Resin composition, resin sheet, security card, and method for producing resin composition

Abstract

To provide a resin composition in which an antistatic agent is thoroughly dispersed in a thermoplastic resin and which has low surface resistivity, a resin sheet formed from the resin composition, a security card, and a method for producing a resin composition.SOLUTION: A resin composition includes a thermoplastic resin (A) and an antistatic agent (B), wherein the thermoplastic resin (A) includes at least one of polycarbonate resin and amorphous polyester resin, and the antistatic agent (B) is a compound represented by formula (1). Formula (1): [(R1)3R2P]+ (R3SO2)(R4SO2)N-, R1 and R2 each independently represent a C5 or higher alkyl group, and R3 and R4 each independently represent a C1-4 perfluoroalkyl group.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition, a resin sheet, a security card, and a method for producing a resin composition. [Background technology]

[0002] Resin sheets are used as security cards, electronic passports, and the like. During the manufacturing stage and processing stage after manufacturing, such a resin sheet inevitably comes into contact with members of the manufacturing and processing equipment, for example, members made of materials such as metal, rubber, and resin, and friction may occur between the members during this contact. This contact (dynamic contact) accompanied by friction causes the resin sheet to become charged. If the degree of this charging is high, it may cause problems in handling the resin sheet during various steps during and after manufacturing. Specifically, this may be to prevent problems such as ink repellency during printing and to prevent the film from getting stuck when handling it.

[0003] In order to prevent such static electricity, Patent Document 1 discloses an antistatic sheet having a thickness of 20 to 500 μm, which includes a sheet member containing a thermoplastic resin, a phosphonium salt compound represented by the following general formula (1), and a polymeric phosphorus-based compound represented by the following general formula (2). [(R 1 )3R 2 P] + ·(R f 1 SO2)(R f 2 SO2)N - (1) (In the general formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms, and R 2 represents an alkyl group having 8 to 20 carbon atoms, and R f 1 and R f 2 may be the same or different and represent a perfluoroalkyl group having 1 to 4 carbon atoms.) [ka] (In the general formula (2), X and Y each independently represent a substituted or unsubstituted aryl group having 6 to 20 carbon atoms.)

[0004] Furthermore, Patent Documents 2 and 3 also describe blending the antistatic agent described in Patent Document 1 above with a polycarbonate resin. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2016-108424 A [Patent Document 2] JP 2011-056678 A [Patent Document 3] JP 2014-129488 A Summary of the Invention [Problem to be solved by the invention]

[0006] As described above, it is known that the antistatic agent described in Patent Document 1 is blended with polycarbonate resin to prevent static electricity and reduce the surface resistivity. However, the inventors have conducted research and found that the antistatic agent described in Patent Document 1 has insufficient dispersibility. When the dispersibility is reduced, the content of the antistatic agent increases in order to achieve a sufficiently low surface resistivity. When the content of the antistatic agent is high, it may have a negative effect on the inherent physical properties of the polycarbonate resin. The present invention aims to solve the above-mentioned problems, and to provide a resin composition in which an antistatic agent is sufficiently dispersed in a thermoplastic resin and which has low surface resistivity, as well as a resin sheet, a security card, and a method for producing the resin composition formed from the resin composition. [Means for solving the problem]

[0007] In view of the above-mentioned problems, the present inventors have conducted research and found that the above-mentioned problems can be solved by using a specific ionic compound as an antistatic agent. <1> Preferably, <2> ~ <15> Thus, the above problem was solved. <1> A resin composition comprising a thermoplastic resin (A) and an antistatic agent (B), wherein the thermoplastic resin (A) comprises at least one of a polycarbonate resin and an amorphous polyester resin, and the antistatic agent (B) is a compound represented by the following formula (1): [(R 1 )3R 2 P] + ·(R 3 SO2)(R 4 SO2)N - (1) In formula (1), R 1 and R 2 each independently represents an alkyl group having 5 or more carbon atoms; R 3 and R 4 each independently represents a perfluoroalkyl group having 1 to 4 carbon atoms. <2> In the formula (1), R 1 At least one of and R 2 and are alkyl groups having different carbon numbers; <1> The resin composition according to claim 1. <3> In the formula (1), R 1 is an alkyl group having 6 to 9 carbon atoms, and R 2 is a linear alkyl group having 10 to 16 carbon atoms; <1> or <2> The resin composition according to claim 1. <4> In the formula (1), R 3 and R 4 each independently represents a perfluoroalkyl group having 1 or 2 carbon atoms; <1> ~ <3> 10. The resin composition according to claim 9 . <5> In the formula (1), R 1 is an alkyl group having 6 to 9 carbon atoms, and R 2 is a linear alkyl group having 10 to 16 carbon atoms, and R 3 and R 4 each independently represents a perfluoroalkyl group having 1 or 2 carbon atoms; <1> The resin composition according to claim 1. <6> The content of the antistatic agent (B) is 0.1 to 1.0% by mass of the resin composition. <1> ~ <5> 10. The resin composition according to claim 9 . <7> The content of the antistatic agent (B) is 0.3 to 0.8% by mass of the resin composition. <1> ~ <5> 10. The resin composition according to claim 9 . <8> The antistatic agent (B) has a melting point of 0° C. or lower as measured by differential scanning calorimetry. <1> ~ <7> 10. The resin composition according to claim 9 . <9> The 5% mass loss temperature of the antistatic agent (B) is 370° C. or higher. <1> ~ <8> 10. The resin composition according to claim 9 . <10> Further, the composition contains a phosphorus-based antioxidant (C), <1> ~ <9> 10. The resin composition according to claim 9 . <11> Further, containing an inorganic pigment, <1> ~ <10> 10. The resin composition according to claim 9 . <12> For security cards, <1> ~ <11> 10. The resin composition according to claim 9 . <13> <1> ~ <12> 2. A resin sheet formed from the resin composition according to claim 1. <14> <13> A security card comprising the resin sheet according to claim 1. <15> The method includes blending the antistatic agent (B) with a powdered thermoplastic resin (A), <1> ~ <12> 13. A method for producing the resin composition according to claim 12. Effect of the Invention

[0008] The present invention makes it possible to provide a resin composition in which an antistatic agent is sufficiently dispersed in a thermoplastic resin and which has low surface resistivity, as well as a resin sheet, a security card, and a method for producing the resin composition formed from the resin composition. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The present invention will be described in detail below. In this specification, the word "to" is used to mean that the numerical values ​​before and after it are included as the lower limit and upper limit.

[0010] The resin composition of the present invention comprises a thermoplastic resin (A) and an antistatic agent (B), the thermoplastic resin (A) comprising at least one of a polycarbonate resin and an amorphous polyester resin, and the antistatic agent (B) being a compound represented by the following formula (1): [(R 1 )3R 2 P] + ·(R 3 SO2)(R 4 SO2)N - (1) In formula (1), R 1 and R 2 each independently represents an alkyl group having 5 or more carbon atoms; R 3 and R 4 each independently represents a perfluoroalkyl group having 1 to 4 carbon atoms. By using the above-mentioned constitution, it is possible to obtain a resin composition in which the antistatic agent (B) is sufficiently dispersed in the thermoplastic resin (A) and which has a low surface resistivity. As described above, when the resin composition is charged, inconvenience occurs in handling the resin sheet formed from the resin composition. Therefore, it is considered to add an antistatic agent (B) to the resin composition. However, even when the antistatic agent (B) is added, it is required to exert an antistatic function without impairing the inherent physical properties of the thermoplastic resin (A) as much as possible. In the present invention, this problem is solved by using a compound represented by formula (1) having high dispersibility in the thermoplastic resin (A) as the antistatic agent (B). That is, the compound represented by formula (1) is an ionic compound, has a low melting point, and becomes liquid under normal use. Therefore, it has excellent dispersibility in the thermoplastic resin (A). As a result, even if the amount of the compound added is reduced, a sufficient antistatic function can be expected, and the antistatic function can be imparted without impairing the inherent physical properties of the resin composition as much as possible.

[0011] <Thermoplastic resin (A)> The thermoplastic resin (A) contains at least one of a polycarbonate resin and an amorphous polyester resin, and preferably contains at least a polycarbonate resin. <<Polycarbonate resin>> The polycarbonate resin is not particularly limited as long as it contains a -[OR-OCO]- unit (where R is an aliphatic group, an aromatic group, or both an aliphatic group and an aromatic group, and further has a straight-chain structure or a branched structure) that contains a carbonate bond in the molecular main chain. However, it is preferable to use an aromatic polycarbonate resin. The weight average molecular weight of the polycarbonate resin is preferably from 20,000 to 80,000, more preferably from 30,000 to 70,000, and further preferably from 40,000 to 60,000. The glass transition temperature of the polycarbonate resin is preferably from 120 to 160° C., and more preferably from 130 to 155° C. The glass transition temperature is measured according to the description in the examples described later.

[0012] <<Amorphous polyester resin>> The type of amorphous polyester resin is not particularly limited, but examples thereof include PETG resin and PCTG resin. PETG resin is a polyester copolymer of dicarboxylic acid units, primarily terephthalic acid units, ethylene glycol units, and glycol units, primarily 1,4-cyclohexanedimethanol units, where the terephthalic acid units, for example, account for all of the dicarboxylic acid units on a molar basis, and the 1,4-cyclohexanedimethanol units, for example, account for less than 50% of the total glycol units on a molar basis. The PCTG resin is a polyester copolymer consisting of dicarboxylic acid units, mainly terephthalic acid units, ethylene glycol units, and glycol units, mainly 1,4-cyclohexanedimethanol units, where the terephthalic acid units account for, for example, all of the dicarboxylic acid units on a molar basis, and the 1,4-cyclohexanedimethanol units account for, for example, 50% or more of all of the glycol units on a molar basis.

[0013] <<Other thermoplastic resins>> The thermoplastic resin (A) contains at least one of a polycarbonate resin and an amorphous polyester resin, but may contain other thermoplastic resins. Examples of other thermoplastic resins include polyether resins and acrylic resins. Specifically, those described in paragraphs 0032 and 0033 of JP 2014-129488 A can be used, the contents of which are incorporated herein by reference. The thermoplastic resin (A) is preferably at least 50% by mass, more preferably at least 60% by mass, even more preferably at least 80% by mass, still more preferably at least 90% by mass, even more preferably at least 95% by mass, and even more preferably 100% by mass of at least one of a polycarbonate resin and an amorphous polyester resin (preferably a polycarbonate resin).

[0014] The content of the thermoplastic composition resin (A) in the resin composition of the present invention is preferably 70% by mass or more, more preferably 80% by mass or more, and may be 90% by mass or more, or 95% by mass or more. The upper limit of the content of the thermoplastic composition resin (A) is, for example, 99.99% by mass or less. The resin composition of the present invention may contain only one type of thermoplastic resin (A), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0015] <Antistatic agent (B)> The resin composition of the present invention contains a compound represented by the following formula (1) as the antistatic agent (B). [(R 1 )3R 2 P] + ·(R 3 SO2)(R 4 SO2)N - (1) In formula (1), R 1 and R 2 each independently represents an alkyl group having 5 or more carbon atoms; R 3 and R 4 each independently represents a perfluoroalkyl group having 1 to 4 carbon atoms. The compound represented by formula (1) is liquid under normal use conditions (eg, at 25° C.), and therefore can be dispersed well in the thermoplastic resin (A).

[0016] In formula (1), R 1 and R 2 each independently represents an alkyl group having 5 or more carbon atoms, and preferably an alkyl group having 6 or more carbon atoms. There is no particular upper limit on the number of carbon atoms in the alkyl group, but it is, for example, 20 or less, and preferably 16 or less. R 1 and R 2 Also, R 1 At least one of and R 2 and R are preferably alkyl groups having different carbon numbers. 1 At least one of and R 2 and R preferably have a difference of 3 or more in the number of carbon atoms. 1 At least one of and R 2 It is more preferable that the difference in the number of carbon atoms is 5 or more. The upper limit of the difference in the number of carbon atoms is not particularly specified, but for example, the difference is 12 or less. By adopting such a constitution, the compound represented by formula (1) tends to be less likely to crystallize, and the dispersibility tends to be improved. More specifically, the occurrence of non-uniform parts (poorly dispersed parts) called lumps can be prevented. As a result, the standard deviation (variation) of the antistatic performance of the resin composition can be suppressed. Also, the three R's 1 may be the same or different groups. In one embodiment, three R 1 are the same group. Furthermore, in the present invention, R 1 is an alkyl group having 6 to 9 carbon atoms, and R 2 is preferably a linear alkyl group having 10 to 16 carbon atoms, and R 1 is an alkyl group having 6 to 8 carbon atoms, and R 2 is preferably a linear alkyl group having 12 to 15 carbon atoms. R 1The alkyl group as R is preferably a pentyl group, a hexyl group, a heptyl group, an octyl group, or a nonyl group. 2 The alkyl group as is preferably a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, or a hexadecyl group. The pentyl group is exemplified by an n-pentyl group, an i-pentyl group, or a sec-pentyl group, with an n-pentyl group being preferred. The same applies to a hexyl group, etc.

[0017] In formula (1), R 3 and R 4 R each independently represents a perfluoroalkyl group having 1 or 2 carbon atoms, and is preferably a trifluoromethyl group. 3 and R 4 may be the same or different groups. In one embodiment, R 3 and R 4 are the same group.

[0018] In the present invention, particularly, in formula (1), R 1 is an alkyl group having 6 to 9 carbon atoms, and R 2 is a linear alkyl group having 10 to 16 carbon atoms, and R 3 and R 4 each independently preferably represents a perfluoroalkyl group having 1 or 2 carbon atoms.

[0019] The compound represented by formula (1) preferably has a melting point of 0°C or less, more preferably -5°C or less, and even more preferably -10°C or less. By using such a compound, it becomes possible to more easily disperse the antistatic agent (B) in the thermoplastic resin (A). As a result, it becomes possible to further reduce the content of the antistatic agent (B) (the compound represented by formula (1)) in the resin composition. Furthermore, the compound represented by formula (1) does not solidify even at low temperatures and can be made liquid, so that it can be suitable for use in cold regions. In addition, the lower limit of the melting point of the compound represented by formula (1) is not particularly specified, but may be, for example, -100°C or more. The melting point here is a value measured according to differential scanning calorimetry (DSC).

[0020] The compound represented by formula (1) preferably has a 5% mass loss temperature of 370° C. or higher, and more preferably 372° C. or higher. There is no particular upper limit to the 5% mass loss temperature, but it may be, for example, 400° C. or lower. Such a high mass loss temperature allows for a resin composition with superior heat resistance to be obtained. The mass loss temperature is a value measured by the method described in the examples described below.

[0021] The lower limit of the molecular weight of the compound represented by formula (1) is preferably 660 or more, more preferably 680 or more, even more preferably 700 or more, still more preferably 730 or more, and even more preferably 750 or more. The upper limit of the molecular weight of the compound represented by formula (1) may be, for example, 1000 or less, 900 or less, or 800 or less.

[0022] The content of the compound represented by formula (1) in the resin composition of the present invention is preferably 0.1 mass% or more, more preferably 0.3 mass% or more, and may be 0.5 mass% or more, particularly 0.6 mass% or more. The upper limit of the content of the compound represented by formula (1) is, for example, 3.0 mass% or less. However, since the compound represented by formula (1) has excellent dispersibility, an excellent antistatic effect can be achieved even if the content of the compound represented by formula (1) is 1.0 mass% or less, further 0.9 mass% or less, 0.8 mass% or less, or 0.7 mass% or less. The resin composition of the present invention may contain only one type of compound represented by formula (1), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0023] The resin composition of the present invention may or may not contain an antistatic agent other than the compound represented by formula (1). As one embodiment of the present invention, a configuration that is substantially free of antistatic agents other than the compound represented by formula (1) is exemplified. Substantially free means that the content of antistatic agents other than the compound represented by formula (1) is 5% by mass or less, preferably 3% by mass or less, and may be 1% by mass or less of the content of the compound represented by formula (1).

[0024] <Phosphorus-based antioxidant (C)> The resin composition of the present invention may contain a phosphorus-based antioxidant (C). By blending a phosphorus-based antioxidant, the mass loss temperature can be increased in addition to the function that the antioxidant originally exhibits. The phosphorus-based antioxidant (C) is not particularly limited as long as it is an antioxidant containing a phosphorus atom. Specific examples of phosphorus-based antioxidants include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; phosphate compounds, phosphite compounds, and phosphonite compounds, with phosphite compounds being particularly preferred. By selecting a phosphite compound, a resin sheet having higher discoloration resistance and continuous productivity can be obtained. For the phosphorus-based antioxidant, reference can be made to the description in paragraphs 0058 to 0064 of JP 2018-090677 A, the contents of which are incorporated herein by reference.

[0025] An example of a preferred embodiment of the phosphorus-based antioxidant (C) used in the present invention is a phosphorus-based antioxidant having a pentaerythritol diphosphite structure. Examples of phosphorus-based antioxidants having a pentaerythritol diphosphite structure include the compounds described in WO2013 / 088796 and the pentaerythritol diphosphite compound represented by the following formula (II). [ka] In formula (II), Y 1 ~Y 4 each independently represents a hydrocarbon group having 6 or more carbon atoms, preferably each independently represents a hydrocarbon group having 6 to 20 carbon atoms, and more preferably a substituted or unsubstituted cumyl group, phenyl group, naphthyl group or biphenyl group.

[0026] The pentaerythritol diphosphite compound represented by the above formula (II) is preferably a pentaerythritol diphosphite compound represented by the following formula (II-1). [ka] In the formula, R B1 ~R B8 R each independently represents an alkyl group (preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group) or an alkenyl group (preferably an alkyl group having 2 to 4 carbon atoms), and each independently represents an alkyl group. B1 and R B2 , R B3 and R B4 , R B5 and R B6 , R B7 and R B8 may be bonded to each other to form a ring, but it is preferable that they do not form a ring. B9 ~R B12 Each of m1 to m4 independently represents an alkyl group. Each of m1 to m4 independently represents an integer of 0 to 5, preferably 0 or 1, and more preferably 0. Z 1 ~Z 4 each independently represents a single bond or a carbon atom, and preferably a carbon atom. 1 ~Z 4 If represents a single bond, R B1 ~R B8 is excluded from formula (II-1).

[0027] The pentaerythritol diphosphite compound represented by the above formula (II) or (II-1) can be obtained by adding a chlorine-based solvent to phosphorus trichloride and pentaerythritol to obtain pentaerythritol dichlorophosphite, and then heating and mixing the mixture in the presence of an aromatic solvent and an organic nitrogen-containing base compound (see, for example, JP 2004-018406 A).

[0028] Among the pentaerythritol diphosphite compounds represented by the above formula (II) or (II-1), bis(2,4-dicumylphenyl)pentaerythritol diphosphite represented by the following formula (II-2) is particularly suitable because it can provide the resin composition with good heat resistance and hydrolysis resistance and is also easily available. This compound is commercially available, and for example, "Doverphos (registered trademark) S9228PC" manufactured by Dover Chemical Co. can be used.

[0029] [ka]

[0030] The content of the phosphorus-based antioxidant (C) in the resin composition of the present invention is preferably 0.005 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.03 parts by mass or more, relative to 100 parts by mass of the thermoplastic resin (A). The upper limit of the content of the phosphorus-based antioxidant (C) is preferably 1 part by mass or less, more preferably 0.8 parts by mass or less, even more preferably 0.5 parts by mass or less, and even more preferably 0.1 parts by mass or less, and may be 0.07 parts by mass or less, relative to 100 parts by mass of the thermoplastic resin (A). In the resin composition of the present invention, the mass ratio of the phosphorus-based antioxidant (C) to the antistatic agent (B) (antistatic agent (B) / phosphorus-based antioxidant (C)) is preferably 3 or more, more preferably 5 or more, and even more preferably 10 or more. The upper limit is preferably 22 or less, and more preferably 18 or less. By setting the ratio in this way, the heat resistance tends to be more excellent. The resin composition of the present invention may contain only one type of phosphorus-based antioxidant (C), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0031] <Coloring agent> The resin composition of the present invention may or may not contain a colorant. Examples of the colorant include inorganic pigments, organic pigments, and organic dyes, with inorganic pigments being preferred. Examples of inorganic pigments include sulfide pigments such as carbon black, cadmium red, and cadmium yellow; silicate pigments such as ultramarine; oxide pigments such as titanium oxide, zinc white, red iron oxide, chromium oxide, iron black, titanium yellow, zinc-iron brown, titanium-cobalt green, cobalt green, cobalt blue, copper-chromium black, and copper-iron black; chromate pigments such as yellow lead and molybdate orange; and ferrocyanide pigments such as iron blue, of which carbon black and titanium oxide are preferred.

[0032] Examples of organic pigments and organic dyes include phthalocyanine dyes or pigments such as copper phthalocyanine blue and copper phthalocyanine green; azo dyes or pigments such as nickel azo yellow; condensed polycyclic dyes or pigments such as thioindigo, perinone, perylene, quinacridone, dioxazine, isoindolinone, and quinophthalone; and anthraquinone, heterocyclic, and methyl dyes or pigments.

[0033] The content of the colorant in the resin composition of the present invention can be appropriately determined depending on the type of colorant, etc., but is, for example, 0.0001 parts by mass or more and, for example, 50 parts by mass or less per 100 parts by mass of the thermoplastic resin (A). More specifically, when a black colorant (such as carbon black) is used as the colorant, the amount is preferably 0.0001 to 0.005 parts by mass relative to 100 parts by mass of the thermoplastic resin (A). When a white colorant (such as titanium oxide) is used as the colorant, the amount is preferably 1 to 50 parts by mass, more preferably 5 to 35 parts by mass, relative to 100 parts by mass of the thermoplastic resin (A). The resin composition of the present invention may contain only one type of colorant, or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0034] <Other ingredients> In addition to the above-mentioned components, the resin composition of the present invention may contain the following additives: at least one additive selected from the group consisting of a non-phosphorus-based antioxidant, a heat stabilizer, a flame retardant, a flame retardant assistant, an ultraviolet absorber, and a mold release agent. In addition, fluorescent whitening agents, antifogging agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc. may be added as long as they do not significantly impair the desired physical properties. The content of the additive in the resin composition, if contained, is, based on the mass of the resin composition, for example, 0.001 mass% or more, and, for example, 5.0 mass% or less, preferably 3.0 mass% or less, and more preferably 1.0 mass% or less.

[0035] <Physical properties of resin composition> The resin composition of the present invention, when molded into a resin sheet having a thickness of 100 μm, preferably has a surface resistivity of 1.0E+14 Ω / sq. or less, more preferably 9.0E+13 Ω / sq. or less, even more preferably 1.0E+13 Ω / sq. or less, and even more preferably 9.0E+12 Ω / sq. or less. The lower limit of the surface resistivity is not particularly set, but 1.0E+10 Ω / sq. or more is practical. The method for measuring the surface resistivity follows the method described in the Examples below. The 5% mass loss temperature of the resin composition of the present invention is preferably 460° C. or higher, more preferably 465° C. or higher, and even more preferably 470° C. or higher. The lower limit of the 5% mass loss temperature is not particularly limited, but examples thereof include 500° C. or lower, and further 480° C. or lower. The 5% mass loss temperature is measured according to the method described in the Examples below.

[0036] <Method of producing resin composition> The method for producing the resin composition of the present invention is not limited, and a wide variety of known methods for producing resin compositions can be used. A specific example of such a method includes a method in which the thermoplastic resin (A), the antistatic agent (B), and other components that are blended as necessary are premixed using various mixers such as a tumbler, a Henschel mixer, or a super mixer, and then the mixture is melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, or a kneader. In the present invention, it is particularly preferable that the method for producing a resin composition includes blending an antistatic agent (B) with a powdered thermoplastic resin (A). The antistatic agent (B) used in the present invention is usually liquid at room temperature, so that it can be sufficiently dispersed even if it is directly added to a powdered resin. As a result, compounding becomes easy.

[0037] <Resin sheet> The resin sheet in the present invention may have a non-reinforced thermoplastic resin layer laminated on one or both sides of the surface layer. That is, according to one embodiment of the present invention, a laminated sheet having a thermoplastic resin layer on at least one side of the resin sheet is provided. The thermoplastic resin to be laminated may contain various additives. Examples of such additives include stabilizers, antioxidants, release agents, ultraviolet absorbers, dyes and pigments, antistatic agents, flame retardants, impact strength improvers, plasticizers, dispersants, and antibacterial agents. One type of these resin additives may be contained, or two or more types may be contained in any combination and ratio.

[0038] The term "sheet" generally refers to a thin, flat product whose thickness is small relative to its length and width, and is intended to include films. The thickness of the resin sheet of the present invention is preferably in the range of 10 to 1000 μm, more preferably in the range of 30 to 500 μm.

[0039] <Application> The resin composition and resin sheet of the present invention can be preferably used as a security card. The security card in the present invention is exemplified by an identification card (ID card), a passport, a driver's license, a bank card, a credit card, an insurance card, and other identification cards.

[0040] In addition, in the present invention, the descriptions in paragraphs 0048 to 0059 of JP 2016-108424 A and the descriptions in paragraphs 0075 to 0088 of JP 2015-168728 A may be taken into consideration within the scope of the present invention, and the contents of these are incorporated into this specification. EXAMPLES

[0041] The present invention will be described in more detail below with reference to examples. The materials, amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

[0042] Examples 1 to 8, Comparative Examples 1 to 3 Each component was blended in a tumbler to obtain the composition shown in Table 1 or Table 2 below. At this time, the powdered thermoplastic resin (A) was mixed with the antistatic agent (B). When a liquid (trihexyl(tetradecyl)phosphonium bis(trifluoromethanesulfonyl)amide) was used as the antistatic agent (B), it was dropped with a dropper, and when a mixture of solid and liquid (tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide) was used, it was scooped up with a spatula and mixed. Next, a resin sheet with a width of 50 mm and a thickness of 100 μm was molded at a screw rotation speed of 25 rpm using a twin-screw melt extruder with a T-die ("Labo Plastomill" manufactured by Toyo Seiki Seisakusho Co., Ltd.). The cylinder and die head temperature was set at 300°C. The thermoplastic resin (A) was a polycarbonate resin ("Iupilon (registered trademark) E-2000F" manufactured by Mitsubishi Engineering Plastics Corporation), and the phosphorus-based antioxidant (C) was "Doverphos S9228PC" manufactured by Dover Chemical Co., Ltd. The antistatic agent (B) was the following compound (both manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.). The carbon black was MONARCH (registered trademark) 800 manufactured by Cabot Corporation, and the titanium oxide was PC-3 manufactured by Ishihara Sangyo Kaisha, Ltd.

[0043] Trihexyl(tetradecyl)phosphonium bis(trifluoromethanesulfonyl)amide [ka] The melting point of trihexyl(tetradecyl)phosphonium bis(trifluoromethanesulfonyl)amide is less than -50°C, the 5% mass loss temperature is 375°C, and the molecular weight is 764. Hex represents a hexyl group. Tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide [ka] Bu represents a butyl group. Tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide has a melting point of 17° C., a 5% mass loss temperature of 369° C., and a molecular weight of 652.

[0044] <Surface resistivity> The antistatic properties of the resin compositions of the respective Examples and Comparative Examples were evaluated as follows. The resin sheet to be measured was left for more than 24 hours under conditions of a temperature of 23°C and a relative humidity of 50%, and then a DC voltage of 1000V was applied for 60 seconds using a resistivity meter to measure the surface resistivity (unit: Ω / sq.) at five locations, and the average value was evaluated as follows. The resistivity meter used was a Hiresta UP (manufactured by Mitsubishi Chemical Analytech Co., Ltd.). A: Surface resistivity 10 13 Ω / sq. or less B: Surface resistivity 10 13 Ω / sq. super 10 14 Ω / sq. or less C: Surface resistivity 10 14 Ω / sq. super

[0045] <Dispersion stability> The standard deviation (variation) of the surface resistivity was determined as an index of the stability of the antistatic performance. The resin sheet to be measured (width 50 mm, length 1 m) was divided into 10 sections, and the surface resistivity of each section was measured in the same manner as above. The common logarithm of the surface resistivity of each section was calculated, and their standard deviation was determined and evaluated as follows. A: Standard deviation less than 0.5 B: Standard deviation 0.5 or more

[0046] <Dispersibility evaluation (visual inspection)> The evaluation was made based on whether or not uneven areas (poorly dispersed areas) called lumps were visually confirmed when the antistatic agent (B) was added to the powdered thermoplastic resin (A). Five people, including the inventors, evaluated the results, and the evaluation given by the majority was used as the final evaluation. A: Almost no lumps were found. B: Clumps were confirmed (other than A)

[0047] <Mass reduction temperature> Using a thermogravimetric and differential thermal analyzer, approximately 10 mg of the resin sheet was heated from room temperature to 600°C at a rate of 10°C / min under air (flow rate 200 mL / min), and the temperatures (unit: °C) at which the mass decreased by 1%, 5%, and 10% by mass were measured. The simultaneous differential thermal and thermogravimetric analyzer used was EXSTAR TGDTA 7220 manufactured by Hitachi High-Tech Science Corporation. In addition, an overall evaluation was made based on the following criteria. 1 mass% reduction temperature: 430℃ or more 5% mass reduction temperature: 460℃ or more 10% mass reduction temperature: 475℃ or higher A: Meet all three of the above criteria B: Meets two of the above criteria C: Meets one of the above criteria D: Does not meet the above criteria (practical level) E: Does not meet the above criteria (not practical level)

[0048] [Table 1] [Table 2]

[0049] As is clear from the above results, the resin composition of the present invention had a low surface resistivity and excellent dispersibility of the antistatic agent (B). Furthermore, the mass loss temperature was high. In particular, when a phosphorus-based antioxidant was used, the mass loss temperature was significantly high.

Claims

1. A thermoplastic resin (A) which is a polycarbonate resin and / or an amorphous polyester resin, an antistatic agent (B), a phosphorus-based antioxidant (C) which is blended as necessary, titanium oxide, and other components which are blended as necessary, the other component is at least one selected from the group consisting of a non-phosphorus-based antioxidant, a heat stabilizer, a flame retardant, a flame retardant assistant, an ultraviolet absorber, a release agent, a fluorescent brightener, an antifogging agent, a flow improver, a plasticizer, a dispersant, and an antibacterial agent, and the content of the other component is less than 0% by mass to 5.0% by mass of the resin composition; The antistatic agent (B) is a compound represented by the following formula (1): a resin composition further comprising 1 to 50 parts by mass of titanium oxide per 100 parts by mass of the thermoplastic resin (A); [(R １ ) ３ R ２ P] ＋ ・(R ３ SO ２ )(R ４ SO ２ )N － (1) In formula (1), R １ and R ２ each independently represents an alkyl group having 5 or more carbon atoms; R ３ and R ４ each independently represents a perfluoroalkyl group having 1 to 4 carbon atoms.

2. In the formula (1), R １ At least one of and R ２ The resin composition according to claim 1 , wherein the alkyl groups have different numbers of carbon atoms.

3. In the formula (1), R １ is an alkyl group having 6 to 9 carbon atoms, and R ２ The resin composition according to claim 1 or 2, wherein is a linear alkyl group having 10 to 16 carbon atoms.

4. In the formula (1), R ３ and R ４ Each of independently represents a perfluoroalkyl group having 1 or 2 carbon atoms.

5. In the formula (1), R １ is an alkyl group having 6 to 9 carbon atoms, and R ２ is a linear alkyl group having 10 to 16 carbon atoms, R ３ and R ４ The resin composition according to claim 1 , wherein each independently represents a perfluoroalkyl group having 1 or 2 carbon atoms.

6. The resin composition according to any one of claims 1 to 5, wherein the content of the antistatic agent (B) is 0.1 to 1.0 mass% of the resin composition.

7. The resin composition according to any one of claims 1 to 5, wherein the content of the antistatic agent (B) is 0.3 to 0.8 mass% of the resin composition.

8. The resin composition according to any one of claims 1 to 7, wherein the antistatic agent (B) has a melting point of 0°C or lower as measured by differential scanning calorimetry.

9. The resin composition according to any one of claims 1 to 8, wherein the 5% mass reduction temperature of the antistatic agent (B) is 370°C or higher, and the 5% mass reduction temperature is the temperature (unit: °C) at which the mass of 10 mg of the antistatic agent (B) is reduced by 5% by mass when the antistatic agent (B) is heated from room temperature to 600°C at a rate of 10°C / min in air (flow rate: 200 mL / min) using a thermogravimetric and differential thermal analyzer.

10. The resin composition according to any one of claims 1 to 9, further comprising a phosphorus-based antioxidant (C).

11. The resin composition according to any one of claims 1 to 10, wherein the titanium oxide is contained in an amount of 15.00 to 35 parts by mass per 100 parts by mass of the thermoplastic resin (A).

12. The resin composition according to any one of claims 1 to 11, which is for a security card.

13. A resin sheet formed from the resin composition according to any one of claims 1 to 12.

14. A security card comprising the resin sheet according to claim 13.

15. The method for producing the resin composition according to any one of claims 1 to 12, comprising blending the antistatic agent (B) with a powdery thermoplastic resin (A).

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