LED sheet, shelf board for growth shelf of animals and plants, growth shelf of animals and plants, and animal and plant growth factory

Abstract

To provide a lighting device using LEDs having a low power consumption as a light source instead of conventional fluorescent tubes and high-pressure sodium lamps.SOLUTION: An LED sheet 20 includes: a flexible substrate film 31; a metal wiring part on the substrate film 31; and a plurality of LED chips 21 mounted to the metal wiring part, where a plurality of through-holes 10 penetrating the LED sheet 20 is provided, thereby circulating air and promoting growth of plants.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to an LED sheet, a shelf board for a growth shelf of animals and plants, a growth shelf of animals and plants, and an animal and plant growth factory.

Background Art

[0002] As a lighting device used in an animal and plant growth factory, in recent years, the demand for a lighting device using an LED with low power consumption as a light source has been expanding, replacing conventional fluorescent lamps, high-pressure sodium lamps, etc.

[0003] As an example of an animal and plant growth factory using a lighting device with an LED as a light source, a plant growth device in which a plurality of straight tube-type plant growth lamps with LEDs as light sources are arranged on the shelf board of a plant growth shelf is known (see, for example, Patent Document 1).

[0004] An LED lighting device for animal and plant growth in which a plurality of LED chips are arranged on a flexible type circuit board to form a planar light source has also been proposed (see, for example, Patent Document 2).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present disclosure provides an LED sheet, a shelf board for a growth shelf of animals and plants, a growth shelf of animals and plants, and an animal and plant growth factory capable of obtaining animals and plants with a good yield.

Means for Solving the Problems

[0007] The LED sheet according to this embodiment includes a flexible substrate film, a metal wiring portion on the substrate film, and a plurality of LED chips mounted on the metal wiring portion, and the LED sheet is provided with a through hole penetrating the LED sheet.

[0008] In the LED sheet according to this embodiment, a plurality of the through holes may be provided.

[0009] In the LED sheet according to this embodiment, four or more through holes are provided along the longitudinal direction of the substrate film, and two or more rows of the through holes may be provided along the width direction of the substrate film.

[0010] In the LED sheet according to this embodiment, the aperture ratio of the LED sheet may be 10% or more and 50% or less.

[0011] In the LED sheet according to this embodiment, the aperture ratio may be 15% or more.

[0012] In the LED sheet according to this embodiment, the size of the through hole may increase as it is farther from the center of the substrate film.

[0013] In the LED sheet according to this embodiment, the plurality of through holes may be respectively provided at positions corresponding to each of the LED chips.

[0014] The shelf board for growing animals and plants according to this embodiment includes a substrate and the LED sheet according to this embodiment attached to the substrate.

[0015] The growing shelf for animals and plants according to this embodiment includes the shelf board according to this embodiment, and the LED sheet is attached to the lower surface side of the substrate.

[0016] In the growth shelf for animals and plants according to the present embodiment, the LED sheet may be further arranged on the side surface side of the shelf board.

[0017] The animal and plant growth factory according to the present embodiment is an animal and plant growth factory including a building and the growth shelf for animals and plants according to the present embodiment arranged inside the building.

Effect of the Invention

[0018] According to the present embodiment, animals and plants can be obtained in good yields.

Brief Description of the Drawings

[0019]

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Mode for Carrying Out the Invention

[0020] The LED sheet according to the present embodiment includes a flexible substrate film, a metal wiring portion on the substrate film, and a plurality of LED chips mounted on the metal wiring portion. Further, the LED sheet is provided with through holes penetrating the LED sheet. Thereby, good yields of animals and plants can be obtained.

[0021] When growing animals and plants using artificial light, in order to grow animals and plants efficiently, it is important to appropriately adjust the illuminance of the LED lighting device and effectively circulate the air. That is, by effectively circulating the air, when growing animals and plants, for example, variations in growth due to heat are less likely to occur. In this case, in order to grow animals and plants efficiently, it is preferable that the air velocity around the animals and plants is 0.5 m / s or more. In this way, when the air velocity around the animals and plants is 0.5 m / s or more, the air around the animals and plants can be effectively circulated, and when growing animals and plants, variations in growth can be effectively suppressed. Also, when the air velocity around the plants is 0.5 m / s or more, the photosynthesis rate of the plants can be increased. For this reason, the growth of the plants can be promoted, and the plants can be obtained in good yields.

[0022] By the way, in a plant and animal growing factory that grows animals and plants using artificial light, basically, the air circulation is configured to be performed by an air conditioner. On the other hand, in a region where, for example, plants are dense, the air may be less likely to circulate. In contrast, in the present embodiment, through-holes penetrating the LED sheet are provided in the LED sheet. Thereby, in the plant and animal growing factory, air can be effectively circulated through the through-holes. For this reason, the growth of animals and plants can be promoted, and animals and plants can be obtained in good yields.

[0023] Moreover, the LED sheet according to the present embodiment is a sheet-shaped LED lighting device including a flexible substrate film. For this reason, the weight of the LED lighting device can be reduced. Also, the LED sheet according to the present embodiment can have a smaller overall thickness compared to a straight tube type LED bar light in which a plurality of LEDs are arranged. For this reason, the vertical interval between the shelves of the plant and animal growing shelf can be narrowed, and the yield of animals and plants per floor area of the plant and animal growing factory can be improved.

[0024] Furthermore, since the LED sheet is a sheet-shaped LED lighting device including a flexible substrate film, on the shelves of the plant and animal growing shelf, the LED sheet can be easily attached to substrates of various shapes.

[0025] Hereinafter, an embodiment will be specifically described with reference to the drawings. Each of the drawings shown below is a schematic diagram. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. Also, it can be implemented with appropriate changes within the scope not departing from the technical idea. In each of the drawings shown below, the same parts are denoted by the same reference numerals, and some detailed descriptions may be omitted. Also, the numerical values such as the dimensions of each member described in this specification and the material names are examples as an embodiment, and are not limited thereto, and can be appropriately selected and used. In this specification, terms specifying shapes and geometric conditions, such as terms like parallel, orthogonal, and perpendicular, are interpreted to include not only the strictly meant state but also substantially the same state. In this specification, animals and plants mean animals and / or plants. In the following, for the sake of convenience, the case of growing (cultivating) plants using an LED sheet will be taken as an example for description, but the LED sheet for growing animals and plants according to this embodiment can also be applied to the case of growing animals within a range where no contradiction occurs.

[0026] (LED sheet) As shown in FIG. 1, the LED sheet 20 for growing animals and plants according to this embodiment is an LED lighting device installed in a plant growing factory 90 (FIG. 7) using artificial light and is used to grow plants. A control unit 40 is electrically connected to such an LED sheet 20.

[0027] As shown in FIGS. 1 and 2, the LED sheet 20 is a so-called single-sided light-emitting planar light source sheet. A plurality of LED chips 21 are arranged on the light-emitting surface 20a side of the LED sheet 20. By using such a direct-down type LED sheet 20, the irradiation light from the LED chips 21 directly passes through the light-emitting surface 20a. Therefore, since the irradiation light directly reaches the plants directly below, the light amount can be increased to promote the growth of the plants. Also, since the overall thickness of the LED sheet 20 can be made thinner than that of an LED bar light, it is possible to suppress the generation of shadows on the side portion side of the LED chips 21.

[0028] In addition, although FIGS. 1 and 2 show an example of a direct - type LED sheet 20, the present invention is not limited thereto, and an edge - lit type LED sheet with a light guide plate or the like interposed therebetween may be used. The edge - lit type LED sheet is likely to suppress variations in the amount of light from the light - emitting surface.

[0029] The LED sheets 20 in FIGS. 1 and 2 include a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30. By using such a flexible wiring board 30, an LED sheet 20 with a relatively large sheet - surface area can be obtained. Generally, in a plant growth factory or a plant growth shelf, a plurality of LED sheets 20 are arranged and used. If the positions of adjacent LED sheets 20 vary, variations in the amount of light may occur, which may reduce the yield of plants and animals. Since the LED sheet 20 with a relatively large sheet - surface area can reduce the number of LED sheets 20 used, variations in the amount of light due to the arrangement of a plurality of LED sheets 20 can be suppressed. In addition, although FIGS. 1 and 2 show an example of an LED sheet 20 provided with a flexible wiring board 30, the present invention is not limited thereto, and an LED sheet provided with a rigid wiring board may also be used. The LED sheet provided with a rigid wiring board has high resistance to stress and is not easily damaged. In addition, in FIGS. 1 and 2, the display of the light - reflective insulating protective film 34 and the transparent protective film 35, which will be described later, is omitted.

[0030] In this case, the LED chips 21 are arranged in a lattice - dot pattern in a plan view within the flexible wiring board 30. That is, the LED chips 21 are arranged in a matrix of multiple rows and multiple columns, and the columns R1 of M LED chips 21 connected in series are arranged in N columns.

[0031] For example, in FIG. 2, 14 LED chips 21 are connected in series along the first array direction (X direction) of the LED chips 21. Further, a row R1 having these 14 LED chips 21 is arranged in parallel in 10 rows (N = 10) along the second array direction (Y direction) of the LED chips 21. Note that the number of arranged LED chips 21 is not limited to this. Specifically, the LED chips 21 are arranged in series in 10 or more and 14 or less (14 ≧ M ≧ 10) in the first array direction (X direction), and this row R1 is preferably arranged in parallel in 4 or more and 10 or less (10 ≧ N ≧ 4) in the second array direction (Y direction) of the LED chips 21. By arranging 10 or more LED chips 21 in series, the interval between the LED chips 21 in the first array direction (X direction) can be shortened. Thereby, the in-plane variation in the illuminance of the LED sheet 20 can be suppressed. For this reason, the variation in the light irradiated to the plant can be suppressed. Also, by arranging 14 or less LED chips 21 in series, the power consumption can be reduced. Further, by arranging the rows of the LED chips 21 in parallel in 4 or more in the second array direction (Y direction) of the LED chips 21, even when a specific LED chip 21 is damaged, it can be prevented from affecting the LED chips 21 in other rows. Thereby, it can be suppressed that the illuminance of the entire LED sheet 20 extremely decreases. Incidentally, when the LED sheet 20 is a direct type, the possibility that an operator contacts the LED chip 21 increases when the LED sheet 20 is installed or removed. And when the operator accidentally and strongly contacts the LED chip 21, the risk of the LED chip 21 being damaged increases. For this reason, taking measures when the LED chip 21 is damaged is important from the viewpoint of risk management. Furthermore, by arranging the rows of the LED chips 21 in parallel in 10 or less, the power consumption can be reduced.

[0032] The LED sheet 20 has a plurality of metal wiring portions 22, and the plurality of metal wiring portions 22 are arranged along the first arrangement direction (X direction). The plurality of metal wiring portions 22 arranged along the first arrangement direction (X direction) respectively correspond to each row R1 of the LED chips 21. The LED chips 21 are arranged so as to straddle a pair of adjacent metal wiring portions 22 in the X direction. Also, each terminal (not shown) of the LED chips 21 is electrically connected to a pair of metal wiring portions 22 respectively. The plurality of metal wiring portions 22 constitute a power supply portion to the LED chips 21. When power is supplied to the plurality of metal wiring portions 22, all the LED chips 21 arranged in the row R1 are lit. Note that the plurality of metal wiring portions 22 constitute a part of the metal wiring portion 32 described later.

[0033] The interval Px between the LED chips 21 in the first arrangement direction (X direction) is preferably 37 mm or more and 50 mm or less. Also, the interval Py between the LED chips 21 in the second arrangement direction (Y direction) is preferably 37 mm or more and 100 mm or less. By setting the interval between the LED chips 21 within the above range, the luminance of the LED sheet 20 can be made uniform in the plane. For this reason, variations in the light irradiated into the space can be suppressed, and the power consumption of the LED sheet 20 can be suppressed.

[0034] The thickness of the thickest portion of the LED sheet 20 is preferably 5 mm or less. By reducing the thickness of the LED sheet 20 in this way, the vertical interval between the substrates 81 (FIG. 8) on which the LED sheet 20 is installed can be narrowed, and thereby the number of substrates 81 per plant growth shelf 80 (FIG. 8) can be increased. As a result, the yield of plants per unit area can be increased. Also, when the plants and the LED sheet 20 are close to each other, variations in the relatively strong light irradiated to the plants can be more suppressed.

[0035] The arrangement of the LED chips 21 is not limited to a grid pattern in plan view. As shown in Fig. 3(a), it may be arranged in a staggered pattern in plan view. Also, the LED chips 21 do not have to be uniformly arranged within the plane of the LED sheet 20. For example, at the peripheral portion of the LED sheet 20, the density of the LED chips 21 may be increased. Specifically, as shown in Fig. 3(b), at the central portion (lower part in Fig. 3(b)) of the LED sheet 20, the LED chips 21 are arranged in a grid pattern, and at the peripheral portion (upper part in Fig. 3(b)) of the LED sheet 20, the LED chips 21 may be arranged in a staggered pattern. Thereby, a decrease in the luminance of the LED sheet 20 at the peripheral portion can be suppressed, the luminance of the LED sheet 20 can be made uniform in the plane, and variations in the light irradiated into the space can be suppressed.

[0036] The overall shape of the LED sheet 20 is rectangular in plan view, but the size and planar shape of the LED sheet 20 are not particularly limited. Since the LED sheet 20 has a high degree of freedom in processing of size and shape, it can flexibly respond to various demands in this regard. Also, since the LED sheet 20 has flexibility, it can be attached not only to an installation surface having a flat shape but also to installation surfaces having various shapes.

[0037] In Fig. 2, the length Lx of the LED sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more and 700 mm or less, and more preferably 550 mm or more and 650 mm or less. The length Ly of the LED sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more and 500 mm or less, and more preferably 350 mm or more and 450 mm or less. By the individual LED sheets 20 not being excessively small, the amount of light from the LED sheets 20 can be increased. Also, by the individual LED sheets 20 not being excessively large, when a specific LED chip 21 is damaged, the influence on other LED chips 21 can be minimized. For this reason, an extreme decrease in the illuminance of the entire LED sheet 20 can be prevented, and the range in which the illuminance decreases can be limited.

[0038] Next, the control unit 40 will be described. As shown in FIG. 1, the control unit 40 supplies power to the LED sheet 20 and controls the light emission and the like of the LED sheet 20. The control unit 40 is detachably connected to the LED sheet 20 via a first connector 44A provided on the LED sheet 20. That is, the control unit 40 is configured separately from the LED sheet 20 and is externally connected to the LED sheet 20. In other words, the control unit 40 is not integrated with the LED sheet 20. Thereby, the control unit 40 serving as a heat source can be separated from the LED sheet 20, and the growth of plants can be prevented from being affected by the heat from the control unit 40.

[0039] Further, the control unit 40 includes a power input unit 41, an AC / DC converter (driver) 42, and a PWM control unit 43. Among these, an alternating voltage having an arbitrary voltage of, for example, 100V to 240V is supplied to the power input unit 41. The AC / DC converter 42 converts an alternating voltage of 100V to 240V into a direct voltage of a constant voltage (for example, 44V). The PWM control unit 43 performs dimming of the LED chips 21 of the LED sheet 20 by arbitrarily changing the pulse width of the constant voltage waveform from the AC / DC converter 42. That is, the PWM control unit 43 also serves as a dimming control unit that controls the dimming of the LED sheet 20. The constant voltage output from the PWM control unit 43 is applied to the LED sheet 20 via the first connector 44A.

[0040] In this embodiment, a DC constant voltage is applied from the PWM control unit 43 of the control unit 40 to the LED sheet 20. As a result, unlike the case where a pulse voltage directly rectified is applied to the LED sheet 20, it becomes possible to dim the LED chip 21. That is, the PWM control unit 43 can arbitrarily control the illuminance of the LED chip 21 by appropriately changing the duty ratio of the DC voltage from the AC / DC converter 42. For example, as shown in Fig. 4(a), the PWM control unit 43 can reduce the illuminance of the LED chip 21 by suppressing the duty ratio of the constant voltage from the AC / DC converter 42 from 100% (solid line) to 50% (dotted line).

[0041] When adjusting the illuminance of the LED chip 21 in this way, for example, the illuminance of the LED sheet 20 may be adjusted according to the growth stage of the plant. Thereby, the degree of plant growth can be adjusted. For example, in the early growth stage when the size of the plant leaves is small, the illuminance of the LED sheet 20 may be lowered, and in the late growth stage when the size of the plant leaves is large, the illuminance of the LED sheet 20 may be increased. Alternatively, in the early growth stage when the plant height is low, since the distance between the plant and the LED chip 21 is large, the illuminance of the LED sheet 20 may be increased. Also, in the late growth stage when the plant height is large, since the distance between the plant and the LED chip 21 is close, the illuminance of the LED sheet 20 may be lowered. As another example of adjusting the illuminance of the LED sheet 20, the illuminance may be increased for plants that require a high illuminance, and the illuminance may be lowered for plants that can grow even with a low illuminance. Also, when it is desired to advance the shipping time, the illuminance may be increased, and when it is desired to delay the shipping time, the illuminance may be lowered.

[0042] Further, by applying a DC constant voltage from the PWM control unit 43 to the LED sheet 20, the integrated light quantity per unit time of the light from the LED sheet 20 can be increased. That is, for example, the integrated light quantity (the area of the shaded portion in FIG. 4(a)) when a DC constant voltage is applied to the LED sheet 20 can be made larger than the integrated light quantity (the area of the shaded portion in FIG. 4(b)) when a voltage is applied in pulses as a comparative example. Thereby, the light emission efficiency of the light from the LED sheet 20 can be enhanced, and the growth efficiency of algae can be improved.

[0043] Referring to FIG. 1 again, a regulator 45 is provided on the LED sheet 20. In this case, the regulator 45 is provided corresponding to each column of the LED chips 21. Specifically, ten regulators 45 are provided corresponding to the ten columns of the LED chips 21. This regulator 45 serves to keep the current flowing through the plurality of LED chips 21 in each column constant. Thereby, even when one LED chip 21 is damaged, it is possible to suppress an excessive current from flowing through the LED chips 21 in other columns and prevent the LED chips 21 in other columns from being damaged. As a result, it is possible to prevent the illuminance of the entire LED sheet 20 from extremely decreasing and suppress the variation in the light irradiating the space.

[0044] Furthermore, a power supply line 46 is provided on the LED sheet 20, branching from the first connector 44A. Also, a second connector 44B is provided on the LED sheet 20. The power supply line 46 is electrically connected to the wiring of another LED sheet 200 having the same configuration as the LED sheet 20 without being electrically connected to the LED chips 21 of the LED sheet 20. That is, the power supply line 46 is detachably connected to the wiring of the LED sheet 200 via the second connector 44B and another first connector 44A provided on the other LED sheet 200. The current from the power supply line 46 is supplied to the other LED sheet 200 via the second connector 44B and another first connector 44A. Thereby, two LED sheets 20 and 200 are connected, and these two LED sheets 20 and 200 can be simultaneously controlled by one control unit 40. Since a plurality of LED sheets 20 and 200 can be simultaneously controlled by one control unit 40, the number of control units 40 can be reduced. For this reason, variations in plant growth due to heat from the control unit 40 are less likely to occur, and a decrease in yield can be suppressed.

[0045] (Each member of the LED sheet) Next, each member constituting the LED sheet 20 will be described. As shown in FIG. 5, the LED sheet 20 includes a flexible wiring board 30 and a plurality of LED chips 21 disposed on the flexible wiring board 30. Among these, the flexible wiring board 30 has a flexible substrate film 31 and a metal wiring portion 32 on the substrate film 31. The metal wiring portion 32 is laminated on the substrate film 31 via an adhesive layer 33.

[0046] Each LED chip 21 is mounted in a manner that can be electrically connected to the metal wiring portion 32. In this LED sheet 20, since the LED chips 21 are mounted on the flexible wiring board 30, it is possible to arrange the plurality of LED chips 21 at a desired high density.

[0047] On the metal wiring portion 32, a light-reflective insulating protective film 34 is formed. This light-reflective insulating protective film 34 is not formed in the regions of the LED sheet 20 where the LED chips 21, the regulator 45, the first connector 44A, or the second connector 44B are provided. Also, the light-reflective insulating protective film 34 is not formed in the peripheral regions of the regions where the LED chips 21, the regulator 45, the first connector 44A, or the second connector 44B are provided. The light-reflective insulating protective film 34 is a layer having both an insulating function that contributes to improving the migration resistance characteristics of the LED sheet 20 and a light-reflective function that contributes to improving the light environment created by the LED sheet 20. This layer is formed of an insulating resin composition containing a white pigment. When the migration resistance characteristics and the light-reflective function are obtained by the aforementioned metal wiring portion 32 and the transparent protective film 35 described later, the light-reflective insulating protective film 34 may not be formed on the metal wiring portion 32.

[0048] Also, a transparent protective film 35 is formed so as to cover the light-reflective insulating protective film 34 and the LED chips 21. The transparent protective film 35 is a resinous film formed on the outermost surface (the surface located on the light-emitting surface 20a side) mainly to ensure the waterproofness of the LED sheet 20.

[0049] Furthermore, a solder portion 36 is provided on the metal wiring portion 32. Each LED chip 21 is electrically connected to the metal wiring portion 32 via the solder portion 36.

[0050] (Substrate film) As the substrate film 31, a resin film having flexibility can be used. In this specification, "having flexibility" means "the radius of curvature when bent is at least 1 m or less, preferably 50 cm, more preferably 30 cm, still more preferably 10 cm, and particularly preferably 5 cm".

[0051] As the material of the substrate film 31, a thermoplastic resin with high heat resistance and insulation may be used. As such a resin, a polyimide resin (PI) or a polyethylene naphthalate (PEN) that is excellent in heat resistance, dimensional stability during heating, mechanical strength, and durability can be used. Among them, polyethylene naphthalate (PEN) whose heat resistance and dimensional stability are improved by performing a heat resistance improvement treatment such as annealing treatment is preferably used. Also, polyethylene terephthalate (PET) whose flame retardancy is improved by adding a flame retardant inorganic filler or the like may be used.

[0052] The substrate film 31 has a first region Re1 (see FIG. 2) where the LED chips 21 are arranged and a second region Re2 (see FIG. 2) provided around the first region Re1. In this case, among each row R1 of the LED chips 21, in the row R1 that is the farthest from the center in the width direction (Y direction) of the substrate film 31 toward the plus side in the Y direction, the center of each LED chip 21 may be located on the outer edge of the first region Re1. Similarly, among each row R1 of the LED chips 21, in the row R1 that is the farthest from the center in the width direction (Y direction) of the substrate film 31 toward the minus side in the Y direction, the center of each LED chip 21 may be located on the outer edge of the first region Re1. Also, in each row R1, among the LED chips 21, the center of the LED chip 21 that is the farthest from the center in the longitudinal direction (X direction) of the substrate film 31 toward the plus side in the X direction may be located on the outer edge of the first region Re1. Further, in each row R1, among the LED chips 21, the center of the LED chip 21 that is the farthest from the center in the longitudinal direction (X direction) of the substrate film 31 toward the minus side in the X direction may be located on the outer edge of the first region Re1. In the present embodiment, the first region Re1 has a rectangular shape in plan view. However, it is not limited to this, and the first region Re1 may have another shape in plan view.

[0053] The thickness of the substrate film 31 is not particularly limited. The thickness of the substrate film 31 should not become a bottleneck as a heat dissipation path, should have heat resistance and insulation properties, and from the perspective of the balance of manufacturing costs, it is preferably generally 10 μm or more and 500 μm or less, more preferably 50 μm or more and 250 μm or less. Also, from the perspective of maintaining good productivity when manufacturing by the roll-to-roll method, the thickness of the substrate film 31 is preferably within the above thickness range.

[0054] (Adhesive layer) As the adhesive for forming the adhesive layer 33, known resin-based adhesives may be appropriately used. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, ester-based, or epoxy-based adhesives, etc. can be particularly preferably used.

[0055] (Metal wiring part) The metal wiring part 32 is a wiring pattern formed on the surface 31a of the substrate film 31 (the surface on the light-emitting surface 20a side) by a conductive substrate such as a metal foil. This metal wiring part 32 is preferably formed on the surface 31a of the substrate film 31 by the dry lamination method via the adhesive layer 33. The metal wiring part 32 includes the plurality of metal wiring parts 22 described above. The plurality of metal wiring parts 22 include a first metal wiring part 22A and a second metal wiring part 22B arranged at a distance from the first metal wiring part 22A. The LED chip 21 is mounted on the first metal wiring part 22A and the second metal wiring part 22B, and the LED chip 21 is electrically connected to the first metal wiring part 22A and the second metal wiring part 22B. The LED chip 21 is lit by the electric power supplied to the first metal wiring part 22A and the second metal wiring part 22B.

[0056] The metal wiring portion 32 preferably achieves high levels of both heat dissipation and electrical conductivity, and for example, a copper foil can be used. In this case, the heat dissipation from the LED chip 21 is stabilized, and an increase in electrical resistance can be prevented, so the light emission variation between the LED chips 21 is reduced and stable light emission becomes possible. Also, the lifespan of the LED chip 21 is extended. Furthermore, deterioration of peripheral members such as the substrate film 31 due to heat can be prevented, so the product lifespan of the LED sheet 20 can also be extended. Examples of the metal for forming the metal wiring portion 32 include metals such as aluminum, gold, and silver in addition to the above-mentioned copper.

[0057] The thickness of the metal wiring portion 32 may be appropriately set according to the magnitude of the current resistance required for the flexible wiring board 30, etc. However, in order to suppress warping due to heat shrinkage of the substrate film 31 during soldering processing by a reflow method or the like, the thickness of the metal wiring portion 32 is preferably 10 μm or more. On the other hand, the thickness of the metal wiring portion 32 is preferably 50 μm or less, whereby sufficient flexibility of the flexible wiring board 30 can be maintained, and a decrease in handling performance due to an increase in weight can also be suppressed.

[0058] (Soldering portion) The soldering portion 36 joins the metal wiring portion 32 and the LED chip 21. This joining by soldering can be performed by either a reflow method or a laser method.

[0059] (LED chip) The LED chip 21 is a light-emitting element that utilizes light emission at a PN junction where a P-type semiconductor and an N-type semiconductor are joined. As the LED chip 21, a structure in which a P-type electrode and an N-type electrode are provided on the upper surface and the lower surface of the element, respectively, may be used, or a structure in which both a P-type electrode and an N-type electrode are provided on one side of the element may be used.

[0060] In addition, it is preferable to select an LED chip 21 with high luminous efficiency. Specifically, as the LED chip 21, it is preferable to use one having a luminous efficiency of 150 lm / W or more, and more preferably one having a luminous efficiency of 180 lm / W or more. By increasing the luminous efficiency of the LED chip 21 to 150 lm / W or more, the mounting number (density) of the LED chip 21 can be reduced, the heat generation due to Joule heat from the LED chip 21 can be decreased, and the deterioration of peripheral members such as the substrate film 31 due to the heat from the LED chip 21 can be prevented.

[0061] As described above, the LED sheet 20 directly mounts the LED chip 21 on the metal wiring portion 32 that can exhibit high heat dissipation. Thereby, even when the LED chips 21 are arranged at a high density, the excessive heat generated when the LED chips 21 are lit can be quickly diffused through the metal wiring portion 32. For this reason, sufficient heat dissipation can be achieved to the outside of the LED sheet 20 through the substrate film 31, and the deterioration of peripheral members such as the substrate film 31 due to the heat from the LED chip 21 can be prevented.

[0062] (Light-reflective insulating protective film) As shown in FIG. 5, the light-reflective insulating protective film 34 is a layer formed in a region excluding the region where the LED chip 21 is provided and its peripheral region. This light-reflective insulating protective film 34 is a so-called resist layer that improves the migration resistance characteristics of the flexible wiring board 30 by having sufficient insulation, and is also a light-reflective layer having light reflectivity that contributes to the improvement of the emission luminance of the light environment created by the LED sheet 20.

[0063] The light-reflective insulating protective film 34 can be formed of various resin compositions based on a urethane resin or the like and further containing a white pigment composed of an inorganic filler such as titanium oxide. As the base resin of the resin composition used to form the light-reflective insulating protective film 34, in addition to the urethane resin, an acrylic polyurethane resin, a polyester resin, a phenolic resin, etc. can be appropriately used. As the base resin of the resin composition for forming the light-reflective insulating protective film 34, it is more preferable to use the same or a resin of the same series as the resin composition for forming the transparent protective film 35. Regarding the transparent protective film 35, as will be described later, it is preferable to use an acrylic polyurethane resin as the main material resin. From this, when the base resin of the resin composition for forming the transparent protective film 35 is an acrylic polyurethane resin, the base resin of the resin composition for forming the light-reflective insulating protective film 34 is more preferably a urethane resin or an acrylic polyurethane resin.

[0064] As the inorganic filler contained as a white pigment in the resin composition for forming the light-reflective insulating protective film 34, in addition to titanium oxide, at least one selected from alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, talc, calcium carbonate, zinc oxide, silica, mica powder, powder glass, powder nickel, and powder aluminum can be used.

[0065] The thickness of the light-reflective insulating protective film 34 is 5 μm or more and 50 μm or less, and more preferably 7 μm or more and 20 μm or less. When the thickness of the light-reflective insulating protective film 34 is 5 μm or more, it is possible to suppress the thinning of the light-reflective insulating protective film 34, particularly at the edge portion of the metal wiring portion 32. Therefore, it is possible to suppress the exposure of the metal wiring portion 32. Further, when the thickness of the light-reflective insulating protective film 34 is 50 μm or less, even when the flexible wiring board 30 is curved during conveyance or the like, it is possible to suppress the light-reflective insulating protective film 34 from peeling off from, for example, the metal wiring portion 32.

[0066] In addition, the light-reflective insulating protective film 34 preferably has a light reflectance of 65% or more, more preferably 70% or more, and still more preferably 80% or more at wavelengths from 400 nm to 780 nm. For example, when the LED sheet 20 contains 20 parts by mass or more of titanium oxide with respect to 100 parts by mass of a base resin of urethane-based or acrylic-based polyurethane, the light reflectance of the same layer can be 75% or more when the thickness of the light-reflective insulating protective film 34 is 8 μm.

[0067] (Transparent protective film) The transparent protective film 35 is formed on the outermost surface of the LED sheet 20 so as to cover the LED chip 21. The transparent protective film 35 has waterproofness and transparency. Due to the waterproofness of the transparent protective film 35, the intrusion of water into the LED sheet 20 can be prevented. When a highly luminous LED chip 21 having a luminous efficiency of, for example, 150 lm / W or more is selected as the LED chip 21, the influence when a specific LED chip 21 is damaged in the LED sheet 20 becomes large. Therefore, it is important from the perspective of risk management to make the LED chip 21 as difficult to break as possible.

[0068] The transparent protective film 35 can be formed of various resin compositions having an acrylic-based polyurethane resin or the like as a base resin. As the base resin of the resin composition used to form the transparent protective film 35, in addition to the acrylic-based polyurethane resin, urethane-based resins, polyester-based resins, phenolic resins, etc. can be appropriately used. It is more preferable that the base resin of the resin composition forming the transparent protective film 35 is the same or a resin of the same series as the resin composition forming the light-reflective insulating protective film 34. As a preferable specific combination, a combination can be mentioned in which the base resin of the resin composition forming the light-reflective insulating protective film 34 is a urethane-based resin and the same resin forming the transparent protective film 35 is an acrylic-based polyurethane resin.

[0069] The thickness of the transparent protective film 35 is 10 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. By setting the thickness of the transparent protective film 35 within the above range, good flexibility, thinness, light weight, and good optical properties required in an emergency of the LED sheet 20 can be maintained. In addition, sufficient waterproofness required in an emergency for the LED sheet 20 can be provided.

[0070] The water resistance of the LED sheet 20 by the transparent protective film 35 is not particularly limited as long as it can suppress the deterioration of the LED chip 21 when water is sprayed on the LED sheet 20. Such water resistance preferably indicates IPX4 or higher in the waterproof and dustproof protection standard defined by the IEC (International Electrotechnical Commission). The waterproofness of IPX4 or higher means that the LED chip 21 is not affected detrimentally by water droplets from all directions. Specifically, when water is sprayed from a water spray nozzle at a water volume of 10 L / min for 5 minutes in the entire range of ±180° with respect to the normal direction of the LED sheet 20, it is ensured that no detrimental effect is exerted on the LED chip 21.

[0071] Incidentally, referring back to FIG. 2, the LED sheet 20 is provided with a through hole 10 that penetrates the LED sheet 20. This through hole 10 serves to circulate the air around the plant. In this case, in the shelf board 83 (FIG. 8) for the plant growing shelf described later, the through hole 10 can be attached to the substrate 81 without being blocked by a mounting member (for example, a rivet or the like (not shown)) for attaching the LED sheet 20 to the substrate 81 or the substrate 81. Therefore, in the shelf board 83 (FIG. 8) for the plant growing shelf described later, air can pass through the through hole 10, and thereby the air around the plant can be circulated.

[0072] In this embodiment, a plurality of through-holes 10 are provided. At least a part of the through-holes 10 is preferably provided within the first region Re1 (see FIG. 2) of the substrate film 31. Thereby, the air around the plant can be effectively circulated. The through-holes 10 are formed in a lattice dot pattern in a plan view within the LED sheet 20. That is, the through-holes 10 are formed in a multi-stage and multi-column matrix shape. That is, M rows R2 of through-holes 10 provided along the longitudinal direction (X direction) of the substrate film 31 are provided in N columns along the width direction (Y direction) of the substrate film 31.

[0073] For example, in FIG. 2, 14 through-holes 10 (M = 14) are provided along the longitudinal direction (X direction) of the substrate film 31. Further, the rows R2 having these 14 through-holes 10 are provided in 10 columns (N = 10) along the width direction (Y direction) of the substrate film 31. Note that the number of arrangements of the through-holes 10 is not limited thereto. Specifically, the through-holes 10 are preferably provided in 4 or more and 300 or less (300 ≥ M ≥ 4) along the longitudinal direction (X direction) of the substrate film 31, and the rows R2 are provided in 2 or more and 200 or less (200 ≥ N ≥ 2) along the width direction (Y direction) of the substrate film 31. By providing 4 or more through-holes 10 along the longitudinal direction of the substrate film 31 and 2 or more rows R2 of through-holes 10 along the width direction of the substrate film 31, convection of air through the through-holes 10 is likely to occur. Therefore, the air can be effectively circulated. As a result, the growth of the plant is more effectively promoted, and the plant can be obtained with a better yield. Further, by the number of through-holes 10 along the longitudinal direction of the substrate film 31 being 300 or less and the number of rows R2 of through-holes 10 along the width direction of the substrate film 31 being 200 or less, it is possible to suppress a decrease in stiffness in the LED sheet 20.

[0074] In addition, the plurality of through-holes 10 may be provided at positions corresponding to the respective LED chips 21. Thereby, the ON state and the OFF state of the LED chip 21 can be easily confirmed through the through-holes 10. That is, when the LED chip 21 is lit, light leaks from the through-holes 10. On the other hand, when the LED chip 21 is not lit, no light leaks from the through-holes 10.

[0075] In the present embodiment, the same number of through-holes 10 as the number of LED chips 21 are formed in the LED sheet 20. And one through-hole may be formed in the vicinity (the vicinity on the minus side in the Y direction) of each LED chip 21. Thereby, the damaged LED chip 21 can be easily specified.

[0076] In the illustrated example, the planar shape of the through-hole 10 is circular. However, the shape of the through-hole is not particularly limited. For example, the planar shape of the through-hole 10 may be elliptical, or may be a polygonal shape such as a square shape or a rectangular shape. Also, the planar shapes of the respective through-holes 10 may be different from each other.

[0077] The size of such through-holes 10 may increase as the distance from the center of the substrate film 31 increases. Thereby, as will be described later, air flowing from the outside of the culture medium region MA (FIG. 7) into the culture medium region MA can be easily supplied between the plants PL through the through-holes 10. Thereby, the air around the plant PL can be effectively circulated.

[0078] In the illustrated example, in each column R2, the size of the through-hole 10 increases as it moves away from the center in the longitudinal direction (X direction) of the substrate film 31. That is, when viewed along the longitudinal direction (X direction) of the substrate film 31, the size of the through-hole 10 increases as it moves away from the center in the longitudinal direction (X direction) of the substrate film 31. Also, when viewed along the width direction (Y direction) of the substrate film 31, the size of the through-hole 10 increases as it moves away from the center in the width direction (Y direction) of the substrate film 31. Note that this is not limited thereto. For example, although not shown in the figure, when viewed along the longitudinal direction (X direction) of the substrate film 31, the sizes of the through-holes 10 may be equal to each other, and when viewed along the width direction (Y direction) of the substrate film 31, the size of the through-hole 10 may increase as it moves away from the center in the width direction (Y direction) of the substrate film 31. Also, when viewed along the longitudinal direction (X direction) of the substrate film 31, the size of the through-hole 10 may increase as it moves away from the center in the longitudinal direction (X direction) of the substrate film 31, and when viewed along the width direction (Y direction) of the substrate film 31, the sizes of the through-holes 10 may be equal to each other.

[0079] The aperture ratio of the LED sheet 20 is preferably 10% or more and 50% or less, and more preferably 15% or more and 50% or less. When the aperture ratio of the LED sheet 20 is 10% or more, air can be circulated more effectively, and when the aperture ratio of the LED sheet 20 is 15% or more, air can be circulated even more effectively. Also, when the aperture ratio of the LED sheet 20 is 50% or less, it is possible to suppress a decrease in stiffness in the LED sheet 20. Note that the aperture ratio refers to the ratio (%) of the area of the through-hole 10 to the area of the LED sheet 20.

[0080] (Method for manufacturing an LED sheet) Next, a method for manufacturing the LED sheet 20 according to the present embodiment will be described with reference to FIGS. 6(a) - (h).

[0081] First, prepare a substrate film 31 (Fig. 6(a)). Next, laminate a metal foil 32A, such as a copper foil, which is a material for the metal wiring portion 32, on the surface 31a of the substrate film 31 (Fig. 6(b)). The metal foil 32A is adhered to the surface 31a of the substrate film 31 by an adhesive layer 33, such as a urethane-based adhesive. Alternatively, the metal foil 32A may be directly formed on the surface 31a of the substrate film 31 by an electrolytic plating method or a vapor deposition method (sputtering, ion plating, electron beam evaporation, vacuum evaporation, chemical vapor deposition, etc.). Or, the substrate film 31 may be directly welded to the metal foil 32A for formation.

[0082] Next, form an etching mask 37 patterned into the shape required for the metal wiring portion 32 on the surface of the metal foil 32A (Fig. 6(c)). This etching mask 37 is provided so that the portion corresponding to the wiring pattern of the metal foil 32A that will become the metal wiring portion 32 is not corroded by the etching solution. The method for forming the etching mask 37 is not particularly limited. For example, it may be formed by exposing a photoresist or a dry film through a photomask and then developing it, or an etching mask may be formed on the surface of the metal foil 32A by a printing technique such as an inkjet printer.

[0083] Next, remove the metal foil 32A located at the portions not covered by the etching mask 37 with an immersion solution (Fig. 6(d)). Thereby, portions other than the portions that will become the metal wiring portion 32 of the metal foil 32A are removed.

[0084] Thereafter, use an alkaline stripping solution to remove the etching mask 37. Thereby, the etching mask 37 is removed from the surface of the metal wiring portion 32 (Fig. 6(e)).

[0085] Subsequently, a light-reflective insulating protective film 34 is laminated and formed on the metal wiring portion 32 (FIG. 6(f)). The formation of the light-reflective insulating protective film 34 is not particularly limited as long as it is a coating means capable of uniformly coating the material resin composition constituting the light-reflective insulating protective film 34. For example, methods such as screen printing, offset printing, dip coater, and brush coating can be used. Alternatively, an insulating protective film material having photosensitivity may be coated over the entire surface, and after being exposed only through a photomask at necessary locations and then developed, the light-reflective insulating protective film 34 may be formed.

[0086] Next, an LED chip 21, a regulator 45, and connectors 44A and 44B are mounted on the metal wiring portion 32 (FIG. 6(g)). In FIGS. 6(g) and 6(h) to be described later, for the sake of clarity of the drawing, the illustration of the regulator 45 and the like is omitted. In this case, the LED chip 21 is joined to the metal wiring portion 32 by soldering via a solder portion 36. The joining by this soldering can be performed by a reflow method, a laser method, or joining with a conductive resin.

[0087] Next, a transparent protective film 35 is formed so as to cover the light-reflective insulating protective film 34, the LED chip 21, the regulator 45, and the connectors 44A and 44B (FIG. 6(h)). It is preferable to form this transparent protective film 35 by a method of spraying a transparent resin composition by a spray treatment (hereinafter referred to as the "spray coating method") or a method of forming it by a curtain coating method. The formation of the transparent protective film 35 by the spray coating method can be performed, for example, by spraying a coating liquid for spray coating containing an acrylic-based polyurethane resin onto a desired region on the flexible wiring board 30 by a spray coater to form a coating film. The formation of the transparent protective film 35 by the curtain coating method can be performed, for example, by dropping a coating liquid for curtain coating containing an acrylic-based polyurethane resin onto a desired region on the flexible wiring board 30 by a curtain coater to form a coating film.

[0088] Thereafter, for example, a through-hole 10 is formed in the LED sheet 20 by a cutter or the like. At this time, the through-hole 10 is formed in a region other than the region where the metal wiring portion 32 is formed.

[0089] Note that the LED sheet 20 according to the present embodiment is not limited to the above-described method, and can also be manufactured by a conventionally known method for manufacturing a flexible wiring board for an LED chip or various LED sheets obtained by mounting an LED chip thereon.

[0090] (Plant cultivation factory and plant cultivation shelf) FIG. 7 is a diagram schematically showing the configuration of a plant cultivation factory 90 using the LED sheet 20 according to the present embodiment. The plant cultivation factory 90 includes a building 91 and a plurality of plant cultivation shelves 80 arranged inside the building 91.

[0091] As shown in FIG. 8, the plant cultivation shelf 80 has a plurality (four) of columns 82 and a plurality of substrates 81 arranged at intervals in the vertical direction along the columns 82. A culture medium region MA for cultivating the plant PL is provided on the upper surface of each substrate 81 except for the uppermost substrate 81. The lower surface of each substrate 81 except for the lowermost substrate 81 constitutes a ceiling surface with respect to the substrate 81 located below the substrate 81. An LED sheet 20 is attached to the lower surface side of each substrate 81 except for the lowermost substrate 81, and the LED sheets 20 are arranged in parallel. In this case, the control unit 40 is arranged at a location sufficiently far from the LED sheet 20. Therefore, there is little possibility that the growth varies due to the heat from the control unit 40 between the plant PL at a position close to the control unit 40 and the plant PL at a position far from the control unit 40. Further, the substrate 81 and the LED sheet 20 attached to the substrate 81 constitute a shelf board 83 for a plant cultivation shelf. In the present embodiment, such a shelf board 83 for a plant cultivation shelf (FIG. 8), a plant cultivation shelf 80 (FIG. 8), and a plant cultivation factory 90 (FIG. 7) including the plant cultivation shelf 80 are also provided.

[0092] Since the LED sheet 20 according to this embodiment has flexibility and light weight, the LED sheet 20 can be attached to the lower surface of each substrate 81 more easily than the attachment by a conventional straight tube type lighting device or the like. Further, since the LED sheet 20 has flexibility, the LED sheet 20 can be attached to ceiling surfaces having various sizes and shapes. As a result, the LED sheet 20 according to this embodiment can be applied to various plant growing shelves 80 and plant growing factories 90.

[0093] In addition, the LED sheet 20 is thinner than a conventional straight tube type lighting device. Thereby, the interval between the substrates 81 in the vertical direction can be narrowed, and the number of substrates 81 included in each plant growing shelf 80 can be increased. As a result, the yield of the plants PL per unit area can be increased.

[0094] Note that, as shown in FIGS. 9(a) - (b), the LED sheet 20 may be disposed not only on the lower surface side of the substrate 81 but also on the side surface side of the substrate 81. The LED sheet 20 on this side surface side is suspended from the substrate 81 located above toward the substrate 81 located below the substrate 81. In this case, as shown in FIG. 9(a), the LED sheet 20 may reach the substrate 81 located below. Alternatively, as shown in FIG. 9(b), the LED sheet 20 may cover only the upper side of the space located between the upper and lower substrates 81 without reaching the substrate 81 located below. Thus, by further disposing the LED sheet 20 on the side surface side of the substrate 81, the amount of light at the periphery of the substrate 81 where the illuminance tends to be weak can be compensated, and the luminance of the LED sheet 20 can be made uniform in the plane. As a result, the growth of the plants can be made uniform in the plane, and the yield of the plants to be grown can be improved.

[0095] Incidentally, in the present embodiment, a plurality of through holes 10 penetrating the LED sheet 20 are provided in the LED sheet 20. As a result, for example, as shown in FIG. 10, the air A flowing below the LED sheet 20 is supplied between the plants PL through the through holes 10. Thereby, the air around the plant PL can be circulated. A plurality of openings 81a penetrating the substrate 81 are formed in the substrate 81, and the air A that has passed through the through holes 10 is configured to be supplied between the plants PL through the openings 81a. At least a part of the openings 81a is preferably formed at a position overlapping the through holes 10 of the LED sheet 20 in a plan view when the LED sheet 20 is attached to the substrate 81. That is, in the shelf board 83 for the plant growing shelf, it is preferable that at least a part of the openings 81a is formed at a position overlapping the through holes 10 of the LED sheet 20 in a plan view. Thereby, the air A that has passed through the through holes 10 can be easily supplied between the plants PL through the openings 81a. Although not shown, a flow path such as a gap through which the air A can pass is formed between the substrate 81 and the LED sheet 20.

[0096] Further, as described above, in order to improve the light utilization efficiency, the LED sheet 20 may be arranged on the side surface side of the substrate 81. Also in this case, since the through holes 10 are provided in the LED sheet 20, the air A1 outside the culture medium region MA easily flows into the culture medium region MA through the through holes 10. Thereby, the air around the plant PL can be effectively circulated.

[0097] Further, when the size of the through holes 10 increases as the distance from the center of the substrate film 31 increases, when the air A2 outside the culture medium region MA flows into the culture medium region MA from the outside of the culture medium region MA (for example, the left side in FIG. 10), the air A2 can be easily supplied between the plants PL through the through holes 10. Thereby, the air around the plant PL can be circulated more effectively.

[0098] According to this embodiment, the LED sheet 20 includes a flexible substrate film 31, a metal wiring portion 32 on the substrate film 31, and a plurality of LED chips 21 mounted on the metal wiring portion 32. Further, the LED sheet 20 is provided with a through hole 10 penetrating the LED sheet 20. Thereby, in the plant cultivation factory 90, air can be effectively circulated. In particular, even in a region where the plants PL are dense, air can be effectively circulated. For this reason, the growth of the plants PL can be promoted, and the plants PL can be obtained in a good yield. Also, for example, in this case, the air flow velocity around the plants PL can be set to 0.5 m / s or more. Thereby, the air around the plants PL can be effectively circulated, and when growing animals and plants, variations in growth can be effectively suppressed. Also, since the air flow velocity around the plants PL is 0.5 m / s or more, the photosynthesis rate of the plants PL can be increased. For this reason, the growth of the plants PL can be promoted, and the plants PL can be obtained in a good yield. Note that the fact that air can be effectively circulated in the plant cultivation factory 90 in this way will be described by the examples described later.

[0099] Further, according to this embodiment, a plurality of through holes 10 are provided. Thereby, in the plant cultivation factory 90, air can be circulated more effectively. For this reason, the plants PL can be obtained in a better yield.

[0100] Further, according to this embodiment, since the LED sheet 20 is a sheet-shaped LED lighting device including a flexible substrate film 31, the weight of the LED sheet 20 can be reduced. Also, the LED sheet 20 according to this embodiment can have a smaller overall thickness than a straight tube type LED bar light in which a plurality of LEDs are arranged. For this reason, it is possible to prevent the LED sheet 20 from being bulky. Thereby, the installation space for the LED sheet 20 can be reduced. Furthermore, since the LED sheet 20 is a sheet-shaped LED lighting device having a flexible substrate film 31, the LED sheet 20 can be easily attached to substrates 81 of various shapes.

[0101] Further, according to the present embodiment, the size of the through hole 10 increases as the distance from the center of the substrate film 31 increases. As a result, when the air A2 outside the culture medium region MA flows into the culture medium region MA from the outside of the culture medium region MA, the air A2 can be easily supplied between the plants PL through the through hole 10. Thereby, the air around the plant PL can be effectively circulated.

[0102] Furthermore, according to the present embodiment, the plurality of through holes 10 are respectively provided at positions corresponding to the respective LED chips 21. Thereby, it is possible to easily confirm the ON state and the OFF state of the LED chip 21 through the through hole 10.

[0103] [Example] Next, a specific example in the present embodiment will be described.

[0104] (Example 1) The flow velocity distribution of the air passing through the LED sheet 20 was calculated by simulation. Specifically, as shown in FIG. 11, the flow velocity distribution of the air passing through the box B provided with the upper plate b1 and the lower plate b2 was calculated. In this simulation, the width W of the box B was set to 600 mm, the depth D was set to 400 mm, and the height H was set to 500 mm. Further, as shown in FIG. 12, two through holes 10 were formed in the upper plate b1 and the lower plate b2 along the longitudinal direction (X direction) of the upper plate b1 (lower plate b2). At this time, the diameter of the through hole 10 was set to 200 mm.

[0105] Then, when the air A3 (see FIG. 11) with a flow velocity of 0.5 m / s was blown from below the lower plate b2 to the box B, the flow velocity distribution of the air passing through the box B was calculated. At this time, the inspection surface of the flow velocity distribution was set to a surface 200 mm above the lower plate b2. Further, the flow velocity of the air was calculated at a plurality of measurement points on the inspection surface. Furthermore, the ratio of the measurement points at which the flow velocity of the air became 0.5 m / s or more with respect to all the measurement points was calculated.

[0106] (Example 2) As shown in Fig. 13, except that eight through-holes 10 are respectively formed in the upper plate b1 and the lower plate b2, and the diameter of the through-hole 10 is set to 100 mm, the air velocity distribution was calculated by simulation in the same manner as in Example 1. At this time, four through-holes 10 arranged in a staggered pattern are formed in the upper plate b1 and the lower plate b2 along the longitudinal direction (X direction) of the upper plate b1 (lower plate b2). Also, the rows having these four through-holes 10 are provided in two rows along the width direction (Y direction) of the upper plate b1 (lower plate b2). And the diameter of the through-hole 10 is set to 100 mm.

[0107] (Example 3) As shown in Fig. 14, except that fifty through-holes 10 are respectively formed in the upper plate b1 and the lower plate b2, and the diameter of the through-hole 10 is set to 40 mm, the air velocity distribution was calculated by simulation in the same manner as in Example 1. At this time, ten through-holes 10 arranged in a staggered pattern are formed in the upper plate b1 and the lower plate b2 along the longitudinal direction (X direction) of the upper plate b1 (lower plate b2). Also, the rows having these ten through-holes 10 are provided in five rows along the width direction (Y direction) of the upper plate b1 (lower plate b2). And the diameter of the through-hole 10 is set to 40 mm.

[0108] (Example 4) As shown in Fig. 15, 76 through-holes 10 were set to be formed in the upper plate b1 and the lower plate b2 respectively, and the size of the through-holes 10 was set to increase as it is away from the center of the upper plate b1 (lower plate b2). Except for this, in the same manner as in Example 1, the air velocity distribution was calculated by simulation. At this time, in the center of the width direction (Y direction) of the upper plate b1 and the lower plate b2, a row Ra having 16 through-holes 10 arranged in a staggered pattern along the longitudinal direction (X direction) of the upper plate b1 (lower plate b2) was set to be formed. Also, in the width direction (Y direction) of the upper plate b1 (lower plate b2), on both sides of the row Ra, a row Rb having 16 through-holes 10 arranged in a staggered pattern along the longitudinal direction (X direction) of the upper plate b1 (lower plate b2) was set to be formed. Further, in the width direction (Y direction) of the upper plate b1 (lower plate b2), on the outer side of the row Rb (the side away from the center in the width direction (Y direction)), a row Rc having 14 through-holes 10 arranged in a staggered pattern along the longitudinal direction (X direction) of the upper plate b1 (lower plate b2) was set to be formed. And the diameter of the through-holes 10 in the row Ra was set to be 20 mm, the diameter of the through-holes 10 in the row Rb was set to be 30 mm, and the diameter of the through-holes 10 in the row Rc was set to be 40 mm.

[0109] The above results are shown in Figs. 16 to 19 and Table 1. Fig. 16 is a diagram showing the air velocity distribution in Example 1, Fig. 17 is a diagram showing the air velocity distribution in Example 2, Fig. 18 is a diagram showing the air velocity distribution in Example 3, and Fig. 19 is a diagram showing the air velocity distribution in Example 4.

[0110]

Table 1

[0111] As a result, as shown in FIGS. 16 to 19 and Table 1, in all of Examples 1 to 4, the ratio of the measurement points where the air flow velocity was 0.5 m / s or more was 35% or more. In particular, in Examples 2 to 4, the ratio of the measurement points where the air flow velocity was 0.5 m / s or more was 55% or more. Thus, in Examples 1 to 4, it was found that a region where the air flow velocity passing through the inside of box B becomes high can be widened, and the air inside box B can be effectively circulated. For this reason, according to this embodiment, it was found that air can be effectively circulated in a plant cultivation factory.

[0112] It is also possible to appropriately combine a plurality of components disclosed in the above embodiment and each modification as needed. Alternatively, some components may be deleted from all the components shown in the above embodiment and each modification.

Explanation of Reference Numerals

[0113] 10 Through-hole 20 LED sheet 21 LED chip 31 Substrate film 32 Metal wiring part 80 Cultivation shelf 81 Substrate 83 Shelf board 90 Plant cultivation factory 91 Building

Claims

1. An LED sheet, comprising: a flexible substrate film; a metal wiring portion on the substrate film; a plurality of LED chips mounted on the metal wiring portion, wherein the LED sheet is provided with through holes penetrating the LED sheet, wherein a plurality of the through holes are provided, and wherein the size of the through holes increases as the distance from the center of the substrate film increases. An LED sheet.

2. The LED sheet according to claim 1, wherein four or more of the through holes are provided along the longitudinal direction of the substrate film, and two or more rows of the through holes are provided along the width direction of the substrate film.

3. The LED sheet according to claim 1 or 2, wherein the aperture ratio of the LED sheet is 10% or more and 50% or less.

4. The LED sheet according to claim 3, wherein the aperture ratio is 15% or more.

5. The LED sheet according to any one of claims 1 to 4, wherein the plurality of through holes are respectively provided at positions corresponding to each of the LED chips.

6. A shelf board for a growth shelf of animals and plants, comprising: a substrate; and the LED sheet according to any one of claims 1 to 5 attached to the substrate. A shelf board for a growth shelf of animals and plants.

7. A growth shelf for animals and plants, comprising: the shelf board according to claim 6, wherein the LED sheet is attached to the lower surface side of the substrate. A growth shelf for animals and plants.

8. The growth shelf for animals and plants according to claim 7, wherein the LED sheet is further arranged on the side surface side of the shelf board.

9. An animal and plant cultivation factory, comprising: a building; and the growth shelf for animals and plants according to claim 7 or 8 arranged inside the building.

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