Microchannel Chip and Method for Manufacturing the Same

Abstract

To prevent molding failure in manufacture of a resin substrate while manufacturing a micro flow channel chip using a resin substrate having flow channel grooves at low cost.SOLUTION: A micro flow channel chip (1) includes a resin substrate (2) having flow channel grooves (21) on one surface, and a covering material (3) joined to the resin substrate (2) so as to cover the flow channel grooves (21). An arithmetic average height Sa measured according to ISO 25178 of a joint surface (2a) to the covering material (3) in the resin substrate (2) is 0.1 μm or less, and an arithmetic average curvature Spc of a mountain top is 150 mm-1 or more and 500 mm-1 or less.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a microchannel chip and a method for manufacturing the same.

Background Art

[0002] In recent years, in the field of the chemical industry (especially the pharmaceutical industry related to the manufacture of pharmaceuticals, reagents, etc.), the development of a microchannel chip using a microcontainer called a micromixer or a microreactor has been promoted. The microchannel chip is provided with a plurality of microchannels (microcavities connected to the microchannels). By causing a plurality of types of fluids to merge in the microcavity through the microchannels, the plurality of types of fluids are mixed, or a chemical reaction occurs together with the mixing.

[0003] As such a microchannel chip, for example, Japanese Patent Application Laid-Open No. 2015-199340 (Patent Document 1) discloses a resin substrate having a flow path groove on one surface and a covering material joined to the resin substrate so as to cover the flow path groove. The resin substrate having the flow path groove can be formed by injection molding using, for example, a mold, and by doing so, the microchannel chip can be manufactured at low cost.

[0004] By the way, the surface of the mold for injection molding is usually mirror-finished, and the resin substrate formed using the mold also has a smooth surface. However, if the mold surface is too smooth, conversely, the mold release property after molding deteriorates, and molding defects such as the edges of the flow path grooves being turned up may occur.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] While manufacturing a microchannel chip at low cost using a resin substrate having a channel groove, it is desired to make it difficult to cause molding defects during the manufacture of the resin substrate.

Means for Solving the Problems

[0007] As a result of intensive studies, the inventor has found that the arithmetic mean curvature Spc of the peak points on the bonding surface with the coating material in the resin substrate is related to the likelihood of molding defects occurring during the manufacture of the resin substrate. The present invention has been made based on such findings.

[0008] The microchannel chip according to the present invention A resin substrate having a channel groove on one surface, A coating material bonded to the resin substrate so as to cover the channel groove, and The arithmetic mean height Sa measured in accordance with ISO25178 of the bonding surface of the resin substrate with the coating material is 0.1 μm or less, and the arithmetic mean curvature Spc of the peak points is 150 mm -1 or more and 500 mm -1 or less.

[0009] According to this configuration, a microchannel chip can be manufactured at low cost using a resin substrate having a channel groove. In this case, by setting the arithmetic mean curvature Spc of the peak points on the bonding surface of the resin substrate with the coating material to 150 mm -1 or more and 500 mm -1 or less, the arithmetic mean height Sa itself can be kept unchanged (usually 0.1 μm or less), and the mold release property after molding can be improved. Thereby, it is possible to manufacture a microchannel chip at low cost and make it difficult to cause molding defects during the manufacture of the resin substrate.

[0010] Moreover, the manufacturing method of the microchannel chip according to the present invention A step of injecting molten resin into a cavity space in a mold having a first mold and a second mold to form a resin substrate having a channel groove on one surface, A step of joining a coating material to the resin substrate so as to cover the flow path groove, Prior to the step of forming the resin substrate, among the inner surfaces forming the cavity spaces in the first mold and the second mold, the inner surface around the portion where the ridge portion corresponding to the flow path groove is formed is measured in accordance with ISO25178, and the arithmetic mean height Sa is 0.1 μm or less, and the arithmetic mean curvature Spc of the peak points is 250 mm -1 or more and 800 mm -1 The method further includes a step of roughening so as to be less than or equal to the following.

[0011] According to this configuration, a resin substrate having a flow path groove on one surface can be formed using a mold having a first mold and a second mold, and a micro flow path chip can be manufactured at low cost using the resin substrate. In this case, the arithmetic mean curvature Spc of the peak points on the inner surface around the portion where the ridge portion corresponding to the flow path groove is formed in the first mold or the second mold is 250 mm -1 or more and 800 mm -1 By setting it to less than or equal to the following, the arithmetic mean height Sa itself can be improved without changing (usually 0.1 μm or less), and the mold release property after molding can be improved. As a result, it is possible to manufacture a micro flow path chip at low cost and to reduce the occurrence of molding defects during the manufacture of the resin substrate.

[0012] Further features and advantages of the present invention will become more apparent from the following description of exemplary and non-limiting embodiments described with reference to the drawings.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0014] Embodiments of a microchannel chip and a method for manufacturing the same will be described with reference to the drawings. As shown in FIG. 1, the microchannel chip 1 of the present embodiment includes a resin substrate 2 and a coating material 3 joined to the resin substrate 2.

[0015] As the resin constituting the resin substrate 2, a resin excellent in heat resistance and transparency can be appropriately selected. The resin substrate 2 can be made of, for example, a resin selected from the group consisting of polycarbonate, cycloolefin copolymer, cycloolefin polymer, polymethylpentene, polystyrene, polymethyl (meth) acrylate, and polyethylene terephthalate.

[0016] The resin substrate 2 has a flow channel groove 21 on one surface (in this embodiment, the joint surface 2a with the coating material 3). The number of the flow channel grooves 21 may be one or a plurality. When a plurality of flow channel grooves 21 are provided, they may be provided in series or in parallel. Further, the flow channel groove 21 may have a branch. The flow channel groove 21 may have, for example, a width of 1 mm or less and a depth of 0.01 mm or more and 0.5 mm or less. In this way, experiments and the like on a minute scale can be performed.

[0017] The outer shape and size of the resin substrate 2 can be appropriately set in consideration of handling properties, analysis compatibility (compatibility with analysis methods and analysis apparatuses), and the like. For example, if it is a quadrangle (square or rectangle), it is preferably, for example, 10 mm or more and 200 mm or less on one side, and more preferably 10 mm or more and 150 mm or less. The outer shape of the resin substrate 2 may be other polygons, a circle, an ellipse, or the like.

[0018] The resin substrate 2 can be produced, for example, by injection molding.

[0019] The covering material 3 can be composed of, for example, a resin film, a resin plate, or the like. As the resin constituting the covering material 3, a resin excellent in heat resistance and transparency can be appropriately selected. The covering material 3 can be composed of a resin selected from the group consisting of, for example, polycarbonate, cycloolefin copolymer, cycloolefin polymer, polymethylpentene, polystyrene, polymethyl (meth) acrylate, and polyethylene terephthalate. Note that the resin constituting the covering material 3 may be the same resin as the resin constituting the resin substrate 2 or a different resin.

[0020] The thickness of the covering material 3 is not particularly limited, but can be, for example, 0.01 mm or more and 1 mm or less. By being 0.01 mm or more, wrinkles or the like are less likely to occur during bonding, and the flow path groove 21 can be sufficiently sealed. Also, by being 1 mm or less, good followability to the unevenness of the resin substrate 2 can be obtained.

[0021] The resin substrate 2 and the covering material 3 are laminated so that the bonding surface 2a of the resin substrate 2 (the surface on which the flow path groove 21 is formed) and the bonding surface 3a which is one surface of the covering material 3 are in contact with each other. The covering material 3 is bonded to the resin substrate 2 so as to cover the flow path groove 21. Thus, a microchannel composed of the flow path groove 21 is formed between the resin substrate 2 and the covering material 3. Such a microchannel chip 1 can be suitably used as, for example, a biochip such as a nucleic acid chip, a protein chip, an antibody chip, an aptamer chip, and a glycoprotein chip, or a microanalysis chip for various chemical analyses.

[0022] The bonding between the resin substrate 2 and the covering material 3 can be performed by thermocompression bonding of the laminate of the resin substrate 2 and the covering material 3 using a hot press machine. Alternatively, the bonding between the resin substrate 2 and the covering material 3 can also be performed by using an adhesive, an adhesive agent, an adhesive film, or the like.

[0023] In the microchannel chip 1 of the present embodiment, the arithmetic mean curvature Spc of the peak points of the bonding surface 2a of the resin substrate 2 with the covering material 3 is 150 mm -1 or more and 500 mm-1 It is characterized by the following. Here, the arithmetic mean curvature Spc of the peak points is a kind of parameter representing the surface roughness, and specifically, it represents the average of the principal curvatures of the peak points on the surface. Note that the arithmetic mean curvature Spc of the peak points can be measured in accordance with ISO25178.

[0024] When the arithmetic mean curvature Spc of the peak points of the joint surface 2a of the resin substrate 2 is less than 150 mm -1 when manufacturing the resin substrate 2 having the flow channel groove 21 by injection molding, the mold release property deteriorates instead because the surface smoothness is too good. On the other hand, it is often difficult to exceed 500 mm for the arithmetic mean curvature Spc of the peak points of the joint surface 2a of the resin substrate 2 under general injection molding conditions. Therefore, by setting the arithmetic mean curvature Spc of the peak points of the joint surface 2a of the resin substrate 2 with the coating material 3 to 150 mm -1 or more and 500 mm -1 or less, the mold release property during production by injection molding can be improved without requiring overly special molding conditions. -1 It is preferable that the arithmetic mean curvature Spc of the peak points of the joint surface 2a of the resin substrate 2 with the coating material 3 is 160 mm

[0025] or more, more preferably 170 mm -1 or more, and even more preferably 180 mm -1 or more. Also, it is preferable that the arithmetic mean curvature Spc of the peak points of the joint surface 2a of the resin substrate 2 with the coating material 3 is 480 mm -1 or less, more preferably 460 mm -1 or less, and even more preferably 440 mm -1 or less. -1 It is more preferable that it is 440 mm or less.

[0026] In addition, in the microchannel chip 1 of the present embodiment, the arithmetic mean height Sa of the bonding surface 2a between the resin substrate 2 and the coating material 3 is 0.1 μm or less. Here, the arithmetic mean height Sa is another type of parameter representing surface roughness, different from the arithmetic mean curvature Spc of the peak points, and represents the average of the absolute values of the height differences of each point with respect to the average surface of the surface. Note that the arithmetic mean height Sa can also be measured in accordance with ISO25178.

[0027] Normally, when trying to adjust the arithmetic mean height Sa for the purpose of improving the mold release property, if it was initially 0.1 μm or less, for example, with a mirror finish, it is common to increase it to about 0.2 μm to 0.5 μm. In contrast, in the microchannel chip 1 of the present embodiment, the arithmetic mean curvature Spc of the peak points on the bonding surface 2a between the resin substrate 2 and the coating material 3 is 150 mm -1 or more and 500 mm -1 or less, so that the arithmetic mean height Sa itself remains 0.1 μm or less, and the mold release property after molding can be improved.

[0028] The microchannel chip 1 of the present embodiment can be manufactured using an injection mold 5 for injection molding and a hot press machine. For example, the resin substrate 2 can be produced using the mold 5, and the resin substrate 2 and the coating material 3 separately produced can be thermocompression bonded using a hot press machine for manufacturing.

[0029] As shown in FIG. 2, the mold 5 includes a first mold 5A having a concave portion 51 and a second mold 5B having a convex rib portion 52. The concave portion 51 corresponds to the outer shape of the resin substrate 2. The convex rib portion 52 corresponds to the inner shape of the flow channel groove 21. When the first mold 5A and the second mold 5B are clamped, a cavity space C is formed as a space surrounded by the inner surface of the concave portion 51 (first inner surface 5c) and the inner surface (second inner surface 5d) around the portion where the convex rib portion 52 is formed on the second mold 5B (see FIG. 3). A gate 53 communicating with the cavity space C is also formed in the second mold 5B.

[0030] The hot press machine includes a first block and a second block that sandwiches and crimps a laminate of a resin substrate 2 and a coating material 3 between the first block. The first block and the second block each have a built-in heater.

[0031] The manufacturing method of the microchannel chip 1 of this embodiment includes a mold adjustment step, a molding step, and an assembly step. These are executed in the order of mold adjustment step → molding step → assembly step.

[0032] The mold adjustment step is a step of adjusting the surface state of a mold 5 that has been subjected to normal mirror finishing. In this embodiment, in the mold adjustment step, among the inner surfaces forming the cavity space C in the first mold 5A and the second mold 5B, the inner surface (the second inner surface 5d of the second mold 5B) around the portion where the ridge portion 52 corresponding to the flow path groove 21 is formed is roughened. The roughening treatment can be executed by, for example, blasting treatment.

[0033] The material of the abrasive grains used in the roughening treatment (blasting treatment) is not particularly limited, but for example, alumina, silicon carbide, zirconia, glass, nylon, stainless steel, etc. can be preferably used. The average particle size of the abrasive grains is not particularly limited, but can be, for example, 20 μm or less. Also, the discharge pressure of the abrasive grains during the roughening treatment (blasting treatment) is not particularly limited, but can be, for example, 0.01 MPa or more and 0.6 MPa or less.

[0034] By performing such a roughening treatment, the arithmetic mean curvature Spc of the peak points of the inner surface (second inner surface 5d) around the portion where the ridge portion 52 is formed in the second mold 5B can be adjusted to be 250 mm -1 or more and 800 mm -1 or less. At this time, while keeping the arithmetic mean height Sa of the portion at 0.1 μm or less, the arithmetic mean curvature Spc of the peak points can be made 250 mm -1 or more and 800 mm -1 or less. The arithmetic mean curvature Spc and the arithmetic mean height Sa of the peak points can be measured in accordance with ISO25178.

[0035] The arithmetic mean curvature Spc of the peak points of the inner surface (second inner surface 5d) around the part where the rib portion 52 is formed in the second type 5B is 260 mm -1 or more, preferably 270 mm -1 or more, more preferably 280 mm -1 or more, even more preferably. Also, the arithmetic mean curvature Spc of the peak points of the inner surface (second inner surface 5d) around the part where the rib portion 52 is formed in the second type 5B is 780 mm -1 or less, preferably 760 mm -1 or less, more preferably 740 mm -1 or less, even more preferably.

[0036] If the arithmetic mean curvature Spc of the peak points of the inner surface (second inner surface 5d) around the part where the rib portion 52 is formed in the second type 5B is less than 250 mm -1 when the mold is opened in the subsequent molding process, the surface smoothness is too good, which instead deteriorates the mold release property. On the other hand, it is often difficult to exceed 800 mm for the arithmetic mean curvature Spc of the peak points of the inner surface (second inner surface 5d) around the part where the rib portion 52 is formed in the second type 5B under the conditions of general roughening treatment (blasting treatment). Therefore, by setting the arithmetic mean curvature Spc of the peak points of the inner surface (second inner surface 5d) around the part where the rib portion 52 is formed in the second type 5B to be 250 mm -1 or more and 800 mm -1 or less, the mold release property after molding can be improved without requiring overly special roughening treatment (blasting treatment) conditions. -1

[0037] The molding process is a process of forming a resin substrate 2 having a flow channel groove 21 on one surface using a mold 5. In the molding process, as shown in FIG. 3, the first mold 5A and the second mold 5B are clamped, and molten resin is injected from the gate 53 into the cavity space C formed therebetween. After cooling and mold opening, as shown in FIG. 4, a resin substrate 2 is obtained in which a flow channel groove 21 having an outer shape corresponding to the concave portion 51 of the first mold 5A and an inner surface corresponding to the convex strip portion 52 of the second mold 5B is formed on one surface. At this time, as described above, since the second mold 5B is subjected to a predetermined roughening treatment (blasting treatment) in the preceding mold adjustment process, the resin substrate 2 can be easily released from the mold 5, and molding defects are less likely to occur.

[0038] The assembly process is a process of assembling the resin substrate 2 produced in the molding process and a coating material 3 produced separately. In the assembly process, first, as shown in FIG. 5, the coating material 3 is laminated on the resin substrate 2 so as to cover the flow channel groove 21. Then, the laminate is subjected to a hot press machine to thermally bond the resin substrate 2 and the coating material 3 to join them. In this way, the microchannel chip 1 shown in FIG. 1 can be satisfactorily manufactured.

[0039] Hereinafter, the microchannel chip 1 of the present embodiment will be described in more detail with reference to examples and comparative examples. However, the scope of the present invention is not limited by the following examples and comparative examples.

[0040] [Comparative Example 1] An injection molding mold made of chromium molybdenum stainless steel was prepared. Regarding the inner surface forming the cavity space of this mold, the arithmetic mean height Sa, the maximum height Sz, the aspect ratio Str of the surface texture, the arithmetic mean curvature Spc of the peak points, and the developed area ratio Sdr of the interface were measured. These were measured in accordance with ISO25178 using a laser microscope VK-X1100 manufactured by Keyence Corporation. The measurements were taken at 15 points on the mold, and the average value thereof was used as the measured value.

[0041] In addition, injection molding was performed using the mold to produce a resin substrate having a flow channel groove. When the mold was opened and the resin substrate was taken out, it was confirmed that there was curling (release failure) at the edge of the flow channel groove in the resin substrate. Regarding the surface on the side where the flow channel groove was formed in the obtained resin substrate, the arithmetic mean height Sa, the maximum height Sz, the aspect ratio Str of the surface texture, the arithmetic mean curvature Spc of the peak points, and the developed area ratio Sdr of the interface were measured. These measurement conditions are the same as those for the above-described mold.

[0042] [Example 1] For the mold of Comparative Example 1, as a surface treatment, blasting was performed using a GMT treatment device manufactured by Fuji Seisakusho to roughen the surface. Regarding the inner surface forming the cavity space of the mold after this surface treatment, various measurements were performed in the same manner as in Comparative Example 1. In addition, injection molding was performed using the mold to produce a resin substrate. When the mold was opened and the resin substrate was taken out, the releasability of the resin substrate was good. Similarly, various measurements were also performed on the surface on the side where the flow channel groove was formed in the obtained resin substrate.

[0043] [Example 2] A mold for injection molding made of chromium vanadium molybdenum stainless steel was prepared, and surface treatment was performed on this mold under the same conditions as in Example 1. Regarding the inner surface forming the cavity space of the mold after this surface treatment, various measurements were performed in the same manner as in Comparative Example 1. In addition, injection molding was performed using the mold to produce a resin substrate. When the mold was opened and the resin substrate was taken out, the releasability of the resin substrate was extremely good. Similarly, various measurements were also performed on the surface on the side where the flow channel groove was formed in the obtained resin substrate.

[0044] These results are shown in the following table.

[0045]

Table 1

[0046] From these, by adjusting so that the arithmetic mean curvature Spc of the peak points on the mold surface is 250 mm -1 or more and 800 mm -1 or less, it was confirmed that the mold release property of the resin substrate obtained by injection molding using the mold can be improved. Also, when looking at the resin substrate as the center, the arithmetic mean curvature Spc of the peak points on the surface of the obtained resin substrate is 150 mm -1 or more and 500 mm -1 or less, it was confirmed that the mold release property from the mold after injection molding can be improved. In these cases, it was confirmed that in both the mold surface and the resin substrate surface, the arithmetic mean height Sa is maintained at 0.1 μm or less without any change from normal.

[0047] As described above, the microchannel chip and its manufacturing method have been described in detail by showing specific embodiments, examples, and comparative examples. However, the present invention is not limited thereto. The embodiments disclosed in this specification are illustrative in all respects, and can be appropriately modified within the scope not departing from the gist of the present disclosure.

Explanation of Signs

[0048] 1 Microchannel chip 2 Resin substrate 2a Bonding surface 3 Coating material 3a Bonding surface 5 Mold 5A First mold 5B Second mold 5c First inner surface 5d Second inner surface 21 Flow channel groove 51 Recess 52 Ridge portion 53 Gate C Cavity space

Claims

1. A resin substrate having a flow path groove on one surface, and A coating material joined to the resin substrate so as to cover the flow path groove, and comprising The arithmetic mean height Sa measured in accordance with ISO 25178 of the bonding surface of the resin substrate with the coating material is 0.1 μm or less, and the arithmetic mean curvature Spc of the peak points is 150 mm －１ or more and 500 mm －１ or less, a microchannel chip.

2. A step of injecting molten resin into a cavity space in a mold having a first type and a second type to form a resin substrate having a flow path groove on one surface, and A step of joining a coating material to the resin substrate so as to cover the flow path groove, and including Prior to the step of forming the resin substrate, among the inner surfaces forming the cavity spaces in the first mold and the second mold, the inner surface around the portion where the ridge portion corresponding to the flow path groove is formed is measured in accordance with ISO 25178, and the arithmetic mean height Sa is 0.1 μm or less, and the arithmetic mean curvature Spc of the peak points is 250 mm －１ or more and 800 mm －１ or less, and further includes a step of roughening, a method for manufacturing a microchannel chip.

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