Cover Tape for Electronic Component Packaging, Electronic Component Package, and Method for Manufacturing Cover Tape for Electronic Component Packaging

Abstract

To provide a cover tape which is excellent in adhesion resistance while having a good balance between adhesion and peelability, and an electronic component package using the cover tape.SOLUTION: A cover tape for an electronic component packaging has a base material layer 1, an intermediate layer 2 and a sealant layer 3 in this order, wherein the sealant layer 3 contains a resin (A1) having a glass transition temperature of 60°C or higher and 120°C or lower.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a cover tape for packaging electronic components, an electronic component package, and a method for manufacturing a cover tape for packaging electronic components.

Background Art

[0002] Conventionally, electronic components such as transistors, diodes, capacitors, piezoelectric element resistors, etc. are, at the manufacturing site of electronic devices, accommodated in a package composed of a carrier tape in which pockets capable of accommodating the electronic components are continuously formed and a cover tape sealed to the carrier tape, and after being subjected to a heat sealing process, they are transported in a state of being wound around a reel made of paper or plastic to a work area where surface mounting is performed on an electronic circuit board or the like. And such electronic components are taken out from the pockets formed in the carrier tape after peeling off the cover tape of the package in the above-described work area, and are surface-mounted on an electronic circuit board or the like.

[0003] For example, Patent Document 1 focuses on the peeling resistance ratio α between the maximum value and the minimum value of the peeling resistance between the carrier tape and the cover tape, and discloses making the peelability appropriate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the process of transporting a package composed of a carrier tape and a cover tape to a work area where surface mounting is performed, the environment may be hot and humid. Also, since it is wound around a reel, a certain pressure is applied to the carrier tape and the cover tape, and the carrier tape and the cover tape adhere even to the non-heat-sealed parts, resulting in the problem that the carrier tape and the cover tape do not peel smoothly in the mounting process. That is, the conventional cover tape has the problem that the non-heat-sealed part adheres to the carrier tape when pressure is applied in a hot and humid environment.

[0006] In view of the above problems, an object of the present invention is to provide a cover tape in which adhesion (unintended adhesion) between the carrier tape and the non-heat-sealed part of the carrier tape is suppressed even when pressure is applied in a hot and humid environment.

Means for Solving the Problems

[0007] The present inventor has found that by using a resin having a glass transition temperature in a specific range for the sealant layer of the cover tape, the above object can be achieved, and has completed the present invention.

[0008] According to the present invention, the following cover tape for packaging electronic components is provided.

[0009] A base material layer, An intermediate layer, A sealant layer, A cover tape for packaging electronic components having these in this order, The sealant layer contains one or more resins (A1) having a glass transition temperature measured according to the following <Method for Measuring Glass Transition Temperature> of more than 60°C and 120°C or less. A cover tape for packaging electronic components. <Method for Measuring Glass Transition Temperature> The glass transition temperature (°C) of the resin (A1) is measured using a differential scanning calorimeter (DSC), raising the temperature from 0°C to 200°C at a heating rate of 10°C / min, and measuring under nitrogen atmosphere conditions.

[0010] Also, according to the present invention, a carrier tape in which electronic components are housed in recesses, and the above-described cover tape for packaging electronic components, are provided, and there is provided an electronic component package in which the sealant layer side is adhered to the carrier tape so as to seal the electronic components.

[0011] Also, according to the present invention, a base material layer, an intermediate layer, a sealant layer, A method for manufacturing a cover tape for packaging electronic components, which has these in this order, a step of preparing a composition for forming a sealant layer containing a resin (A1) having a glass transition temperature measured according to the following <Method for Measuring Glass Transition Temperature> of more than 60°C and 120°C or less; a step of forming the sealant layer using the composition for forming the sealant layer, having, A method for manufacturing a cover tape for packaging electronic components. <Method for Measuring Glass Transition Temperature> The glass transition temperature (°C) of the resin (A1) is measured using a differential scanning calorimeter (DSC) under nitrogen atmosphere conditions with a temperature increase rate of 10°C / min from 0°C to 200°C.

Advantages of the Invention

[0012] According to the present invention, it is possible to provide a cover tape in which, even when pressure is applied in a high-temperature and high-humidity environment, the non-heat-sealed portion is prevented from adhering to the carrier tape (unintended adhesion).

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Embodiments for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description will be omitted as appropriate. Also, the figures are schematic diagrams and do not necessarily match the actual dimensional ratios.

[0015] The notation "acrylic" in this specification represents a concept including both acrylic and methacrylic. The same applies to similar notations such as "acrylate".

[0016] <Cover Tape for Electronic Component Packaging> FIG. 1 schematically shows an example of the cover tape for electronic component packaging of this embodiment. The cover tape for electronic component packaging of this embodiment is a cover tape for electronic component packaging including a base material layer 1, an intermediate layer 2, and a sealant layer 3 in this order. In the cover tape 10 for electronic component packaging, usually, the sealant layer 3 is adhered to the carrier tape. In other words, usually, the upper surface side in FIG. 1 is adhered to the carrier tape. Also, each layer may be composed of a plurality of layers. The sealant layer 3 contains at least one resin (A1) having a glass transition temperature measured by a predetermined method of more than 60°C and 120°C or less. The resin (A1) is preferably at least one selected from the group consisting of a styrene resin, an acrylic resin, and an ester resin. Furthermore, the sealant layer 3 has a peel strength with respect to a polystyrene film measured by a predetermined method of preferably 0.3 N or more and 0.9 N or less, and a tack force measured by a predetermined method of preferably 0 N / cm 2 or more and 5.0 N / cm 2The following is the case. As a result, in the cover tape for electronic component packaging, while achieving a good balance between adhesiveness and peelability with respect to the carrier tape, the adhesion resistance can be improved.

[0017] The cover tape 10 for electronic component packaging of the present embodiment has an excellent adhesion resistance while achieving a good balance between adhesiveness and peelability. Although the details of the mechanism by which the cover tape 10 for electronic component packaging has an excellent adhesion resistance while achieving a good balance between adhesiveness and peelability are not clear, by using a resin (A1) having a glass transition temperature (hereinafter also referred to as Tg) of more than 60°C and 120°C or less, preferably at least one resin (A1) selected from the group consisting of styrene resins, acrylic resins, and ester resins, the cover tape and the carrier tape are bonded together to form a package. Even in a normal temperature environment or a transported environment, since the resin is in a glass state, the adhesiveness can be suppressed while the adhesion resistance can be improved. Furthermore, it is considered that the peelability when peeling the cover tape from the carrier tape at normal temperature can be improved.

[0018] <Other layers> An adhesive layer (not shown) may be provided between the respective layers of the cover tape 10 for electronic component packaging. According to this adhesive layer, the adhesiveness between the respective layers can be improved. Examples of the material for forming the adhesive layer include urethane-based dry laminating adhesive resins or anchor coat adhesive resins. Generally, those obtained by combining polyester compositions such as polyester polyols and polyether polyols with isocyanate compounds can be mentioned. In addition, layers other than the adhesive layer may be provided. For example, a layer for improving the strength of the entire film, a water vapor barrier layer, etc. may be provided.

[0019] <Base material layer> For the base material layer 1, if it has mechanical strength capable of withstanding external forces applied during processing of the cover tape 10 for electronic component packaging, heat sealing to the carrier tape, use, etc., and heat resistance capable of withstanding the heat during heat sealing, films processed from various materials can be used.

[0020] Specific examples of the material constituting the base material layer 1 include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, ABS resins, and the like. Among these, as the material constituting the base material layer 1, polyester resins and polyolefin resins are preferable, and polyethylene terephthalate and polyethylene, which can improve mechanical strength, are particularly preferable. Further, when a polyamide resin is selected as the material constituting the base material layer 1, it is preferable to use nylon, which can improve mechanical strength and flexibility.

[0021] As the form of the film used to form the base material layer 1, it may be a stretched film or a film stretched in one axial direction or two axial directions. However, from the viewpoint of improving the mechanical strength of the cover tape for electronic component packaging, it is preferable that the film is stretched in one axial direction or two axial directions.

[0022] The base material layer 1 may be formed of a single-layer film containing the above-described material, or may be formed using a multi-layer film containing the above-described material in each layer. From the viewpoint of reducing the amount of charge generated when the carrier tape is peeled off, the base material layer 1 may contain an antistatic agent, or an antistatic layer may be provided as one of the layers of the base material layer on the surface opposite to the surface on which the intermediate layer 2 in the base material layer 1 is provided. The surface of the base material layer 1 containing such an antistatic agent or the antistatic layer has a possibility of coming into contact with the bottom surface of the carrier tape of the package stacked above when a plurality of packages are stacked and conveyed when an electronic component is housed and conveyed in a package composed of the carrier tape and the cover tape 10 for electronic component packaging.

[0023] The thickness of the base material layer 1 is preferably, for example, 6 μm or more, preferably 7 μm or more, and more preferably 8 μm or more. Also, the thickness of the base material layer 1 is preferably, for example, 35 μm or less, preferably 33 μm or less, and more preferably 30 μm or less. If the thickness of the base material layer 1 is below the above upper limit value, the rigidity of the cover tape for electronic component packaging does not become too high, and even if torsional stress is applied to the carrier tape after sealing, the cover tape 10 for electronic component packaging can follow the deformation of the carrier tape and the possibility of peeling off can be reduced. Further, if the thickness of the base material layer 1 is above the above lower limit value, the mechanical strength of the cover tape 10 for electronic component packaging becomes suitable, and even when peeling the cover tape 10 for electronic component packaging from the carrier tape at high speed, the possibility of the cover tape 10 for electronic component packaging breaking can be reduced. Note that the base material layer 1 may have a two-layer structure of a first base material layer and a second base material layer, or a three-layer or more structure having additional layers. In this case, for example, the material used for the base material layer 1 can be used. Also, preferably, the total thickness of the first base material layer, the second base material layer, etc. is the "thickness of the base material layer 1".

[0024] <Intermediate layer> The intermediate layer 2 is a layer provided for the purpose of imparting cushioning properties to the cover tape 10 for electronic component packaging according to the present embodiment. Thereby, the adhesion between the cover tape 10 for electronic component packaging and the carrier tape during sealing can be improved.

[0025] The material of the intermediate layer 2 is not particularly limited as long as it can impart cushioning properties to the cover tape 10 for electronic component packaging. Examples include one or more selected from polyacrylic acid derivatives, polyacrylate esters derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, cyclic olefin resins, and copolymers thereof. Among these, olefin resins are preferred, and more preferably ethylene resins can be suitably used.

[0026] The thickness of the intermediate layer 2 is typically 10 μm or more and 50 μm or less, preferably 15 μm or more and 45 μm or less, from the viewpoint of improving the adhesion between the cover tape 10 for electronic component packaging and the carrier tape during sealing.

[0027] <Sealant layer> The sealant layer 3 is a layer provided on the surface side opposite to the surface in contact with the base material layer 1 of the intermediate layer 2, and is a layer in contact with the carrier tape when the cover tape 10 for electronic component packaging is sealed (for example, heat-sealed) to the carrier tape. The sealant layer 3 has heat-sealability and is adhered to the carrier tape, showing easy peelability that can be easily peeled off during use. Note that the sealant layer 3 may be laminated in the order of an adhesive resin layer and an antistatic layer on the side opposite to the surface in contact with the intermediate layer 2.

[0028] The sealant layer 3 contains a resin (A1) having a glass transition temperature (°C) measured by a differential scanning calorimeter (DSC) with a temperature increase from 0 °C to 200 °C at a heating rate of 10 °C / min under a nitrogen atmosphere condition, and the glass transition temperature (°C) is greater than 60 °C and 120 °C or less. The resin (A1) preferably contains at least one resin (A1) selected from the group consisting of styrene-based resins, acrylic-based resins, and ester-based resins. The glass transition temperature (°C) of the resin (A1) is greater than 60 °C and 120 °C or less, preferably 118 °C or less, more preferably 116 °C or less, and still more preferably 114 °C or less. Regarding the glass transition temperature of the resin (A1), by considering not only the lower limit but also the upper limit, for example, it becomes easier to balance the improvement of the adhesion of the cover tape to the carrier tape (improvement of peel strength) and the ease of peeling during peeling (peelability).

[0029] Specific examples of styrene resins include, for example, polystyrene, styrene-butadiene copolymer (SB), styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-(meth)methyl acrylate copolymer, hydrogenated styrene block copolymer, high impact polystyrene (HIPS), general purpose polystyrene resin (GPPS), etc. These may be used alone or in combination of two or more. Among these, from the viewpoint of high transparency and well-balanced improvement of adhesion resistance and peel strength, it is preferable to use polystyrene or styrene-butadiene copolymer (SB).

[0030] Specific examples of acrylic resins include, for example, resins composed of monomers such as acrylic acid esters such as acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate; methacrylic acid esters such as methyl methacrylate, ethyl methacrylate, butyl methacrylate; and monomers such as acrylonitrile, methacrylonitrile, acrylamide. The constituent monomers of the acrylic resin include one or more of these exemplified monomers. Further, the constituent monomers of the acrylic resin may further include monomers other than these exemplified ones. Also, derivatives of these monomers may be used.

[0031] Ester resins are composed of an alcohol component and a carboxylic acid component. Specific examples of the alcohol component include, for example, chain or branched aliphatic diols such as ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2,2-dimethyl-1,3-propanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,12-dodecanediol, etc.; alicyclic diols such as hydrogenated bisphenol A [2,2-bis(4-hydroxycyclohexyl)propane] and adducts of hydrogenated bisphenol A with an alkylene oxide having 2 to 4 carbon atoms (average addition mole number of 2 or more and 12 or less); and polyhydric alcohols having a trivalent or higher valence such as glycerin, pentaerythritol, trimethylolpropane, sorbitol, etc. These alcohol components may be used alone or in combination of two or more. Examples of the carboxylic acid component include, for example, chain or branched aliphatic dicarboxylic acids such as oxalic acid, malonic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, succinic acid, adipic acid, sebacic acid, dodecanedioic acid, azelaic acid, dodecylsuccinic acid, dodecenylsuccinic acid, octenylsuccinic acid, etc.; polyvalent carboxylic acids having a trivalent or higher valence such as trimellitic acid or its anhydride; and aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, etc. These carboxylic acid components may be used alone or in combination of two or more.

[0032] Examples of commercially available styrene resins having a glass transition temperature higher than 60°C and 120°C or lower include, for example, L8900 (Tg: 100°C) manufactured by Asahi Kasei Corporation. Examples of commercially available acrylic resins having a glass transition temperature higher than 60°C and 120°C or lower include VSC6254w (Tg: 84°C) manufactured by Daicel Ornex Co., Ltd. Examples of commercially available ester resins with a glass transition temperature greater than 60°C and less than or equal to 120°C include Unitika's Arterial KT-8803 (Tg: 65°C), Unitika's Arterial KA-5034 (Tg: 67°C), Unitika's Arterial KA-3556 (Tg: 80°C), Unitika's Arterial KA-5034 (Tg: 67°C), and the like.

[0033] When the total amount of the materials constituting the sealant layer 3 is 100% by mass, the content of the resin (A1) with respect to the total amount of the materials constituting the sealant layer 3 is preferably 10% by mass or more, more preferably 20% by mass or more, and preferably 98% by mass or less, more preferably 95% by mass or less. By the content of the resin (A1) being within the above range, for example, unintentional adhesion can be further suppressed, or the balance between adhesiveness and peelability of the carrier tape of the cover tape for electronic component packaging can be improved.

[0034] The sealant layer 3 preferably further contains a resin (A2) having a glass transition temperature of 60°C or less as measured under nitrogen atmosphere conditions with a temperature increase from 0°C to 200°C at a rate of 10°C / min using a differential scanning calorimeter (DSC). The resin (A2) is preferably at least one selected from the group consisting of styrene resins, acrylic resins, and ester resins. The glass transition temperature of the resin (A2) is preferably 60°C or less, more preferably 55°C or less, and even more preferably 50°C or less. There is no limit to the lower limit value of the glass transition temperature of the resin (A2), but for example, it is 20°C or more. By using the resin (A2), for example, the balance between adhesiveness and peelability of the carrier tape of the cover tape for electronic component packaging can be improved.

[0035] Examples of commercially available styrene resins with a glass transition temperature of 60°C or less include Asahi Kasei's L-7708 (Tg: 38°C), Asahi Kasei's A-7755 (Tg: 36°C), Asahi Kasei's L-2301 (Tg: 24°C), Asahi Kasei's L-7532 (Tg: 17°C), and the like. Examples of commercially available acrylic resins having a glass transition temperature of 60°C or lower include VSC6828w (Tg: 42°C) manufactured by Daicel Ornex Co., Ltd. Examples of commercially available ester resins having a glass transition temperature of 60°C or lower include Elitel KA-0134 (Tg: 40°C) and Elitel KT-9204 (Tg: 18°C), both manufactured by Unitika Ltd.

[0036] Also, when the total amount of resin (A1) and resin (A2) in the sealant layer 3 is taken as 100, the ratio by mass is preferably (A1):(A2) = 10:90 to 90:10, more preferably 15:85 to 85:15, and even more preferably 20:80 to 80:20.

[0037] Also, the resins used for resin (A1) and resin (A2) may be a combination of resins of the same type or a combination of resins of different types. What this means is that, for example, it may be a combination of a styrene resin having a glass transition temperature greater than 60°C and not exceeding 120°C and a styrene resin having a glass transition temperature of 60°C or lower, or a combination of a styrene resin having a glass transition temperature greater than 60°C and not exceeding 120°C and a resin other than a styrene resin (acrylic resin or ester resin) having a glass transition temperature of 60°C or lower, and so on.

[0038] In addition to the above-mentioned resin (A1) and resin (A2), the sealant layer 3 may contain other resins. Specific examples of other resins include one or more selected from the group consisting of olefin resins and urethane resins and copolymers thereof.

[0039] From the viewpoint of reducing the surface resistance value of the sealant layer 3 to suppress the generation of static electricity during peeling and maintaining the sealing property, the sealant layer 3 can further contain (B) an antistatic agent. (B) Specific examples of the antistatic agent include antimony-doped tin, polythiophene or polythiophene derivatives, phosphorus-doped tin, fluorine-doped tin, carbon nanotubes, etc. From the viewpoint of obtaining good compatibility with the above (A1) alone or with the above (A1) and (A2), and more surely obtaining the effect of suppressing static electricity during peeling, it is preferable that the (B) antistatic agent be polythiophene, a polythiophene derivative or antimony-doped tin.

[0040] Examples of the above polythiophene or polythiophene derivative include polythiophene, poly(3,4)-ethylenedioxythiophene, and poly(3-thiophene-β-ethanesulfonic acid). Among these, from the viewpoint of maintaining better antistatic properties and sealing properties, it is preferably poly 3,4-ethylenedioxythiophene or its derivative.

[0041] The sealant layer 3 may contain, as other additives, a dispersant for improving the dispersibility of the antistatic agent, silica sol, a leveling agent, a conductive aid, etc.

[0042] From the viewpoint of suitably performing the sealing operation and the peeling operation, the thickness of the sealant layer 3 is typically preferably 0.02 μm or more and 20 μm or less, and more preferably 0.03 μm or more and 15 μm or less.

[0043] From the viewpoint of ensuring the film strength, the thickness of the cover tape for packaging electronic components according to the present embodiment is preferably 40 μm or more and 65 μm or less, and more preferably 45 μm or more and 60 μm or less.

[0044] Hereinafter, the characteristics of the cover tape for packaging electronic components according to the present embodiment will be described.

[0045] In the cover tape for packaging electronic components according to the present embodiment, the tack force of the sealant layer 3 is considered to be an index closely related to the unintentional adhesion (described above) of the cover tape to the carrier tape. Here, the contact area is 20 mm 2Press the stainless steel material against the sealant layer 3 of the cover tape for electronic component packaging at a contact speed of 30 mm / min, hold it for 20 seconds at a measurement temperature of 60°C and a contact load of 25 N, and then peel it off at a speed of 600 mm / min. The load per unit area at this time is defined as the tack force at 60°C. At this time, from the viewpoint of further suppressing the unintended adhesion of the sealant layer 3 to the carrier tape of the cover tape, the tack force of the sealant layer 3 at 60°C is preferably 5.0 N / cm 2 or less, more preferably 4.5 N / cm 2 or less, and even more preferably 4.0 N / cm 2 or less. Also, there is no limit to the lower limit value of the tack force at 60°C. For example, it is 0 N / cm 2 or more, specifically 0.01 N / cm 2 or more.

[0046] The cover tape for electronic component packaging according to this embodiment can further improve the balance between adhesiveness and peelability to the carrier tape made of polystyrene by devising the composition of the sealant layer and the like. Specifically, the following indicators can be cited for this.

[0047] The cover tape for electronic component packaging is sized at 5.5 mm in width, and the sealant layer side of the cover tape for electronic component packaging is bonded to the uneven surface side of a polystyrene film with a width of 8 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm. Using a double-edge iron with a single-edge width of 0.4 mm and a length of 28 mm, heat sealing is performed under the conditions of a seal temperature of 180°C, a load of 5 kgf, a seal time of 60 milliseconds, and a carrier tape feed pitch of 4 mm to obtain a sample. In the said sample, the lower limit value of the peel strength of the cover tape for electronic component packaging with respect to the said polystyrene film under the conditions of a peel speed of 300 mm / min, a measurement temperature of 25°C, and a peel angle of 170° is preferably 0.20 N or more, more preferably 0.21 N or more, and even more preferably 0.22 N or more. Also, the upper limit value of the 170° peel strength of the cover tape for electronic component packaging with respect to the said polystyrene film is preferably 0.9 N or less, more preferably 0.8 N or less, and even more preferably 0.7 N or less. By setting the 170° peel strength of the cover tape for electronic component packaging with respect to the said polystyrene film within the above range, the balance between adhesiveness and peelability with respect to the polystyrene carrier tape can be made even better.

[0048] Furthermore, the cover tape for electronic component packaging according to the present embodiment can further improve the balance between adhesiveness and peelability with respect to a polycarbonate carrier tape by devising the composition of the sealant layer and the like. Regarding this, specific indicators can be cited as follows.

[0049] The cover tape for electronic component packaging is sized at 5.5 mm in width, and the sealant layer side of the cover tape for electronic component packaging is bonded to the uneven surface side of a polycarbonate film with a width of 8 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm. Using a double-edged iron with a single-edge width of 0.4 mm and a length of 28 mm, heat sealing is performed under the conditions of a seal temperature of 180°C, a load of 5 kgf, a seal time of 60 milliseconds, and a carrier tape feed pitch of 4 mm to obtain a sample. In the said sample, the lower limit value of the peel strength of the cover tape for electronic component packaging with respect to the polycarbonate film under the conditions of a peel speed of 300 mm / min, a measurement temperature of 25°C, and a peel angle of 170° is preferably 0.2 N or more, more preferably 0.21 N or more, and still more preferably 0.22 N or more. Also, the upper limit value of the 170° peel strength of the cover tape for electronic component packaging with respect to the polycarbonate film is preferably 0.9 N or less, more preferably 0.8 N or less, and still more preferably 0.7 N or less. By setting the 170° peel strength of the cover tape for electronic component packaging with respect to the polycarbonate film within the above range, the balance between adhesiveness and peelability with respect to the polycarbonate carrier tape can be made even better.

[0050] As described above, even when pressure is applied in a high-temperature and high-humidity environment, the cover tape for electronic component packaging according to this embodiment suppresses the adhesion of the portion not heat-sealed to the carrier tape to the carrier tape (unintended adhesion). Specifically, the following indicators can be cited for this.

[0051] The cover tape for electronic component packaging is sized to 10 mm in width, and the sealant layer side of the cover tape is bonded to the uneven surface of a polystyrene film with a width of 8 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm to form a sample. A seal coat with a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample and left standing for 24 hours under the conditions of 60 °C and 90% RH. After standing, it is evaluated whether the polystyrene film and the cover tape for electronic component packaging are adhered at the adhesion mark on the polystyrene film. Specifically, at the adhesion mark on the polystyrene film, the dimension in the length direction of the polystyrene film is measured as the length of the adhesion mark on the polystyrene film. The length of the adhesion mark on the polystyrene film is preferably 15 mm or less, more preferably 13 mm or less, and even more preferably 11 mm or less. There is no limit to the lower limit value of the length of the adhesion mark on the polystyrene film, but for example, it is 0 mm or more. By designing the cover tape so that the length of the adhesion mark becomes shorter, when the cover tape and the carrier tape are bonded to form a package and wound on a reel for storage, the adhesion between the cover tape and the carrier tape can be further suppressed at locations other than the heat-sealed bonded portion.

[0052] The surface resistance value on the surface of the base material layer of the cover tape for electronic component packaging according to this embodiment, measured at 25 °C and 50% RH, is preferably 1.0×10 3 Ω or more, more preferably 1.0×10 4 Ω or more, even more preferably 1.0×10 5 Ω or more, preferably 1.0×10 13 Ω or less, more preferably 1.0×10 12 Ω or less, even more preferably 1.0×10 11 Ω or less. By setting the surface resistance value of the base material layer of the cover tape for electronic component packaging within the above range, static electricity generated by various factors can be efficiently discharged to the outside. Note that the surface of the base material layer refers to the exposed surface side of the base material layer in the cover tape for electronic component packaging (that is, the surface that does not contact the intermediate layer in the base material layer).

[0053] The surface resistance value on the surface of the sealant layer of the cover tape for electronic component packaging according to the present embodiment, measured at 25°C and 50% RH, is preferably 1.0×10 3 Ω or more, more preferably 1.0×10 4 Ω or more, still more preferably 1.0×10 5 Ω or more, preferably 1.0×10 12 Ω or less, more preferably 1.0×10 11 Ω or less, still more preferably 1.0×10 10 Ω or less. By setting the surface resistance value on the surface of the sealant layer of the cover tape for electronic component packaging, measured at 25°C and 50% RH, within the above range, it is possible to obtain a cover tape for electronic component packaging with even better antistatic properties during the peeling of the carrier tape. Note that the surface of the sealant layer refers to the exposed surface side of the sealant layer in the cover tape for electronic component packaging (that is, the surface that does not contact the intermediate layer in the sealant layer).

[0054] The total light transmittance of the cover tape for electronic component packaging according to the present embodiment, measured with a light source D65 in accordance with JIS K7361-1 (1997), is preferably 70% or more, more preferably 75% or more, still more preferably 80% or more, preferably 95% or less, more preferably 94% or less, still more preferably 93% or less. By doing so, in the package 100 composed of the cover tape 10 for electronic component packaging and the carrier tape, it is possible to impart transparency to such an extent that it is possible to inspect whether the electronic components are correctly accommodated in the pocket of the carrier tape. That is, by setting the total light transmittance of the cover tape for electronic component packaging to be equal to or higher than the above lower limit value, it becomes possible to visually confirm and check the electronic components accommodated inside the package 100 composed of the cover tape 10 for electronic component packaging and the carrier tape from the outside of the package 100.

[0055] Regarding the cover tape for electronic component packaging according to this embodiment, the external haze measured with a light source D65 in accordance with JIS K7136 (2000) is preferably 5% or more, more preferably 6% or more, and most preferably 7% or more, and is preferably 50% or less, more preferably 45% or less, and most preferably 40% or less. By setting the external haze of the cover tape for electronic component packaging below the above upper limit value, in a package composed of the cover tape 10 for electronic component packaging and a carrier tape, it is possible to impart transparency to such an extent that it is possible to inspect whether or not the electronic components are correctly accommodated in the pockets of the carrier tape.

[0056] In this embodiment, for example, by appropriately selecting conditions such as the types, properties, and blending amounts of the respective components included in the base material layer 1, the intermediate layer 2, and the sealant layer 3 constituting the cover tape for electronic component packaging, and the manufacturing method of the cover tape for electronic component packaging, etc., for example, even when pressure is applied in a high-temperature and high-humidity environment, it is possible to suppress the adhesion (unintended adhesion) of the non-heat-sealed portion to the carrier tape. Also, in this embodiment, in addition to using a resin (A1) having a glass transition temperature within a specific range in the sealant layer 3, by further devising other conditions, for example, it is possible to improve the balance between the adhesiveness and peelability with respect to the carrier tape.

[0057] <Manufacturing Method of Cover Tape for Electronic Component Packaging> An example of the manufacturing method of the cover tape for electronic component packaging according to this embodiment will be described. First, an intermediate layer 2 is formed on the surface of the base material layer 1. The intermediate layer 2 can be formed, for example, by an extrusion lamination method or a dry lamination method. The manufacturing method of the cover tape for electronic component packaging according to this embodiment includes a step of preparing a composition for forming a sealant layer containing a resin (A1), and a step of forming a sealant layer using the composition for forming a sealant layer. In the step of forming the sealant layer, the sealant layer-forming composition obtained above, i.e., the sealant layer coating liquid, is applied onto the intermediate layer 2 by a coating method and dried, or laminated by an extrusion lamination method to form the sealant layer 3.

[0058] In addition, when forming the adhesive layer described above, the material of the adhesive layer may be applied to the surface of the target layer by a conventionally known coating method.

[0059] The cover tape for electronic component packaging according to the present embodiment can be used as a package attached to a carrier tape. That is, it is preferable to form a package including a carrier tape having a plurality of storage parts for storing electronic components, the electronic components stored in the storage parts, and the cover tape for electronic component packaging arranged to cover the storage parts. With such a package, the generation of static electricity can be suppressed, and the electronic components stored in the storage parts can be more reliably protected from static electricity.

[0060] <Electronic component package> An electronic component package can be obtained from the cover tape for electronic component packaging of the present embodiment described above and a carrier tape in which electronic components are housed in recesses. This will be described with reference to FIG. 2.

[0061] In FIG. 2, the cover tape 10 for electronic component packaging is used as a lid material for a strip-shaped carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of the electronic components. Specifically, the cover tape 10 for electronic component packaging is adhered (usually, heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening surface of the pocket 21 of the carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 10 for electronic component packaging and the carrier tape 20 will be referred to as the electronic component package 100.

[0062] The electronic component package 100 can be manufactured, for example, by the following procedure. First, an electronic component is accommodated in the pocket 21 of the carrier tape 20. Next, an electronic component packaging cover tape 10 is adhered to the surface of the carrier tape 20 by a heat seal method so as to cover the entire opening surface of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 in the electronic component packaging cover tape 10 is brought into contact with the carrier tape 20 (that is, heat sealing is performed so that the "back surface" of the electronic component packaging cover tape 10 in FIG. 2 becomes the sealant layer 3). The specific method and conditions of heat sealing are not particularly limited as long as the electronic component packaging cover tape 10 adheres strongly enough to the carrier tape 20. Typically, it can be performed within the range of a temperature of 100 to 240 ° C, a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second using a known heat sealer.

[0063] As described above, a structure (electronic component package 100) in which the electronic component is hermetically accommodated is obtained. This structure (electronic component package 100) is, for example, wound around a reel and then transported to a work area for mounting the electronic component on an electronic circuit board or the like. The material of the reel can be made of metal, paper, plastic, or the like.

[0064] After the electronic component package 100 is transported to the work area, the electronic component packaging cover tape 10 is peeled off from the carrier tape 20, and the accommodated electronic component is taken out.

[0065] Note that the electronic component accommodated in the electronic component package 100 is not particularly limited. Examples include components used in the manufacture of electrical and electronic devices such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes.

[0066] Although the embodiments of the present invention have been described in detail above, these are examples of the present invention. In addition, various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiments.

Example

[0067] Embodiments of the present invention will be described in detail based on examples and comparative examples, but the present invention is not limited thereto.

[0068] Each constituent material of the sealant layer shown in Table 1 is as follows. (Resin (A1) having a glass transition temperature of more than 60°C and 120°C or less, specifically, styrene resin, acrylic resin or ester resin) · Resin 1: Styrene resin ("L8900" manufactured by Asahi Kasei Co., Ltd., Tg: 100°C) · Resin 2: Ester resin ("Eryther KT-8803" manufactured by Unitika Ltd., Tg: 65°C) · Resin 3: Acrylic resin ("VSC6254w" manufactured by Daicel Ornex Co., Ltd., Tg: 84°C) · Resin 4: Ester resin ("Z-687" manufactured by Gohsei Chemical Industry Co., Ltd., Tg: 110°C)

[0069] (Resin (A2) having a glass transition temperature of 60°C or less, specifically, styrene resin, acrylic resin or ester resin) · Resin 5: Styrene resin ("L7708" manufactured by Asahi Kasei Co., Ltd., Tg: 38°C) · Resin 6: Ester resin ("Eryther KA-0134" manufactured by Unitika Ltd., Tg: 40°C) · Resin 7: Acrylic resin ("VIACRYL VSC6828w" manufactured by Daicel Ornex Co., Ltd., Tg: 42°C)

[0070] (Resin (for comparative example) having a glass transition temperature of more than 120°C, specifically, acrylic resin) · Resin 8: Acrylic resin ("TE-1048" manufactured by Starlight PMC Co., Ltd., Tg: 123°C)

[0071] (Antistatic agent) · Antistatic agent 1: Polythiophene derivative (PEDOT:PSS) ("Clevios P1000" manufactured by Heraeus)

[0072] <Example 1> [Production of substrate layer and intermediate layer] An anchor coating agent was wet-coated at a thickness of 4 μm by gravure coating on an antistatic polyethylene terephthalate (PET) film (「E7455」 manufactured by Toyobo Co., Ltd.) with a thickness of 12 μm. After drying at 100 °C, it was extrusion laminated with low-density polyethylene (「Sumika Seal L705」 with a thickness of 37 μm manufactured by Sumitomo Chemical Co., Ltd.) and cooled by a cooling roll (surface temperature 20 °C) to produce a laminated film composed of a base material layer and an intermediate layer.

[0073] On the surface of the obtained laminated film on the intermediate layer side, a sealant layer composed of the components shown in Table 1 was formed into a film with a thickness of 0.5 μm by the gravure coating method. The total thickness of the cover tape is shown in Table 1.

[0074] <Examples 2 to 10, Comparative Examples 1 to 4> According to the formulations described in Table 1, cover tapes for electronic component packaging were prepared in the same manner as in Example 1.

[0075] <Glass transition temperature> For at least one resin (A1) selected from the group consisting of the styrene-based resin, acrylic-based resin, and ester-based resin used in the examples and comparative examples, and at least one resin (A2) selected from the group consisting of the styrene-based resin, acrylic-based resin, and ester-based resin, using a differential scanning calorimeter (DSC) (「DSC7000X」 manufactured by Hitachi High-Tech Science Corporation), the temperature was raised from 0 °C to 200 °C at a rate of 10 °C / min under a nitrogen atmosphere condition, and the glass transition temperature (°C) was measured.

[0076] <Tack force at 60 °C> A stainless steel material (SUS304) with a contact area of 20 mm 2 was pressed against the sealant layer of the cover tape at a contact speed of 30 mm / min, held for 20 seconds at a measurement temperature of 60 °C and a contact load of 25 N, and then peeled off at a speed of 600 mm / min. The load per unit area was measured using a tacking tester TAC0-1000 manufactured by RHESCA, and the tack force (N / cm at 60 °C) 2) was used. The stainless steel material is attached to the tacking tester.

[0077] <Peel strength at 170° for polystyrene film> Each cover tape for electronic component packaging obtained above was made to have a width of 5.5 mm, and the sealant layer side of the cover tape for electronic component packaging was bonded to the uneven surface side of a polystyrene film (manufactured by Sumitomo Bakelite Co., Ltd., "CEL-E980A") with a width of 8 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm. The bonded product was heat-sealed using a heat sealer (manufactured by Tokyo Wells Co., Ltd., "TWA-6621") under the conditions of a seal temperature of 180 °C, a load of 5 kgf, a seal time of 60 milliseconds, a carrier tape feed pitch of 4 mm, and 2 rows and 7 hits to obtain a sample. Using the obtained sample, the peel strength (N) immediately after heat-sealing of the cover tape for electronic component packaging with respect to the polystyrene film was measured. The measurement of the peel strength was performed using a peel tester (manufactured by EPI Co., Ltd., "PTS-5000") under the conditions of a peel speed of 300 mm / min, a peel angle of 170°, and a measurement temperature of 25 °C. The results are shown in Table 1. The surface roughness (Ra) of the polystyrene film was measured using a surface roughness measuring instrument (manufactured by Mitutoyo Co., Ltd., "SJ-210") in accordance with JIS B 0601 (2001) before bonding to the cover tape for electronic component packaging for the portion of the polystyrene film used above that was bonded to the cover tape for electronic component packaging. The unit is μm.

[0078] <Peel strength at 170° for polycarbonate film> Each cover tape for electronic component packaging obtained above was made to have a width of 5.5 mm, and the sealant layer side of the cover tape for electronic component packaging was bonded to the uneven surface side of a polycarbonate film (3M's "No. 3000") with a width of 8 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm. The bonded product was heat-sealed using a heat-sealing machine ("TWA-6621" manufactured by Tokyo Wells) under the conditions of a seal temperature of 180°C, a load of 5 kgf, a seal time of 60 milliseconds, a carrier tape feed pitch of 4 mm, and 2 rows and 7 degrees of punching using a double-edge iron with a single-edge width of 0.4 mm and a length of 28 mm to obtain a sample. Using the obtained sample, the peel strength (N) immediately after heat-sealing of the cover tape for electronic component packaging to the polycarbonate film was measured. The measurement of the peel strength was performed using a peel tester ("PTS-5000" manufactured by EPI) under the conditions of a peel speed of 300 mm / min, a peel angle of 170°, and a measurement temperature of 25°C. The results are shown in Table 1. The surface roughness (Ra) of the polycarbonate film was measured using a surface roughness measuring instrument ("SJ-210" manufactured by Mitutoyo) in accordance with JIS B 0601 (2001) before bonding to the cover tape for electronic component packaging for the portion of the polycarbonate film used above that was bonded to the cover tape for electronic component packaging. The unit is μm.

[0079] <Measurement of Adhesion Marks (Evaluation of Unintended Adhesion)> The cover tape for electronic component packaging obtained above was made to have a width of 10.0 mm, and the side of the cover tape on the sealant layer side was bonded to the uneven surface side of a polystyrene film (Sumitomo Bakelite Co., Ltd.'s "CEL-E980A") with a width of 8.0 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm to obtain a sample. A seal coat with a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g was placed on the upper surface of the cover tape and left for 24 hours under the conditions of 60°C and 90% RH. Then, in the adhesion mark (where gloss can be seen) on the polystyrene film, the dimension in the length direction of the polystyrene film was measured as the length of the adhesion mark on the polystyrene film. Incidentally, the "length of the adhesion mark" means the total length of each adhesion mark when the adhesion marks are observed intermittently (sporadically). The shorter this adhesion mark is, it can be said that the part of the carrier tape in the cover tape that is not heat-sealed is less likely to adhere to the carrier tape (unintended adhesion).

[0080] <Surface resistance value of the base material layer> The surface resistance value (Ω) on the surface of the base material layer of the cover tape for electronic component packaging obtained above was measured at 25°C and 50% RH using a surface resistance measuring instrument (SIMCO's "ST-3") manufactured by SIMCO. The results are shown in Table 1. Note that, for example, "5.E+09" in Example 1 described in Table 1 represents "5×10 9 ".

[0081] <Surface resistance value of the sealant layer> The surface resistance value (Ω) on the surface of the sealant layer of the cover tape for electronic component packaging obtained above was measured at 25°C and 50% RH using a surface resistance measuring instrument (SIMCO's "ST-3") manufactured by SIMCO. The results are shown in Table 1. Note that, for example, "1.E+07" in Example 1 described in Table 1 represents "1×10 7 ".

[0082] <Total light transmittance> The total light transmittance (%) of the cover tape for electronic component packaging obtained above was measured at a light source D65 using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS K7361-1 (1997). The results are shown in Table 1.

[0083] <External haze> The external haze (%) of the cover tape for electronic component packaging obtained above was measured at a light source D65 using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS K7136 (2000). The results are shown in Table 1.

[0084]

Table 1

[0085]

Table 2

[0086] In Examples 1 to 10, since the resin (A1) having a glass transition temperature higher than 60°C and 120°C or lower was included, the tack force at 60°C was relatively small, and the length of the adhesion mark on the polystyrene film was relatively short. From this, it was shown that by using the cover tapes of Examples 1 to 10, it was possible to suppress the adhesion (unintended adhesion) of the portion of the cover tape that was not heat-sealed to the carrier tape to the carrier tape. Also, in Examples 1 to 10, the evaluation results such as various peel strengths, surface resistance values of the sealant layer, surface resistance values of the base material layer, total light transmittance, and external haze were good.

Explanation of reference numerals

[0087] 1 Base material layer 2 Intermediate layer 3 Sealant layer 10 Cover tape 20 Carrier tape 21 Pocket 100 Electronic component package

Claims

1. a base material layer, an intermediate layer, a sealant layer (excluding a heat-sealing layer containing a random copolymer of 60% by mass of butyl methacrylate and 40% by mass of methyl methacrylate (manufactured by Mitsubishi Rayon Co., Ltd., "Dianal BR-106", glass transition temperature 52°C, acid value 7 mgKOH / g) and SEBS (manufactured by Asahi Kasei Chemicals Corporation, "Tuftec H1141", styrene content 30% by mass, hydrogenated butadiene content 70% by mass, MFR = 22 g / 10 min. (JIS K7210, temperature 190°C × load 2.16 kg))). An electronic component packaging cover tape having the above in this order (excluding a cover film characterized by comprising at least (A) a base material layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat-sealing layer having a heat-sealable resin, wherein the thermoplastic resin constituting the (D) heat-sealing layer is composed of a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, and among the (meth)acrylic acid ester copolymer mixtures, one type has a glass transition temperature of -20 to 10°C, and the other type of (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80°C). The sealant layer contains one or more resins (A1) having a glass transition temperature of greater than 60°C and less than or equal to 120°C as measured according to the following <Method for Measuring Glass Transition Temperature> (excluding the hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene hydrocarbon compound, wherein the aromatic vinyl compound in the resin (a) is 20% by mass or more and 45% by mass or less). The resin (A1) contains at least one resin selected from the group consisting of styrene resins, acrylic resins, and ester resins. The sealant layer further contains (B) an antistatic agent. When evaluated by the following <Adhesion Test>, the length of the adhesion mark on the polystyrene film is 0 mm or more and 11 mm or less. An electronic component packaging cover tape, wherein when the total amount of the materials constituting the sealant layer is 100% by mass, the content of the resin (A1) with respect to the total amount of the materials constituting the sealant layer is 10% by mass or more and 95% by mass or less. <Method for Measuring Glass Transition Temperature> The glass transition temperature (°C) of the resin (A1) is measured using a differential scanning calorimeter (DSC) under nitrogen atmosphere conditions by increasing the temperature from 0°C to 200°C at a heating rate of 10°C / min. <Adhesion test> The cover tape for electronic component packaging is made to have a width of 10.0 mm, and the sealant layer side of the cover tape is bonded to the uneven surface side of a polystyrene film with a width of 8.0 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm to form a sample. A seal coat with a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample and left standing for 24 hours under the conditions of 60°C and 90% RH. After standing, in the adhesion mark on the polystyrene film, the dimension in the length direction of the polystyrene film is measured as the length of the adhesion mark on the polystyrene film.

2. The cover tape for electronic component packaging according to claim 1, wherein the sealant layer further contains one or more resins (A2) having a glass transition temperature of 60°C or lower as measured according to the <Method for measuring glass transition temperature>.

3. The cover tape for electronic component packaging according to claim 2, wherein the resin (A2) contains at least one resin selected from the group consisting of styrene resins, acrylic resins, and ester resins.

4. The cover tape for electronic component packaging according to any one of claims 1 to 3, wherein the (B) antistatic agent is polythiophene or a polythiophene derivative.

5. The cover tape for electronic component packaging according to any one of claims 1 to 4, wherein the peel strength with respect to the polystyrene film measured by the following <Method for measuring peel strength with respect to polystyrene film> is 0.2 N or more and 0.9 N or less. <Method for measuring peel strength with respect to polystyrene film> The cover tape for electronic component packaging is sized to be 5.5 mm in width, and the sealant layer side of the cover tape for electronic component packaging is bonded to the uneven surface side of a polystyrene film that is 8 mm in width and has an average surface roughness (Ra) of 0.25 μm on the uneven surface. Using a double-edged iron with a single-edge width of 0.4 mm and a length of 28 mm, heat sealing is performed under the conditions of a seal temperature of 180 °C, a load of 5 kgf, a seal time of 60 milliseconds, and a carrier tape feed pitch of 4 mm to obtain a sample. In the said sample, the peel strength (N) of the cover tape for electronic component packaging with respect to the polystyrene film is measured under the conditions of a peel rate of 300 mm / min, a measurement temperature of 25 °C, and a peel angle of 170°.

6. A cover tape for electronic component packaging according to any one of Claims 1 to 5, wherein the peel strength with respect to a polycarbonate film measured by <Measurement of Peel Strength with Respect to Polycarbonate Film> below is 0.2 N or more and 0.9 N or less. <Measurement of Peel Strength with Respect to Polycarbonate Film> The cover tape for electronic component packaging is sized to be 5.5 mm in width, and the sealant layer side of the cover tape for electronic component packaging is bonded to the uneven surface side of a polycarbonate film that is 8 mm in width and has an average surface roughness (Ra) of 0.25 μm on the uneven surface. Using a double-edged iron with a single-edge width of 0.4 mm and a length of 28 mm, heat sealing is performed under the conditions of a seal temperature of 180 °C, a load of 5 kgf, a seal time of 60 milliseconds, and a carrier tape feed pitch of 4 mm to obtain a sample. In the said sample, the peel strength (N) of the cover tape for electronic component packaging with respect to the polycarbonate film is measured under the conditions of a peel rate of 300 mm / min, a measurement temperature of 25 °C, and a peel angle of 170°.

7. A cover tape for electronic component packaging according to any one of Claims 1 to 6, The tack force of the sealant layer measured by the following <Method for Measuring Tack Force> is 0 N / cm ２ or more and 5.0 N / cm ２ or less. A cover tape for packaging electronic components. <Method for Measuring Tack Force> Contact area: 20 mm ２ Press the stainless steel material against the sealant layer of the cover tape at a contact speed of 30 mm / min, hold it for 20 seconds at a measurement temperature of 60°C and a contact load of 25 N, and then peel it off at a speed of 600 mm / min. The measured value of the load per unit area is defined as the tack force (N / cm ２ ) at 60°C.

8. A cover tape for electronic component packaging according to any one of Claims 1 to 7, The surface resistance value on the surface of the base material layer measured at 25 °C and 50% RH is 1.0×10 ３ Ω or more and 1.0×10 １３ Ω or less, a cover tape for electronic component packaging.

9. A cover tape for electronic component packaging according to any one of Claims 1 to 8, The surface resistance value on the surface of the sealant layer measured at 25°C and 50% RH is 1.0×10 ３ Ω or more and 1.0×10 １２ Ω or less, a cover tape for electronic component packaging.

10. A cover tape for electronic component packaging according to any one of Claims 1 to 9, A cover tape for electronic component packaging that complies with JIS K7361-1 (1997) and has a total light transmittance of 70% or more and 95% or less when measured with a light source D65.

11. A cover tape for electronic component packaging according to any one of Claims 1 to 10, A cover tape for electronic component packaging that complies with JIS K7136 (2000) and has an external haze of 5% or more and 50% or less when measured with a light source D65.

12. A carrier tape in which an electronic component is housed in a recess, A cover tape for electronic component packaging according to any one of Claims 1 to 11, and An electronic component package in which the sealant layer side is adhered to the carrier tape so as to seal the electronic component.

13. A base material layer, An intermediate layer, A sealant layer (however, excluding a heat seal layer containing a random copolymer of 60% by mass of butyl methacrylate and 40% by mass of methyl methacrylate (manufactured by Mitsubishi Rayon, "Dianal BR-106", glass transition temperature 52 ° C, acid value 7 mgKOH / g) and SEBS (manufactured by Asahi Kasei Chemicals, "Tuftec H1141", styrene content 30% by mass, hydrogenated butadiene content 70% by mass, MFR = 22 g / 10 min. (JIS K7210, temperature 190 ° C × load 2.16 kg))). A method for manufacturing a cover tape for electronic component packaging having these in this order (however, excluding a cover film comprising at least (A) a base material layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, and characterized in that the thermoplastic resin constituting the (D) heat seal layer is a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, and among the (meth)acrylic acid ester copolymer mixtures, one type has a glass transition temperature of -20 to 10 ° C and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80 ° C).), A step of preparing a composition for forming a sealant layer containing a resin (A1) having a glass transition temperature of more than 60 ° C and 120 ° C or less as measured according to the following <Method for Measuring Glass Transition Temperature> (however, excluding the hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene hydrocarbon compound, wherein the aromatic vinyl compound in the resin (a) is 20% by mass or more and 45% by mass or less). A step of forming the sealant layer using the composition for forming the sealant layer; comprising; the resin (A1) contains at least one resin selected from the group consisting of a styrene resin, an acrylic resin, and an ester resin; the sealant layer further contains (B) an antistatic agent; when evaluated in the following <Adhesion test>, the length of the adhesion mark on the polystyrene film is 0 mm or more and 11 mm or less; A method for manufacturing a cover tape for electronic component packaging, wherein when the total amount of the materials constituting the sealant layer is 100% by mass, the content of the resin (A1) with respect to the total amount of the materials constituting the sealant layer is 10% by mass or more and 95% by mass or less. <Method for measuring glass transition temperature> The glass transition temperature (°C) of the resin (A1) is measured under a nitrogen atmosphere condition by raising the temperature from 0 °C to 200 °C at a heating rate of 10 °C / min using a differential scanning calorimeter (DSC). <Adhesion test> The cover tape for electronic component packaging is made to have a width of 10.0 mm, and the sealant layer side of the cover tape is bonded to the uneven surface side of a polystyrene film having a width of 8.0 mm and an average surface roughness (Ra) of the uneven surface of 0.25 μm to obtain a sample. A seal coat having a width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g is placed on the upper surface of the cover tape of the sample and left standing for 24 hours under the conditions of 60 °C and 90% RH. After standing, in the adhesion mark on the polystyrene film, the dimension in the length direction of the polystyrene film is measured as the length of the adhesion mark on the polystyrene film.

Images