Lighting module and lighting device including the same

Abstract

The lighting module disclosed in the embodiments of the invention includes a circuit board, a plurality of light-emitting elements arranged in a first direction on the circuit board, a resin layer sealing the plurality of light-emitting elements, and a reflective member arranged on the surface of the resin layer and having an opening on one side, wherein the resin layer includes an emission surface portion on which the opening is arranged, a curved surface portion opposite the emission surface portion, and an upper surface portion arranged above the curved surface portion and the emission surface portion, the light-emitting elements overlap vertically with the curved surface portion, the upper surface portion of the resin portion has a horizontal plane, the vertical width of the opening is smaller than the vertical height of the emission surface portion, and the light-emitting elements are arranged so as to be adjacent to the lower end of the curved surface portion rather than the lower end of the emission surface portion.

Description

Technical Field

[0001] Embodiments of the invention relate to a lighting module that illuminates side light. Embodiments of the invention relate to a lighting device, a light unit, or a vehicle lamp having the lighting module.

Background Art

[0002] Light-emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. Such light-emitting elements are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights. Recently, as a vehicle light source, a lamp adopting a light-emitting element has been proposed. Compared with an incandescent lamp, the light-emitting element is advantageous in that it has low power consumption. In addition, since the light-emitting diode is small in size, the degree of freedom in the design of the lamp can be increased, and it also has economic efficiency due to its semi-permanent life.

Summary of the Invention

Problems to be Solved by the Invention

[0003] Embodiments of the invention can provide a lighting module that can improve the luminous intensity and light collection efficiency of light emitted to one side. Embodiments of the invention provide a lighting module that provides one or more side lights on one side. Embodiments of the invention can provide a lighting module that illuminates side light, and a lighting device, a light unit, a liquid crystal display device, or a vehicle lamp having the same.

Means for Solving the Problems

[0004] The lighting module according to an embodiment of the invention includes a circuit board, a plurality of light-emitting elements arranged in a first direction on the circuit board, a resin layer that seals the plurality of light-emitting elements, and a reflecting member disposed on the surface of the resin layer and having an opening on one side. The resin layer includes an emission surface portion where the opening is disposed, a curved surface portion on the opposite side of the emission surface portion, and an upper surface portion disposed above the curved surface portion and the emission surface portion. The light-emitting element overlaps the curved surface portion in a vertical direction, and the light-emitting element overlaps a part of the reflecting member disposed on the emission surface portion in a horizontal direction. The upper surface portion of the resin portion has a horizontal plane, and the vertical width of the opening is smaller than the vertical height of the emission surface portion. The light-emitting element is disposed adjacent to the lower end of the curved surface portion rather than the lower end of the emission surface portion.

[0005] According to an embodiment of the invention, the reflecting member may include a first reflecting portion disposed on the curved surface portion of the resin portion, a second reflecting portion disposed on the first upper surface portion, and a third reflecting portion disposed on the emission surface portion and having the opening. The third reflecting portion is disposed below the emission surface portion, and the height of the upper end of the third reflecting portion is disposed higher than the height of the upper end of the light-emitting element. The curved surface portion or the first reflecting portion may have a parabolic shape. A reflecting layer may be included between the resin layer and the circuit board, and a diffusion layer disposed on the emission surface portion may be included.

[0006] According to an embodiment of the invention, a reflector disposed between the light-emitting element and the emission surface portion is included, and the height of the upper end of the reflector is higher than the upper surface of the light-emitting element and may be 50% or less of the maximum thickness of the resin layer. The distance between the emission surface portion and the light-emitting element may be greater than the distance between the reflector and the light-emitting element.

[0007] The lighting module according to an embodiment of the invention includes a circuit board, a plurality of light emitting elements arranged in a first direction on the circuit board, a resin layer for sealing the plurality of light emitting elements, and a reflecting member disposed on the surface of the resin layer and having an opening on one side. The light emitting elements include a first light emitting element arranged in a first row and a second light emitting element arranged in a second row. The resin layer includes a first resin portion for sealing the first light emitting element and providing a first light emitting surface portion, and a second resin portion for sealing the second light emitting element and providing a second light emitting surface portion. The reflecting member may include a first reflecting member having a first opening in the first light emitting surface portion and disposed on the first resin portion, and a second reflecting member disposed between the first and second resin portions and providing a second opening in the second light emitting surface portion.

[0008] According to an embodiment of the invention, the first resin portion includes a first curved surface portion on the opposite side of the second light emitting surface portion and a first upper surface portion disposed above the first curved surface portion and the first light emitting surface portion. The second resin portion includes a second curved surface portion on the opposite side of the second light emitting surface portion and a second upper surface portion disposed above the second curved surface portion and the second light emitting surface portion. A part of the reflecting member is disposed on at least a part of the first light emitting surface portion and the second light emitting surface portion.

[0009] According to an embodiment of the invention, the first light emitting element overlaps the first curved surface portion in a vertical direction. The first and second upper surface portions have a horizontal plane. The first light emitting element is disposed adjacent to the lower end of the first curved surface portion rather than the lower end of the first light emitting surface portion. The second light emitting surface portion is disposed above the first light emitting surface portion. A diffusion layer may be included in at least one of the first and second light emitting surface portions.

Effects of the Invention

[0010] According to an embodiment of the invention, the luminous intensity and the light condensing efficiency can be improved in the lighting module. According to an embodiment of the invention, a lighting module suitable for the central luminous intensity of a daytime running lamp can be provided, and the light extraction efficiency of the lighting module can be improved.

[0011] The optical reliability of the lighting module according to the embodiment of the invention and the lighting device having the same can be improved. Further, the invention can be applied to a vehicle lighting device, a light unit, various display devices, a surface light source lighting device, or a vehicle lamp having the lighting module.

Brief Description of Drawings

[0012]

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Best Mode for Carrying Out the Invention

[0013] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to the partial embodiments described, but can be embodied in various different forms, and within the scope of the technical idea of the present invention, one or more of the components can be selectively combined or replaced between the embodiments and used. Also, the terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined otherwise, are to be construed as having a meaning generally understood by those of ordinary skill in the technical field to which the present invention pertains, and terms that are generally used like those defined in a dictionary can be interpreted considering their meaning in the context of the relevant technology. Also, the terms used in the embodiments of the present invention are for the purpose of explaining the embodiments and are not intended to limit the present invention. In this specification, the singular form can include the plural form as well, unless otherwise specifically limited in the description, and when described as "at least one (or one or more) of A and B, C", it can include one or more of all the combinations that can be combined with A, B, and C. Also, in the description of the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are for distinguishing the components from other components, and the essence or order of the components is not limited by such terms. And when a component is described as being "connected", "coupled", or "joined" to another component, it includes both the case where the component is directly connected or joined to the other component and the case where one or more other components are further "connected", "coupled", or "joined" between the components. Also, when described as being formed or arranged "above or below" each component, "above or below" includes not only the case where two components are in direct contact, but also the case where one or more other components are formed or arranged between the two components. Also, when expressed as "above or below", it can include the meaning not only in the upward direction but also in the downward direction with respect to one component as a reference. The lighting device according to the present invention is applicable to various lamp devices that require lighting, such as mobile bodies, vehicle lamps, household lighting devices, or industrial lighting devices.For example, the vehicle lamp can be applied to, for example, a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a brake lamp, a daytime running lamp, vehicle interior lighting, a door scuff, a rear combination lamp, a backup lamp, etc. The lighting device of the present invention is also applicable to indoor and outdoor advertising devices, display devices, and various electric vehicle fields, and can also be said to be applicable to all lighting-related fields and advertising-related fields that have been currently developed and commercialized or can be realized by future technological developments.

[0014] <First Embodiment> FIG. 1 is a perspective view showing a lighting module according to a first embodiment of the invention, FIG. 2 is an example of a front view of the lighting module of FIG. 1, FIG. 3 is an example of a side cross-sectional view of the lighting module of FIGS. 1 and 2, and FIGS. 4 to 6 are modified examples of the lighting module of FIG. 3.

[0015] Referring to FIGS. 1 to 3, the lighting module 100 according to an embodiment of the invention includes a circuit board 11, a light-emitting element 21 disposed on the circuit board 11, a resin layer 31 that seals the light-emitting element 21 on the circuit board 11, a reflecting member 60 disposed on the upper surface and a plurality of side surfaces of the resin layer 31, and an opening 65 in which at least a part of one side surface of the reflecting member 60 is open. The opening 65 may be a region where a part of the resin layer 31 is exposed or another light-transmissive member is exposed.

[0016] The light-emitting element 21 is arranged on the circuit board 11 in at least one row. The light-emitting elements 21 can emit light of the same color as each other, or at least two of them can emit light of different colors from each other. The color of the light emitted from the light-emitting element 21 can be at least one or two or more of blue, green, red, and yellow. The lighting module 100 can emit the light emitted from the light-emitting element 21 as surface light. The lighting module 100 can illuminate the surface light in a side-view type from the light emitted from the light-emitting element 21. Since the lighting module 100 is provided with side-type surface light, the generation of hot spots can be blocked, and the light collection efficiency and luminous intensity can be improved. The thickness of the lighting module 100 can be 10 mm or more from the bottom of the circuit board 11, or can have a range of 10 mm to 20 mm or a range of 10 mm to 15 mm. The thickness of the lighting module 100 may be the straight-line distance between the bottom surface of the circuit board 11 and the uppermost surface of the reflecting member 60. The lighting module 100 is provided with a thickness of less than 20 mm, and with such a thin thickness, the surface light can emit light in a line form, and the directivity characteristics become wider.

[0017] With the lighting module 100, the circuit board 11 can function as a base member or a support member located below the light-emitting element 21, the resin layer 31, and the reflecting member 60. The circuit board 11 includes a printed circuit board (PCB). The circuit board 11 can include at least one of, for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. The circuit board 11 can include, for example, a flexible PCB or a rigid PCB. The circuit board 11 has a length that is long in one direction, and the width in the direction orthogonal to the length direction may be smaller than the length.

[0018] The circuit board 11 includes a wiring layer (not shown) on the upper part, and the wiring layer is electrically connected to the light-emitting element 21. The reflective material or protective layer disposed on the upper part of the circuit board 11 can protect the wiring layer. The light-emitting elements 21 may be connected in series, parallel, or series-parallel by the wiring layer of the circuit board 11. The plurality of light-emitting elements 21 may be such that groups having two or more are connected in series or parallel, or the groups may be connected in series or parallel to each other. The protective layer can include a member having a solder resist material, and the solder resist material can reflect incident light as a white material. The thickness of the circuit board 11 can be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the circuit board 11 is provided to be thin, the thickness of the lighting module 100 is not increased. Since the circuit board 11 is provided with a thickness of 0.5 mm or less, a flexible module can be supported. A resin layer 31 may be formed on the circuit board 11, or a resin layer 31 may be formed on the circuit board 11 on which a reflective material layer or member is formed. As shown in FIG. 4, the lighting module 100 can include a reflective layer 15 disposed on the upper surface of the circuit board 11. The reflective layer 15 can reflect the light traveling on the upper surface of the circuit board 11. The reflective layer 15 may be attached to the upper surface of the circuit board 11 or disposed between the circuit board 11 and the resin layer 31. A bonding layer, for example, a material such as a UV adhesive, silicone, or epoxy, is formed between the reflective layer 15 and the circuit board 11. The reflective layer 15 may be provided as a film composed of any one of a resin material, transparent PET, white PET (white polyethylene terephthalate), and an Ag sheet. Reflective dots are disposed on the reflective layer 15 and can reflect the incident light. The reflective dots can include ink and can be printed with a material containing any one of, for example, TiO2, CaCO3, BaSO4, Al2O3, Silicon, and PS. Here, the reflective layer 15 has an open region, and the light-emitting element 21 is disposed through the open region.The reflective layer 15 may be formed over the entire upper surface of the circuit board 11 or may be disposed under the region of the resin layer 31 of the circuit board 11. As another example, the circuit board 11 may include a transparent material. When the circuit board 11 made of the transparent material is provided, the light emitted from the light-emitting element 21 is emitted in the upward and downward directions of the upper surface of the circuit board 11.

[0019] The light-emitting element 21 is arranged on the circuit board 11 in at least one row. As another example, the light-emitting element 21 may be arranged in a plurality of rows or / and columns. The light-emitting element 21 can overlap with the resin layer 31 and the reflecting member 60 in the vertical direction. The light-emitting element 21 is arranged in the resin layer 31 or sealed in the resin layer 31. The light-emitting element 21 is embodied by a light-emitting chip that emits light, that is, an LED, or may include a light-emitting chip and a wavelength conversion layer covering the same. A plurality of pads are exposed at the lower part of the light-emitting element 21, and light can be emitted through the upper surface and the side surface. The wavelength conversion layer will wavelength-convert some of the light emitted from the light-emitting chip. The light-emitting chip may be provided as a blue LED chip. The light-emitting chip may be provided in a flip-chip form, or may be provided as a vertical chip or a horizontal chip. The wavelength conversion layer may include at least one or two or more of red, yellow, and green phosphors. The thickness of the wavelength conversion layer is arranged in a range of 200 μm or less, for example, 100 to 200 μm. The thickness of the light-emitting chip may be 0.3 mm or less. As another example, at least one or two or more of the light-emitting elements 21 can emit light of the same or different wavelengths.

[0020] At least one layer or two or more layers of resin material are disposed on the upper portion of the circuit board 11. The resin layer 31 is disposed on the light-emitting element 21 and may be a transparent resin material, such as a UV (Ultra violet) resin (Resin), silicone, or epoxy resin material. The resin layer 31 may be a layer containing a diffusing agent or a layer not containing it. The resin layer 31 is disposed with a length that is long in one direction, and the width of the lower surface may be smaller than the length, for example, it can have 50% or less of the length. The circuit board 11 and the resin layer 31 may be provided in a linear form, or a part or the whole of the length direction may be in a curved form. As shown in FIG. 3, the width D3 of the upper surface of the resin layer 31 may be smaller than the width D1 of the lower surface. The width D1 of the lower surface of the resin layer 31 is the maximum distance from one side surface of the resin layer 31 to the opposite side surface, and the width D3 of the upper surface may be the distance from the upper end of one side surface to the upper end of the opposite side extended horizontally. One end on the lower surface and one end on the upper surface of the resin layer 31 are disposed on the same straight line, and the other end on the lower surface is disposed farther from the other end on the upper surface with respect to one side surface of the resin layer 31. The width D3 of the upper surface of the resin layer 31 may be formed in the range of 90% or less of the width D1 of the lower surface, for example, in the range of 40% to 90% or 50% to 80%. Since the width D3 of the upper surface of the resin layer 31 is provided to be narrower than the width D1 of the lower surface, light can be guided in the direction of the opening 65. The resin layer 31 may include a curved surface portion R1 and an upper surface portion R2. The curved surface portion R1 has a predetermined curvature and is extended from the other end of the lower surface of the resin layer 31 to the other end of the upper surface portion R2. The lower end of the curved surface portion R1 can be adjacent to the light-emitting element 21. That is, the light-emitting element 21 is disposed at a position adjacent to the other end rather than one end of the lower surface of the resin layer 31. The curved surface portion R1 may be formed in a parabolic shape. The light-emitting element 21 is disposed at a position overlapping the curved surface portion R1 in the vertical direction. The center region between the upper end and the lower end of the curved surface portion R1 can overlap the opening 65 in the horizontal direction. The distance G1 between the center of the light-emitting element 21 and the lower end or the other end of the lower surface of the curved surface portion R1 can have a range of 9% or more of the width D1 of the lower surface of the resin layer 31, for example, between 9% and 15% or between 9% and 13%.The center of the light-emitting element 21 can have a distance G1 between the center and the other end of the lower surface of the resin layer 31 that is 1 / 5 or less, for example, in the range of 1 / 5 to 1 / 8, compared to the separation distance G2 at one end of the lower surface of the resin layer 31. The distance G1 can be 2.5 mm or less, for example, in the range of 1.8 mm to 2.5 mm or in the range of 1.8 to 2.3 mm. When the distance G1 is narrower than the range, the light extraction efficiency decreases. When the distance G1 is larger than the range, the light extraction efficiency decreases or the width of the module increases. Here, the width of the lower surface of the resin layer 31 is defined as the first distance D1, the distance or the minimum distance between a straight line perpendicular to the lower end of the curved surface portion R1 of the resin layer 31 and the upper end of the curved surface portion R1 is defined as the second distance D2, and the width of the upper surface portion R2 of the resin layer 31 can be defined as the third distance D3. The distance G1 from the center of the light-emitting element 21 to the lower end of the curved surface portion R1 can be 0.5 or less of the second distance D2, for example, in the range of 0.2 to 0.4 or in the range of 0.2 to 0.35. The second distance D2 may be smaller than the third distance D3. The second distance D2 can be 1.2 or more of the third distance D3, for example, in the range of 1.2 to 2 or in the range of 1.2 to 1.5. Since the second distance D2 is arranged smaller than the third distance D3 in the above range, the reflection efficiency can be improved by the area and curvature of the curved surface portion R1. The first distance D1 can be 15 mm or more, for example, in the range of 15 mm to 25 mm or in the range of 15 mm to 20 mm.

[0021] The upper surface portion R2 of the resin layer 31 may be provided as a flat surface. In the resin layer 31, the area of the upper surface portion R2 may be smaller than the lower surface area. The resin layer 31 may include an emission surface portion 35. The emission surface portion 35 may be the surface facing the opening 65 or the surface on which the opening 65 is formed. The emission surface portion 35 extends vertically from one end of the lower surface of the resin layer 31 to one end of the upper surface portion R2. The surface of the emission surface portion 35 facing the opening 65 may be a flat surface. As another example, in the emission surface portion 35, the surface facing the opening 65 may be a flat surface, and the other surfaces may be curved surfaces, inclined surfaces, or stepped portions. The maximum thickness B1 of the resin layer 31 can be 8 mm or more, for example, in the range of 8 mm to 15 mm or in the range of 8 mm to 13 mm. Thereby, a reflecting member 60 can be formed outside the emission surface portion 35 of the resin layer 31 or a housing can be formed, and light can be condensed through the opening 65 or provided with a high luminous intensity.

[0022] The reflection member 60 is formed outside the curved surface portion R1, the upper surface portion R2, both side surfaces in the length direction of the resin layer 31, and the outside of the light-emitting surface portion 35 disposed in the region outside the opening 65. A part of the lower end of the reflection member 60 can contact the upper surface of the circuit board 11 or contact the reflection layer 15 in the structures of FIGS. 4 and 5. The reflection member 60 is formed of a reflection member made of a metal or non-metal material on the surface of the resin layer 31. The metal material is formed of a material such as aluminum or silver. The non-metal material is provided by at least one of a resin material, a transparent PET, and a white polyethylene terephthalate material. The reflection member 60 can contain any one of TiO2, CaCO3, BaSO4, Al2O3, Silicon, and PS inside the resin. The thickness of the reflection member 60 is formed to be a thickness such that the light reflectance is 85% or more, for example, 90% or more. The reflection member 60 can include a first reflection portion 61 disposed on the curved surface portion R1 of the resin layer 31, a second reflection portion 62 disposed on the upper surface portion R2 of the resin layer 31, and a third reflection portion 63 disposed on the light-emitting surface portion 35 of the resin layer 31. The first reflection portion 61 is formed on the entire surface of the curved surface portion R1. The second reflection portion 62 is extended from the first reflection portion 61 and formed on the entire surface of the upper surface portion R2. The third reflection portion 63 is formed on the entire surface of the light-emitting surface portion 35 excluding the opening 65. The third reflection portion 63 can include a first portion 63A extended to the upper part of the light-emitting surface portion 35 by the second reflection portion 62, and a second portion 63B disposed at the lower part of the light-emitting surface portion 35. The opening 65 is disposed between the first portion 63A and the second portion 63B. The first portion 63A and the second portion 63B are formed on the light-emitting surface portion 35 of the resin layer 31. In the vertical direction, the height B4 of the first portion 63A of the third reflection portion 63 and the height B3 of the second portion 63B may be the same, or the other one may be larger with a difference of 10% or less. The sum of the heights (B4 + B3) of the first portion 63A and the second portion 63B is the same as the width B2 of the opening 65, or is disposed in the range of 40% to 60% of the width B2 of the opening 65.That is, in the vertical direction, the width B2 of the opening 65 can be 60% or less of the thickness of the light-emitting surface portion 35 (for example, B1), for example, in the range of 40% to 60% or in the range of 45% to 55%. The lower end position of the opening 65 is arranged in the range of 80% or less of the height of the light-emitting surface portion 35, for example, in the range of 70% to 80% or 72% to 78%. Thereby, the side surface of the light-emitting element 21 faces the second portion 63B and does not face the opening 65. The lower end position of the opening 65 is arranged at a position higher than the upper surface of the light-emitting element 21. The height of the lower end of the opening 65 is the height of the second portion 63B with reference to the upper surface of the circuit board 11, and can be 5 times or more the thickness of the light-emitting element 21, for example, in the range of 5 times to 10 times or 5 times to 7 times. Thereby, the amount of light directly emitted from the light-emitting element 21 through the opening 65 can be reduced. The height of the second portion 63B can be 2 mm or more, for example, in the range of 2 mm to 3 mm.

[0023] As shown in FIGS. 1 and 2, the third reflecting portion 63 can include third portions 63C arranged on both side surfaces in the length direction at the light-emitting surface portion 35 of the resin layer 31. The third portions 63C are connected to the first portion 63A and the second portion 63B, and the width thereof varies according to the length of the opening 65. As shown in FIGS. 5 and 6, a reflector 15B is formed in the resin layer 31. The reflector 15B is arranged between the light-emitting element 21 and the third reflecting portion 63 of the reflecting member 60. The reflector 15B is arranged on the circuit board 11 or on the reflecting layer 15. The reflector 15B has a length that is long in one direction, and the lower surface is formed with a width wider than the upper end. The reflector 15B may be formed with a polygonal cross-sectional shape, for example, a triangular shape, or may be formed with a hemispherical shape. The distance G1 (see FIG. 3) between the center of the light-emitting element 21 and the other end of the lower surface of the resin layer 31 may be the same as the distance to the reflector 15B. This enables the position of the light-emitting element 21 to be arranged at the center between the lower end of the first reflecting portion 61 of the reflecting member 60 and the reflector 15B so that the distribution of the reflection efficiency of the light emitted from both side surfaces of the light-emitting element 21 is similar.

[0024] The upper end of the reflector 15B can overlap in the vertical direction with the first reflecting portion 61 of the reflecting member 60 or the curved surface portion R1 of the resin layer 31. The upper end of the reflector 15B may not overlap in the vertical direction with the second reflecting portion 62 of the reflecting member 60 or the upper surface portion R2 of the resin layer 31. The upper end of the reflector 15B can correspond to a position adjacent to the boundary portion between the first reflecting portion 61 and the second reflecting portion 62 of the reflecting member 60. The distance between the reflector 15B and the light-emitting element 21 may be smaller than the distance between the light-emitting surface portion 35 and the reflector 15B. Thereby, the light emitted toward one side surface of the light-emitting element 21 can be effectively reflected, and the light extraction efficiency and loss can be reduced. The height B5 of the upper end of the reflector 15B is arranged higher than the upper surface of the light-emitting element 21. The upper end position of the reflector 15B is arranged higher than the lower end position of the opening 65. The height B5 of the upper end of the reflector 15B may be 50% or less of the maximum height B1 of the light-emitting surface portion 35 and may be equal to or higher than the height B3 of the upper end of the second portion 63B. The upper end of the reflector 15B is located on a virtual straight line K1 passing through the upper ends of the light-emitting element 21 and the light-emitting surface portion 35 of the resin layer 31. For example, the upper end of the reflector 15B is arranged at a height of 100% to 120% based on the straight line K1. That is, considering the light directivity angle distribution of the light-emitting element 21, the light reflection region can be set. Thereby, the amount of light directly emitted from the light-emitting element 21 through the opening 65 can be minimized. As a first example, when viewed in the structure of FIG. 2, the reflector 15B is arranged to cover a plurality of light-emitting elements 21 with a length. Such a length of the reflector 15B may be shorter than the length of the resin layer 31 and may be larger than the interval between the outermost light-emitting elements 21.

[0025] As a second example, a plurality of the reflectors 15B are arranged in regions corresponding to the respective light-emitting elements 21. Each of the reflectors 15B is larger than the length of each of the light-emitting elements 21 and is arranged, for example, in the range of 120% to 250% of the length of each of the light-emitting elements 21. Thereby, each of the reflectors 15B can effectively reflect the light emitted from the opposing light-emitting elements 21. That is, the reflector 15B is provided with a structure in which at least a part of the region between the respective light-emitting elements 21 is open.

[0026] The reflector 15B is formed of a metal or non-metal material. The metal material is formed of a material such as aluminum or silver. The non-metal material is provided by at least one of a resin material, transparent PET, and white PET (white polyethylene terephthalate) material. The reflector 15B can contain any one of TiO2, CaCO3, BaSO4, Al2O3, Silicon, and PS inside the resin. Since the thickness of the reflector 15B becomes thinner towards the upper end, the lower part of the center of the reflector 15B has a light reflectance of 85% or more, for example, 90% or more, and the upper part of the center may have a light reflectance of 85% or less or a light transmittance of 15% or more. Such a reflector 15B can suppress hot spots on the side surface of the light-emitting element 21.

[0027] As shown in FIG. 6, a diffusion layer 81 is disposed on the light-emitting surface portion 35 of the resin layer 31. The diffusion layer 81 is disposed over the entire light-emitting surface portion 35 of the resin layer 31. The diffusion layer 81 extends from the upper end to the lower end of the light-emitting surface portion 35 of the resin layer 31. The diffusion layer 81 can be in contact with the light-emitting surface portion 35 of the resin layer 31. The diffusion layer 81 can be in contact with the third reflecting portion 63 of the reflecting member 60. The diffusion layer 81 is disposed between the light-emitting surface portion 35 of the resin layer 31 and the third reflecting portion 63 of the reflecting member 60. The diffusion layer 81 is disposed in the opening 65 formed in the third reflecting portion 63 of the reflecting member 60. Thereby, the light traveling to the opening 65 is diffused by the diffusion layer 81 and then emitted. As another example, the diffusion layer 81 is disposed on the outer surface of the third reflecting portion 63 of the reflecting member 60 and can cover the outside of the opening 65. The diffusion layer 81 can be in contact with the inside of the first portion 63A, the second portion 63B, and the third portion 63C of the third reflecting portion 63. The outer surface of the diffusion layer 81 is open or exposed at the opening 65 of the third reflecting portion 63. As another example, the diffusion layer 81 is formed to correspond to the shape of the opening 65 of the third reflecting portion 63 and is disposed in the opening 65 so as to be surrounded by the first portion 63A, the second portion 63B, and the third portion 63C of the third reflecting portion 63.

[0028] The diffusion layer 81 is formed of a resin material such as silicone or epoxy, thereby preventing a decrease in the adhesive force with the resin layer 31. The diffusion layer 81 can contain a diffusing agent in a transparent resin material. The diffusion layer 81 can diffuse incident light. The diffusing agent can include at least one of PMMA (Poly Methyl Meth Acrylate) - based, TiO2, SiO2, Al2O3, and silicone - based. The diffusion layer 81 can include at least one or two or more of a diffusing agent such as beads, a phosphor, and ink particles. The inner surface of the diffusion layer 81 can contact the resin layer 31, and the outer surface can be exposed to the outside. The diffusion layer 81 can include a single layer or multiple layers. The thickness of the diffusion layer 81, as the distance between the inner surface and the outer surface, is 25 μm or more, and can have a range of, for example, 25 - 250 μm or 100 - 250 μm. Such a diffusion layer 81 can provide the light incident within the range of the thickness as uniform surface light. As another example, a micro - sized lens pattern is formed on the inner surface or / and the outer surface of the diffusion layer 81. Thereby, the diffusion layer 81 can improve the uniformity of the emitted light. The vertical length of the diffusion layer 81 can be the same as the vertical length of the emission surface portion 35 or larger than the vertical width of the opening 65. The horizontal length of the diffusion layer 81 can be the same as the horizontal length of the emission surface portion 35 or larger than the horizontal length of the opening 65. Here, as another example of the invention, a phosphor layer (not shown) is disposed between the reflecting member 60 and the resin layer 31. The phosphor layer can convert the wavelength of the incident light. The phosphor layer can include at least one of blue, green, yellow, or red phosphors. The phosphor layer is disposed on the curved surface portion R1 of the resin layer 31 or on the curved surface portion R1 and the upper surface portion.

[0029] <Second Embodiment> Figs. 7 to 12 are drawings showing an illumination module or an illumination device according to the second embodiment. In the description of Figs. 7 to 12, the same configurations as those in the first embodiment shall be referred to the description of the first embodiment and can be selectively applied to the second embodiment.

[0030] Referring to FIGS. 7 and 8, the lighting module 100B can include a circuit board 11, a resin layer having a first resin portion 31A and a second resin portion 31B on the circuit board 11, a reflecting member having a first reflecting member 60A and a second reflecting member 60B, and a light emitting portion having first and second light emitting elements 21A, 21B on the circuit board 11. The reflective layer 15 is disposed on the circuit board 11 and is disposed below the first and second resin portions 31A, 31B. The first resin portion 31A can include a first curved surface portion R1A, a first upper surface portion R2A, and a first emission surface portion 35A. The second resin portion 31B can include a second curved surface portion R3, a second upper surface portion R4, and a second emission surface portion 35B. The first reflecting member 60A can include a first reflecting portion 61A disposed on the first curved surface portion R1A of the first resin portion 31A and a second reflecting portion 62A disposed on the first upper surface portion R2A. The second reflecting member 60B can include a fourth reflecting portion 61B disposed on the second curved surface portion R3 of the second resin portion 31B and a fifth reflecting portion 62B disposed on the second upper surface portion R4 of the second resin portion 31B. The first light emitting element 21A is disposed in the first row on the circuit board 11 and is sealed in the first resin portion 31A. The second light emitting element 21B is disposed in the second row in front of the first row on the circuit board 11 and is sealed in the second resin portion 31B. A plurality of the first light emitting elements 21A are arranged along the length direction of the circuit board 11 and are disposed between the first reflecting portion 61A of the first reflecting member 60A and the fourth reflecting portion 61B of the second reflecting member 60B. The center of the first light emitting element 21A can be spaced at the same distance from the first reflecting portion 61A and the fourth reflecting portion 61B. A plurality of the second light emitting elements 21B are arranged along the length direction of the circuit board 11 and are disposed between the fourth reflecting portion 61B of the second reflecting member 60B and the second emission surface portion 35B of the second resin portion 31B. The distance between the second light emitting element 21B and the fourth reflecting portion 61B of the second reflecting member 60B may be smaller than the distance between the second light emitting element 21B and the second emission surface portion 35B.

[0031] Here, the first and second reflecting members 60A and 60B can include a third reflecting portion 63 (63A, 63B, 63C) (see FIG. 8) disposed at at least a part of the upper, lower, or both outer sides of the first and second emitting surface portions 35A and 35B. The second reflecting member 60B is disposed between the first resin portion 31A and the second resin portion 31B. The first and second reflecting members 60A and 60B are connected by the third reflecting portion 63, and the first and second reflecting members 60A and 60B or the third reflecting portion 63 can include a first opening 65A in which the first emitting surface portion 35A of the first resin portion 31A is opened and a second opening 65B in which the second emitting surface portion 35B of the second resin portion 31B is opened. The first opening 65A is disposed above the second resin portion 31B. The first opening 65A is disposed outside between the second reflecting portion 62A of the first reflecting member 60A and the fifth reflecting portion 62B of the second reflecting member 60B. The first opening 65A is disposed above the second opening 65B, and the second opening 65B is disposed lower than the first opening 65A. The first emitting surface portion 35A or the first opening 65A is disposed outside between the second reflecting portion 62A of the first reflecting member 60A and the fifth reflecting portion 62B of the second reflecting member 60B. The second emitting surface portion 35B or the second opening 65B is disposed outside between the second reflecting portion 62B of the second reflecting member 60B and the circuit board 11 or the reflective layer 15.

[0032] The first emission surface portion 35A of the first resin portion 31A and the second emission surface portion 35B of the second resin portion 31B are arranged in the same vertical plane. As another example, the first emission surface portion 35A may be provided as a vertical or inclined surface, and the second emission surface portion 35B may be provided as a vertical or inclined surface. Here, the inclined surfaces of the first and second emission surface portions 35A and 35B may be planes in a form in which the upper end of the first emission surface portion 35A or the second emission surface portion 35B protrudes outward from the lower end, or the lower end protrudes outward from the upper end. The third reflection portion 63 may include a first portion 63A on the first emission surface portion 35A, a second portion 63B on the second emission surface portion 35B, and third portions 63C on both outer sides (see FIG. 8), and the first opening 65A and the second opening 65B can be exposed. The height of the upper end of the second portion 63B of the third reflection portion 63 is arranged higher than the upper surface height of the first and second light emitting elements 21A and 21B. Thereby, the amount of light directly emitted through the second emission surface portion 35B through the side surface of the second light emitting element 21B can be reduced.

[0033] The first curved surface portion R1A of the first resin portion 31A is arranged outside the first light emitting element 21A. The lower region of the first curved surface portion R1A may face the second curved surface portion R3, and the upper region may face the first emission surface portion 35A. The lower region of the first curved surface portion R1A of the first resin portion 31A may be formed with the same curvature as the curvature of the second curved surface portion R3 of the second resin portion 31B. Since the lower region of the first curved surface portion R1A and the second curved surface portion R3 are provided with surfaces having the same curvature, the reflection characteristics of the light emitted from the first and second light emitting elements 21A and 21B can be made uniform.

[0034] The first resin part 31A extends from the rear to the upper part of the second resin part 31B and can emit the light emitted from the first light-emitting element 21A through the first light-emitting surface part 35A. The second resin part 31B is arranged in front of the first resin part 31A and can emit the light emitted from the second light-emitting element 21B through the second light-emitting surface part 35B. The second light-emitting element 21B can overlap with a part of the second curved surface part R3 of the second resin part 31B in the vertical direction. Or, the second light-emitting element 21B can overlap with a part of the second curved surface part R3 of the second resin part 31B and / or the second upper surface part R4 in the vertical direction. Such first and second light-emitting elements 21A and 21B may be driven separately from each other or may be driven identically. The vertical width B7 of the first light-emitting surface part 35A can be the same as the vertical width B6 of the second light-emitting surface part 35B or can have a range of 50% to 100% of the vertical width B6 of the second light-emitting surface part 35B. The vertical width B7 of the first opening 65A can be the same as the vertical width B6 of the second opening 65B or can have a range of 50% to 100% of the width of the second opening 65B. Thereby, the emission area where light is emitted can be adjusted by the sizes of the first and second openings 65A and 65B. Here, the height B1 from the upper surface of the circuit board 11 to the first upper surface part R2A of the first resin part 31A can be 8 mm or more, for example, in the range of 8 mm to 15 mm or in the range of 8 mm to 13 mm. Thereby, each of the widths B6 and B7 is provided in the range of 3 mm or more, for example, in the range of 3 mm to 7 mm.

[0035] As a first modification of the invention, a first phosphor layer (not shown) is arranged between the first reflecting member 60A and the first resin part 31A. The first phosphor layer can convert the wavelength of the incident light. The first phosphor layer can contain at least one of blue, green, yellow, or red phosphors. The first phosphor layer is arranged on the first curved surface part R1A of the first resin part 31A or on the first curved surface part R1A and the first upper surface part R2A.

[0036] As a second modification of the invention, a second phosphor layer (not shown) is disposed between the second reflecting member 60B and the second resin portion 31B. The second phosphor layer can convert the wavelength of the incident light. The second phosphor layer can include at least one of blue, green, yellow, or red phosphors. The second phosphor layer is disposed on the second curved surface portion R3 of the second resin portion 31B or on the second curved surface portion R3 and the second upper surface portion R4.

[0037] A third modification of the invention can include all of the first phosphor layer and the second phosphor layer disclosed above. For example, a first phosphor layer is disposed on the first curved surface portion R1A or / and the first upper surface portion R2A of the first resin portion 31A, and a second phosphor layer is disposed on the second curved surface portion R3 or / and the second upper surface portion R4 of the second resin portion 31B. Also, the phosphors added to the first and second phosphor layers may be the same or different.

[0038] The first light emitting element 21A and the second light emitting element 21B can emit light having the same color wavelength as each other or light having different color wavelengths from each other. The numbers of the first and second light emitting elements 21A and 21B may be the same or different. For example, the number of the first light emitting elements 21A may be larger than the number of the second light emitting elements 21B. The number of such elements of the light emitting portion can be provided as a number required according to the luminous intensity characteristics of the lamp.

[0039] As shown in FIG. 10, in the illumination module, the third reflecting portion 63 of the reflecting member can include a fourth portion 63D disposed below the first light emitting surface portion 35A of the first resin portion 31A and above the second light emitting surface portion 35B of the second resin portion 31B. The fourth portion 63D of the third reflecting portion 63 can contact one end of the fifth reflecting portion 62B of the second reflecting member 60B. The fourth portion 63D of the third reflecting portion 63 is disposed so as to horizontally overlap the first and second light emitting surface portions 35A and 35B. Thereby, the sizes of the first and second openings 65A and 65B can be adjusted by the third reflecting portion 63. As shown in FIG. 11, the fourth portion 63D of the third reflecting portion 63 is disposed below the first light emitting surface portion 35A or above the second light emitting surface portion 35B.

[0040] As shown in FIG. 11, at least one or both of the first and second light emitting surfaces 35A and 35B are provided with diffusion layers 81A and 81B. The diffusion layers 81A and 81B can include, for example, a first diffusion layer 81A disposed on the first light emitting surface 35A and a second diffusion layer 81B disposed on the second light emitting surface 35B. The first diffusion layer 81A and the second diffusion layer 81B are separated by a fourth portion 63D of the third reflecting portion 63. The fourth portion 63D of the third reflecting portion 63 is disposed between the first diffusion layer 81A and the second diffusion layer 81B and can block light interference. The first diffusion layer 81A is in contact with the surface of the first light emitting surface 35A and can diffuse the light emitted from the first light emitting element 21A. The second diffusion layer 81B is in contact with the surface of the second light emitting surface 35B and can diffuse the light emitted from the second light emitting element 21B.

[0041] Here, the first diffusion layer 81A is formed on the entire surface of the first light emitting surface 35A of the first resin portion 31A or is disposed inside the third reflecting portion 63 excluding the first opening 65A. The second diffusion layer 81B is formed on the entire surface of the second light emitting surface 35B of the second resin portion 31B or is disposed inside the third reflecting portion 63 excluding the second opening 65B.

[0042] As shown in FIG. 12, the lighting module can be provided with a housing 60C having a predetermined shape with respect to the reflecting member. The housing 60C covers the curved surface portion R1 and the upper surface portion R2 of the resin layer 31 on the circuit board 11, has a third reflecting portion 63, and can function as a reflecting member. The first portion 63A and the second portion 63B of the third reflecting portion 63 extend to the light emitting surface 35 excluding the opening 65. The housing 60C is formed of a plastic material or a metal material having a reflecting property.

[0043] FIG. 13 is a plan view of a vehicle to which a lamp having an illumination module according to an embodiment is applied, FIG. 14 is a drawing showing an example of a front lamp in the vehicle of FIG. 13, and FIG. 15 is a drawing showing a tail lamp of the vehicle of FIG. 13. Referring to FIGS. 13 to 15, in the vehicle 900, the front lamp 850 can include one or more illumination modules 855, and by individually controlling the driving timing of these illumination modules 855, not only the function as a normal headlamp but also additional functions such as a welcome light or a celebration effect can be provided when the driver opens the vehicle door. The lamp can be applied to a daytime running light, a high beam, a low beam, a fog lamp, or a turn indicator lamp.

[0044] And the tail lamp 800 of the vehicle 900 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be an illumination module for serving as a turn indicator lamp, the second lamp unit 814 may be an illumination module for serving as a side marker lamp, and the third lamp unit 816 may be an illumination module for serving as a brake lamp, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, 816 can include the illumination module disclosed in the embodiment. The housing 810 houses the first to third lamp units 812, 814, 816 and can be made of a light-transmitting material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first to third lamp units 812, 814, 816 can implement a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp can be applied to the turn signal lamp of the vehicle when the lamp unit is applied to the tail lamp, brake lamp, or turn signal lamp of the vehicle.

[0045] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Also, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified for other embodiments by those with ordinary knowledge in the field to which the embodiment belongs. Therefore, the content related to such combinations and modifications should be construed as being included in the scope of the present invention. Further, although the above has been described mainly with reference to the embodiments, this is merely illustrative and does not limit the present invention. Those with ordinary knowledge in the field to which the present invention belongs can make various modifications and applications not exemplified above without departing from the essential characteristics of this embodiment. For example, each component specifically presented in the embodiment can be implemented with modifications. And the differences related to such modifications and applications should be construed as being included in the scope of the present invention defined by the appended claims.

Claims

1. A circuit board, a plurality of light-emitting elements arranged in a first direction on the circuit board, a resin layer for sealing the plurality of light-emitting elements, a reflecting member disposed on the surface of the resin layer and having an opening on one side, comprising: the resin layer includes an emission surface portion where the opening is disposed, and an opposite curved surface portion on the opposite side of the emission surface portion, the resin layer includes the opposite curved surface portion and an upper surface portion disposed above the emission surface portion, the light-emitting element overlaps with the opposite curved surface portion in a vertical direction, the light-emitting element overlaps with a part of the reflecting member disposed on the emission surface portion in a horizontal direction, the upper surface portion of the resin layer has a horizontal plane, the vertical width of the opening is smaller than the vertical height of the emission surface portion, the light-emitting element is disposed adjacent to the lower end of the opposite curved surface portion rather than the lower end of the emission surface portion, the reflecting member includes a first portion extended above the emission surface portion and a second portion disposed below the emission surface portion, the opening is disposed between the first portion and the second portion, the side surface of the light-emitting element faces the second portion, a lighting module, wherein a lower end position of the opening is disposed at a position higher than an upper surface of the light-emitting element.

2. the reflecting member includes a first reflecting portion disposed on the opposite curved surface portion of the resin layer, a second reflecting portion disposed on the upper surface portion, and a third reflecting portion disposed on the emission surface portion and having the opening, the lighting module according to claim 1, wherein the third reflecting portion has the first portion and the second portion.

3. the lighting module according to claim 2, wherein a height of an upper end of the second portion of the third reflecting portion is disposed higher than a height of an upper end of the light-emitting element.

4. the lighting module according to claim 2, wherein the opposite curved surface portion or the first reflecting portion has a parabolic shape.

5. the lighting module according to any one of claims 1 to 4, including a reflective layer between the resin layer and the circuit board.

6. including a diffusion layer disposed on the emission surface portion, the lighting module according to any one of claims 1 to 4, wherein the diffusion layer contacts the inside of the first portion and the second portion.

7. including a reflective layer between the resin layer and the circuit board and a reflector disposed between the plurality of light-emitting elements and the emission surface portion, the lighting module according to any one of claims 1 to 5, wherein a height of an upper end of the reflector is higher than an upper surface of the light-emitting element and is 50% or less of a maximum thickness of the resin layer.

8. The distance between the light-emitting surface portion and the light-emitting element is greater than the distance between the reflector and the light-emitting element. The height of the reflector is equal to or greater than the height of the upper end of the second portion. The lighting module according to claim 7, wherein the length of the reflector is shorter than the length of the resin layer and greater than the interval between the outermost light-emitting elements.

9. A circuit board, A plurality of light-emitting elements arranged in a first direction on the circuit board, A resin layer that seals the plurality of light-emitting elements, A reflecting member disposed on the surface of the resin layer and having an opening on one side, Including, The plurality of light-emitting elements include a first light-emitting element in which a plurality are arranged in a first row and a second light-emitting element in which a plurality are arranged in a second row. The resin layer includes a first resin portion that seals the first light-emitting element and provides a first light-emitting surface portion, and a second resin portion that seals the second light-emitting element and provides a second light-emitting surface portion. The reflecting member has a first opening in the first light-emitting surface portion, includes a first reflecting member disposed on the first resin portion, and a second reflecting member disposed between the first and second resin portions and providing a second opening in the second light-emitting surface portion. The lighting module.

10. The first resin portion includes a first curved surface portion on the opposite side of the second light-emitting surface portion and a first upper surface portion disposed above the opposite side first curved surface portion and the first light-emitting surface portion. The second resin portion includes a second curved surface portion on the opposite side of the second light-emitting surface portion and a second upper surface portion disposed above the opposite side second curved surface portion and the second light-emitting surface portion. The lighting module according to claim 9, wherein a part of the reflecting member is disposed on at least a part of the first light-emitting surface portion and the second light-emitting surface portion.

11. The first light-emitting element overlaps in a vertical direction with the opposite side first curved surface portion. The first and second upper surface portions have a horizontal plane. The lighting module according to claim 10, wherein the first light-emitting element is disposed adjacent to the lower end of the opposite side first curved surface portion rather than the lower end of the first light-emitting surface portion.

12. The lighting module according to any one of claims 9 to 11, wherein the first light-emitting surface portion is disposed above the second light-emitting surface portion.

13. The lighting module according to claim 12, including a diffusion layer disposed on at least one of the first and second light-emitting surface portions.

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