Liquid cooling device and machine

Abstract

The embodiment of the present application relates to the field of electronic device heat dissipation technology, and discloses a liquid cooling device and equipment, comprising a cooling substrate, a first seal cover plate, and a first seal tube, the cooling substrate is in contact with a heat dissipation target device and is used to cool the heat dissipation target device, the first seal cover plate is fixed on the cooling substrate and forms a first seal cavity together with the cooling substrate, the first seal tube is fixed on the first seal cover plate and communicates with the first seal cavity, the first seal tube forms a liquid cooling passage for transporting a liquid refrigerant together with the first seal cavity, the second seal cover plate is fixed on the cooling substrate and covers the first seal cover plate, the second seal tube is fixed on the second seal cover plate, the second seal cover plate forms a second seal cavity together with the second seal tube, and the liquid cooling passage is located in the second seal cavity. The liquid cooling device according to the present application has excellent sealing performance, and eliminates the reliability problem caused by water leakage from the first seal cavity, thereby improving the safety of the liquid cooling device.

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application is proposed based on a Chinese patent application bearing application number "202110181444X" and filing date of February 9, 2021, and claims priority to this Chinese patent application, the entire contents of which are hereby incorporated by reference into this application.

[0002] The present application relates to the field of electronic device heat dissipation technology, for example, to liquid cooling devices and equipment. [Background technology]

[0003] At present, with the rapid development of electronic products, the power consumption of electronic devices is becoming larger and larger, and the constant increase in the power consumption of its single chip has caused the current air cooling technology to reach its heat dissipation limit, so it is necessary to develop the next generation of liquid cooling technology to solve the heat dissipation problem of high power consumption chips. For example, the core component CPU in electronic devices is mainly responsible for the operation calculation of electronic devices, and has a large amount of work and is prone to generate a large amount of heat, which results in the operation speed of electronic devices slowing down, and in the worst case, the CPU may even burn out, so a heat sink is required to cool the CPU of electronic devices and dissipate heat. Most of the CPU heat sinks currently on the market are air-cooled, and with the increase in CPU power consumption, the current air cooling technology has difficulty solving the heat dissipation problem of CPUs, so in order to meet the heat dissipation needs of high power consumption CPUs, liquid cooling technologies such as cold plate type liquid cooling technology need to be further developed.

[0004] However, if the sealing performance of the water pipe joint of the water-cooled CPU cold plate is not sufficient, the cooling liquid is easily leaked from the joint, and there is a risk of leakage from the welding seam and seam of the CPU cold plate itself. If the cooling liquid leaks, the electronic equipment will be catastrophically damaged, which will greatly increase the economic loss of the user and is disadvantageous to mass popularization and use. Therefore, it is necessary to provide a new liquid cooling device that solves the above problems. Summary of the Invention [Problem to be solved by the invention]

[0005] An objective of some embodiments of the present application is to provide a liquid cooling device and equipment that has excellent sealing performance and eliminates reliability issues due to water leakage from the first seal cavity, thereby improving the safety of the liquid cooling device. [Means for solving the problem]

[0006] An embodiment of the present application provides a liquid cooling device, and a first seal body including a cooling substrate, a first seal cover plate, and a first seal pipe, the cooling substrate is used to contact a heat dissipation target device and cool the heat dissipation target device, the first seal cover plate is fixed on the cooling substrate and forms a first seal cavity together with the cooling substrate, the first seal pipe is fixed on the first seal cover plate and communicates with the first seal cavity, and the first seal pipe is connected to the first seal cavity. and a second seal body including a second seal cover plate having an accommodating space and a second seal tube, the second seal cover plate being fixed on the cooling substrate and covering the first seal cover plate, the second seal tube being fixed on the second seal cover plate, the second seal cover plate forming a second seal cavity together with the second seal tube, and the liquid cooling passage being located within the second seal cavity.

[0007] An embodiment of the present application further provides an apparatus, which includes an electronic device and the above liquid cooling device, wherein the liquid cooling device is in contact with the heat dissipation target device and is used to cool the heat dissipation target device. Effect of the Invention

[0008] The embodiments of the present application, compared to the related art, realize the heat dissipation cooling of the heat dissipation target device and itself by installing the first seal body; by installing the second seal body, the second seal cover plate forms a second seal cavity together with the second seal tube, so that even if some liquid refrigerant leaks from the first seal body, the liquid refrigerant is contained in the second seal cavity without contacting the heat dissipation target device or other electronic devices, preventing the heat dissipation target device or other electronic devices from contacting and being damaged by the liquid refrigerant, and improving the safety of the liquid cooling device; further, the second seal cover plate covers the first seal cover plate, and the liquid cooling passage is located in the second seal cavity, that is, no matter where liquid leakage occurs in the first seal body, the leaked liquid can be contained in the second seal cavity, thereby providing the liquid cooling device with excellent sealing performance and further improving the safety of the liquid cooling device.

[0009] The second seal cover plate includes an upper plate located on the side of the first seal cover plate away from the cooling substrate, a side plate surrounding the storage space together with the upper plate, and an abutment plate extending from an edge of the side plate away from the upper plate in a direction away from the first seal cover plate by bending it, and the liquid cooling device further includes an adhesive part, and the abutment plate is fixedly connected to the cooling substrate via the adhesive part. By providing such a structure, the contact area between the second seal cover plate and the cooling substrate can be increased, and therefore the second seal cover plate can be stably fixed on the cooling substrate.

[0010] In addition, a first screw hole is provided on the abutment plate, a second screw hole is provided on the cooling substrate, the first screw hole faces the second screw hole, the liquid cooling device further includes a screw, and the screw is fixed into the first screw hole and the second screw hole. By providing such a structure, the fixing between the second seal cover plate and the cooling substrate can be made stronger, thereby further improving the stability of the liquid cooling device.

[0011] The liquid cooling device further includes a liquid leakage sensor, the liquid leakage sensor being installed in the second seal cavity and positioned outside the liquid cooling passage, and the liquid leakage sensor being used to send warning information when it detects the presence of liquid in the second seal cavity. In this manner, warning information can be issued in real time when liquid leakage occurs in the first seal body, thereby further improving the safety and reliability of the liquid cooling device.

[0012] In addition, an opening is provided on the second seal pipe, the liquid leakage sensor protrudes out of the second seal cavity through the opening and is connected to an external circuit board, and the liquid cooling device further includes a seal part, which is used to seal the opening. The seal part is provided to seal the opening, that is, the seal part seals the joint between the liquid leakage sensor and the opening, so that the leaked liquid does not flow out from the joint, and further improves the safety of the liquid cooling device.

[0013] The second seal pipe has an opening communicating with the accommodating space and with the outside, and the liquid in the second seal cavity is discharged to the outside through the opening. By providing such a structure, the second seal pipe can be used as a drain pipe to discharge the liquid in the second seal cavity, improving the practicality of the liquid cooling device.

[0014] In addition, the second seal pipe is a first hose, and the first hose and the second seal cover plate are reinforced in a first predetermined manner, and the first predetermined manner includes welding and / or sealing. The installation of such a structure can make the fixing between the second seal cover plate and the second seal pipe more stable.

[0015] In addition, the second seal pipe is a rigid pipe, and the rigid pipe and the second seal cover plate are reinforced by a second preset manner, and the second preset manner includes one or more of welding fixing, seal fixing, screw fixing, or crimping fixing.

[0016] The first seal pipe includes a joint and a second hose, one end of the joint is fixed on the first seal cover plate, the other end of the joint is provided with a regulating part, and the second hose is fixedly connected to the joint via the regulating part, where the regulating part is a hollow cone-shaped protrusion extending from an end of the joint away from the first seal cover plate in a direction away from the first seal cover plate, and the size of the hollow cone-shaped protrusion close to the first seal cover plate is larger than the size of the hollow cone-shaped protrusion away from the first seal cover plate. By providing such a structure, the connection between the hose and the joint is made stronger, the hose is prevented from falling off, and the reliability of the liquid cooling device is improved. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a structural schematic diagram of a liquid-cooled cold plate in the prior art; [Diagram 2] FIG. 2 is another structural schematic diagram of a liquid-cooled cold plate in the prior art; [Diagram 3] 1 is a structural schematic diagram of a liquid cooling device according to a first embodiment of the present application; [Figure 4] FIG. 2 is another structural schematic diagram of the liquid cooling device according to the first embodiment of the present application. [Diagram 5] FIG. 2 is another structural schematic diagram of the liquid cooling device according to the first embodiment of the present application. [Figure 6] FIG. 2 is yet another structural schematic diagram of the liquid cooling device according to the first embodiment of the present application. [Figure 7] FIG. 2 is yet another structural schematic diagram of the liquid cooling device according to the first embodiment of the present application. [Figure 8] FIG. 2 is a structural schematic diagram of a restriction portion according to the first embodiment of the present application. [Figure 9] 1 is a structural schematic diagram of a liquid cooling device and a CPU chip according to a first embodiment of the present application. [Figure 10] 1 is a plan view of a liquid cooling device and a plurality of CPU chips according to a first embodiment of the present application. [Figure 11] FIG. 2 is a structural schematic diagram of a liquid cooling device and a memory according to a first embodiment of the present application. [Figure 12] FIG. 2 is a structural schematic diagram of a memory and a part of a first sealing body according to a first embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] The cold plate type liquid cooling device includes both a cold plate and a duct, the cold plate and the duct are assembled by welding (hard pipe) or locking (hose), and there is liquid (usually pure water) inside the cold plate. At present, there are mainly two design proposals for server liquid cooling cold plates, but both of them have difficulty in effectively preventing liquid leakage, and therefore it is difficult to ensure that electronic devices are not damaged.

[0019] Analyzing the design plan of the first server liquid cooling cold plate, referring to Fig. 1, the cold plate bottom plate and the cold plate top cover are welded, the joint and the cold plate top cover are welded, and the hose is fitted onto the joint. In the above plan, it can be easily found that there is a risk of liquid leakage at the welded seam between the cold plate bottom plate and the cold plate top cover, the welded seam between the joint and the cold plate top cover, and the connection point between the hose and the joint. After leakage, the liquid will directly flow onto the electronic device inside the housing, causing damage to the electronic device.

[0020] The design plan of the second type of server liquid cooling cold plate is analyzed, referring to Fig. 2, the cold plate bottom plate and the cold plate top cover are sealed with an O-ring, the joint and the cold plate top cover are welded, and the hose is fitted onto the joint. In the above plan, there is a risk of liquid leakage at the joint between the cold plate bottom plate and the cold plate top cover, the welded joint between the joint and the cold plate top cover, and the connection between the hose and the joint. After leakage, the liquid will directly flow onto the electronic devices inside the case, causing damage to the electronic devices.

[0021] As can be seen from the above analysis, the causes of damage to electronic devices include: the liquid in the liquid cooling device leaks and then flows directly onto the electronic device; and there are multiple positions in the liquid cooling device where there is a risk of liquid leakage.

[0022] Therefore, an embodiment of the present application provides a liquid cooling device, and by installing a second seal body, even if some liquid refrigerant leaks from within the first seal body, the liquid refrigerant will be contained within the second seal cavity without coming into contact with the heat dissipation target device or other electronic devices; further, the second seal cover plate covers the first seal cover plate, and the liquid cooling passage is located within the second seal cavity, so that no matter where liquid leakage occurs in the first seal body, the leaked liquid can be ensured to be contained within the second seal cavity, thereby providing the liquid cooling device with excellent sealing performance and further improving the safety of the liquid cooling device.

[0023] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following describes each embodiment of the present application in detail in conjunction with the drawings. However, as can be understood by those skilled in the art, each embodiment of the present application proposes many technical details to help readers better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solution claimed in the present application can be realized.

[0024] The first embodiment of the present application relates to a liquid cooling device, the specific structure of which is as shown in FIG. A first seal body 1 includes a cooling substrate 11, a first seal cover plate 12, and a first seal tube 13. The cooling substrate 11 is used to contact a heat dissipation target device and cool the heat dissipation target device. The first seal cover plate 12 is fixed on the cooling substrate 11 and forms a first seal cavity 10 together with the cooling substrate 11. The first seal tube 13 is fixed on the first seal cover plate 12 and communicates with the first seal cavity 10. The first seal tube 13 and the first seal cavity 10 are used to circulate a liquid refrigerant. The second seal body 2 includes a first seal body 1 forming a liquid cooling passage for transporting the liquid, and a second seal body 2 including a second seal cover plate 21 and a second seal tube 22, the second seal cover plate 21 being fixed on a cooling substrate 11 and covering the first seal cover plate 12, the second seal tube 22 being fixed on the second seal cover plate 21, the second seal cover plate 21 forming a second seal cavity 20 together with the second seal tube 22, and the second seal body 2 having a liquid cooling passage located within the second seal cavity 20.

[0025] Specifically, in this embodiment, the materials of the first seal cover plate 12 and the second seal cover plate 21 may be the same or different, for example, the first seal cover plate 12 and the second seal cover plate 21 are both made of plastic materials, or the first seal cover plate 12 is made of plastic material and the second seal cover plate 21 is made of metal material, and this embodiment does not specifically limit the materials of the first seal cover plate 12 and the second seal cover plate 21.

[0026] It should be noted that the heat dissipation target device may refer to an integrated circuit board such as a CPU or GPU in an electronic device, and the electronic device includes, but is not limited to, IT products (e.g., servers, storage devices) and communication devices.

[0027] As can be appreciated, the liquid cooling passages described in this embodiment can be considered to be located within the second seal cavity 20, with the second seal cavity 20 surrounding the liquid cooling passages.

[0028] In the embodiment of the present application, compared with the related art, by installing the first seal body 1, the heat dissipation cooling of the heat dissipation target device and itself is realized; by installing the second seal body 2, the second seal cover plate 21 forms the second seal cavity 20 together with the second seal tube 22, so that even if some liquid refrigerant leaks from the first seal body 1, the liquid refrigerant is accommodated in the second seal cavity 20 without contacting the heat dissipation target device or other electronic devices, preventing the heat dissipation target device or other electronic devices from contacting and being damaged by the liquid refrigerant, and improving the safety of the liquid cooling device 100; furthermore, the second seal cover plate 21 covers the first seal cover plate 12, and the liquid cooling passage is located in the second seal cavity 20, that is, no matter where liquid leakage occurs in the first seal body 1, the leaked liquid can be accommodated in the second seal cavity 20, thereby providing the liquid cooling device 100 with excellent sealing performance and further improving the safety of the liquid cooling device 100.

[0029] 4, the second seal cover plate 21 includes an upper plate 211 located on the side of the first seal cover plate 12 away from the cooling substrate 11, a side plate 212 forming an accommodating space 30 together with the upper plate 211, and a contact plate 213 extending from an edge of the side plate 212 away from the upper plate 211 in a direction away from the first seal cover plate 12, and the liquid cooling device 100 further includes an adhesive part 3, and the contact plate 213 is fixedly connected to the cooling substrate 11 through the adhesive part 3. By installing such a structure, the contact area between the second seal cover plate 21 and the cooling substrate 11 can be increased, so that the second seal cover plate 21 can be stably fixed on the cooling substrate 11. As can be understood, the present embodiment does not specifically limit the contact area between the second seal cover plate 21 and the cooling substrate 11, and may be installed according to actual needs.

[0030] In this embodiment, the material of the adhesive portion 3 is preferably a pressure-sensitive adhesive. A pressure-sensitive adhesive is a type of adhesive that is sensitive to pressure. In general, the peel strength of the pressure-sensitive adhesive (the peel strength that appears after the adhesive tape is pressed and adhered to the substrate) < the cohesive strength of the adhesive (the acting force between pressure-sensitive adhesive molecules) < the adhesive strength of the adhesive (the adhesive force between the adhesive and the substrate), thereby preventing phenomena such as the pressure-sensitive adhesive peeling off during use.

[0031] 5, a first screw hole 2130 is provided on the abutment plate 213, a second screw hole 110 is provided on the cooling substrate 11, the first screw hole 2130 faces the second screw hole 110, and the liquid cooling device 100 further includes a screw (not shown), which is fixed in the first screw hole 2130 and the second screw hole 110. By providing such a structure, the fixation between the second sealing cover plate 21 and the cooling substrate 11 can be made stronger, thereby further improving the stability of the liquid cooling device 100.

[0032] It should be noted that the screw shown in FIG. 3 is one, and in actual application, the number of screws may be multiple (e.g., two, three, four...), and the multiple screws may be evenly spaced around the side plate 212 to further improve the stability of the liquid cooling device 100.

[0033] Referring to FIG. 6, the liquid cooling device 100 further includes a liquid leakage sensor 5, which is installed in the second seal cavity 20 and located outside the liquid cooling passage, and the liquid leakage sensor 5 is used to send warning information when it detects the presence of liquid in the second seal cavity 20.

[0034] Specifically, in this embodiment, the liquid leakage sensor 5 is string-shaped, and the string-shaped liquid leakage sensor 5 may be installed either inside the second seal cavity 20 or outside the liquid cooling passage. For example, by wrapping the liquid leakage sensor 5 around each connection point of the first seal body 1, when liquid leakage occurs at any position of the first seal body 1, the liquid leakage sensor 5 can detect the liquid in real time and issue warning information in real time, thereby further improving the safety and reliability of the liquid cooling device 100.

[0035] In addition, an opening 220 is provided on the second seal tube 22 shown in FIG. 6, and the liquid leakage sensor 5 protrudes out of the second seal cavity 20 through the opening 220 to be connected to an external circuit board, and the liquid cooling device 100 further includes a seal part (not shown), which is used to seal the opening 220. As can be understood, after the liquid leakage sensor 5 passes through the opening 220, there may be a seam between the liquid leakage sensor 5 and the opening 220, and the leaked liquid will flow out from the seam, and the heat dissipation target device will contact with the liquid and be damaged. The opening 220 is sealed by installing the seal part, that is, the seal part seals the seam between the liquid leakage sensor 5 and the opening 220, so that the leaked liquid will not flow out from the seam, and the safety of the liquid cooling device 100 is further improved.

[0036] It should be noted that in this embodiment, the materials of the sealing portion and the adhesive portion 3 may be the same or different, for example, the sealing portion may be OCA adhesive, etc., and this embodiment does not specifically limit the materials of the sealing portion and the adhesive portion 3.

[0037] It should be further explained that the seal in this embodiment may be a sealant, a seal ring, or other seal structure, that is, this embodiment does not specifically limit the shape and structure of the seal, and may be installed according to actual needs, as long as it ensures that the leaked liquid does not flow out from the joint between the liquid leakage sensor 5 and the opening 220.

[0038] Furthermore, the liquid leakage sensor plug of the liquid leakage sensor 5 can be directly engaged with a socket on the PCB circuit board, eliminating the need to install a separate socket, thereby ensuring normal operation of the liquid leakage sensor 5 while minimizing the space occupied by the liquid cooling device 100.

[0039] 3 to 6, the second seal pipe 22 in this embodiment has an opening communicating with the outside, and the liquid in the second seal cavity 20 is discharged to the outside through the opening. By providing such a structure, the liquid in the second seal cavity 20 can be discharged using the second seal pipe 21 as a drain pipe, improving the practicality of the liquid cooling device 100.

[0040] Preferably, the second seal pipe 22 in this embodiment is a first hose, and the first hose and the second seal cover plate 21 are reinforced by a first preset manner, which includes welding and / or sealing. The installation of such a structure can make the fixing between the second seal cover plate 21 and the second seal pipe 22 more stable. It should be noted that the second seal pipe is installed as the first hose, so that the hose has a certain tensile performance, and therefore the opening of the second seal pipe 22 can be connected to the outside, and the liquid in the second seal cavity 20 can be discharged through the second seal pipe 22.

[0041] Preferably, the second seal pipe 22 in this embodiment is a hard pipe, and the hard pipe and the second seal cover plate 21 are reinforced by a second preset manner, and the second preset manner includes one or more of welding fixing, sealing part fixing, screw fixing, or crimping fixing. The installation of such a structure can make the fixing between the second seal cover plate 21 and the second seal pipe 22 more stable. It should be noted that the material of the second seal pipe 22 and the material of the second seal cover plate 21 can be the same or different, for example, the second seal pipe 22 and the second seal cover plate 21 are both made of plastic material, the second seal cover plate 21 can be made of plastic material, and the second seal pipe 22 can be made of metal material. By installing the second seal pipe 22 as a hard pipe, the bonding strength of the second seal cover plate 21 and the second seal pipe 22 can be reinforced, and the stability of the liquid cooling device 100 can be further improved.

[0042] Referring to Figures 7 and 8 together, the first seal pipe 12 includes a fitting 121 and a hose 122, one end of the fitting 121 is fixed on the first seal cover plate 11, a regulating portion 7 is provided at the other end of the fitting 121, and the hose 122 is fixedly connected to the fitting 121 via the regulating portion 7.

[0043] Specifically, the joint 121 shown in FIG. 7 includes a first joint 1211 and a second joint 1212, one end of the first joint 1211 is fixed onto the first seal cover plate 12 via welding or a seal portion fixing method, a first threaded portion 1211A is provided at the other end of the first joint 1211, a second threaded portion 1212A that engages with the first threaded portion 1211A is provided at one end of the second joint 1212, and a regulating portion 1212B is provided at the other end of the second joint 1212, and the first threaded portion 1211A and the second threaded portion 1212A engage with each other so that the first joint 1211 and the second joint 1212 are fixed to each other. By installing such a structure, the connection between the first fitting 1211 and the second fitting 1212, and between the second fitting 1212 and the hose 122 is made more stable, and the liquid flowing through the liquid cooling passage is prevented from leaking at the connection points between the first fitting 1211 and the second fitting 1212, and between the second fitting 1212 and the hose 122, thereby improving the safety of the liquid cooling device 100.

[0044] 8 is a hollow cone-shaped protrusion extending from an end of the joint 121 away from the first seal cover plate 12 in a direction away from the first seal cover plate 12, and the size of the hollow cone-shaped protrusion close to the first seal cover plate 12 is larger than the size of the hollow cone-shaped protrusion away from the first seal cover plate 12. By providing such a structure, the connection between the hose 122 and the joint 121 becomes stronger, which prevents the hose 122 from falling off and improves the reliability of the liquid cooling device 100.

[0045] In addition, the hollow conical protrusion in this embodiment may be a hollow conical protrusion, which makes it easier to connect the hose 122 and the fitting 121 and reduces the difficulty of manufacturing the liquid cooling device 100. The hollow conical protrusion may be a hollow pyramidal protrusion, which makes it less likely that relative displacement will occur between the hose 122 and the fitting 121 after the hose 122 is fitted onto the fitting 121, thereby further preventing the hose 122 from falling off and improving the reliability of the liquid cooling device 100.

[0046] For ease of understanding, the assembly process of the liquid cooling device 100 of this embodiment will be described in detail below. The first seal cover plate 12 is welded onto the cooling substrate 11, and a first joint 1211 is welded onto the first seal cover plate 12 (the first joint 1211 has a first threaded portion 1211A at the end away from the first seal cover plate 12).

[0047] The second seal cover plate 21 is fixed onto the cooling substrate 11 (after the adhesive portion 3 is placed on the contact plate 213, it is fixed by driving in screws).

[0048] The second joint 1212 is connected and fixed onto the first joint 1211 (the first threaded portion 1211A and the second threaded portion 1212A engage with each other).

[0049] The hose 122 is connected onto the second fitting 1212 .

[0050] The second seal pipe 22 is connected onto the second seal cover plate 21, and the assembly of the liquid cooling device 100 is completed.

[0051] In this embodiment, the purpose of installing the first joint 1211 and the second joint 1212 is as follows. The accommodation space of the second seal cover plate 21 is relatively small, and if the first joint 1211 is installed too long, it becomes more difficult to install the second seal cover plate 21 (the second seal cover plate 21 can be easily installed only when the first joint 1211 is located within the accommodation space), and if the first joint 1211 is installed too short, it becomes difficult to fix the hose 122. In order to achieve stability, by separately installing the second fitting 1212, one end of the second fitting 1212 is tightly fixed to the first fitting 1211 by a screw, and the other end of the second fitting 1212 is tightly fixed to the hose 122 by the regulating part 7, which reduces the difficulty of installing the liquid cooling device 100 while at the same time realizing a more stable connection between the first fitting 1211 and the second fitting 1212, and between the second fitting 1212 and the hose 122, thereby improving the safety of the liquid cooling device 100.

[0052] It should be noted that the embodiment does not specifically limit the number of the joints 121, for example, only one joint may be installed, and the number may be set according to actual needs.

[0053] 9, there is shown a structural schematic diagram of the liquid cooling device 100 of this embodiment mounted on a CPU chip. The CPU chip shown in FIG. 9 is mounted on a PCB circuit board, the cooling substrate 11 contacts the side of the CPU chip that is away from the PCB circuit board, a PCB socket is further provided on the PCB circuit board, and the plug of the liquid leakage sensor 5 can be engaged with the PCB socket for use.

[0054] Referring to Fig. 10, for a server system in which two CPU chips are arranged, Fig. 10 is a system layout diagram of a first seal body and a second seal body. As can be seen from Fig. 10, the second seal body sufficiently seals the position where liquid leakage may occur in the first seal body, and the hose of the second seal body extends to the outer surface of the housing, and the end of the second seal body hose is open on the outer surface of the housing, so that it can be used as a drain. A quick coupling is attached to the end of the hose of the first seal cavity, and the quick coupling may be connected to a water storage device (not shown) to realize the flow of circulating water in the liquid cooling passage.

[0055] 11 is a structural schematic diagram of the liquid cooling device 100 of this embodiment mounted on a memory. The memory shown in FIG. 11 is installed on a PCB circuit board, the thermal conductive pad contacts the side of the memory remote from the PCB circuit board, the cooling substrate 11 contacts the side of the thermal conductive pad remote from the memory, a PCB socket is further provided on the PCB circuit board, and the plug of the liquid leakage sensor 5 may be engaged with the PCB socket for use.

[0056] 12, which is a structural schematic diagram of a memory and a part of a first seal body. The heat of the memory chip is transferred to the memory heat conduction plate by the memory heat conduction pad, and the memory heat conduction plate transfers the heat to the cooling substrate 11 by the heat conduction pad.

[0057] A second embodiment of the present application relates to an apparatus, including a heat dissipation target device and the liquid cooling device of the above embodiment, wherein the liquid cooling device is in contact with the heat dissipation target device and is used to cool the heat dissipation target device.

[0058] As can be appreciated, the devices described in this embodiment include, but are not limited to, IT products (eg, servers, storage devices), communication devices, and electrical / power devices that can use liquid cooling devices.

[0059] As can be understood by those skilled in the art, the above embodiments are specific embodiments for implementing the present application, but in practical applications, various changes in form and details may be made without departing from the spirit and scope of the present application.

Claims

1. 1. A liquid cooling device, comprising: a first seal body including a cooling substrate, a first seal cover plate, and a first seal tube, the cooling substrate being in contact with a heat dissipation target device to cool the heat dissipation target device, the first seal cover plate being fixed on the cooling substrate and forming a first seal cavity together with the cooling substrate, the first seal tube being fixed on the first seal cover plate and communicating with the first seal cavity, the first seal tube forming a liquid cooling passage for transporting a liquid refrigerant together with the first seal cavity; a second seal body including a second seal cover plate having an accommodation space and a second seal tube, the second seal cover plate being fixed on the cooling substrate and covering the first seal cover plate, the second seal tube being fixed on the second seal cover plate, the second seal cover plate forming a second seal cavity together with the second seal tube, and the liquid cooling passage being located within the second seal cavity; The second seal cavity surrounds the first seal tube and the first seal cover plate.

2. the second seal cover plate includes an upper plate located on a side of the first seal cover plate away from the cooling substrate, a side plate surrounding and forming the accommodation space together with the upper plate, and a contact plate extending from an edge of the side plate away from the upper plate in a direction away from the first seal cover plate by bending it, The liquid cooling device according to claim 1 , further comprising an adhesive portion, the contact plate being fixedly connected to the cooling substrate via the adhesive portion.

3. a first screw hole is formed on the abutment plate, a second screw hole is formed on the cooling substrate, the first screw hole faces the second screw hole, The liquid cooling device of claim 2 , further comprising a screw, the screw being secured within the first screw hole and the second screw hole.

4. 2. The liquid cooling device of claim 1, further comprising a liquid leakage sensor, the liquid leakage sensor being installed in the second seal cavity and positioned outside the liquid cooling passage, the liquid leakage sensor being used to send warning information when it detects the presence of liquid in the second seal cavity.

5. an opening is provided on the second seal pipe, and the liquid leakage sensor protrudes to the outside of the second seal cavity through the opening and is connected to an external circuit board; The liquid cooling device according to claim 4 , further comprising a seal portion, the seal portion being used to seal the opening.

6. 6. The liquid cooling device according to claim 1, wherein the second seal pipe has an opening communicating with the accommodating space and with the outside, and liquid in the second seal cavity is discharged to the outside through the opening.

7. 6. The liquid cooling device according to claim 1, wherein the second seal pipe is a first hose, and the first hose and the second seal cover plate are reinforced by a first pre-set manner, and the first pre-set manner includes welding fixing and / or sealing portion fixing.

8. 6. The liquid cooling device according to claim 1, wherein the second seal pipe is a rigid pipe, and the rigid pipe and the second seal cover plate are reinforced by a second preset manner, and the second preset manner includes one or more of welding fixing, seal fixing, screw fixing, or crimping fixing.

9. The first seal pipe includes a joint and a second hose, one end of the joint is fixed on the first seal cover plate, and the other end of the joint is provided with a regulating portion, and the second hose is fixedly connected to the joint via the regulating portion, The liquid cooling device of claim 1, wherein the regulating portion is a hollow conical protrusion extending from an end of the joint away from the first seal cover plate in a direction away from the first seal cover plate, and the size of the hollow conical protrusion closer to the first seal cover plate is larger than the size of the hollow conical protrusion away from the first seal cover plate.

10. 10. An apparatus comprising: a heat dissipation target device; and the liquid cooling device according to claim 1, wherein the liquid cooling device is in contact with the heat dissipation target device and is used to cool the heat dissipation target device.

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