Detection device and detection system

Abstract

To improve the radiation performance.SOLUTION: A detection device 2 comprises: an imaging unit 26; a processing unit 211; a control board 42; a housing 3; a first heat transmission unit 51; and a second heat transmission unit 52. The imaging unit 26 performs imaging. The processing unit (control unit 21) detects the existence of a person on the basis of a photographed image captured by the imaging unit 26. The control board 42 includes a first surface 421 on which the processing unit is mounted and a second surface 422 being a rear surface of the first surface 421. The housing 3 stores the imaging unit 26 and the control board 42. The first heat transmission unit 51 is thermally connected to the processing unit. The second heat transmission unit 52 is thermally connected to the first heat transmission unit 51 and a heat transmission surface 313 of the housing 3. The first normal direction D1 of the first surface 421 of the control board 42 intersects the second normal direction D2 of the heat transmission surface 313 of the housing 3.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure generally relates to a detection device and a detection system, and more particularly to a detection device and a detection system including an imaging unit.

Background Art

[0002] The lighting control system described in Patent Document 1 includes an image sensor device, a lighting fixture, and a control device. The image sensor device has an image sensor, a control unit, and a communication interface unit. The communication interface unit transmits a detection signal of the presence or absence of a person determined by the control unit from the image of the image sensor to the control device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in an image sensor device (detection device) as described in Patent Document 1, it is desired to improve the heat dissipation performance of the image sensor device.

[0005] In view of the above reasons, the present disclosure is made, and an object thereof is to provide a detection device and a detection system capable of improving heat dissipation performance.

Means for Solving the Problems

[0006] A detection device according to one aspect of the present disclosure comprises an imaging unit, a processing unit, a control board, a housing, a first heat transfer unit, and a second heat transfer unit. The imaging unit performs imaging. The processing unit detects the presence or absence of a person based on the image captured by the imaging unit. The control board has a first surface on which the processing unit is mounted, and a second surface which is the back surface of the first surface. The housing accommodates the imaging unit and the control board. The first heat transfer unit is thermally connected to the processing unit. The second heat transfer unit is thermally connected to the first heat transfer unit and the heat transfer surface of the housing. The first normal direction of the first surface of the control board and the second normal direction of the heat transfer surface of the housing intersect.

[0007] A detection system according to one aspect of this disclosure comprises the detection device and an external device. The external device receives the detection result of the presence or absence of a person from the detection device. [Effects of the Invention]

[0008] According to the detection device and detection system described in the above embodiments of this disclosure, heat dissipation performance can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a block diagram showing the configuration of the detection system according to the embodiment. [Figure 2] Figure 2 is a schematic diagram illustrating an example of the application of the above-mentioned detection system. [Figure 3] Figure 3 is a perspective view of the detection device in the detection system described above. [Figure 4] Figure 4 is a schematic diagram of the detection device described above. [Figure 5] Figure 5 is an exploded perspective view of the main components of the detection device described above. [Figure 6] Figure 6 is a schematic diagram showing a cross-section of the main part of the detection device described above. [Modes for carrying out the invention]

[0010] Preferred embodiments of this disclosure will be described in detail below with reference to the drawings. In the embodiments described below, elements common to each other are denoted by the same reference numerals, and redundant descriptions of common elements may be omitted. The embodiments described below are merely one of many embodiments of this disclosure. Embodiments can be modified in various ways depending on the design, etc., as long as the objectives of this disclosure are achieved. The figures described in this disclosure are schematic diagrams, and the ratios of the size and thickness of each component in each figure do not necessarily reflect the actual dimensional ratios. The arrows indicating directions in the drawings are examples only and are not intended to define the direction in which the detection system 1 is used. Furthermore, the arrows indicating directions in the drawings are for illustrative purposes only and do not represent actual objects.

[0011] In this disclosure, "orthogonal (perpendicular)" means not only a state where the angle between two objects is exactly 90 degrees, but also a state where the two objects are orthogonal within a certain margin of error. In other words, the angle between two orthogonal objects falls within a certain range of difference from 90 degrees (for example, 10 degrees or less). That is, "orthogonal" in this disclosure includes cases where the angle between two objects is between 80 degrees and 100 degrees.

[0012] Similarly, the term "parallel" as used in this disclosure includes not only a state where the two objects do not intersect strictly, but also a state where the two objects are parallel within a certain range of difference. For example, "parallel" as used in this disclosure includes a state where the inclination of one object relative to the other is 10 degrees or less. In other words, "parallel" as used in this disclosure includes a state where the angle between one object and the other is between -10 degrees and 10 degrees.

[0013] In the embodiment, where "less than" is used to describe the comparison of two values ​​such as measurement data, it may also be used as "less than or equal to". In other words, whether or not the case where the two values ​​are equal is included in the comparison of two values ​​can be arbitrarily changed depending on the setting of the reference value, etc., so there is no technical difference between "less than" and "less than or equal to". Similarly, where "greater than" is used, it may also be used as "greater than or equal to".

[0014] (Embodiment) (1) Overview First, the overview of the detection system 1 according to the present embodiment will be described with reference to FIGS. 1, 2, and 6.

[0015] As shown in FIG. 1, the detection system 1 according to the present embodiment includes a plurality of detection devices 2 and a management system 11 (external device). The plurality of detection devices 2 detect the presence or absence of a person H1 (see FIG. 2). The management system 11 receives the detection results of the presence or absence of a person from the plurality of detection devices 2. In the following description, each of the plurality of detection devices 2 may be simply referred to as the "detection device 2".

[0016] As shown in FIG. 2, the detection device 2 according to the present embodiment is used in a facility 100 (target space) such as an office building, a store, a school, or a factory, and is a device for detecting the presence or absence of a person H1 in the facility 100. In the present embodiment, as an example, the facility 100 is an office building. The detection device 2 is provided, for example, so as to be embedded in the ceiling 101 (construction material) of the facility 100. In the example of FIG. 2, two detection devices 2 are attached to the ceiling 101, but one detection device 2 may be provided on the ceiling 101, or three or more detection devices 2 may be provided on the ceiling 101.

[0017] As shown in FIG. 6, the detection device 2 of the present embodiment includes an imaging unit 26, a control unit 21 (processing unit 211), a control board 42, a housing 3, a first heat transfer unit 51, and a second heat transfer unit 52.

[0018] The imaging unit 26 performs imaging. More specifically, the imaging unit 26 performs imaging in at least a part of the space where the detection device 2 is provided.

[0019] The processing unit 211 detects the presence or absence of a person H1 in the imaging range of the imaging unit 26 based on the captured image captured by the imaging unit 26.

[0020] The control board 42 has a first surface 421 on which the processing unit 211 (control unit 21) is mounted and a second surface 422 which is the back surface of the first surface 421.

[0021] The housing 3 houses the imaging unit 26 and the control board 42.

[0022] The first heat transfer part 51 is thermally connected to the processing part 211 (control part 21).

[0023] As used in the present disclosure, "thermally connected" means a state in which heat is transferred between two objects by heat conduction when the two objects are in direct contact or when the two objects are in indirect contact via another object.

[0024] The second heat transfer part 52 is thermally connected to the first heat transfer part 51. Further, the second heat transfer part 52 is thermally connected to the heat transfer surface 313 of the housing 3.

[0025] The first normal direction D1 of the first surface 421 of the control board 42 intersects with the second normal direction D2 of the heat transfer surface 313 of the housing 3. That is, the first surface 421 of the control board 42 and the heat transfer surface 313 of the housing 3 are non-parallel. More specifically, the first normal direction D1 and the second normal direction D2 in the present embodiment are orthogonal.

[0026] According to the detection device 2 of the present embodiment, the heat generated in the processing part 211 can be released to the housing 3 through the first heat transfer part 51 and the second heat transfer part 52, so that the heat dissipation performance can be improved.

[0027] Further, according to the detection device 2 of the present embodiment, the heat generated in the processing part 211 can be released to the heat transfer surface 313 which is non-parallel to the first surface 421 on which the processing part 211 is mounted through the first heat transfer part 51 and the second heat transfer part 52. Therefore, even when there are restrictions on the shape of the housing, the size of the housing, the size of the substrate, the arrangement of the substrate, the orientation of the substrate, etc., as in the detection device 2 of the present embodiment which is provided so as to be embedded in the ceiling 101, heat can be efficiently released from the heat generating body to the housing.

[0028] (2) Details The detailed configuration of the detection system 1 according to this embodiment will be described below with reference to Figures 1 to 6.

[0029] (2.1) Detection system The detection system 1 shown in Figure 1 is a system that uses the detection results of the presence or absence of a person H1 by multiple detection devices 2 to control multiple lighting fixtures 12 or provide predetermined services. The detection system 1 of this embodiment comprises multiple detection devices 2, a management system 11, a service provision system 13, multiple lighting fixtures 12, and a remote controller 14.

[0030] (2.2) Management System As shown in Figure 1, the management system 11 of this embodiment is connected to the detection device 2 via a first communication line W1. The management system 11 and the detection device 2 transmit and receive data (information) using, for example, a communication signal consisting of a bipolar (±24V) time-division multiplexed signal. The management system 11 receives the detection result of whether or not a person is present from the detection device 2 via the first communication line W1. In other words, the management system 11 is an example of an external device that receives the detection result of whether or not a person is present from the detection device 2.

[0031] The management system 11 stores the detection results, linking them to the identification information of the detection device 2 that transmitted the detection results. In other words, the management system 11 in this embodiment manages the detection results for each detection device 2.

[0032] (2.3) Lighting fixtures As shown in Figure 2, multiple (seven in the example in Figure 2) lighting fixtures 12 are installed on the ceiling 101 (building material) of the facility 100. The multiple lighting fixtures 12 are equipment for illuminating the facility 100. In the following description, each of the multiple lighting fixtures 12 may be simply referred to as "lighting fixture 12".

[0033] As shown in Figure 1, the lighting fixture 12 is connected to the detection device 2 via a second communication line W2. The lighting fixture 12 and the detection device 2 communicate, for example, in accordance with DALI (Digital Addressable Lighting Interface). The lighting fixture 12 receives the detection result of whether or not a person is present from the detection device 2 via the second communication line W2. In other words, the lighting fixture 12 is an example of an external device that receives the detection result of whether or not a person is present from the detection device 2. Based on the detection result received from the detection device 2, the lighting fixture 12 illuminates the facility 100.

[0034] (2.4) Service delivery system The service provision system 13 is a system for providing predetermined services based on captured images or detection results of the presence or absence of a person received from the detection device 2. The predetermined services include, for example, support for the installation work of the detection device 2 by construction companies, etc., and support for monitoring work using the detection device 2 by management companies, etc.

[0035] In this disclosure, "captured image" means image data and may include still images, videos, and frame-by-frame images.

[0036] The service provision system 13 is connected to the detection device 2 via a third communication line W3. The third communication line W3 is, for example, a LAN cable. The service provision system 13 and the detection device 2 communicate using, for example, a method compliant with Ethernet®. The service provision system 13 receives captured images or detection results of the presence or absence of a person from the detection device 2 via the third communication line W3. In other words, the service provision system 13 is an example of an external device that receives detection results of the presence or absence of a person from the detection device 2.

[0037] (2.5) Remote controller The remote controller 14 communicates wirelessly with the detection device 2 and transmits setting information regarding the settings of the detection device 2 to the detection device 2. Wireless communication can be, for example, Wi-Fi®, Bluetooth®, or infrared communication. The setting information includes, for example, range information regarding the detection range of the detection device 2 and function information regarding the enable / disable status of the detection function by the detection device 2.

[0038] (2.6) Configuration of the detection device As shown in Figure 1, the detection device 2 of this embodiment includes a control unit 21, a first communication unit 22, a second communication unit 23, a third communication unit 24, a fourth communication unit 25, an imaging unit 26, a plurality of infrared sensors 27, a power supply unit 28, and a storage unit 29. In the following description, each of the plurality of infrared sensors 27 may be simply referred to as "infrared sensor 27".

[0039] The control unit 21 primarily consists of a computer system having, for example, one or more processors and one or more memories. In this embodiment, the control unit 21 is configured as a single-chip device having one or more processors and one or more memories. In the detection device 2, the functions of the control unit 21 are realized when one or more processors execute a program recorded in memory. The program may be pre-recorded in memory, provided via a telecommunication line such as the Internet, or provided on a non-temporary recording medium such as a memory card.

[0040] As shown in Figure 5, the control unit 21 of this embodiment is formed, for example, in the shape of a rectangular flat plate and is surface-mounted on the first surface 421 of the control board 42.

[0041] As shown in Figure 1, the control unit 21 controls the first communication unit 22, second communication unit 23, third communication unit 24, fourth communication unit 25, imaging unit 26, multiple infrared sensors 27, and storage unit 29 individually by outputting control signals to each of them. The control unit 21 is mounted on a control board 42 (see Figure 5), which will be described later.

[0042] The control unit 21 has a processing unit 211.

[0043] The processing unit 211 detects the presence or absence of person H1 based on the image captured by the imaging unit 26. The processing unit 211 detects the presence or absence of person H1 by, for example, performing difference detection processing using the image captured by the imaging unit 26, or image recognition processing using the image captured by the imaging unit 26. In this embodiment, the processing unit 211 detects the presence or absence of person H1 by performing image recognition processing using the image captured by the imaging unit 26.

[0044] For example, the difference detection process is a process that detects the presence of person H1 using background difference, or a process that detects the presence of person H1 within a predetermined range by deriving the amount of movement of person H1 within a predetermined range included in the imaging range of the imaging unit 26 using interframe difference.

[0045] For example, the image recognition process uses a trained model generated by machine learning to detect the presence of a person H1 within a predetermined range included in the imaging range of the imaging unit 26. The trained model is generated, for example, by supervised learning using multiple training data. The multiple training data are, for example, multiple captured images in which a person H1 is present within a predetermined range included in the imaging range of the imaging unit 26. The processing unit 211 takes the captured images taken by the imaging unit 26 as input to the trained model and can obtain the detection result of whether or not a person H1 is present as the output of the trained model. As an example of a machine learning algorithm, a neural network is used.

[0046] The detection result of the processing unit 211 regarding the presence or absence of person H1 may include not only presence / absence information indicating whether or not person H1 is present within a predetermined range, but also number information indicating the number of people H1 present within the predetermined range.

[0047] Furthermore, the processing unit 211 can detect a person H1 that is within the detection range of the infrared sensor 27 based on the infrared light received by the infrared sensor 27. In this embodiment, the detection device 2 is equipped with multiple (four in the example of Figure 3) infrared sensors 27. The processing unit 211 can detect the presence or absence of a person H1 for each of the multiple detection ranges that correspond one-to-one with the multiple infrared sensors 27.

[0048] The first communication unit 22 (communication unit) includes a communication interface for communicating with the management system 11. As described above, the first communication unit 22 transmits and receives data (information) using a communication signal consisting of, for example, a bipolar (±24V) time-division multiplexed signal. In this embodiment, the first communication unit 22 outputs (transmits) the detection result of the processing unit 211 regarding the presence or absence of person H1 to the management system 11. The first communication unit 22 is mounted on the communication board 43 (see Figure 4), which will be described later.

[0049] The second communication unit 23 (communication unit) includes a communication interface for communicating with the lighting fixture 12. The second communication unit 23 is connected to the lighting fixture 12 via a second communication line W2. As described above, the second communication unit 23 and the lighting fixture 12 communicate, for example, in accordance with DALI (registered trademark). In this embodiment, the second communication unit 23 outputs (transmits) the detection result of the presence or absence of a person H1 by the processing unit 211 to the lighting fixture 12. The second communication unit 23 is mounted on a communication board 43 (see Figure 4).

[0050] The third communication unit 24 includes a communication interface for communicating with the service provision system 13. The third communication unit 24 is connected to the service provision system 13 via the third communication line W3. As described above, the third communication unit 24 and the service provision system 13 communicate, for example, using Ethernet®. In this embodiment, the third communication unit 24 outputs (transmits) the detection result of the processing unit 211 regarding the presence or absence of person H1 and the captured image to the service provision system 13. The third communication unit 24 is mounted on the control board 42 (see Figure 4).

[0051] The fourth communication unit 25 includes a communication interface for communicating with the remote controller 14. As described above, the fourth communication unit 25 communicates wirelessly with the remote controller 14. The fourth communication unit 25 receives configuration information transmitted from the remote controller 14. As described above, the configuration information is information related to the settings of the detection device 2. The fourth communication unit 25 is mounted on the communication board 43 (see Figure 4).

[0052] The imaging unit 26 images the facility 100 and generates an image. The imaging unit 26 has a two-dimensional image sensor, such as a CCD (Charge Coupled Devices) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor. The imaging unit 26 is mounted on an imaging substrate 41 (see Figure 4), which will be described later.

[0053] The multiple infrared sensors 27 are, for example, PIR (Passive Infrared Ray) sensors. The infrared sensors 27 detect infrared radiation emitted from the human body. Specifically, when a person H1 enters the detection range of any of the multiple infrared sensors 27, the amount of infrared radiation incident on this infrared sensor 27 changes by an amount equivalent to the temperature difference between the human body surface and the background, thereby making it possible to capture the movement of person H1. The multiple infrared sensors 27 are mounted on an imaging substrate 41 (see Figure 4), which will be described later.

[0054] The power supply unit 28 includes, for example, a linear regulator or a switching regulator. The power supply unit 28 converts power supplied from an external source via a power line into desired power and supplies the converted power to each unit (control unit 21, first communication unit 22, second communication unit 23, third communication unit 24, fourth communication unit 25, imaging unit 26, infrared sensor 27, and storage unit 29). The power supply unit 28 is mounted on a power supply board 44 (see Figure 4), which will be described later.

[0055] The storage unit 29 includes, for example, semiconductor memory such as ROM (Read Only Memory), RAM (Random Access Memory), or EEPROM (Electrically Erasable Programmable Read Only Memory). Note that the storage unit 29 is not limited to semiconductor memory; it may also be a hard disk drive or the like.

[0056] The storage unit 29 stores, for example, identification information (e.g., an address) assigned to the detection device 2. The storage unit 29 also stores the above-mentioned setting information. Furthermore, the storage unit 29 may store the detection result of the presence or absence of person H1 by the processing unit 211 and the captured image. In this embodiment, however, the detection result of the presence or absence of person H1 is stored in the management system 11 and the captured image is stored in the service provision system 13, so the detection result of the presence or absence of person H1 and the captured image are not stored in the storage unit 29.

[0057] (2.7) Structure of the detection device Next, the structure of the detection device 2 will be explained with reference to Figures 3 to 6. In the following explanation, as shown in Figure 4, the direction from the imaging substrate 41 toward the top plate 312 (described later) is defined as the upward direction. The opposite of the upward direction is defined as the downward direction. In this embodiment, the downward direction is the direction of gravity (vertical direction). The upward and downward directions are sometimes collectively referred to as the "upper and lower directions." Furthermore, the direction from the control board 42 toward the power supply board 44 is defined as the rightward direction. The opposite of the rightward direction is defined as the leftward direction. The rightward and leftward directions are sometimes collectively referred to as the "left-right directions." The upper and lower directions and the left-right directions are orthogonal. Furthermore, the direction orthogonal to the upper and lower directions and the left-right directions is sometimes referred to as the "front-back directions."

[0058] As shown in Figures 4 and 5, the detection device 2 of this embodiment further comprises a housing 3, an imaging substrate 41, a control board 42, a communication board 43, a power supply board 44, a first heat transfer unit 51, a second heat transfer unit 52, a processing unit side heat transfer unit 61, and housing side heat transfer units 62, 63.

[0059] (2.7.1) Enclosure The housing 3 is formed as a hollow cylindrical shape with its central axis aligned vertically. Furthermore, the housing 3 in this embodiment is made of synthetic resin. Because the housing 3 is a hollow cylindrical shape aligned vertically, the detection device 2 can be easily embedded in building materials such as the ceiling 101.

[0060] The housing 3 houses an imaging board 41, a control board 42, a communication board 43, a power supply board 44, a first heat transfer unit 51, a second heat transfer unit 52, a processing unit side heat transfer unit 61, and housing side heat transfer units 62, 63. The housing 3 also has a first housing section 31, a second housing section 32, and a cover 33.

[0061] The first housing section 31 is formed in a cylindrical shape, having a side circumference 311 and a top plate 312.

[0062] The side circumference 311 is formed in a cylindrical shape. When the detection device 2 is installed on the ceiling 101 (building material), the second end 315 of the first housing section 31 (housing 3) is the upper end of the housing 3. The first end 314 side of the side circumference 311 is open in the vertical direction, and a top plate 312 is provided on the second end 315 side of the side circumference 311 in the vertical direction. The top plate 312 is provided so as to close the opening on the second end 315 side of the side circumference 311. The top plate 312 is formed in a circular plate shape. The lower surface of the top plate 312 functions as a heat transfer surface 313. In other words, the heat transfer surface 313 is provided on the second end 315 side of the first housing section 31 (housing 3) in the vertical direction.

[0063] The internal space of the first housing section 31 houses a control board 42, a communication board 43, a power supply board 44, a first heat transfer unit 51, a second heat transfer unit 52, a processing unit side heat transfer unit 61, and housing side heat transfer units 62 and 63.

[0064] The second housing section 32 is positioned below the first housing section 31 when the detection device 2 is installed on the ceiling 101 (building material). The second housing section 32 fixes the imaging substrate 41. That is, the imaging substrate 41 is provided on the first end 314 side of the first housing section 31 (casing) in the vertical direction.

[0065] The second housing section 32 has a cylindrical section 321 and an annular section 322.

[0066] As shown in Figure 6, the annular portion 322 is formed in the shape of an annular plate having an outer edge 323 and an inner edge 324. A part of the imaging portion 26 (for example, a lens) protrudes downward from the opening formed by the inner edge 324 of the annular portion 322.

[0067] The cylindrical portion 321 is formed in a cylindrical shape. The cylindrical portion 321 protrudes upward from between the outer edge 323 and the inner edge 324 of the annular portion 322. The cylindrical portion 321 is arranged to be continuous with the first end 314 of the side circumference 311 of the first housing portion 31. In a plan view from above, the cylindrical portion 321 and the side circumference 311 of the first housing portion 31 overlap. The cylindrical portion 321 surrounds the imaging substrate 41 in the front-rear, left-right, and right directions (horizontal direction). In this embodiment, the outer edge of the imaging substrate 41 is in contact with the inner circumference of the cylindrical portion 321.

[0068] As shown in Figure 3, the cover 33 is formed in a disc shape. The cover 33 is attached to the second housing 32 so as to cover the annular portion 322 of the second housing 32 from below. The cover 33 has a first opening 331 and a plurality (four in Figure 3) of second openings 332. Each of the first opening 331 and the plurality of second openings 332 penetrates the cover 33 in the thickness direction of the cover 33. The first opening 331 is located in the center of the cover 33. The plurality of second openings 332 are arranged at equal intervals along the circumferential direction of the cover 33 so as to surround the first opening 331. The imaging unit 26 is exposed to the outside of the housing 3 through the first opening 331. In addition, each of the plurality of infrared sensors 27 is exposed to the outside of the housing 3 through the corresponding second opening 332 among the plurality of second openings 332.

[0069] (2.7.2) Circuit board The imaging substrate 41 is a rigid substrate such as a glass epoxy substrate or a silicon substrate. As shown in Figure 4, the third normal direction D3 (see Figure 6) of the main surface of the imaging substrate 41 is aligned in the vertical direction. The shape of the imaging substrate 41 is circular when viewed from above or below. The imaging unit 26 and a plurality of infrared sensors 27 are arranged (mounted) on the main surface (bottom surface) of the imaging substrate 41.

[0070] The control board 42 is a rigid substrate such as a glass epoxy substrate or a silicon substrate. As shown in Figure 6, the control board 42 has a first surface 421 (right surface) on which the processing unit 211 (control unit 21) is mounted, and a second surface 422 (left surface) which is the back surface of the first surface 421. The first normal direction D1 of the main surface (first surface 421 or second surface 422) of the control board 42 is aligned in the left-right direction. The control board 42 is positioned between the communication board 43 and the power supply board 44 in the first normal direction D1 (left-right direction). The shape of the control board 42 is a rectangle that is long in the vertical direction when viewed from the left-right direction.

[0071] Furthermore, the control board 42 is positioned above the imaging board 41. The lower end of the control board 42 is connected to the imaging board 41, for example, via a connector. The first normal direction D1 of the main surface of the control board 42 and the third normal direction D3 of the main surface of the imaging board 41 intersect. More specifically, the first normal direction D1 and the third normal direction D3 in this embodiment are perpendicular. As in this embodiment, by positioning the vertically long control board 42 upright on the main surface (top surface) of the imaging board 41 (vertical orientation), the diameter (radius) of the cylindrical housing 3 can be reduced. In this embodiment, the control board 42 is positioned along the center of the imaging board 41 in the left-right direction.

[0072] The communication board 43 is a rigid substrate such as a glass epoxy substrate or a silicon substrate. The communication section (first communication section 22, second communication section 23, fourth communication section 25) is mounted on the communication board 43.

[0073] The normal direction of the main surface of the communication board 43 is aligned with the left-right direction. In other words, the main surface of the communication board 43 and the main surface of the control board 42 are parallel. In the left-right direction, the right surface of the communication board 43 faces the second surface 422 of the control board 42. That is, the communication board 43 is positioned to the left of the control board 42. The shape of the communication board 43, when viewed from the left-right direction in plan, is a rectangle that is elongated in the vertical direction.

[0074] Furthermore, the communication board 43 is positioned above the imaging board 41. The lower end of the communication board 43 is connected to the imaging board 41, for example, via a connector.

[0075] The power supply board 44 is, for example, a rigid substrate such as a glass epoxy substrate or a silicon substrate. The power supply board 44 supplies power to the imaging substrate 41, the control substrate 42, and the communication substrate 43.

[0076] The normal direction of the main surface of the power supply board 44 is aligned with the left-right direction. In other words, the main surface of the power supply board 44 and the main surface of the control board 42 are parallel. In the left-right direction, the left surface of the power supply board 44 faces the first surface 421 of the control board 42. That is, the power supply board 44 is positioned to the right of the control board 42. The shape of the power supply board 44, when viewed from the left-right direction in plan, is a rectangle that is elongated in the vertical direction.

[0077] Furthermore, the power supply board 44 is positioned above the imaging board 41. The lower end of the power supply board 44 is connected to the imaging board 41, for example, via a connector.

[0078] (2.7.3) Heat transfer section As described above, the first heat transfer unit 51 is thermally connected to the control unit 21 (processing unit 211) mounted on the control board 42. More specifically, in this embodiment, the first heat transfer unit 51 is thermally connected to the control unit 21 via the processing unit-side heat transfer unit 61.

[0079] The first heat transfer section 51 is made of a metal such as aluminum or iron. In this embodiment, the first heat transfer section 51 is made of aluminum.

[0080] The first heat transfer unit 51 in this embodiment is formed in the shape of a plate. More specifically, the first heat transfer unit 51 is formed in the shape of a rectangular plate. The first heat transfer unit 51 is housed in the housing 3 such that its long side is aligned in the vertical direction. The normal to the main surface of the first heat transfer unit 51 is aligned in the left-right direction. That is, the normal to the main surface of the first heat transfer unit 51 is aligned with the first normal direction D1 of the first surface 421 of the control board 42. By arranging the first heat transfer unit 51 so that its main surface and the first surface 421 of the control board 42 are parallel, the thermal conductivity between the first heat transfer unit 51 and the control unit 21 (processing unit 211) mounted on the first surface 421 can be reduced. In this embodiment, the first heat transfer unit 51 is arranged between the control board 42 and the power supply board 44 so as to face the first surface 421 of the control board 42 in the left-right direction. Furthermore, the upper end of the first heat transfer unit 51 is located above the upper end of the control board 42, the upper end of the communication board 43, and the upper end of the power supply board 44.

[0081] Furthermore, as shown in Figure 4, in a plan view from the first normal direction D1, a portion of the control board 42 and at least a portion of the first heat transfer section 51 overlap. In other words, a portion of the control board 42 does not overlap with the first heat transfer section 51 in a plan view from the first normal direction D1. Therefore, when mounting relatively tall elements such as aluminum electrolytic capacitors on the first surface 421 of the control board 42, for example, contact between the elements and the first heat transfer section 51 can be suppressed. Note that, as shown in Figure 5, the width X2 of the first heat transfer section 51 in the front-to-back direction in this embodiment is smaller than the width X1 of the control board 42 in the front-to-back direction.

[0082] The second heat transfer unit 52 is thermally connected to the first heat transfer unit 51 and the heat transfer surface 313 of the housing 3 (first housing unit 31). More specifically, in this embodiment, the second heat transfer unit 52 is thermally connected to the heat transfer surface 313 of the housing 3 via the housing-side heat transfer units 62, 62. Since the heat transfer surface 313 of the housing 3 is located at the upper end (second end 315) of the housing 3, the heat generated in the control unit 21 (processing unit 211) can be efficiently dissipated to the housing.

[0083] The second heat transfer section 52 is made of a metal such as aluminum or iron. In this embodiment, the second heat transfer section 52 is made of aluminum. That is, the second heat transfer section 52 in this embodiment is made of the same material as the first heat transfer section 51. Since the first heat transfer section 51 and the second heat transfer section 52 are made of the same material, there is an advantage that, for example, the first heat transfer section 51 and the second heat transfer section 52 can be easily manufactured in the same factory. However, the first heat transfer section 51 and the second heat transfer section 52 may be made of different materials.

[0084] The second heat transfer section 52 in this embodiment is formed in a plate shape. More specifically, the second heat transfer section 52 in this embodiment is formed in an arc-shaped plate shape, at least a portion of its outer edge. The normal to the main surface of the second heat transfer section 52 is aligned in the vertical direction. That is, the normal to the main surface of the second heat transfer section 52 is aligned with the second normal direction D2 of the heat transfer surface 313 of the housing 3. By arranging the second heat transfer section 52 so that its main surface and the heat transfer surface 313 of the housing 3 are parallel, the thermal conductivity between the second heat transfer section 52 and the heat transfer surface 313 can be reduced. Furthermore, by making the shape of the second heat transfer section 52 an arc-shaped plate shape, at least a portion of its outer edge can be aligned in an arc shape, thereby increasing the area of ​​the portion where the second heat transfer section 52 and the circular heat transfer surface 313 are thermally connected, and improving heat dissipation performance. Note that the second heat transfer section 52 in this embodiment is formed in a semicircular plate shape. In a plan view from above, the straight portion (diameter portion) of the second heat transfer section 52 aligns with the first heat transfer section 51. Furthermore, the diameter X3 of the second heat transfer section 52 is greater than the width X2 of the first heat transfer section 51 in the front-to-back direction.

[0085] In this embodiment, the second heat transfer section 52 is thermally connected to the upper end of the first heat transfer section 51 and protrudes toward the power supply board 44 (to the right) along the first normal direction D1. In other words, the second heat transfer section 52 protrudes toward the communication board 43 away from the upper end of the first heat transfer section 51 along the first normal direction D1. Because the second heat transfer section 52 protrudes toward the communication board 43, it becomes easier to position communication connectors and the like above the communication board 43. Furthermore, in this embodiment, the second heat transfer section 52 overlaps with the power supply board 44 in a plan view from the second normal direction D2 (up and down direction). By making the second heat transfer section 52 protrude to the extent that it overlaps with the power supply board 44 in a plan view, the area of ​​the part where the second heat transfer section 52 and the heat transfer surface 313 of the housing 3 are thermally connected becomes larger, and the heat dissipation performance can be improved.

[0086] In this embodiment, the second heat transfer section 52 is formed integrally with the first heat transfer section 51. For example, in this embodiment, the first heat transfer section 51 and the second heat transfer section 52 are formed by bending a single plate. Because the first heat transfer section 51 and the second heat transfer section 52 are formed integrally, the thermal conductivity between the first heat transfer section 51 and the second heat transfer section 52 can be lowered compared to the case where the first heat transfer section 51 and the second heat transfer section 52 are separate components, thereby improving heat dissipation performance.

[0087] In this embodiment, the first heat transfer unit 51 and the second heat transfer unit 52 are fixed to the control board 42 by screws.

[0088] As shown in Figure 6, the processing unit-side heat transfer unit 61 is positioned between the processing unit 211 (control unit 21) and the first heat transfer unit 51 in the first normal direction D1. Furthermore, the processing unit-side heat transfer unit 61 is in contact with the processing unit 211 (control unit 21) and the first heat transfer unit 51 in the first normal direction D1.

[0089] The heat transfer section 61 on the processing side is, for example, a heat dissipation sheet or a heat dissipation gel. The heat transfer section 61 on the processing side is electrically insulating and is made of a material with lower hardness than the first heat transfer section 51 and the processing section 211 (control section 21). The heat transfer section 61 on the processing side is made of a gel-like or viscous material. The heat transfer section 61 on the processing side may be made of a material obtained by hardening a viscous material. The heat transfer section 61 on the processing side is made of, for example, a silicone resin or a fluororesin. The thermal conductivity of the heat transfer section 61 on the processing side is about 0.5 to 10.0 W / m·K, which is much higher than the thermal conductivity of air (about 25 mW / m·K). In this embodiment, the heat transfer section 61 on the processing side is formed in the shape of a rectangular plate and covers the entire surface of the processing section 211 (control section 21).

[0090] In this embodiment, the heat transfer section 61 on the processing side has lower hardness and is more easily crushed compared to the first heat transfer section 51 and the processing section 211 (control section 21). Therefore, the contact thermal resistance between the processing section 211 and the first heat transfer section 51 can be reduced, and the heat dissipation performance from the processing section 211 to the first heat transfer section 51 can be improved.

[0091] The housing-side heat transfer sections 62 and 63 are positioned between the heat transfer surface 313 of the housing 3 and the second heat transfer section 52 in the second normal direction D2. Furthermore, the housing-side heat transfer sections 62 and 63 are in contact with the heat transfer surface 313 of the housing 3 and the second heat transfer section 52 in the second normal direction D2.

[0092] The housing-side heat transfer sections 62 and 63 are, for example, heat dissipation sheets or heat dissipation gels. The housing-side heat transfer sections 62 and 63 are made of a material that has electrical insulating properties and is less hard than the second heat transfer section 52 and the housing 3. The housing-side heat transfer sections 62 and 63 are made of a gel-like or viscous material. The housing-side heat transfer sections 62 and 63 may also be made of a material which is a hardened viscous material. The housing-side heat transfer sections 62 and 63 are made of, for example, silicone resin or fluororesin. In this embodiment, the housing-side heat transfer sections 62 and 63 are made of the same material as the processing-side heat transfer section 61.

[0093] In this embodiment, the housing-side heat transfer sections 62 and 63 are formed in the shape of rectangular plates that are elongated in the front-to-back direction. The width of the housing-side heat transfer section 62 in the front-to-back direction is greater than the width of the housing-side heat transfer section 63 in the front-to-back direction. The housing-side heat transfer section 62 is positioned to the left of the housing-side heat transfer section 63.

[0094] In this embodiment, the heat transfer sections 62 and 63 on the housing side have lower hardness and are more easily deformed compared to the second heat transfer section 52 and the housing 3 (heat transfer surface 313). Therefore, the contact thermal resistance between the second heat transfer section 52 and the heat transfer surface 313 can be reduced, and the heat dissipation performance from the second heat transfer section 52 to the heat transfer surface 313 can be improved.

[0095] (3) Variant The following lists some modifications of the above embodiment. The modifications described below can be combined and applied as appropriate.

[0096] The housing 3 may be made of a metal such as aluminum or iron. By making the housing 3 out of metal, the heat dissipation performance of the detection device 2 can be further improved.

[0097] The first heat transfer unit 51 and the processing unit side heat transfer unit 61 may be arranged to face the second surface 422 of the control board 42. When the first heat transfer unit 51 and the processing unit side heat transfer unit 61 are arranged to face the second surface 422, for example, thermal vias or the like may be provided on the control board 42 to allow heat generated in the processing unit 211 (control unit 21) to escape to the second surface 422. By making the processing unit side heat transfer unit 61 in contact with the first heat transfer unit 51 and the second surface 422, heat generated in the processing unit 211 can be released to the first heat transfer unit 51 via the thermal vias and the processing unit side heat transfer unit 61.

[0098] The shape of the second heat transfer section 52 may be a rectangular (polygonal) plate.

[0099] It is not essential that the first heat transfer section 51 and the second heat transfer section 52 are formed in a plate shape. The shape of the first heat transfer section 51 and the second heat transfer section 52 is sufficient as long as it can transfer the heat generated in the control section 21 (processing section 211) from the first heat transfer section 51 to the second heat transfer section 52, and from the second heat transfer section 52 to the heat transfer surface 313 of the housing 3.

[0100] The first heat transfer section 51 and the second heat transfer section 52 may be separate. If the first heat transfer section 51 and the second heat transfer section 52 are separate, the second heat transfer section 52 may be arranged to be in direct contact with the first heat transfer section 51, or it may be thermally connected to the first heat transfer section 51 via a heat transfer member such as a heat dissipation sheet or heat dissipation gel (a heat transfer member formed of silicone resin or fluororesin).

[0101] In a plan view from the first normal direction D1, the entire control board 42 may overlap with the first heat transfer section 51. Also, the width X2 of the first heat transfer section 51 may be greater than the width X1 of the control board 42 in the front-to-back direction. By increasing the volume of the first heat transfer section 51, the heat capacity of the first heat transfer section 51 is increased, making it easier to dissipate the heat generated in the processing unit 211 to the housing 3.

[0102] The housing-side heat transfer sections 62 and 63 may be formed integrally. If the housing-side heat transfer sections 62 and 63 are formed integrally, for example, they may be formed to cover the entire upper surface of the second heat transfer section 52.

[0103] The first heat transfer unit 51 and the second heat transfer unit 52 may be fixed to the housing 3 by means of screws or the like, with the second heat transfer unit 52 being fixed to the top plate 312 of the housing 3. The first heat transfer unit 51 and the second heat transfer unit 52 may also be fixed to the housing 3 by adhesive fixing the upper surface of the second heat transfer unit 52 to the heat transfer surface 313 of the housing 3. In addition, the first heat transfer unit 51 may be fixed to the imaging substrate 41 via a base or the like.

[0104] In the above embodiment, the machine learning algorithm was exemplified as a neural network. However, the machine learning algorithm is not limited to a neural network and may be, for example, XGB (eXtreme Gradient Boosting) regression, random forest, decision tree, logistic regression, support vector machine (SVM), naive Bayes classifier, or k-nearest neighbors. Furthermore, the machine learning algorithm may also be, for example, a Gaussian mixture model (GMM) or k-means clustering.

[0105] A trained model may be updated by performing additional training.

[0106] The detection system 1 may include, in place of or in addition to, the lighting fixture 12, equipment such as air conditioning equipment that is controlled based on the detection results of the detection device 2.

[0107] (summary) As described above, the detection device (2) according to the first embodiment comprises an imaging unit (26), a processing unit (211), a control board (42), a housing (3), a first heat transfer unit (51), and a second heat transfer unit (52). The imaging unit (26) performs imaging. The processing unit (211) detects the presence or absence of a person (H1) based on the image captured by the imaging unit (26). The control board (42) has a first surface (421) on which the processing unit (211) is mounted, and a second surface (422) which is the back surface of the first surface (421). The housing (3) houses the imaging unit (26) and the control board (42). The first heat transfer unit (51) is thermally connected to the processing unit (211). The second heat transfer section (52) is thermally connected to the first heat transfer section (51) and the heat transfer surface (313) of the housing (3). The first normal direction (D1) of the first surface (421) of the control board (42) intersects with the second normal direction (D2) of the heat transfer surface (313) of the housing (3).

[0108] According to this embodiment, the heat generated in the processing unit (211) can be dissipated to the housing (3) via the first heat transfer unit (51) and the second heat transfer unit (52), thereby improving heat dissipation performance. Furthermore, the heat generated in the processing unit (211) can be dissipated via the first heat transfer unit (51) and the second heat transfer unit (52) to a heat transfer surface (313) that is not parallel to the first surface (421) on which the processing unit (211) is mounted. Therefore, even if there are limitations on the shape of the housing (3), the size of the housing (3), the size of the circuit board, the arrangement of the circuit board, and the orientation of the circuit board, for example, because the detection device (2) is installed embedded in the ceiling (101), heat can be efficiently dissipated from the heat-generating element to the housing (3).

[0109] In the detection device (2) according to the second embodiment, as in the first embodiment, the imaging unit (26) is provided on the first end (314) side of the housing (3) in a predetermined direction. The heat transfer surface (313) of the housing (3) is provided on the second end (315) side of the housing (3) in a predetermined direction.

[0110] According to this embodiment, for example, when the detection device (2) is installed on the ceiling (101), an imaging unit (26) is provided at the lower end and a heat transfer surface (313) is provided at the upper end, so that the heat generated in the processing unit (211) can be efficiently dissipated to the housing (3).

[0111] In the detection device (2) according to the third embodiment, in the state in which the detection device (2) is installed on the building material (ceiling 101) as in the second embodiment, the second end (315) of the housing (3) is the upper end of the housing (3).

[0112] According to this embodiment, since the heat transfer surface (313) of the housing (3) is provided at the upper end of the housing (3), the heat generated in the processing unit (211) can be efficiently dissipated to the housing (3).

[0113] The detection device (2) according to the fourth embodiment further comprises an imaging substrate (41) in any of the first to third embodiments. An imaging unit (26) is mounted on the imaging substrate (41). The first normal direction (D1) and the third normal direction (D3) of the main surface of the imaging substrate (41) intersect.

[0114] According to this embodiment, for example, by arranging the control board (42) upright on the main surface of the imaging substrate (41), the diameter (radius) of the cylindrical housing (3) can be reduced.

[0115] The detection device (2) according to the fifth embodiment further comprises a power supply board (44) and a communication board (43) in any of the first to fourth embodiments. The power supply board (44) supplies power to the control board (42). A communication unit (first communication unit 22; second communication unit 23; fourth communication unit 25) is mounted on the communication board (43). The power supply board (44) and the communication board (43) are arranged so as to sandwich the control board (42) in the first normal direction (D1). The first heat transfer unit (51) is arranged between the control board (42) and the power supply board (44) so ​​as to face the first surface (421) of the control board (42) in the first normal direction (D1). The second heat transfer unit (52) is thermally connected to the upper end of the first heat transfer unit (51) and protrudes away from the communication board (43) along the first normal direction (D1).

[0116] In this embodiment, since the second heat transfer unit (52) protrudes away from the communication board (43), it becomes easier to position communication connectors and the like above the communication board (43).

[0117] In the detection device (2) according to the sixth embodiment, the second heat transfer unit (52) overlaps with the power supply board (44) in a plan view from the second normal direction (D2).

[0118] According to this embodiment, by making the second heat transfer section (52) protrude to the extent that it overlaps with the power supply board (44) in a plan view, the area of ​​the part where the second heat transfer section (52) and the heat transfer surface (313) of the housing (3) are thermally connected is increased, and the heat dissipation performance can be improved.

[0119] In the detection device (2) according to the seventh embodiment, in any of the first to sixth embodiments, a part of the control board (42) and at least a part of the first heat transfer unit (51) overlap in a plan view from the first normal direction (D1).

[0120] According to this embodiment, for example, when mounting a relatively tall element such as an aluminum electrolytic capacitor on the first surface (421) of the control board (42), it is possible to suppress contact between the element and the first heat transfer section (51).

[0121] In the detection device (2) according to the eighth embodiment, the first heat transfer section (51) and the second heat transfer section (52) are integrally formed in any of the first to seventh embodiments.

[0122] According to this embodiment, since the first heat transfer section (51) and the second heat transfer section (52) are integrally formed, the thermal conductivity between the first heat transfer section (51) and the second heat transfer section (52) can be reduced compared to the case where the first heat transfer section (51) and the second heat transfer section (52) are separate, thereby improving heat dissipation performance.

[0123] In the detection device (2) according to the ninth embodiment, in any of the first to eighth embodiments, the first heat transfer section (51) and the second heat transfer section (52) are formed of the same material.

[0124] According to this embodiment, since the first heat transfer section (51) and the second heat transfer section (52) are made of the same material, there is an advantage that, for example, the first heat transfer section (51) and the second heat transfer section (52) can be easily manufactured in the same factory.

[0125] In the detection device (2) according to the tenth embodiment, in the second or third embodiment, the shape of the housing (3) is a hollow cylindrical shape with a central axis aligned in a predetermined direction.

[0126] In this embodiment, the housing (3) is a hollow cylindrical shape aligned in the vertical direction, making it easy to embed the detection device (2) in the ceiling (101) or the like.

[0127] In the detection device (2) according to the 11th embodiment, in the 10th embodiment, the second heat transfer section (52) is formed in an arc-shaped plate form, at least a portion of its outer edge.

[0128] According to this embodiment, by making the shape of the second heat transfer section (52) such that at least a part of its outer edge is arc-shaped, the area of ​​the part in which the second heat transfer section (52) and the circular heat transfer surface (313) are thermally connected can be increased, thereby improving heat dissipation performance.

[0129] The detection device (2) according to the twelfth embodiment further comprises a processing-side heat transfer section (61) in any of the first to eleventh embodiments. The processing-side heat transfer section (61) is positioned between the processing section (211) and the first heat transfer section (51) in the first normal direction (D1) and is in contact with the processing section (211) and the first heat transfer section (51). The hardness of the processing-side heat transfer section (61) is lower than that of the first heat transfer section (51).

[0130] According to this embodiment, the heat transfer section (61) on the processing side has lower hardness and is more easily deformed compared to the first heat transfer section (51), so the contact thermal resistance between the processing section (211) and the first heat transfer section (51) can be reduced, and the heat dissipation performance from the processing section (211) to the first heat transfer section (51) can be improved.

[0131] The detection device (2) according to the 13th embodiment further comprises a housing-side heat transfer section (62; 63) in any of the first to 12 embodiments. The housing-side heat transfer section (62; 63) is positioned between the heat transfer surface (313) and the second heat transfer section (52) in the second normal direction (D2) and is in contact with the heat transfer surface (313) and the second heat transfer section (52). The hardness of the housing-side heat transfer section (62; 63) is lower than the hardness of the second heat transfer section (52).

[0132] According to this embodiment, the heat transfer portion (62;63) on the housing side has lower hardness and is more easily deformed compared to the second heat transfer portion (52), so the contact thermal resistance between the second heat transfer portion (52) and the heat transfer surface (313) can be reduced, and the heat dissipation performance from the second heat transfer portion (52) to the heat transfer surface (313) can be improved.

[0133] In the detection device (2) according to the 14th embodiment, in any of the first to 13 embodiments, the first heat transfer section (51) and the second heat transfer section (52) are formed in a plate shape. The normal direction of the main surface of the first heat transfer section (51) is along the first normal direction (D1). The normal direction of the main surface of the second heat transfer section (52) is along the second normal direction (D2).

[0134] According to this embodiment, by arranging the first heat transfer unit (51) so that its main surface is parallel to the first surface (421) of the control board (42), the thermal conductivity between the first heat transfer unit (51) and the processing unit (211) mounted on the first surface (421) can be reduced. Furthermore, by arranging the second heat transfer unit (52) so that its main surface is parallel to the heat transfer surface (313) of the housing (3), the thermal conductivity between the second heat transfer unit (52) and the heat transfer surface (313) can be reduced.

[0135] Configurations other than those in the first embodiment are not essential to the detection device (2) and can be omitted as appropriate.

[0136] The detection system (1) according to the 15th embodiment comprises a detection device (2) according to any of the first to 14th embodiments, and an external device (management system 11; lighting fixture 12; service provision system 13). The external device (management system 11; lighting fixture 12; service provision system 13) receives the detection result of whether or not a person (H1) is present from the detection device (2).

[0137] In this embodiment, the heat generated in the processing unit (211) can be dissipated to the housing (3) via the first heat transfer unit (51) and the second heat transfer unit (52) in the detection device (2), thereby improving heat dissipation performance. Furthermore, in the detection device (2), the heat generated in the processing unit (211) can be dissipated via the first heat transfer unit (51) and the second heat transfer unit (52) to a heat transfer surface (313) that is not parallel to the first surface (421) on which the processing unit (211) is mounted. Therefore, even if there are limitations on the shape of the housing (3), the size of the housing (3), the size of the circuit board, the arrangement of the circuit board, and the orientation of the circuit board, for example, because the detection device (2) is installed embedded in the ceiling, heat can be efficiently dissipated from the heat-generating element to the housing (3). [Explanation of symbols]

[0138] 1. Detection System 101 Ceiling (building materials) 11. Management System (External Device) 12. Lighting fixtures (external devices) 13. Service delivery system (external device) 2. Detection device 211 Processing Unit 26 Imaging Department 3 cabinets 313 Heat transfer surface 314 1st end 315 2nd end 41 Imaging substrate 42 Control board 421 Page 1 422 2nd page 43 Communication board 44 Power supply board 51. First heat transfer section 52. Second heat transfer section 61 Processing side heat transfer section 62,63 Heat transfer section on the housing side D1 1st normal direction D2 2nd normal direction D3 Third Normal Direction H1 people

Claims

1. an imaging unit that captures images; a processing unit that detects the presence or absence of a person based on the captured image captured by the imaging unit; a control board having a first surface on which the processing unit is mounted and a second surface that is the reverse side of the first surface; a housing that houses the imaging unit and the control board; a first heat transfer unit thermally connected to the processing unit; a second heat transfer portion thermally connected to the first heat transfer portion and the heat transfer surface of the housing; Equipped with a first normal direction of the first surface of the control board and a second normal direction of the heat transfer surface of the housing intersect with each other; Detection device.

2. the imaging unit is provided on a first end side of the housing in a predetermined direction, the heat transfer surface of the housing is provided on a second end side of the housing in the predetermined direction. The detection device of claim 1 .

3. When the housing is installed on the construction material, the second end of the housing is the upper end of the housing. The detection device of claim 2 .

4. further comprising an imaging board on which the imaging unit is mounted, the first normal direction intersects with a third normal direction to the main surface of the imaging substrate; The detection device of claim 1 .

5. a power supply board that supplies power to the control board; a communication board on which a communication unit is mounted; Further provided with the power supply board and the communication board are arranged to sandwich the control board in the first normal direction, the first heat transfer unit is disposed between the control board and the power supply board so as to face the first surface of the control board in the first normal direction; the second heat transfer portion is thermally connected to an upper end of the first heat transfer portion and protrudes in a direction away from the communication board along the first normal direction; The detection device of claim 1 .

6. the second heat transfer portion overlaps with the power supply substrate in a plan view from the second normal direction; The detection device of claim 5 .

7. a portion of the control board overlaps with at least a portion of the first heat transfer unit in a plan view from the first normal direction; The detection device of claim 1 .

8. The first heat transfer portion and the second heat transfer portion are integrally formed. The detection device of claim 1 .

9. The first heat transfer portion and the second heat transfer portion are formed of the same material. The detection device of claim 1 .

10. The housing has a hollow cylindrical shape with a central axis aligned in the predetermined direction. The detection device of claim 2 .

11. At least a part of the outer edge of the second heat transfer portion is formed into an arc-shaped plate. The detection device of claim 10.

12. a processing-unit-side heat transfer unit disposed between the processing unit and the first heat transfer unit in the first normal direction and in contact with the processing unit and the first heat transfer unit, the hardness of the processing-side heat transfer portion is lower than the hardness of the first heat transfer portion; The detection device of claim 1 .

13. a housing-side heat transfer portion that is disposed between the heat transfer surface and the second heat transfer portion in the second normal direction and that is in contact with the heat transfer surface and the second heat transfer portion, the hardness of the housing-side heat transfer portion is lower than the hardness of the second heat transfer portion; The detection device of claim 1 .

14. The first heat transfer portion and the second heat transfer portion are formed in a plate shape, a normal direction of a main surface of the first heat transfer portion is along the first normal direction, The normal direction of the main surface of the second heat transfer portion is along the second normal direction. The detection device of claim 1 .

15. A detection device according to any one of claims 1 to 14; an external device that receives a detection result of the presence or absence of a person from the detection device; Equipped with Detection system.

Images