Film, method for producing the same, and laminate
The film, characterized by a low dielectric loss tangent and specific surface energy, addresses the issues of film breakage and surface roughness during peeling by using fluorine and silicon-containing compounds, ensuring effective performance in high-frequency communication devices.
JP7684112B2Active Publication Date: 2025-05-27FUJIFILM CORP
Patent Information
- Application Number
- JP2021109254
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-06-30
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2041-06-30
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Abstract
To provide a film that prevents the film itself from being broken when peeled off and prevents its surface from becoming rough and a method for producing the same, and a laminate including the film.SOLUTION: A film has a dielectric loss tangent of 0.01 or less, with its surface free energy on at least one surface being 15 mN / m-36 mN / m. Additionally, the film has a dielectric loss tangent of 0.01 or less, in which the surface coverage of at least one surface with at least one compound selected from the group consisting of a fluorine atom-containing compound and a silicon atom-containing compound is 30%-100%. There are also provided methods for producing the films. There are also provided laminates including the films.SELECTED DRAWING: None
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Citation Information
Patent Citations
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