Inductor coil

Abstract

The present invention relates to an inductor coil comprising a first component (12), a second component (14), a length of conductor (18), and a heat sink (100), wherein the first component is positioned adjacent to the second component, the first component and the second component form a core (16), a first part of the length of conductor is wound around at least the core to form multiple turns of the conductor, the heat sink comprises a thermally conductive material, the heat sink comprises a first part (90, 110) and a second part, the first part of the heat sink has first material and / or structural properties, and the second part of the heat sink has second material and / or structural properties different from the first material and / or structural properties, and the inner surface of the first part of the heat sink contacts the outer surface of some of the multiple turns of the conductor.

Description

Technical Field

[0001] The present invention relates to an inductor coil and a method for cooling the inductor coil.

[0002] Background of the Invention An inductor coil may generate heat, and in certain situations, it is necessary to remove this heat in order to cool the inductor coil.

[0003] Current solutions rely on a mechanical housing that encapsulates the entire inductor using some form of epoxy compound. Since the thermal conductivity of air is about 24 mW / m·K, this is more beneficial than using natural convection. On the other hand, cost-effective epoxies applicable to potting the inductor are in the range of 1 W / m·K to 1.3 W / m·K and are more than 50 times superior in terms of thermal performance. This has an apparently obvious advantage, but looking at the whole process, it also has significant drawbacks that are not necessarily considered. Ferrite materials saturate more easily at high temperatures from 25°C to 100°C, and it has been observed that even high-grade materials such as 3C96 have a 10% reduction in saturation level. Also, complete encapsulation provides a good path for the ferrite material, resulting in a reduction in the maximum saturation current level. The materials for the potting compound and the mechanical housing to completely encapsulate the inductor both incur additional costs. Since additional materials are required, the price of each individual component increases significantly. Following encapsulation, the footprint of the components increases to accommodate the potting material and the housing. If the case is manufactured too tightly or in close proximity to the ferrite, there is a problem that eddy currents are induced in the housing itself.

[0004] It is necessary to address these problems.

[0005] Summary of the Invention It is advantageous to have an improved inductor coil and a method for cooling the inductor coil.

[0006] The object of the present invention is solved by the subject matter of the independent claims, and further embodiments are incorporated into the dependent claims. It should be noted that the aspects and examples described below of the present invention also apply to an inductor coil and a method of cooling the inductor coil.

[0007] In a first aspect, a first component, a second component, a conductor of a predetermined length, and a heat sink are provided to form an inductor coil.

[0008] The first component is arranged adjacent to the second component. A core is formed from the first component and the second component. A first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. The heat sink includes a thermally conductive material. The heat sink comprises a first part and a second part. The first part of the heat sink has a first material and / or structural property, and the second part of the heat sink has a second material and / or structural property different from the first material and / or structural property. The inner surface of the first part of the heat sink is in contact with the outer surface of a part of the plurality of turns of the conductor.

[0009] In one example, the first material and / or structural property includes magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0010] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink.

[0011] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and is greater than the circumferential resistance of the second part of the heat sink.

[0012] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink.

[0013] In one example, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and is less than the circumferential conductance of the second part of the heat sink.

[0014] In one example, the heat sink is formed from a single piece, and the first structural property of the first part is different from the second structural property of the second part.

[0015] In one example, the first part of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0016] In one example, the first part of the heat sink includes a plurality of slots or grooves.

[0017] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0018] In one example, the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0019] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0020] In one example, the second part of the heat sink is configured to connect to a printed circuit board.

[0021] In one example, the heat sink has at least one third part disposed on an opposite side of the second part of the heat sink relative to the first part of the heat sink. The at least one third part of the heat sink is configured to dissipate heat from the second part of the heat sink.

[0022] In one example, the third part of the at least one third part of the heat sink comprises a fin structure.

[0023] In one example, the third part of the at least one third part of the heat sink comprises a connection terminal.

[0024] In one example, the connection terminal comprises a fin structure.

[0025] In one example, the connection terminal comprises a thick copper wire.

[0026] In one example, the second part of the heat sink comprises one or more pins configured for mechanical alignment with and / or mechanical fixation to the printed circuit board.

[0027] In one example, the first and second parts of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0028] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap within the core. The first part of the conductor of a predetermined length is wound around the core and the gap within the core. The inner portion of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The inner portion of one or more turns of the conductor disposed around the gap within the core is spaced apart from the central axis by at least a predetermined second distance that is greater than at least the predetermined first distance.

[0029] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap within the core. A spacer is disposed within the gap in the core so as to form a gap surrounding the core. The outer surface of a portion of the spacer is disposed at a distance from the central axis of the core that is greater than the distance from the central axis to the outer surfaces of the first component forming the core and the second component.

[0030] In one example, the dimension of a portion of the spacer adjacent to the outer surfaces of the first component and the second component in the direction of the central axis is greater than the dimension of the gap within the core in the direction of the central axis.

[0031] In one example, the outer surface of a portion of the spacer is configured to contact one or more turns of the conductor disposed around the gap within the core.

[0032] In one example, the spacer includes a non-conductive material.

[0033] In one example, the spacer includes a central hole configured to be disposed surrounding the central axis.

[0034] In a second aspect, a first component, a second component, a conductor of a predetermined length, a heat sink, and an inductor coil including the same are provided.

[0035] The first component is arranged adjacent to the second component. A core is formed from the second component. A first part of a conductor of a predetermined length is wound around at least the core to form a plurality of turns of the conductor. The heat sink includes a thermally conductive material. The heat sink includes a first part and a second part. The first part of the heat sink has a first magnetic permeability, and the second part of the heat sink has a second magnetic permeability greater than the first magnetic permeability. The inner surface of the first part of the heat sink is in contact with the outer surface of a part of the plurality of turns of the conductor.

[0036] In one example, the first material and / or structural property includes magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0037] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink.

[0038] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink.

[0039] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance less than the resistance or resistivity of the first part of the heat sink.

[0040] In one example, the circumferential conductance of the first part of the heat sink is smaller than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is smaller than the radial conductance of the second part of the heat sink, and is smaller than the circumferential conductance of the second part of the heat sink.

[0041] In one example, the heat sink is formed from a single piece, and the first structural characteristic of the first part is different from the second structural characteristic of the second part.

[0042] In one example, the first part of the heat sink has a thickness in the axial direction of the core that is smaller than the thickness of the second part of the heat sink in the axial direction of the core.

[0043] In one example, the first part of the heat sink comprises a plurality of slots or grooves.

[0044] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0045] In one example, the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0046] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0047] In one example, the second part of the heat sink is configured to connect to a printed circuit board.

[0048] In one example, the heat sink has at least one third part disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink. At least one third part of the heat sink is configured to dissipate heat from the second part of the heat sink.

[0049] In one example, the third part of at least one third part of the heat sink has a fin structure.

[0050] In one example, the third part of at least one third part of the heat sink has a connection terminal.

[0051] In one example, the connection terminal has a fin structure.

[0052] In one example, the connection terminal has a thick copper wire.

[0053] In one example, the second part of the heat sink has one or more pins configured for mechanical alignment with and / or mechanical fixation to a printed circuit board.

[0054] In one example, the first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0055] In one example, the core of the second component is spaced apart from the first component so as to form a gap between the core and the first component. The first part of a conductor of a predetermined length is wound around the core and the gap between the core and the first component. The inner part of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The inner part of one or more turns of the conductor disposed around the gap between the core and the first component is spaced apart from the central axis by at least a predetermined second distance that is greater than at least the predetermined first distance.

[0056] In one example, the core of the second component is spaced apart from the first component so as to form a gap between the core and the first component. A spacer is disposed in the gap between the core and the first component so as to form a gap surrounding the core. The outer surface of a part of the spacer is disposed at a distance from the central axis that is greater than the distance from the central axis to the outer surface of the core of the second component.

[0057] In one example, the dimension of a part of the spacer adjacent to the outer surface of the core of the second component in the direction of the central axis is larger than the dimension of the gap between the core and the first component in the direction of the central axis.

[0058] In one example, the outer surface of a part of the spacer is configured to contact one or more turns of a conductor arranged to surround the gap between the core and the first component.

[0059] In one example, the spacer includes a non-conductive material.

[0060] In one example, the spacer includes a central hole configured to be arranged surrounding the central axis.

[0061] In a third aspect, a method of cooling an inductor coil is provided. The inductor coil includes a first component, a second component, and a conductor of a predetermined length. The first component is arranged adjacent to the second component. A core is formed from the first component and the second component. A first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. The method includes using a heat sink, the heat sink includes a thermally conductive material, the heat sink includes a first part and a second part, the first part of the heat sink has a first magnetic permeability, the second part of the heat sink has a second magnetic permeability greater than the first magnetic permeability, using the heat sink includes contacting an inner surface of the first part of the heat sink with an outer surface of a part of the plurality of turns of the conductor.

[0062] In one example, the first material and / or structural property includes magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0063] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity that is less than the resistance or resistivity of the first part of the heat sink.

[0064] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink.

[0065] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink.

[0066] In one example, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and less than the circumferential conductance of the second part of the heat sink.

[0067] In one example, the heat sink is formed from a single piece, and the first structural property of the first part is different from the second structural property of the second part.

[0068] In one example, the first part of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0069] In one example, the first part of the heat sink comprises a plurality of slots or grooves.

[0070] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0071] In one example, the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0072] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0073] In one example, the method includes connecting the second part of the heat sink to a printed circuit board.

[0074] In one example, the heat sink has at least one third part disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink. The method includes dissipating heat from the second part of the heat sink through at least one third part of the heat sink.

[0075] In one example, the third part of at least one third part of the heat sink has a fin structure.

[0076] In one example, the third part of at least one third part of the heat sink has a connection terminal.

[0077] In one example, the connection terminal has a fin structure.

[0078] In one example, the connection terminal has a thick copper wire.

[0079] In one example, the second part of the heat sink has one or more pins. The method includes mechanically aligning the one or more pins with the printed circuit board and / or mechanically fixing the one or more pins to the printed circuit board.

[0080] In one example, the first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0081] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap within the core. The first part of a conductor of a predetermined length is wound around the core and the gap within the core. The inner portion of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The method includes spacing apart the inner portion of one or more turns of the conductor disposed around the gap within the core from the central axis by at least a predetermined second distance that is greater than at least the predetermined first distance.

[0082] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap within the core. The method includes disposing a spacer within the gap within the core so as to form a gap surrounding the core, and an outer surface of a portion of the spacer is disposed at a distance from the central axis that is greater than the distance from the central axis to the outer surfaces of the first component forming the core and the second component.

[0083] In one example, the dimension of a portion of the spacer adjacent to the outer surfaces of the first component and the second component in the direction of the central axis is greater than the dimension of the gap within the core in the direction of the central axis.

[0084] In one example, the method includes contacting an outer surface of a portion of the spacer with one or more turns of the conductor disposed around the gap within the core.

[0085] In one example, the spacer includes a non-conductive material.

[0086] In one example, the spacer includes a central hole configured to be disposed surrounding the central axis.

[0087] In a fourth aspect, a method of cooling an inductor coil is provided. The inductor coil comprises a first component, a second component, and a conductor of a predetermined length. The first component is disposed adjacent to the second component. A core is formed from the second component. A first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. The method includes using a heat sink, the heat sink including a thermally conductive material, the heat sink comprising a first part and a second part, the first part of the heat sink having a first magnetic permeability, the second part of the heat sink having a second magnetic permeability greater than the first magnetic permeability, using the heat sink includes contacting an inner surface of the first part of the heat sink with an outer surface of a portion of the plurality of turns of the conductor.

[0088] In one example, the first material and / or structural property includes magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0089] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink.

[0090] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink.

[0091] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance less than the resistance or resistivity of the first part of the heat sink.

[0092] In one example, the circumferential conductance of the first part of the heat sink is smaller than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is smaller than the radial conductance of the second part of the heat sink, and is smaller than the circumferential conductance of the second part of the heat sink.

[0093] In one example, the heat sink is formed from a single piece, and the first structural characteristic of the first part is different from the second structural characteristic of the second part.

[0094] In one example, the first part of the heat sink has a thickness in the axial direction of the core that is smaller than the thickness of the second part of the heat sink in the axial direction of the core.

[0095] In one example, the first part of the heat sink comprises a plurality of slots or grooves.

[0096] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0097] In one example, the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0098] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0099] In one example, the method includes connecting the second part of the heat sink to a printed circuit board.

[0100] In one example, the heat sink has at least one third part disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink. The method includes dissipating heat from the second part of the heat sink through at least one third part of the heat sink.

[0101] In one example, the third part of at least one third part of the heat sink comprises a fin structure.

[0102] In one example, the third part of at least one third part of the heat sink comprises a connection terminal.

[0103] In one example, the connection terminal comprises a fin structure.

[0104] In one example, the connection terminal comprises a thick copper wire.

[0105] In one example, the second part of the heat sink comprises one or more pins, and the method includes mechanically aligning the one or more pins with a printed circuit board and / or mechanically fixing the one or more pins to the printed circuit board.

[0106] In one example, the first and second parts of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0107] In one example, the core of the second component is spaced apart from the first component to form a gap between the core and the first component. The first part of a conductor of a predetermined length is wound around the core and the gap between the core and the first component. The inner portion of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The method includes spacing the inner portion of one or more turns of the conductor disposed around the gap between the core and the first component from the central axis by at least a predetermined second distance greater than the at least predetermined first distance.

[0108] In one example, the core of the second component is spaced apart from the first component so as to form a gap between the core and the first component. The method includes placing a spacer in the gap between the core and the first component to form a gap surrounding the core, and an outer surface of a portion of the spacer is disposed at a distance from the central axis that is greater than the distance from the central axis of the core to the outer surface of the core of the second component.

[0109] In one example, a dimension of a portion of the spacer adjacent to the outer surface of the core of the second component in the direction of the central axis is greater than a dimension of the gap between the core and the first component in the direction of the central axis.

[0110] In one example, the method includes contacting an outer surface of a portion of the spacer with one or more turns of a conductor disposed to surround the gap between the core and the first component.

[0111] In one example, the spacer includes a non-conductive material.

[0112] In one example, the spacer includes a central hole configured to be disposed surrounding the central axis.

[0113] Advantageously, the benefits provided by any of the above aspects apply equally to all of the other aspects, and vice versa.

[0114] The above aspects and examples will become apparent from and will be elucidated with reference to the embodiments described below.

Brief Description of the Drawings

[0115] Exemplary embodiments will be described below with reference to the following drawings.

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

[0116] Detailed Description of the Embodiment Figures 1 to 15 relate to an inductor coil and a method of cooling the inductor coil.

[0117] In one example, the inductor coil includes a first component 12, a second component 14, a conductor 18 of a predetermined length, and a heat sink 100. The first component is disposed adjacent to the second component. A core 16 is formed from the first component and the second component. A first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. The heat sink includes a thermally conductive material. The heat sink includes a first part 90, 110 and a second part. The first part of the heat sink has a first material and / or structural property, and the second part of the heat sink has a second material and / or structural property different from the first material and / or structural property. The inner surface of the first part of the heat sink is in contact with the outer surface of a part of the plurality of turns of the conductor.

[0118] Accordingly, an inductor coil having a core formed from two components has a heat sink 100 having a first part 90 that acts as a heat transfer element or heat transfer material, and the first part 90 thermally conducts heat from the coil 18 while suppressing the generation of eddy currents. It should be noted that the first and second parts 90, 110 of the heat sink 100 can be combined into a single part, but the characteristics and technical advantages of the first heat transfer element 90 remain the same.

[0119] In one example, the first material and / or structural property includes a magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0120] In one example, the first material and / or structural property includes a resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink.

[0121] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and is greater than the circumferential resistance of the second part of the heat sink.

[0122] In one example, the first material and / or structural characteristic includes conductivity or conductance, and the second material and / or structural characteristic includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink.

[0123] In one example, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and is less than the circumferential conductance of the second part of the heat sink.

[0124] In one example, the heat sink 100 is formed from a single piece, and the first structural characteristic of the first part 90 is different from the second structural characteristic of the second part 110.

[0125] In one example, the first part 110 of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0126] In one example, the first part 90 of the heat sink includes a plurality of slots or grooves.

[0127] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0128] In one example, the plurality of slots or grooves extend to the boundary between the first part and the second part of the heat sink.

[0129] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0130] In one example, the second part of the heat sink is configured to connect to the printed circuit board 120.

[0131] In one example, the heat sink includes at least one third part (130, 140) disposed on an opposite side of the second part of the heat sink with respect to the first part of the heat sink. At least one third part of the heat sink is configured to dissipate heat from the second part of the heat sink.

[0132] In one example, the third part of at least one third part of the heat sink comprises a fin structure 130.

[0133] In one example, the third part of at least one third part of the heat sink comprises a connection terminal 140.

[0134] In one example, the connection terminal comprises a fin structure.

[0135] In one example, the connection terminal comprises a thick copper wire.

[0136] In one example, the second part of the heat sink comprises one or more pins configured for mechanical alignment with the printed circuit board 120 and / or for mechanical fixation to the printed circuit board.

[0137] In one example, the first and second parts of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0138] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap 20 within the core. The first part of a conductor of a predetermined length is wound around the core and the gap within the core. The inner portion of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The inner portion of one or more turns of the conductor disposed around the gap within the core is spaced apart from the central axis by at least a predetermined second distance that is greater than at least the predetermined first distance.

[0139] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap 20 within the core. A spacer 30 is disposed within the gap in the core so as to form a gap 22 surrounding the core. The outer surface of a portion of the spacer is disposed at a distance from the central axis of the core that is greater than the distance from the central axis to the outer surfaces of the first component and the second component forming the core.

[0140] In one example, the dimension of a portion of the spacer adjacent to the outer surfaces of the first component and the second component in the direction of the central axis is greater than the dimension 24 of the gap within the core in the direction of the central axis.

[0141] In one example, the outer surface of a portion of the spacer is configured to contact one or more turns of the conductor disposed around the gap within the core.

[0142] In one example, the spacer includes a non-conductive material.

[0143] In one example, the spacer includes a central hole 32 configured to be disposed surrounding the central axis.

[0144] In one example, the inductor coil comprises a first component 12, a second component 14, a conductor 18 of a predetermined length, and a heat sink 100. The first component is arranged adjacent to the second component. A core 16 is formed from the second component. A first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. The heat sink includes a thermally conductive material. The heat sink comprises a first part 90, 110 and a second part. The first part of the heat sink has a first material and / or structural property, and the second part of the heat sink has a second material and / or structural property that is different from the first material and / or structural property. The inner surface of the first part of the heat sink is in contact with the outer surface of a part of the plurality of turns of the conductor.

[0145] Accordingly, an inductor coil having a core formed from one component has a heat sink 100 having a first part 90 that acts as a heat transfer element or thermally conductive material, the first part 90 thermally conducting heat from the coil 18 while suppressing the generation of eddy currents. It should be noted that the first and second parts 90, 110 of the heat sink 100 can be combined into a single part, but the properties and technical advantages of the first heat transfer element 90 remain the same.

[0146] In one example, the first material and / or structural property includes magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0147] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink.

[0148] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink.

[0149] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink.

[0150] In one example, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and less than the circumferential conductance of the second part of the heat sink.

[0151] In one example, the heat sink 100 is formed from a single piece, and the first structural property of the first part 90 is different from the second structural property of the second part 110.

[0152] In one example, the first part 110 of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0153] In one example, the first part 90 of the heat sink includes a plurality of slots or grooves.

[0154] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0155] In one example, the plurality of slots or grooves extend to the boundary between the first part and the second part of the heat sink.

[0156] In one example, the plurality of slots or grooves each have a longitudinal axis that intersects the central axis of the core.

[0157] In one example, the second part of the heat sink is configured to connect to the printed circuit board 120.

[0158] In one example, the heat sink includes at least one third part 130, 140 disposed on an opposite side of the second part of the heat sink relative to the first part of the heat sink. At least one third part of the heat sink is configured to dissipate heat from the second part of the heat sink.

[0159] In one example, the third part of at least one third part of the heat sink comprises a fin structure 130.

[0160] In one example, the third part of at least one third part of the heat sink comprises a connection terminal 140.

[0161] In one example, the connection terminal comprises a fin structure.

[0162] In one example, the connection terminal comprises a thick copper wire.

[0163] In one example, the second part of the heat sink comprises one or more pins configured for mechanical alignment with and / or mechanical fixation to the printed circuit board 120.

[0164] In one example, the first and second parts of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0165] In one example, the core of the second component is spaced apart from the first component so as to form a gap 20 between the core and the first component. The first part of a conductor of a predetermined length is wound around the core and the gap between the core and the first component. The inner part of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The inner part of one or more turns of the conductor disposed around the gap between the core and the first component is spaced apart from the central axis by at least a predetermined second distance that is greater than at least the predetermined first distance.

[0166] In one example, the core of the second component is spaced apart from the first component so as to form a gap 20 between the core and the first component. A spacer 30 is disposed in the gap between the core and the first component so as to form a gap 22 surrounding the core. The outer surface of a part of the spacer is disposed at a distance from the central axis that is greater than the distance from the central axis of the core of the second component to the outer surface of the core.

[0167] In one example, the dimension of a part of the spacer adjacent to the outer surface of the core of the second component in the direction of the central axis is greater than the dimension 24 of the gap between the core and the first component in the direction of the central axis.

[0168] In one example, the outer surface of a part of the spacer is configured to contact one or more turns of the conductor disposed around the gap between the core and the first component.

[0169] In one example, the spacer includes a non-conductive material.

[0170] In one example, the spacer includes a central hole 32 configured to be disposed surrounding the central axis.

[0171] In one example, the inductor coil includes a first component 12, a second component 14, and a conductor 18 of a predetermined length. The first component is disposed adjacent to the second component. A core 16 is formed from the first component and the second component. A first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. An exemplary method of cooling the inductor coil is including using a heat sink 100. The heat sink includes a thermally conductive material. The heat sink includes a first part 90, 110 and a second part. The first part of the heat sink has a first material and / or structural property, and the second part of the heat sink has a second material and / or structural property that is different from the first material and / or structural property, using the heat sink includes contacting an inner surface of the first part of the heat sink with an outer surface of a part of the plurality of turns of the conductor.

[0172] In one example, the first material and / or structural property includes permeability, and the second material and / or structural property includes a permeability that is greater than the permeability of the first part of the heat sink.

[0173] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity that is less than the resistance or resistivity of the first part of the heat sink.

[0174] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink.

[0175] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink.

[0176] In one example, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and less than the circumferential conductance of the second part of the heat sink.

[0177] In one example, the heat sink 100 is formed from a single piece, and the first structural characteristics of the first part 90 of the heat sink are different from the second structural characteristics of the second part 110 of the heat sink.

[0178] In one example, the first part 110 of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0179] In one example, the first part 90 of the heat sink comprises a plurality of slots or grooves.

[0180] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0181] In one example, the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0182] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0183] In one example, the method includes connecting the second part of the heat sink to the printed circuit board 120.

[0184] In one example, the heat sink includes at least one third part 130, 140 disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink. The method includes dissipating heat from the second part of the heat sink through at least one third part of the heat sink.

[0185] In one example, a third part of at least one third part of the heat sink comprises a fin structure 130.

[0186] In one example, a third part of at least one third part of the heat sink comprises a connection terminal 140.

[0187] In one example, the connection terminal comprises a fin structure.

[0188] In one example, the connection terminal comprises a thick copper wire.

[0189] In one example, the second part of the heat sink comprises one or more pins. The method includes mechanically aligning the one or more pins with the printed circuit board 120 and / or mechanically fixing the one or more pins to the printed circuit board.

[0190] In one example, the first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0191] In one example, the core portion of the first component is spaced apart from the core portion of the second component to form a gap 20 within the core. The first part of a conductor of a predetermined length is wound around the core and the gap within the core. The inner portion of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The method includes spacing the inner portion of one or more turns of the conductor disposed around the gap within the core from the central axis by at least a predetermined second distance greater than the at least predetermined first distance.

[0192] In one example, the core portion of the first component is spaced from the core portion of the second component to form a gap 20 within the core. The method includes placing a spacer 30 within the gap in the core so as to form a gap 22 surrounding the core. The outer surface of a portion of the spacer is disposed at a distance from the central axis of the core that is greater than the distance from the central axis to the outer surface of the first component forming the core and the outer surface of the second component.

[0193] In one example, the dimension of a portion of the spacer adjacent to the outer surfaces of the first component and the second component in the direction of the central axis is greater than the dimension 24 of the gap within the core in the direction of the central axis.

[0194] In one example, the method includes contacting an outer surface of a portion of the spacer with one or more turns of a conductor disposed surrounding the gap in the core.

[0195] In one example, the spacer includes a non-conductive material.

[0196] In one example, the spacer includes a central hole 32 configured to be disposed surrounding the central axis.

[0197] In one example, the inductor coil includes a first component 12, a second component 14, and a conductor 18 of a predetermined length. The first component is disposed adjacent to the second component. A core 16 is formed from the second component. A first part of the conductor of the predetermined length is wound at least surrounding the core to form a plurality of turns of the conductor. An exemplary method of cooling the inductor coil is including using a heat sink 100. The heat sink includes a thermally conductive material. The heat sink includes a first part 90, 110 and a second part. The first part of the heat sink has a first material and / or structural characteristic, and the second part of the heat sink has a second material and / or structural characteristic different from the first material and / or structural characteristic, Using a heat sink includes contacting an inner surface of a first part of the heat sink with an outer surface of a portion of a plurality of turns of a conductor.

[0198] In one example, the first material and / or structural property includes permeability, and the second material and / or structural property includes a permeability greater than the permeability of the first part of the heat sink.

[0199] In one example, the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink.

[0200] In one example, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink.

[0201] In one example, the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance less than the resistance or resistivity of the first part of the heat sink.

[0202] In one example, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and less than the circumferential conductance of the second part of the heat sink.

[0203] In one example, the heat sink 100 is formed from a single piece, and the first structural property of the first part 90 is different from the second structural property of the second part 110.

[0204] In one example, the first part 110 of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0205] In one example, the first part 90 of the heat sink comprises a plurality of slots or grooves.

[0206] In one example, the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0207] In one example, the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0208] In one example, each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0209] In one example, the method includes connecting the second part of the heat sink to the printed circuit board 120.

[0210] In one example, the heat sink includes at least one third part 130, 140 disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink. The method includes dissipating heat from the second part of the heat sink through at least one third part of the heat sink.

[0211] In one example, the third part of the at least one third part of the heat sink comprises a fin structure 130.

[0212] In one example, the third part of the at least one third part of the heat sink comprises a connection terminal 140.

[0213] In one example, the connection terminal comprises a fin structure.

[0214] In one example, the connection terminal comprises a thick copper wire.

[0215] In one example, the second part of the heat sink comprises one or more pins. The method includes mechanically aligning the one or more pins with the printed circuit board 120 and / or mechanically securing the one or more pins to the printed circuit board.

[0216] In one example, the first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core.

[0217] In one example, the core of the second component is spaced apart from the first component so as to form a gap 20 between the core and the first component. The first part of a conductor of a predetermined length is wound around the core and the gap between the core and the first component. The inner portion of two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The method includes spacing the inner portion of one or more turns of the conductor disposed around the gap between the core and the first component from the central axis by at least a predetermined second distance that is greater than the at least predetermined first distance.

[0218] In one example, the core of the second component is spaced apart from the first component so as to form a gap 20 between the core and the first component. The method includes placing a spacer 30 within the gap between the core and the first component to form a gap 22 surrounding the core. The outer surface of a portion of the spacer is disposed at a distance from the central axis that is greater than the distance from the central axis to the outer surface of the core of the second component.

[0219] In one example, the dimension of a portion of the spacer adjacent to the outer surface of the core of the second component in the direction of the central axis is greater than the dimension 24 of the gap between the core and the first component in the direction of the central axis.

[0220] In one example, the method includes contacting the outer surface of a portion of the spacer with one or more turns of a conductor disposed around the gap between the core and the first component.

[0221] In one example, the spacer includes a non-conductive material.

[0222] In one example, the spacer includes a central hole 32 configured to be disposed surrounding a central axis.

[0223] Accordingly, new heat sink technologies have been developed that are utilized in certain embodiments to optimize heat transfer from the windings of an inductor coil to a medium such as a printed circuit board or an extended heat sink. Further, when exposed to an alternating current associated with a typical application as a switch mode converter, eddy currents generated within the thermally conductive heat sink are reduced or suppressed, and as a result, the initial heat generation that needs to be transferred by the heat sink can be reduced.

[0224] In certain embodiments, 1) The heat sink design removes heat from the coil, but removes heat from the same plane where the terminals of the coil exit for attachment to a medium such as a printed circuit board. This can eliminate the need for a fully enclosed inductor and obviate the need to fully pot the electronic device or rely on expensive thermal solutions. 2) This design provides embodiments that reduce the accumulation of eddy currents due to the proximity of a thermally conductive material to the alternating magnetic field generated by the coil.

[0225] Next, with reference to FIGS. 1 - 15 again, certain embodiments will be described.

[0226] Figure 1 shows a cross-sectional view of a particular detailed embodiment of an inductor coil before the heat sink is placed in contact with the turns of the conductor. A first component part 12 of ferrite material is shown at the top. This has a base portion and a cylindrical core portion extending downward. The outer rim portion extends downward and is spaced from the core portion, within which turns of a conductor 18 in the form of a multi-strand wire can be placed. Here, six turns are shown, but there may be more or fewer turns. A second component part 14 is also of ferrite material and is shown at the bottom. This also has a base portion, a cylindrical core portion 16 extending upward, and an outer rim portion extending upward and spaced from the core portion within which turns of the conductor 18 can be placed. The core portions of the first component part and the second component part form the core 16. The center 20 of the core is shown between the two component parts, and the center gap has a dimension 24. The dimension 24 can be, for example, 1 mm, but it can be larger or smaller. As described, six turns of a multi-strand wire (or Litz wire) are shown wound around the core and the gap within the core, but there may be fewer or more. In addition to the gap 20 being provided between the cores, a gap 22 is formed surrounding this center gap, and the wire turns do not penetrate into this gap 22. As shown in the figure, the wire turns are deformed and maintained outside this gap 22. Thus, Figure 1 shows that although the cross-section of each turn is kept the same, under compression, free space is generated to avoid the gaps generated by the ferrite. The center gap 20 is an area where a spacer 30 of non-conductive material forming the gap 22 can be placed, which will be described in more detail below.

[0227] Figure 2 shows a cross-sectional view of a particular detailed embodiment of an inductor coil before the heat sink is again placed in contact with the turns of the conductor. A first component part 12 of ferrite material is shown at the top. This has a base portion. A second component part 14, which is also of ferrite material, is shown at the bottom. This also has a base portion and has a cylindrical core 16 extending upward. The outer rim portion extends upward and is spaced from the core, within which turns of a conductor 18 in the form of a multi-strand wire can be placed. The core 16 is spaced from the base portion of the first component part to form a gap 40 within the core. Six turns of the multi-strand wire are shown wound around the core and the gap within the core, although fewer or more than this may be used. In addition to the gap 40 being provided between the core and the first component part, a gap 42 is effectively formed within the core between the core and the first component part, and the wire turns do not penetrate into this gap 42 and, as shown, the wire turns are deformed and maintained outside of this gap 42. Thus, again in this case, Figure 2 shows that although the cross-section of each turn is kept the same, free space is created to avoid the gaps created by the ferrite under compression. The upper gap 40 is an area where a spacer 50 of non-conductive material forming the gap 42 can be placed, which will be described in more detail below.

[0228] Figure 3 shows a particular detailed embodiment of an inductor coil having a central gap 20 within a core, such as shown in FIG. 1, where conductor 18 is not shown and no heat sink is shown. The first component part 12 and the second component part 14 are shown separated from each other, and it is shown that spacer 30 has a central hole 32. As shown, there is a space 60 for winding conductor 18 in the form of multi-strand wire on both the first and second component parts. Thus, this figure shows a non-conductive insert (spacer 30) extending over a very long length. This can be used regardless of the presence or absence of hole 32 at the center of the non-conductive portion. This can be added during or after compression of the wire to prevent the wire from entering the leakage magnetic field after compression.

[0229] Figure 4 shows a representative cross-section of the inductor coil, showing the outer rim of the first component part 12 or the second component part 14 and the upper surface of the core 16 of one of the two component parts. In the central cross-section of gap spacer 30, the outer rim of the first component part or the second component part is not actually cut and is the upper surface. The turns of wire of conductor 18 can be laterally pushed by spacer 30 and / or the turns of wire can be deformed by spacer 30 in the region of central gap 20 to keep the turns of wire conductor 18 outside the leakage magnetic field. Thus, the ring-shaped spacer 30 can be used to compress the conductive wire 18 or to allow the bundle or strands to jump over the space containing the leakage magnetic field, and the wire can form bumps 80 outside the core shape, and the space 70 can be a space into which the wire can freely enter. Thus, spacer 30 causes heat generation by keeping the portion of the wire conductor outside the leakage magnetic field, thereby improving thermal stability and reducing the generation of heat that needs to be transferred by a heat sink.

[0230] FIG. 5 is a diagram of a horizontal cross-section of an inductor coil having a heat sink 100. The heat sink has a first part 90 having a series of grooves or slots, and this first part contacts the wire turns, is thermally bonded, contacts the second part of the heat sink, and itself contacts the ferrite material of the first component 12 and / or the second component 14. The first part 90 of the heat sink 100 can be regarded as a vortex-type heat sink in that the slots or grooves reduce the volume of the magnetic permeability material adjacent to the wire turns, and the eddy current reducing heat sink 90 reduces the flow of eddy currents in the thermally conductive heat sink, and thus less heat is generated.

[0231] FIG. 6 is a diagram of a horizontal cross-section of an inductor coil having a heat sink 100. The heat sink has a first part 110 that contacts the wire turns, is thermally bonded, and contacts the second part of the heat sink, and itself contacts the ferrite material of the first component 12 and / or the second component 14. The first part 110 of the heat sink 100 is thinner than the second part of the heat sink. The first part 110 of the heat sink 100 can also be regarded as a vortex-type heat sink in that its thinness reduces the volume of the magnetic permeability material adjacent to the wire turns, and the eddy current reducing heat sink 110 reduces the flow of eddy currents in the thermally conductive heat sink, and thus less heat is generated. It should be noted that the first part of the heat sink 90 having the grooves and slots described with respect to FIG. 5 may be the heat sink 110 that is thinner than the second part of the heat sink described with respect to FIG. 6. Thus, in FIG. 6, the heat sink contacts the ferrite material but uses a thermally conductive pad or material to provide a thermally conductive path and creates a low magnetic permeability space to reduce eddy current generation. In this embodiment, the second part of the heat sink is shown in contact with a printed circuit board (PCB) 120.

[0232] FIG. 7 is a diagram of an inductor coil and a heat sink of the same nature as shown in FIG. 6, but having an option of the heat sink having a third part 130 for improving heat transfer to the surroundings, either through press-fitting of screw terminals or pins on the heat sink, or through a fin structure for heat transfer to the surroundings.

[0233] FIG. 8 is a diagram of an inductor coil and a heat sink of the same nature as shown in FIG. 6 (in the form shown in FIGS. 3 - 4), but having an embodiment of a vortex space as a combination of heat reduction components and an improved heat path from a novel heat sink solution. Here, the third part of the heat sink is a thick copper wire in the form of a connection terminal 140 that helps release heat from the inductor coil.

[0234] FIG. 9 is a diagram showing a method of using screw terminals from a heat sink base for attaching an inductor coil and a heat sink to a printed circuit board so that the heat path is transferred from copper on the printed circuit board to a mounting hole in a mechanical enclosure. In FIG. 9, "A" represents a method of utilizing a PCB mounting hole, where copper is connected to a ground plane and an inductor coil heat sink to improve the heat path from copper to the mechanical housing. "B" represents holes for screwing the inductor coil base and the heat sink to the PCB for an additional heat path from the inductor coil, and the copper resist can be removed to improve heat transfer to the printed circuit board.

[0235] FIG. 10 shows an inductor coil comprising a first part 12 and a second part 14 which, when combined with each other, form a magnetic flux cage having a core 16 and a conductor 18 of a predetermined length forming a coil, and a heat sink, that is to say, in other words, a heat transfer element 100 at least thermally connected to the winding of the conductor 18 of a predetermined length at a part of the outer surface of the conductor 18. The heat transfer element comprises a heat transfer region 111 and a heat sink region 113, and energy is transferred from the heat transfer region 111 to the heat sink region 113. The heat sink region 113 can be part of the element 100 designed to function as a cooling body. The heat sink can be a mounting plate designed to form good thermal contact with the heat sink. The material of the heat transfer element or the heat sink element 100 can be aluminum. The heat transfer region is preferably designed to transfer heat radially away from the coil conductor 18, in particular by a change in the material structure on a scale of less than a millimeter. This change in the heat transfer region 111 can be thin slots or laminations, which locally include heat conduction layers extending radially but not much in the circumferential direction with respect to the central axis of the core 16. The heat sink region 113 of the element 100 can be structured or coated to improve heat transfer to the environment or a cooling device. By making use of this arrangement, the heat generated in the conductor 18 of a predetermined length is at least partially transferred through the heat transfer region of the element 100 and transferred to the heat sink region 113.

[0236] FIG. 11 shows an embodiment without a magnetic flux cage. Then, the magnetic field generates a magnetic field further penetrating the heat transfer element. These magnetic fields result in strong heat generation based on the eddy current effect when a high alternating current frequency occurs in this element if the heat transfer element has a high conductivity in the heat transfer region 111. Therefore, the eddy current power density is reduced by using an anisotropic conductivity or reducing the conductivity in the partial volume 111 which is the heat transfer region close to the winding of the coil 18.

[0237] FIG. 12 shows a similar embodiment without the heat transfer region 113. Here, heat is transferred to an external heat sink thermally attached to the heat transfer element 100. The material 101 may be a metal alloy. The heat transfer element 100 can include two locally different chemical element mixtures in the alloy to reduce the conductivity in the heat transfer region 111 as compared to the conductivity in the heat sink region 101 or 113 (see also FIG. 11). In many cases, the conductivity and the thermal conductivity of the material 101 behave similarly, and when the conductivity is low, the thermal conductivity is high.

[0238] FIG. 13 shows an embodiment having a heat transfer element 110 between the heat transfer or heat sink element 100 and the coil conductor 18. The material of the heat transfer element 110 is different from the material 101 of the heat sink element 100. The heat transfer element 110 may be made of a heat transfer material that has a high thermal conductivity compared to other polymers but has a very low conductivity like an insulating material. The advantage of this embodiment is that the heat generated in the high-power coil 18 can be transferred through the transfer element 110 and to the heat sink element 100, and due to its low conductivity, the eddy current losses caused in the transfer element 110 are very small. Even when both the thermal conductivity and the conductivity of the material 101 are high, the eddy current losses are low. The same type of heat transfer element 110 can be the heat transfer region 111 in the embodiments shown in FIGS. 10, 11, and 12. Preferred heat transfer materials are materials that are thermally conductive but electrically insulating, which can be composed of silicone-type materials such as SILPAD by Henkel, or other polymers, or mixtures of polymers and particles.

[0239] FIG. 14 is an example using a normal winding where there is no degree of freedom in the space for eddy currents to occur around the gap 20. The cross-sectional view AB shows how thermal contact is made between the transfer element 110, the coil conductor 18, and the heat sink element 100.

[0240] FIG. 15 shows a diagram of an exemplary heat sink. This heat sink is made from a single extruded piece of aluminum. The features on the first and second parts of the single piece have differences in structural properties as described above. Slots in the aluminum change the average electrical resistance of the volume of the material by interrupting the circulating eddy currents. Since this part has less loss due to eddy currents and can achieve optimal heat transfer, the second part away from the current flow can have a strong structure. The slots in the aluminum are filled with thermal epoxy, which is in most cases 50 times more effective than air and also bridges any gaps between the first part with slots and the coil itself. As implementation techniques, there are thermal vias and heat transfer from the PCB to the case through mounting holes, removal from aluminum to copper and solder resist transfer, and thermal vias and PCB mounting holes for transfer to the case. As another method, there is a PCB cutout that allows the aluminum heat sink to pass through the PCB for direct mounting on a casing or a larger heat sink that also provides a heat sink for any switching MOSFET or power electronics.

[0241] Additional example In one example, the thermal conductivity of the heat transfer region 111 provides anisotropic thermal conductivity on the sub-millimeter scale. Anisotropy means that the thermal conductivity is high due to local structure and local material properties, but is low at least in the circumferential direction along the central axis of the core 16, or in other words, the thermal conductivity in the heat transfer region is low in a direction approximately tangent to the surface of the coil 18 but high in the radial direction. The low thermal conductivity in the tangential direction is achieved by the selection of a radial laminated structure having thin layers of conductive material with a planar direction in the radial direction and small tangential thickness or small slots in the radial direction filled with air or polymer or oil. Most of the heat transfer element 100 is a good thermal conductor with isotropic thermal conductivity.

[0242] In one example, the conductivity of the heat transfer region 111 provides sub-millimeter scale anisotropic conductivity. Anisotropy means that the conductivity is high due to local structure and local material properties, but low at least circumferentially along the central axis of the core 16, or in other words, the conductivity in the heat transfer region is low in a direction substantially tangent to the surface of the coil 18 but high in a substantially radial direction. The low conductivity in the tangential direction is achieved by the selection of a radial laminate structure having thin layers of conductive material stacked in the radial planar direction and small tangential thicknesses or small slots in the radial direction filled with air or polymer or oil. Most of the heat transfer element 100 is a good electrical conductor having isotropic conductivity. The material of the element 110 may be an aluminum alloy.

[0243] Eddy current Although eddy current generation was mentioned above, some related details are provided below.

[0244] The formula for eddy current loss is P = fn(ρ, B 2 , d 2 , f 2 ) a function of. In the formula, ρ is the resistivity of the material, B is the magnetic field strength, d is the thickness of the material, and f is the frequency.

[0245] Regarding the inductor coil and heat sink described above, the frequency can be considered constant in all innovative applications. However, the magnetic field B varies between 90 and 100. However, since heat transfer is required between 90 and 110 of the heat sink 100, a change in thickness d or ρ is provided to achieve this. Regarding the resistivity ρi of the material. When the first part 90 and the second part 110 of the heat sink 100 are made of extruded aluminum, the resistivity of aluminum remains constant when both parts are made of the same material, so the thickness d can be changed. However, by reducing the term of d between the parts, a medium with higher electrical resistance will be introduced in between to decompose the eddy current field.

[0246] This applies when air (potentially filled with thermal epoxy) or Baclac is added to bond a laminate that has a higher electrical resistance, in the case of a laminate or aluminum with slots.

[0247] By adding a thermal SIL pad, a layer of a high electrical resistance heat transfer layer is added to the aluminum. To add a sufficient distance to sufficiently reduce the B magnetic field, the thickness of the SIL pad needs to be increased, which is quite insufficient for heat transfer but can be an implementation form of use.

[0248] In this way, an inductor coil and a heat sink are developed in which a heat sink of a thermally conductive material is connected to a coil of a plurality of turns of the conductive material of the inductor. The heat sink is connected to the coil via a heat conduction path that reduces the generation of eddy magnetic fields due to differences in structures and / or materials within the magnetic field generation region.

[0249] The volume reduction can be achieved, for example, via a thermally conductive pad, and the thickness of the pad creates a heat path to the heat sink but results in a volume reduction.

[0250] The reduction in the volume of the material can alternatively or additionally be achieved by removing the material within slots or grooves that reduce the circulating eddy currents.

[0251] Furthermore, the heat sink can have screw terminals for mechanical fixation and pins for mechanical alignment and mechanical fixation to a medium such as a printed circuit board. The screw terminals can be screwed into a heat sink having a fin mechanism that improves heat transfer to the surroundings.

[0252] Furthermore, it should be noted that the inductor coil may have a gap within the core, at the center between the ferrite components, or adjacent to one of the ferrite components. The gap can be used for controlling the magnetic resistance in the magnetic circuit and can be important in inductor design. However, here, the wire is held away from this central gap via a non-conductive spacer disposed within a gap wider than the core, thereby preventing eddy currents in the coil windings. The non-conductive spacer serves to keep the conductor outside the eddy current space and reduce heat generation.

[0253] The following provides an example regarding specific details related to some possible structures of the inductor coil and specific details related to some possible methods of cooling the inductor coil.

[0254] Example 1. An inductor coil, a first component 12, a second component 14, a conductor 18 of a predetermined length, a heat sink 100, comprising, the first component is disposed adjacent to the second component, a core 16 is formed from the first component and the second component, a first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor, the heat sink includes a thermally conductive material, the heat sink includes a first part 90, 110 and a second part, the first part of the heat sink has a first material and / or structural property, and the second part of the heat sink has a second material and / or structural property different from the first material and / or structural property, the inner surface of the first part of the heat sink is in contact with the outer surface of a part of the plurality of turns of the conductor, the inductor coil.

[0255] Example 2. The first material and / or structural characteristic includes permeability, and the second material and / or structural characteristic includes a permeability greater than the permeability of the first part of the heat sink. The inductor coil described in Example 1.

[0256] Example 3. The first material and / or structural characteristic includes resistance or resistivity, and the second material and / or structural characteristic includes a resistance or resistivity less than the resistance or resistivity of the first part of the heat sink. The inductor coil described in Example 1 or 2.

[0257] Example 4. The circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink. The inductor coil described in Example 3.

[0258] Example 5. The first material and / or structural characteristic includes conductivity or conductance, and the second material and / or structural characteristic includes a conductivity or conductance less than the resistance or resistivity of the first part of the heat sink. The inductor coil described in any one of Examples 1 to 4.

[0259] Example 6. The circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and less than the circumferential conductance of the second part of the heat sink. The inductor coil described in Example 5.

[0260] Example 7. The heat sink 100 is formed from a single piece, and the first structural characteristic of the first part 90 is different from the second structural characteristic of the second part 110. The inductor coil described in any one of Examples 1 to 6.

[0261] Example 8. The inductor coil according to any one of Examples 1 to 7, wherein the first part 110 of the heat sink has a thickness in the axial direction of the core that is smaller than the thickness of the second part of the heat sink in the axial direction of the core.

[0262] Example 9. The inductor coil according to any one of Examples 1 to 8, wherein the first part 90 of the heat sink has a plurality of slots or grooves.

[0263] Example 10. The inductor coil according to Example 9, wherein the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0264] Example 11. The inductor coil according to Example 9 or 10, wherein the plurality of slots or grooves extend to the boundary between the first part and the second part of the heat sink.

[0265] Example 12. The inductor coil according to any one of Examples 9 to 11, wherein each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core.

[0266] Example 13. The inductor coil according to any one of Examples 1 to 12, wherein the second part of the heat sink is configured to be connected to the printed circuit board 120.

[0267] Example 14. The inductor coil according to any one of Examples 1 to 13, wherein the heat sink includes at least one third part 130, 140 disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink, and at least one third part of the heat sink is configured to release heat from the second part of the heat sink.

[0268] Example 15. The inductor coil according to Example 14, wherein the third part of at least one third part of the heat sink has a fin structure 130.

[0269] Example 16. The third part of at least one third part of the heat sink is the inductor coil described in Example 14 or 15, which includes a connection terminal 140.

[0270] Example 17. The connection terminal is the inductor coil described in Example 16, which includes a fin structure.

[0271] Example 18. The connection terminal is the inductor coil described in Example 16, which includes a thick copper wire.

[0272] Example 19. The second part of the heat sink includes one or more pins configured for mechanical alignment with the printed circuit board 120 and / or for mechanical fixation to the printed circuit board, and is the inductor coil described in any one of Examples 1 to 18.

[0273] Example 20. The first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core, and is the inductor coil described in any one of Examples 1 to 19.

[0274] Example 21. The core part of the first component is separated from the core part of the second component to form a gap (20) in the core. The first part of the conductor of a predetermined length is wound around the core and the gap in the core. The inner part of two or more turns of the conductor arranged around the core is separated from the central axis of the core by at least a predetermined first distance. The inner part of one or more turns of the conductor arranged around the gap in the core is separated from the central axis by at least a predetermined second distance greater than the predetermined first distance, and is the inductor coil described in any one of Examples 1 to 20.

[0275] Example 22. The core part of the first component is separated from the core part of the second component to form a gap 20 in the core, and a spacer 30 is disposed in the gap within the core to form a gap 22 surrounding the core. The outer surface of a part of the spacer is disposed at a distance from the central axis of the core that is greater than the distance from the central axis to the outer surfaces of the first component and the second component forming the core. The inductor coil according to any one of Examples 1 to 21.

[0276] Example 23. The dimension of a part of the spacer adjacent to the outer surfaces of the first component and the second component in the direction of the central axis is greater than the dimension 24 of the gap in the core in the direction of the central axis. The inductor coil according to Example 22.

[0277] Example 24. The outer surface of a part of the spacer is configured to contact one or more turns of a conductor disposed surrounding the gap in the core. The inductor coil according to Example 22 or 23 when dependent on Example 21.

[0278] Example 25. The spacer includes a non-conductive material. The inductor coil according to any one of Examples 22 to 24.

[0279] Example 26. The spacer includes a central hole 32 configured to be disposed surrounding the central axis. The inductor coil according to any one of Examples 22 to 25.

[0280] Example 27. An inductor coil, a first component 12, a second component 14, a conductor 18 of a predetermined length, a heat sink 100, and comprising, the first component is disposed adjacent to the second component, and a core 16 is formed from the second component, a first part of the conductor of the predetermined length is wound at least surrounding the core to form a plurality of turns of the conductor, The heat sink includes a thermally conductive material, The heat sink includes a first part 90, 110 and a second part, The first part of the heat sink has a first material and / or structural characteristic, and the second part of the heat sink has a second material and / or structural characteristic different from the first material and / or structural characteristic, The inner surface of the first part of the heat sink is in contact with the outer surface of a part of a plurality of turns of a conductor. Inductor coil.

[0281] Example 28. The inductor coil according to Example 27, wherein the first material and / or structural characteristic includes magnetic permeability, and the second material and / or structural characteristic includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0282] Example 29. The inductor coil according to Example 27 or 28, wherein the first material and / or structural characteristic includes resistance or resistivity, and the second material and / or structural characteristic includes a resistance or resistivity smaller than the resistance or resistivity of the first part of the heat sink.

[0283] Example 30. The inductor coil according to Example 29, wherein the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and is greater than the circumferential resistance of the second part of the heat sink.

[0284] Example 31. The inductor coil according to any one of Examples 27 to 30, wherein the first material and / or structural characteristic includes conductivity or conductance, and the second material and / or structural characteristic includes a conductivity or conductance smaller than the resistance or resistivity of the first part of the heat sink.

[0285] Example 32. The circumferential conductance of the first part of the heat sink is smaller than the radial conductance of the first part of the heat sink, and the circumferential conductance of the first part of the heat sink is smaller than the radial conductance of the second part of the heat sink and smaller than the circumferential conductance of the second part of the heat sink. The inductor coil described in Example 31.

[0286] Example 33. The heat sink 100 is formed from a single piece, and the first structural characteristic of the first part 90 is different from the second structural characteristic of the second part 110. The inductor coil described in any one of Examples 27 to 32.

[0287] Example 34. The first part 110 of the heat sink has a thickness in the axial direction of the core that is smaller than the thickness of the second part of the heat sink in the axial direction of the core. The inductor coil described in any one of Examples 27 to 33.

[0288] Example 35. The first part 90 of the heat sink includes a plurality of slots or grooves. The inductor coil described in any one of Examples 27 to 34.

[0289] Example 36. The plurality of slots or grooves extend to the inner surface of the first part of the heat sink. The inductor coil described in Example 35.

[0290] Example 37. The plurality of slots or grooves extend to the boundary between the first part and the second part of the heat sink. The inductor coil described in Example 35 or 36.

[0291] Example 38. Each of the plurality of slots or grooves has a longitudinal axis that intersects the central axis of the core. The inductor coil described in any one of Examples 35 to 37.

[0292] Example 39. The second part of the heat sink is the inductor coil according to any one of Examples 27 to 38, which is configured to be connected to the printed circuit board 120.

[0293] Example 40. The heat sink includes at least one third part 130, 140 disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink, and at least one third part of the heat sink is the inductor coil according to any one of Examples 27 to 39, which is configured to release heat from the second part of the heat sink.

[0294] Example 41. The third part among at least one third part of the heat sink is the inductor coil according to Example 40, which includes a fin structure 130.

[0295] Example 42. The third part among at least one third part of the heat sink is the inductor coil according to Example 40 or 41, which includes a connection terminal 140.

[0296] Example 43. The connection terminal is the inductor coil according to Example 42, which includes a fin structure.

[0297] Example 44. The connection terminal is the inductor coil according to Example 42, which includes a thick copper wire.

[0298] Example 45. The second part of the heat sink is the inductor coil according to any one of Examples 27 to 44, which includes one or more pins configured for mechanical alignment with the printed circuit board 120 and / or for mechanical fixation to the printed circuit board.

[0299] Example 46. The first part and the second part of the heat sink are the inductor coil according to any one of Examples 27 to 45, which extend in a direction substantially perpendicular to the central axis of the core.

[0300] Example 47. The core of the second component is spaced apart from the first component to form a gap 20 between the core and the first component. The first part of a conductor of a predetermined length is wound around the core and the gap between the core and the first component. The inner part of two or more turns of the conductor arranged around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The inner part of one or more turns of the conductor arranged around the gap between the core and the first component is spaced apart from the central axis by at least a predetermined second distance that is greater than at least the predetermined first distance. The inductor coil according to any one of Examples 27 to 46.

[0301] Example 48. The core of the second component is spaced apart from the first component to form a gap 20 between the core and the first component. A spacer 30 is arranged in the gap between the core and the first component to form a gap 22 surrounding the core. The outer surface of a part of the spacer is arranged at a distance from the central axis that is greater than the distance from the central axis to the outer surface of the core of the second component. The inductor coil according to any one of Examples 27 to 47.

[0302] Example 49. The dimension of a part of the spacer adjacent to the outer surface of the core of the second component in the direction of the central axis is greater than the dimension 24 of the gap between the core and the first component in the direction of the central axis. The inductor coil according to Example 48.

[0303] Example 50. The outer surface of a part of the spacer is configured to contact one or more turns of the conductor arranged around the gap between the core and the first component. The inductor coil according to Example 48 or 49 when dependent on Example 47.

[0304] Example 51. The spacer includes a non-conductive material. The inductor coil according to any one of Examples 48 to 50.

[0305] Example 52. The spacer is the inductor coil according to any one of Examples 48 to 51, which is configured to be disposed surrounding a central axis and includes a central hole 32.

[0306] Example 53. An inductor coil includes a first component 12, a second component 14, and a conductor 18 of a predetermined length. The first component is disposed adjacent to the second component, and a core 16 is formed from the first component and the second component. A first part of the conductor of the predetermined length is wound at least surrounding the core to form a plurality of turns of the conductor. A method for cooling the inductor coil, includes using a heat sink 100. The heat sink includes a heat conductive material and includes a first part 90, 110 and a second part. The first part of the heat sink has a first material and / or structural property, and the second part of the heat sink has a second material and / or structural property different from the first material and / or structural property. Using the heat sink includes bringing an inner surface of the first part of the heat sink into contact with an outer surface of a part of the plurality of turns of the conductor. Method.

[0307] Example 54. The method according to Example 53, wherein the first material and / or structural property includes magnetic permeability, and the second material and / or structural property includes a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0308] Example 55. The method according to Example 53 or 54, wherein the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity smaller than the resistance or resistivity of the first part of the heat sink.

[0309] Example 56. The circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, and the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and greater than the circumferential resistance of the second part of the heat sink, the method according to Example 55.

[0310] Example 57. The first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink, the method according to any one of Examples 53 to 56.

[0311] Example 58. The circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, and the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and less than the circumferential conductance of the second part of the heat sink, the method according to Example 57.

[0312] Example 59. The heat sink 100 is formed from a single piece, and the first structural property of the first part 90 is different from the second structural property of the second part 110, the method according to any one of Examples 53 to 58.

[0313] Example 60. The first part 110 of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core, the method according to any one of Examples 53 to 59.

[0314] Example 61. The first part 90 of the heat sink comprises a plurality of slots or grooves, the method according to any one of Examples 53 to 60.

[0315] Example 62. The plurality of slots or grooves extend to the inner surface of the first part of the heat sink, the method according to Example 61.

[0316] Example 63. The method according to Example 61 or 62, wherein a plurality of slots or grooves extend to a boundary between a first part of the heat sink and a second part of the heat sink.

[0317] Example 64. The method according to any one of Examples 61 to 63, wherein each of the plurality of slots or grooves has a longitudinal axis intersecting the central axis of the core.

[0318] Example 65. The method according to any one of Examples 53 to 64, including connecting a second part of the heat sink to the printed circuit board 120.

[0319] Example 66. The heat sink includes at least one third part 130, 140 disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink, and the method includes dissipating heat from the second part of the heat sink through at least one third part of the heat sink. The method according to any one of Examples 53 to 65.

[0320] Example 67. The method according to Example 66, wherein the third part of at least one third part of the heat sink includes a fin structure 130.

[0321] Example 68. The method according to Example 66 or 67, wherein the third part of at least one third part of the heat sink includes a connection terminal 140.

[0322] Example 69. The method according to Example 68, wherein the connection terminal includes a fin structure.

[0323] Example 70. The method according to Example 68, wherein the connection terminal includes a thick copper wire.

[0324] Example 71. The second part of the heat sink includes one or more pins, and the method includes mechanically aligning the one or more pins with the printed circuit board 120 and / or mechanically fixing the one or more pins to the printed circuit board, and is the method according to any one of Examples 53 to 70.

[0325] Example 72. The first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core, and is the method according to any one of Examples 53 to 71.

[0326] Example 73. The core portion of the first component is spaced from the core portion of the second component to form a gap 20 in the core. The first part of a conductor of a predetermined length is wound around the core and the gap in the core. The inner portion of two or more turns of the conductor disposed around the core is spaced from the central axis of the core by at least a predetermined first distance. The method includes spacing the inner portion of one or more turns of the conductor disposed around the gap in the core from the central axis by at least a predetermined second distance greater than the at least predetermined first distance, and is the method according to any one of Examples 53 to 72.

[0327] Example 74. The core portion of the first component is spaced from the core portion of the second component to form a gap 20 in the core. The method includes disposing a spacer 30 in the gap in the core and forming a gap 22 surrounding the core. The outer surface of a part of the spacer is disposed at a distance from the central axis greater than the distance from the central axis to the outer surfaces of the first component and the second component forming the core, and is the method according to any one of Examples 53 to 73.

[0328] Example 75. The dimension of a part of the spacer adjacent to the outer surfaces of the first component and the second component in the direction of the central axis is greater than the dimension 24 of the gap in the core in the direction of the central axis, and is the method according to Example 74.

[0329] Example 76. The method according to any one of Examples 74 to 75 when dependent on Example 73, the method comprising contacting an outer surface of a portion of the spacer with one or more turns of a conductor disposed surrounding a gap in the core.

[0330] Example 77. The inductor coil according to any one of Examples 74 to 76, wherein the spacer comprises a non-conductive material.

[0331] Example 78. The method coil according to any one of Examples 74 to 77, wherein the spacer comprises a central hole 32 configured to be disposed surrounding a central axis.

[0332] Example 79. A method of cooling an inductor coil, the inductor coil comprising a first component 12, a second component 14, and a conductor 18 of a predetermined length, the first component being disposed adjacent to the second component, a core 16 being formed from the second component, and a first part of the conductor of the predetermined length being wound around at least the core to form a plurality of turns of the conductor, the method comprising: utilizing a heat sink 100, the heat sink comprising a thermally conductive material, the heat sink comprising a first part 90, 110 and a second part, the first part of the heat sink having a first material and / or structural property, the second part of the heat sink having a second material and / or structural property different from the first material and / or structural property, utilizing the heat sink comprising contacting an inner surface of the first part of the heat sink with an outer surface of a part of the plurality of turns of the conductor. Method.

[0333] Example 80. The method according to Example 79, wherein the first material and / or structural property comprises a magnetic permeability, and the second material and / or structural property comprises a magnetic permeability greater than the magnetic permeability of the first part of the heat sink.

[0334] Example 81. The method according to Example 79 or 80, wherein the first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity that is less than the resistance or resistivity of the first part of the heat sink.

[0335] Example 82. The method according to Example 81, wherein the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink, and is greater than the circumferential resistance of the second part of the heat sink.

[0336] Example 83. The method according to any one of Examples 79 to 82, wherein the first material and / or structural property includes conductivity or conductance, and the second material and / or structural property includes a conductivity or conductance that is less than the resistance or resistivity of the first part of the heat sink.

[0337] Example 84. The method according to Example 83, wherein the circumferential conductance of the first part of the heat sink is less than the radial conductance of the first part of the heat sink, the circumferential conductance of the first part of the heat sink is less than the radial conductance of the second part of the heat sink, and is less than the circumferential conductance of the second part of the heat sink.

[0338] Example 85. The method according to any one of Examples 79 to 84, wherein the heat sink 100 is formed from a single piece, and the first structural property of the first part 90 is different from the second structural property of the second part 110.

[0339] Example 86. The method according to any one of Examples 79 to 85, wherein the first part 110 of the heat sink has a thickness in the axial direction of the core that is less than the thickness of the second part of the heat sink in the axial direction of the core.

[0340] Example 87. The first part 90 of the heat sink is the method according to any one of Examples 79 to 86, comprising a plurality of slots or grooves.

[0341] Example 88. The method according to Example 87, wherein the plurality of slots or grooves extend to the inner surface of the first part of the heat sink.

[0342] Example 89. The method according to Example 87 or 88, wherein the plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink.

[0343] Example 90. The method according to any one of Examples 87 to 89, wherein each of the plurality of slots or grooves has a longitudinal axis intersecting the central axis of the core.

[0344] Example 91. The method according to any one of Examples 79 to 90, comprising connecting the second part of the heat sink to the printed circuit board 120.

[0345] Example 92. The heat sink includes at least one third part 130, 140 disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink, and the method includes dissipating heat from the second part of the heat sink through at least one third part of the heat sink. The method according to any one of Examples 79 to 91.

[0346] Example 93. The method according to Example 92, wherein the third part of the at least one third part of the heat sink includes a fin structure 130.

[0347] Example 94. The method according to Example 92 or 93, wherein the third part of the at least one third part of the heat sink includes a connection terminal 140.

[0348] Example 95. The method according to Example 94, wherein the connection terminal includes a fin structure.

[0349] Example 96. The method described in Example 94, wherein the connection terminal comprises a thick copper wire.

[0350] Example 97. The second part of the heat sink comprises one or more pins, and the method comprises mechanically aligning the one or more pins with the printed circuit board 120 and / or mechanically fixing the one or more pins to the printed circuit board, the method according to any one of Examples 79 to 96.

[0351] Example 98. The first and second parts of the heat sink extend in a direction substantially perpendicular to the central axis of the core, the method according to any one of Examples 79 to 97.

[0352] Example 99. The core of the second component is spaced from the first component to form a gap 20 between the core and the first component, and the first part of the conductor of a predetermined length is wound around the core and the gap between the core and the first component. The inner part of the conductor of two or more turns of the conductor disposed around the core is spaced from the central axis of the core by at least a predetermined first distance. The method comprises spacing the inner part of the conductor of one or more turns of the conductor disposed around the gap between the core and the first component from the central axis by at least a predetermined second distance greater than the at least predetermined first distance, the method according to any one of Examples 79 to 98.

[0353] Example 100. The core of the second component is spaced from the first component to form a gap 20 between the core and the first component. The method comprises disposing a spacer 30 in the gap between the core and the first component to form a gap 22 surrounding the core, and the outer surface of a part of the spacer is disposed at a distance from the central axis greater than the distance from the central axis to the outer surface of the core of the second component, the method according to any one of Examples 79 to 99.

[0354] Example 101. The method according to Example 100, wherein the dimension of a part of the spacer adjacent to the outer surface of the core of the second component in the direction of the central axis is larger than the dimension 24 of the gap between the core and the first component in the direction of the central axis.

[0355] Example 102. The method according to Example 100 or 101 when dependent on Example 99, the method comprising contacting an outer surface of a part of the spacer with one or more turns of a conductor arranged to surround the gap between the core and the first component.

[0356] Example 103. The method according to any one of Examples 100 to 102, wherein the spacer comprises a non-conductive material.

[0357] Example 104. The method according to any one of Examples 100 to 103, wherein the spacer comprises a central hole 32 configured to be arranged surrounding the central axis.

[0358] It should be noted that the embodiments of the present invention are described with reference to different subjects. In particular, some embodiments are described with reference to method-type claims, and other embodiments are described with reference to device-type claims. However, those skilled in the art will presume from the above and the following description that, unless otherwise notified, any combination of features belonging to one type of subject, in addition to any combination of features regarding different subjects, is also considered to be disclosed with this application. However, it is not possible to combine all features to provide a synergistic effect that exceeds the simple sum of the features.

[0359] Although the present invention has been illustrated and described in detail in the drawings and the foregoing description, such illustrations and descriptions are exemplary or illustrative and should not be considered limiting. The present invention is not limited to the disclosed embodiments. Other modifications to the disclosed embodiments can be understood and achieved by those skilled in the art when implementing the invention described in the claims from a study of the drawings, the disclosure, and the dependent claims.

[0360] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or other unit may perform the functions of a plurality of items recited in the claims. The mere fact that certain means are recited in mutually different dependent claims does not indicate that a combination of these means cannot be used advantageously. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. An inductor coil, comprising: a first component (12); a second component (14); a conductor (18) of a predetermined length; a heat sink (100); The first component is arranged adjacent to the second component, a core (16) is formed from the first component and the second component, a first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor, the heat sink includes a heat-conductive material, the heat sink includes a first part (90, 110) and a second part, the first part of the heat sink has a first material and / or structural characteristic, and the second part of the heat sink has a second material and / or structural characteristic different from the first material and / or structural characteristic, an inner surface of the first part of the heat sink is in contact with an outer surface of a part of the plurality of turns of the conductor, the first material and / or structural characteristic includes resistance or resistivity, and the second material and / or structural characteristic includes a resistance or resistivity smaller than the resistance or resistivity of the first part of the heat sink, a circumferential resistance of the first part of the heat sink is greater than a radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than a radial resistance of the second part of the heat sink, and the circumferential resistance of the first part of the heat sink is greater than a circumferential resistance of the second part of the heat sink, the first part (90) of the heat sink includes a plurality of slots or grooves filled with air or polymer or oil in the radial direction, and by the plurality of slots or grooves filled with air or polymer or oil in the radial direction, the circumferential resistance of the first material and / or structural characteristic of the first part of the heat sink is greater than the radial resistance of the first material and / or structural characteristic of the first part of the heat sink, the circumferential resistance of the first material and / or structural characteristic of the first part of the heat sink is greater than the radial resistance of the second material and / or structural characteristic of the second part of the heat sink, and the circumferential resistance of the first material and / or structural characteristic of the first part of the heat sink is greater than the circumferential resistance of the second material and / or structural characteristic of the second part of the heat sink ​ The circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is smaller than the radial thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink, the circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is smaller than the radial thermal conductivity of the second material and / or structural characteristics of the second part of the heat sink, and is smaller than the circumferential thermal conductivity of the second material and / or structural characteristics of the second part of the heat sink. Inductor coil. Claim 2 The first material and / or structural characteristics include magnetic permeability, and the second material and / or structural characteristics include a magnetic permeability greater than the magnetic permeability of the first part of the heat sink. The inductor coil according to claim 1. Claim 3 The heat sink is formed from a single piece, and the first structural characteristics of the first part are different from the second structural characteristics of the second part. The inductor coil according to claim 1 or 2. Claim 4 The first part (110) of the heat sink has a thickness in the axial direction of the core that is smaller than the thickness of the second part of the heat sink in the axial direction of the core. The inductor coil according to any one of claims 1 to 3. Claim 5 The plurality of slots or grooves extend to the inner surface of the first part of the heat sink. The inductor coil according to claim 1. Claim 6 The plurality of slots or grooves extend to the boundary between the first part of the heat sink and the second part of the heat sink. The inductor coil according to claim 1 or 5. Claim 7 The second part of the heat sink is configured to be connected to a printed circuit board (120). The inductor coil according to any one of claims 1 to 6. Claim 8 The heat sink includes at least one third part (130, 140) disposed on the opposite side of the second part of the heat sink with respect to the first part of the heat sink, and the at least one third part of the heat sink is configured to release heat from the second part of the heat sink. The inductor coil according to any one of claims 1 to 7.

9. The third part of the at least one third part of the heat sink includes a fin structure (130). The inductor coil according to claim 8.

10. The third part of the at least one third part of the heat sink includes a connection terminal (140). The inductor coil according to claim 9.

11. The connection terminal includes the fin structure. The inductor coil according to claim 10.

12. The connection terminal includes a thick copper wire. The inductor coil according to claim 10.

13. The second part of the heat sink includes one or more pins configured for mechanical alignment with and / or mechanical fixation to a printed circuit board (120). The inductor coil according to any one of claims 1 to 12.

14. The first part and the second part of the heat sink extend in a direction substantially perpendicular to the central axis of the core. The inductor coil according to any one of claims 1 to 13.

15. The core portion of the first component is spaced apart from the core portion of the second component to form a gap (20) in the core. The first part of the conductor of the predetermined length is wound around the core and the gap in the core. The inner part of the conductor among two or more turns of the conductor disposed around the core is spaced apart from the central axis of the core by at least a predetermined first distance. The inner part of the conductor among one or more turns of the conductor disposed around the gap in the core is spaced apart from the central axis by at least a predetermined second distance greater than the at least predetermined first distance. The inductor coil according to any one of claims 1 to 14.

16. The core portion of the first component is spaced apart from the core portion of the second component to form a gap (20) within the core, and a spacer (30) is disposed within the gap in the core so as to form a gap (22) surrounding the core. An outer surface of a portion of the spacer is disposed at a distance from the central axis of the core that is greater than a distance from the central axis to an outer surface of the first component forming the core and an outer surface of the second component. The inductor coil according to any one of claims 1 to 15.

17. An inductor coil, a first component (12), a second component (14), a conductor (18) of a predetermined length, a heat sink (100), comprising: The first component is disposed adjacent to the second component, a core (16) is formed from the second component, a first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor, the heat sink includes a thermally conductive material, the heat sink includes a first part (90, 110) and a second part, the first part of the heat sink has a first material and / or structural characteristic, and the second part of the heat sink has a second material and / or structural characteristic different from the first material and / or structural characteristic, an inner surface of the first part of the heat sink is in contact with an outer surface of a part of the plurality of turns of the conductor, the first material and / or structural characteristic includes resistance or resistivity, and the second material and / or structural characteristic includes a resistance or resistivity smaller than the resistance or resistivity of the first part of the heat sink, a circumferential resistance of the first part of the heat sink is greater than a radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink is greater than a radial resistance of the second part of the heat sink, and greater than a circumferential resistance of the second part of the heat sink, the first part (90) of the heat sink includes a plurality of slots or grooves filled with air or polymer or oil in the radial direction, by the plurality of slots or grooves filled with air or polymer or oil in the radial direction, The circumferential resistance of the first material and / or structural characteristics of the first part of the heat sink is greater than the radial resistance of the first material and / or structural characteristics of the first part of the heat sink, the circumferential resistance of the first material and / or structural characteristics of the first part of the heat sink is greater than the radial resistance of the second material and / or structural characteristics of the second part of the heat sink, and the circumferential resistance of the first material and / or structural characteristics of the first part of the heat sink is greater than the circumferential resistance of the second material and / or structural characteristics of the second part of the heat sink. The circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is less than the radial thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink, the circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is less than the radial thermal conductivity of the second material and / or structural characteristics of the second part of the heat sink, and the circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is less than the circumferential thermal conductivity of the second material and / or structural characteristics of the second part of the heat sink. Inductor coil. Claim 18 An inductor coil comprising a first component (12), a second component (14), and a conductor (18) of a predetermined length, wherein the first component is arranged adjacent to the second component, and a core (16) is formed from the first component and the second component, and a first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. A method of cooling the inductor coil, comprising using a heat sink (100), the heat sink including a thermally conductive material, the heat sink including a first part (90, 110) and a second part, the first part of the heat sink having a first material and / or structural characteristics, and the second part of the heat sink having a second material and / or structural characteristics different from the first material and / or structural characteristics. Using the heat sink includes bringing an inner surface of the first part of the heat sink into contact with an outer surface of a part of the plurality of turns of the conductor. The first material and / or structural property includes resistance or resistivity, and the second material and / or structural property includes a resistance or resistivity smaller than the resistance or resistivity of the first part of the heat sink. The circumferential resistance of the first part of the heat sink is greater than the radial resistance of the first part of the heat sink, and the circumferential resistance of the first part of the heat sink is greater than the radial resistance of the second part of the heat sink and greater than the circumferential resistance of the second part of the heat sink. The first part (90) of the heat sink includes a plurality of slots or grooves filled with air or polymer or oil in the radial direction, and by the plurality of slots or grooves filled with air or polymer or oil in the radial direction. The circumferential resistance of the first material and / or structural property of the first part of the heat sink is greater than the radial resistance of the first material and / or structural property of the first part of the heat sink, and the circumferential resistance of the first material and / or structural property of the first part of the heat sink is greater than the radial resistance of the second material and / or structural property of the second part of the heat sink and greater than the circumferential resistance of the second material and / or structural property of the second part of the heat sink. The circumferential thermal conductivity of the first material and / or structural property of the first part of the heat sink is smaller than the radial thermal conductivity of the first material and / or structural property of the first part of the heat sink, and the circumferential thermal conductivity of the first material and / or structural property of the first part of the heat sink is smaller than the radial thermal conductivity of the second material and / or structural property of the second part of the heat sink and smaller than the circumferential thermal conductivity of the second material and / or structural property of the second part of the heat sink. Method. Claim 19 An inductor coil comprising a first component (12), a second component (14), and a conductor (18) of a predetermined length, wherein the first component is arranged adjacent to the second component, a core (16) is formed from the second component, and a first part of the conductor of the predetermined length is wound around at least the core to form a plurality of turns of the conductor. A method of cooling the inductor coil, comprising using a heat sink (100), the heat sink including a thermally conductive material, the heat sink including a first part (90, 110) and a second part, the first part of the heat sink having a first material and / or structural property, and the second part of the heat sink having a second material and / or structural property different from the first material and / or structural property, using the heat sink including bringing an inner surface of the first part of the heat sink into contact with an outer surface of a part of the plurality of turns of the conductor, the first material and / or structural property including a resistance or resistivity, and the second material and / or structural property including a resistance or resistivity smaller than the resistance or resistivity of the first part of the heat sink, a circumferential resistance of the first part of the heat sink being greater than a radial resistance of the first part of the heat sink, the circumferential resistance of the first part of the heat sink being greater than a radial resistance of the second part of the heat sink and greater than a circumferential resistance of the second part of the heat sink, the first part (90) of the heat sink comprising a plurality of slots or grooves filled with air or polymer or oil in the radial direction, by the plurality of slots or grooves filled with air or polymer or oil in the radial direction, The circumferential resistance of the first material and / or structural characteristics of the first part of the heat sink is greater than the radial resistance of the first material and / or structural characteristics of the first part of the heat sink, the circumferential resistance of the first material and / or structural characteristics of the first part of the heat sink is greater than the radial resistance of the second material and / or structural characteristics of the second part of the heat sink, and the circumferential resistance of the first material and / or structural characteristics of the first part of the heat sink is greater than the circumferential resistance of the second material and / or structural characteristics of the second part of the heat sink. The circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is smaller than the radial thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink, the circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is smaller than the radial thermal conductivity of the second material and / or structural characteristics of the second part of the heat sink, and the circumferential thermal conductivity of the first material and / or structural characteristics of the first part of the heat sink is smaller than the circumferential thermal conductivity of the second material and / or structural characteristics of the second part of the heat sink. Method.

Images