Machining method, machining device, and machining program

Abstract

To provide a technology for additional machining of a workpiece having a larger diameter within the same machining area. [Solution] A method for machining a workpiece using a machining device, the machining device comprising a workpiece spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis, a laser head capable of supplying powder material to the workpiece and performing additional machining by irradiating the workpiece with laser light, and a drive unit for driving the laser head, the machining method comprising the steps of rotating the workpiece using the workpiece spindle, and performing additional machining on the rotating workpiece while moving the laser head in the direction of the rotation axis while keeping the distance between the laser light irradiation port of the laser head and the surface of the workpiece constant. In the step of performing additional machining, the laser light is irradiated onto the surface of the workpiece above the rotation axis, and is not irradiated onto the intersection of the vertical plane along the rotation axis and the surface of the workpiece.

Description

[Technical field]

[0001] The present disclosure relates to a processing method, a processing apparatus, and a processing program. [Background technology]

[0002] In recent years, additive processing equipment capable of forming a workpiece by melting and layering supplied powder material has become widespread. This type of forming method is called the Directed Energy Deposition (DED) method. DED additive processing equipment has a laser head. The laser head ejects powder material onto the workpiece while moving relative to the workpiece, and irradiates the workpiece with laser light. This melts the portion of the workpiece irradiated with the laser light. When powder material is supplied to the melted portion, it melts and solidifies, and is layered on the workpiece.

[0003] Regarding additive processing technology using the DED method, JP 2020-189316 A (Patent Document 1) discloses a "build-up method for stacking a uniform build-up layer on the inner wall of a hollow hole in a workpiece having a hollow hole" (see paragraph

[0005] ). In this build-up method, a cylindrical workpiece is rotated around the central axis of the cylinder while being tilted, and powder material and laser light are emitted onto the inner wall of the hollow hole. The powder material and laser light are emitted in the direction of gravity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-189316 A Summary of the Invention [Problem to be solved by the invention]

[0005] The maximum diameter of a workpiece that can be additionally machined is determined on the premise that additional machining is performed on the outer circumferential surface of the workpiece. This maximum diameter is limited by the size of the machining area in the processing device. In view of this, a technology that allows additional machining of a workpiece with a larger diameter within the same machining area is desired. [Means for solving the problem]

[0006] In one example of the present disclosure, a method for processing a workpiece by a processing device is provided. The processing device includes a workpiece spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis, a laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light, and a drive unit for driving the laser head. The processing method includes a step of rotating the workpiece by the workpiece spindle, and a step of performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while keeping the distance between the irradiation port of the laser light by the laser head and the surface of the workpiece constant. In the step of performing the additional processing, the drive unit is controlled so that the laser light is irradiated on the surface of the workpiece above the rotation axis and is not irradiated on the intersection portion between the vertical plane along the rotation axis and the surface of the workpiece.

[0007] In one example of the present disclosure, when the angle formed by the perpendicular direction of the surface at the irradiation point of the laser light and the optical axis of the laser head on a vertical plane perpendicular to the rotation axis is defined as a first angle, in the step of performing the additional processing, the drive unit is controlled so that the first angle is greater than 0 degrees and less than 90 degrees.

[0008] In one example of the present disclosure, in the step of performing the additional processing, the drive unit is controlled so that the optical axis faces a vertical direction when viewed from a direction of the rotation axis.

[0009] In one example of the present disclosure, when the angle formed by the perpendicular direction of the surface at the irradiation point of the laser light and the optical axis on a vertical plane along the rotation axis is defined as a second angle, in the step of performing the additional processing, the drive unit is controlled so that the second angle is greater than 0 degrees and less than 90 degrees.

[0010] In one example of the present disclosure, the second angle is set so that, when viewed from a horizontal direction perpendicular to the rotation axis, the irradiation point of the laser light on the workpiece is between the laser head and the workpiece spindle.

[0011] In one example of the present disclosure, the processing device further includes a cover body defining a processing area for performing the additional processing, and a window provided in the cover body. In the step of performing the additional processing, the drive unit is controlled so that an irradiation point of the laser light on the workpiece is located behind the intersection line portion in a front view of the processing area through the window.

[0012] In one example of the present disclosure, the step of performing the additional machining is executed when the diameter of the workpiece is greater than a predetermined value.

[0013] In another example of the present disclosure, a processing device is provided. The processing device includes a work spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis, a laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light, a drive unit for driving the laser head, and a control unit. The control unit executes a process of rotating the workpiece on the work spindle, and a process of performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while keeping the distance between the irradiation port of the laser light by the laser head and the surface of the workpiece constant. In the process of performing the additional processing, the drive unit is controlled so that the laser light is irradiated on the surface of the workpiece above the rotation axis and is not irradiated on the intersection part between the vertical plane along the rotation axis and the surface of the workpiece.

[0014] In another example of the present disclosure, a processing program for a workpiece by a processing device is provided. The processing device includes a workpiece spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis, a laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light, and a drive unit for driving the laser head. The processing program causes the processing device to execute a step of rotating the workpiece by the workpiece spindle, and a step of performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while keeping the distance between the irradiation port of the laser light by the laser head and the surface of the workpiece constant. In the step of performing the additional processing, the drive unit is controlled so that the laser light is irradiated on the surface of the workpiece above the rotation axis and is not irradiated on the intersection portion between the vertical plane along the rotation axis and the surface of the workpiece.

[0015] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0016] [Figure 1] FIG. 2 is a diagram showing an example of the appearance of a processing device. [Diagram 2] FIG. 2 is a diagram illustrating an example of a device configuration of a processing device. [Diagram 3] 1 shows a cross-sectional view of a laser head during additive processing. [Figure 4] FIG. 2 is a diagram showing an embodiment of a coating process. [Diagram 5] FIG. 13 is a view from the Z-axis direction showing the laser head performing coating processing. [Figure 6] FIG. 6 is a view showing the coating process shown in FIG. 5 from the X-axis direction. [Figure 7] 1 is a diagram showing the laser head performing coating processing on the top of the workpiece from the Z-axis direction. FIG. [Figure 8] 13 is a diagram showing the state in which the laser head is performing special coating processing according to the first modified example, viewed from the Y-axis direction. FIG. [Figure 9] 13 is a diagram showing the state in which the laser head is performing special coating processing according to the second modified example, as viewed from the X direction. FIG. [Figure 10] FIG. 2 is a diagram illustrating an example of a drive mechanism of the processing device. [Figure 11] FIG. 2 illustrates an example of a hardware configuration of a control unit. [Figure 12] 1 is a flowchart showing a flow of a coating process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are given the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated. Note that each embodiment and each modified example described below may be appropriately and selectively combined.

[0018] <A. Appearance of the processing device 100> First, with reference to FIG. 1, the processing device 100 according to the embodiment will be described. FIG. 1 is a diagram showing an example of the appearance of the processing device 100.

[0019] The processing device 100 is a processing machine capable of additive processing (AM (Additive manufacturing) processing) in which a powder material is supplied while irradiating a workpiece with a laser beam, and subtractive processing (SM (Subtractive manufacturing)) of the workpiece using a tool. The subtractive processing function of the processing device 100 includes, for example, at least one of a milling function and a turning function using a fixed tool.

[0020] The processing device 100 includes, for example, a cover body 130 and an operation panel 200.

[0021] The cover body 130 is a mechanism for protecting the components provided inside the processing device 100. A door DR is provided on the cover body 130. The door DR is, for example, a slide-type door. The door DR may be configured to be openable and closable by a drive source such as a motor, or may be configured to be openable and closable manually.

[0022] A window WD is provided on the door DR. An operator can check the state of the processing area inside the processing device 100 through the window WD.

[0023] In the example of FIG. 1, an example in which the window WD is provided on the door DR is shown, but the window WD may be provided on a part other than the door DR. Also, the number of windows WD provided on the cover body 130 may be one or a plurality.

[0024] The operation panel 200 is a general-purpose computer and has a display for displaying various pieces of information related to processing. The display is, for example, a liquid crystal display, an organic EL (Electro Luminescence) display, or other display device. Further, the display is provided with a touch panel and accepts various operations on the processing apparatus 100 by touch operations.

[0025] <B. Device Configuration of Processing Apparatus 100> Next, with reference to FIG. 2, the device configuration of the processing apparatus 100 will be described. FIG. 2 is a diagram showing an example of the device configuration of the processing apparatus 100.

[0026] As described above, the processing apparatus 100 includes a cover body 130. The cover body 130 forms the exterior of the processing apparatus 100 and partitions and forms a processing area AR for performing additional processing on the workpiece W.

[0027] Further, the processing apparatus 100 includes a bed 11, a tool rest 16, a workpiece spindle 22, a steady rest 25, a tool spindle 30, and a laser head 140.

[0028] For the sake of convenience of explanation, hereinafter, the rotational axis direction of the workpiece spindle 22 is also referred to as the "Z-axis direction". The Z-axis direction is parallel to the axes AX1 to AX3 shown in FIG. 2. Also, one direction on the horizontal plane orthogonal to the Z-axis direction is also referred to as the "Y-axis direction". The direction orthogonal to both the Y-axis direction and the Z-axis direction is referred to as the "X-axis direction". In the example of FIG. 2, the X-axis direction corresponds to the direction opposite to the gravitational direction.

[0029] The bed 11 is a base member for supporting various devices provided in the processing apparatus 100. In the example of FIG. 2, the bed 11 supports the tool rest 16, the workpiece spindle 22, the steady rest 25, and the laser head 140. The bed 11 is installed on the floor surface of a factory or the like. The bed 11 is formed of a metal such as cast iron.

[0030] The tool rest 16 has a turret 18. The turret 18 is configured to be rotatable about an axis AX1. The turret 18 holds a plurality of tools at intervals in the circumferential direction about the axis AX1. The tool rest 16 is also configured to be movable in the Y-axis direction and the X-axis direction by various driving mechanisms such as a motor. The tool rest 16 performs turning by bringing a fixed tool held by the turret 18 into contact with a workpiece W that is rotationally driven by a workpiece spindle 22.

[0031] The work spindle 22 is configured to be rotatable while holding the workpiece W. More specifically, the work spindle 22 is provided with a chuck mechanism 23. The chuck mechanism 23 is a mechanism for fixing the workpiece W to the work spindle 22. The work spindle 22 is also configured to be rotatable about an axis AX2 that is aligned with the axial direction of the work spindle 22.

[0032] The tailstock 25 is configured to be movable along the axis AX3 by various driving mechanisms such as a motor. As a result, the tailstock 25 supports the long workpiece W from the side opposite to the workpiece spindle 22. Typically, the axis AX3 is coaxial with the axis AX2. The tailstock 25 is also configured to be rotatable about the axis AX3.

[0033] A second work spindle (not shown) may be provided instead of the tailstock 25. The second work spindle is provided opposite the work spindle 22 and is configured to be able to hold the work W from the side opposite the work spindle 22.

[0034] The tool spindle 30 is provided, for example, at a position higher than the work spindle 22 and the tailstock 25. The tool spindle 30 is configured to allow a tool and a laser head 140 to be detachably attached thereto. Fig. 2 shows an example in which the laser head 140 is attached to the tool spindle 30.

[0035] The attachment and detachment of the laser head 140 to and from the tool spindle 30 is realized by a dedicated attachment and detachment mechanism (not shown) for the laser head 140, which is different from, for example, an automatic tool changer (ATC: Automatic Tool Changer) used for automatic tool change of a cutting tool. When performing additional processing on the workpiece W, the processing apparatus 100 attaches the laser head 140 to the tool spindle 30. On the other hand, when performing removal processing on the workpiece W, the processing apparatus 100 attaches a tool to the tool spindle 30.

[0036] As an example of removal processing, there is milling in which a rotating tool is brought into contact with the workpiece W fixed to the workpiece spindle 22. As another example of removal processing, there is turning in which a tool is pressed against the workpiece W rotating about the axis AX2.

[0037] The laser head 140 performs additional processing by the DED method while being attached to the tool spindle 30. As a mechanism for realizing additional processing, the laser head 140 includes a head body 142 and a laser nozzle 146.

[0038] Powder material is supplied to the head body 142 via a cable (not shown). The supplied powder material may be metal powder, resin powder, or other types of powder that melt upon irradiation with laser light.

[0039] The laser nozzle 146 irradiates the workpiece W with laser light and defines the laser light irradiation region on the workpiece W. The powder material supplied to the laser head 140 is discharged toward the workpiece W through the laser nozzle 146.

[0040] <C. Additional Processing> Next, with reference to FIGS. 3 to 7, the additional processing by the laser head 140 will be described in more detail. FIG. 3 shows a cross-sectional view of the laser head 140 during additional processing.

[0041] While at least one of the laser head 140 and the workpiece W is being driven, the laser head 140 irradiates the surface of the workpiece W with the laser light LS. As an example, while moving in the axial direction of the workpiece spindle 22 (i.e., the Z-axis direction), the laser head 140 irradiates the rotating workpiece W with the laser light LS. As a result, the workpiece W melts at the irradiated portion of the laser light LS, and a molten pool MP is formed on the surface of the workpiece W.

[0042] In parallel with the irradiation of the laser light LS, the laser head 140 supplies the powder material PM to the molten pool MP. The powder material PM is guided to the molten pool MP by the gas GS discharged from the laser head 140. As a result, the powder material PM melts and liquefies in the molten pool MP. Then, as the molten pool MP solidifies, a layer SL is formed on the workpiece W. Note that the gas GS also functions as a shielding gas and prevents oxidation of the workpiece W, which is a laminate.

[0043] The processing apparatus 100 can realize various additional processes by controlling the laser head 140. Examples of the types of additional processes include a laminating process and a coating process. The laminating process is a process of stacking layers SL on the workpiece W. The coating process is a process of covering the surface of the workpiece W with the layer SL.

[0044] FIG. 4 is a diagram showing an aspect of the coating process. More specifically, the processing apparatus 100 first rotates a workpiece W that is axisymmetric with respect to the axis AX2 on the workpiece spindle 22. As a result, the workpiece W rotates about the axis AX2. Next, the processing apparatus 100 performs an additional process on the rotating workpiece W while moving the laser head 140 in the direction of the axis AX2 while keeping the distance between the irradiation port of the laser light LS by the laser head 140 and the surface of the workpiece W constant. Thereby, the surface of the workpiece W is coated with the layer SL.

[0045] <D. Coating Process> Next, the coating process will be further described with reference to Fig. 5 to Fig. 7. Fig. 5 is a view showing the state in which the laser head 140 is performing the coating process from the Z-axis direction. Fig. 6 is a view showing the coating process shown in Fig. 5 from the X-axis direction. For ease of explanation, the laser head 140 is omitted from Fig. 6.

[0046] 5 corresponds to a position where the laser head 140 irradiates the laser light LS onto the workpiece W. In other words, the irradiation point IP corresponds to an intersection point between the laser light LS irradiated from the laser head 140 and the outer circumferential surface of the workpiece W.

[0047] 5 represents the central axis of the laser beam LS emitted from the laser head 140. The optical axis LX corresponds to a line connecting the center point of the emission port of the laser beam LS emitted by the laser head 140 and the focal point of the laser beam LS.

[0048] A vertical axis SX shown in FIG. 5 represents a direction perpendicular to the outer circumferential surface of the workpiece W on the irradiation point IP of the laser light LS.

[0049] The tilt angle θ shown in FIG. T The (first angle) is the angle between the vertical axis SX and the optical axis LX on a vertical plane perpendicular to the axis AX2 (i.e., on the XY plane). In other words, the tilt angle θ T is the angle between the vertical axis SX projected onto the XY plane and the optical axis LX projected onto the XY plane.

[0050] The apex TP shown in FIGS. 5 and 6 represents the upper intersection of the vertical plane along the axis AX2 and the surface of the workpiece W.

[0051] In this embodiment, the driving of the laser head 140 is controlled so that the laser light LS is irradiated onto the surface of the workpiece W above the axis AX2 during additional processing, but is not irradiated onto the top part TP. In other words, the laser head 140 performs coating processing in a state where the irradiation point IP is shifted from the top part TP in the Y-axis direction. As a result, the irradiation point IP passes through a path IR that does not overlap with the top part TP (see FIG. 6).

[0052] The effect of irradiating the laser beam LS to a portion other than the top portion TP of the workpiece W will be described with reference to Fig. 7. Fig. 7 is a view showing the state in which the laser head 140 is performing coating processing on the top portion TP of the workpiece W, as viewed from the Z-axis direction.

[0053] In the example of Fig. 7, the laser head 140 irradiates the top TP of the workpiece with the laser light LS in the vertical direction (i.e., the direction of gravity). Hereinafter, this type of coating process is also referred to as "normal coating process". In contrast, the coating process shown in Figs. 5 and 6 is also referred to as "special coating process".

[0054] 5 to 7, when the laser head 140 performs special coating processing, the position of the laser head 140 is lower than when the laser head 140 performs normal coating processing. Therefore, the processing device 100 can coat a workpiece W having a larger diameter within the same processing area.

[0055] In normal coating processing, since the laser beam LS is irradiated onto the top TP from directly above, the shape of the irradiation point IP approaches a perfect circle, improving the additional processing accuracy. On the other hand, in special coating processing, the shape of the irradiation point IP becomes approximately elliptical. Therefore, the shaping accuracy of normal coating processing is higher than that of special coating processing. However, the particle size of the powder material PM varies in the range of about 50 to 100 microns, and from this range of variation, the decrease in the shaping accuracy of special coating processing is negligible. The processing apparatus 100 can obtain an effect that exceeds the decrease in shaping accuracy by performing coating additional processing.

[0056] Note that the tilt angle θ T may be 0 degrees or may be greater than 0 degrees. Preferably, when performing special coating processing, the tilt angle θ T is such that the laser head 140 is driven so as to be greater than 0 degrees and less than 90 degrees. In the example of FIG. 5, the tilt angle θ T of the laser head 140 is controlled so that the optical axis LX faces the vertical direction (i.e., the X-axis direction) when viewed from the direction of the axis AX2.

[0057] Also, the irradiation point IP may be located on the front side of the top TP or on the back side of the top TP in a front view of the processing area AR viewed through the above-described window WD (see FIG. 1). Preferably, the processing apparatus 100 controls the driving of the laser head 140 so that the irradiation point IP is located on the back side of the top TP in a front view of the processing area AR viewed through the above-described window WD. As a result, the workpiece W exists between the window WD and the irradiation point IP. Thereby, the laser beam LS reflected by the workpiece W is prevented from hitting the window WD, and damage to the window WD is prevented.

[0058] <E. Modification Example 1> Next, with reference to FIG. 8, a modification example of the special coating processing shown in FIGS. 5 and 6 will be described. FIG. 8 is a view showing a state in which the laser head 140 is performing special coating processing according to this modification example from the Y-axis direction.

[0059] The definitions of the irradiation point IP, the optical axis LX, and the vertical axis SX shown in FIG. 8 are as described above, and therefore the description thereof will not be repeated.

[0060] The lead angle θ shown in FIG. L The second angle is the angle between the vertical axis SX and the optical axis LX on a vertical plane along the axis AX2 (i.e., on the XZ plane). In other words, the lead angle θ L is the angle between the vertical axis SX projected onto the XZ plane and the optical axis LX projected onto the XZ plane.

[0061] In the special coating process shown in Figures 5 and 6 above, the lead angle θ L On the other hand, in the special coating process according to this modified example, the lead angle θ L is greater than 0 degrees and less than 90 degrees.

[0062] In this way, the lead angle θ is greater than 0 degrees and less than 90 degrees. L When the special coating process is performed while maintaining the above, the position of the laser head 140 becomes even lower than in the case of the special coating process shown in Figures 5 and 6. This enables the processing device 100 to coat the workpiece W with an even larger diameter.

[0063] Preferably, the lead angle θ is set so that the irradiation point IP of the laser light LS on the workpiece W is between the laser head 140 and the workpiece spindle 22 when viewed from a horizontal direction perpendicular to the axis AX2 (i.e., the Y-axis direction). L is set. In other words, the processing device 100 performs the special coating processing in a state where the laser head 140 is tilted in a direction away from the workpiece spindle 22. This allows the processing device 100 to perform the special coating processing while avoiding interference between the workpiece spindle 22 and the laser head 140. As a result, the processing device 100 can coat a longer workpiece W within the same processing area.

[0064] <Example of Modification 2> Next, with reference to FIG. 9, a modification of the workpiece W that is symmetric with respect to the special coating process will be described. FIG. 9 is a view showing the state in which the laser head 140 is performing the special coating process according to this modification from the X direction.

[0065] In the examples of FIGS. 5 and 6 described above, the cylindrical workpiece W was subjected to the special coating process. However, the workpiece W to be subjected to the special coating process is not limited thereto, and various workpieces that are axisymmetric with respect to the axis AX2 are targeted. FIG. 9 shows a workpiece WA whose diameter varies at each location in the Z-axis direction as another example of the axisymmetric workpiece W. The processing apparatus 100 can also perform the special coating process on such a workpiece WA.

[0066] <G. Driving Mechanism of the Processing Apparatus 100> Next, with reference to FIG. 10, the driving mechanism in the processing apparatus 100 will be described. FIG. 10 is a view showing an example of the driving mechanism of the processing apparatus 100.

[0067] As shown in FIG. 10, the processing apparatus 100 includes a control unit 50 and driving units 210, 220, 230A, 230B, 240.

[0068] The control unit 50 controls various devices within the processing apparatus 100. The device configuration of the control unit 50 is arbitrary. The control unit 50 may be composed of a single control unit or a plurality of control units. As an example, the control unit 50 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0069] The driving unit 210 is a driving mechanism for rotationally driving the workpiece spindle 22. The driving unit 210 may be composed of a single driving unit or a plurality of driving units. In the example of FIG. 10, the driving unit 210 is composed of a motor driver 211C and a motor 212C.

[0070] The motor driver 211C sequentially receives input of the target rotation angle or the target rotation speed of the work spindle 22 from the control unit 50, and outputs a current according to the target rotation angle or the target rotation speed to the motor 212C. As a result, the work held by the work spindle 22 rotates about the Z-axis direction as the center of rotation. The motor 212C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0071] The driving unit 220 is a driving mechanism for driving the tailstock 25. The driving unit 220 may be composed of a single driving unit, or may be composed of multiple driving units. In the example of Fig. 10, the driving unit 220 is composed of a motor driver 221Z and a motor 222Z.

[0072] The motor driver 221Z sequentially receives input of target positions for the work spindle 22 from the control unit 50, and outputs a current corresponding to the target positions to the motor 222Z. This causes the motor 222Z to move the tailstock 25 to an arbitrary position in the Z-axis direction. The motor 222Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0073] The driving unit 230A is a driving mechanism for moving the position of the tool spindle 30. The above-mentioned laser head 140 is driven by being attached to the tool spindle 30. The driving unit 230A may be composed of a single driving unit, or may be composed of a plurality of driving units. In the example of FIG. 10, the driving unit 230A is composed of motor drivers 231X to 231Z and motors 232X to 232Z.

[0074] The motor driver 231X sequentially receives input of target positions of the tool spindle 30 in the Y-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232X. As a result, the motor 232X drives the tool spindle 30 to an arbitrary position in the Y-axis direction. The motor 232X may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0075] The motor driver 231Y sequentially receives input of target positions of the tool spindle 30 in the X-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Y. As a result, the motor 232Y drives the tool spindle 30 to an arbitrary position in the X-axis direction. The motor 232Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0076] The motor driver 231Z sequentially receives input of target positions of the tool spindle 30 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target positions to the motor 232Z. As a result, the motor 232Z moves the tool spindle 30 to an arbitrary position in the Z-axis direction. The motor 232Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0077] The driving unit 230B is a driving mechanism for rotationally driving the tool spindle 30. The driving unit 230B may be composed of a single driving unit, or may be composed of multiple driving units. In the example of Fig. 10, the driving unit 230B is composed of motor drivers 231A and 231B and motors 232A and 232B.

[0078] The motor driver 231A sequentially receives input of a target rotation angle or a target rotation speed of the tool spindle 30 centered on the Y-axis direction from the control unit 50, and outputs a current according to the target rotation angle or the target rotation speed to the motor 232A. The motor 232A drives the tool spindle 30 to rotate around the Y-axis direction. The motor 232A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0079] The motor driver 231B sequentially receives an input of a target rotation angle or a target rotation speed of the tool spindle 30 about the axial direction of the tool spindle 30 as a rotation center from the control unit 50, and outputs a current according to the target rotation angle or the target rotation speed to the motor 232B. The motor 232B drives and rotates the tool spindle 30 about the axial direction of the tool spindle 30 as a rotation center. The motor 232B may be an AC motor, a stepping motor, a servo motor, or another type of motor.

[0080] The driving unit 240 is a driving mechanism for driving the tool rest 16 and the turret 18. The driving unit 240 may be composed of a single driving unit, or may be composed of multiple driving units. In the example of Fig. 10, the driving unit 240 is composed of motor drivers 241C, 241Y, and 241Z, and motors 242C, 242Y, and 242Z.

[0081] The motor driver 241C receives an input of a target value for the rotation angle of the turret 18 about the Z-axis direction, and outputs a current according to the target value to the motor 242C. In this way, the motor driver 241C controls the rotation angle of the turret 18 about the Z-axis direction as the center of rotation. The motor 242C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0082] The motor driver 241Y sequentially receives the input of the target position of the tool rest 16 in the X-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 242Y. Thereby, the motor 242Y moves the tool rest 16 to an arbitrary position in the X-axis direction. The motor 242Y may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0083] The motor driver 241Z sequentially receives the input of the target position of the tool rest 16 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 242Z. Thereby, the motor 242Z moves the tool rest 16 to an arbitrary position in the Z-axis direction. The motor 242Z may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0084] <H. Hardware Configuration of Control Unit 50> Next, with reference to FIG. 11, the hardware configuration of the control unit 50 shown in FIG. 10 will be described. FIG. 11 is a diagram showing an example of the hardware configuration of the control unit 50.

[0085] As described above, the control unit 50 may be a CNC or a PLC. FIG. 11 shows the hardware configuration of the control unit 50 as a CNC.

[0086] The control unit 50 includes, for example, a control circuit 101, a ROM (Read Only Memory) 102, a RAM (Random Access Memory) 103, a communication interface 104, and an auxiliary storage device 120. These components are connected to an internal bus 109.

[0087] The control circuit 101 is configured, for example, by at least one integrated circuit. The integrated circuit may be configured, for example, by at least one central processing unit (CPU), at least one graphics processing unit (GPU), at least one application specific integrated circuit (ASIC), at least one field programmable gate array (FPGA), or a combination thereof.

[0088] The control circuit 101 controls the operation of the control unit 50 by executing various programs such as a machining program 122. The machining program 122 is a program for realizing various processes described in this specification. Based on receiving an execution command for the machining program 122, the control circuit 101 reads the machining program 122 from the ROM 102 to the RAM 103. The RAM 103 functions as a working memory and temporarily stores various data required for executing the machining program 122.

[0089] The communication interface 104 is an interface for realizing communication with various devices. The processing device 100 communicates with various drive units (e.g., the above-mentioned drive units 210, 220, 230A, 230B, 240, etc.) for realizing additional processing of the workpiece, for example, via the communication interface 104.

[0090] The auxiliary storage device 120 is a storage medium such as a hard disk or a flash memory. The auxiliary storage device 120 stores a machining program 122 and the like. The storage location of the machining program 122 is not limited to the auxiliary storage device 120, and may be stored in a memory area (e.g., cache memory) of the control circuit 101, the ROM 102, the RAM 103, an external device (e.g., a server), or the like.

[0091] Furthermore, the machining program 122 may be provided not as a standalone program but as part of an arbitrary program. In this case, various processes according to this embodiment are realized in cooperation with the arbitrary program. Even a program that does not include some of these modules does not deviate from the spirit of the machining program 122 according to this embodiment. Furthermore, some or all of the functions provided by the machining program 122 may be realized by dedicated hardware. Furthermore, the control unit 50 may be configured in the form of a so-called cloud service in which at least one server executes part of the processing of the machining program 122.

[0092] <I.フローチャート> Next, the control flow of the coating process will be described with reference to Fig. 12. Fig. 12 is a flowchart showing the flow of the coating process.

[0093] 12 is realized by the control unit 50 of the processing device 100 executing the above-mentioned processing program 122. In another aspect, a part or all of the processing may be executed by circuit elements or other hardware.

[0094] In step S110, the control unit 50 controls the above-mentioned drive unit 210 (see FIG. 10) to start rotating the workpiece W.

[0095] In step S120, the control unit 50 acquires the maximum diameter of the workpiece to be machined, and judges whether or not the maximum diameter is equal to or less than a predetermined threshold value. The maximum diameter may be acquired from the machining program 122, or may be input in advance by a user from the above-mentioned operation panel 200 or the like. When the control unit 50 judges that the maximum diameter of the workpiece to be machined is equal to or less than the predetermined threshold value (YES in step S120), it switches control to step S122. When not (NO in step S120), the control unit 50 switches control to step S132.

[0096] In step S122, the control unit 50 starts the above-mentioned normal coating process. The normal additional process is executed, for example, according to a processing program 122 that is designed in advance.

[0097] In step S124, the control unit 50 determines whether or not the laser head 140 has reached the processing end position. The processing end position of the laser head 140 is described in the processing program 122, for example.

[0098] When the control unit 50 determines that the laser head 140 has reached the processing end position (YES in step S124), it ends the normal coating process and switches the control to step S140. Otherwise (NO in step S124), the control unit 50 executes the process of step S124 again.

[0099] In step S132, the control unit 50 starts the above-mentioned special coating process. The special coating process is executed, for example, in accordance with the processing program 122 that is designed in advance.

[0100] In step S134, the control unit 50 determines whether or not the laser head 140 has reached the processing end position. The processing end position of the laser head 140 is described in the processing program 122, for example.

[0101] When the control unit 50 determines that the laser head 140 has reached the processing end position (YES in step S134), it ends the special coating processing and switches the control to step S140. Otherwise (NO in step S134), the control unit 50 executes the process of step S134 again.

[0102] In step S140, the control unit 50 removes the laser head 140 from the tool spindle 30 and mounts a tool for finishing on the tool spindle 30. Thereafter, the control unit 50 controls the tool spindle 30 to start finishing of the workpiece W. The finishing is achieved by removal processing. The finishing is performed, for example, according to a processing program 122 that is designed in advance.

[0103] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0104] 11 bed, 16 tool rest, 18 turret, 22 work spindle, 23 chuck mechanism, 25 tailstock, 30 tool spindle, 50 control unit, 100 machining device, 101 control circuit, 102 ROM, 103 RAM, 104 communication interface, 109 internal bus, 120 auxiliary storage device, 122 machining program, 130 cover body, 140 laser head, 142 head body, 146 laser nozzle, 200 operation panel, 210 drive unit, 211C motor driver, 212C motor, 220 drive unit, 221Z motor driver, 222Z motor, 230A drive unit, 230B drive unit, 231A motor driver, 231B motor driver, 231X motor driver, 231Y motor driver, 231Z motor driver, 232A Motor, 232B motor, 232X motor, 232Y motor, 232Z motor, 240 drive unit, 241C motor driver, 241Y motor driver, 241Z motor driver, 242C motor, 242Y motor, 242Z motor, AR machining area, AX1 axis, AX2 axis, AX3 axis, DR door, GS gas, IP irradiation point, IR path, LS laser light, LX optical axis, MP molten pool, PM powder material, SL layer, SX vertical axis, TP top, W workpiece, WA workpiece, WD window.

Claims

1. A method for machining a workpiece by a machining device, comprising: The processing device includes: A work spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; a drive unit for driving the laser head, The processing method includes: Rotating the workpiece on the workpiece spindle; and performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while maintaining a constant distance between an irradiation port of the laser light by the laser head and a surface of the workpiece, In the step of performing the additional processing, the drive unit is controlled so that the laser light is irradiated onto a surface of the workpiece above the rotation axis and is not irradiated onto an intersection portion between a vertical plane along the rotation axis and the surface of the workpiece, When an angle formed by a direction perpendicular to the surface at the irradiation point of the laser light and an optical axis of the laser head on a vertical plane perpendicular to the rotation axis is defined as a first angle, in the step of performing the additional processing, the drive unit is controlled so that the first angle is greater than 0 degrees and less than 90 degrees; A processing method in which, when the angle formed by the perpendicular direction of the surface at the irradiation point of the laser light and the optical axis on a vertical plane along the rotation axis is defined as a second angle, in the step of performing the additional processing, the drive unit is controlled so that the second angle is greater than 0 degrees and less than 90 degrees.

2. The processing method according to claim 1 , wherein in the step of performing the additional processing, the drive unit is controlled so that the optical axis is oriented in a vertical direction when viewed from a direction of the rotation axis.

3. 3. The machining method according to claim 1, wherein the second angle is set so that, when viewed from a horizontal direction perpendicular to the rotation axis, an irradiation point of the laser light on the workpiece is between the laser head and the workpiece spindle.

4. The processing device further comprises: A cover body that defines a processing area for performing the additional processing; A window is provided in the cover body, 3. The processing method according to claim 1, wherein in the step of performing the additional processing, the drive unit is controlled so that, when viewed from the front of the processing area through the window, the irradiation point of the laser light on the workpiece is located behind the intersection portion.

5. A method for machining a workpiece using a machining device, comprising: The processing device includes: A work spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; a drive unit for driving the laser head, The processing method includes: Rotating the workpiece on the workpiece spindle; and performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while maintaining a constant distance between an irradiation port of the laser light by the laser head and a surface of the workpiece, In the step of performing the additional processing, the drive unit is controlled so that the laser light is irradiated onto a surface of the workpiece above the rotation axis and is not irradiated onto an intersection portion between a vertical plane along the rotation axis and the surface of the workpiece, A machining method, wherein the step of performing additional machining is executed when the diameter of the workpiece is larger than a predetermined value.

6. A work spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; A drive unit for driving the laser head; A control unit. The control unit is A process of rotating the workpiece on the workpiece spindle; A process of performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while maintaining a constant distance between an irradiation port of the laser light by the laser head and a surface of the workpiece, In the process of performing the additional machining, the drive unit is controlled so that the laser light is irradiated onto the surface of the workpiece above the rotation axis and is not irradiated onto an intersection portion between a vertical plane along the rotation axis and the surface of the workpiece, When an angle formed by a direction perpendicular to the surface at an irradiation point of the laser light and an optical axis of the laser head on a vertical plane perpendicular to the rotation axis is defined as a first angle, in the process of performing the additional machining, the drive unit is controlled so that the first angle is greater than 0 degrees and less than 90 degrees; A processing device in which, when the angle formed by the perpendicular direction of the surface at the irradiation point of the laser light and the optical axis on a vertical plane along the rotation axis is defined as a second angle, in the process of performing the additional processing, the drive unit is controlled so that the second angle is greater than 0 degrees and less than 90 degrees.

7. A program for machining a workpiece by a machining device, The processing device includes: A work spindle capable of rotating a workpiece symmetrical with respect to a rotation axis about the rotation axis; A laser head capable of supplying powder material to the workpiece and performing additional processing by irradiating the workpiece with laser light; a drive unit for driving the laser head, The processing program is for the processing device. Rotating the workpiece on the workpiece spindle; and performing the additional processing on the rotating workpiece while moving the laser head in the direction of the rotation axis while maintaining a constant distance between an irradiation port of the laser light by the laser head and a surface of the workpiece. In the step of performing the additional processing, the drive unit is controlled so that the laser light is irradiated onto a surface of the workpiece above the rotation axis and is not irradiated onto an intersection portion between a vertical plane along the rotation axis and the surface of the workpiece, When an angle formed by a direction perpendicular to the surface at the irradiation point of the laser light and an optical axis of the laser head on a vertical plane perpendicular to the rotation axis is defined as a first angle, in the step of performing the additional processing, the drive unit is controlled so that the first angle is greater than 0 degrees and less than 90 degrees; A processing program in which, when the angle formed by the perpendicular direction of the surface at the irradiation point of the laser light and the optical axis on a vertical plane along the rotation axis is defined as a second angle, in the step of performing the additional processing, the drive unit is controlled so that the second angle is greater than 0 degrees and less than 90 degrees.

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