Processing device and processing method, machining method, and also, modeling device and modeling method

Abstract

To provide a processing device capable of properly processing to a surface of a molded article which is molded.MEANS: A processing device performs processing for irradiating an object with energy beam, and the device comprises: an energy beam irradiating unit for irradiating at least a part of a surface of an object with the energy beam; and a position changing unit for changing an irradiation position of the energy beam in a surface of the object, in the processing device, the irradiation position of the energy beam is controlled on the basis of shape information related to a shape of an object.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the technical fields of, for example, a processing apparatus and a processing method for irradiating an object with an energy beam, a processing method, and a shaping apparatus and a shaping method.

Background Art

[0002] Patent Document 1 describes a shaping apparatus that forms a shaped object by melting a powdery material with an energy beam and then re-solidifying the melted material. The shaping apparatus described in Patent Document 1 removes the powdery material adhering to the shaped object after forming the shaped object. In such a shaping apparatus, it is a technical problem to perform appropriate processing on the surface of the shaped object.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect, there is provided a processing apparatus that performs a process of irradiating an object with an energy beam, the processing apparatus including: an energy beam irradiation device that irradiates at least a part of the surface of the object with the energy beam; and a position changing device that changes an irradiation position of the energy beam on the surface of the object, the processing apparatus controlling the irradiation position of the energy beam using shape information regarding the shape of the object.

[0005] According to a second aspect, there is provided a processing apparatus that performs a process of irradiating an object with an energy beam, the processing apparatus including: an energy beam irradiation device that irradiates an energy beam onto a first portion of the surface of the object and a second portion of the surface of the object that is oriented in a direction different from the first portion; a posture changing device that changes the posture of the object with respect to the irradiation direction of the energy beam; and a position changing device that changes the irradiation position of the energy beam on the surface of the object. The processing apparatus sets the posture of the object to a first posture such that the first portion faces a first direction and irradiates the first portion with the energy beam, and sets the posture of the object to a second posture different from the first posture such that the second portion faces a second direction and irradiates the energy beam.

[0006] According to a third aspect, there is provided a processing apparatus that processes a shaped object formed by irradiating a first surface of a member with a shaping energy beam to form a molten pool on the first surface and supplying a shaping material to the molten pool, the processing apparatus irradiating a processing energy beam onto at least a part of a second surface of the shaped object oriented in a second direction intersecting a first direction in which the member and the shaped object are aligned.

[0007] According to a fourth aspect, there is provided a processing apparatus including: a light source that supplies an energy beam; a condensing optical system that condenses the energy beam from the light source onto an object; a material supply unit that supplies a shaping material to a condensing position of the energy beam via the condensing optical system; a position changing device that changes a relative positional relationship between the condensing position and the object; and a control device that controls the position changing device to supply the shaping material to the condensing position while changing the relative positional relationship between the condensing position and the object to shape an object as a shaped object. The processing apparatus irradiates the object with the energy beam via the condensing optical system, and the optical path of the energy beam from the light source that is condensed onto the object within the condensing optical system and the optical path of the energy beam irradiated onto the object within the condensing optical system are the same optical path.

[0008] According to a fifth aspect, in a processing method for performing a process of irradiating an object with an energy beam, irradiating at least a part of the surface of the object with the energy beam and changing an irradiation position of the energy beam on the surface of the object are included, and a processing method for changing the irradiation position of the energy beam using shape information regarding the shape of the object is provided.

[0009] According to a sixth aspect, in a processing method for performing a process of irradiating an object with an energy beam, setting the posture of the object to a first posture so that a first part of the surface of the object faces a first direction and irradiating the first part with the energy beam, and setting the posture of the object to a second posture different from the first posture so that a second part of the surface of the object facing a direction different from the first part faces a second direction, and irradiating the second part with the energy beam are included.

[0010] According to a seventh aspect, there is provided a processing method for processing a shaped object formed by irradiating a first surface of a member with a shaping energy beam to form a molten pool on the first surface and supplying a shaping material to the molten pool, including irradiating at least a part of a second surface of the shaped object directed in a second direction intersecting a first direction in which the member and the shaped object are arranged with a processing energy beam.

[0011] According to an eighth aspect, there is provided a processing method including shaping a shaped object by irradiating a first surface of a member with a shaping energy beam to form a molten pool on the first surface and supplying a shaping material to the molten pool, and irradiating at least a part of a second surface of the shaped object directed in a second direction intersecting a first direction in which the member and the shaped object are arranged with a processing energy beam.

[0012] According to a ninth aspect, there is provided a processing method including: supplying an energy beam; condensing the energy beam onto an object using a condensing optical system; supplying a shaping material to a condensing position where the energy beam is condensed; shaping an object as a shaped object by supplying the shaping material to the condensing position while changing a relative positional relationship between the condensing position and the object; and irradiating the object with the energy beam through the condensing optical system, wherein an optical path of the energy beam from a light source that condenses onto the object within the condensing optical system and an optical path of the energy beam that irradiates the object within the condensing optical system are the same optical path.

[0013] The operations and other advantages of the present invention will become apparent from the following embodiments for carrying out the invention.

Brief Description of the Drawings

[0014]

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[0015] Hereinafter, embodiments of a processing apparatus, a processing method, a machining method, a modeling apparatus, and a modeling method will be described with reference to the drawings. Hereinafter, a modeling system 1 capable of forming a three-dimensional structure ST by performing additive processing using a modeling material M by laser metal deposition (LMD: Laser Metal Deposition) will be used to describe embodiments of the processing apparatus, the processing method, the machining method, the modeling apparatus, and the modeling method. Note that the laser metal deposition (LMD) may also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas-through-wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, or laser rapid forming.

[0016] In the following description, the positional relationship of various components constituting the modeling system 1 will be described using an XYZ orthogonal coordinate system defined by an X axis, a Y axis, and a Z axis that are orthogonal to each other. In the following description, for convenience of explanation, it is assumed that the X-axis direction and the Y-axis direction are each a horizontal direction (that is, a predetermined direction in a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane, and substantially a vertical direction). Also, the rotation directions (in other words, the inclination directions) around the X axis, the Y axis, and the Z axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Also, the XY plane may be the horizontal direction.

[0017] (1) Structure of the shaping system 1 First, with reference to FIGS. 1 and 2(a) to 2(b), the overall structure of the modeling system 1 of the present embodiment will be described. FIG. 1 is a block diagram showing an example of the structure of the modeling system 1 of the present embodiment. Each of FIGS. 2(a) and 2(b) is a side view showing the structure of the modeling device 4 included in the modeling system 1 of the present embodiment (however, for convenience of explanation, a part is a cross-sectional view).

[0018] The modeling system 1 can form a three-dimensional structure (that is, a three-dimensional object having a size in any direction in the three-dimensional direction, a three-dimensional object) ST. The modeling system 1 can form the three-dimensional structure ST on a work W that serves as a basis (that is, a base material) for forming the three-dimensional structure ST. The modeling system 1 can form the three-dimensional structure ST by performing additional processing on the work W. When the work W is the stage 43 described later, the modeling system 1 can form the three-dimensional structure ST on the stage 43. When the work W is an existing structure held by the stage 43, the modeling system 1 can form the three-dimensional structure ST on the existing structure. In this case, the modeling system 1 may form a three-dimensional structure ST integrated with the existing structure. The operation of forming a three-dimensional structure ST integrated with the existing structure is equivalent to the operation of adding a new structure to the existing structure. Alternatively, the modeling system 1 may form a three-dimensional structure ST separable from the existing structure. Note that FIG. 2 shows an example in which the work W is an existing structure held by the stage 43. Also, hereinafter, the description will proceed using an example in which the work W is an existing structure held by the stage 43.

[0019] As described above, the shaping system 1 can form the three-dimensional structure ST by laser cladding welding. That is to say, the shaping system 1 can also be said to be a 3D printer that forms an object using additive manufacturing technology. Incidentally, additive manufacturing technology is also referred to as Rapid Prototyping, Rapid Manufacturing, or Additive Manufacturing.

[0020] To form the three-dimensional structure ST, as shown in FIG. 1, the shaping system 1 includes a material supply device 3, a shaping device 4, a light source 5, a gas supply device 6, and a control device 7. The material supply device 3, the shaping device 4, the light source 5, the gas supply device 6, and the control device 7 are housed in the housing C. In the example shown in FIG. 1, the shaping device 4 is housed in the upper space UC of the housing C, and the material supply device 3, the light source 5, the gas supply device 6, and the control device 7 are housed in the lower space LC of the housing C located below the upper space UC. However, the arrangement positions of the material supply device 3, the shaping device 4, the light source 5, the gas supply device 6, and the control device 7 within the housing C are not limited to the arrangement positions shown in FIG. 1.

[0021] The material supply device 3 supplies the shaping material M to the shaping device 4. The material supply device 3 supplies a desired amount of the shaping material M corresponding to the required amount so that the amount of the shaping material M required per unit time for the shaping device 4 to form the three-dimensional structure ST is supplied to the shaping device 4.

[0022] The shaping material M is a material that can be melted by irradiation with light EL having a predetermined intensity or more. As such a shaping material M, for example, at least one of a metallic material and a resinous material can be used. However, other materials different from the metallic material and the resinous material may be used as the shaping material M. The shaping material M is a powdery or granular material. That is to say, the shaping material M is a powder or granule. However, the shaping material M does not have to be a powder or granule, and for example, a wire-shaped shaping material or a gaseous shaping material may be used.

[0023] The shaping device 4 processes the shaping material M supplied from the material supply device 3 to form the three-dimensional structure ST. Further, the shaping device 4 performs a process of processing at least a part of the surface of the formed three-dimensional structure ST. Therefore, the shaping device 4 substantially functions also as a processing device (that is, a processing apparatus that performs a process for processing) for processing at least a part of the surface of the three-dimensional structure ST. To form and process the three-dimensional structure, as shown in FIGS. 2(a) and 2(b), the shaping device 4 includes a shaping head 41, a head drive system 42, a stage 43, a stage drive system 44, and a measuring device 45. Further, the shaping head 41 includes an irradiation system 411 and a material nozzle (that is, a supply system that supplies the shaping material M) 412. The shaping head 41, the head drive system 42, the stage 43, the stage drive system 44, and the measuring device 45 are housed in the chamber 46.

[0024] The irradiation system 411 is an optical system (for example, a condensing optical system) for emitting the light EL from the emission part 413. Specifically, the irradiation system 411 is optically connected via a light transmission member (not shown) such as an optical fiber or a light pipe to the light source 5 that emits the light EL. The irradiation system 411 emits the light EL propagated from the light source 5 via the light transmission member. The irradiation system 411 irradiates the light EL downward (that is, toward the -Z side) from the irradiation system 411. The stage 43 is disposed below the irradiation system 411. When the workpiece W is mounted on the stage 43, the irradiation system 411 can irradiate the workpiece W with the light EL. Specifically, the irradiation system 411 irradiates the light EL onto a circular (or any other shape) irradiation region EA set on the workpiece W as a region where the light EL is irradiated (typically, condensed). Further, the state of the irradiation system 411 can be switched between a state of irradiating the light EL onto the irradiation region EA and a state of not irradiating the light EL onto the irradiation region EA under the control of the control device 7. Note that the direction of the light EL emitted from the irradiation system 411 is not limited to directly downward (that is, coinciding with the -Z axis direction), and may be, for example, a direction inclined by a predetermined angle with respect to the Z axis.

[0025] The material nozzle 412 has a supply outlet 414 for supplying the modeling material M. The material nozzle 412 supplies (specifically, injects, ejects, sprays) the modeling material M from the supply outlet 414. The material nozzle 412 is physically connected to a material supply device 3 that is a supply source of the modeling material M via a powder transmission member such as a pipe (not shown). The material nozzle 412 supplies the modeling material M supplied from the material supply device 3 via the powder transmission member. Incidentally, in FIGS. 2(a) to 2(b), the material nozzle 412 is depicted in a tube shape, but the shape of the material nozzle 412 is not limited to this shape. The material nozzle 412 supplies the modeling material M downward (that is, toward the -Z side) from the material nozzle 412. A stage 43 is disposed below the material nozzle 412. When the workpiece W is mounted on the stage 43, the material nozzle 412 supplies the modeling material M toward the workpiece W. Incidentally, the traveling direction of the modeling material M supplied from the material nozzle 412 is a direction inclined by a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, but it may be on the -Z side (that is, directly below).

[0026] In the present embodiment, the material nozzle 412 is aligned with the irradiation system 411 so as to supply the modeling material M toward the irradiation region EA where the irradiation system 411 irradiates the light EL. That is, the material nozzle 412 and the irradiation system 411 are aligned so that the supply region MA set on the workpiece W as the region where the material nozzle 412 supplies the modeling material M coincides with (or at least partially overlaps) the irradiation region EA. Incidentally, the material nozzle 412 may be aligned so as to supply the modeling material M to the melting pool MP formed on the workpiece W by the light EL emitted from the irradiation system 411.

[0027] The head drive system 42 moves the shaping head 41. To move the shaping head 41, the head drive system 42 includes a head drive system 42X, a head drive system 42Y, and a head drive system 42Z. The head drive system 42X moves the shaping head 41 along the X-axis. The head drive system 42Y moves the shaping head 41 along the Y-axis. The head drive system 42Z moves the shaping head 41 along the Z-axis. That is, the head drive system 42 moves the shaping head 41 along each of the X-axis, Y-axis, and Z-axis. When the shaping head 41 moves along each of the X-axis and Y-axis, the irradiation region EA (and further the supply region MA) moves on the workpiece W along each of the X-axis and Y-axis. Incidentally, the head drive system 42 may be configured to rotatably move the shaping head 41 along the rotation axes around the X-axis and the Y-axis.

[0028] Each of the head drive systems 42X, 42Y, and 42Z is a drive system including, for example, a voice coil motor, but may also be a drive system including other motors (or drive sources). The head drive system 42X is fixed to a support frame 423 installed via a vibration isolation device such as an air spring on the bottom surface of the chamber 46 and includes an X guide portion 421X extending along the X axis, a stator (for example, one of a magnet and a coil) fixed to the X guide portion 421X, and a voice coil motor 422X including a mover (for example, the other of a magnet and a coil) fixed to a later-described Y guide portion 421Y. The head drive system 42Y includes a Y guide portion 421Y to which the mover of the voice coil motor 422X is fixed and extends along the Y axis, a stator (for example, one of a magnet and a coil) fixed to the Y guide portion 421Y, and a voice coil motor 422Y including a mover (for example, the other of a magnet and a coil) fixed to a later-described Z guide portion 421Z. The head drive system 42Z includes a Z guide portion 421Z to which the mover of the voice coil motor 422Y is fixed and extends along the Z axis, a stator (for example, one of a magnet and a coil) fixed to the Z guide portion 421Z, and a voice coil motor 422Z including a mover (for example, the other of a magnet and a coil) fixed to the shaping head 41. When the voice coil motor 422X is driven, the Y guide portion 421Y (and further, the shaping head 41 connected to the Y guide portion 421Y via the Z guide portion 421Z) moves along the X guide portion 421X (that is, along the X axis). When the voice coil motor 422Y is driven, the Z guide portion 421Z (and further, the shaping head 41 connected to the Z guide portion 421Z) moves along the Y guide portion 421Z (that is, along the Y axis). When the voice coil motor 422Z is driven, the shaping head 41 moves along the Z guide portion 421Z (that is, along the Z axis). Note that the support frame 423 is installed in the chamber via a vibration isolation device for reducing vibration from the floor on which the shaping system 1 is installed or vibration from outside the chamber within the shaping system 1. However, for example, if vibration from outside the chamber 46 within the shaping system 1 can be ignored, it may be provided between the shaping system 1 and the floor. If the vibration conditions of this floor are good (low vibration), the vibration isolation device may not be provided.

[0029] The stage 43 can hold the workpiece W. Further, the stage 43 can release the held workpiece W. The above-described irradiation system 411 irradiates light EL at least in part of the period during which the stage 43 holds the workpiece W. Further, the above-described material nozzle 412 supplies the modeling material M at least in part of the period during which the stage 43 holds the workpiece W. Note that part of the modeling material M supplied by the material nozzle 412 may scatter or spill from the surface of the workpiece W to the outside of the workpiece W (for example, around the stage 43). For this reason, the modeling system 1 may include a recovery device that recovers the scattered or spilled modeling material M around the stage 43. Note that the stage 43 may include a mechanical chuck, a vacuum suction chuck, or the like in order to hold the workpiece W.

[0030] The stage drive system 44 moves the stage 43 (changes the posture of the stage 43). In order to move the stage 43, the stage drive system 44 includes a stage drive system 44θY and a stage drive system 44θZ. The stage drive system 44θY moves the stage 43 along the θY axis. In other words, the stage drive system 44θY rotates the stage 43 around the Y axis. The stage drive system 44θZ moves the stage 43 along the θZ axis. In other words, the stage drive system 44θZ rotates the stage 43 around the Z axis. That is, the stage drive system 44 moves the stage 43 along each of the θY axis and the θZ axis. Note that in the examples shown in FIGS. 2(a) and 2(b), the θY axis is set so as to penetrate the workpiece W (so that the θY axis substantially coincides with the upper surface of the stage 43), but the present invention is not limited thereto, and the θY axis may be set above or below the workpiece (above the upper surface of the stage 43 (+Z side), or below the upper surface of the stage 43 (-Z side)).

[0031] Each of the stage drive system 44θY and the stage drive system 43θZ is a drive system including, for example, a rotary motor, but may also be a drive system including other motors (or drive sources). The stage drive system 44θY includes a plate-shaped holding member 441θY that holds the stage 43, a plate-shaped wall member 442θY that protrudes in the +Z direction from the +Y side end and the -Y side end of the holding member 441θY, a rotary motor 443θY having a rotor that can rotate around the Y axis, and a connecting member 444θY that connects the rotor of the rotary motor 443θY and the wall member 442θY. The rotary motor 443θY is fixed to a support frame 445 that is installed on the bottom surface of the chamber 46 via a vibration isolation device such as an air spring. The stage drive system 44θZ includes a rotary motor 443θZ having a rotor that can rotate around the Z axis and is connected to the stage 43. The rotary motor 443θZ is fixed to the holding member 441θY. When the rotary motor 443θY is driven, the holding member 441θY (and further the stage 43 held by the holding member 441θY) rotates around the Y axis. When the rotary motor 44θZ is driven, the holding member 441θY (and further the stage 43 held by the holding member 441θY) rotates around the Y axis. When the rotary motor 443θZ is driven, the stage 43 rotates around the Z axis. When the rotary motor 44θZ is driven, the holding member 441θY (and further the stage 43 held by the holding member 441θY) rotates around the Y axis. Incidentally, the support frame 445 is installed in the chamber via a vibration isolation device for reducing vibration from the floor on which the modeling system 1 is installed or vibration from outside the chamber 46 within the modeling system 1. However, for example, if the vibration from outside the chamber 46 within the modeling system 1 can be ignored, it may be provided between the modeling system 1 and the floor. If the vibration conditions of this floor are good (low vibration), the vibration isolation device may not be necessary.

[0032] When the stage 43 moves along each of the θY axis and the θZ axis (rotates about each of the θY axis and the θZ axis), the relative position of the stage 43 with respect to the irradiation system 411 (more specifically, at least one of the work W held by the stage 43 and the three-dimensional object ST) changes. More specifically, when the stage 43 moves along at least one of the θY axis and the θZ axis, the posture of the stage 43 with respect to the irradiation system 411 (more specifically, at least one of the work W held by the stage 43 and the three-dimensional object ST) changes. The posture of the stage 43 (more specifically, at least one of the work W held by the stage 43 and the three-dimensional object ST) changes with respect to the emission direction of the light EL from the irradiation system 411. The posture of the stage 43 (more specifically, at least one of the work W held by the stage 43 and the three-dimensional object ST) changes with respect to the axis of the light EL heading toward the irradiation region EA from the irradiation system 411.

[0033] The measuring device 45 measures the shape of the three-dimensional structure ST formed by the modeling device 4. The measuring device 45 measures, for example, the shape of the surface of the three-dimensional structure ST. The measuring device 45 may measure the shape of the three-dimensional structure ST by, for example, a pattern projection method or a light cutting method in which a light pattern is projected onto the surface of the three-dimensional structure ST and the shape of the projected pattern is measured, a time-of-flight method in which light is projected onto the surface of the three-dimensional structure ST and the distance to the three-dimensional structure ST is measured from the time until the projected light returns, and this is performed at a plurality of positions on the three-dimensional structure ST, a moire topography method (specifically, a grating irradiation method or a grating projection method), a holographic interference method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, or a knife-edge method.

[0034] Note that the measuring device 45 may measure the shape of the work W (for example, the shape of its surface).

[0035] Again referring to FIG. 1, the light source 5 emits at least one of, for example, infrared light, visible light, and ultraviolet light as light EL. However, other types of light may be used as the light EL. The light EL is laser light. In this case, the light source 5 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of the laser light source may include a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the light EL does not have to be laser light, and the light source 5 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0036] The gas supply device 6 is a supply source of an inert gas. Examples of the inert gas include nitrogen gas or argon gas. The gas supply device 6 supplies the inert gas into the chamber 46 of the shaping device 4. As a result, the internal space of the chamber 46 becomes a space purged with the inert gas. Note that the gas supply device 6 may be a cylinder storing an inert gas such as nitrogen gas or argon gas, and when the inert gas is nitrogen gas, it may be a nitrogen gas generator that generates nitrogen gas using air as a raw material.

[0037] The control device 7 controls the operation of the modeling system 1. The control device 7 may include, for example, a CPU (Central Processing Unit) and a memory. In particular, in the present embodiment, the control device 7 controls the injection mode of the light EL by the irradiation system 411. The injection mode includes, for example, at least one of the intensity of the light EL and the injection timing of the light EL. When the light EL is pulsed light, the injection mode may include, for example, at least one of the length of the emission time of the pulsed light and the ratio of the emission time to the extinction time of the pulsed light (so-called duty ratio). Further, the control device 7 controls the movement mode of the modeling head 41 by the head drive system 42 and the movement mode of the stage 43 by the stage drive system 44. The movement mode includes, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing. Further, the control device 7 controls the supply mode of the modeling material M by the material nozzle 412. The supply mode includes, for example, the supply amount (particularly, the supply amount per unit time). Note that the control device 7 may not be provided inside the modeling system 1, and may be provided outside the modeling system 1 as a server or the like, for example.

[0038] (2) Operation of the shaping system 1 Next, the operation of the modeling system 1 will be described. In the present embodiment, as described above, the modeling system 1 performs a modeling operation for forming the three-dimensional structure ST. Further, the modeling system 1 performs a processing operation for processing at least a part of the surface of the three-dimensional structure ST formed by the modeling operation. Therefore, hereinafter, the modeling operation and the processing operation will be described in order.

[0039] (2-1) Shaping operation First, the modeling operation will be described. As described above, the modeling system 1 forms the three-dimensional structure ST by the laser cladding method. Therefore, the modeling system 1 may form the three-dimensional structure ST by performing an existing modeling operation compliant with the laser cladding method. Hereinafter, an example of the modeling operation of the three-dimensional structure ST by the laser cladding method will be briefly described.

[0040] The shaping system 1 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data of the three-dimensional structure ST to be formed (for example, CAD (Computer Aided Design) data, etc.). The three-dimensional model data includes data representing the shape of the three-dimensional structure ST (in particular, the three-dimensional shape). As the three-dimensional model data, measurement data of a three-dimensional object measured by a measuring device 45 provided in the shaping system 1, a three-dimensional shape measuring machine provided separately from the shaping system 1, for example, a contact-type three-dimensional coordinate measuring machine having a probe that can move relative to the workpiece and contact the workpiece, or a non-contact three-dimensional measuring machine (as an example, a three-dimensional measuring machine using the pattern projection method, the optical cutting method, the time-of-flight method, the moire topography method, the holographic interference method, the CT (Computed Tomography) method, the MRI (Magnetic Resonance Imaging) method, etc.) may be used. Alternatively, design data of the three-dimensional structure ST may be used as the three-dimensional model data. Incidentally, as the three-dimensional model data, for example, STL (Stereo Lithography) format, VRML (Virtual Reality Modeling Language) format, AMF (Additive Manufacturing File Format), IGES (Initial Graphics Exchange Specification) format, VDA-FS (Association of German Automotive Manufactures - Surfaces Interface) format, HP / GL (Hewlett-Packard Graphics Language) format, bitmap format, etc. can be used. The shaping system 1 forms, in order, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction in order to form the three-dimensional structure ST. For example, the shaping system 1 sequentially forms one by one the plurality of structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis direction.As a result, a three-dimensional structure ST, which is a stacked structure in which a plurality of structural layers SL are stacked, is formed. Hereinafter, the flow of the operation of forming the three-dimensional structure ST by sequentially forming the plurality of structural layers SL one by one will be described.

[0041] First, the operation of forming each structural layer SL will be described. Under the control of the control device 7, the shaping system 1 sets an irradiation region EA in a desired region on the shaping surface CS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL, and irradiates the irradiation region EA with light EL from the irradiation system 411. Note that the region occupied by the light EL irradiated from the irradiation system 411 on the shaping surface CS may be referred to as the irradiation region EA. In the present embodiment, the focus position (that is, the condensing position) of the light EL coincides with the shaping surface CS. As a result, as shown in FIG. 3(a), a melting pool (that is, a pool of metal melted by the light EL) MP is formed in a desired region on the shaping surface CS by the light EL emitted from the irradiation system 411. Further, under the control of the control device 7, the shaping system 1 sets a supply region MA in a desired region on the shaping surface CS, and supplies the shaping material M from the material nozzle 412 to the supply region MA. Here, since the irradiation region EA and the supply region MA coincide with each other as described above, the supply region MA is set in the region where the melting pool MP is formed. For this reason, as shown in FIG. 3(b), the shaping system 1 supplies the shaping material M from the material nozzle 412 to the melting pool MP. As a result, the shaping material M supplied to the melting pool MP melts. When the light EL is no longer irradiated to the melting pool MP as the shaping head 41 moves, the shaping material M melted in the melting pool MP is cooled and solidified (that is, solidifies) again. As a result, as shown in FIG. 3(c), the reshaped shaping material M is deposited on the shaping surface CS. That is, a shaped object is formed by the deposit of the reshaped shaping material M.

[0042] A series of shaping processes including the formation of the melting pool MP by irradiating light EL, the supply of the shaping material M to the melting pool MP, the melting of the supplied shaping material M, and the re-solidification of the melted shaping material M are repeated while relatively moving the shaping head 41 along the XY plane with respect to the shaping surface CS. When the shaping head 41 relatively moves with respect to the shaping surface CS, the irradiation region EA also relatively moves with respect to the shaping surface CS. Therefore, the series of shaping processes are repeated while relatively moving the irradiation region EA along the XY plane with respect to the shaping surface CS. At this time, the light EL is selectively irradiated to the irradiation region EA set in the region where the shaped object is desired to be formed, while not being selectively irradiated to the irradiation region EA set in the region where the shaped object is not desired to be formed (it can also be said that the irradiation region EA is not set in the region where the shaped object is not desired to be formed). That is, the shaping system 1 irradiates the shaping surface CS with the light EL at a timing according to the distribution pattern of the region where the shaped object is desired to be formed (that is, the pattern of the structural layer SL) while moving the irradiation region EA along a predetermined movement locus on the shaping surface CS. As a result, a structural layer SL corresponding to an aggregate of shaped objects made of the solidified shaping material M is formed on the shaping surface CS. Here, the irradiation region EA may be referred to as a set region. In the above description, the irradiation region EA is moved with respect to the shaping surface CS, but the shaping surface CS may also be moved with respect to the irradiation region EA.

[0043] The shaping system 1 repeatedly performs operations for forming such a structural layer SL under the control of the control device 7 based on three-dimensional model data. Specifically, first, the three-dimensional model data is sliced at a lamination pitch to create slice data. Note that data obtained by partially modifying this slice data may be used according to the characteristics of the shaping system 1. The shaping system 1 performs an operation for forming the first structural layer SL#1 on the shaping surface CS corresponding to the surface of the workpiece W based on the three-dimensional model data corresponding to the structural layer SL#1, that is, the slice data corresponding to the structural layer SL#1. As a result, as shown in FIG. 4(a), the structural layer SL#1 is formed on the shaping surface CS. Thereafter, the shaping system 1 sets the surface (that is, the upper surface) of the structural layer SL#1 as a new shaping surface CS, and then forms the second structural layer SL#2 on the new shaping surface CS. To form the structural layer SL#2, the control device 7 first controls the drive system 42 so that the shaping head 41 moves along the Z-axis. Specifically, the control device 7 controls the drive system 42 to move the shaping head 41 in the +Z direction so that the irradiation region EA and the supply region MA are set on the surface of the structural layer SL#1 (that is, the new shaping surface CS). Thereby, the focus position of the light EL coincides with the new shaping surface CS. Thereafter, the shaping system 1 forms the structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2 by the same operation as the operation for forming the structural layer SL#1 under the control of the control device 7. As a result, as shown in FIG. 4(b), the structural layer SL#2 is formed. Thereafter, the same operation is repeated until all the structural layers SL constituting the three-dimensional structure to be formed on the workpiece W are formed. As a result, as shown in FIG. 4(c), a three-dimensional structure is formed by a laminated structure in which a plurality of structural layers SL are laminated along the Z-axis (that is, along the direction from the bottom surface to the upper surface of the melting pool MP).

[0044] Note that after forming some of the structural layers SL and before forming all of the structural layers SL, the shape of the three-dimensional structure (e.g., the shape of its surface) may be measured using the measuring device 45. In that case, at least a part of the slice data used for the shaping of the subsequent structural layer SL may be corrected based on the results of the measuring device 45.

[0045] (2-2) Processing operation (polishing operation) Subsequently, the processing operation will be described. The shaping system 1 performs a processing operation for processing at least a part of the surface of the three-dimensional structure ST formed by the shaping operation by irradiating light EL on at least a part of the surface of the three-dimensional structure ST. In the following description, as an example of the processing operation, the description will proceed using a polishing operation for polishing at least a part of the surface of the three-dimensional structure ST. Hereinafter, the surface polished by the polishing operation is referred to as the polishing target surface PS.

[0046] In the present embodiment, the "polishing operation for polishing the polishing target surface PS" includes "an operation of making the polishing target surface PS smoother, increasing the flatness of the polishing target surface PS (i.e., making it flat), and / or making the surface roughness of the polishing target surface PS finer (i.e., smaller) as compared with before performing the polishing operation". Note that when the polishing target surface PS is polished, the color tone of the polishing target surface PS may change as compared with before the polishing target surface PS is polished. Therefore, the "polishing operation for polishing the polishing target surface PS" may include "an operation of changing the color tone of the polishing target surface PS as compared with before performing the polishing operation". When the polishing target surface PS is polished, at least one of the reflectance (e.g., the reflectance with respect to arbitrary light) and the diffusivity (e.g., the diffusivity with respect to arbitrary light) of the polishing target surface PS may change as compared with before the polishing target surface PS is polished. Therefore, the "polishing operation for polishing the polishing target surface PS" may include "an operation of changing at least one of the reflectance and the diffusivity of the polishing target surface PS as compared with before performing the polishing operation".

[0047] Hereinafter, the polishing target surface PS on which such a polishing operation is performed will be described with reference to FIGS. 5(a) and 5(b). FIG. 5(a) is a cross-sectional view showing a cross-section of the three-dimensional structure ST, and FIG. 5(b) is a perspective view showing the appearance of the three-dimensional structure.

[0048] As shown in FIGS. 5(a) and 5(b), the surface of the three-dimensional structure ST may include a plane (typically, a parallel plane) along the stacking direction (i.e., the Z-axis direction) of the plurality of structural layers SL that make up the three-dimensional structure ST. In this case, the surface to be polished PS may include a plane extending in the stacking direction of the structural layers SL. That is, the surface to be polished PS may include a surface to be polished PS1 along the stacking direction of the structural layers SL. In other words, the surface to be polished PS may include a surface to be polished PS1 facing a direction intersecting (in this case, particularly, orthogonal to) the stacking direction of the structural layers SL. The surface to be polished PS1 may include the surfaces of the plurality of structural layers SL. Further, the surface of the three-dimensional structure ST may include a plane inclined with respect to the stacking direction of the structural layers SL (i.e., intersecting at an angle other than 90 degrees with respect to the stacking direction of the structural layers SL). In this case, the surface to be polished PS may include a plane inclined with respect to the stacking direction of the structural layers SL. That is, the surface to be polished PS may include a surface to be polished PS2 inclined with respect to the stacking direction of the structural layers SL. In other words, the surface to be polished PS may include a surface to be polished PS2 facing a direction intersecting (but not orthogonal to) the stacking direction of the structural layers SL. The surface to be polished PS2 may include the surfaces of the plurality of structural layers SL. Further, the surface of the three-dimensional structure ST may include a plane orthogonal to the stacking direction of the structural layers SL (i.e., a plane along the XY plane). In this case, the surface to be polished PS may include a plane orthogonal to the stacking direction of the structural layers SL. That is, the surface to be polished PS may include a surface to be polished PS3 orthogonal to the stacking direction of the structural layers SL. In other words, the surface to be polished PS may include a surface to be polished PS3 facing the stacking direction of the structural layers SL. Incidentally, any of the surfaces to be polished PS1 to PS3 may be a plane including a flat surface or a surface including a curved surface. Incidentally, the stacking direction of the structural layers SL may be inclined with respect to the Z-axis direction. In this case, taking the surface to be polished PS2 as an example, the direction in the plane of the surface to be polished PS2 that includes a Z-direction component may be referred to as the stacking direction.

[0049] Such a surface PS to be polished may be a relatively rough surface (i.e., a surface with irregularities) that can be smoothed (or flattened or made finer in surface roughness) by polishing.

[0050] For example, as described above, in this embodiment, the three-dimensional structure ST is formed by melting and then re-solidifying the powdery or granular modeling material M. Therefore, there is a possibility that the unmelted modeling material M adheres to at least a part of the surface of the three-dimensional structure ST. In this case, the surface to which the unmelted modeling material M adheres can be a relatively rough surface that can be smoothed by a polishing operation. Furthermore, there is a possibility that the modeling material M that has re-solidified in an unintended shape adheres to at least a part of the surface of the three-dimensional structure ST. In this case, the surface to which the modeling material M that has re-solidified in an unintended shape adheres can be a relatively rough surface that can be smoothed by a polishing operation.

[0051] For example, as described above, in this embodiment, during the period when each structural layer SL is formed, the shaping head 41 moves along each of the X-axis and the Y-axis (i.e., along the XY plane). In this case, depending on the relative movement pattern of the shaping head 41 with respect to the shaping surface CS, regular or irregular unevenness corresponding to the movement pattern (typically, the pitch of the movement) of the shaping head 41 may appear on at least a part of the surface of the structural layer SL along the XY plane (and thus, the surface of the three-dimensional structure ST). In this case, the surface on which the regular or irregular unevenness appears can be a relatively rough surface that can be smoothed by a polishing operation.

[0052] For example, as described above, in the present embodiment, a three-dimensional structure ST is formed by laminating a plurality of structural layers SL. In this case, on the surface of the three-dimensional structure ST (particularly, a surface facing a direction intersecting the lamination direction of the structural layers SL, which is a surface along the lamination direction or an inclined surface), regular or irregular unevenness corresponding to the pitch of the lamination of the plurality of structural layers SL may appear. In this case, the surface on which the regular or irregular unevenness appears can be a relatively rough surface that can be smoothed by a polishing operation.

[0053] In order to perform a polishing operation on such a polishing target surface PS, the modeling system 1 first acquires shape information regarding the shape of the surface of the three-dimensional structure ST under the control of the control device 7. The shape information may include information regarding the measurement result of the measuring device 45. Further, the shape information may include information regarding the measurement result by a three-dimensional measuring device outside the modeling system 1. In this case, after the three-dimensional structure ST is formed by the modeling operation, the measuring device 45 measures the shape of the surface of the three-dimensional structure ST. Then, the measuring device 45 outputs the measurement result to the control device 7. Alternatively, the shape information may include information regarding the three-dimensional model data of the three-dimensional structure ST used in the modeling operation (that is, used when forming the three-dimensional structure ST) in addition to or instead of the information regarding the measurement result of the measuring device 45.

[0054] After acquiring the shape information, the modeling system 1 identifies the surface to be polished PS under the control of the control device 7. For example, the control device 7 may set at least a part of the surface of the three-dimensional structure ST along the lamination direction of the structural layer SL as the surface to be polished SP (that is, the surface to be polished SP1). For example, the control device 7 may set at least a part of the surface of the three-dimensional structure ST that is inclined with respect to the lamination direction of the structural layer SL as the surface to be polished SP (that is, the surface to be polished SP2). For example, the control device 7 may set at least a part of the surface of the three-dimensional structure ST that is orthogonal to the lamination direction of the structural layer SL as the surface to be polished SP (that is, the surface to be polished SP3). For example, the control device 7 may set at least a part of the outer surface of the three-dimensional structure ST (that is, the surface that constitutes the appearance of the three-dimensional structure ST and can be observed from the outside) as the surface to be polished SP. At this time, the control device 7 may also identify at least one of the relative position and posture of the surface to be polished PS with respect to at least one of the irradiation system 411 and the stage 43.

[0055] Thereafter, under the control of the control device 7, the shaping system 1 irradiates the polishing target surface PS with light EL to polish the polishing target surface PS. That is, in this embodiment, the polishing target surface PS is polished with light EL. Specifically, as shown in FIG. 6(a), the control device 7 sets an irradiation region EA in a certain region portion on the polishing target surface PS based on the shape information, and irradiates the irradiation region EA with light EL from the irradiation system 411. Note that FIG. 6(a) shows an example where the polishing target surface PS is a surface on which regular or irregular unevenness appears. At this time, the control device 7 moves at least one of the shaping head 41 and the stage 43 as necessary to set the irradiation region EA in a desired region portion on the desired polishing target surface PS. When the irradiation region EA is irradiated with light EL, as shown in FIG. 6(b), the shaping material M in the region portion of the polishing target surface PS where the irradiation region EA is set melts again by the light EL. When the shaping material M that was solidified to form unevenness melts, the surface (that is, the interface) of the melted shaping material M approaches a flat surface or becomes flat due to the action of at least one of the self-weight and surface tension of the melted shaping material M. That is, the smoothness of the surface (that is, the interface) of the melted shaping material M is improved. Thereafter, when the melted shaping material M is no longer irradiated with light EL as the shaping head 41 moves, the melted shaping material M is cooled and solidified again (that is, solidifies). As a result, as shown in FIG. 6(c), the shaping material M that has been re-solidified to have a smooth (or improved flatness and / or finer surface roughness) surface constitutes the surface of the three-dimensional structure ST. In this way, the polishing target surface PS is polished by the polishing operation.

[0056] The control device 7 repeatedly performs a series of polishing processes including melting of the shaping material M by such light irradiation EL and re-solidification of the melted shaping material M while relatively moving the shaping head 41 relative to the three-dimensional structure ST based on the shape information. That is, the control device 7 repeatedly performs a series of polishing processes while relatively moving the irradiation region EA relative to the polishing target surface PS based on the shape information.

[0057] However, as described above, the three-dimensional structure ST may include a plurality of polishing target surfaces PS that are non-parallel to each other (i.e., facing different directions). In this case, simply moving the shaping head 41 along at least one of the X-axis, Y-axis, and Z-axis may not be able to irradiate the entire polishing target surface PS with the light EL. For example, after irradiating the first polishing target surface PS, which is a flat surface, with the light EL and polishing the first polishing target surface PS, when polishing the second polishing target surface PS that is non-parallel to the first polishing target surface PS, it is difficult to irradiate the second polishing target surface PS with the light EL by simply moving the shaping head 41 along at least one of the X-axis, Y-axis, and Z-axis. More specifically, in the example shown in FIGS. 5(a) and 5(b), after irradiating any one of the polishing target surfaces PS1 to PS3 with the light EL and polishing any one of the polishing target surfaces PS1 to PS3, when polishing any other one of the polishing target surfaces PS1 to PS3, it is difficult to move the shaping head 41 to a position where it is possible to irradiate any other one of the polishing target surfaces PS1 to PS3 with the light EL by simply moving the shaping head 41 along at least one of the X-axis, Y-axis, and Z-axis.

[0058] Therefore, in the polishing operation, in addition to or instead of moving the shaping head 41, the control device 7 may relatively move the shaping head 41 and the three-dimensional structure ST by moving the stage 43. That is, the control device 7 repeatedly performs a series of polishing processes while relatively moving the irradiation area EA with respect to the polishing target surface PS and changing the posture of the three-dimensional structure ST with respect to the irradiation system 411 based on the shape information. Specifically, in the examples shown in FIGS. 5(a) and 5(b), the control device 7 moves the stage 43 so that the posture of the three-dimensional structure ST is in a first posture in which the polishing target surface PS1 faces a first direction in which the light EL can be irradiated onto any one of the polishing target surfaces PS1 to PS3 (for example, the polishing target surface PS1). Then, with the posture of the three-dimensional structure ST being in the first posture, the control device 7 repeatedly performs a series of polishing processes while relatively moving the irradiation area EA with respect to the polishing target surface PS1 based on the shape information. After the polishing of the polishing target surface PS1 is completed, the control device 7 moves the stage 43 so that the posture of the three-dimensional structure ST is in a second posture in which the polishing target surface PS2 faces a second direction in which the light EL can be irradiated onto any other one of the polishing target surfaces PS1 to PS3 (for example, the polishing target surface PS2). Then, with the posture of the three-dimensional structure ST being in the second posture, the control device 7 repeatedly performs a series of polishing processes while relatively moving the irradiation area EA with respect to the polishing target surface PS2 based on the shape information. Thereafter, the same operation is repeated until the polishing of all the polishing target surfaces PS is completed. As a result, the light EL can be irradiated onto any polishing target surface PS.

[0059] (2-3) Operating conditions in the polishing operation In the present embodiment, the control device 7 may perform the polishing operation so that a first operation condition regarding the light EL used in the polishing operation is satisfied. The control device 7 may perform the polishing operation so that, in addition to or instead of the first operation condition, a second operation condition regarding the polishing target surface PS is satisfied. Hereinafter, the first operation condition and the second operation condition will be described in order.

[0060] (2-3-1) First operating conditions regarding light EL (2-3-1-1) Light intensity condition regarding the intensity of light EL The first operation condition may include a light intensity condition regarding the intensity of the photo-EL (particularly, the intensity per unit area on the surface PS to be polished or the intensity per unit area within the irradiation region EA set on the surface PS to be polished; hereinafter, the same shall apply unless otherwise noted). Here, as the unit of the intensity of the photo-EL, fluence [W / cm 2 may be used. As shown in FIG. 7, the light intensity condition may include a first intensity condition that the intensity of the photo-EL used in the polishing operation is smaller than the intensity of the photo-EL used in the shaping operation. When the polishing operation is performed so as to satisfy the intensity condition including such a first intensity condition, the shaping material M will not be melted more than necessary by the irradiation of the photo-EL. Specifically, due to the irradiation of the photo-EL, relatively much shaping material M will not be melted to such an extent that the shape of the surface of the three-dimensional structure ST will change unintentionally. For example, relatively much shaping material M will not be melted to such an extent that the melted shaping material M will drip downward due to the irradiation of the photo-EL. Therefore, the shaping system 1 can perform the polishing operation without unintentionally changing the shape of the three-dimensional structure ST.

[0061] The light intensity condition may include a second intensity condition that the intensity of the photo-EL used in the polishing operation becomes a predetermined intensity that is not so high as to unintentionally change the shape of the surface of the three-dimensional structure ST due to melting relatively much shaping material M. However, as described above, in the present embodiment, the surface PS to be polished is polished by melting the shaping material M by the irradiation of the photo-EL. Therefore, if the intensity of the photo-EL used in the polishing operation becomes equal to or lower than the intensity at which the shaping material M cannot even be melted, the shaping system 1 will not be able to polish the surface PS to be polished by the irradiation of the photo-EL. Therefore, the predetermined intensity is a temperature that is high enough to be able to melt the shaping material M. Even when the polishing operation is performed so as to satisfy the light intensity condition including such a second intensity condition, the shaping system 1 can perform the polishing operation without unintentionally changing the shape of the three-dimensional structure ST.

[0062] As an example of a predetermined intensity used in the second strength condition, a value corresponding to N1 (%) (where N1 is greater than 0) of the intensity of the optical EL used in the shaping operation can be given. N1 may be, for example, less than 100, less than 70, less than 50, or less than 30. When N1 is less than 100, the second strength condition corresponds to a specific example of the first strength condition described above. Alternatively, as an example of a predetermined intensity, a value corresponding to 1 / N2 (where N2 is greater than 0) of the intensity of the optical EL used in the shaping operation can be given. N2 may be, for example, 1 or more, 2 or more, 3 or more, or 4 or more. When N2 is greater than 1, the second strength condition corresponds to a specific example of the first strength condition described above.

[0063] Also, the second strength condition may be determined, for example, based on experiments, simulations, or both. Also, the second strength condition may be determined based on the shaping material M.

[0064] To satisfy the light intensity condition, the control device 7 may control the intensity of the optical EL by controlling the light source 5. For example, the control device 7 may control the intensity of the optical EL emitted by the light source 5.

[0065] In order to satisfy the light intensity condition, the control device 7 may control the intensity of the light EL by controlling the irradiation system 411. For example, the control device 7 may control the intensity of the light EL by controlling the optical member included in the irradiation system 411 for controlling the intensity of the light EL. For example, the control device 7 may control the intensity of the light EL by controlling the optical member included in the irradiation system 411 for controlling the intensity distribution of the light EL within the irradiation region EA. As the optical member for controlling at least one of the intensity and the intensity distribution, for example, at least one of a filter having a required concentration distribution in a plane crossing the optical path of the light EL, an aspherical optical member (for example, a refractive optical member or a reflective optical member) having a required surface shape in a plane crossing the optical path of the light EL, a diffractive optical element, and a spatial light modulator can be used. For example, the control device 7 may control the intensity of the light EL by controlling the optical member included in the irradiation system 411 for controlling the focus position (in other words, the defocus amount) of the light EL. This is because the intensity of the light EL on the polishing target surface PS decreases as the focus position moves away from the polishing target surface PS (that is, as the defocus amount increases). Therefore, the control device 7 may control the focus position so that the focus position during the polishing operation is different from the focus position during the shaping operation. Specifically, the control device 7 may control the focus position so that the deviation amount (that is, the defocus amount) of the focus position from the polishing target surface PS during the polishing operation is larger than the deviation amount of the focus position from the shaping surface CS during the shaping operation. Incidentally, as the optical member for controlling the focus position, for example, a condensing optical element or the like can be used.

[0066] In order to satisfy the light intensity condition, the control device 7 may control the intensity of the light EL by controlling at least one of the head drive system 42 and the stage drive system 44. Specifically, the control device 7 may control at least one of the head drive system 42 and the stage drive system 44 so that the shaping head 41 (particularly, the irradiation system 411) moves along the Z-axis with respect to the surface PS to be polished. When the irradiation system 411 moves along the Z-axis with respect to the surface PS to be polished, the distance between the surface PS to be polished and the irradiation system 411 changes. When the distance between the surface PS to be polished and the irradiation system 411 changes, the focus position of the light EL with respect to the surface PS to be polished changes. Therefore, the operation of moving the irradiation system 411 with respect to the surface PS to be polished is equivalent to the operation of controlling the focus position of the light EL. In this case, the control device 7 may control at least one of the head drive system 42 and the stage drive system 44 so that the distance between the surface PS to be polished and the irradiation system 411 when the polishing operation is performed is larger than the distance between the shaping surface CS and the irradiation system 411 when the shaping operation is performed.

[0067] In order to satisfy the light intensity condition, the control device 7 may control the intensity of the light EL by controlling any characteristic of the light EL that correlates with the intensity of the light EL. As an example of such an arbitrary characteristic of the light EL, at least one of the size, shape, and position of the irradiation area EA on the surface PS to be polished can be mentioned. This is because when at least one of the size, shape, and position of the irradiation area EA on the surface PS to be polished changes, the intensity distribution of the light EL on the surface PS to be polished can change. For example, the larger the irradiation area EA, the smaller the intensity of the light within the irradiation area EA. Therefore, the control device 7 may control the size of the irradiation area EA so that the irradiation area EA used in the polishing operation is larger than the irradiation area EA used in the shaping operation. As a result, the first intensity condition that the intensity of the light EL used in the polishing operation is smaller than the intensity of the light EL used in the shaping operation is satisfied. Also, for example, the larger the irradiation area EA, the less time can be spent on the polishing operation. For example, the control device 7 may set an irradiation area EA that is larger than the irradiation area EA used in the shaping operation within a range that satisfies the second intensity condition.

[0068] Furthermore, when the three-dimensional structure ST to be polished is formed of different materials depending on the location, different light intensity conditions may be set for each position on the three-dimensional structure ST (polishing target surface PS) according to the characteristics of the forming material. Even when the three-dimensional structure ST is composed of one forming material M, different light intensity conditions may be set for each position on the polishing target surface PS within the range that satisfies the second intensity condition.

[0069] In the above description, the CW laser (Continuous Wave Laser) was taken into consideration and the explanation was made in terms of intensity. However, when a pulsed laser is used as the light source, instead of the intensity, the light intensity condition may be represented by the total energy contained in one pulse. That is, the first operating condition may be a light energy condition regarding the energy of the light EL (energy per unit area on the polishing target surface PS or energy per unit area within the irradiation region EA set on the polishing target surface PS; hereinafter, the same applies unless otherwise noted), and the condition that the energy of the light EL used in the polishing operation is smaller than the energy of the light EL used in the forming operation. Also, the second operating condition may be the condition that the energy of the light EL used in the polishing operation is greater than the energy that can melt the forming material M. Here, the energy of the light EL may be the integrated value of the intensity of the light EL per pulse [ΣW / cm 2 . When the light EL is pulsed light, the longer the emission time of the pulsed light (in other words, the shorter the extinction time of the pulsed light), the greater the intensity of the light EL on the irradiation region EA. Therefore, when the light EL is pulsed light, for example, the control device 7 may control the duty ratio of the light EL emitted by the light source 5.

[0070] (2-3-1-2) Irradiation size condition regarding the size of the irradiation area EA irradiated by light EL The first operating condition may include an irradiation size condition regarding the size of the irradiation region EA irradiated with the light EL (particularly, the size in the direction along the surface PS to be polished). As shown in FIG. 8, the irradiation size condition may include a first size condition that the size R1 of the irradiation region EA set in a certain region portion of the surface PS to be polished (specifically, the width of the irradiation region EA in the direction along the surface PS to be polished) is larger than the pitch R2 of the unevenness appearing in the region portion. Note that the pitch R2 of the unevenness means the distance between two adjacent concave portions sandwiching a certain convex portion (that is, the distance along the surface PS to be polished) or the distance between the center positions of two adjacent convex portions sandwiching a certain concave portion (that is, the distance along the surface PS to be polished). Note that the pitch R2 of the unevenness may mean the width of a certain convex portion along the surface PS to be polished or the width of a certain concave portion along the surface to be polished.

[0071] Here, if the irradiation size condition including the first size condition is not satisfied, the size R1 of the irradiation region EA becomes smaller than the pitch R2 of the unevenness appearing in the region portion. Therefore, as shown in FIGS. 9(a) and 9(b), only a part of one convex portion (or a part of one concave portion, the same applies hereinafter) within the irradiation region EA of the light EL is included. In other words, there is a possibility that the boundaries of a plurality of convex portions are not included in the irradiation region EA of the light EL. In this case, as shown in FIG. 9(a), after the first portion A1 of one convex portion is irradiated with the light EL and the first portion A1 is polished, as shown in FIG. 9(b), the second portion A2 of one convex portion is irradiated with the light EL and the second portion A2 is polished. As a result, since partial polishing is performed a plurality of times on the same convex portion, there is a possibility that the convex portion is not polished so that the first portion A1 and the second portion A2 are located in the same plane. That is, the macroscopic smoothness of the surface PS to be polished on which the polishing operation is performed may deteriorate relatively. However, even in this case, compared with the case where the polishing operation is not performed, the surface PS to be polished is still microscopically smooth.

[0072] However, when the polishing operation is performed so that the irradiation size condition including the first size condition is satisfied, as shown in FIG. 8, the entire of one convex portion (or the entire of one concave portion, the same shall apply hereinafter) within the irradiation region EA of the light EL is included. In other words, the boundaries of a plurality of convex portions are included within the irradiation region EA of the light EL. For this reason, by the irradiation of the light EL, the entire of one convex portion located within the irradiation region EA is polished collectively (see FIG. 6(c) described above). As a result, compared with the case where the polishing operation is performed so that the irradiation size condition including the first size condition is not satisfied, the polishing target surface PS is appropriately polished. That is, the unevenness remaining on the polishing target surface PS becomes relatively small. Therefore, the shaping system 1 can polish the polishing target surface PS so that the polishing target surface PS becomes a smoother surface.

[0073] As described above, irregular or regular unevenness corresponding to the pitch of the stacking of the plurality of structural layers SL may appear on the surface PS to be polished (see FIG. 10). Such unevenness is relatively likely to appear when the surface PS to be polished includes at least one of the surfaces PS1 and PS2 to be polished facing a direction intersecting the stacking direction of the structural layers SL. In this case, as shown in FIG. 10, the pitch R2 of the unevenness is equivalent to the height (i.e., thickness) H of the structural layer SL. Therefore, the irradiation size condition may include a second size condition that the size R1 of the irradiation area EA set in a certain area portion of the surface PS to be polished is larger than the height H of the structural layer SL formed in the area portion. When the polishing operation is performed so that the irradiation size condition including the second size condition is satisfied for at least one of the surfaces PS1 and PS2 to be polished facing a direction intersecting the stacking direction of the structural layers SL, as shown in FIG. 10, the irradiation area EA is set across a plurality of structural layers SL. That is, the irradiation area EA is set across a certain structural layer SL and at least one other structural layer SL formed on the structural layer SL. In other words, the irradiation area EA is set to include the boundary between a certain structural layer SL and at least one other structural layer SL formed on the structural layer SL. As a result, the entire one convex portion corresponding to the side end portion of the structural layer SL (or the entire one concave portion, the same applies hereinafter) is included in the irradiation area EA of the light EL. That is, the boundary between a certain structural layer SL and at least one other structural layer SL formed on the structural layer SL is irradiated with the light EL, and the certain structural layer SL and the at least one other structural layer SL are polished so that the boundary becomes inconspicuous. As a result, similar to the case where the polishing operation is performed so that the irradiation size condition including the first size condition is satisfied, the shaping system 1 can polish the surface PS to be polished so that the surface PS to be polished becomes a smoother surface.

[0074] However, the height H of the plurality of structural layers SL that make up the three-dimensional structure ST is not always the same. Specifically, as shown in FIG. 11, the height H1 of one structural layer SL that makes up the three-dimensional structure ST may be lower than the height H2 of another structural layer SL. In this case, when the second size condition that the size R1 of the irradiation region EA is larger than the height H1 of the relatively low structural layer SL is set, in some cases, as shown in FIG. 11, within the irradiation region EA of the light EL, the entire one convex portion (or the entire one concave portion, the same applies hereinafter) corresponding to the side end portion of the relatively high structural layer SL may not be included. For this reason, the irradiation size condition may include the third size condition that the size R1 of the irradiation region EA set in a certain region portion of the polishing target surface PS is larger than the height H (in the example shown in FIG. 11, the height H2) of the highest structural layer SL among the plurality of structural layers SL formed in the region portion. In this case, the shaping system 1 can polish the polishing target surface PS so that the polishing target surface PS becomes a smoother surface. Alternatively, the irradiation size condition may include the fourth size condition that the size R1 of the irradiation region EA set in a certain region portion of the polishing target surface PS is larger than the interval D1 (see FIG. 11) between the central positions (specifically, the central positions along the stacking direction of the structural layers SL) of two or more adjacent structural layers SL formed in the region portion. In other words, the irradiation size condition may include the fifth size condition that the size R1 of the irradiation region EA set in a certain region portion of the polishing target surface PS is larger than the average value of the heights of two or more adjacent structural layers SL formed in the region portion. In the example shown in FIG. 11, the fifth size condition may include the condition that the size R1 of the irradiation region EA is larger than "(H1 + H2) / 2", which is the average value of the height H1 of a certain structural layer SL and the height H2 of the structural layer SL formed on the certain structural layer SL. Alternatively, in the example shown in FIG. 11, the fifth size condition may include the condition that the size R1 of the irradiation region EA is larger than "(H1 + H3) / 2", which is the average value of the height H1 of a certain structural layer SL and the height H3 of a plurality of (two in the example shown in FIG. 11) structural layers SL formed on the certain structural layer SL.

[0075] In order to satisfy the irradiation size condition, the control device 7 may control the irradiation system 411. For example, the control device 7 may control the size of the irradiation region EA by controlling an optical member included in the irradiation system 411 to control the size of the irradiation region EA. As an example of such an optical member, for example, a condenser optical element capable of changing the condensing state by changing the position or posture, a diaphragm member capable of changing at least one of the shape and size of an aperture through which the light EL can pass, and a light shaping member capable of variably setting a region through which the light EL can pass and a region capable of blocking the light EL in a plane intersecting the optical axis of the irradiation system 411 (that is, a plane intersecting the propagation direction of the light EL), etc. can be mentioned. Alternatively, since the size of the irradiation region EA may also change when the relative position (particularly, the posture) of the surface PS to be polished with respect to the irradiation system 411 changes, the control device 7 controls at least one of the head drive system 42 and the stage drive system 44 to control the relative position (particularly, the posture) of the surface PS to be polished with respect to the irradiation system 411, thereby the size of the irradiation region EA may be controlled. When controlling the size of the irradiation region EA, the control device 7 may specify the pitch R2 of the unevenness appearing on the surface PS to be polished based on the above-described shape information, and control the size of the irradiation region EA so that the irradiation size condition determined according to the specified pitch R2 is satisfied. For this reason, the above-described shape information may include information regarding the shape of the unevenness appearing on the surface PS to be polished.

[0076] (2-3-1-3) Light direction condition regarding the direction of light EL toward the irradiation area EA The first operation condition may include a light direction condition regarding the direction of the light EL toward the irradiation region EA. The light direction condition may include a first light direction condition that the angle θ formed by the normal line NV of the polishing target surface PS where the irradiation region EA is set and the axis of the light EL toward the irradiation region EA does not change according to the position of the irradiation region EA. For example, as shown in FIG. 12(a), when the polishing target surface PS includes non-parallel polishing target surfaces PS#a, PS#b, and PS#c, the first light direction condition is that the angle θ#a formed by the normal line NV#a of the polishing target surface PS#a and the axis of the light EL irradiated on the polishing target surface PS#a, the angle θ#b formed by the normal line NV#b of the polishing target surface PS#b and the axis of the light EL irradiated on the polishing target surface PS#b, and the angle θ#c formed by the normal line NV#c of the polishing target surface PS#c and the axis of the light EL irradiated on the polishing target surface PS#c are all the same. For example, as shown in FIG. 12(b), when the polishing target surface PS is a curved surface, the first light direction condition is that the angle θ#d formed by the normal line NV#d of the first portion A#d of the polishing target surface PS and the axis of the light EL irradiated on the first portion A#d, and the angle θ#e formed by the normal line NV#e of the second portion A#e of the polishing target surface PS and the axis of the light EL irradiated on the second portion A#e are all the same. When the polishing operation is performed so that the light direction condition including the first light direction condition is satisfied, compared with the case where the polishing operation is performed so that the light direction condition including the first light direction condition is not satisfied, the shape of the spot of the light EL on the polishing target surface PS (that is, the shape of the irradiation region EA) does not change according to the position of the irradiation region EA. Therefore, the shaping system 1 can perform the polishing operation so as to polish the polishing target surface PS relatively accurately regardless of the position of the irradiation region EA. Note that, when the polishing target surface PS is a curved surface, the normal line can be the normal line of the tangent plane of the curved surface at a specific position on the curved surface. Therefore, the normal line NV#d of the first portion A#d of the polishing target surface PS can be the normal line of the tangent plane in contact with the first portion A#d, and the normal line NV#e of the second portion A#e of the polishing target surface PS can be the normal line of the tangent plane in contact with the second portion A#e.

[0077] As shown in FIG. 13, the light direction condition may include a second light direction condition that the direction of the normal line NV of the polishing target surface PS where the irradiation region EA is set and the direction of the axis of the light EL directed toward the irradiation region EA are aligned (in other words, coincide) regardless of the position of the irradiation region EA. In other words, the light direction condition may include a second light direction condition that the angle θ formed by the normal line NV of the polishing target surface PS where the irradiation region EA is set and the axis of the light EL directed toward the irradiation region EA is 0 degrees. Here, the state where the "angle θ is 0 degrees" includes not only the case where the angle θ exactly coincides with 0 degrees, but also a state where the angle θ does not coincide with 0 degrees but can be regarded as substantially 0 degrees (that is, the angle θ is approximately 0 degrees). When the polishing operation is performed so that the light direction condition including the second light direction condition is satisfied, the light EL will be perpendicularly incident on the polishing target surface PS. Therefore, when the polishing operation is performed so that the light direction condition including the second light direction condition is satisfied, the shape of the spot of the light EL on the polishing target surface PS (that is, the shape of the irradiation region EA) approaches an ideal shape (for example, a perfect circle) as compared with the case where the polishing operation is performed so that the light direction condition including the second light direction condition is not satisfied. For this reason, the shaping system 1 can perform the polishing operation so as to polish the polishing target surface PS with relatively high accuracy.

[0078] As shown in FIG. 14, the light direction condition may include a third light direction condition that the direction (that is, the direction of the axis) of the light EL from the irradiation system 411 toward the irradiation region EA is adjusted so that the angle θ formed by the normal line NV of the polishing target surface PS where the irradiation region EA is set and the axis of the light EL directed toward the irradiation region EA becomes smaller (that is, approaches 0 degrees). When the polishing operation is performed after adjusting the direction of the light EL so that the light direction condition including such a third light direction condition is satisfied, the shape of the spot of the light EL on the polishing target surface PS (that is, the shape of the irradiation region EA) approaches an ideal shape correspondingly as compared with the case where the polishing operation is performed without adjusting the direction of the light EL. For this reason, the shaping system 1 can perform the polishing operation so as to polish the polishing target surface PS with relatively high accuracy correspondingly.

[0079] To satisfy the light direction condition, the control device 7 may control the irradiation system 411. For example, when the emission direction of the light EL from the irradiation system 411 changes, the direction of the light EL from the irradiation system 411 toward the irradiation region EA (i.e., the direction of the axis) may also change. Therefore, the control device 7 may control the incident angle θ by controlling the optical member provided in the irradiation system 411 to control the direction in which the light EL is emitted from the irradiation system 411. As an example of such an optical member, an optical member capable of deflecting the light EL (e.g., a rotating mirror) can be given.

[0080] When the attitude of the three-dimensional object ST with respect to the emission direction of the light EL from the irradiation system 411 changes, the direction of the light EL from the irradiation system 411 toward the irradiation region EA (i.e., the direction of the axis) may also change. Therefore, to satisfy the light direction condition, the control device 7 may control the stage drive system 44 to change the attitude of the three-dimensional structure ST with respect to the emission direction of the light EL. Alternatively, as will be described later, when the head drive system 42 can move the shaping head 41 (particularly, the irradiation system 411) along at least one of the θX axis, θY axis, and θZ axis, the control device 7 may control the head drive system 42 to change the attitude of the three-dimensional structure ST with respect to the emission direction of the light EL.

[0081] When controlling at least one of the irradiation system 411, the head drive system 42, and the stage drive system 44 so as to satisfy the light direction condition, the control device 7 specifies the relative positional relationship between the irradiation system 411 and the polishing target surface PS based on the above-described shape information, and controls the direction of the light EL toward the irradiation region EA so that the direction of the light EL toward the irradiation region EA satisfies the light direction condition based on the specified positional relationship. Therefore, the above-described shape information may include information regarding the relative positional relationship between the irradiation system 411 and the polishing target surface PS as at least a part of the information regarding the shape of the polishing target surface PS.

[0082] Note that the direction of the axis of the light EL toward the irradiation region EA may be, for example, the direction of the principal ray of the light EL or the direction of the axis connecting the light amount center-of-gravity positions of the light EL in a plurality of cross-sections in the traveling direction of the light EL.

[0083] (2-3-2) Second operating conditions regarding the polishing target surface PS The second operation condition may include a surface direction condition regarding the direction in which the surface PS to be polished faces. As shown in FIGS. 15(a) to 15(c), the surface direction condition may include a first surface direction condition that the direction of the normal line NV of the surface PS to be polished where the irradiation region EA is set does not change according to the position of the irradiation region EA. That is, the surface direction condition may include a first surface direction condition that the surface PS to be polished where the irradiation region EA is set faces the same direction regardless of the position of the irradiation region EA. For example, as shown in FIGS. 15(a) to 15(c), when the surface PS to be polished includes the surfaces PS#a, PS#b, and PS#c to be polished that are non-parallel to each other, the first surface direction condition is that the direction of the normal line NV#a of the surface PS#a when the irradiation region EA is set on the surface PS#a, the direction of the normal line NV#b of the surface PS#b when the irradiation region EA is set on the surface PS#b, and the direction of the normal line NV#c of the surface PS#c when the irradiation region EA is set on the surface PS#c are all the same. Although not shown, when the surface PS to be polished is a curved surface, the first surface direction condition is that the direction of the normal line NV#d of the first portion A#d of the surface PS to be polished when the irradiation region EA is set on the first portion A#d and the direction of the normal line NV#e of the second portion A#e of the surface PS to be polished when the irradiation region EA is set on the second portion A#e are all the same.

[0084] When the polishing operation is performed so that the light direction condition including the first surface direction condition is satisfied in the example shown in FIGS. 15(a) to 15(c), the control device 7 controls the stage drive system 44 so that the direction of the normal line NV of one of the plurality of polishing target surfaces PS becomes the desired direction, and then repeats the operation of polishing one polishing target surface PS such that the plurality of polishing target surfaces PS are sequentially set as one polishing target surface PS. Specifically, the control device 7 controls the stage drive system 44 to move the stage 43 so that the posture of the three-dimensional structure ST becomes a posture #a (for example, the posture shown in FIG. 15(a)) in which any one of the polishing target surfaces PS#a to PS#c (for example, the polishing target surface PS#a) faces the desired direction. Then, with the posture of the three-dimensional structure ST being the posture #a, the control device 7 repeatedly performs a series of polishing processes on the polishing target surface PS#a while relatively moving the irradiation region EA with respect to the polishing target surface PS#a based on the shape information. After the polishing of the polishing target surface PS#a is completed, the control device 7 controls the stage drive system 44 to move the stage 43 so that the posture of the three-dimensional structure ST becomes a posture #b (for example, the posture shown in FIG. 15(b)) in which any other one of the polishing target surfaces PS#a to PS#c (for example, the polishing target surface PS#b) faces the same desired direction. Then, with the posture of the three-dimensional structure ST being the posture #b, the control device 7 repeatedly performs a series of polishing processes on the polishing target surface PS#b while relatively moving the irradiation region EA with respect to the polishing target surface PS#b based on the shape information. After the polishing of the polishing target surface PS#b is completed, the control device 7 controls the stage drive system 44 to move the stage 43 so that the posture of the three-dimensional structure ST becomes a posture #c (for example, the posture shown in FIG. 15(c)) in which the remaining one of the polishing target surfaces PS#a to PS#c (for example, the polishing target surface PS#c) faces the same desired direction. Then, with the posture of the three-dimensional structure ST being the posture #c, the control device 7 repeatedly performs a series of polishing processes on the polishing target surface PS#c while relatively moving the irradiation region EA with respect to the polishing target surface PS#c based on the shape information.As a result, regardless of what polishing target surface PS the three-dimensional structure ST includes, the modeling system 1 can polish the polishing target surface PS with the polishing target surfaces PS facing the same direction.

[0085] When the polishing operation is performed so that the light direction condition including the first surface direction condition is satisfied in this way, compared with the case where the polishing operation is performed so that the light direction condition including the first surface direction condition is not satisfied, the shape of the spot of the light EL on the polishing target surface PS (that is, the shape of the irradiation region EA) is less likely to change according to the position of the irradiation region EA. For this reason, the modeling system 1 can perform the polishing operation so as to polish the polishing target surface PS with relatively high accuracy regardless of the position of the irradiation region EA.

[0086] The surface direction condition may include a second surface direction condition that the direction of the normal line NV of the polishing target surface PS where the irradiation region EA is set coincides with the gravitational direction (that is, the Z-axis direction) regardless of the position of the irradiation region EA. That is, the surface direction condition may include a second surface direction condition that the polishing target surface PS where the irradiation region EA is set becomes a horizontal plane (that is, parallel to the XY plane) regardless of the position of the irradiation region EA. The state of "the polishing target surface PS becomes a horizontal plane" as used herein includes not only the case where the polishing target surface PS is completely parallel to the XY plane, but also a state where the polishing target surface PS can be regarded as being substantially a horizontal plane although the polishing target surface PS is not completely parallel to the XY plane (that is, a state where the polishing target surface PS is approximately a horizontal plane). Incidentally, FIGS. 15(a) to 15(c) show examples in which the directions of the normal lines NV#a of the polishing target surface PS#a where the irradiation region EA is set, the normal lines NV#b of the polishing target surface PS#b where the irradiation region EA is set, and the normal lines NV#c of the polishing target surface PS#c where the irradiation region EA is set coincide with the gravitational direction, respectively.

[0087] Here, if the surface PS to be polished is not horizontal, as shown in Fig. 16(a), the shaped material M melted by the irradiation of the light EL may be biased downward and distributed within the surface PS to be polished due to the self-weight of the melted shaped material M. That is, the surface of the shaped material M melted by the irradiation of the light EL may not become a flat surface. As a result, the surface PS to be polished polished by the irradiation of the light EL may not become a flat surface. Even in this case, compared with the case where the polishing operation is not performed, the surface PS to be polished is still smooth. On the other hand, if the surface PS to be polished is horizontal, as shown in Fig. 16(b), the shaped material M melted by the irradiation of the light EL is more likely to be evenly distributed within the surface PS to be polished by at least one of the self-weight and surface tension of the melted shaped material M. That is, the surface of the shaped material M melted by the irradiation of the light EL is more likely to become a flat surface. As a result, the surface PS to be polished polished by the irradiation of the light EL is more likely to become a flat surface. Therefore, the shaping system 1 can polish the surface PS to be polished so that the surface PS to be polished becomes a smoother surface by performing the polishing operation so that the surface direction condition including the second surface direction condition is satisfied. Note that the second surface direction condition may be a condition that the posture of the surface PS to be polished where the irradiation region EA is set is constant regardless of the position of the irradiation region EA. In this case, the degree of bias of the shaped material M melted by the irradiation of the light EL is the same at any position on the surface PS to be polished, and the polishing state of the surface PS to be polished is constant regardless of the position.

[0088] The surface direction condition may include a third surface direction condition that the polishing target surface PS where the irradiation region EA is set faces vertically upward (i.e., the +Z side). When the polishing target surface PS faces vertically upward, the shaped material M melted by the irradiation of the light EL is relatively likely to be evenly distributed within the polishing target surface PS due to the self-weight of the melted shaped material M (see Fig. 16(b) described above). That is, the surface of the shaped material M melted by the irradiation of the light EL is relatively likely to become a flat surface. As a result, the polishing target surface PS polished by the irradiation of the light EL is relatively likely to become a flat surface. Therefore, the shaping system 1 can polish the polishing target surface PS so that the polishing target surface PS becomes a smoother surface by performing a polishing operation so that the surface direction condition including the third surface direction condition is satisfied.

[0089] To satisfy the surface direction condition, the control device 7 may control the stage drive system 44. That is, the control device 7 may control the posture of the polishing target surface PS (i.e., the posture of the three-dimensional structure ST) so that the surface direction condition is satisfied (i.e., the polishing target surface PS becomes a horizontal plane). In other words, the control device 7 may control the relative position of the polishing target surface PS with respect to the light EL (i.e., the relative position of the three-dimensional structure ST with respect to the light EL) so that the surface direction condition is satisfied. In this case, the control device 7 may specify the direction of the normal line NV of the polishing target surface PS based on the shape information described above, and control the stage drive system 44 based on the specified direction of the normal line NV so that the surface direction condition is satisfied. For this reason, the above-described shape information may include information regarding the posture of the polishing target surface PS as at least a part of the information regarding the shape of the polishing target surface PS. If the direction of the normal line NV of the polishing target surface PS is not in the desired direction (for example, the direction of gravity), the control device 7 controls the stage drive system 44 so that the direction of the normal line NV of the polishing target surface PS becomes the desired direction. After the direction of the normal line NV of the polishing target surface PS becomes the desired direction, the control device 7 starts polishing the polishing target surface PS.

[0090] When the surface PS to be polished is a curved surface, the direction in which the surface PS to be polished faces can be the direction of the normal line of the tangent plane of the curved surface at a specific position on the curved surface. For example, when the surface PS to be polished is a curved surface, the direction in which the first portion on the surface PS to be polished faces may be the direction of the normal line of the tangent plane in contact with the first portion.

[0091] In addition, in the above embodiment, the processing operation is performed by optical EL after the formation of all the structural layers SL (the shaping of the three-dimensional structure ST) is completed. However, the processing operation (polishing operation) may be performed by optical EL on the three-dimensional structure after the formation of some of the structural layers SL and before all the structural layers SL are formed.

[0092] (3) Modification example Subsequently, a modified example of the shaping system 1 will be described.

[0093] (3-1) First modification example First, a first modified example of the shaping system 1 will be described. In the above description, the shaping head 41 included in the shaping system 1 emits both the optical EL used for the shaping operation and the optical EL used for the polishing operation. That is, the optical path in the optical EL irradiation system 411 during the period when the shaping operation is being performed is the same as the optical path in the optical EL irradiation system 411 during the period when the polishing operation is being performed. On the other hand, the shaping system 1a of the first modified example includes a polishing head 41a that emits the optical EL used for the polishing operation separately from the shaping head 41 that emits the optical EL used for the shaping operation.

[0094] Specifically, the shaping system 1a is different from the shaping system 1 in that it includes a shaping device 4a instead of the shaping device 4. The shaping device 4a is different from the shaping device 4 in that it includes a polishing head 41a and a head drive system 42a. Other components of the shaping system 1a may be the same as those of the shaping system 1. For this reason, hereinafter, with reference to FIG. 17, the shaping device 4a of the first modified example will be further described. In addition, for the components that are the same as those included in the shaping system 1, the same reference numerals are given and the detailed description thereof is omitted.

[0095] As shown in FIG. 17, in addition to the shaping head 41, the head drive system 42, the stage 43, the stage drive system 44, and the measuring device 45 described above, the shaping device 4a includes a polishing head 41a and a head drive system 42a. The polishing head 41a includes an irradiation system 411a. In FIG. 17, for simplicity of the drawing, the descriptions of the head drive system 42 and the stage drive system 44 are simplified.

[0096] The irradiation system 411a is an optical system (for example, a condensing optical system) for emitting the light ELa from the emitting portion 413a. Specifically, the irradiation system 411a is optically connected to a light source 5 that emits the light EL via a light transmission member (not shown) such as an optical fiber or a light pipe. The irradiation system 411a emits the light EL propagated from the light source 5 via the light transmission member as the light ELa. That is, the light EL emitted by the light source 5 is branched into two lights EL by an optical splitter disposed between the light source 5 and the shaping device 4a or within the shaping device 4a, and one light EL propagates to the shaping head 41, and the other light EL propagates to the polishing head 41a. The irradiation system 411a irradiates the light ELa downward (that is, the -Z side) from the irradiation system 411a. The stage 43 is disposed below the irradiation system 411a. When the three-dimensional structure ST is mounted on the stage 43, the irradiation system 411a irradiates the light ELa toward the three-dimensional structure ST. Specifically, the irradiation system 411a irradiates the light ELa onto a circular (or any other shape) irradiation region EAa set on the polishing target surface PS as a region where the light ELa is irradiated. Further, the state of the irradiation system 411a can be switched between a state of irradiating the light ELa onto the irradiation region EAa and a state of not irradiating the light ELa onto the irradiation region EAa under the control of the control device 7.

[0097] The head drive system 42a moves the polishing head 41a. Specifically, the head drive system 42a moves the polishing head 41a along each of the X-axis, Y-axis, and Z-axis. Note that the structure of the head drive system 42a may be the same as the structure of the head drive system 42. Therefore, a detailed description of the structure of the head drive system 42a is omitted.

[0098] Since the polishing head 41a is provided separately from the shaping head 41, the polishing head 41a irradiates the light ELa from a direction different from that of the shaping head 41. That is, the light ELa propagates along an optical path different from the optical path of the light EL and is irradiated onto the polishing target surface PS. For this reason, the polishing head 41a can irradiate the light ELa at least in part of the period during which the shaping head 41 irradiates the light EL. That is, the shaping system 1a can perform the shaping operation and the polishing operation in parallel. In other words, the shaping system 1a can overlap at least part of the time zone (or timing) in which the shaping operation is performed and the time zone (or timing) in which the polishing operation is performed, or at least part of the timing of the shaping operation and the timing of the polishing operation. Specifically, the shaping system 1a irradiates the light ELa onto at least part of the polishing target surface PS, which is at least part of the surface of the other part of the already formed three-dimensional structure ST, at least in part of the period during which the shaping head 41a forms a part of the three-dimensional structure ST by irradiating the light EL onto the shaping surface CS. As a result, the throughput for forming and polishing the three-dimensional structure ST is improved. That is, the shaping system 1a of the first modification example can improve the throughput for forming the polished three-dimensional structure ST while enjoying the same effects as those enjoyed by the shaping system 1 described above.

[0099] However, even when the shaping device 4a includes the polishing head 41a separately from the shaping head 41, the shaping system 1a may perform the polishing operation after the three-dimensional structure ST is formed by the shaping operation. Even in this case, the shaping system 1a of the first modification example can enjoy the same effects as those enjoyed by the shaping system 1 described above.

[0100] Also, after the three-dimensional structure ST is formed by the shaping operation, the polishing operation may be performed using both the shaping device 4a and the polishing head 41a.

[0101] In the above description, when the three-dimensional structure ST is irradiated with the light EL from the shaping head 41 and the light ELa from the polishing head 41a simultaneously, at least one of the polishing head 41a and the shaping head 41 is set so that the region irradiated with the light EL and the region irradiated with the light ELa are different. However, the light EL and the light ELa may be set to the same region, or the region irradiated with the light EL and the region irradiated with the light ELa may be partially overlapped.

[0102] (3-2) Second modification example Next, with reference to FIG. 18, a second modified example of the shaping system 1 will be described. In the first modified example described above, the light EL emitted from the common light source 5 is propagated to the shaping head 41 and the polishing head 41a. On the other hand, the shaping system 1b of the second modified example is different from the shaping system 1a of the first modified example in that, as shown in FIG. 18, it includes a light source 5b that emits the light ELa used in the polishing operation separately from the light source 5 that emits the light EL used in the shaping operation. Other components of the shaping system 1b may be the same as those of the shaping system 1a. Such a shaping system 1b of the second modified example can enjoy the same effects as those that the shaping system 1a of the first modified example can enjoy.

[0103] The light source 5a may emit the light ELa having the same characteristics (for example, intensity, wavelength, polarization, etc.) as the light EL emitted by the light source 5. The light source 5a may emit the light ELa having different characteristics (for example, intensity, wavelength, polarization, etc.) from the light EL emitted by the light source 5. The light source 5a may emit an energy beam of a different type from the light EL emitted by the light source 5.

[0104] (3-3) Third modification example Next, a third modification example of the modeling system 1 will be described. The structure of the modeling system 1c of the third modification example is the same as the structure of the modeling system 1 described above. The modeling system 1c of the third modification example is different from the modeling system 1 described above in that when performing the polishing operation, a deformation suppression operation for suppressing the deformation of the three-dimensional structure ST caused by the polishing operation is also performed. Hereinafter, after explaining the reason why the deformation of the three-dimensional structure ST caused by the polishing operation occurs, the deformation suppression operation for suppressing the deformation will be described.

[0105] (3-3-1) Reason for the deformation of the three-dimensional structure ST caused by the polishing operation When the polishing target surface PS is polished, as described above, the polishing target surface PS is irradiated with the light EL. Heat is transferred from the light EL to the polishing target surface PS. This heat is also transferred (substantially diffused) into the three-dimensional structure ST through the polishing target surface PS. Here, depending on the characteristics of the three-dimensional structure ST (for example, at least one of the material, shape, and density), the degree of heat diffusion in the three-dimensional structure ST (that is, an index indicating the ease or difficulty of diffusion) is not necessarily uniform. That is, there may be regions on the polishing target surface PS with different characteristics with respect to the heat transferred from the light EL (here, heat characteristics related to the degree of heat diffusion). For example, on the polishing target surface PS, there may be regions where the heat transferred from the light EL is relatively difficult to diffuse and regions where the heat transferred from the light EL is relatively easy to diffuse.

[0106] For example, as shown in FIG. 19, in addition to the surface SF1 including the polishing target surface PS where the irradiation region EA is set, the three-dimensional structure ST may have a surface SF2 including a polishing target surface PS that does not include the polishing target surface PS or where the irradiation region EA is not currently set (for example, to be set in the future or already set). In this case, it is possible to estimate the degree of heat diffusion transmitted to a certain region portion on the polishing target surface PS according to the proximity between a certain region portion on the polishing target surface PS and the surface SF2. Specifically, as shown in FIG. 19, the region WA1 on the polishing target surface PS is closer to the surface SF2 than the region WA2 on the polishing target surface PS. Therefore, the heat diffusion path (that is, the diffusion path inside the three-dimensional structure ST) of the heat transmitted to the region WA1 is smaller or less than the heat diffusion path of the heat transmitted to the region WA2. Accordingly, the shorter the distance between a certain region portion on the polishing target surface PS and the surface SF2, the more difficult it is for the heat transmitted to the region portion to be diffused. In the example shown in FIG. 19, it can also be said that on the polishing target surface PS, there are a region WA1 where the heat transmitted from the light EL is relatively difficult to be diffused and a region WA2 where the heat transmitted from the light EL is relatively easy to be diffused.

[0107] In the region WA1 where heat is relatively difficult to be diffused, heat is relatively likely to be accumulated compared to the region WA2 where heat is relatively easy to be diffused. As a result, in the region WA1, the possibility of thermal deformation is higher than that in the region WA2 by the amount that heat is relatively likely to be accumulated. For this reason, if a series of polishing processes are performed on the polishing target surface PS without considering the difference in the degree of heat diffusion, the polished three-dimensional structure ST may be deformed unintentionally according to the difference in the degree of heat diffusion.

[0108] Alternatively, when the three-dimensional structure ST includes a plurality of surfaces to be polished ST (for example, a plurality of surfaces to be polished PS that are parallel or non-parallel to each other), there may be a surface to be polished PS where the heat transmitted from the light EL is relatively difficult to diffuse and a surface to be polished PS where the heat transmitted from the light EL is relatively easy to diffuse. Even in this case, on the surface to be polished PS where the heat is relatively difficult to diffuse, the possibility of thermal deformation is higher than that on the surface to be polished PS where the heat is relatively easy to diffuse. Therefore, even in this case, depending on the difference in the degree of heat diffusion, the polished three-dimensional structure ST may be deformed unintentionally.

[0109] Therefore, in the third modification, the control device 7 (in other words, the shaping system 1 under the control of the control device 7) performs a deformation suppression operation to suppress the deformation of the three-dimensional structure ST caused by the polishing operation (particularly, due to the difference in the degree of heat diffusion from the light EL).

[0110] (3-3-2) Deformation suppression operation The control device 7 may perform a deformation suppression operation of suppressing the deformation of the three-dimensional structure ST by controlling the amount of heat transferred from the light EL to the polishing target surface PS through the irradiation region EA. Specifically, as shown in FIG. 20, the control device 7 may control the amount of heat transferred from the light EL so that the amount of heat transferred from the light EL decreases as it becomes more difficult for the heat to diffuse. That is, the control device 7 controls the amount of heat transferred from the light EL so that the amount of heat transferred from the light EL to a certain region portion on the polishing target surface PS decreases as the heat transferred to the region portion becomes more difficult to diffuse. For example, the control device may control the amount of heat transferred from the light EL so that the amount of heat transferred from the light EL to the region WA1 where heat is relatively difficult to diffuse is less than the amount of heat transferred from the light EL to the region WA2 where heat is relatively easy to diffuse. As a result, the amount of heat transferred to the region portion where heat is relatively difficult to diffuse becomes less than the amount of heat transferred to the region portion where heat is relatively easy to diffuse. When the amount of heat transferred to a certain region portion decreases, it becomes more difficult for the region portion to thermally deform. Therefore, it is suppressed that the region portion where heat is relatively difficult to diffuse deforms due to the heat from the light EL. As a result, the deformation of the three-dimensional structure ST due to the polishing operation (particularly, due to the difference in the degree of heat diffusion from the light EL) is suppressed.

[0111] In order to control the amount of heat transmitted from the light EL, the control device 7 may control the intensity or energy of the light EL on the irradiation region EA (in particular, the intensity or energy per unit area). Specifically, as shown in FIG. 21, the greater the intensity / energy of the light EL on the irradiation region EA, the greater the amount of heat transmitted from the light EL. Therefore, the control device 7 can control the amount of heat transmitted from the light EL by controlling the intensity of the light EL on the irradiation region EA. That is, the control device 7 controls the intensity or energy of the light EL on the irradiation region EA according to the position of the irradiation region EA on the surface PS to be polished (that is, the degree of heat diffusion in the region portion of the surface PS to be polished where the irradiation region EA is set), so as to control the amount of heat transmitted from the light EL. In this case, the control device 7 may control the intensity or energy of the light EL such that the intensity or energy of the light EL decreases as the heat becomes more difficult to diffuse. That is, the control device 7 may control the intensity or energy of the light EL such that the intensity or energy of the light EL irradiated on a certain region portion on the surface PS to be polished decreases as the heat transmitted to the region portion becomes more difficult to diffuse. Note that the method of controlling the intensity or energy of the light EL has already been described in connection with the description of the light intensity conditions considered during the polishing operation, so a detailed description thereof will be omitted.

[0112] In order to control the amount of heat transferred from the optical EL, the control device 7 may control the relative movement speed of the irradiation area EA with respect to the polishing target surface PS (that is, the relative movement speed of the irradiation area EA with respect to the three-dimensional structure ST). Specifically, the faster the movement speed of the irradiation area EA set in a certain area portion on the polishing target surface PS, the shorter the time during which the irradiation area EA is set in the area portion. In other words, the faster the movement speed of the irradiation area EA set in a certain area portion on the polishing target surface PS, the shorter the time during which the optical EL irradiates a certain area portion. The shorter the time during which the irradiation area EA is set in a certain area portion on the polishing target surface PS, the less the amount of heat transferred from the optical EL to the area portion. That is, as shown in FIG. 22, the faster the movement speed of the irradiation area EA set in a certain area portion on the polishing target surface PS, the less the amount of heat transferred from the optical EL to the area portion. Therefore, the control device 7 can control the amount of heat transferred from the optical EL by controlling the relative movement speed of the irradiation area EA. That is, the control device 7 may control the amount of heat transferred from the optical EL by controlling the relative movement speed of the irradiation area EA according to the position of the irradiation area EA on the polishing target surface PS (that is, the degree of heat diffusion in the area portion of the polishing target surface PS where the irradiation area EA is set). In this case, the control device 7 may control the relative movement speed of the irradiation area EA such that the relative movement speed of the irradiation area EA increases as it becomes more difficult for heat to diffuse. That is, the control device 7 may control the relative movement speed of the irradiation area EA such that the relative movement speed of the irradiation area EA set in a certain area portion on the polishing target surface PS increases as the heat transferred to the area portion becomes more difficult to diffuse.

[0113] The control device 7 may control at least one of the head drive system 42 and the stage drive system 44 in order to control the moving speed of the irradiation region EA. That is, the control device 7 may control the relative moving speed of the irradiation region EA with respect to the polishing target surface PS by controlling at least one of the moving speed of the shaping head 41 (particularly, the moving speed in the direction along the XY plane) and the moving speed of the stage 44 (particularly, the moving speed in the direction along the XY plane). Alternatively, when the irradiation system 411 includes an optical member (for example, a galvanometer scanner or the like) capable of deflecting the light EL, the control device 7 may control the relative moving speed of the irradiation region EA with respect to the polishing target surface PS by controlling the optical member capable of deflecting the light EL.

[0114] In addition, regardless of the position of the irradiation region EA on the three-dimensional structure ST (that is, the degree of heat diffusion in the region portion of the polishing target surface PS where the irradiation region EA is set), the control device 7 may control the amount of heat transmitted from the light EL so that the amount of heat transmitted from the light EL becomes constant. In particular, when the degree of heat diffusion in the three-dimensional structure ST is uniform, the control device 7 may control the amount of heat transmitted from the light EL so that the amount of heat transmitted from the light EL becomes constant regardless of the position of the irradiation region EA on the three-dimensional structure ST. That is, the control device 7 may make the amount of heat transmitted from the light EL to the first region of a certain polishing target surface PS the same as the amount of heat transmitted from the light EL to the second region of the same polishing target surface PS, or make the amount of heat transmitted from the light EL to another polishing target surface PS the same as the amount of heat transmitted from the light EL to another polishing target surface PS. In this case, for example, the control device 7 may control the intensity of the light EL so that the intensity of the light EL on the irradiation region EA becomes constant regardless of the position of the irradiation region EA on the polishing target surface PS. For example, the control device 7 may control the relative moving speed of the irradiation region EA so that the relative moving speed of the irradiation region EA with respect to the polishing target surface PS becomes constant regardless of the position of the irradiation region EA on the polishing target surface PS.

[0115] Still, the above-described deformation suppression operation may be performed using the three-dimensional model data of the three-dimensional structure ST. For example, a thermal simulation may be performed using the three-dimensional model data of the three-dimensional structure ST to identify a region where heat is difficult to diffuse, and the amount of heat transferred from the light EL may be controlled so that the amount of heat transferred from the light EL to the identified region is reduced. Also, the degree of heat diffusion for each partial shape of the three-dimensional structure may be stored in a library. For example, for parts of three-dimensional structures having different shapes, the degree of heat diffusion may be obtained by experiment or simulation and stored as a library in association with the shape. Then, according to the shape of the three-dimensional structure ST as the object to be polished, information on the degree of heat diffusion for each part may be read from the library, and the amount of heat transferred from the light EL may be controlled using this information.

[0116] (3-4) Other modification examples The shaping system 1 does not necessarily perform the polishing operation so as to satisfy the above-described light intensity condition. In this case, the intensity of the light EL used in the polishing operation may be the same as or greater than the intensity of the light EL used in the shaping operation.

[0117] The shaping system 1 does not necessarily perform the polishing operation so as to satisfy the above-described irradiation size condition. In this case, the size R1 of the irradiation area EA set in a region of the polishing target surface PS may be the same as or greater than the pitch R2 of the unevenness appearing in the region.

[0118] The shaping system 1 does not necessarily perform the polishing operation so as to satisfy the above-described light direction conditions. In this case, the angle θ formed by the normal line NV of the polishing target surface PS where the irradiation region EA is set and the axis of the light EL directed toward the irradiation region EA may vary according to the position of the irradiation region EA. The direction of the normal line NV of the polishing target surface PS where the irradiation region EA is set and the direction of the axis of the light EL directed toward the irradiation region EA do not necessarily align (in other words, they do not necessarily coincide). The direction of the light EL (that is, the direction of the axis) from the irradiation system 411 toward the irradiation region EA does not necessarily need to be adjusted so that the angle θ formed by the normal line NV of the polishing target surface PS where the irradiation region EA is set and the axis of the light EL directed toward the irradiation region EA becomes smaller.

[0119] The shaping system 1 does not necessarily perform the polishing operation so as to satisfy the above-described surface direction conditions. In this case, the direction of the normal line NV of the polishing target surface PS where the irradiation region EA is set may vary according to the position of the irradiation region EA. The polishing target surface PS where the irradiation region EA is set may face different directions according to the position of the irradiation region EA. The direction of the normal line NV of the polishing target surface PS where the irradiation region EA is set does not necessarily coincide with the gravitational direction (that is, the Z-axis direction). The polishing target surface PS where the irradiation region EA is set does not necessarily need to be horizontal. The polishing target surface PS where the irradiation region EA is set does not necessarily face vertically upward (that is, the +Z side). For example, the polishing target surface PS where the irradiation region EA is set does not necessarily face vertically downward (that is, the -Z side). When the polishing target surface PS faces vertically downward, depending on the relationship between the self-weight and surface tension of the shaped material M melted by the irradiation of the light EL, the surface of the shaped material M melted by the irradiation of the light EL may become a flat surface.

[0120] Although the polishing operation is being performed as a processing operation for the three-dimensional shaped object ST, the polishing operation may be omitted. Also, although the polishing operation is being performed as a processing operation for the three-dimensional shaped object ST, other processing operations besides the polishing operation, for example, removal processing using the light EL or ELa, may be performed.

[0121] In the above description, the head drive system 42 moves the shaping head 41 along each of the X-axis, Y-axis, and Z-axis. However, the head drive system 42 does not necessarily have to move the shaping head 41 along at least one of the X-axis, Y-axis, and Z-axis. The head drive system 42 may move the shaping head 41 along at least one of the θX-axis, θY-axis, and θZ-axis in addition to or instead of at least one of the X-axis, Y-axis, and Z-axis.

[0122] In the above description, the stage drive system 44 moves the stage 43 along each of the θY-axis and θZ-axis. However, the stage drive system 44 does not necessarily have to move the stage 43 along at least one of the θY-axis and θZ-axis. The stage drive system 44 may move the stage 43 along at least one of the θX-axis, X-axis, Y-axis, and Z-axis in addition to or instead of at least one of the θY-axis and θZ-axis.

[0123] In the above description, the shaping apparatus 4 melts the shaping material M by irradiating the shaping material M with light EL. However, the shaping apparatus 4 may melt the shaping material M by irradiating the shaping material M with an arbitrary energy beam. In this case, the shaping apparatus 4 may include, in addition to or instead of the irradiation system 411, a beam irradiation apparatus capable of irradiating an arbitrary energy beam. The arbitrary energy beam includes, but is not limited to, charged particle beams such as electron beams and ion beams, or electromagnetic waves. Further, the shaping apparatus 4 may melt the shaping material M by transferring heat to the shaping material M. In this case, the shaping apparatus 4 may, in addition to or instead of the irradiation system 411, add a high-temperature gas (e.g., a flame as an example) to the shaping material M to melt the shaping material M.

[0124] In the above description, the shaping system 1 can form a shaped object by laser cladding welding. However, the shaping system 1 may also form a three-dimensional structure ST from the shaping material M by other methods that can form a three-dimensional structure ST by repeatedly performing an operation of forming a structural layer SL from the shaping material M and laminating a plurality of structural layers SL. As other methods, for example, powder bed fusion methods such as selective laser sintering (SLS), binder jetting, or laser metal fusion (LMF) can be mentioned.

[0125] (4) Supplementary note Regarding the embodiments described above, the following additional remarks are further disclosed. [Appendix 1] In a processing apparatus that performs a process of irradiating an object with an energy beam, an energy beam irradiation device that irradiates at least a part of the surface of the object with the energy beam, a position changing device that changes the irradiation position of the energy beam on the surface of the object, and a processing apparatus that controls the irradiation position of the energy beam using shape information regarding the shape of the object. [Appendix 2] further comprising a shape measurement device that measures the shape of the object, wherein the shape information includes the measurement result of the measurement device. The processing apparatus according to Appendix 1. [Appendix 3] wherein the shape information includes the design information of the object. The processing apparatus according to Appendix 1 or 2. [Appendix 4] changing the direction of the energy beam heading toward the irradiation position according to the irradiation position on the surface of the object. The processing apparatus according to any one of Appendices 1 to 3. [Appendix 5] The angle formed between the normal line of the surface at the irradiation position and the axis of the energy beam directed towards the irradiation position does not change according to the irradiation position on the surface of the object. The processing apparatus according to any one of Appendices 1 to 4. [Appendix 6] The apparatus further comprises a posture changing device that changes the posture of the object with respect to the axis of the energy beam directed towards the irradiation position. The processing apparatus according to any one of Appendices 1 to 5. [Appendix 7] The direction of the normal line of the surface at the irradiation position does not change according to the irradiation position on the surface of the object. The processing apparatus according to any one of Appendices 1 to 6. [Appendix 8] The direction of the normal line is the direction of the gravitational force. The processing apparatus according to Appendix 7. [Appendix 9] Change the intensity or energy per unit area of the energy beam directed towards the irradiation position according to the irradiation position on the surface of the object. The processing apparatus according to any one of Appendices 1 to 8. [Appendix 10] The intensity or energy per unit area of the energy beam directed towards the irradiation position does not change according to the irradiation position on the surface of the object. The processing apparatus according to any one of Appendices 1 to 8. [Appendix 11] The object is a three-dimensional object. The processing apparatus according to any one of Appendices 1 to 10. [Appendix 12] In a processing apparatus that performs a process of irradiating an object with an energy beam, An energy beam irradiation device that irradiates an energy beam onto a first portion of the surface of the object and a second portion of the surface of the object that is directed in a direction different from the first portion, A posture changing device that changes the posture of the object with respect to the irradiation direction of the energy beam, A position changing device for changing the irradiation position of the energy beam on the surface of the object and setting the posture of the object to a first posture so that the first part faces a first direction, irradiating the first part with an energy beam, setting the posture of the object to a second posture different from the first posture so that the second part faces a second direction, and irradiating the energy beam processing device. [Appendix 13] The first direction and the second direction are the same direction The processing device according to Appendix 12. [Appendix 14] The first and second directions are parallel to the direction of gravity The processing device according to Appendix 12 or 13. [Appendix 15] Setting the first and second postures using shape information regarding the shape of the object The processing device according to any one of Appendices 12 to 14. [Appendix 16] Comprising a shape measuring device for measuring the shape of the object The shape information includes the measurement result of the measuring device The processing device according to Appendix 15. [Appendix 17] The shape information includes the design information of the object The processing device according to Appendix 15. [Appendix 18] The design information includes information representing the shape of the object The processing device according to Appendix 17. [Appendix 19] The intensity or energy per unit area of the energy beam irradiated on the first part is the same as the intensity or energy per unit area of the energy beam irradiated on the second part The processing device according to any one of Appendices 12 to 18. [Appendix 20] The intensity or energy per unit area of the energy beam irradiated on the first part is different from the intensity or energy per unit area of the energy beam irradiated on the second part. The processing apparatus according to any one of Appendices 12 to 18. [Appendix 21] The object is a three-dimensional object, The first part is a part of the three-dimensional object, and the second part is another part of the three-dimensional object. The processing apparatus according to any one of Appendices 12 to 20. [Appendix 22] A processing apparatus for processing a shaped object formed by irradiating a first surface of a member with a shaping energy beam to form a melting pool on the first surface and supplying a shaping material to the melting pool, Irradiating at least a part of a second surface of the shaped object directed in a second direction intersecting a first direction in which the member and the shaped object are arranged with a processing energy beam. Processing apparatus. [Appendix 23] Irradiating the processing energy beam at a boundary portion between the member and the shaped object. The processing apparatus according to Appendix 22. [Appendix 24] The member is shaped by supplying a shaping material to a melting pool formed by irradiating a third surface of a base material with a shaping energy beam. The processing apparatus according to Appendix 22 or 23. [Appendix 25] The first direction is a direction from the bottom surface to the top surface of the melting pool. The processing apparatus according to any one of Appendices 22 to 24. [Appendix 26] The intensity or energy per unit area of the processing energy beam is smaller than the intensity or energy per unit area of the shaping energy beam. The processing apparatus according to any one of Appendices 22 to 25. [Appendix 27] The size of the first region where the processing energy beam is irradiated onto the second surface is larger than the size of the second region where the shaping energy beam is irradiated onto the first surface. The processing apparatus according to any one of appendices 22 to 26. [Appendix 28] The processing apparatus further includes a light source that emits the shaping energy beam and the processing energy beam. The processing apparatus according to any one of appendices 22 to 27. [Appendix 29] The processing apparatus includes a condensing optical system that condenses the energy beam from the light source. The first condensing state of the energy beam from the condensing optical system that is condensed onto the first surface is different from the second condensing state of the energy beam from the condensing optical system that is condensed onto the second surface. The processing apparatus according to appendix 28. [Appendix 30] The energy beam in the first condensing state is used as the shaping energy beam, and the energy beam in the second condensing state is used as the processing energy beam. The processing apparatus according to appendix 29. [Appendix 31] The processing apparatus further includes a posture changing device that changes the posture of the shaped object with respect to the direction in which the shaping energy beam is emitted. The processing apparatus according to any one of appendices 22 to 30. [Appendix 32] The posture is changed such that the direction in which the shaping energy beam is emitted toward the first surface when the shaped object is being shaped is different from the direction in which the processing energy beam is emitted toward the second surface. The processing apparatus according to appendix 31. [Appendix 33] The posture is changed using the shape information regarding the shape of the shaped object. The processing apparatus according to appendix 31 or 32. [Appendix 34] The processing apparatus according to any one of appendices 31 to 33, wherein the direction in which the shaping energy beam is emitted is changed using the shape information regarding the shape of the shaped object. [Appendix 35] Comprising a shape measurement device for measuring the shape of the shaped object The shape information includes the measurement results of the measurement device The processing device according to Appendix 33 or 34 [Appendix 36] The shape information includes the design information of the shaped object The processing device according to any one of Appendices 33 to 35 [Appendix 37] The design information includes information representing the shape of the shaped object The processing device according to Appendix 36 [Appendix 38] Shaping the shaped object using the design information The processing device according to Appendix 36 or 37 [Appendix 39] The posture changing device changes the posture so that the processing energy beam is perpendicularly incident on the second surface The processing device according to any one of Appendices 31 to 38 [Appendix 40] The posture changing device changes the posture so that the incident angle of the processing energy beam with respect to the second surface becomes smaller compared to before changing the posture The processing device according to any one of Appendices 31 to 39 [Appendix 41] When the processing energy beam irradiates the second surface, the second surface is horizontal The processing device according to any one of Appendices 22 to 40 [Appendix 42] The member is shaped by supplying a shaping material to a molten pool formed by irradiating a third surface of a base material with a shaping energy beam The processing energy beam is irradiated onto an irradiation region within a plane including the second surface of the shaped object and a fourth surface oriented in the second direction among the surfaces of the member The size of the irradiation region along the first direction is larger than the distance between the center position of the member and the center position of the shaped object along the first direction The processing apparatus according to any one of Appendices 22 to 41. [Appendix 43] The size of the irradiation area along the first direction is larger than half of the sum of the size of the shaped object along the first direction and the size of the member along the first direction. The processing apparatus according to Appendix 42. [Appendix 44] At least a part of the period during which a part of the member is formed, polish the other part of the already formed member with the processing energy beam. The processing apparatus according to Appendix 42 or 43. [Appendix 45] The size of the irradiation area of the processing energy beam irradiated on the second surface is larger than the pitch of the unevenness on the second surface. The processing apparatus according to any one of Appendices 22 to 44. [Appendix 46] The processing apparatus further includes a control device that controls the processing conditions of the second surface by the processing energy beam. The processing apparatus according to any one of Appendices 22 to 45. [Appendix 47] The control device controls the processing conditions so that the first processing conditions used when irradiating the third part of the second surface with the processing energy beam are different from the second processing conditions used when irradiating the fourth part of the second surface with the processing energy beam. The processing apparatus according to Appendix 46. [Appendix 48] The heat transfer mode from the processing energy beam in the third part is different from the heat transfer mode from the processing energy beam in the fourth part. The processing apparatus according to Appendix 47. [Appendix 49] The transfer mode includes the heat diffusion characteristics from the processing energy beam. The processing apparatus according to Appendix 48. [Appendix 50] The third part includes a region where heat diffuses less from the processing energy beam than the fourth part. The control device controls the processing conditions such that the amount of heat transferred from the processing energy beam to the third portion is less than the amount of heat transferred from the processing energy beam to the fourth portion. The processing apparatus according to any one of Appendices 47 to 49. [Appendix 51] The processing conditions include a first condition regarding the processing energy beam. The processing apparatus according to any one of Appendices 45 to 50. [Appendix 52] The first condition includes conditions regarding at least one of the intensity or energy per unit area of the processing energy beam, the focus position of the processing energy beam, the defocus amount of the processing energy beam, the size of the irradiation area irradiated with the processing energy beam, the shape of the irradiation area, the position of the irradiation area, and the intensity distribution or energy distribution of the processing energy beam. The processing apparatus according to Appendix 51. [Appendix 53] The apparatus further includes a position changing device that changes the relative position between the processing beam and the second surface. The processing conditions include a second condition regarding the position changing device. The processing apparatus according to any one of Appendices 45 to 52. [Appendix 54] The second condition includes the relative moving speed of the irradiation area irradiated with the processing energy beam with respect to the second surface. The processing apparatus according to Appendix 53. [Appendix 55] The processing conditions are polishing conditions. The processing apparatus according to any one of Appendices 45 to 54. [Appendix 56] Irradiation of the energy beam onto the second surface makes the second surface smoother than before the irradiation of the energy beam. The processing apparatus according to any one of Appendices 22 to 55. [Appendix 57] Irradiating the second surface with the energy beam changes the color tone of the second surface from that before the irradiation of the energy beam. The processing apparatus according to any one of Appendices 22 to 56. [Appendix 58] Irradiating the second surface with the energy beam increases the reflectance of the second surface as compared with that before the irradiation of the energy beam. The processing apparatus according to any one of Appendices 22 to 57. [Appendix 59] Irradiating the second surface with the energy beam makes the surface roughness of the second surface finer than that before the irradiation of the energy beam. The processing apparatus according to any one of Appendices 22 to 58. [Appendix 60] Irradiating the second surface with the energy beam reduces the light diffusivity at the second surface as compared with that before the irradiation of the energy beam. The processing apparatus according to any one of Appendices 22 to 59. [Appendix 61] Irradiating the second surface with the energy beam melts the second surface. The processing apparatus according to any one of Appendices 21 to 60. [Appendix 62] The action of the surface tension at the surface of the melt melted at the second surface improves the smoothness at the surface. The processing apparatus according to Appendix 61. [Appendix 63] A light source that supplies an energy beam, A condensing optical system that condenses the energy beam from the light source onto an object, A material supply unit that supplies a shaping material to the condensing position of the energy beam via the condensing optical system, A position changing device that changes the relative positional relationship between the condensing position and the object, A control device that controls the position changing device so as to supply the shaping material to the condensing position while changing the relative positional relationship between the condensing position and the object to shape an object as a shaped article and Irradiate the object with the energy beam through the light condensing optical system. The optical path of the energy beam from the light source that condenses on the object within the light condensing optical system is the same as the optical path of the energy beam irradiated on the object within the light condensing optical system. Processing device. [Appendix 64] By irradiating the object with the energy beam, make the surface of the object smoother than before the irradiation of the energy beam. The processing device according to any one of Appendices 1 to 21 and 63. [Appendix 65] By irradiating the object with the energy beam, change the color tone of the surface of the object from that before the irradiation of the energy beam. The processing device according to any one of Appendices 1 to 21, 63 and 64. [Appendix 66] By irradiating the object with the energy beam, increase the reflectance of the surface of the object compared to before the irradiation of the energy beam. The processing device according to any one of Appendices 1 to 21 and 63 to 65. [Appendix 67] By irradiating the object with the energy beam, make the surface roughness of the surface of the object finer than before the irradiation of the energy beam. The processing device according to any one of Appendices 1 to 21 and 63 to 66. [Appendix 68] By irradiating the object with the energy beam, reduce the light diffusion degree on the surface of the object compared to before the irradiation of the energy beam. The processing device according to any one of Appendices 1 to 21 and 63 to 67. [Appendix 69] By irradiating the object with the energy beam, melt the surface of the object. The processing device according to any one of Appendices 1 to 21 and 63 to 68. [Appendix 70] Improve the smoothness on the surface by the action of the surface tension on the surface of the melt melted on the surface of the object. The processing device according to Appendix 69. [Appendix 71] In a processing method for performing a process of irradiating an object with an energy beam, irradiating at least a part of the surface of the object with the energy beam, and changing an irradiation position of the energy beam on the surface of the object are included, and the irradiation position of the energy beam is changed using shape information regarding the shape of the object processing method. [Appendix 72] In a processing method for performing a process of irradiating an object with an energy beam, setting the posture of the object to a first posture so that a first part of the surface of the object faces a first direction and irradiating the first part with an energy beam, setting the posture of the object to a second posture different from the first posture so that a second part of the surface of the object facing a direction different from the first part faces a second direction, and irradiating the second part with the energy beam are included in the processing method. [Appendix 73] A processing method for processing a shaped object formed by irradiating a first surface of a member with a shaping energy beam to form a molten pool on the first surface and supplying a shaping material to the molten pool, irradiating at least a part of a second surface of the shaped object directed in a second direction intersecting a first direction in which the member and the shaped object are aligned with a processing energy beam are included in the processing method. [Appendix 74] shaping a shaped object by irradiating a first surface of a member with a shaping energy beam to form a molten pool on the first surface and supplying a shaping material to the molten pool, irradiating at least a part of a second surface of the shaped object directed in a second direction intersecting a first direction in which the member and the shaped object are aligned with a processing energy beam are included in the processing method. [Appendix 75] supplying an energy beam, condensing the energy beam onto an object using a condensing optical system; supplying a shaping material to a condensing position where the energy beam is condensed; shaping an object as a shaped article by supplying the shaping material to the condensing position while changing a relative positional relationship between the condensing position and the object; irradiating the object with the energy beam through the condensing optical system; comprising; an optical path of the energy beam from the light source that condenses onto the object within the condensing optical system and an optical path of the energy beam that irradiates the object within the condensing optical system are the same optical path; processing method. [Appendix 76] A processing method for processing the surface of the object using the processing apparatus according to any one of Appendices 1 to 21 and 63 to 70. [Appendix 77] A processing method for processing the second surface using the processing apparatus according to any one of Appendices 22 to 62. [Appendix 78] A shaping apparatus for forming a target shaped article, a shaping apparatus for polishing the surface of the target shaped article using the processing apparatus according to any one of Appendices 1 to 70. [Appendix 79] A shaping apparatus for forming a target shaped article, a shaping apparatus for polishing the surface of the target shaped article using the processing method according to any one of Appendices 71 to 75. [Appendix 80] The shaping apparatus includes an energy beam irradiation device that irradiates a shaping surface with a shaping energy beam and a supply system that supplies a shaping material to the shaping surface, and forms the target shaped article by forming a melting pool on the shaping surface with the shaping energy beam irradiated on the shaping surface and melting the shaping material in the melting pool; The shaping apparatus according to Appendix 78 or 79. [Appendix 81] forming a target shaped article; Using the processing apparatus according to any one of Appendices 1 to 70, polishing the surface of the target shaped object A shaping method including this. [Appendix 82] Forming a target shaped object Using the processing method according to any one of Appendices 71 to 75, polishing the surface of the target shaped object A shaping method including this.

[0126] At least a part of the constituent elements of each of the above-described embodiments can be appropriately combined with at least another part of the constituent elements of each of the above-described embodiments. A part of the constituent elements of each of the above-described embodiments may not be used. Also, to the extent permitted by law, the disclosures of all the published gazettes and U.S. patents cited in each of the above-described embodiments are incorporated by reference and made part of the description herein.

[0127] The present invention is not limited to the above-described examples, and can be appropriately changed within a range not contrary to the gist or idea of the invention read from the claims and the entire specification. The processing apparatus, processing method, processing method, and shaping apparatus and shaping method involving such changes are also included in the technical scope of the present invention.

Description of Signs

[0128] 1 Shaping system 3 Material supply device 4 Shaping device 41 Shaping head 411 Irradiation system 412 Material nozzle 42 Head drive system 43 Stage 44 Stage drive system 5 Light source W Workpiece M Shaping material SL Structural layer ST Three-dimensional structure CS Shaping surface PS Polishing target surface EA Irradiation area MA Supply area MP Melting Pool

Claims

1. A shaping method for shaping a shaped object including a first constituent layer, a second constituent layer, and a third constituent layer by a shaping apparatus, comprising: a first shaping step of shaping the second constituent layer along a lamination direction by irradiating the first constituent layer shaped by the shaping apparatus with an energy beam and supplying a shaping material of the shaped object; a processing step of irradiating an object surface, which is a surface having a part of the first constituent layer and the second constituent layer and facing a direction intersecting the lamination direction, with the energy beam to melt and re-solidify at least a part of the object surface, thereby reducing the surface roughness of the object surface; a second shaping step of shaping the third constituent layer along the lamination direction by irradiating the second constituent layer shaped in the first shaping step with the energy beam and supplying the shaping material; including wherein the processing step is performed between the first shaping step and the second shaping step.

2. In the shaping method according to claim 1, the object surface is a surface along the lamination direction of the first constituent layer and the second constituent layer. Shaping method.

3. In the shaping method according to claim 1 or 2, in the first shaping step and the second shaping step, a first energy beam is used as the energy beam, and in the processing step, a second energy beam different from the first energy beam is used as the energy beam. Shaping method.

4. In the shaping method according to any one of claims 1 to 3, the processing step includes irradiating the energy beam so as to include a part of the first constituent layer and a part of the second constituent layer. Shaping method.

5. In the shaping method according to any one of claims 1 to 4, a part of the first constituent layer and a part of the second constituent layer include ends of the first constituent layer and the second constituent layer. Shaping method.

6. In the shaping method according to any one of claims 1 to 5, the processing step includes changing at least one of the light reflectance and the light diffusivity of the object surface. Shaping method.

7. In the shaping method according to any one of claims 1 to 6, The processing step includes moving at least one of a support device that supports a shaped article including the first constituent layer and the second constituent layer and an irradiation device that irradiates the energy beam, changing the positional relationship between the target surface and the irradiation position of the energy beam, and then irradiating the target surface with the energy beam in the changed positional relationship. Shaping method. **Claim 8** In the shaping method according to claim 7, the processing step includes irradiating the target surface facing the direction opposite to the gravitational direction with the energy beam. Shaping method. **Claim 9** In the shaping method according to claim 7 or 8, the second shaping step changes the positional relationship by moving the support device and shapes the third constituent layer in the changed positional relationship. Shaping method. **Claim 10** In the shaping method according to any one of claims 1 to 9, further includes a measuring step of measuring the shape of the shaped target surface, and the processing step reduces the surface roughness of the target surface based on the measured shape. Shaping method. **Claim 11** In the shaping method according to any one of claims 1 to 9, the processing step reduces the surface roughness of the target surface based on the design data of the shaped article. Shaping method. **Claim 12** In the shaping method according to any one of claims 1 to 11, the lamination directions of the first shaping step and the second shaping step are the same direction. Shaping method. **Claim 13** In the shaping method according to any one of claims 1 to 11, the lamination directions of the first shaping step and the second shaping step are different directions. Shaping method. **Claim 14** In the shaping method according to any one of claims 1 to 13, the first shaping step includes supplying the shaping material to a molten pool formed by irradiating the first constituent layer with the energy beam. Shaping method. **Claim 15** In the shaping method according to claim 3 and any one of claims 4 to 14 dependent on claim 3, the intensities of the first energy beam and the second energy beam are different from each other. Shaping method. **Claim 16** In the shaping method according to claim 3 and any one of claims 4 to 15 dependent on claim 3, the first and second energy beams are emitted from the same irradiation optical system. Shaping method. **Claim 17** In the shaping method according to claim 3 and any one of claims 4 to 15 dependent on claim 3, The first and second energy beams are emitted from different irradiation optical systems. Shaping method.

18. In the shaping method according to claim 3 and any one of claims 4 to 17 dependent on claim 3, The distance between the upper surface of the first constituent layer and the condensing position of the first energy beam is different from the distance between the target surface and the condensing position of the second energy beam. Shaping method.

19. In the shaping method according to claim 3 and any one of claims 4 to 18 dependent on claim 3, The energy per unit area of the first energy beam on the upper surface of the first constituent layer is higher than the energy per unit area of the second energy beam on the target surface. Shaping method.

20. In the shaping method according to claim 3 and any one of claims 4 to 19 dependent on claim 3, The size of the irradiation region of the second energy beam on the target surface is larger than the size of the irradiation region of the first energy beam on the upper surface of the first constituent layer. Shaping method.

21. A processing apparatus for shaping a shaped object including a first constituent layer and a second constituent layer, A first irradiation device that irradiates the first constituent layer with a first energy beam, A shaping material supply device that supplies the shaping material of the shaped object to the first constituent layer while irradiating the first energy beam, A second irradiation device that irradiates a target surface, which is a surface having a part of the second constituent layer shaped on the first constituent layer by the first irradiation device and the shaping material supply device and facing a direction intersecting the lamination direction, with a second energy beam, A control device And comprising The control device Controls the first irradiation device and the shaping material supply device so as to shape the first constituent layer and the second constituent layer along the lamination direction, Controls the second irradiation device so as to reduce the surface roughness of the target surface by irradiating the target surface with a second energy beam to melt and re-solidify it Processing apparatus.

22. In the processing apparatus according to claim 21, Further includes a measuring device that measures the shape of the target surface, The control device controls the second irradiation device based on the measured shape Processing apparatus.

23. In the processing apparatus according to claim 21 or 22, Including a positional relationship changing device that changes the positional relationship between the target surface and the irradiation position of the second energy beam Processing apparatus.

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