Display device

Abstract

The display device includes a plurality of display modules, each including a module substrate and a plurality of light emitting elements mounted on the module substrate, and a support substrate on which the plurality of display modules are disposed, wherein each of the module substrates is provided with a through-hole penetrating the module substrate and a via provided in the through-hole, and each of the light emitting elements is electrically connected to a wiring on the support substrate through the via.

Description

[Technical field]

[0001] The present invention relates to displays, and more particularly to large area, multi-module displays. [Background technology]

[0002] In recent years, display devices using light emitting diodes (LEDs) have been developed. Display devices using light emitting diodes are obtained by forming red (R), green (G), and blue (B) light emitting diode (LED) structures that are individually grown on a final substrate.

[0003] However, in addition to the need for high-resolution, full-color display devices, the need for display devices having various areas, particularly large areas, is also continuously increasing. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a high quality, large area, multi-module display device and a method for manufacturing the same. [Means for solving the problem]

[0005] A display device according to an embodiment of the present invention includes a plurality of display modules, each of which includes a module substrate and a plurality of light emitting elements mounted on the module substrate, and a support substrate on which the plurality of display modules are disposed, wherein each of the module substrates is provided with a through hole penetrating the module substrate and a via provided in the through hole, and each of the light emitting elements is electrically connected to a wiring on the support substrate through the via.

[0006] In one embodiment of the present invention, each of the vias includes an upper pad provided on an upper surface of the module substrate, a lower pad provided on a lower surface of the module substrate, and an internal electrode provided in the through hole, and the lower pad may be connected to the support substrate in a ball grid array (BGA) manner.

[0007] In an embodiment of the present invention, the display device may further include a connection wire provided on a lower surface of the module substrate, and the connection wire may be electrically connected to the wire of the support substrate.

[0008] In an embodiment of the present invention, the module substrate may have a plurality of recesses recessed from a lower surface of the module substrate, and the connecting wires may be provided within the recesses.

[0009] In one embodiment of the present invention, the module substrate may include a pixel region in which the light emitting element is provided and an image is displayed, and a non-pixel region surrounding the pixel region, and some or all of the connecting wires may be provided in the pixel region.

[0010] In an embodiment of the present invention, a portion of the through-holes may be provided in the pixel region.

[0011] In an embodiment of the present invention, a portion of the through hole may be provided in an area corresponding to the recess.

[0012] In an embodiment of the present invention, the support substrate may have a protrusion corresponding to the recess on a surface facing the module substrate.

[0013] In one embodiment of the present invention, the protrusion may include a conductive material and be electrically connected to a wiring of the support substrate.

[0014] In one embodiment of the present invention, the support substrate has a conductive electrode portion provided on a surface facing the module substrate, and the via may be in contact with the conductive electrode portion.

[0015] In one embodiment of the present invention, the support substrate is provided on a surface facing the module substrate and has a hole corresponding to the through hole, and the via is provided integrally with the through hole and the hole and can contact the conductive electrode portion.

[0016] In one embodiment of the present invention, the through holes may be disposed along an edge of the module substrate.

[0017] The display device according to an embodiment of the present invention may be manufactured by manufacturing a plurality of display modules and providing the plurality of display modules on a supporting substrate, and the manufacturing step of each of the plurality of display modules may include the steps of forming a light emitting element on a module substrate, forming a through hole in the module substrate, and forming a driving circuit unit on a lower surface of the module substrate and electrically connecting the light emitting element and the driving circuit unit through the through hole.

[0018] In one embodiment of the present invention, the through holes may be formed using a laser.

[0019] In one embodiment of the present invention, the method of manufacturing the display device may further include polishing an edge of a module substrate on which the light emitting device is formed, forming a plurality of recesses in a lower surface of the module substrate by laser processing, forming connecting wires in the recesses, and forming protrusions in the support substrate at positions corresponding to the recesses.

[0020] In one embodiment of the present invention, when manufacturing the display substrate, the method may further include forming holes on the upper surface of the support substrate at positions corresponding to the through holes, and forming vias in each of the through holes and the holes. Effect of the Invention

[0021] According to an embodiment of the present invention, it is possible to provide a large area display device in which problems such as image separation and dark lines appearing in an image are minimized. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view illustrating a display device according to an embodiment of the present invention.

[0023] [Figure 2a] FIG. 2a is a plan view showing a portion corresponding to P1 in FIG. [Figure 2b] FIG. 2b is a cross-sectional view taken along line AA' in FIG. 2a.

[0024] [Diagram 3] FIG. 3 is a cross-sectional view showing a simplified light emitting device according to an embodiment of the present invention.

[0025] [Figure 4] FIG. 4 is a diagram illustrating a display device according to an embodiment of the present invention in which a driving circuit unit is separately provided on a lower surface of a module substrate.

[0026] [Figure 5a] 1A to 1C are diagrams sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 5b] 1A to 1C are diagrams sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 5c] 1A to 1C are diagrams sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 5d] 1A to 1C are diagrams sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 5e] 1A to 1C are diagrams sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention.

[0027] [Figure 6] FIG. 6 is a diagram showing a connection structure between a display module and a supporting substrate in a display device according to an embodiment of the present invention.

[0028] [Figure 7] FIG. 7 is a diagram showing a connection structure between a display module and a supporting substrate in a display device according to an embodiment of the present invention.

[0029] [Figure 8] FIG. 8 is a structural diagram showing a display device according to an embodiment of the present invention.

[0030] [Figure 9] FIG. 9 is a plan view showing that light emitting devices are arranged in a different manner from the above-described embodiment in accordance with an embodiment of the present invention, and shows a portion corresponding to P1 in FIG.

[0031] [Figure 10a] FIG. 10a is a plan view showing that light emitting devices are arranged in a form different from that of the above-described embodiment in accordance with an embodiment of the present invention, and shows a portion corresponding to P1 in FIG. [Figure 10b] FIG. 10b is a simplified conceptual diagram of the light-emitting device shown in FIG. 10a.

[0032] [Figure 11] FIG. 11 is a schematic plan view showing that the light emitting devices are arranged in a different manner in accordance with an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Since the present invention can be modified in various ways and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text, but it is not intended to limit the present invention to the specific disclosed forms, and it should be understood that the present invention includes all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0034] The present invention relates to a display device including pixels. In the display device of the present invention, each light-emitting element may be used as a pixel to display an image. The display device includes televisions, tablets, e-book displays, computer monitors, kiosks, digital cameras, game consoles, mobile phones, PDAs, large outdoor / indoor display boards, etc.

[0035] A display device according to an embodiment of the present invention includes a micro light-emitting element. The micro light-emitting element may be an element having a width or length on the scale of about 1 micrometer to about 800 micrometers, about 1 micrometer to about 500 micrometers, or about 10 micrometers to about 300 micrometers. However, the micro light-emitting element according to an embodiment of the present invention does not necessarily have to have a width or length within the above range, and may be smaller or larger as necessary. Hereinafter, all micro light-emitting elements are referred to as "light-emitting elements".

[0036] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0037] Fig. 1 is a perspective view showing a display device according to an embodiment of the present invention, Fig. 2a is a plan view showing a portion corresponding to P1 in Fig. 1, and Fig. 2b is a cross-sectional view taken along line A-A' in Fig. 2a.

[0038] 1, 2a and 2b, a display device 100 according to an embodiment of the present invention includes a support substrate 160 and a number of display modules 110 arranged on the support substrate 160. Each display module 110 has a pixel region 111 where an image is displayed, and may be arranged along rows and columns on the support substrate 160. At least one pixel, preferably a number of pixels, may be formed in the pixel region 111 of the display module 110.

[0039] The supporting substrate 160 has a wiring portion and each light emitting element 130 formed thereon, and may be rigid or flexible. The supporting substrate 160 may be formed to have an area larger than that of the individual display modules 110, so that a number of display modules 110 can be mounted on the supporting substrate 160. In this embodiment, a display device 100 having a large display screen can be realized by combining a number of display modules 110.

[0040] Each of the display modules 110 includes a module substrate 120 and a plurality of light emitting elements 130 mounted on the upper surface of the module substrate 120 .

[0041] Each module substrate 120 of the display module 110 may be made of various materials. For example, the module substrate 120 may be made of a light-transmitting insulating material. Here, the module substrate 120 having "light transmissivity" means not only a transparent substrate that transmits all light, but also a semi-transparent or partially transparent substrate that transmits only light of a predetermined wavelength or only a portion of light of a long wavelength. Examples of materials for the module substrate 120 include glass, quartz, organic polymers, and organic-inorganic composite materials. However, the material for the module substrate 120 is not limited thereto, and may be any material that has light transmissivity and insulating properties.

[0042] The module substrate 120 includes at least one pixel region 111 and a non-pixel region surrounding the pixel region 111. The pixel region 111 is a region in which pixels are provided, and corresponds to a region where light emitted from a light emitting element 130 (described later) travels and is visually recognized by a user. The non-pixel region is a region excluding the pixel region 111. The non-pixel region is provided on at least one side of the pixel region 111, and in one embodiment of the present invention, is provided in a form surrounding the pixel region 111.

[0043] At least one light emitting element 130 is provided in the pixel region 111, so in the embodiment of the present invention, a case where a plurality of light emitting elements 130 are provided in the pixel region 111 will be described as an example.

[0044] The pixel unit 113 is the smallest unit for displaying an image. Each pixel unit 113 can emit white light and / or colored light. Each pixel unit 113 may include one pixel that emits one color, or may include multiple different pixels that are combined with different colors to emit white light and / or colored light. For example, each display module 110 may include first to third pixels.

[0045] Each pixel is provided in a pixel region 111 on a module substrate 120. At least one pixel is provided in the pixel unit 113 of each display module 110, and each pixel unit 113 may include first to third pixels. The first to third pixels may be implemented by first to third light emitting elements 130a, 130b, and 130c. That is, when the lights emitted by the first to third pixels are respectively referred to as first to third lights, the first to third lights may have different wavelength bands. In one embodiment of the present invention, the first to third lights may correspond to blue, red, and green wavelength bands. However, the wavelength bands of the lights emitted by each pixel included in each display module 110 are not limited thereto, and may correspond to cyan, magenta, and yellow wavelength bands.

[0046] Each light emitting device 130 is provided for each pixel and can provide light of various wavelengths. In one embodiment of the present invention, each light emitting device 130 can include first to third light emitting devices 130a, 130b, and 130c that emit light of green, red, and blue wavelength bands as the first to third light, respectively. In this case, the first to third light emitting devices 130a, 130b, and 130c can be realized as blue light emitting diodes, red light emitting diodes, and green light emitting diodes. However, in order to realize blue, red, and green, the first to third lights do not need to have blue, red, and green wavelength bands, respectively. This is because, even if the first to third lights have the same wavelength band, the color of the final emitted light can be controlled when a light conversion layer that converts at least a part of the first to third lights into light of another wavelength band is further used, although not shown. The light conversion layer can include materials such as phosphors and quantum dots that convert light of a certain wavelength into light of another wavelength. In other words, the first to third pixels do not necessarily have to use green, red, and blue LEDs to realize green, red, and / or blue colors, and LEDs of colors other than the above colors may be used. For example, a red LED may be used to realize red, but a blue or ultraviolet LED may be used, and a light conversion layer that absorbs blue light or ultraviolet light and then emits red light may be used.

[0047] Since each light emitting element 130 is formed in a fine size, it can be mounted on a flexible module substrate such as plastic by a method such as transfer. The light emitting element 130 according to an embodiment of the present invention may be an inorganic light emitting element, which can be formed by thin film growth of an inorganic material, unlike an organic light emitting element. This simplifies the manufacturing process and improves the yield. Furthermore, since the individually separated light emitting elements 130 can be simultaneously transferred onto a large-area substrate, it is possible to manufacture a large-area display device. Furthermore, a light emitting element made of an inorganic material has advantages of higher brightness, longer life, and lower unit cost than an organic light emitting element.

[0048] Although not shown in the drawings, a wiring section may be disposed on the upper surface of the module substrate 120, and the wiring section may include a plurality of wires (data lines and / or scan lines, which will be described later). In one embodiment of the present invention, a wiring section including a plurality of wires may also be formed on the lower surface of the module substrate 120. The wiring section may be provided in the pixel area 111 and the non-pixel area.

[0049] Each of the wires formed on the lower surface of the module substrate 120 may be connected to a separate driving circuit unit 150. The driving circuit unit 150 may be manufactured as a separate printed circuit board, disposed on the lower surface of the module substrate 120, and then connected to each of the wires formed on the lower surface of the module substrate 120. Each of the wires formed on the upper surface of the module substrate 120 may be connected to each of the wires formed on the lower surface of the module substrate 120 via through holes 121, which will be described later.

[0050] In one embodiment of the present invention, although not shown, the module substrate 120 may be formed with not only a number of wires but also driving elements for driving each of the light emitting elements 130. In this case, the driving elements may be thin film transistors, and each thin film transistor may be connected to each of the light emitting elements 130 by an external driving signal to turn each of the light emitting elements 130 on or off.

[0051] The first to third light emitting elements 130a, 130b, and 130c may be various types of light emitting diodes.

[0052] 3 is a cross-sectional view showing a light emitting device 130 according to an embodiment of the present invention. The light emitting device 130 shown in FIG. 3 may be any one of the first to third light emitting devices 130a, 130b, and 130c.

[0053] Referring to FIG. 3, the light-emitting element includes an element substrate 131, a first semiconductor layer 132, an active layer 133, a second semiconductor layer 134, a first contact electrode 135a, a second contact electrode 135b, an insulating film 136, a first contact pad 137a, and a second contact pad 137b.

[0054] In one embodiment, in the case of a light emitting device that emits green light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include indium gallium nitride (InGaN), gallium nitride (GaN), aluminum indium gallium nitride (AlInGaN), gallium phosphide (GaP), aluminum gallium indium phosphide (AlGaInP), and aluminum gallium phosphide (AlGaP). In one embodiment, in the case of a light emitting device that emits red light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include aluminum gallium arsenide (AlGaAs), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), and gallium phosphide (GaP). In one embodiment, in the case of a light emitting device that emits blue light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include gallium nitride (GaN), indium gallium nitride (InGaN), aluminum indium gallium nitride (AlInGaN), and zinc selenide (ZnSe).

[0055] Here, the first and second semiconductor layers 132 and 134 may be doped with impurities of opposite types, and may be n-type or p-type semiconductor layers depending on the type of impurity. For example, the first semiconductor layer 132 may be an n-type semiconductor layer and the second semiconductor layer 134 may be a p-type semiconductor layer, or conversely, the first semiconductor layer 132 may be a p-type semiconductor layer and the second semiconductor layer 134 may be an n-type semiconductor layer.

[0056] In the drawings, the first semiconductor layer 132 and the second semiconductor layer 134 are each shown as a single layer, but these layers may be multiple layers or may include a superlattice layer. The active layer 133 may include a single quantum well structure or a multiple quantum well structure, and the composition ratio of the nitride-based semiconductor is adjusted to emit a desired wavelength.

[0057] A second contact electrode 135b is disposed on the first semiconductor layer 132 where the active layer 133 and the second semiconductor layer 134 are not provided, and a first contact electrode 135a is disposed on the second semiconductor layer 134.

[0058] The first and / or second contact electrodes 135a, 135b may be formed of a single layer or multiple layers. Materials for the first and / or second contact electrodes 135a, 135b may include various metals such as Al, Ti, Cr, Ni, Au, Ag, Cu, and alloys thereof, or transparent conductive oxide layers such as ITO (indium tin oxide), ZnO, and the like.

[0059] An insulating film 136 is provided on the first and second contact electrodes 135a and 135b, and a first contact pad 137a and a second contact pad 137b are provided on the insulating film 136, which are connected to the first contact electrode 135a and the second contact electrode 135b through contact holes. In this embodiment, the first contact pad 137a is connected to the first contact electrode 135a, and the second contact pad 137b is connected to the second contact electrode 135b, but this is for convenience of explanation and is not limited thereto. For example, the second contact pad 137b may be connected to the first contact electrode 135a, and the first contact pad 137a may be connected to the second contact electrode 135b.

[0060] The first contact pad 137a and / or the second contact pad 137b may be made of a single layer or multi-layer metal. The material of the first contact pad 137a and / or the second contact pad 137b may be metal such as Al, Ti, Cr, Ni, Au, or an alloy thereof.

[0061] Although the light emitting device 130 has been briefly described with reference to the drawings in accordance with an embodiment of the present invention, the light emitting device 130 may further include layers having additional functions in addition to the above-mentioned layers, such as a reflective layer for reflecting light, an additional insulating layer for insulating certain components, a solder prevention layer for preventing diffusion of solder, and the like.

[0062] 3, the light emitting device is shown with the first and second contact pads facing upward, but when mounted on the module substrate, the light emitting device may be inverted and mounted with the first and second contact pads facing the upper surface of the module substrate. The first and second contact pads may be directly connected to wiring portions provided on the module substrate, or may be electrically connected to the wiring portions using a conductive adhesive member or the like.

[0063] Referring again to Figures 1, 2a, and 2b, in the display device 100 according to one embodiment of the present invention, a common voltage and a data signal are applied to the light emitting element 130 to turn it on, thereby emitting light, and the emitted light travels toward the bottom surface of the module substrate 120 through the lower module substrate 120.

[0064] In one embodiment of the present invention, each display module 110 has a structure connected to a wiring unit formed on a support substrate 160, among which is a conductive electrode unit 163. Various types of wiring units and circuits (e.g., various circuits for driving each pixel) may be provided on the support substrate 160, and driving signals are provided to each light emitting device 130 arranged on each display module 110 via the conductive electrode unit 163. To this end, a structure for connecting the conductive electrode unit 163 of the support substrate 160 and a wiring unit 125 on the upper surface of the module substrate 120 is provided on the module substrate 120 of the display module 110.

[0065] In one embodiment of the present invention, each module substrate 120 is provided with through holes 121 penetrating the module substrate 120. The through holes 121 may be provided in a non-pixel region other than the pixel region 111, and thus may be disposed along an edge of the module substrate 120. However, the location of each through hole 121 is not limited thereto, and although not shown, each through hole 121 may be disposed within the pixel region 111. The through holes 121 may be provided in a number that is sufficient to connect the number of light emitting elements 130 and the wiring units 125 connected to the light emitting elements 130, and an arbitrary number is shown in the drawings for convenience of explanation.

[0066] Each through hole 121 is formed to penetrate both sides of the module substrate 120. A via 123 is formed in each through hole 121. Each via 123 includes an upper pad 123a formed on the upper surface of the module substrate 120, a lower pad 123c formed on the lower surface of the module substrate 120, and an internal electrode 123b that corresponds to the inside of the through hole 121 and connects the upper pad 123a and the lower pad 123c. The upper pad 123a may be connected to a wiring portion 125 formed on the upper surface of the module substrate 120, and the lower pad 123c may be connected to the wiring portion 125 formed on the lower surface of the module substrate 120 or to a conductive electrode portion 163 of the support substrate 160.

[0067] In one embodiment of the present invention, when a driving circuit unit 150 for driving the light emitting device 130 is separately provided on the lower surface of the module substrate 120, the lower pad 123c is connected to the driving circuit unit 150 via a wiring part 125 provided on the lower surface of the module substrate 120.

[0068] FIG. 4 is a diagram illustrating a display device 100 according to an embodiment of the present invention in which a driving circuit unit 150 is separately provided on a lower surface of a module substrate 120. As shown in FIG.

[0069] 1 to 4, the driving circuit unit 150 may be provided in a single unit or in two or more units as illustrated. For example, the driving circuit unit 150 may include a first driving unit 151 and a second driving unit 153. The first and second driving units 151 and 153 are electrically connected to the lower pads 123c of the vias 123 through wiring units 125 formed on the lower surface of the module substrate 120. The first and second driving units 151 and 153 may be, for example, a scan driving unit and a data driving unit. The first and second driving units 151 and 153 may be provided in areas corresponding to the pixel regions 111 and / or non-pixel regions.

[0070] When the driving circuit unit 150 is not provided separately on the lower surface of the module substrate 120, or when it is provided but needs to be connected to an additional element, the lower pad 123c is connected to the conductive electrode unit 163 on the support substrate 160. When the lower pad 123c is connected to the conductive electrode unit 163 of the support substrate 160, the connection may be made in a form in which a conductive adhesive member 140 such as a solder paste is provided between the lower pad 123c and the conductive electrode unit 163. Alternatively, when the lower pad 123c is connected to the conductive electrode unit 163 of the support substrate 160, the connection may be made in a ball grid array manner. In this case, a solder ball may be provided between the lower pad 123c and the conductive electrode unit 163 of the support substrate 160.

[0071] The supporting substrate 160 may be formed with a wiring section including various wirings electrically connected to various elements, for example, a timing controller, a memory such as an EEPROM, circuits such as a voltage source for driving the light emitting device 130, and the conductive electrode section 163. The supporting substrate 160 may be formed with a gate driver and a data driver for applying scan signals and image signals to the scan lines and the data lines, respectively.

[0072] According to this structure, driving signals output from the driving circuit unit 150 or various elements on the supporting substrate 160 are transmitted to the light emitting element 130 through each via 123, thereby turning the light emitting element 130 on or off to display an image.

[0073] As described above, the display device 100 according to an embodiment of the present invention corresponds to a multi-module display device including a plurality of display modules 110. As an example, in FIG. 1, 4x5 display modules 110 constitute one display device 100.

[0074] In this embodiment, each or at least some of the multiple display modules 110 may be driven independently, or at least some of the display modules 110 may be driven in a dependent manner while interlocking with the remaining display modules 110. When the multiple display modules 110 are interlocked and driven, one image can be displayed.

[0075] In this embodiment, the display modules 110 are all provided with the same size, but the present invention is not limited thereto, and it is of course possible for at least one display module to be provided with a size different from that of the remaining display modules. Also, at least one display module may have a different number of pixels from that of the remaining display modules, and therefore the resolutions may also be different from that of the remaining display modules. In addition, when the resolution of all regions does not need to be the same, the display device 100 may be manufactured by arranging display modules with different resolutions.

[0076] In one embodiment of the present invention, each display module 110 may be provided in a shape other than a rectangle, and in particular, may be provided in a shape other than a square, depending on the overall shape of the display device 100. In addition, the number of the support substrate 160 and each display module 110 disposed on the support substrate 160 may vary depending on the size of the display device 100 to be manufactured.

[0077] In the display device having the above structure, when a large-area multi-module display device is manufactured, the separation of the pixel regions between adjacent display modules is minimized, thereby minimizing problems such as separation of a displayed image or the appearance of dark lines in an image. According to an embodiment of the present invention, the vias may be formed in the module substrate itself on which the light emitting elements are mounted, particularly in a non-pixel region immediately adjacent to the pixel region, or may be formed in the pixel region. As a result, in an embodiment of the present invention, since a separate device for connecting the display module and the supporting substrate does not need to be provided on the side of the module substrate, a space for mounting a separate device on the side of the module substrate is omitted, and thus the distance between two adjacent display modules may be minimized.

[0078] 5a to 5e are diagrams sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention.

[0079] 5a to 5e, a display device 100 according to one embodiment of the present invention may be manufactured by first manufacturing a plurality of display modules 110 and then arranging the plurality of display modules 110 on a supporting substrate 160.

[0080] First, the steps of manufacturing a plurality of display modules 110 will be described.

[0081] Referring to Fig. 5a, first, a mother substrate 120m is prepared. The mother substrate 120m is provided to be the same size as or larger than the display module 110. The mother substrate 120m may be formed of a light-transmitting insulating material. The mother substrate 120m may include a pixel region 111 in which each light-emitting element 130 is disposed, and a non-pixel region surrounding the pixel region 111. The non-pixel region may then be further extended outside an imaginary line 120i corresponding to the size of the display module 110.

[0082] The wiring part 125 and each light emitting element 130 are formed on the mother substrate 120m. The wiring part 125 may be formed by various methods such as plating, photolithography, etc. Each light emitting element 130 may be individually mounted through transfer, or a plurality of light emitting elements 130 may be mounted on the mother substrate 120m.

[0083] 5b, through holes 121 are formed in the non-pixel region, penetrating the upper and lower surfaces of the mother substrate 120m. The through holes 121 may be formed by laser processing. However, the method of forming the through holes 121 is not limited thereto, and it is obvious that the through holes 121 may be formed by various methods. Vias are formed in the mother substrate 120m in which the through holes 121 are formed. The vias may be easily formed by plating.

[0084] Referring to FIG. 5c, the edge of the mother substrate 120m may be cut or ground to the size of the display module 110 to be manufactured, so that each display module 110 is composed of a module substrate 120 and each light emitting element 130.

[0085] Optionally, referring to FIG. 5 d , a driving circuit unit may be disposed on the lower surface of the module substrate 120 , and each of the light emitting devices 130 may be electrically connected to the driving circuit unit through the through holes 121 .

[0086] 5e, each display module 110 completed through the above steps is disposed on a support substrate 160 and then electrically connected. A plurality of display modules 110 may be disposed along rows and columns on the support substrate 160. A conductive adhesive such as solder paste or solder balls used in a ball grid array may be disposed between the display module 110 and the support substrate 160 to electrically connect the display module 110 and the support substrate 160.

[0087] As described above, a display module can be manufactured by simply forming through holes in a module substrate and easily forming vias in the through holes, and the display module can be attached to a supporting substrate by simple soldering or a ball grid array method, making it possible to manufacture a multi-module display device in a simple and inexpensive manner.

[0088] In an embodiment of the present invention, the connection structure between the display module and the supporting substrate may be modified in various ways.

[0089] 6 and 7 are cross-sectional views showing a connection structure between a display module and a supporting substrate in a display device according to an embodiment of the present invention, each of which corresponds to FIG. 2b.

[0090] 6, according to an embodiment of the present invention, a module substrate 120 may be provided with a number of recesses 127 recessed from a lower surface of the module substrate 120. The recesses 127 may be formed by laser processing.

[0091] A connecting wire 129 may be provided in the recess 127 as a part of the wiring portion 125 formed on the lower surface of the module substrate 120. The recess 127 may be formed so that the recessed cross section has an inclined surface, or may be formed in another shape. The connecting wire 129 may be formed in the recess 127. The connecting wire 129 can be easily formed in the recess 127 by using plating, or may be formed in the recess 127 without plating, or may be formed in a region corresponding to the recess 127 and the vicinity of the recess 127 even if it is not completely disposed in the recess 127.

[0092] The connecting wire 129 may be connected to the driving circuit unit 150 provided on the lower surface of the module substrate 120, or may be connected to the supporting substrate 160 facing the lower surface of the module substrate 120. A conductive electrode unit 163 may be formed on the supporting substrate 160 in an area facing the portion where the connecting wire 129 is formed. In addition, a protrusion may be formed on the conductive electrode unit 163 of the supporting substrate 160 in an area corresponding to the recess 127 of the connecting wire 129, the protrusion being in contact with the recess 127 and electrically connected thereto. The protrusion may include a conductive material, and thus, when the protrusion and the connecting wire 129 are in contact with each other, the connecting wire 129 may be electrically connected to each wiring of the supporting substrate 160. The material of the protrusion is not particularly limited as long as it is a conductive material, and may be made of, for example, solder paste.

[0093] In one embodiment of the present invention, the connecting wire 129 may be formed using a method such as plating after the formation of the recess 127, and the protrusion may then be formed before connecting the connecting wire 129 to the supporting substrate 160.

[0094] In this embodiment, a portion of each through hole 121 may be provided in the pixel region 111, and a via 123 may be formed in each through hole 121. Each via 123 may be provided in the pixel region 111, and a portion of each via 123 may be disposed at a position overlapping each light emitting element 130. In one embodiment of the present invention, each via 123 may be provided in a region where the first and second contact pads of each light emitting element 130 are formed.

[0095] Thus, the first and second contact pads of each light emitting element 130 may be connected to the connecting wire 129 provided on the lower surface of the module substrate 120 by each via 123 disposed in the pixel region 111. Each through hole 121 and each via 123 may be formed in a non-pixel region other than the pixel region 111 as in the above-described embodiment, and some of each through hole 121 and each via 123 may be formed in a region corresponding to the recess 127 in the pixel region 111.

[0096] 7, the support substrate 160 is provided on a surface facing the module substrate 120 and has holes corresponding to the through holes 121, and the vias 123 are provided integrally with the through holes 121 and may contact the conductive electrode portion 163. Here, the support substrate 160 may have a side portion 163b and a top portion 163a to easily make electrical contact with the vias 123.

[0097] In this embodiment, a hole may be formed in a position corresponding to the through hole 121 on the upper surface of the support substrate 160, and then the through hole 121 and the via 123 may be formed in the hole. The via 123 may be formed by filling the through hole 121 and the hole with a conductive material, or may be formed by forming the via 123 with a separate material and then inserting it into the through hole 121 and the hole.

[0098] FIG. 8 is a structural diagram showing a display device according to an embodiment of the present invention.

[0099] 8, the display device according to an embodiment of the present invention includes pixels implemented by a timing controller 155, a first driver 151, a second driver 153, a wiring unit, and first to third light emitting elements 130a, 130b, and 130c. In an embodiment of the present invention, the first driver 151 and the second driver 153 may be a scan driver and a data driver, respectively, and will be referred to as a scan driver and a data driver in the following description.

[0100] Each pixel is individually connected to a scan driver 151, a data driver 153, etc. through a wiring portion.

[0101] The timing controller 155 receives various control signals and image data required to drive the display device from an external source (e.g., a system that transmits image data). The timing controller 155 rearranges the received image data and transmits it to the data driver 153. The timing controller 155 also generates scan control signals and data control signals required to drive the scan driver 151 and the data driver 153, and transmits the generated scan control signals and data control signals to the scan driver 151 and the data driver 153, respectively.

[0102] The scan driver 151 receives a scan control signal from the timing controller 155 and generates a scan signal in response thereto.

[0103] The data driver 153 receives a data control signal and image data from the timing controller 155 and generates a data signal in response thereto.

[0104] The wiring unit includes a number of signal wirings. Specifically, the wiring unit includes a first wiring 103 connecting the scan driver 151 and each pixel, and a second wiring 102 connecting the data driver 153 and each pixel. In one embodiment of the present invention, the first wiring 103 may be each scan line, and the second wiring 102 may be each data line. In addition, the wiring unit further includes each wiring that connects between the timing controller 155 and the scan driver 151, the timing controller 155 and the data driver 153, or each other component and transmits corresponding signals.

[0105] Each scan line 103 provides each pixel with a scan signal generated by the scan driver 151. A data signal generated by the data driver 153 is output to each data line 102. The data signal output to each data line 102 is input to each pixel of a horizontal display module 110 line selected by the scan signal.

[0106] Each pixel is connected to each scan line 103 and each data line 102. When a scan signal is supplied from each scan line 103, each pixel selectively emits light in response to a data signal input from each data line 102. For example, during each frame period, each pixel emits light with a luminance corresponding to the input data signal. Each pixel that receives a data signal corresponding to black luminance displays black by not emitting light during the corresponding frame period.

[0107] In an embodiment of the present invention, each pixel may be driven in a passive or active manner. When the display device is driven in an active manner, the display device may be driven by being supplied with first and second pixel power sources in addition to the scan signals and data signals.

[0108] In an embodiment of the present invention, the light emitting elements may be arranged in various configurations within a pixel region to form a pixel unit.

[0109] FIG. 9 is a plan view showing that light emitting devices are arranged in a different manner from the above-described embodiment in accordance with an embodiment of the present invention, and shows a portion corresponding to P1 in FIG.

[0110] Referring to FIG. 9, a plurality of light emitting devices 130 may be provided in the pixel region 111 of the module substrate 120. The plurality of light emitting devices 130 may be arranged in various shapes to form a pixel unit. In the embodiment disclosed in FIG. 2a, one pixel unit is composed of first to third light emitting devices 130a, 130b, and 130c, and the first to third light emitting devices 130a, 130b, and 130c are arranged in a triangular shape. In another embodiment of the present invention, as shown in FIG. 9, a plurality of light emitting devices 130 may be arranged in a matrix. For example, when the pixel unit is composed of the first to third light emitting devices 130a, 130b, and 130c, the first to third light emitting devices 130a, 130b, and 130c may be arranged alternately along rows or columns, or may be arranged alternately along both rows and columns. In another example, when a pixel unit is composed of first to third light-emitting elements, when the first to third light-emitting elements are arranged, the first light-emitting element, the second light-emitting element, and the third light-emitting element may be arranged in a form in which they are sequentially repeated along a row or column, or may be arranged in a form in which they are all repeated along both the row and the column.

[0111] Figure 10a is a plan view showing that light emitting devices are arranged in a form different from that of the above-described embodiment in an embodiment of the present invention, and shows a portion corresponding to P1 in Figure 1. Figure 10b is a schematic diagram showing the light emitting device shown in Figure 10a.

[0112] 10a, a plurality of light emitting devices 230 are provided in the pixel region 111 of the module substrate 120, and each light emitting device forms one pixel unit. Each light emitting device 230 may include a plurality of epitaxial stacks emitting light of different colors. For example, each light emitting device 230 may include first to third epitaxial stacks 231, 233, and 235 as three layers stacked in sequence, as shown in FIG. 10b.

[0113] Each epitaxial stack can emit color light in the visible light band among light in many wavelength bands. The first epitaxial stack 231 can emit a first color light, the second epitaxial stack 233 can emit a second color light, and the third epitaxial stack 235 can emit a third color light. Here, the first to third color lights may correspond to different color lights, and the first to third color lights may be color lights in different wavelength bands having successively shorter wavelengths. That is, the first to third color lights may have different wavelength bands, and may be color lights in short wavelength bands having higher energy from the first color light to the third color light. In this embodiment, the first color light may be red light, the second color light may be green light, and the third color light may be blue light. However, the order of the first, second and third color lights is not limited thereto, and may be provided in a different order according to the stacking order of the first, second and third epitaxial stacks 231, 233 and 235.

[0114] In this way, when one pixel unit is manufactured in a stacked type, only one light-emitting stack needs to be mounted instead of multiple light-emitting elements, so that a larger number of pixel units can be included in a unit area, and the manufacturing method is significantly simplified.

[0115] FIG. 11 is a schematic plan view showing another arrangement of light emitting devices according to an embodiment of the present invention.

[0116] 11, the light emitting elements 130 (130a, 130b, 130c) according to this embodiment are arranged on the display module 110 as described with reference to FIG 9. However, the light emitting elements 130a, 130b, 130c may be disposed on an auxiliary substrate 141 and arranged on the display module 110, so that the pixel unit 113 includes the auxiliary substrate 141. The auxiliary substrate 141 may be, for example, but is not limited to, a sapphire substrate.

[0117] Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art or those with ordinary knowledge in the relevant technical field that the present invention can be modified and changed in various ways without departing from the spirit and technical scope of the present invention as set forth in the claims below.

[0118] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims. [Explanation of symbols]

[0119]

[0120] 100 Display device 110 Display module

[0121] 111 pixel area 113 pixel unit

[0122] 120 Module board 121 Through hole

[0123] 123 Via 125 Wiring section

[0124] 127 Depression 129 Connecting wiring

[0125] 130 Light emitting element 140 Conductive adhesive member

[0126] 150 Drive circuit section 155 Timing control section

[0127] 160 supporting substrate 163 conductive electrode portion

Claims

1. An optical module including a module substrate and a plurality of light sources disposed on the module substrate; and a driver circuit electrically connected to the light module and configured to control the plurality of light sources; The module substrate includes: an upper surface on which the plurality of light sources are arranged, and a lower surface opposite to the upper surface; a plurality of first wirings disposed on the top surface; a first region including at least one of the plurality of first wirings and at least one of the plurality of light sources; a second region surrounding the first region; and a hole disposed in the module substrate; and a via disposed in the hole; At least one of the holes and the vias is disposed on the second region; the module substrate includes a plurality of second wirings disposed on the lower surface, the module substrate includes a plurality of recesses formed on the lower surface, and at least one of the plurality of second wirings is disposed within the recesses. Display module.

2. The display module according to claim 1 , wherein at least one of the plurality of first wirings is disposed on a region corresponding to the first region.

3. The display module according to claim 1 , wherein at least one of the plurality of first wirings is disposed on a region corresponding to the second region.

4. The display module according to claim 1 , wherein at least one of the plurality of second wirings is disposed on a region corresponding to the first region.

5. The display module according to claim 1 , wherein at least one of the plurality of second wirings is disposed on a region corresponding to the second region.

6. The display module of claim 1 , wherein the holes and vias are disposed on the second region.

7. an optical module including a module substrate and a plurality of light sources disposed on the module substrate; and a driver circuit electrically connected to the light module and configured to control the plurality of light sources, The module substrate includes: an upper surface on which the plurality of light sources are arranged, and a lower surface opposite to the upper surface; a plurality of first traces disposed on the top surface; a plurality of second traces disposed on the lower surface; a first region including at least one of the plurality of first wirings and at least one of the plurality of light sources; and a second region surrounding the first region; At least one of the plurality of second wirings is disposed on a region corresponding to the first region; A display device, wherein the module substrate includes a plurality of recesses formed on the lower surface, and at least one of the plurality of second wirings is disposed within the recess.

8. The display device according to claim 7 , further comprising a hole disposed in the module substrate, and a via disposed in the hole.

9. The display device according to claim 8 , wherein at least one of the holes and the vias is disposed on the second region.

10. The display device according to claim 7 , wherein at least one of the plurality of first wirings is disposed on a region corresponding to the first region.

11. 8. The display device according to claim 7, wherein at least one of the plurality of first wirings is disposed on a region corresponding to the second region.

12. The display device according to claim 7 , wherein at least one of the plurality of second wirings is disposed on a region corresponding to the second region.

13. an optical module including a module substrate and a plurality of light sources disposed on the module substrate; and a driver circuit electrically connected to the light module and configured to control the plurality of light sources, The module substrate includes: an upper surface on which the plurality of light sources are arranged, and a lower surface opposite to the upper surface; a plurality of first traces disposed on the top surface; a plurality of second traces disposed on the lower surface; a first region including at least one of the plurality of first wirings and at least one of the plurality of light sources; and a second region surrounding the first region; At least one of the plurality of second wirings is disposed on a region corresponding to the second region; A display device, wherein the module substrate includes a plurality of recesses formed on the lower surface, and at least one of the plurality of second wirings is disposed within the recess.

14. The display device of claim 13 , further comprising a hole disposed in the module substrate, and a via disposed in the hole.

15. The display device according to claim 14 , wherein at least one of the holes and the vias is disposed on the second region.

16. The display device according to claim 13 , wherein at least one of the plurality of first wirings is disposed on a region corresponding to the first region.

17. The display device according to claim 13 , wherein at least one of the plurality of first wirings is disposed on a region corresponding to the second region.

18. 14. The display device according to claim 13, wherein at least one of the plurality of second wirings is disposed on a region corresponding to the first region.

19. The display device according to claim 14 , wherein the holes and vias are disposed on the second region.

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