Image projection device

Abstract

To provide an image projection device that can make an optical engine drip proof and water proof and extend the life of the image projection device.SOLUTION: The image projection device comprises: a light source that emits light; a modulation element that modulates the light emitted from the light source; a projection lens that projects the light modulated by the modulation element; a housing that has an upper plate and a lower plate provided side by side in the vertical direction and a plurality of side plates provided side by side in the horizontal direction, and accommodates at least the light source and the modulation element therein; light source heat radiation units that are provided on surfaces of the side plates directed to the outside of the housing and radiate heat from the light source; and a modulation element heat radiation unit that is provided on a surface of the side plate directed to the outside of the housing and radiates heat from the modulation element.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an image projection apparatus.

Background Art

[0002] In an image projection apparatus such as a projector, a mechanism is known in which heat in a heat-generating portion of an optical engine is connected to a heat radiating portion such as a heat sink for heat radiation, and the heat radiated to the heat radiating portion is cooled by a fan or the like.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Patent Document 1 describes a projector device in which a heat sink for radiating heat of internal optical components is provided on the upper outer side of a sealed device, and the heat sink is cooled by water in a water storage portion. However, it is necessary to cool the heat sink, and since a water storage portion is provided as a cooling configuration, it is necessary to manage the evaporation of water and perform maintenance on the cooling configuration itself, such as water injection.

[0004] The present invention has been made in view of the above, and an object thereof is to provide an image projection apparatus that can efficiently radiate heat of optical components inside a housing of the image projection apparatus without using a special cooling configuration.

Means for Solving the Problems

[0005] In order to solve the above-described problems and achieve the object, the present invention includes a light source that emits light, a modulation element that modulates the light emitted from the light source, a projection lens that projects the light modulated by the modulation element, an upper plate and a lower plate provided side by side in the vertical direction, and a plurality of side plates provided side by side in the horizontal direction, and has a housing that houses at least the light source and the modulation element inside, and is provided on a surface of the side plate facing the outside of the housing, and radiates heat of the light source A plurality of a light source heat radiating portion, and a modulation element heat radiating portion provided on a surface of the side plate facing the outside of the housing, and radiating heat of the modulation element. , the plurality of light source heat dissipation parts include the light source heat dissipation parts of the light sources with low heat generation amount and the light source heat dissipation parts of at least one or more light sources with high heat generation amount. Among the plurality of light source heat dissipation parts, the light source heat dissipation parts of the light sources with low heat generation amount are provided on the same surface as the surface from which the light modulated by the modulation element exits among the outer surfaces of the housing. The light source heat dissipation parts of at least one or more light sources with high heat generation amount among the plurality of light source heat dissipation parts and the modulation element heat dissipation part are provided on a surface different from the surface from which the light modulated by the modulation element exits. The size of the light source heat dissipation parts of the light sources with low heat generation amount is smaller than the size of the light source heat dissipation parts of at least one or more light sources with high heat generation amount and the size of the modulation element heat dissipation part 。

Advantages of the Invention

[0006] According to the present invention, there is an effect that the heat of the optical components inside the housing of the image projection apparatus can be efficiently radiated without using a special cooling configuration.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2A

Figure 2B

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

[0008] Hereinafter, embodiments of an image projection apparatus will be described in detail with reference to the accompanying drawings.

[0009] (First Embodiment) FIG. 1 is a diagram showing an example of a hardware configuration of a projector to which an image projection apparatus according to a first embodiment is applied. First, with reference to FIG. 1, an example of the hardware configuration of a projector 8 according to the present embodiment will be described.

[0010] As shown in FIG. 1, the projector 8 according to the present embodiment includes a CPU (Central Processing Unit) 801, a ROM (Read Only Memory) 802, a RAM (Random Access Memory) 803, a media I / F (Interface) 807, an operation unit 808, a power switch 809, a bus line 810, a network I / F 811, an LED (Light Emitting Diode) drive circuit 814, an LED light source 815, a projection device 816, a projection lens 817, and an external device connection I / F (Interface) 818.

[0011] Among these, the CPU 801 controls the operation of the entire projector 8. The ROM 802 stores a program used for driving the CPU 801. The RAM 803 is used as a work area for the CPU 801. The media I / F 807 controls reading or writing (storage) of data with respect to a recording medium 806 such as a flash memory.

[0012] The operation unit 808 is provided with various keys, buttons, LEDs, etc., and is used for the user to perform various operations on the projector 8 other than turning the power on / off. For example, the operation unit 808 receives instruction operations such as adjustment operations for the size of the projected image, adjustment operations for color tone, focus adjustment operations, keystone adjustment operations, etc., and outputs the received operation contents to the CPU 801.

[0013] The power switch 809 is a switch for switching the on / off of the power of the projector 8. The bus line 810 is an address bus, a data bus, etc. for electrically connecting each component such as the CPU 801 shown in FIG. 1. The network I / F 811 is an interface for performing data communication using a communication network 100 such as the Internet.

[0014] The LED drive circuit 814 controls the lighting and extinguishing of the LED light source 815 under the control of the CPU 801. The LED light source 815 is an example of a light source that emits light. When it is lit under the control of the LED drive circuit 814, the projection light irradiates the projection device 816. The projection device 816 (an example of a modulation element) modulates the projection light from the LED light source 815 by a spatial light modulation method based on the image data given via the external device connection I / F 818, etc., and projects the modulated light as an image onto the projection surface of the screen through the projection lens 817. As the projection device 816, for example, a liquid crystal panel or a DMD (Digital Micro-mirror Device) etc. is used. The projection lens 817 is an example of a projection lens that projects (projects) the light modulated by the projection device 816 onto the projection surface of the screen. The above LED drive circuit 814, LED light source 815, projection device 816, and projection lens 817 function as a projection unit (projection means) that projects a projection image onto the projection surface based on the image data as a whole.

[0015] The external device connection I / F 818 is directly connected to a PC (Personal Computer), and acquires control signals and image data with the PC.

[0016] Also, when power supply power is supplied, the CPU 801 starts according to a control program stored in advance in the ROM 802, gives a control signal to the LED drive circuit 814 to turn on the LED light source 815. Further, when the supply of power supply power from the power supply circuit 21 to the projector 8 is started, the projection device 816 becomes in a state where an image can be displayed, and further, power is supplied from the power supply circuit 21 to various other components.

[0017] Also, when the power switch 809 of the projector 8 is turned off, a power-off signal is sent from the power switch 809 to the CPU 801. When the CPU 801 detects the power-off signal, it gives a control signal to the LED drive circuit 814 to turn off the LED light source 815. The CPU 801 then ends its own control process by itself, and finally gives an instruction to the power supply circuit 21 to stop the supply of power supply power.

[0018] FIG. 2A is a perspective view of an example of a projector according to the first embodiment. FIG. 2B is a diagram showing an example of a schematic configuration of the projector according to the first embodiment. Next, an example of a schematic configuration of the projector 8 according to the present embodiment will be described with reference to FIGS. 2A and 2B.

[0019] In this embodiment, as shown in FIG. 2A, the projector 8 has a housing 203. The housing 203 houses an LED drive circuit 814, an LED light source 815, a projection device 816, a projection lens 817, and an illumination system 820 inside. Further, as shown in FIG. 2A, the housing 203 has six plate-like members (side plates 203a to 203d, upper plate 203e, lower plate 203f). Specifically, the housing 203 has an upper plate 203e and a lower plate 203f provided side by side in the vertical direction, and a plurality of side plates 203a, 203b, 203c, 203d provided side by side in the horizontal direction. That is, the housing 203 has a rectangular parallelepiped shape. The side plates 203a, 203b, 203c, 203d are arranged such that their surfaces are substantially parallel to the vertical direction. The upper plate 203e and the lower plate 203f are arranged such that their surfaces are substantially parallel to the horizontal direction. In this embodiment, the housing 203 has a rectangular parallelepiped shape, but is not limited thereto.

[0020] In this embodiment, the housing 203 houses an LED drive circuit 814, an LED light source 815, a projection device 816, and an illumination system 820, and houses a part of the projection lens 817. Further, in this embodiment, the housing 203 has a sealing member 204 (for example, a sealing material or a cushioning material) that houses the LED drive circuit 814, the LED light source 815, the projection device 816, and the illumination system 820 in a sealed state inside. The illumination system 820 guides the light emitted from the LED light source 815 to the projection device 816, and projects the light (modulated light) modulated by the projection device 816 onto the projection surface as an image through the projection lens 817.

[0021] In this embodiment, as shown in FIG. 2A, the projector 8 has a heat radiating portion 201 that radiates the heat of the LED light source 815 and the projection device 816. The heat radiating portion 201 is provided on the surface of at least any one of the side plates 203a, 203b, 203c, 203d facing the outside of the housing 203. In this embodiment, as an example, an example in which the heat radiating portion 201 is provided on the side plates 203a, 203c, 203d is shown.

[0022] In this embodiment, as shown in FIG. 2B, the LED light source 815 includes an LED light source 815a for R, an LED light source 815b for G, and an LED light source 815c for B. And the heat radiating part 201 of the projector 8 includes heat sinks 201a to 201c for light sources, which are an example of a light source heat radiating part that radiates heat from the LED light sources 815a to 815c, and a heat sink 201d for modulation elements, which is an example of a modulation element heat radiating part that radiates heat from the projection device 816, as shown in FIG. 2B.

[0023] The heat sinks 201a to 201c for light sources are provided on outer surfaces 203a', 203c' which are an example of the surfaces of the housing 203 facing the outside of the side plates 203a, 203c. Thereby, the heat generated by the LED light sources 815a, 815b is transmitted to the heat sink 201a for light sources through the side plate 203a and radiated, and the heat generated by the LED light source 815c is transmitted to the heat sink 201c for light sources through the side plate 203c and radiated. Also, the heat sink 201d for modulation elements is provided on an outer surface 203d' which is an example of the surface of the housing 203 facing the outside of the side plate 203d. Thereby, the heat generated by the projection device 816 is transmitted to the heat sink 201d for modulation elements through the side plate 203d and radiated.

[0024] The heat sinks 201a to 201c for light sources and the heat sink 201d for modulation elements are provided on the outer surfaces 203a', 203c', 203d' of the housing 203 of the projector 8, as shown in FIG. 2B. Thereby, the heat generated by the heat sources inside the projector 8 can be efficiently radiated. That is, since the projector 8 generates heat from the inside, an upward airflow is generated outside its housing 203. By providing heat radiating members on the outer surfaces 203a', 203c', 203d', efficient heat radiation using the upward airflow becomes possible. Also, the sealed state of the LED drive circuit 814, the LED light source 815, the projection device 816, the portion where the projection lens 817 is housed, and the illumination system 820 housed in the housing 203 can be enhanced.

[0025] Also, when forced air cooling using a fan or the like is employed, even if the lifespan of a light source, which is an example of an optical engine, is extended, the lifespan of the entire projector 8 may be shortened due to failures caused by the rotation of the fan motor or the like. However, since it does not have a configuration that causes failures such as in the motor, an effect of extending the lifespan of the projector 8 can also be obtained. Since it does not have a configuration for forced air cooling such as a fan, effects of miniaturization and cost reduction can also be obtained. In this way, it is possible to handle the drip-proof and waterproofing of the optical engine and extend the lifespan of the projector 8. Also, the heat of the optical components inside the housing 203 of the projector 8 can be efficiently radiated without using a special cooling configuration. In the present embodiment, the heat sinks 201a to 201c for the light source and the heat sink 201d for the modulation element may be black-painted.

[0026] In the present embodiment, among the heat sinks 201a to 201c for the light source and the heat sink 201d for the modulation element, a heat radiation part (an example of a first heat radiation part) that radiates the heat of a heat source that is easily affected by heat or has a large heat generation amount is made larger than a heat radiation part (an example of a second heat radiation part) of a heat source that is less affected by heat or has a small heat generation amount among the heat sinks 201a to 201c for the light source and the heat sink 201d for the modulation element. Here, the heat source is the LED light sources 815a to 815c or the projection device 816.

[0027] In the present embodiment, among the heat sinks 201a to 201c for the light source, the size of the heat sink 201a for the R LED light source 815a that is easily affected by heat, the size of the heat sink 201b for the G LED light source 815b that has a large heat generation amount, and the size of the heat sink 201d for the modulation element of the projection device 816 that has a large heat generation amount are made larger than the size of the heat sink 201c for the B LED light source 815c that has a small heat generation amount.

[0028] That is, a heat radiating portion (an example of the first heat radiating portion) that radiates heat from a heat source that is easily affected by heat or has a large calorific value is made to have higher heat radiating performance than a heat radiating portion (an example of the second heat radiating portion) of a heat source that is hardly affected by heat or has a small calorific value. For example, if the materials of the heat radiating portions are the same, the larger the size, the larger the heat capacity, and thus the more efficiently heat can be absorbed from the heat source. Therefore, when the materials of the heat radiating portions are the same, the heat radiating portion that radiates heat from a heat source that is easily affected by heat or has a large calorific value is made larger than the heat radiating portion of a heat source that is hardly affected by heat or has a small calorific value. Here, the heat radiating performance is improved by changing the size of the heat radiating portion. However, in addition to the size of the heat radiating portion, the heat radiating performance can also be changed by changing the material and shape of the heat radiating portion, and it is also possible to assign a heat radiating portion having appropriate heat radiating performance according to the heat source.

[0029] FIG. 3 is a diagram showing another example of the schematic configuration of the projector according to the first embodiment. Next, another example of the schematic configuration of the projector 8 according to the present embodiment will be described with reference to FIG. 3.

[0030] In the projector 8 shown in FIGS. 2A and 2B, heat source heat radiating portions such as the LED light sources 815a to 815c and the projection device 816 use the light source heat sinks 201a to 201c and the modulation element heat sink 201d. However, if the heat capacity of the heat source is large, and the heat source is only connected to the light source heat sinks 201a to 201c and the modulation element heat sink 201d, the heat of the heat source may not be sufficiently radiated. In this case, as shown in FIG. 3, a heat pipe 300 as a heat transport portion is connected to the heat source, and the heat generated from the heat source is transported to an arbitrary empty space, the light source heat sinks 201a to 201c, and the modulation element heat sink 201d, and it is also possible to improve the heat radiation efficiency of the heat source.

[0031] Specifically, as shown in FIG. 3, the heat generated from the LED light source 815a is transmitted to the heat sink 201a for the light source through the heat pipe 300 in contact with the LED light source 815a and the side plate 203a in contact with the heat pipe 300, and is dissipated. Also, the heat generated from the LED light source 815b is transmitted to the heat sink 201b for the light source through the heat pipe 300 in contact with the LED light source 815b and the side plate 203b in contact with the heat pipe 300, and is dissipated. Further, the heat generated from the projection device 816 is transmitted to the heat sink 201d for the modulation element through the heat pipe 300 in contact with the projection device 816 and the side plate 203d in contact with the heat pipe 300, and is dissipated. Furthermore, similar to FIG. 2B, the heat generated from the LED light source 815c is transmitted to the heat sink 201c for the light source through the side plate 203c and is dissipated.

[0032] FIGS. 4 and 5 are diagrams for explaining an example of the schematic configuration of the heat sink for the light source and the heat sink for the modulation element included in the projector according to the first embodiment. Next, an example of the schematic configuration of the heat sink 201a for the light source and the heat sink 201d for the modulation element will be described with reference to FIGS. 4 and 5. Here, the configurations of the heat sink 201a for the light source and the heat sink 201d for the modulation element will be described, but the heat sinks 201b and 201c for the light source have the same configuration.

[0033] In the present embodiment, as shown in FIG. 4, the heat sink 201a for the light source and the heat sink 201d for the modulation element have a plurality of fins. And each fin is provided along the gravitational direction (i.e., the upward air flow) so that the heat of the fin is dissipated by efficiently utilizing the upward air flow in which hot air rises upward, as shown in FIG. 4.

[0034] Specifically, as shown in FIGS. 4 and 5, it is preferable that a plurality of fins of the heat sink 201a for the light source and the heat sink 201d for the modulation element are provided with openings between the plurality of fins vertically so that the upward airflow between the plurality of fins can pass through. Further, the shape of the fins is an arbitrary shape. In the following description, the posture of the projector 8 in which a plurality of fins are arranged along the upward airflow (in other words, the posture of the projector 8 in which the openings between the plurality of fins are arranged vertically) is referred to as the basic installation posture (an example of a predetermined installation posture).

[0035] More specifically, the heat sink 201a for the light source is a planar fin, and each of the fins is arranged such that its surface is along the direction of gravity. Further, the heat sink 201a for the light source has a plurality of fins arranged substantially parallel to each other in the horizontal direction with a predetermined gap therebetween so that openings between the plurality of fins are provided vertically. Therefore, the upward airflow passes through the openings between the fins of the heat sink 201a for the light source without being obstructed.

[0036] Further, the heat sink 201d for the modulation element is a planar fin, and each of the fins is arranged such that its surface is along the direction of gravity. Also, the heat sink 201d for the modulation element has a plurality of fins arranged substantially parallel to each other in the horizontal direction with a predetermined gap therebetween so that openings between the plurality of fins are provided vertically. Further, the plurality of fins of the heat sink 201d for the modulation element are also arranged in the direction of gravity. In the example shown in FIG. 4, up to four fins of the heat sink 201d for the modulation element are arranged in the direction of gravity. And, as shown in FIG. 5, the fins of the heat sink 201d for the modulation element are arranged in the direction of gravity so as not to obstruct the upward airflow.

[0037] In FIGS. 4 and 5, the upward airflow passing through the heat sink 201a for the light source is described when the projector 8 is viewed from the side. For example, as shown in FIG. 3, the heat sink 201b for the light source is also arranged such that each fin has its surface along the direction of gravity. Further, in the heat sink 201b for the light source, a plurality of fins are arranged substantially parallel to each other in the horizontal direction with a predetermined gap therebetween so that openings between the plurality of fins are provided vertically. Therefore, also in the heat sink 201b for the light source, the upward airflow passes through the openings between the fins without being obstructed.

[0038] In FIGS. 4 and 5, the upward airflow passing through the heat sink 201d for the modulation element is described when the projector 8 is viewed from the side. For example, the heat sink 201c for the light source is also arranged such that each fin has its surface along the direction of gravity. Further, the heat sink 201c for the light source has a predetermined gap therebetween so that openings between the plurality of fins are provided vertically, and is arranged substantially parallel to each other in the horizontal direction. Also, the plurality of fins of the heat sink 201c for the light source are arranged side by side in the direction of gravity. In the example shown in FIG. 4, six fins of the heat sink 201c for the light source are arranged side by side in the direction of gravity. And, as shown in FIG. 5, the heat sink 201c for the light source is arranged in the direction of gravity so as not to obstruct the upward airflow.

[0039] FIG. 6 is a diagram for explaining an example of the basic installation posture of the projector according to the first embodiment. Next, an example of the basic installation posture of the projector 8 according to the present embodiment will be described with reference to FIG. 6.

[0040] For example, when the projector 8 is in the basic installation posture, if the projection image projected from the projector 8 onto the projection surface has a horizontal length of a and a vertical length of b, then a > b. In the present embodiment, it is assumed that the projector 8 is used in a state where the projection image projected onto the projection surface is in the state of a > b or in a ceiling-suspended state where the projection image is inverted from that state, and these states are the basic installation postures of the projector 8. In the present embodiment, when the projector 8 is in a posture other than the basic installation posture, since the plurality of fins of the heat sinks 201a to 201c for the light source and the heat sink 201d for the modulation element cannot dissipate heat by utilizing the upward airflow, it is difficult to obtain the same heat dissipation performance by the fins as when the projector 8 is in the basic installation posture.

[0041] Therefore, when it is assumed that the projector 8 is used in a state where the projection image is in the state of b > a, in a state of projecting on a table, or in a state where the projection image is inverted from the state of b > a, it is preferable that the projector 8 sets those states as the basic installation postures of the projector 8, and in that basic installation posture, a plurality of fins are arranged so as to be able to dissipate heat by utilizing the upward airflow.

[0042] FIG. 7 is a flowchart showing an example of the flow of the projection process of the projection image onto the projection surface by the projector according to the first embodiment. Next, an example of the flow of the projection process of the projection image onto the projection surface by the projector 8 according to the present embodiment will be described with reference to FIG. 7.

[0043] When the LED light source 815 is turned on under the control of the LED drive circuit 814 and the projection of the projection image onto the projection surface is started, the CPU 801 (an example of the control unit) detects the installation posture, which is the posture in which the projector 8 is installed, based on the detection result of the acceleration by the acceleration sensor provided in the projector 8 (step S701). Next, the CPU 801 determines whether the detected installation posture is the basic installation posture (step S702).

[0044] When it is determined that the detected installation posture is the basic installation posture (step S702: Yes), the process returns to step S701, and the CPU 801 continues to detect the installation posture of the projector 8. On the other hand, when it is determined that the detected installation posture is not the basic installation posture (step S702: No), the CPU 801 determines whether the detected installation posture is a posture obtained by inverting the basic installation posture up and down (step S703).

[0045] When it is determined that the detected installation posture is a posture obtained by inverting the basic installation posture up and down (step S703: Yes), the process returns to step S701, and the CPU 801 continues to detect the installation posture of the projector 8. On the other hand, when it is determined that the detected installation posture is not a posture obtained by inverting the basic installation posture up and down (step S703: No), the CPU 801 controls the LED drive circuit 814 to turn off the LED light source 815 and ends the projection of the projection image onto the projection surface. That is, when the detected installation posture is not the basic installation posture, the CPU 801 turns off the power of the projector 8.

[0046] FIG. 8 is a diagram showing an example of the installation of a heat sink in the projector according to the first embodiment. Next, an example of the installation of the heat sink in the projector 8 according to the present embodiment will be described with reference to FIG. 8.

[0047] In the present embodiment, as shown in FIG. 8, the projector 8 preferably provides the heat sink 201c for the LED light source 815c of B, which is less susceptible to heat or has a small heat generation amount, among the heat sinks 201a to 201c for the light source and the heat sink 201d for the modulation element, on the outer surface 203c' of the housing 203, which is the surface from which the light modulated by the projection device 816 is emitted onto the projection surface. Thereby, the sizes of the heat sink 201a for the R LED light source 815a, which is susceptible to heat, the heat sink 201b for the G LED light source 815b, which has a large heat generation amount, and the heat sink 201d for the modulation element of the projection device 816, which has a large heat generation amount, can be made larger.

[0048] That is, a projection lens 817 is provided on the outer surface 203c´. Accordingly, compared with the other side plates 203a, 203b, and 203d, the space where a heat sink can be provided is small. Therefore, a heat sink 201c for the light source of the B LED light source 815c, which is less susceptible to heat or has a low heat generation amount, is provided on the outer surface 203c´.

[0049] On the other hand, since no other members such as the projection lens 817 of the side plate 203c are provided on the other side plates 203a, 203b, and 203d, the space where a heat sink can be provided is large. Therefore, heat sinks 201a for the light sources of the R LED light sources 815a, which are susceptible to heat, heat sinks 201b for the light sources of the G LED light sources 815b, which have a large heat generation amount, and a heat sink 201d for the modulation element of the projection device 816, which has a large heat generation amount, are provided on the outer surfaces 203a´, 203b´, and 203d´.

[0050] FIG. 9 is a diagram for explaining an example of the schematic configuration of an illumination system included in the projector according to the first embodiment. Next, an example of the schematic configuration of an illumination system 820 included in the projector 8 according to the present embodiment will be described with reference to FIG. 9.

[0051] In the present embodiment, as shown in FIG. 9, the illumination system 820 includes a collimator lens 911, dichroic mirrors 912 and 913, a mirror 914, and a prism 915. The collimator lens 911 collimates the light (excitation light) emitted from the LED light sources 815a to 815c into parallel light. The dichroic mirror 912 transmits the blue light emitted from the B LED light source 815c and reflects the light of other colors (that is, the light emitted from the R LED light source 815a).

[0052] The dichroic mirror 913 transmits the blue light emitted from the LED light source 815c of B and the red light emitted from the LED light source 815a of R, and reflects the light of other colors (that is, the green light emitted from the LED light source 815b of G). The mirror 914 reflects all the light emitted from the LED light sources 815a to 815c. The prism 915 transmits incident light such as illumination light by a method such as the RTIR (Reverse Total Internal Reflection) prism method, and totally reflects the light reflected by the mirror 914.

[0053] In the illumination system 820 shown in FIG. 9, the excitation light emitted from the LED light source 815c of B becomes parallel light by the collimator lens 911, passes through the dichroic mirrors 912 and 913, is reflected by the mirror 914, then passes through the prism 915, is reflected by the projection device 816, is reflected again by the prism 915, and is projected onto the projection surface through the projection lens 817.

[0054] Also, in the illumination system 820 shown in FIG. 9, the excitation light emitted from the LED light source 815a of R becomes parallel light by the collimator lens 911, is reflected by the dichroic mirror 912 and the mirror 914, then passes through the prism 915, is reflected by the projection device 816, is reflected again by the prism 915, and is projected onto the projection surface through the projection lens 817.

[0055] Also, in the illumination system 820 shown in FIG. 9, the excitation light emitted from the LED light source 815b of G becomes parallel light by the collimator lens 911, is reflected by the dichroic mirror 913 and the mirror 914, then passes through the prism 915, is reflected by the projection device 816, is reflected again by the prism 915, and is projected onto the projection surface through the projection lens 817.

[0056] Thus, according to the projector 8 according to the first embodiment, the heat of the optical components inside the housing 203 of the projector 8 can be efficiently dissipated without using a special cooling configuration.

[0057] (Second Embodiment) This embodiment is an example in which the light source heat radiating part and the modulation element heat radiating part are radiators that radiate the heat of the LED light source and the projection device by liquid. In the following description, the description of the same configuration as that of the first embodiment will be omitted.

[0058] FIG. 10 is a diagram showing an example of the schematic configuration of a projector according to the second embodiment. As shown in FIG. 10, in the projector 8 according to this embodiment, radiators 901 and 902 are used for the heat radiating parts of the R and G LED light sources 815a and 815b and the projection device 816, respectively.

[0059] In this embodiment, the radiators 901 and 902 radiate the heat of the heat sources (LED light sources 815a and 815b and projection device 816) by water cooling. In this embodiment, the radiators 901 and 902 radiate the heat of the heat sources by water, but it is not limited to this as long as the heat of the heat sources is radiated by liquid. Further, in this embodiment, the projector 8 has heat receiving parts 903 to 905 that receive the heat of the R and G LED light sources 815a and 815b and the projection device 816, respectively.

[0060] Then, in this embodiment, the projector 8 transmits the heat received by the heat receiving parts 903 to 905 to the water circulating between the radiators 901 and 902 and the heat receiving parts 903 to 905 by the pump 906, and cools the water by the radiators 901 and 902, thereby radiating the heat of the R and G LED light sources 815a and 815b and the projection device 816.

[0061] FIG. 11 is a diagram for explaining an example of the heat radiation process of the heat source by the projector according to the second embodiment. Next, an example of the heat radiation process of the heat source by the projector 8 according to this embodiment will be described with reference to FIG. 11.

[0062] Specifically, the projector 8 circulates water through the heat receiving part 905 of the projection device 816, which generates a large amount of heat among the LED light sources 815a, 815b and the projection device 816 by means of the pump 906, and then circulates water through the heat receiving part 903 of one of the LED light sources (for example, the LED light source 815b) among the LED light sources 815a, 815b. Thereafter, the water is once cooled by the radiator 901. Then, the projector 8 circulates water from the radiator 901 through the heat receiving part 904 of the other LED light source (for example, the LED light source 815a) among the LED light sources 815a, 815b, and then cools the water by the radiator 902 and returns the water to the pump 906.

[0063] That is, in the present embodiment, the projector 8 first takes away the heat of the projection device 816 by the water circulated by the pump 906, and then takes away the heat of the LED light source 815b of G. Thereafter, the water is cooled by the radiator 901. Next, the projector 8 takes away the heat of the LED light source 815a of R by the water cooled by the radiator 901, and after cooling the water again by the radiator 902, returns the water to the pump 906. In this way, by constantly circulating water among the LED light sources 815a, 815b, the projection device 816, and the radiators 901, 902, the LED light sources 815a, 815b and the projection device 816 are cooled.

[0064] In the present embodiment, in order to reduce the size of the projector 8, a heat sink 201c for a light source is used for the heat radiating part of the LED light source 815c of B in the same manner as in the first embodiment. However, it is also possible to use a radiator for the light source heat radiating part of the LED light source 815c of B.

[0065] As described above, according to the projector 8 according to the second embodiment, the same operational effects as those of the first embodiment can be obtained.

Explanation of Reference Numerals

[0066] 8 Projector 201a, 201b, 201c Heat sinks for light sources Heat sink for 201d modulation element 203 Housing 203a, 203b, 203c, 203d Side plates 203e Upper plate 203f Lower plate 203a´, 203b´, 203c´, 203d´ Outer surfaces 300 Heat pipe 801 CPU 814 LED drive circuit 815, 815a, 815b, 815c LED light sources 816 Projection device 820 Lighting system 901, 902 Radiators 903 - 905 Heat receiving parts

Prior art documents

Patent documents

[0067]

Patent Document 1

Claims

1. A light source that emits light, A modulation element that modulates the light emitted from the light source, A projection lens that projects the light modulated by the modulation element, An upper plate and a lower plate provided side by side in the vertical direction, and a plurality of side plates provided side by side in the horizontal direction, and a housing that houses at least the light source and the modulation element inside, A plurality of light source heat radiating parts provided on the surface of the side plate facing the outside of the housing, for radiating the heat of the light source, A modulation element heat radiating part provided on the surface of the side plate facing the outside of the housing, for radiating the heat of the modulation element, and comprising, The plurality of light source heat radiating parts include a light source heat radiating part of the light source with a small heat generation amount, and a light source heat radiating part of at least one or more light sources with a large heat generation amount, The light source heat radiating part of the light source with a small heat generation amount among the plurality of light source heat radiating parts is provided on the same surface as the surface from which the light modulated by the modulation element exits among the outer surfaces of the housing, The light source heat radiating part of at least one or more light sources with a large heat generation amount among the plurality of light source heat radiating parts, and the modulation element heat radiating part are provided on a surface different from the surface from which the light modulated by the modulation element exits, An image projection apparatus, wherein the size of the light source heat radiating part of the light source with a small heat generation amount is smaller than the sizes of the light source heat radiating part of at least one or more light sources with a large heat generation amount and the modulation element heat radiating part.

2. The light source heat radiating part and the modulation element heat radiating part have a plurality of fins, The image projection apparatus according to claim 1, wherein openings between the plurality of fins are provided vertically.

3. The light source and the light source heat radiating part are connected by a heat pipe, The image projection apparatus according to claim 1 or 2, wherein the modulation element and the modulation element heat radiating part are connected by a heat pipe.

4. The image projection apparatus according to claim 1 or 2, wherein the light source heat radiating part and the modulation element heat radiating part are radiators that radiate the heat of the light source and the modulation element by liquid.

5. The image projection apparatus according to any one of claims 1 to 4, wherein the light source heat radiating part and the modulation element heat radiating part are black painted.

6. The image projection apparatus according to any one of claims 1 to 5, further comprising a control unit that detects the installation posture of the image projection apparatus and turns off the power of the image projection apparatus when the detected installation posture is not a predetermined installation posture.

7. The image projection apparatus according to any one of claims 1 to 6, wherein the housing has a sealing member inside the housing for sealing the light source and the modulation element.

8. The control unit turns off the power of the image projection apparatus when the detected installation posture is not any of the predetermined installation posture and the posture in which the top and bottom of the predetermined installation posture are inverted. The image projection apparatus according to claim 6.

9. A light source that emits light; A modulation element that modulates the light emitted from the light source; A projection lens that projects the light modulated by the modulation element; A housing that houses at least the light source and the modulation element inside; A heat radiating part that radiates heat of the light source or the modulation element, comprising: The heat radiating part is provided on a surface of a side plate of the housing facing the outside of the housing; The heat radiating part has a plurality of fins; Openings between the plurality of fins are provided vertically; The heat radiating part includes a plurality of light source heat radiating parts that radiate heat of the light source; The plurality of light source heat radiating parts include a light source heat radiating part of the light source with a small heat generation amount and a light source heat radiating part of at least one light source with a large heat generation amount; The light source heat radiating part of the light source with a small heat generation amount among the plurality of light source heat radiating parts is provided on the same surface as the surface of the outer side of the housing from which the light modulated by the modulation element is emitted; The light source heat radiating part of at least one light source with a large heat generation amount among the plurality of light source heat radiating parts and the heat radiating part of the modulation element are provided on a surface different from the surface from which the light modulated by the modulation element is emitted; An image projection apparatus, wherein the size of the light source heat radiating part of the light source with a small heat generation amount is smaller than the size of the light source heat radiating part of at least one light source with a large heat generation amount and the heat radiating part of the modulation element.

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