Display device and electronic equipment

Abstract

The present invention provides a display device and an electronic apparatus, the display device being capable of suppressing light mixing and color mixing and having excellent light extraction efficiency.　This display device comprises: a plurality of light-emitting elements each having an organic layer; a plurality of color filters disposed at positions corresponding to the respective light-emitting elements; and a protective layer covering side surface portions of the plurality of color filters. In the protective layer, a gap portion is formed at a position between the color filters adjacent to each other.

Description

Technical Field

[0001] The present disclosure relates to a display device and an electronic device. In particular, the present disclosure relates to a display device including a light-emitting element having an organic layer and a color filter, and an electronic device including the display device.

Background Art

[0002] In a display device including a light-emitting element having an organic layer and a color filter, it is important to suppress the occurrence of light mixing and color mixing caused by light generated from the light-emitting element corresponding to a predetermined pixel entering the color filter corresponding to the pixel adjacent to that pixel.

[0003] For example, Patent Document 1 discloses a technique of overlapping side surfaces of adjacent color filters. Further, in Patent Document 2, a black matrix is disposed between adjacent color filters.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] Of the light generated from the light-emitting element corresponding to a predetermined pixel, the light directed toward the color filter corresponding to the adjacent pixel is absorbed at the interface of the adjacent color filters in the technique disclosed in Patent Document 1 and by the black matrix in the technique disclosed in Patent Document 2, respectively. Therefore, there is room for improvement in terms of improving the light extraction efficiency in the techniques of Patent Documents 1 and 2.

[0006] The present disclosure has been made in view of the above points, and one of the objectives is to provide a display device and an electronic device that can suppress the mixing and color mixing of light and have excellent light extraction efficiency.

Means for Solving the Problems

[0007] The present disclosure is, for example, (1) a plurality of light-emitting elements having an organic layer, a plurality of color filters disposed at positions corresponding to the respective light-emitting elements, and a protective layer covering side surfaces of the plurality of color filters and includes wherein a void portion is formed in the protective layer at a position between adjacent color filters and is a display device.

[0008] Further, the present disclosure may be, for example, an electronic device including the display device described in (1) above.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] Hereinafter, an embodiment and the like according to the present disclosure will be described with reference to the drawings. The description will be made in the following order. In this specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0011] Note that the description will be made in the following order. 1. First Embodiment 2. Second Embodiment 3. Third Embodiment 4. Simulation Example 5. Application Example

[0012] The following description is a preferred specific example of the present disclosure, and the content of the present disclosure is not limited to these embodiments and the like. Also, in the following description, for the sake of convenience of explanation, directions such as front and back, left and right, up and down, etc. are shown, but the content of the present disclosure is not limited to these directions. In the examples of FIGS. 1 and 8, the Z-axis direction is the up-down direction (the upper side is the +Z direction and the lower side is the -Z direction), the X-axis direction is the front-back direction (the front side is the +X direction and the back side is the -X direction), and the Y-axis direction is the left-right direction (the right side is the +Y direction and the left side is the -Y direction), and the description will be made based on this. The same applies to FIGS. 2 to 7 and FIGS. 9 to 14. The relative size ratios of the sizes and thicknesses of the respective layers shown in each of FIGS. 1 and the like are for convenience of description and do not limit the actual size ratios. The same applies to the definitions and size ratios regarding these directions for each of FIGS. 2 to 14.

[0013] [1 First Embodiment] [1-1 Configuration of Display Device] FIG. 1 is a cross-sectional view showing a configuration example of an organic EL (Electroluminescence) display device 10 (hereinafter simply referred to as "display device 10") according to an embodiment of the present disclosure. The display device 10 includes a substrate 11, a plurality of light-emitting elements 13, an insulating layer 14, an element protection layer 15, a plurality of color filters 17, and a filter protection layer 18.

[0014] The display device 10 is a top emission type display device. The substrate 11 is located on the back side of the display device 10, and the direction from the substrate 11 toward the filter protection layer 18 (+Z direction) is the front side direction of the display device 10. The filter protection layer 18 side is the top side, and the substrate 11 side is the bottom side. In the following description, in each layer constituting the display device 10, the surface on the display surface side (+Z direction side) of the display device 10 is referred to as the first surface (upper surface), and the surface on the back side (-Z direction side) of the display device 10 is referred to as the second surface (lower surface).

[0015] The display device 10 may be a microdisplay. The display device 10 may be used in various electronic devices. Examples of the electronic devices in which the display device 10 is used include, for example, display devices for VR (Virtual Reality), MR (Mixed Reality), or AR (Augmented Reality), an electronic viewfinder (Electronic View Finder: EVF), or a small projector, etc.

[0016] (Substrate 11) The substrate 11 is provided with various circuits for driving a plurality of light emitting elements 13. That is, on the first surface of the substrate 11, a driving circuit including a sampling transistor and a driving transistor for controlling the driving of the plurality of light emitting elements 13 and a power supply circuit (both not shown) for supplying power to the plurality of light emitting elements 13 are provided.

[0017] The substrate 11 may be made of, for example, glass or resin with low permeability to moisture and oxygen, or may be made of a semiconductor that is easy to form transistors or the like. Specifically, the substrate 11 may be a glass substrate, a semiconductor substrate, a resin substrate, or the like. The glass substrate includes, for example, high-strain-point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single-crystalline silicon. The resin substrate includes at least one selected from the group consisting of, for example, polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyethersulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0018] Generally, an insulating film (not shown) that covers the above-described drive circuit, power supply circuit, etc. is formed on the first surface of the substrate 11, and a plurality of contact plugs (not shown) for connecting the first electrode 13A constituting the light-emitting element 13 and the drive circuit are provided in the insulating film.

[0019] (Light-emitting element 13) The plurality of light-emitting elements 13 are provided on the first surface side of the substrate 11. The plurality of light-emitting elements 13 are two-dimensionally arranged (arranged in the XY plane direction) in a specified arrangement pattern such as a matrix pattern, for example. The light-emitting element 13 is configured to be capable of emitting white light. The light-emitting element 13 is, for example, a white OLED or a white Micro-OLED (MOLED). In the present embodiment, as a colorization method in the display device 10, a method using the light-emitting element 13 and the color filter 17 is used. However, the colorization method is not limited to this, and an RGB painting method or the like may be used. Also, instead of the color filter 17, a single-color filter may be used.

[0020] The light-emitting element 13 includes a first electrode 13A, an organic layer 13B, and a second electrode 13C. The first electrode 13A, the organic layer 13B, and the second electrode 13C are laminated in this order in the direction from the substrate 11 side toward the color filter 17 (+Z direction).

[0021] (First electrode 13A) The first electrode 13A is provided on the insulating film on the first surface side of the substrate 11. The first electrode 13A is electrically separated for each sub-pixel by the insulating layer 14 described later. The first electrode 13A is an anode. The first electrode 13A also functions as a reflective layer, and it is preferable to be made of a material with as high a reflectivity as possible and a large work function in order to increase the light emission efficiency. A sub-pixel indicates the smallest display section unit composed of one kind of color obtained by further dividing the pixels that are the section units constituting the screen. For example, one pixel (picture element) is constituted by a combination of adjacent red sub-pixels, green sub-pixels, and blue sub-pixels.

[0022] The first electrode 13A is constituted by at least one of a metal layer and a metal oxide layer. More specifically, the second electrode 13C is constituted by a single-layer film of a metal layer or a metal oxide layer, or a laminated film of a metal layer and a metal oxide layer. When the first electrode 13A is constituted by a laminated film, the metal oxide layer may be provided on the organic layer 13B side, or the metal layer may be provided on the organic layer 13B side. However, from the viewpoint of adjacent the layer having a high work function to the organic layer 13B, it is preferable that the metal oxide layer is provided on the organic layer 13B side.

[0023] The metal layer contains, for example, at least one metal element selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). The metal layer may contain the above at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy or a silver alloy. Specific examples of the aluminum alloy include, for example, AlNd or AlCu.

[0024] The metal oxide layer contains at least one of, for example, a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and titanium oxide (TiO).

[0025] (Second electrode 13C) The second electrode 13C is provided opposite to the first electrode 13A. The second electrode 13C is provided as an electrode common to all sub-pixels. The second electrode 13C is a cathode. The second electrode 13C is a transparent electrode having transparency to the light generated in the organic layer 13B. Here, the transparent electrode is assumed to include a semi-transmissive reflective layer. It is preferable that the second electrode 13C is made of a material having as high transparency as possible and a small work function in order to enhance the light emission efficiency.

[0026] The second electrode 13C is composed of at least one of a metal layer and a metal oxide layer. More specifically, the second electrode 13C is composed of a single-layer film of a metal layer or a metal oxide layer, or a laminated film of a metal layer and a metal oxide layer. When the second electrode 13C is composed of a laminated film, the metal layer may be provided on the organic layer 13B side, or the metal oxide layer may be provided on the organic layer 13B side. From the viewpoint of adjacent the layer having a low work function to the organic layer 13B, it is preferable that the metal layer is provided on the organic layer 13B side.

[0027] The metal layer contains at least one metal element selected from the group consisting of, for example, magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include MgAg alloy, MgAl alloy, or AlLi alloy. The metal oxide contains at least one of, for example, a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and zinc oxide (ZnO).

[0028] (Organic layer 13B) The organic layer 13B is provided between the first electrode 13A and the second electrode 13C. The organic layer 13B is provided as an organic layer common to all sub-pixels. The organic layer 13B is configured to be capable of emitting white light. However, this does not prohibit the emission color of the organic layer 13B from being other than white, and colors such as red, blue, and green may be adopted. That is, the emission color of the organic layer 13B may be, for example, any one of white, red, blue, and green.

[0029] The organic layer 13B has a structure in which a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are laminated in this order from the first electrode 13A toward the second electrode 13C. Note that the structure of the organic layer 13B is not limited to this, and layers other than the light-emitting layer are provided as necessary.

[0030] The hole injection layer is for enhancing the hole injection efficiency into the light-emitting layer and is also a buffer layer for suppressing leakage. The hole transport layer is for enhancing the hole transport efficiency to the light-emitting layer. The light-emitting layer causes recombination of electrons and holes when an electric field is applied, generating light. The light-emitting layer is an organic light-emitting layer containing an organic light-emitting material. The electron transport layer is for enhancing the electron transport efficiency to the light-emitting layer. An electron injection layer may be provided between the electron transport layer and the second electrode 13C. This electron injection layer is for enhancing the electron injection efficiency.

[0031] (Insulating layer 14) The insulating layer 14 is provided on an insulating film formed on the first surface side of the substrate 11. The insulating layer 14 electrically separates each first electrode 13A for each light-emitting element 13 (that is, for each sub-pixel). The insulating layer 14 has a plurality of openings 14A, and the first surface (the surface facing the second electrode 13C) of the separated first electrode 13A is exposed from the openings 14A. The insulating layer 14 may cover from the peripheral portion of the first surface of the separated first electrode 13A to the side surface (end face). In this specification, the peripheral portion of the first surface refers to a region having a predetermined width from the periphery of the first surface toward the inside.

[0032] The insulating layer 14 is made of, for example, an organic material or an inorganic material. The organic material includes, for example, at least one of polyimide and acrylic resin. The inorganic material includes, for example, at least one of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide. Note that when the light-emitting element 13 is separated for each by the processing of the first electrode 13A, the organic layer 13B, and the second electrode 13C, the insulating layer 14 may be omitted.

[0033] (Element protection layer) The element protection layer 15 is provided on the first surface of the second electrode 13C and covers the light-emitting element 13. The element protection layer 15 blocks the light-emitting element 13 from the outside air and suppresses the intrusion of moisture and oxygen from the external environment into the light-emitting element 13. Further, when the second electrode 13C is made of a metal layer, the element protection layer 15 may have a function of suppressing the oxidation of this metal layer.

[0034] The element protection layer 15 is made of, for example, an inorganic material. As the inorganic material constituting the element protection layer 15, those with low hygroscopicity are preferable. Specifically, the inorganic material constituting the element protection layer 15 is preferably at least one selected from the group consisting of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiNO), titanium oxide (TiO), and aluminum oxide (Al 2 O 3 ). The element protection layer 15 may have a single-layer structure, but may have a multilayer structure when increasing the thickness. This is to relax the internal stress in the element protection layer 15.

[0035] (Color filter) The color filter 17 is provided on the element protection layer 15. The color filter 17 is, for example, an on-chip color filter (OCCF). The color filter 17 can include, for example, a red filter 17R, a green filter 17G, and a blue filter 17B as shown in the example of FIG. 1. The red filter 17R, the green filter 17G, and the blue filter 17B are respectively provided facing the light-emitting elements 13 for red sub-pixels, the light-emitting elements 13 for green sub-pixels, and the light-emitting elements 13 for blue sub-pixels. Thereby, the white light emitted from each of the light-emitting elements 13 in the red sub-pixel, the green sub-pixel, and the blue sub-pixel passes through the above-mentioned red filter 17R, green filter 17G, and blue filter 17B respectively, and red light, green light, and blue light are respectively emitted from the display surface. Note that the example of FIG. 1 is just one example, and the types of color filters are not intended to be limited to a combination of three types: red, green, and blue. For example, the types of color filters may be a combination of four types: red, green, blue, and white.

[0036] The color filters 17 (in the example of FIG. 1, the red filter 17R, the green filter 17G, and the blue filter 17B) are arranged in a spaced-apart state from each other.

[0037] It is preferable that the ratio (Hc / Wc) of the height of the color filter 17 (indicated by the symbol Hc in FIG. 1) to the interval between adjacent color filters 17 (indicated by the symbol Wc in FIG. 1) (in this specification, the ratio (Hc / Wc) is referred to as the aspect ratio) is 1 or more. By having an aspect ratio of 1 or more, it becomes easy to form a void portion 12 in the filter protection layer 18 between adjacent color filters 17.

[0038] (Arrangement of Color Filters) In the example of FIG. 1, the arrangement of the color filter 17 is an arrangement in which the red filter 17R, the green filter 17G, and the blue filter 17B are repeatedly arranged in this order. Also, in this example, each color filter 17 (red filter 17R, green filter 17G, and blue filter 17B) is formed in a stripe shape on the XY plane as shown in FIG. 8C. Note that FIG. 8C is a diagram for explaining an example of the layout of the color filter. The XY plane is a plane having the Z-axis direction shown in FIG. 1 etc. as a normal. This is the same for FIGS. 8A, 8B, 9A, 9B, and 9C.

[0039] (Filter protection layer) The filter protection layer 18 is disposed so as to cover the side surface portion 28 of the color filter 17. The filter protection layer 18 has a function of regulating the exposure of the side surface portions 28 of the respective color filters 17 (red filter 17R, green filter 17G, blue filter 17B) to the outside and their deterioration. The filter protection layer 18 is preferably composed of the same material as the element protection layer 15. That is, the filter protection layer 18 is composed of, for example, an inorganic material in the same manner as the element protection layer 15. Examples of the inorganic material include silicon oxide (SiO), silicon nitride (SiN), and aluminum oxide (Al 2 O 3 ). etc. Silicon oxide (SiO) and silicon nitride (SiN) formed by plasma vapor deposition (P-SiO and P-SiN respectively) are preferred.

[0040] As shown in FIG. 1, the filter protection layer 18 preferably further covers a portion (upper surface portion 27) forming the first surface of the color filter 17. In the example of the display device 10 in FIG. 1, the filter protection layer 18 covers both the upper surface portion 27 and the side surface portion 28 of the color filter 17, and the portion of the filter protection layer 18 covering the upper surface portion 27 of the color filter 17 and the portion of the filter protection layer 18 covering the side surface portion 28 of the color filter 17 are integrally formed of the same material. However, this does not prohibit the filter protection layer 18 covering the upper surface portion 27 of the color filter 17 and the filter protection layer 18 covering the side surface portion 28 of the color filter 17 from being formed of different materials.

[0041] Also, in the example of the display device 10 in FIG. 1, irregularities are formed on the first surface of the filter protection layer 18, and convex portions 18A having a trapezoidal cross-section are formed so as to be continuous with each other, and the connecting portions of adjacent convex portions are recesses. The convex portions 18A are formed above the upper surface portion 27 of each color filter 17, and each convex portion 18A is formed in a shape and size corresponding to the layout of the sub-pixels. When the convex portions 18A are formed above the upper surface portion 27 of the color filter 17, by adjusting the shape of the convex portions 18A, the filter protection layer 18 can be provided with a lens function. Note that this does not prohibit the first surface (surface) of the filter protection layer 18 from being a flat surface. The first surface of the filter protection layer 18 may be a flat surface. For example, when a lens 20 is separately provided as in the example of the third embodiment described later (FIG. 12), the flattening layer 19 can be omitted because the filter protection layer 18 is a flat surface.

[0042] The refractive index of the filter protective layer 18 is preferably equal to or less than the refractive index of the color filter 17. Since the refractive indices of the filter protective layer 18 and the color filter 17 are in such a magnitude relationship, when the light reflected at the contact interface between the filter protective layer 18 and the void portion 12 reaches the interface between the filter protective layer 18 and the color filter 17, it is less likely to cause light reflection at the interface between the filter protective layer 18 and the color filter 17. Therefore, it is less likely to cause repeated light reflection within the filter protective layer 18, and it is possible to suppress the luminance from becoming excessively large around the outer periphery of the color filter 17.

[0043] The refractive index of the filter protective layer 18 is preferably equal to or less than the refractive index of the element protective layer 15. Since the refractive indices of the filter protective layer 18 and the element protective layer 15 are in such a magnitude relationship, when the light generated by the light-emitting element 13 reaches the interface between the filter protective layer 18 and the element protective layer 15, it is less likely to cause reflection at the interface between the filter protective layer 18 and the element protective layer 15. In particular, as described in Modification Example 5 to be described later, when a stepped portion 21 is formed in the element protective layer 15 and a contact interface is formed between the stepped surface (side surface portion 21B) of the stepped portion 21 and the filter protective layer 18, the contact interface between the filter protective layer 18 and the element protective layer 15 may be formed below the color filter 17. When the refractive index of the filter protective layer 18 is equal to or less than the refractive index of the element protective layer 15 in such a case, light reflection at the contact interface between the filter protective layer 18 and the element protective layer 15 is suppressed, and light is more likely to travel to the color filter 17 above the contact interface.

[0044] Further, as the material for forming the filter protective layer 18, a material having a lower step coverage value than the material for forming the element protective layer 15 and the like is preferable. By forming the filter protective layer 18 with such a material, the void portion 12 can be formed more efficiently.

[0045] (Void portion) In the display device 10 of FIG. 1, a void portion 12 is formed in the filter protective layer 18 between adjacent color filters 17.

[0046] In the example of FIG. 1, the cross-sectional shape of the gap portion 12 is formed in a forward taper shape. The forward taper shape means a case where the taper angle β (in FIG. 14, the taper angle between the side wall surface 12A of the gap portion 12 and the horizontal plane E (in FIG. 14, the horizontal plane)) formed between the gap portion 12 and the filter protection layer 18 is less than 90°. From the viewpoint of facilitating total reflection of light and suppressing light leakage to adjacent sub-pixels and enhancing light extraction efficiency, it is more preferable that the gap portion 12 is formed in a forward taper shape with a taper angle β of 70° or less.

[0047] In terms of the vertical position, in the example of FIG. 1, the lower end of the gap portion 12 is above the lower end of the color filter 17, and the upper end is below the upper surface portion of the color filter 17. For the gap portion 12, at least a part of the gap portion 12 may be formed between adjacent color filters, and it is preferable that the lower end portion (-Z direction side end portion) of the gap portion 12 is located as low as possible. By positioning the lower end portion of the gap portion 12 lower, even when the miniaturization degree of the sub-pixels is improved, light leakage to the color filter 17 on the adjacent sub-pixel side can be suppressed. The upper end portion of the gap portion 12 is not particularly limited and may be located above the upper surface portion 27 of the color filter 17 (+Z direction side).

[0048] [1-2 Method for manufacturing a display device according to the first embodiment] Hereinafter, an example of a method for manufacturing the display device 10 according to an embodiment of the present disclosure will be described.

[0049] First, for example, using thin film formation technology, photolithography technology, and etching technology, a driving circuit, a power supply circuit, etc. are formed on the first surface of the substrate 11. Next, for example, by the CVD method, after forming an insulating film on the first surface of the substrate 11 so as to cover the driving circuit and the power supply circuit, a plurality of contact plugs are formed in the insulating film.

[0050] Next, for example, by a sputtering method, after forming a laminated film of a metal layer and a metal oxide layer on the first surface of the substrate 11, the laminated film is patterned using, for example, photolithography technology and etching technology, thereby forming the first electrode 13A separated for each light-emitting element 13 (that is, for each sub-pixel).

[0051] Next, for example, by a CVD method, after forming the insulating layer 14 on the formation surface side (the first surface side) of the insulating film of the substrate 11 so as to cover the plurality of first electrodes 13A, the insulating layer 14 is patterned using photolithography technology and etching technology. As a result, a plurality of openings 14A are formed in the insulating layer 14.

[0052] Next, for example, by a vapor deposition method, a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are laminated in this order on the first surface of the first surface of the first electrode 13A, thereby forming the organic layer 13B. Next, for example, by a vapor deposition method or a sputtering method, the second electrode 13C is formed on the first surface of the organic layer 13B. As a result, a plurality of light-emitting elements 13 are formed on the first surface side of the substrate 11.

[0053] Next, for example, by a CVD method or a vapor deposition method, the element protection layer 15 is formed on the first surface of the second electrode 13C. As a result, an element laminate 30 in which the light-emitting element 13 and the element protection layer 15 are formed on the first surface side of the substrate 11 is obtained (FIG. 2A).

[0054] For the element laminate 30, a color filter 17 is formed on the first surface of the element protection layer 15. The color filters 17 are formed at intervals from each other in a shape determined according to the layout of the sub-pixels and pixels (FIG. 2B). The color filter 17 can be formed, for example, by applying a photolithography method. In the example of FIG. 2B, a red filter 17R, a green filter 17G, and a blue filter 17B are formed in a stripe shape while being separated from each other.

[0055] Next, a filter protection layer 18 is formed on the first surface of the color filter 17. The filter protection layer 18 can be formed by, for example, a CVD method or a vapor deposition method, similar to the element protection layer 15. At this time, various protection layer formation conditions are determined, such as the separation distance between adjacent color filters 17, the height of the color filter 17 and its ratio (aspect ratio), the thickness of the filter protection layer 18, and the step coverage of the material for forming the filter protection layer 18. As a result, a void portion 12 corresponding to the protection layer formation conditions is formed in the filter protection layer 18 between adjacent color filters 17. The taper angle β, the lower end position, etc. of the void portion 12 are also controlled by these protection layer formation conditions.

[0056] Note that the formation of the filter protection layer 18 is preferably carried out under low-temperature conditions from the viewpoint of suppressing the deterioration of the color filter 17 and the light-emitting element 13. Specifically, the formation of the filter protection layer 18 is preferably carried out under temperature conditions of 100°C or lower, from the viewpoint of being able to form the void portion 12 while maintaining the performance of the color filter 17 and the light-emitting element 13.

[0057] Thus, the display device 10 shown in FIG. 1 is obtained.

[0058] [1-3 Effects] According to the display device 10, a void portion 12 is formed in the filter protection layer 18 between adjacent color filters 17. Therefore, the light propagated in the oblique direction through the color filter 17 is less likely to leak to the adjacent sub-pixel side, and light mixing and color mixing can be suppressed. In addition, the light traveling toward the adjacent sub-pixel side can be reflected at the contact interface between the filter protection layer 18 and the void portion 12 and taken out to the outside from the first surface side, so that the light extraction efficiency can be improved.

[0059] As in the display device 10 of FIG. 1, since the upper surface portion 27 and the side surface portion 28 of the color filter 17 are covered with the filter protection layer 18, the swelling suppression property and the outgassing suppression property of the color filter 17 can be improved. Further, since the filter protection layer 18 is formed so as to cover the color filter 17 and is in contact between the adjacent color filters 17 with respect to the element protection layer 15, peeling between the color filter 17 and the element protection layer 15 can be suppressed, and the adhesion between the color filter 17 and the element protection layer 15 can be improved.

[0060] Also, as in the display device 10 of FIG. 1, when the shape of the first surface of the filter protection layer 18 is adjusted to form an uneven surface so that the filter protection layer 18 has a lens function, the step of separately providing a lens on the filter protection layer 18 during the manufacture of the display device can be omitted, and the number of manufacturing steps of the display device can be reduced.

[0061] [1-4 Modification Example] (Modification Example 1) In the example of the display device 10 of FIG. 1, the upper surface (first surface) of the element protection layer 15 was a flat surface, but it is not limited thereto. As shown in FIG. 3A, a step portion 21 may be formed on the first surface of the element protection layer 15. When the step portion 21 is formed on the element protection layer 15, since the color filter 17 is disposed on the upper surface 21A of the step portion 21, the lower end of the filter protection layer 18 can be positioned below the color filter 17 (position on the -Z direction side). Therefore, also with respect to the void portion 12 formed in the filter protection layer 18, the lower end of the void portion 12 can be positioned below the color filter 17. When the color filter 17 is disposed on the upper surface 21A of the step portion 21, the color filter 17 may be disposed such that the side surface portion 21B of the step portion 21 and the side surface portion 28 of the color filter 17 are flush with each other as shown in FIG. 3A, or as will be described later, the color filter 17 may be disposed such that the side surface portion 21B of the step portion 21 and the side surface portion 28 of the color filter 17 are in positions shifted from each other.

[0062] In the example of the display device 10 shown in FIG. 3A, when the direction from the color filter 17 toward the light-emitting element (-Z direction) along the thickness direction (Z-axis direction) of the color filter 17 is defined as the downward direction, the lower end of the gap portion 12 is located below the color filter 17 and above the light-emitting element 13. According to the display device 10 of Modification 1, since the lower end of the gap portion 12 is located lower (because the height h of the gap portion 12 in FIG. 13 becomes lower), the light extraction efficiency can be improved as described in the simulation example to be described later.

[0063] (Manufacturing method of the display device according to Modification 1) Such a display device 10 can be manufactured, for example, as shown in FIGS. 4A and 4B. FIGS. 4A and 4B are cross-sectional views for explaining the manufacturing process of the display device 10 according to Modification 1. The same processes as those of the manufacturing method of the display device 10 according to the above-described first embodiment are performed to form an element laminate 30 as shown in FIG. 2A. By forming a groove portion 31 at a predetermined position in the element laminate 30 by, for example, photolithography technology and etching technology, a step portion 21 is formed (FIG. 4A).

[0064] As shown in FIG. 4B, a color filter 17 is formed on the upper surface 21A of the step portion 21 of the element protection layer 15. The color filters 17 are formed at intervals from each other in a shape determined according to the layout of sub-pixels and pixels. The color filter 17 can be formed, for example, by applying a photolithography method. In the example of FIG. 4B, a red filter 17R, a green filter 17G, and a blue filter 17B are formed in a stripe shape while being separated from each other.

[0065] Next, the filter protection layer 18 is integrally formed on the first surface of the color filter 17, between adjacent color filters, and between adjacent step portions 21. The filter protection layer 18 can be formed in the same manner as the manufacturing method of the display device 10 according to the first embodiment described above. At this time, void portions 12 are formed in the filter protection layer 18 between adjacent color filters 17 and in the filter protection layer 18 between adjacent step portions 21. That is, the void portions 12 are formed below adjacent color filters 17 such that the lower ends thereof are located between adjacent step portions 21. In this way, the display device 10 as shown in FIG. 3A can be formed.

[0066] (Modification 2) In the display device 10 according to Modification 1 as shown in FIG. 3A, the lower end of the void portion 12 is located above the light-emitting element 13, but the lower end of the void portion 12 is not limited thereto. As shown in FIG. 3B, when the direction from the color filter 17 toward the light-emitting element 13 along the thickness direction of the color filter 17 is defined as the downward direction, the lower end of the void portion 12 may be located between adjacent light-emitting elements 13 (Modification 2). At this time, regarding the vertical position (position in the Z-axis direction), the position of the lower end of the void portion 12 may be at the position of the second electrode 13C or the organic layer 13B, or may be at the position of the first electrode 13A. According to the display device 10 of Modification 2, the lower end of the void portion 12 is located more downward, and the light extraction efficiency can be improved as described in the simulation example to be described later.

[0067] (Modification 3) Regarding the lower end of the gap portion 12, it is not limited to Modifications 1 and 2. As shown in FIG. 3C, when the direction from the color filter 17 toward the light-emitting element 13 along the thickness direction of the color filter 17 is defined as the downward direction, the lower end of the gap portion 12 may be located below the space between adjacent light-emitting elements 13 (Modification 3). According to the display device 10 according to Modification 3, the lower end of the gap portion 12 is positioned lower, and similar to Modification 2, the light extraction efficiency can be improved as will be described in the simulation example below. Further, according to the display device 10 according to Modification 3, adjacent light-emitting elements 13 can be separated by the filter protection layer 18 and the gap portion 12.

[0068] (Modification 4) In the above Modifications 1 to 3, the color filter 17 was arranged such that the side surface portion 21B of the step portion 21 and the side surface portion 28 of the color filter 17 were flush. However, in the display device 10, the color filter 17 may be arranged such that the side surface portion 21B of the step portion 21 and the side surface portion 28 of the color filter 17 are in misaligned positions. For example, in the display device 10, as shown in FIG. 6A, the color filter 17 may be arranged within the upper surface portion 21A of the step portion 21 (Modification 4).

[0069] (Manufacturing method of the display device according to Modification 4) Such a display device 10 can be manufactured, for example, as shown in FIG. 4C, by performing the same steps as the display device according to Modification 1, except that the color filter 17 is arranged within the upper surface portion 21A of the step portion 21.

[0070] (Modification 5) In the above Modification 4, as the arrangement of the color filter 17 such that the side surface portion 21B of the step portion 21 and the side surface portion 28 of the color filter 17 are in misaligned positions, the color filter 17 was arranged within the upper surface portion 21A of the step portion 21. The arrangement of the color filter 17 is not limited to this.

[0071] In the display device 10, as shown in FIG. 6B, a color filter 17 may be disposed so as to cover the upper surface 21A and the side surface 21B of the step portion 21 in the element protection layer 15 (Modification 5). In this case, the color filter 17 is disposed such that the upper surface 21A and the side surface 21B of the step portion 21 enter the inside of the color filter 17, and the side surface 21B of the step portion 21 and the side surface 28 of the color filter 17 are in positions shifted from each other.

[0072] According to the display device 10 according to Modification 5, the contact area between the color filter 17 and the element protection layer 15 increases, and the adhesion between the color filter 17 and the element protection layer 15 can be further improved. Further, according to the display device 10 of Modification 5, the light extraction efficiency can be improved in the same manner as the display device of Modification 1.

[0073] (Manufacturing method of the display device according to Modification 5) The display device 10 according to Modification 5 can be manufactured, for example, as shown in FIGS. 5A, 5B, and 5C. FIGS. 5A, 5B, and 5C are diagrams for explaining the manufacturing process of the display device 10 according to Modification 5. The element laminate 30 is formed in the same process as the manufacturing method of the display device according to Modification 1 (FIG. 5A). Further, a step portion 21 is formed in the same process as the manufacturing method of the display device according to Modification 1 (FIG. 5B). Next, as shown in FIG. 5C, the color filter 17 is formed so as to cover the step portion 21 with the color filter 17.

[0074] Then, the filter protection layer 18 is integrally formed between adjacent color filters 17 on the first surface of the color filter 17. The filter protection layer 18 can be formed in the same manner as the manufacturing method of the display device 10 according to the first embodiment described above. At this time, a void portion 12 is formed in the filter protection layer 18 between adjacent color filters 17. Thus, the display device 10 as shown in FIG. 6B can be formed.

[0075] (Modification 6) The cross-sectional shape of the gap portion 12 is not limited to the tapered shape as shown in the example of FIG. 1. The cross-sectional shape of the gap portion 12 may be non-tapered as shown in FIG. 7A. Examples of the non-tapered shape include polygons with four or more sides such as a rectangular shape as shown in FIG. 7A, and shapes having a curved surface portion. Further, the cross-sectional shape of the gap portion 12 may be an inverse-tapered shape as shown in FIG. 7B. Even in this case, it is possible to improve the light utilization efficiency as compared with the case where the gap portion 12 is not provided. Note that FIGS. 7A and 7B illustrate, for Modification 1, the case where the cross-sectional shape of the gap portion 12 is non-tapered and the case where the cross-sectional shape of the gap portion 12 is inverse-tapered, respectively.

[0076] (Modification 7) Normally, the gap portion 12 is filled with air inside, but the gap portion 12 may be filled with a predetermined gas other than air. Examples of the gas include nitrogen, carbon dioxide, and noble gases. When the gap portion 12 is filled with air, the refractive index of the gap portion 12 is approximately 1.

[0077] (Modification 8) In the case where the first surface of the filter protective layer 18 is an uneven surface, the convex portion 18A of the filter protective layer 18 is not limited to the trapezoidal cross-sectional shape as shown in FIG. 1 or the like. The convex portion 18A of the filter protective layer 18 may be formed in a hemispherical shape as shown in FIG. 10. FIG. 10 illustrates, for Modification 1, the case where the convex portion 18A is formed in a hemispherical shape on the first surface of the filter protective layer 18. Further, in the example of FIG. 10, the convex portions 18A are formed so as to be continuous with each other, and the connecting portions of the adjacent convex portions 18A that are connected to each other are concave portions. The convex portions 18A are formed above each color filter 17, and each convex portion 18A is determined to have a shape and size corresponding to the layout of the sub-pixels. When the convex portion 18A is formed above the color filter 17, by adjusting the shape of the convex portion 18A to be hemispherical, the filter protective layer 18 can be provided with a lens function.

[0078] (Modification 9) In the display measures of FIG. 1, the arrangement of the color filter 17 was a stripe arrangement as shown in FIG. 8C, but the display device 10 of this embodiment is not limited to this. The arrangement of the color filter 17 may be a square arrangement as shown in FIG. 8A, or a delta arrangement as shown in FIG. 8B. Also, in FIG. 8C, the color filter 17 was a stripe arrangement of three types: a red filter 17R, a green filter 17G, and a blue filter 17B, but as shown in FIG. 9C, it may also be a stripe arrangement of four color types. In FIG. 9C, a combination of a white filter 17W, a red filter 17R, a green filter 17G, and a blue filter 17B is arranged in a stripe shape. This is the same for the cases where the arrangement of the color filter 17 is a square arrangement or a delta arrangement, as exemplified in FIGS. 8A, 8B, 9A, and 9B.

[0079] That is, in the example shown in FIG. 8A, a square arrangement for one pixel is configured by a combination of one red filter 17R, two blue filters 17B, and one green filter. In the example shown in FIG. 9A, a square arrangement for one pixel is configured by a combination of one white filter 17W, one red filter 17R, one green filter 17G, and one blue filter 17B. Also, in the example shown in FIG. 8B, the red filter 17R, the green filter 17G, and the blue filter 17B are arranged in a delta shape. In the example shown in FIG. 9B, a combination of a white filter 17W, a red filter 17R, a green filter 17G, and a blue filter 17B is arranged in a delta shape.

[0080] [2 Second Embodiment] In the display device 10 according to the first embodiment, as shown in FIG. 11C, a filter upper surface protective film 29 may be formed between the upper surface portion 27 of the color filter 17 and the filter protective layer 18 (second embodiment). Note that FIG. 11C illustrates the case where the filter upper surface protective film 29 is formed in Modification 1 of the first embodiment.

[0081] (Filter upper surface protective film) The filter upper surface protective film 29 is a film that regulates the exposure of the upper surface portion 27 of the color filter 17. The filter upper surface protective film 29 can more reliably suppress the surface deterioration of the color filter 17 when the filter protective layer 18 is formed. As materials for the filter upper surface protective film 29, similar to the element protective layer 15 and the filter protective layer 18, silicon oxide (SiO), silicon nitride (SiN), and aluminum oxide (Al 2 O 3 ) etc. can be exemplified.

[0082] The display device 10 according to the second embodiment can be manufactured, for example, as shown in FIGS. 11A and 11B. FIGS. 11A and 11B are diagrams for explaining the manufacturing process of the display device according to the second embodiment. Up to the step of forming the element laminate 30, the same steps as those of the manufacturing method of the display device according to the above-described first embodiment are performed.

[0083] A color filter 17 is formed on the first surface of the element protective layer 15 with respect to the element laminate 30. The red filter 17R, the green filter 17G, and the blue filter 17B are formed in a stripe shape in a mutually adjacent state. At this time, these color filters 17 are formed without any space between them. Next, the filter upper surface protective film 29 is formed on the first surface of the color filter 17 (FIG. 11A).

[0084] Furthermore, for example, by photolithography technology and etching technology, groove portions 32 are formed at predetermined positions according to the layout of sub-pixels and pixels, and a state in which adjacent color filters 17 are separated from each other is formed. Next, the filter protective layer 18 is formed on the first surface of the filter upper surface protective film 29. At this time, the filter protective layer 18 is also formed between adjacent color filters 17 and covers the side surface portion 28 of the color filter 17. The filter protective layer 18 can be formed, for example, by a CVD method or a vapor deposition method, similar to the element protective layer 15. Also, when the filter protective layer 18 is formed, void portions 12 are formed in the filter protective layer 18 between adjacent color filters 17. Thus, the display device 10 is obtained.

[0085] [3. Third Embodiment] In the display device according to the first embodiment or the second embodiment, as shown in FIG. 12, a planarization layer 19 and a lens 20 may be laminated on the first surface (upper surface) of the filter protection layer 18.

[0086] (Planarization layer) The planarization layer 19 is provided between the filter protection layer 18 and the lens 20. The planarization layer 19 planarizes the surface on the first surface side of the filter protection layer 18 and has a function as an adhesive layer for bonding the filter protection layer 18 and the lens 20. The planarization layer 19 contains, for example, at least one of a thermosetting resin and an ultraviolet curable resin.

[0087] (Lens) The lens 20 is provided on the surface of the planarization layer 19. In the display device, the traveling direction of light is adjusted by the light that has passed through the color filter 17 further passing through the lens 20.

[0088] The display device according to the third embodiment can be manufactured as follows. First, the process is carried out up to the formation of the filter protection layer 18 by the method described in the manufacturing method of the display device according to the first embodiment or the second embodiment. Next, the planarization layer 19 is formed on the first surface of the filter protection layer 18. For example, the planarization layer 19 can be formed so as to cover the entire first surface of the filter protection layer 18 using the ODF (One Drop Fill) method.

[0089] The lens 20 is formed on the first surface side of the planarization layer 19. The lens 20 can be formed by applying an on-chip microlens (OCL) formation method using a melting method, an etch-back method, or the like. Thereby, the display device 10 is obtained.

[0090] [4 Simulation Examples] An example of the simulation of the total reflection position of light at the contact interface between the filter protection layer 18 and the gap portion 12 in the display device 10 will be described with reference to FIGS. 13, 14, 15A, and 15B. FIGS. 13 and 14 are diagrams for explaining the simulation conditions for determining the total reflection position at the contact interface in the display device according to the second embodiment. FIGS. 15A and 15B are diagrams showing the results of the simulation.

[0091] When assuming the display device 10 shown in FIGS. 13 and 14, the conditions for the light (light U1 from the light emission position V1 of the organic layer 13B of the light emitting element 13, from the filter protection layer 18 to the gap portion 12 in FIGS. 13 and 14) to be totally reflected at the contact interface between the filter protection layer 18 and the gap portion 12 are defined as shown in Equation 1. In FIGS. 13 and 14, reference numeral V2 indicates the interface reflection position. The interface reflection position V2 indicates the position where the light U1 can cause interface reflection at the contact interface between the filter protection layer 18 and the gap portion 12, and is specified as the intersection position of the contact interface between the filter protection layer 18 and the gap portion 12 and the line along the traveling direction of the light U1.

[0092]

Equation

[0093] However, in Equation 1, h is the height (the position in the Z-axis direction) from the light-emitting position V1 of the light-emitting element 13 to the interface reflection position V2 at the contact interface between the filter protection layer 18 and the gap portion 12 (the minimum height at which total reflection occurs) (in FIG. 13, height h). That is, in FIG. 13, h is the distance along the Z-axis direction (the height from the light-emitting position) from the horizontal plane including the light-emitting position V1 (indicated by a dashed-dotted line with reference numeral E1 in FIG. 13) to the interface reflection position V2. Note that the height direction (+Z direction) for specifying the height h is orthogonal to the horizontal plane E1. L is the distance from the opening end of the opening 14A of the light-emitting element 13 to the light-emitting position V1 (in FIG. 13, distance L). β is the inclination (the taper angle of the gap portion 12) of the contact interface between the filter protection layer 18 and the gap portion 12 (the side wall surface 12A of the gap portion 12 in FIGS. 13 and 14) with respect to the horizontal plane including the interface reflection position V2 (indicated by a dashed-dotted line with reference numeral E in FIG. 14) (taper angle β in FIG. 14). Also, as shown in FIG. 13, the taper angle β is also the inclination of the extension surface of the contact interface with respect to the horizontal plane E1 (indicated by a dashed-dotted line with reference numeral E X attached thereto in FIG. 13).

[0094] Also, θ max is the critical angle. The critical angle θ max is the value of the incident angle of the light U1 with respect to the contact interface being θ 1 such that when the refraction angle is θ 2 the refraction angle θ 2 becomes 90°. Note that, as shown in FIG. 14, the incident angle θ 1 is the angle formed by the normal line m of the contact interface and the light U1, and is equal to the angle formed by the normal line m of the contact interface and the reflected light U2. Also, the light U3 is the refracted light. Total reflection of the light U1 at the contact interface occurs when the incident angle θ1 is greater than or equal to the critical angle θ 1 . The critical angle θ max can be calculated based on the refractive index of the filter protection layer 18 and the refractive index of the gap portion 12. max

[0095] ​Regarding the relationship between the distance L and the height h when the equal sign holds in the above formula (1), simulations were performed under the following conditions. The simulations were carried out by determining the value of h when the value of L was varied. Also, the simulations were carried out under the condition that the value of β was in the range of 60° to 110°, and the taper angle β was changed at 2° intervals. The results of the simulations are shown in FIG. 15A as a graph with L on the horizontal axis and h on the vertical axis. In FIG. 15A, the case where the taper angle β is 60° is denoted as β(60), and the case where the taper angle β is 110° is denoted as β(110). Also, when the taper angle β is F1[°] selected from the range of 60° to 110°, it is denoted as β(F1), and when the taper angle β is F2[°] selected from the range of 60° to 110°, it is denoted as β(F2). Note that the value of F2 is larger than the value of F1. In FIG. 15A, under the condition that the equal sign holds in the above formula (1), the value of the height h in the case of a predetermined taper angle β and a predetermined distance L is indicated by an unfilled circle. The same applies to FIG. 15B showing the simulation results for the example of non-formation of the gap portion described later.

[0096] (Simulation conditions) (Condition 1) The pixel pitch is 3.6 μm (length N in FIG. 13), The dimension of the first electrode of the light-emitting element is 1.0 μm (length A1 in FIG. 13), The distance between adjacent first electrodes is 0.2 μm (length A2 in FIG. 13), The thickness of the first electrode is 0.075 μm (length B1 in FIG. 13), The thickness of the organic layer is 0.22 μm (length B2 in FIG. 13), The thickness of the second electrode is 0.06 μm (length B3 in FIG. 13), The thickness of the element protection layer is 0.5 μm (length C in FIG. 13), and, The thickness of the color filter is 1.1 μm (length D in FIG. 13).

[0097] (Condition 2) Except that the pixel pitch is 4.2 μm and the distance between adjacent first electrodes is 0.4 μm, it is the same as Condition 1.

[0098] (Condition 3) The pixel pitch is 5.1 μm, and the distance between adjacent first electrodes is 0.7 μm. Otherwise, it is the same as Condition 1.

[0099] From the simulation results shown in FIG. 15A, for a predetermined distance L, the value of the height h is smaller when the value of the taper angle β is (F1) than when the value of the taper angle β is β(F2). That is, it was confirmed that the smaller the taper angle β of the void portion 12 of the filter protective layer 18, the smaller the value of the minimum height h at which total reflection occurs. Therefore, it was confirmed that the smaller the taper angle β of the void portion 12 of the filter protective layer 18, the wider the range in which total reflection can be caused at the contact interface, and the light extraction efficiency can be improved.

[0100] Also, under Condition 1, it is preferable that the light-emitting position V1 can be totally reflected in the range from the position of 0 μm to the position of 0.9 μm with reference to the opening end (range Re1 in FIG. 15A), so that the void portion 12 can be formed. According to the simulation results in FIG. 15A, in the range Re1, there is a region (region Ar1 shown with hatching in FIG. 15A) where the combination of the distance L and the height h satisfies the total reflection condition. Therefore, for Condition 1, it is possible to design the void portion 12 so as to satisfy the total reflection condition. Under Condition 2, it is preferable that the light-emitting position V1 can be totally reflected in the range from the position of 0 μm to the position of 1.1 μm with reference to the opening end (range Re2 in FIG. 15A), so that the void portion 12 can be formed. According to the simulation results in FIG. 15A, in the range Re2, there is a region (the combined region of region Ar1 and region Ar2 shown with hatching in FIG. 15A) where the combination of the distance L and the height h satisfies the total reflection condition. Therefore, for Condition 2, it is possible to design the void portion 12 so as to satisfy the total reflection condition. Under Condition 3, it is preferable that the light-emitting position V1 can be totally reflected in the range from the position of 0 μm to the position of 1.4 μm with reference to the opening end (range Re3 in FIG. 15A), so that the void portion 12 can be formed. According to the simulation results in FIG. 15A, in the range Re3, there is a region (the combined region of region Ar1, region Ar2, and region Ar3 shown with hatching in FIG. 15A) where the combination of the distance L and the height h satisfies the total reflection condition. Therefore, for Condition 3 as well, it is possible to design the void portion 12 so as to satisfy the total reflection condition. Furthermore, from the simulation results shown in FIG. 15A, it was confirmed that even if the pixel pitch is reduced, more light can be totally reflected by reducing the height of the void portion 12, and the light extraction efficiency can be improved.

[0101] Also, for comparison with the above results, a case where the portion of the void portion 12 in the display device 10 shown in FIGS. 13 and 14 is replaced with a solid layer (an example of non-formation of the void portion) was assumed. As the solid layer, SiO 2A layer was assumed. For this case, simulations were performed based on the above Conditions 1 to 3. The simulation results are shown in FIG. 15B.

[0102] From the results of FIG. 15B, in the example where no void portion is formed, when L can be a larger value than that in Condition 1 as in Condition 2 or Condition 3 (in the case of Range Re2 and Range Re3) (when the pixel pitch is large), there may occur a case where the height h cannot be determined so as to satisfy the total reflection condition at a position below the first surface of the color filter 17. That is, in the case of Range Re2 and Range Re3, a portion deviating from the region (region Ar4 in FIG. 15B) that is a combination of the distance L and the height h satisfying the total reflection condition occurs. On the other hand, from the results of FIG. 15A, when the void portion 12 is formed, even if L is a large value in Condition 2 or Condition 3, the height h that satisfies the total reflection condition can be determined at a position below the first surface of the color filter.

[0103] As described above, from the comparison between the simulation results of FIG. 15A and the simulation results of FIG. 15B, it was confirmed that the formation of the void portion 12 in the filter protection layer 18 makes it easier to realize total reflection at the contact interface than in the case where a solid layer is formed.

[0104] [5 Application Examples] (Electronic Device) The display device 10 according to the above-described embodiment and modification may be provided in various electronic devices. In particular, it is preferably provided in those that require high resolution, such as an electronic viewfinder of a video camera or a single-lens reflex camera, or a head-mounted display, and are used by being enlarged near the eyes.

[0105] (Specific Example 1) FIG. 16A is a front view showing an example of the appearance of the digital still camera 310. FIG. 16B is a rear view showing an example of the appearance of the digital still camera 310. This digital still camera 310 is of the interchangeable-lens single-lens reflex type, and has an interchangeable photographing lens unit (interchangeable lens) 312 at approximately the center of the front of the camera body (camera body) 311, and a grip portion 313 for the photographer to hold on the left side of the front.

[0106] A monitor 314 is provided at a position shifted to the left from the center of the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. The photographer can view the optical image of the subject guided from the photographing lens unit 312 through the electronic viewfinder 315 and determine the composition. As the electronic viewfinder 315, any one of the display devices 10 according to the above-described embodiment and modification can be used.

[0107] (Specific Example 2) FIG. 17 is a perspective view showing an example of the appearance of the head-mounted display 320. The head-mounted display 320 has, for example, ear-hanging portions 322 for attaching to the user's head on both sides of the spectacle-shaped display portion 321. As the display portion 321, any one of the display devices 10 according to the above-described embodiment and modification can be used.

[0108] (Specific Example 3) FIG. 18 is a perspective view showing an example of the appearance of the television device 330. This television device 330 has, for example, a video display screen portion 331 including a front panel 332 and a filter glass 333, and this video display screen portion 331 is constituted by any one of the display devices 10 according to the above-described embodiment and modification.

[0109] As described above, the first to third embodiments of the present disclosure and their modifications have been specifically described. However, the present disclosure is not limited to the first to third embodiments and their modifications described above, and various modifications based on the technical idea of the present disclosure are possible.

[0110] For example, the configurations, methods, steps, shapes, materials, numerical values, etc. exemplified in the first to third embodiments and their modifications described above are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, etc. may be used as necessary.

[0111] The configurations, methods, steps, shapes, materials, numerical values, etc. of the first to third embodiments and their modifications described above can be combined with each other as long as the gist of the present disclosure is not deviated from.

[0112] The materials exemplified in the first to third embodiments and their modifications described above can be used alone or in combination of two or more without special notice.

[0113] In addition, the present disclosure can also adopt the following configuration. (1) A plurality of light-emitting elements having an organic layer, A plurality of color filters disposed at positions corresponding to each of the light-emitting elements, A filter protection layer covering side portions of the plurality of color filters and A void portion is formed in the filter protection layer at a position between adjacent color filters. A display device. (2) When the direction from the color filter toward the light-emitting element along the thickness direction of the color filter is defined as the downward direction, a lower end of the void portion is located below the color filter and above the light-emitting element. The display device according to (1) above. (3) When the direction from the color filter toward the light-emitting element along the thickness direction of the color filter is defined as the downward direction, the lower end of the void portion is located between adjacent ones of the light-emitting elements. The display device according to (1) above. (4) When the direction from the color filter toward the light-emitting element along the thickness direction of the color filter is defined as the downward direction, the lower end of the void portion is located below the space between adjacent ones of the light-emitting elements. The display device according to (1) above. (5) The cross-sectional shape of the void portion is any one of a forward-tapered shape, a non-tapered shape, and a reverse-tapered shape. The display device according to any one of (1) to (4) above. (6) The refractive index of the filter protective layer is equal to or less than the refractive index of the color filter. The display device according to any one of (1) to (5) above. (7) An element protective layer covering the light-emitting element is provided, the element protective layer has a stepped portion formed on an upper surface thereof, and side surfaces of the stepped portion and side surfaces of the color filter are arranged at positions shifted from each other. The display device according to any one of (1) to (6) above. (8) An element protective layer covering the light-emitting element is provided, the refractive index of the filter protective layer is equal to or less than the refractive index of the element protective layer. The display device according to any one of (1) to (7) above. (9) The ratio of the height of the color filter to the interval between adjacent color filters is 1 or more. The display device according to any one of (1) to (8) above. (10) The filter protective layer further covers a upper surface portion side of the color filter, and a surface shape of the filter protective layer is a flat surface or an uneven surface having any one of a trapezoidal shape or a hemispherical convex portion. The display device according to any one of (1) to (9) above. (11) A planarization film and a lens are further formed in this order on the upper surface of the filter protection layer. The display device according to any one of (1) to (9) above. (12) A filter upper surface protection film is formed between the upper surface portion of the color filter and the filter protection layer. The display device according to any one of (1) to (11) above. (13) The plurality of color filters are arranged in any one of a square array, a delta array, and a stripe array. The display device according to any one of (1) to (12) above. (14) The light emission color of the organic layer is any one of white, red, blue, and green. The display device according to any one of (1) to (13) above. (15) An electronic device including the display device according to any one of (1) to (14) above.

Description of Reference Numerals

[0114] 10 Display device 11 Substrate 12 Void portion 13A First electrode 13B Organic layer 13C Second electrode 14 Insulating layer 15 Element protection layer 17 Color filter 18 Filter protection layer 19 Planarization layer 20 Lens 21 Step portion 21A Upper surface 21B Side surface 27 Upper surface portion 28 Side surface 31, 32 Groove portions 310 Digital still camera 320 Head-mounted display 330 Television device

Claims

1. A plurality of light-emitting elements having an organic layer, a plurality of color filters disposed at positions corresponding to the respective light-emitting elements, and a filter protective layer covering side surfaces of the plurality of color filters are provided, and a void portion is formed in the filter protective layer at a position between adjacent color filters, a display device.

2. When the direction from the color filter toward the light-emitting element along the thickness direction of the color filter is defined as the downward direction, the lower end of the void portion is located below the color filter and above the light-emitting element, The display device according to claim 1.

3. When the direction from the color filter toward the light-emitting element along the thickness direction of the color filter is defined as the downward direction, the lower end of the void portion is located between adjacent light-emitting elements, The display device according to claim 1.

4. When the direction from the color filter toward the light-emitting element along the thickness direction of the color filter is defined as the downward direction, the lower end of the void portion is located below between adjacent light-emitting elements, The display device according to claim 1.

5. The cross-sectional shape of the void portion is any one of a forward-tapered shape, a non-tapered shape, and a reverse-tapered shape, The display device according to claim 1.

6. The refractive index of the filter protective layer is equal to or less than the refractive index of the color filter, The display device according to claim 1.

7. An element protective layer covering the light-emitting element is provided, the element protective layer forms a stepped portion on the upper surface thereof, and side surfaces of the stepped portion and side surfaces of the color filter are disposed at positions shifted from each other, The display device according to claim 1.

8. An element protective layer covering the light-emitting element is provided, the refractive index of the filter protective layer is equal to or less than the refractive index of the element protective layer, The display device according to claim 1.

9. The ratio of the height of the color filter to the interval between adjacent color filters is 1 or more, The display device according to claim 1.

10. The filter protective layer further covers the upper surface portion side of the color filter, and the surface of the filter protective layer is a flat surface or an uneven surface having any one of a trapezoidal shape or a hemispherical convex portion, The display device according to claim 1.

11. A planarization film and a lens are further formed in this order on the upper surface of the filter protective layer, The display device according to claim 1.

12. A filter upper surface protective film is formed between the upper surface portion of the color filter and the filter protective layer. The display device according to claim 1.

13. The plurality of color filters are arranged in any one of a square array, a delta array, and a stripe array. The display device according to claim 1.

14. The light emitting color of the organic layer is any one of white, red, blue, and green. The display device according to claim 1.

15. An electronic device comprising the display device according to claim 1. Electronic device.

Images