Cover Type Antenna

Abstract

An antenna according to an embodiment of the present invention includes a first radiating portion formed in a cover shape on a first surface of a printed circuit board, and a second radiating portion extending from one end of the first radiating portion through the printed circuit board to a second surface of the printed circuit board, the second radiating portion including a radiation pattern on the second surface of the printed circuit board, and the radiation pattern being spaced a predetermined distance from a ground pattern formed on the first surface of the printed circuit board or inside the printed circuit board.

Description

[Technical field]

[0001] The present invention relates to an antenna, and more particularly to a cover-type antenna including a capacitance auxiliary pattern. [Background technology]

[0002] In a normal antenna configuration, the length must be designed to be 1 / 4 of the wavelength. For example, in the case of a 2.4 GHz frequency, the antenna length must be approximately 32 mm line length, taking into account the wavelength. A certain amount of space from the ground (GND) is also required. In the case of a small antenna required for a short-range small communication module, the antenna must also be configured to be small in size in accordance with the miniaturization.

[0003] Conventional products use PCB patterns to adjust the line length, sash-type antennas that are large in size, or chip antennas. The problem with each of these is that they are not suitable for miniaturization, and chip antennas, in particular, have a disadvantage in terms of cost. Summary of the Invention [Problem to be solved by the invention]

[0004] The technical problem to be solved by the present invention is to provide a cover type antenna including a capacitance auxiliary pattern.

[0005] The object of the present invention is not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0006] In order to solve the above technical problems, an antenna according to an embodiment of the present invention includes a first radiating portion formed in a cover shape on a first surface of a printed circuit board, and a second radiating portion extending from one end of the first radiating portion through the printed circuit board to another surface of the printed circuit board, the second radiating portion including a radiation pattern on the second surface of the printed circuit board, and the radiation pattern is spaced a predetermined distance from the first surface of the printed circuit board or a ground pattern formed inside the printed circuit board.

[0007] The printed circuit board may include a plurality of layers, and the ground pattern may be formed on one of the layers.

[0008] In addition, the printed circuit board may include a plurality of layers, and no ground may be formed between the radiation pattern and the ground pattern.

[0009] Also, the radiation pattern may be capacitively coupled to the ground pattern.

[0010] Also, the frequency of the radiation signal can be changed depending on the distance between the radiation pattern and the ground pattern.

[0011] Also, the frequency of the radiation signal can be changed according to the length of the radiation pattern.

[0012] The second radiating portion may include a connecting portion that is connected to a radiating portion of another board on which the antenna is mounted.

[0013] Furthermore, the board on which the antenna is mounted may not have a ground formed in the radiation direction of the radiation pattern.

[0014] The first radiating portion may include a feed portion that receives a signal from the printed circuit board, and a ground portion that is connected to a ground of the printed circuit board.

[0015] The first radiating portion may include one or more supporting portions soldered onto the printed circuit board to support the first radiating portion.

[0016] Also, there may be a case where no ground is provided between the lower part of the support portion and the second surface of the printed circuit board. Effect of the Invention

[0017] According to the embodiment of the present invention, the shield can part that is usually used can be designed as an antenna, which reduces the area required for a separate antenna design, making it smaller and reducing costs. Also, antenna optimization is possible through capacitance patterning signal lines to maximize the fine tuning and radiation effect in resonance point design. Furthermore, additional auxiliary patterns can be inserted into application boards that use additional modules, making it possible to fine-tune in various lamination and dielectric constant environments of various types of application PCBs.

[0018] This makes it possible to realize an ultra-small sash antenna integrated module, increase efficiency with additional auxiliary patterns for antenna length and performance, and easily debug and supplement resonance points that change depending on various application environments, such as fixtures, metals, bodies, PCB stacking, and dielectric constants.

[0019] The effects of the present invention are not limited to the above-mentioned examples, and more diverse effects are included in the present specification. [Brief description of the drawings]

[0020] [Figure 1] 1 illustrates an antenna according to one embodiment of the present invention. [Diagram 2] 1 illustrates an antenna according to an embodiment of the present invention mounted on another board. [Diagram 3] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. [Figure 4] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. [Figure 6] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. [Figure 7] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. [Figure 8] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. [Figure 9] FIG. 2 is a diagram for explaining an antenna according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0022] However, the technical concept of the present invention is not limited to the described embodiments, but may be embodied in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0023] Furthermore, unless otherwise clearly and specifically defined, terms (including technical and scientific terms) used in the embodiments of the present invention are to be interpreted as meanings that are commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and commonly used terms such as predefined terms should be interpreted in light of the contextual meaning of the relevant art.

[0024] Furthermore, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0025] In this specification, the singular can include the plural unless otherwise specified in the context, and when it is stated that "A and (and) at least one (or more) of B and C" is used, it can include one or more of all possible combinations of A, B, and C.

[0026] In addition, in describing components of the embodiments of the present invention, terms such as 1, 2, A, B, (a), (b), etc. are used to distinguish the components from other components, and the terms are not intended to limit the nature, order, or sequence of the components.

[0027] Furthermore, when a component is described as being 'coupled', 'coupled', or 'connected' to another component, this includes not only the case where the component is directly 'coupled', 'coupled', or 'connected' to the other component, but also the case where the component is 'coupled', 'coupled', or 'connected' by another component between the component and the other component.

[0028] In addition, when described as being formed or disposed "above" or "below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more additional components are formed or disposed between the two components. In addition, when described as "above" or "below", it can include not only the upper direction but also the lower direction based on one component.

[0029] FIG. 1 illustrates an antenna according to one embodiment of the present invention.

[0030] The antenna according to the embodiment of the present invention includes a first radiating part 110 and a second radiating part 120 .

[0031] The first radiating part 110 is formed in the form of a cover on a first surface 131 of the printed circuit board 130 .

[0032] More specifically, the first radiating unit 110 is formed on the printed circuit board 130 in a form of covering the printed circuit board 130 and radiates a signal to the outside. Here, the printed circuit board 130 may be a SIP (System In Package) communication module, or may be a short-range wireless communication module such as BT (Bluetooth (registered trademark)), BLE (low power Bluetooth), WiFi (wi-fi), etc. Of course, it may be various other communication modules. As a module performing short-range wireless communication, it may be a small communication module. The first radiating unit 110 serves as a shield cover to protect the printed circuit board 130 and at the same time radiates a signal. For this, the first radiating unit 110 may be formed of metal. By being formed of metal, it is possible to protect the printed circuit board 130 and radiate a signal at the same time.

[0033] The first radiating part 110 is formed in a cover shape, and is spaced apart from the first surface 131 of the printed circuit board 130 by a predetermined distance, and is formed in a shape that covers the first surface 131 of the printed circuit board 130. The first radiating part 110 may include a feed part 111 that receives a signal from the printed circuit board 130 and a ground part 112 that is connected to the ground of the printed circuit board 130 for signal radiation. A signal is input by applying a current through the feed part 111, and the current applied to the ground part 112 exits, and the signal is radiated through the first radiating part 110 formed in a meander shape as shown in FIG.

[0034] The first radiating portion 110 may include one or more supporting portions 113, 114, and 115 that are soldered onto the printed circuit board 130 to maintain the shape of the cover and support the first radiating portion 110. One of the supporting portions 113, 114, and 115, 113, is connected to the second radiating portion 120 described below, and the other supporting portions 114 and 115 are soldered and connected to the printed circuit board 130, and may be formed to be insulated without being connected to ground or other components.

[0035] The first radiating part 110 can simultaneously perform the role of covering the printed circuit board 130 and the role of radiating, thereby eliminating the need for a separate radiation structure for signal radiation, which is advantageous for miniaturization. In addition, when forming a radiating part, a spatial constraint occurs in which other components must not be placed within a certain distance so that they do not affect the radiation, but by realizing the radiating part in the form of a cover for the printed circuit board 130, the spatial constraint can be reduced and the degree of freedom in design can be increased.

[0036] The second radiating portion 120 extends from one end 113 of the first radiating portion 110 through the printed circuit board 130 to a second surface 132 of the printed circuit board 130 .

[0037] More specifically, the second radiating portion 120 extends from the first radiating portion 110, penetrating the printed circuit board 130 to the second surface 132 of the printed circuit board 130. The second radiating portion 120 may be formed by extending from one of the supporting portions 113, 114, and 115 of the first radiating portion 110 described above.

[0038] The second radiating portion 120 may include a through-hole 122 penetrating the printed circuit board 130 and a radiation pattern 121 formed on the second surface of the printed circuit board 130. The second radiating portion 120 is electrically connected to the first radiating portion 110, and a current applied to the first radiating portion 110 also flows to the second radiating portion 120, thereby radiating a signal. Thus, radiation is performed from both the first radiating portion 110 and the second radiating portion 120. The first radiating portion 110 is formed on the first surface 131 of the printed circuit board 130, and the second radiating portion 120 is formed on the second surface 132 of the printed circuit board 130, and bidirectional radiation is performed from the first radiating portion 110 and the second radiating portion 120. Bidirectional radiation can increase radiation efficiency and improve the directionality of radiation, and can increase radiation efficiency even in an environment with limited radiation space.

[0039] The first radiating portion 110 is formed in the form of a cover for the printed circuit board 130, but the length of the radiating portion that can be realized by the first radiating portion 110 is limited according to the size of the printed circuit board 130. Even if a pattern is formed in a meander shape as shown in FIG. 2, the total length of the radiating portion is limited due to the area limit. The second radiating portion 120 is connected to the first radiating portion 110 and extends through the printed circuit board 130, thereby extending the total length of the radiating portion and resolving the length restriction. The second radiating portion 120 is embodied by the length of the through-hole 122 that penetrates the printed circuit board 130, that is, the thickness of the printed circuit board 130 and the length of the radiating pattern 121 formed on the second surface 132 of the printed circuit board 130, and the length of the entire radiating portion can be secured by the length of the second radiating portion 120. The frequency of the radiating signal can be changed according to the length of the radiating pattern 121. The frequency of the radiating signal is affected by the total length of the radiating portion. The length of the first radiating part 110 is difficult to adjust due to spatial constraints, whereas the length of the radiation pattern 121 is easy to adjust. However, the length of the radiation pattern 121 can be adjusted according to design depending on the frequency of the signal to be radiated.

[0040] Also, the radiation pattern 121 is formed on the second surface 132 of the printed circuit board 130, and may be formed at a predetermined distance from the first surface 131 of the printed circuit board 130 or from the ground pattern 133 formed inside the printed circuit board 130. The radiation pattern 121 is formed at a predetermined distance from the ground pattern 133, so that the radiation pattern 121 and the ground pattern 133 may form a capacitance coupling. The frequency of the radiation signal varies depending on the resonance point of the radiation part, and the resonance point of the radiation part is affected by the inductance component and the capacitance component formed in the radiation part. The radiation pattern 121 can be adjusted for the resonance point by forming a capacitance coupling with the ground pattern 133. The capacitance is affected by the distance and area of ​​the two patterns, and the frequency of the radiation signal may vary depending on the distance between the radiation pattern 121 and the ground pattern 133.

[0041] The ground pattern 133 may be formed on or inside the first surface 131 of the printed circuit board 130. Here, the ground pattern 133 may be a pattern connected to a ground formed to correspond to the radiation pattern 121. The ground pattern 133 may be formed to correspond to the shape of the radiation pattern 121, or may be formed in a wide plate shape, or may be formed in various other shapes.

[0042] When the ground pattern 133 is formed on the first surface 131 of the printed circuit board 130, the printed circuit board 130 may be formed to a predetermined thickness, and the radiation pattern 121 may be formed on the second surface 132 of the printed circuit board 130, but the radiation pattern 121 and the ground pattern 133 may be formed to be spaced apart by the thickness of the printed circuit board 130. That is, the frequency of the radiation signal may change depending on the thickness of the printed circuit board 130.

[0043] The ground pattern 133 may be formed inside the printed circuit board 130, not on the first surface 131 of the printed circuit board 130. In this case, the printed circuit board 130 includes a plurality of layers, and the ground pattern may be formed on one of the layers. The printed circuit board 130 may be formed by stacking a plurality of printed circuit boards, each of which is not a single printed circuit board, and the ground pattern 133 may be formed on one of the layers. When the ground pattern 133 is formed on the top layer of the printed circuit board 130, it can be said that the top layer of the printed circuit board 130 corresponds to the first surface of the printed circuit board 130, and the ground pattern 133 is formed on the first surface 131 of the printed circuit board 130.

[0044] When the printed circuit board 130 is formed in a plurality of layers, a ground may not be formed between the radiation pattern 121 and the ground pattern 133. The radiation pattern 121 and the ground pattern 133 are separated from each other and are capacitively coupled. When a ground is formed between the radiation pattern 121 and the ground pattern 133, it may affect the capacitance coupling between the radiation pattern 121 and the ground pattern 133. In order to improve the accuracy of the resonance point design and the radiation efficiency, a ground may not be formed in the corresponding area of ​​the layer located between the radiation pattern 121 and the ground pattern 133. The corresponding space can be opened without forming other configurations such as a signal line other than the ground. For example, as shown in FIG. 1, when the printed circuit board 130 is formed in four layers, the radiation pattern 121 is formed on the second surface 132 of the printed circuit board 130, and the ground pattern 133 is formed on the first surface 131 of the printed circuit board 130, i.e., the fourth layer, a ground may not be formed in the corresponding area of ​​the second and third layers.

[0045] The first radiating portion 110 formed as above and the second radiating portion 120 extending from the first radiating portion 110 can be expressed as an equivalent circuit as shown in FIG. 3. The entire radiating portion is connected to the feed portion 111 and the ground portion 112. When only the first radiating portion 110 is formed, there is a limit to the length that can be physically realized in the total length L1 of the first radiating portion 110. For example, when the length required for L1 to radiate a signal is 32 mm, even if it is designed in a meander shape within a module space of 6×4 mm, which is the area of ​​the cover of the printed circuit board 130, only a length of about 18 mm, which is half the length, can be realized, making it difficult to realize a desired frequency of the radiation signal. However, by connecting the second radiating portion 120, the length of L1 can be extended to realize a desired frequency of the radiation signal, and by including the radiation pattern 121 that is capacitively coupled with the ground pattern 133, the length of the radiation portion can be extended and a resonance point can be designed by a capacitance component, so that an improvement in radiation efficiency performance can be expected.

[0046] As described above, the first radiating portion 110 has one or more supports 113, 114, and 115. When a ground is formed under the supports 114 and 115 that are not connected to the second radiating portion 120, capacitance coupling is performed between the supports 114 and 115 and the ground under the supports. The resonance point can be adjusted using the capacitance coupling performed by the supports 114 and 115, or conversely, the resonance point adjustment using the capacitance coupling can be realized by the radiation pattern 121, and the influence of the capacitance coupling in the supports 114 and 115 can be minimized. For this, a ground may not be formed between the lower part of the supports 114 and 115 and the second surface 132 of the printed circuit board 130. By not forming a ground between the lower part of the supports 114 and 115 and the second surface 132 of the printed circuit board 130, the capacitance coupling generated by the supports 114 and 115 can be fixed, and it is easy to adjust the resonance point using the radiation pattern 121.

[0047] When the printed circuit board 130 is formed in a plurality of layers, for example, when the printed circuit board 130 is formed in four layers, each layer may be embodied as shown in Figs. 4 to 7. The first surface 131 of the printed circuit board 130 on which the first radiating portion 110 is formed, i.e., the fourth layer, may have a configuration required for a communication module as shown in Fig. 4. Also, a feed terminal 411 connected to the first radiating portion 110 and the feed portion 111, and a ground terminal 412 connected to the ground portion 112 may be formed, regions 414 and 415 to which the support portions 114 and 115 are soldered may be formed, and a region 413 to which the first radiating portion 110 and the second radiating portion 120 are connected may be formed. The third and second layers may have through holes penetrating the layers as shown in Figs. 5 and 6. The first layer, i.e., the second surface 132 of the printed circuit board 130, may have a configuration required for a communication module as shown in Fig. 7, and a through portion 713 and a radiation pattern 721 of the second radiating portion 120 may be formed. The radiation pattern 121 may be capacitively coupled to a ground pattern 510 formed on the third layer as shown in FIG. 5, and no ground may be formed on the second layer between the first and third layers as shown in FIG. 6.

[0048] The antenna formed as described above can be mounted on an application board 200 as shown in FIG. 2 and operate as a communication module. In this case, the second radiating part 120 can include a connecting part connected to the radiating parts 201 and 202 of another board 200 on which the antenna is mounted. The second radiating part 120 can form a connecting part that can be connected to the radiating parts 201 and 202 formed on the corresponding board 200 so that the total length of the radiating part does not end at its own radiation pattern 121, but can be extended in the other board 200 on which the antenna is mounted. When the antenna is mounted on the application board 200, the radiation characteristics of the antenna may be affected by the characteristics of the application board 200. Therefore, a connecting part can be provided so that the radiation characteristics can be finely adjusted according to the characteristics of the application board 200.

[0049] The radiating parts 201 and 202 of the application board may be connected to the second radiating part 120 as shown in Fig. 8. The radiating part of the application board may include a penetration part 201 penetrating the application board and a radiation pattern 202. The radiation pattern 202 of the application board may be capacitively coupled to the ground pattern 133, and the radiation characteristics may be adjusted according to the shape of the radiation pattern 202 of the application board.

[0050] The shape of the printed circuit board of the antenna connected to the radiating part of the application board may be embodied as shown in Fig. 9. The first radiating part 110 is connected to the second radiating part 120 by penetrating the first surface 131 of the printed circuit board 130 as shown in Fig. 9(a), and the radiation pattern 121 of the second radiating part 120 is formed on the second surface of the printed circuit board 130 as shown in Fig. 9(b). The radiating part of the application board is connected to the radiation pattern of the second radiating part 120 as shown in Fig. 9(c), and the radiating part of the application board may penetrate the application board to form a radiation pattern on the other surface as shown in Fig. 9(d). This makes it easy to adjust the radiation characteristics.

[0051] When the antenna is mounted on an application board, the application board is located in the radiation direction of the second radiating part 120, but the configuration of the application board may affect the radiation of the second radiating part 120. Therefore, in order to increase the radiation efficiency of the second radiating part 120, the board on which the antenna is mounted may not have a ground formed in the radiation direction of the radiation pattern.

[0052] This allows additional auxiliary patterns to be implemented on the application board, enabling fine tuning of radiation characteristics in various laminate and dielectric constant environments of the printed circuit boards that make up various types of application boards. Therefore, it is easy to debug and complement resonance points that change depending on the environment of various applications, i.e., equipment, metal, body, PCB laminate, dielectric constant, etc.

[0053] As described above, the present invention has been described using specific details such as concrete components, limited embodiments, and drawings. However, this is merely provided to assist in a more general understanding of the present invention, and the present invention is not limited to the above embodiments. Those skilled in the art to which the present invention pertains can make various modifications and variations from the position measurement described above.

[0054] Therefore, the concept of the present invention should not be limited to the described embodiments, and all things that are equivalent to the scope of the claims or have equivalent variations can be said to belong to the scope of the concept of the present invention, not just the scope of the claims described below.

Claims

1. a first radiating portion formed apart from a first surface of the printed circuit board; a second radiating portion extending from one end of the first radiating portion through the printed circuit board to a second surface of the printed circuit board, the second radiating portion includes a radiation pattern on a second surface of the printed circuit board; the radiation pattern is spaced a predetermined distance from a ground pattern formed on a first surface of the printed circuit board or inside the printed circuit board; The first radiating portion is a feed section for receiving a signal input from the printed circuit board; a ground portion connected to a ground of the printed circuit board.

2. The printed circuit board includes a plurality of layers; The antenna according to claim 1 , wherein the ground pattern is formed on one of the plurality of layers.

3. The printed circuit board includes a plurality of layers; 3. The antenna according to claim 1, wherein no ground is formed between said radiation pattern and said ground pattern.

4. The antenna according to any one of claims 1 to 3, wherein the radiation pattern is capacitively coupled to the ground pattern.

5. 5. The antenna according to claim 1, wherein the frequency of a radiated signal varies depending on the distance between the radiation pattern and the ground pattern.

6. An antenna as claimed in any one of claims 1 to 5, wherein the frequency of the radiated signal varies depending on the length of the radiation pattern.

7. The antenna according to claim 1 , wherein the second radiating portion includes a connecting portion that is connected to a radiating portion of another board on which the antenna is mounted.

8. 8. The antenna according to claim 1, wherein another board on which the antenna is mounted has no ground formed in the radiation direction of the radiation pattern.

9. The antenna according to claim 1 , wherein the first radiating portion includes one or more supports soldered onto the printed circuit board for supporting the first radiating portion.

10. The antenna according to claim 9 , wherein no ground is formed between the lower part of the support and the second surface of the printed circuit board.

11. The antenna of claim 7 , wherein the other board comprises an application board.

12. The antenna according to any one of claims 1 to 11, wherein the first radiating portion is formed in a meander shape.

13. A printed circuit board; a first radiating portion formed apart from a first surface of the printed circuit board; a second radiating portion extending from one end of the first radiating portion through the printed circuit board to a second surface of the printed circuit board, the second radiating portion includes a radiation pattern on a second surface of the printed circuit board; the radiation pattern is spaced a predetermined distance from a ground pattern formed on a first surface of the printed circuit board or inside the printed circuit board; The first radiating portion is a feed section for receiving a signal input from the printed circuit board; a ground portion coupled to the ground of the printed circuit board.

14. The printed circuit board includes a plurality of layers; The communication module according to claim 13 , wherein the ground pattern is formed on one of the plurality of layers.

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