Component inspection method, component manufacturing method, and component inspection apparatus

Abstract

This component inspection method includes: a fluid supply step for supplying a fluid to a cooling flow passage of a component internally including said cooling flow passage; a heating step for heating a surface of the component; and a measurement step for measuring a temperature of the surface of the component heated by means of the heating step.

Description

Technical Field

[0001] The present disclosure relates to a method for inspecting parts, a method for manufacturing parts, and an apparatus for inspecting parts. This application claims priority to Japanese Patent Application No. 2021-185755 filed in Japan on November 15, 2021, the content of which is incorporated herein by reference.

Background Art

[0002] For example, Patent Document 1 discloses a technique in which a turbine part (hereinafter referred to as a part) is heated by irradiating the surface of the turbine part with an optical pulse, and an abnormality (defect) on the outermost surface can be detected from the temperature response due to the heating.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the technique described in Patent Document 1, when there is an abnormality in the cooling flow path through which the fluid for cooling the parts formed inside the parts flows, there is a problem that it is difficult to detect this abnormality.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to provide a method for inspecting parts, a method for manufacturing parts, and an apparatus for inspecting parts that can detect an abnormality in a cooling flow path formed inside the parts.

Means for Solving the Problems

[0006] To solve the above problems, the method for inspecting a component according to the present disclosure includes a fluid supply step of supplying fluid to a cooling flow path of a component having a cooling flow path inside, a heating step of heating the surface of the component, and a measurement step of measuring the temperature of the surface of the component heated by the heating step. See, in the heating step, the surface of the component is heated using the irradiation light of a heating lamp. In the measurement step, the temperature distribution of the surface is measured using an infrared camera. The wavelength band to be detected by the infrared camera is larger than the wavelength at which the spectral energy in the irradiation light of the heating lamp peaks. In the heating step, a filter that cuts the wavelength of the wavelength band to be detected by the infrared camera in the irradiation light of the heating lamp is used.

[0007] Further, the method for manufacturing a component according to the present disclosure includes a manufacturing step of manufacturing a component having a cooling flow path inside, and the method for inspecting the component for inspecting the component manufactured in the manufacturing step.

[0008] Further, the method for manufacturing a component according to the present disclosure includes a manufacturing step of manufacturing a component having a cooling flow path inside, and the method for inspecting the component for inspecting the component manufactured in the manufacturing step. See, the heating unit has a heating lamp that heats the surface of the component using irradiation light. The measurement unit has an infrared camera that measures the temperature distribution of the surface. The wavelength band to be detected by the infrared camera is larger than the wavelength at which the spectral energy in the irradiation light of the heating lamp peaks. The heating unit further has a filter that cuts the wavelength of the wavelength band to be detected by the infrared camera in the irradiation light of the heating lamp.

Advantages of the Invention

[0009] According to the present disclosure, it is possible to provide a method for inspecting a component, a method for manufacturing a component, and an inspection apparatus for a component that can detect an abnormality in a cooling flow path formed inside the component.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Best Mode for Carrying Out the Invention

[0011] Hereinafter, a component inspection apparatus according to an embodiment of the present disclosure will be described with reference to the drawings.

[0012] (Inspection Apparatus) The inspection apparatus is an apparatus for detecting an abnormality that has occurred in a cooling flow path through which a fluid for cooling a component (specimen) formed in the component flows. The component in the present embodiment is a high-temperature component for a gas turbine that constitutes a gas turbine.

[0013] Examples of the high-temperature component for a gas turbine include turbine blades (stationary blades and rotating blades), segmented rings, and heat shield rings. In the present embodiment, a segmented ring will be described as an example of the high-temperature component for a gas turbine. As shown in FIG. 1, the inspection apparatus 1 includes a fluid supply unit 10, a heating unit 20, and a measurement unit 30.

[0014] (Fluid Supply Unit) The fluid supply unit 10 supplies the fluid F to a cooling flow path Wp for cooling the component W formed inside the component W. For example, air is adopted as the fluid F in the present embodiment. The fluid supply unit 10 has a chamber 11, a compressor 12, a supply line 13, and a valve 14.

[0015] (Chamber) The chamber 11 is a processing chamber for supplying the fluid F to the component W. The component W is placed and fixed in the chamber 11. That is, the chamber 11 supports the component W from below (the lower side in the vertical direction Dv). The chamber 11 has a box shape without a ceiling portion. That is, the chamber 11 has an opening portion that opens upward (the upper side in the vertical direction Dv).

[0016] In this embodiment, the vertical direction Dv (the vertical direction in FIG. 1) coincides with the direction of gravity. The opening portion of the chamber 11 facing the upper side in the vertical direction Dv is a component support portion 11a for supporting the component W. When the component W is placed on this component support portion 11a, a space is formed between the chamber 11 and the component W.

[0017] Here, when the component W is placed in the chamber 11, it faces the upper side in the vertical direction Dv, and has a surface Ws1 (inspection surface) that is the inspection target of the inspection device 1, and a non-inspection surface Ws2 that is located on the lower side in the vertical direction Dv than the surface Ws1 and is supported by the component support portion 11a of the chamber 11. The surface Ws1 and the non-inspection surface Ws2 form the outer shell of the component W, and the non-inspection surface Ws2 is connected to the surface Ws1.

[0018] A part of the non-inspection surface Ws2 of the component W contacts the component support portion 11a of the chamber 11, thereby forming a space in which the non-inspection surface Ws2 of the component W and the inner surface of the chamber 11 are airtightly isolated from the atmosphere. In this embodiment, this space is referred to as a supply space R. The supply space R is a space for temporarily storing the fluid F in a positive pressure (higher than atmospheric pressure) state in order to supply the fluid F to the cooling flow path Wp of the component W. For cooling In order to supply the fluid F to the cooling flow path Wp of the component W, it is a space for temporarily storing the fluid F in a positive pressure (higher than atmospheric pressure) state.

[0019] In the chamber 11, a hole portion 11b penetrating from the outside to the inside of the chamber 11 is formed. Through this hole portion 11b, the fluid F is introduced into the supply space R from the outside of the chamber 11. For cooling The fluid F is introduced into the supply space R.

[0020] Here, the component W has a plurality of cooling flow paths Wp extending in the horizontal direction through which the cooling fluid F can flow inside. The plurality of cooling flow paths Wp in this embodiment are arranged at equal intervals in the horizontal direction. The cooling flow path Wp has a fluid inlet portion Wp1 that opens into the supply space R, an intermediate portion Wp2 through which the fluid F flowing in from the fluid inlet portion Wp1 flows, and a fluid outlet portion Wp3 that opens to the atmosphere and can discharge the fluid F that has passed through the intermediate portion Wp2 to the atmosphere.

[0021] (Compressor) The compressor 12 is a device that compresses the fluid F inhaled from the outside, increases the pressure of the fluid F to a predetermined pressure, and pumps the fluid F with increased pressure into the supply space R in the chamber 11.

[0022] (Supply line) The supply line 13 is a pipe that connects the chamber 11 and the compressor 12 and through which the fluid F flows inside. For cooling The fluid F is introduced into the supply space R from the compressor 12 through this supply line 13.

[0023] (Valve) The valve 14 is a valve body for adjusting the pressure of the fluid F flowing in the supply line 13 from the compressor 12 toward the chamber 11. The valve 14 is provided in the middle of the supply line 13.

[0024] Therefore, the fluid F supplied into the supply space R from the compressor 12 through the supply line 13 flows into the middle part Wp2 through the fluid inlet part Wp1 of the cooling flow path Wp in the component W. The fluid F that has flowed into the middle part Wp2 of the cooling flow path Wp flows through the middle part Wp2, cools the component W, and is then discharged to the atmosphere through the fluid outlet part Wp3.

[0025] (Heating part) The heating part 20 heats the surface Ws1 of the component W placed on the chamber 11 of the fluid supply part 10. The heating part 20 has a heating lamp 21 and a filter 22.

[0026] (Heating lamp) The heating lamp 21 is a halogen lamp capable of irradiating the surface Ws1 of the component W with irradiation light L having a specific spectral distribution. The spectral distribution of the irradiation light L irradiated by the heating lamp 21 in this embodiment shows the property that the spectral emissivity (%) peaks at a specific wavelength (μm). As shown in FIG. 2, the irradiation light L in this embodiment has a peak P of spectral emissivity (spectral energy) in the wavelength band near 1.0 μm.

[0027] In the present embodiment, the heating lamp 21 is disposed above the surface Ws1 of the component W in the vertical direction Dv. Hereinafter, the direction in which the heating lamp 21 irradiates toward the surface Ws1 of the component W is referred to as the "irradiation direction Di". Therefore, one side of the irradiation direction Di is the direction from the heating lamp 21 toward the surface Ws1 of the component W, and the other side of the irradiation direction Di is the direction from the surface Ws1 of the component W on the side opposite to the one side of the irradiation direction Di toward the heating lamp 21. In the present embodiment, the irradiation direction Di coincides with the vertical direction Dv.

[0028] (Filter) The filter 22 is a quartz glass (fused quartz) that does not transmit (cuts) light in a specific wavelength band. The filter 22 is formed of quartz (SiO2). The filter 22 in the present embodiment has the property of not transmitting the irradiation light L having a wavelength component of 3.0 μm or more among the irradiation light L irradiated from the heating lamp 21 to the surface Ws1 of the component W.

[0029] The filter 22 is disposed between the surface Ws1 of the component W and the heating lamp 21 so as to cover the surface Ws1 of the component W from above in the vertical direction Dv. That is, the filter 22 is interposed between the heating lamp 21 and the component W in the irradiation direction Di. The filter 22 has a flat plate shape and has a first surface 22a facing the upper side in the vertical direction Dv (the heating lamp 21 side) and a second surface 22b facing the lower side in the vertical direction Dv (the component W side) opposite to the first surface 22a.

[0030] The areas of the first surface 22a and the second surface 22b of the filter 22 are formed larger than the area of the surface Ws1 of the component W. The thickness of the filter 22 in the vertical direction Dv is set to 15 mm to 30 mm. Thereby, the filter 22 can cut only the irradiation light component in the above wavelength band from the irradiation light L incident from the first surface 22a and emit the irradiation light L in which the irradiation light component in the above wavelength band is cut to the surface Ws1 from the second surface 22b.

[0031] (Measurement unit) The measurement unit 30 measures the temperature of the surface Ws1 of the component W heated by the heating unit 20. The measurement unit 30 includes an infrared camera 31 and a measurement device 32.

[0032] (Infrared camera) The infrared camera 31 images light in a specific wavelength band. The infrared camera 31 in this embodiment can receive and image (perform image processing on) light in the wavelength band of 3.0 μm to 17 μm. Therefore, the wavelength band to be detected by the infrared camera 31 in this embodiment is larger than the wavelength at which the spectral energy in the irradiation light L of the heating lamp 21 peaks.

[0033] The infrared camera 31 is arranged so that the surface Ws1 of the component W can be included within the angular field of view (imaging range). Therefore, the infrared camera 31 can obtain, as data, a temperature distribution image showing the temperature distribution of the surface Ws1 by receiving infrared rays (light) emitted from the surface Ws1 of the component W.

[0034] (Measurement device) The measurement device 32 is a device that acquires the temperature distribution image obtained by the infrared camera 31 imaging the surface Ws1 of the component W from the infrared camera 31 and determines whether there is an abnormality in the temperature distribution image. The measurement device 32 is connected to the infrared camera 31 via a cable or the like.

[0035] Here, bumps or the like may occur in the cooling channel Wp of the component W, and part or all of one cooling channel Wp may be blocked by the bumps. The abnormality in this embodiment means the starting point of the disturbance of the temperature distribution in the temperature distribution image caused by these bumps. In other words, the abnormality in the temperature distribution image indicates the location (generation position) where the bumps occur in the cooling channel Wp.

[0036] As shown in FIG. 3, the measurement device 32 includes a temperature distribution acquisition unit 32a, an abnormality determination unit 32b, and a storage unit 32c.

[0037] The temperature distribution acquisition unit 32a acquires the temperature distribution image acquired by the infrared camera 31. The abnormality determination unit 32b determines whether there is an abnormality in the temperature distribution of the surface Ws1 of the component W based on the temperature distribution image acquired by the temperature distribution acquisition unit 32a.

[0038] The abnormality determination unit 32b compares, for example, the acquired temperature distribution image with a sample image showing an ideal temperature distribution on the surface Ws1 of the component W previously stored in the storage unit 32c. Specifically, the abnormality determination unit 32b, for example, takes the difference between the temperature based on the radiance of each pixel of the temperature distribution image and the temperature based on the radiance of each pixel of the sample image. The abnormality determination unit 32b determines that there is an abnormality when the difference exceeds a predetermined threshold value, and determines that there is an abnormality in the cooling channel Wp corresponding to the pixel exceeding the threshold value in the image.

[0039] Here, for example, as shown in FIG. 4, when there is an abnormality in the cooling channel Wp inside the component W, an unnatural (irregular) temperature distribution occurs with a specific location A in the temperature distribution image as a base point. In this case, the difference between the temperature at the specific location A in the temperature distribution image and the temperature at the location corresponding to the specific location A in the sample image exceeds a predetermined threshold value.

[0040] (Manufacturing method of component) Hereinafter, the manufacturing method of the component W in the present embodiment will be described. As shown in FIG. 5, the manufacturing method of the component W includes a manufacturing step S0 and an inspection method Si of the component W.

[0041] (Manufacturing step) In the manufacturing step S0, a component W having a cooling channel Wp inside is manufactured. Specifically, the component W is manufactured by additive manufacturing (AM; Additive Manufacturing) using a 3D printer or the like.

[0042] (Inspection method of component) The inspection method Si for component W includes a fluid supply step S1, a heating step S2, a measurement step S3, and a determination step S4.

[0043] In the fluid supply step S1, the fluid F is supplied to the cooling channel Wp formed inside the component W. Specifically, by driving the compressor 12, the fluid F continues to flow through the cooling channel Wp of the component W.

[0044] In the heating step S2, the surface Ws1 of the component W is heated after the fluid supply step S1. Specifically, by driving the heating lamp 21, the component W is irradiated with the irradiation light L and the surface Ws1 of the component W is heated.

[0045] In the measurement step S3, the temperature of the surface Ws1 of the component W heated in the heating step S2 is measured. Specifically, the infrared camera 31 acquires the temperature distribution image of the surface Ws1 of the component W, and the measuring device 32 measures the temperature distribution of the surface Ws1 of the component W based on the temperature distribution image.

[0046] In the determination step S4, based on the temperature distribution image measured in the measurement step S3, it is determined whether there is an abnormality in the cooling channel Wp. Specifically, the measuring device 32 determines whether there is an abnormality in the temperature distribution image using the sample image.

[0047] By going through the above steps, a component W is manufactured in which the inspection of whether there is an abnormality in the cooling channel Wp is completed.

[0048] (Function and effect) In the inspection method Si for component W according to the above embodiment, while supplying the fluid F to the cooling channel Wp, the surface Ws1 of the heated component W is measured. Thereby, since the temperature of the surface Ws1 of the component W cooled by the fluid F can be measured, when there is an abnormality in the cooling channel Wp, an abnormality in the temperature on the surface Ws1 of the component W caused by the abnormality can be detected. Therefore, an abnormality in the cooling channel Wp formed inside the component W can be detected.

[0049] Also, in the inspection method Si for the component W according to the above embodiment, since it is determined whether there is an abnormality in the cooling flow path Wp based on the measured temperature of the surface Ws1 of the component W, it is not necessary to directly measure the temperature inside the cooling flow path Wp. That is, it is possible to indirectly determine whether there is an abnormality in the cooling flow path Wp by measuring the temperature of the surface Ws1 of the component W. Therefore, since no jig or the like is used when inspecting the inside of the cooling flow path Wp of the component W, it is possible to inspect whether there is an abnormality in the cooling flow path Wp in a simple manner.

[0050] Also, in the inspection method Si for the component W according to the above embodiment, since the component W is a high-temperature component for a gas turbine, it is possible to obtain a high-temperature component for a gas turbine in which it is ensured that there is no abnormality in the cooling flow path Wp.

[0051] Also, in the inspection method Si for the component W according to the above embodiment, the surface Ws1 of the component W is heated using the irradiation light L of the heating lamp 21, and the temperature distribution of the surface Ws1 of the component W is measured using the infrared camera 31. Thereby, the above-described operational effects can be achieved with a specific configuration.

[0052] Also, in the inspection method Si for the component W according to the above embodiment, since the wavelength band to be detected by the infrared camera 31 is larger than the wavelength at which the spectral energy in the irradiation light L peaks, it is possible to suppress the infrared camera 31 from being directly affected by heat from the irradiation light L. Therefore, it is possible to suppress the measurement accuracy from deteriorating when measuring the temperature of the surface Ws1 of the component W.

[0053] Also, in the inspection method Si for the component W according to the above embodiment, since the filter 22 cuts the wavelength in the wavelength band to be detected by the infrared camera 31 in the irradiation light L, it is possible to further suppress the infrared camera 31 from being directly affected by heat from the irradiation light L. Therefore, it is possible to further suppress the measurement accuracy from deteriorating when measuring the temperature of the surface Ws1 of the component W.

[0054] [Other Embodiments] As described above, the embodiments of the present disclosure have been described in detail with reference to the drawings. However, the specific configuration is not limited to the configuration of the embodiments, and additions, omissions, substitutions, and other changes to the configuration are possible without departing from the gist of the present disclosure. Further, the present disclosure is not limited by the embodiments, but is limited only by the claims.

[0055] Note that FIG. 6 is a hardware configuration diagram showing the configuration of the computer 1100 according to the present embodiment. The computer 1100 includes a processor 1110, a main memory 1120, a storage 1130, and an interface 1140.

[0056] The above-described measurement device 32 is implemented in the computer 1100. The operations of the above-described respective processing units are stored in the storage 1130 in the form of a program. The processor 1110 reads the program from the storage 1130 and expands it in the main memory 1120, and executes the above processing according to the program. Further, the processor 1110 secures a storage area corresponding to each of the above-described storage units 32c in the main memory 1120 according to the program.

[0057] The program may be for realizing a part of the functions to be exerted by the computer 1100. For example, the program may exert functions by combination with other programs already stored in the storage 1130 or by combination with other programs implemented in other devices. Further, in addition to the above configuration or instead of the above configuration, the computer 1100 may include a custom LSI (Large Scale Integrated Circuit) such as a PLD (Programmable Logic Device). Examples of PLDs include PAL (Programmable Array Logic), GAL (Generic Array Logic), CPLD (Complex Programmable Logic Device), and FPGA (Field Programmable Gate Array). In this case, part or all of the functions realized by the processor 1110 may be realized by the integrated circuit.

[0058] Examples of the storage 1130 include a magnetic disk, a magneto-optical disk, a semiconductor memory, etc. The storage 1130 may be an internal medium directly connected to the bus of the computer 1100, or may be an external medium connected to the computer 1100 via the interface 1140 or a communication line. Also, when this program is distributed to the computer 1100 via a communication line, the computer 1100 that has received the distribution may expand the program in the main memory 1120 and execute the above processing. In the above embodiment, the storage 1130 is a non-temporary tangible storage medium.

[0059] Also, the program may be for realizing a part of the functions described above. Further, the program may be what realizes the functions described above in combination with other programs already stored in the storage 1130, namely, a so-called difference file (difference program).

[0060] Further, the manufacturing step S0 of the above embodiment may include a film forming process in which a film (coating agent) having higher radiation characteristics than the surface Ws1 is formed on the surface Ws1 of the component W. Specifically, in the film forming process, black paint or the like is adopted as the film.

[0061] Thereby, since the heating lamp 21 of the heating unit 20 can effectively heat the surface Ws1 of the component W, the infrared camera 31 of the measurement unit 30 can acquire a clearer temperature distribution image.

[0062] Therefore, the determination unit can more accurately determine whether there is an abnormality in the cooling flow path Wp. Note that the film adopted in the above film forming process does not have to be formed of black paint. That is, the color of the paint that becomes the material of the film is not limited.

[0063] In the inspection method Si of the component W of the above embodiment, the heating step S2 in which the surface Ws1 of the component W is heated after the fluid supply step S1 is executed, but this order is not limited, and the fluid supply step S1 may be executed after the heating step S2.

[0064] Further, the measuring device 32 of the measuring unit 30 in the above embodiment may further include a temperature distribution display unit that displays the temperature distribution image acquired by the infrared camera 31. At this time, for example, the comparison between the temperature distribution image displayed by the temperature distribution display unit and a limit sample or the like may be made by the operator's visual inspection, and the operator may determine whether there is an abnormality in the cooling flow path Wp of the component W.

[0065] In the above embodiment, the component W is placed in the chamber 11 such that the surface Ws1 faces upward in the vertical direction Dv, but the configuration is not limited thereto. For example, the component W may be fixed to the chamber 11 in a state where the surface Ws1 is inclined with respect to the horizontal direction or in a state where it faces directly sideways.

[0066] Further, the filter 22 in the above embodiment does not have to be formed in a flat plate shape. The filter 22 may have a disk shape or the like. Also, the areas of the first surface 22a and the second surface 22b of the filter 22 may be formed to be the same size as the area of the surface Ws1 of the component W. Further, the thickness of the filter 22 in the vertical direction Dv is more preferably formed to be 20 mm to 30 mm.

[0067] Also, the component W in the above embodiment does not have to be formed by additive manufacturing (AM). The component W may be formed, for example, by casting using a mold or the like. Also, the cooling channel Wp of the component W may be formed by electrical discharge machining or the like.

[0068] Also, the measuring device 32 in the above embodiment is connected to the infrared camera 31 via a cable or the like, but is not limited to this configuration, and the measuring device 32 and the infrared camera 31 may be wirelessly connected.

[0069] Also, the abnormality determination unit 32b in the above embodiment takes the difference between the temperature based on the radiance at each pixel of the temperature distribution image and the temperature based on the radiance at each pixel of the sample image, but is not limited to this configuration.

[0070] The temperature distribution image and the sample image are each divided into a plurality of meshes (regions), and the abnormality determination unit 32b may perform a comparison by taking the difference between data obtained by statistical processing or the like for the temperatures of each of the plurality of pixels included in each mesh.

[0071] At that time, the abnormality determination unit 32b compares the data of the meshes corresponding to each other in the temperature distribution image and the sample image. In this case, the abnormality determination unit 32b may determine that there is an abnormality when the difference exceeds a predetermined threshold value, and may determine that there is an abnormality in the region of the cooling channel Wp corresponding to the mesh exceeding the threshold value in the image.

[0072] Also, in the embodiment, a split ring having a cooling channel Wp inside as a component is described as an example, but the present invention is not limited to the split ring. The component W may be a blade body of a stator blade or a rotor blade as a gas turbine blade. The blade body has an airfoil cross-section and has a cooling flow path Wp inside through which the fluid F can flow. The surface Ws1 to be inspected is, for example, a pressure surface (ventral surface) as a concave curved surface connecting the leading edge and the trailing edge, or a suction surface (dorsal surface) as a convex curved surface.

[0073] Alternatively, the component W may be a shroud of a stator blade or a rotor blade as a gas turbine blade. The shroud has an Cooling channel Wp inside through which the fluid F can flow. Further, the component W may be a platform of a rotor blade that is a gas turbine blade. The platform has a cooling flow path Wp inside through which the fluid F can flow. When the shroud or the platform becomes the component W, the surface Ws1 to be inspected is, for example, a gas path surface. Alternatively, the component W may be a heat shield ring having a cooling flow path Wp inside. Alternatively, the component W may be a tail pipe for a combustor having a cooling flow path Wp inside.

[0074] Further, the component W is not limited to high-temperature components for a gas turbine that constitute a gas turbine. The component W is, for example, among components that constitute other rotating machines such as a steam turbine and a compressor, as long as it is a high-temperature component for a rotating machine having a Cooling channel Wp inside through which the cooling fluid F can flow.

[0075] [Appendix] The inspection method, manufacturing method, and inspection apparatus for the component described in the embodiment are understood as follows, for example.

[0076] (1) The inspection method Si for the component W according to the first aspect includes a fluid supply step S1 of supplying the fluid F to the cooling flow path Wp of the component W having the cooling flow path Wp inside, a heating step S2 of heating the surface Ws1 of the component W, and a measurement step S3 of measuring the temperature of the surface Ws1 of the component W heated by the heating step S2.

[0077] Thereby, since the temperature of the surface Ws1 of the component W cooled by the fluid F can be measured, when there is an abnormality in the cooling flow path Wp, an abnormality in the temperature at the surface Ws1 of the component W caused by the abnormality can be detected.

[0078] (2) The inspection method Si for the component W according to the second aspect may be the inspection method Si for the component W in (1), and further include a determination step S4 of determining whether there is an abnormality in the cooling flow path Wp based on the temperature measured in the measurement step S3.

[0079] Thereby, there is no need to directly measure the temperature inside the cooling flow path Wp. That is, it is possible to indirectly determine whether there is an abnormality in the cooling flow path Wp by measuring the temperature of the surface Ws1 of the component W.

[0080] (3) The inspection method Si for the component W according to the third aspect may be the inspection method Si for the component W in (1) or (2), and the component W may be a high-temperature component for a rotating machine.

[0081] Thereby, it is possible to obtain a high-temperature component for a rotating machine in which it is ensured that there is no abnormality in the cooling flow path Wp.

[0082] (4) The inspection method Si for the component W according to the fourth aspect may be the inspection method Si for the component W in (3), and the high-temperature component for a rotating machine may be a high-temperature component for a gas turbine.

[0083] Thereby, it is possible to obtain a high-temperature component for a gas turbine in which it is ensured that there is no abnormality in the cooling flow path Wp.

[0084] (5) The inspection method Si for the component W according to the fifth aspect may be the inspection method Si for the component W in any one of (1) to (4). In the heating step S2, the surface Ws1 of the component W may be heated using the irradiation light L of the heating lamp 21, and in the measurement step S3, the temperature distribution of the surface Ws1 may be measured using the infrared camera 31.

[0085] As a result, the above-described effects can be achieved with a specific configuration.

[0086] (6) The inspection method Si of the component W according to the sixth aspect is the inspection method Si of the component W in (5), and the wavelength band to be detected by the infrared camera 31 may be larger than the wavelength at which the spectral energy in the irradiation light L of the heating lamp 21 reaches the peak P.

[0087] As a result, it is possible to suppress the infrared camera 31 from being directly affected by heat from the irradiation light L.

[0088] (7) The inspection method Si of the component W according to the seventh aspect is the inspection method Si of the component W in (6), and in the heating step S2, a filter 22 that cuts the wavelength in the wavelength band to be detected by the infrared camera 31 in the irradiation light L of the heating lamp 21 may be used.

[0089] As a result, it is possible to further suppress the infrared camera 31 from being directly affected by heat from the irradiation light L.

[0090] (8) The inspection method Si of the component W according to the eighth aspect is the inspection method Si of the component W in any one of (5) to (7), and a film having higher radiation characteristics than the surface Ws1 of the component W may be formed on the surface Ws1 of the component W.

[0091] As a result, the heating lamp 21 of the heating unit 20 can effectively heat the surface Ws1 of the component W, so that the infrared camera 31 of the measurement unit 30 can acquire a clearer temperature distribution image.

[0092] (9) The manufacturing method of the component W according to the ninth aspect includes a manufacturing step S0 of manufacturing the component W having a cooling flow path Wp inside, and the inspection method Si of the component W in any one of (1) to (8) for inspecting the component W manufactured in the manufacturing step S0.

[0093] (10) The inspection apparatus 1 for the component W according to the tenth aspect includes a fluid supply unit 10 that supplies a fluid F to the cooling flow path Wp of the component W having a cooling flow path Wp inside, a heating unit 20 that heats the surface Ws1 of the component W, and a measurement unit 30 that measures the temperature of the surface Ws1 of the component W heated by the heating unit 20.

Industrial Applicability

[0094] According to the present disclosure, it is possible to provide an inspection method for a component, a manufacturing method for a component, and an inspection apparatus for a component that can detect an abnormality in a cooling flow path formed inside the component.

Explanation of Reference Numerals

[0095] 1... Inspection apparatus 10... Fluid supply unit 11... Chamber 11a... Component support part 11b... Hole part 12... Compressor 13... Supply line 14... Valve 20... Heating unit 21... Heating lamp 22... Filter 22a... First surface 22b... Second surface 30... Measurement unit 31... Infrared camera 32... Measuring device 32a... Temperature distribution acquisition part 32b... Abnormality determination part 32c... Storage part 1100... Computer 1110... Processor 1120... Main memory 1130... Storage 1140... Interface A... Specific location Di... Irradiation direction Dv... Vertical direction F... Fluid L... Irradiation light P... Peak R... Supply space S0... Manufacturing step S1... Fluid supply step S2... Heating step S3... Measurement step S4... Judgment step Si... Inspection method W... Component Wp... Cooling flow path Wp1... Fluid inlet part Wp2... Intermediate part Wp3... Fluid outlet part Ws1... Surface Ws2... Non-inspected surface

Claims

1. A fluid supply step of supplying a fluid to a cooling flow path of a component having a cooling flow path inside; A heating step of heating the surface of the component; A measurement step of measuring the temperature of the surface of the component heated by the heating step; including In the heating step, the surface of the component is heated using the irradiation light of a heating lamp. In the measurement step, the temperature distribution of the surface is measured using an infrared camera. The wavelength band to be detected by the infrared camera is larger than the wavelength at which the spectral energy in the irradiation light of the heating lamp peaks. A method for inspecting a component, wherein in the heating step, a filter for cutting the wavelength of the wavelength band to be detected by the infrared camera in the irradiation light of the heating lamp is used.

2. The method for inspecting a component according to claim 1, further including a determination step of determining whether there is an abnormality in the cooling flow path based on the temperature measured in the measurement step.

3. The method for inspecting a component according to claim 1 or 2, wherein the component is a high-temperature component for a rotating machine.

4. The method for inspecting a component according to claim 3, wherein the high-temperature component for a rotating machine is a high-temperature component for a gas turbine.

5. The method for inspecting a component according to claim 1, wherein a film having higher radiation characteristics than the surface of the component is formed on the surface of the component.

6. A manufacturing step of manufacturing a component having a cooling flow path inside; The method for inspecting a component according to claim 1 or 2 for inspecting the component manufactured in the manufacturing step; A method for manufacturing a component including

7. The method for inspecting a component according to claim 1 or 2, wherein the heating lamp is a halogen lamp.

8. A fluid supply unit for supplying a fluid to a cooling flow path of a component having a cooling flow path inside; A heating unit for heating the surface of the component; A measurement unit for measuring the temperature of the surface of the component heated by the heating unit; comprising The heating unit has a heating lamp that heats the surface of the component using irradiation light. The measurement unit has an infrared camera that measures the temperature distribution of the surface. The wavelength band to be detected by the infrared camera is larger than the wavelength at which the spectral energy in the irradiation light of the heating lamp peaks. An inspection apparatus for a component, wherein the heating unit further has a filter for cutting the wavelength of the wavelength band to be detected by the infrared camera in the irradiation light of the heating lamp. The inspection apparatus for parts according to claim 8, wherein the heating lamp is a halogen lamp.

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