Film, method for producing the same, and laminate

The film, characterized by a low dielectric loss tangent and specific surface energy, addresses the issues of film breakage and surface roughness during peeling by using fluorine and silicon-containing compounds, ensuring effective performance in high-frequency communication devices.

JP7684112B2Active Publication Date: 2025-05-27FUJIFILM CORP
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Patent Information

Application Number
JP2021109254
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-06-30
Publication Date
2025-05-27
Estimated Expiration
2041-06-30

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Patent Text Reader

Abstract

To provide a film that prevents the film itself from being broken when peeled off and prevents its surface from becoming rough and a method for producing the same, and a laminate including the film.SOLUTION: A film has a dielectric loss tangent of 0.01 or less, with its surface free energy on at least one surface being 15 mN / m-36 mN / m. Additionally, the film has a dielectric loss tangent of 0.01 or less, in which the surface coverage of at least one surface with at least one compound selected from the group consisting of a fluorine atom-containing compound and a silicon atom-containing compound is 30%-100%. There are also provided methods for producing the films. There are also provided laminates including the films.SELECTED DRAWING: None
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Citation Information

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