UV-curable resin composition for organic EL encapsulant
The UV-curable resin composition for organic EL encapsulants addresses landing position deviations and adhesion issues by using specific components with controlled residual voltage, enhancing the reliability and stability of inkjet application.
JP7709516B2Active Publication Date: 2025-07-16MITSUI CHEMICALS INC
Patent Information
- Application Number
- JP2023505601
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-03-10
- Filing Date
- 2022-03-09
- Publication Date
- 2025-07-16
- Estimated Expiration
- 2042-03-09
Smart Images
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Abstract
The ultraviolet-curing resin composition for an organic EL sealant comprises a component (a): at least one polymerizable compound selected from the group consisting of epoxy compounds and oxetane compounds, and a component (b): a nonionic polymerization initiator. When the ultraviolet-curing resin composition for an organic EL sealant contains a component (c): solvent, the content of component (c) is not more than 0.05 mass% with reference to the overall ultraviolet-curing resin composition for an organic EL sealant. The residual voltage of the ultraviolet-curing resin composition for an organic EL sealant is not greater than 1 V.
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Citation Information
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