Computing device

Abstract

A computing device is disclosed that includes a frame, a computing module disposed within the frame and equipped with a power supply interface, a control module, a power supply module, a heat dissipation module, and a connection box connected to the frame, the power supply module having a power connection end, the power supply interface extending from the frame into the connection box, the power connection end extending into the connection box, and the power interface and the power connection end being connected within the connection box by a conductive bar. The computing device includes a sealable connection box that connects the power supply and the power lines of the computing board internally, so that various power connection lines are sealed within the connection box and not exposed, improving safety and appearance, and the connection box being located at the top of the device, making operation easier. The frame of the present invention is a one-piece formed aluminum frame that does not require attachment, making it inexpensive and strong.

Description

Technical Field

[0001] This application relates to the technical field of data operations, and more particularly, to a more secure computing device.

Background Art

[0002] A computing device is an electronic device that performs high-speed operations such as an electronic device configured to execute a specific algorithm to obtain a corresponding virtual currency and communicate with a remote server. With the development of existing industries, the development of automation and the intelligence of computing devices have improved, and various alternative products have emerged one after another. However, in many designs of existing computing devices, the connection lines are still exposed, which not only affects safety but also affects the appearance.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The object of this application is to provide a computing device with higher safety.

Means for Solving the Problems

[0004] To achieve the above object, the computing device of this application includes a frame, a computing module, a control module, a power module, and a heat dissipation module. The computing module is disposed within the frame, and the power module, the control module, and the heat dissipation module are connected to the outside of the frame. The computing module includes a power interface, and the power module includes a power connection terminal. The computing device further includes a connection box disposed on the top of the frame and the power module. The power interface extends from the upper end of the frame into the connection box, the power connection terminal extends into the connection box, and the power interface and the power connection terminal are connected via a conductive bar within the connection box.

[0005] In one embodiment of the computing device described above, the computing module includes a signal interface, the control module includes a signal connection terminal, the control module is disposed within a connection box, and the signal interface and the signal connection terminal are connected within the connection box via a signal line.

[0006] In one embodiment of the computing device described above, the connection box includes an upper cover plate and a bottom cover body, and the upper cover plate covers the bottom cover body so as to seal the connection box.

[0007] In one embodiment of the computing device described above, the frame is an integrally formed aluminum piece.

[0008] In one embodiment of the computing device described above, the frame includes a first side wall, a second side wall, a top wall, and a bottom wall, and the first side wall and the second side wall are supported between the top wall and the bottom wall.

[0009] In one embodiment of the computing device described above, an outer portion of the first side wall is provided with a power slide rail disposed in a transverse direction, a power module bracket is connected to the first side wall through the power slide rail, and a power module is attached to the power module bracket.

[0010] In one embodiment of the computing device described above, the bottom wall is provided with a computing board bottom slide rail disposed in a transverse direction, and the computing module is configured to slide into or out of the frame through the computing board bottom slide rail.

[0011] In one embodiment of the computing device described above, the computing module includes a heat sink, and the heat sink is provided with a groove configured to engage with the computing board bottom slide rail.

[0012] In one embodiment of the computing device described above, the top wall includes a notch disposed in the transverse direction, the power interface of the computing module protrudes above the frame through the notch and extends into the connection box, and the signal interface of the computing module protrudes above the frame through the notch and extends into the connection box.

[0013] In one embodiment of the computing device described above, the top wall includes an upper slide rail of the computing board corresponding to the bottom slide rail of the computing board, and the upper slide rail of the computing board is formed by extrusion of an aluminum material on one side of the notch.

[0014] In one embodiment of the computing device described above, a plurality of computing modules are arranged in parallel, and a conductive bar is configured to connect the plurality of computing modules in sequence.

[0015] In one embodiment of the computing device described above, the heat dissipation module includes a first fan and a second fan. The frame is hollow at the front end and the rear end. The first fan and the second fan are respectively connected to the front end and the rear end of the frame so as to close the front end and the rear end of the frame.

[0016] The present application further provides a computing device including a frame, a computing module, a control module, a power module, and a heat dissipation module. The computing module is disposed in the frame and includes a power interface. The power module includes a power connection end. The computing device further includes a connection box connected to the frame. The power interface extends from the frame into the connection box, the power connection end extends into the connection box, the power interface and the power connection end are connected through a conductive bar in the connection box, and the connection box is provided with an access portion communicating with the frame.

[0017] In one embodiment of the computing device described above, the frame includes an access surface for the entire computing module to slide outward or inward, and the connection box is disposed on this access surface or on another surface of the frame different from this access surface.

[0018] In one embodiment of the computing device described above, the power module, the control module, and the heat dissipation module are disposed within the frame, or at least one of the power module, the control module, and the heat dissipation module forms part of the frame.

[0019] This application will be described in detail below with reference to the accompanying drawings and specific embodiments, which should not be construed as limitations of this application.

Brief Description of the Drawings

[0020]

Figure 1

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Mode for Carrying Out the Invention

[0021] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments so as to provide a further understanding of the object, solution and effect of the present application, but they are not intended to limit the protection scope of the appended claims of the present application.

[0022] In the specification, references such as "an embodiment", "another embodiment" and "this embodiment" mean that the described embodiment can include specific features, structures or characteristics, but not necessarily all embodiments include those specific features, structures or characteristics. In addition, such expressions do not refer to the same embodiment. Furthermore, when a specific feature, structure or characteristic is described in association with an embodiment, whether or not it is explicitly stated, it is shown that the incorporation of such a feature, structure or characteristic into other embodiments is within the scope of the knowledge of those skilled in the art.

[0023] Specific terms are used in the description and appended claims to refer to a particular assembly or component, and those skilled in the art should understand that a technical user or manufacturer can refer to the same assembly or component by different terms. This specification and the appended claims do not use differences in names as a way to distinguish assemblies or components, but use differences in the functions of assemblies or components as a criterion for identification. The terms "comprising" and "including" referred to throughout this specification and the appended claims are open-ended terms and should therefore be interpreted as "including but not limited to". In addition, the term "connected" in this specification includes any direct or indirect connection means.

[0024] In the description of the present application, the directions or positional relationships indicated by terms such as "transverse", "longitudinal", "above", "below", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are the directions or positional relationships shown based on the attached drawings, and are only for conveniently explaining the present application and simplifying the explanation, and it should be noted that it is not intended to indicate or imply that the described device or element needs to have a specific direction and be constructed and operated in a specific direction. Therefore, the direction or positional relationship cannot be understood as a limitation in the present application. For the convenience of clear explanation, the sequential terms such as "first", "second", "third", "fourth", etc. described in this specification are used to distinguish one element, region or component from other identical or similar elements, regions or components, rather than to limit that element, region or component.

[0025] As shown in FIGS. 1 and 2, FIGS. 1 and 2 are respectively a three-dimensional structure diagram and an exploded diagram of a computing device according to an embodiment of the present application. The computing device of the present application includes a frame 100, a computing module 200, a control module 300, a power module 400, and a heat dissipation module 500. The computing module 200 is arranged within the frame 100. The power module 400, the control module 300, and the heat dissipation module 500 are connected to the outside of the frame 100. For example, the power module 400 is attached to one side surface of the frame 100, the heat dissipation module 500 is connected to one of the front end and the rear end or both ends of the frame 100, and the control module 300 is attached within a sealed box on the upper surface of the frame 100.

[0026] The computing device of the present application further includes a connection box 600. The connection box 600 is arranged on the frame 100 and on the upper surface of the power module 400.

[0027] Preferably, the upper part of the frame 100 is on the same plane as the upper part of the power supply module 400 to facilitate the placement of the connection box 600.

[0028] Preferably, as shown in FIG. 1, the left side surface S1 and the right side surface S2 of the connection box 600 are respectively on the same plane as the left side surface of the frame 100 and the right side surface of the power supply module 400. The front side surface S3 and the rear side surface S4 of the connection box 600 are respectively on the same plane as the front side surface and the rear side surface of the power supply module 400. The overall structure of the computing device is clear.

[0029] As shown in FIGS. 2 and 3, FIG. 3 is a three-dimensional structural view of a computing device according to an embodiment of the present application, in which the upper cover plate of the connection box is open. The control module 300 is disposed in the connection box 600 of the frame 100. The computing module 200 includes a power interface 210, and the power interface 210 extends from the upper end of the frame 100 into the connection box 600. The power supply module 400 includes a power connection end 410, and the power connection end 410 extends into the connection box 600 on the upper surface. The power connection end 410 of the power supply module 400 and the power interface 210 of the computing module 200 are connected via a conductive bar 700 in the connection box 600.

[0030] As shown in FIGS. 3 and 4, FIG. 4 is a three-dimensional structural view of a computing device according to an embodiment of the present application, in which the upper cover plate of the connection box is removed to show the signal connection structure between the control module and the computing module. The connection box 600 includes an access part 600S, and the access part 600S communicates with the frame 100. Optionally, the computing module 200 can be drawn out from the frame 100 by removing the conductive bar 700 and related signal lines without removing other frame structures such as the connection box 600. As shown in FIGS. 2 to 4, the computing module 200 includes a signal interface 220, and the signal interface 220 extends from the upper end of the frame 100 into the connection box 600. The control module 300 includes a signal connection end 310, and the signal connection end 310 extends into the connection box 600 on the upper surface. The signal connection end 310 of the signal module 300 and the signal interface 220 of the computing module 200 are electrically connected via a signal line 900 in the connection box 600.

[0031] The computing device of the present application is provided with a sealable connection box. The control board and the control interface between the control board and the computing board are connected in the connection box, and the power supply and the power line of the computing board are connected in the connection box. Therefore, the exposure of the power connection line and the signal line is prevented, thereby improving the safety and appearance. Furthermore, since the connection box is arranged at the upper end of the device, the operation is easy.

[0032] As shown in FIG. 2, the connection box 600 includes an upper cover plate 610 and a bottom cover body 620, and the upper cover plate 610 covers the bottom cover body 620 so as to seal the connection box 600.

[0033] FIG. 5 is a three-dimensional structural view of the frame of the computing device of the present application. The frame 100 of the computing device according to an embodiment of the present application is an integrally formed aluminum piece that does not need to be attached, and is inexpensive and has high strength. The frame 100 includes a first side wall 110, a second side wall 120, a top wall 130, and a bottom wall 140. The first side wall 110 and the second side wall 120 are supported between the top wall 130 and the bottom wall 140.

[0034] The first side wall 110, the second side wall 120, the top wall 130, and the bottom wall 140 form the peripheral wall of the frame 100, and the frame 100 is hollow at the front end and the rear end. Referring to FIG. 2, the heat dissipation module 500 includes a first fan 510 and a second fan 520. The first fan 510 and the second fan 520 are respectively connected to the front end and the rear end of the frame 100 so as to close the front end and the rear end of the frame 100.

[0035] The outer portion of the first side wall 110 is provided with a power slide rail 111 arranged along the transverse direction X. Referring to FIG. 2, the power module bracket 800 is connected to the first side wall 110 through the power slide rail 111, and a power module 400 is attached to the power module bracket 800.

[0036] Referring to FIGS. 5 and 6, FIG. 6 is a three-dimensional structural view of the computing module of the computing device connected to the frame according to an embodiment of the present application. The bottom wall 140 includes a computing board bottom slide rail 141 arranged along the transverse direction X, and the computing module 200 is configured to slide into or out of the frame 100 through the computing board bottom slide rail 141.

[0037] The computing module 200 includes a heat sink 230 and a computing board 240. The heat sink 230 is attached to the computing board 240 to dissipate heat from the computing board 240. The heat sink 230 can be attached to one or both sides of the computing board 240. In this embodiment, the heat sink 230 is attached to both sides of the computing board 240, that is, the computing board 240 is sandwiched between two heat sinks 230. The bottom of the heat sink 230 is provided with a groove 231 configured to engage with the computing board bottom slide rail 141. The groove 231 and the computing board bottom slide rail 141 are configured to engage with each other to enable the insertion and removal of the computing module 200 with respect to the frame 100. In addition, the two ends of the slide rail are provided with a positioning and fixing structure such as a positioning strip and a positioning protrusion. Alternatively, the positioning and fixing structure may be a heat dissipation module.

[0038] The groove 231 may be provided only at the bottom of one heat sink 230, or may be provided at the bottoms of two heat sinks 230.

[0039] In the present application, the slide rail is provided on the heat sink, that is, the heat sink is used for support and sliding, thus effectively preventing the computing board from being deformed or damaged.

[0040] The top wall 130 is provided with a notch 131 arranged in the transverse direction. The power interface 210 and the signal interface 220 of the computing board 240 of the computing module 200 protrude above the frame 100 through the notch 131. Referring to FIG. 2, when the connection box 600 is connected to the upper end of the frame 100, the power interface 210 and the signal interface 220 are inside the connection box 600.

[0041] The top wall 130 is provided with a computing board upper slide rail 132 corresponding to the computing board bottom slide rail 141 of the bottom wall 140. The computing board upper slide rail 132 is formed by extrusion of an aluminum material on one side of the notch 131. Similarly, the upper end of the heat sink 230 is provided with a groove 232 configured to engage with the computing board upper slide rail 132. The upper slide rail and the bottom slide rail work together to provide accurate and stable sliding.

[0042] The directions or positional relationships indicated by the above terms "upper end" or "upper surface" are the directions or positional relationships shown based on the accompanying drawings, including the outermost ends of the sides. As shown in FIG. 7, in the three-dimensional structure diagram of the computing device according to an embodiment of the present application when the computing device shown in FIG. 1 is placed horizontally, the connection box 600 is arranged on one side surface of the frame 100. As shown in FIG. 8, in the three-dimensional structure diagram of the computing module of the computing device connected to the frame according to an embodiment of the present application, the computing module 200 is inserted and removed from the top of the frame 100. In addition, in order to simplify the chassis structure, the control module 300, the power module 400, and the heat dissipation module 500 can all be arranged within the frame 100, thus improving the integrity and cleanliness of the frame structure.

[0043] Referring again to FIGS. 2 and 6, a plurality of computing modules 200 are arranged in parallel along the transverse direction X. The control module 300 includes a plurality of control connection ends respectively connected to the signal interfaces of the corresponding computing modules 200. In addition, the conductive bar 700 is configured to sequentially connect a plurality of computing modules 200 to connect the computing modules 200 to the power module 400.

[0044] Surely, this application can further have a plurality of other embodiments. Those skilled in the art can make various corresponding modifications and changes to this application without departing from the spirit and essence of this application. However, such corresponding modifications and changes fall within the protection scope of the claims appended to this application.

Industrial Applicability

[0045] The computing device of this application is provided with a sealable connection box, and the power line of the power supply and the computing board is connected within the connection box. Therefore, various power connection lines are sealed inside the connection box and not exposed, so not only the safety and appearance are improved, but also the operation is easy. The connection box is provided with an access part communicating with the frame. The computing module can slide entirely out of or into the frame through the access part without removing other frame structures such as the connection box, thus saving time and effort in maintenance.

Explanation of Reference Numerals

[0046] 100 Frame 110 First Side Wall 111 Power Slide Rail 120 Second Side Wall 130 Top Wall 131 Notch 132 Computing Board Upper Slide Rail 140 Bottom Wall 141 Computing Board Bottom Slide Rail 200 Computing Module 210 Power Interface 220 Signal Interface 230 Heat Sink 231 Groove 232 Groove 240 Computing Board 300 Control Module 310 Signal Connection Terminal 400 Power Module 410 Power Connection Terminal 500 Heat Dissipation Module 510 First Fan 520 Second Fan 600 Connection Box 600S Access Part 610 Upper Cover Plate 620 Bottom Cover Plate 700 Conductive Bar 800 Power Module Bracket 900 Signal Line X Transverse Direction S1, S2, S3, S4 Sides

Claims

1. A computing device, comprising: a frame, a computing module, a control module, a power module, and a heat dissipation module; wherein the computing module is disposed within the frame, and the power module, the control module, and the heat dissipation module are connected to the outside of the frame; the computing module comprises a power interface, and the power module comprises a power connection end; the computing device further comprises a connection box disposed on the tops of the frame and the power module; the power interface extends from the upper end of the frame into the connection box, the power connection end extends into the connection box, and the power interface and the power connection end are connected in the connection box via a conductive bar; the control module is connected to the computing module and the power module, and the heat dissipation module is connected to the power module.

2. The computing device according to claim 1, wherein the computing module comprises a signal interface, the control module comprises a signal connection end, the control module is disposed within the connection box, and the signal interface and the signal connection end are connected in the connection box via a signal line.

3. The computing device according to claim 1, wherein the connection box comprises an upper cover plate and a bottom cover body, and the upper cover plate covers the bottom cover body so as to seal the connection box.

4. The computing device according to claim 2, wherein the frame is an integrally formed aluminum piece.

5. The computing device according to claim 4, wherein the frame comprises a first side wall, a second side wall, a top wall, and a bottom wall, and the first side wall and the second side wall are supported between the top wall and the bottom wall.

6. The outer portion of the first side wall is provided with a power supply slide rail arranged in the transverse direction, a power supply module bracket is connected to the first side wall through the power supply slide rail, and the power supply module is attached to the power supply module bracket. The computing device according to claim 5.

7. The bottom wall is provided with a computing board bottom slide rail arranged in the transverse direction, and the computing module is configured to slide into or out of the frame through the computing board bottom slide rail. The computing device according to claim 5.

8. The computing module is provided with a heat sink, and the heat sink is provided with a groove configured to engage with the computing board bottom slide rail. The computing device according to claim 7.

9. The top wall is provided with a notch arranged in the transverse direction, the power interface of the computing module projects above the frame through the notch and extends into the connection box, and the signal interface of the computing module projects above the frame through the notch and extends into the connection box. The computing device according to claim 7.

10. The top wall is provided with a computing board top slide rail corresponding to the computing board bottom slide rail, and the computing board top slide rail is formed by extrusion of an aluminum material on one side of the notch. The computing device according to claim 9.

11. A plurality of computing modules are arranged in parallel, and the conductive bar is configured to sequentially connect the plurality of computing modules. The computing device according to any one of claims 1 to 10.

12. The heat dissipation module includes a first fan and a second fan, the frame is hollow at the front end and the rear end, and the first fan and the second fan are respectively connected to the front end and the rear end of the frame so as to close the front end and the rear end of the frame. The computing device according to any one of claims 1 to 10.

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