LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS

Abstract

To suppress a risk that a liquid is attached onto a discharge port surface of an element substrate of a liquid discharge head at the time of wiping.SOLUTION: A liquid discharge device has: a liquid discharge head including a substrate provided with a discharge port surface for discharging a liquid, an electric wiring board electrically connected to the substrate, and a support member provided with a support surface for supporting the electric wiring board, and a wiping member for wiping the discharge port surface. The support surface is positioned at a gap between the discharge port surface and the support surface on the upstream side of the discharge port surface in a relative movement direction to the discharge port surface of the wiping member at the time of wiping, and the electric wiring board has a part which overhangs from the support surface and covers at least a part of the gap.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a liquid ejection head that ejects liquid and a liquid ejection apparatus. [Background technology]

[0002] A liquid ejection device (inkjet recording device) is equipped with a liquid ejection head (recording head) that ejects liquid. Paper dust from recording paper and dust suspended in the air may adhere to the liquid ejection head, or droplets ejected from the ejection port of the liquid ejection head may bounce back and adhere to the head. There is a risk that these deposits may hinder stable liquid ejection. Therefore, in order to remove these deposits, the liquid ejection device is provided with a means for cleaning the ejection port surface of the liquid ejection head. For example, wiping is performed by wiping the ejection port surface with a blade made of an elastic material such as rubber, thereby removing the dust and droplets attached to the ejection port surface. Patent Document 1 describes a wiping method for removing the dust and droplets attached to the ejection port surface of the liquid ejection head. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 07-017045 Summary of the Invention [Problem to be solved by the invention]

[0004] If liquid accumulates in the gaps on the side surfaces of the element substrate of the liquid ejection head, there is a risk that the liquid will be scraped off by wiping and adhere to the ejection port surface.

[0005] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENTS The present invention has an object to reduce the risk of liquid adhering to the ejection port surface of the element substrate of the liquid ejection head during wiping. [Means for solving the problem]

[0006] A liquid ejection device according to the present invention has a liquid ejection head including a substrate provided with an ejection port surface for ejecting liquid, an electric wiring substrate electrically connected to the substrate, and a support member provided with a support surface for supporting the electric wiring substrate, and a wiping member that moves relatively to the ejection port surface to wipe the ejection port surface, the support surface being located upstream of the ejection port surface in a relative movement direction of the wiping member to the ejection port surface during wiping, with a gap between the support surface and the ejection port surface, the electric wiring substrate having a portion that protrudes from the support surface and covers at least a portion of the gap, the portion being an electrical connection portion between the substrate and the electric wiring substrate. The inner lead It is characterized in that it is provided so as to extend to the base portion of the Effect of the Invention

[0007] According to the present invention, it is possible to suppress the risk of liquid adhering to the ejection port surface of the element substrate of the liquid ejection head during wiping. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram illustrating an ink jet recording head according to a first embodiment. [Diagram 2] FIG. 2 is a perspective view showing an inkjet recording head. [Diagram 3] 5A to 5C are diagrams illustrating wiping of the inkjet print head according to the first embodiment. [Figure 4] 11A and 11B are diagrams for explaining wiping of an ink jet recording head of a comparative example. [Diagram 5] 1A to 1C are diagrams illustrating a manufacturing process of an electric wiring board. [Figure 6] FIG. 13 is a diagram illustrating an ink jet recording head according to a second embodiment. [Figure 7] FIG. 13 is a diagram illustrating an ink jet recording head according to a third embodiment. [Figure 8] FIG. 13 is a diagram illustrating a modified example of the third embodiment. [Figure 9]FIG. 13 is a diagram illustrating an ink jet recording head according to a fourth embodiment. [Figure 10] FIG. 1 is a diagram illustrating an inkjet recording apparatus. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments to which the present invention can be applied will be described in detail.

[0010] (First embodiment) Fig. 1 shows an inkjet recording head 1 as a liquid ejection head of this embodiment. Fig. 1(a) is a plan view seen from the ejection port side, and Fig. 1(b) is a cross-sectional view taken along line II of Fig. 1(a). Fig. 2(a) is a perspective view showing the inkjet recording head 1 of this embodiment, and Fig. 2(b) is a perspective view showing a recording element substrate 3.

[0011] As shown in FIG. 2, the inkjet recording head 1 has a recording element substrate 3, an electric wiring substrate 4, and a housing 2 that contains ink (liquid) to be supplied to the recording element substrate 3. The recording element substrate 3 has energy generating elements 36 formed at a predetermined pitch to generate energy for ejecting ink from ejection ports 31. The recording element substrate 3 also has one or more liquid supply ports 34 formed therein to supply liquid from the housing 2 to the ejection ports 31. The electric wiring substrate 4 has wiring to supply power to the recording element substrate 3. The housing 2 also serves as a support member that supports the recording element substrate 3 and the electric wiring substrate 4.

[0012] As shown in FIG. 1, in the inkjet recording head 1 of this embodiment, there is a gap 5 between the recording element substrate 3 and the support surface 21 of the housing 2 that supports the electric wiring substrate 4. The electric wiring substrate 4 has a portion 49 that protrudes from the support surface 21 and covers the gap 5. The portion 49 of the electric wiring substrate 4 is provided so as to cover the gap 5 on the upstream side in the wiping direction (arrow A direction) of a blade 81 as a wiping member. In this embodiment, the electric wiring substrate 4 does not cover the gap 5 on the downstream side in the wiping direction. Note that it is sufficient that the electric wiring substrate 4 has a configuration including the portion 49 that covers at least a part of the gap 5 on the upstream side in the wiping direction. The electric wiring substrate 4 may or may not cover the gap 5 on the downstream side.

[0013] Here, problems that occur when wiping the inkjet recording head will be described. FIG. 4 is a diagram for explaining wiping of the inkjet recording head of the comparative example. FIG. 4(a1)-(e1) are plan views for explaining wiping. FIG. 4(a2)-(e2) are cross sections taken along the line IV-IV of FIG. 4(a1)-(e1), respectively. FIG. 4(a3)-(e3) are enlarged views showing the inside of region C of FIG. 4(a2)-(e2), respectively. Ink discharged from the inkjet recording head 1 may bounce back and adhere to the discharge port surface 35 of the recording element substrate 3, or may enter the gap 5 between the recording element substrate 3 and the support surface 21 of the housing 2 that supports the electric wiring substrate 4. If the amount of ink 7 increases, the ink 7 may accumulate in the gap 5.

[0014] The blade 81 moves relative to the discharge port surface 35 in the direction of the arrow A in FIG. 4 to wipe the discharge port surface 35 of the recording element substrate 3. First, as shown in FIG. 4(a1) and (a2), the blade 81 moves relatively toward the discharge port surface 35 of the recording element substrate 3 (in the direction of the arrow A) while being in close contact with the upper surface of the electric wiring substrate 4. Then, as shown in FIG. 4(b3) and (c3), the blade 81 enters the gap 5, and the ink 7 adheres to and is held at the tip of the blade 81 by the meniscus force. After that, the ink 7 adhered to the tip of the blade 81 is scraped out onto the discharge port surface 35 of the recording element substrate 3 (FIG. 4(d3)), and the ink 7 may be left behind on the discharge port surface 35 (FIG. 4(e3)). If the ink 7 remains on the discharge port surface 35 after wiping, the direction of ink discharge may be shifted when ink is discharged for image formation, or ink discharge may not be performed, which may affect image formation.

[0015] Next, wiping in this embodiment will be described with reference to Fig. 3, which is a diagram for explaining wiping of the inkjet recording head 1 of this embodiment. Fig. 3(a1)-(f1) are plan views for explaining wiping. Fig. 3(a2)-(f2) are cross-sectional views taken along III-III in Fig. 3(a1)-(f1), respectively. Fig. 3(a3)-(c3) are enlarged views showing the inside of region B in Fig. 3(a2)-(c2), respectively.

[0016] As described above, the electric wiring board 4 of the inkjet recording head 1 of this embodiment has a portion 49 that protrudes from the support surface 21 and covers the gap 5 (FIGS. 3(a2) and (a3)). In this embodiment, the gap 5 in which the ink 7 is likely to accumulate is covered by the electric wiring board 4, so ink is less likely to accumulate in the gap 5 compared to the inkjet recording head of the comparative example. However, ink 7 may enter the gap 5 from the portion not covered by the electric wiring board 4.

[0017] The inkjet recording head 1 is wiped. First, as shown in FIG. 3(a1) and FIG. 3(a2), the blade 81 moves in the direction of the discharge port surface 35 of the recording element substrate 3 (in the direction of the arrow A) while being in close contact with the upper surface of the electric wiring substrate 4, relative to the discharge port surface 35. Next, as shown in FIG. 3(b1)-(b3), the blade 81 advances on the portion 49 of the electric wiring substrate 4. At this time, if the base material of the electric wiring substrate 4 is made of a material such as resin, the electric wiring substrate 4 may bend under the load of the blade 81 and come into contact with the recording element substrate 3. After that, the blade 81 descends the step between the electric wiring substrate 4 and the recording element substrate 3 and advances onto the discharge port surface 35 of the recording element substrate 3 (FIG. 3(c1)-(c3)), and moves on the discharge port surface 35 of the recording element substrate 3 ((d1)-(d3)). In this embodiment, since the gap 5 on the downstream side is not covered by the electric wiring board 4, the blade 81 enters the gap 5 on the downstream side in the wiping direction (FIGS. 3(e1), (e2)). Thereafter, the blade 81 moves on the upper surface of the electric wiring board 4 (FIGS. 3(f1), (f2)).

[0018] In this embodiment, even if ink 7 gets into gap 5 on the upstream side in the wiping direction, gap 5 is covered by portion 49 of electric wiring board 4, so that it is possible to suppress the risk that blade 81 will enter gap 5 on the upstream side and scrape out ink 7. It is also possible to reduce the possibility that ink 7 will be left behind on ejection port surface 35 by blade 81.

[0019] In this embodiment, the electric wiring board 4 does not cover the gap 5 on the downstream side in the wiping direction. If the electric wiring board 4 protrudes from the support surface 21 of the housing 2 so as to cover the downstream gap 5, the movement of the blade 81 may cause the portion of the electric wiring board 4 covering the downstream gap 5 to be turned over. Even if the blade 81 scrapes out the ink 7 accumulated in the downstream gap 5, the ejection port surface 35 is located upstream in the wiping direction, so that the scraped out ink 7 is unlikely to adhere to the ejection port surface 35. Therefore, a configuration in which the downstream gap 5 is not covered by the electric wiring board 4 as in this embodiment is preferable.

[0020] Even if the electric wiring board 4 has a portion other than the portion 49 that protrudes from the support surface 21 of the housing 2 so as to cover the downstream gap 5, it is preferable that the protruding length of the upstream portion 49 is longer than the protruding length of the downstream portion. This can prevent the electric wiring board 4 from turning over on the downstream side.

[0021] In this embodiment, a gap 5 is provided between the side surface of the recording element substrate 3 and the support surface 21, and the ink 7 can be prevented from accumulating by filling this gap 5 with a sealant. However, this type of configuration requires a large amount of sealant to be used, and therefore the stress applied to the recording element substrate 3 increases when the sealant cures and shrinks during the manufacturing process. In order to prevent the recording element substrate 3 from cracking due to this stress, the recording element substrate 3 is required to have a certain degree of high rigidity. Therefore, in particular when the rigidity of the recording element substrate 3 is low (for example, when the aspect ratio, which is the ratio of the vertical dimension to the horizontal dimension, is high), the configuration of this embodiment in which the gap 5 is not filled with a sealant is effective.

[0022] Next, an example of a manufacturing method for the electric wiring board 4 of this embodiment will be described. Fig. 5 is a diagram sequentially showing the manufacturing process for the electric wiring board 4. Figs. 5(a1) to (e1) are views of the electric wiring board 4 seen from the front surface side of the base material 41, Figs. 5(a2) to (e2) are cross sections taken along the line VV of Figs. 5(a3) to (e3), respectively, and Figs. 5(a3) to (e3) are views of the electric wiring board 4 seen from the back surface side of the base material 41.

[0023] First, as shown in Figs. 5(a1) and 5(a3), a portion that will become a device hole 48 is punched out of a resin-based base material 41 using a mold or the like. At this time, the base material 41 is punched out so as to have a shape that covers the gap 5 (area indicated by a dotted line) provided on the upstream side of the wiping of the recording element substrate 3. Next, as shown in Figs. 5(b1) to 5(b3), the copper foil 42 that will become the electrical wiring is bonded to the base material 41 using an adhesive or the like (not shown). Then, as shown in Figs. 5(c1) to 5(c3), the copper foil 42 that will become the electrical wiring is patterned to form wiring. Next, as shown in Figs. 5(d1) to 5(d3), a resin-based film 45 is bonded to the exposed portion of the copper foil 42 excluding the inner lead 43 and the outer lead 44 that will become the electrical connection portion. Furthermore, as shown in Figs. 5(e1) to 5(e3), Au plating 47 is applied to the copper exposed portions of the inner lead 43 and the outer lead 44 via Ni plating (adhesion improving layer).

[0024] The inkjet recording head 1 is manufactured by electrically connecting the electric wiring board 4 manufactured in this manner to the recording element board 3. In this embodiment, the electric wiring board 4 incorporated into the inkjet recording head 1 is provided so that a portion 49 covering the gap 5 extends to a base portion 431 (FIG. 5(e1)) of the inner lead 43. As shown in FIG. 1(b), this portion 49 extends to a position covering the end portion of the recording element board 3, but does not cover the ejection ports 31 of the recording element board 3.

[0025] Second embodiment In this embodiment, the shape of the portion of the electric wiring board 4 that covers the gap 5 between the recording element substrate 3 and the housing 2 is different from that of the above-mentioned embodiment. Fig. 6 is a plan view of the inkjet recording head 1 of this embodiment as viewed from the ejection port surface 35 side. The portion of the electric wiring board 4 that covers the above-mentioned gap 5 is not limited to the above-mentioned embodiment as long as it has a shape that can prevent the blade 81 from entering the gap 5 when the blade 81 moves from the electric wiring board 4 to the recording element substrate 3 during the wiping operation.

[0026] As shown in Fig. 6(a), a portion 490 of the electric wiring board 4 covering the gap 5 may have a round tip, and as shown in Fig. 6(b), a portion 491 of the electric wiring board 4 covering the gap 5 may have a triangular tip. Also, as shown in Fig. 6(c), a portion 492 of the electric wiring board 4 covering the gap 5 may be shaped to be located at the center of the gap 5 in the Y direction (a direction intersecting the wiping direction). Also, as shown in Fig. 6(d), a portion 493 of the electric wiring board 4 covering the gap 5 may be provided in a plurality of portions in the Y direction.

[0027] (Third embodiment) Fig. 7 is a diagram showing the inkjet recording head 1 of this embodiment. Figs. 7(a1) to (a3) ​​show the state of the electric wiring board 4 of this embodiment before the cover film 45 is bonded. Fig. 7(a1) is a diagram seen from the front side of the base material 41, Fig. 7(a2) is a VIIA-VIIA cross section of Fig. 7(a3), and Fig. 7(a3) is a diagram of the electric wiring board 4 seen from the back side of the base material 41. Figs. 7(b1) and (b2) are diagrams showing the inkjet recording head 1 during a wiping operation, Fig. 7(b1) is a plan view seen from the ejection port surface 35 side, and Fig. 7(b2) is a VIIB-VIIB cross section of Fig. 7(b1).

[0028] During wiping, if the load of blade 81 causes a large deflection of portion 49 of electric wiring board 4, there is a possibility that blade 81 will enter gap 5. In particular, if blade 81 has a high hardness or if base material 41 of electric wiring board 4 has a low hardness, the pressing load of blade 81 will increase, increasing the possibility of blade 81 entering gap 5.

[0029] Therefore, in this embodiment, in order to increase the rigidity of the portion 49 of the electric wiring board 4, the shape of the wiring pattern of the copper foil 42 is changed in the portion 49 of the electric wiring board 4. As shown in FIG. 7(a3), the width W of the wiring pattern 421 of the copper foil 42 arranged inside the portion 49 of the electric wiring board 4 covering the gap 5 is increased. Then, as shown in FIG. 7(b2), this wiring pattern 421 is provided so as to straddle the surface of the recording element substrate 3 and the support surface 21 of the housing 2 when viewed from a direction perpendicular to the ejection port surface 35. This makes it possible to increase the rigidity of the portion 49 of the electric wiring board 4 covering the gap 5.

[0030] 8 is a diagram showing a modified example of the inkjet recording head 1 during the wiping operation of this embodiment. FIG. 8(a) is a plan view seen from the ejection port surface 35 side, and FIG. 8(b) is a cross section taken along line VIII-VIII of FIG. 8(a). In cases where the actual wiring as shown in FIG. 7 cannot be made thicker due to wiring design reasons, etc., a wiring pattern 423 provided separately from the actual wiring 422 may be formed of copper foil 42 on a portion 49 of the electric wiring board 4 as shown in FIG. 8. This wiring pattern 423 is provided so as to straddle the surface of the recording element board 3 and the support surface 21 of the housing 2, thereby making it possible to increase the rigidity of the portion 49 of the electric wiring board 4 that covers the gap 5.

[0031] (Fourth embodiment) Fig. 9 is a diagram showing the inkjet recording head 1 during the wiping operation of this embodiment. Fig. 9(a) is a plan view seen from the ejection port surface 35 side, Fig. 9(b) is a cross-sectional view taken along line IX-IX in Fig. 9(a), and Fig. 9(c) is an enlarged view of region D in Fig. 9(b).

[0032] In the above-described embodiment, the portion 49 of the electric wiring board 4 located above the gap 5 is shaped to extend from the support surface 21 to a position spanning the surface of the recording element substrate 3. However, in this embodiment, the portion 494 of the electric wiring board 4 does not reach the surface of the recording element substrate 3 in the wiping direction of the blade 81, and this portion 494 is configured to cover a part of the gap 5 in the wiping direction.

[0033] For example, if there is variation in punching the base material 41 in the manufacturing process of the electric wiring board 4, it may happen that the portion 491 of the electric wiring board 4 does not reach onto the recording element board 3 as in this embodiment.

[0034] In order to prevent the blade 81 from entering the gap 5, it is preferable that the portion 49 of the electric wiring board 4 located above the gap 5 extends from the support surface 21 to a position that spans the surface of the recording element substrate 3, as in the above embodiment. However, even with the configuration of this embodiment, it is possible to prevent the blade 81 from entering the gap 5. Furthermore, even if the blade 81 enters the gap 5, the contact width with the ink 7 is reduced compared to a configuration in which the electric wiring board 4 does not have a portion that covers the gap 5, so that the amount of ink 7 adhering to the blade 81 is small, and the influence on ink ejection can be suppressed. Note that, in the configuration of this embodiment, from the viewpoint of preventing the blade 81 from entering, it is preferable that the distance Ws from the tip of the portion 494 of the electric wiring board 4 to the end of the recording element substrate 3 is equal to or less than the width Wb of the blade 81.

[0035] (Inkjet recording device) 10 is a perspective view of an example of an inkjet recording apparatus 100 as a liquid ejection apparatus to which this embodiment can be applied. In a recovery process for the ejection port surface 35 of the inkjet recording head 1, the ejection port surface 35 is wiped using a blade 81 provided in the inkjet recording apparatus 100 to remove and clean ink droplets and the like adhering to the ejection port surface 35. Note that it is sufficient that the ejection port surface 35 and the blade 81 move relatively to clean the ejection port surface 35 with the blade 81, and at least one of them needs to move. In this specification, the "wiping direction" refers to the relative movement direction of the blade 81 with respect to the ejection port surface 35 during the wiping operation. [Explanation of symbols]

[0036] 1. Inkjet recording head (liquid ejection head) 2 Housing (supporting member) 3. Recording element board 4 Electrical wiring board 5. Gap 21 Support surface 35 Discharge port surface 49 parts 81 Blade (wiping member) 100 Inkjet recording device (liquid ejection device)

Claims

1. a liquid ejection head including a substrate provided with an ejection port surface for ejecting liquid, an electric wiring board electrically connected to the substrate, and a support member provided with a support surface for supporting the electric wiring board; a wiping member that moves relatively to the ejection port surface to wipe the ejection port surface; In a liquid ejection device having the support surface is located upstream of the ejection port surface in a relative movement direction of the wiping member with respect to the ejection port surface during the wiping, with a gap between the support surface and the ejection port surface, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, The liquid ejection device is characterized in that the portion is provided so as to extend to a base portion of an inner lead which is an electrical connection portion between the substrate and the electrical wiring board.

2. The liquid ejection device according to claim 1 , wherein the portion reaches an end of the ejection face.

3. the support surface is located downstream of the discharge port surface in the movement direction, with a gap separate from the gap between the support surface and the discharge port surface, The liquid ejection device according to claim 1 , wherein the electrical wiring board does not cover the other gap.

4. A liquid ejection head comprising: a substrate having an ejection port surface for ejecting liquid; an electric wiring board electrically connected to said substrate; and a support member having a support surface for supporting said electric wiring board; a wiping member that moves relatively to the ejection port surface to wipe the ejection port surface; In a liquid ejection device having the support surface is located upstream of the ejection port surface in a relative movement direction of the wiping member with respect to the ejection port surface during the wiping, with a gap between the support surface and the ejection port surface, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, the support surface is located downstream of the discharge port surface in the movement direction, with a gap separate from the gap between the support surface and the discharge port surface, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the other gap, the portion being different from the other gap; A liquid ejection device, wherein a length of the portion protruding from the support surface is longer than a length of the other portion protruding from the support surface.

5. A liquid ejection head comprising: a substrate having an ejection port surface for ejecting liquid; an electric wiring board electrically connected to said substrate; and a support member having a support surface for supporting said electric wiring board; a wiping member that moves relatively to the ejection port surface to wipe the ejection port surface; In a liquid ejection device having the support surface is located upstream of the ejection port surface in a relative movement direction of the wiping member with respect to the ejection port surface during the wiping, with a gap between the support surface and the ejection port surface, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, A liquid ejection device, characterized in that wiring is provided inside the portion.

6. The liquid ejection device according to claim 5 , wherein the wiring extends across the support surface and the ejection port surface when viewed from a direction perpendicular to the ejection port surface.

7. The liquid ejection device according to claim 5 or 6, wherein the wiring has a wider width at the portion.

8. A liquid ejection head comprising: a substrate having an ejection port surface for ejecting liquid; an electric wiring board electrically connected to the substrate; and a support member having a support surface for supporting the electric wiring board; a wiping member that moves relatively to the ejection port surface to wipe the ejection port surface; In a liquid ejection device having the support surface is located upstream of the ejection port surface in a relative movement direction of the wiping member with respect to the ejection port surface during the wiping, with a gap between the support surface and the ejection port surface, The liquid ejection device, wherein the electric wiring board has a plurality of portions that protrude from the support surface and cover at least a portion of the gap.

9. A liquid ejection head comprising: a substrate having an ejection port surface for ejecting liquid; an electric wiring board electrically connected to the substrate; and a support member having a support surface for supporting the electric wiring board; a wiping member that moves relatively to the ejection port surface to wipe the ejection port surface; In a liquid ejection device having the support surface is located upstream of the ejection port surface in a relative movement direction of the wiping member with respect to the ejection port surface during the wiping, with a gap between the support surface and the ejection port surface, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, the portion does not extend to an edge of the outlet face, A liquid ejection device, wherein a distance between the portion and the end of the ejection port surface is the same as or smaller than a width of the wiping member.

10. The liquid ejection device according to claim 1 , wherein the wiping member wipes the ejection port surface by passing through the portion.

11. a substrate provided with a discharge port surface for discharging liquid; an electrical wiring board electrically connected to the substrate; a support member having a support surface for supporting the electric wiring board; In a liquid ejection head comprising: the support surface is located upstream of the ejection port surface with a gap therebetween in a relative movement direction of a wiping member that wipes the ejection port surface with respect to the ejection port surface during wiping, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, The liquid ejection head is characterized in that the portion is provided so as to extend to a base portion of an inner lead which is an electrical connection portion between the substrate and the electrical wiring board.

12. The liquid ejection head according to claim 11 , wherein the portion reaches an end of the ejection port surface.

13. the support surface is located downstream of the discharge port surface in the movement direction, with a gap separate from the gap between the support surface and the discharge port surface, The liquid ejection head according to claim 11 or 12, wherein the electric wiring board does not cover the other gap.

14. A substrate having an ejection port surface for ejecting liquid; an electrical wiring board electrically connected to the substrate; a support member having a support surface for supporting the electric wiring board; In a liquid ejection head comprising: the support surface is located upstream of the ejection port surface with a gap therebetween in a relative movement direction of a wiping member that wipes the ejection port surface with respect to the ejection port surface during wiping, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, the support surface is located downstream of the discharge port surface in the movement direction, with a gap separate from the gap between the support surface and the discharge port surface, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the other gap, the portion being different from the other gap; A liquid ejection head, wherein a length of the portion that protrudes from the support surface is longer than a length of the other portion that protrudes from the support surface.

15. A substrate having an ejection port surface for ejecting liquid; an electrical wiring board electrically connected to the substrate; a support member having a support surface for supporting the electric wiring board; In a liquid ejection head comprising: the support surface is located upstream of the ejection port surface with a gap therebetween in a relative movement direction of a wiping member that wipes the ejection port surface with respect to the ejection port surface during wiping, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, A liquid ejection head, characterized in that wiring is provided inside the portion.

16. The liquid ejection head according to claim 15 , wherein the wiring straddles the support surface and the ejection port surface when viewed from a direction perpendicular to the ejection port surface.

17. 17. The liquid ejection head according to claim 15, wherein the wiring has a wider width at the portion.

18. A substrate having an ejection port surface for ejecting liquid; an electrical wiring board electrically connected to the substrate; a support member having a support surface for supporting the electric wiring board; In a liquid ejection head comprising: the support surface is located upstream of the ejection port surface with a gap therebetween in a relative movement direction of a wiping member that wipes the ejection port surface with respect to the ejection port surface during wiping, the electrical wiring board has a portion that protrudes from the support surface and covers at least a portion of the gap, The liquid ejection head is characterized in that the electric wiring board has a plurality of the above-mentioned portions.

Images