Enclosure of a wireless embedded device with a built-in power source

Abstract

An implantable device includes a housing, a circuit within the housing, and a power source attached to the housing and electrically connected to the circuit. The device may include a conductive connector configured to electrically connect the positive and negative terminals of the power source to the circuit. The device may include a power source terminal enclosure attached to the power source and configured to seal the positive and negative terminals of the power source. The power source terminal enclosure may include a hole through which the conductive connector passes. The device may include a housing cap enclosure attached to the power source terminal enclosure and to the open end of the housing. The housing cap enclosure may seal the circuit within the housing and include a passage through which the conductive connector passes.

Description

Technical Field

[0001] Cross - reference to Related Applications

[0001] This application claims the benefit of priority of U.S. Provisional Application No. 62 / 994,809, filed Mar. 25, 2020, which is hereby incorporated by reference in its entirety.

[0002]

[0002] Field of the Invention

[0003] The present invention generally relates to specimen monitoring and also to implantable devices including a power source.

Background Art

[0003]

[0004] Consideration of the Background

[0005] Implantable sensors without charge - storage devices may exclusively rely on an external device for the operating power (e.g., to perform measurements and operate their own circuitry to transmit data to an external device). The sensor and the external device may each include an inductive element (e.g., a coil). The sensor can receive power from the external device when the external device uses its inductive element to generate an electrodynamic field and the inductive element of the sensor and the external device are magnetically coupled within the electrodynamic field. However, without an internal power source, when the sensor is not located in the vicinity of the external device (i.e., when the inductive element of the sensor and the external device are not coupled within the electrodynamic field generated by the external device), the sensor is in a quiescent state.

[0004]

[0006] For example, a sensor without a charge storage device may be embedded in the arm of a human patient, and when the human patient wears an armband having an external device therein, the sensor may be disposed in the vicinity of the external device. The sensor can perform a specimen measurement and transmit data to the external device while the patient is wearing the armband, but the sensor cannot perform a specimen measurement while the patient is not wearing the armband (e.g., because the human patient is swimming or taking a shower), and as a result, there will be a gap in the specimen measurement information. Summary of the Invention Problems to be Solved by the Invention

[0005]

[0007] Accordingly, there is a need for an improved sensor and a method of using the same to improve the sensor's ability to perform specimen measurements. Means for Solving the Problems

[0006]

[0008] One aspect of the present invention can provide an implantable device including a housing, a circuit, a power source, a conductive connector, a power terminal enclosure, and a housing cap enclosure. The power source may be attached to the housing. The power source may include a positive terminal and a negative terminal electrically connected to the circuit. The conductive connector may be configured to electrically connect the positive and negative terminals of the power source to the circuit. The power terminal enclosure may be attached to the power source and configured to seal the positive and negative terminals of the power source. The housing cap enclosure may be attached to the power terminal enclosure and also to the open end of the housing, and the housing cap enclosure seals the circuit within the housing.

[0007]

[0009] In some embodiments, the power terminal enclosure may include a hole through which the conductive connector passes. In some embodiments, the housing cap enclosure may include a passage through which the conductive connector passes. In some embodiments, the housing cap enclosure may include a passage through which one or more supports attached to and extending from the power source pass.

[0008]

[0010] In some embodiments, the device may further include a spring configured to establish an electrical connection between a certain connector among the conductive connectors and the positive terminal of the power source. In some embodiments, the power terminal enclosure may seal the spring.

[0009]

[0011] In some embodiments, the device may further include one or more supports attached to and extending from the power source, and the one or more supports may be configured to support the attachment of the power source to the housing. In some embodiments, the one or more supports may have a diameter larger than the diameter of the conductive connector. In some embodiments, the support may be made of a non-conductive material. In some embodiments, the power terminal enclosure may include a hole through which the support passes. In some embodiments, the housing cap enclosure may include a passage through which the support passes.

[0010]

[0012] In some embodiments, the device may further include one or more substrates within the housing, and the circuit may include one or more circuit components mounted on or created within the one or more substrates. In some embodiments, the one or more circuit components may include one or more light sources and one or more light receivers.

[0011]

[0013] In some embodiments, the circuit may include an inductive element. In some embodiments, the inductive element may include a conductor and a magnetic core. In some embodiments, the device may further include one or more analyte indicators on or in a portion of the outer surface of the housing. In some embodiments, the power source may be a battery. In some embodiments, the device may be hermetically sealed. In some embodiments, the implantable device may further include a drug-eluting polymer matrix that coats at least a portion of the power terminal enclosure and / or the housing cap enclosure.

[0012]

[0014] Another aspect of the invention may provide a method of manufacturing an implantable device. The method may include placing a circuit within a housing. The method may include filling the housing with epoxy up to an initial epoxy fill line after placing the circuit within the housing. The method may include curing the epoxy after filling the housing with epoxy up to the initial epoxy fill line. The method may include connecting a conductive connector to a contact pad of the circuit. The method may include placing the conductive connector within a passage of a housing cap enclosure. The method may include filling the remaining space within the housing between the initial epoxy fill line and the end of the housing with epoxy after placing the conductive connector within the passage of the housing cap enclosure. The method may include curing the epoxy in the remaining space within the housing between the initial epoxy fill line and the end of the housing.

[0013]

[0015] In some embodiments, the method may further include placing one or more supports attached to and extending from the power source within a passage of the housing cap enclosure. In some embodiments, the method may further include connecting the conductive connector to the positive and negative terminals of the power source.

[0014]

[0016] In some embodiments, connecting the conductive connectors to the positive and negative terminals of the power supply may include pressing a spring at the end of one of the conductive connectors against the positive terminal of the power supply and compressing the spring. In some embodiments, after placing the conductive connectors within the passage of the housing cap enclosure, the surface of the housing cap enclosure abuts against a power terminal enclosure attached to the power supply, sealing the positive and negative terminals of the power supply.

[0015]

[0017] Yet another aspect of the present invention may provide an embedded device including a housing, a circuit at least partially within the housing, a power supply, first and second conductive connectors, and a coupler. The power supply may include a positive terminal and a negative terminal electrically connected to the circuit. The first conductive connector may be configured to electrically connect the positive terminal of the power supply to the circuit. The second conductive connector may be configured to electrically connect the negative terminal of the power supply to the circuit. The coupler may be between the housing and the power supply. The coupler may be attached to the power supply and may include one or more supports extending from the coupler into the housing.

[0016]

[0018] In some embodiments, the coupler may include the second conductive connector. In some embodiments, the one or more supports may be made of a non-conductive material. In some embodiments, the coupler may have a cylindrical portion and the one or more supports may extend from the cylindrical portion.

[0017]

[0019] In some embodiments, the device may include one or more substrates within the housing, and the circuit may include one or more circuit components mounted on or formed within the one or more substrates. In some embodiments, the one or more circuit components may include one or more light sources and one or more light receivers.

[0018]

[0020] In some embodiments, the circuit may include an inductive element. In some embodiments, the inductive element may include a conductor and a magnetic core. In some embodiments, the inductive element may extend into the coupler.

[0019]

[0021] In some embodiments, the circuit may include contact pads, and the device may further include bonding wires that electrically connect the first and second conductive connectors to the contact pads. In some embodiments, the device may include one or more analyte indicators on or in a portion of the outer surface of the housing. In some embodiments, the power source may be a battery. In some embodiments, the device may be hermetically sealed. In some embodiments, the device may include a spring configured to establish an electrical connection between the first conductive connector and the positive terminal of the power source. In some embodiments, the implantable device may further include a drug-eluting polymer matrix that coats at least a portion of the coupler.

[0020]

[0022] Yet another aspect of the present invention may provide a method of manufacturing an implantable device. The method may include placing a circuit within a housing. The method may include filling the housing with epoxy up to an initial epoxy fill line after placing the circuit within the housing. The method may include curing the epoxy after filling the housing with epoxy up to the initial epoxy fill line. The method may include inserting one or more supports of the coupler into the housing. The method may include connecting the first and second conductive connectors to the contact pads of the circuit with the one or more supports of the coupler inserted into the housing. The method may include attaching the coupler to a power source. The method may include filling at least the remaining space within the housing between the initial epoxy fill line and the end of the housing with epoxy. The method may include curing the epoxy in at least the remaining space within the housing between the initial epoxy fill line and the end of the housing.

[0021]

[0023] In some embodiments, attaching the coupler to the power source may include connecting a first conductive connector to the positive terminal of the power source. In some embodiments, connecting the first conductive connector to the positive terminal of the power source may include pressing a spring at the end of the first conductive connector against the positive terminal of the power source and compressing the spring.

[0022]

[0024] In some embodiments, attaching the coupler to the power source may include connecting a second conductive connector to the negative terminal of the power source. In some embodiments, after inserting one or more supports of the coupler into the housing, the surface of the coupler abuts against the surface of the housing.

[0023]

[0025] Further variations included in the system and method are described in the following detailed description of the present invention.

[0024]

[0026] The accompanying drawings, which are incorporated herein and form a part of this specification, illustrate various non-limiting embodiments of the present invention. In the drawings, like reference numerals indicate identical or functionally similar elements.

Brief Description of the Drawings

[0025]

Figure 1

[0027] It is a schematic diagram showing a system embodying an aspect of the present invention.

Figure 2A

[0028] It is a perspective view showing an embedded device embodying an aspect of the present invention.

Figure 2B

Figure 3A

[0029] It is a side view showing an embedded device embodying an aspect of the present invention.

Figure 3B

Figure 3E

Figure 3CD

[0030] FIG. 3C is a perspective view showing a housing of an implantable device and a coupler configured to attach a power supply, embodying an aspect of the present invention. FIG. 3D is a cross-sectional view showing a housing of an implantable device and a coupler configured to attach a power supply, embodying an aspect of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0026]

[0031] FIG. 1 is a schematic diagram of an exemplary system 50 embodying an aspect of the present invention. In some embodiments, system 50 may be a specimen monitoring system. In some embodiments, system 50 may be a continuous specimen monitoring system (e.g., a continuous glucose monitoring system). In some embodiments, system 50 may include one or more of an implantable device 100, an external device 101, and a display device 107. In some embodiments, implantable device 100 may be a specimen sensor. In some embodiments, implantable device 100 may be a small, fully subcutaneous sensor that measures the amount or concentration of a specimen (e.g., glucose) in a medium (e.g., interstitial fluid) of a living animal (e.g., a living human). However, this is not essential, and in some alternative embodiments, implantable device 100 may be a partially implanted (e.g., transcutaneous) device. Additionally, while embodiments of the present invention are described with respect to a specimen monitoring system in which implantable device 100 is a specimen sensor, this is not essential. In some alternative embodiments, implantable device 100 is not a sensor, and instead, is a different type of implantable device, such as, for example and without limitation, an insulin pump, a pacemaker, or an electrical / thermal therapy device.

[0027]

[0032] In some embodiments, the external device 101 may be an external wearable device (e.g., attached via an armband, wristband, waistband, or adhesive patch). In some embodiments, the external device 101 may communicate remotely with the implanted device 100 (e.g., via near field communication (NFC)). In some embodiments, the external device 101 may communicate with the implanted device 100 to initiate a measurement and receive a measurement value from the implanted device 100. In some embodiments, the external device 101 may be a transceiver. In some embodiments, the external device 101 may be a smartphone (e.g., an NFC-enabled smartphone). In some embodiments, the external device 101 may wirelessly communicate information (e.g., one or more analyte measurement values) to a handheld application running on a display device 107 (e.g., a smartphone) (e.g., but not limited to, via a Bluetooth (trademark) communication standard such as Bluetooth Low Energy).

[0028]

[0033] FIG. 2A is a perspective view of an implanted device 100 of a system 50 according to some embodiments. FIG. 2B is a perspective view of portion A of the implanted device 100 as shown in FIG. 2A. FIG. 3A is a side view of an implanted device 100 of a system 50 according to some alternative embodiments. FIG. 3B is a side view of portion B of the implanted device 100 as shown in FIG. 3A. In some embodiments, the implanted device 100 may be a wireless analyte sensor. In some embodiments, the implanted device 100 may be an analyte sensor. In some embodiments, the analyte sensor may detect the presence, amount, and / or concentration of an analyte (e.g., glucose, oxygen, cardiac markers, low density lipoprotein (LDL), high density lipoprotein (HDL), or triglycerides). In some embodiments, the implanted device 100 may be an optical sensor (e.g., a fluorometer). In some embodiments, the implanted device 100 may be a chemical or biochemical sensor.

[0029]

[0034] In some embodiments, as shown in FIGS. 2A, 2B, 3A, and 3B, the implantable device 100 may include a power source 202, inductive elements 204, one or more substrates 206, and / or a housing 208. In some embodiments, the housing 208 may be a body, shell, capsule, or container. In some embodiments, the housing 208 may be rigid and / or biocompatible. In some embodiments, the housing 208 may include a polymer (e.g., PMMA) sleeve or a silicone tube. However, this is not essential, and in other embodiments, different materials and / or shapes may be used for the housing 208.

[0030]

[0035] In some embodiments, the implantable device 100 may include one or more analyte indicators (e.g., analyte indicator 334 in FIG. 3E), such as a polymer graft or hydrogel, coated, diffused, adhered, embedded, or grown on or in at least a portion of the outer surface of the housing 208. In some embodiments, as shown in FIGS. 2A and 3A, the housing 208 may include one or more cutouts or depressions 209, and one or more analyte indicators may be (partially or entirely) disposed in the cutout or depression 209. In some embodiments, one or more analyte indicators may be porous and may allow an analyte (e.g., glucose) in a medium (e.g., interstitial fluid) to diffuse into the one or more analyte indicators.

[0031]

[0036] In some embodiments, one or more analyte indicators may exhibit one or more detectable properties (e.g., optical properties) that vary according to the amount or concentration of analyte in the vicinity of the one or more indicators. In some embodiments, one or more analyte indicators may emit a certain amount of emitted light that varies according to the amount or concentration of analyte in the vicinity of the one or more indicators. In some embodiments, one or more analyte indicators may include one or more analyte indicator molecules (e.g., fluorescent analyte indicator molecules) that may be distributed throughout the one or more analyte indicators. In some embodiments, one or more analyte indicators may be phenylboron-based analyte indicators. However, phenylboron-based analyte indicators are not essential, and in some alternative embodiments, the implantable device 100 may include different analyte indicators, such as, but not limited to, glucose oxidase-based indicators, glucose dehydrogenase-based indicators, or glucose-binding protein-based indicators.

[0032]

[0037] In some embodiments, as shown in FIGS. 2A and 3A, the implantable device 100 may include one or more light sources 210 that emit excitation light over an excitation wavelength range. In some embodiments, the excitation wavelength range may be a range of wavelengths that interact with an analyte indicator (e.g., one or more of the analyte indicators 334 in FIG. 3E). In some embodiments, the excitation light may be ultraviolet (UV) light.

[0033]

[0038] In some embodiments, as shown in FIGS. 2A and 3A, the implantable device 100 may include one or more light receivers 212 (e.g., photodiodes, phototransistors, photoreceptors, or other photosensitive elements). In some embodiments, one or more light receivers 212 may be configured to detect a detectable property of the analyte indicator and output an analyte signal indicative of the amount or concentration of the analyte in the medium within the body of a living animal. In some embodiments, one or more light receivers 212 may be configured to output an analyte signal indicative of the amount of radiant light (e.g., fluorescence light) received by the one or more light receivers 212.

[0034]

[0039] In some embodiments, as shown in FIGS. 2A, 2B, 3A, and 3B, the implantable device 100 may include one or more substrates 206 on one side of the inductive element 204. In some embodiments, although not shown in FIGS. 2A, 2B, 3A, and 3B, the implantable device 100 may additionally include one or more substrates 206 on the opposite side of the inductive element 204. In some embodiments, one or more substrates 206 may be a circuit board (e.g., a printed circuit board (PCB) or a flexible PCB) on which one or more of circuit components (e.g., analog and / or digital circuit components) may be mounted or otherwise attached. However, in some alternative embodiments, one or more substrates 206 may be a semiconductor substrate.

[0035]

[0040] In embodiments where the substrate 206 is a semiconductor substrate, one or more of the circuit components may be fabricated on the substrate 206. For example, the fabricated circuit components may include analog and / or digital circuits. Also, in some embodiments where the substrate 206 is a semiconductor substrate, in addition to the circuit components fabricated on the semiconductor substrate, circuit components may be mounted on the semiconductor substrate or attached in another way. In other words, in some semiconductor substrate embodiments, one or more of the circuit components, which may include discrete circuit elements, integrated circuits (e.g., application specific integrated circuits (ASICs)), and / or other electronic components (e.g., non-volatile memory), may be fabricated on the semiconductor substrate, and the remainder of the circuit components may be fixed to the semiconductor substrate, thereby providing communication paths between the various fixed components.

[0036]

[0041] In some embodiments, as shown in FIGS. 2A and 3A, one or more of the light sources 210 may be mounted on one or more of the substrates 206 or fabricated within one or more of the substrates. In some embodiments, one or more of the light receivers 212 may be mounted on one or more of the substrates 206 or fabricated within one or more of the substrates. In some embodiments, one or more of the light sources 210 may be mounted on one or more of the substrates 206, one or more of the light receivers 212 may be fabricated within one or more of the substrates 206, and all or some of the circuit components may be fabricated within one or more of the substrates 206. In some embodiments, as shown in FIGS. 2B, 3A, and 3B, the embedded device 100 may additionally or alternatively have one or more circuit components 214 (e.g., capacitors) mounted on the inductive element 204.

[0037]

[0042] In some embodiments, the implantable device 100 may communicate with an external device 101. In some embodiments, the external device 101 may communicate with the implantable device 100 to provide commands (e.g., measurement commands) to the implantable device 100 and / or receive measurement data (e.g., photodetector and / or temperature sensor readings) from the implantable device 100, and may be an electronic device. The measurement data may include one or more readings from one or more photodetectors 212 of the implantable device 100 and / or one or more readings from one or more temperature sensors of the implantable device 100. In some embodiments, the external device 101 may calculate the analyte concentration from the measurement data received from the implantable device 100. However, it is not essential for the external device 101 to perform the analyte concentration calculation itself. In some alternative embodiments, the external device 101 may instead transmit / relay the measurement data received from the implantable device 100 to another device that calculates the analyte concentration. In other alternative embodiments, the implantable device 100 may perform the analyte concentration calculation.

[0038]

[0043] In some embodiments, the inductive element 204 of the implantable device 100 may act as an antenna. In some embodiments, the external device 101 may communicate with the implantable device 100 via an inductive magnetic link to implement passive telemetry for data transfer. In some embodiments, the inductive element 204 may be, for example, a ferrite-based microantenna. In some embodiments, as shown in FIG. 2A, the inductive element 204 may include a conductor 216 in the form of a coil and a magnetic core 218. In some embodiments, the core 218 may be, for example, but not limited to, a ferrite core. In some embodiments, the inductive element 204 may be connected to a circuit (e.g., an application-specific integrated circuit (ASIC)) of the implantable device 100. In some embodiments, the implantable device 100 may provide a data link and transmit data from the implantable device 100 to the external device 101, depending on the external device 101.

[0039]

[0044] In some embodiments, the circuitry of the implantable device 100 may include inductive elements 204, circuit components (e.g., one or more light sources 210 and / or one or more light receivers 212) mounted on or formed within one or more substrates 206, and / or one or more circuit components 214 mounted on the inductive elements 204. In some embodiments, the circuitry of the implantable device 100 may be powered by a power source 202.

[0040]

[0045] In some embodiments, the power source 202 may be a charge storage device. In some embodiments, the power source 202 may be a battery (e.g., a rechargeable battery such as a lithium ion battery), a capacitor, or a supercapacitor. In some embodiments, at least the exterior of the power source 202 may be made of a biocompatible material such as, for example and without limitation, stainless steel or a titanium alloy. In some embodiments, the power source 202 may include a positive terminal (cathode) 220 and a negative terminal (anode) 222.

[0041]

[0046] In some embodiments, as shown in FIGS. 2A, 2B, 3A, and 3B, one or more couplers may attach the power source 202 to the housing 208. In some embodiments, as shown in FIGS. 2A and 2B, the one or more couplers that attach the power source 202 to the housing 208 may include a power terminal enclosure 224 and a housing cap enclosure 226. In some embodiments, conductive connectors 228 and 230 may electrically connect the positive terminal 220 and the negative terminal 222 of the power source 202, respectively, to the circuitry of the implantable device 100. In some embodiments, the attachment of the power source 202 to the housing 208 may be supported by one or more supports 232. In some embodiments, as shown in FIG. 2A, the circuitry of the implantable device 100 may extend away from the power source 202 along the longitudinal axis of the power source.

[0042]

[0047] In some embodiments, the conductive connectors 228 and 230 may be rods or beams that include or are made from a conductive material. In some embodiments, the bonding wire 234 may electrically connect the conductive connectors 228 and 230 to the contact pads 236 on the inductive element 204. In some embodiments, a spring 238 (e.g., a V-shaped spring) may be attached (e.g., welded) to one end of the conductive connector 228. In some embodiments, the spring 238 may be made of a conductive material and may establish an electrical connection between the connector 228 and the positive terminal 220 of the power supply 202. In some embodiments, when the housing 208 and the power supply 202 are attached to each other, the spring 238 may be pressed against and compressed by the positive terminal 220 of the power supply 202.

[0043]

[0048] In some embodiments, one or more supports 232 may be reinforcing rods, bars, or beams. In some embodiments, one or more supports 232 may be attached to and extend from the power supply 202. In some embodiments, one or more supports 232 may have a diameter larger than that of the conductive connectors 228 and 230. In some embodiments, one or more supports 232 may be made from a non-conductive material.

[0044]

[0049] In some embodiments, as shown in FIG. 2B, the power terminal enclosure 224 may be cup-shaped (e.g., a hollow cylinder having a flat bottom 224b and an open top). However, other shapes (e.g., a hollow right prism having a flat bottom and an open top) may be used in alternative embodiments. In some embodiments, the power terminal enclosure 224 may enclose the positive terminal 220 and the negative terminal 222 of the power supply 202. In some embodiments, the power terminal enclosure 224 may enclose the spring 238. In some embodiments, the bottom 224b of the power terminal enclosure 224 may have holes 224c through which the conductive connectors 228 and 230 and one or more supports 232 pass. In some embodiments, the power terminal enclosure 224 may be made of a biocompatible material. In some embodiments, the power terminal enclosure 224 may be made of a biocompatible metal, such as, for example and without limitation, stainless steel or titanium. In some embodiments, the power terminal enclosure 224 may be attached (e.g., welded) to the power supply 202. In some embodiments, the power terminal enclosure 224 may be attached to the power supply 202 by laser welding.

[0045]

[0050] In some embodiments, the housing cap enclosure 226 may have a solid cylindrical shape. However, other shapes (e.g., a solid right prism shape) may be used in alternative embodiments. In some embodiments, the housing cap enclosure 226 may be made of a biocompatible material such as, but not limited to, glass or ceramic. In some embodiments, the housing cap enclosure 226 may include a passage or feedthrough 240 through which the conductive connectors 228 and 230 and one or more supports 232 pass. In some embodiments, the housing cap enclosure 226 may include a first flat surface that abuts and is attached to the bottom 224b of the power terminal enclosure 224. In some embodiments, the housing cap enclosure 226 may be attached to the bottom 224b of the power terminal enclosure 224 by soldering. In some embodiments, the housing cap enclosure 226 may include a first flat surface that abuts and is attached to the open end 208a of the housing 208. In some embodiments, the housing cap enclosure 226 may enclose the circuit of the implantable device 100 within the housing 208.

[0046]

[0051] In some embodiments, after the circuit of the implantable device 100 is disposed within the housing 208, the housing 208 may be filled with epoxy up to an initial epoxy fill line 242. In some embodiments, the epoxy may create a permeable optical cavity within the housing 208. In some embodiments, the permeable optical cavity may be formed from a suitable optically transparent polymer material such as, for example, an acrylic-based polymer (e.g., polymethyl methacrylate (PMMA)). However, this is not essential and in other embodiments, different materials may be used for the permeable optical cavity.

[0047]

[0052] In some embodiments, after the housing 208 is filled with epoxy up to the initial epoxy fill line 242, the epoxy may be cured. In some embodiments, the conductive connectors 228 and 230 may be connected to the contact pads 236 of the circuit of the embedded device 100 (e.g., by soldering the bonding wires 234 to the contact pads 236). In some embodiments, after the conductive connectors 228 and 230 and one or more supports 232 are disposed in place within the passageways or feedthroughs 240 of the housing cap enclosure 226, the remaining space within the housing 208 between the initial epoxy fill line 242 and the open end 208a of the housing 208 is filled with epoxy, and then the epoxy is cured.

[0048]

[0053] In some embodiments, the embedded device 100 including the power source 202, the power terminal enclosure 224, the housing cap enclosure 226, and the housing 208 may be hermetically sealed.

[0049]

[0054] In some alternative embodiments, as shown in FIGS. 3A and 3B, the coupler 324 may attach the housing 208 and the power supply 202. In some embodiments, the coupler 324 may be between the housing 208 and the power supply 202. In some embodiments, the embedded device 100 including the power supply 202, the coupler 324, and the housing 208 may be hermetically sealed. In some embodiments, as shown in FIG. 3B, the embedded device 100 may include first and second conductive connectors 228 and 230. In some embodiments, the first conductive connector 228 may be configured to electrically connect the positive terminal 220 of the power supply 202 to the circuit. In some embodiments, the second conductive connector 230 may be configured to electrically connect the negative terminal 222 of the power supply 202 to the circuit. In some embodiments, as shown in FIG. 3B, the coupler 324 may include a flat surface 326 that abuts the power supply 202. In some embodiments, the coupler 324 may be attached to the power supply 202 (e.g., by laser welding). In some embodiments, as shown in FIG. 3A, the circuit of the embedded device 100 may extend away from the power supply 202 along the longitudinal axis of the power supply 202.

[0050]

[0055] In some embodiments, the first conductive connector 228 may be a rod or beam that comprises or is made from a conductive material. In some embodiments, the second conductive connector 230 may include a conductive material (e.g., gold plating). In some embodiments, the bonding wire 234 may electrically connect the first and second conductive connectors 228 and 230 to a circuit contact pad 236 (e.g., the contact pad 236 on the inductive element 204). In some embodiments, as shown in FIG. 3B, one or both of the first and second conductive connectors 228 and 230 may not extend from the coupler 324 and instead may be housed with the coupler 324. However, this is not essential, and in some alternative embodiments, one or both of the first and second conductive connectors 228 and 230 may extend from the coupler 324 into the housing 208. In some embodiments, as shown in FIG. 3B, the inductive element 204 may extend into the coupler 324.

[0051]

[0056] In some embodiments, a spring (e.g., a V-shaped spring such as the spring 238 shown in FIG. 2B) may be attached (e.g., welded) to one end of the conductive connector 228. In some embodiments, the spring 238 may be made of a conductive material and may establish an electrical connection between the connector 228 and the positive terminal 220 of the power supply 202. In some embodiments, when the housing 208 and the power supply 202 are attached to each other, the spring 238 may be pressed against and compressed by the positive terminal 220 of the power supply 202.

[0052]

[0057] Figures 3C and 3D are perspective and cross-sectional views, respectively, of coupler 324 according to some embodiments. In some embodiments, as shown in FIGS. 3B-3D, coupler 324 may include one or more supports 232. In some embodiments, the one or more supports 232 may be reinforcing rods, bars, or beams. In some embodiments, the one or more supports 232 may be attached to and / or integral with coupler 324. In some embodiments, the one or more supports 232 may be made of a non-conductive material. The coupler 324 of the illustrated embodiment includes three supports 232, but this is not essential, and in some alternative embodiments, coupler 324 may include more or fewer supports 232 (e.g., 1, 2, 4, 5, 6, or 10 supports 232). In some embodiments, as shown in FIGS. 3A and 3B, the one or more supports 232 may extend from coupler 324 into housing 208.

[0053]

[0058] In some embodiments, as shown in FIGS. 3B-3D, coupler 324 may include a second conductive connector 230. In some embodiments, as shown in FIG. 3C, the coupler has a cylindrical portion, and one or more supports 232 may extend from the cylindrical portion. In some embodiments, as shown in FIG. 3B, coupler 324 may include a flat surface 328 that abuts housing 328. In some embodiments, coupler 324 and housing 208 may be held together (e.g., by cured epoxy within housing 208 and / or coupler 324).

[0054]

[0059] In some embodiments, the process of manufacturing the embedded device 100 may include placing a circuit (e.g., an inductive element 204, circuit elements mounted on the inductive element 204, and / or a circuit including circuit elements mounted on or formed in one or more substrates 206) at least partially within the housing 208. The process may include filling the housing 208 with epoxy up to an initial epoxy fill line after placing the circuit at least partially within the housing 208. In some embodiments, the initial epoxy fill line may be such that the contact pads 236 are not exposed and are not covered by the epoxy. In some embodiments, the initial epoxy fill line may additionally or alternatively be such that there is still space within the housing 208 for inserting one or more supports 232 into the housing 208 after the epoxy has cured.

[0055]

[0060] In some embodiments, the process may include curing the epoxy after filling the housing with epoxy up to the initial epoxy fill line. In some embodiments, the cured epoxy may create a transmissive optical cavity within the housing 208. In some embodiments, the transmissive optical cavity may be formed from a suitable optically transmissive polymer material, such as an acrylic polymer (e.g., polymethyl methacrylate (PMMA)). However, this is not essential, and in other embodiments, different materials may be used for the transmissive optical cavity.

[0056]

[0061] In some embodiments, the process may include inserting one or more supports 232 of the coupler 324 into the housing 208 (e.g., into the remaining space within the housing 208 not filled with cured epoxy). In some embodiments, after inserting one or more supports 232 of the coupler 324 into the housing 208, the surface of the coupler 328 may abut the surface of the housing 208.

[0057]

[0062] In some embodiments, the process may include connecting the first and second conductive connectors 228 and 230 to the contact pads 236 of the circuit (e.g., the contact pads 236 on the inductive element 204) with one or more supports 232 of the coupler 324 inserted into the housing 208. In some embodiments, the first and second conductive connectors 228 and 230 may be connected to the contact pads 236 of the circuit by soldering the bonding wires 234 to the contact pads 236.

[0058]

[0063] In some embodiments, the process may include attaching the coupler 324 to the power source 202 (e.g., by laser welding the flat surface 326 of the coupler 324). In some embodiments, attaching the coupler 324 to the power source 202 may include connecting the first conductive connector 228 to the positive terminal 220 of the power source 202. In some embodiments, connecting the first conductive connector 228 to the positive terminal 220 of the power source 202 may include pressing a spring (e.g., spring 238) at the end of the first conductive connector 238 against the positive terminal 220 of the power source 202 and compressing the spring 238. In some embodiments, attaching the coupler 324 to the power source 202 may include connecting the second conductive connector 230 to the negative terminal 222 of the power source 202.

[0059]

[0064] In some embodiments, the process may include filling at least the remaining space within the housing 208 between the initial epoxy filling line and the end of the housing 208 with epoxy. In some embodiments, the epoxy may additionally be filled in all or a portion of the coupler 324. In some embodiments, the remaining space within the housing 208, all or a portion thereof, and / or all or a portion of the coupler 324 may be filled with epoxy using small holes in the coupler 324.

[0060]

[0065] In some embodiments, the process may include curing epoxy in at least the remaining space within housing 208 between the initial epoxy filling line and the end of housing 208. In some embodiments, since one or more supports 232 of coupler 324 are inserted into housing 208, the cured epoxy within the remaining space and / or within coupler 324 may hold coupler 324 and housing 208 together.

[0061]

[0066] In some embodiments, implant device 100 may include one or more drug-eluting polymer matrices. In some embodiments, implant device 100 may include one or more drug-eluting polymer matrices (e.g., drug-eluting polymer matrix 330 shown in FIG. 3E) on all or a portion of the outer surface of housing 208. In some embodiments, one or more drug-eluting polymer matrices on housing 208 may be disposed in one or more depressions of housing 208. In some embodiments, in addition or alternatively, implant device 100 may include one or more drug-eluting polymer matrices (e.g., drug-eluting polymer matrix 332 shown in FIG. 3E) on all or a portion of the outer surface of one or more couplers that attach power source 202 and housing 208. In some embodiments, one or more drug-eluting polymer matrices may be disposed on all or a portion of one or both of power terminal enclosure 224 and housing cap enclosure 226. In some embodiments, as shown in FIG. 3E, one or more drug-eluting polymer matrices 332 may be disposed on all or a portion of coupler 324.

[0062]

[0067] In some embodiments, one or more drug eluting polymer matrices may be applied to the sensor housing 208 and / or one or more couplers (e.g., coupler 324 or power terminal enclosure 224 and housing cap enclosure 226) via an immersion or spray coating. In some alternative embodiments, one or more drug eluting polymer matrices may have a preformed shape, such as a ring or a sleeve. In some alternative embodiments, one or more drug eluting polymer matrices may have different shapes. In some embodiments, as shown in FIG. 3E, one or more drug eluting polymer matrices 330 and 332 may be wrapped around a portion of the sensor housing 208 and / or a portion of the coupler 324. In some alternative embodiments, one or more drug eluting polymer matrices 330 and 332 may be wider or narrower than the drug eluting polymer matrices 330 and 332 shown in FIG. 3E.

[0063]

[0068] One or more therapeutic agents may be dispersed within one or more drug-eluting polymer matrices (e.g., one or more inert polymer matrices). In some embodiments, one or more therapeutic agents may reduce or prevent neutrophil migration into the wound space and thus reduce or prevent the production of hydrogen peroxide and fibrotic encapsulation. Thus, in some embodiments, one or more therapeutic agents may reduce the degradation of one or more analyte indicators (e.g., analyte indicator 334). In some embodiments, one or more therapeutic agents that may be dispersed within the drug-eluting polymer matrix may include one or more anti-inflammatory agents such as, for example, non-steroidal anti-inflammatory drugs (e.g., acetylsalicylic acid (aspirin) and / or isobutylphenylpropanoic acid (ibuprofen)). In some non-limiting embodiments, one or more therapeutic agents dispersed within the drug-eluting polymer matrix may include one or more glucocorticoids. In some non-limiting embodiments, one or more therapeutic agents may include one or more of dexamethasone, triamcinolone, betamethasone, methylprednisolone, beclomethasone, fludrocortisone, their derivatives, and their analogs. In some embodiments, one or more therapeutic agents may reduce the production of hydrogen peroxide by neutrophils and macrophages.

[0064]

[0069] Embodiments of the present invention have been described fully above with reference to the drawings. Although the present invention has been described based on these preferred embodiments, it will be apparent to those skilled in the art that specific changes, modifications, and alternative configurations to the described embodiments may be made within the spirit and scope of the present invention. For example, in some embodiments, the implantable device 100 may include a cross-linked material having insulation. [Item 1] A housing, a circuit at least partially within the housing, a power supply including a positive terminal and a negative terminal electrically connected to the circuit, a first conductive connector configured to electrically connect the positive terminal of the power supply to the circuit, a second conductive connector configured to electrically connect the negative terminal of the power supply to the circuit, a coupler between the housing and the power supply, attached to the power supply and including one or more supports extending from the coupler into the housing An embedded device comprising the above components. [Item 2] The device according to Item 1, wherein the coupler includes the second conductive connector. [Item 3] The device according to Item 1 or 2, wherein the one or more supports are made of a non-conductive material. [Item 4] The device according to any one of Items 1 to 3, wherein the coupler has a cylindrical portion and the one or more supports extend from the cylindrical portion. [Item 5] The device according to any one of Items 1 to 4, further comprising one or more substrates within the housing, wherein the circuit includes one or more circuit components mounted on or formed within the one or more substrates. [Item 6] The device according to Item 5, wherein the one or more circuit components include one or more light sources and one or more light receivers. [Item 7] The device according to any one of Items 1 to 6, wherein the circuit includes an inductive element. [Item 8] The device according to Item 7, wherein the inductive element includes a conductor and a magnetic core. [Item 9] The device according to Item 7 or 8, wherein the inductive element extends into the coupler. [Item 10] The device according to any one of Items 1 to 9, wherein the circuit includes contact pads, and the device further comprises bonding wires that electrically connect the first and second conductive connectors to the contact pads. [Item 11] The device according to any one of Items 1 to 10, further comprising one or more specimen indicators on or within a portion of the outer surface of the housing. [Item 12] The device according to any one of Items 1 to 11, wherein the power supply is a battery. [Item 13] The device according to any one of items 1 to 12, wherein the device is hermetically sealed. [Item 14] The device according to any one of items 1 to 13, further comprising a spring configured to establish an electrical connection between the first conductive connector and the positive terminal of the power supply. [Item 15] The device according to any one of items 1 to 14, further comprising a drug-eluting polymer matrix covering at least a part of the coupler. [Item 16] A method for manufacturing an implantable device, placing a circuit at least partially within a housing, after placing the circuit at least partially within the housing, filling the housing with epoxy up to an initial epoxy filling line, after filling the housing with epoxy up to the initial epoxy filling line, curing the epoxy, inserting one or more supports of a coupler into the housing, connecting first and second conductive connectors to contact pads of the circuit with the one or more supports of the coupler inserted into the housing, attaching the coupler to a power supply, filling at least the remaining space within the housing between the initial epoxy filling line and an end of the housing with epoxy, curing at least the epoxy in the remaining space within the housing between the initial epoxy filling line and an end of the housing comprising the method. [Item 17] The method according to item 16, wherein the step of attaching the coupler to the power supply includes connecting the first conductive connector to the positive terminal of the power supply. [Item 18] The method according to item 17, wherein the step of connecting the first conductive connector to the positive terminal of the power supply includes pressing a spring at an end of the first conductive connector against the positive terminal of the power supply and compressing the spring. [Item 19] The method according to any one of items 16 to 18, wherein the step of attaching the coupler to the power supply includes connecting the second conductive connector to the negative terminal of the power supply. [Item 20] The method according to any one of items 16 to 19, wherein after inserting the one or more supports of the coupler into the housing, a surface of the coupler abuts a surface of the housing. [Item 21] A housing, The circuit within the housing, a power supply attached to the housing, the power supply including a positive terminal and a negative terminal electrically connected to the circuit, a conductive connector configured to electrically connect the positive terminal and the negative terminal of the power supply to the circuit, a power terminal enclosure attached to the power supply and configured to seal the positive terminal and the negative terminal of the power supply, a housing cap enclosure attached to the power terminal enclosure and also to the open end of the housing, the housing cap enclosure sealing the circuit within the housing comprising an embedded device. [Item 22] The device according to item 21, wherein the power terminal enclosure includes a hole through which the conductive connector passes. [Item 23] The device according to item 21 or 22, wherein the housing cap enclosure includes a passage through which the conductive connector passes. [Item 24] The device according to any one of items 21 to 23, wherein the housing cap enclosure includes a passage through which one or more supports attached to the power supply and extending from the power supply pass. [Item 25] The device according to any one of items 21 to 24, further comprising one or more supports attached to the power supply and extending from the power supply, the one or more supports being configured to support the attachment of the power supply to the housing. [Item 26] The device according to item 25, wherein the one or more supports have a diameter larger than the diameter of the conductive connector. [Item 27] The device according to item 25 or 26, wherein the one or more supports are made of a non-conductive material. [Item 28] The device according to any one of items 25 to 27, wherein the power terminal enclosure includes a hole through which the support passes. [Item 29] The device according to any one of items 25 to 28, wherein the housing cap enclosure includes a passage through which the support passes. [Item 30] The device according to any one of items 25 to 29, further comprising a drug-eluting polymer matrix covering at least a portion of the power terminal enclosure and / or the housing cap enclosure. [Item 31] A method of manufacturing an embedded device, comprising: placing a circuit within a housing, ​ After disposing the circuit within the housing, filling the housing with epoxy up to an initial epoxy fill line; After filling the housing with epoxy up to the initial epoxy fill line, curing the epoxy; Connecting a conductive connector to a contact pad of the circuit; Placing the conductive connector within a passage of a housing cap enclosure; After placing the conductive connector within the passage of the housing cap enclosure, filling the remaining space within the housing between the initial epoxy fill line and an end of the housing with epoxy; Curing the epoxy in the remaining space within the housing between the initial epoxy fill line and an end of the housing; A method comprising the above steps. [Item 32] The method according to item 31, further comprising placing one or more supports attached to a power source and extending from the power source within the passage of the housing cap enclosure. [Item 33] The method according to item 31 or 32, further comprising connecting the conductive connector to a positive terminal and a negative terminal of a power source. [Item 34] The method according to item 33, wherein the step of connecting the conductive connector to the positive terminal and the negative terminal of the power source includes pressing a spring at an end of a certain connector among the conductive connectors against the positive terminal of the power source and compressing the spring. [Item 35] The method according to any one of items 31 to 34, wherein after placing the conductive connector within the passage of the housing cap enclosure, a surface of the housing cap enclosure abuts against a power source terminal enclosure attached to a power source, sealing the positive terminal and the negative terminal of the power source. [Item 36] A coupler for a housing of an embedded device and a power source attachment, comprising: A cylindrical portion including a first flat surface configured to abut against the power source and a second flat surface configured to abut against the housing; One or more supports extending from the cylindrical portion; A conductive connector configured to electrically connect a terminal of the power source to a circuit at least partially received within the housing. The coupler comprising the above components.

Claims

1. A housing, a circuit at least partially within the housing, a power supply including a positive terminal and a negative terminal electrically connected to the circuit, a first conductive connector configured to electrically connect the positive terminal of the power supply to the circuit, a second conductive connector configured to electrically connect the negative terminal of the power supply to the circuit, a coupler between the housing and the power supply, attached to the power supply, a hardened first material filling the housing up to an initial filling line, a hardened second material filling the remaining space within the housing between the initial filling line and an end of the housing, the hardened second material holding both the coupler and the housing and an embedded device comprising the same.

2. The device according to claim 1, wherein the coupler includes the second conductive connector.

3. The device according to claim 1, wherein a part of the coupler extends into the housing.

4. The device according to claim 3, wherein the part of the coupler extending into the housing includes one or more supports.

5. The device according to claim 4, wherein the one or more supports are made of a non-conductive material.

6. The device according to claim 4, wherein the coupler has a cylindrical portion and the one or more supports extend from the cylindrical portion.

7. The device according to any one of claims 1 to 6, further comprising one or more substrates within the housing, wherein the circuit includes one or more circuit components mounted on or formed within the one or more substrates.

8. The device according to claim 7, wherein the one or more circuit components include one or more light sources and one or more light receivers.

9. The device according to any one of claims 1 to 8, wherein the circuit includes an inductive element.

10. The device according to claim 9, wherein the inductive element includes a conductor and a magnetic core.

11. The device according to claim 9 or 10, wherein the inductive element extends into the coupler.

12. The device according to any one of claims 1 to 11, wherein the circuit includes contact pads, and the device further comprises bonding wires that electrically connect the first and second conductive connectors to the contact pads.

13. The device according to any one of claims 1 to 12, further comprising one or more specimen indicators on or in a portion of the outer surface of the housing.

14. The device according to any one of claims 1 to 13, wherein the power source is a battery.

15. The device according to any one of claims 1 to 14, wherein the device is hermetically sealed.

16. The device according to any one of claims 1 to 15, further comprising a spring configured to establish an electrical connection between the first conductive connector and the positive terminal of the power source.

17. The device according to any one of claims 1 to 16, further comprising a drug-eluting polymer matrix that covers at least a portion of the coupler.

18. The device according to claim 3, wherein a portion of the coupler extending into the housing includes two or more supports.

19. The device according to claim 1, wherein the cured second material fills all of the coupler.

20. The device according to claim 1, wherein the cured second material fills a portion of the coupler.

21. The device according to claim 1, wherein the cured first material forms a permeable optical cavity within the housing.

22. The device according to claim 1, wherein the first material and the second material are epoxy.

Images