Apparatus, system and method for delivering an end effector - Patents.com

Abstract

To provide an end effector that grips a semiconductor wafer and a method for handling and transferring the semiconductor wafer by using the end effector.SOLUTION: An end effector that can accommodate semiconductor wafers of various sizes, and includes: a fork part 202 that is a wafer support; a bearing arm 204 that can interface with at least one robot element, and that can at least partially support the wafer support in one end part thereof; a plurality of support pads 212a to 212d on the wafer support for physically interfacing with one of the semiconductor wafers; and a law friction moving clamp 210 driven bi-directionally along a plane at least partially provided by the bearing arm. The moving clamp is electromechanically driven by an actuator 420 or the like to retractably apply force to a proximal edge of the semiconductor wafer.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This disclosure relates to transporting items such as semiconductor wafers, and more particularly to the transport of such wafers. An end effector for gripping the face, and a method for using the end effector to The present invention relates to a method for handling and transporting wafers. [Background technology]

[0002] The use of robots is particularly important for tasks where human handling is inefficient and / or undesirable. It is a well-established manufacturing method for applications where One of the most prominent examples is semiconductor technology, where robots move wafers through various processing steps. Such processing steps include, for example, chemical reactions. Mechanical planarization (CMP), etching, deposition, passivation, and sealing and / or "Clean" to limit contamination and ensure compatibility with a variety of special processing conditions This can include various processes that must maintain the environment.

[0003] The current method in semiconductor technology for handling these wafers robotically involves the use of stacking points. The semiconductor wafer is then subjected to various processing steps corresponding to the processing steps described above as an example. This often involves the use of end effectors operably attached to a robot, which are then transferred to a processing port. The robot may perform a specific port operation before and / or after processing in the associated processing chamber. or to position the end effector to remove the wafer from the collection site. In this way, the wafer can be further processed by a robot connected to the end effector. Once the wafer processing step is complete, the wafer can be shuttled to the next port for further processing. The robot can then return the processed semiconductor wafer to the integration port, and the end The effector can be used again to remove the next wafer for processing in the system. Some semiconductor wafers are handled this way using end effectors during each processing operation. It is generally dealt with by law.

[0004] A typical end effector has a vacuum hole on the backside. Uses surface suction to hold the wafer at the bottom, rather than applying other mechanical forces directly to the wafer. is not common, partly because applying mechanical force can damage the wafer. The main reasons for this are that it is believed to be highly likely to cause contamination.

[0005] Therefore, it is preferable to use a variety of sizes of wafers without damaging or contaminating them. Easily handle and transport very thin wafers through multiple processing steps There is a need for an end effector that can Summary of the Invention

[0006] Some embodiments provide an instrument, system, and method for delivering an end effector. The end effector is a method of A wafer support and at least one robot capable of handling semiconductor wafers. element, which can be coupled to the wafer support at least partially at one end. a support arm for physically supporting one of said semiconductor wafers; a plurality of support pads on the wafer support for at least partially supporting the support; a low-friction moving clamp that moves bidirectionally along a plane provided by the arm; The low-friction moving clamp provides a physical connection between the semiconductor wafer and the plurality of support pads. a force is applied to the proximal end of the semiconductor wafer to effect the connection; .

[0007] The wafer support may be or include a fork. The wafer support may also include wafer presence detection. Various sizes of wafers held by the holder include, by way of non-limiting example, 200 mm wafers. This may include 300mm and 300mm wafers.

[0008] The bidirectional drive unit may include at least a moving clamp motor. A vacuum cylinder can be engaged with the moving clamp motor. The pump can consist of a sealless glass tube with a graphite piston. .

[0009] The end effector also includes a bidirectional drive for actuating the low-friction moving clamp. and then at least one stop for stopping the movement of the low-friction moving clamp. The at least one stop may be vacuum operated. The at least one stop may be, for example, a pop-out "button" stop. can.

[0010] The low-friction travel clamp includes an angled contact surface for applying force to the wafer. The wafer can be rotated substantially along a central axis of rotation for optimal bonding. The contact surface having the low friction moving clamp is further provided with a contact surface having the low friction moving clamp. two inclined rollers capable of applying the force substantially to the wafer edge; can include:

[0011] The plurality of support pads may include at least four support pads, At least two of the four support pads are located at the base end of the support arm, and At least two of the support pads are located at the distal ends of the support arms. The two support pads at the tip of each of the semiconductor wafers have a central axis. The roller portion and the tilted portion may include a tilted central axis. The two proximal support pads may also include ramps. The support pad and / or the tip support pad may have additional raised ridges. can be included.

[0012] Therefore, the present disclosure provides a method for processing a variety of wafer sizes without damaging or contaminating the wafer. Easily handle and transport very thin semiconductor wafers for multiple processing steps The present invention provides an instrument, system, and method for providing an end effector that can be used. [Brief explanation of the drawings]

[0013] Exemplary arrangements, systems, and methods are described below with reference to the accompanying drawings, which are not intended to be limiting. It is given by way of limited example only. [Figure 1] 1 illustrates a wafer handling system according to a disclosed embodiment. [Figure 2]1 illustrates an end effector according to a disclosed embodiment. [Figure 3] 1 illustrates an end effector according to a disclosed embodiment. [Figure 4] 1 illustrates an end effector according to a disclosed embodiment. [Figure 5] 1 illustrates a wafer support pad according to disclosed embodiments. [Figure 6] 1 illustrates a wafer support pad according to disclosed embodiments. [Figure 7] 1 illustrates an end effector according to a disclosed embodiment. [Figure 8] 1 illustrates a moving clamp according to a disclosed embodiment. [Figure 9] 1 illustrates a wafer support pad according to disclosed embodiments. [Figure 10] 1 illustrates an end effector according to a disclosed embodiment. [Figure 11] 1 illustrates an end effector according to a disclosed embodiment. [Figure 12] 1 illustrates a wafer support pad according to disclosed embodiments. [Figure 13] 1 illustrates a travel clamp motor according to a disclosed embodiment. [Figure 14] 1 illustrates a travel clamp motor according to a disclosed embodiment. [Figure 15] 1 illustrates a travel clamp motor according to a disclosed embodiment. [Figure 16] 1 illustrates a processing system according to disclosed embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0014] The illustrations and descriptions provided herein provide a clear understanding of the devices, systems, and methods described herein. While showing features that are relevant to the invention, they are not found in similar devices, systems, and methods in general. Other possible features have been omitted for the sake of clarity. Those skilled in the art will therefore be able to The elements and / or operations are preferred for implementing the devices, systems, and methods described herein. However, it is possible to recognize that such requirements are necessary and / or necessary. The elements and operations are known in the art and do not facilitate understanding of the present invention. Therefore, for the sake of brevity, such elements and operations are not described herein. However, this disclosure does not limit the features described to those skilled in the art. This Agreement shall be deemed to include all elements, modifications and alterations of the Software.

[0015] The embodiments are fully detailed by this disclosure and encompass all of the scope of the disclosed embodiments. The present disclosure is presented to convey information to those skilled in the art. Numerous specific details are set forth to provide a thorough understanding of the disclosed embodiments. However, it will be apparent to those skilled in the art that the specific details disclosed may not be adopted and may be easily understood. It will be apparent that the embodiments may be embodied in other forms. The embodiments should not be construed as limiting the scope of the present disclosure. In some embodiments, well-known processes, well-known device configurations, and well-known techniques are used. It does not go into detail about.

[0016] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. For example, even in the singular, unless otherwise clear from the context, The words "comprise," "comprises," "includes," and "has" are used interchangeably. , is inclusive and therefore describes features, values, steps, operations, elements, and / or components. Although the present invention is described above, one or more other features, values, steps, operations, elements, and / or their equivalents may be incorporated into the present invention. The steps, processes, and operations described herein do not preclude the presence or addition of groups. Unless otherwise stated as a preferred or required order of execution, the steps described or illustrated They should not be construed as requiring each to be performed in a particular order. Additional or alternative steps may be employed instead of or in addition to features disclosed. .

[0017] Unless expressly stated otherwise, elements or layers are "attached" or "connected" to other elements or layers. When "attached" or "coupled" to something, it is not directly "attached," "connected," or "coupled" to it. On the other hand, if an element or layer is "interposed" between other elements or layers, When "directly attached," "directly connected," or "directly coupled" to an element or layer, There may be no elements or layers between them. Words should be interpreted similarly (e.g., "between" vs. "directly between," "adjacent" vs. "directly"). (e.g., "adjacently adjacent"). Furthermore, as used herein, the term "and / or" includes: Contains some or all of one or more of the associated listed items.

[0018] Furthermore, the terms "first," "second," "third," "six ... Whenever terms such as "first", "second", "third", etc. are used, these elements, components, regions, layers, and / or sections are used. The term "component" should not be construed as limiting the scope of the present invention. The words "region," "layer," or "section" are used only to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Therefore, the terms "first," "second," and other numerical terms used herein When used herein, no order or sequence is implied unless clearly indicated from the context. Therefore, the first element, component, region, layer, or portion described below is a teaching according to the embodiment. Without departing from the spirit and scope of the invention, the term "second element," "component," "region," "layer," or "section" may be used interchangeably with the term "second element," "component," "region," "layer," or "section."

[0019] Figure 1 shows a semiconductor wafer, such as a silicon wafer, of various radii, compositions, and physical properties. an automated wafer handling system 100 suitable for precision handling of wafers or substrates 102; The handling system 100 is shown for rapid, sequential wafer processing. The wafer 102 may be supplied by , end-gripping ends suitable for handling or transporting for processing at such various locations. A robot such as a robot arm 104 equipped with an effector 106 can be used in various situations. It may be operated or transported between locations.

[0020] As a non-limiting example, the robotic arm 104 and end effector 106 may be coordinated. The wafer 102 is then passed through a wafer processing system, one or more wafer exposure tools, and one or more wafer -The end effector is used to place and remove the parts from the cassette. 106 may include one or more vacuum holes 108, which are targeted during wafer processing. In addition to being able to hold the wafer 102 vertically, horizontally, and inverted, The various wafer gripping features described herein can be provided or supplemented.

[0021] Thus, in the example of FIG. 1, the exemplary end effector 106 disclosed herein may be operated In summary, the various forms described below are used in a system 100 that can End-grasping end effector 106 shown as representative of the end effector 106 of the The calculation of the extracted wafer with exposure processing and / or various subsequent wafer processing steps For convenience, wafers 102 can be removed from one or more cassettes. , various types of end effectors are provided in certain embodiments, such as various wafer - Using a single end effector 106 for wafers of different diameters to be processed can be done.

[0022] Semiconductor wafers not only vary in diameter, but also generally have tolerances on other dimensions, including diameter. wherein the surface on which the device is to be received is substantially flat, such as to a flatness of 1.5 microns or less. Furthermore, as an example, a 200mm system is manufactured according to a standard specification that requires it to be Silicon wafers, for example, have a standard diameter of 200±0.2 mm and a thickness of 675±25 microns. Typical wafer thicknesses after processing range from about 500 microns to about 700 microns. In addition, silicon wafers are used for alignment and / or Alternatively, there may be a distinct facet or notch used to indicate the crystal orientation. Therefore, the wafer flatness is maintained during the interaction between the wafer and the end effector 106. Maintaining surface integrity is essential to maintaining acceptable levels of wafer processing and waste. It's the key.

[0023] Certain integrated circuit applications, especially those requiring even smaller thicknesses after processing Thin wafers can be particularly useful in applications where thin wafers are required. In some cases, warping or bending beyond the allowable flatness may occur, and depending on the wafer, Even before the product is assembled, it may have warpage or bending that exceeds the required level. , which may cause improper placement or alignment of the alignment surfaces or notches mentioned above. In such cases, wafer processing is adversely affected by the warpage or bowing. These adverse effects may be due to warping or bending caused by the end effector 106. This may increase further.

[0024] The aforementioned problems resulting from warpage and bowing can be exacerbated with thin wafers. The cause of flatness exceeding tolerance is a prominent problem in modern wafer processing. The reason for the flatness exceeding the tolerance is that the wafer sizes are different due to wafer processing. This is even more significant and complicated in terms of the rigidity of the wafer that allows for the end effect. Minimize the effect of the interaction of the wafer with the wafer flatness and correct the wafer bow. Providing an end effector 106 that can This is a major advantage.

[0025] FIG. 2 illustrates an exemplary end-grasping end effector 106 according to a disclosed embodiment. As shown in FIG. 2, the end effector 106 carries a silicon wafer 102. 1. The robotic arm shown in FIG. 1 may be connected to one or more robots. The fork portion 202 includes a support arm 204 that can interface with the By way of non-limiting example, it may be constructed of 17.4 pH stainless steel heat treated to H900 conditions. Throughout this description, the fork portion 202 is defined as having a support arm 204 at least partially It should be noted that these are merely examples of wafer supports that can be used to support the wafer. That is, other types of wafer supports such as spatula type or ring type are also possible. may be used in certain embodiments.

[0026] The support arm 204 may include, for example, a support member that physically connects the fork portion 202 to the wafer 102. One or more electromechanical elements may be created in or on the support arm 204 to The support arm 204 may further include an electronic circuit for operating the detector. ,processing capabilities, computer memory, and networking capabilities such as wireless connectivity (RFID unique identification, process counters, electrical interaction with the robotic arm 104, Batteries, such as high density rechargeable batteries, etc., may be included.

[0027] A support arm for providing physical interaction between the fork 202 and the wafer 102. The electromechanical element associated with the arm 204 can be a moving clamp 210. The moving clamp has a moving clamp 210 at the part that abuts against the wafer 102. Include one or more pads to minimize interaction forces with the wafer 102. The moving clamp 210 may be directly or indirectly driven by one or more negative pressure actuators. It is electromechanically moved by a motor, pneumatic actuator, or motor actuator. or by spring action to physically couple with the fork portion 202. The support arm 20 is used to grip, move, or align the silicon wafer 102. 4 towards the fork portion 202.

[0028] Also shown in FIG. 2 is a diagram of a silicon wafer 102 physically connected to a fork 202. and four pads 212a-d for attaching to the moving clamp 210. In the figure, the support pads 212a to 212d are pads 212a The slope of the gradient of d is set so that it descends toward the center of the silicon wafer 102. Alternatively, when the wafer 102 is physically connected to the pads 212a-d, , can be a bump that holds and stops the wafer 102. 212a-d make it easy to slide along the surface or provide a small amount of friction, or , strong frictional forces can be exerted, and the surface condition can be changed between different In the illustrated embodiment, the support pad 210 is located adjacent to the moving clamp 210. 12a-b, at least the tips of the support pads 212c-d function as clamp pads. The pads 212c-d at the tip of the fork part 202 are different in that they fulfill the following functions. For a particular pad 212c-d, the pad edge farthest from the moving clamp 210 The raised / protruding portion is located at the farthest perimeter of the wafer 102 at the fork 202. As explained, this is most effective for the moving clamp 210. Unlike the simple sloped support pads 212a-b at the base of the proximal fork portion 202, It may be possible.

[0029] FIG. 3 shows an embodiment of an end-grasping end effector 106. In the figure, an alternative A type of moving clamp 210 is shown, where the clamp element at the base of the fork 202 Mergence slot 302 allows for advancement and retraction of alternatively shaped moving clamp 210. Further, in the example of FIG. 3, the adjacent support pad 212a In order to stop the movement of the wafer 102, a ridge is formed at the tip relative to the center of the wafer. Furthermore, the fork part 202 at the tip end as seen from the moving clamp 210 is The support pads 212c-d have a thickness of 100 μm to minimize the possibility of damaging the wafer. , the fork 202 physically interacts with the wafer 102 and the wafer 102 To facilitate stopping action, the illustrated roller tip 306 may be included.

[0030] The roller tips 306 are angled to better grip the corresponding wafers 102. The angled roller tip 306 is particularly useful for textured or thick wafers. Handling of the clamp can be improved, and therefore, the clamp can be positioned near and / or over the moving clamp 210. The roller tip 306 may be, for example, stainless steel. Made of stainless steel, improving physical centering of especially thin wafers relative to the fork portion 202 It is possible.

[0031] Figure 4 shows an embodiment of the end effector 106. The example in Figure 4 is similar to the example in Figure 3. However, support arm cover 312 is not included on support arm 204 of FIG. In the roller tip support pads 212c-d and the raised proximal end support pads The blades 212a-b are included in the fork portion 202. Also shown in FIG. A hard detection system 404, shown by way of non-limiting example at the far end of the fork 202, Such a wafer detection system 404 may include, by way of example and not limitation, a fork 202. The optical fiber 102 detects the presence and / or characteristics of the wafer 102. The beam may be or include a fiber beam.

[0032] FIG. 4 shows the support arm housing 312, which, in operation, emerges from an emergence slot 302 in the support arm housing 312. Also shown is a travel clamp in the form of an angled travel clamp 210. Pump 210 is electromechanically driven, such as by actuator 420, as shown. and subject to drive length limitations that limit the possible linear travel distance of the angled travel clamp 210. This may happen.

[0033] FIG. 5 further illustrates exemplary roller pads 212c-d at the tips of fork portion 202. 3 shows an exemplary tip support pad having a roller portion 306. In addition to the pads 212c-d, these exemplary support pads 212c-d are also d is downward toward the center of the silicon wafer 102 associated with the fork portion 202. It is clear that the gradient is such that the

[0034] Naturally, angular or curved support pads can cause the wafer to bump into the corners. The wafer receiving device must be positioned so that it does not have a sufficient surface area for gripping. The angle or curvature may be, in a non-limiting example, such that the inner angle is The outer angle can be increased. The design eliminates the bottom wafer function from the bottoming of the fork portion 202, thereby enabling gripping. can be improved.

[0035] The distal end support pads 212c-d having the roller portion 306 are shown in FIG. 2 shows a cross section of a distal support pad 212c having a ramp and roller portion 602, 306. , when engaged at the tip periphery 606 by the moving clamp 210, the silicon wafer The tip periphery 606 of the tip support pad 212c abuts against the roller portion 306 of the tip support pad 212c. The engaging angled travel clamp 210 is shown, by way of non-limiting example, in FIG. It can be the moving clamp 210 shown.

[0036] 4, 5, and 6, the end effector fork portion 202 may, to the extent possible, It is best to avoid contact with the bottom of the wafer 102 as it is physically associated with it. This feature is particularly noted in the support pad at the tip with roller 306. 212c-d, further bending or tilting of the fork portion 202 may be additionally This is provided by the sloped characteristics of the support pads 212a-d, including: The protrusion 630 of the fork portion 202 is bent so as to be slightly inclined toward the center of the protrusion 630. That is, the fork portion 202 may have one or more bends or inclines near the support arm. Inclined, or upward or downward slopes are included, and in such embodiments, the fork The protrusion 630 of the portion has a slope, bend, or incline toward the tip support pads 212c-d. may or may not be included.

[0037] FIG. 7 illustrates an exemplary angled moving clamp 210. In the embodiment of FIG. The moving clamp 210 includes a centering mechanism for the wafer 102 with respect to the contact surface of the moving clamp 210. To improve the clamping angle, a first axis of rotation 702 is included about which the clamp angle θ rotates. Further, by way of non-limiting example, the angled moving clamp 210 of FIG. The outer ends of the moving clamp 210 may include angled rollers 706a-b. These rollers 706a-b may be tilted in certain embodiments. The wafer 102 may be supported by the slopes, ridges, and and / or gently apply pressure to the edge of the wafer 102, such as by pressing it against a roller. It can be made possible.

[0038] Figure 8 illustrates an exemplary angled moving clamp 210. In the embodiment of Figure 8, by way of example and not limitation, the axis of rotation 702 of the moving clamp 210 is substantially at the center point of the clamp angle θ. to be established Second axes of rotation 802a-b are provided for receiving one or more rollers 706a-b substantially outboard from the axis of rotation 702 of the angular travel clamp 210. Such rollers 706a-b may or may not be tilted to be received in the pivots 802a-b similar to the exemplary tilted rollers shown in FIG.

[0039] FIG. 9 shows the pads 212a-d that can be used as root or tip support pads. 9 shows an example of a support pad 902 that can be used to support the inclined At the highest point of 906, the support pad 902 is provided with a ridge 904. 04 has two distinguishable flat portions such as a corner or curved portion 910 on its upper surface. Further, and by way of non-limiting example, the ramp 902 of the support pad 902 of FIG. 06 may additionally include one or more ridges or discriminator surfaces 912. Corners or curves The upper ridge, which includes the fork portion 202, in certain embodiments The raised ramp 902 allows for improved positioning of the wafer 102. This allows for improved contact and centering of the wafer 102 relative to the contact 202.

[0040] FIG. 10 illustrates a rectangular moving clamp, such as the exemplary embodiment illustrated in connection with FIG. 210 along the slot 1002 along the support arm 204 toward the fork portion 202 As shown, two or more different types of wafers 102a, 102b are attached to the fork. 202. By way of example and not limitation, in the embodiment of FIG. 10, the moving clamp 210 is Physically coupled to unit 202 to accommodate 200mm or 300mm wafers. 10, the fork portion 202 is shown as being disposable. The most distal end is the distal end support pad 902a-b as shown in FIG. It is used to improve contact with wafers of different geometric diameters. The other types of support pads 212a-d referenced may be added to the embodiment of FIG. 10 and / or Or it can be used in conjunction with other embodiments described herein.

[0041] FIG. 11 shows the use of an angular rather than rectangular moving clamp 210. 11 shows an embodiment similar to that of FIG. 10, in which the cornered clamp 210 is used. At the corners of the most distal ends of some clamps 210, roller tips 706a-b are provided. In this particular figure, the tip support pads 212c-d also include roller tips 306. It can be enjoyed.

[0042] Figure 12 shows an embodiment of a roller tip at the end of the support pad 212c. The distal roller support pad 212c is shown in FIG. 11 by way of example and not limitation. It can be adapted for use in a particular embodiment, such as those described in the figures. As shown in FIG. 2, the roller 1140 is inclined and has a wedge connected to the fork 202. The roller tip 1140 is inclined toward the center of the edge 102. For example, a thin knife-like edge, such as a wafer with an edge thickness of 50 μm to 150 μm, It is possible to prevent the edge friction of the wafer having a surface. The roller tilt adjustment part 1144 and the wafer connected to the fork part 202 are a positioning mechanism 1140 associated with a roller tip 1140 for positioning the roller tip 1140; The number is 146.

[0043] FIG. 13 shows the wafer 102 mounted on the support arm 204 as described. The clamp is moved outward toward the tip of the fork portion 202 to 13 shows an exemplary clamp motor 1210 for operating the clamp 210. Although a square travel clamp 210 is shown, it will be appreciated that in light of the description herein, Thus, an angled travel clamp 210 can be used instead in the embodiment of FIG.

[0044] Shown by way of non-limiting example is a true flex clamp for coupling to the moving clamp 210. The low-friction actuator 1212 is a vacuum cylinder. 212 allows for a small gripping force to prevent or minimize damage to the wafer 102. Generally, the moving clamp in certain embodiments is moved using a low friction mechanism. By way of example and not limitation, the low friction drive may be used with a 121 mm thrust shaft. It can be a long stroke drive like a torque wrench, but what is the stroke length? It can also be made smaller.

[0045] In a more specific and non-limiting example, the moving clamp actuator 1212 , a sealless design glass tube and graphite piston vacuum cylinder (i.e., air pump Such an actuator 1212 can weigh 2 oz (56.7 g). ) It is also possible to achieve very low gripping loads such as: A low-friction slide (such as slide 1226 in FIG. 14) that interfaces with the ramp actuator 1212 Roller slides can also further limit potential damage to the wafer. However, it should be understood that other drive methods 1212, such as electric motors, may be used in this embodiment. It can also be adopted.

[0046] The gripping force and gripping speed of the moving clamp 210 are controlled by the adjustment control unit 1222 as shown in FIG. The adjustment control section 1222 is further connected to the fork section 202. This minimizes damage to the wafer 102 that is being held. High precision controls, such as precise flow control to meter air into vacuum cylinder 1212, are used to A control 1222 can be attached for the stroke of the moving clamp.

[0047] Position detector 1220 also detects the movement of moving clamp 210 in certain embodiments. The position of the moving clamp 210 can be adjusted based on the actual position of the clamp 210. position, but to slide the moving clamp 210 toward the fork portion 202. By determining the position of the low friction roller slide 1226 used, directly or indirectly This can be determined by the position detector 1220. or other track, resulting in virtually zero friction and little At the very least, the wafer 102 attached to the fork portion 202 is pulled by minimizing friction. Potential damage can be minimized.

[0048] FIG. 14 illustrates a two-position clamp motor 1210 used in the particular embodiment described herein. Similar to FIG. 13, the specific embodiment of FIG. 14 includes a low friction One or more low-friction vacuum slides 1226 for driving the moving clamp 210. cylinder 1212 and a gripping speed control 1 to minimize the possibility of wafer damage. Includes 222.

[0049] FIG. 14 also shows a plurality of position detectors 1220 for detecting the position of the moving clamp 210. As a non-limiting example, the first position detector 1220a detects the movement of the moving object. This can indicate that the lamp 210 is fully retracted. 20b, the moving clamp 210 is adapted to move a first large wafer, such as a 300 mm wafer 102a. The third position detector 1220c can detect movement The clamp 210 has reached its maximum travel distance and is The fork is connected to the smallest wafer that can be connected to the fork. It can be shown that

[0050] FIG. 14 also illustrates the design for a smaller wafer size, such as a 200 mm wafer 102b. A backstop 1240 is shown to limit the possibility of backstopping. As can be seen in light of the explanation above, it is used as a running stop rather than a backstop. The backstop 1240 may be, by way of non-limiting example, vacuum actuated and / or spring actuated. Furthermore, a plurality of reverse or travel stops may be provided, each of which may be a travel stop or a rear stop. Various wafers with different stroke distances of the moving clamps associated with the retract stop can be included to support the type.

[0051] FIG. 15 is similar to FIG. 14, but with the retract stop 1240 extended. As shown, A small wafer such as a 0.00 mm wafer 102 is physically connected to the fork 202. When engaged, extending the retraction stop 1240 allows the support arm housing 21 By limiting the ability to retract the clamp to 2, the clamp cycle distance can be reduced. This can save cycle time for smaller wafers. As mentioned above, more than one stopper may be used to save cycle time for different sized wafers. It should be noted that 1240 can be included.

[0052] Therefore, the present disclosure provides a method for placing multiple, e.g., two-sized wafers on an end effector. This ability allows for handling without the need for replacement. First, by operating a moving clamp, which is vacuum powered. Driven by a lever, motor, spring drive, etc. Low friction piston integrated with moving clamp Exemplary uses of low friction wafer clamping, such as a tonnage drive and / or low friction slides, are This allows for precise speed and low load when used in certain embodiments, This minimizes friction and therefore improves wafer grip, yet still reduces the predicted wattage. Minimize damage to the blade.

[0053] The aforementioned instruments, systems, and methods also include controllers for the various robotic functions mentioned. Such control devices include, by way of non-limiting example, the robots and Allows a user to enter instructions that are executed by software code associated with the system 1 or more controllers, such as keyboard, mouse, touchscreen, etc. This may include manual control using a user interface. As is well known to those skilled in the art, the system controller requires no manual user interaction. , "start" and reference functions, i.e. the user The initial program or computer code address to perform the prescribed operations and operating procedures described. It can be fully automated, requiring only the upload of the data. In any of the automatic embodiments, or in any combination thereof, The apparatus may be configured to, for example, position the wafer, support arms, forks, or other known locations. You can keep it glamorous.

[0054] FIG. 16 illustrates a robotic control system that can be operatively employed in the embodiments described herein. A computer that contains the program and is therefore capable of performing the processes and logic described. 14 illustrates an exemplary embodiment of a computer processing system 1400. The computer system 1400 is a system that can be used in the systems and methods described herein. This is just one example of the system.

[0055] The computer system 1400 includes an operating system (OS) and one or more The computer may execute software such as a computer application 1490. The software may also use the application 1490 to perform input / output (I / O) Such hardware may be suitable for operating and / or monitoring such hardware.

[0056] The operation of the exemplary computer system 1400 is controlled by a hard disk drive (HDD) 1 415, optical disks such as CDs and DVDs (not shown), USB "thumb drives" Stored on a computer-readable storage medium, such as a solid-state drive (not shown), etc. It is primarily controlled by computer-readable instructions, such as instructions written in a Such instructions may be implemented by a central processor to cause the computer system 1400 to perform the disclosed operations. It can be implemented in a central processing unit (CPU) 1410. Many known computers Servers, workstations, PLCs, personal computers, mobile devices, etc. In this case, the CPU 1410 is incorporated into an integrated circuit called a processing unit.

[0057] The various logic, logic blocks, modules, and so forth described in connection with the embodiments disclosed herein may be implemented in various ways. The module and engine are a general-purpose CPU and a digital processor, respectively, which operate as the CPU 1410. Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmers FPGAs and other programmable logic devices, discrete gate arrays gate or transistor logic, discrete hardware components, or a combination of these The general-purpose processing may be incorporated into or performed by any of the above. The device may be a microprocessor, but alternatively the processing device may be any It may be any conventional processor, controller, microcontroller, or state machine such as The processing unit may be, for example, a combination of a DSP and a microprocessor, or a combination of multiple microprocessors. processor, one or more microprocessors in combination with a DSP core, or other such structure. The present invention may also be implemented as a combination of computer devices, such as a computer system.

[0058] Of course, the computer system 1400 includes one CPU 1410. Although the present invention is illustrated as being similar to that of the computer system 1, such description is merely illustrative and should not be construed as limiting the scope of the present invention. 400 may include multiple CPUs 1410. In addition, the computer system The system 1400 may be connected to, for example, a local or remote communications network 1470 or other data Through communication means, resources of a remote CPU or parallel CPUs (not shown) can be utilized. .

[0059] During operation, the CPU 1410 reads and writes data from a computer-readable storage medium such as a HDD 1415. It retrieves instructions from the body, decodes them, and executes them. These instructions are then passed to the operating system. Software includes operating systems (OS), executable programs / applications, etc. Such as computer instructions and other computer-readable data. Information is transmitted to the elements of computer system 1400 via the system's primary data transmission path. The main data transmission path is the serial communication path between the devices. In order to achieve this, a structure using a serializer, a deserializer, and a crossbar switch is used. Although other computer architectures (not shown) may be used, the system bus architecture 14 05 can also be used.

[0060] The system bus 1405 includes a data line for transmitting data, a line for transmitting addresses, and a address lines for sending interrupts and operating the system bus Some buses may include control lines. It performs bus arbitration to adjust access from the U1410. The device that arbitrates access to the bus is called a bus master. Bus master support also By adding a bus master adapter with a processor and support chips, the bus master Multi-processor architectures can be created.

[0061] The memory devices connected to the system bus 1405 include random access memory (RAM). ) 425 and read-only memory (ROM) 1430. A ROM 1430 includes a circuit that can store and retrieve information. It has stored data that generally cannot be modified. Data is generally read or changed by the CPU 1410 or other communication hardware device. Access to RAM 1425 and / or ROM 1430 is memory controlled. The memory controller 1420 executes instructions. When a virtual address is created, it can provide an address translation function that converts the virtual address into a physical address. The memory controller 1420 also separates the processing within the system, allowing the system to be run from user processing. It also provides memory protection to isolate system processes. A program run on a virtual machine is usually mapped in its own virtual address space. can only access memory that is mapped to it, and cannot access memory in the virtual address space of other processes. , and cannot be accessed unless memory sharing between processes is set up.

[0062] The steps and / or actions described in connection with the features disclosed herein may be performed by the memory controller 1. 420 to obtain the instructions necessary to achieve the desired performance. as a software module executed by a processor, or as a combination of both. that is, can be implemented as a program or program that is recorded to perform the functions and instructions described herein. The software described may be stored in RAM memory, flash memory, ROM memory, EPROM Memory, EEPROM memory, registers, hard disk, removable disk, CD The program may be stored in a ROM, a ROM, or other form of storage medium known to those skilled in the art. One or more of the exemplary storage media may be coupled to the processing unit 1410, and the processing unit may Information can be read from and stored on the storage medium. The storage medium may be incorporated into the processor. Further, in some aspects, the processor and The storage medium may be contained within an ASIC. The data and / or operations are configured through I / O port 1485, such as a "flash" drive. External machine-readable and / or computer-readable media that can be embedded It can reside as one or a combination of the above commands or sets of commands.

[0063] Additionally, the computer system 400 includes a printer 1440, a keyboard 1445, and peripheral hardware such as a mouse 1450, and other hardware. a peripheral controller 143 responsible for communicating instructions using the peripheral bus from 5. An example of a peripheral bus is the Peripheral Component Interface (PCI). PCI bus.

[0064] One or more hardware input / output (I / O) devices 1485 are connected to the hardware controller 149 This communication and control of the hardware can be accomplished in a variety of ways. and may include one or more computer buses and / or bridges and / or routers. The I / O devices being controlled can include any form of port-based hardware. (and may additionally include software, firmware, etc.) ), and the computer system 1400 transmits data for purposes as disclosed herein. Also includes a network adapter and / or mass storage device from which the device can receive The computer system 1400 can therefore communicate with the I / O device 1485. and / or via a communications network 1470 to the Internet or other networks. It can communicate with network devices / PLCs.

[0065] A display 1460 controlled by a display controller 1455 is Optionally, the data system 1400 may be used to display visual output generated by the data system 1400. The display controller 1455 also controls the display or otherwise Visual output can be, for example, text, graphics, animation, etc. The display 146 may include customized graphics and / or video. 0 is for CRT video displays, LCD displays, and gas plasma displays. It can be implemented as a display, touch panel, etc. Device 1455 contains the electronic components necessary to generate the video signal that is sent for display. Includes:

[0066] Additionally, the computer system 1400 may include or be connected to the Internet. and access, and therefore be able to track and access the processed data described herein. The computer system 1400 is connected to an external communication network 1470 that can A network adapter 1465 may be provided that may be used for communication. Network 1470 includes software and a means for electronically communicating and transmitting information. or via a computer system such as the PSTN or a cellular network 1480. computer system 1400 by means of which it can be indirectly connected to the In addition, the communication network 1470 may be used to access several Distributed processing involves computers sharing the workload or working together to perform a task. Of course, the network connections shown are for illustrative purposes only. and other means of establishing a communications link between computer systems 1400. It is also possible.

[0067] It will be appreciated that the exemplary computer system 1400 may be implemented in a manner consistent with the systems and methods described. It only refers to the computing environment in which the method operates, and is not a computer with different elements and configurations. However, the present invention is not limited to implementing the systems and methods described herein in a data environment. That is, the concepts described herein may be implemented in a variety of computing environments using different components and configurations. It can be executed.

[0068] Furthermore, the teachings in this disclosure are provided to enable any person skilled in the art to make or use the disclosed embodiments. Those skilled in the art will appreciate that the present disclosure provides various It is clear that various modifications can be readily made to the general principles laid out here. and various modifications may be made without departing from the spirit or scope of the present disclosure. Accordingly, this disclosure is intended to be limited to the embodiments and designs illustrated herein. and the broadest scope consistent with the principles and novel features disclosed herein. This is the intention.

Claims

1. An end effector, A wafer support; a support arm capable of being coupled to at least one robotic element and capable of at least partially supporting said wafer support at one end; a plurality of proximal and distal support pads on said wafer support for physically engaging with a semiconductor wafer, at least said distal support pads having a raised ridge at their most distal end for receiving an edge of the wafer; a moving clamp that moves bidirectionally at least partially along a plane defined by said support arms; Equipped with the moving clamp has a contact surface with a bend, has rollers at its outer end and can rotate about an axis of rotation located at the center point of the bend of the moving clamp; The moving clamp applies a force to the angled contact surface toward the proximal edge of the semiconductor wafer, physically engaging the semiconductor wafer with at least the lower portions of the ridges on the distal end of a plurality of support pads.

2. The end effector of claim 1 , wherein the wafer support comprises a fork.

3. The end effector of claim 1 , wherein the moving clamp is capable of accommodating wafers of various sizes including at least 200 mm and 300 mm.

4. The end effector of claim 1 , wherein the bidirectional drive for bidirectionally driving the moving clamp comprises at least one moving clamp motor.

5. The end effector of claim 4, further comprising a low friction vacuum cylinder engaging the travel clamp motor.

6. The end effector of claim 5 , wherein the vacuum cylinder provides a low gripping force to the moving clamp.

7. The end effector of claim 4, further comprising at least one retraction stop for stopping retraction of the traveling clamp after the traveling clamp is actuated by the bi-directional drive.

8. The end effector of claim 7, wherein the at least one backstop is vacuum actuated and / or spring actuated.

9. The end effector of claim 4, further comprising at least one travel stop for stopping travel of the moving clamp driven by the bi-directional drive.

10. The end effector of claim 1 , wherein the moving clamp comprises a rectangular contact surface for applying a force.

11. The end effector of claim 1 , wherein the wafer support further comprises at least one vacuum hole for gripping the semiconductor wafer.

12. The end effector of claim 1 , wherein the wafer support further comprises a fiber optic wafer presence detector.

13. The end effector of claim 1 , wherein the angled contact surface rotates about the axis of rotation.

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