Composition for cleaning resin molded articles and method for cleaning resin molded articles

Abstract

To provide means for further improving cleaning performance in a cleaning agent of a resin molding.SOLUTION: An ion bondable salt represented by the following formula (1) is used as a composition for cleaning is used in cleaning of a resin molding. In the formula (1), (Q)+ is at least one selected from the group consisting of an ammonium ion, an imidazolium ion, a pyridinium ion, a pyrrolidinium ion, a pyrrolinium ion, a pyrazinium ion, a pyrimidinium ion, a triazolium ion, a triazinium ion, a quinolinium ion, an isoquinolinium ion, an indolinium ion, a quinoxalinium ion, a piperadinium ion, an oxazolinium ion, a thiazolinium ion, and a morpholinium ion, and (T)- is a sulfate anion, a phosphate anion or a sulfonic acid anion having a predetermined structure.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a cleaning composition for resin molded articles and a method for cleaning resin molded articles.

Background Art

[0002] Conventionally, halogenated hydrocarbon solvents such as trichloroethane and trichlorotrifluoroethane have been used as cleaning agents for removing organic contaminants such as machine oil, grease, flux, wax, ink, and fingerprints adhering to the surface of resin molded articles and the like. Halogenated hydrocarbon solvents can not only clean a wide range of contaminants, but are also very easy-to-use solvents with excellent non-flammability and drying properties. However, some of these have been found to destroy the ozone layer in the atmosphere, and thus the use of these solvents is now regulated from the viewpoints of environmental pollution and safety. For this reason, the substitution from these halogenated hydrocarbon solvents to non-halogenated cleaning agents has been rapidly advanced in the industry. Here, as non-halogenated alternative cleaning agents, for example, alcohol-based cleaning agents, hydrocarbon-based cleaning agents, water-based cleaning agents, and other cleaning agents described in the "Manual for Reducing the Use of Ozone-Depleting Substances, 3rd Edition" (published by the Ozone Layer Protection Countermeasure Industry Council, May 1, 1993) are known.

[0003] As an example of such non-halogenated cleaning agents, for example, Patent Document 1 discloses a cleaning agent for cleaning resin molded articles made of resins having transparency such as polycarbonate resin and acrylic resin. Specifically, in Patent Document 1, a cleaning agent containing an aliphatic amine, a glycol ether, a nonionic surfactant, a sequestering agent, and water and not containing an abrasive is applied to the surface of a resin material having transparency, and a cleaning step of floating and wiping off contaminants is performed. Further, Patent Document 1 also discloses that, following the cleaning step, a finishing step of applying and polishing a protective agent containing a petroleum-based solvent, wax, and an abrasive is performed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] According to the disclosure of Patent Document 1, it is said that the transparency and aesthetic appearance of resin molded products can be improved easily and speedily without requiring a polishing process.

[0006] However, according to the study by the present inventor, even if the cleaning process is performed using the cleaning agent disclosed in Patent Document 1, it is difficult to say that the cleaning effect is sufficiently satisfactory, and it has been found that there is still room for improvement.

[0007] Therefore, an object of the present invention is to provide a means capable of further improving the cleaning performance of a cleaning agent for resin molded products.

Means for Solving the Problems

[0008] To solve the above problems, the present inventor has conducted intensive studies. As a result, surprisingly, it has been found that when a resin molded product is cleaned using a cleaning agent containing a predetermined ionic bond salt as an essential component, cleaning performance significantly superior to that of the conventional technology can be exhibited. Based on this finding, the present inventor has completed the present invention.

[0009] That is, according to one aspect of the present invention, there is provided a cleaning composition for use in cleaning a resin molded product, which contains (A) an ionic bond salt represented by the following formula (1) as an active ingredient:

[0010]

Chemical formula

[0011] In the above formula (1), (Q) +is at least one selected from the group consisting of ammonium ion, imidazolium ion, pyridinium ion, pyrrolidinium ion, pyrrolinium ion, pyrazinium ion, pyrimidinium ion, triazolium ion, triazinium ion, quinolinium ion, isoquinolinium ion, indolinium ion, quinoxalinium ion, piperazinium ion, oxazolinium ion, thiazolinium ion, and morpholinium ion, (T) - is the following formula (t-1):

[0012]

Chemical formula

[0013] In the above formula (t-1), R 1 is an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted cycloalkyl group having 3 to 20 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or an optionally substituted arylalkyl group having 7 to 31 carbon atoms, A 1 is a linear or branched alkylene group having 2 to 4 carbon atoms, s is an integer from 0 to 50, sulfate anion represented by, the following formula (t-2):

[0014]

Chemical formula

[0015] In the above formula (t-2), R 2 and R 3is, independently of one another, a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, or a substituted or unsubstituted arylalkyl group having 7 to 31 carbon atoms, provided that R 2 and R 3 are not simultaneously hydrogen atoms, A 2 and A 3 are, independently of one another, a linear or branched alkylene group having 2 to 4 carbon atoms, t and u are, independently of one another, integers from 0 to 50, a phosphate anion represented by the following formula (t-3):

[0016] [Chemical formula]

[0017] In the above formula (t-3), R 4 is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, or a substituted or unsubstituted arylalkyl group having 7 to 31 carbon atoms, A 4 is a linear or branched alkylene group having 2 to 4 carbon atoms, v is an integer from 0 to 50, a sulfonate anion represented by [Advantages of the Invention]

[0018] According to the present invention, in a cleaning agent for resin molded articles, it is possible to further improve the cleaning performance. [Modes for Carrying Out the Invention]

[0019] <Composition for Cleaning Resin Moldings> One embodiment of the present invention is a cleaning composition for use in cleaning resin moldings, which contains a predetermined ionic salt (A) as an essential active ingredient. Further, the cleaning composition according to this embodiment preferably further contains an ether compound (B) or a nonionic surfactant (C), and more preferably further contains both the ether compound (B) and the nonionic surfactant (C). As will be described later, the cleaning composition according to this embodiment is usually diluted with water or an organic solvent and used as a cleaning agent. Hereinafter, the details of each component that can be included in the cleaning composition according to this embodiment will be described.

[0020] (A) Ionic salt In the cleaning composition according to this embodiment, the above-mentioned predetermined ionic salt (A) has a structure represented by the following formula (1).

[0021]

Chemical formula

[0022] In the above formula (1), (Q) + is at least one selected from the group consisting of ammonium ion, imidazolium ion, pyridinium ion, pyrrolidinium ion, pyrrolinium ion, pyrazinium ion, pyrimidinium ion, triazolium ion, triazinium ion, quinolinium ion, isoquinolinium ion, indolinium ion, quinoxalinium ion, piperazinium ion, oxazolinium ion, thiazolinium ion, and morpholinium ion.

[0023] In the above formula (1), (T) - is the following formula (t-1):

[0024]

Chemical formula

[0025] The sulfate anion represented by, the following formula (t-2):

[0026]

Chem.

[0027] The phosphate ester anion represented by, or the following formula (t-3):

[0028]

Chem.

[0029] It is a sulfonate anion represented by.

[0030] In the above formula (t-1), R 1 is an alkyl group having 1 to 20 carbon atoms which may or may not be substituted, a cycloalkyl group having 3 to 20 carbon atoms which may or may not be substituted, an aryl group having 6 to 30 carbon atoms which may or may not be substituted, or an arylalkyl group having 7 to 31 carbon atoms which may or may not be substituted, A 1 is a linear or branched alkylene group having 2 to 4 carbon atoms, and s is an integer of 0 to 50.

[0031] Also, in the above formula (t-2), R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms which may or may not be substituted, a cycloalkyl group having 3 to 20 carbon atoms which may or may not be substituted, an aryl group having 6 to 30 carbon atoms which may or may not be substituted, or an arylalkyl group having 7 to 31 carbon atoms which may or may not be substituted. At this time, R 2 and R 3 are not hydrogen atoms at the same time, A 2 and A 3 are each independently a linear or branched alkylene group having 2 to 4 carbon atoms, and t and u are each independently an integer of 0 to 50.

[0032] Furthermore, in the above formula (t-3), R 4 is an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted cycloalkyl group having 3 to 20 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or an optionally substituted arylalkyl group having 7 to 31 carbon atoms, and A 4 is a linear or branched alkylene group having 2 to 4 carbon atoms, and v is an integer of 0 to 50.

[0033] As described above, according to the study by the present inventors, even when the cleaning step is performed using the cleaning agent (a cleaning agent containing an aliphatic amine, a glycol ether, a nonionic surfactant, a metal sequestering agent and water and not containing an abrasive) disclosed in the above Patent Document 1, it is difficult to say that the cleaning effect is sufficiently satisfactory, and it has been found that there is still room for improvement.

[0034] Therefore, in view of the above-described problems, the present inventors have intensively conducted research. As a result, surprisingly, it has been found that when a resin molded article is cleaned using a cleaning agent containing a predetermined ionic bond salt as an essential component, cleaning performance significantly superior to that of the conventional technology can be exhibited. Although the mechanism is not clear, it is considered that the structures of the amine and the surfactant contained in the predetermined ionic bond salt have a high affinity with other cleaning agent components, and as a result, they exhibit a high function as a cleaning aid.

[0035] Hereinafter, embodiments of the present invention will be specifically described.

[0036] (Cation (Q) + ) The above (Q) + is a cation derived from a nitrogen-containing compound. Cation (Q) +Specific examples of the nitrogen-containing compound that brings about [the relevant effect] include, for example, in addition to ammonia (NH3), at least one nitrogen-containing organic compound selected from the group consisting of amine compounds, imidazole compounds, pyridine compounds, pyrrolidine compounds, pyrrole compounds, pyrazine compounds, pyrimidine compounds, triazole compounds, triazine compounds, quinoline compounds, isoquinoline compounds, indole compounds, quinoxaline compounds, piperazine compounds, oxazoline compounds, thiazoline compounds, and morpholine compounds. Here, the above (Q) + is preferably a cation derived particularly from a nitrogen-containing organic compound.

[0037] Specific examples of each of the above nitrogen-containing organic compounds can be the same as those described in paragraphs

[0071] to

[0091] of JP-A-2012-72130. However, from the viewpoint of easy availability and the like, among the above compounds, amine compounds are particularly preferred.

[0038] Among amine compounds, alkylamines such as dimethylamine, diethylamine, monopropylamine, dipropylamine, monobutylamine, dibutylamine, methyl(ethyl)amine, methyl(propyl)amine, methyl(butyl)amine, methyl(pentyl)amine, methyl(hexyl)amine, ethyl(propyl)amine, ethyl(butyl)amine, ethyl(pentyl)amine, ethyl(hexyl)amine; aromatic-substituted alkylamines such as monobenzylamine, (1-phenethyl)amine, (2-phenethyl)amine (alias: monophenethylamine), dibenzylamine, bis(1-phenethyl)amine, bis(2-phenethyl)amine (alias: diphenethylamine); cycloalkylamines such as monocyclopentylamine, dicyclopentylamine, monocyclohexylamine, dicyclohexylamine, monocycloheptylamine, dicycloheptylamine; and alkanolamines such as monomethanolamine, dimethanolamine, monoethanolamine, diethanolamine, triethanolamine, mono(n-propanol)amine, di(n-propanol)amine, monoisopropanolamine, diisopropanolamine, monobutanolamine, dibutanolamine, monopentanolamine, dipentanolamine, tripentanolamine, monohexanolamine, dihexanolamine, monomethylmonoethanolamine, monoethylmonoethanolamine (alias: N-ethylethanolamine), monoethylmonopropanolamine, monoethylmonobutanolamine, monoethylmonopentanolamine, monopropylmonoethanolamine, monopropylmonopropanolamine, monopropylmonobutanolamine, monopropylmonopentanolamine, monobutylmonoethanolamine, monobutylmonopropanolamine, monobutylmonobutanolamine, monobutylmonopentanolamine are preferred. These amine compounds are preferred from the viewpoint of easy availability. Among them, alkanolamines are preferably used because a cleaning composition and a cleaning agent capable of exhibiting excellent cleaning performance on resin molded articles can be obtained.

[0039] (Q) +It can be a cation derived from various nitrogen-containing compounds described above. Among them, a cation derived from an amine compound is preferable, and further, a cation derived from an alkanolamine is more preferable. Such a cation is suitable in that it easily imparts excellent cleaning performance to the cleaning composition and the detergent.

[0040] Further, as the above amine compound, from the viewpoint of simplifying the reaction step for preparing the ionic bond salt (1), those in which the amino group contained in the compound is primary, secondary or tertiary are preferable. Also, from the viewpoint of easily obtaining the effects of the present invention, those that are secondary or tertiary are more preferable, and those that are secondary are particularly preferable.

[0041] (Anion (T) - ) In the above formula (1), the anion ((T) - ) is a sulfate anion represented by the above formula (t-1), a phosphate ester anion represented by the formula (t-2), or a sulfonate anion represented by the formula (t-3). These anions improve the affinity with the resin constituting the resin molded product by interacting with the above-mentioned cation. As a result, it can greatly contribute to the improvement of the cleaning performance by using the ionic bond salt (1). In addition, since these anions provide a counter anion having a structure not containing halogen as the counter anion of the above cation, they are suitable for use in applications that dislike halogen. Hereinafter, the structures of these anions will be specifically described.

[0042] A in the above formula (t-1) 1 , A in the formula (t-2) 2 and A 3 , and A in the formula (t-3) 4 Each represented as, examples of the linear or branched alkylene group having 2 to 4 carbon atoms include an ethylene group, a propylene group, a butylene group, etc. From the viewpoint of easy availability, an ethylene group and a propylene group are particularly preferable.

[0043] R in the above formula (t-1)1 and R in formula (t-2) 2 and R 3 and R in formula (t-3) 4Examples of substituted or unsubstituted alkyl groups having 1 to 20 carbon atoms, each shown as such, include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isoamyl group, tert-pentyl group, neopentyl group, n-hexyl group, 3-methylpentan-2-yl group, 3-methylpentan-3-yl group, 4-methylpentyl group, 4-methylpentan-2-yl group, 1,3-dimethylbutyl group, 3,3-dimethylbutyl group, 3,3-dimethylbutan-2-yl group, n-heptyl group, 1-methylhexyl group, 3-methylhexyl group, 4-methylhexyl group, 5-methylhexyl group, 1-ethylpentyl group, 1-(n-propyl)butyl group, 1,1-dimethylpentyl group, 1,4-dimethylpentyl group, 1,1-diethylpropyl group, 1,3,3-trimethylbutyl group, 1-ethyl-2,2-dimethylpropyl group, n-octyl group, 2-methylhexan-2-yl group, 2,4-dimethylpentan-3-yl group, 1,1-dimethylpentan-1-yl group, 2,2-dimethylhexan-3-yl group, 2,3-dimethylhexan-2-yl group, 2,5-dimethylhexan-2-yl group, 2,5-dimethylhexan-3-yl group, 3,4-dimethylhexan-3-yl group, 3,5-dimethylhexan-3-yl group, 1-methylheptyl group, 2-methylheptyl group, 5-methylheptyl group, 2-methylheptan-2-yl group, 3-methylheptan-3-yl group, 4-methylheptan-3-yl group, 4-methylheptan-4-yl group, 1-ethylhexyl group, 2-ethylhexyl group, 1-propylpentyl group, 2-propylpentyl group, 1,1-dimethylhexyl group, 1,4-dimethylhexyl group, 1,5-dimethylhexyl group, 1-ethyl-1-methylpentyl group, 1-ethyl-4-methylpentyl group, 1,1,4-trimethylpentyl group, 2,4,4-trimethylpentyl group, 1-isopropyl-1,2-dimethylpropyl group, 1,1,3,3-tetramethylbutyl group, n-nonyl group, 1-methyloctyl group, 6-methyloctyl group, 1-ethylheptyl group, 1-(n-butyl)pentyl group, 4-methyl-1-(n-propyl)pentyl group, 1,5,5-trimethylhexyl group, 1,1,Examples of linear or branched alkyl groups include 5-trimethylhexyl group, 2-methyloctan-3-yl group, n-decyl group, 1-methylnonyl group, 1-ethyloctyl group, 1-(n-butyl)hexyl group, 1,1-dimethyloctyl group, 3,7-dimethyloctyl group, n-undecyl group, 1-methyldecyl group, 1-ethylnonyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, 1-methyltridecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, etc. From the viewpoints of availability and ease of arrangement of the ionic bond salt (1) with respect to the (meth)acrylic pressure-sensitive adhesive resin, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms is preferred, a 2-ethylhexyl group, a tridecyl group, and a 1,2-bis(2-ethylhexyloxycarbonyl)ethyl group are more preferred, and a 2-ethylhexyl group is particularly preferred.,

[0044] Examples of substituted or unsubstituted cycloalkyl groups having 3 to 20 carbon atoms include, for example, cyclopropyl group, cyclopentyl group, cyclohexyl group, norbornyl group, adamantyl group. From the viewpoints of availability and ease of arrangement of the ionic bond salt (1) on the surface of the resin molded article, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms is more preferred, and a cyclopropyl group, a cyclopentyl group, and a cyclohexyl group are more preferred.

[0045] Examples of the substituted or unsubstituted aryl group having 6 to 30 carbon atoms include, for example, phenyl group, biphenyl group, 1-naphthyl group, 2-naphthyl group, 9-anthryl group, 9-phenanthryl group, 1-pyrenyl group, 5-naphthacenyl group, 1-indenyl group, 2-azulenyl group, 9-fluorenyl group, terphenyl group, quarterphenyl group, mesityl group, pentalenyl group, binaphthalenyl group, ternaphthalenyl group, heptalenyl group, biphenylene group, indacenyl group, fluoranthenyl group, acenaphthylenyl group, aceanthrylenyl group, phenalenyl group, fluorenyl group, anthryl group, bianthracenyl group, teranthracenyl group, quarteranthracenyl group, anthraquinolyl group, phenanthryl group, triphenylenyl group, pyrenyl group, chrysenyl group, naphthacenyl group, preiadrenyl group, picenyl group, perylenyl group, pentaphenyl group, pentacenyl group, tetraphenylenyl group, hexaphenyl group, hexacenyl group, rubicenyl group, coronenyl group, trinaphthylenyl group, heptaphenyl group, heptacenyl group, pyranthrenyl group, ovalenyl group and the like. From the viewpoints of availability and ease of arranging the ionic bond salt (1) on the surface of the resin molded article, a substituted or unsubstituted aryl group having 6 to 18 carbon atoms is preferable, and a phenyl group, dimethylphenyl group (2,3-dimethylphenyl group, 2,4-dimethylphenyl group, 3,4-dimethylphenyl group, etc.), isopropylphenyl group (2-isopropylphenyl group, 3-isopropylphenyl group, 4-isopropylphenyl group), dodecylphenyl group (2-dodecylphenyl group, 3-dodecylphenyl group, 4-dodecylphenyl group) are particularly preferable.

[0046] Examples of the substituted or unsubstituted arylalkyl group having 7 to 31 carbon atoms include, for example, benzyl group, phenylethyl group, 3-phenylpropyl group, 1-naphthylmethyl group, 2-naphthylmethyl group, 2-(1-naphthyl)ethyl group, 2-(2-naphthyl)ethyl group, 3-(1-naphthyl)propyl group, or 3-(2-naphthyl)propyl group and the like.

[0047] From the viewpoint of availability, R1 ~R 4 is more preferably an alkyl group having 1 to 20 carbon atoms which may or may not be substituted or an aryl group having 6 to 30 carbon atoms which may or may not be substituted, and still more preferably an alkyl group having 1 to 10 carbon atoms which may or may not be substituted or an aryl group having 6 to 20 carbon atoms which may or may not be substituted. Further, considering the ease of handling such as availability and viscosity, etc., preferably, it is an n-butyl group, an n-hexyl group, a 2-ethylhexyl group, a dimethylphenyl group, an isopropylphenyl group, a dodecylphenyl group.

[0048] In the above formula (t-1), s, in the formula (t-2), t and u, and in the formula (t-3), v represent the number of divalent substituents -(OA 1~4 )-, and are integers from 0 to 50. From the viewpoint of ease of handling such as a decrease in viscosity, etc., the above s, t, u, and v are each independently preferably an integer from 1 to 40, and more preferably an integer from 2 to 30. Here, when the above s, t, u, and v are 1 or more, the ionic bond salt (1) has an oxyalkylene chain. In order to further improve the effects of the present invention, it is preferable that the above s, t, u, and v are 1 or more. Thus, when the ionic bond salt (1) contains an oxyalkylene chain, the effect of improving the cleaning performance on the resin molded product can be further enhanced. Therefore, it is more preferable that the above s, t, u, and v are 1 or more, and particularly preferably 2 or more. On the other hand, when the oxyalkylene chain is too long, the viscosity becomes high, so considering the handleability, the upper limit of the above s, t, u, and v is preferably 50, more preferably 40, and particularly preferably 30.

[0049] In the ionic bond salt (1), the sulfate anion represented by the formula (t-1), the phosphate anion represented by the formula (t-2), or the sulfonate anion represented by the formula (t-3) is appropriately selected depending on its use.

[0050] In addition, in this specification, when a certain group is "optionally substituted", examples of the substituent that can substitute the certain group include, for example, halogens such as fluorine, chlorine, bromine, and iodine, alkyl groups such as methyl group, ethyl group, tert-butyl group, and dodecyl group, aryl groups such as phenyl group, p-tolyl group, xylyl group, cumenyl group, naphthyl group, anthryl group, and phenanthryl group, alkoxy groups such as methoxy group, ethoxy group, and tert-butoxy group, aryloxy groups such as phenoxy group and p-tolyloxy group, alkoxycarbonyl groups such as methoxycarbonyl group, butoxycarbonyl group, 2-ethylhexyloxycarbonyl group, and phenoxycarbonyl group, acyloxy groups such as acetoxy group, propionyloxy group, and benzoyloxy group, acyl groups such as acetyl group, benzoyl group, isobutyryl group, acryloyl group, methacryloyl group, and methoxysulfuryl group, alkylsulfanyl groups such as methylsulfanyl group and tert-butylsulfanyl group, arylsulfanyl groups such as phenylsulfanyl group and p-tolylsulfanyl group, alkylamino groups such as methylamino group and cyclohexylamino group, dialkylamino groups such as dimethylamino group, diethylamino group, morpholino group, and piperidino group, arylamino groups such as phenylamino group and p-tolylamino group, and in addition, hydroxy group, carboxy group, formyl group, mercapto group, sulfo group, mesyl group, p-toluenesulfonyl group, amino group, nitro group, cyano group, trifluoromethyl group, trichloromethyl group, trimethylsilyl group, phosphinico group, phosphono group, etc. However, the substituents that exist in some cases will not be the same as the group to be substituted. For example, an alkyl group will not be substituted by an alkyl group.

[0051] (T) - Specific examples of [the compound] are given. Particularly from the viewpoint of having a high effect of improving the cleaning performance, those having any of the following structures are preferably mentioned.

[0052] [Chemical formula]

[0053] (Specific examples of the ionic bond salt (A)) As more preferable compounds of the ionic bond salt (A) represented by the above formula (1), ionic bond salts represented by the following chemical formulas (101) to (113) can be mentioned. The ionic bond salt (A) may be used alone or in combination of two or more. Among them, from the viewpoint that the effects of the present invention can be more easily obtained, as the ionic bond salt (1), ionic bond salts represented by chemical formulas (101) to (103), (107) to (112) are preferable, and ionic bond salts represented by chemical formulas (101), (107), (110), (111) are more preferable.

[0054] [Chemical formula]

[0055] [Chemical formula]

[0056] Although there is no particular limitation on the content of the (A) ionic bond salt in the cleaning composition according to this form, from the viewpoint of enhancing the affinity with other cleaning agent components, the content of the (A) ionic bond salt is preferably 0.1 to 5% by mass, more preferably 0.12 to 1.5% by mass, still more preferably 0.15 to 1% by mass, and particularly preferably 0.2 to 0.5% by mass with respect to 100% by mass of the total amount of the composition.

[0057] (B) Ether compound The cleaning composition according to this form preferably further contains an ether compound. By containing an ether compound in the cleaning composition, the fat solubility of the cleaning composition can be enhanced, and the detergency against oil and fat stains on the object to be cleaned can be improved.

[0058] Although there is no particular limitation on the specific form of the ether compound, it is preferably an ether compound represented by the following formula (2).

[0059] [Chemical formula]

[0060] Here, in the above formula (2), R a is an alkyl group having 1 to 8 carbon atoms, and specific examples thereof are as described above. Among them, an alkyl group having 1 to 4 carbon atoms is preferable, an alkyl group having 2 to 4 carbon atoms is more preferable, an alkyl group having 3 or 4 carbon atoms is still more preferable, an alkyl group having 4 carbon atoms is particularly preferable, and an n-butyl group is most preferable. Further, in the above formula (2), n represents the average number of moles of oxyethylene groups added, and is a number from 1 to 3. Among them, n is preferably 2 or 3, and n is particularly preferably 2.

[0061] Specific examples of the ether compound (B) represented by the above formula (2) include, for example, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol monoethyl ether, ethylene glycol monopropyl ether, diethylene glycol monopropyl ether, triethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, triethylene glycol monohexyl ether, ethylene glycol monooctyl ether, diethylene glycol monooctyl ether, triethylene glycol monooctyl ether, ethylene glycol mono-2-ethylhexyl ether, diethylene glycol mono-2-ethylhexyl ether, triethylene glycol mono-2-ethylhexyl ether, etc. These may be used alone or in combination of two or more. Among them, from the viewpoint of further expressing the effects of the present invention, diethylene glycol mono n-butyl ether (BDG), triethylene glycol mono n-butyl ether (BTG), ethylene glycol monomethyl ether (MG), diethylene glycol monomethyl ether (MDG), triethylene glycol monomethyl ether (MTG) are preferable, and diethylene glycol mono n-butyl ether (BDG) or triethylene glycol mono n-butyl ether (BTG) is particularly preferable.

[0062] There is no particular limitation on the content of the (B) ether compound in the cleaning composition according to this embodiment. However, from the viewpoint of enhancing the lipophilicity of the detergent and improving the detergency against oil and fat stains, the content of the (B) ether compound is preferably 10 to 99.9% by mass, more preferably 40 to 99.7% by mass, further preferably 70 to 99% by mass, and particularly preferably 90 to 95% by mass with respect to 100% by mass of the total amount of the composition.

[0063] (C) Nonionic surfactant The cleaning composition according to this form preferably further contains a nonionic surfactant. By containing a nonionic surfactant in the cleaning composition, the cleaning performance of the cleaning composition can be further improved.

[0064] There is no particular limitation on the specific form of the nonionic surfactant, but it is preferably a compound represented by the following formula (3).

[0065] [Chemical formula]

[0066] Here, in the above formula (3), R bis a monovalent hydrocarbon group having 4 to 20 carbon atoms, which may be substituted or unsubstituted. Here, the "monovalent hydrocarbon group" may be linear, branched or cyclic, and may be saturated or unsaturated. Examples of the monovalent hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, a cycloalkenyl group, a cycloalkynyl group, an aryl group and the like. Among these, examples of the alkyl group, the cycloalkyl group and the aryl group include those having 4 to 20 carbon atoms among those described above. Further, examples of the alkenyl group having 4 to 20 carbon atoms include a 2-butenyl group, a 3-pentenyl group, a hexenyl group, a heptenyl group, an octenyl group, a nonenyl group, a decenyl group and the like. Examples of the alkynyl group having 4 to 20 carbon atoms include a 2-butynyl group, a 3-pentynyl group, a hexynyl group, a heptynyl group, an octynyl group, a decynyl group and the like. Examples of the cycloalkenyl group having 4 to 20 carbon atoms include a cyclobutenyl group, a cyclopentenyl group, a cyclohexenyl group, a cycloheptenyl group, a cyclooctenyl group, a cyclodecenyl group and the like. Examples of the cycloalkynyl group having 4 to 20 carbon atoms include a cyclobutinyl group, a cyclopentynyl group, a cyclohexynyl group, a cycloheptynyl group, a cyclooctynyl group, a cyclodecynyl group and the like. Among them, R b is preferably a substituted or unsubstituted alkyl group or cycloalkyl group having 4 to 20 carbon atoms, more preferably a substituted or unsubstituted alkyl group having 4 to 20 carbon atoms, still more preferably a substituted or unsubstituted alkyl group having 8 to 20 carbon atoms, even more preferably a substituted or unsubstituted alkyl group having 10 to 16 carbon atoms, particularly preferably a substituted or unsubstituted alkyl group having 12 to 14 carbon atoms, and most preferably an unsubstituted alkyl group having 12 to 14 carbon atoms.

[0067] In the above formula (3), A is a linear or branched alkylene group having 2 to 4 carbon atoms. Examples of such alkylene groups include an ethylene group (-(CH2)2-); propylene groups such as an n-propylene group (-(CH2)3-), an isopropylene group (-(CH2)-CH(CH3)-, -CH(CH3)-CH2-); butylene groups such as an n-butylene group (-(CH2)4-), a 1-methylpropylene group (-(CH2)-CH2-CH(CH3)-, -CH(CH3)-CH2-CH2-), a 2-methylpropylene group (-(CH2)-CH(CH3)-CH2-), a dimethylethylene group (-(CH2)-C(CH3)2-, -C(CH3)2-CH2-), an ethylethylene group (-(CH2)-CH(CH2CH3)-, -CH(CH2CH3)-CH2-); and the like.

[0068] In the above formula (3), (AO) m represents a polyoxyalkylene chain. Here, (AO) m preferably contains an alkylene group other than an oxyethylene group (-(O-(CH2)2-), and more preferably contains an oxyethylene group and an oxyalkylene group other than an oxyethylene group. Generally, when the addition amount of the nonionic surfactant in the cleaning composition and the detergent increases, foaming is likely to occur during cleaning, and a large amount of solvent (water) and time may be consumed to wash away the generated foam. In this regard, by configuring the nonionic surfactant (C) as described above, it is possible to suppress the generation of foaming during cleaning when using the same amount of the nonionic surfactant. From the viewpoint of suppressing foaming during cleaning, the proportion of the oxyalkylene group other than the oxyethylene group in (AO) m in the formula (3) is preferably 1 to 70 mol%, more preferably 3 to 50 mol%, and still more preferably 5 to 30 mol%. When (AO) m has two or more oxyalkylene groups other than the oxyethylene group, the above proportion (mol%) represents the total of the proportions (mol%) of each structure. Further, when (AO) m has two or more oxyalkylene groups, the arrangement may be either a random type or a block type.

[0069] In the above formula (3), m represents the average number of moles of AO added, and is a number from 4 to 30. From the viewpoint of the effect of improving the cleaning performance, m is preferably a number from 6 to 20, more preferably a number from 8 to 12, and particularly preferably a number from 9 to 11.

[0070] There is no particular limitation on the content of the (C) nonionic surfactant in the cleaning composition according to this embodiment, but it is usually 1 to 80% by mass based on 100% by mass of the total amount of the composition. Further, from the viewpoint of suppressing foaming during cleaning, the content of the (C) nonionic surfactant is preferably 1 to 50% by mass, more preferably 1 to 20% by mass, still more preferably 1 to 10% by mass, and particularly preferably 1 to 5% by mass based on 100% by mass of the total amount of the composition.

[0071] The cleaning composition according to this embodiment may contain one or more kinds of various conventionally known additives in addition to the above-mentioned components (A) to (C). Examples of such additives include solubilizers, solubilizing agents, chelating agents, pH adjusters such as buffering agents, enzymes, viscosity adjusters, thickeners, surface modifiers, antioxidants, ultraviolet absorbers, preservatives, antibacterial agents, dispersants, antifoaming agents, rust preventives, and polymer compounds.

[0072] <Detergent> The object to be cleaned by the cleaning composition according to one embodiment of the present invention described above is a resin molded article. Here, there is no particular limitation on the material of the resin molded article, and resin molded articles used in applications where organic stains such as machine oil, grease, flux, wax, ink, and fingerprints can adhere to the surface can be widely targeted. Examples of the materials constituting the resin molded article include, for example, acrylonitrile-butadiene-styrene resin (ABS resin), acrylonitrile-styrene resin (AS resin), polyacrylate resin, polystyrene resin, polyester resin, polyethylene resin, polypropylene resin, polyvinyl chloride resin, polycarbonate resin, polyamide resin, polyimide resin, polyacrylate-styrene resin which is a copolymer of these, polyurethane resin, epoxy resin, etc. Preferably, acrylonitrile-butadiene-styrene resin (ABS resin), acrylonitrile-styrene resin (AS resin), polyacrylate resin, polystyrene resin, polyester resin, polyethylene resin, polypropylene resin, polyvinyl chloride resin, polycarbonate resin, polyamide resin, polyimide resin, polyacrylate-styrene resin which is a copolymer of these are mentioned. More preferably, acrylonitrile-butadiene-styrene resin (ABS resin), acrylonitrile-styrene resin (AS resin), polyacrylate resin, polystyrene resin are mentioned.

[0073] The cleaning composition according to one embodiment of the present invention described above may be a concentrated type intended to be diluted and used with a liquid medium such as water or an organic solvent, or a non-diluted type intended to be used as it is without dilution. In any case, the mixture when actually subjected to the cleaning treatment is referred to as a "cleaning agent" in this specification. In other words, the cleaning composition according to one embodiment of the present invention described above can be used as it is without dilution for cleaning resin molded articles. Further, the cleaning composition according to one embodiment of the present invention may be used for cleaning resin molded articles as a diluted solution diluted 1-fold or more and 20-fold or less with water or an organic solvent. In addition, according to still another embodiment of the present invention, there is also provided a method for cleaning a resin molded article, which includes cleaning the surface of the resin molded article with the cleaning composition according to one embodiment of the present invention described above or a cleaning agent which is a dilution thereof.

[0074] When diluting the cleaning composition to obtain a cleaning agent, the type of the liquid medium used for dilution can be appropriately selected according to the type and degree of the dirt present on the surface of the resin molded article to be cleaned. For example, as the liquid medium, those that can serve as a solvent mainly composed of water (aqueous medium) and organic solvents are all suitable. Examples of the aqueous medium include water, a mixed medium of water and alcohol, and a mixed medium containing water and an organic solvent compatible with water. On the other hand, as the organic solvent used for dilution as the liquid medium, polar solvents such as ketone solvents, ester solvents, ether solvents, and amide solvents, and known organic solvents that can be used for cleaning such as hydrocarbon solvents are included.

[0075] As the dilution ratio when adding a liquid medium to the cleaning composition for dilution, it is preferable to dilute 1 part by mass of the cleaning composition by adding the liquid medium to more than 1 part by mass and 100 parts by mass or less (more than 1-fold and 10-fold or less), more preferably dilute to 1.5 to 50 parts by mass (1.5 to 50-fold), particularly preferably dilute to 2 to 20 parts by mass (2 to 20-fold), and most preferably dilute to 3 to 20 parts by mass (3 to 20-fold).

[0076] Alternatively, it is also preferable to determine the dilution ratio in consideration of the final concentration of each component contained in the cleaning agent obtained by dilution. Specifically, for example, it is also a preferred embodiment to dilute such that the contents of the (A) ionic bond salt, (B) ether compound, and (C) nonionic surfactant contained in the cleaning agent after dilution are 0.001 to 0.1% by mass, 0.5 to 50% by mass, and 0.1 to 5% by mass, respectively, with respect to 100% by mass of the total amount of the cleaning agent. That is, according to a preferred embodiment of the present invention, it includes cleaning the surface of a resin molded product using a cleaning agent that is a dilution obtained by diluting the cleaning composition according to one embodiment of the present invention described above with water or an organic solvent, and the contents of the (A) ionic bond salt, (B) ether compound, and (C) nonionic surfactant contained in the cleaning agent are 0.001 to 0.1% by mass, 0.5 to 50% by mass, and 0.1 to 5% by mass, respectively, with respect to 100% by mass of the total amount of the cleaning agent. A method for cleaning a resin molded product is also provided. It is more preferable that the final concentrations of the components (A) to (C) in the cleaning agent described above are 0.005 to 0.05% by mass, 2 to 30% by mass, and 0.1 to 1.5% by mass, respectively.

[0077] During cleaning, the cleaning agent may be used as it is at room temperature without heating, or the cleaning agent may be heated and used. Specifically, the temperature of the cleaning agent used for cleaning is preferably 20 to 50°C. Here, according to the study of the present inventor, when cleaning the surface of a resin molded product using a cleaning agent that is a dilution obtained by diluting the cleaning composition with a liquid medium such as water or an organic solvent, when the content of the ether compound contained in the dilution (cleaning agent) is relatively high, even if the temperature of the cleaning agent during cleaning is room temperature (20 to 30°C), it has been found that sufficiently excellent cleaning performance is exhibited. Therefore, when using the cleaning composition according to one embodiment of the present invention by diluting it with a liquid medium such as water or an organic solvent to obtain a cleaning agent, by diluting it so that the content of the ether compound becomes relatively high, it is possible to reduce various utilities such as the equipment and light and heat costs required for heat preservation during cleaning, and it can be said that the industrial superiority is very high.

Examples

[0078] Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited by the following examples. In the following, the terms "parts" or "%" may be used, and unless otherwise specified, they represent "parts by mass" or "% by mass".

[0079] 《Synthesis of Ionic Salt》 [Synthesis Example 1: Synthesis of [MEM][EHDG-S]; Synthesis of Ionic Salt] 150.0 parts by mass of toluene was added to 150.0 parts by mass of diethylene glycol mono 2-ethylhexyl ether (manufactured by Nippon Emulsifier Co., Ltd., trade name: 2-ethylhexyl diglycol, abbreviation: EHDG), and the temperature was raised to 110°C. 80.2 parts by mass of sulfamic acid was added thereto and reacted for 3 hours. After the reaction, the excess sulfamic acid was filtered off to obtain a toluene solution of ammonium diethylene glycol mono 2-ethylhexyl ether sulfate (abbreviation: EHDG-SF; ammonium ion is NH4 + ).

[0080] 21.2 parts by mass of N-ethylethanolamine (manufactured by Nippon Emulsifier Co., Ltd., trade name: amino alcohol MEM, abbreviation: MEM) was added to 100.0 parts by mass of a 50% toluene solution of EHDG-SF obtained above, and the mixture was reacted at 120°C for 3 hours. (The molar ratio of EHDG-SF to MEM is 1:1.5) After completion of the reaction, toluene and unreacted MEM were distilled off under reduced pressure (temperature: 150°C, degree of vacuum: 1.33 kPa (10 mmHg)) to obtain 61.2 parts by mass of the target ionic salt (abbreviation: [MEM][EHDG-S]; the compound represented by the above chemical formula (101)).

[0081] [Synthesis Example 2: Synthesis of [MEM][1305-S]; Synthesis of Ionic Salt] Instead of EHDG-SF, ammonium polyoxyethylene tridecyl ether sulfate (abbreviation: 1305-SF; ammonium ion is NH4 +)Except for using 100.0 parts by mass, in the same manner as in Synthesis Example 1 above, 12.9 parts by mass of the target ionic bond salt (abbreviation: [MEM][1305-S]; the compound represented by the above chemical formula (107)) was obtained.

[0082] [Synthesis Example 3: Synthesis of [MEM][DOSS]; Synthesis of Ionic Bond Salt] Except for using 100.0 parts by mass of ammonium dioctyl sulfosuccinate (abbreviation: DOSS-NH4) instead of EHDG-SF, in the same manner as in Synthesis Example 1 above, 30.4 parts by mass of the target ionic bond salt (abbreviation: [MEM][DOSS]; the compound represented by the above chemical formula (111)) was obtained.

[0083] [Synthesis Example 4: Synthesis of [MEM][Cum-SO3]; Synthesis of Ionic Bond Salt] Except for using 100.0 parts by mass of cumene sulfonic acid (o-, m-, p-cumene sulfonic acid isomer mixture) (abbreviation: Cum-SO3H) instead of EHDG-SF, in the same manner as in Synthesis Example 1 above, 66.8 parts by mass of the target ionic bond salt (abbreviation: [MEM][Cum-SO3H]; the compound represented by the above chemical formula (110)) was obtained.

[0084] 《Preparation of Cleaning Composition and Detergent》 [Example 1] 2.5 parts by mass of diethylene glycol mono n-butyl ether (nBu-O-(CH2CH2)2-OH; BDG), which is an ether compound, 2.5 parts by mass of nonionic surfactant (1) (a compound obtained by block addition of oxyethylene groups and oxypropylene groups to a linear alcohol having 12 to 13 carbon atoms (average addition mole number = 10; ratio of addition mole numbers of oxyethylene groups to oxypropylene groups = 4:1)), and 0.02 parts by mass of the ionic bond salt ([MEM][EHDG-S]) synthesized in Synthesis Example 1 above were mixed and stirred until homogeneous to prepare the cleaning composition of this example.

[0085] Next, 5.0 parts by mass of the cleaning composition prepared above and 95.0 parts by mass of water were mixed and stirred until uniform to prepare the cleaning agent of this example.

[0086] [Example 2] The cleaning composition and cleaning agent of this example were prepared in the same manner as in Example 1 described above, except that 2.5 parts by mass of nonionic surfactant (2) (a product obtained by adding an oxyethylene group to a linear alcohol having 12 to 13 carbon atoms (average number of added moles = 10)) was used instead of nonionic surfactant (1).

[0087] [Example 3] The cleaning composition and cleaning agent of this example were prepared in the same manner as in Example 1 described above, except that 0.02 parts by mass of the ionic bond salt ([MEM][1305 - S]) synthesized in Synthesis Example 2 was used instead of [MEM][EHDG - S].

[0088] [Example 4] The cleaning composition and cleaning agent of this example were prepared in the same manner as in Example 1 described above, except that 0.02 parts by mass of the ionic bond salt ([MEM][DOSS]) synthesized in Synthesis Example 3 was used instead of [MEM][EHDG - S].

[0089] [Example 5] The cleaning composition and cleaning agent of this example were prepared in the same manner as in Example 1 described above, except that 0.02 parts by mass of the ionic bond salt ([MEM][Cum - SO3]) synthesized in Synthesis Example 4 was used instead of [MEM][EHDG - S].

[0090] [Examples 6 - 7] The cleaning compositions and cleaning agents of Examples 6 - 7 were prepared in the same manner as in Example 1 described above, except that the blending amounts (parts by mass) of each component were changed as shown in Table 1 below.

[0091] [Comparative Example 1] Instead of [MEM][EHDG-S], the cleaning composition and the cleaning agent of this comparative example were prepared by the same method as in Example 1 described above, except that 0.02 parts by mass of monoethanolamine (NH2-CH2CH2-OH) was used.

[0092] [Comparative Example 2] Instead of monoethanolamine, the cleaning composition and the cleaning agent of this comparative example were prepared by the same method as in Comparative Example 1 described above, except that 0.02 parts by mass of methylethanolamine (CH3-NH-CH2CH2-OH) was used.

[0093] [Comparative Example 3] Instead of monoethanolamine, the cleaning composition and the cleaning agent of this comparative example were prepared by the same method as in Comparative Example 1 described above, except that 0.02 parts by mass of ethylethanolamine (CH3CH2-NH-CH2CH2-OH) was used.

[0094] 《Evaluation of the Cleaning Agent》 [Evaluation of Cleaning Performance] The cleaning performance of the cleaning agent prepared above against the oil and grease stains adhering to the resin molded product was evaluated by the following method.

[0095] First, a molded product of ABS resin (size: 7.5 cm × 15 cm × 0.2 cm) was prepared as a test piece.

[0096] Next, with the test piece prepared above kept at 40°C, fingerprints were attached one by one from the thumb of each of the three panelists, for a total of 3 places. Also, a mold release agent was applied to a part of the test piece surface away from the fingerprint attachment part to obtain a sample to be cleaned.

[0097] To the fingerprint-attached part and the mold release agent-coated part of the sample to be cleaned thus prepared, each of the cleaning agents prepared above, kept at 40°C, was poured over for 10 seconds. Then, the degree to which the fingerprints and the stains caused by the mold release agent were cleaned was visually observed and evaluated in four grades according to the following criteria. The results are shown in Table 1 below. Note that if the evaluation is "◎" or "○", it can be used without practical problems.

[0098] (Evaluation Criteria for Cleaning Test) ◎: The dirt was thoroughly washed away and no residue of dirt was observed; ○: Most of the dirt was washed away, but a little dirt remained; △: Part of the dirt was washed away, but a considerable amount of dirt remained.

[0099] [Evaluation of Foaming] The degree of foaming when the above-mentioned cleaning test was carried out was visually observed and evaluated in three grades according to the following criteria. The results are shown in Table 1 below.

[0100] (Evaluation Criteria for Foaming) ◎: Almost no foaming was observed during the cleaning test; ○: Some foaming was observed during the cleaning test; △: Considerable foaming was observed during the cleaning test.

[0101]

Table 1

[0102] From the results shown in Table 1, it can be seen that the cleaning composition according to the present invention containing a predetermined ionic bond salt has excellent cleaning performance against the oil and grease stains attached to the resin molded product as compared with the cleaning composition containing an amine compound which is not a predetermined ionic bond salt.

[0103] According to the results shown in Table 1, it can be seen that sufficient cleaning performance was exhibited even when the usage amount of the nonionic surfactant was reduced to 1% by mass, and in this case, foaming could be sufficiently suppressed (Example 6). On the other hand, in Example 7 where the usage amount of the nonionic surfactant was relatively large at 4% by mass, considerable foaming was observed. Furthermore, it can also be seen that foaming was suppressed in Example 1 where a nonionic surfactant containing an oxyalkylene group other than the oxyethylene group (here, an oxypropylene group) was used, as compared with the case where a nonionic surfactant containing only an oxyethylene group was used (Example 2). Also, in the experiment where the ratio of the added molar numbers of the oxyethylene group and the oxypropylene group in the nonionic surfactant used in Example 1 was changed from 4:1 to 3:1 or 7.5:1 and carried out in the same manner, it was confirmed that results equivalent to those of Example 1 were obtained.

[0104] [Examples 8 to 13] Diethylene glycol mono-n-butyl ether (nBu - O - (CH2CH2)2 - OH; BDG), which is an ether compound, and the ionic bond salt ([MEM][Cum - SO3]) synthesized in Synthesis Example 4 above were mixed at a mass ratio of 9:1 to prepare Mixture A.

[0105] Next, this Mixture A, water, BDG, and nonionic surfactant (1) were mixed and stirred until homogeneous to prepare the cleaning compositions and detergents of Examples 8 to 13. The blending amounts (parts by mass) of the respective components in the finally obtained detergents for each example are shown in Table 2 below. Also, the names of the ether compounds described in Table 2 below in abbreviations are as follows.

[0106] BTG: Triethylene glycol mono-n-butyl ether MG: Ethylene glycol monomethyl ether MDG: Diethylene glycol monomethyl ether MTG: Triethylene glycol monomethyl ether Subsequently, the detergents prepared above were evaluated in the same manner as above. The results are shown in Table 2 below.

[0107]

Table 2

[0108] From the results shown in Table 2, it can be seen that in Examples 8 to 10 using BDG or BTG as the ether compound, compared with Examples 11 to 13 using other ether compounds, better cleaning performance was exhibited. Also, from the results of Example 8 etc., it can be seen that even if the usage amount of the nonionic surfactant is reduced to 0.15% by mass, sufficient cleaning performance can be ensured.

[0109] [Examples 14 to 15] Except that the compounding amounts (parts by mass) of each component were changed as shown in Table 3 below, the cleaning compositions and cleaning agents of Examples 14 to 15 were prepared by the same method as Example 8 described above. That is, first, BDG which is an ether compound and the ionic bond salt ([MEM][Cum-SO3]) synthesized in Synthesis Example 4 above were mixed at a mass ratio of 9:1 to prepare mixture A. Next, this mixture A, water, BDG, and the nonionic surfactant (1) were mixed and stirred until uniform to prepare the cleaning compositions and cleaning agents of Examples 14 to 15. The compounding amounts (parts by mass) of each component in the finally obtained cleaning agent for each example are shown in Table 3 below.

[0110] Subsequently, the same evaluation as above was carried out on the cleaning agent prepared above. However, here, during the evaluation, the test piece and the cleaning agent were evaluated at room temperature (25°C) without keeping them warm at 40°C. The results are shown in Table 3 below.

[0111]

Table 3

[0112] From the results shown in Table 3, it can be seen that sufficient cleaning performance can be obtained even at room temperature by diluting so that the mass ratio of the cleaning composition to water is 30:70. In addition, when the cleaning tests at room temperature were similarly conducted using the cleaning agents prepared in Examples 8 and 9 described above (the mass ratio of the cleaning agent composition to water was 5:95), the evaluation results were all "〇". Therefore, when the cleaning composition according to the present invention is diluted with a liquid medium such as water or an organic solvent and used as a cleaning agent, by diluting so that the concentration of the cleaning composition becomes relatively high, it is possible to reduce various utilities such as the equipment required for heat retention during cleaning and the light and heat costs, and thus it can be said that the industrial superiority is very high.

Claims

1. A cleaning composition for cleaning resin molded articles, comprising (A) an ionic bond salt represented by the following formula (1) as an active ingredient, (B) an ether compound represented by the following formula (2), and (C) a nonionic surfactant represented by the following formula (3): 【Chemical Formula 1】 In the above formula (1), (Q) ＋ is at least one selected from the group consisting of ammonium ion, imidazolium ion, pyridinium ion, pyrrolidinium ion, pyrrolinium ion, pyrazinium ion, pyrimidinium ion, triazolium ion, triazinium ion, quinolinium ion, isoquinolinium ion, indolinium ion, quinoxalinium ion, piperazinium ion, oxazolinium ion, thiazolinium ion, and morpholinium ion; (T) － is the following formula (t-1): 【Chemical Formula 2】 In the above formula (t-1), R １ is an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted cycloalkyl group having 3 to 20 carbon atoms, an optionally substituted aryl group having 6 to 30 carbon atoms, or an optionally substituted arylalkyl group having 7 to 31 carbon atoms; A １ is a linear or branched alkylene group having 2 to 4 carbon atoms; s is an integer from 0 to 50, and represents a sulfate ester anion; The following formula (t-2): 【Chemical Formula 3】 In the above formula (t-2), R ２ and R ３is, independently of one another, a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, or a substituted or unsubstituted arylalkyl group having 7 to 31 carbon atoms, provided that R ２ and R ３ are not simultaneously hydrogen atoms, A ２ and A ３ are each independently a linear or branched alkylene group having 2 to 4 carbon atoms, t and u are each independently an integer from 0 to 50, a phosphate anion represented by, or the following formula (t-3): 【Chemical formula 4】 In the above formula (t-3), R ４ is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, or a substituted or unsubstituted arylalkyl group having 7 to 31 carbon atoms, A ４ is a linear or branched alkylene group having 2 to 4 carbon atoms, v is an integer from 0 to 50, and is a sulfonate anion represented by. 【Chemical formula 5】 In the above formula (2), Ra is an alkyl group having 3 to 8 carbon atoms, n represents the average number of moles of oxyethylene groups added and is a number from 1 to 3, 【Chemical formula 6】 In the above formula (3), Rb is a substituted or unsubstituted monovalent hydrocarbon group having 4 to 20 carbon atoms, A is a linear or branched alkylene group having 2 to 4 carbon atoms, m represents the average number of moles of AO added, and is a number from 4 to 30.

2. The cleaning composition according to claim 1, wherein Ra is an alkyl group having 3 to 4 carbon atoms.

3. The cleaning composition according to claim 1, wherein Ra is an alkyl group having 4 carbon atoms.

4. The cleaning composition according to claim 1, wherein Ra is an n-butyl group.

5. The cleaning composition according to claim 4, wherein the (B) ether compound is diethylene glycol mono n-butyl ether or triethylene glycol mono n-butyl ether.

6. The cleaning composition according to any one of claims 1 to 5, wherein the content of the (C) nonionic surfactant is 1% by mass or less based on 100% by mass of the total amount of the composition.

7. In the formula (1), (Q) ＋ is a secondary ammonium ion or a tertiary ammonium ion, (T) － is a sulfate anion represented by the formula (t-1) or a sulfonate anion represented by the formula (t-3), The cleaning composition according to any one of claims 1 to 6.

8. In the formula (1), (T) － has any of the following structures, and the cleaning composition according to any one of claims 1 to 7: 【Chemical formula 7】

9. The cleaning composition according to any one of claims 1 to 8, wherein the content of the (A) ionic bond salt is 0.1 to 5% by mass based on 100% by mass of the total amount of the composition.

10. The cleaning composition according to any one of claims 1 to 9, wherein the content of the (B) ether compound is 10 to 99.9% by mass based on 100% by mass of the total amount of the composition.

11. In the (C) nonionic surfactant, (AO) ｍ The cleaning composition according to any one of claims 1 to 10, wherein contains an oxyalkylene group other than an oxyethylene group.

12. In the (C) nonionic surfactant, (AO) ｍ The cleaning composition according to claim 11, wherein contains an oxyethylene group and an oxyalkylene group other than an oxyethylene group.

13. The cleaning composition according to claim 12, wherein in the (C) nonionic surfactant, (AO) m contains an oxyethylene group and an oxypropylene group.

14. The cleaning composition according to any one of claims 1 to 13, wherein in the (C) nonionic surfactant, m is a number from 8 to 20.

15. The cleaning composition according to any one of claims 1 to 14, which is used for cleaning a resin molded article as it is without dilution or as a diluted solution diluted 2 to 20 times with water or an organic solvent.

16. A method for cleaning a resin molded article, comprising cleaning the surface of the resin molded article with a cleaning agent which is the cleaning composition according to any one of claims 1 to 15 or a dilution thereof.

17. The method for cleaning a resin molded article according to claim 16, comprising cleaning the surface of the resin molded article with a cleaning agent which is a diluted solution obtained by diluting the cleaning composition 2 to 20 times with water or an organic solvent.

18. Washing the surface of the resin molded article using a cleaning agent which is a dilution obtained by diluting the cleaning composition with water or an organic solvent, wherein the contents of the (A) ionic bond salt, (B) ether compound, and (C) nonionic surfactant contained in the cleaning agent are 0.001 to 0.1% by mass, 0.5 to 50% by mass, and 0.1 to 5% by mass, respectively, based on 100% by mass of the total amount of the cleaning agent. The method for cleaning a resin molded article according to claim 16 or 17.

19. The method for cleaning a resin molded article according to claim 17 or 18, wherein the temperature of the cleaning agent is 10 to 50°C.

20. Washing the surface of the resin molded article using a cleaning agent which is a dilution obtained by diluting the cleaning composition with water or an organic solvent, wherein the content of the (B) ether compound contained in the cleaning agent is 5% by mass or more based on 100% by mass of the total amount of the cleaning agent, and the temperature of the dilution is 10 to 35°C. The method for cleaning a resin molded article according to claim 18.

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