Endoscopy

Abstract

To provide an endoscope that has a conductive part properly disposed therein, the conductive part to be connected with power wires for supplying electricity to light-emitting elements.SOLUTION: This endoscope is provided with a light-emitting module that is incorporated in a leading end of an insertion tube. The light-emitting module includes a mounted substrate that has a plurality of light-emitting elements mounted thereon. The mounted substrate is formed in an annular shape having in its center a hole through which an imaging element using the light-emitting elements as a light source is inserted, and is provided with: a first surface that has the light-emitting elements surface-mounted thereon; and a lateral surface that is located at the periphery of the first surface. The lateral surface is provided with a conductive part that is electrically conductive with the light-emitting elements. The conductive part is connected with power wires for supplying electricity to the light-emitting elements.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present technology relates to endoscopy. [Background technology]

[0002] An endoscope is a medical device that enables observation and treatment of a desired location by being inserted into a body cavity of a subject, and is equipped with an imaging unit incorporated in the tip of an insertion tube that is inserted into the body cavity, and an illumination device that illuminates the imaging field of the imaging unit. Patent Document 1 discloses an endoscope that is equipped with an illumination device that realizes illumination in a wide angle range of 180° or more, enabling observation in a wide viewing angle. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-16021 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the endoscopic device described in Patent Document 1 has a problem in that when providing a conductive portion to which a power line for supplying power to the lighting device is connected, no consideration is given to the suitable arrangement of the conductive portion.

[0005] One aspect of the present invention is to provide an endoscope that allows for suitable arrangement of a conductive portion to which a power supply line for supplying power to a light-emitting element is connected. [Means for solving the problem]

[0006] An endoscope in one aspect of the present disclosure is an endoscope equipped with an optical module incorporated into the tip of an insertion tube, the optical module including a mounting board on which a plurality of optical elements are mounted, the mounting board being annular with a hole in the center through which an imaging element using the optical element as a light source is inserted, the mounting board having a first surface on which the optical element is surface-mounted and a side surface located on the periphery of the first surface, the side surface being provided with a conductive portion that is electrically conductive to the optical element, and a power line for supplying power to the optical element being connected to the conductive portion. Effect of the Invention

[0007] According to the present disclosure, it is possible to provide an endoscope in which a conductive portion to which a power supply line for supplying power to a light-emitting element is connected is suitably arranged. [Brief description of the drawings]

[0008] [Figure 1] 1 is an external view of an endoscope according to a first embodiment. [Diagram 2] FIG. 2 is an enlarged view of the tip of the insertion tube. [Diagram 3] FIG. 4 is an explanatory diagram illustrating an example of a connection state between a mounting board and a power supply line. [Figure 4] FIG. 2 is a schematic plan view illustrating an example of a mounting substrate. [Diagram 5] FIG. 2 is a schematic cross-sectional side view illustrating an example of a mounting board. [Figure 6] 11 is a schematic cross-sectional side view illustrating an example of a mounting board according to embodiment 2 (a recess in a heat sink). FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Embodiment 1) The present invention will be described in detail below with reference to the drawings showing the embodiments. Fig. 1 is an external view of an endoscope 1 according to the first embodiment. The endoscope 1 includes an insertion tube 2, an operation section 3, a universal tube 4, and a connector section 5. The insertion tube 2 is a section to be inserted into a body cavity, and includes a long flexible section 20 and a tip section 22 connected to one end of the flexible section 20 via a curved section 21. The other end of the flexible section 20 is connected to the operation section 3 via a cylindrical connecting section 23. The universal tube 4 has one end connected to the operation section 3 and extends in a different direction from the insertion tube 2, and the connector section 5 is connected to the other end of the universal tube 4.

[0010] The operation section 3 is provided to be held by a user (operator) of the endoscope 1, such as a doctor, to perform various operations, and includes a bending operation knob 30, a plurality of operation buttons 31, etc. The bending operation knob 30 is connected to the bending section 21 by a wire (not shown) passing through the connecting section 23 and the inside of the flexible section 20. The bending section 21 is bent in two directions perpendicular to each other in the axial cross section by operating the bending operation knob 30, and the orientation of the tip section 22 inserted into the body cavity changes.

[0011] The endoscope 1 is connected to the processor device 10 via the connector unit 5 and used as an endoscope 1 device. The processor device 10 includes a control unit, a storage unit, a signal processing circuit, etc., and performs integrated control of the endoscope device by a control program stored in the storage unit.

[0012] 2 is an enlarged view of the tip of the insertion tube. The tip 22 has a cylindrical housing 24 with one side fixed to the curved portion 21. The other side of the housing 24 is covered with a central objective lens 25 and an annular light distribution lens 26 that surrounds the objective lens 25. An image sensor 6 is built into the housing 24, facing the inside of the objective lens 25. The image sensor 6 captures an image of an observation object (subject), which is an internal body part such as a body cavity, via the objective lens 25. The objective lens 25 is fitted into the inner frame of a hole provided in the tip 22 of the insertion tube 2, and functions as an observation window. A light emitting module 7 is built into the housing 24, facing the inside of the light distribution lens 26.

[0013] The imaging element 6 is composed of a semiconductor element such as a CMOS (Complementary Metal Oxide Semiconductor) and an optical system for forming an image on an imaging surface, and images the inside of the body cavity through the objective lens 25. The objective lens 25 is, for example, a wide-angle lens, and the imaging element 6 is configured to be able to capture an image at a predetermined viewing angle such as 180° or more by setting the optical system including the objective lens 25. The imaging element 6 outputs imaging data (image signal) of the captured observation object (subject) via a signal line connected to the imaging element 6. The imaging data (image signal) output by the imaging element 6 is subjected to pre-processing such as AD conversion or white balance correction, and is output to the processor device 10.

[0014] The light emitting module 7 includes an annular mounting board 72 surrounding the periphery of the imaging element 6, and a plurality of light emitting elements 71 mounted on a first surface (mounting surface) of the mounting board 72 facing the light distribution lens 26. The plurality of light emitting elements are, for example, configured of white LEDs, narrowband LEDs, or a combination of both LEDs. The plurality of light emitting elements are arranged at equal intervals along the circumference of the annular mounting board 72, for example, in groups of one or two. The annular mounting board 72 has a circular hole formed in the center, and the imaging element 6 is located at the center of the circular hole. As a result, the outer peripheral surface of the imaging element 6 faces the inner peripheral surface (inner peripheral side surface) of the hole formed in the mounting board 72.

[0015] The light distributing lens 26 is a cylindrical lens having a shape that spreads outward from the peripheral portion of the objective lens 25, passes through a curved portion, and continues to the peripheral wall of the housing 24. The light emitted from the light emitting element 71 is emitted through the light distributing lens 26 and illuminates the imaging field of the imaging element 6. Image capture by the imaging element 6 is performed under illumination by the light emitted from the light emitting element 71.

[0016] FIG. 3 is an explanatory diagram for explaining an example of a connection state between the mounting board 72 and the power line 8. FIG. 4 is a schematic plan view for explaining an example of the mounting board 72. FIG. 5 is a schematic side cross-sectional view for explaining an example of the mounting board 72. The mounting board 72 is a multilayer board configured by stacking a plurality of boards 720 (four boards 720 in this embodiment). The mounting board 72 includes a first surface 721 which is a mounting surface on which the light emitting element 71 is mounted, and a second surface 722 located on the opposite side of the first surface 721, and the heat sink 9 is provided in close contact with the second surface 722. As a result, the heat sink 9 and the mounting board 72 are thermally connected.

[0017] In each of the substrates 720 constituting the mounting substrate 72, which is a multilayer substrate, the first surface 721, which is the mounting surface on which the light-emitting element 71 is mounted, corresponds to the front surface of the substrate 720 located at the most distal end side (the side of the objective lens 25), and the second surface 722 to which the heat sink 9 is in close contact corresponds to the rear surface of the substrate 720 located at the most proximal end side (the side of the curved portion 21).

[0018] The side surfaces located on the periphery of the first surface 721 include an inner peripheral side surface 723 which is the inner peripheral surface of a hole 73 formed in the annular mounting substrate 72, and an outer peripheral side surface 726 of the mounting substrate 72. The inner peripheral side surface 723 has a plurality of notches 724 cut in the thickness direction of the mounting substrate 72. That is, the notches 724 are formed in the side surfaces of the respective substrates 720 constituting the mounting substrate 72 which is a multilayer substrate, and the notches 724 of the substrates 720 are arranged so as to be continuous in the thickness direction of the substrate 720, so that the inner peripheral side surface 723 of the multilayer substrate has a groove-shaped notch 724 which runs along the thickness direction of the multilayer substrate.

[0019] The notch portion 724 may be formed in all the substrates 720 constituting the mounting substrate 72 (multilayer substrate), or may be formed only in some of the substrates 720 including at least the substrate 720 having the first surface 721 which is the mounting surface on which the light emitting element 71 is mounted. In this embodiment, the notch portion 724 is formed in the substrates 720 other than the substrate 720 to which the heat sink 9 is in close contact, among the substrates 720 constituting the multilayer substrate. That is, the substrate 720 to which the heat sink 9 is in close contact, i.e., the substrate 720 of the second surface 722, does not have the notch portion 724. In this way, among the substrates 720 constituting the multilayer substrate, the substrate 720 in close contact with the heat sink 9 does not have the notch portion 724 and the conductive portion 725, and thus the substrate 720 in close contact with the heat sink 9 can insulate the heat sink 9 from the conductive portion 725 provided in the notch portion 724 of the other substrate 720.

[0020] A conductive portion 725 is provided in a notch portion 724 formed in the inner peripheral side surface 723, i.e., a groove formed in the thickness direction of the inner peripheral side surface 723. The conductive portion 725 is made of a conductive material with good conductivity, such as copper, a copper alloy, or a conductive paste, and is, for example, a land for connecting a cable. The conductive portion 725 is provided so as to fill the notch portion 724 (groove) formed in the inner peripheral side surface 723.

[0021] An end of conductive portion 725 on the side of first surface 721 may be provided to be located on first surface 721 and form an L-shape. As illustrated in the present embodiment, in L-shaped conductive portion 725, a portion of conductive portion 725 provided in cutout portion 724 may correspond to a vertical side of the L-shape, and a portion of conductive portion 725 located on first surface 721 may correspond to a horizontal side of the L-shape. Core wire 81 of power line 8 is joined to the portion of conductive portion 725 that corresponds to the vertical side of the L-shape.

[0022] The conductive portion 725 is electrically connected to the terminal of the light-emitting element 71 or the light-emitting element land 711 via a wiring pattern, a land, a through-hole, or the like provided on the first surface 721 and the surface of each stacked substrate 720. As described above, the light-emitting element 71 is constituted by an LED or the like, and the conductive portion 725 includes a conductive portion 725 (positive electrode side conductive portion) connected to the anode (positive electrode side) of the LED, and a conductive portion 725 (negative electrode side conductive portion) connected to the cathode (negative electrode side).

[0023] The number of conductive parts 725 is determined based on the individual control mode for each of the multiple light-emitting elements 71. For example, when eight light-emitting elements 71 (LEDs) are mounted, in order to control the brightness of each of the light-emitting elements 71 (LEDs), eight conductive parts 725 (positive-side conductive parts) may be provided on the anode side, and one conductive part 725 (negative-side conductive part) may be provided on the cathode side by combining them into one circuit, or two conductive parts 725 (negative-side conductive parts) having redundancy against disconnection as two circuits. In this way, the number of conductive parts 725 (negative-side conductive parts) on the cathode side may be less than the number of conductive parts 725 (positive-side conductive parts) on the anode side.

[0024] The cutout portion 724 and conductive portion 725 provided on the inner peripheral side surface 723 of the mounting substrate 72 may be created by splitting a VIA (via hole) in half when forming (hollowing out) the hole 73 to give the mounting substrate 72 an annular shape, or may be patterned after the mounting substrate 72 is molded.

[0025] A core wire 81 of a power line 8 extending from the processor device 10 is joined to the conductive part 725. Power from the processor device 10 is supplied to the light-emitting module 7 via the power line 8 and the conductive part 725, causing the light-emitting element 71 to light up.

[0026] The power line 8 extending from the processor device 10 side is connected so as to be parallel (parallel) to the conductive part 725, that is, parallel to the groove-shaped cutout part 724 along the thickness direction of the multilayer board, based on the extension direction of the insertion tube 2. As a result, the axial direction of the core wire 81 of the power line 8 joined to the conductive part 725 is parallel to the extension direction of the insertion tube 2 and the thickness direction of the mounting board 72, and the core wire 81 is also located inside the hole 73 of the mounting board 72. Since the power line 8 extending from the processor device 10 side is connected parallel to the conductive part 725 in the extension direction of the insertion tube 2, bending of the power line 8 can be suppressed at the part of the power line 8 near the part where the conductive part 725 is connected. As a result, stress acting in a direction to peel the power line 8 from the conductive part 725 can be suppressed, and the connection strength between the power line 8 and the conductive part 725 can be secured or improved.

[0027] The heat sink 9 is made of a metal with high thermal conductivity, and is configured from an annular plate member similar to the mounting substrate 72. The annular heat sink 9 has a hole in the center, similar to the mounting substrate 72, and the hole of the heat sink 9 and the hole 73 of the mounting substrate 72 form a concentric circle. Inside the hole of the heat sink 9, multiple power supply lines 8 and signal lines connected to the image sensor 6 are located.

[0028] The heat sink 9 is in close contact with the second surface 722 of the mounting substrate 72, and the mounting substrate 72 and the heat sink 9 are thermally connected. As a result, heat generated by the light emitting element 71 is dissipated to the surrounding space via the heat sink 9, and the light emitting element 71 can be cooled by suppressing a temperature rise. It goes without saying that the second surface 722 of the mounting substrate 72 and the heat sink 9 are electrically insulated. This is not limited to the case where the mounting substrate 72 (second surface 722) and the heat sink 9 (contact surface 91) are in direct contact with each other, and a thermally conductive paste having insulating properties may be provided between the mounting substrate 72 (second surface 722) and the heat sink 9 (contact surface 91).

[0029] The outer peripheral surface of the imaging element 6 faces the inner peripheral side surface 723 of the mounting substrate 72 on which the conductive portion 725 is provided, and an insulating resin member or the like may be provided in a gap formed between the outer peripheral surface of the imaging element 6 and the inner peripheral side surface 723 of the mounting substrate 72. By providing an insulating resin member or the like by filling the gap, it is possible to ensure insulation between the imaging element 6 and the conductive portion 725 and the core wire 81 connected to the conductive portion 725.

[0030] In this embodiment, the cutout portion 724 and the conductive portion 725 are provided on the inner peripheral side surface 723 of the mounting substrate 72, but this is not limiting and the cutout portion 724 and the conductive portion 725 may be provided on the outer peripheral side surface 726 of the mounting substrate 72. In this embodiment, the mounting substrate 72 is a multilayer substrate, but this is not limiting and the mounting substrate 72 may be a single layer substrate constituted by one substrate 720.

[0031] According to this embodiment, the conductive part 725 to which the power line 8 for supplying power to the light emitting element 71 is connected is provided on the inner peripheral side surface 723 located on the periphery of the first surface 721 on which the light emitting element 71 is surface mounted. This makes it unnecessary to provide the conductive part 725 (a part of the conductive part 725 that is joined to the core wire 81) on the first surface 721, and the conductive part 725 can be suitably arranged on the mounting board 72 contained in the tip of the insertion tube 2. The area of ​​the first surface 721 can be reduced, and the size of the tip of the insertion tube 2 in which the light emitting module 7 is incorporated can be reduced. By reducing the area of ​​the first surface 721, the diameter of the hole 73 provided in the mounting board 72 can be increased, and thus the size of the imaging element 6 inserted and arranged through the hole 73 can be increased without increasing the outer diameter of the mounting board 72 and the size of the tip of the insertion tube 2. The mounting space of the first surface 721 is enlarged, the degree of freedom in arranging the light emitting elements 71 on the first surface 721 (degree of freedom in mounting) is improved, and the number of light emitting elements 71 mounted is increased, making it possible to arrange a large number of these light emitting elements 71. Since the conductive portion 725 is provided on the inner peripheral side surface 723 that constitutes the inner peripheral surface of the hole 73 through which the imaging element 6 is inserted, the conductive portion 725 can be provided inside the hole 73. This allows the size of the tip of the insertion tube 2 to be reduced.

[0032] According to this embodiment, since the conductive portion 725 is provided in the cutout portion 724 formed in the side surface, it is possible to reduce the height of the convex portion formed between the conductive portion 725 and the side surface on which the cutout portion 724 is not formed. When the side surface on which the cutout portion 724 is formed is the inner peripheral side surface 723 constituting the inner peripheral surface of the hole 73, by providing the conductive portion 725 in the cutout portion 724, it is possible to prevent the conductive portion 725 from protruding from the inner peripheral surface of the hole 73, and it is possible to increase the diameter of the hole 73.

[0033] According to this embodiment, the mounting board 72 is formed by a multilayer board in which a plurality of boards 720 are laminated, so that the degree of freedom of the wiring of the wiring pattern connecting the conductive part 725 and the light emitting element 71 can be improved. In the mounting board 72 made of a multilayer board, a heat sink or other heat sink is in close contact with a second surface 722 located on the opposite side of a first surface 721 which is a mounting surface of the light emitting element 71. Among the plurality of boards 720 constituting the multilayer board, the boards 720 other than the board 720 to which the heat sink 9 is in close contact are provided with a notch 724, but the board 720 to which the heat sink 9 is in close contact, i.e., the board 720 having the second surface 722, does not have a notch 724. Therefore, the board 720 to which the heat sink 9 is in close contact (the board 720 including the second surface 722) does not have a conductive part 725. In this manner, among the multiple substrates 720 constituting the multilayer substrate, the substrate 720 in close contact with the heat sink 9 does not have the cutout portion 724 and the conductive portion 725, and thereby the substrate 720 in close contact with the heat sink 9 can insulate the heat sink 9 from the conductive portion 725 provided in the cutout portion 724 of the other substrates 720.

[0034] According to this embodiment, the power line 8 extending from the processor device 10 side is connected in parallel to the conductive portion 725 in the extending direction of the insertion tube 2, so that the power line 8 can be prevented from bending at a portion of the power line 8 near the portion where the conductive portion 725 is connected. This prevents the power line 8 from being peeled off from the conductive portion 725, and improves the connection strength (reliability of the soldered surface) between the power line 8 and the conductive portion 725. By providing the core wire 81 of the power line 8 on the inner circumferential side surface 723, bending of the power line 8 is prevented, so that the bent portion (R portion) caused by the bending (bending) does not interfere with the image pickup element 6 inserted in the center of the hole 73. As a result, the surface distance (clearance) between the inner circumferential side surface 723 of the mounting board 72 and the outer circumferential surface of the image pickup element 6 only needs to be secured by the outer diameter dimension of the power line 8, and the inner diameter dimension of the hole 73 of the mounting board 72 (the inner diameter dimension of the mounting board 72) can be reduced.

[0035] (Embodiment 2) 6 is a schematic cross-sectional side view for explaining an example of a mounting board 72 according to the second embodiment (a recess 92 in a heat sink 9). In this embodiment, notches 724 are formed on the side surfaces of all the substrates 720 constituting the mounting board 72, which is a multilayer substrate, and the notches 724 of the substrates 720 are provided so as to be continuous in the thickness direction of the substrate 720. As a result, a groove-shaped notch 724 extending in the thickness direction is formed on the inner peripheral side surface 723 of the multilayer substrate. That is, the notch 724 is also provided in the substrate 720 to which the heat sink 9 is in close contact, i.e., the substrate 720 having the second surface 722.

[0036] By forming the notch 724 in all the substrates 720 constituting the mounting substrate 72, which is a multilayer substrate, it is possible to form the notch 724 (groove) having the same length as the thickness of the mounting substrate 72 on the side surface of the mounting substrate 72, and to increase the length of the notch 724 parallel to the extension direction of the insertion tube 2. The conductive portion 725 is provided in the entire area of ​​the notch 724, and this allows the length of the conductive portion 725 parallel to the extension direction of the insertion tube 2 to be increased, which increases the joining area when the conductive portion 725 is joined to the core wire 81 of the power line 8, and improves the joining strength between the conductive portion 725 and the core wire 81 (power line 8).

[0037] A recess 92 is formed by cutting away (notching) a part of an edge of a contact surface 91 of the heat sink 9 which faces and is in close contact with the second surface 722 of the mounting board 72. The recess 92 is formed in the contact surface 91 along the edge (inner peripheral edge) of the inner circumference of the hole of the ring-shaped heat sink 9.

[0038] The recesses 92 are provided corresponding to the conductive portions 725, and the number of recesses 92 formed on the contact surface 91 may be the same as the number of conductive portions 725 provided on the inner peripheral side surface 723 of the mounting substrate 72. The positional correspondence between the recesses 92 and the conductive portions 725 includes a relationship in which the regions of the recesses 92 and the conductive portions 725 overlap when the mounting substrate 72 is viewed in a plan view, i.e., in the direction perpendicular to the first surface 721 of the mounting substrate 72.

[0039] The recess 92 provided in the contact surface 91 reliably separates the conductive portion 725 of the mounting board 72, particularly the portion of the conductive portion 725 provided on the board 720 having the second surface 722 (the board 720 located at the rear end side), from the heat sink 9, thereby ensuring an insulation distance between the conductive portion 725 and the heat sink 9.

[0040] Although a plurality of recesses 92 for ensuring an insulating distance between the conductive portion 725 and the heat sink 9 are formed on the inner periphery of the contact surface 91 in correspondence with each conductive portion 725, the present invention is not limited to this. The recesses 92 may be formed by cutting out (notching) the entire inner periphery of a hole provided on the contact surface 91 of the heat sink 9.

[0041] According to this embodiment, in the mounting substrate 72, a heat sink or other such heat sink is in close contact with a second surface 722 located opposite to a first surface 721 which is a mounting surface of the light emitting element 71, and a recess 92 is provided on a contact surface 91 of the heat sink 9 which is in close contact with the second surface 722, i.e., on the surface of the heat sink 9 facing the second surface 722 (contact surface 91). The recess 92 provided on the contact surface 91 can separate the conductive portion 725 of the mounting substrate 72 from the heat sink 9, and can ensure insulation of the heat sink 9 from the conductive portion 725.

[0042] The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The technical features described in each embodiment can be combined with each other, and the scope of the present invention is intended to include all modifications within the scope of the claims and the scope equivalent to the claims. [Explanation of symbols]

[0043] 1 Endoscope 10. Processor Unit 2 Insertion tube 20 Soft part 21 Curved section 22 Tip 23 Connecting part 24 Housing 25 Objective Lens 26 Light distribution lens 3 Control section 30 Curvature control knob 31 Operation buttons 4 Universal Tube 5 Connector part 6. Image sensor 7 Light Emitting Module 71 Light emitting element 711 Light Emitting Device Land 72 Mounting Board 720 Substrate 721 Page 1 722 2nd page 723 Inner side surface 724 Notch 725 Conductive part (positive conductive part, negative conductive part) 726 Outer periphery side 73 holes 8 Power line 81 Core Wire 9 Heat sink 91 Contact surface 92 Recess

Claims

1. An endoscope having a light emitting module incorporated in a distal end of an insertion tube, The light emitting module includes a mounting substrate on which a plurality of light emitting elements are mounted, the mounting substrate has an annular shape with a hole in the center through which an imaging element using the light emitting element as a light source is inserted, the mounting substrate has a first surface on which the light emitting element is surface-mounted, and a side surface located on a periphery of the first surface; A conductive portion that is electrically connected to the light emitting element is provided on the side surface, A power supply line for supplying power to the light emitting element is connected to the conductive portion. Endoscope.

2. The side surface is an inner peripheral side surface that constitutes the inner peripheral surface of the hole. The endoscope according to claim 1 .

3. A notch is formed in the side surface, The conductive portion is provided in the notch. The endoscope according to claim 1 or 2.

4. the mounting board is a multi-layer board in which a plurality of boards are stacked, A heat sink is in close contact with a second surface located opposite to the first surface, The notch is formed in one of the substrates constituting the multilayer substrate other than the substrate to which the heat sink is in close contact. The endoscope according to claim 3.

5. A heat sink is in close contact with a second surface located opposite to the first surface, a recess is provided on a contact surface of the heat sink that contacts the second surface, The recess separates the heat sink from the conductive portion. The endoscope according to any one of claims 1 to 3.

6. The power supply line is The processor device is connected to the endoscope. In the extending direction of the insertion tube, the conductive portion is connected in parallel to the An endoscope according to any one of claims 1 to 5.

7. the conductive portion includes a positive electrode side conductive portion connected to a positive electrode side of the light-emitting element and a negative electrode side conductive portion connected to a negative electrode side of the light-emitting element, The number of negative electrode side conductive parts connected to the negative electrode side is smaller than the number of positive electrode side conductive parts connected to the positive electrode side. An endoscope according to any one of claims 1 to 6.

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