Liquid cooling and heat dissipation equipment, cabinets and systems

Abstract

The embodiments of the present application relate to the field of liquid cooling technology, and disclose a liquid cooling heat dissipation device, cabinet and system, which solve the technical problems of the existing cold plate type liquid cooling solution, such as the risk of liquid leakage, the high difficulty of maintenance, the poor system performance and the lack of aesthetic appearance. In the present application, the liquid cooling heat dissipation device, a pipe outlet is provided on the outer wall of a chassis, the outer wall is a side plate outer wall contacting the chassis panel and the IO port panel of the chassis, a circuit board is fixed on the inner bottom surface of the chassis, an evaporator is fixed on the circuit board with a predetermined gap and forms an accommodation space together with the circuit board, a heat generating electronic component is mounted on the circuit board in the accommodation space and is electrically connected to the circuit board and thermally connected to the evaporator, a condenser is fixed on the outer wall of the area where the pipe outlet is located, and a steam pipe and a liquid pipe pass through the pipe outlet to communicate with the evaporator and the condenser.

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application is proposed based on a Chinese patent application bearing application number "2021103624793" and filing date of April 2, 2021, and claims priority to this Chinese patent application, the entire contents of which are incorporated herein by reference.

[0002] TECHNICAL FIELD The embodiments of the present application relate to the field of liquid cooling technology, and in particular to a liquid cooling heat dissipation device, cabinet and system. [Background technology]

[0003] A data center is a global collaboration of specific equipment networks for transmitting, accelerating, presenting, computing, and storing data information over the Internet network infrastructure, and is composed of countless computer hardware. With the continuous increase of computer hardware in data centers, the heat dissipation and energy saving pressures faced by data centers are increasing. Research shows that liquid cooling heat dissipation can reduce the power usage effectiveness (PUE) of data centers to 1.2 or less, and the closer the PUE is to 1, the more energy efficient the data center is. Therefore, from the needs of heat dissipation and energy saving of data centers, liquid cooling technology is an inevitable choice.

[0004] At present, the cold plate type liquid cooling scheme is widely used in IT / communication equipment and data centers. Although the cold plate type liquid cooling scheme has relatively few restrictions on data center construction, the desired cold plate type liquid cooling scheme has the following problems in terms of heat dissipation reliability, piping layout design and maintainability.

[0005] 1. Problems of reliability of heat dissipation: Referring to FIG. 1, the current cold plate type liquid cooling scheme has two parts, a cold plate 11', a cold water pipe 12' and a hot water pipe 13', inside an electronic device, for example, a chassis 100'. The cold plate 11', the cold water pipe 12' and the hot water pipe 13' are assembled by welding or engagement. There is liquid (usually water) inside the cold plate 11', and due to problems in the processing and assembly process of the cold plate 11', the cold water pipe 12' and the hot water pipe 13', there is a risk of liquid leakage from the cold plate 11', the cold water pipe 12' and the hot water pipe 13'. In addition, outside the chassis 100', it is usually connected to the manifold of the cabinet by a quick joint 200' and a hose 300', but the quick joint 200' is a moving part, so if the system of the cold plate type liquid cooling scheme shown in FIG. 1 is adopted, for example, in a data center, there is a risk of liquid leakage even during long-term operation.

[0006] 2. Problems with piping layout: In the current cold plate type liquid cooling solution, the cold plate 11', cold water pipe 12' and hot water pipe 13' exit from inside the chassis 100' in two ways: from the front and from the rear. Referring to Fig. 1, the front exit type exits from the liquid cooling panel 14' on the chassis 100', which is generally used for layout of hard disks, so it is necessary to remove part of the hard disk to lay out the cold water pipe 12' and hot water pipe 13', which not only affects the system performance but also the aesthetics of the equipment. The rear exit type exits from the IO port side, which naturally requires removal of part of the IO, which also affects the performance of the entire system.

[0007] 3. Maintenance issues: The chassis 100' or any node within the chassis 100' that can perform independent data processing all need to connect the quick couplings 200' and hoses 300' to the manifold of the chassis, and when the chassis 100' or a node needs to be maintained, the quick couplings 200' must first be unplugged (separate the male and female heads) and turned on. Also, when maintaining a node, the node module (e.g. hard disk) may not be able to be smoothly inserted or removed due to interference from the upper and lower pipes (cold water pipe 12' and hot water pipe 13'), so removing part of the IO for maintenance will affect the performance of the entire system. There are some maintenance issues, and the same convenience as an air-cooled system cannot be obtained. Summary of the Invention [Means for solving the problem]

[0008] An embodiment of the present application provides a liquid-cooled heat dissipation device, including a chassis, a circuit board, an evaporator, a heat-generating electronic device, a condenser, a vapor conduit, and a liquid conduit; A pipe outlet is provided on an outer wall of the chassis, the outer wall being a side panel outer wall that contacts a chassis panel and an I / O port panel of the chassis, the circuit board is fixed onto an inner bottom surface of the chassis; the evaporator is fixed on the circuit board with a predetermined gap therebetween, and forms an accommodation space together with the circuit board; The heat generating electronic element is mounted on the circuit board in the receiving space, and is electrically connected to the circuit board and thermally connected to the evaporator; The condenser is fixed on the outer wall in a region where the pipe outlet is located; the vapor line and the liquid line pass through the line outlet and communicate with the evaporator and the condenser; Here, when the heat generating electronic element is operated, the liquid in the evaporator absorbs the heat generated by the heat generating electronic element, vaporizes into vapor, enters the condenser along the vapor pipeline under the action of internal vapor pressure, and returns to the evaporator along the liquid pipeline after being cooled to liquid by the condenser.

[0009] An embodiment of the present application further provides a liquid-cooled heat-dissipating cabinet, comprising: two front pillars near a front door of the cabinet; two rear pillars near a rear door of the cabinet; a chassis pallet for placing the liquid-cooled heat-dissipating device; and a liquid-cooling mechanism used in cooperation with a condenser fixed on an outer wall of the liquid-cooled heat-dissipating device; The chassis pallet is fixed to a region surrounded by the two front pillars and the two rear pillars, and is fixed by the two front pillars and the two rear pillars, The liquid cooling mechanism is fixed on the rear pillar located on the same side as the condenser in the upper region of the chassis pallet.

[0010] An embodiment of the present application further provides a liquid cooling heat dissipation system, comprising the above liquid cooling heat dissipation equipment and the above liquid cooling heat dissipation cabinet; The liquid-cooled heat dissipation device is placed on a chassis pallet in the liquid-cooled heat dissipation cabinet, and when the liquid-cooled heat dissipation device is inserted into the liquid-cooled heat dissipation cabinet along the chassis pallet, each condenser fixed on the outer wall of the liquid-cooled heat dissipation device contacts one cold plate fixed on the rear pillar in the liquid-cooled heat dissipation cabinet by one heat conduction pad, the cold plate slides toward the rear pillar along the cold plate chute structure, and an elastic member located between the cold plate and the rear pillar is compressed from a naturally extended state to a compressed state, so that the cold plate contacts the condenser through the heat conduction pad to transfer heat, and the condenser and an evaporator located in the liquid-cooled heat dissipation device help to dissipate heat from heat-generating electronic elements in the liquid-cooled heat dissipation device. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic diagram of the structure of a heat dissipation device laid out inside a chassis in a conventional cold plate type liquid cooling solution; [Diagram 2] 1 is a structural schematic diagram of a liquid-cooling heat dissipation device according to an embodiment of the present application; [Diagram 3] 2 is a schematic diagram of the internal structure of a condenser 12A in a liquid cooling device according to an embodiment of the present application. [Figure 4] FIG. 2 is a plan view of a liquid-cooled heat dissipation cabinet according to another embodiment of the present application. [Diagram 5] FIG. 2 is a detailed structural schematic diagram of liquid cooling mechanisms 204A and 204B in a liquid-cooling heat-dissipating cabinet 200 according to another embodiment of the present application. [Figure 6] FIG. 2 is a schematic diagram of the internal structure of a cold plate 204A-1 in a liquid cooling mechanism 204A in a liquid-cooling heat dissipation cabinet 200 according to another embodiment of the present application. [Figure 7] FIG. 2 is a side view of a liquid-cooled heat dissipating cabinet according to another embodiment of the present application, taken from the perspective of the front door of the cabinet. [Figure 8] FIG. 13 is a schematic diagram of the relationship between a condenser 12A, a heat conduction pad 15A, and a cold plate 204A-1 in a liquid cooling mechanism 204A in a liquid cooling heat dissipation cabinet in a liquid cooling heat dissipation system according to another embodiment of the present application. [Figure 9] FIG. 2 is a structural schematic diagram of a liquid cooling heat dissipation system according to another embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The following clearly and completely describes the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without any creative efforts are within the scope of protection of the present application.

[0013] In addition, when directional indications (e.g., up, down, left, right, front, back, etc.) are included in the embodiments of the present application, the directional indications are used only to describe the relative positional relationships, movement conditions, etc. between each component in a certain posture (as shown in the drawings), and when the certain posture changes, the directional indications also change accordingly.

[0014] In addition, when there are descriptions of "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are used for explanatory purposes only, and cannot be understood as indicating or implying the relative importance thereof, or implying the number of the indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions between the embodiments may be combined with each other, but this should be based on what a person skilled in the art can realize. If the combination of the technical solutions is inconsistent with each other or cannot be realized, such combination of the technical solutions does not exist and is not within the scope of the claims of the present application.

[0015] One embodiment of the present application provides a liquid-cooled heat dissipation equipment, which may be a server, a switch, a communication equipment, etc. In a specific implementation, the liquid-cooled heat dissipation equipment in this embodiment includes, but is not limited to, a chassis, a circuit board, an evaporator, a heat-generating electronic element, a condenser, a steam pipe, a liquid pipe, a hard disk area, a fan, a memory, an interface card area and a power supply area.

[0016] For ease of explanation, this embodiment will be explained by taking a server in a data center as an example and combining FIG. 2 and FIG.

[0017] As shown in FIG. 2, in a specific implementation, duct outlets such as 10A-1 and 10B-1 are provided on the outer wall 10 of the chassis 100 of the liquid-cooled heat dissipation device in this embodiment, a circuit board (not shown in FIG. 2) is fixed on the inner bottom surface of the chassis 100, evaporators 11A and 11B are fixed on the circuit board with a predetermined gap therebetween to form an accommodating space together with the circuit board, a heat-generating electronic element 16A is mounted in the accommodating space formed by the evaporator 11A and the circuit board, and is electrically connected to the circuit board and thermally connected to the evaporator 11A. 6B is mounted in a storage space formed by the evaporator 11B and the circuit board, and is electrically connected to the circuit board and thermally connected to the evaporator 11B, the condenser 12A is fixed on the outer wall 10 of the area where the pipe outlet 10A-1 is located, the condenser 12B is fixed on the outer wall 10 of the area where the pipe outlet 10B-1 is located, the steam pipe 13A and the liquid pipe 14A pass through the pipe outlet 10A-1 and communicate between the evaporator 11A and the condenser 12A, and the steam pipe 13B and the liquid pipe 14B pass through the pipe outlet 10B-1 and communicate between the evaporator 11B and the condenser 12B.

[0018] Based on the above structure, when the heat-generating electronic elements 16A, 16B are operated, the liquid in the corresponding evaporator 11A, 11B absorbs the heat generated by the heat-generating electronic elements 16A, 16B, vaporizes into steam, and enters the corresponding condenser 12A, 12B along the corresponding steam pipe 13A, 13B under the action of internal vapor pressure, and returns to the evaporator 11A, 11B along the corresponding liquid pipe 14A, 14B after being cooled to liquid by the condenser 12A, 12B.

[0019] During the process of condensers 12A, 12B condensing the steam into liquid, the steam constantly releases heat and becomes a liquid with a relatively low temperature. Therefore, the cooperation of the evaporator and the condenser can quickly remove the heat generated by the heat-generating electronic elements, and can achieve rapid heat dissipation from the heat-generating electronic elements.

[0020] In one embodiment of the present application, the outer wall 10 mentioned in this embodiment specifically refers to a side panel outer wall in contact with the chassis panel (the panel corresponding to the left side of the hard disk area in FIG. 2 ) and the IO port panel (the panel corresponding to the right side of the interface card area and power supply area in FIG. 2 ) of the chassis 100.

[0021] In one embodiment of the present application, for the pipe outlets opened on the outer wall 10, the specific positions of 10A-1 and 10B-1 on the outer wall 10 in FIG. 2 can be reasonably planned based on the positions of the heat-generating electronic components 16A and 16B in the chassis 100, and the surrounding spaces of the heat-generating electronic components 16A and 16B, and the layout of other electronic components, such as IO interfaces, power supplies, hard disks, etc., that is, the layout of the steam pipes and liquid pipes in the chassis 100 that connect the condenser and the evaporator as simply as possible.

[0022] In one embodiment of the present application, the number of pipe outlets opened on the outer wall 10 may be determined based on the number of condensers needed to be used in the entire liquid-cooled heat dissipation device, for example, the pipe outlets correspond one-to-one to the condensers, or one pipe outlet corresponds to multiple condensers. FIG. 2 shows that one pipe outlet corresponds to one condenser, for example, pipe outlet 10A-1 corresponds to condenser 12A and pipe outlet 10B-1 corresponds to condenser 12B, but in actual application, this is not limited to the above.

[0023] In one embodiment of the present application, the heat-generating electronic elements 16A and 16B in this embodiment include, but are not limited to, power-consuming elements such as a central processing unit (CPU) and memory in a liquid-cooled heat dissipation device, and this embodiment does not limit this.

[0024] In order to better understand the condenser in the liquid-cooling heat dissipation device, this embodiment gives a condenser with a specific structure, specifically a condenser with a fin structure.

[0025] For ease of explanation, a condenser having a fin structure will be specifically explained below using the condenser 12A as an example.

[0026] As shown in FIG. 3, the condenser 12A includes a substrate (not shown in FIG. 3), a housing 12A-1, a plurality of condenser fins 12A-2, a vapor inlet, and a liquid outlet.

[0027] In one embodiment of the present application, the housing 12A-1 and the substrate define a sealed cavity, a plurality of condensing fins 12A-2 are fixed in a row and spaced apart relation on the substrate within the cavity, a vapor inlet connected to a vapor conduit 13A (in FIG. 2) is provided at one end of a side wall of the housing 12A-1 parallel to the plurality of condenser fins 12A-2, and a liquid outlet connected to a liquid conduit 14A is provided at the other end of the same side wall of the housing 12A-1 parallel to the plurality of condenser fins 12A-2, as shown in FIG. 3.

[0028] In one embodiment of the present application, in order to allow the cooled liquid to flow back into the evaporator in a timely manner, a liquid outlet needs to be opened at the bottom of the side wall of the housing 12A-1 parallel to the multiple condenser fins 12A-2 shown in FIG. 3, so that even if the amount of cooled liquid is relatively small, it can also flow back into the evaporator 13A.

[0029] The above evaporator is determined based on the thickness of the heat-generating electronic element that needs to be fixed in the specifically formed accommodating space when it is fixed on the circuit board with a predetermined gap, i.e., the formed accommodating space can ensure that the heat-generating electronic element is fixed on the circuit board in the accommodating space, and the top surface of the heat-generating electronic element (away from the surface that contacts the circuit board) is as close as possible to the evaporator, so as to ensure that the heat generated when the heat-generating electronic element is operated is absorbed in whole or as much as possible by the evaporator.

[0030] In practical application, in order to improve the heat transfer effect between the heat-generating electronic element and the evaporator, a heat-conducting pad may be installed on the upper surface of the heat-generating electronic element, and two opposite surfaces of the heat-conducting pad may be installed in contact with the heat-generating electronic element and the evaporator respectively, so that the heat-generating electronic element can be in close contact with the evaporator through the heat-conducting pad, and further ensure that the heat generated from the heat-generating electronic element is transferred to the evaporator as much as possible and as quickly as possible.

[0031] At the same time, based on the flexibility characteristics of the thermal conductive pad, by installing the thermal conductive pad between the heat-generating electronic element and the evaporator, the problem of direct contact between the heat-generating electronic element and the evaporator, resulting in extrusion and damage to the device, can be effectively avoided.

[0032] In one embodiment of the present application, the above examples given in FIG. 2 and FIG. 3 are merely examples given for a better understanding of the technical solution of this embodiment, and are not unique limitations of this embodiment.

[0033] That is, in practical applications, the number of condensers installed on the outer wall of the chassis is not limited to two, and the number of condensers may be determined specifically based on the number of heat-generating electronic components that need to dissipate heat in the liquid-cooled heat dissipation device, for example, one heat-generating electronic component corresponds to one condenser.

[0034] In one embodiment of the present application, the number of condensers may be determined based on the refrigeration effect of the condenser. For example, if the refrigeration effect of the selected condenser is high, multiple heat-generating electronic elements may be installed to correspond to one condenser; conversely, one heat-generating electronic element may correspond to one condenser, or one heat-generating electronic element may correspond to multiple condensers, and this embodiment is not limited thereto.

[0035] Therefore, in practical application, the evaporator for absorbing heat generated by the heat-generating electronic element may be installed so that one heat-generating electronic element corresponds to one evaporator, or multiple heat-generating electronic elements in the same area may be installed so that they correspond to one evaporator, and this embodiment does not limit this.

[0036] In practical application, if the number of condensers is an even number, for example, two as shown in FIG. 2, in order to ensure the symmetry and balance of the appearance of the entire chassis, it is necessary to provide pipe outlets such as pipe outlets 10A-1 and 10B-1 as shown in FIG. 2 on the two opposing outer walls of the chassis.

[0037] An even number of condensers must be fixed symmetrically on the outer wall of the area where the pipe outlets are located, and condenser 12A in FIG. 2 must be fixed on the outer wall of the area where pipe outlet 10A-1 is located, and condenser 12B must be fixed on the outer wall of the area where pipe outlet 10B-1 is located.

[0038] In one embodiment of the present application, the liquid-cooled heat dissipation equipment according to this embodiment, i.e., the server of the data center, needs to be placed in a liquid-cooled heat dissipation cabinet dedicated to the server in practical application, and in order to enable the liquid-cooled heat dissipation equipment and the liquid-cooled heat dissipation cabinet to cooperate with each other and further enhance the heat dissipation effect, the liquid-cooled heat dissipation equipment further includes a thermal conduction pad.

[0039] When the liquid-cooled heat dissipation equipment is placed into the liquid-cooled heat dissipation cabinet, the condenser comes into contact with the cold plate of the liquid-cooled heat dissipation cabinet, and the condenser and the cold plate cooperate to realize secondary heat dissipation of the heat-generating electronic components. Therefore, the thermal conduction pad is specifically installed on the side of the condenser that comes into contact with the cold plate of the liquid-cooled heat dissipation cabinet.

[0040] In one embodiment of the present application, since multiple condensers may be fixed on the outer wall of the chassis of one liquid-cooled heat dissipation device, a thermal conduction pad also needs to be installed on the side wall of each condenser, so that when the condenser contacts the cold plate in the liquid-cooled heat dissipation cabinet, the thermal conduction pad can better transfer heat, so that the liquid-cooled heat dissipation device can better cooperate with the liquid-cooled heat dissipation cabinet to dissipate heat, and further improve the heat dissipation effect.

[0041] The heat conductive pad installed on the condenser side wall can be manufactured by adopting materials that can be repeatedly used in practical application.

[0042] Similarly, the thermally conductive pad located between the heat generating electronic element and the evaporator can be manufactured using reusable materials.

[0043] As is clear from the above description, the liquid cooling heat dissipation device of this embodiment has an evaporator installed on the heat-generating electronic element, a condenser fixed to the outer wall of the chassis, and a steam pipeline and a liquid pipeline connecting the evaporator and the condenser. Through the cooperation of the evaporator and the condenser, the conventional direct liquid cooling is changed to evaporation and then liquefaction, thereby greatly improving the heat dissipation effect.

[0044] In addition, the liquid cooling mechanism (evaporator, condenser, steam pipe, liquid pipe) that dissipates heat in the entire liquid cooling heat dissipation device does not need to be connected by quick fittings, thereby avoiding the risk of liquid leakage inside the liquid cooling heat dissipation device that would occur if quick fittings were used.

[0045] The liquid-cooled heat dissipation device according to the present embodiment uses a heat dissipation method of vaporizing and then liquefying, so that the amount of liquid required is very small, and even if it leaks, it will not damage the electronic elements inside the chassis.

[0046] In the liquid cooling heat dissipation device according to this embodiment, the condenser is installed on the outer wall of the chassis, so it does not occupy the internal space of the chassis. Therefore, the layout of the steam pipelines and liquid pipelines does not affect the integrity of the hard disks in the hardware area within the chassis or the number of IO interfaces in the IO interface area, resulting in better system performance.

[0047] Based on the above-mentioned structure, the liquid-cooled heat dissipating device according to this embodiment does not require the installation of a liquid-cooled panel or a female head of a quick coupling on the front surface of the chassis, and the overall appearance of the liquid-cooled heat dissipating device is made more beautiful.

[0048] Another embodiment of the present application relates to a liquid-cooled heat dissipation cabinet, which is mainly used to place the liquid-cooled heat dissipation equipment according to the first embodiment, cooperate with a condenser in the liquid-cooled heat dissipation equipment, and further dissipate heat from heat-generating electronic components in the liquid-cooled heat dissipation equipment.

[0049] As can be understood, in practical applications, in order to make the liquid cooling cabinet and the liquid cooling equipment work better together, the liquid cooling cabinet can be customized based on the liquid cooling equipment to be placed therein, for example, for a liquid cooling cabinet for servers placed in a data center, since these servers are generally standard servers, the width of the liquid cooling cabinet can be a standard width, for example 800mm.

[0050] In order to better understand the liquid-cooled heat-dissipating cabinet in this embodiment, the liquid-cooled heat-dissipating cabinet will be described in detail below in conjunction with FIG. 4 to FIG. 7. As shown in FIG. 4, the liquid-cooled heat dissipating cabinet 200 in this embodiment includes two front pillars 201 near the front door of the cabinet, two rear pillars 202 near the rear door of the cabinet, a chassis pallet 203 for placing the liquid-cooled heat dissipating equipment according to the first embodiment, and liquid cooling mechanisms 204A, 204B used in cooperation with condensers (condensers 12A, 12B in FIG. 2) fixed on the outer walls of the liquid-cooled heat dissipating equipment.

[0051] Since the liquid cooling mechanism is used in cooperation with the condenser in the liquid cooling heat dissipation device, the number of liquid cooling mechanisms in the liquid cooling heat dissipation cabinet 200 must be the same as the number of condensers fixed on the outer wall of the liquid cooling heat dissipation device, and must correspond one-to-one. The reason why two liquid cooling mechanisms 204A, 204B are shown in Fig. 4 is only to illustrate that this liquid cooling heat dissipation cabinet is used in cooperation with a liquid cooling heat dissipation device having two condensers 12A, 12B installed on the outer wall corresponding to Fig. 2, and is an example given to better understand the technical solution of this embodiment, and is not a unique limitation of this embodiment.

[0052] As can be seen from FIG. 4, when specifically implemented, the chassis pallet 203 is fixed to the area surrounded by two front pillars 201 and two rear pillars 202, and is fixed by the two front pillars 201 and the two rear pillars 202.

[0053] Regarding the fixing method of the chassis pallet 203, when specifically implemented, it may be fixed by using fixing members such as bolts, fasteners, etc., or by opening grooves on the two front pillars 201 and the two rear pillars 202, and then inserting the chassis pallet 203 into the grooves and fixing it. Those skilled in the art can install it as needed, and this embodiment is not limited thereto.

[0054] As can be seen from FIG. 4, in a concrete implementation, the liquid cooling mechanisms 204A, 204B are fixed on the rear pillar 202 located in the upper area of ​​the chassis pallet 203 on the same side as the condenser.

[0055] The specific structure of the liquid cooling mechanisms 204A and 204B will be described in detail below with reference to FIG. As shown in FIG. 5, the liquid cooling mechanism 204A includes a cold plate 204A-1, an elastic member 204A-2, a water inlet pipeline 204A-3, a water outlet pipeline 204A-4, a cold plate chute structure 204A-5, a water inlet manifold 204A-6, and a water outlet manifold 204A-7.

[0056] The liquid cooling mechanism 204B similarly includes the seven structural assemblies mentioned above, namely, the cold plate 204B-1, the elastic member 204B-2, the water inlet pipe 204B-3, the water outlet pipe 204B-4, the cold plate chute structure 204B-5, the water inlet manifold 204B-6, and the water outlet manifold 204B-7 shown in FIG. 5.

[0057] For ease of explanation, the following takes the liquid cooling mechanism 204A as an example to explain the installation positions of the above seven structural assemblies: As shown in FIG. 5, the cold plate chute structure 204A-5 is fixed on the rear pillar 202, one end of the elastic member 204A-2 is fixed on the rear pillar 202 and is located between the areas corresponding to the cold plate chute structure 204A-5, and the cold plate 204A-1 is fixed to the other end of the elastic member 204A-2 and slidably mounted within the cold plate chute structure 204A-5, and communicates with the water inlet manifold 204A-6 via the water inlet pipe 204A-3 and with the water outlet manifold 204A-7 via the water outlet pipe 204A-4.

[0058] When the cold plate 204A-1 is not in contact with the thermal conduction pad (15A in FIG. 2) installed on the condenser (12A in FIG. 2), the elastic member 204A-2 is in a natural stretched state, and when the cold plate 204A-1 is in contact with the thermal conduction pad (15A in FIG. 2) installed on the condenser (12A in FIG. 2), the elastic member 204A-2 is in a compressed state, whereby the cold plate 204A-1 contacts the condenser (12A in FIG. 2) through the thermal conduction pad (15A in FIG. 2) to transfer heat, and helps the condenser (12A in FIG. 2) and the evaporator (11A in FIG. 2) located in the liquid-cooled heat dissipation device to dissipate heat from the heat-generating electronic element (16A in FIG. 2) in the liquid-cooled heat dissipation device.

[0059] The above-mentioned water inlet manifolds 204A-6, 204B-6 and water outlet manifolds 204A-7, 204B-7 are generally referred to as manifolds.

[0060] In this embodiment, the cold plates 204A-1 and 204B-1 have a fin structure. For ease of explanation, the following will take 204A-1 as an example and provide a detailed explanation in conjunction with FIG.

[0061] As shown in FIG. 6, the cold plate 204A-1 includes a substrate (not shown in FIG. 6), a housing 204A-11, a plurality of condenser fins 204A-12, a cold water inlet, and a hot water outlet.

[0062] In a specific implementation, the housing 204A-11 and the substrate define a sealed cavity, a plurality of condensing fins 204A-12 are fixed in a row and spaced apart relation on the substrate within the cavity, a cold water inlet connecting to the inlet manifold 204A-6 (in FIG. 5) is provided at one end of a side wall of the housing 204A-11 parallel to the plurality of condenser fins 204A-12, and a hot water outlet connecting to the outlet manifold 204A-7 is provided at the other end of the same side wall of the housing 204A-11 parallel to the plurality of condenser fins 204A-12, as shown in FIG. 6.

[0063] In practical application, after the cold water that has absorbed the heat transferred by the condenser 12A (in FIG. 2) through the thermal conduction pad 15A (in FIG. 2) becomes hot water, in order to ensure that the hot water flows out of the outlet manifold 204A-7 in a timely manner, a hot water outlet needs to be opened at the bottom of the side wall of the housing 204A-11 parallel to the multiple condenser fins 204A-12 shown in FIG. 6, so that even if the amount of hot water obtained by absorbing heat is relatively small, it can still flow out of the outlet manifold 204A-7.

[0064] The above examples are merely given for a better understanding of the technical solutions of the present embodiment, and are not unique limitations of the present embodiment.

[0065] In addition, the cold plate chute structure in this embodiment, whether 204A-5 or 204B-5 in FIG. 5, is divided into two parts, a first chute and a second chute, when specifically realized.

[0066] The first chute and the second chute are fixed on the rear pillar at a preset distance, and the cold plate is slidably attached in an accommodation space defined by the first chute and the second chute.

[0067] The preset distance is slightly larger than the thickness of the cold plate, thus ensuring that the cold plate can be installed in the accommodation space defined by the first chute and the second chute, and ensuring that the swing amplitude of the cold plate in the accommodation space is not excessively large, i.e. ensuring the stability of the sliding process of the cold plate, allowing the condenser of the liquid-cooled heat dissipation device in contact with the cold plate to be in stable contact with the cold plate, and further ensuring the overall heat dissipation effect.

[0068] Regarding the elastic member in this embodiment, whether it is 204A-2 or 204B-2 in Figure 5, the elastic member may include a first fixing portion and a second fixing portion in order to ensure the fixing effect between the elastic member and the cold plate and the rear pillar.

[0069] For example, the elastic member is a spring, one end of the spring extends outward to form a first fixed portion, and the other end extends outward to form a second fixed portion.

[0070] The first fixing portion is fixed onto a surface of the cold plate facing the rear pillar, and the second fixing portion is fixed onto a surface of the rear pillar facing the cold plate.

[0071] The first fixing portion may be fixed onto the cold plate by a method such as adhesion or screws.

[0072] The second fixing portion may be fixed onto the rear pillar by adhesive, screws, or the like.

[0073] The above examples are merely given for a better understanding of the technical solutions of the present embodiment, and are not unique limitations of the present embodiment.

[0074] In practical applications, there may be multiple liquid-cooled heat dissipation devices placed in one liquid-cooled heat dissipation cabinet. In order to ensure the heat dissipation effect of the heat-generating electronic components in each liquid-cooled heat dissipation device, multiple chassis pallets may be fixed at predetermined intervals between the two front pillars and two rear pillars of the liquid-cooled heat dissipation cabinet, and one liquid cooling mechanism may be fixed on the rear pillar located on the same side as the condenser in the upper area of ​​each chassis pallet.

[0075] In one embodiment of the present application, in order to ensure that the chassis pallet can be stably fixed on the front pillars and rear pillars, and to prevent the chassis (liquid-cooled heat dissipation equipment) placed on the chassis pallet from falling off from both the left and right sides, the chassis pallet may adopt a U-shaped groove pallet, and be installed so that the side walls of the U-shaped groove pallet are in contact with and fixed to the front pillar and rear pillar located on the same side, respectively.

[0076] The installation of the multi-layer U-shaped groove structure chassis pallet in the liquid-cooled heat dissipation cabinet is shown in Figure 7.

[0077] After ensuring that the liquid-cooled heat dissipation equipment is placed into the liquid-cooled heat dissipation cabinet, the elastic member is compressed to a compressed state after the condenser on the outer wall of the liquid-cooled heat dissipation equipment contacts the cold plate of the liquid cooling mechanism in the liquid-cooled heat dissipation cabinet, during which it can be ensured that the elastic member is always in a compressed state, and further, sufficient pressure can be provided to the heat conduction pad installed between the condenser and the cold plate, so that the condenser can achieve good heat transfer through the cold plate and the heat conduction pad, and the liquid-cooled heat dissipation cabinet further includes a chassis fixing member.

[0078] In one embodiment of the present application, the chassis fixing member is used to fix the liquid-cooled heat dissipation equipment placed on the chassis pallet onto the two front pillars, so that the elastic member is always in a compressed state.

[0079] The above-mentioned chassis fixing member may be composed of two parts, a screw and an ear hook, in practical application, and in order to ensure the fixing effect of the chassis in practical application, it is necessary to fix the ear hooks on the two outer walls of the chassis, and fix the two ear hooks to the front pillars located on both sides by the screw, thereby realizing the fixing of the liquid-cooling heat dissipation device on the two front pillars.

[0080] In one embodiment of the present application, a condenser with a certain height is fixed on the outer wall of the chassis of the liquid-cooled heat dissipation equipment, so that the outer wall of the chassis is slightly separated from the side wall of the chassis pallet, in order to further realize the fixing to the chassis, so as to avoid that when the liquid-cooled heat dissipation cabinet is hit, the liquid-cooled heat dissipation equipment placed on the chassis pallet will shake from side to side, causing the resistance element inside the chassis to shift and affect the overall performance, and the liquid-cooled heat dissipation cabinet further includes a chassis auxiliary structure.

[0081] In one embodiment of the present application, the chassis support structure is installed on the outer wall of the chassis of the liquid-cooled heat dissipation equipment to which the condenser is fixed, and is in close contact with the side wall of the chassis pallet when the liquid-cooled heat dissipation equipment is inserted into the liquid-cooled heat dissipation cabinet along the chassis pallet.

[0082] By installing the chassis auxiliary structure, it is possible to further achieve fixation to the chassis, and since the chassis auxiliary structure can be closely attached to the side wall of the chassis pallet, the chassis can easily slide along the opening direction of the chassis pallet, and the chassis can be easily fixed to or removed from the chassis pallet.

[0083] In one embodiment of the present application, the liquid-cooled heat dissipation cabinet according to this embodiment needs to cooperate with a liquid-cooled heat dissipation device, and absorbs heat from a condenser fixed on the outer wall of the chassis of the liquid-cooled heat dissipation device through a cold plate, and the condenser helps the evaporator to absorb high-temperature steam evaporated by the heat-generating electronic elements and quickly cool it to a relatively low-temperature liquid. The steam inlet of the condenser needs to be installed opposite the cold water inlet connected to the water inlet manifold of the cold plate, and the liquid outlet of the condenser needs to be installed opposite the hot water outlet connected to the water outlet manifold of the cold plate. The condenser is 12A in Figure 2, the thermal conduction pad is 15A, and the cold plate is 204A-1 in Figure 5. For details on the installation method of these three, please refer to Figure 8.

[0084] Based on this installation, after high-temperature steam enters the condenser through the steam inlet, the heat is transferred to the cold plate installed opposite by the heat conduction pad, and the cold water flowing into the cold plate from the cold water inlet absorbs the transferred heat, becomes hot water, and flows out from the hot water outlet on the cold plate, further realizing secondary heat dissipation with the heat.

[0085] As is apparent from the above description, the liquid-cooled heat dissipation cabinet of this embodiment assists the condenser in the liquid-cooled heat dissipation device to perform secondary heat dissipation by installing a cold plate in the liquid-cooled heat dissipation cabinet, thereby better dissipating heat from the heat-generating electronic elements in the liquid-cooled heat dissipation device, and further improving the heat dissipation effect.

[0086] In the liquid-cooled heat dissipation cabinet according to this embodiment, the cold plate in the liquid-cooled heat dissipation cabinet machine and the condenser on the liquid-cooled heat dissipation equipment do not need to be connected with quick joints, thereby avoiding the risk of liquid leakage due to the use of quick joints.

[0087] Another embodiment of the present application provides a liquid cooling heat dissipation system, including a liquid cooling heat dissipation device according to the above embodiment and a liquid cooling heat dissipation cabinet according to the above embodiment.

[0088] As shown in FIG. 9, the liquid-cooled heat dissipation device (chassis 100 in FIG. 9) is placed on a chassis pallet in a liquid-cooled heat dissipation cabinet 200. When the liquid-cooled heat dissipation device is inserted into the liquid-cooled heat dissipation cabinet along the chassis pallet, each condenser fixed on the outer wall of the liquid-cooled heat dissipation device contacts one cold plate fixed on the rear pillar of the liquid-cooled heat dissipation cabinet by one heat conduction pad, and the cold plate slides toward the rear pillar along the cold plate chute structure. The elastic member located between the cold plate and the rear pillar is compressed from a naturally elongated state to a compressed state, so that the cold plate contacts the condenser through the heat conduction pad to transfer heat, and the condenser and the evaporator located in the liquid-cooled heat dissipation device help to dissipate heat from the heat-generating electronic elements in the liquid-cooled heat dissipation device.

[0089] As is apparent from the above description, the liquid cooling heat dissipation system according to this embodiment realizes secondary heat dissipation by installing the cold plate in the liquid cooling heat dissipation cabinet machine so that it contacts the condenser on the outer wall of the chassis of the liquid cooling heat dissipation equipment through a thermal conduction pad, thereby better dissipating heat from the heat-generating electronic elements in the liquid cooling heat dissipation equipment, and further improving the heat dissipation effect.

[0090] In the liquid cooling heat dissipation system of this embodiment, the condenser in the liquid cooling heat dissipation equipment and the cold plate in the liquid cooling heat dissipation cabinet directly realize heat transfer through the heat conduction pad, eliminating the need for quick couplings and hoses. Therefore, there is no need to insert or remove quick couplings or organize hoses during actual maintenance; it is sufficient to simply remove the chassis from the chassis pallet, which ensures the heat dissipation effect while also greatly facilitating maintenance for workers.

[0091] The above is merely a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made using the contents of the specification and drawings of the present application based on the application idea of ​​the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A liquid-cooled heat dissipating cabinet, comprising: two front pillars adjacent to a front door of the cabinet; two rear pillars adjacent to a rear door of the cabinet; a chassis pallet for placing a liquid-cooled heat dissipating device; and a liquid-cooling mechanism for use in cooperation with a condenser fixed on an outer wall of the liquid-cooled heat dissipating device; The liquid cooling heat dissipation device includes a chassis, a circuit board, an evaporator, a heat-generating electronic device, a condenser, a vapor pipe, and a liquid pipe; A pipe outlet is provided on an outer wall of the chassis, and the outer wall of the chassis is a side plate outer wall that contacts a chassis panel and an I / O port panel of the chassis, the circuit board is fixed onto an inner bottom surface of the chassis; the evaporator is fixed on the circuit board with a predetermined gap therebetween, and forms an accommodation space together with the circuit board; The heat generating electronic element is mounted on the circuit board in the receiving space, and is electrically connected to the circuit board and thermally connected to the evaporator; The condenser is fixed on an outer wall of a region where the pipe outlet is located, the vapor line and the liquid line pass through the line outlet and communicate with the evaporator and the condenser; wherein, when the heat generating electronic element is operated, the liquid in the evaporator absorbs the heat generated by the heat generating electronic element, vaporizes into vapor, and enters the condenser along the vapor pipe under the action of internal vapor pressure, and returns to the evaporator along the liquid pipe after being cooled to liquid by the condenser; The chassis pallet is fixed to a region surrounded by the two front pillars and the two rear pillars, and is fixed by the two front pillars and the two rear pillars, The liquid cooling mechanism is a liquid-cooled heat dissipation cabinet that is fixed on the rear pillar located on the same side as the condenser in the upper area of ​​the chassis pallet.

2. The condenser includes a substrate, a housing, a plurality of condenser fins, a vapor inlet, and a liquid outlet; the housing and the substrate define a sealed cavity; the plurality of condenser fins are secured in a side-by-side, spaced-apart relationship on the substrate within the cavity; The steam inlet is connected to the steam line and is opened at one end on a side wall of the housing parallel to the plurality of condenser fins; 2. The liquid-cooled heat dissipating cabinet according to claim 1, wherein the liquid outlet is connected to the liquid pipeline and is opened on the other end of the side wall where the steam inlet is located.

3. The number of the condensers is an even number, 2. The liquid-cooled heat dissipation cabinet according to claim 1, wherein the duct outlets are provided on two opposing outer walls of the chassis, respectively, and the condenser is symmetrically fixed on the outer walls of the area where the duct outlets are located.

4. The liquid cooling heat dissipation device further includes a thermal conduction pad, The liquid-cooling heat dissipating cabinet according to claim 1 , wherein the heat-conducting pad is installed on a side of the condenser that contacts a cold plate in the liquid-cooling heat dissipating cabinet.

5. the liquid cooling mechanism includes a cold plate, an elastic member, a water inlet conduit, a water outlet conduit, a cold plate chute structure, a water inlet manifold, and a water outlet manifold; The cold plate chute structure is fixed on the rear pillar, One end of the elastic member is fixed on the rear pillar and is located between the cold plate chute structure and the area corresponding to the cold plate chute structure; the cold plate is fixed to the other end of the elastic member, slidably mounted within the cold plate chute structure, and communicates with the water inlet manifold through the water inlet conduit and with the water outlet manifold through the water outlet conduit; 2. The liquid-cooled heat dissipation cabinet of claim 1, wherein when the cold plate is not in contact with the thermal conduction pad installed on the condenser, the elastic member is in a natural stretched state, and when the cold plate is in contact with the thermal conduction pad installed on the condenser, the elastic member is in a compressed state, so that the cold plate contacts the condenser through the thermal conduction pad to transfer heat, and the condenser and an evaporator located in the liquid-cooled heat dissipation device help dissipate heat from heat-generating electronic elements in the liquid-cooled heat dissipation device.

6. The cold plate chute structure includes a first chute and a second chute, and the elastic member includes a first fixing portion and a second fixing portion; The first chute and the second chute are fixed on the rear pillar at a preset distance, the preset distance being slightly greater than a thickness of the cold plate; the cold plate is slidably attached to an accommodation space defined by the first chute and the second chute; The liquid-cooled heat dissipation cabinet according to claim 5 , wherein the first fixing portion is fixed onto a surface of the cold plate facing the rear pillar, and the second fixing portion is fixed onto a surface of the rear pillar facing the cold plate.

7. 7. The liquid-cooled heat dissipation cabinet according to claim 5 or 6, wherein the steam inlet of the condenser is installed opposite a cold water inlet connected to a water inlet manifold of the cold plate, and the liquid outlet of the condenser is installed opposite a hot water outlet connected to a water outlet manifold of the cold plate.

8. The liquid-cooled heat dissipation cabinet further includes a chassis fixing member; 7. The liquid-cooled heat dissipation cabinet according to claim 5 or 6, wherein the chassis fixing member is used to fix the liquid-cooled heat dissipation equipment placed on the chassis pallet onto the two front pillars so that the elastic member is always in a compressed state.

9. A liquid cooling and heat dissipation system, comprising: a liquid cooling and heat dissipation cabinet according to any one of claims 1 to 8; The liquid-cooled heat dissipation system includes: a liquid-cooled heat dissipation device placed on a chassis pallet in the liquid-cooled heat dissipation cabinet; when the liquid-cooled heat dissipation device is inserted into the liquid-cooled heat dissipation cabinet along the chassis pallet, each condenser fixed on an outer wall of the liquid-cooled heat dissipation device contacts a cold plate fixed on a rear pillar in the liquid-cooled heat dissipation cabinet by a thermal conduction pad; the cold plate slides toward the rear pillar along a cold plate chute structure; and an elastic member located between the cold plate and the rear pillar is compressed from a natural extension state to a compression state, so that the cold plate contacts the condenser through the thermal conduction pad to transfer heat; and the condenser and an evaporator located in the liquid-cooled heat dissipation device assist the heat dissipation of heat-generating electronic elements in the liquid-cooled heat dissipation device.

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