Laminated board, multilayer board, and method for manufacturing a laminated board

Abstract

To provide a laminate board, a multilayer board, and a manufacturing method of a laminate board.SOLUTION: A laminate board comprises: a liquid crystal polymer film; and at least one metallic layer attached to a surface of the liquid crystal polymer film. The liquid crystal polymer film has a melting point of 345°C or higher and comprises a liquid crystal polymer that is polymerized from a reactant including: a plurality of first monomers which are aromatic dicarboxylic acids, aliphatic dicarboxylic acids, or a combination thereof; a plurality of second monomers which are aromatic hydroxycarboxylic acids; a plurality of third monomers which are an aromatic diol and aliphatic diol, or a combination thereof; and a plurality of fourth monomers which are an aromatic diamine, aromatic hydroxyamine and aromatic aminocarboxylic acid, or a combination thereof.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to laminates, multilayer boards, and methods for manufacturing laminates.

Background Art

[0002] Laminates typically include an insulating substrate and metal wiring. When depositing and then thermocompression bonding multiple layers of laminates, if the heat resistance of the insulating substrate is not good, the metal wiring may easily sink or deform within the insulating substrate. Therefore, problems such as impedance errors occurring in the prior circuit design arise, and furthermore, it may increase signal transmission loss and cross-talk between wirings. In view of this, it has become an urgent task to develop a solution method that can overcome the above problems.

Summary of the Invention

[0003] The present disclosure provides a laminate including a liquid crystal polymer film including a liquid crystal polymer polymerized by a reactant including a plurality of first monomers having a melting point of 345 °C or higher and being aromatic dicarboxylic acids, aliphatic dicarboxylic acids, or combinations thereof, a plurality of second monomers being aromatic hydroxycarboxylic acids, a plurality of third monomers being aromatic diols, aliphatic diols, or combinations thereof, a plurality of fourth monomers being aromatic diamines, aromatic hydroxyamines, aromatic aminocarboxylic acids, or combinations thereof, or combinations thereof, and at least one metal layer attached to the surface of the liquid crystal polymer film.

[0004] In some embodiments, the liquid crystal polymer is polymerized by an aromatic diol, an aromatic dicarboxylic acid, and an aromatic hydroxycarboxylic acid.

[0005] In some embodiments, the liquid crystal polymer is polymerized by an aromatic dicarboxylic acid, an aromatic hydroxycarboxylic acid, and an aromatic hydroxyamine.

[0006] In some embodiments, the liquid crystal polymer is polymerized from aromatic dicarboxylic acid, aromatic hydroxycarboxylic acid and aliphatic diol.

[0007] In some embodiments, the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, a plurality of third monomer units and a plurality of fourth monomer units, and each first monomer unit is

Chem.

Chem.

Chem.

Chem.

[0008] In some embodiments, in the liquid crystal polymer, these first monomer units are 60 mol% to 74 mol%, these second monomer units are 14 mol% to 16 mol%, these third monomer units are 5 mol% to 13 mol%, and these fourth monomer units are 5 mol% to 13 mol%.

[0009] In some embodiments, in the liquid crystal polymer, these first monomer units are 60 mol% to 74 mol%, these second monomer units are 16 mol% to 18 mol%, these third monomer units are 9 mol% to 12 mol%, and these fourth monomer units are 9 mol% to 12 mol%.

[0010] In some embodiments, the liquid crystal polymer includes a plurality of first monomer units and a plurality of second monomer units, and each first monomer unit is [Chemical formula] and each second monomer unit is [Chemical formula] and these first monomer units are 70 mol% to 85 mol%, and these second monomer units are 15 mol% to 30 mol%.

[0011] In some embodiments, the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, and a plurality of third monomer units, and each first monomer unit is [Chemical formula] and each second monomer unit is [Chemical formula] and each third monomer unit is [Chemical formula] and these first monomer units are 55 mol% to 65 mol%, these second monomer units are 15 mol% to 25 mol%, and these third monomer units are 15 mol% to 25 mol%.

[0012] The present disclosure provides a multilayer board including at least one single-sided board or at least one double-sided board, and a laminate board according to any one of the above embodiments bonded to at least one single-sided board or at least one double-sided board.

[0013] The present disclosure provides a method for manufacturing a laminate, comprising: a liquid crystal polymer polymerized by reactants including a plurality of first monomers having a melting point of 345° C. or higher and being aromatic dicarboxylic acids, aliphatic dicarboxylic acids, or a combination thereof, a plurality of second monomers being aromatic hydroxycarboxylic acids, a plurality of third monomers being aromatic diols, aliphatic diols, or a combination thereof, a plurality of fourth monomers being aromatic diamines, aromatic hydroxyamines, aromatic aminocarboxylic acids, or a combination thereof, or a combination thereof; a step of producing a liquid crystal polymer film; and a step of forming at least one metal layer adhering to the surface of the liquid crystal polymer film.

[0014] In some embodiments, the liquid crystal polymer is polymerized by an aromatic diol, an aromatic dicarboxylic acid, and an aromatic hydroxycarboxylic acid.

[0015] In some embodiments, the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, a plurality of third monomer units, and a plurality of fourth monomer units, and each first monomer unit is

Chemical formula

Chemical formula

Chemical formula

Chemical formula

[0016] In some embodiments, in the liquid crystal polymer, these first monomer units are 60 mol% to 74 mol%, these second monomer units are 14 mol% to 16 mol%, these third monomer units are 5 mol% to 13 mol%, and these fourth monomer units are 5 mol% to 13 mol%.

[0017] In some embodiments, in the liquid crystal polymer, these first monomer units are 60 mol% to 74 mol%, these second monomer units are 16 mol% to 18 mol%, these third monomer units are 9 mol% to 12 mol%, and these fourth monomer units are 9 mol% to 12 mol%.

[0018] The present disclosure is a liquid crystal polymer polymerized from a reactant containing a plurality of first monomers that are aromatic dicarboxylic acids, aliphatic dicarboxylic acids or combinations thereof, having a melting point of less than 345°C, a plurality of second monomers that are aromatic hydroxycarboxylic acids, a plurality of third monomers that are aromatic diols, aliphatic diols or combinations thereof, a plurality of fourth monomers that are aromatic diamines, aromatic hydroxyamines, aromatic aminocarboxylic acids or combinations thereof, or combinations thereof, and having a first melting point of less than 345°C of T m A step of producing a first liquid crystal polymer film, and a heating temperature of T m -40°C to T m A step of heating the first liquid crystal polymer film by a heating process to form a second liquid crystal polymer film having a second melting point of 345°C or higher, and a step of forming at least one metal layer adhering to the surface of the second liquid crystal polymer film, and a method for manufacturing a laminate including the steps is provided.

[0019] In some embodiments, the liquid crystal polymer is polymerized from an aromatic dicarboxylic acid, an aromatic hydroxycarboxylic acid, and an aromatic hydroxyamine.

[0020] In some embodiments, the liquid crystal polymer is polymerized from an aromatic dicarboxylic acid, an aromatic hydroxycarboxylic acid, and an aliphatic diol.

[0021] In some embodiments, the liquid crystal polymer includes a plurality of first monomer units and a plurality of second monomer units, and each first monomer unit is

Chemical formula

Chemical formula

[0022] In some embodiments, the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, and a plurality of third monomer units, and each first monomer unit is

Chemical formula

Chemical formula

Chemical formula

Brief Description of the Drawings

[0023] By reading the following detailed description of the embodiments and referring to the drawings, the present disclosure can be more comprehensively understood.

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0024] The following multiple embodiments will be described in detail and disclosed with reference to the drawings. For the sake of clear explanation, many practical details will be described together in the following description. However, it should be understood that these practical details are not intended to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are not necessary. Also, for the purpose of simplifying the drawings, some known structures and elements are schematically shown in the drawings.

[0025] The methods disclosed herein will be described by a series of operations or steps hereinafter, but the order shown in these operations or steps should not be construed as limiting the present disclosure. For example, some operations or steps may be performed in a different order and / or simultaneously with other steps. Also, it is not necessary to perform all the operations, steps and / or features necessarily shown in the drawings before the embodiments of the present disclosure can be realized. Also, each operation or step described herein can include a plurality of sub-steps or actions.

[0026] The present disclosure provides a laminate including a liquid crystal polymer film and at least one metal layer attached to the surface of the liquid crystal polymer film. The liquid crystal polymer film has a melting point of 345°C or higher. In some embodiments, the melting point is from 345°C to 400°C, for example, 345, 350, 355, 360, 365, 370, 375, 385, 390, 395 or 400°C. The liquid crystal polymer film includes a liquid crystal polymer polymerized by reactants. The reactants include a plurality of first monomers, a plurality of second monomers, a plurality of third monomers, a plurality of fourth monomers or combinations thereof. These first monomers are aromatic dicarboxylic acids, aliphatic dicarboxylic acids or combinations thereof, these second monomers are aromatic hydroxycarboxylic acids, these third monomers are aromatic diols, aliphatic diols or combinations thereof, and these fourth monomers are aromatic diamines, aromatic hydroxyamines, aromatic aminocarboxylic acids or combinations thereof. Since the heat resistance of the liquid crystal polymer film is good, the laminate can withstand a thermal shock test at 250°C to 320°C. Specifically, the metal layer does not sink or deform in the liquid crystal polymer film during the thermal shock test.

[0027] The present disclosure provides a multilayer board including at least one single-sided board or at least one double-sided board and the above laminate. The laminate is bonded to at least one single-sided board or at least one double-sided board. Specifically, the laminate is pressure-bonded to at least one single-sided board or at least one double-sided board. Since the laminate of the present disclosure has good heat resistance, when the multilayer laminate of the present disclosure is thermocompression-bonded to form a multilayer board, it is possible to avoid the metal wiring from sinking into the liquid crystal polymer film, so problems such as impedance error of the circuit due to deformation of the wiring, increase in transmission loss, and increase in crosstalk between wirings can be avoided. Therefore, the multilayer board can have good quality after thermocompression-bonding.

[0028] FIG. 1 is a schematic cross-sectional view of a multilayer board according to various embodiments of the present disclosure. As shown in FIG. 1, the multilayer board ML1 includes a laminate 110 and a laminate 120. The laminate 110 and the laminate 120 each include a liquid crystal polymer film having a melting point of 345° C. or higher and at least one metal layer (not shown) attached to the surface of the liquid crystal polymer film. Since the liquid crystal polymer film has a high melting point, when the laminate 110 and the laminate 120 are pressed against each other (thermocompression bonding) to form the multilayer board ML1, the metal layer does not sink into the liquid crystal polymer film and thus does not deform. As a result, the multilayer board ML1 can have good quality after the compression bonding. In some embodiments, the laminate 110 and the laminate 120 are independently single-sided boards or double-sided boards.

[0029] FIG. 2 is a schematic cross-sectional view of a multilayer board according to various embodiments of the present disclosure. The multilayer board ML2 includes a laminate 210 and a laminate 220. The laminate 210 is a double-sided board, and the laminate 220 is a single-sided board. The laminate 210 includes a liquid crystal polymer film 212, a metal layer 214, and a metal layer 216, and the metal layers 214 and 216 are attached to the upper surface S1 and the lower surface S2 of the liquid crystal polymer film 212, respectively. More specifically, the metal layer 214 is in direct contact with the upper surface S1, and the metal layer 216 is in direct contact with the lower surface S2. The laminate 220 includes a liquid crystal polymer film 222 and a metal layer 224. The metal layer 224 is attached to the upper surface S3 of the liquid crystal polymer film 222. More specifically, the metal layer 224 is in direct contact with the upper surface S3. The liquid crystal polymer films 212 and 222 both have a melting point of 345° C. or higher. As shown in FIG. 2, the metal layers 214, 216, and 224 are metal wirings and may be referred to as patterned metal layers. The metal wiring is, for example, copper wiring. The method of forming the metal wiring includes forming a metal foil (for example, a copper foil) on the surface of the liquid crystal polymer film and then etching the metal foil to form the metal wiring. The method of forming the metal foil is, for example, a sputtering method, an electroless plating method, or an electroplating method. In another embodiment, the metal wiring is directly formed on the surface of the liquid crystal polymer film by printing or electroplating. However, in other embodiments, the metal layers 214, 216, and 224 may be unetched metal foils, so the upper surfaces S1, S2, and S3 are completely covered by the metal layers 214, 216, and 224, respectively. In some embodiments, the liquid crystal polymer films 212 and 222 are independently a thermoplastic liquid crystal polymer film or a thermotropic liquid crystal polymer film.

[0030] Continuing to refer to FIG. 2, the laminate 210 and the laminate 220 are overlapped, and the metal layer 214 is brought into contact with the lower surface S4 of the liquid crystal polymer film 222. Since the liquid crystal polymer film 212 has a high melting point, when the laminate 210 and the laminate 220 are pressure-bonded (thermocompression-bonded) to form the multilayer board ML2, the metal layer 214 will not sink into the liquid crystal polymer film 212 and will not be deformed by the pressure bonding. Therefore, the distance between the metal layer 214 and the metal layer 216 can match the predetermined circuit design. Based on the above, thermocompression-bonding will not cause impedance errors in the predetermined circuit design, will not increase signal transmission loss, and will not increase crosstalk between wirings. The multilayer board ML2 can have good quality.

[0031] FIG. 3 is a schematic cross-sectional view of a multilayer board according to various embodiments of the present disclosure. The multilayer board ML3 includes a laminate 310 and a laminate 320. Both the laminate 310 and the laminate 320 are single-sided boards. The laminate 310 includes a liquid crystal polymer film 312 and a metal layer 314. The metal layer 314 adheres to the upper surface S5 of the liquid crystal polymer film 312, and the lower surface S6 of the liquid crystal polymer film 312 is not covered by the metal layer. More specifically, the metal layer 314 is in direct contact with the upper surface S5. The laminate 320 includes a liquid crystal polymer film 322 and a metal layer 324. The metal layer 324 adheres to the upper surface S7 of the liquid crystal polymer film 322. More specifically, the metal layer 324 is in direct contact with the upper surface S7. The liquid crystal polymer films 312 and 322 have a melting point of 345° C. or higher. As shown in FIG. 3, the metal layers 314 and 324 are metal wirings and may be called patterned metal layers. However, in other embodiments, the metal layers 314 and 324 may be unetched metal foils, so the upper surfaces S5 and S7 are completely covered by the metal layers 314 and 324, respectively.

[0032] Continuing to refer to FIG. 3, the laminate 310 and the laminate 320 are overlapped, and the metal layer 314 is brought into direct contact with the lower surface S8 of the liquid crystal polymer film 322. Since the liquid crystal polymer film 312 has a high melting point, when the laminate 310 and the laminate 320 are pressure-bonded (thermocompression bonded) to form the multilayer board ML3, the metal layer 314 will not sink into the liquid crystal polymer film 312 and will not be deformed by the pressure bonding. Therefore, the pressure bonding (thermocompression bonding) will not cause impedance errors in a predetermined circuit design, will not increase signal transmission loss, and will not increase crosstalk between wirings. The multilayer board ML3 can have good quality.

[0033] FIG. 4 is a cross-sectional schematic view of a multilayer board according to various embodiments of the present disclosure. The multilayer board ML4 includes laminates 410, 420, 430, 440, 450, 460, and each of the above laminates includes a liquid crystal polymer film having a melting point of 345° C. or higher. Each laminate may be a single-sided board or a double-sided board. The single-sided board embodiment may refer to the embodiments of the laminate 220, the laminate 310, or the laminate 320 described above, and the double-sided board embodiment may refer to the embodiment of the laminate 210 described above. The laminates 410, 420, 430, 440, 450, 460 are pressure-bonded to form the multilayer board ML4. In the multilayer board ML4, the number of laminates may be arbitrarily adjusted according to the design needs, and the number may be 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, or 21, but is not limited thereto.

[0034] The present disclosure provides a method for manufacturing a laminate including the following operations. A liquid crystal polymer film is produced with a liquid crystal polymer having a melting point of 345 °C or higher. In some embodiments, the melting point is from 345 °C to 400 °C, for example, 345, 350, 355, 360, 365, 370, 375, 385, 390, 395 or 400 °C. The liquid crystal polymer is polymerized by a reactant including a plurality of first monomers, a plurality of second monomers, a plurality of third monomers, a plurality of fourth monomers or a combination thereof. These first monomers are aromatic dicarboxylic acids, aliphatic dicarboxylic acids or a combination thereof, these second monomers are aromatic hydroxycarboxylic acids, these third monomers are aromatic diols, aliphatic diols or a combination thereof, and these fourth monomers are aromatic diamines, aromatic hydroxyamines, aromatic aminocarboxylic acids or a combination thereof. At least one metal layer adhering to the surface of the liquid crystal polymer film is formed.

[0035] For example, the first monomer is

Chemical formula

Chemical formula

Chemical formula

Chemical formula

[0036] In some embodiments, the liquid crystal polymer having a melting point of 345 °C or higher is polymerized from an aromatic diol and an aromatic dicarboxylic acid.

[0037] In some embodiments, the liquid crystal polymer having a melting point of 345 °C or higher is polymerized from an aromatic diol and an aromatic hydroxycarboxylic acid.

[0038] In some embodiments, the liquid crystal polymer is a first type of thermotropic liquid crystal polymer. In some embodiments, the first type of thermotropic liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, and a plurality of third monomer units. Each first monomer unit is

Chemical formula

Chemical formula

Chemical formula

[0039] In some embodiments, a liquid crystal polymer having a melting point of 345 °C or higher is polymerized from an aromatic diol, an aromatic dicarboxylic acid, and an aromatic hydroxycarboxylic acid. For example, the liquid crystal polymer is polymerized from p-hydroxybenzoic acid (4-Hydroxybenzoic acid; HBA), 6-hydroxy-2-naphthoic acid (6-Hydroxy-2-naphthalene carboxylic acid; HNA), terephthalic acid (Terephthalic acid; TPA), and hydroquinone (hydroquinone; HQ), and the following first monomer unit, second monomer unit, third monomer unit, and fourth monomer unit can be obtained from HBA, HNA, TPA, and HQ, respectively. In some embodiments, the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, a plurality of third monomer units, and a plurality of fourth monomer units. Each first monomer unit is [Chemical formula] and each second monomer unit is [Chemical formula] and each third monomer unit is [Chemical formula] and each fourth monomer unit is [Chemical formula] It is so. In some embodiments, in the liquid crystal polymer, these first monomer units are 60 mol% to 74 mol%, these second monomer units are 14 mol% to 16 mol%, these third monomer units are 5 mol% to 13 mol%, and these fourth monomer units are 5 mol% to 13 mol%. In some embodiments, in the liquid crystal polymer, these first monomer units are 60 mol% to 74 mol%, these second monomer units are 16 mol% to 18 mol%, these third monomer units are 9 mol% to 12 mol%, and these fourth monomer units are 9 mol% to 12 mol%. The molar percentages of the first monomer unit, the second monomer unit, the third monomer unit, and the fourth monomer unit may be any positive integer within the above numerical ranges.

[0040] Next, a thermal shock test is performed on a laminate including a liquid crystal polymer film and copper wiring. Referring to FIG. 5, FIG. 5 is a schematic diagram of performing a thermal shock test according to various embodiments of the present disclosure. The laminate 510 includes a liquid crystal polymer film 512 and a metal layer 514 attached to the lower surface S10 of the liquid crystal polymer film 512. The laminate 520 includes a liquid crystal polymer film 522, a metal layer 524, and a metal layer 526, and the metal layer 526 and the metal layer 524 are attached to the upper surface S11 and the lower surface S12 of the liquid crystal polymer film 522, respectively. The laminate 510 is a single-sided flexible printed circuit board, and the laminate 520 is a double-sided flexible printed circuit board. The laminate 510 and the laminate 520 are overlapped, and the metal layer 524 is brought into contact with the upper surface S9 of the liquid crystal polymer film 512. The laminate 510 and the laminate 520 are thermocompression bonded by the cushion pad 532 of the thermoelectrode 530, and the thickness of the cushion pad 532 is 25 μm. The materials of the liquid crystal polymer films 512 and 522 are the same, and each includes a liquid crystal polymer polymerized by HBA, HNA, TPA, and HQ. Therefore, the liquid crystal polymer includes the above-described first monomer unit, second monomer unit, third monomer unit, and fourth monomer unit. The thicknesses of the liquid crystal polymer films 512 and 522 are 50 μm, and the metal layers 514, 524, and 526 are copper wirings. The copper wirings have a thickness of 12 μm, a line width of 1 mm, and a line pitch of 1 mm. The thermocompression bonding temperature may be 250°C to 320°C, the thermocompression bonding pressure is 10 N, the thermocompression bonding time is 20 seconds, and the number of thermocompression bonding times is 10. Referring to FIG. 6, FIG. 6 is a bottom surface schematic diagram of a laminate according to various embodiments of the present disclosure. The laminate 510 shown in FIG. 5 is a partial cross-sectional view of the laminate 510 in FIG. 6. The wiring pattern of the metal layer 524 and 526 may be designed with reference to the wiring pattern of the metal layer 514. Refer to Table 1 below for the test results of performing thermal shock with different liquid crystal polymer films.

Table 1

[0041] As can be seen from Table 1, the melting points of the liquid crystal polymer films of Examples 1 to 4 are higher than 345°C. The liquid crystal polymer film with a melting point of 350°C can withstand a thermocompression bonding temperature of 275°C. Specifically, the copper wiring of this liquid crystal polymer laminate does not sink into the liquid crystal polymer film at 275°C. The liquid crystal polymer film with a melting point of 355°C can withstand a thermocompression bonding temperature of 285°C. Specifically, the copper wiring of this liquid crystal polymer laminate does not sink into the liquid crystal polymer film at 285°C. Conversely, in Comparative Example 1 and Comparative Example 2, since the melting point of the liquid crystal polymer film is lower than 345°C, the copper wiring completely sinks into the liquid crystal polymer film.

[0042] The present disclosure provides a method for manufacturing another laminate including the following operations. A first liquid crystal polymer film is produced with a liquid crystal polymer having a melting point of less than 345°C. The liquid crystal polymer is polymerized by a reactant including a plurality of first monomers, a plurality of second monomers, a plurality of third monomers, a plurality of fourth monomers or a combination thereof. These first monomers are aromatic dicarboxylic acids, aliphatic dicarboxylic acids or a combination thereof, these second monomers are aromatic hydroxycarboxylic acids, these third monomers are aromatic diols, aliphatic diols or a combination thereof, and these fourth monomers are aromatic diamines, aromatic hydroxyamines, aromatic aminocarboxylic acids or a combination thereof. Embodiments of the first monomer, the second monomer, the third monomer and the fourth monomer refer to the foregoing embodiments, and the description thereof is omitted here. By adjusting the ratio of the monomers for synthesizing the liquid crystal polymer, the melting point of the liquid crystal polymer can be made less than 345°C, equal to it, or greater than it. The first melting point of the first liquid crystal polymer film is T m and T m is less than 345°C. The first liquid crystal polymer film is heated by a heating process to form a second liquid crystal polymer film having a second melting point of 345°C or higher. The heating temperature of the heating process is T m -40°C to T mForm at least one metal layer adhering to the surface of the second liquid crystal polymer film. By this method, a laminate in any one of the foregoing embodiments can be manufactured, and the laminate may be a single-sided board or a double-sided board.

[0043] In some embodiments, the heating temperature is, for example, T m -40, T m -35, T m -30, T m -25, T m -20, T m -15, T m -10, T m -5 or T m °C. During heating, the polymer in the liquid crystal polymer film is rearranged, increasing the molecular weight of the polymer, making the polymer arrangement more orderly, and raising the melting point of the liquid crystal polymer film. By raising the melting point, the liquid crystal polymer film can have good heat resistance. When laminating multiple layers of liquid crystal polymer laminates to form a multilayer board, the quality of the lamination can be improved, and it is difficult for metal wiring to sink into the liquid crystal polymer film. In some embodiments, the heating rate of the heating process is 0.1 °C / min to 30 °C / min. The heating rate is, for example, 0.1, 0.5, 1, 5, 10, 15, 20, 25, or 30 °C / min. In some embodiments, the heating time of the heating process is 10 minutes to 900 minutes. The heating time is, for example, 10, 20, 40, 60, 80, 100, 200, 300, 400, 500, 600, 700, 800, or 900 minutes. In some embodiments, the heating process is performed in an inert environment. For example, the inert gas in the inert environment is argon gas, nitrogen gas, or a combination thereof.

[0044] In some embodiments, a liquid crystal polymer having a melting point of less than 345 °C is polymerized by an aromatic diol, an aromatic dicarboxylic acid, and an aromatic hydroxycarboxylic acid. In some embodiments, a liquid crystal polymer having a melting point of less than 345 °C is polymerized by an aromatic diol and an aromatic dicarboxylic acid. In some embodiments, a liquid crystal polymer having a melting point of less than 345 °C is polymerized by an aromatic diol and an aromatic hydroxycarboxylic acid.

[0045] In some embodiments, the reactants include a different first aromatic hydroxycarboxylic acid and a second aromatic hydroxycarboxylic acid. In some embodiments, the liquid crystal polymer film includes a second type of thermotropic liquid crystal polymer. In some embodiments, the second type of thermotropic liquid crystal polymer is polymerized by p-hydroxybenzoic acid (HBA) and 6-hydroxy-2-naphthoic acid (HNA). The following first monomer unit and second monomer unit can be obtained by HBA and HNA respectively. In some embodiments, the liquid crystal polymer includes a plurality of first monomer units and a plurality of second monomer units. Each first monomer unit

Chemical formula

Chemical formula

[0046] In some embodiments, a liquid crystal polymer having a melting point of less than 345 °C is polymerized by an aromatic dicarboxylic acid, an aromatic hydroxycarboxylic acid, and an aromatic hydroxyamine. In some embodiments, the liquid crystal polymer is polymerized by 6-hydroxy-2-naphthoic acid (HNA), terephthalic acid (TPA), and p-aminophenol (AP). The second monomer unit, the third monomer unit, and the fourth monomer unit in the following liquid crystal polymers can be obtained by HNA, TPA, and AP, respectively. In some embodiments, the liquid crystal polymer includes a plurality of second monomer units, a plurality of third monomer units, and a plurality of fourth monomer units. Each second monomer unit is

Chemical formula

Chemical formula

Chemical formula

[0047] In some embodiments, a liquid crystal polymer having a melting point of less than 345 °C is polymerized from an aromatic diol, an aromatic dicarboxylic acid, and an aromatic hydroxycarboxylic acid. In some embodiments, the liquid crystal polymer is polymerized from p-hydroxybenzoic acid (HBA), 6-hydroxy-2-naphthoic acid (HNA), terephthalic acid (TPA), and 4,4'-biphenol (4,4'-BP). The first monomer unit, the second monomer unit, the third monomer unit, and the fifth monomer unit in the following liquid crystal polymers can be obtained from HBA, HNA, TPA, and BP, respectively. In some embodiments, the liquid crystal polymer comprises a plurality of first monomer units, a plurality of second monomer units, a plurality of third monomer units, and a plurality of fifth monomer units. Each first monomer unit is [Chemical formula] as follows, and each second monomer unit is [Chemical formula] as follows, and each third monomer unit is [Chemical formula] as follows, and each fifth monomer unit is [Chemical formula] as follows.

[0048] Refer to Table 2 below for the melting points and molar percentages of the monomer units of Liquid Crystal Polymer Films 1 to 4. [Table 2]

[0049] In some embodiments, the liquid crystal polymer is polymerized from an aromatic dicarboxylic acid, an aromatic hydroxycarboxylic acid, and an aliphatic diol. In some embodiments, the liquid crystal polymer is [Chemical formula] It contains the following monomer units.

[0050] Next, a thermal shock test was conducted with the arrangement shown in FIG. 5 above, and the test results are shown in Table 3 below. During the test, as the liquid crystal polymer films of Comparative Example 3 and Examples 5 to 7, the liquid crystal polymer film 1 or the liquid crystal polymer film 3 in Table 2 above was selected, and the melting point of the liquid crystal polymer film was adjusted by a heating process to obtain the post-heating melting point in Table 3. After forming copper wiring on the liquid crystal polymer film, a thermal shock test was conducted. As the liquid crystal polymer films of Comparative Example 4 and Examples 8 to 9, the liquid crystal polymer film 2 in Table 2 above was selected, and the melting point of the liquid crystal polymer film was adjusted by a heating process to obtain the post-heating melting point in Table 3. After forming copper wiring on the liquid crystal polymer film, a thermal shock test was conducted.

Table 3

[0051] As can be seen from Table 3, the liquid crystal polymer films with post-heating melting points of 345 °C, 350 °C, and 355 °C can withstand thermal bonding temperatures of 260 °C, 275 °C, and 285 °C respectively. Specifically, the copper wiring of these liquid crystal polymer laminates does not sink into the liquid crystal polymer film at the above thermal bonding temperatures. Conversely, in Comparative Example 3 and Comparative Example 4, since the melting point of the liquid crystal polymer film is less than 345 °C, the copper wiring completely sinks into the liquid crystal polymer film.

[0052] In summary, the present disclosure provides a laminate and a method for manufacturing the same, as well as a multilayer board. The laminate includes a liquid crystal polymer film and at least one metal layer attached to the surface of the liquid crystal polymer film. Since the laminate of the present disclosure has good heat resistance, when forming a multilayer board by thermocompression bonding multiple laminates, it is possible to avoid the metal wiring from sinking into the liquid crystal polymer film, thereby avoiding problems such as impedance errors of the circuit due to wiring deformation, an increase in transmission loss, and an increase in crosstalk between wirings. Therefore, the multilayer board can have good quality after thermocompression bonding.

[0053] Although the present disclosure has been described in great detail with reference to several embodiments, other embodiments are also possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

[0054] As will be apparent to those skilled in the art, various modifications and changes can be made to the configuration of the present disclosure without departing from the scope or spirit of the present disclosure. In view of the foregoing, the present disclosure is intended to cover modifications and changes of the present disclosure that fall within the scope of the appended claims.

Description of Reference Numerals

[0055] 110, 120, 210, 220, 310, 320, 410, 420, 430, 440, 450, 460, 510, 520 Laminate 212, 222, 312, 322, 512, 522 Liquid crystal polymer film 214, 216, 224, 314, 324, 514, 524, 526 Metal layer 530 Thermoelectric electrode 532 Cushion pad ML1, ML2, ML3, ML4, ML5 Multilayer board S1, S3, S5, S7, S9, S11 Upper surface S2, S4, S6, S8, S10, S12 Lower surface

Claims

1. A laminated plate comprising a liquid crystal polymer film containing a liquid crystal polymer and having a melting point of 345°C or higher, and at least one metal layer adhering to the surface of the liquid crystal polymer film, wherein the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, a plurality of third monomer units, and a plurality of fourth monomer units, or includes a plurality of fifth monomer units, a plurality of sixth monomer units, and a plurality of seventh monomer units, each first monomer unit is 【Chemical 1】 and each second monomer unit is 【Chemical 2】 and each third monomer unit is 【Chemical Formula 3】 and each fourth monomer unit is 【Chemical Formula 4】 and each fifth monomer unit is [Chemical Formula 5] and each sixth monomer unit is [Chemical Formula 6] and each seventh monomer unit is [Chemical 7] and the first monomer unit is 60 mol% to 74 mol%, the second monomer unit is 14 mol% to 16 mol%, the third monomer unit is 5 mol% to 13 mol%, and the fourth monomer unit is 5 mol% to 13 mol%, or when the liquid crystal polymer consists only of the plurality of first monomer units, the plurality of second monomer units, the plurality of third monomer units, and the plurality of fourth monomer units, the first monomer unit is 60 mol% to 66 mol%, the second monomer unit is 16 mol% to 18 mol%, the third monomer unit is 9 mol% to 12 mol%, and the fourth monomer unit is 9 mol% to 12 mol%, the fifth monomer unit is 55 mol% to 65 mol%, the sixth monomer unit is 15 mol% to 25 mol%, and the seventh monomer unit is 15 mol% to 25 mol%.

2. at least one single-sided plate or at least one double-sided plate, and the laminated plate according to Claim 1 bonded to the at least one single-sided plate or the at least one double-sided plate, wherein the multilayer plate comprises.

3. a step of producing a liquid crystal polymer film from a liquid crystal polymer having a melting point of 345°C or higher, and a step of forming at least one metal layer adhering to the surface of the liquid crystal polymer film, wherein the method comprises The liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, a plurality of third monomer units, and a plurality of fourth monomer units, and each first monomer unit is 【Chemical Formula 8】 and each second monomer unit is 【Chemical Formula 9】 and each third monomer unit is 【Chemical 10】 and each fourth monomer unit is 【Chemical Formula 11】 and the first monomer unit is 60 mol% to 74 mol%, the second monomer unit is 14 mol% to 16 mol%, the third monomer unit is 5 mol% to 13 mol%, and the fourth monomer unit is 5 mol% to 13 mol%, or when the liquid crystal polymer consists only of the plurality of first monomer units, the plurality of second monomer units, the plurality of third monomer units, and the plurality of fourth monomer units, the first monomer unit is 60 mol% to 66 mol%, the second monomer unit is 16 mol% to 18 mol%, the third monomer unit is 9 mol% to 12 mol%, and the fourth monomer unit is 9 mol% to 12 mol%. A method for manufacturing a laminate.

4. A step of producing a first liquid crystal polymer film from a liquid crystal polymer having a melting point of less than 345°C, The heating temperature is T ｍ -40°C to T ｍ heating the first liquid crystal polymer film by a heating process where the temperature is in this range to form a second liquid crystal polymer film having a second melting point of 345°C or higher A step of forming at least one metal layer adhering to the surface of the second liquid crystal polymer film, including the liquid crystal polymer includes a plurality of first monomer units, a plurality of second monomer units, and a plurality of third monomer units, and each first monomer unit is 【Chemical Formula 12】 and each second monomer unit is 【Chemical Formula 13】 and each third monomer unit is 【Chemical Formula 14】 and the first monomer unit is 55 mol% to 65 mol%, the second monomer unit is 15 mol% to 25 mol%, and the third monomer unit is 15 mol% to 25 mol%. A method for manufacturing a laminate.

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