Flip-chip interconnected light emitting diode package assembly

Abstract

The light emitting diode (LED) package assembly includes a substrate. The substrate has a top surface, a bottom surface, and an opening formed therethrough. The opening includes a first portion adjacent the top surface and a second portion adjacent the bottom surface that is wider than the first portion, such that a portion of the substrate overhangs the second portion of the opening. A pad is provided on the bottom surface of the portion of the substrate that overhangs the second portion of the opening. The assembly also includes a hybrid device within the opening. The hybrid device includes a silicon backplane having a top surface, a bottom surface, and an interconnect on the top surface. The interconnect is electrically coupled to the pad. The hybrid device also includes an LED array on the top surface of the silicon backplane.

Description

Technical Field

[0001] This application claims the benefit of U.S. Patent Application No. 17 / 132,359, filed on December 23, 2020, and U.S. Provisional Application No. 62 / 954,121, filed on December 27, 2019, and incorporates them herein by reference as if fully set forth.

Background Art

[0002] Precision control lighting applications may require the production and manufacture of small, addressable light-emitting diode (LED) lighting systems. Even smaller sizes for such systems may require non-conventional components and manufacturing processes.

Summary of the Invention

[0003] A light-emitting diode (LED) package assembly includes a substrate having a top surface, a bottom surface, and an opening formed through the substrate. The opening includes a first portion adjacent to the top surface and a second portion adjacent to the bottom surface that is wider than the first portion, such that a portion of the substrate overhangs the second portion of the opening. A pad is provided on the bottom surface of the portion of the substrate that overhangs the second portion of the opening. The assembly also includes a hybrid device within the opening. The hybrid device includes a silicon backplane having a top surface, a bottom surface, and interconnects on the top surface. The interconnects are electrically coupled to the pads. The hybrid device also includes an LED array on the top surface of the silicon backplane.

Brief Description of the Drawings

[0004] A more detailed understanding will be obtained from the following description given by way of example in conjunction with the accompanying drawings.

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DETAILED DESCRIPTION OF THE INVENTION

[0005] Examples of a plurality of different optical illumination systems and / or light emitting diode (“LED”) implementations will now be described in greater detail with reference to the accompanying drawings. These examples are not mutually exclusive and features found in one example may be combined with features found in one or more other examples to achieve further implementations. Accordingly, it is to be understood that the examples shown in the accompanying drawings are provided for illustrative purposes only and are not intended to limit the present disclosure in any way. Throughout, like elements are referred to by like reference numerals.

[0006] It is to be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms may be used to distinguish one element from another. For example, without departing from the scope of the present invention, a first element may be termed a second element, and, similarly, a second element may be termed a first element. As used herein, the term “and / or” may include any and all combinations of one or more of the associated listed items.

[0007] It is to be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it may be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, intervening elements may be absent. It is also to be understood that when an element is referred to as being “connected to” or “coupled to” another element, it may be directly connected or coupled to the other element and / or may be connected or coupled to the other element via one or more intervening elements. In contrast, when an element is referred to as being “directly connected to” or “directly coupled to” another element, no intervening elements are present between the element and the other element. It is to be understood that these terms are intended to encompass elements in different orientations in addition to the orientation depicted in the figures.

[0008] Here, relative terms such as "below", "above", "upper", "lower", "horizontal", or "vertical" may be used to describe the relationship of one element, layer, or region to another when shown in the figures. It is to be understood that these terms are intended to encompass devices in different orientations in addition to the orientation depicted in the figures.

[0009] Also, whether an LED, LED array, electrical component, and / or electronic component is housed on one, two, or more electronics substrates may also depend on design constraints and / or applications.

[0010] Among the most efficient light sources currently available are semiconductor light-emitting devices (LEDs), or light output emitting devices such as those that emit light output in, for example, ultraviolet (UV) or infrared (IR). These devices (hereinafter, "LEDs") may include light-emitting diodes, resonant light-emitting diodes, vertical resonator laser diodes, edge-emitting lasers, or the like. LEDs can be attractive candidates for a number of different applications, for example, due to their small size and lower power requirements. For example, they can be used as light sources (e.g., flash light and camera flash) for portable battery-powered devices such as cameras and mobile phones. They can also be used, for example, for automotive lighting, head-up display (HUD) lighting, horticultural lighting, street lighting, video torches, general lighting (e.g., lighting for homes, stores, offices, and studios, theater / stage lighting, and architectural lighting), augmented reality (AR) lighting, virtual reality (VR) lighting, used as a backlight for displays, and also used in IR spectroscopy. A single LED will provide light that is not brighter than an incandescent light source, and thus, in applications where brighter light is desired or required, multi-junction devices or arrays of LEDs (e.g., monolithic LED arrays, micro-LED arrays, etc.) can be used.

[0011] LEDs can be arranged in arrays for some applications. For example, LED arrays can support applications that benefit from fine-grained control of the intensity, spatial, and temporal distribution of light. This can include, but is not limited to, precise spatial patterning of the emitted light from pixel blocks or individual pixels. Depending on the application, the emitted light may be spectrally different, adaptable over time, and / or environmentally responsive. The LED array may provide a pre-programmed orientation in various intensity, spatial, or temporal patterns. The emitted light may be at least partially based on received sensor data and may also be used for optical wireless communication. The accompanying electronic circuits and optics may vary at the emitter level, emitter block level, or device level.

[0012] LED arrays can be formed from one-dimensional, two-dimensional, or three-dimensional arrays of LEDs, VCSELs, OLEDs, or other controllable light-emitting systems. LED arrays may be formed as an array of emitters on a monolithic substrate, by partial or complete segmentation of the substrate, using photolithography, additive, or subtractive processes, or through assembly using pick-and-place or other suitable mechanical placement. The LED arrays may be evenly arranged in a grid pattern or may be positioned to define a geometric structure, curve, random, or irregular layout.

[0013] Figure 1 is a top view of an example LED array 101. In the example shown in Figure 1, the LED array 101 is an array of emitters 111. The emitters 111 within the LED array 101 may be individually addressable or addressable in groups / subsets.

[0014] An enlarged view of a 3×3 portion of the LED array 101 is also shown in FIG. 1. As shown in the 3×3 enlarged view, the LED array 101 may include a plurality of emitters 111 each having a width w1. In an embodiment, the width w1 may be about 100 μm or less (e.g., 40 μm). The lanes 113 between the emitters 111 may have a width of w2. In an embodiment, the width w2 may be about 20 μm or less (e.g., 5 μm). In some embodiments, the width w2 may be as small as about 1 μm. The lanes 113 may provide an air gap between adjacent emitters or may include other materials. The distance D1 from the center of one emitter 111 to the center of the adjacent emitter 111 may be about 120 μm or less (e.g., 45 μm). It is understood that the widths and distances provided here are merely examples, and the actual widths and / or dimensions may vary.

[0015] It is understood that although FIG. 1 shows square emitters arranged in a symmetric matrix, the embodiments described herein may apply to emitters of any shape and arrangement. For example, the LED array 101 of FIG. 1 may include more than 20,000 emitters in any applicable arrangement, such as a 200×100 matrix, a symmetric matrix, an asymmetric matrix, or the like. It is also understood that multiple sets of emitters, matrices, and / or substrates may be arranged in any applicable form to implement the embodiments described herein.

[0016] As described above, an LED array, such as the LED array 101, may include more than 20,000 emitters. Such an array may be 90 mm 2can have the surface area above and may require significant power to power them, such as 60 watts for example. An LED array such as this may be referred to as a micro LED array or simply a micro LED. In some embodiments, a micro LED can include hundreds, thousands, or even millions of LEDs or emitters arranged together on a centimeter-scale substrate or a substrate smaller than that. A micro LED may include an array of individual emitters provided on a substrate, or alternatively, may be a single silicon wafer or die that is partially or fully divided into segments that form the emitters.

[0017] The controller can be coupled to selectively power sub-groups of emitters within the LED array to provide different light beam patterns. At least some of the emitters within the LED array can be individually controlled via connected electrical wiring. In other embodiments, groups or sub-groups of emitters can be controlled together. In some embodiments, the emitters may have colors other than different whites. For example, at least four of the emitters may be an RGBY group of emitters.

[0018] The LED array lighting fixture can include an optical fixture that can be programmed to project different lighting patterns based on selective emitter activation and intensity control. Such lighting fixtures can deliver multiple controllable beam patterns from a single lighting device without using moving parts. Typically, this is done by adjusting the brightness of individual LEDs within a 1D or 2D array. The optical system, whether shared or individual, can optionally direct light to a specific target area. In some embodiments, the height of the LEDs, their support substrates and electrical wiring, and the accompanying micro-optics can be less than 5 millimeters.

[0019] LED arrays, including micro-LED arrays, can be used to selectively and adaptively illuminate a building or area for improved visual display or to reduce lighting costs. Such LED arrays can also be used to project a media facade for decorative motion or video effects. Together with tracking sensors and / or cameras, selective illumination of the area around a pedestrian can be possible. Spectrally different emitters can be used to adjust the color temperature of the lighting and to support horticultural lighting with specific wavelengths.

[0020] Street lighting is an important application that can greatly benefit from the use of LED arrays. A single type of LED array can be used to mimic various streetlight types, and by appropriate activation or deactivation of the selected emitters, it can be possible to switch, for example, between a linear type-I streetlight and a semi-circular type-IV streetlight. Furthermore, by adjusting the intensity or distribution of the light beam according to environmental conditions or usage time, street lighting costs can be reduced. For example, the light intensity and distribution area can be reduced when no pedestrians are present. If the emitters are spectrally different, the respective color temperature of the light can be adjusted according to daylight, twilight, or nighttime conditions.

[0021] LED arrays are also well-suited to support applications that require direct or projected displays. For example, warning signs, emergency signs, or information signs can all be displayed or projected using LED arrays. This enables, for example, an exit sign with changing colors or flashing lights to be projected. If the LED array includes a large number of emitters, text or numerical information may be presented. Instruction arrows or similar indicators can also be provided.

[0022] A vehicle headlamp is an LED array application that requires a large number of pixels and a high data refresh rate. Automotive headlamps that actively illuminate only selected portions of the road can be used to reduce problems associated with the glare or eye dazzle of oncoming drivers. Using an infrared camera as a sensor, the LED array can activate only the emitters necessary to illuminate the road while deactivating emitters that could dazzle the eyes of pedestrians or oncoming vehicle drivers. Also, to enhance the driver's environmental awareness, pedestrians, animals, or signs outside the road can be selectively illuminated. If the emitters are spectrally different, the respective color temperatures of the light may be adjusted according to daylight, twilight, or nighttime conditions. Some emitters may be used for optical wireless vehicle-to-vehicle communication.

[0023] A silicon backplane may be provided proximate to the LED array to drive or control the individual LEDs or emitters within the array. In some embodiments, the silicon backplane can include the following, namely, circuitry for receiving power from one or more sources to power various portions of the silicon backplane, circuitry for receiving image input from one or more sources to display an image through the LED array, circuitry for communication between the silicon backplane and an external controller (e.g., a vehicle headlamp control device, a general lighting control device, etc.), circuitry for generating a signal, such as a pulse width modulation (PWM) signal, for example, to control the operation of the individual LEDs or emitters within the array based on the received image input and communication received from an external source, and a number of LED drivers for driving the LEDs or emitters within the array individually based on the generated signal. In an embodiment, the silicon backplane can be a complementary metal oxide semiconductor (CMOS) backplane, which may include the same number of drivers as the LEDs or emitters within the corresponding LED array. In some embodiments, the silicon backplane may be an application specific integrated circuit (ASIC). In some embodiments, one driver may be provided for each group of some number of LEDs or emitters, and the control may be for the group of LEDs or emitters rather than individual ones. Each driver may be electrically coupled to the corresponding LED or emitter or group of multiple LEDs or emitters individually. While a silicon backplane has been described with respect to certain circuitry, it will be understood by those skilled in the art that a silicon backplane used to drive an LED array as described herein may include more, fewer, or different components that potentially perform different functions without departing from the embodiments described herein.

[0024] As described above, individual drivers within the silicon backplane can be electrically coupled to individual LEDs or emitters within the LED array or to groups of multiple LEDs or emitters. Accordingly, the LED array must be disposed in close proximity to the silicon backplane. In an embodiment, this can be accomplished by individually coupling copper pillar bumps or other connectors within an array of copper pillar bumps or connectors on the surface of the LED array to corresponding connectors on the opposing surface of the silicon backplane. A silicon backplane as described above can become very hot during operation, especially given that it is in close proximity to the LED array. Thus, heat dissipation can be a challenge in such devices. While several solutions for heat dissipation of semiconductor devices are known, such solutions often include structures that dissipate heat through the top of the device. However, due to the light emission from the LED array, heat dissipation through the top of the device may not be practical or possible. The embodiments described herein provide a structure that can enable effective and efficient heat dissipation through the bottom surface of the device.

[0025] Furthermore, an LED array, such as LED array 101, and an accompanying silicon backplane may require that a number of passive components, such as resistors, capacitors, and crystals, be disposed on a circuit board in close proximity to the silicon backplane. In addition to providing heat dissipation through the bottom surface of the device, the embodiments described herein can also provide an LED package that enables a number of passive components (e.g., 27 or more) to be disposed on the top surface of the circuit board in close proximity to the backplane and the LED array. Also, the embodiments described herein can provide a low-profile LED array package that can house one or more passive components and enable the dissipation of heat generated by the silicon backplane and the LED array.

[0026] Figure 2A is a cross-sectional view of an example of a hybrid device 210. In the example shown in Figure 2A, the hybrid device 210 includes a silicon backplane 214. The first surface 213 of an LED array 212, such as a μLED, for example, can be attached onto the first surface 215 of the silicon backplane 214. For simplicity of explanation, the first surface 215 of the silicon backplane 214 may herein be referred to as the top surface, and the first surface 213 of the LED array 212 may herein be referred to as the bottom surface. However, as will be understood by those skilled in the art, the first surface 215 can become the bottom surface when the hybrid device 210 is turned over, can become a side surface when the hybrid device 210 is placed horizontally, and so on. Similarly, the first surface 213 can become the top surface when the hybrid device 210 is turned over, can become a side surface when the hybrid device 210 is placed horizontally, and so on. As described above, an array of connectors (not shown) on the first surface 215 of the silicon backplane 214 can be soldered, reflowed, or otherwise electrically and mechanically coupled to an array of connectors on the bottom surface of the LED array 212. The array of connectors can be any array of connectors, such as an array of copper pillar bumps, for example. The LED array 212 can have a depth D2. In an embodiment, the depth D2 can be, for example, between 5 μm and 250 μm. The silicon backplane 214 can have a depth D3. In an embodiment, the depth D3 can be, for example, between 100 μm and 1 mm. The hybrid device 210 may also be referred to as a hybrid die.

[0027] Figure 2B is a cross-sectional view of an example of an LED package assembly 100 incorporating the hybrid device 210 of FIG. 2A. In the example shown in FIG. 2B, the hybrid device 210 is packaged within the package substrate 102. The LED package assembly 100 can use flip-chip interconnects for one or more of the interconnects described further herein and can be implemented in, for example, lighting systems (such as vehicle headlights and / or other lights) and / or display systems (such as computer displays, television displays, and / or other displays) that include light.

[0028] The substrate 102 can include a core material or can be formed from a core material. For example, the substrate 102 can be a high-density organic substrate such as a glass-reinforced epoxy laminate substrate, including FR-4 substrate material. The substrate 102 can include one or more conductive elements (not shown), such as, for example, conductive layers, wiring, vias, pads, or some combination thereof. The conductive elements can be dispersed within the core material and can provide electrical conduction through the substrate 102 and / or provide connection of other elements to the substrate. In some embodiments, the substrate 102 can have a thickness 112 of about 1 mm (within 0.1 millimeter (mm)).

[0029] The substrate 102 can have an opening (aperture) 104 formed in or through the substrate 102 and a recess 106 extending into the substrate 102. Here, the opening 104 and the recess 106 together may be referred to as an opening or a cavity, and the opening and the recess may be referred to as a first part and a second part of the opening. The opening 104 can be located on a first side 108 of the substrate 102. The recess 106 can extend into the substrate 102 from a second side 110 and can border the opening 104. Specifically, the recess 106 can extend from the second side 110 and partially extend through the substrate 102. The opening 104 can extend from the first side 108 of the substrate 102 to the recess 106, whereby the opening 104 is connected to the recess 106. The recess 106 can have a width 114, the opening 104 can have a width 116, and the width 114 of the recess 106 is greater than the width 116 of the opening 104. The substrate 102 can include an intermediate plane 118 located between a first surface or top surface 120 of the substrate 102 and a second surface or bottom surface 122 of the substrate 102. The intermediate plane 118 can border the recess 106 and project over the recess. In some embodiments, the intermediate plane 118 can be substantially (within 10 degrees) parallel to the first surface 120 and / or the second surface 122. The intermediate plane 118 can be about (within 10 μm) 500 μm from the first surface 120, and the portion of the substrate 102 located between the intermediate plane 118 and the first surface 120 can have a thickness 142 of about (within 10 μm) 500 μm. Also, the intermediate plane 118 can extend over a length 144 of about (within 0.1 mm) 1.027 mm from a side surface 146 of the recess 106. The intermediate plane 118 can be formed by the difference between the width 114 of the recess 106 and the width 116 of the opening 104.

[0030] The substrate 102 may include one or more pads 124 located on the intermediate surface 118. The pads 124 can be in contact with the recess 106 and can be used to couple components to the substrate 102 at the intermediate surface 118. The pads 124 can be formed of a conductive material (such as copper, silver, aluminum, alloys thereof, and / or combinations thereof) and can be coupled to other conductive elements of the substrate. Accordingly, the pads 124 can provide an electrical connection to components coupled to the substrate 102 via the pads 124.

[0031] The substrate 102 may further include one or more pads 126 located on the second surface 122 of the substrate 102. In some embodiments, the pads 126 may have an array of pads. For example, the pads 126 may have a land grid array (LGA) in some embodiments. In other embodiments, the pads 126 may have a ball grid array (BGA). The pads 126 can be used for electrical connection of the substrate 102 to an external circuit board. In an embodiment, the pads 126 are coupled to other conductive elements of the substrate, the LED array 212, and / or the silicon backplane 214 to create an electrical connection between the external circuit board, electronic components provided on the substrate 102, the LED array 212, and / or the silicon backplane 214.

[0032] The LED package assembly 100 may further include one or more electronic components 128 attached to the first surface 120 of the substrate 102. In some embodiments, the electronic component 128 can be a passive component such as, for example, a resistor, capacitor, inductor, other passive components, or combinations thereof. In other embodiments, the electronic component 128 can have passive components, active components, or combinations thereof. The electronic component 128 can be coupled to one or more of the conductive elements of the substrate 102, thereby also being coupled to one or more of the pads 126, the silicon backplane 214, the LED array 212, and / or other electronic components 128.

[0033] The hybrid device 210 can be coupled to the substrate 102 and can also be electrically coupled to one or more of the electronic component 128 and the pad 126 via the conductive elements of the substrate 102. The silicon backplane 214 can be coupled to the substrate 102 via the pad 124. The silicon backplane 214 can be located partially or completely within the recess 106. In some embodiments, the silicon backplane 214 can have a thickness 140 of about 725 μm (within about 10 micrometers (μm)), and the silicon backplane 214 can extend beyond the second surface 122 of the substrate 102 by about 325 μm (within about 10 μm) and out of the recess 106. In some embodiments, the silicon backplane 214 can have a thickness between 300 microns and 750 microns. Also, in some embodiments, the side surface 156 of the silicon backplane 214 can be located about 500 μm (within about 10 μm) from the side surface 146 of the recess 106. The LED die 212 can be coupled to the first side 136 of the silicon backplane 214 and can be located between the first surface 120 of the substrate 102 and the silicon backplane 214. In some embodiments, the LED die 212 can be partially located within the opening 104.

[0034] The LEDs or segments of the LED array 212 can be directed through the opening 104, and the light emitted by the LEDs or segments can be directed through the opening 104. In some embodiments, the edge of the LED array 212 and the edge of the first surface 120 of the substrate 102 that abuts the opening 104 can be spaced apart by a certain distance that allows the light emitted by the LEDs of the LED array 212 to be radiated at an angle 138 with respect to the edge of the LED array 212. In some embodiments, the angle 138 can be about 45 degrees (within about 10 degrees). In other embodiments, the LED package assembly 100 can be designed at different angles with respect to the angle 138 at which light can be radiated from the LED array 212.

[0035] The LED package assembly 100 may further include one or more flip-chip interconnects 148 that couple the hybrid device 210 to the substrate 102. Specifically, the flip-chip interconnect 148 can couple the silicon backplane 214 to the pad 124 of the substrate 102. The flip-chip interconnect 148 can be or include one or more solder bump joints, one or more copper pillar bump joints, or some combination thereof. The flip-chip interconnect 148 can be conductive and electrically couple the silicon backplane 214 to the substrate 102 to provide electrical coupling and / or signal exchange between the silicon backplane 214 and one or more of the electronic component 128 and the pad 126 through conductive elements (not shown) within the substrate 102. In some embodiments, the flip-chip interconnect 148 can maintain the distance between the intermediate surface 118 and the first side 136 of the silicon backplane 214. For example, the flip-chip interconnect 148 can have a thickness 150 of about 100 μm (within 10 μm) in some embodiments. Also, the flip-chip interconnect 148 can be located at a distance 152 of about 340 μm (within 10 μm) from the side surface 154 of the opening 104 and / or at a distance of about 0.187 μm (within 10 μm) from the side surface 156 of the silicon backplane 214.

[0036] Utilizing the flip-chip interconnect 148 to couple the silicon backplane 214 to the pad 124 of the substrate 102 can provide one or more advantages over other coupling means. For example, the flip-chip interconnect 148 can provide better thermal performance. Further, the flip-chip interconnect 148 can provide interconnects with a smaller pitch, which can enable a higher density of interconnects. Those skilled in the art may recognize further advantages of utilizing the flip-chip interconnect 148.

[0037] The LED package assembly 100 may further include an underfill material 158 that can cover at least the flip-chip interconnects 148. For example, the underfill material 158 can surround each of the flip-chip interconnects 148 to prevent the flip-chip interconnects 148 from being exposed. The underfill material 158 can be, or can include, an electrically insulating material that can prevent a short circuit between the flip-chip interconnects 148 or, in some embodiments, between the flip-chip interconnects 148 and other conductive elements. Also, the underfill material 158 can provide physical support for the bond between the silicon backplane 132 and the substrate 102. In some embodiments, the underfill material 158 may be omitted. In other embodiments, the underfill material 158 may cover a larger surface area than shown in FIG. 2B, for example, by filling more of the empty space between the hybrid device 210 and the substrate 102.

[0038] The LED package assembly 100 can include a circuit board 160. The circuit board 160 can be coupled to the substrate 102 via pads 126. The board 160 can include circuitry that can provide control signals provided to the hybrid device 210 and / or other data such as, for example, image data, and the image data can affect the operation of the LED array 212. The circuit board 160 can include an integrated heat sink 164. This integrated heat sink 164 can be made of a thermally conductive material such as, for example, copper, or can include it. The integrated heat sink 164 can be positioned adjacent to the silicon backplane 214 and can be thermally coupled to a second side 162 of the silicon backplane 214 that is opposite the first side 136, and can provide cooling for the silicon backplane 214. The direct coupling between the silicon backplane 214 and the integrated heat sink 164 enables better heat dissipation of the hybrid device 210 and also enables heat dissipation through the bottom surface of the hybrid device 210 rather than through the top surface, and as a result, efficient heat dissipation can be achieved without interfering with the light emission from the LED array 212.

[0039] FIG. 2C is a top view of an example of the hybrid device 210 of FIGS. 2A and 2B according to some embodiments. In the example shown in FIG. 2C, the hybrid device 210 includes an LED array 212 and a silicon backplane 214. The silicon backplane 214 can be coupled to the LED array 212, such as, for example, by being coupled by one or more interconnects (such as solder bump joints and / or copper pillar bump joints).

[0040] As can be seen in FIG. 2C, the silicon backplane 214 can have a footprint larger than the footprint of the LED array 212, such that a portion of the silicon backplane 214 extends beyond the footprint of the LED array 212. The silicon backplane 214 can include one or more pads 206. The pads 206 can be located on a portion of the silicon backplane 214 that extends beyond the footprint of the LED array 212 on the surface of the silicon backplane 214. The pads 206 can be coupled to circuitry within the silicon backplane 214 and can be used to couple components to the silicon backplane 214. For example, a flip chip interconnect 148 can be coupled to the pads 206 and can be used to couple the substrate 102 to the silicon backplane 214.

[0041] FIG. 3 is a flow diagram of an example of a method 300 for manufacturing an LED package assembly. For example, the procedure 300 can be used to manufacture the LED package assembly 100.

[0042] The method 300 can begin with a substrate. For example, FIG. 4 is a cross-sectional view of an example of a substrate 400 that can be used in the method 300 of FIG. 3 according to some embodiments. The substrate 400 can include one or more of the features of the substrate 102. For example, the substrate 400 can include one or more pads 402 located on a second surface 404 of the substrate, and the pads 402 can include one or more of the features of the pads 126. Additionally, the substrate 400 can include one or more pads 406, and the pads 406 can include one or more of the features of the pads 124. The pads 406 can be embedded within the substrate 400 when the method 300 is initiated. The substrate 400 can be manufactured using a substrate manufacturing process such as, for example, a build-up process.

[0043] A recess can be formed in the substrate (302). In an embodiment, the recess can be formed by a mechanical cutting process such as, for example, a routing process. Specifically, a mechanical cutting process can be applied to the surface of the substrate to remove a portion of the material from the substrate, thereby forming the recess. The recess formed by the mechanical cutting process extends from the surface of the substrate into the substrate to one or more pads embedded in the substrate, where the mechanical cutting process exposes the pads.

[0044] FIG. 5 is a cross-sectional view of an example of a product 500 fabricated by forming a recess in a substrate according to the method of FIG. 3. The recess 502 can be formed in the substrate 400 by a mechanical cutting process 302. The recess 502 can include one or more of the features of the recess 106. The mechanical cutting process can be applied to the second surface 404 of the substrate 400 to generate the recess 502. The mechanical cutting process can be applied to a portion of the second surface 404 located between the pads 402. The recess 502 extends into the substrate 400 from the second surface 404 of the substrate 400 to the pad 406, thereby exposing the pad 406. Further, forming the recess 502 can create an intermediate surface 504 of the substrate 400, and the intermediate surface 504 can include one or more of the features of the intermediate surface 118. For example, the pad 406 can be located on the intermediate surface 504 and exposed in the recess 502.

[0045] An opening can be formed in the substrate (304). The opening can be formed by a mechanical cutting process such as, for example, a routing process. Specifically, a mechanical cutting process can be applied to the surface of the substrate to remove a portion of the material from the substrate, thereby forming an opening in the substrate. The opening formed can extend from the recess through the surface of the substrate opposite the recess.

[0046] FIG. 6 is a cross-sectional view of an example of a manufactured product 600 produced by forming an opening in a substrate according to the method of FIG. 3. The opening 602 may be formed in the substrate 400 by the machining process of step 304. The opening 602 may include one or more of the features of the opening 104. The machining process may be applied to the intermediate surface 504 or the first surface 604 of the substrate 400 to create the opening 602. The machining process for forming the opening 602 may use a tool that is narrower than the machining process for forming the recess 502, thereby allowing the opening 602 to have a width narrower than the recess 502. The opening 602 may extend through the substrate 400 from the intermediate surface 504 to the first surface 604. The opening 602 may be located between the pads 406 of the substrate 400.

[0047] In the example method shown in FIG. 3, the recess 502 is shown as being formed prior to forming the opening 602, but it should be understood that in other embodiments the order may be reversed. Specifically, in other embodiments the opening 602 may be formed before the recess 502. The opening 602 may be formed through the substrate 400 from the first surface 604 to the second surface 404. After the opening 602 is formed in the substrate 400, the recess 502 may be formed from the second surface 404.

[0048] A hybrid device may be positioned within the recess (306). For example, an LED array of the hybrid device may be oriented towards the opening of the substrate, and the silicon backplane of the hybrid device may be positioned within the recess of the substrate. When positioned within the recess, the silicon backplane may be partially or fully located within the recess. Also, the LED array may be able to be positioned within the recess and / or may be partially located within the opening. The LED array may be positioned between the silicon backplane and the first surface of the substrate. The LED array may be coupled to the surface of the silicon backplane. The silicon backplane may be aligned with the pads of the substrate located on the intermediate surface adjacent to the recess so that the silicon backplane can be coupled to the pads via flip-chip interconnects.

[0049] FIG. 7 is a cross-sectional view of an example of a manufactured product 700 produced by positioning a hybrid device within a substrate according to the method of FIG. 3. In the example shown in FIG. 7, the hybrid device 702 is positioned within the recess 502 of the substrate 400. The hybrid device 702 can include one or more of the features of the integrated LED 130. The silicon backplane 704 of the hybrid device 702 can be positioned within the recess 502. For example, the silicon backplane 704 can be positioned partially or fully within the recess 502. In some embodiments, a portion of the silicon backplane 704 may extend beyond the second surface 404 and outside the recess 502. The LED array 706 of the hybrid device 702 can be coupled to the silicon backplane 704 and can be directed toward the opening 602. The LED array 706 can be positioned within the recess 502 and / or can be partially positioned within the opening 602. The LED array 706 can be positioned between the silicon backplane 704 and the first surface 604. The silicon backplane 704 can be aligned with the pad 406 of the substrate 400 such that the silicon backplane 704 can be coupled to the pad via a flip-chip interconnect. Specifically, a portion of the silicon backplane 704 can be disposed adjacent to the intermediate surface 504 where the pad 406 is located.

[0050] The hybrid device can be coupled to the substrate via one or more flip-chip interconnects (308). For example, a flip-chip interconnect can be formed between a pad on an intermediate surface of the substrate and the silicon backplane of the integrated LED. The flip-chip interconnect can electrically couple the hybrid device and the substrate. The flip-chip interconnect can have solder bump joints or copper pillar bump joints. In some embodiments, the flip-chip interconnect can be formed by a wave flow process.

[0051] FIG. 8 is a cross-sectional view of an example of a manufactured product 800 produced by coupling a hybrid device to a substrate via one or more flip-chip interconnects according to the method of FIG. 3. One or more flip-chip interconnects 802 may be formed between the hybrid device 702 and the substrate 400. The flip-chip interconnect 802 may include one or more of the features of the flip-chip interconnect 148. The flip-chip interconnect 802 can be formed between the silicon backplane 704 and the pad 406 at the intermediate surface 504 of the substrate 400. The flip-chip interconnect 802 can electrically couple the silicon backplane 704 to the pad 406 and provide for the exchange of signals between the hybrid device 702 and the substrate 400. The flip-chip interconnect 802 may have solder bump joints or copper bump joints.

[0052] An underfill material may be formed around the flip-chip interconnect (310). The underfill material can surround the flip-chip interconnect and prevent the flip-chip interconnect from being exposed. The underfill material provides electrical insulation around the flip-chip interconnect, thereby preventing an electrical short circuit between the flip-chip interconnect and / or other electrical components of the LED package assembly. The underfill material can further provide physical support for the flip-chip interconnect, thereby helping to maintain the physical bond between the substrate and the integrated LED.

[0053] FIG. 9 is a cross-sectional view of an example of a manufactured article 900 fabricated by forming an underfill material around a flip-chip interconnect according to the method of FIG. 3. The underfill material 902 can be formed around the flip-chip interconnect 802. The underfill material 902 can include one or more of the features of the underfill material 158. The underfill material 902 can surround each of the flip-chip interconnects 802, thereby preventing exposure of the flip-chip interconnects 802. For example, the underfill material 902 can surround each of the flip-chip interconnects 802. The underfill material 902 can have an electrically insulating material that can prevent a short circuit between the flip-chip interconnects 802 and / or other electrical components of the LED package assembly. The underfill material 902 can extend between the substrate 400 and the hybrid device 702 and can physically couple the substrate 400 and the hybrid device 702. The underfill material 902 can provide physical support between the substrate 400 and the hybrid device 702. Specifically, the underfill material 902 can assist in maintaining a physical bond between the substrate 400 and the hybrid device. In other embodiments, the underfill material 902 may be omitted, and the step 310 that creates the underfill material 902 may be omitted.

[0054] An electronic component can be coupled to the substrate (312). For example, an electronic component can be coupled to a first surface of the substrate. The electronic component can be, or can include, a passive component, an active component, or some combination thereof.

[0055] FIG. 10 is a cross-sectional view of an example of a manufactured product 1000 produced by bonding electronic components to a substrate according to the method of FIG. 3. One or more electronic components 1002 may be bonded to the first surface 604 of the substrate 400. The electronic component 1002 may include one or more of the features of the electronic component 128. The electronic component 1002 can be electrically coupled to the substrate 400, thereby enabling signals to be exchanged between the electronic component and the substrate. In other embodiments, the electronic component 1002 may be omitted, and the stage 312 that bonds the electronic component 1002 to the substrate 400 may be omitted.

[0056] A circuit board can be coupled to the substrate (314). Specifically, the circuit board can be coupled to pads of the substrate, and the pads are located on the second surface of the substrate. The coupling of the circuit board to the pads of the substrate can maintain the position of the circuit board and provide an electrical connection between the circuit board and the substrate. The circuit board may include an integrated heat sink. The integrated heat sink can be located adjacent to the silicon backplane and can be thermally coupled to the silicon backplane. In some embodiments, coupling the circuit board to the substrate may include applying a thermal transfer compound between the silicon backplane and the integrated heat sink.

[0057] FIG. 11 is a cross-sectional view of an example of a product 1100 fabricated by coupling a circuit board to a substrate according to the method of FIG. 3. Specifically, product 1100 may be a completed LED package assembly according to some embodiments. Circuit board 1102 may be coupled to substrate 400. Circuit board 1102 may include one or more of the features of circuit board 160. Specifically, circuit board 1102 may be coupled to pad 402 of substrate 400. The coupling of circuit board 1102 to pad 402 may maintain the position of circuit board 1102 and provide an electrical connection between circuit board 1102 and substrate 400. Further, substrate 400 may provide an electrical connection between circuit board 1102 and hybrid device 702. Circuit board 1102 may include an integral heat sink 1106. Integral heat sink 1106 may be positioned in contact with surface 1104 opposite the LED array 706 of silicon backplane 704. Integral heat sink 1106 may be thermally coupled to silicon backplane 704 and may facilitate cooling of hybrid device 702. In some embodiments, a thermal transfer compound may be applied between integral heat sink 1106 and silicon backplane 704 to assist in heat transfer between integral heat sink 1106 and hybrid device 702. In some embodiments, integral heat sink 1106 may be omitted from circuit board 1102.

[0058] FIG. 12 is a block diagram of an example of a system 1200 that includes an LED package assembly. For example, system 1200 may include a lighting system or a display system that utilizes LED package assembly 1202 to provide illumination and / or display. In some embodiments, system 1200 can be, or can include, a vehicle headlight, a light, a handheld device (such as a smartphone, a smartwatch, and / or an electronic organizer, etc.), a display for a system (such as a computer display and / or a television display, etc.), or some combination thereof. Although the components of system 1200 are illustrated, it should be understood that in some embodiments, system 1200 may include additional components and / or alternative components that perform the functions of the components described.

[0059] System 1200 may include a controller 1204. Controller 1204 may determine an image to be displayed by the LEDs of LED package assembly 1202. For example, controller 1204 can include, or be coupled to, a processor that can indicate an image to be displayed by an LED or a segment. The image can be a user interface to be displayed by the LEDs, an arrangement of light, a certain intensity of light, one or more symbols, or some combination thereof. Controller 1204 may generate image data indicative of the image to be displayed by the LEDs and provide the image data to components of system 1200. The image data can be, or can include, a signal indicative of the image to be generated by the LEDs.

[0060] System 1200 may include an LED package assembly 1202. The LED package assembly 1202 may include one or more of the features of the LED package assembly 100. For example, the LED package assembly 1202 can include a substrate, such as substrate 102, to which a hybrid device 1206 can be coupled via one or more flip-chip interconnects, such as flip-chip interconnect 148. The hybrid device 1206 may include one or more of the features of the hybrid device 210. For example, the hybrid device 1206 can include a silicon backplane 1208 and an LED array 1210, where the silicon backplane 1208 can include one or more of the features of the silicon backplane 214 and the LED array 1210 can include one or more of the features of the LED array 212. The LED array 1210 may include one or more LEDs, μLEDs, and / or segments that provide light and / or display for the system 1200.

[0061] The silicon backplane 1208 may include a controller 1212. The controller 1212 can be coupled to the controller 1204 and can receive image data from the controller 1204. Based on the image data received from the controller 1204, the controller 1212 can determine an image to be displayed by the LEDs of the LED array 1210. The controller 1212 can determine actions to be taken by the LED devices 1210 and the LEDs or segments of the LED array 1210 to generate the image, and can cause the LED array 1210 and the LEDs or segments of the LED devices 1210 to take those actions. For example, the controller 1212 can determine when each of the LEDs or segments of the LED array 1210 should be turned on to generate the image, and can turn on the LEDs or segments according to the time when the LEDs or segments should be turned on (e.g., by activating corresponding switches of the silicon backplane 2108 to turn on the LEDs or segments). Also, the controller 1212 can determine the intensity and / or color of the light to be emitted by the LEDs, and can cause the LEDs to emit the determined light intensity and / or light color.

[0062] FIG. 13 is a block diagram of another example system 1300. In some embodiments, the system 1300 can be part of, or can include, a vehicle headlamp system in some embodiments. For example, the system 1300 can be, or can include, an adaptive headlamp system in some embodiments, and the intensity and / or the image of the light output by the system 1300 can be varied. The system 1300, or a part thereof, can be within a vehicle, within a headlamp of the vehicle, or a combination thereof. The system 1300 can implement a pixelated configuration enabled by an array of LEDs.

[0063] System 1300 can be coupled to vehicle bus 1302 and power source 1304. Power source 1304 can provide power to system 1300. Bus 1302 can be coupled to one or more components that can provide data and / or utilize data provided to system 1300. The data provided on bus 1302 can be related to environmental conditions around the vehicle (e.g., time, whether it is raining, foggy, ambient light level, and other environmental data), the state of the vehicle (e.g., whether the vehicle is parked, the vehicle is in operation, the current speed of the vehicle, the current direction of travel of the vehicle, etc.), and / or the presence / position of other vehicles or pedestrians around the vehicle. System 1300 can provide feedback (e.g., information regarding the operation of the system, etc.) to the components.

[0064] System 1300 may further include sensor module 1306. In some embodiments, sensor module 1306 may include one or more sensors that can sense the surroundings of the vehicle. For example, the one or more sensors can sense the surrounding conditions that can affect an image generated by light emitted by system 1300. In some embodiments, these sensors can sense the environmental conditions around the vehicle and / or the presence / position of other vehicles or pedestrians around the vehicle. Sensor module 1306 may operate in combination with the data provided on bus 1302, or alternatively, may operate in place of a portion of the data provided on bus 1302 (e.g., environmental conditions and / or the presence / position of other vehicles or pedestrians, etc.). Sensor module 1306 can output data indicative of what is sensed by the sensors.

[0065] System 1300 may further include a transceiver 1308. The transceiver 1308 may have, in some embodiments, a universal asynchronous receiver-transmitter (UART) interface or a serial peripheral interface (SPI). The transceiver 1308 can be coupled to the bus 1302 and the sensor module 1306 and can receive data from the bus 1302 and the sensor module 1306. In some embodiments, the transceiver 1308 can multiplex the data received from the bus 1302 and the sensor module 1306 and can direct feedback to the bus 1302 or the sensor module 1306.

[0066] System 1300 may further include a processor 1310. The processor 1310 can be coupled to the transceiver 1308 to exchange data with the transceiver 1308. For example, the processor 1310 can receive from the transceiver 1308 data provided by the bus 1302 and / or the sensor module 1306. The processor 1310 can generate image data indicative of an image to be generated by light emitted from the system 1300. The processor 1310 may further generate one or more queries requesting information from one or more of the components of the system. The processor 1310 can further provide to the transceiver 1308 feedback directed to the bus 1302 or the sensor module 1306.

[0067] System 1300 may further include a vehicle headlamp 1312. The headlamp 1312 can be or include an active headlamp in some embodiments, and the active headlamp can generate a plurality of different light outputs. The headlamp 1312 may include an illumination system 1314. The illumination system 1314 may include an LED package assembly, such as the LED package assembly 100, or a part thereof. For example, the illumination system 1314 may include a substrate 102 and a hybrid device 210 in some embodiments. The headlamp 1312 is coupled to the processor 1310 and can exchange data with the processor 1310. In particular, the illumination system 1314 is coupled to the processor 1310 and can exchange data with the processor 1310. The illumination system 1314 can receive image data and queries from the processor 1310 and can provide feedback to the processor 1310.

[0068] System 1300 may further include power protection 1316. The power protection 1316 is coupled to the power source 1304 and can receive power from the power source. The power protection 1316 may include one or more filters that can reduce conductive radiation and provide power tolerance. In some embodiments, the power protection 1316 can provide electrostatic discharge (ESD) protection, load dump protection, alternator field decay protection, reverse polarity protection, or some combination thereof.

[0069] System 1300 may further include a processor power supply 1318. The processor power supply 1318 is coupled to the power protection 1316 and can receive power from the power source 1304. The processor power supply 1318 may have a low dropout (LDO) regulator that can generate power for supplying power to the processor 1310 from the power provided by the power source 1304. The processor power supply 1318 is further coupled to the processor 1310 and can provide power to the processor 1310.

[0070] System 1300 may further include a power supply 1320. The power supply 1320 may be coupled to the power protection 1316 to receive power from the power source 1304. In some embodiments, the power supply 1320 may have a converter that converts the power from the power source 1304 into power for the headlamp 1312. For example, the power supply 1320 may have a DC (direct current)-DC converter that converts the power from the power supply 1320 from a first voltage to a second voltage for the lighting system 1314 of the headlamp 1312.

[0071] FIG. 14 is a block diagram of another example lighting system 1400 according to some embodiments. For example, the system 1300 of FIG. 13 may include one or more of the features of the lighting system 1400. The lighting system 1400 may be implemented in a headlamp such as the headlamp 1312 of FIG. 13, for example.

[0072] The lighting system 1400 may include a control unit 1402. The control unit 1402 may be coupled to a processor such as the processor 1310 of FIG. 13, for example. The control unit 1402 can receive image data and queries from the processor. The control unit 1402 can further provide feedback to the processor.

[0073] The controller 1402 may include a digital interface 1404. The digital interface 1404 may facilitate communication between the processor and other components within the lighting system 1400. For example, the digital interface 1404 can be, or include, an SPI interface in some embodiments, and the SPI interface can assist with communication.

[0074] The control unit 1402 may further include an image processor 1406. The image processor 1406 can receive image data via the digital interface 1404, process the image data, and generate an indication indicating a pulse width modulation (PWM) duty cycle and / or light intensity for causing the illumination system 1400 to generate an image represented by the image data.

[0075] The control unit 1402 may further include a frame buffer 1408 and a standby image storage 1410. The frame buffer 1408 can receive the indication generated by the image processor 1406 and store the indication for implementation. The standby image storage 1410 can further store an indication of the PWM duty cycle and / or light intensity. The indication stored in the standby image storage 1410 can be used when there is no indication stored in the frame buffer 1408. For example, when the frame buffer 1408 is empty, the frame buffer 1408 can retrieve the indication from the standby image storage 1410.

[0076] The controller 1402 may further include a PWM generator 1412. The PWM generator 1412 can receive an indication from the frame buffer 1408 and generate a PWM signal according to the indication. The PWM generator 1412 can further determine the light intensity based on the indication and generate a signal for creating that light intensity.

[0077] The lighting system 1400 may include a μLED array 1414. The μLED array 1414 can include a plurality of pixels, each including a pixel unit 1416. Specifically, the pixel unit 1416 may include an LED 1418, a PWM switch 1420, and a current source 1422. The pixel unit 1416 may receive a signal from the PWM generator 1412. The PWM signal from the PWM generator 1412 may open and close the PWM switch 1420 according to the value of the PWM signal. A signal corresponding to the light intensity may cause a current for generating the corresponding light intensity in the LED 1418 to be generated in the current source 1422.

[0078] The lighting system 1400 may further include an LED power supply 1424. The LED power supply 1424 can be coupled to the power supply 1320 of FIG. 13 and receive power from the power supply 1320. The LED power supply 1424 can generate power for the LEDs of the μLED array 1414. The LED power supply 1424 can be coupled to the μLED array 1414 to provide power for the LEDs to the μLED array 1414.

[0079] FIG. 15 is an example of a hardware configuration 1500 for implementing the system 1300 of FIG. 13 according to some embodiments. In particular, the hardware configuration 1500 may show the hardware components that can implement the system 1300.

[0080] The hardware configuration 1500 may include an LED package assembly 1512. The LED package assembly 1512 may be manufactured by the method 300 of FIG. 3. The LED package assembly 1512 may include one or more of the features of the LED package assembly 100 of FIG. 1. For example, the LED package assembly 1512 may include a hybrid device 1508 having a silicon backplane 1504 and an LED array 1502. The LED array 1502 can be coupled to the silicon backplane by one or more interconnects 1510, and the interconnects 1510 may provide for signal transmission between the LED die 1502 and the silicon backplane 1504. The interconnects 1510 may have one or more solder bump joints, one or more copper pillar bump joints, or some combination thereof.

[0081] The LED array 1502 may also include circuitry for implementing the μLED array 1414 of FIG. 14. In particular, the LED array 1502 may include a plurality of pixels of the μLED array 1414. The LED array 1502 can include a shared active layer and a shared substrate for the μLED array 1414, whereby the μLED array 1414 can be a monolithic μLED array. Each pixel of the μLED array 141414 may include an individual segmented active layer and / or substrate. Thus, the LED array 1502 may be a monolithic die having a segmented surface where corresponding pixels of the μLED array 1214 occupy each segment of the surface. In some embodiments, the LED array 1502 may further include a PWM switch and a current source for the μLED array 1414. In other embodiments, the PWM switch and the current source may be included in the silicon backplane 1504.

[0082] The silicon backplane 1504 may include circuitry for implementing the controller 1402 of FIG. 14 and the LED power supply 1424 of FIG. 14. The silicon backplane 1504 can utilize the interconnect 1510 to provide a PWM signal and an intensity signal to the μLED array 1414, and can generate light in accordance with the PWM signal and its intensity in the μLED array 1414.

[0083] The LED package assembly 1512 may further include a substrate 1516. The substrate 1516 may be coupled to the silicon backplane 1504 via one or more flip-chip interconnects 1518. The flip-chip interconnects 1518 may include one or more of the features of the flip-chip interconnect 148.

[0084] The hardware configuration 1500 may further include a circuit board 1506. The circuit board 1506 may include one or more of the features of the circuit board 160 of FIG. 1. The circuit board 1506 may include circuitry for implementing one or more of the power protection 1316 of FIG. 13, the power supply 1320 of FIG. 13, the processor power supply 1318 of FIG. 13, the sensor module 1306 of FIG. 13, the transceiver 1308 of FIG. 13, the processor 1310 of FIG. 13, or a portion thereof. The circuit board 1506 can be coupled to the substrate 1516, and the substrate 1516 can assist in communication between the circuit board 1506 and the hybrid device 1508. For example, the circuit board 1506 can be coupled to the substrate 1516 via pads 1520 in the illustrated embodiment. The circuit board 1506 and the silicon backplane 1504 can exchange, among other signals, image data, power, and / or feedback via coupling through the substrate 1516.

[0085] Although embodiments have been described in detail, those skilled in the art will understand that the embodiments described herein can be modified without departing from the spirit of the inventive concept given this specification. Accordingly, it is not intended that the scope of the invention be limited to the specific embodiments illustrated and described.

Claims

1. A light-emitting diode (LED) package assembly, comprising: a substrate having a top surface, a bottom surface, and an opening formed through the substrate, the opening having a first portion adjacent to the top surface and a second portion adjacent to the bottom surface that is wider than the first portion, and a part of the substrate overhanging on the second portion of the opening; a plurality of pads on the bottom surface of the part of the substrate overhanging on the second portion of the opening; a hybrid device within the opening; a silicon backplane having a top surface, a bottom surface, and a plurality of interconnects on the top surface of the silicon backplane, the silicon backplane being an integrated circuit (IC) die, the plurality of interconnects being electrically coupled to the plurality of pads and having a thickness that maintains a predetermined distance between the bottom surface of the part of the substrate overhanging on the second portion of the opening and the top surface of the silicon backplane; and an LED array on the top surface of the silicon backplane; a hybrid device having the above; and an LED package assembly having the above.

2. The LED package assembly according to claim 1, wherein the plurality of interconnects have at least one of solder bump joints or copper pillar bump joints.

3. The LED package assembly according to claim 1, wherein the LED array is between the top surface of the substrate and the silicon backplane.

4. The LED package assembly according to claim 1, wherein the entire silicon backplane is within the second portion of the opening.

5. A part of the LED array is within the first portion of the opening such that the top surface of the LED array is below the top surface of the substrate and the outer edge of the LED array is spaced from the inner edge of the substrate in contact with the first portion of the opening in the substrate, so that light is radiated at a predetermined angle. The LED package assembly according to claim 1.

6. The LED package assembly according to claim 1, further comprising a heat sink thermally coupled to the bottom surface of the silicon backplane.

7. The LED package assembly according to claim 1, wherein the LED array is a monolithic array having a plurality of light-emitting segments.

8. The LED package assembly according to claim 1, wherein the predetermined distance is about 100 μm.

9. The LED package assembly according to claim 5, wherein the predetermined angle is about 45°.

10. The LED package assembly according to claim 1, further comprising a plurality of contact pads on the bottom surface of the substrate, configured to electrically couple at least one of the silicon backplane, the LED array, or the passive components on the top surface of the substrate to an external control board.

11. A light-emitting diode (LED) package assembly, A substrate having a top surface, a bottom surface, and a cavity, An integrated circuit (IC) die coupled to the substrate by one or more flip-chip interconnects, the IC die being at least partially disposed within the cavity, An LED array coupled to the IC die, the LED array being at least partially disposed between the IC die and the surface of the substrate located on the opposite side of the IC die, and A plurality of contact pads on the bottom surface of the substrate, configured to electrically couple at least one of the IC die, the LED array, or the passive components on the top surface of the substrate to an external control board. An LED package assembly having, A circuit board coupled to the LED package assembly, the circuit board having a processor configured to provide image data representing an image to be displayed by the LED package assembly to the LED package assembly. A vehicle headlamp system having.

12. The vehicle headlamp system according to claim 11, wherein the one or more flip-chip interconnects have one or more solder bump joints or one or more copper pillar bump joints, the one or more flip-chip interconnects electrically couple the IC die to one or more pads of the substrate, the one or more flip-chip interconnects have a thickness that maintains a predetermined distance between the bottom surface of the portion of the substrate that overhangs the top surface of the IC die and the top surface of the IC die, and the one or more pads are in contact with the cavity.

13. The cavity has a first portion extending from a first surface of the substrate and a second portion extending from a second surface of the substrate into the substrate, the second surface being on the opposite side of the substrate from the first surface, the second portion of the cavity being wider than the first portion of the cavity, and the LED array being between the first surface and the IC die, the vehicle headlamp system according to claim 11.

14. The thickness of the IC die is between 300 microns and 750 microns, the vehicle headlamp system according to claim 11.

15. The IC die has a controller, the LED array has one or more LEDs coupled to the controller, and the controller is configured to cause the one or more LEDs to display the image indicated by the image data, the vehicle headlamp system according to claim 11.

16. The circuit board has a monolithic heat sink in contact with a bottom surface of the IC die, the vehicle headlamp system according to claim 11.

17. A method of manufacturing a light-emitting diode (LED) package assembly, forming an opening in the substrate through a top surface of the substrate, forming a recess in the substrate through a bottom surface of the substrate such that a portion of the substrate adjacent to the opening overhangs the recess to form an intermediate surface of the substrate, positioning a hybrid device at least partially within the recess and coupling the hybrid device to the intermediate surface via one or more flip-chip interconnects having a thickness to maintain a predetermined distance between the intermediate surface of the substrate and a top surface of the hybrid device, comprising wherein the hybrid device has a silicon backplane that is an integrated circuit (IC) die and an LED array coupled to the silicon backplane, method.

18. Coupling the hybrid device to the intermediate surface comprises positioning the silicon backplane at least partially within the recess, positioning the LED array at least partially within the opening, and forming the one or more flip-chip interconnects between the silicon backplane and the intermediate surface, the method according to claim 17.

19. Forming the recess in the substrate comprises removing a portion of the substrate by a mechanical cutting process, and removing the portion of the substrate exposes one or more pads on the intermediate surface, and the one or more flip chip interconnects couple the silicon backplane to the one or more pads, the method of claim 17.

20. Forming the opening in the substrate comprises removing a portion of the substrate by a mechanical cutting process to form the opening, the method of claim 17.

Images