Antenna Array

Abstract

To provide a micro strip antenna capable of improving isolation and reducing an axial ratio.SOLUTION: A micro strip antenna includes a carrier, an antenna, a ground element and a power divider. The antenna arranged on the carrier includes a circular main body part and two circular feeding points; the circular main body part has a first circle center and radius; two circular feeding points are surrounded by the circular main body part without contacting the circular main body part so as to generate a capacity effect with the circular main body part; each of the two circular feeding points has a second circle center; the shortest distance between the first and second circle centers is equal to or less than a half of the first radius; the ground element is arranged on the carrier; the power divider is electrically connected at the two circular feeding points; and the two circular feeding points have a phase difference of 90 degrees therebetween by the power divider.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to antennas, and in particular to microstrip antennas. [Background technology]

[0002] Microstrip antennas are widely used in electronic products (e.g., mobile phones) because they can be printed directly on circuit boards and are inexpensive. Traditional dual-feed microstrip antennas are designed with factors such as isolation and axial ratio in mind to ensure ideal operation (e.g., avoiding interference from components in electronic products). However, the development of traditional dual-feed microstrip antennas has matured, and traditional dual-feed microstrip antennas are no longer able to improve isolation or reduce axial ratios.

[0003] Therefore, the inventor believed that the above-mentioned shortcomings could be remedied, and so he deliberately researched and applied scientific principles, ultimately completing an invention that is rationally designed and effective in remedying the above-mentioned shortcomings. Summary of the Invention [Problem to be solved by the invention]

[0004] In order to address the above technical deficiencies, the present invention provides a microstrip antenna. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, one of the technical aspects adopted by the present invention is to provide a microstrip antenna. The microstrip antenna includes an insulating carrier, a circular body, two circular feed points, a ground element, and a power divider. The circular body is disposed on the insulating carrier. The circular body has a first circular center and a radius. The two circular feed points are surrounded by the circular body and are not connected to the circular body, and the two circular feed points are configured to generate a capacitive effect with the circular body. Each of the two circular feed points has a second circular center, and the shortest distance between the second circular center and the first circular center is less than 1 / 2 of the radius. The ground element is disposed on the insulating carrier. The power divider is electrically coupled to the two circular feed points. The power divider is configured to generate a phase difference of 90 degrees between the two circular feed points.

[0006] In one possible or preferred embodiment, the insulating carrier includes a first layer, a second layer, and at least one intermediate layer between the first layer and the second layer, the circular body portion being disposed on the first layer, the power divider being disposed on the second layer, and the ground element being disposed on the second layer or on the at least one intermediate layer.

[0007] In one preferred embodiment, each of the first and second layers is a circuit board and at least one intermediate layer is an air medium.

[0008] In one preferred embodiment, each of the first layer, the second layer, and the at least one intermediate layer is a circuit board.

[0009] In one preferred embodiment, at least one intermediate layer has two through holes, and each of the four microstrip antennas includes two conductive pillars that pass through the two through holes, such that two ends of each of the two conductive pillars are electrically coupled to the power divider and the circular feed point.

[0010] As described above, in the microstrip antenna provided by the present invention, "the two circular feed points are configured to generate a capacitive effect with the circular body," and "each of the two circular feed points has a second circular center, and the shortest distance between the second circular center and the first circular center is less than 1 / 2 of the radius," thereby allowing the microstrip antenna to effectively improve isolation while simultaneously reducing the axial ratio.

[0011] In order to make the features and technical contents of the present invention more readily apparent, reference is made to the following detailed description of the present invention and the accompanying drawings, which are provided for reference and explanation only and are not intended to limit the scope of the present invention. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic three-dimensional diagram of an antenna array according to a first embodiment of the present invention. [Diagram 2] FIG. 4 is another schematic three-dimensional view of the antenna array according to the first embodiment of the present invention. [Diagram 3] 1 is a schematic top view of an antenna array according to a first embodiment of the present invention. [Figure 4] FIG. 2 is a schematic bottom view of the antenna array according to the first embodiment of the present invention. [Diagram 5] FIG. 4 is a schematic cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 4 is a diagram showing axial ratio data of the antenna array according to the first embodiment of the present invention. [Figure 7] FIG. 4 is a diagram showing peak gain data of the antenna array according to the first embodiment of the present invention. [Figure 8] FIG. 5 is a schematic cross-sectional view of an antenna array according to a second embodiment of the present invention. [Figure 9] FIG. 11 is a schematic top view of an antenna array according to a third embodiment of the present invention. [Figure 10] FIG. 11 is a schematic bottom view of an antenna array according to a third embodiment of the present invention. [Figure 11]FIG. 10 is a schematic diagram showing how a circuit is connected to an antenna array according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The following describes the embodiments disclosed in the present invention with specific examples of the "microstrip antenna" according to the present application. Those skilled in the art can understand the advantages and effects of the present invention from the disclosure of this specification. The present invention can be implemented or applied in other different embodiments. Each section in this specification can be modified and changed based on various aspects or applications without departing from the spirit of the present invention. In addition, the drawings of the present invention are for simple and schematic illustration only and do not show actual dimensions. In the following embodiments, the technical matters related to the present invention will be further described, but the disclosed contents do not limit the present invention. In addition, the term "or" used in this specification may include any one or more combinations of related items according to actual circumstances.

[0014] Throughout this specification, terms such as "first," "second," and "third" may be used to describe various components or signals, but it should be understood that these components and signals should not be limited by these terms. These terms are used primarily to distinguish one component from another or one signal from another. Furthermore, as used herein, the term "or" can include any one or combination of the associated listed items, where appropriate.

[0015] Furthermore, when reference is made in the following description to a particular drawing or as shown in a particular drawing, this is intended only to emphasize that in the following description, most of the relevant content described appears in that particular drawing, and is not intended to limit the following description to only references to that particular drawing.

[0016] [First embodiment] 1 to 7, the first embodiment of the present invention provides a microstrip antenna 100 suitable for a wide band. As shown in Fig. 1 and Fig. 2, the microstrip antenna 100 includes an insulating carrier 1, a circular body 2, two circular feeding points 3, a ground element 4, and two conductive poles 5 arranged on the insulating carrier 1, and a power divider electrically coupled to the two circular feeding points 3. In the following description, the structure and connection relationship of each component of the microstrip antenna 100 will be described.

[0017] Referring to Figures 1, 2 and 5, the insulating carrier 1 of this embodiment is a multi-layer printed wiring board, and the insulating carrier 1 includes a first layer 11, a second layer 12, and an intermediate layer 13 located between the first layer 11 and the second layer 12.

[0018] In practical applications, the first layer 11 and the second layer 12 may be physical components (i.e., circuit boards), and the first layer 11 and the second layer 12 may be spaced apart from each other and supported by insulating supports (not shown) such that the first layer 11 and the second layer 12 have an intermediate layer 13 as an air medium.

[0019] 1, 3 and 5, the circular body 2 in this embodiment is a sheet-like conductive material (e.g., copper foil). The circular body 2 is disposed on the side of the first layer 11 away from the second layer 12, and has a first center C1 and a radius R.

[0020] In addition, the circular body 2 also has two circular through holes H21, and a part of the first layer 11 can be exposed by forming the two circular through holes H21. The area of ​​the two circular through holes H21 must be larger than the area of ​​the two circular feeding points 3, so that the two circular through holes H21 can be used to accommodate the two circular feeding points 3, respectively. Furthermore, the two circular feeding points 3 are respectively disposed in the central regions of the two circular through holes H21, so that the two circular feeding points 3 are surrounded by the circular body 2 and are not connected to the circular body 2, and the two circular feeding points 3 can exert a capacitive effect with the circular body 2.

[0021] It should be noted that each of the two circular feeding points 3 in this embodiment is also a sheet-shaped conductive material (e.g., copper foil). In order to improve the isolation of the capacitive effect and reduce the axial ratio of the capacitive effect, the positional relationship between the two circular feeding points 3 and the circular main body 2 is particularly important. Specifically, each of the circular feeding points 3 has a second center C2, and the shortest distance T1 between the second center C2 of each of the two circular feeding points 3 and the first center C1 of the circular main body 2 is required, and is preferably 1 / 2 or less of the radius R. In other words, the positions of the two circular feeding points 3 are adjacent to the center of the circular main body 2.

[0022] In a preferred application, the area of ​​each of the two circular feed points 3 is preferably 1 / 4 or less of the area of ​​the circular body 2 so that the capacitive effect between the two circular feed points 3 and the circular body 2 is appropriate. Furthermore, the first extension line L1 can pass through the second center C2 of one of the two circular feed points 3 and the first center C1 of the circular body 2, and the second extension line L2 can pass through the second center C2 of the other of the two circular feed points 3 and the first center C1 of the circular body 2, and the first extension line L1 and the second extension line L2 have an angle of 90 degrees therebetween.

[0023] 1 and 5, the two conductive pillars 5 in this embodiment are cylindrical structures, and the two conductive pillars 5 are disposed between the first layer 11 and the second layer 12. The two conductive pillars 5 correspond in position to the two circular feeding points 3, and one of both ends of the two conductive pillars 5 can pass through the first layer 11 and be electrically coupled to the two circular feeding points 3, and the other of both ends of the two conductive pillars 5 can pass through the second layer 12 and be electrically coupled to the power divider 6.

[0024] The ground element 4 in this embodiment is also a sheet-like conductive material (e.g., copper foil), and the ground element 4 is disposed on the side of the second layer 12 facing the first layer 11. The ground element 4 has two avoidance holes H4, which positionally correspond to the two conductive posts 5, so that the ground element 4 is not connected to the two conductive posts 5. Furthermore, the ground element 4 can preferably completely cover the side of the second layer 12 facing the first layer 11, but the present invention is not limited thereto.

[0025] 2, 4 and 5, the power divider 6 in this embodiment may be a Wilkinson power divider, which can be used to receive a signal from a beamforming integrated circuit (i.e., BFIC). Also, the power divider 6 is disposed on the side of the second layer 12 away from the first layer 11, and the power divider 6 can be electrically coupled to the two circular feed points 3 by another of the two conductive pillars 5 ends, so as to generate a 90 degree phase difference between the two circular feed points 3. Thus, the microstrip antenna 100 can generate a circularly polarized field pattern, and can cooperate with the beamforming integrated circuit to realize beam control.

[0026] FIG. 6 is a diagram of the axial ratio data of the antenna array according to the first embodiment of the present invention, and FIG. 7 is a diagram of the peak gain data of the antenna array according to the first embodiment of the present invention. From the axial ratio data, it can be seen that when the microstrip antenna 100 is in the range of 10.6MHz to 14MHz, the axial ratio of the microstrip antenna 100 can be 3dB or less. Also, when the microstrip antenna 100 is in the range of 11.6MHz to 13.6MHz, the axial ratio of the microstrip antenna 100 can be less than 1.2dB. Furthermore, from the peak gain data, it can be seen that when the microstrip antenna 100 is in the range of 10.9MHz to 13MHz, the peak gain of the microstrip antenna 100 can be greater than 2dB. That is, the microstrip antenna 100 of the present invention not only has the advantage of a small axial ratio, but also has the effect of being able to increase the gain value.

[0027] [Second embodiment] Referring to FIG. 8, the second embodiment provides a microstrip antenna 100'. This embodiment is similar to the first embodiment, and the similarities will not be repeated here. The main differences between this embodiment and the first embodiment are as follows:

[0028] 8, each of the first layer 11, the second layer 12, and the intermediate layer 13 in this embodiment is a circuit board, and the ground element 4 is disposed on the surface of the intermediate layer 13 facing the first layer 11. Furthermore, two through holes H13 are formed in the intermediate layer 13, and the two through holes H13 positionally correspond to the two conductive posts 5, allowing the two conductive posts 5 to penetrate the intermediate layer 13. Note that each of the conductive posts 5 in this embodiment may also be a via hole, but the present invention is not limited thereto.

[0029] Therefore, when the intermediate film 13 is a (high frequency) circuit board, the intermediate film 13 can be used as a power source or a control circuit. In addition, since the microstrip antenna 100' of this embodiment is directly formed by stacking a plurality of circuits in the manufacturing process, it is possible to improve manufacturing convenience compared to the microstrip antenna 100 of the first embodiment (particularly the array antenna).

[0030] Furthermore, it should be noted that in another embodiment of the present invention (not shown), the insulating carrier 1 includes a plurality of intermediate layers 13 and a plurality of ground elements 4, where a portion of the intermediate layers 13 may be a circuit board and another portion of the intermediate layers 13 may be an air medium. The ground elements 4 are disposed on the intermediate layers 13 which are circuit boards.

[0031] Naturally, all of the intermediate films 13 may be circuit boards, but the present invention is not limited to this. That is, the number of intermediate films 13 in the insulating carrier 1 and the ground member 4 may be at least one.

[0032] [Third embodiment] Referring to FIG. 9 to FIG. 11, the third embodiment of the present invention provides an antenna array 1000, which includes a common carrier SC and four microstrip antennas 100″ arranged on the common carrier SC. The following description will describe the structure and connection relationship of each component of the antenna array 1000.

[0033] 9 and 10, the common carrier SC includes a first plate surface S1 and a second plate surface S2 facing each other, and the common carrier SC has a first direction D1 and a second direction D2 perpendicular to the first direction D1. In this embodiment, the common carrier SC can be exemplified as a plurality of insulating carriers 1 of the first embodiment or the second embodiment. That is, the common carrier SC of this embodiment is similar to the insulating carrier 1 of the first embodiment or the second embodiment, and the similarities between this embodiment and the first embodiment or the second embodiment will not be repeated here.

[0034] That is, the common carrier SC also includes a first layer 11, a second layer 12, and an intermediate layer 13 between the first layer 11 and the second layer 12 (as shown in FIG. 5 or FIG. 8). Note that the surface of the first layer 11 away from the second layer 12 is defined as a first plate surface S1, and the surface of the second layer 12 away from the first layer 11 is defined as a second plate surface S2.

[0035] 9 and 10, each of the microstrip antennas 100" of this embodiment can be exemplified as the microstrip antennas 100, 100' of the first or second embodiment. That is, each of the four microstrip antennas 100" of this embodiment is similar to the microstrip antennas 100, 100' of the first or second embodiment, and the similarities with this embodiment include the circular body portion 2, the ground element 4, the two conductive posts 5 and the power divider 6 (shown in FIG. 1), so the similarities between this embodiment and the first or second embodiment will not be repeated here. For convenience of explanation, each of the circular body portion 2 and the two circular feeding points 3 of the microstrip antenna 100" can be further defined as an antenna structure AS.

[0036] In order to reduce the area used by the circuit 200 connected to the four microstrip antennas 100″ on the common carrier SC (as shown in FIG. 11), the four microstrip antennas 100″ can be configured as follows.

[0037] Specifically, the four microstrip antennas 100" are arranged at intervals on a common carrier SC, and the four microstrip antennas 100" are arranged in a matrix along the first direction D1 and the second direction D2. Furthermore, on the first plate surface S1, among the antenna structures AS along the second direction D2, any two adjacent ones have a two-fold rotational symmetry relationship. Furthermore, on the second plate surface S2, among the power distributors 6 along the first direction D1 or the second direction D2, any two adjacent ones have a mirror image relationship.

[0038] For example, as shown in FIG. 9, the first plate surface S1 has a first center line CL1 parallel to the second direction D2. The first plate surface S1 also has a first rotation point CP1 between the two microstrip antennas 100" in the first row CO1, and the first rotation point CP1 is passed by the first center line CL1 (and the connecting line of the centers of the two circular body portions 2). The first plate surface S1 also has a second rotation point CP2 between the two microstrip antennas 100" in the second row CO2, and the second rotation point CP2 is passed by the first center line CL1 (and the connecting line of the centers of the two circular body portions 2). When the two circular feed points 3 of the two microstrip antennas 100'' in the first row RO1 are rotated 180 degrees relative to the first rotation point CP1 and the second rotation point CP2, respectively, the circular feed points 3 of the two microstrip antennas 100'' in the first row RO1 can be superimposed on the circular feed points 3 of the two microstrip antennas 100'' in the second row RO2.

[0039] 10, the second plate surface S2 has two second center lines CL2 parallel to the first direction D1 and the second direction D2. The two power dividers 6 in the first row RO1 and the two power dividers 6 in the second row RO2 are arranged symmetrically with respect to one of the two second center lines CL2 as an axis parallel to the second direction D2, and the two power dividers 6 in the first row CO1 and the two power dividers 6 in the second row CO2 are arranged symmetrically with respect to one of the two second center lines CL2 as an axis parallel to the first direction D1.

[0040] Of course, in another embodiment of the present invention (not shown), the antenna array 1000 may include 4M microstrip antennas 100'', where M is a positive integer.

[0041] [Beneficial Effects of the Embodiments] In conclusion, in the microstrip antenna provided by the present invention, "the two circular feed points are configured to generate a capacitive effect with the circular body," and "each of the two circular feed points has a second circular center, and the shortest distance between the second circular center and the first circular center is less than 1 / 2 of the radius," thereby enabling the microstrip antenna to effectively improve isolation while simultaneously reducing the axial ratio.

[0042] The above disclosure is merely a preferred embodiment of the present invention, and does not limit the scope of the claims of the present invention. Therefore, all equivalent technical modifications made based on the contents of the specification and accompanying drawings of the present invention shall be included in the scope of the claims of the present invention. [Explanation of symbols]

[0043] 1000 Antenna Array 100, 100', 100” Microstrip Antenna 1. Insulating carrier 11 First Layer 12 Second Layer 13. Middle Class H13 through hole 2 Circular body H21 Circular through hole 3 Circular power supply point 4. Grounding element H4 Interference avoidance hole 5 Conductive Pillars 6 Power Divider C1 First center C2 Second center R radius T1 Shortest distance L1 First extension line L2 Second extension line SC Common Carrier AS Antenna Structure S1 First plate S2 Second board D1 First direction D2 Second direction RO1 1st row RO2 2nd row CO1 1st column CO2 2nd column CP1 First rotation point CP2 Second rotation point CL1 First center line CL2 Second center line 200 circuits

Claims

1. 1. An antenna array comprising four microstrip antennas, Each of the four microstrip antennas has: an insulating carrier; a circular body portion disposed on the insulating carrier and having a first center and a radius; two circular feed points that are surrounded by the circular main body and are not connected to the circular main body so as to generate a capacitive effect with the circular main body, and each of the two circular feed points has a shortest distance from the first circle center that is less than half the radius; a ground element disposed on the insulating carrier; a power divider electrically coupled to the two circular feed points to create a 90 degree phase difference between the two circular feed points; Equipped with The four microstrip antennas are arranged in a 2×2 matrix, and the circular body and the circular feed point of one of the two microstrip antennas in a first column of the 2×2 matrix are arranged with 180° rotational symmetry with respect to each other, and the circular body and the circular feed point of one of the two microstrip antennas in a second column of the 2×2 matrix are arranged with 180° rotational symmetry with respect to each other, An antenna array characterized in that the geometric shape of one of the power dividers of the two microstrip antennas in the first column of the 2 x 2 matrix and the geometric shape of the other of the power dividers are arranged line-symmetrically with respect to a central axis of the insulating carrier perpendicular to the column direction of the 2 x 2 matrix, and the geometric shape of one of the power dividers of the two microstrip antennas in the second column of the 2 x 2 matrix and the geometric shape of the other of the power dividers are arranged line-symmetrically with respect to the central axis.

2. 2. The antenna array of claim 1, wherein the insulating carrier includes a first layer, a second layer, and at least one intermediate layer between the first layer and the second layer, the circular body portion being disposed on the first layer, the power divider being disposed on the second layer, and the ground element being disposed on the second layer or the at least one intermediate layer.

3. The antenna array of claim 2 , wherein each of said first layer and said second layer is a circuit board, and said at least one intermediate layer is an air medium.

4. The antenna array of claim 2 , wherein each of the first layer, the second layer, and the at least one intermediate layer is a circuit board.

5. 5. The antenna array of claim 4, wherein the at least one intermediate layer has two through holes, and each of the microstrip antennas includes two conductive pillars, the two conductive pillars passing through the two through holes such that both ends of each of the two conductive pillars are electrically coupled to the power divider and one of the two circular feed points.

6. 2. The antenna array according to claim 1, wherein a first extension line passes through a second center of one of the two circular feed points and the first center of the circular body, and a second extension line passes through a second center of the other of the two circular feed points and the first center of the circular body, and the first extension line and the second extension line form an angle of 90 degrees.

7. 2. The antenna array of claim 1, wherein the area of ​​each of the two circular feed points is less than or equal to 1 / 4 of the area of ​​the circular body portion.

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