer formed of the molybdenum material embedded within at least one of the second plate member and the third plate member and in contact with the plurality of first conductive vias.

[10] The heater of claim 9 further comprising a terminal wire joined to the termination portion.

[11] The heater of claim 6 , further comprising a termination layer material embedded within at least one of the second plate member and the third plate member.

[12] The heater of claim 11 , wherein the termination layer comprises molybdenum and silicon.

[13] The heater of claim 12 , further comprising at least one of a molybdenum-silicon (Mo—Si) alloy and a Mo—Si intermetallic compound between the heating layer and the AlN substrate.

[14] 6. The heater of claim 5, wherein the plurality of plate members includes a first plate member, a second plate member having a plurality of first conductive vias formed of the molybdenum material extending therethrough, and a third plate member having a plurality of second conductive vias formed of the molybdenum material extending therethrough.

[15] The heater of claim 14 , wherein the heating layer is embedded in at least one of the first plate member and the second plate member.

Claims

1. A ceramic substrate; a heating layer, the heating layer being bonded to the ceramic substrate via liquid phase diffusion bonding; a wiring layer extending radially between a central portion of the ceramic substrate and an outer portion of the ceramic substrate, the wiring layer being disposed within the ceramic substrate; a plurality of first conductive vias connecting the heating layer and the wiring layer, the wiring layer and at least one of the plurality of first conductive vias being bonded to the ceramic substrate by liquid phase diffusion bonding; A heater comprising:

2. The heater of claim 1 , further comprising a plurality of second conductive vias connecting the wiring layer to a surface of the ceramic substrate.

3. The heater of claim 1 , wherein the ceramic substrate comprises a plurality of plate members bonded via liquid phase diffusion bonding.

4. The heater of claim 3 , wherein the plurality of plate members includes a first plate member and a second plate member through which the plurality of first conductive vias extend.

5. The heater of claim 4 , wherein the heating layer is embedded within at least one of the first plate member and the second plate member.

6. The heater of claim 4 , wherein an average surface roughness between said first plate member and said second plate member is less than 5 μm.

7. The heater of claim 4 , further comprising a wiring layer embedded within at least one of the second and third plate members and in contact with the plurality of first conductive vias.

8. The heater of claim 7 further comprising a terminal wire joined to the termination portion.

9. The heater of claim 7 further comprising a termination layer material embedded within at least one of the second plate member and the third plate member.

10. The heater of claim 9 , wherein the termination layer material comprises molybdenum and silicon.

11. The heater of claim 10, further comprising at least one of a molybdenum-silicon (Mo-Si) alloy and a Mo-Si intermetallic compound between the heating layer and the ceramic substrate.

12. 4. The heater of claim 3, wherein the plurality of plate members includes a first plate member, a second plate member having a plurality of first conductive vias extending therethrough, and a third plate member having a plurality of second conductive vias extending therethrough.

13. The heater of claim 12 , wherein the heating layer is embedded in at least one of the first plate member and the second plate member.

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