Lead wire mounting component and method for manufacturing lead wire mounting component

Abstract

To provide a lead wire mounting component with a good sealability.SOLUTION: A lead wire mounting component 10 includes: a lead wire 20 having a conductor 22 and an insulation body 26 that covers an outer peripheral surface of the conductor 22; and a penetration hole 40 into which the lead wire 20 is inserted, and comprises: a lead wire holding member 30 that holds the lead wire 20; a first filling agent 50 that is filled with a whole of a cross-section of a part inserted into the penetration hole 40 of the conductor 22, and in which a liquid cannot pass; and a second filling agent 60 that is filled over between the conductor 22 into which the first filling agent 50 is filled and the lead wire holding member 30 and the whole body of a peripheral direction, and to which the liquid cannot pass.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a lead wire-mounted component and a method for manufacturing the lead wire-mounted component.

Background Art

[0002] Conventionally, lead wires have been used to connect electronic components and the like disposed inside a case of a transmission of an automobile or the like to electronic components and the like disposed outside the case. The lead wire is inserted, for example, through a through hole formed in the case via a holding member that holds the lead wire, one end is disposed inside the case, and the other end is disposed outside the case. The case is filled with a liquid such as oil, for example, and the lead wire is located in the oil.

[0003] For example, Patent Document 1 discloses a technique in which, in a structure in which a lead wire connects inside and outside a liquid container, a holding member that holds the lead wire is attached to an attachment hole of the liquid container. A filler is filled in the core wire (conductor) of the portion where the insulating coating (insulator) of the lead wire is removed so that the liquid inside the liquid container does not flow out to the outside of the liquid container through the lead wire.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the technology of Patent Document 1, since it is necessary to fill a filler inside the core wire of the lead wire, it is necessary to select a filler with a relatively low viscosity. However, when a low-viscosity filler is used, there is a risk that the filler will leak out to the outside from the gap between the lead wire and the holding member, and a gap will be generated between the lead wire and the holding member. If there is a gap between the lead wire and the holding member, there is a risk that the liquid contained inside the liquid container will leak out to the outside through the gap.

[0006] The present invention has been made in view of such a point, and an object thereof is to provide a lead wire mounting component having excellent sealing performance and a method for manufacturing the same.

Means for Solving the Problems

[0007] The lead wire mounting component according to the present invention includes a lead wire having a conductor and an insulator covering the outer peripheral surface of the conductor, a lead wire holding member having a through hole through which the lead wire is inserted and holding the lead wire, a first filler that fills the entire cross section of the portion of the conductor inserted into the through hole and through which liquid cannot pass, and a second filler that fills between the conductor filled with the first filler and the lead wire holding member over the entire circumferential direction and through which liquid cannot pass.

[0008] According to the lead wire mounting component of the present invention, the entire cross section of the portion of the conductor inserted into the through hole is filled with a first filler through which liquid cannot pass. For this reason, even if a part of the lead wire is disposed in the liquid and liquid flows through the conductor from one end of the lead wire, the flow of the liquid is blocked by the first filler. That is, the flow of liquid from one end to the other end of the lead wire is suppressed. Further, a second filler through which liquid cannot pass is filled between the conductor filled with the first filler and the lead wire holding member over the entire circumferential direction. For this reason, even if a part of the lead wire and the lead wire holding member are disposed in the liquid, the flow of liquid from between the lead wire and the lead wire holding member is blocked by the second filler.

[0009] Further, the manufacturing method of the lead wire mounting component according to the present invention includes a lead wire having a conductor and an insulator covering the outer peripheral surface of the conductor, and a lead wire holding member having a through hole through which the lead wire is inserted and holding the lead wire. The manufacturing method of the lead wire mounting component includes a forming step of forming an exposed portion where the conductor is exposed in the lead wire, a first filling step of filling the entire cross section of the exposed portion with a first filler having a first viscosity and through which liquid cannot pass, an arranging step of arranging the exposed portion in the through hole, and a second filling step of filling the space between the exposed portion filled with the first filler and the lead wire holding member and over the entire circumferential direction with a second filler having a second viscosity and through which liquid cannot pass. The first viscosity is lower than the second viscosity.

[0010] According to the manufacturing method of the lead wire mounting component according to the present invention, in the first filling step, a first filler through which liquid cannot pass is filled over the entire cross section of the exposed portion. Here, the first viscosity of the first filler is lower than the second viscosity of the second filler. Therefore, the first filler can be more reliably filled over the entire cross section of the exposed portion. As a result, a part of the lead wire is disposed in the liquid, and even if liquid flows through the conductor from one end of the lead wire, the flow of the liquid is blocked by the first filler. That is, the flow of liquid from one end to the other end of the lead wire is suppressed. Further, in the second filling step, a second filler through which liquid cannot pass is filled over the entire circumferential direction between the exposed portion filled with the first filler and the lead wire holding member. Here, the second viscosity of the second filler is higher than the first viscosity of the first filler. Therefore, the second filler does not leak to the outside from the gap between the lead wire and the lead wire holding member, and the gap between the lead wire and the lead wire holding member can be more reliably filled with the second filler. As a result, even if a part of the lead wire and the lead wire holding member are disposed in the liquid, the flow of liquid between the lead wire and the lead wire holding member is blocked by the second filler.

Advantages of the Invention

[0011] According to the present invention, it is possible to provide a lead wire mounting component having excellent sealing performance and a manufacturing method thereof.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0013] Hereinafter, embodiments of a lead wire mounting component according to the present invention will be described with reference to the drawings. Note that the embodiments described here are not intended to limit the present invention in particular. Also, members and parts having the same function are denoted by the same reference numerals, and redundant descriptions are omitted or simplified as appropriate.

[0014] As shown in FIG. 1, the liquid storage case 100 with a lead wire includes a lead wire mounting component 10 and a liquid storage case 110. The liquid storage case 100 with a lead wire is used, for example, as a case of a transmission of an automobile or the like, a case of a motor, or the like.

[0015] As shown in FIG. 1, the liquid storage case 110 has a liquid storage chamber 120 for storing liquid and an attachment hole 130 communicating with the liquid storage chamber 120. The liquid storage chamber 120 stores, for example, mission oil as the liquid. The liquid storage chamber 120 stores a part of the lead wire mounting component 10. The liquid storage chamber 120 stores an electronic component or the like (not shown) connected to one end of the lead wire mounting component 10. The attachment hole 130 penetrates the side wall 110W of the liquid storage case 110. The lead wire mounting component 10 is attached to the attachment hole 130.

[0016] As shown in FIG. 1, the lead wire mounting component 10 includes a lead wire 20, a lead wire holding member 30 for holding the lead wire 20, a first filler 50, and a second filler 60.

[0017] As shown in FIG. 1, the lead wire 20 includes a conductor 22 and an insulator 26 covering the outer peripheral surface of the conductor 22. The conductor 22 is composed of a core wire of a conductive metal (for example, copper or aluminum). The insulator 26 is composed of, for example, polyvinyl chloride, fluororesin, cross-linked polyethylene, natural rubber, synthetic rubber, or the like. The lead wire 20 has an exposed portion 24 where a part of the insulator 26 is removed and the conductor 22 is exposed. The exposed portion 24 includes a first exposed portion 24A which is a portion inserted into a through hole 40 described later, and a second exposed portion 24B located outside the lead wire holding member 30.

[0018] As shown in FIG. 1, the lead wire holding member 30 has an insertion portion 32, an engagement portion 34, a retaining portion 36, and a through hole 40. The lead wire holding member 30 is formed of an elastically deformable material. The lead wire holding member 30 is formed of, for example, natural rubber, synthetic rubber, or the like. The lead wire holding member 30 is attached to the mounting hole 130 of the liquid storage case 110. The insertion portion 32 is a portion inserted into the mounting hole 130. The insertion portion 32 is located outside the liquid storage case 110. The engagement portion 34 is a portion that engages with the mounting hole 130. The retaining portion 36 is a member that suppresses the lead wire holding member 30 attached to the mounting hole 130 from falling off the liquid storage case 110. The retaining portion 36 is located inside the liquid storage case 110 (more specifically, inside the liquid storage chamber 120). The outer diameter of the engagement portion 34 is smaller than the outer diameter of the insertion portion 32 and the outer diameter of the retaining portion 36. The outer diameter of the insertion portion 32 is smaller than the outer diameter of the retaining portion 36. Note that the outer diameter of the insertion portion 32 may be larger than the outer diameter of the retaining portion 36 or may be the same.

[0019] As shown in FIG. 1, the through hole 40 penetrates the lead wire holding member 30. A lead wire 20 is inserted through the through hole 40. The through hole 40 includes a first through hole 41 having an outer diameter substantially the same as the outer diameter of the lead wire 20, and a second through hole 42 that communicates with the first through hole 41 and has an inner diameter larger than the outer diameter of the lead wire 20. The first through hole 41 is formed across a part of the insertion portion 32, the engagement portion 34, and the retaining portion 36. The second through hole 42 is formed in the other part of the insertion portion 32. In the first through hole 41, the conductor 22 covered by the insulator 26 of the lead wire 20 is disposed. In the second through hole 42, the conductor 22 with a part of the insulator 26 removed is disposed. In the present embodiment, the second through hole 42 is located outside the liquid storage case 110.

[0020] The first filler 50 is configured to be impermeable to liquid. The first filler 50 is, for example, a substance (adhesive) that cures at normal temperature (e.g., 20°C to 30°C). Examples of the first filler 50 include anaerobic adhesives, instant adhesives, etc. Examples of the first filler 50 include acrylic resin-based adhesives. Depending on the configuration of the conductor 22 of the lead wire 20, the first viscosity of the first filler 50 before curing is, for example, 600 mPa·s or less (e.g., 100 mPa·s to 150 mPa·s). The first viscosity and the second viscosity described later can be measured, for example, using a standard vibrating viscometer (e.g., a vibrating viscometer compliant with JIS Z 8803:2011 Method for Measuring Viscosity of Liquids) in the relevant field.

[0021] As shown in FIG. 1, the first filler 50 fills the entire cross-section of the portion of the conductor 22 inserted into the through-hole 40. The first filler 50 fills the entire cross-section of the portion of the conductor 22 inserted into the through-hole 40 that is not covered by the insulator 26. In the present embodiment, the first filler 50 fills the entire cross-section of the portion of the conductor 22 inserted into the through-hole 40 where a part of the insulator 26 has been removed (i.e., the first exposed portion 24A). The first filler 50 is filled in the conductor 22 located in the second through-hole 42. The first filler 50 fills the gaps (gaps between core wires) of the conductor 22. The first filler 50 is disposed outside the liquid storage case 110. Since the first filler 50 fills the entire cross-section of the conductor 22, the liquid flowing inside the conductor 22 is blocked from moving by the first filler 50, and the flow of liquid to the outside through the conductor 22 is suppressed.

[0022] The second filler 60 is configured to be impermeable to liquid. The second filler 60 is, for example, a substance (adhesive) that cures in a high-temperature environment (for example, 80°C to 200°C). Examples of the second filler 60 include thermosetting adhesives and room-temperature curing adhesives. Examples of the second filler 60 include epoxy resin-based adhesives and urethane resin-based adhesives. The second viscosity of the second filler 60 before curing is, for example, 10,000 mPa·s or more (for example, 10,000 mPa·s to 30,000 mPa·s). Note that the second filler 60 is not particularly limited as long as the second viscosity before curing is higher than the first viscosity of the first filler 50 before curing.

[0023] As shown in FIG. 1, the second filler 60 is filled between the conductor 22 filled with the first filler 50 and the lead wire holding member 30 and over the entire circumferential direction. The second filler 60 is filled outside the conductor 22 filled with the first filler 50 located in the second through hole 42. The second filler 60 fills the gap between the conductor 22 filled with the first filler 50 and the lead wire holding member 30. The thickness of the second filler 60 is greater than the thickness of the insulator 26. The second filler 60 is disposed outside the liquid storage case 110. By filling the second filler 60 at the above-described predetermined position, it is possible to suppress the liquid from flowing from the lead wire holding member 30 to the outside through the space between the conductor 22 filled with the first filler 50 and the lead wire holding member 30. Thus, since the lead wire mounting component 10 is provided with the first filler 50 and the second filler 60 at predetermined positions, it has excellent sealing properties.

[0024] The elastic modulus of the second filler 60 is higher than that of the first filler 50. The elastic modulus of the lead wire holding member 30 is lower than that of the second filler 60 and higher than that of the first filler 50. Note that the elastic modulus of the lead wire holding member 30 may be higher than that of the second filler 60. Here, the elastic moduli of the first filler 50 and the second filler 60 are the values after curing. The elastic modulus can be measured, for example, in accordance with JIS K7181:2011 (compressive properties) and JIS K7161-1:2014 (tensile properties).

[0025] Next, a manufacturing method of the lead wire mounting component 10 will be described. FIG. 2 is a flowchart showing the manufacturing method of the lead wire mounting component 10. As shown in FIG. 2, the manufacturing method of the lead wire mounting component 10 includes a forming step (step S10), a first filling step (step S20), an arranging step (step S30), and a second filling step (step S40).

[0026] In the forming step (step S10), an exposed portion 24 where the conductor 22 is exposed is formed in the lead wire 20. In the forming step (step S10), for example, in the lead wire 20, a part of the insulator 26 is removed to form the exposed portion 24 where the conductor 22 is exposed. Note that in the forming step (step S10), for example, in the lead wire 20, the exposed portion 24 where the conductor 22 is exposed may be formed by preparing the conductor 22 that has not been covered by the insulator 26 from the beginning.

[0027] In the first filling step (step S20), a first filler 50 having a first viscosity and through which liquid cannot pass is filled (applied) over the entire cross section of the exposed portion 24 of the lead wire 20. In step S20, after filling the exposed portion 24 with the first filler 50, the first filler 50 is cured.

[0028] In the arranging step (step S30), the exposed portion 24 of the lead wire 20 filled with the first filler 50 is arranged in the through hole 40 of the lead wire holding member 30. Here, the first exposed portion 24A of the lead wire 20 filled with the first filler 50 is arranged in the second through hole 42.

[0029] In the second filling step (step S40), a second filler 60 having a second viscosity and through which liquid cannot pass is filled (applied) between the exposed portion 24 filled with the first filler 50 and the lead wire holding member 30 and over the entire circumferential direction. The second viscosity is higher than the first viscosity. In step S40, after filling the second filler 60 at the above-described predetermined position, the second filler 60 is cured. Thereby, the lead wire mounting component 10 is manufactured.

[0030] In addition, in the above manufacturing method, after the exposed portion 24 of the lead wire 20 is filled with the first filler 50, the lead wire 20 is disposed in the through hole 40 of the lead wire holding member 30, but the present invention is not limited thereto. FIG. 3 is a flowchart showing another manufacturing method of the lead wire mounting component 10. As shown in FIG. 3, another manufacturing method of the lead wire mounting component 10 includes a forming step (step S10), a disposing step (step S120), a first filling step (step S130), and a second filling step (step S40). Note that the forming step (step S10) and the second filling step (step S40) are the same as those in the above manufacturing method, and thus the description thereof is omitted.

[0031] In the disposing step (step S120), the exposed portion 24 of the lead wire 20 is disposed in the through hole 40 of the lead wire holding member 30. Here, the first exposed portion 24A of the lead wire 20 is disposed in the second through hole 42. In step S120, the exposed portion 24 is not yet filled with the first filler 50.

[0032] In the first filling step (step S130), the first filler 50 having a first viscosity and through which liquid cannot pass is filled over the entire cross section of the exposed portion 24 of the lead wire 20 disposed in the through hole 40. In step S130, after the exposed portion 24 is filled with the first filler 50, the first filler 50 is cured.

[0033] As described above, according to the lead wire mounting component 10 of the present embodiment, the entire cross section of the portion of the conductor 22 inserted into the through hole 40 is filled with a first filler 50 through which liquid cannot pass. Therefore, even if a part of the lead wire 20 is disposed in the liquid and liquid flows through the conductor 22 from one end of the lead wire 20, the flow of the liquid is blocked by the first filler 50. That is, the flow of liquid from one end to the other end of the lead wire 20 is suppressed. Further, a second filler 60 through which liquid cannot pass is filled between the conductor 22 filled with the first filler 50 and the lead wire holding member 30 over the entire circumferential direction. Therefore, even if a part of the lead wire 20 and the lead wire holding member 30 are disposed in the liquid, the flow of liquid from between the lead wire 20 and the lead wire holding member 30 is blocked by the second filler 60.

[0034] In the lead wire mounting component 10 of the present embodiment, the first filler 50 is filled in the entire cross section of the portion of the conductor 22 inserted into the through hole 40 and not covered by the insulator 26. According to the above aspect, the flow of liquid from one end to the other end of the lead wire 20 is more reliably suppressed.

[0035] In the lead wire mounting component 10 of the present embodiment, the elastic modulus of the second filler 60 is higher than the elastic modulus of the first filler 50. According to the above aspect, since the second filler 60 easily follows the movement of the conductor 22, the sealing property is excellent.

[0036] In the lead wire mounting component 10 of the present embodiment, the elastic modulus of the lead wire holding member 30 is lower than the elastic modulus of the second filler 60 and higher than the elastic modulus of the first filler 50. According to the above aspect, for example, when the lead wire holding member 30 of the lead wire mounting component 10 is inserted into and attached to the attachment hole 130 of the liquid storage case 110, since the elastic modulus of the second filler 60 is the highest (that is, the second filler 60 is most easily deformed), it is easy to insert and the attachment property is excellent.

[0037] In the lead wire mounting component 10 of the present embodiment, the elastic modulus of the lead wire holding member 30 may be higher than the elastic modulus of the second filler 60. According to the above aspect, since the elastic modulus increases toward the outer side in the radial direction from the center of the conductor 22, the vibration transmitted to the lead wire holding member 30 gradually attenuates and is less likely to be transmitted to the conductor 22.

[0038] The liquid storage case 100 with lead wires of the present embodiment includes a liquid storage case 110 having a lead wire mounting component 10, a liquid storage chamber 120 for storing a liquid, and a mounting hole 130 that communicates with the liquid storage chamber 120 and to which the lead wire mounting component 10 is attached. The first filler 50 and the second filler 60 are disposed outside the liquid storage case 110. According to the above aspect, by disposing the first filler 50 and the second filler 60 outside the liquid storage case 110, the size of the retaining portion 36 can be reduced, so that the cost of the lead wire mounting component 10 can be reduced. In addition, since the positions of the attachment portion (for example, the engaging portion 34) of the lead wire mounting component 10 and the filling portion (the first filler 50 and the second filler 60) can be separated, the compressive stress applied to the attachment portion is less likely to be transmitted to the filling portion, and a reliable sealing property can be maintained in the filling portion.

[0039] According to the manufacturing method of the lead wire mounting component 10 of the present embodiment, in the first filling step (step S20), a first filler 50 through which liquid cannot pass is filled over the entire cross section of the exposed portion 24. Here, the first viscosity of the first filler 50 is lower than the second viscosity of the second filler 60. Therefore, the first filler 50 can be more reliably filled over the entire cross section of the exposed portion 24. As a result, a part of the lead wire 20 is disposed in the liquid, and even if the liquid flows through the conductor 22 from one end of the lead wire 20, the flow of the liquid is blocked by the first filler 50. That is, the flow of the liquid from one end to the other end of the lead wire 20 is suppressed. Further, in the second filling step (step S40), a second filler 60 through which liquid cannot pass is filled between the exposed portion 24 filled with the first filler 50 and the lead wire holding member 30 and over the entire circumferential direction. Here, the second viscosity of the second filler 60 is higher than the first viscosity of the first filler 50. Therefore, the second filler 60 does not leak to the outside from the gap between the lead wire 20 and the lead wire holding member 30, and the gap between the lead wire 20 and the lead wire holding member 30 can be more reliably filled with the second filler 60. As a result, even if a part of the lead wire 20 and the lead wire holding member 30 is disposed in the liquid, the flow of the liquid between the lead wire 20 and the lead wire holding member 30 is blocked by the second filler 60.

[0040] In the manufacturing method of the lead wire mounting component 10 of the present embodiment, the placement step (step S30) is performed after the first filling step (step S20). According to the above aspect, since the first filler 50 can be filled in the exposed portion 24 where the conductor 22 is exposed regardless of the shape of the lead wire holding member 30, the working efficiency is improved.

[0041] In the manufacturing method of the lead wire mounting component 10 of the present embodiment, the placement step (step S120) may be performed before the first filling step (step S130). According to the above aspect, when the exposed portion 24 filled with the first filler 50 is inserted into the through hole 40, there is a possibility that the first filler 50 peels off from the conductor 22 in contact with the lead wire holding member 30. However, since the first filler 50 is filled in the conductor 22 after the exposed portion 24 is disposed in the through hole 40, the occurrence of peeling due to contact can be suppressed.

[0042] The preferred embodiments of the present invention have been described above. However, the above-described embodiments are merely examples, and the present invention can be implemented in various other forms.

[0043] In the above-described embodiment, the first filler 50 and the second filler 60 were arranged outside the liquid storage case 110, but the present invention is not limited thereto. For example, as shown in FIG. 4, in the liquid storage case 200 with a lead wire, the first filler 50 and the second filler 60 may be arranged in the liquid storage chamber 120 of the liquid storage case 110. In this case, the first through hole 41 is formed across a part of the insertion portion 32, the engagement portion 34, and the retaining portion 36 of the lead wire holding member 230. The second through hole 42 is formed in another part of the retaining portion 36. In the present embodiment, the second through hole 42 is located within the liquid storage chamber 120.

[0044] The liquid storage case 200 with a lead wire of the present embodiment includes a liquid storage case 110 having a lead wire mounting component 210, a liquid storage chamber 120 for storing liquid, and a mounting hole 130 that communicates with the liquid storage chamber 120 and to which the lead wire mounting component 210 is attached, and the first filler 50 and the second filler 60 are arranged within the liquid storage chamber 120. According to the above aspect, since the insertion load when inserting the lead wire holding member 230 into the liquid storage case 110 is not applied to the second filler 60, it is possible to suppress breakage when inserting the lead wire holding member 230.

[0045] In the above-described embodiment, the second filler 60 was filled between the conductor 22 filled with the first filler 50 and the lead wire holding member 30 and over the entire circumferential direction, but the present invention is not limited to this. For example, as shown in FIG. 5, in the liquid storage case 300 with a lead wire, the second filler 60 of the lead wire mounting component 310 is further filled between the portion of the lead wire 20 inserted into the through hole 40 and the lead wire holding member 30 and over the entire circumferential direction, and the portion of the lead wire 20 from which the insulator 26 has been removed may be located within the through hole 40. Further, as shown in FIG. 6, in the liquid storage case 400 with a lead wire, the second filler 60 of the lead wire mounting component 410 is further filled between the portion of the lead wire 20 inserted into the through hole 40 and the lead wire holding member 230 and over the entire circumferential direction, and the portion of the lead wire 20 from which the insulator 26 has been removed may be located within the through hole 40.

[0046] In the lead wire mounting components 310 and 410 of the present embodiment, the second filler 60 is further filled between the insulator 26 of the portion of the lead wire 20 inserted into the through hole 40 and the lead wire holding members 30 and 230 and over the entire circumferential direction. According to the above aspect, the second filler 60 is located outside the insulator 26 of the portion of the lead wire 20 inserted into the through hole 40. That is, since the conductor 22 is not exposed to the outside over the entire lead wire 20, it is not necessary to cover the conductor 22 with another insulator.

[0047] In the above-described embodiment, the second filler 60 was directly filled over the entire circumferential direction of the conductor 22 filled with the first filler 50, but it is not limited thereto. For example, as shown in FIG. 7, in the liquid-containing case 500 with a lead wire, the insulator 26 of the lead-wire-mounted component 510 includes a filled coating portion 26F that covers the outer peripheral surface of the portion of the conductor 22 filled with the first filler 50, and the second filler 60 may be further filled between the filled coating portion 26F and the lead-wire holding member 30 and over the entire circumferential direction. That is, the second filler 60 may be indirectly filled over the entire circumferential direction of the conductor 22 filled with the first filler 50 via the filled coating portion 26F. The filled coating portion 26F is attached, for example, so as to cover the portion after filling the first filler 50 in the portion of the conductor 22 not covered by the insulator 26. According to the above aspect, it is possible to more reliably suppress the flow of liquid from one end to the other end of the lead wire 20.

Explanation of Signs

[0048] 10 Lead-wire-mounted component 20 Lead wire 22 Conductor 24 Exposed portion 26 Insulator 30 Lead-wire holding member 40 Through hole 50 First filler 60 Second filler 100 Liquid-containing case with a lead wire 110 Liquid-containing case 120 Liquid-containing chamber 130 Mounting hole

Claims

1. A method for manufacturing a lead wire mounting component, comprising: a lead wire including a conductor and an insulator covering an outer peripheral surface of the conductor; and a lead wire holding member having a through hole through which the lead wire is inserted and holding the lead wire, wherein, in the lead wire, a forming step of forming an exposed portion where the conductor is exposed; a first filling step of filling the entire cross section of the exposed portion with a first filler having a first viscosity and through which liquid cannot pass; a placement step of placing the exposed portion in the through hole; a second filling step of filling an entirety in the circumferential direction between the exposed portion filled with the first filler and the lead wire holding member with a second filler having a second viscosity and through which liquid cannot pass, wherein the first viscosity is lower than the second viscosity.

2. The manufacturing method according to claim 1, wherein the placement step is performed after the first filling step.

3. The manufacturing method according to claim 1, wherein the placement step is performed before the first filling step.

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