Inductor component and method for manufacturing the same

Abstract

To provide an inductor component which can increase an inductance value and a method for manufacturing the inductor component.SOLUTION: An inductor component 1 includes: a base layer 10 with a main surface 10s; a coil wire 11 on the main surface 10s of the base layer 10; an insulation layer 12 over the coil wire 11; and a magnetic layer 13 covering the insulation layer 12. The insulation layer 12 has a trapezoidal shape in which a width A1 of a first end surface opposite to the base layer 10 is narrower than a width C1 of a second end surface on a base layer 10 side, in a cross section of the insulation layer vertical to the main surface 10s of the base layer 10 and also has a shape in which the width A1 of the first end surface is narrower than the width B1 of a formation area of the coil wire in a direction parallel to the main surface 10s of the base layer 10.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an inductor component and a method for manufacturing the same.

Background Art

[0002] Conventionally, as an inductor component, there is one in which a coil wiring is formed by electrolytic plating on a seed layer in a through hole formed by removing a part of an insulating layer by SAP (Semi-Additive Process) (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] FIG. 9 is a cross-sectional view schematically showing the configuration of the above-described conventional inductor component 100. In the inductor component 100, a coil wiring 111 is partitioned by a rectangular resin wall 112a which is an insulating layer and formed on a base layer 110, and a rectangular insulating layer 112b is formed on the upper surfaces of the coil wiring 111 and the resin wall 112a. In the inductor component 100, a magnetic layer 113 is provided so as to cover the entire coil portion including the coil wiring 111 and the insulating layers 112a and 112b. However, the larger the volume of the magnetic layer 113, the more the inductance value of the inductor component 100 is improved. However, in the configuration shown in FIG. 9, since the width A3 of the insulating layer 112b cannot be made narrower than the width B3 of the formation area of the coil wiring 111, the volume of the insulating layer becomes large. Therefore, there is a disadvantage that it is difficult to increase the volume of the magnetic layer and improve the inductance value of the inductor component. Therefore, an object of the present disclosure is to provide an inductor component capable of improving the inductance value and a method for manufacturing the same.

Means for Solving the Problem

[0005] The inventors of the present invention have found that by making the shape of the insulating layer covering the coil wiring of the inductor component different from that of conventional products, the volume of the magnetic layer covering the coil portion can be increased, and the inductance value of the inductor component can be improved, thus completing the present invention.

[0006] The inductor component according to the first aspect of the present disclosure for solving the above problems includes a base layer having a main surface, a coil wiring formed on the main surface of the base layer, an insulating layer covering the coil wiring, and a magnetic layer covering the insulating layer. The shape of the insulating layer in a cross-section perpendicular to the main surface of the base layer is a trapezoidal shape in which the width of the first end surface on the side opposite to the base layer is narrower than the width of the second end surface on the base layer side, and the width of the first end surface is narrower than the width of the formation area of the coil wiring in a direction parallel to the main surface of the base layer. The trapezoidal shape is such that the two opposing side surfaces connecting the first end surface and the second end surface have a smaller inclination on the first end surface side than on the second end surface side. and convex inward on the second end face side 。

[0007] The manufacturing method of the inductor component according to the second aspect of the present disclosure for solving the above problems includes a first step of forming a coil wiring on the main surface of a base layer, a second step of disposing a positive-type photosensitive insulating material on the main surface of the base layer so as to cover the coil wiring to form an insulating layer, and removing, by photolithography, a range other than the portion of the insulating layer covering the coil wiring, so that the shape of the insulating layer in a cross-section perpendicular to the main surface of the base layer is a trapezoidal shape in which the width of the first end surface on the side opposite to the base layer is narrower than the width of the second end surface on the base layer side, and the width of the first end surface is narrower than the width of the formation area of the coil wiring in a direction parallel to the main surface of the base layer. The trapezoidal shape is such that the two opposing side surfaces connecting the first end surface and the second end surface have a smaller inclination on the first end surface side than on the second end surface side. and convex inward on the second end face side And a third step of making the shape.

Advantages of the Invention

[0009] According to the inductor component of the present invention, the inductance value can be improved. According to the manufacturing method of the inductor component of the present invention, an inductor component with an improved inductance value can be manufactured.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0011] Hereinafter, aspects of the inductor component and its manufacturing method of the present disclosure will be described in detail with reference to the illustrated embodiments.

[0012] [1. First Embodiment] (1-1. Configuration) FIG. 1 and FIG. 2 are cross-sectional views schematically showing the configuration of the inductor component 1 according to the first embodiment. FIG. 1 also shows the difference in configuration from the conventional product, and FIG. 2 illustrates the dimensions of the components. The inductor component 1 is an electronic component mounted on an electronic device such as a personal computer, a DVD player, a digital camera, a TV, a mobile phone, or car electronics, and is generally in the shape of a substantially rectangular parallelepiped (hexahedron). However, the shape of the inductor component 1 is not particularly limited and may be a cylindrical shape, a polygonal column shape, a frustum of a cone shape, or a frustum of a polygonal pyramid shape.

[0013] As shown in FIG. 1, the inductor component 1 includes a base layer 10, a coil wiring 11, an insulating layer 12, and a magnetic layer 13. The coil wiring 11 is connected to an external terminal (not shown). In the figure, the normal direction of the main surface 10s of the base layer 10 is defined as the Z direction, the forward Z direction is the upper side, and the reverse Z direction is the lower side. Also, in FIG. 1, the direction parallel to the main surface 10s of the base layer 10 is defined as the X direction. Note that the cross-section shown in FIG. 1 is a cross-section including the center of the inductor component 1 in the direction parallel to the main surface 10s of the base layer 10 and is a cross-section orthogonal to the extending direction of the coil wiring 11. Also, the forward Z direction, that is, the upper side, is the direction from the base layer 10 toward the coil wiring 11.

[0014] The coil wiring 11 is formed on the main surface 10s of the base layer 10 and extends upward from the base layer 10 and is wound around the base layer 10. The coil wiring 11 has a spiral shape with the number of turns exceeding one turn. Referring to FIG. 2, the thickness d1 of the coil wiring 11 is, for example, 5 to 100 μm, the thickness d2 of the insulating layer 12 is, for example, 10 to 140 μm, and the thickness d3 of the insulating layer 12 above the coil wiring 11 is, for example, 5 to 40 μm. Also, the width w1 of the coil wiring 11 is, for example, 5 to 100 μm, and the line-to-line space w2 of the coil wiring 11 is, for example, 5 to 30 μm. The coil wiring 11 is made of a conductive material and is made of a metal material with low electrical resistance such as Cu, Ag, or Au.

[0015] The insulating layer 12 is a layer that covers the coil wiring 11 along the coil wiring 11. The insulating layer 12 is made of an insulating material that does not contain a magnetic material, and is made of, for example, a resin material such as an epoxy resin, a phenolic resin, or a polyimide resin, or an inorganic material such as an oxide film or a nitride film of silicon or aluminum. Since the insulating layer 12 does not contain a magnetic material, it can prevent conduction between the wirings of the coil wiring 11. Note that the insulating layer 12 preferably has a configuration that does not contain a filler. In this case, the insulating layer 12 can be made thinner and the flatness can be improved. On the other hand, when the insulating layer 12 contains a filler of a non-magnetic material such as silica, the strength, processability, and electrical characteristics of the insulating layer 12 can be improved. Further, as will be described later, the insulating layer 12 is formed of a positive-type photosensitive insulating material.

[0016] The magnetic layer 13 is formed so as to cover the base layer 10 and the insulating layer 12 on which the coil wiring 11 is formed. Note that FIGS. 1 and 2 show diagrams in which the magnetic layer 13 is made transparent. The magnetic layer 13 is made of a magnetic material, and is made of, for example, a resin containing powder of a magnetic material. Examples of the resin constituting the magnetic layer 13 include epoxy resins, phenolic resins, polyimide resins, etc., and examples of the powder of the magnetic material include powders of metal magnetic materials such as FeSi-based alloys such as FeSiCr, FeCo-based alloys, Fe-based alloys such as NiFe, or their amorphous alloys, or powders such as ferrite. The content of the magnetic material is preferably 50 vol% or more and 85 vol% or less with respect to the entire magnetic layer 13. Note that the powder of the magnetic material preferably has a substantially spherical particle shape, and the average particle diameter is preferably 5 μm or less. Further, the magnetic layer 13 may be a sintered body of ferrite or the like. When the magnetic material is formed of a resin, it is preferable to use the same material as the insulating layer 12. In this case, the adhesion between the insulating layer 12 and the magnetic layer 13 can be improved.

[0017] The base layer 10 is a layered structure having a main surface 10s around which the coil wiring 11 is wound, and is formed so as to be encapsulated by the magnetic layer 13. The base layer 10 is made of the same material as the insulating layer 12. However, the base layer 10 may be made of the same material as the magnetic layer 13, or may be a sintered ferrite body when the magnetic layer 13 is a resin containing magnetic material powder. Also, the base layer 10 may be integrated with the insulating layer 12 or the magnetic layer 13, or may be separate from these layers.

[0018] In the inductor component 1, as shown in FIG. 1, in a cross section perpendicular to the main surface 10s of the base layer 10, the shape of the insulating layer 12 is a trapezoidal shape in which the width A1 of the upper first end face (the end face opposite to the base layer 10) is narrower than the width C1 of the lower second end face (the end face on the base layer 10 side), and the width A1 of the first end face is narrower than the width B1 of the formation area of the coil wiring 11 in the X direction parallel to the base layer.

[0019] By forming the insulating layer 12 of the inductor component 1 into the above shape, the volume of the insulating layer 12 is reduced as compared with the case where the insulating layers 112a and 112b are rectangular as in the conventional inductor component shown by the dotted line in FIG. 1. And by this reduction amount, the volume of the magnetic layer 13 covering the insulating layer 12 increases. Thereby, the inductance value of the inductor component 1 can be improved.

[0020] Note that in the inductor component 1, in the cross section of FIG. 1, it is preferable that the trapezoidal shape of the insulating layer 12 is such that two opposing side edges connecting the first end face and the second end face form a curve or a broken line protruding outward from the insulating layer 12. In this case, the magnetic layer 13 can be easily filled around the insulating layer 12.

[0021] In the inductor component 1, the coil wiring 11 has a spiral shape that exceeds one turn. In the cross-section of FIG. 1, it is preferable that the difference between the width A1 of the first end face and the width B1 of the formation area of the coil wiring 11 is larger than the line-to-line space w2 of the coil wiring 11. Thereby, the volume of the insulating layer 12 can be reduced sufficiently more than the manufacturing variation of the coil wiring 11, and the inductance value of the inductor component 1 can be improved more reliably. Note that it is more preferable that the width A1 of the first end face is narrower than the width B1 of the formation area of the coil wiring 11 by 10 μm or more, and the inductance value of the inductor component 1 can be improved more reliably.

[0022] In the inductor component 1, in the cross-section of FIG. 1, it is preferable that the difference between the width A1 of the first end face and the width C1 of the second end face is larger than the width w1 of the coil wiring 11. Thereby, the volume of the insulating layer 12 corresponding to about one turn of the coil wiring 11 can be reduced. Note that it is more preferable that the width A1 of the first end face is narrower than the width C1 of the second end face by 50 μm or more, and the inductance value of the inductor component 1 can be further improved.

[0023] (1-2. Manufacturing method) Next, the manufacturing method of the inductor component 1 will be described with reference to FIGS. 3 to 5.

[0024] First, as shown in Step 1-1 of FIG. 3, an insulating pedestal 21 is formed on a substrate (wafer) 20. The substrate 20 is a flat substrate made of, for example, a ceramic material such as glass or ferrite, or a printed wiring board material such as a resin containing glass cloth. The pedestal 21 is made of, for example, a polyimide-based resin that does not contain a magnetic material, and is formed on the upper surface of the substrate 20 by photolithography.

[0025] In the next step 1-2, a Cu seed layer 22 is formed on the main surface 21s of the pedestal 21 by sputtering, electroless plating, or the like. In the next step 1-3, a dry film resist (DRF) is attached to the seed layer 22 to form a resist 23, and the resist 23 is patterned by photolithography to form a through hole 24 in which the seed layer 22 is exposed in the region where the coil wiring is to be formed.

[0026] In the next step 1-4 (corresponding to the first step of the present disclosure), a metal film 25 is formed on the seed layer 22 in the through hole 24 by electrolytic plating. In the next step 1-5, the resist 23 is peeled off. In the subsequent step 1-6 of FIG. 4, the exposed portion of the seed layer 22 where the metal film 25 is not formed is removed by etching. Thereby, coil wiring made of the metal film 25 is formed on the main surface 21s (main surface of the base layer) of the pedestal 21.

[0027] In the next step 1-7 (corresponding to the second step of the present disclosure), an insulating layer 26 is formed by pressing and disposing a positive-type insulating dry film (positive-type photosensitive insulating material) on the upper surface side of the pedestal 21. Note that a liquid-type photosensitive insulating material may be used. In the next step 1-8 (corresponding to the third and fourth steps of the present disclosure), the insulating layer 26 is patterned by photolithography using a broadband light source, and the portion other than the portion covering the coil wiring of the insulating layer 26 is removed and cured by baking to form a trapezoidal insulating layer 27 having a gentle slope.

[0028] Here, since the lower side of the insulating layer 27 is restricted by the pedestal, shrinkage in the X direction is less likely to occur than the unrestricted upper side. Therefore, the insulating layer 27 has a trapezoidal shape with a gentle slope. In this way, the trapezoidal shape of the insulating layer 27 can adjust the slope of the insulating layer 12 to a desired aspect by changing the exposure conditions (exposure time, focus depth of the exposure machine, etc.) of photolithography, the heating conditions (heating time, heating temperature, etc.) of baking, and the formation conditions (formation range, material) of the pedestal.

[0029] The following steps 1-9 are the steps of forming the second layer 29 on the first layer 28. Using the upper surface of the first layer 28 as the base layer, the second layer 29 is formed by repeating the above-described steps 1-1 to 1-8.

[0030] In the subsequent step 1-10 of FIG. 5, a magnetic sheet made of a magnetic material is pressure-bonded to the upper surface side (the side where the coil wiring is formed) of the pedestal 21. Thereby, a magnetic layer 30 is formed so as to cover the insulating layers of the first layer 28 and the second layer 29. In the next step 1-11, a part of the substrate 20 and the pedestal 21 is removed by polishing. The remaining part of the pedestal 21 becomes the base layer of the present disclosure. In the next step 1-12, a magnetic sheet made of a magnetic material is pressure-bonded to the lower surface side of the pedestal 21. Thereby, a magnetic layer 31 is formed so as to cover the insulating layer 12 together with the magnetic layer 30 formed in step 1-11.

[0031] According to the method for manufacturing the inductor component 1, in steps 1-7 and 1-8, a positive-type insulating dry film is pressure-bonded, and patterning by photolithography and baking are performed. Thereby, as shown in FIG. 1, an inductor component 1 can be manufactured, which has a shape in which the width A1 of the upper end face of the insulating layer 12 is narrower than the width C1 of the lower end face, and A1 is narrower than the width B1 of the formation portion of the coil wiring 11. Therefore, it is possible to manufacture an inductor component 1 in which the volume occupied by the magnetic layer 13 is increased compared to the conventional product, and the inductance value is improved compared to the conventional product.

[0032] Note that, as exemplified in the above manufacturing method, the inductor component 1 may have a configuration in which a second layer is formed. More specifically, as shown in Step 1-12 of FIG. 5, the second coil wiring 41 formed on the main surface 12s of the insulating layer 12 and the second insulating layer 42 formed on the main surface 12s of the insulating layer 12 and covering the second coil wiring 41 are further provided. The shape of the second insulating layer 42 in a cross-section perpendicular to the main surface 10s of the base layer 10 may be a trapezoidal shape in which the width of the first end face on the side opposite to the base layer 10 is narrower than the width of the second end face on the base layer 10 side, and the width of the first end face of the second insulating layer 42 may be narrower than the width of the formation area of the second coil wiring 41 in the X direction parallel to the main surface 10s of the base layer 10. Thereby, even in a configuration in which a second layer is formed, the volume of the second insulating layer 42 is reduced, and the volume of the magnetic layer 30 covering the second insulating layer 42 is increased by this reduction amount. Therefore, the inductance value of the inductor component 1 can be improved. Note that the inductor component 1 may have a configuration in which a third layer or more is formed.

[0033] [2. Second Embodiment] (2-1. Configuration) FIG. 6 is a cross-sectional view schematically showing the configuration of the inductor component 2 of the second embodiment, and also shows the difference in configuration from the conventional product. The inductor component 2 of the second embodiment includes a base layer 50, a coil wiring 51, insulating layers 52a and 52b, and a magnetic layer 53. The coil wiring 51 is connected to an external electrode (not shown). In the figure, the normal direction of the base layer 50 is defined as the Z direction, the forward Z direction is the upper side, and the reverse Z direction is the lower side. Also, in FIG. 6, the direction parallel to the main surface 50s of the base layer 50 is defined as the X direction. Note that the cross-section shown in FIG. 6 is a cross-section including the center of the inductor component 2 in the direction parallel to the main surface 50s of the base layer 50 and is a cross-sectional plane perpendicular to the extending direction of the coil wiring 51. Also, the forward Z direction, that is, the upper side, is defined as the direction from the base layer 50 toward the coil wiring 51.

[0034] The use and shape of the inductor component 2 are the same as those of the inductor component 1 in the first embodiment. Also, the materials for generating the base layer 50, the coil wiring 51, the insulating layers 52a and 52b, and the magnetic layer 53 are the same as those of the inductor component 1 in the first embodiment. However, as will be described later, the insulating layers 52a and 52b are composed of a negative-type photosensitive insulating material.

[0035] The coil wiring 51 is formed on the main surface 50s of the base layer 50 so as to extend above the base layer 50 and is wound around the base layer 50. The coil wiring 11 has a spiral shape with the number of turns exceeding one turn. The insulating layers 52a and 52b are layers that cover the coil wiring 51. The insulating layer 52a is a wall portion that covers the side portion of the coil wiring 51, and the insulating layer 52b is a lid portion that covers the end portion of the coil wiring 51. The magnetic layer 53 is formed so as to cover the base layer 50 on which the coil wiring 51 is formed and the insulating layers 52a and 52b. Note that in FIG. 6, the magnetic layer 53 is shown as a transparent view.

[0036] In the inductor component 2, in a cross section perpendicular to the main surface 50s of the base layer 50, the width in the X direction parallel to the main surface 50s of the base layer 50 of the insulating layer 52a (wall portion) has a tapered shape that gradually decreases from C21 to C22 from the lower side to the upper side. Also, for the insulating layer 52b (lid portion), the width in the X direction has a tapered shape that gradually decreases from A21 to A22 from the lower side to the upper side.

[0037] By forming the insulating layers 52a and 52b of the inductor component 2 into the above tapered shape, the volume of the insulating layers 52a and 52b is reduced as compared with the case where the insulating layers 112a and 112b are rectangular as in the conventional inductor component shown by the dotted line in FIG. 6. And by this reduced amount, the volume of the magnetic layer 53 that covers the insulating layers 52a and 52b increases. Thereby, the inductance value of the inductor component 2 can be improved.

[0038] In the inductor component 2, as shown in FIG. 6, it is preferable that the wall portion 52a and the lid portion 52b are separate members that come into contact via an interface. Thereby, since the respective shapes can be adjusted independently, an insulating layer 52a, 52b with a higher degree of freedom in shape can be realized. However, like the inductor component 1, the wall portion and the lid portion may be integrated, whereby the insulating layer 12 can be formed more easily.

[0039] (2-2. Manufacturing method) Next, the manufacturing method of the inductor component 2 will be described with reference to FIGS. 7 to 8.

[0040] First, as shown in step 2-1 of FIG. 7, an insulating pedestal 61 is formed on a substrate (wafer) 60. The substrate 60 is, for example, a flat substrate made of a ceramic material such as glass or ferrite, or a printed wiring board material such as a resin containing glass cloth. The pedestal 61 is made of, for example, a polyimide-based resin that does not contain a magnetic material, and is formed on the upper surface of the substrate 60 by photolithography.

[0041] In the next step 2-2, a Cu seed layer 62 is formed on the main surface 61s of the pedestal 61 by sputtering, electroless plating, or the like. In the next step 2-3, patterning is performed by photolithography to remove the seed layer 62, leaving a region 63 for forming the coil wiring.

[0042] In the next step 2-4 (corresponding to the first and second steps of the present disclosure), a negative-type insulating dry film is pressure-bonded to the upper surface side of the pedestal 61 to form a first insulating layer. The first insulating layer is patterned by photolithography using a broadband light source and cured by baking to form a wall portion 65 (permanent resist wall) of a tapered through hole 64. Note that a liquid-type photosensitive insulating material may be used.

[0043] Here, the focus position of the projection exposure machine when performing photolithography is set to be shifted downward from the surface F of the first insulating layer by u1. As a result, the irradiation range below the first insulating layer is made narrower than the upper side, forming a tapered shape. Also, similar to the manufacturing method of the inductor component 1 of the first embodiment, by changing the exposure conditions of photolithography (exposure time, focus depth of the exposure machine, etc.), the heating conditions of baking (heating time, heating temperature, etc.), and the forming conditions of the pedestal (forming range, material), the inclination of the wall portion 65 can be adjusted to a desired mode.

[0044] In the subsequent step 2-5 of FIG. 8 (corresponding to the third step of the present disclosure), a metal film 66 is formed on the seed layer 63 by electrolytic plating. In the next step 2-6 (corresponding to the fourth step of the present disclosure), a negative-type insulating dry film, which is a permanent resist, is pressure-bonded to the upper surface side of the pedestal 61 to form a second insulating layer 67, which is a permanent resist layer. In the next step 2-7 (corresponding to the fifth step of the present disclosure), patterning by photolithography and curing by baking are performed to form an insulating layer 68 that becomes the lid portion. Note that a liquid-type photosensitive insulating material may be used.

[0045] Also in step 2-7, similar to step 2-4 described above, the focus position of the projection exposure machine when performing photolithography is set to be shifted downward from the surface F2 of the permanent resist layer 67 by u2. As a result, the irradiation range below the permanent resist layer 67 is made narrower than the upper side, forming a tapered shape. Also, similar to the manufacturing method of the inductor component 1 of the first embodiment, by changing the exposure conditions of photolithography (exposure time, focus depth of the exposure machine, etc.), the heating conditions of baking (heating time, heating temperature, etc.), and the forming conditions of the pedestal (forming range, material), the inclination of the insulating layer 68 that is the lid portion can be adjusted to a desired mode.

[0046] Next, the same processing as in steps 1-9 to 1-12 in the first embodiment is performed to complete the inductor component 2.

[0047] According to the manufacturing method of the above inductor component 2, in steps 2-4 and 2-7, photolithography is performed on the insulating layer made of a negative-type insulating material with the focus position of the projection exposure machine set to be shifted downward from the surface of the insulating layer. As a result, as shown in FIG. 6, the width in the X direction parallel to the main surface 50s of the base layer 50 of the insulating layer 52a (wall portion) has a tapered shape that gradually decreases from C21 to C22 from the lower surface to the upper surface. Also, for the insulating layer 52b (lid portion), the width in the X direction has a tapered shape that gradually decreases from A21 to A22 from the lower surface to the upper surface, and the inductor component 2 can be manufactured. Therefore, it is possible to manufacture the inductor component 2 with an increased volume occupied by the magnetic layer 53 compared to the conventional product and an improved inductance value compared to the conventional product.

[0048] Note that each of the above-described embodiments is merely an example of one aspect of the present invention, and can be arbitrarily modified and applied without departing from the gist of the present invention. For example, in the inductor component 2, in steps 2-4 and 2-7, photolithography may be performed on the insulating layer made of a positive-type insulating material with the focus position of the projection exposure machine set to be shifted upward from the surface of the insulating layer.

[0049] In the above-described embodiments, the horizontal and vertical directions, various numerical values, shapes, and materials include ranges (so-called equivalent ranges) that exhibit the same operational effects as those directions, numerical values, shapes, and materials, unless otherwise specified.

[0050] The number of turns of the coil wiring 11 in the above embodiment may be less than one turn, and the shape of the coil wiring 11 may be a known shape such as straight or meander (serpentine).

[0051] [3. Configuration Supported by the Above Embodiment] The above-described embodiments support the following configurations.

[0052] (Configuration 1) An inductor component comprising a base layer having a main surface, a coil wiring formed on the main surface of the base layer, an insulating layer covering the coil wiring, and a magnetic layer covering the insulating layer, wherein a shape of the insulating layer in a cross section perpendicular to the main surface of the base layer is a trapezoidal shape in which a width of a first end surface on a side opposite to the base layer is narrower than a width of a second end surface on the base layer side, and a width of the first end surface is narrower than a width of a formation area of the coil wiring in a direction parallel to the main surface of the base layer.

[0053] (Configuration 2) The inductor component according to Configuration 1, wherein the insulating layer is made of a positive-type photosensitive insulating material.

[0054] (Configuration 3) The inductor component according to Configuration 1 or Configuration 2, wherein in the trapezoidal shape, two opposing side surfaces connecting the first end surface and the second end surface form a curve or a broken line protruding toward the outside of the insulating layer.

[0055] (Configuration 4) The coil wiring extends in a normal direction of the main surface of the base layer, the insulating layer includes a wall portion covering a side portion of the coil wiring and a lid portion covering an upper end portion of the coil wiring, and a shape of the insulating layer in a cross section perpendicular to the main surface of the base layer is a tapered shape in which a width in a direction parallel to the main surface of the base layer becomes narrower as it moves away from the base layer in both the wall portion and the lid portion. The inductor component according to any one of Configurations 1 to 3.

[0056] (Configuration 5) The inductor component according to any one of Configurations 1 to 4, wherein the insulating layer is made of a negative-type photosensitive insulating material.

[0057] (Configuration 6) The inductor component according to Configuration 4, wherein the wall portion and the lid portion are integrated.

[0058] (Configuration 7) The inductor component according to Configuration 4, wherein the wall portion and the lid portion are separate members that contact each other through an interface.

[0059] (Configuration 8) A second coil wiring formed on the main surface of the insulating layer, and a second insulating layer formed on the main surface of the insulating layer and covering the second coil wiring, and the shape of the second insulating layer in a cross-section perpendicular to the main surface of the base layer is a trapezoidal shape in which the width of the first end surface on the side opposite to the base layer is narrower than the width of the second end surface on the base layer side, and the width of the first end surface is narrower than the width of the formation area of the second coil wiring in a direction parallel to the main surface of the base layer. The inductor component according to any one of Configurations 1 to 7.

[0060] (Configuration 9) The coil wiring is in a spiral shape exceeding one turn, and the difference between the width of the first end surface and the width of the formation area of the coil wiring is larger than the line space of the coil wiring. The inductor component according to any one of Configurations 1 to 8.

[0061] (Configuration 10) The width of the first end surface is 10 μm or more narrower than the width of the formation area of the coil wiring. The inductor component according to any one of Configurations 1 to 9.

[0062] (Configuration 11) The difference between the width of the first end surface and the width of the second end surface is larger than the width of the coil wiring. The inductor component according to any one of Configurations 1 to 10.

[0063] (Configuration 12) The width of the first end surface is 50 μm or more narrower than the width of the second end surface. The inductor component according to any one of Configurations 1 to 10.

[0064] (Configuration 13) A first step of forming a coil wiring on the main surface of the base layer, a second step of disposing a positive photosensitive insulating material on the main surface of the base layer so as to cover the coil wiring to form an insulating layer, and a range other than the portion of the insulating layer covering the coil wiring is removed by photolithography, so that the shape of the insulating layer in a cross section perpendicular to the main surface of the base layer has a trapezoidal shape in which the width of the first end surface on the side opposite to the base layer is narrower than the width of the second end surface on the base layer side, and the width of the first end surface is narrower than the width of the formation area of the coil wiring in the direction parallel to the main surface of the base layer. A manufacturing method of an inductor component including a third step.

[0065] (Configuration 14) The manufacturing method of the inductor component according to Configuration 13, further including a fourth step of curing the insulating layer after the third step.

[0066] (Configuration 15) A first step of forming a first insulating layer on the main surface of the base layer, and by photolithography in which the focus position of the projection exposure machine is set to be shifted from the surface of the first insulating layer, a through hole for forming a coil wiring extending in the normal direction of the main surface of the base layer is formed in a tapered shape in which the width of the wall portion of the through hole in a cross section perpendicular to the main surface of the base layer becomes narrower as it is away from the base layer. A second step, a third step of forming the coil wiring in the through hole, a fourth step of forming a second insulating layer covering the through hole, and by photolithography in which the focus position of the projection exposure machine is set to be shifted from the surface of the second insulating layer, removing the portion other than the portion covering the through hole of the second insulating layer, so that the lid portion covering the through hole has a tapered shape in which the width in the direction parallel to the main surface of the base layer of the lid portion in a cross section perpendicular to the main surface of the base layer becomes narrower as it is away from the base layer. A manufacturing method of an inductor component including a fifth step.

Explanation of Reference Numerals

[0067] 1 Inductor component 10 Base layer 11 Coil wiring 12 Insulating layer 13 Magnetic layer 20 Substrate 21 Pedestal 22 Seed layer 23 Resist 24 Through-hole 25 Metal film 26 Insulating layer before processing 27 Insulating layer 28 First layer 29 Second layer 30 Magnetic layer 2 Inductor component 50 Base layer 51 Coil wiring 52a, 52b Insulating layer 53 Magnetic layer 60 Substrate 61 Pedestal 62, 63 Seed layer 64 Through-hole 65 Wall portion of through-hole 66 Metal film 67 Insulating layer 68 Cover portion

Claims

1. A base layer having a main surface, A coil wiring formed on the main surface of the base layer, An insulating layer covering the coil wiring, A magnetic layer covering the insulating layer, and comprising, In a cross-section perpendicular to the main surface of the base layer, the shape of the insulating layer is a trapezoidal shape in which the width of the first end surface on the side opposite to the base layer is narrower than the width of the second end surface on the base layer side, and the width of the first end surface is narrower than the width of the formation area of the coil wiring in the direction parallel to the main surface of the base layer. The trapezoidal shape is such that the two opposing side surfaces connecting the first end surface and the second end surface have a smaller inclination on the first end surface side than on the second end surface side, and are convex inward on the second end surface side An inductor component.

2. In the trapezoidal shape, the two opposing side surfaces connecting the first end surface and the second end surface are such that the inclination of the portion covering the upper surface of the formation area of the coil wiring on the first end portion side is smaller than the inclination of the portion covering the side surface of the formation area of the coil wiring on the second end portion side The inductor component according to claim 1.

3. The insulating layer is composed of a positive-type photosensitive insulating material The inductor component according to claim 1.

4. The coil wiring extends in the normal direction of the main surface of the base layer, The insulating layer includes a wall portion covering the side portion of the coil wiring and a lid portion covering the upper end portion of the coil wiring, In a cross-section perpendicular to the main surface of the base layer, the shape of the insulating layer is a tapered shape in which the width in the direction parallel to the main surface of the base layer is narrower as it moves away from the base layer in both the wall portion and the lid portion The inductor component according to claim 1.

5. The insulating layer is composed of a negative-type photosensitive insulating material The inductor component according to claim 4.

6. The wall portion and the lid portion are integrated The inductor component according to claim 4.

7. The wall portion and the lid portion are separate members that contact via an interface The inductor component according to claim 4.

8. A second coil wiring formed on the main surface of the insulating layer, A second insulating layer formed on the main surface of the insulating layer and covering the second coil wiring, and further comprising In a cross-section perpendicular to the main surface of the base layer, the shape of the second insulating layer is a trapezoidal shape in which the width of the first end face on the side opposite to the base layer is narrower than the width of the second end face on the base layer side, and the width of the first end face is narrower than the width of the formation area of the second coil wiring in the direction parallel to the main surface of the base layer. The inductor component according to claim 1.

9. The coil wiring has a spiral shape exceeding one turn. The difference between the width of the first end face and the width of the formation area of the coil wiring is larger than the line space of the coil wiring. The inductor component according to claim 1.

10. The width of the first end face is 10 μm or more narrower than the width of the formation area of the coil wiring. The inductor component according to claim 1.

11. The difference between the width of the first end face and the width of the second end face is larger than the width of the coil wiring. The inductor component according to claim 1.

12. The width of the first end face is 50 μm or more narrower than the width of the second end face. The inductor component according to claim 1.

13. A first step of forming coil wiring on the main surface of the base layer; A second step of disposing a positive-type photosensitive insulating material on the main surface of the base layer so as to cover the coil wiring to form an insulating layer; By removing, by photolithography, a range other than the portion of the insulating layer covering the coil wiring, the shape of the insulating layer in a cross-section perpendicular to the main surface of the base layer is such that the width of the first end face on the side opposite to the base layer is a trapezoidal shape narrower than the width of the second end face on the base layer side, and the width of the first end face is narrower than the width of the formation area of the coil wiring in the direction parallel to the main surface of the base layer, and the trapezoidal shape is such that two opposing side surfaces connecting the first end face and the second end face have a smaller inclination on the first end face side than on the second end face side, and are convex inward on the second end face side. A third step of forming the shape; A method for manufacturing an inductor component including the above steps.

14. After the third step, it further includes a fourth step of curing the insulating layer. The method for manufacturing an inductor component according to claim 13.

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