Radiation conversion unit and method for manufacturing the same

Abstract

A radiation conversion unit capable of sufficiently ensuring moisture resistance of a scintillator layer, and a method for manufacturing the same. [Solution] A radiation detector 10 includes a sensor panel 11 and a scintillator panel 1 arranged on the sensor panel 11. The scintillator panel 1 includes a support layer 4, a scintillator layer 5 arranged on the sensor panel 11 side of the support layer 4, an adhesive layer 6 arranged on the sensor panel 11 side of the scintillator layer 5 and in contact with the sensor panel 11, and a first moisture-proof layer 3 integrally covering an outer edge 51 of the scintillator layer 5 and an outer edge 61 of the adhesive layer 6. An edge 31 on the sensor panel 11 side of the first moisture-proof layer 3 includes at least one of an inner portion 311 arranged between the sensor panel 11 and the adhesive layer 6 on the inner side relative to the edge 31 of the adhesive layer 6, and an outer portion arranged on the sensor panel 11 on the outer side relative to the outer edge 61 of the adhesive layer 6.

Description

[Technical field]

[0001] The present invention relates to a radiation conversion unit and a method for manufacturing a radiation conversion unit. [Background technology]

[0002] As a conventional radiation conversion unit (radiation detector), Patent Document 1 describes a configuration in which a scintillator panel that converts radiation into light and a sensor panel that detects the converted light are bonded together via an adhesive layer. In the configuration described in Patent Document 1, a columnar crystal layer (scintillator layer) is covered with a moisture-proof protective layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-172511 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the radiation conversion unit as described above, it is extremely important to ensure that the scintillator layer is moisture-proof.

[0005] An object of the present invention is to provide a radiation conversion unit capable of ensuring sufficient moisture resistance of a scintillator layer, and a method for producing a radiation conversion unit by which such a radiation conversion unit can be obtained. [Means for solving the problem]

[0006] The radiation conversion unit of the present invention is [1] "a radiation conversion unit comprising: a light receiving unit; and a scintillator panel arranged on the light receiving unit, the scintillator panel including a support layer, a scintillator layer arranged on the light receiving unit side of the support layer and including a plurality of columnar crystals, an adhesive layer arranged on the light receiving unit side of the scintillator layer and in contact with the light receiving unit, and a first moisture proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer, wherein the edge portion of the first moisture proof layer on the light receiving unit side includes at least one of an inner portion arranged between the light receiving unit and the adhesive layer on the inner side of the outer edge portion of the adhesive layer, and an outer portion arranged on the light receiving unit on the outer side of the outer edge portion of the adhesive layer."

[0007] In the radiation conversion unit described in [1] above, the first moisture-proof layer integrally covers the outer edge of the scintillator layer and the outer edge of the adhesive layer. This prevents moisture from entering through the outer edge of the scintillator layer, the outer edge of the adhesive layer, and the interface between the scintillator layer and the adhesive layer. Furthermore, the edge of the first moisture-proof layer on the light-receiving unit side includes an inner portion disposed between the light-receiving unit and the adhesive layer on the inner side of the outer edge of the adhesive layer, and an outer portion disposed on the light-receiving unit on the outer side of the outer edge of the adhesive layer. This increases the contact area between the edge of the first moisture-proof layer and the light-receiving unit, and prevents moisture from entering through the interface between the edge of the first moisture-proof layer and the light-receiving unit. As a result, the radiation conversion unit can sufficiently ensure the moisture-proofness of the scintillator layer.

[0008] The radiation conversion unit of the present invention may be [2] "the radiation conversion unit according to the above [1], wherein the edge part on the light receiving section side of the first moisture proof layer includes the inner part." According to the radiation conversion unit according to [2], the area on the light receiving section that is outside the outer edge of the scintillator panel can be effectively utilized, and for example, wiring, IC circuits, and the like can be arranged in this area.

[0009] The radiation conversion unit of the present invention may be [3] "the radiation conversion unit according to the above [1] or [2], in which the edge part on the light receiving part side of the first moisture proof layer includes the outer part." According to the radiation conversion unit described in [3], the first moisture proof layer is not present in the part on the light receiving part where the light receiving part and the adhesive layer are in contact with each other, so that a wide light receiving area of ​​the light receiving part can be ensured.

[0010] The radiation conversion unit of the present invention may be [4] "the radiation conversion unit according to any one of the above [1] to [3], wherein the width of each of the inner portion and the outer portion is 0.5 μm or more and 300 μm or less." The radiation conversion unit according to [4] can reliably ensure the moisture resistance of the scintillator layer while preventing the light-receiving region from being narrowed more than necessary.

[0011] The radiation conversion unit of the present invention may be [5] "the radiation conversion unit according to any one of the above [1] to [4], wherein the first moisture proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite to the scintillator layer." According to the radiation conversion unit described in [5], the first moisture proof layer further integrally covers the outer edge of the support layer and the surface of the support layer opposite to the scintillator layer, so that the support layer and the interface between the scintillator layer and the support layer are not exposed to the outside. Thus, it is possible to suppress the intrusion of moisture from the support layer and the interface between the scintillator layer and the support layer, and to further improve the moisture proofness of the scintillator layer.

[0012] The radiation conversion unit of the present invention may be [6] "the radiation conversion unit according to any one of the above [1] to [5], further comprising a second moisture proof layer disposed between the scintillator layer and the adhesive layer." The radiation conversion unit according to [6] can more sufficiently ensure the moisture proofness of the scintillator layer.

[0013] The radiation conversion unit of the present invention may be the one described in any one of [1] to [6] above, where "when viewed in the thickness direction of the support layer, the outer edges of the support layer, the scintillator layer, and the adhesive layer coincide". According to the radiation conversion unit described in [7], when attaching the scintillator panel to the light receiving portion, it becomes easier to align the scintillator panel and the light receiving portion.

[0014] The radiation detector radiation conversion unit of the present invention may be the one described in any one of [1] to [7] above, where "the light receiving portion is a sensor panel". According to the radiation conversion unit described in [8], by providing a sensor panel, a radiation conversion unit with high moisture resistance of the scintillator layer that can operate as a radiation detector can be obtained.

[0015] The manufacturing method of the radiation conversion unit of the present invention is the one described in [9], which is "a step of preparing a scintillator panel including a support layer, a scintillator layer disposed on the support layer and including a plurality of columnar crystals, an adhesive layer disposed on the scintillator layer, a release layer disposed on the adhesive layer, a moisture-proof layer integrally covering the outer edge portion of the scintillator layer, the outer edge portion of the adhesive layer, the outer edge portion of the release layer, and the surface of the release layer opposite to the adhesive layer; a step of removing the portion of the moisture-proof layer covering the surface of the release layer together with the release layer; and a step of attaching the scintillator panel to the light receiving portion through the adhesive layer".

[0016] In the method for producing a radiation conversion unit described in [9], a scintillator panel is prepared that includes a moisture-proof layer that integrally covers the outer edge of the scintillator layer, the outer edge of the adhesive layer, the outer edge of the release layer, and the surface of the release layer opposite to the adhesive layer. This ensures the moisture-proof property of the scintillator layer that includes a plurality of columnar crystals when the scintillator panel is not in use. Furthermore, in the method for producing a radiation conversion unit described in [8], a portion of the moisture-proof layer that covers the surface of the release layer is removed together with the release layer. This results in a state in which the edge of the moisture-proof layer that covered the outer edge of the release layer protrudes from the outer edge of the adhesive layer toward the light-receiving unit. In this state, the scintillator panel is attached to the light-receiving unit via the adhesive layer. This results in a state in which the edge of the first moisture-proof layer includes at least one of an inner portion that is disposed between the light-receiving unit and the adhesive layer on the inner side of the outer edge of the adhesive layer, and an outer portion that is disposed on the light-receiving unit on the outer side of the outer edge of the adhesive layer. Thus, the method for producing a radiation conversion unit described in [8] can provide a radiation conversion unit that can ensure the moisture-proof property of the scintillator layer sufficiently. Effect of the Invention

[0017] According to the present invention, it is possible to provide a radiation conversion unit capable of sufficiently ensuring the moisture resistance of a scintillator layer, and a method for manufacturing a radiation detector capable of obtaining such a radiation conversion unit. [Brief description of the drawings]

[0018] [Figure 1] 1 is a cross-sectional view of a scintillator panel according to an embodiment. [Diagram 2] 2 is a cross-sectional view of a radiation detector including the scintillator panel shown in FIG. 1. [Diagram 3] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 4] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Diagram 5] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 6] 2A to 2C are diagrams illustrating a method for manufacturing the scintillator panel shown in FIG. [Figure 7] 3A to 3C are diagrams illustrating a method for manufacturing the radiation detector illustrated in FIG. 2. [Figure 8] FIG. 11 is a cross-sectional view of a radiation detector according to a modified example. [Figure 9] FIG. 11 is a cross-sectional view of a modified scintillator panel. [Figure 10] 10 is a cross-sectional view of a radiation detector including the scintillator panel shown in FIG. 9. [Figure 11] 10A to 10C are diagrams illustrating a manufacturing method of the scintillator panel shown in FIG. [Figure 12] 10A to 10C are diagrams illustrating a manufacturing method of the scintillator panel shown in FIG. [Figure 13] 11A to 11C are diagrams illustrating a method for manufacturing the radiation detector illustrated in FIG. [Figure 14] FIG. 11 is a cross-sectional view of a modified scintillator panel. [Figure 15] FIG. 11 is a cross-sectional view of a modified scintillator panel. [Figure 16] FIG. 16 is a plan view of the scintillator panel shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and duplicated explanations will be omitted. [Scintillator panel configuration]

[0020] As shown in FIG. 1, the scintillator panel 1 includes a scintillator unit 2 and a first moisture-proof layer 3. The first moisture-proof layer 3 covers the scintillator unit 2. The scintillator unit 2 includes a support layer 4, a scintillator layer 5, an adhesive layer 6, a peeling layer 7, and a second moisture-proof layer 8. The scintillator layer 5 is disposed on the support layer 4. The adhesive layer 6 is disposed on the scintillator layer 5. The peeling layer 7 is disposed on the adhesive layer 6. In other words, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the peeling layer 7 are laminated on the support layer 4 in this order in the thickness direction of the support layer 4 (hereinafter, "direction A"). That is, the second moisture-proof layer 8 is disposed between the scintillator layer 5 and the adhesive layer 6. When viewed from direction A, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 8a of the second moisture-proof layer 8, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the release layer 7 are aligned. That is, the outer edges 4a, 5a, 8a, 6a, and 7a are flush with each other.

[0021] The first moisture-proof layer 3 integrally covers the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 81 of the second moisture-proof layer 8, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the peeling layer 7, the surface 7b of the peeling layer 7, and the surface 4b of the support layer 4. The surface 7b of the peeling layer 7 is the surface of the peeling layer 7 opposite the adhesive layer 6. The surface 4b of the support layer 4 is the surface of the support layer 4 opposite the scintillator layer 5. That is, the first moisture-proof layer 3 integrally covers the scintillator unit 2 continuously and seamlessly. Therefore, in the scintillator panel 1, the interfaces between the first moisture-proof layer 3 and each layer are not exposed to the outside. The first moisture-proof layer 3 has a function of suppressing moisture from entering the scintillator unit 2 from the outside. In the scintillator panel 1, the thickness of the first moisture-proof layer 3 is uniform over the entire surface of the scintillator unit 2, and is 0.5 μm or more and 40 μm or less. The material of the first moisture proof layer 3 is, for example, parylene (polyparaxylylene).

[0022] The support layer 4 includes a first support layer 401 and a second support layer 402. The second support layer 402 is disposed on the first support layer 401 in a state where it is located on the scintillator layer 5 side of the first support layer 401. The outer edge portion of the first support layer 401 and the outer edge portion of the second support layer 402 configure the outer edge portion 41 of the support layer 4. When viewed from the direction A, the outer edge of the first support layer 401 and the outer edge of the second support layer 402 are aligned.

[0023] The first support layer 401 has a function of suppressing moisture from entering the scintillator unit 2 from the outside, and a function of suppressing light from entering the scintillator unit 2 from the outside. The material of the first support layer 401 is, for example, a composite material in which a resin material and a metal material are combined. As an example, the material of the first support layer 401 is a composite material of PET (polyethylene terephthalate) and Al. The resin material contained in the first support layer 401 may be PEN (polyethylene naphthalate), PI (polyimide), PP (polypropylene), PE (polyethylene), PU (polyurethane), PMMA (polymethyl methacrylate), or the like. The metal material contained in the first support layer 401 may be Cu, Ti, Fe, SUS (stainless steel), or the like.

[0024] The second support layer 402 has a function of reflecting light emitted from the scintillator layer 5 in response to incidence of radiation (e.g., X-rays). The material of the second support layer 402 is, for example, a composite material in which a resin material and a white inorganic material are combined. As an example, the material of the second support layer 402 is a composite material of PET and a white inorganic material. In addition to PET, examples of the resin material include PEN, PI, PP, PE, PU, ​​PMMA, etc. Examples of the white inorganic material include TiO 2 , ZnO, LAS (lithium aluminum silicate), etc.

[0025] The thickness of the first support layer 401 is, for example, 30 μm or more and 250 μm or less. The thickness of the second support layer 402 is, for example, 10 μm or more and 250 μm or less. The support layer 4 is flexible. The support layer 4 can be bent to have a radius of curvature of, for example, 30 mm or more and 120 mm or less.

[0026] The scintillator layer 5 is disposed on the surface of the second support layer 402 opposite to the first support layer 401. The scintillator layer 5 includes a plurality of columnar crystals 50. The plurality of columnar crystals 50 are aligned along a plane perpendicular to the direction A. Each columnar crystal 50 extends in the direction A and has a substantially uniform height (thickness) over the entire region. Each columnar crystal 50 includes a first end 50a on the opposite side to the support layer 4 and a second end 50b on the support layer 4 side. Each first end 50a becomes thinner toward the opposite side to the support layer 4. The material of the scintillator layer 5 is, for example, CsI:Tl (cesium iodide containing thallium as an activator), CsI:Na (cesium iodide containing sodium as an activator), CsI:Ce (cesium iodide containing cerium as an activator), CsI:Tl,Eu (cesium iodide containing thallium and europium as activators), etc. The thickness of the scintillator layer 5 is, for example, 50 μm or more and 1000 μm or less (preferably, 100 μm or more and 300 μm or less when resolution is required, and 400 μm or more and 700 μm or less when sensitivity is required).

[0027] The second moisture-proof layer 8 covers the first end portions 50a. The second moisture-proof layer 8 has a function of suppressing the movement of moisture from the adhesive layer 6 to the scintillator layer 5 even if the adhesive layer 6 contains moisture. The material of the second moisture-proof layer 8 is, for example, parylene (polyparaxylene). The thickness of the second moisture-proof layer 8 is smaller than the thickness of the first moisture-proof layer 3. The thickness of the second moisture-proof layer 8 is, for example, half or less of the thickness of the first moisture-proof layer 3. Here, the thickness of the second moisture-proof layer 8 is, for example, the distance between the plane and the surface 8b of the second moisture-proof layer 8 on the opposite side to the scintillator layer 5 when the multiple tips of the multiple first end portions 50a are arranged along the plane. The thickness of the second moisture-proof layer 8 is 0.5 μm or more and 40 μm or less.

[0028] The adhesive layer 6 is disposed on the second moisture-proof layer 8. The adhesive layer 6 is in contact with a surface 8b of the second moisture-proof layer 8. The adhesive layer 6 functions as an adhesive layer for bonding the scintillator panel 1 to the sensor panel 11. The material of the adhesive layer 6 is an organic material having optical transparency, such as OCA (Optical Clear Adhesive). The thickness of the adhesive layer 6 is, for example, 0.5 μm or more and 50 μm or less.

[0029] The peeling layer 7 is in contact with the surface 6b of the adhesive layer 6 opposite to the scintillator layer 5. The peeling layer 7 has releasability with respect to the surface 6b of the adhesive layer 6. The peeling layer 7 is, for example, a release film, and can be easily peeled off from the surface 6b. The peeling layer 7 is peeled off from the surface 6b of the adhesive layer 6 when the scintillator panel 1 is in use. The peeling layer 7 protects the adhesiveness of the adhesive layer 6 and prevents unnecessary substances from adhering to the adhesive layer 6 when the scintillator panel 1 is not in use. The material of the peeling layer 7 is, for example, PET, PE, PP, etc. The surface of the peeling layer 7 on the adhesive layer 6 side may be coated with a silicone-based release agent. This allows the peeling layer 7 to be easily peeled off from the surface 6b of the adhesive layer 6. The first moisture-proof layer 3 has a peeling trigger 32 (weak part) in the outer edge region 3a on the surface 7b side of the peeling layer 7 opposite to the adhesive layer 6 so that the user can easily peel it off. The peeling trigger 32 has a smaller strength in the outer edge region 3a than in the central region 3b on the surface 7b side of the peeling layer 7. For example, in a scintillator panel 1 that is rectangular when viewed from the direction A, the peeling trigger 32 may be provided at least one of the four corners on the surface 7b side of the first moisture-proof layer 3. As shown in FIG. 1, the peeling trigger 32 may be a notch provided at a corner of the first moisture-proof layer 3. Alternatively, the peeling trigger 32 may be a notch provided around the entire periphery of the outer edge region 3a including the corner of the first moisture-proof layer 3, a notch provided in a direction parallel to the surface 7b of the peeling layer 7, or a notch provided in a direction parallel to the outer edge 7a of the peeling layer 7 in the direction A (a direction perpendicular to the surface 7b). The thickness of the peeling layer 7 is 5 μm or more and 300 μm or less. [Radiation detector configuration]

[0030] As shown in FIG. 2, the radiation detector (radiation conversion unit) 10 includes the above-mentioned scintillator panel 1 and a sensor panel (light receiving section) 11. The sensor panel 11 has a light receiving surface 11a. The scintillator panel 1 is disposed on the light receiving surface 11a with the scintillator layer 5 positioned on the sensor panel 11 side with respect to the support layer 4. The scintillator panel 1 is adhered to the sensor panel 11 by an adhesive layer 6. A plurality of photoelectric conversion elements (not shown) are provided on a portion of the sensor panel 11 along the light receiving surface 11a. Each photoelectric conversion element forms a pixel and outputs an electrical signal in response to incident light. In the radiation detector 10, light emitted from the scintillator layer 5 of the scintillator panel 1 in response to the incidence of radiation is detected by the sensor panel 11. The radiation detector 10 is used as a radiation imaging device, for example, in a medical radiation image diagnostic device, a non-destructive testing device, etc.

[0031] The radiation detector 10 is manufactured by peeling the release layer 7 from the adhesive layer 6, removing a portion of the first moisture-proof layer 3 covering the surface 7b of the release layer 7, and then attaching the scintillator panel 1 to the sensor panel 11 via the adhesive layer 6. In a state in which the scintillator panel 1 is attached to the sensor panel 11, the edge portion 31 of the first moisture-proof layer 3 on the sensor panel 11 side includes an inner portion 311. The inner portion 311 is a portion disposed between the sensor panel 11 and the adhesive layer 6 on the inner side of the outer edge portion 61 of the adhesive layer 6. The inner portion 311 may be a portion in which the edge portion 31 is folded back on the inner side of the outer edge portion 61 of the adhesive layer 6. The inner portion 311 covers the surface 6b of the adhesive layer 6 on the inner side of the outer edge portion 61 of the adhesive layer 6, and covers the light receiving surface 11a of the sensor panel 11. In other words, the inner portion 311 is disposed at the outer edge portion 61 of the adhesive layer 6 between the surface 6b of the adhesive layer 6 and the light receiving surface 11a of the sensor panel 11.

[0032] The width D1 of the inner portion 311 varies along the outer edge 6a of the adhesive layer 6. Here, the width D1 of the inner portion 311 is the length from the outer edge 6a to the end face 31a of the edge portion 31 in a direction perpendicular to the direction A. The width D1 is 0.5 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less. When the width D1 varies, the width D1 being 5 μm or more and 200 μm or less means that the maximum value and the minimum value of the width D1 are within the range of 5 μm or more and 200 μm or less.

[0033] The radiation detector 10 further includes a sealing member 12. The sealing member 12 extends in a frame shape in a region surrounding the light receiving surface 11a of the surface of the sensor panel 11, and covers the side surface of the scintillator panel 1. The sealing member 12 has a function of preventing moisture from entering through the interface between the first moisture proof layer 3 and the sensor panel 11. The material of the sealing member 12 is, for example, epoxy, silicone, fluorine, urethane, acrylic, etc. The material of the sealing member 12 may contain a filler material made of an inorganic material such as glass. [Scintillator panel manufacturing method]

[0034] A method for manufacturing the scintillator panel 1 described above will be described. First, as shown in (a) of FIG. 3, the second support layer 402 bonded to the carrier substrate 13 is prepared. The carrier substrate 13 and the second support layer 402 may be bonded to each other by an adhesive or by a double-sided tape. The material of the carrier substrate 13 is, for example, a glass substrate. In order to improve smoothness and peelability, the surface of the carrier substrate 13 may be coated with a release agent. The thickness of the carrier substrate 13 is, for example, 0.1 mm or more and 1.5 mm or less. Next, as shown in (b) of FIG. 3, the scintillator layer 5 is formed on the second support layer 402 by a vapor deposition method. In this embodiment, the scintillator layer 5 is formed on the second support layer 402 by a vapor deposition method. As a result, in the plurality of columnar crystals 50, the plurality of second end portions 50b are located on the second support layer 402 side, and the plurality of first end portions 50a are located on the opposite side to the second support layer 42. An example of a vapor phase deposition method other than the vapor deposition method is the sputtering method.

[0035] Then, as shown in (a) of FIG. 4, the carrier substrate 13, the second support layer 402, and the scintillator layer 5 are covered with the second moisture-proof layer 8. In the example of (a) of FIG. 4, the surface of the carrier substrate 13 opposite to the second support layer 402, both ends of the carrier substrate 13, both ends of the second support layer 402, both ends of the scintillator layer 5, and the first ends 50a of the scintillator layer 5 are integrally covered with the second moisture-proof layer 8. Then, as shown in (b) of FIG. 4, the carrier substrate 13 is removed from the second support layer 402. In the example of (b) of FIG. 4, the part of the second moisture-proof layer 8 that covered the surface of the carrier substrate 13 and the part that covered both ends of the carrier substrate 13 are removed together with the carrier substrate 13. As a result, the surface of the second support layer 402 opposite to the scintillator layer 5 is exposed to the outside.

[0036] Next, as shown in (a) of FIG. 5, the first support layer 401 is bonded to the surface of the second support layer 402 opposite to the scintillator layer 5. Also, an adhesive layer 6 is prepared with a peeling layer 7 bonded to the surface 6b, and the adhesive layer 6 is disposed on the scintillator layer 5 via the second moisture-proof layer 8. In the example of (a) of FIG. 5, the surface 6c of the adhesive layer 6 opposite to the peeling layer 7 is bonded to the surface 8b of the second moisture-proof layer 8. Next, as shown in (b) of FIG. 5, the first support layer 401, the second support layer 402, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the peeling layer 7 are cut to a predetermined size in the direction A. For example, a laminate composed of the support layer 4, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the peeling layer 7 is cut from the state shown in (a) of FIG. 5 so as to obtain a plurality of scintillator units 2 having the same dimensions and shapes (e.g., rectangular). Alternatively, for example, the ends of the support layer 4, the scintillator layer 5, the second moisture-proof layer 8, the adhesive layer 6, and the peeling layer 7 may be cut to obtain one scintillator unit 2. As a result, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 8a of the second moisture-proof layer 8, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the peeling layer 7 are aligned. These outer edges constitute the outer edge of the scintillator unit 2. Note that a blade whose tip has a gradually decreasing thickness in the direction A may be used as the blade used for cutting. When cut with such a blade, the outer edge of the scintillator unit 2 may gradually increase in the direction A. The manufacturing steps described above in (a) of FIG. 4 to (b) of FIG. 5 correspond to the step of preparing the scintillator unit 2, and the cutting step described in (b) of FIG. 5 is included in the step of preparing the scintillator unit 2.

[0037] 6, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the release layer 7, the outer edge 81 of the second moisture-proof layer 8, and the surface 7b of the release layer 7 opposite to the adhesive layer 6 are covered integrally with the first moisture-proof layer 3 (a step of covering integrally with the first moisture-proof layer 3). As a result, the entire surface of the scintillator unit 2 is completely surrounded by the first moisture-proof layer 3. As a result, the interfaces between the layers in the scintillator unit 2 and the interfaces between the layers and the first moisture-proof layer 3 are covered by the first moisture-proof layer 3 and are not exposed to the outside. In this manner, the scintillator panel 1 is manufactured. [Radiation detector manufacturing method]

[0038] A method for manufacturing the radiation detector 10 described above will be described. First, as shown in (a) of FIG. 7, the portion of the first moisture-proof layer 3 covering the surface 7b of the peeling layer 7 is removed together with the peeling layer 7 (a step of removing the portion of the first moisture-proof layer 3 covering the surface 7b of the peeling layer 7 together with the peeling layer 7). Since the peeling layer 7 has releasability with respect to the surface 6b of the adhesive layer 6, the peeling layer 7 is easily peeled off from the surface 6b. If a peeling trigger is provided at a corner of the peeling layer 7, the user may grasp the peeling trigger and peel off the peeling layer 7. When the peeling layer 7 is peeled off, the surface 6b is exposed to the outside.

[0039] As a result of the portion of the first moisture-proof layer 3 covering the surface 7b of the peel-off layer 7 being removed together with the peel-off layer 7, the portion of the first moisture-proof layer 3 covering the outer edge 71 of the peel-off layer 7 protrudes from the outer edge 61 of the adhesive layer 6 towards the sensor panel 11. This protruding portion becomes the edge 31 of the first moisture-proof layer 3. At this time, the edge 31 has burrs. For example, the end face 31a of the edge 31 has an irregular uneven shape (for example, a sawtooth shape) when viewed from the thickness direction of the first moisture-proof layer 3.

[0040] 7(b), the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 (a step of attaching the scintillator panel 1 to the sensor panel 11 via the adhesive layer 6). At this time, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 in a state in which the edge 31 of the first moisture-proof layer 3 protrudes from the outer edge 61 of the adhesive layer 6 toward the sensor panel 11. As a result, the edge 31 includes a portion that is folded back inward relative to the outer edge 61 of the adhesive layer 6. This results in the edge 31 including an inner portion 311.

[0041] 2, the side surfaces of the scintillator panel 1 are covered with a sealing member 12. In this manner, the radiation detector 10 is manufactured. [Action and Effects]

[0042] In the radiation detector 10, the first moisture-proof layer 3 integrally covers the outer edge 51 of the scintillator layer 5 and the outer edge 61 of the adhesive layer 6. This prevents moisture from entering through the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, and the interface between the scintillator layer 5 and the adhesive layer 6. Furthermore, the edge 31 on the sensor panel 11 side of the first moisture-proof layer 3 includes an inner portion 311 disposed between the sensor panel 11 and the adhesive layer 6 on the inner side of the outer edge 61 of the adhesive layer 6. This increases the contact area between the edge 31 of the first moisture-proof layer 3 and the sensor panel 11, and prevents moisture from entering through the interface between the edge 31 of the first moisture-proof layer 3 and the sensor panel 11. As a result, the radiation detector can ensure sufficient moisture-proofness of the scintillator layer.

[0043] The edge 31 of the first moisture-proof layer 3 on the sensor panel 11 side includes an inner portion 311. This allows the area on the sensor panel 11 outside the outer edge 1a of the scintillator panel 1 to be effectively utilized, and for example, wiring, IC circuits, etc. to be arranged in this area. Also, in the inner portion 311, the end face 31a of the edge 31 is folded inward and arranged to wrap around the outer edge 61 of the adhesive layer 6, so that intrusion of moisture from the outside through the outer edge 61 of the adhesive layer 6 can be further suppressed.

[0044] Width D1 of inner portion 311 is not less than 0.5 μm and not more than 300 μm. This makes it possible to reliably ensure the moisture resistance of scintillator layer 5 while preventing the light receiving region from becoming narrower than necessary.

[0045] The first moisture-proof layer 3 further integrally covers the outer edge 41 of the support layer 4 and the surface 4b of the support layer 4 opposite the scintillator layer 5. With this, the first moisture-proof layer 3 further integrally covers the outer edge 41 of the support layer 4 and the surface 4b of the support layer 4 opposite the scintillator layer 5, so that the support layer 4 and the interface between the scintillator layer 5 and the support layer 4 are not exposed to the outside. This makes it possible to suppress moisture from penetrating through the support layer 4 and the interface between the scintillator layer 5 and the support layer 4, and further improve the moisture-proof property of the scintillator layer 5.

[0046] The radiation detector 10 further includes a second moisture-proof layer 8 disposed between the scintillator layer 5 and the adhesive layer 6. This can ensure the moisture-proof property of the scintillator layer 5 more sufficiently. In addition, since the adhesive layer 6 does not directly contact the scintillator layer 5, damage to the tip of the first end 50a of the columnar crystal 50 can be suppressed even when the adhesive layer 6 and the peeling layer 7 are bonded together. At that time, since the second moisture-proof layer 8 is harder (has a higher hardness) than the adhesive layer 6, the second moisture-proof layer 8 can protect the tip of the first end 50a, while the cushioning property of the adhesive layer 6 can reduce the force applied to the tip of the first end 50a during bonding.

[0047] When viewed from the thickness direction (direction A) of the support layer 4, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the peeling layer 7 are aligned. This makes it easy to align the scintillator panel 1 with another member (e.g., a sensor panel 11) when attaching the scintillator panel 1 to the other member. In addition, because the side surface of the scintillator panel 1 is flat, unevenness in thickness is less likely to occur when the first moisture-proof layer 3 is formed, and a first moisture-proof layer 3 with higher moisture resistance can be formed.

[0048] The radiation detector 10 includes a sensor panel 11. This makes it possible to obtain the radiation detector 10 in which the scintillator layer 5 has high moisture resistance.

[0049] In the manufacturing method of the radiation detector 10, a scintillator panel 1 is prepared, which includes a first moisture-proof layer 3 integrally covering the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the peeling layer 7, and the surface 7b of the peeling layer 7 opposite to the adhesive layer 6. This ensures the moisture-proof property of the scintillator layer 5 including a plurality of columnar crystals 50 when the scintillator panel 1 is not in use. Furthermore, in the manufacturing method, the portion of the first moisture-proof layer 3 covering the surface 7b of the peeling layer 7 is removed together with the peeling layer 7. This results in a state in which the edge 31 of the first moisture-proof layer 3 covering the outer edge 71 of the peeling layer 7 protrudes from the outer edge 61 of the adhesive layer 6 toward the sensor panel 11. In this state, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6. This results in a state in which the edge 31 of the first moisture-proof layer 3 includes an inner portion 311 arranged between the sensor panel 11 and the adhesive layer 6 on the inner side of the outer edge 61 of the adhesive layer 6. Therefore, according to the above manufacturing method, it is possible to obtain a radiation detector 10 in which the moisture resistance of the scintillator layer 5 can be sufficiently ensured. [Variations]

[0050] The present invention is not limited to the above-described embodiments. As shown in FIG. 8, in a state where the scintillator panel 1 is adhered to the sensor panel 11, the edge portion 31 on the sensor panel 11 side of the first moisture-proof layer 3 may include an outer portion 312 instead of the inner portion 311. The outer portion 312 is a portion disposed on the sensor panel 11 outside the outer edge portion 61 of the adhesive layer 6. The outer portion 312 may be a portion where the edge portion 31 is folded back outside the outer edge portion 61 of the adhesive layer 6. In the example of FIG. 8, the outer portion 312 covers the light-receiving surface 11a of the sensor panel 11 outside the outer edge portion 61 of the adhesive layer 6. The outer portion 312 is disposed between the outer edge 1a of the scintillator panel 1 and the outer edge 11b of the sensor panel 11 in a region on the light-receiving surface 11a of the sensor panel 11.

[0051] The width D2 of the outer portion 312 varies along the outer edge 6a of the adhesive layer 6. Here, the width D2 of the outer portion 312 is the length from the outer edge 6a to the end face 31a of the edge portion 31 in a direction perpendicular to the direction A. The width D2 is 0.5 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less. When the width D2 varies, the fact that the width D2 is 5 μm or more and 200 μm or less means that the maximum value and the minimum value of the width D2 are included in the range of 5 μm or more and 200 μm or less.

[0052] In the manufacturing method of the radiation detector 10 including the outer portion 312, similar to the radiation detector 10 including the inner portion 311, with the edge portion 31 of the first moisture-proof layer 3 protruding from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11 side, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6. As a result, the edge portion 31 includes a portion folded back outside the outer edge portion 61 of the adhesive layer 6. Thereby, the edge portion 31 is in a state including the outer portion 312.

[0053] By including the outer portion 312, the edge portion 31 enables a wider light-receiving area of the sensor panel 11 to be secured in the portion where the sensor panel 11 and the adhesive layer 6 are in contact, because the first moisture-proof layer 3 does not exist there. In addition, when the edge portion 31 includes the outer portion 312, as shown in FIG. 8, the entrance of the interface between the first moisture-proof layer 3 and the sensor panel 11 (the contact portion between the end face 31a and the light-receiving surface 11a) is separated from the scintillator layer 5. Thereby, the intrusion of moisture from the interface between the edge portion 31 of the first moisture-proof layer 3 and the sensor panel 11 is further suppressed. By setting the width of the outer portion 312 to be 0.5 μm or more and 300 μm or less, more preferably 5 μm or more and 200 μm or less, it is possible to surely secure the moisture-proof property of the scintillator layer 5 and avoid the light-receiving area from being narrowed more than necessary. In the manufacturing method of the radiation detector 10 including the outer portion 312, a radiation detector 10 capable of sufficiently securing the moisture-proof property of the scintillator layer 5 can be obtained in the same manner as the radiation detector 10 including the inner portion 311.

[0054] The edge portion 31 may include the inner portion 311 or the outer portion 312, or may include both the inner portion 311 and the outer portion 312. That is, the edge portion 31 only needs to include at least one of the inner portion 311 and the outer portion 312.

[0055] As shown in FIG. 9, the scintillator panel 1A may not include the second moisture-proof layer 8. The scintillator panel 1A is different from the scintillator panel 1 in that the second moisture-proof layer 8 is not disposed between the scintillator layer 5 and the adhesive layer 6. In the scintillator panel 1A, the adhesive layer 6 is in contact with a plurality of first end portions 50a and covers the plurality of first end portions 50a. In the scintillator panel 1A, the outer edge portion 51 of the scintillator layer 5, the outer edge portion 61 of the adhesive layer 6, the outer edge portion 71 of the release layer 7, and the surface 7b of the release layer 7 on the side opposite to the adhesive layer 6 are integrally covered by the first moisture-proof layer 3.

[0056] 10, in a radiation detector 10A including a scintillator panel 1A, the distance between the sensor panel 11 and a plane including the multiple tips of the multiple first ends 50a is smaller than in the radiation detector 10. This makes it possible to suppress scattering and attenuation of light converted in the scintillator layer 5 in the radiation detector 10A, and to suppress a decrease in resolution caused by the presence of the second moisture proof layer 8. Note that even in this case, it is sufficient that the edge portion 31 includes at least one of the inner portion 311 and the outer portion 312.

[0057] Next, a method for manufacturing the scintillator panel 1A will be described. First, as in the scintillator panel 1, as shown in (a) of FIG. 3 and (b) of FIG. 3, the scintillator layer 5 is formed on the second support layer 402 bonded to the carrier substrate 13. Then, as shown in (a) of FIG. 11, the carrier substrate 13 is removed from the second support layer 402. Then, as shown in (b) of FIG. 11, the first support layer 401 is bonded to the surface of the second support layer 402 opposite to the scintillator layer 5. At the same time, the surface of the adhesive layer 6 opposite to the release layer 7 is directly bonded to the multiple first ends 50a of the scintillator layer 5. Then, as shown in (a) of FIG. 12, the first support layer 401, the second support layer 402, the scintillator layer 5, the adhesive layer 6, and the release layer 7 are cut to a predetermined size in the direction A. For example, a laminate composed of the support layer 4, the scintillator layer 5, the adhesive layer 6, and the peeling layer 7 is cut from the state shown in (b) of FIG. 11 so as to obtain a plurality of scintillator units 2A having the same size and shape (e.g., rectangular). Alternatively, for example, the ends of the support layer 4, the scintillator layer 5, the adhesive layer 6, and the peeling layer 7 may be cut to obtain one scintillator unit 2A. As a result, the outer edge 4a of the support layer 4, the outer edge 5a of the scintillator layer 5, the outer edge 6a of the adhesive layer 6, and the outer edge 7a of the peeling layer 7 are aligned. Then, as shown in (b) of FIG. 12, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 61 of the adhesive layer 6, the outer edge 71 of the peeling layer 7, and the surface 7b of the peeling layer 7 opposite to the adhesive layer 6 are integrally covered with the first moisture-proof layer 3.

[0058] Next, a manufacturing method of the radiation detector 10A will be described. As in the radiation detector 10, as shown in (a) of Fig. 13, a portion of the first moisture-proof layer 3 covering the surface 7b of the peeling layer 7 is removed together with the peeling layer 7. Then, as shown in (b) of Fig. 13, the scintillator panel 1 is attached to the sensor panel 11 via the adhesive layer 6 in a state in which the edge portion 31 of the first moisture-proof layer 3 protrudes from the outer edge portion 61 of the adhesive layer 6 toward the sensor panel 11. This results in the edge portion 31 including at least one of the inner portion 311 and the outer portion 312. Finally, as shown in Fig. 10, the side surface of the scintillator panel 1A is covered with the sealing member 12.

[0059] The peeling trigger included in the first moisture-proof layer 3 does not have to be a cut. As shown in FIG. 14, the peeling trigger 32A may be a portion where at least one of the four corners on the surface 7b side of the first moisture-proof layer 3 is rounded off. The peeling trigger 32A may be a portion where a corner of the first moisture-proof layer 3 is scraped off by a polishing member. The polishing member is, for example, a blade such as a hand wrapper or a cutter. A hand wrapper is a tool such as a brush with a grindstone attached to the tip. Alternatively, the peeling trigger 32A may be a portion where a corner of the first moisture-proof layer 3 is scraped off by laser processing. The peeling trigger 32A may be provided over the entire circumference of the outer edge region 3a including the corner of the first moisture-proof layer 3.

[0060] The first moisture-proof layer 3 may not cover the surface 7b of the peeling layer 7 opposite to the scintillator layer 5. As shown in FIG. 15, the first moisture-proof layer 3 may integrally cover the surface 4b of the support layer 4 opposite to the scintillator layer 5, the outer edge 41 of the support layer 4, the outer edge 51 of the scintillator layer 5, the outer edge 81 of the second moisture-proof layer 8, the outer edge 61 of the adhesive layer 6, and the outer edge 71 of the peeling layer 7. The end face 31a of the edge 31 on the sensor panel 11 side of the first moisture-proof layer 3 may be flush with the surface 7b. In this case, the surface 7b and the end face 31a are exposed to the outside. Also, a tape may be provided on the surface 7b as a peeling trigger 72 for the peeling layer 7, not for the first moisture-proof layer 3. The peeling trigger 72 may be attached to the surface 7b at least at one of the four corners of the first moisture-proof layer 3 so as to face the center of the surface 7b, as shown in FIG. 16. The number of peeling triggers 72 is not limited to one, and may be more than one. The peeling trigger 72 may be provided on at least one of the four sides of the first moisture-proof layer 3.

[0061] In the scintillator panel 1, the thickness of the first moisture-proof layer 3 may be less than 0.5 μm or more than 40 μm. The thickness of the first moisture-proof layer 3 may not be uniform over the entire surface of the scintillator unit 2, but may vary. The thickness of the peeling layer 7 may be less than 5 μm or more than 200 μm. The width D1 of the inner portion 311 and the width D2 of the outer portion 312 may be less than 5 μm or more than 200 μm. The widths D1 and D2 may be constant along the outer edge 6a of the adhesive layer 6. Even when the widths D1 and D2 are constant, each of the widths D1 and D2 is preferably 5 μm or more and 200 μm or less, but may be less than 5 μm or more than 200 μm. The second support layer 402 may have a function of absorbing light emitted from the scintillator layer 5 in response to the incidence of radiation (e.g., X-rays). In this case, as an example, the material of the second support layer 402 is a composite material of PET and a black inorganic material. The black inorganic material is, for example, carbon black, iron oxide, etc. Furthermore, the light receiving section on which the scintillator panel 1 is disposed is not limited to the sensor panel 11, and may be, for example, a light guiding member such as an FOP (fiber optics plate). [Explanation of symbols]

[0062] 1,1A...scintillator panel, 2,2A...scintillator unit, 3...first moisture-proof layer, 4...support layer, 10,10A...radiation detector (radiation conversion unit), 11...sensor panel (light-receiving portion), 31...edge, 311...inner portion, 312...outer portion, 41...outer edge of support layer, 4a...outer edge of support layer, 4b...surface of support layer, 5...scintillator layer, 50...columnar crystals, 51...outer edge of scintillator layer, 5a...outer edge of scintillator layer, 6...adhesive layer, 61...outer edge of adhesive layer, 6a...outer edge of adhesive layer, 6b...surface of adhesive layer, 7...peeling layer, 71...outer edge of peeling layer, 7a...outer edge of peeling layer, 7b...surface of adhesive layer, 8...second moisture-proof layer, A...direction, D1...width of inner portion, D2...width of outer portion.

Claims

1. A light receiving unit; a scintillator panel disposed on the light receiving portion, The scintillator panel comprises: The support base and a scintillator layer disposed on the light receiving portion side with respect to the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the light receiving portion side with respect to the scintillator layer and in contact with the light receiving portion; a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer; an edge portion of the first moisture proof layer on the light receiving unit side includes at least one of an inner portion disposed between the light receiving unit and the adhesive layer on the inner side of the outer edge portion of the adhesive layer, and an outer portion disposed on the light receiving unit on the outer side of the outer edge portion of the adhesive layer, the edge portion of the first moisture proof layer on the light receiving portion side includes the inner portion.

2. A light receiving unit; a scintillator panel disposed on the light receiving portion, The scintillator panel comprises: The support base and a scintillator layer disposed on the light receiving portion side with respect to the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the light receiving portion side with respect to the scintillator layer and in contact with the light receiving portion; a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer; an edge portion of the first moisture proof layer on the light receiving unit side includes at least one of an inner portion disposed between the light receiving unit and the adhesive layer on the inner side of the outer edge portion of the adhesive layer, and an outer portion disposed on the light receiving unit on the outer side of the outer edge portion of the adhesive layer, A radiation conversion unit, wherein the width of each of the inner portion and the outer portion is 0.5 μm or more and 300 μm or less.

3. A light receiving unit; a scintillator panel disposed on the light receiving portion, The scintillator panel comprises: The support base and a scintillator layer disposed on the light receiving portion side with respect to the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the light receiving portion side with respect to the scintillator layer and in contact with the light receiving portion; a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer; an edge portion of the first moisture proof layer on the light receiving unit side includes at least one of an inner portion disposed between the light receiving unit and the adhesive layer on the inner side of the outer edge portion of the adhesive layer, and an outer portion disposed on the light receiving unit on the outer side of the outer edge portion of the adhesive layer, a first moisture-proof layer integrally covering an outer edge portion of the support layer and a surface of the support layer opposite to the scintillator layer;

4. A light receiving unit; a scintillator panel disposed on the light receiving portion, The scintillator panel comprises: The support base and a scintillator layer disposed on the light receiving portion side with respect to the support layer and including a plurality of columnar crystals; an adhesive layer disposed on the light receiving portion side with respect to the scintillator layer and in contact with the light receiving portion; a first moisture-proof layer integrally covering an outer edge portion of the scintillator layer and an outer edge portion of the adhesive layer; an edge portion of the first moisture proof layer on the light receiving unit side includes at least one of an inner portion disposed between the light receiving unit and the adhesive layer on the inner side of the outer edge portion of the adhesive layer, and an outer portion disposed on the light receiving unit on the outer side of the outer edge portion of the adhesive layer, A radiation conversion unit, wherein an outer edge of the support layer, an outer edge of the scintillator layer, and an outer edge of the adhesive layer are aligned when viewed in a thickness direction of the support layer.

5. 5. The radiation conversion unit according to claim 1, wherein the edge of the first moisture proof layer on the light receiving portion side includes the outer portion.

6. The radiation conversion unit according to claim 1 , further comprising a second moisture-proof layer disposed between the scintillator layer and the adhesive layer.

7. 5. The radiation conversion unit according to claim 1, wherein the light receiving section is a sensor panel.

8. 5. The radiation conversion unit according to claim 2, wherein the edge of the first moisture proof layer on the light receiving portion side includes the inner portion.

9. The radiation conversion unit according to claim 3 , wherein the width of each of the inner portion and the outer portion is not less than 0.5 μm and not more than 300 μm.

10. The radiation conversion unit according to claim 4 , wherein the first moisture proof layer further integrally covers an outer edge portion of the support layer and a surface of the support layer opposite to the scintillator layer.

11. preparing a scintillator panel including a support layer, a scintillator layer disposed on the support layer and including a plurality of columnar crystals, an adhesive layer disposed on the scintillator layer, a release layer disposed on the adhesive layer, and a moisture-proof layer integrally covering an outer edge of the scintillator layer, an outer edge of the adhesive layer, an outer edge of the release layer, and a surface of the release layer opposite to the adhesive layer; removing a portion of the moisture barrier layer covering the surface of the release layer together with the release layer; and attaching the scintillator panel to a light receiving portion via the adhesive layer.

Images