A ring-shaped metal plating is formed on a thin wire base material made of non-conductive fiber yarns to form conductive connection materials arranged horizontally and in parallel

Abstract

An object of the present invention is to provide a conductive connection material formed by arranging horizontally and in parallel so as to be compatible with the flatness and thinness of the plane of a conductive circuit board, and applying ring-shaped metal plating to each of the fine wire base materials one by one. 【Solution means】Using the same type or a plurality of types of fine wire base materials of chemical fiber, plant fiber, paper fiber, and ceramic, which are non-conductive fibers, the fine wire base materials are arranged horizontally and in parallel with a space therebetween so that they do not become conductive to each other, and a plurality of ring-shaped metal platings 2 are applied to each of the fine wire base materials 1.

Description

Technical Field

[0001] The present invention relates to a conductive connection material in which a ring-shaped metal plating is formed for each one of a base material in which thin base material yarns made of non-conductive fibers of various materials and shapes are arranged horizontally and in parallel at equal or unequal intervals.

Background Art

[0002] Conventionally, in a glass cloth for a printed wiring board formed by sewing warp and weft, a glass yarn formed by bundling glass fibers having a single fiber diameter equal to or thinner than the single fiber diameter of the warp and 4.5 μm or less is used as the weft. There is a glass cloth for a printed wiring board (see, for example, Patent Document 1). Further, in an anisotropic conductive film in which conductive particles are dispersed in a thermosetting epoxy resin composition containing an epoxy resin, a cationic curing agent as a curing agent for the epoxy resin, and a resin for film formation, the epoxy resin is a β-alkyl glycidyl type epoxy resin. There is an anisotropic conductive film containing a glycidyl ether type epoxy resin at a mass ratio of 8:2 to 4:6 (see, for example, Patent Document 2). However, at present, base materials such as woven fabrics and non-woven fabrics made of fibers so far have drawbacks even when a conductive circuit is formed by plating. For example, in recent years, electronic devices have become smaller and more precise, and a conductive circuit board is required to be thin, inexpensive, have few irregularities on the board, and have a large contact area by line contact rather than point contact at the intersections woven like a woven fabric. However, such a conductive circuit board does not currently exist. In addition, conventional anisotropic conductive films have a structure in which conductive particles are dispersed in a thermosetting resin of an adhesive. There are many types of conductive particles contained in this anisotropic conductive film, and a typical one is a structure in which the core made of resin is covered with nickel or gold that easily conducts electricity, and further, its surface is coated with an insulator. When heat and pressure are applied, the opposing terminals sandwich the conductive particles, and a circuit through which current flows is formed by breaking the insulating coat on the outermost surface. The particles that are not sandwiched between the terminals move between the terminals inside the base resin of the film, and since the insulating coat is maintained, short circuits can be prevented. Electric current can pass in the vertical direction between the electrodes and not in the horizontal direction between the electrodes. That is, it is called an anisotropic conductive film because it has different electrical characteristics depending on the direction. An anisotropic conductive film is temporarily pasted on the terminals of an electronic component, and using a heat bonder, while heating to a temperature at which the anisotropic conductive film does not thermoset but exhibits adhesiveness and pressing, the conductive particles of the anisotropic conductive film are dispersed, the conductive particles sandwiched between the terminals are crushed, and an electrically conductive connection structure is obtained between the terminals of the first electronic component and the terminals of the second electronic component. However, it is an extremely special material and requires pressing after delicate temperature control (see, for example, Patent Document 2). There is a need to solve this problem. In response to this requirement, by forming a ring-shaped metal plating around a plurality of fibers arranged horizontally and in parallel without weaving, a conductive circuit board that is thin and has few irregularities can be obtained. In this way, a conductive connection material that can be provided more lightly, more thinly, more softly, more flatly, and more inexpensively is formed, so that the above-mentioned drawbacks can be addressed. Therefore, the present invention invented a conductive connection material formed by forming a ring-shaped metal plating on a thin wire base material made of fiber yarns arranged horizontally and in parallel, which was impossible with conventional woven fabrics and non-woven fabrics.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

[0004] In a conventional glass cloth woven from fiber yarns, strength can be obtained by using stronger fiber yarns. However, in reality, in order to obtain various shapes and functions, and for use in precision equipment where miniaturization is aimed for, the thickness of the substrate needs to be reduced. If the substrate is woven or made of non-woven fabric, the thickness will be at least twice as thick compared to the substrate with the minimum thickness. Also, the conductive circuit board needs to have fewer irregularities. Since electronic components are extremely small, if the substrate is woven or made of non-woven fabric, there will be irregularities, and when placing electronic components, there will be gaps, and the phenomenon of dropping (sagging) into these gaps is sometimes seen. Moreover, special materials are required, and it is impossible without the technical ability to perform pressing after delicate temperature control. In order to solve these drawbacks, the first invention of the present invention aims to provide a conductive connection material formed by horizontally and parallelly arranging fine wire substrates made of non-conductive fiber yarns, with ring-shaped metal plating formed on each individual fine wire substrate, which can cope with the flatness and thinness of the plane of the conductive circuit board. [Means for Solving the Problems]

[0005] The first invention of the present invention that can achieve the above object is a conductive connection material formed by forming ring-shaped metal plating on a fine wire substrate made of non-conductive fiber yarns as described in claim 1, and arranging them horizontally and in parallel, and is as follows. Using the same type or a plurality of types of fine wire substrates of chemical fiber, plant fiber, paper fiber, and ceramic, which are non-conductive fibers, the above-mentioned fine wire substrates are arranged horizontally and in parallel with a gap between them so that they do not become conductive to each other, and a plurality of ring-shaped metal platings are applied to each individual fine wire substrate., The ring-shaped metal plating applied to various thin wire substrates is formed such that for the upper half of the surface, a plurality of them are arranged in a ring shape at appropriate intervals, and for the lower half of the surface, the entire surface is plated. The ring-shaped portion and the entire surface of the lower half are connected, and the metal plating is formed as a lead wire. It is a configuration.

[0006] The first invention of the present invention that can achieve the above object 2 is a conductive connection material formed by forming a ring-shaped metal plating on a thin wire base material made of a non-conductive fiber yarn as described in claim 2 and arranged horizontally and in parallel, and is as follows. In the conductive connection material according to claim 1, wiring boards are arranged and laminated from above and below, and the upper and lower layers are conductively connected. It is a configuration.

Effects of the Invention

[0007] The conductive connection material formed by forming a ring-shaped metal plating on a thin wire base material made of a non-conductive fiber yarn according to the present invention and arranged horizontally and in parallel has the configuration as described above, and thus exhibits the following effects. (1) Since the base material is composed of fiber yarns arranged horizontally and in parallel, it is possible to mount micro components. (2) Since the base material is not woven, it is possible to use rigid fiber yarns and extremely thin fiber yarns. (3) When produced with the same size and the same members as compared with base materials of woven fabrics and non-woven fabrics, the thickness of the base material can be made at least 1 / 2. (4) Since there are fewer irregularities than in woven fabrics and non-woven fabrics, even micro components do not fall onto the irregularities and can be mounted horizontally. (5) Wiring boards made of base materials of woven fabrics and non-woven fabrics have irregularities and were difficult to use for high-frequency boards. However, since the conductive connection material of the present application has fewer irregularities, it is also suitable for use in high-frequency boards. (6) When laminating the conductive connection materials, for example, the strength of the conductive connection materials can be increased by arranging the first layer in the horizontal direction and the second layer in the vertical direction so as to intersect. (7) When forming a conductive circuit board in which an electronic component is conductively connected to the upper surface of a conductive connection material formed with a ring-shaped metal plating on each of the thin wire base materials made of non-conductive fiber yarns arranged horizontally and in parallel, and a wiring board is conductively connected to the lower surface, by winding and dropping an adhesive through the gaps of the ring-shaped metal platings provided in a large number in this space where the ring-shaped metal platings are arranged in parallel and in parallel and pressing them, it is possible to securely adhere and fix them, and the work can be extremely easily performed. (8) Since the ring-shaped metal plating formed on the upper surface of the thin wire substrate and the semi-full surface metal plating formed on the entire lower surface are plated so as to be partially connected, the lower surface of the thin wire substrate corresponds to the wiring substrate, and thus there is an effect that a wiring board is not particularly required.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0009] Using the same type or multiple types of non-conductive fibers such as chemical fibers, plant fibers, paper fibers, and ceramic fine wire substrates, the above-mentioned fine wire substrates are arranged horizontally and in parallel at intervals so as not to be in a conductive state, and a plurality of ring-shaped metal platings are applied to each of the above-mentioned fine wire substrates. , The ring-shaped metal plating applied to various thin wire substrates is formed such that for the upper half of the surface, a plurality of them are arranged in a ring shape at appropriate intervals, and for the lower half of the surface, the entire surface is plated. The ring-shaped portion and the entire surface of the lower half are connected, and the metal plating is formed as a lead wire. It is a conductive connecting material.

Example

[0010] Hereinafter, based on the drawings, a conductive connecting material in which a ring-shaped metal plating is formed on a fine wire substrate made of non-conductive fiber yarns arranged horizontally and in parallel according to an embodiment of the present invention will be described. The present invention of the actual The example will be described with reference to FIG. 1. First, the fine wire substrate will be described in detail. As the material of the fine wire substrate which is a non-conductive connecting material, chemical fibers, plant fibers, paper fibers, ceramics, etc. are adopted. In addition, the wire diameter of each fiber is adopted according to the application from 5 μm to 100 μm. In addition, when using a ceramic sheet, it functions extremely well when using a thickness of 50 μm to 1 mm. Also, since the amount of contacts changes depending on the amount of electricity, an insulating material may be interposed. Also, when using a hard ceramic, a stable conductive connecting material excellent in the insulating property, heat resistance, and heat dissipation property which are the characteristics of the ceramic can be obtained.

[0011] Here, based on FIG. 1, the first embodiment of the fine wire substrate made of the various chemical fibers described above will be described in detail. What is shown in FIG. 1(a) is formed by using a round bar-shaped fine wire substrate 1 made of chemical fiber and forming a plurality of narrow-width metal platings 2 in a ring shape at equal intervals or randomly in the longitudinal direction. What is shown in FIG. 1(b) is formed by using a round bar-shaped fine wire substrate 1 made of chemical fiber and forming a plurality of wide-width metal platings formed in a ring shape in the longitudinal direction 2´ at equal intervals or randomly. As shown in Fig. 1(c), a plurality of narrow-width metal platings 2 formed in a ring shape in the longitudinal direction are formed at equal intervals or randomly on a flat and thin wire base material 1 made of chemical fiber. As shown in Fig. 1(d), a wide-width metal plating 2´ formed in a ring shape in the longitudinal direction is formed at equal intervals or randomly on a flat and thin wire base material 1 made of chemical fiber.

[0012] Furthermore, specific thin wire base material of the actual Examples will be described in detail. As shown in Fig. 2(a), instead of the round bar-shaped thin wire base material 1 made of chemical fiber shown in Fig. 1(a) and (b) described above, a plurality of narrow-width metal platings 2 formed in a ring shape (resulting in a semi-ring shape) in the longitudinal direction are formed on the upper surface, and on the lower surface, a metal plating 6 is formed as a lead-out wire over the entire surface in the longitudinal direction (resulting in a substantially semi-circular shape over the entire longitudinal direction). Note that the ring-shaped (semi-ring-shaped) metal plating 2 formed on the upper surface of the thin wire base material 1 and the semi-full-surface metal plating 6 formed on the entire lower surface are plated so as to be partially connected. This is because the lower surface of the thin wire base material 1 corresponds to a wiring board, so a wiring board is not particularly required. As a modified example having a similar function, as shown in Fig. 2(b), when a ring-shaped (resulting in a semi-ring shape) narrow-width metal plating 2 is formed on the upper half of a flat thin wire base material 1 and a semi-full-surface metal plating 6 is formed as a lead-out wire on the lower half (the lower half when cut in half in the longitudinal direction), it will have the same function as that described in Fig. 2(a).

[0013] Next, based on Figs. 3 and 4, the configuration of a conductive circuit board formed by attaching an electronic component using the thin wire base material 1 having the ring-shaped metal plating 2 of the present invention will be described. First, wiring adapted to a conductive circuit board is provided on the substrate 4, and a conductive connection material made of a thin wire base material 1 in which the thin-width metal plating 2 described above is formed in a ring shape is provided thereon. Further, an electronic component is provided on the upper part of the conductive connection material via an adhesive or the like to form a conductive circuit board.

[0014] When the material of the thin wire base material 1 described above is a chemical fiber, by utilizing the elasticity of the round bar-shaped fiber, when the ring-shaped metal plating 2 makes a conductive connection with the wiring and the electronic component, the point contact with the round fiber is deformed into an ellipse under pressure as shown in FIG. 6, so that the point contact becomes a line contact and the contact area becomes larger. The shape of the thin wire base material 1 described above adopts a round shape, a square shape, a rectangular shape, a triangular shape, etc. Also, when the thin wire base materials 1 are arranged horizontally and in parallel, the interval between a large number of ring-shaped metal platings 2 is selected and determined according to the shape of the contact point of the electronic component. Also, an adhesive is poured into the interval (gap), and the adhesive is wound around the thin wire base material 1 for connection and fixing. Since the adhesive is also wound around the portions other than the connection portion, strong bonding can be obtained.

[0015] Next, based on FIG. 5, as an example, a description will be given of a case where the ring-shaped metal plating 2 is applied in a random manner. Corresponding to the contact point of the electronic component, it can also be performed by matching the interval of the ring-shaped metal plating 2 so that the ring-shaped metal plating 2 functions as a contact point.

[0016] In addition, by using the conductive connection material of the present invention, wiring boards are arranged and laminated from above and below, and conductive connections are made above and below, respectively, so that a multilayer conductive wiring board can be obtained. Furthermore, when the wiring board and the electronic component are adhesively fixed to the conductive connection materials formed horizontally and in parallel, by utilizing the gap between the ring-shaped metal platings 2 of the plurality of ring-shaped metal platings 2 provided with an interval on the thin wire base material 1, the adhesive is wound and dropped for pressure contact, so that the electronic component, the conductive connection material, and the wiring board can be adhesively bonded to each other, which is extremely effective.

Industrial Applicability

[0017] It can also be used for the winding of motors, the wiring boards at the bent parts of robots, etc., the fine wiring boards of smartphones, etc., the wiring boards for high-current electric vehicles, the wiring boards for drones, and further for the conductive connection of aluminum substrates. Moreover, it can be applied to the conductive connection of perovskite batteries, the conductive connection with solid-state batteries, the conductive connection of LED wiring, the conductive connection of wireless chargers, the conductive connection of comb-shaped electrodes, etc.

Explanation of Symbols

[0018] 1 ···· Fine wire base material 2 ···· Narrow-width metal plating 2´ ···· Wide-width metal plating 3 ···· Wiring board 4 ···· Substrate 5 ···· Contact of electronic component 6 ···· Semi-full-surface metal plating

Claims

1. Using the same type or multiple types of chemical fibers, plant fibers, paper fibers, and ceramic fine wire substrates that are non-conductive fibers, the above fine wire substrates are arranged horizontally and in parallel with a gap between them so that they do not become conductive. A plurality of ring-shaped metal platings are applied to each individual fine wire substrate. The ring-shaped metal platings applied to various fine wire substrates are formed such that in the upper half of the surface, a plurality of them are arranged in a ring shape at appropriate intervals, and in the lower half of the surface, the entire surface is covered. The ring-shaped portion and the entire lower half of the surface are connected as a drawn wire to form a conductive connection material.

2. A multilayer conductive wiring board, characterized in that wiring boards are arranged and laminated from above and below on the conductive connection material according to Claim 1, and the upper and lower layers are conductively connected.

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